An adjustment device and method based on the temperature consistency of a ceramic heater

Abstract

The present invention provides an adjustment device and method based on the temperature consistency of a ceramic heater. The device includes: an upper cover assembly; a lower disc body assembly disposed below the upper cover assembly, and the lower disc body assembly and the upper cover assembly form a heating cavity in combination; a heating assembly installed inside the lower disc body assembly to heat the inside of the heating cavity; a temperature adjustment assembly installed inside the lower disc body assembly to perform temperature compensation and adjustment on the heating assembly; and a ventilation assembly installed on the upper cover assembly to discharge and intake gas inside the heating cavity to maintain the stable air flow inside the heating cavity. The heating assembly is temperature-compensated by means of double temperature compensation, the temperature of the heating assembly is adjusted to be uniform and consistent, and at the same time, the air flow environment is stabilized, thereby improving the overall heating effect.

Description

Technical Field

[0001] The present invention relates to the technical field of heat treatment of semiconductor chips, and particularly to an adjustment device and method based on temperature uniformity of a ceramic heater. Background Art

[0002] In a cleaning machine tool used in front-end manufacturing processes such as wafer processing in the semiconductor industry, wafers will undergo a series of processes through the process flow of the equipment, including adhesion enhancement, coating, baking, cooling, exposure, etc., and then a series of processes such as development, etching, and resist stripping. This is repeated several times, and finally the required complex circuit structure is transferred to the substrate, and then it is transferred to the subsequent process to complete the processing of each chip.

[0003] During the coating process using a cleaning track machine tool, a photosensitive substance (photoresist) needs to be coated on the wafer substrate. This photosensitive substance contains a large amount of organic solvents and other liquids. In the next process, a heating unit is required to bake and volatilize the above-mentioned organic solvents and discharge them to a specified position through special treatment. With the development and progress of the overall industry, the feature size on mass-produced chips has been scaled down to the level of less than 7 nanometers or even 5 nanometers. Currently, a ceramic heater with seven heating zones is standardly configured on the cleaning track machine tool, and there is a coupling relationship between the seven heating zones. Therefore, the heating effect on the wafer surface is completely controlled by the seven heating zones. Therefore, high-precision control of the temperature uniformity of the ceramic heater with seven-zone heating capacity is the research and development direction of each equipment manufacturer. However, during the process of adjusting the uniformity of the ceramic heater, when using a temperature detection device, such as an RTD Wafer resistive temperature detector wafer for detection, it often occurs that the temperatures at multiple points on the surface of the ceramic heater are detected to be uneven.

[0004] For example, in the prior art, the patent number is 201420197500.4, and the patent name is "A Wafer Heating Device", which discloses "A wafer heating device, the wafer heating device at least includes: a heating chamber, a base, a heater, at least one temperature sensor, a controller, a fixed boss, and a power meter; the base is arranged at the bottom of the heating chamber; the heater is used to heat the wafer and is arranged on the surface of the base; the temperature sensor is installed in the heater; the fixed boss is used to fix the wafer and is arranged on the surface of the heater; the controller is connected to the heater through a power cable; the power meter is installed on the power cable. In the wafer heating device provided by the present invention, a power meter is installed on the power cable, and the thermal power absorbed by the wafer in the heating chamber is monitored through the power meter. If it is detected that the thermal power absorbed by the wafer decreases, it means that the wafer has tilted. After discovery, the wafer can be repositioned to the correct position, reducing the risk of uneven wafer heating and improving the yield of the wafer."

[0005] Therefore, it is necessary to provide a new type of adjustment device and method based on the temperature consistency of a ceramic heater to solve the above problems existing in the prior art. Summary of the Invention

[0006] The purpose of the present invention is to provide an adjustment device and method based on the temperature consistency of a ceramic heater to improve the uniformity of heating of a heating component.

[0007] To achieve the above purpose, the adjustment device based on the temperature consistency of a ceramic heater of the present invention includes:

[0008] An upper cover assembly;

[0009] A lower disk body assembly, arranged below the upper cover assembly, and the lower disk body assembly and the upper cover assembly form a heating cavity in combination;

[0010] A heating component, installed inside the lower disk body assembly, for heating the inside of the heating cavity;

[0011] A temperature adjustment component, installed inside the lower disk body assembly, for temperature compensation and adjustment of the heating component; and

[0012] A ventilation component, installed on the upper cover assembly, for discharging and introducing gas inside the heating cavity to maintain the stability of the air flow inside the heating cavity.

[0013] The beneficial effect of the present invention is that: a heating cavity is formed by the upper cover assembly and the lower disk body assembly to heat the wafer to be processed. During the heating process, the temperature adjustment component compensates the temperature of the heating component to ensure that the overall temperature is uniform when the heating component is heating. At the same time, the ventilation component is used for the air flow exchange of the entire heating cavity to ensure that the entire heating cavity is in a stable working environment. At the same time, the flow of the air forms a non-contact heat preservation layer, further ensuring that the temperature is uniform when the heating component is heating, thereby improving the processing quality of the wafer.

[0014] Preferably, the upper cover assembly includes an outer layer cover, a middle layer cover, and an inner layer cover arranged in sequence from outside to inside. The middle layer cover is connected with a plurality of middle layer cover support columns, the middle layer cover support columns are connected with the outer layer cover, the middle layer cover is connected with a plurality of inner layer cover support columns, and the inner layer cover support columns are connected with the inner layer cover.

[0015] Through the fitting support of the middle layer cover support columns and the inner layer cover support columns, the outer layer cover, the middle layer cover, and the inner layer cover are stably fixed together, improving the stability of the entire upper cover assembly.

[0016] Preferably, a uniform exhaust cavity is provided between the lower surface of the outer layer cover and the upper surface of the middle layer cover, and a uniform intake cavity is provided between the lower surface of the middle layer cover and the upper surface of the inner layer cover.

[0017] Preferably, the ventilation component includes a ventilation block installed on the upper surface of the outer layer cover. The intake end of the ventilation block is connected to an intake pipe, and the exhaust end of the ventilation block is connected to an exhaust pipe. The intake pipe is in mutual communication with the uniform intake cavity, and the exhaust pipe is in mutual communication with the uniform exhaust cavity.

[0018] External gas enters the ventilation block through the intake pipe and then enters the interior of the uniform intake cavity. The gas in the heating cavity enters the ventilation block through the uniform exhaust cavity and is discharged through the exhaust pipe, making the air flow in the entire heating cavity uniform, providing a stable environment for the air flow in the entire heating cavity. At the same time, it can quickly replace the volatiles generated by the wafers that meet the process conditions when the entire device is heating, so as to maintain a stable environment inside the heating cavity.

[0019] Preferably, a plurality of air outlet holes are further provided on the surface of the inner layer cover, and the gas inside the uniform intake cavity is discharged into the interior of the heating cavity through the air outlet holes. The gas inside the uniform intake cavity is discharged into the heating cavity through the air outlet holes to realize the entire air flow process.

[0020] Preferably, the uniform exhaust cavity is connected to the exhaust end of the ventilation block through a middle layer exhaust channel, and the middle layer exhaust channel is installed on the middle layer cover. The uniform intake cavity is connected to the intake end of the ventilation block through an inner layer intake channel, and the inner layer intake channel is installed on the inner layer cover.

[0021] Preferably, the heating component is a ceramic heater.

[0022] Preferably, the temperature adjustment component includes at least one back temperature compensator, and the back temperature compensator is arranged on the back of the heating component, and a temperature control area is formed between the back temperature compensator and the heating component.

[0023] The back of the heating component is temperature-compensated by the back cooling compensator to ensure that the temperature at the surface position of the heating component is uniform.

[0024] Preferably, the temperature adjustment component further includes an edge temperature compensator, and the edge temperature compensator is arranged at the outer edge of the heating component and performs temperature compensation on the heating component.

[0025] The outer edge of the heating component is temperature-compensated by the edge temperature compensator to ensure that the temperature at the edge position of the heating component is uniform and avoid the situation of uneven temperature at the edge position of the heating component due to heat dissipation.

[0026] Preferably, the back temperature compensator is a back cooling block.

[0027] Preferably, the lower platen assembly includes a fixed seat, a sealing plate is arranged inside the fixed seat, and the heating assembly is installed on the fixed seat. The heating assembly is installed on the fixed seat.

[0028] Preferably, an air flow exchange channel is arranged between the fixed seat and the outer cover, and the air flow exchange channel is communicated with the uniform exhaust cavity. Since the air flow is distributed in the heating cavity after being discharged through the air outlet holes, the air in the heating cavity is discharged into the uniform exhaust cavity through the air flow exchange channel and discharged through the exhaust pipe, realizing the whole air flow process.

[0029] Preferably, a plurality of mounting threaded holes are further arranged on the upper surface of the fixed seat, a wafer positioning guide post is threadedly connected inside the mounting threaded hole, and a through hole is further arranged at the center of the wafer positioning guide post. The wafer on the heating assembly is limited and guided through the wafer positioning guide post and the through hole, preventing the wafer from shifting and affecting the stability of temperature measurement.

[0030] Preferably, a compensation channel for introducing cooling gas is further arranged inside the back temperature compensator. It is used to input cooling gas for temperature compensation.

[0031] Preferably, the lower platen assembly includes a fixed seat, a sealing plate is arranged inside the fixed seat, the heating assembly is installed on the fixed seat, and the back temperature compensator is arranged on the sealing plate.

[0032] Preferably, an air flow exchange channel is arranged between the fixed seat and the outer cover, the air flow exchange channel is communicated with the uniform exhaust cavity, and the cooling gas introduced into the compensation channel is discharged into the uniform exhaust cavity through the air flow exchange channel.

[0033] Preferably, a plurality of mounting threaded holes are further arranged on the upper surface of the fixed seat, a wafer positioning guide post is threadedly connected inside the mounting threaded hole, and a through hole is further arranged at the center of the wafer positioning guide post.

[0034] The present invention also provides an adjustment method based on the temperature consistency of a ceramic heater, including the following steps:

[0035] During the process of heating the wafer by the heating assembly, the temperature information of the heating assembly is detected by a temperature detection device and recorded in a memory;

[0036] The temperature detection device feeds back the detected temperature information to a controller, and the controller starts a temperature adjustment component at a corresponding position for temperature compensation according to the temperature information;

[0037] After detecting that the temperature of the heating component has uniformly reached the requirement, turn off the temperature adjustment component to complete the adjustment.

[0038] The beneficial effects of the present invention are as follows: By detecting the heating temperature on the heating component, when it is detected that the temperatures of the heating components are inconsistent, the temperature adjustment component is controlled by the controller to perform temperature compensation, and the temperature of the heating component is adjusted to be uniform.

[0039] Preferably, the temperature detection device is a resistive temperature detector chip.

[0040] Preferably, the temperature adjustment component includes a back temperature compensator and an edge temperature compensator. The back temperature compensator is used to perform temperature compensation on local positions of the heating component, and the edge temperature compensator is used to perform temperature compensation on the edge positions of the heating component.

[0041] Preferably, it further includes:

[0042] Record the temperature adjustment parameters of the temperature adjustment component and store them in the memory. When the temperature detection device detects that the temperatures of the heating components are inconsistent, the controller directly calls the temperature adjustment parameters in the memory to adjust the temperature adjustment component.

[0043] Record the temperature information and the temperature adjustment parameters of the temperature adjustment component through the memory. When the heating component is used again, the controller can directly call the temperature adjustment parameters stored in the memory, thereby performing rapid temperature compensation on the heating component, making the heating process of the heating component better meet the requirements, and improving the efficiency of temperature compensation adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 is a schematic diagram of the overall structure of the adjustment device of the present invention;

[0045] Figure 2 is a schematic diagram of the structure of the ventilation component of the present invention;

[0046] Figure 3 is a schematic diagram of the structure of the air flow exchange channel of the present invention;

[0047] Figure 4 is a schematic diagram of the cross-sectional structure of the upper cover component of the present invention;

[0048] Figure 5 is of the present invention Figure 4 The enlarged schematic diagram of B in;

[0049] Figure 6 is of the present invention Figure 4 The enlarged schematic diagram of A in;

[0050] Figure 7 Schematic diagram of the overall structure of the upper cover assembly of the present invention;

[0051] Figure 8 of the present invention Figure 7 Schematic diagram of the enlarged structure of C in;

[0052] Figure 9 Schematic diagram of the compensation channel structure on the back temperature compensator of the present invention.

[0053] Figure 10 Schematic diagram of the structure of the wafer positioning guide post of the present invention;

[0054] Figure 11 Schematic diagram of the working process of the adjustment method of the present invention;

[0055] Figure 12 Schematic diagram of the overall working process of the adjustment method of the present invention when it includes step S4 in an embodiment.

[0056] Reference numerals in the figure:

[0057] 1 - Upper cover assembly;

[0058] 11 - Outer layer cover; 1101 - Uniform exhaust cavity;

[0059] 12 - Middle layer cover; 1201 - Middle layer cover support column; 1202 - Inner layer cover support column; 1203 - Middle layer exhaust channel;

[0060] 13 - Inner layer cover; 1301 - Uniform intake cavity; 1302 - Air outlet hole; 1303 - Inner layer intake channel;

[0061] 2 - Lower disk body assembly;

[0062] 201 - Fixed seat; 202 - Sealing plate; 203 - Air flow exchange channel; 204 - Mounting threaded hole; 205 - Wafer positioning guide post; 206 - Through hole;

[0063] 3 - Heating cavity;

[0064] 4 - Heating component;

[0065] 5 - Temperature adjustment component; 501 - Back temperature compensator; 502 - Edge temperature compensator; 503 - Compensation channel;

[0066] 6 - Ventilation component; 61 - Ventilation block; 62 - Intake pipe; 63 - Exhaust pipe. Detailed implementation manners

[0067] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which the present invention pertains. As used herein, words such as "including" and the like mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items.

[0068] In view of the problems existing in the prior art, such as Figures 1 to 10 As shown, an adjustment device based on the temperature uniformity of a ceramic heater is provided in an embodiment of the present invention, including:

[0069] An upper cover assembly 1;

[0070] A lower disk body assembly 2, disposed below the upper cover assembly 1, and the lower disk body assembly 2 and the upper cover assembly 1 form a heating cavity 3 in combination;

[0071] A heating assembly 4, installed inside the lower disk body assembly 2, for heating the inside of the heating cavity;

[0072] A temperature adjustment assembly 5, installed inside the lower disk body assembly 2, for temperature compensation and adjustment of the heating assembly 4; and

[0073] A ventilation assembly 6, installed on the upper cover assembly 1, for discharging and exhausting gas inside the heating cavity 3 to maintain the stability of the air flow inside the heating cavity.

[0074] When the above device is in use, the lower disk body assembly 2 and the upper cover assembly 1 form a heating cavity 3, and the wafer on the heating cavity 3 is heated by the heating assembly 4. During the heating process, when the temperature on the heating assembly 4 is not uniform, the temperature of the heating assembly 4 is compensated and adjusted by the temperature adjustment assembly 5 to make the temperature of the heating assembly 4 uniformly consistent. At the same time, the ventilation assembly 6 enables the air flow pressure and direction inside the entire heating cavity 3 to be maintained in a stable environment, and the above environment can displace the volatiles generated by the wafer during heating, further ensuring the stability of the environment inside the entire heating cavity 3.

[0075] Such as Figures 4 to 7As shown in the figure, the upper cover assembly 1 includes an outer layer cover 11, a middle layer cover 12, and an inner layer cover 13 arranged in sequence from outside to inside. A plurality of middle layer cover support columns 1201 are connected to the upper surface of the middle layer cover 11, the upper surfaces of the middle layer cover support columns 1201 are attached to the lower surface of the outer layer cover 11, a plurality of inner layer cover support columns 1202 are connected to the lower surface of the middle layer cover, and the lower surfaces of the inner layer cover support columns 1202 are attached to the upper surface of the inner layer cover 13.

[0076] Through the fitting and support of the middle layer cover support columns 1201 and the inner layer cover support columns 1202, the outer layer cover 11, the middle layer cover 12, and the inner layer cover 13 are stably fixed together, improving the stability of the entire upper cover assembly 1.

[0077] In a possible implementation manner, a uniform exhaust cavity 1101 is provided between the lower surface of the outer layer cover 11 and the upper surface of the middle layer cover 12, and a uniform intake cavity 1301 is provided between the lower surface of the middle layer cover and the upper surface of the inner layer cover.

[0078] External gas enters the interior of the heating cavity 3 through the uniform intake cavity 1301, and the gas inside the heating cavity 3 is discharged to the outside through the uniform exhaust cavity 1101 after use.

[0079] In a possible implementation manner, a plurality of air outlet holes 1302 are further provided on the surface of the inner layer cover 13. The gas inside the uniform intake cavity 1301 is discharged into the heating cavity 3 through the air outlet holes 1302. When the gas enters the interior of the uniform intake cavity 1301, the gas is discharged into the heating cavity 3 through the plurality of air outlet holes 1302.

[0080] In a possible implementation manner, the lower disc body assembly 2 includes a fixed seat 201. A sealing plate 202 is arranged inside the fixed seat 201. The heating assembly 4 is installed on the fixed seat 201, and a disc body support column 207 is connected to the bottom end of the fixed seat 201.

[0081] In a possible implementation manner, as Figure 3 shown, an air flow exchange channel 203 is provided between the fixed seat 201 and the outer layer cover 11, and the air flow exchange channel 203 is in mutual communication with the uniform exhaust cavity 1101.

[0082] Among them, since the gas inside the uniform intake cavity 1301 is discharged into the heating cavity 3 through the air outlet holes 1302, after the airflow flows inside the heating cavity 3, it enters the uniform exhaust cavity 1101 through the airflow exchange channel 203, thereby realizing the circular flow of the gas. The combined action of the uniform intake cavity 1301, the airflow exchange channel 203, and the uniform exhaust cavity 1101 forms an airflow circulation channel, enabling the airflow pressure and flow direction inside the entire heating cavity 3 to be maintained in a stable environment. At the same time, the above-mentioned environment can displace the volatiles generated by the wafer due to heating, further ensuring the stability of the environment inside the entire heating cavity 3.

[0083] As Figure 10 shown, in a possible implementation manner, a plurality of mounting threaded holes 204 are further provided on the upper surface of the fixing base 201. A wafer positioning guide post 205 is threadedly connected inside the mounting threaded hole 204, and a through hole 206 is further provided at the center of the wafer positioning guide post 205.

[0084] The wafer positioning guide post 205 is rotatably connected to the mounting threaded hole 204, facilitating the installation and disassembly of the wafer positioning guide post 205. At the same time, the through hole 206 at the center of the wafer positioning guide post 205 can fix the heated wafer, limit and guide the wafer on the heating component 4, and prevent the wafer from shifting and affecting the stability of temperature measurement.

[0085] In a possible implementation manner, the heating component 4 is a ceramic heater.

[0086] Among them, the ceramic heater is a commonly used device in existing wafer heating. In this embodiment, the ceramic heater is taken as an example for specific description.

[0087] In a possible implementation manner, the temperature adjustment component 5 includes at least one back temperature compensator 501. The back temperature compensator 501 is provided on the sealing plate 202 and is located at the back of the heating component 4. A temperature control area is formed between the back temperature compensator 501 and the heating component 4.

[0088] Since the heating component 4 will cause the local temperature of the heating component to be too high due to the central heat aggregation effect during heating in specific use, resulting in the inability to actively cool down, the back temperature compensator 501 can be used to compensate for the area with too high local temperature of the ceramic heater, improving the temperature uniformity of the ceramic plate.

[0089] In a possible implementation manner, the back temperature compensator 501 is a back cooling block, and the back cooling block uses semiconductor refrigeration for cooling.

[0090] When the heating component 4 is heated, a large amount of heat accumulates at its middle position due to the central heat accumulation effect, resulting in a temperature increase. The back cooling block can achieve a good cooling compensation effect, ensure the uniform temperature of the entire heating component 4, and improve the heating effect on the wafer.

[0091] In a possible implementation manner, the temperature adjustment component 5 further includes an edge temperature compensator 502. The edge temperature compensator 502 is arranged at the outer edge of the heating component 4 and compensates the temperature of the heating component 4.

[0092] Due to the heat convection phenomenon in the air flow exchange channel 203 between the upper cover component 1 and the lower disk component 2 at the edge of the overall heating cavity 3, a large amount of cooling gas enters the heating cavity 3 through the air flow exchange channel 203, resulting in a low temperature at the edge of the ceramic heater. At this time, the edge temperature compensator 502 heats for temperature compensation, thereby compensating for the heat loss at the edge and further ensuring the uniform temperature on the heating component 4.

[0093] In a possible implementation manner, as Figure 9 shown, a compensation channel 503 for introducing cooling gas is further arranged inside the back temperature compensator 501.

[0094] Cooling gas can be introduced through the compensation channel 503. When the local temperature of the heating component 4 is too high, by introducing cooling gas in a timely manner, the heating component 4 can be quickly cooled down so as to quickly achieve the uniform temperature of the heating component 4. The cooling gas introduced into the compensation channel 503 is discharged into the uniform exhaust cavity 1101 through the air flow exchange channel 203.

[0095] After the gas introduced into the compensation channel 503 is cooled, it is discharged into the uniform exhaust cavity 1101 through the air flow exchange channel 203 and then discharged, realizing the air flow circulation.

[0096] It should be noted that the back temperature compensator 501 and the edge temperature compensator 502 used in the above solutions are temperature compensators in the prior art, and their functions are to perform temperature compensation, including cooling compensation and heating compensation. This solution does not involve the improvement of the temperature compensator itself. Any temperature compensator in the prior art that can achieve temperature compensation can be applied to this technical solution, and will not be elaborated here.

[0097] In a possible implementation manner, as Figure 2As shown, the ventilation component 6 includes a ventilation block 61 installed on the upper surface of the outer cover 11. An intake pipe 62 is connected to the intake end of the ventilation block 61, and an exhaust pipe 63 is connected to the exhaust end of the ventilation block 61. The intake pipe 62 is in mutual communication with the uniform intake cavity 1301, and the exhaust pipe 63 is in mutual communication with the uniform exhaust cavity 1101.

[0098] During specific use, clean external gas enters through the intake pipe 62, then enters the interior of the ventilation block 61, and is discharged into the uniform intake cavity 1301 through the ventilation block 61 for use in subsequent technological processes.

[0099] In a possible implementation manner, the uniform exhaust cavity 1101 is connected to the exhaust end of the ventilation block 61 through a middle exhaust channel 1201. The middle exhaust channel 1201 is installed on the middle cover 12. The uniform intake cavity 1301 is connected to the intake end of the ventilation block 61 through an inner intake channel 1302. The inner intake channel 1302 is installed on the inner cover 13.

[0100] It should be noted that in the above solution, external gas enters the interior of the ventilation block 61 through the intake pipe 62. Then, the intake end of the ventilation block 61 discharges the external gas into the inner intake channel 1303 and discharges it into the uniform intake cavity 1301 through the inner intake channel 1303. Then, the gas in the uniform intake cavity 1301 enters the heating cavity 3 through the air outlet holes 1302. The flow direction of the air entering the heating cavity 3 is as shown by the arrow in Figure 8 And the gas used in the heating cavity 3 enters the uniform exhaust cavity 1101 through the air flow exchange channel 203, then is discharged into the interior of the ventilation block 61 through the middle exhaust channel 1203, and is discharged to the exhaust pipe 63 through the exhaust end of the ventilation block 61, thus realizing the gas flow process. The flow direction of the air flow when the air flows out of the heating cavity 3 to the outside is as shown by the arrow in Figure 5 the arrow in.

[0101] The working principle of the present invention is as follows:

[0102] During the process of the heating component 4 heating the wafer, the temperature of the heating component 4 is detected. When the temperature of a local heating area of the heating component 4 is too high, the heating component 4 is cooled and compensated by the back temperature compensator 501. When the edge temperature is too low, the heating component 4 is heated and compensated by the edge temperature compensator 502 until the temperature of the entire heating component 4 reaches uniform consistency, that is, the temperature displayed when detecting the temperature of the heating component 4 meets the standard.

[0103] It should be noted that when the heating component 4 is in use, it will be partitioned, including three partitions, five partitions, seven partitions, eight partitions, that is, multiple partitions greater than three. The device of the present invention can be applied to the heating component 4 with different partitions, that is, applied to the ceramic heater with different partitions. The specific working process is as described above and will not be elaborated here.

[0104] As Figure 11 shown, the present invention also provides an adjustment method based on the temperature consistency of the ceramic heater, including the following steps:

[0105] S1. During the process of the heating component heating the wafer, the temperature detection device detects the temperature information of the heating component and records it in the memory;

[0106] S2. The temperature detection device feeds back the detected temperature information to the controller, and the controller starts the temperature adjustment component at the corresponding position according to the temperature information for temperature compensation;

[0107] S3. After detecting that the temperature of the heating component has reached the requirement uniformly, turn off the temperature adjustment component to complete the adjustment.

[0108] Furthermore, the temperature adjustment component 5 includes a back temperature compensator 501 and an edge temperature compensator 502. The back temperature compensator 501 is used to perform temperature compensation on the local position of the heating component 4, and the edge temperature compensator 502 is used to perform temperature compensation on the edge position of the heating component 4.

[0109] The specific working process of the above method is as follows: The temperature of the heating component is detected by the temperature detection device. The detected temperature information is recorded by the memory on the one hand and transmitted to the controller for analysis on the other hand to determine whether the local temperature is too high or the edge temperature is too low. Then, the controller starts the temperature adjustment component according to the temperature information to perform temperature compensation on the heating component. When the temperature information shows that the local temperature of the heating component 4 is too high, the back temperature compensator 501 is started to perform back cooling compensation on the heating component 4. When the temperature information shows that the edge temperature of the heating component 4 is too low, the edge temperature compensator 502 is started to perform edge heating compensation on the heating component until the local temperature and the edge temperature of the heating component 4 no longer show abnormal conditions, that is, when the temperature of the entire heating component 4 is uniformly consistent and meets the standard, stop the temperature adjustment component 5 to complete the entire temperature compensation process.

[0110] Further, during the specific detection process, based on the temperature information detected by the temperature detection device, the operator can make a direct judgment. After determining that there is a situation of excessively high local temperature or excessively low edge temperature, the operator activates the temperature adjustment component for compensation adjustment. Specifically, when the operator determines that the local temperature of the heating component 4 is too high, the back temperature compensator 501 is activated to perform back cooling compensation on the heating component 4. When the operator determines that the edge temperature of the heating component 4 is too low, the edge temperature compensator 502 is activated to perform edge heating compensation on the heating component until the local temperature and edge temperature of the heating component 4 no longer show abnormal conditions, that is, when the temperature of the entire heating component 4 is uniform and consistent with the standard, the operator turns off and stops the temperature adjustment component 5 to complete the entire temperature compensation process. The entire process can be automatically controlled by the controller or manually semi-automatically controlled by the operator, and the operation is simple and convenient.

[0111] It should be noted that the heating component 4 in this solution uses a ceramic heater.

[0112] In a possible implementation manner, the temperature detection device is a resistive temperature detector chip.

[0113] It should be noted that the temperature detection device in this technical solution mainly performs multi-point temperature detection on the heating component 4. Any temperature detection device in the prior art that can achieve the above detection function can be applied to the solution of this application, and will not be elaborated here.

[0114] In a possible implementation manner, as Figure 12 shown, it further includes: Step S4, recording the temperature adjustment parameters of the temperature adjustment component and storing them in the memory. When the temperature detection device detects that the temperatures of the heating components are inconsistent, the controller directly calls the temperature adjustment parameters in the memory to adjust the temperature adjustment component.

[0115] When the heating component 4 is heating, when the external environment remains unchanged, the positions and specific situations where temperature differences occur will not change either. By recording the temperature information and the temperature adjustment parameters of the temperature adjustment component in the memory, when the heating component 4 is used again, the controller can directly call the temperature adjustment parameters stored in the memory, thereby performing rapid temperature compensation on the heating component 4, making the heating process of the heating component 4 more meet the requirements.

[0116] The recorded temperature information is convenient for studying the heating process of the entire heating component 4 and better mastering the specific situation when the heating component 4 is heating.

[0117] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are all within the scope and spirit of the present invention as described in the claims. Moreover, the present invention as described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. An adjustment device based on the temperature consistency of a ceramic heater, characterized in that, Comprising: An upper cover assembly, the upper cover assembly includes an outer cover, a middle cover, and an inner cover arranged in sequence. A plurality of middle cover support columns are connected to the middle cover, the middle cover support columns are connected to the outer cover, the middle cover is connected to a plurality of inner cover support columns, and the inner cover support columns are connected to the inner cover. A uniform exhaust cavity is provided between the lower surface of the outer cover and the upper surface of the middle cover, and a uniform intake cavity is provided between the lower surface of the middle cover and the upper surface of the inner cover; A lower disk assembly, arranged below the upper cover assembly, and the lower disk assembly and the upper cover assembly form a heating cavity in combination; A heating assembly, installed inside the lower disk assembly; The lower disk assembly includes a fixed seat, a sealing plate is arranged inside the fixed seat, and the heating assembly is installed on the fixed seat; An air flow exchange channel is provided between the fixed seat and the outer cover, and the air flow exchange channel is in mutual communication with the uniform exhaust cavity; A temperature adjustment assembly, installed inside the lower disk assembly, performs temperature compensation and adjustment on the heating assembly. The temperature adjustment assembly includes at least one back temperature compensator, the back temperature compensator is arranged on the back of the heating assembly and on the sealing plate. A compensation channel for introducing cooling gas is further arranged inside the back temperature compensator. The compensation channel is in communication with the air flow exchange channel of the lower disk assembly. The cooling gas introduced into the compensation channel is discharged into the uniform exhaust cavity through the air flow exchange channel. The back temperature compensator is a back cooling block, and a temperature control area is formed between the back temperature compensator and the heating assembly; The temperature adjustment assembly further includes an edge temperature compensator, the edge temperature compensator is arranged on the outer edge of the heating assembly, and performs temperature compensation on the heating assembly; A ventilation assembly, installed on the upper cover assembly, discharges and introduces gas inside the heating cavity to maintain the stability of the air flow inside the heating cavity.

2. The adjustment device based on the temperature uniformity of the ceramic heater according to claim 1, characterized in that The ventilation assembly includes a ventilation block installed on the upper surface of the outer cover. The intake end of the ventilation block is connected to an intake pipe, and the exhaust end of the ventilation block is connected to an exhaust pipe. The intake pipe is in mutual communication with the uniform intake cavity, and the exhaust pipe is in mutual communication with the uniform exhaust cavity.

3. The adjustment device based on the temperature consistency of the ceramic heater according to claim 1, characterized in that A plurality of air outlet holes are further arranged on the surface of the inner cover, and the gas inside the uniform intake cavity is discharged into the heating cavity through the air outlet holes.

4. The adjustment device based on the temperature consistency of the ceramic heater according to claim 2, characterized in that The uniform exhaust cavity is connected to the exhaust end of the ventilation block through a middle exhaust channel, the middle exhaust channel is installed on the middle cover, and the uniform intake cavity is connected to the intake end of the ventilation block through an inner intake channel, and the inner intake channel is installed on the inner cover.

5. The adjustment device based on the temperature consistency of the ceramic heater according to claim 1, characterized in that, The heating assembly is a ceramic heater.

6. The adjustment device based on the temperature consistency of the ceramic heater according to claim 1, wherein A plurality of installation threaded holes are further arranged on the upper surface of the fixed seat, and a wafer positioning guide post is threadedly connected inside the installation threaded holes. A through hole is further arranged at the center of the wafer positioning guide post.

7. A method for adjusting the temperature consistency based on a ceramic heater, characterized in that, Applied to the adjustment device for the temperature consistency based on a ceramic heater according to any one of claims 1-6, comprising the following steps: During the process of the heating component heating the wafer, the temperature detection device detects the temperature information of the heating component and records it in the memory; The temperature detection device feeds back the detected temperature information to the controller, and the controller starts the temperature adjustment component at the corresponding position for temperature compensation according to the temperature information; After detecting that the temperature of the heating component has uniformly reached the requirement, the temperature adjustment component is turned off to complete the adjustment.

8. The adjustment method based on the temperature consistency of the ceramic heater according to claim 7, characterized in that The temperature detection device is a resistive temperature detector chip.

9. The adjustment method based on the temperature uniformity of the ceramic heater according to claim 7, wherein The temperature adjustment component includes a back temperature compensator and an edge temperature compensator. The back temperature compensator is used to perform temperature compensation on local positions on the heating component, and the edge temperature compensator is used to perform temperature compensation on the edge positions of the heating component.

10. The adjustment method based on the temperature consistency of the ceramic heater according to claim 7, characterized in that, It further includes: Recording the temperature adjustment parameters of the temperature adjustment component and storing them in the memory. When the temperature detection device detects that the temperature of the heating component is inconsistent, the controller directly calls the temperature adjustment parameters in the memory to adjust the temperature adjustment component.

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