Packaging structure and manufacturing method thereof and electronic device

Abstract

The present invention discloses a packaging structure and a manufacturing method thereof and an electronic device. The manufacturing method comprises: preparing a mother substrate, the mother substrate having a conductor layer, the conductor layer comprising a plurality of patterned circuits; forming a plurality of visual units on the mother substrate, the bright area of ​​each visual unit being provided with a photoelectric element, the photoelectric element being arranged correspondingly and electrically connected to at least one of the patterned circuits, and a dark area being defined around the bright area; arranging a plurality of packages on the mother substrate, each package completely covering each bright area and partially covering the corresponding patterned circuit, so that the average reflectivity inside each package is greater than the average reflectivity outside thereof; and cutting along the periphery of each visual unit.

Description

Technical Field

[0001] The present invention relates to a packaging structure and a manufacturing method thereof and an electronic device, and in particular to a packaging structure with high contrast characteristics and a manufacturing method thereof and an electronic device. Background Art

[0002] Light-emitting diodes are light-emitting components made of semiconductor materials. The components have two electrode terminals. When voltage is applied between the terminals, a very small voltage is passed through, and the remaining energy can be stimulated and released in the form of light through the combination of electrons and holes. Unlike ordinary incandescent bulbs, light-emitting diodes are cold-emitting, with advantages such as low power consumption, long component life, no warm-up time, and fast response speed. In addition, they are small in size, vibration-resistant, suitable for mass production, and easy to be made into very small or array modules in accordance with application requirements. Therefore, they can be widely used in lighting equipment, information, communications, indicators of consumer electronic products, backlight modules of display devices, and displays themselves, and have become one of the indispensable and important components in daily life. Summary of the invention

[0003] The object of the present invention is to provide a packaging structure with high contrast characteristics, a manufacturing method thereof and an electronic device.

[0004] To achieve the above-mentioned purpose, a manufacturing method of a packaging structure according to the present invention includes: preparing a mother substrate, wherein the mother substrate has a conductor layer, and the conductor layer includes multiple patterned circuits; forming multiple visual units on the mother substrate, wherein each visual unit has a bright area and a dark area, and the bright area is provided with a photoelectric element, and the photoelectric element is correspondingly arranged and electrically connected to at least one of these patterned circuits, and the dark area is defined along the periphery of the bright area; arranging multiple packages on the mother substrate, wherein each package completely covers the bright area of ​​each visual unit and partially covers the corresponding patterned circuit, so that the average reflectivity inside each package is greater than the average reflectivity outside thereof; and cutting the mother substrate along the periphery of each visual unit.

[0005] In one embodiment, the step of forming a plurality of visual units on the mother substrate further includes: forming a plurality of light reflecting layers on the mother substrate, wherein each light reflecting layer is located above or below the wire layer, and at least a portion of each light reflecting layer defines a bright area of ​​each visual unit.

[0006] In one embodiment, the step of forming a plurality of visual units on the mother substrate further includes: forming a plurality of light absorbing layers on the mother substrate, wherein each light absorbing layer is arranged around the bright area of ​​each visual unit, and each light absorbing layer defines the dark area of ​​each visual unit.

[0007] In one embodiment, in the step of preparing the mother substrate, the mother substrate is a light reflecting plate or a light absorbing plate.

[0008] In one embodiment, in the step of forming a plurality of light reflecting layers on the mother substrate, the wire layer is located between the light reflecting layer and the mother substrate.

[0009] In one embodiment, the step of forming a plurality of visual units on a mother substrate further includes: forming a plurality of light absorbing layers on the mother substrate, each light absorbing layer being arranged around a bright area of ​​each visual unit, and each light absorbing layer defining a dark area of ​​each visual unit; in the step of forming a plurality of light reflecting layers on the mother substrate, the wire layer is located between the light reflecting layer and the mother substrate, or the light reflecting layer is located between the wire layer and the mother substrate.

[0010] In one embodiment, before the step of cutting the mother substrate around each visual unit, it also includes: forming a plurality of first electrical connection pads on the mother substrate, so that at least one of the first electrical connection pads is arranged around each visual unit, and these first electrical connection pads correspond to the patterned circuit of the conductor layer; and forming a plurality of second electrical connection pads on the conductor layer of the mother substrate, so that the optoelectronic elements of each visual unit are electrically connected to the conductor layer through each second electrical connection pad.

[0011] In one embodiment, before the step of cutting the mother substrate around each visual unit, it also includes: forming a plurality of through holes on the mother substrate, and making these through holes correspond to the patterned circuits of the conductor layer; and setting a conductive member in each through hole, and electrically connecting it to the corresponding patterned circuit, wherein the conductive member is electrically connected to the optoelectronic element of each visual unit through each patterned circuit.

[0012] In one embodiment, in the step of disposing a plurality of packages on the mother substrate, each package further covers a dark area in each corresponding visual unit.

[0013] To achieve the above-mentioned purpose, a packaging structure according to the present invention includes a substrate, a wire layer, a visual unit and a package. The wire layer is arranged on the substrate, and the wire layer includes a plurality of patterned circuits. The visual unit is arranged on the substrate, wherein the visual unit has a bright area and a dark area defined around the bright area, and a photoelectric element is arranged in the bright area, and the photoelectric element is arranged corresponding to at least one of the patterned circuits and is electrically connected. The package is arranged on the substrate, wherein the package completely covers the bright area of ​​the visual unit and partially covers the corresponding patterned circuit, and the average reflectivity inside the package is greater than the average reflectivity outside thereof.

[0014] In one embodiment, the substrate is a soft board.

[0015] In one embodiment, the substrate is a light absorbing plate or a light reflecting plate.

[0016] In one embodiment, the packaging structure further includes a light reflecting layer disposed on the substrate, the light reflecting layer is located above or below the wire layer, and at least a portion of the light reflecting layer is defined as a bright area of ​​the visual unit.

[0017] In one embodiment, the packaging structure further includes a light absorbing layer disposed on the substrate, wherein the light absorbing layer is disposed around the bright area of ​​the visual unit, and the light absorbing layer is defined as a dark area of ​​the visual unit.

[0018] In one embodiment, the packaging structure further includes a light absorbing layer disposed on the substrate or the light reflecting layer, wherein the light absorbing layer is disposed around the bright area of ​​the visual unit and is defined as the dark area of ​​the visual unit.

[0019] In one embodiment, the conductive line layer is located between the light reflecting layer and the substrate.

[0020] In one embodiment, the conductive line layer is located between the light reflecting layer and the substrate, or the light reflecting layer is located between the conductive line layer and the substrate.

[0021] In one embodiment, the packaging structure also includes a plurality of first electrical connection pads and a plurality of second electrical connection pads, wherein the plurality of first electrical connection pads are arranged on the substrate, wherein each first electrical connection pad is arranged around the visual unit and corresponds to the patterned circuit of the conductor layer; and the plurality of second electrical connection pads are arranged on the substrate, wherein each second electrical connection pad is arranged on the conductor layer and is electrically connected to the optoelectronic elements of each visual unit through each patterned circuit corresponding to the conductor layer.

[0022] In one embodiment, the packaging structure further includes a plurality of through holes and a conductive member. The plurality of through holes are arranged on the substrate, and the through holes correspond to the patterned circuits of the conductor layer; the conductive member is arranged in each through hole and electrically connected to the corresponding patterned circuit, wherein the conductive member is electrically connected to the optoelectronic element of the visual unit through the corresponding patterned circuit.

[0023] To achieve the above-mentioned purpose, an electronic device according to the present invention includes a driving circuit board, one of the aforementioned packaging structures, and a plurality of conductive materials. The driving circuit board includes a conductive layer; a plurality of packaging structures are disposed on the driving circuit board; and a plurality of conductive materials are disposed on the conductive layer. The optoelectronic components of each packaging structure are electrically connected to the conductive layer of the driving circuit board through the patterned circuits and the conductive materials.

[0024] As described above, in the packaging structure and manufacturing method thereof and the electronic device of the present invention, the visual unit has a bright area of ​​the photoelectric element and a dark area defined around the bright area. When the package completely covers the bright area of ​​the visual unit, the average reflectivity inside the package can be greater than the average reflectivity outside the package. As a result, the packaging structure and the electronic device can have high contrast characteristics and enhance product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The figure is a flow chart of a method for manufacturing a packaging structure according to a preferred embodiment of the present invention.

[0026] FIG. 2A to FIG. 2H Each of them is a schematic diagram of a manufacturing process of a packaging structure according to an embodiment of the present invention.

[0027] Figure 3A , Figure 4A , Figure 5A and Fig. 6A They are respectively top views of packaging structures according to different embodiments of the present invention.

[0028] Figure 3B for Figure 3A A schematic cross-sectional view of the packaging structure along the section line 3B-3B.

[0029] Figure 4B for Figure 4A A schematic cross-sectional view of the packaging structure along the section line 4B-4B.

[0030] Figure 5B for Figure 5A A schematic cross-sectional view of the packaging structure along the section line 5B-5B.

[0031] Figure 6B for Fig. 6A A schematic cross-sectional view of the packaging structure along the section line 6B-6B.

[0032] Figure 7 FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0033] The packaging structure and the manufacturing method thereof and the electronic device according to the preferred embodiments of the present invention will be described below with reference to the relevant drawings, wherein the same elements will be described with the same reference numerals.

[0034] Figure 1 The figure is a flow chart of a method for manufacturing a packaging structure according to a preferred embodiment of the present invention.

[0035] like Figure 1As shown, the manufacturing method of the package structure may include: preparing a mother substrate, wherein the mother substrate has a conductor layer, and the conductor layer includes a plurality of patterned circuits (step S01); forming a plurality of visual units on the mother substrate, wherein each visual unit has a bright area and a dark area, and the bright area is provided with a photoelectric element, and the photoelectric element is arranged correspondingly and electrically connected to at least one of the patterned circuits, and the dark area is defined along the periphery of the bright area (step S02); arranging a plurality of packages on the mother substrate, wherein each package completely covers the bright area of ​​each visual unit and partially covers the corresponding patterned circuit, so that the average reflectivity inside each package is greater than the average reflectivity outside thereof (step S03); and cutting the mother substrate along the periphery of each visual unit (step S04). The mother substrate may include a hard substrate or a soft substrate. In some embodiments, if the mother substrate includes a flexible substrate, in order to allow subsequent circuits or components to be smoothly formed on the flexible substrate through subsequent processes and to facilitate the operation of the flexible substrate, the flexible substrate needs to be formed on a rigid carrier first, and then the rigid carrier can be removed in subsequent steps. However, if the mother substrate includes a rigid substrate, this process is not required.

[0036] Please refer to Figure 1 And cooperate FIG. 2A to FIG. 2H , to explain each of the above steps in detail. FIG. 2A to FIG. 2H They are schematic diagrams of the manufacturing process of a packaging structure 1 according to an embodiment of the present invention.

[0037] First, prepare the mother substrate 11 (step S01). The mother substrate 11 may include an insulating substrate, and the material of the insulating substrate may be glass, resin, metal or ceramic, or a composite material. The resin material is flexible and may include an organic polymer material, and the glass transition temperature (Glass Transition Temperature, Tg) of the organic polymer material may be, for example, between 250 degrees Celsius and 600 degrees Celsius, and the preferred temperature range may be, for example, between 300 degrees Celsius and 500 degrees Celsius. With such a high glass transition temperature, components or circuits can be directly formed on the soft substrate in the subsequent process. Here, the organic polymer material may be a thermoplastic material, such as polyimide (PI), polyethylene (Polyethylene, PE), polyvinyl chloride (Polyvinylchloride, PVC), polystyrene (PS), acrylic (acrylic), fluorinated polymer (Fluoropolymer), polyester fiber (polyester) or nylon (nylon).

[0038] like Figure 2AAs shown, the mother substrate 11 of this embodiment includes a flexible substrate 111 (material is PI, for example), and is disposed on the rigid carrier 10 by gluing or coating. Figure 2B As shown, the mother substrate 11 further has a conductive line layer (not shown), and the conductive line layer may include a plurality of patterned circuits 112 . Figure 2B The number of patterned circuits 112 shown is four. The patterned circuit 112 can be a thin film conductive circuit made by a thin film process, which can be a semiconductor process, and can be a low temperature polycrystalline silicon (LTPS) process, an amorphous silicon (α-Si) process, or a metal oxide (such as IGZO) semiconductor process; or, the patterned circuit 112 can also be a conductive circuit formed by copper foil or other conductive materials, which is not limited by the present invention. In some embodiments, if an active matrix electronic device is to be spliced ​​later, a thin film element, a conductive circuit or a film layer can also be formed on the substrate 111, such as a thin film transistor, a thin film resistor, a capacitor, a conductive layer, a metal layer, an insulating layer, a transmission line for a scan signal and a data signal, etc.

[0039] Next, before the step S04 of cutting the mother substrate around each visual unit, as shown in FIG. Figure 2B As shown, the manufacturing method of this embodiment may also include: forming a plurality of first electrical connection pads 16 on the mother substrate 11, wherein these first electrical connection pads 16 correspond to these patterned circuits 112 of the conductor layer. The material of the first electrical connection pads 16 is, for example but not limited to, copper, silver or gold, or a combination thereof, or other suitable conductive materials. Here, the first electrical connection pads 16 can be made by, for example, a printing process or other suitable methods. These first electrical connection pads 16 of this embodiment are respectively formed on these patterned circuits 112 (all four), and are in direct contact and electrically connected to each other.

[0040] In addition, before the step S02 of forming a plurality of visual units on the mother substrate, Figure 2C As shown, the manufacturing method of this embodiment may further include: directly or indirectly forming a plurality of light reflecting layers 12 on the mother substrate 11. Here, the light reflecting layer 12 is, for example but not limited to, a white photoresist, and the light reflecting layer 12 may be formed on the mother substrate 11 or the patterned circuit 112 by, for example, coating or printing or other appropriate methods, or simultaneously formed on appropriate positions of the patterned circuit 112 and the substrate 111 as in this embodiment. The light reflecting layer 12 may reflect the light directed toward the substrate 111 and emit it upward to improve the light output efficiency and contrast. It is worth noting that the step of forming a plurality of light reflecting layers 12 may be performed after the process of forming the conductive wire layer, so that each light reflecting layer 12 may be located above the conductive wire layer (patterned circuit 112) (as in this embodiment). Figure 2C); or, it may be performed before the process of forming the conductive line layer, so that the light reflecting layer 12 may be located under the conductive line layer (patterned circuit 112) (not shown), and the present invention is not limited thereto.

[0041] In addition, before the step S02 of forming a plurality of visual units on the mother substrate, Figure 2D As shown, the manufacturing method of this embodiment may also include: directly or indirectly forming a plurality of light absorbing layers 15 on the mother substrate 11. Here, the light absorbing layer 15 is, for example but not limited to, a black photoresist, and may be formed by, for example, coating or printing, or other appropriate methods. In this embodiment, the light absorbing layer 15 is formed on the light reflecting layer 12 and is located next to the first electrical connection pad 16. In different embodiments, the process of forming a plurality of light absorbing layers 15 or a plurality of first electrical connection pads 16 on the mother substrate 11 may also be before or after the step S02 of forming a plurality of visual units on the mother substrate, which is not limited by the present invention.

[0042] Afterwards, if Figure 2E As shown, step S02 is then performed: forming a plurality of visual units 13 on the mother substrate 11, wherein each visual unit 13 is defined with a bright area LA and a dark area DA, and at least one optoelectronic element 131 is directly or indirectly disposed on the mother substrate 11 in the bright area LA, and the optoelectronic element 131 is disposed correspondingly and electrically connected to at least one of the patterned circuits 112, and the dark area DA is defined around the bright area LA. As the name implies, the dark area DA is an area at least covered by the light absorption layer 15, so that the light absorption layer 15 absorbs light to present a dark area, and the bright area LA is an area where the optoelectronic element 131 and the light reflection layer 12 are disposed, so that the optoelectronic element 131 emits light, or the light reflection layer 12 reflects light to present a bright area, thereby improving contrast. In some embodiments, the visual unit 13 may include, for example but not limited to, three optoelectronic elements 131 to form three sub-pixels.

[0043] In the present embodiment, the photoelectric element 131 may be a flip chip type photoelectric element, such as but not limited to LED (light emitting diode), Mini LED or Micro LED, and may include at least one electrode. The photoelectric element 131 of the present embodiment is taken as an example including two electrodes (not shown). In addition, in order to electrically connect with the electrodes of the photoelectric element 131, before the step S02 of forming a plurality of visual units 13 on the mother substrate 11, the manufacturing method of the present embodiment may also include: forming a plurality of second electrical connection pads 17 on the wire layer (patterned circuit 112) of the mother substrate 11, so that the photoelectric element 131 of each visual unit 13 can be electrically connected to the wire layer (patterned circuit 112) through each second electrical connection pad 17. Here, the material of the second electrical connection pad 17 is, for example but not limited to, copper, silver or gold, or a combination thereof, or other suitable conductive materials. Among them, a plurality of second electrical connection pads 17 can be made by, for example, a printing process or other suitable methods, so that each photoelectric element 131 can be electrically connected to the corresponding patterned circuit 112 through two second electrical connection pads 17. In some embodiments, for example, conductive materials such as solder balls or Au bumps can be melted by heating, or materials such as copper glue, silver glue, or anisotropic conductive glue (ACP) can be used to electrically connect the two electrodes of the photoelectric element 131 to the second electrical connection pads 17. In different embodiments, the photoelectric element 131 can also be electrically connected to the corresponding patterned circuit 112 by wire bonding, which is not limited by the present invention.

[0044] In this embodiment, if Figure 2E As shown, a portion of the light reflecting layer 12 is located below the photoelectric element 131 of the visual unit 13 to reflect the light emitted from the bottom of the photoelectric element 131 to the substrate 111, thereby improving the light extraction efficiency. In addition, each light absorbing layer 15 of the present embodiment is arranged around the bright area LA of each visual unit 13, so that each light absorbing layer 15 can define the dark area DA of each visual unit 13, and a portion of each light reflecting layer 12 can define the bright area LA of each visual unit 13. In other words, in the present embodiment, the area where the light absorbing layer 15 is not arranged can be regarded as the aforementioned bright area LA, and the area where the light absorbing layer 15 is arranged can be regarded as the aforementioned dark area DA, and the dark area DA is defined along the periphery of the bright area LA (that is, the dark area DA surrounds the bright area LA). In addition, in the aforementioned process of forming a plurality of first electrical connection pads 16, at least one first electrical connection pad 16 is arranged around each visual unit 13. Here, a plurality of ( Figure 2E Taking two first electrical connection pads 16 as an example, a plurality of first electrical connection pads 16 can be electrically connected to corresponding optoelectronic elements 131 through corresponding patterned circuits 112 and second electrical connection pads 17 .

[0045] Then, if Figure 2F As shown, a plurality of packages 14 are arranged on the mother substrate 11, wherein each package 14 completely covers the bright area LA of each visual unit 13 and partially covers the corresponding patterned circuit 112, so that the average reflectivity inside each package 14 is greater than the average reflectivity outside thereof (step S03). Since each package 14 of the present embodiment completely covers the bright area LA of each visual unit 13, the area covered by the package 14 can be regarded as the aforementioned bright area LA, and the area not covered by the package 14 can be regarded as the aforementioned dark area DA because it includes the light absorbing layer 15. The package 14 can be formed by curing a simple and light-transmissive packaging glue material to completely cover the optoelectronic element 131 and part of the light reflecting layer 12 and the patterned circuit 112, thereby protecting the optoelectronic element 131, the light reflecting layer 12 and the patterned circuit 112 from the invasion of moisture or foreign matter and destroying their characteristics.

[0046] In some embodiments, the light emission color of the packaging structure can be adjusted by the packaging member 14 according to the design needs. For example, if the packaging member 14 is a packaging glue with added fluorescent powder, the light emission color of the packaging structure can be controlled by matching the color of the photoelectric element 131. For example, the blue photoelectric element 131 can be matched with yellow fluorescent powder that can be excited by blue light to form white light. In addition, the side of the packaging member 14 of this embodiment is located between the light absorbing layer 15 and the photoelectric element 131, and the packaging member 14 does not cover the light absorbing layer 15. However, in different embodiments, each packaging member 14 can further cover (part of) the light absorbing layer 15 in the corresponding visual unit 13, and the present invention is not limited.

[0047] Finally, the mother substrate 11 is cut along the periphery of each visual unit 13 (step S04). Here, the mother substrate 11 is cut along the periphery of each visual unit 13, usually between two adjacent first electrical connection pads 16, to obtain Figure 2H However, before the cutting process of step S04 is performed, the manufacturing method of this embodiment may further include: removing the rigid carrier 10 ( Figure 2G Of course, in different embodiments, the rigid carrier board 10 may be removed after the cutting step S04, and the present invention is not limited thereto.

[0048] In Figure 2HThe packaging structure 1 of the embodiment includes a substrate 111, a wire layer (not shown), a visual unit 13 and a package 14. The substrate 111 is a soft board (it may be a hard board in different embodiments); the wire layer is arranged on the substrate 111, and the wire layer may include a plurality of patterned circuits 112; the visual unit 13 is arranged on the substrate 111, wherein the visual unit 13 has a bright area LA and a dark area DA defined around the bright area LA, and the bright area LA is provided with a photoelectric element 131, and the photoelectric element 131 is arranged correspondingly to and electrically connected to the patterned circuit 112; the package 14 is arranged on the substrate 111, wherein the package 14 completely covers the bright area LA of the visual unit 13, and partially covers the corresponding patterned circuit 112, so that the average reflectivity inside the package 14 is greater than the average reflectivity outside thereof, so as to form a high-contrast packaging structure 1.

[0049] In addition, the package structure 1 of the present embodiment may further include a light reflection layer 12 and a light absorption layer 15, and the light reflection layer 12 and the light absorption layer 15 are respectively disposed on the substrate 111. The light reflection layer 12 is located on the patterned circuit 112, so that the conductor layer (patterned circuit 112) is located between the substrate 111 and the light reflection layer 12, and a portion of the light reflection layer 12 (i.e., the portion not covered by the light absorption layer 15) can be defined as the bright area LA of the visual unit 13; in addition, the light absorption layer 15 is disposed around the bright area LA of the visual unit 13, and the light absorption layer 15 can be defined as the dark area DA of the visual unit 13. Here, the light absorption layer 15 is disposed on the light reflection layer 12, so that a portion of the light reflection layer 12 can be located between the light absorption layer 15 and the patterned circuit 112.

[0050] In addition, the packaging structure 1 of the present embodiment may further include a plurality of first electrical connection pads 16 and a plurality of second electrical connection pads 17, and the plurality of first electrical connection pads 16 and the plurality of second electrical connection pads 17 are respectively disposed on the substrate 111. The first electrical connection pads 16 are disposed around the visual unit 13, and correspond to the patterned circuit 112, and are directly in contact with and electrically connected to the corresponding patterned circuit 112; the second electrical connection pads 17 are disposed on the wire layer, and the optoelectronic element 131 of the visual unit 13 is electrically connected to the patterned circuit 112 corresponding to the wire layer through the second electrical connection pads 17. Here, the first electrical connection pad 16 is adjacent to the light reflection layer 12 and the light absorption layer 15, and is disposed on the patterned circuit 112 and contacts the patterned circuit 112, so that the first electrical connection pad 16 can be electrically connected to the optoelectronic element 131 through the corresponding patterned circuit 112 and the second electrical connection pad 17.

[0051] Therefore, in the packaging structure 1 of the present embodiment, the visual unit 13 has a bright area LA of the photoelectric element 131 and a dark area DA defined around the bright area LA, so that when the package 14 completely covers the bright area LA of the visual unit 13, the average reflectivity inside the package 14 can be greater than the average reflectivity outside thereof. As a result, the packaging structure 1 can have the characteristics of high contrast and enhance product competitiveness.

[0052] Please refer to FIG. 3A to FIG. 6B , to illustrate the packaging structure of different embodiments of the present invention. Figure 3A , Figure 4A , Figure 5A and Fig. 6A They are respectively top views of packaging structures according to different embodiments of the present invention, Figure 3B for Figure 3A A schematic cross-sectional view of the package structure along the 3B-3B section line, Figure 4B for Figure 4A A schematic cross-sectional view of the package structure along the section line 4B-4B, Figure 5B for Figure 5A A schematic cross-sectional view of the package structure along the 5B-5B section line, and Figure 6B for Fig. 6A The schematic cross-sectional view of the package structure along the 6B-6B section line is shown first. Figure 3B and Figure 2H However, for the sake of convenience, Figure 3B Labeled as packaging structure 1a.

[0053] exist Figure 3A and Figure 3B In the embodiment, the visual unit 13 of the packaging structure 1a may, for example, include three photoelectric elements 131 to form three sub-pixels. The three photoelectric elements 131 in the three sub-pixels may be red, blue and green LEDs, Mini LEDs or Micro LEDs, respectively, to form a full-color pixel unit, so that multiple packaging structures 1a (visual units 13) can constitute a full-color LED, Mini LED or Micro LED display. Figure 3A The three optoelectronic components 131 shown may be designed with a common anode or a common cathode. Therefore, the package structure 1 a has four first electrical connection pads 16 , and each first electrical connection pad 16 is electrically connected to the three optoelectronic components 131 through a corresponding patterned circuit 112 .

[0054] In addition, if Figure 4A and Figure 4BAs shown, the manufacturing method and structure of the package structure 1b of the present embodiment are substantially the same as the manufacturing method and structure of the package structure 1 (or 1a) of the aforementioned embodiment. The difference is that the package structure 1b of the present embodiment does not have the first electrical connection pad 16, and before the step S04 of cutting the mother substrate 11 around each visual unit 13, the manufacturing method of the package structure 1b of the present embodiment may also include: forming a plurality of through holes H on the mother substrate 11 (substrate 111), and making these through holes H correspond to these patterned circuits 112 of the conductor layer; and, arranging a conductive member 18 in each through hole H, and electrically connecting it to the corresponding patterned circuit 112, wherein the conductive member 18 can be electrically connected to the optoelectronic element 131 of each visual unit 13 through each patterned circuit 112. Here, the substrate 111 can be irradiated with a laser (e.g., laser) to form a plurality of through holes H penetrating the upper and lower surfaces, and then the conductive member 18 can be filled in the through holes H, so that the upper surface of the substrate 111 can be electrically connected to the lower surface of the substrate 111 through the conductive member 18 of the through hole H, and the conductive member 18 can be electrically connected to the second electrical connection pad 17 and the photoelectric element 131 of the visual unit 13 through the patterned circuit 112. The conductive member 18 is formed by curing materials such as, but not limited to, copper glue, silver glue, solder paste, or anisotropic conductive glue (ACP). It is particularly mentioned that in this process, if the substrate 111 is a soft material (e.g., PI) and the through hole H is to be formed by irradiating the laser from the lower surface of the substrate 111 upwards, the aforementioned rigid carrier 10 must be removed before the through hole H is formed before this process can be performed.

[0055] In addition, if Figure 5A and Figure 5B As shown, the manufacturing method and structure of the packaging structure 1c of this embodiment are substantially the same as the manufacturing method and structure of the packaging structure 1 (or 1a) of the aforementioned embodiment. The difference is that the packaging structure 1c of this embodiment does not have a light reflecting layer 12, and therefore, the patterned circuit 112 is located between the light absorbing layer 15 and the substrate 111'. Since the light reflecting layer 12 is not provided, in the step S01 of preparing the mother substrate, the mother substrate of this embodiment (i.e., the substrate 111') itself is a light reflecting plate with high reflectivity (which may be a soft plate or a hard plate) to directly reflect the light emitted by the photoelectric element 131 and directed toward the substrate 111', thereby improving the light extraction efficiency. In some embodiments, the light reflecting plate may be, for example, a white PI film, and its reflectivity may be much greater than the reflectivity of the light absorbing layer 15.

[0056] In addition, if Fig. 6A and Figure 6BAs shown, the manufacturing method and structure of the package structure 1d of this embodiment are substantially the same as the manufacturing method and structure of the package structure 1 (or 1a) of the aforementioned embodiment. The difference is that the light reflection layer 12 of the package structure 1d of this embodiment is only disposed inside the package 14, and the light absorption layer 15 is directly disposed on the patterned circuit 112, and is not disposed on the light reflection layer 12. Therefore, the patterned circuit 112 is located between the light absorbing layer 15 and the substrate 111". In addition, in step S01 of preparing the mother substrate, the mother substrate (i.e., substrate 111") of the present embodiment is itself a light absorbing plate (which may be a soft plate or a hard plate) with low reflectivity to absorb the light emitted by the photoelectric element 131 and directed toward the substrate 111", thereby improving the contrast. In some embodiments, the light absorbing plate may be, for example, a black PI film, and its reflectivity may be much lower than the reflectivity of the light reflecting layer 12. In addition, the packaging structure 1d of the present embodiment does not have a first electrical connection pad 16, but uses the through hole H and the conductive member 18 of the packaging structure 1b to make the upper and lower surfaces of the substrate 111" electrically conductive.

[0057] It should be noted that the design of the substrate 111' of the aforementioned packaging structure 1c as a light reflecting plate can also be applied to the packaging structures 1a and 1b, and the design of the substrate 111" of the aforementioned packaging structure 1d as a light absorbing plate can also be applied to the packaging structures 1a and 1b, and the present invention is not limited to either.

[0058] Figure 7 FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. Figure 7 As shown, the electronic device 3 may include a driving circuit board 2, a plurality of packaging structures 1e ( Figure 7 Only one package structure 1e) and a plurality of conductive materials 31 are shown. The driving circuit board 2 includes a conductive layer 21, and the package structure 1e is disposed on the driving circuit board 2, and a plurality of conductive materials 31 are disposed on the conductive layer 21. Here, the conductive material 31 may be a conductive glue or a conductive paste, such as but not limited to materials including copper glue, silver glue, solder paste or anisotropic conductive glue (ACP). Therefore, the optoelectronic elements 131 of each package structure 1e can be electrically connected to the conductive layer 21 of the driving circuit board 2 through these patterned circuits 112, these first electrical connection pads 16, and these conductive materials 31, so as to drive these optoelectronic elements 131 of these package structures 1e to emit light through the driving circuit board 2.

[0059] The package structure 1e can be one of the aforementioned package structures 1, 1a to 1d, or a variation thereof. The package structure 1e of the present embodiment is a variation of the package structure 1 as an example. In the package structure 1e, the light reflection layer 12 is located below the conductor layer (patterned circuit 112) (the light reflection layer 12 is located between the patterned circuit 112 and the substrate 111), so that the light absorption layer 15 and the first electrical connection pad 16 can be directly disposed on the patterned circuit 112 and directly contact the patterned circuit 112. In addition, the electronic device 3 of the present embodiment may further include a light absorption member 32, which is disposed between the package structure 1e and the driving circuit board 2, and the package structure 1e is disposed on the light absorption member 32 through an adhesive member 33. In addition, the electronic device 3 of the present embodiment may further include another light absorption layer 34, which is disposed around the package structure 1e and the conductive material 31 and is located on the conductive layer 21, thereby improving the contrast of the electronic device 3.

[0060] In some embodiments, a plurality of package structures 1e may be disposed at intervals on the driver circuit board 2 (arranged in straight rows, horizontal columns, or a matrix of rows and columns, or arranged in a polygonal or irregular shape according to the needs of the client), and electrically connected to the driver circuit board respectively. In some embodiments, a plurality of package structures 1e may form a matrix of rows and columns to form an active matrix (AM) electronic device, such as but not limited to an active matrix LED, Mini LED or MicroLED display.

[0061] In summary, in the packaging structure and its manufacturing method and electronic device of the present invention, the visual unit has a bright area of ​​the photoelectric element and a dark area defined around the bright area. When the package completely covers the bright area of ​​the visual unit, the average reflectivity inside the package can be greater than the average reflectivity outside the package. As a result, the packaging structure and the electronic device can have high contrast characteristics and enhance product competitiveness.

[0062] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made thereto without departing from the spirit and scope of the present invention shall be included in the scope of the appended claims.

Claims

1. A method for manufacturing a packaging structure, comprising: Prepare a mother substrate, wherein the mother substrate has a conductor layer, and the conductor layer includes a plurality of patterned circuits; Forming a plurality of visual units on the mother substrate, wherein each of the visual units has a bright area and a dark area, the bright area is provided with a photoelectric element, the photoelectric element is correspondingly arranged and electrically connected to at least one of the patterned circuits, and the dark area is defined along the periphery of the bright area; Forming a plurality of first electrical connection pads on the mother substrate, so that at least one first electrical connection pad is disposed around each of the visual units, and the first electrical connection pad corresponds to the patterned circuit of the conductive wire layer; forming a plurality of second electrical connection pads on the wire layer of the mother substrate, so that the optoelectronic elements of each of the visual units are electrically connected to the wire layer through each of the second electrical connection pads; Arranging a plurality of packages on the mother substrate, wherein each package completely covers the bright area of ​​each visual unit and partially covers the corresponding patterned circuit, so that the average reflectivity inside each package is greater than the average reflectivity outside thereof; as well as The mother substrate is cut along the periphery of each of the visual units.

2. The manufacturing method according to claim 1, wherein: The step of forming a plurality of visual units on the mother substrate also includes: A plurality of light reflection layers are formed on the mother substrate, wherein each of the light reflection layers is located above or below the wire layer, and at least a portion of each of the light reflection layers defines the bright area of ​​each of the visual units.

3. The manufacturing method according to claim 1, wherein: The step of forming a plurality of visual units on the mother substrate also includes: A plurality of light absorbing layers are formed on the mother substrate, wherein each of the light absorbing layers is disposed around the bright area of ​​each of the visual units, and each of the light absorbing layers defines the dark area of ​​each of the visual units.

4. The manufacturing method according to claim 1, wherein: In the step of preparing the mother substrate, the mother substrate is a light reflecting plate or a light absorbing plate.

5. The manufacturing method according to claim 2, wherein: In the step of forming a plurality of light reflection layers on the mother substrate, the wire layer is located between the light reflection layer and the mother substrate.

6. The manufacturing method according to claim 2, wherein: The step of forming a plurality of visual units on the mother substrate also includes: Forming a plurality of light absorbing layers on the mother substrate, each of the light absorbing layers being disposed around the bright area of ​​each of the visual units, and each of the light absorbing layers defining the dark area of ​​each of the visual units; In the step of forming a plurality of light reflection layers on the mother substrate, the wire layer is located between the light reflection layer and the mother substrate, or the light reflection layer is located between the wire layer and the mother substrate.

7. The manufacturing method according to claim 1, wherein: In the step of disposing a plurality of packages on the mother substrate, each of the packages further covers the dark area in each corresponding visual unit.

8. A method for manufacturing a packaging structure, comprising: Prepare a mother substrate, wherein the mother substrate has a conductor layer, and the conductor layer includes a plurality of patterned circuits; Forming a plurality of visual units on the mother substrate, wherein each of the visual units has a bright area and a dark area, the bright area is provided with a photoelectric element, the photoelectric element is correspondingly arranged and electrically connected to at least one of the patterned circuits, and the dark area is defined along the periphery of the bright area; Forming a plurality of through holes on the mother substrate, and making the through holes correspond to the patterned circuits of the conductive line layer; Disposing a conductive member in each of the through holes and electrically connecting the conductive member to the corresponding patterned circuit, wherein the conductive member is electrically connected to the photoelectric element of each of the visual units through each of the patterned circuits; Arranging a plurality of packages on the mother substrate, wherein each package completely covers the bright area of ​​each visual unit and partially covers the corresponding patterned circuit, so that the average reflectivity inside each package is greater than the average reflectivity outside thereof; as well as The mother substrate is cut along the periphery of each of the visual units.

9. The manufacturing method according to claim 8, wherein: The step of forming a plurality of visual units on the mother substrate also includes: A plurality of light reflection layers are formed on the mother substrate, wherein each of the light reflection layers is located above or below the wire layer, and at least a portion of each of the light reflection layers defines the bright area of ​​each of the visual units.

10. The manufacturing method according to claim 8, wherein: The step of forming a plurality of visual units on the mother substrate also includes: A plurality of light absorbing layers are formed on the mother substrate, wherein each of the light absorbing layers is disposed around the bright area of ​​each of the visual units, and each of the light absorbing layers defines the dark area of ​​each of the visual units.

11. The manufacturing method according to claim 8, wherein: In the step of preparing the mother substrate, the mother substrate is a light reflecting plate or a light absorbing plate.

12. The manufacturing method according to claim 9, wherein: In the step of forming a plurality of light reflection layers on the mother substrate, the wire layer is located between the light reflection layer and the mother substrate.

13. The manufacturing method according to claim 9, wherein: The step of forming a plurality of visual units on the mother substrate also includes: Forming a plurality of light absorbing layers on the mother substrate, each of the light absorbing layers being disposed around the bright area of ​​each of the visual units, and each of the light absorbing layers defining the dark area of ​​each of the visual units; In the step of forming a plurality of light reflection layers on the mother substrate, the wire layer is located between the light reflection layer and the mother substrate, or the light reflection layer is located between the wire layer and the mother substrate.

14. The manufacturing method according to claim 8, wherein: In the step of disposing a plurality of packages on the mother substrate, each of the packages further covers the dark area in each corresponding visual unit.

15. A packaging structure, comprising: substrate; A conductor layer, disposed on the substrate, the conductor layer comprising a plurality of patterned circuits; A visual unit is disposed on the substrate, wherein the visual unit has a bright area and a dark area defined around the bright area, the bright area is provided with a photoelectric element, and the photoelectric element is correspondingly disposed and electrically connected to at least one of the patterned circuits; A plurality of first electrical connection pads are disposed on the substrate, wherein each of the first electrical connection pads is disposed around the visual unit and corresponds to the patterned circuit of the conductive line layer; A plurality of second electrical connection pads are disposed on the substrate, wherein each of the second electrical connection pads is disposed on the wire layer, and the optoelectronic elements of the visual unit are electrically connected to the wire layer through each of the second electrical connection pads; as well as A package is arranged on the substrate, wherein the package completely covers the bright area of ​​the visual unit and partially covers the corresponding patterned circuit, and the average reflectivity inside the package is greater than the average reflectivity outside the package. The packaging structure according to claim 15 , wherein the substrate is a flexible board. The packaging structure according to claim 15 , wherein the substrate is a light absorbing plate or a light reflecting plate.

18. The package structure according to claim 15, further comprising: A light reflecting layer is disposed on the substrate. The light reflecting layer is located above or below the wire layer. At least a portion of the light reflecting layer is defined as the bright area of ​​the visual unit.

19. The package structure according to claim 15, further comprising: The light absorbing layer is disposed on the substrate, wherein the light absorbing layer is disposed around the bright area of ​​the visual unit and is defined as the dark area of ​​the visual unit.

20. The package structure according to claim 18, further comprising: The light absorbing layer is disposed on the substrate or the light reflecting layer, wherein the light absorbing layer is disposed around the bright area of ​​the visual unit and is defined as the dark area of ​​the visual unit. 21 . The package structure according to claim 18 , wherein the conductive line layer is located between the light reflecting layer and the substrate. 22 . The packaging structure according to claim 20 , wherein the wire layer is located between the light reflection layer and the substrate, or the light reflection layer is located between the wire layer and the substrate.

23. A packaging structure, comprising: substrate; A conductor layer, disposed on the substrate, the conductor layer comprising a plurality of patterned circuits; A visual unit is disposed on the substrate, wherein the visual unit has a bright area and a dark area defined around the bright area, the bright area is provided with a photoelectric element, and the photoelectric element is correspondingly disposed and electrically connected to at least one of the patterned circuits; A plurality of through holes are disposed on the substrate, and the through holes correspond to the patterned circuits of the conductor layer; A conductive member, disposed in each of the through holes and electrically connected to the corresponding patterned circuit, wherein the conductive member is electrically connected to the photoelectric element of the visual unit through the corresponding patterned circuit; as well as A package is arranged on the substrate, wherein the package completely covers the bright area of ​​the visual unit and partially covers the corresponding patterned circuit, and the average reflectivity inside the package is greater than the average reflectivity outside the package. The packaging structure according to claim 23 , wherein the substrate is a flexible board. The packaging structure according to claim 23 , wherein the substrate is a light absorbing plate or a light reflecting plate.

26. The package structure according to claim 23, further comprising: A light reflecting layer is disposed on the substrate. The light reflecting layer is located above or below the wire layer. At least a portion of the light reflecting layer is defined as the bright area of ​​the visual unit.

27. The package structure according to claim 23, further comprising: The light absorbing layer is disposed on the substrate, wherein the light absorbing layer is disposed around the bright area of ​​the visual unit and is defined as the dark area of ​​the visual unit.

28. The package structure according to claim 26, further comprising: The light absorbing layer is disposed on the substrate or the light reflecting layer, wherein the light absorbing layer is disposed around the bright area of ​​the visual unit and is defined as the dark area of ​​the visual unit.

29. The packaging structure as claimed in claim 26, wherein the wire layer is located between the light reflecting layer and the substrate. 30 . The packaging structure according to claim 28 , wherein the wire layer is located between the light reflection layer and the substrate, or the light reflection layer is located between the wire layer and the substrate.

31. An electronic device comprising: A driving circuit board including a conductive layer; A plurality of packaging structures as claimed in any one of claims 15 to 30, arranged on the driving circuit board; as well as A plurality of conductive materials are disposed on the conductive layer; Wherein, the optoelectronic elements of each of the packaging structures are electrically connected to the conductive layer of the driving circuit board through the patterned circuit and the conductive material.

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