A microchannel heat exchanger

Abstract

The present invention relates to a microchannel heat exchanger, which belongs to the technical field of heat dissipation of electronic components. The microchannel heat exchanger comprises: a shell, on which a cold flow inlet, a cold flow outlet, a hot flow inlet and a hot flow outlet are provided; a microchannel plate, which is arranged in the shell, and the cold flow inlet and the cold flow outlet are connected to the two ends of the microchannel plate; a heat exchange device, which is arranged on the microchannel plate, and the hot flow inlet and the hot flow outlet are connected to the two ends of the heat exchange device, and the heat exchange device is provided with a primary heat exchange channel and a secondary heat exchange channel. The microchannel heat exchanger improves the heat exchange effect and heat exchange efficiency, and the heat dissipation effect is more widely used.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic component heat dissipation, and in particular relates to a microchannel heat exchanger. Background Art

[0002] As electronic components are becoming increasingly miniaturized and integrated, the heat flux density per unit area of ​​electronic components is getting higher and higher. According to research, the function reduction or damage of most electronic components is caused by the failure of heat on their surfaces to be dissipated in time.

[0003] Due to its small size, high specific surface area and high heat and mass transfer efficiency, microchannel heat exchanger is widely used in the thermal management of microelectronic chips with high heat flux density in the semiconductor industry, new energy utilization, and medical devices.

[0004] The current microchannel heat exchanger still has the problem of low heat exchange efficiency, which makes the heat dissipation problem of electronic components still serious.

[0005] Therefore, it is necessary to propose a microchannel heat exchanger with high heat dissipation efficiency. Summary of the invention

[0006] In order to solve the above technical problems, the present invention provides a microchannel heat exchanger, which improves the heat exchange effect and heat exchange efficiency and has a wider range of applications for heat dissipation effects.

[0007] The technical solution of the present invention to solve the above technical problems is as follows: A microchannel heat exchanger, comprising:

[0008] A shell, wherein the shell is provided with a cold flow inlet, a cold flow outlet, a hot flow inlet and a hot flow outlet;

[0009] A microchannel plate, wherein the microchannel plate is disposed in the housing, and the cold flow inlet and the cold flow outlet are connected to two ends of the microchannel plate;

[0010] A heat exchange device is arranged on the microchannel plate, the heat flow inlet and the heat flow outlet are connected to two ends of the heat exchange device, and the heat exchange device is provided with a primary heat exchange channel and a secondary heat exchange channel.

[0011] The beneficial effects of the present invention are as follows: (1) by providing a cold flow inlet and a heat source inlet, the cold source enters the shell from the cold flow inlet and moves along the microchannel plate, and exchanges heat with the heat exchange device during the movement, while the heat source enters the shell through the hot flow inlet and moves in the heat exchange device;

[0012] (2) The primary heat exchange channel and the secondary heat exchange channel are set to enhance the heat exchange effect and improve the heat exchange efficiency, thereby facilitating the rapid cooling of electronic components and effectively protecting them.

[0013] (3) The microchannel heat exchanger has a compact structure, high heat exchange efficiency, is conducive to integrated application, and has a wide range of applications.

[0014] Based on the above technical solution, the present invention can also be improved as follows.

[0015] Furthermore, the heat exchange device includes a body, on which a plurality of heat exchange fins are disposed, the plurality of heat exchange fins are arranged in an array, and a heat exchange space formed between two adjacent heat exchange fins is a primary heat exchange channel.

[0016] The beneficial effect of adopting the above further solution is: thereby achieving efficient heat exchange and achieving better heat dissipation effect.

[0017] Furthermore, a plurality of grooves are provided on the side walls of the plurality of heat exchange fins, and the heat exchange space formed by the plurality of grooves is a secondary heat exchange channel.

[0018] The beneficial effects of adopting the above further solution are: effectively increasing the heat exchange efficiency and heat exchange effect, and increasing the heat dissipation effect.

[0019] Furthermore, the width of the heat exchange fin is 1 mm, the distance between two adjacent heat exchange fins is 1 mm, and the width and depth of the groove are 0.5 mm and 0.5 mm, respectively.

[0020] The beneficial effect of adopting the above further solution is that the structure is small and compact, which is more conducive to integrated design.

[0021] Furthermore, a heat exchange groove is provided on the microchannel plate, and the heat exchange device is connected in the heat exchange groove.

[0022] The beneficial effects of adopting the above further solution are: it is conducive to the flow of the heat source, more conducive to contact with the heat exchange device, and better heat exchange effect.

[0023] Furthermore, two ends of the heat exchange groove extend outwardly with diversion cavities, and the two diversion cavities are respectively connected to the heat flow inlet and the heat flow outlet.

[0024] The beneficial effect of adopting the above further solution is that the heat source is dispersed in the diversion cavity, which is more conducive to contact with the heat exchange device, thereby effectively improving the heat exchange efficiency and achieving a better heat exchange effect.

[0025] Further, the microchannel plate includes a first microchannel plate and a second microchannel plate, the heat exchange groove is provided on one side surface of the first microchannel plate and one side surface of the second microchannel plate, heat exchange devices are provided in the two heat exchange grooves, and the other side surface of the first microchannel plate is fitted and connected to the other side surface of the second microchannel plate.

[0026] The beneficial effect of adopting the above further solution is that the first microchannel plate is used for the heat source to pass through, and the second microchannel plate is used for the cold source to pass through, so that the cold source and the heat source enter and are discharged separately, thereby not affecting electronic components and the like.

[0027] Further, two first through holes are provided at both ends of the first microchannel plate, two second through holes are provided at both ends of the second microchannel plate, the cold flow inlet and the cold flow outlet are connected to the two first through holes and the two second through holes, the cold flow inlet and the cold flow outlet are connected to the two ends of the heat exchange device on the second microchannel plate, and the hot flow inlet and the hot flow outlet are connected to the two ends of the heat exchange device on the first microchannel plate.

[0028] The beneficial effect of adopting the above further solution is that the cold source can easily enter the heat exchange groove on the second microchannel plate through the first through hole and the second through hole.

[0029] Furthermore, the shell includes a first cover plate and a second cover plate, the microchannel plate is located between the first cover plate and the second cover plate, and the first cover plate, the microchannel plate and the second cover plate are connected by bolts.

[0030] The beneficial effect of adopting the above further solution is that the microchannel plate and the heat exchange device can be protected.

[0031] Furthermore, sealing gaskets are provided between the first cover plate, the second cover plate and the microchannel plate respectively.

[0032] The beneficial effect of adopting the above further solution is: avoiding the leakage of the heat source and avoiding the leakage of the cold source. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of an explosion of a microchannel heat exchanger of the present invention;

[0034] Figure 2 It is a schematic diagram of the structure of the heat exchange device of the present invention;

[0035] Figure 3 It is a cross-sectional view of the AA position of the present invention;

[0036] Figure 4 It is a partial enlarged view of position B of the present invention;

[0037] Figure 5 It is a line graph of the detection data of the present invention.

[0038] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0039] 1. First cover plate, 2. First microchannel plate, 3. Heat exchange groove, 4. Heat exchange device, 5. Second microchannel plate, 6. Second cover plate, 7. Hot flow inlet, 8. Cold flow inlet, 9. First through hole, 10. Heat exchange fin, 11. Groove, 12. Second through hole, 13. Hot flow outlet, 14. Cold flow outlet. DETAILED DESCRIPTION

[0040] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0041] Example

[0042] like Figure 1-Figure 4 As shown, this embodiment provides a microchannel heat exchanger, characterized in that it includes: a shell, a microchannel plate and a heat exchange device 4.

[0043] The shell is provided with a cold flow inlet 8, a cold flow outlet 14, a hot flow inlet 7 and a hot flow outlet 13. The microchannel plate is arranged in the shell, and the cold flow inlet 8 and the cold flow outlet 14 are connected to both ends of the microchannel plate; the heat exchange device 4 is arranged on the microchannel plate, and the hot flow inlet 7 and the hot flow outlet 13 are connected to both ends of the heat exchange device 4, and the heat exchange device 4 is provided with a primary heat exchange channel and a secondary heat exchange channel.

[0044] The cold source enters the shell from the cold flow inlet 8 and moves along the microchannel plate, exchanging heat with the heat exchange device 4 during the movement. The heat source enters the shell through the hot flow inlet 7 and moves in the heat exchange device 4. The primary heat exchange channel and the secondary heat exchange channel are provided to enhance the heat exchange effect and improve the heat exchange efficiency, thereby facilitating the rapid cooling of the electronic components and effectively protecting the electronic components.

[0045] Preferably, in this embodiment, the heat exchange device 4 includes a body, on which a plurality of heat exchange fins 10 are arranged in an array, and a heat exchange space formed between two adjacent heat exchange fins 10 is a primary heat exchange channel, thereby achieving efficient heat exchange and better heat dissipation effect.

[0046] The body is a flat plate, one side of which is fixedly connected to the surface of the microchannel plate, and the heat exchange fins 10 are fixedly arranged on the other side of the flat plate. The heat exchange fins 10 are long strips. When the heat source enters the shell through the heat flow inlet 7, it flows between the heat exchange fins 10 to achieve heat exchange.

[0047] Preferably, in this embodiment, a plurality of grooves 11 are provided on the side walls of the plurality of heat exchange fins 10, and the heat exchange space formed by the plurality of grooves 11 is a secondary heat exchange channel. Three grooves 11 are provided on one of the heat exchange fins 10, and the three grooves 11 are arranged side by side, and the space within the three grooves 11 is a secondary heat exchange channel, thereby effectively increasing the heat exchange efficiency and heat exchange effect, and increasing the heat dissipation effect.

[0048] The thickness of the microchannel plate is 6 mm, the length of the microchannel plate is 100 mm, and the width is 80 mm. The number of heat exchange fins 10 is 25 and is evenly distributed, and the total number of grooves 11 is 26. The microchannel plate is made of copper. The heat exchange device 4 is also made of copper.

[0049] Preferably, in this embodiment, the width T of the heat exchange fin 10 is 1 mm, the spacing W between two adjacent heat exchange fins 10 is 1 mm, the width Ws of the groove 11 is 0.5 mm, and the depth Hs is 0.5 mm. The heat exchange effect is good, and the structure is small and compact, which is conducive to integrated design. The height H of the heat exchange fin 10 is 3.5 mm, and the thickness B of the body is 1.5 mm.

[0050] Preferably, in this embodiment, a heat exchange groove 3 is provided on the microchannel plate, and a heat exchange device 4 is connected in the heat exchange groove 3. The width of the heat exchange groove 3 is 51 mm, the length is 60 mm, and the depth is 5 mm. The body is fixedly connected to the bottom of the heat exchange groove 3. After the heat source enters the heat exchange groove 3, it flows between the multiple heat exchange fins 10, and the cold source flows from the other side of the microchannel plate, thereby achieving heat exchange and good heat dissipation effect.

[0051] Preferably, in this embodiment, the two ends of the heat exchange groove 3 extend outward with a diverter cavity, and the two diverter cavities are respectively connected to the heat flow inlet 7 and the heat flow outlet 13, wherein the heat source enters the shell through the heat flow inlet 7, disperses in the diverter cavity, and enters different primary heat exchange channels respectively, thereby effectively improving the heat exchange efficiency and achieving a better heat exchange effect. After heat exchange, the heat source is combined through the diverter cavity and discharged from the heat flow outlet 13.

[0052] Preferably, in this embodiment, the microchannel plate includes a first microchannel plate 2 and a second microchannel plate 5, a heat exchange groove 3 is provided on one side of the first microchannel plate 2 and a side of the second microchannel plate 5, a heat exchange device 4 is provided in each of the two heat exchange grooves 3, and the other side of the first microchannel plate 2 is fitted with the other side of the second microchannel plate 5 and fixedly connected. Thus, the heat exchange groove 3 on the first microchannel plate 2 is arranged opposite to the heat exchange groove 3 on the second microchannel plate 5. The first microchannel plate 2 is used for the heat source to pass through, and the second microchannel plate 5 is used for the cold source to pass through, so that the cold source and the heat source enter and discharge respectively, so as not to affect the electronic components and the like.

[0053] Preferably, in this embodiment, two first through holes 9 are provided at both ends of the first microchannel plate 2, two second through holes 12 are provided at both ends of the second microchannel plate 5, the cold flow inlet 8 and the cold flow outlet 14 are connected with the two first through holes 9 and the two second through holes 12, the cold flow inlet 8 and the cold flow outlet 14 are connected with both ends of the heat exchange device 4 on the second microchannel plate 5, and the hot flow inlet 7 and the hot flow outlet 13 are connected with both ends of the heat exchange device 4 on the first microchannel plate 2. Through the provision of the first through holes 9 and the second through holes 12, it is possible to facilitate the cold source to enter the heat exchange groove 3 on the second microchannel plate 5.

[0054] Preferably, in this embodiment, the housing includes a first cover plate 1 and a second cover plate 6, the microchannel plate is located between the first cover plate 1 and the second cover plate 6, and the first cover plate 1, the microchannel plate and the second cover plate 6 are connected by bolts. The first cover plate 1 covers the first microchannel plate 2, and the second cover plate 6 is located on the second microchannel plate 5. The first cover plate 1 and the second cover plate 6 clamp the first microchannel plate 2 and the second microchannel plate 5. The first cover plate 1, the second cover plate 6, the first microchannel plate 2 and the second microchannel plate 5 are all provided with screw holes, and bolts are provided in the screw holes, so that the first cover plate 1, the second cover plate 6, the first microchannel plate 2 and the second microchannel plate 5 are firmly fixed together.

[0055] Preferably, in this embodiment, a sealing gasket is provided between the first cover plate 1 and the second cover plate 6 and the microchannel plate, respectively. A sealing gasket is provided between the first cover plate 1 and the first microchannel plate 2, and a sealing gasket is provided between the second cover plate 6 and the second microchannel plate 5. The sealing gasket can seal the gap between the first microchannel plate 2 and the first cover plate 1 to avoid leakage of the heat source, and can seal the gap between the second microchannel plate 5 and the second cover plate 6 to avoid leakage of the cold source.

[0056] The present invention also provides a microchannel heat exchanger for testing the present embodiment, and the specific testing scheme is as follows.

[0057] Computational fluid dynamics software CFD is used to analyze the flow and heat conduction of the fluid in the microchannel heat exchanger. Pure copper is selected as the material for manufacturing the heat exchanger because of its excellent thermal conductivity, and the working fluid is liquid water. The cold flow inlet 8 and the hot flow inlet 7 are both set as velocity inlets, and the flow rates are equal. The cold flow outlet 14 and the hot flow outlet 13 are both set as pressure outlets. The temperature of the hot flow inlet 7 is 333K and remains constant; the temperature of the cold flow inlet 8 is 303K and remains constant. The other outer wall surfaces are set to be adiabatic. The control equation adopts non-slip boundary conditions and is solved using the SIMPLE algorithm. The second-order upwind scheme is used to correct the convection terms in the momentum equation and the energy conservation equation; when the normalized residual of the flow equation is less than 10-6 and the normalized residual of the energy equation is less than 10-7, the calculation is considered to converge.

[0058] The heat transfer performance is mainly evaluated by the unit volume heat transfer coefficient Kv. The larger the Kv, the better the heat transfer performance of the heat exchanger.

[0059] Its definition is as follows:

[0060]

[0061] Where Q is the heat transfer rate between the hot and cold fluids; V is the volume of the heat exchanger; ΔTm is the logarithmic mean temperature, which is defined as follows:

[0062]

[0063] T ci and T co Respectively represent the cold flow inlet and outlet temperatures, T hi and T ho Represent the inlet and outlet temperatures of the heat flow respectively. The calculation expression of the convective heat transfer rate Q is as follows:

[0064] Q=c p q m (T co -T ci )

[0065] q m is the mass flow rate of the cold stream, c p is the specific heat of the cold flow.

[0066] In addition, pressure drop is also an important parameter for evaluating heat exchange performance. The greater the pressure drop at the inlet and outlet of the heat exchanger, the greater the pump power required to overcome the energy loss caused by the pressure drop. Therefore, the smaller the pressure drop, the better while meeting the heat exchange requirements. Pressure drop ΔP and pump power Q pum The definition is as follows:

[0067] ΔP=P in -P out =R f *q v

[0068] Q pum =ΔP·q v

[0069] P in and P out is the inlet and outlet pressure drop, q v is the volume flow rate, R f is the flow resistance.

[0070] This embodiment was used to test and compare with a microchannel heat exchanger with only one heat exchange channel. The specific results are as follows: Figure 5 shown.

[0071] in, Figure 5 The vertical axis is the temperature of the heat flow outlet 13, where "" indicates the temperature corresponding to different inlet flow rates when there is a secondary heat exchange channel, and "" indicates the temperature corresponding to different inlet flow rates when there is no secondary heat exchange channel. As can be seen from the figure, overall, the outlet temperature of the microchannel heat exchanger with a secondary heat exchange channel is slightly lower than that of the microchannel heat exchanger without a secondary heat exchange channel, which shows that the heat transfer performance of the microchannel heat exchanger with a secondary heat exchange channel is better than that of the microchannel heat exchanger without a secondary heat exchange channel. This is because the heat transfer area between the fluid and the channel wall is increased when there is a secondary heat exchange channel, so that the heat transfer performance is improved.

[0072] In the description of the present invention, it is necessary to understand that the terms "center", "length", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "inside", "outside", "peripheral", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0073] In the description of the present invention, “plurality” means at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0074] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0075] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0076] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A microchannel heat exchanger, characterized in that: include: A shell, wherein the shell is provided with a cold flow inlet (8), a cold flow outlet (14), a hot flow inlet (7) and a hot flow outlet (13); A microchannel plate, the microchannel plate being arranged in the housing, the cold flow inlet (8) and the cold flow outlet (14) being connected to two ends of the microchannel plate; A heat exchange device (4), wherein the heat exchange device (4) is arranged on the microchannel plate, the heat flow inlet (7) and the heat flow outlet (13) are connected to two ends of the heat exchange device (4), and the heat exchange device (4) is provided with a primary heat exchange channel and a secondary heat exchange channel; The heat exchange device (4) comprises a body, on which a plurality of heat exchange fins (10) are provided, the plurality of heat exchange fins (10) are arranged in an array, and a heat exchange space formed between two adjacent heat exchange fins (10) is a primary heat exchange channel; A plurality of grooves (11) are provided on the side walls of the plurality of heat exchange fins (10), and the heat exchange space formed by the plurality of grooves (11) is a secondary heat exchange channel; A heat exchange groove (3) is provided on the microchannel plate, and the heat exchange device (4) is connected in the heat exchange groove (3).

2. The microchannel heat exchanger according to claim 1, characterized in that: The width of the heat exchange fin (10) is 1 mm, the distance between two adjacent heat exchange fins (10) is 1 mm, and the width and depth of the groove (11) are 0.5 mm and 0.5 mm, respectively.

3. The microchannel heat exchanger according to claim 1, characterized in that: Dividing cavities are extended outwardly from both ends of the heat exchange groove (3), and the two diverting cavities are respectively connected to the heat flow inlet (7) and the heat flow outlet (13).

4. The microchannel heat exchanger according to claim 3, characterized in that: The microchannel plate comprises a first microchannel plate (2) and a second microchannel plate (5); the heat exchange groove (3) is provided on one side surface of the first microchannel plate (2) and one side surface of the second microchannel plate (5); a heat exchange device (4) is provided in each of the two heat exchange grooves (3); and the other side surface of the first microchannel plate (2) is fitted and connected to the other side surface of the second microchannel plate (5).

5. The microchannel heat exchanger according to claim 4, characterized in that: Two first through holes (9) are provided at both ends of the first microchannel plate (2), two second through holes (12) are provided at both ends of the second microchannel plate (5), the cold flow inlet (8) and the cold flow outlet (14) are in communication with the two first through holes (9) and the two second through holes (12), the cold flow inlet (8) and the cold flow outlet (14) are in communication with both ends of the heat exchange device (4) on the second microchannel plate (5), and the hot flow inlet (7) and the hot flow outlet (13) are in communication with both ends of the heat exchange device (4) on the first microchannel plate (2).

6. The microchannel heat exchanger according to any one of claims 1 to 5, characterized in that: The shell comprises a first cover plate (1) and a second cover plate (6); the microchannel plate is located between the first cover plate (1) and the second cover plate (6); the first cover plate (1), the microchannel plate and the second cover plate (6) are connected by bolts.

7. The microchannel heat exchanger according to claim 6, characterized in that: A sealing gasket is provided between the first cover plate (1), the second cover plate (6) and the microchannel plate respectively.

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