Inspection device

Abstract

The present invention relates to an inspection device for performing tests in a high temperature environment, the inspection device comprising an indexing table for mounting a device via a replaceable mounting part, which can realize miniaturization and cost reduction of the inspection device and improve the safety of the inspection device. The inspection device (1) comprises an indexing table (12). The indexing table (12) comprises a device mounting area (AD) for mounting a device (DUT) via a mounting part (M) and a mounting part mounting area (AM) for mounting a preliminary mounting part (M') that can be replaced with the mounting part (M). The indexing table (12) has a built-in heating block (124) for heating the device mounting area and the mounting part mounting area.

Description

Technical Field

[0001] The present invention relates to an inspection device for inspecting a device such as a semiconductor device, and more particularly to an inspection device for inspecting a device in each of two or more environments having different conditions. Background Art

[0002] In the inspection of semiconductor devices, it is sometimes required to perform static characteristic tests and dynamic characteristic tests separately. Patent document 1 discloses an inspection device for performing such tests. In addition, in the inspection of semiconductor devices, it is sometimes required to perform tests in room temperature environments and high temperature environments separately. Patent documents 2 and 3 disclose inspection devices for performing such tests.

[0003] Prior art literature

[0004] Patent Literature

[0005] [Patent Document 1]: Japanese Patent Publication No. 2016-206150

[0006] [Patent Document 2]: Japanese Patent Publication No. 58-39021

[0007] [Patent Document 3]: Japanese Patent Publication No. 4-23446 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] In order to efficiently inspect semiconductor devices, it is preferred to perform static characteristic tests and dynamic characteristic tests on an indexing table that transports semiconductor devices. However, when semiconductor devices are directly placed on an indexing table and these tests are performed, the indexing table may be damaged in the case of a defective semiconductor device. Therefore, it is preferred to place semiconductor devices on an indexing table via a replaceable mounting member and perform these tests.

[0010] However, in order to accurately implement the high temperature test of the semiconductor device, the mounting part that carries the semiconductor device also needs to be at a high temperature. Therefore, when the mounting part is replaced, the pre-mounted part needs to be heated each time, resulting in a problem of long downtime. In addition, in order to avoid long downtime, when a mechanism is provided for pre-heating the pre-mounted part before the mounting part is replaced, the large-scale and high-cost inspection device is inevitable. In addition, when a mechanism for pre-heating the pre-mounted part is provided in an area accessible to the operator, the safety of the inspection device is reduced.

[0011] In addition, the problems that occur when testing semiconductor devices in a high temperature environment are described here, but the same problems also occur when testing devices other than semiconductor devices in a high temperature environment. That is, the above problems can be generalized as problems that can occur when testing any device in a high temperature environment.

[0012] One embodiment of the present invention is completed in view of the above-mentioned problems, and its purpose is to provide an inspection device for performing tests in a high-temperature environment, the inspection device including an indexing table for mounting devices via replaceable mounting parts, which can realize miniaturization and cost reduction of the inspection device and can improve the safety of the inspection device.

[0013] Solutions to the problem

[0014] In order to solve the above-mentioned problems, an inspection device of one embodiment of the present invention has an index table, which has a device loading area and a mounting part loading area, and has a built-in heater for heating the device loading area and the mounting part loading area. The device loading area loads the device via the mounting part, and the mounting part loading area carries a preliminary mounting part that can be replaced with the mounting part.

[0015] Effects of the Invention

[0016] According to one embodiment of the present invention, an inspection device for performing a test in a high temperature environment includes an index table for mounting a device via a replaceable mount, which can achieve miniaturization and cost reduction of the inspection device and improve the safety of the inspection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a perspective view showing a schematic structure of an inspection device according to one embodiment of the present invention.

[0018] Figure 2 It is shown Figure 1 A top view of a conveying path of semiconductor devices in an inspection apparatus.

[0019] Figure 3 It shows that the Figure 1 A flowchart of the process of a method for inspecting a semiconductor device by an inspection apparatus.

[0020] Figure 4 yes Figure 1 The inspection device has a top view of the first indexing station.

[0021] Figure 5 It is a partial cross-sectional view showing details of the periphery of the device placement region of the first index stage.

[0022] Figure 6 yes Figure 1A top view of the second indexing station of the inspection device.

[0023] Figure 7 It is a partial cross-sectional view showing details of the periphery of the device placement region of the second index stage.

[0024] Figure 8 yes Figure 1 An inspection device having an arm portion is shown in top view.

[0025] Fig. 9 yes Figure 1 A side view of an inspection device having an arm having a device adsorption head.

[0026] Fig.10 yes Figure 1 A side view of an inspection device having an arm with a mounting member having a suction head.

[0027] Fig.11 is shown installed in Figure 1 A schematic diagram of a process for replacing a mounting member on a first indexing table of an inspection device.

[0028] Fig.12 is shown installed in Figure 1 A schematic diagram of a process for replacing a mounting member on a second indexing table of an inspection device. DETAILED DESCRIPTION

[0029] [Schematic structure of the inspection device]

[0030] Reference Figure 1 , a schematic structure of an inspection device 1 according to an embodiment of the present invention is described. Figure 1 It is a perspective view showing a schematic structure of the inspection device 1 .

[0031] The inspection device 1 is a device for performing static characteristic tests and dynamic tests on semiconductor devices (an example of "device" in the present invention) in room temperature environments and high temperature environments. Here, the high temperature environment refers to an environment with a temperature higher than the room temperature environment.

[0032] like Figure 1 As shown, the inspection device 1 includes a first index table 11 , a second index table 12 , an arm 13 , a mounting member collecting / supplying unit 14 , a first test device 15 , a second test device 16 , a third test device 17 , and a fourth test device 18 .

[0033] The first index stage 11 is a device for conveying the semiconductor device placed along the circular in-stage conveying path P1. A device placement area for placing devices via replaceable mounting parts is provided on the first index stage 11. Four positions P11 to P14 are set at equal intervals on the in-stage conveying path P1. In particular, the third position P13 is set at a position closest to the second index stage 12 on the in-stage conveying path P1. The first index stage 11 is rotated 90° clockwise when viewed from above to (1) convey the semiconductor device located at the first position P11 to the second position P12, (2) convey the semiconductor device located at the second position P12 to the third position P13, (3) convey the semiconductor device located at the third position P13 to the fourth position P14, and (4) convey the semiconductor device located at the fourth position P14 to the first position P11.

[0034] In the present embodiment, the first indexing station 11 functions as a room temperature test station for implementing static characteristic tests and dynamic tests in a room temperature environment. As an example of a room temperature environment, an environment in which the temperature of a semiconductor device can be set to be above 20°C and below 30°C can be cited. In most cases, the inspection device 1 is set in a clean room. As an example, the room temperature in the clean room is set to 25°C, but in most cases, the actual room temperature is above 20°C and below 30°C. As a result, the temperature of the semiconductor device placed on the first indexing station 11 also becomes above 20°C and below 30°C. The details of the first indexing station 11 will be described later instead of referring to the accompanying drawings.

[0035] The second index table 12 is a device for conveying the semiconductor device along the circular intra-table conveying path P2. The second index table 12 is provided with a device loading area for loading devices by replaceable mounting parts and a mounting part loading area for loading preliminary mounting parts. Four positions P21 to P24 are set on the intra-table conveying path P2. In particular, the first position P21 is set at the position closest to the first index table 11 on the intra-table conveying path P2. The second index table 12 is rotated 90° clockwise when viewed from above to (1) convey the semiconductor device located at the first position P21 to the second position P22, (2) convey the semiconductor device located at the second position P22 to the third position P23, (3) convey the semiconductor device located at the third position P23 to the fourth position P24, and (4) convey the semiconductor device located at the fourth position P24 to the first position P21.

[0036] In the present embodiment, the second index station 12 functions as a high temperature test station for performing a static characteristic test and a dynamic characteristic test in a high temperature environment. An example of a high temperature environment is an environment in which the temperature of a semiconductor device can be set to 50° C. or higher and 300° C. or lower. The details of the second index station 12 will be described later instead of referring to the drawings.

[0037] The arm 13 is a T-shaped rotating arm having two device suction heads 13a, 13b and one mounting part suction head 13c. The arm 13 uses the device suction heads 13a, 13b to perform a device moving action. Here, the device moving action refers to the following action: while using one of the two device suction heads 13a~13b to move the semiconductor device placed on the first index stage 11 to the second index stage 12, the other of the two device suction heads 13a~13b is used to move the semiconductor device placed on the second index stage 12 to the first index stage 11. In addition, the arm 13 uses one of the two device suction heads 13a~13b to perform a device recovery action. Here, the device recovery action refers to the action of recovering a device that is determined to be a defective product in a test from the first index stage 11 or the second index stage 12. In addition, the arm 13 uses the mounting part suction head 13c to perform a mounting part recovery action. Here, the mount recovery operation refers to the operation of recovering the mount on which the device determined to be a defective product in the test is placed from the first index stage 11 or the second index stage 12. In addition, the arm 13 performs the mount installation operation using the mount suction head 13c. Here, the mount installation operation refers to the operation of installing the preliminary mount obtained from the second index stage 12 or the mount recovery / supply unit 14 described later on the first index stage 11 or the second index stage 12. In addition, the details of the arm 13 will be described later instead of the referenced drawings.

[0038] The mount collecting / supplying unit 14 is a unit for collecting mounts on which components determined to be defective in a test are placed, and for supplying spare mounts to be replaced with the mounts.

[0039] The first test device 15 is a device for performing a dynamic characteristic test at room temperature on the semiconductor device placed on the first index stage 11. In this embodiment, the dynamic characteristic test of the semiconductor device by the first test device 15 is performed at the second position P12 of the first stage intra-transport path P1.

[0040] The second test device 16 is a device for performing a dynamic characteristic test in a high temperature environment on the semiconductor device placed on the second index stage 12. In this embodiment, the dynamic characteristic test of the semiconductor device by the second test device 16 is performed at the second position P22 of the second stage intra-transport path P2.

[0041] The third test device 17 is a device for performing a static characteristic test in a high temperature environment on the semiconductor device placed on the second index stage 12. In this embodiment, the static characteristic test of the semiconductor device by the third test device 17 is performed at the fourth position P24 of the second stage internal transport path P2.

[0042] The fourth test device 18 is a device for performing a static characteristic test at room temperature on the semiconductor device placed on the first index stage 11. In this embodiment, the static characteristic test of the semiconductor device by the fourth test device 18 is performed at the fourth position P14 of the first stage intra-transfer path P1.

[0043] In addition, these test devices 15 to 18 can be realized by a known structure (for example, the structure disclosed in Patent Document 1). Therefore, in this specification, the detailed description of the test devices 15 to 18 is omitted.

[0044] [Transportation path of semiconductor devices]

[0045] Reference Figure 2 , a conveying path P of semiconductor devices of the inspection apparatus 1 will be described. Figure 2 1 is a plan view showing the structure of the conveying path P.

[0046] The transport path P is composed of a first intra-stage transport path P1, a second intra-stage transport path P2, and an inter-stage transport path P3. The first intra-stage transport path P1 is a transport path for transporting semiconductor devices through the first index stage 11. The second intra-stage transport path P2 is a transport path for transporting semiconductor devices through the second index stage 12. The inter-stage transport path P3 is a transport path for transporting (moving) semiconductor devices by the arm 13.

[0047] In the inspection apparatus 1, semiconductor devices are transported in the following manner.

[0048] First, through the device supply unit (in Figure 1 (not shown) the uninspected semiconductor devices are supplied to the first position P11 of the first intra-stage transport path P1.

[0049] Next, the semiconductor device supplied to the first position P11 of the first intra-stage transport path P1 is transported along the first intra-stage transport path P1 (1) from the first position P11 to the second position P12 via the first index stage 11, and (2) from the second position P12 to the third position P13.

[0050] Next, the semiconductor device conveyed to the third position P13 of the first intra-stage conveyance path P1 is conveyed (moved) to the first position P21 of the second intra-stage conveyance path P2 along the inter-stage conveyance path P3 by the arm 13 .

[0051] Next, the semiconductor device transported to the first position P21 of the transport path P2 in the second stage is transported along the transport path P2 in the second stage through the second index stage 12, (1) from the first position P21 to the second position P22, (2) from the second position P22 to the third position P23, (3) from the third position P23 to the fourth position P24, and (4) from the fourth position P24 to the first position P21.

[0052] Next, the semiconductor device conveyed to the first position P21 of the second intra-stage conveyance path P2 is conveyed (moved) to the third position P13 of the first intra-stage conveyance path P1 along the inter-stage conveyance path P3 by the arm 13 .

[0053] Next, the semiconductor device transported to the third position P13 of the first-stage intra-transport path P1 passes through the first index stage 11 along the first-stage intra-transport path P1, (1) transported from the third position P13 to the fourth position P14, and (2) transported from the fourth position P14 to the first position P11.

[0054] Finally, the inspected semiconductor device transported to the first position P11 of the first intra-stage transport path P1 is collected by the device recovery unit ( Figure 1 (not shown) recycling.

[0055] In the inspection device 1, the semiconductor devices transported as described above are subjected to dynamic characteristic tests and static characteristic tests in each of the room temperature environment and the high temperature environment. First, the dynamic characteristic test in the room temperature environment is carried out by the test device 15 at the second position P12 of the transport path P1 in the first station. Next, the dynamic characteristic test in the high temperature environment is carried out by the second test device 16 at the second position P22 of the transport path P2 in the second station. Next, the static characteristic test in the high temperature environment is carried out by the third test device 17 at the fourth position P24 of the transport path P2 in the second station. Finally, the static characteristic test in the room temperature environment is carried out by the fourth test device 18 at the fourth position P14 of the transport path P1 in the first station.

[0056] Figure 2The inter-stage transport path included in the transport path P shown is only the inter-stage transport path P3. In addition, the length of the inter-stage transport path P3 can be set to be shorter than the length of the inter-stage transport path for moving semiconductor devices between the shuttle stages. Therefore, the static characteristic test and the dynamic characteristic test can be performed in each of the room temperature environment and the high temperature environment, respectively, without causing unnecessary enlargement of the inspection apparatus 1 and unnecessary reduction of the inspection speed.

[0057] Alternatively, the image inspection of the semiconductor device may be performed at the first position P11 and the third position P13 of the first station conveying path P1, and at the first position P21 and the third position P23 of the second station conveying path P2. For example, in the image inspection at the first position P11 of the first station conveying path P1, a camera (not shown) takes an image of the semiconductor device placed on the first indexing stage 11. Then, a controller (not shown) (1) calculates the difference between the position where the semiconductor device is actually placed and the preset reference position based on the captured image, and (2) adjusts the probe position of the first test device 15 according to the calculated difference. Thus, even if the semiconductor device is placed on the first indexing stage 11 away from the reference position, the dynamic characteristic test by the first test device 15 can be ideally performed. Alternatively, the same image inspection may be performed at the first position P21 of the second station conveying path P2, at the third position P23 of the second station conveying path P2, and at the third position P13 of the first station conveying path P1. By performing these image inspections, the probe positions of the second test device 16, the third test device 17, and the fourth test device 18 can be adjusted respectively, and the same effect as the above-mentioned image inspection can be obtained.

[0058] [Inspection method flow]

[0059] Reference Figure 3 , the process of the inspection method S100 using the inspection device 1 is described. Figure 3 is a flow chart showing the process of the inspection method S100. Figure 3 In the figure, a plurality of steps sequentially applied to each semiconductor device DUTi (i=1, 2, 3, ...) are arranged horizontally, and a plurality of steps simultaneously applied to a plurality of semiconductor devices DUT1, DUT2, DUT3, ... are arranged vertically.

[0060] The inspection method S100 is an inspection method for testing the static characteristics and dynamic characteristics of a semiconductor device in a room temperature environment and a high temperature environment using the inspection device 1 described above. Figure 3As shown, the inspection method S100 includes: a supply / image inspection process S101, a conveying process S102, a room temperature AC test process S103, a conveying process S104, a movement / image inspection process S105, a conveying process S106, a high temperature AC test process S107, a conveying process S108, an image inspection process S109, a conveying process S110, a high temperature DC test process S111, a conveying process S112, a movement / image inspection process S113, a conveying process S114, a room temperature DC test process S115, a conveying process S116, and a recovery process S117.

[0061] The supply / image inspection process S101 is a process of supplying the semiconductor device DUT1 at the first position P11 of the first stage intra-transport path P1 using the device supply unit. In this process, the semiconductor device DUT1 placed on the first index stage 11 is image inspected at the first position P11 of the first stage intra-transport path P1, and the probe position of the first test device 15 is adjusted based on the inspection result.

[0062] The transport step S102 is a step of rotating the first index stage 11 by 90 degrees to transport the semiconductor device DUT1 placed on the first index stage 11 from the first position P11 to the second position P12 along the first intra-stage transport path P1.

[0063] The room temperature AC (dynamic characteristics) test step S103 is a step of performing a dynamic characteristics test in a room temperature environment using the first test apparatus 15 on the semiconductor device DUT1 transported to the second position P12 of the first intra-stage transport path P1.

[0064] The transport step S104 is a step of transporting the semiconductor device DUT1 placed on the first index stage 11 from the second position P12 to the third position P13 along the first intra-stage transport path P1 by rotating the first index stage 11 by 90 degrees.

[0065] The moving / image inspection step S105 is a step of moving the semiconductor device DUT1 transported to the third position P13 of the first stage intra-transport path P1 to the second index stage 12 using the arm 13. In this step, an image inspection is performed on the semiconductor device DUT1 moved to the second index stage 12 at the first position P21 of the second stage intra-transport path P2. And, the probe position of the second test device 16 is adjusted based on the result of the image inspection.

[0066] The transport step S106 is a step of transporting the semiconductor device DUT1 placed on the second index stage 12 from the first position P21 to the second position P22 along the second intra-stage transport path P2 by rotating the second index stage 12 by 90 degrees.

[0067] The high temperature AC test step S107 is a step of performing a dynamic characteristic test in a high temperature environment using the second test apparatus 16 on the semiconductor device DUT1 transported to the second position P22 of the second intra-stage transport path P2 .

[0068] The transport step S108 is a step of rotating the second index stage 12 by 90 degrees to transport the semiconductor device DUT1 placed on the second index stage 12 from the second position P22 to the third position P23 along the second intra-stage transport path P2.

[0069] The image inspection step S109 is a step of performing an image inspection on the semiconductor device DUT1 placed on the second index stage 12 at the third position P23 of the second intra-stage transport path P2. In the image inspection step S109, the probe position of the third test device 17 is adjusted based on the result of the image inspection.

[0070] The transport step S110 is a step of rotating the second index stage 12 by 90 degrees. By performing the transport step S110, the semiconductor device DUT1 placed on the second index stage 12 is transported from the third position P23 to the fourth position P24 along the second intra-stage transport path P2.

[0071] The high temperature DC (static characteristics) test step S111 is a step of performing a static characteristics test in a high temperature environment using the third test apparatus 17 on the semiconductor device DUT1 transported to the fourth position P24 of the second intra-stage transport path P2.

[0072] The transport step S112 is a step of transporting the semiconductor device DUT1 placed on the second index stage 12 from the fourth position P24 to the first position P21 along the second intra-stage transport path P2 by rotating the second index stage 12 by 90 degrees.

[0073] The moving / image inspection step S113 is a step of moving the semiconductor device DUT1 conveyed to the first position P21 of the second stage intra-transport path P2 to the first index stage 11 using the arm 13. In this step, an image inspection is performed on the semiconductor device DUT1 conveyed to the first index stage 11 at the third position P13 of the first stage intra-transport path P1. In this step, the probe position of the fourth test device 18 is adjusted based on the result of the image inspection.

[0074] The transport step S114 is a step of rotating the first index stage 11 by 90 degrees. By performing the transport step S114, the semiconductor device DUT1 placed on the first index stage 11 is transported from the third position P13 to the fourth position P14 along the first intra-stage transport path P1.

[0075] The room temperature DC test step S115 is a step of performing a static characteristic test in a room temperature environment on the semiconductor device DUT1 transported to the fourth position P14 of the first intra-stage transport path P1 using the fourth test apparatus 18 .

[0076] The transport step S116 is a step of rotating the first index stage 11 by 90 degrees. By performing the transport step S116, the semiconductor device DUT1 placed on the first index stage 11 is transported from the fourth position P14 to the first position P11 along the first intra-stage transport path P1.

[0077] The collecting step S117 is a step of collecting the semiconductor device DUT1 at the first position P11 of the first intra-stage transport path P1 using a device collecting unit.

[0078] In addition, the above-mentioned steps S101 to S117 are performed simultaneously and in parallel on a plurality of semiconductor devices DUT1, DUT2, DUT3, ... For example, while the moving / image inspection step S105 is performed on the first semiconductor device DUT1, the room temperature AC test step S103 is performed on the second semiconductor device DUT2, and the supply / image inspection step S101 is performed on the third semiconductor device DUT3. In addition, while the conveying step S106 is performed on the first semiconductor device DUT1, the conveying step S104 is performed on the second semiconductor device DUT2, and the conveying step S102 is performed on the third semiconductor device DUT3.

[0079] [Structure of the index station]

[0080] Reference Figure 4 to Figure 7 , the structures of the first index station 11 and the second index station 12 included in the inspection device 1 are described. Figure 4 is a top view of the first index station 11, Figure 5 is a partial cross-sectional view of the first indexing station 11, Figure 6 is a partial top view of the second indexing station 12, Figure 7 It is a partial cross-sectional view of the second index stage 12 .

[0081] like Figure 5 As shown in FIG. 1 , the first index stage 11 is formed by stacking a heat-resistant insulating resin plate 111, a ceramic plate 112, and a stage block 113 in this order. Figure 4 and Figure 5As shown, a recess 113a serving as a device placement area AD is provided on the upper surface of the stage block 113. A mount M is installed in the recess 113a, and the semiconductor device DUT is placed on the mount M. The mount M is a plate-shaped component made of a material having thermal conductivity and electrical conductivity (e.g., metal). In addition, an air supply and exhaust path 113b is provided inside the stage block 113, one end of which is released in the recess 113a and communicates with a through hole provided on the mount M. The air supply and exhaust path 113b is used as a flow path for air to adsorb the semiconductor device DUT on the mount M, and as a flow path for air to float the semiconductor device DUT from the mount M.

[0082] like Figure 7 As shown in FIG. 1 , the second indexing stage 12 is formed by stacking a heat-resistant insulating resin plate 121, a heating block 124, a ceramic plate 122, and a stage block 123 in this order. Figure 6 and Figure 7 As shown, a recess 123a serving as a device placement area AD is provided on the upper surface of the stage block 123. A mount M is installed in the recess 123a, and the semiconductor device DUT is placed on the mount M. The mount M is a plate-shaped component made of a material having thermal conductivity and electrical conductivity (e.g., metal). In addition, an air supply and exhaust path 123b is provided inside the stage block 123, one end of which is released in the recess 123a and communicates with a through hole provided on the mount M. The air supply and exhaust path 123b is used as a flow path for air to adsorb the semiconductor device DUT to the mount M, and as a flow path for air to float the semiconductor device DUT from the mount M.

[0083] A recessed portion serving as a mounting member placement area AM is also provided on the upper surface of the stage block 123. A preliminary mounting member M' is installed in the recessed portion. The size and material of the preliminary mounting member M' are the same as those of the mounting member M, and the mounting member M and the preliminary mounting member M' are interchangeable.

[0084] The heating block 124 built into the second indexing stage 12 is used to heat the semiconductor device DUT placed in the device placement area AD. Thus, it is possible to perform a test of the semiconductor device DUT in a high temperature environment without using an external heat source. In addition, the heating block 124 built into the second indexing stage 12 is also used to heat the preliminary mounting part M' placed in the mounting part placement area AM. Thus, it is possible to keep the preliminary mounting part M' at a high temperature without using an external heat source. That is, when the mounting part M needs to be replaced, it can be replaced with the preliminary mounting part M' without waiting until the preliminary mounting part M' reaches a high temperature.

[0085] [Arm structure]

[0086] Reference Figure 8 to Figure 10 , the structure of the arm portion 13 of the inspection device 1 will be described. Figure 8 to Figure 10 middle, Figure 8 is a top view of the arm 13, Fig. 9 13 is a side view of the device adsorption heads 13a and 13b of the arm 13. Fig.10 It is a side view of the attachment adsorption head 13 c included in the arm portion 13 .

[0087] like Figure 8 As shown, the arm portion 13 has a T-shaped plane shape formed by combining three straight portions 13A to 13C. The first device adsorption head 13a is mounted on the front back side of the first straight portion 13A extending from the rotation center of the arm portion 13 in the first direction. The second device adsorption head 13b is mounted on the front back side of the second straight portion 13B extending from the rotation center of the arm portion 13 in the direction opposite to the first direction. The mounting part adsorption head 13c is mounted on the front back side of the third straight portion 13C extending from the rotation center of the arm portion 13 in the third direction, the third direction being a direction orthogonal to both the first direction and the second direction, and the second direction being a direction opposite to the first direction.

[0088] like Fig. 9 As shown, the device adsorption heads 13a and 13b have a structure suitable for adsorption of semiconductor devices. Fig.10 As shown, the mounting part suction head 13c has a structure suitable for suction of the mounting part. As the device suction heads 13a, 13b and the mounting part suction head 13c, known suction pads can be used, so the detailed description of their structures is omitted here.

[0089] In addition, the arm portion 13 may also be configured in a cross shape. In this case, another head can be attached to the rear surface of the front end of the fourth straight portion of the arm portion 13 .

[0090] As another head, for example, a third device suction head can be cited. In this case, it can be considered that the first device suction head 13a and the second device suction head 13b are used for the device moving operation, and the third device suction head is used for the device recovery operation. Thus, it is not necessary to use the third device suction head, which may be damaged in the device recovery operation, for the device moving operation.

[0091] In addition, as another head, for example, an air supply head can be cited. In this case, it is possible to use the air blown from the air supply head to remove, for example, foreign matter attached to the attachment.

[0092] [How to replace the mounting parts of the first index table]

[0093] Assume that in a test conducted at room temperature, it is determined that the semiconductor device DUT placed in the device placement area AD of the first index stage 11 via a certain mount M is a defective product. In this case, the inspection device 1 has a function of replacing the mount M with a spare mount M' supplied from the mount recovery / supply unit 14. Fig.11 , the process of the installation part replacement method S200 is explained. Fig.11 2 is a schematic diagram showing the flow of the mounting component replacement method S200 .

[0094] like Fig.11 As shown, the mounting member replacement method S200 includes a rotation step S201, a device adsorption step S202, a rotation step S203, a mounting member adsorption / device adsorption release step S204, a rotation step S205, a mounting member adsorption release step S206, a preliminary mounting member adsorption step S207, a rotation step S208, and a preliminary mounting member adsorption release step S209. These steps S201 to S209 are performed in a state where the device placement area AD is arranged at the third position P13 of the first stage internal transport path P1.

[0095] The rotation step S201 is a step of rotating the arm 13 so that the device adsorption head 13a is arranged at the third position P13 of the first stage internal conveying path P1. In the method for replacing the mounting part of the first index stage, the third position P13 of the first stage internal conveying path P1 is an example of the "first position" described in the present invention.

[0096] The device suction step S202 is a step of suctioning the semiconductor device DUT by the device suction head 13 a at the third position P13 of the first intra-stage transport path P1 .

[0097] The rotation step S203 is a step in which the arm 13 is rotated so that the device adsorption head 13a is arranged at a predetermined position P0, and the mounting part adsorption head 13c is arranged at a third position P13 of the transport path P1 in the first stage. In the mounting part replacement method of the first index stage, the predetermined position P0 is an example of the "second position" described in the present invention.

[0098] The mount adsorption / device adsorption release step S204 is a step of adsorbing the mount M by the mount adsorption head 13c at the third position P13 of the first-stage intra-transport path P1, and releasing the adsorption of the semiconductor device DUT by the device adsorption head 13a at the predetermined position P0. In addition, a device recovery tray is arranged at the predetermined position P0, and the semiconductor device DUT is accommodated in the device recovery tray.

[0099] The rotating step S205 is as follows: the arm 13 is rotated so that the mounting member adsorption head 13c is arranged at the above-mentioned predetermined position P0.

[0100] The fixture suction release step S206 is a step of releasing the fixture M from the suction of the fixture suction head 13 c at the predetermined position P0 . In addition, the fixture recovery / supply unit 14 is disposed at the predetermined position P0 , and the fixture M is recovered by the fixture recovery / supply unit 14 .

[0101] Through the above steps S201 to S206 , the device recovery operation of recovering the semiconductor device DUT from the first index stage 11 and the mount recovery operation of recovering the mount M from the first index stage 11 can be realized.

[0102] The preliminary mounting part adsorption step S207 is a step in which the mounting part adsorption head 13c adsorbs the preliminary mounting part M' at a predetermined position P0. In addition, a mounting part recovery / supply unit 14 is disposed at the predetermined position P0, and the preliminary mounting part M' is provided by the mounting part recovery / supply unit 14.

[0103] The rotating step S208 is a step of rotating the arm 13 so that the attachment adsorption head 13 c is arranged at the third position P13 of the first intra-stage transport path P1 .

[0104] The preliminary mounting member suction release step S209 is a step in which the mounting member suction head 13 c releases the suction of the preliminary mounting member M′ at the third position P13 of the first intra-stage transport path P1 .

[0105] Through the above steps S207 to S209 , the preliminary mounting member installation operation of installing the preliminary mounting member M′ on the first index table 11 can be realized.

[0106] [How to replace the second index table mounting parts]

[0107] Assume that in a test conducted in a high temperature environment, it is determined that the semiconductor device DUT placed in the device placement area AD of the second index stage 12 via a certain mount M is a defective product. In this case, the inspection device 1 has a function of replacing the mount M with a spare mount M' placed in the mount placement area AM of the second index stage 12. Fig.12 , the process of the installation part replacement method S300 is explained. Fig.12 3 is a schematic diagram showing the flow of the mounting component replacement method S300 .

[0108] like Fig.12As shown, the mounting member replacement method S300 includes a rotation step S301, a device adsorption step S302, a rotation step S303, a mounting member adsorption / device adsorption release step S304, a rotation step S305, a mounting member adsorption release step S306, a rotation step S307, a preliminary mounting member adsorption step S308, and a preliminary mounting member adsorption release step S309. In addition, steps S301 to S306 are performed in a state where the device placement area AD is arranged at the first position P21 of the second stage inner conveying path P2.

[0109] The rotation step S301 is a step in which the arm 13 is rotated so that the device adsorption head 13b is arranged at the first position P21 of the second stage internal conveying path P2. In the second index stage mounting part replacement method, the first position P21 of the second stage internal conveying path P2 is an example of the "first position" described in the present invention.

[0110] The device suction step S302 is a step of suctioning the semiconductor device DUT by the device suction head 13 b at the first position P21 of the second intra-stage transport path P2 .

[0111] The rotation step S303 is a step in which the arm 13 is rotated so that the device adsorption head 13b is arranged at a predetermined position P0, and the mounting part adsorption head 13c is arranged at a first position P21 of the transport path P2 in the second stage. In the mounting part replacement method of the second index stage, the predetermined position P0 is an example of the "second position" described in the present invention.

[0112] The mount adsorption / device adsorption release step S304 is a step of adsorbing the mount M by the mount adsorption head 13c at the first position P21 of the second stage internal transport path P2, and releasing the adsorption of the semiconductor device DUT by the device adsorption head 13b at the predetermined position P0. In addition, a device recovery tray is arranged at the predetermined position P0, and the semiconductor device DUT is accommodated in the device recovery tray.

[0113] The rotating step S305 is a step in which the arm 13 is rotated so that the mounting member adsorption head 13 c is arranged at the above-mentioned predetermined position P0 .

[0114] The fixture suction release step S306 is a step of releasing the fixture M from the suction of the fixture suction head 13 c at the predetermined position P0 . In addition, the fixture recovery / supply unit 14 is disposed at the predetermined position P0 , and the fixture M is recovered by the fixture recovery / supply unit 14 .

[0115] Through the above steps S301 to S306 , the device recovery operation of recovering the semiconductor device DUT from the second index stage 12 and the mount recovery operation of recovering the mount M from the second index stage 12 can be realized.

[0116] The rotating step S307 is a step of rotating the arm 13 so that the attachment adsorption head 13 c is arranged at the first position P21 of the second intra-stage transport path P2 .

[0117] The preliminary mounting part adsorption step S308 is a step in which the mounting part adsorption head 13c adsorbs the preliminary mounting part M' at the first position P21 of the second stage internal conveying path P2. The preliminary mounting part adsorption step S308 is performed after the state in which the mounting part placement area AM on which the preliminary mounting part M' is placed is realized at the first position P21 of the second stage internal conveying path P2 by the rotation of the second index stage 12.

[0118] The preliminary mounting part adsorption release step S309 is a step in which the mounting part adsorption head 13c releases the adsorption of the preliminary mounting part M' at the first position P21 of the second stage internal conveying path P2. The preliminary mounting part adsorption release step S309 is performed after the device placement area AD on which the mounting part M is placed is arranged at the first position P21 of the second stage internal conveying path P2 by the rotation of the second index stage 12.

[0119] Through the above steps S307 to S309 , the preliminary mounting member installation operation of installing the preliminary mounting member M′ on the second index table 12 can be realized.

[0120] [Modification of the inspection device]

[0121] In addition, in the present embodiment, the following structure is adopted: a dynamic characteristic test is performed at the second position P12 of the conveying path P1 in the first station, and a static characteristic test is performed at the fourth position P14 of the conveying path P1 in the first station, but the present invention is not limited to this. For example, the following structure may be adopted: a static characteristic test is performed at the second position P12 of the conveying path P1 in the first station, and a dynamic characteristic test is performed at the fourth position P14 of the conveying path P1 in the first station. However, according to the structure of the present embodiment, the dynamic characteristic test will not be the last test. Therefore, in the structure of the present embodiment, there is the following advantage: a malfunction of the semiconductor device caused by the dynamic characteristic test can be detected by a subsequent test.

[0122] In addition, in the present embodiment, the following structure is adopted: the dynamic characteristic test is performed at the second position P22 on the second station internal conveying path P2, and the static characteristic test is performed at the fourth position P24 on the second station internal conveying path P2, but the present invention is not limited to this. For example, the following structure may be adopted: the static characteristic test is performed at the second position P22 on the second station internal conveying path P2, and the dynamic characteristic test is performed at the fourth position P24 on the second station internal conveying path P2.

[0123] In addition, in the present embodiment, the following structure is adopted: the test is performed in a room temperature environment on the first station conveying path P1, and the test is performed in a high temperature environment on the second station conveying path P2, but the present invention is not limited to this. For example, the following structure can also be adopted: the test is performed in a high temperature environment on the first station conveying path P1, and the test is performed in a room temperature environment on the second station conveying path P2. However, according to the structure adopted in the present embodiment, the test in a high temperature environment will not be the last test. Therefore, in the structure of the present embodiment, there is the following advantage: the defective condition of the semiconductor device caused by the high temperature test can be detected by subsequent tests.

[0124] In addition, in this embodiment, a structure is adopted in which the test is performed at two positions P12 and P14 on the first station internal conveying path P1, but the present invention is not limited to this. For example, a structure may be adopted in which the test is performed at one position on the first station internal conveying path P1, or a structure may be adopted in which the test is performed at three or more positions on the first station internal conveying path P1. In this case, the test performed at each position may be a static characteristic test, a dynamic characteristic test, or other tests.

[0125] In addition, in this embodiment, a structure is adopted in which the test is performed at two positions P22 and P24 on the second station internal conveying path P2, but the present invention is not limited to this. For example, a structure may be adopted in which the test is performed at one position on the second station internal conveying path P2, or a structure may be adopted in which the test is performed at three or more positions on the second station internal conveying path P2. In this case, the test performed at each position may be a static characteristic test, a dynamic characteristic test, or other tests.

[0126] In addition, in the present embodiment, a structure having two indexing stations 11, 12 and one arm 13 is adopted, but the present invention is not limited to this. That is, a structure having N indexing stations and N-1 arms may also be adopted when N is set to any natural number greater than 2. In this case, the i-th arm is used to transfer the semiconductor device from the i-th indexing station to the i+1-th indexing station. In addition, in this case, tests under different environments are implemented in mutually adjacent indexing stations. For example, in a structure having three indexing stations, a test under a low temperature environment is implemented in the first indexing station, a test under a room temperature environment is implemented in the second indexing station, and a test under a high temperature environment is implemented in the third indexing station. Alternatively, a test under a room temperature environment is implemented in the first indexing station, a test under a high temperature environment is implemented in the second indexing station, and a test under a room temperature environment is implemented in the third indexing station. The movement of the semiconductor device from the indexing station where the test is performed under the room temperature environment to the indexing station where the test is performed under the high temperature environment may also be performed by manual operation instead of using the arm.

[0127] In this embodiment, semiconductor devices are used as the inspection object of the inspection apparatus 1 , but the present invention is not limited thereto. Any device that needs to be tested in an environment with different conditions (an environment with different temperatures in this embodiment) can be used as the inspection object of the inspection apparatus 1 .

[0128] 〔Summarize〕

[0129] The inspection device of method 1 of the present invention has an index table, which has a device loading area and a mounting part loading area, and has a built-in heater for heating the device loading area and the mounting part loading area. The device loading area loads the device via the mounting part, and the mounting part loading area carries a preliminary mounting part that can be replaced with the mounting part.

[0130] According to the above method, the heating of the device and the heating of the pre-mounting member can be performed by one indexing table. Therefore, it is related to an inspection device for performing a test in a high temperature environment, and the inspection device includes an indexing table for mounting the device via a replaceable mounting member, so that the structure can be simplified. As a result, the miniaturization and cost reduction of such an inspection device can be achieved.

[0131] Furthermore, according to the above aspect, since the preliminary mounting member is heated on the index table where the operator is less likely to come into direct contact with his or her hands, the safety of the inspection device that performs a test in a high-temperature environment can be improved.

[0132] In the inspection device of the second aspect of the present invention, in addition to the structure of the inspection device of the first aspect, the following structure is adopted. That is, the inspection device further includes an arm, and the arm includes a device suction head and a mounting part suction head, the device suction head suctions the device, and the mounting part suction head suctions the mounting part.

[0133] According to the above aspect, the manual operation of the device and the manual operation of the mounting member can be performed by one arm. Therefore, the mechanism for performing the manual operation of the device and the manual operation of the mounting member can be simplified. Thus, the inspection device can be miniaturized and cost-effective.

[0134] In the inspection device of the third aspect of the present invention, in addition to the structure of the inspection device of the second aspect, the following structure is further adopted. That is, the arm performs the following actions: (1) a device recovery action, which uses the device suction head to recover the device from the device placement area; (2) a mount recovery action, which uses the mount suction head to recover the mount from the device placement area; and (3) a mount installation action, which uses the mount suction head to install the preliminary mount in the device placement area.

[0135] When a device is found to be a defective product through testing, the mounting part on which the device is mounted may be damaged. According to the above-mentioned method, the device found to be a defective product, the mounting part on which the device is mounted, and the installation of a spare mounting part can be performed by one arm.

[0136] In the inspection device of mode 4 of the present invention, in addition to the structure of the inspection device of mode 3, the following structure is also adopted. That is, the device recovery action and the mounting part recovery action include the following steps: the arm rotates so that the device adsorption head is configured at the first position; when the device loading area is configured at the first position, the device is adsorbed by the device adsorption head at the first position; the arm rotates so that the device adsorption head is configured at the second position, and the mounting part adsorption head is configured at the first position; when the device loading area is configured at the first position, the mounting part is adsorbed by the mounting part adsorption head at the first position, and the device adsorption head is released from adsorption of the device at the second position; the arm rotates so that the mounting part adsorption head is configured at the second position; and the mounting part adsorption head is released from adsorption of the mounting part at the second position.

[0137] According to the above aspect, the device identified as a defective product and the mount on which the device is mounted can be efficiently collected by one arm.

[0138] In the inspection device of mode 5 of the present invention, in addition to the structure of the inspection device of mode 4, the following structure is further adopted. That is, the mounting part installation action is realized by the following steps: the arm portion rotates so that the mounting part adsorption head is arranged at the first position; when the mounting part placement area is arranged at the first position, the mounting part adsorption head adsorbs the preliminary mounting part at the first position; and when the device placement area is arranged at the first position, the adsorption of the preliminary mounting part by the mounting part adsorption head is released at the first position.

[0139] According to the above aspect, the preliminary mounting member can be efficiently mounted using one arm.

[0140] In the inspection device of mode 6 of the present invention, in addition to the structure of the inspection device of any one of modes 3 to 5, the following structure is also adopted. That is, the inspection device has at least two index tables including the index table, the arm has at least two device suction heads including the device suction head, the arm uses the first device suction head and the second device suction head to perform the device moving action, and the arm uses the first device suction head or the second device suction head to perform the device recovery action, and the device moving action means: while moving the device placed on the first index table to the second index table, the device placed on the second index table is moved to the first index table.

[0141] According to the above aspect, in an inspection device having at least two indexing stages, the device can be moved between the indexing stages using an arm that transports the device and the mount. Therefore, the structure of the inspection device having at least two indexing stages can be simplified.

[0142] In the inspection device of mode 7 of the present invention, in addition to the structure of the inspection device of any one of modes 2 to 5, the following structure is further adopted. That is, the inspection device has at least two index tables including the index table, the arm has at least three device suction heads including the device suction head, the arm performs a device moving action using the first device suction head and the second device suction head, and the arm performs the device recovery action using the third device suction head, and the device moving action means: while moving the device placed on the first index table to the second index table, the device placed on the second index table is moved to the first index table.

[0143] According to the above aspect, in an inspection device having at least two indexing stages, the device can be moved between the indexing stages using an arm that transports the device and the mount. Therefore, the structure of the inspection device having at least two indexing stages can be simplified.

[0144] Furthermore, according to the above method, different suction heads can be used for recovering devices identified as defective products and for moving devices between indexing stations. Therefore, it is possible to avoid contamination of normal devices that may be caused by using a suction head contaminated by recovering devices identified as defective products for moving devices between indexing stations.

[0145] In the inspection device of aspect 8 of the present invention, in addition to the structure of the inspection device of any one of aspects 2 to 7, the following structure is adopted: That is, the arm portion further includes an air blowing head that removes foreign matter attached to the mounting member by blowing air.

[0146] According to the above aspect, it is possible to realize an inspection device having a function of removing foreign matter attached to a mounting member with a simple structure.

[0147] [Additional Notes]

[0148] The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in the above-described embodiments are also included in the technical scope of the present invention.

[0149] Description of symbols

[0150] 1: Check the device;

[0151] 11: 1st index station;

[0152] 12: 2nd index station;

[0153] 13: Arm;

[0154] 14: Installation parts recovery / supply unit;

[0155] 15: Test device No. 1 (for dynamic characteristics test at room temperature);

[0156] 16: The second test device (for dynamic characteristics test under high temperature environment);

[0157] 17: Test device No. 3 (for static characteristics test under high temperature environment);

[0158] 18: Test device No. 4 (for static characteristics test at room temperature).

Claims

1. An inspection device, characterized in that: The inspection device comprises a first indexing platform and an arm. The first indexing table: (1) has a device placement area and a mounting member placement area located on a circular first conveying path centered on a first rotation center; (2) conveys the device and the mounting member along the first conveying path by rotating about the first rotation center; and (3) has a built-in heater for heating the device placement area and the mounting member placement area. The device mounting area is an area where the device is mounted via a mounting member. The mounting member placement area is an area where a preliminary mounting member that can be replaced with the mounting member is placed. The arm portion: (4) has a first straight portion and a second straight portion extending from a second rotation center in first and second directions respectively different from each other and rotating around the second rotation center, a device suction head mounted on the first straight portion for suctioning the device, and a mounting member suction head mounted on the second straight portion for suctioning the mounting member; and (5) transports the device and the mounting member along a circular second transport path by rotating the first straight portion and the second straight portion around the second rotation center, The first conveying path and the second conveying path overlap at a first position, The arm performs the following actions: a device recovery action of recovering the device from the device loading area using the device suction head; a mounting part recovery action of recovering the mounting part from the device loading area using the mounting part suction head; and a mounting part installation action of installing the prepared mounting part to the device loading area using the mounting part suction head. In the device recovery action and the mounting part recovery action, The arm rotates so that the device adsorption head is arranged at the first position. When the device placement area is configured at the first position, the device adsorption head adsorbs the device at the first position. The arm portion rotates so that the device adsorption head is arranged at a second position different from the first position, and the mounting member adsorption head is arranged at the first position, When the device placement area is configured at the first position, the mounting member adsorption head adsorbs the mounting member at the first position, and the device adsorption head releases adsorption of the device at the second position. The arm rotates so that the mounting member adsorption head is arranged at the second position, The mounting part adsorption head releases the adsorption of the mounting part at the second position, In the installation operation of the installation part, The arm rotates so that the mounting member adsorption head is arranged at the first position, When the mounting member placement area is arranged at the first position, the mounting member adsorption head adsorbs the preliminary mounting member at the first position. The first indexing stage moves the device placement area where the mount is recovered by the mount recovery operation to the first position. When the device placement area where the mount is recovered is arranged at the first position, the mount adsorption head releases adsorption of the preliminary mount at the first position.

2. The inspection device according to claim 1, characterized in that: In addition to the first indexing table, the inspection device has a third rotation center and also has a second indexing table for conveying components and mounting parts along a circular third conveying path. The second conveying path and the third conveying path overlap at a third position, In the arm portion, the direction in which the first straight portion extends and the direction in which the second straight portion extends are orthogonal to each other. The arm portion further includes a third straight line portion extending from the second rotation center in a third direction opposite to the first direction. The device adsorption head is used as the first device adsorption head, A second device adsorption head is installed on the third straight line portion. The arm moves the device between the first index stage and the second index stage via the first position and the third position. The arm uses the first device adsorption head and the second device adsorption head to perform the device moving action, and the arm uses the first device adsorption head or the second device adsorption head to perform the device recovery action, wherein the device moving action refers to: while moving the device placed on the first index stage to the second index stage, the device placed on the second index stage is moved to the first index stage.

3. An inspection device, characterized in that: It includes the first indexing platform, the second indexing platform and an arm. The first indexing table: (1) has a device placement area and a mounting member placement area located on a circular first conveying path centered on a first rotation center; (2) conveys the device and the mounting member along the first conveying path by rotating about the first rotation center; and (3) has a built-in heater for heating the device placement area and the mounting member placement area. The device mounting area is an area where the device is mounted via a mounting member. The mounting member placement area is an area where a preliminary mounting member that can be replaced with the mounting member is placed. The second indexing table: (4) has a device placement area on a circular second conveying path centered on a second rotation center, on which the device is placed by a mounting member; and (5) conveys the device along the second conveying path by rotating about the second rotation center. The arm portion: (6) comprises (i) a first straight portion, a second straight portion, a third straight portion and a fourth straight portion extending from a third rotation center in four directions to form a cross, (ii) a first device suction head, a second device suction head and a third device suction head respectively mounted on the first straight portion, the second straight portion and the third straight portion, and (iii) a mounting part suction head mounted on the fourth straight portion; and (7) the device and the mounting part are transported along a circular third transport path by rotating the first straight portion, the second straight portion, the third straight portion and the fourth straight portion around the third rotation center. The first device adsorption head, the second device adsorption head and the third device adsorption head are respectively used to adsorb the devices, and the mounting part adsorption head is used to adsorb the mounting part. The first conveying path and the third conveying path overlap at a first position, The second conveying path and the third conveying path overlap at a second position, The arm performs the following actions: (8) a device conveying action of conveying the device placed on the first index stage to the second index stage and conveying the device placed on the second index stage to the first index stage using the first device suction head and the second device suction head; (9) a device recovery action of recovering the device from the device loading area using the third device suction head; (10) a mounting part recovery action of recovering the mounting part from the device loading area using the mounting part suction head; and (11) a mounting part installation action of installing the prepared mounting part to the device loading area using the mounting part suction head.

4. The inspection device according to claim 3, characterized in that: The arm portion further includes an air supply head, and the air supply head removes foreign matter attached to the mounting member by supplying air.

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