A method for processing a TVS diode using a TVS diode frame assembly

Abstract

TVS diode two-piece frame assembly and processing method. It relates to the technical field of semiconductor devices, and particularly relates to a two-piece frame of a TVS diode. The two-piece frame assembly comprises an upper frame assembly and a lower frame assembly. The lower frame assembly comprises a lower frame upper edge, a lower frame lower edge, and a plurality of lower frame ribs connected between the lower frame upper edge and the lower frame lower edge, and a plurality of lower frame units are distributed on both sides of the lower frame ribs. The upper frame assembly comprises an upper frame upper edge, an upper frame lower edge, and an upper frame rib connected between the upper frame upper edge and the upper frame lower edge, and a plurality of upper frame units are distributed on both sides of the upper frame rib. When the upper frame assembly is stacked on the lower frame assembly, the lower frame units and the upper frame units are one-to-one aligned. The application reduces the influence of stress on the TVS diode, improves the stability of the TVS diode in later use, and prolongs the service life of the TVS diode.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and more specifically to a two-piece frame for TVS diodes. Background Technology

[0002] TVS diodes, also known as transient voltage suppressor diodes, are a widely used new type of high-efficiency circuit protection device. They have extremely fast response times (sub-nanosecond level) and relatively high surge absorption capabilities. When their terminals are subjected to a sudden high-energy surge, the TVS diode can rapidly change the impedance between its terminals from high impedance to low impedance to absorb a large instantaneous current and clamp the voltage across its terminals to a predetermined value, thereby protecting downstream circuit components from the impact of transient high-voltage spikes.

[0003] As a protective device in a circuit, the quality of TVS diodes is particularly important. Currently, stress is generated during the lead cutting and bending processes of TVS diode manufacturing. During later use, the release of this stress can affect the stability of the TVS diode, leading to its failure. Summary of the Invention

[0004] To address the above problems, this invention provides a TVS diode two-piece frame assembly that can reduce the vibration and stress generated during the production process.

[0005] The technical solution of the present invention is: a TVS diode frame assembly, including an upper frame assembly and a lower frame assembly. The lower frame assembly includes an upper lower frame side, a lower lower frame side, and a plurality of lower frame ribs connecting the upper lower frame side and the lower lower frame side. A plurality of lower frame units are evenly distributed on both sides of the lower frame ribs. The upper frame assembly includes an upper upper frame side, an upper lower frame side, and an upper frame rib connecting the upper upper frame side and the lower upper frame side. A plurality of upper frame units are evenly distributed on both sides of the upper frame rib. When the upper frame assembly is superimposed on the lower frame assembly, the lower frame units and the upper frame units are aligned one-to-one.

[0006] The upper frame assembly has positioning holes on its upper and lower sides; the lower frame assembly has positioning holes on its upper and lower sides; the positioning holes of the upper and lower frames are positioned relative to each other.

[0007] The upper frame of the upper frame component has a chamfer at one end.

[0008] The other end of the upper part of the lower frame of the lower frame component is chamfered.

[0009] The upper frame unit is connected to the upper frame rib via an upper pin, and at least one upper pressure groove is formed on the surface of the upper pin.

[0010] At least one indentation is also formed on the surface of the upper pin.

[0011] The lower frame unit is connected to the lower frame rib via a lower pin, and at least one downward pressure groove is formed on the surface of the lower pin.

[0012] At least one indentation is formed on the surface of the lower pin.

[0013] The method for fabricating TVS diodes using TVS diode frame assemblies is as follows:

[0014] 1) Position the lower frame assembly in the welding fixture, and place TVS diode chips one by one on the chip carrier surface of several lower frame units;

[0015] 2) Then, position and stack the upper frame components one by one onto the lower frame component, so that the chip connection surface of the upper frame unit covers the top surface of the TVS diode chip.

[0016] 3) Welding and encapsulation;

[0017] 4) Low-vibration transmission cutoff, obtained.

[0018] After step 4), bend the upper pin and / or lower pin along the upper and / or lower pressure grooves.

[0019] The beneficial effects of this invention are as follows: several upper frame components are discontinuously connected to the lower frame component. During the lead cutting and blanking process, the vibration generated by the lead cutting is only transmitted backward along the lower frame component, which not only weakens the overall vibration of the upper and lower frame components but also avoids alternating stress on the TVS diode caused by the upper and lower frame components. In addition to the change in the structure of the upper frame component, both the upper and lower leads have at least one pressure groove, which also reduces the bending stress generated during the bending process. Through the above methods, this invention reduces the impact of stress on the TVS diode, improves the stability of the TVS diode in later use, and extends the service life of the TVS diode. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the upper frame component structure.

[0021] Figure 2 This is a schematic diagram of the lower frame component structure.

[0022] Figure 3 This is a schematic diagram of the overlapping structure of the upper frame component and the lower frame component.

[0023] Figure 4 This is a schematic diagram of the pre-indentation marks at the pin bending point.

[0024] Figure 5 This is a schematic diagram of a TVS diode structure.

[0025] Figure 6 This is a schematic diagram of the cross-section of a TVS diode.

[0026] In the diagram, 1 is the upper frame assembly, 11 is the upper frame unit, 111 is the upper pin, 112 is the upper frame unit chip connection surface, 12 is the upper frame rib, 131 is the upper edge of the upper frame, 132 is the lower edge of the upper frame, 14 is the upper frame assembly positioning hole, 2 is the lower frame assembly, 21 is the lower frame unit, 211 is the lower pin, 212 is the lower frame unit chip carrier surface, 22 is the lower frame rib, 231 is the upper edge of the lower frame, 232 is the lower edge of the lower frame, 24 is the lower frame assembly positioning hole, 25 is the lower frame assembly mounting positioning hole, 3 is the pin slot, 4 is the pin indentation, and 5 is the TVS diode. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings. The TVS diode frame assembly includes an upper frame assembly 1 and a lower frame assembly 2. The lower frame assembly 2 includes an upper lower frame edge 231, a lower lower frame edge 232, and a plurality of lower frame ribs 22 connecting the upper lower frame edge 231 and the lower lower frame edge 232. A plurality of lower frame units 21 are evenly distributed on both sides of the lower frame ribs 22. The upper frame assembly 1 includes an upper upper frame edge 131, an upper lower frame edge 132, and an upper frame rib 12 connecting the upper upper frame edge 131 and the upper lower frame edge 132. A plurality of upper frame units 11 are evenly distributed on both sides of the upper frame rib 12. When the upper frame assembly 1 is superimposed on the lower frame assembly 2, the lower frame units 21 and the upper frame units 11 are aligned one-to-one.

[0028] The upper frame assembly 1 has positioning holes 14 on its upper frame upper edge 131 and lower frame lower edge 132, which are circular holes on the upper and lower sides of the upper frame ribs 12. The lower frame assembly 2 has positioning holes 24 on its lower frame upper edge 231 and lower frame lower edge 232, which are circular holes sandwiched between two oval holes on the upper frame upper edge 231 and the corresponding circular hole on the lower frame lower edge 232. The positioning holes 14 and 24 of the upper frame assembly are aligned, thus ensuring that the upper frame unit 11 and the lower frame unit 21 are aligned one-to-one.

[0029] The lower frame assembly 2 is further provided with mounting and positioning holes 25 on the upper side 231 and the lower side 232 of the lower frame. The mounting and positioning holes 25 of the lower frame assembly are circular holes of the lower frame ribs 22 that are respectively aligned with the upper side 231 and the lower side 232 of the lower frame.

[0030] The upper frame component 1 has a chamfer at one end of the upper frame 131. The chamfer is located on the upper left side of the upper frame 131 and is used to quickly distinguish the front and back of the upper frame component 1.

[0031] The other end of the upper edge 231 of the lower frame component 2 is provided with a chamfer. The chamfer is located on the upper right side of the upper edge 231 of the lower frame, which is used to quickly distinguish the front and back of the lower frame component 2.

[0032] The upper frame unit 11 is connected to the upper frame rib 12 via the upper pin 111, and at least one upper pressure groove 3 is formed on the surface of the upper pin 111; the lower frame unit 21 is connected to the lower frame rib 22 via the lower pin 211, and at least one lower pressure groove 3 is formed on the surface of the lower pin 211. The number of pressure grooves 3 can be formed on the surface of the upper pin 111 and / or the lower pin 211 according to different bending requirements.

[0033] At least one upper indentation 4 is formed on the surface of the upper pin 111, and at least one lower indentation 4 is formed on the surface of the lower pin 211. The indentation 4 is to improve the adhesion between the molding compound and the surfaces of the upper pin 111 and / or the lower pin 211.

[0034] The method for fabricating TVS diodes using TVS diode frame assemblies is as follows:

[0035] 1) Position the lower frame assembly 2 in the welding fixture, and place TVS diode chips one by one on the chip carrier surface 212 of several lower frame units 21.

[0036] 2) Then, position and stack the upper frame components 1 one by one onto the lower frame components 2, so that the chip connection surface 112 of the upper frame unit 21 covers the top surface of the TVS diode chip.

[0037] 3) Welding and encapsulation;

[0038] 4) Low-vibration transmission cutoff, obtained.

[0039] After step 4), the upper pin 111 and / or the lower pin 211 can be bent along the upper pressure groove 3 and / or the lower pressure groove 3 according to different needs.

[0040] This invention is not limited to the above embodiments. Based on the technical solutions disclosed in this invention, those skilled in the art can make some substitutions and modifications to some of the technical features without creative effort, and all such substitutions and modifications are within the protection scope of this invention.

Claims

1. A method for fabricating TVS diodes using a TVS diode frame assembly, wherein the TVS diode frame assembly comprises an upper frame assembly and a lower frame assembly, characterized in that, The lower frame assembly is a continuous integral structure, including an upper lower frame, a lower lower frame, and a plurality of lower frame ribs connecting the upper lower frame and the lower lower frame. A plurality of lower frame units are evenly distributed on both sides of the lower frame ribs. The upper frame assembly is a discontinuous split structure, including an upper frame top edge, an upper frame bottom edge, and an upper frame rib connecting the upper frame top edge and the upper frame bottom edge; several upper frame units are evenly distributed on both sides of the upper frame rib. Process according to the following steps: 1) Position the lower frame assembly of the continuous integral structure in the welding fixture, and place TVS diode chips one by one on the chip carrier surface of several lower frame units. 2) Then, the split upper frame components are positioned and stacked one by one onto the lower frame component, so that the chip connection surface of the upper frame unit covers the top surface of the TVS diode chip. To achieve a one-to-one alignment between the lower frame unit and the upper frame unit; 3) Welding and encapsulation; 4) Low vibration transmission cutting: The frame assembly is cut and blanked using a low vibration transmission cutting process. The vibration force generated by cutting the ribs is only transmitted to the rear along the continuous integral lower frame assembly, avoiding the transmission of vibration force to the split upper frame assembly and TVS diode chip, eliminating the generation of alternating stress, and producing the finished TVS diode.

2. The method for fabricating a TVS diode using a TVS diode frame assembly according to claim 1, characterized in that, The upper frame assembly has positioning holes on its upper and lower sides; the lower frame assembly has positioning holes on its upper and lower sides; the positioning holes of the upper and lower frames are positioned relative to each other.

3. The method for fabricating a TVS diode using a TVS diode frame assembly according to claim 1, characterized in that, The upper frame of the upper frame component has a chamfer at one end.

4. A method for fabricating a TVS diode using a TVS diode frame assembly according to claim 1, characterized in that, The other end of the upper part of the lower frame of the lower frame component is chamfered.

5. A method for fabricating a TVS diode using a TVS diode frame assembly according to claim 1, characterized in that, The upper frame unit is connected to the upper frame rib via an upper pin, and at least one upper pressure groove is formed on the surface of the upper pin.

6. A method for fabricating a TVS diode using a TVS diode frame assembly according to claim 5, characterized in that, At least one indentation is also formed on the surface of the upper pin.

7. A method for fabricating a TVS diode using a TVS diode frame assembly according to claim 1, characterized in that, The lower frame unit is connected to the lower frame rib via a lower pin, and at least one downward pressure groove is formed on the surface of the lower pin.

8. A method for fabricating a TVS diode using a TVS diode frame assembly according to claim 7, characterized in that, At least one indentation is formed on the surface of the lower pin.

9. A method for fabricating a TVS diode using a TVS diode frame assembly according to claim 1, characterized in that, After step 4), bend the upper pin and / or lower pin along the upper and / or lower pressure groove.

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