Alignment carrier, alignment system and method for semiconductor device bonding

Abstract

The present application discloses an alignment carrier, an alignment system and a method for semiconductor device bonding, and relates to a panel-level package (PLP) with high precision and high scalability. PLP adopts an alignment carrier with a low coefficient of expansion, which is constructed with a semiconductor device area having a local semiconductor device alignment mark. For example, a local semiconductor device alignment mark is set for each semiconductor device attachment area. Depending on the size of the panel, it can be divided into a plurality of blocks, each block having a semiconductor device area containing a local semiconductor device alignment mark. In addition, the block includes an alignment semiconductor device area constructed for attaching an alignment semiconductor device. Due to the local semiconductor device alignment mark and the alignment semiconductor device, linear and nonlinear position errors are reduced. The use of local semiconductor device alignment marks and alignment semiconductor devices can increase production and scaling, thereby improving productivity and reducing overall costs.

Description

Technical Field

[0001] The present disclosure relates to packaging of devices. In particular, the present disclosure relates to an alignment carrier and an alignment system having a camera module, wherein the camera module is configured to align semiconductor devices (e.g., silicon wafers, dies, passive components, metal components, etc.) on the alignment carrier so as to bond the semiconductor devices. Background Art

[0002] In recent years, panel-level packaging (PLP) of devices has received great attention. This is due to the fact that a greater number of semiconductor devices can be packaged in parallel than conventional wafer-level or substrate-level packaging techniques. PLP involves attaching individual semiconductor devices on a large carrier for semiconductor device bonding. For example, the die are arranged on the carrier in a matrix of rows and columns of die. Depending on the panel size, the panel can accommodate significantly more die than on a wafer, for example, 3 to 5 times more die than on a wafer or more. This increases packaging yield and reduces costs.

[0003] An important consideration in PLP is to accurately position the semiconductor device on the panel before bonding at the target location. Conventionally, the bonding location is calculated based on global reference marks on the panel, and each semiconductor device is placed at the predetermined location through precise mechanical movement of the bonding head.

[0004] However, conventional PLP techniques are limited by having positioning errors on the carrier. Positioning errors may occur due to various reasons such as geometry-related issues (e.g., straightness, linearity, and orthogonality), temperature issues (e.g., expansion, sliding, and deformation of the scale), and vibration issues (e.g., long-distance high-speed movement may cause stop position errors). In addition, during the reconstruction or reassembly process, the carrier and panel (encapsulated semiconductor devices) experience thermal cycles of expansion and contraction. Due to the repeated use of the carrier, additional thermal cycles may be experienced.

[0005] Panel deformation causes the geometry or size to be different from the original design, based on which the semiconductor device position is calculated. The more thermal cycles experienced, the greater the deformation. The deformation problem worsens as the panel size increases. The deformation causes the semiconductor device on the panel to shift from the originally calculated position. The shift of the semiconductor device has a negative impact on the yield of the bonding process, thereby increasing costs. The greater the deformation, the greater the shift. The greater the shift, the greater the negative impact on yield and cost. Due to the shift error, subsequent processing requires a lot of error mitigation measures to more accurately construct the circuit.

[0006] Based on the foregoing discussion, it is desirable to provide high precision to the PLP throughout the entire bonding process to increase yield and improve scalability. Summary of the invention

[0007] Embodiments of the present disclosure generally relate to devices. In particular, the present disclosure relates to semiconductor device bonding using an alignment carrier. The alignment carrier can be used for die bonding of a single die package or a multi-die package, such as a multi-chip module (MCM). Semiconductor device bonding is facilitated by a semiconductor device bonding tool having a camera or alignment module, which is configured to align the semiconductor device for bonding on the alignment carrier.

[0008] In one embodiment, a device includes an alignment carrier for semiconductor device bonding, the alignment carrier including a planar carrier and semiconductor device bonding regions defined on the planar carrier, wherein each semiconductor device bonding region of the planar carrier includes a local alignment mark for semiconductor device bonding.

[0009] In one embodiment, an alignment system for a semiconductor device bonder includes an integrated camera module configured to observe downward in a vertical direction to detect a local alignment mark of a semiconductor device bonding region of the alignment carrier to be bonded with a semiconductor device when an alignment carrier having a semiconductor device bonding region with a local alignment mark is mounted on a base assembly of the semiconductor device bonder. The integrated camera module is also configured to observe upward in a vertical direction to observe a bottom surface of a semiconductor device when attached to a bonding head for semiconductor device bonding of the semiconductor device bonder. The system also includes an alignment controller for receiving input from the camera module, the alignment controller being configured to align the semiconductor device when attached to the bonding head with the semiconductor device bonding region to be bonded with the semiconductor device based on the input from the camera module so that the semiconductor device is bonded.

[0010] In one embodiment, a method for semiconductor device bonding includes: setting an alignment carrier, the alignment carrier including a semiconductor device bonding area defined thereon. The semiconductor device bonding area includes a local alignment mark to facilitate alignment of a semiconductor device for semiconductor device bonding of the semiconductor device with the semiconductor device bonding area, and the alignment carrier is mounted on a base assembly of a semiconductor device bonder. The method also includes picking up a first semiconductor device for semiconductor device bonding onto a first semiconductor device bonding area on the alignment carrier by a bonding head of the semiconductor device bonder, and using an alignment system to align the first semiconductor device with the first semiconductor device bonding area. The alignment system is configured to observe downward in a vertical direction to detect the local alignment mark of the first semiconductor device bonding area, and observe upward in the vertical direction to observe the bottom surface of the first semiconductor device. The method also includes sending information of the alignment system to a controller, which aligns the first semiconductor device with the first semiconductor device bonding area based on the information from the alignment system. The method continues by moving the first semiconductor device vertically downward to the alignment carrier by the bond head after achieving alignment of the first semiconductor device with the first semiconductor device bonding region to bond the first semiconductor device to the first semiconductor device bonding region of the alignment carrier.

[0011] These and other advantages and features of the embodiments disclosed herein will become apparent by reference to the following description and drawings.In addition, it should be understood that the features of the various embodiments described herein are not mutually exclusive, but may exist in various combinations and arrangements. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings, which are incorporated in and form a part of the specification, wherein like reference numerals represent like components, illustrate preferred embodiments of the present disclosure and, together with the description, serve to explain the principles of the various embodiments of the present disclosure.

[0013] Figure 1 Various views of a semiconductor wafer are shown;

[0014] Figure 2 shows a simplified top view of an embodiment of an alignment carrier for die bonding;

[0015] Figure 3 An embodiment of a process flow for preparing an alignment carrier for die bonding is shown;

[0016] Figure 4 shows a simplified side view of an embodiment of a bonding tool;

[0017] Figure 5a to Figure 5bSimplified top and side views showing an embodiment of a camera unit of a bonding tool;

[0018] Figure 5c An exemplary distance configuration of components of a camera unit is shown;

[0019] Figure 6 A portion of another embodiment of an alignment carrier is shown;

[0020] Figure 7a to Figure 7b An exemplary die layout of a die bonding area having multiple dies is shown;

[0021] Figures 8a to 8f shows a simplified process of attaching a die to a die bonding area of ​​an alignment carrier;

[0022] Fig. 9 A simplified process for die bonding using an alignment carrier is shown;

[0023] Figures 10a to 10d An implementation of the alignment process is shown in more detail;

[0024] Figures 11a to 11f A simplified cross-sectional view illustrating an embodiment of a die reconstruction process using an alignment carrier;

[0025] Figures 12a to 12c A process of checking the position of a die on a carrier substrate is shown;

[0026] Fig.12d shows the splitting lines of the panel assembly calculated according to the DLC;

[0027] Figures 13a to 13e A simplified cross-sectional view showing an embodiment of downstream processing of a die on a carrier substrate; and

[0028] Figure 14a to Figure 14b Simplified side and top views are shown of trace interconnect tolerances of bonding contacts with respect to downstream processing using an alignment carrier with local die alignment marks and an alignment die. DETAILED DESCRIPTION

[0029] Embodiments generally relate to devices, such as semiconductor devices or integrated circuits (ICs). In particular, the present disclosure relates to semiconductor device (e.g., silicon wafer, die, passive components, metal components, etc.) bonding of the device using an alignment carrier. The alignment carrier can be used for die bonding of a single die package or a multi-die package, such as a multi-chip module (MCM). Semiconductor device bonding is facilitated by a semiconductor device bonding tool having a camera or alignment module, which is configured to align the semiconductor device for bonding on the alignment carrier. Figure 1-Figure 14 uses bare die bonding as an example to illustrate an alignment carrier, an alignment system and a method for bonding semiconductor devices. It can be understood that the alignment carrier, the alignment system and the method are also applicable to the bonding of semiconductor devices such as silicon wafers, passive components, and metal components.

[0030] Figure 1 A simplified view of a semiconductor wafer 100 is shown. For example, a top view 100a and side views 100b-100c of the wafer are shown. The wafer can be a lightly doped p-type silicon wafer. Other types of wafers can also be used. A plurality of devices 105 are formed on the active surface of the wafer. For example, the active surface can be the top surface of the wafer, and the inactive surface can be the bottom surface. The devices are arranged in rows along a first direction (x direction) and in columns along a second direction (y direction). After the processing of the wafer is completed, as shown in the side view 100c, the wafer is cut along the cutting line 120 in the x direction and the y direction to separate the devices into individual wafers 105.

[0031] The processed wafer may be an incoming processed wafer from an external supplier. For example, a packaging vendor may receive the processed wafer. The processed wafer may be cut into individual dies for packaging using an alignment carrier and a die bonding tool equipped with an alignment module, the die bonding tool being used to align the dies for die bonding on the alignment carrier.

[0032] Figure 2 A simplified top view of an embodiment of an alignment carrier 200 is shown. The alignment carrier is configured for die bonding, such as attaching a die thereto. As shown, the alignment carrier is a rectangular carrier. Carriers of other shapes may also be practical. In a preferred embodiment, the panel is formed of a material having a low coefficient of expansion (CTE) to minimize linear changes during temperature changes. For example, the panel may be formed of a material having a CTE equal to or less than 8. In addition, the material should be strong enough to withstand handling during the bonding process. In addition, the material should preferably be magnetic so that the panel can be firmly held during the grinding process as part of the entire bonding process. For example, low CTE materials may include, for example, alloy 42 (CTE3-4.5) and alloy 46 (CTE7-8). Other types of low CTE materials may also be used to form the alignment carrier. It may also be practical to form the alignment carrier using other materials and materials having other CTEs (including materials having a CTE greater than 8). The size of the alignment carrier may be as large as 600*600mm. 2 (square millimeters). It may also be practical to provide alignment carriers having other dimensions.

[0033] In one embodiment, the alignment carrier includes a die bonding area 240. The die bonding area is configured to accommodate a die for die bonding. For example, each die bonding area of ​​the alignment carrier is configured to accommodate a die for die bonding. In one embodiment, the die bonding area includes local alignment marks 250 for aligning the die with the die attachment area 252. For example, each die area includes its own local die alignment marks for attaching a die thereto. The die attachment area is an area of ​​the die bonding area on which a die is attached.

[0034] In one embodiment, the die bonding area includes at least two local die alignment marks. It may also be practical to set other numbers of local die alignment marks greater than 2. For example, the die area may include 2 to 4 alignment marks. It may also be practical to set other numbers of alignment marks (including more than four alignment marks). As shown, the die area includes 4 local die alignment marks. For example, the local die alignment marks are located on the corners of the die bonding area, forming the corners of a rectangle. Other configurations of local die alignment marks may also be practical.

[0035] In one embodiment, the alignment mark is preferably located outside the die attach area. For example, the alignment mark (as shown) surrounds the die attach area. The alignment mark arranged in the die attach area or the combination of the alignment mark outside the die attach area and in the die attach area may also be practical. If necessary, the alignment mark is arranged outside the die attach area to facilitate the post-bonding inspection. The die bonding area can be configured to accommodate a single die or multiple die, such as multi-chip module (MCM) applications. In the case of MCM applications, the alignment mark is arranged outside the die attach area so that the alignment mark can be used as a common alignment mark for bonding multiple die to the die bonding area. If the alignment mark is arranged in the die attach area of ​​one of the die, additional alignment marks can be arranged for the die bonding of other die of the MCM.

[0036] In one embodiment, local die alignment marks are constructed for detection by a co-linear vision camera for alignment. Local die alignment marks can be formed on the die bonding area of ​​the alignment carrier using, for example, laser drilling. Other techniques for forming local alignment marks may also be practical. Preferably, the local die alignment marks are shallow alignment marks that facilitate removal by grinding for panel recycling. For example, such as when one die is no longer produced, the local alignment marks can be removed and new local alignment marks can be formed for die bonding of another or different types of dies.

[0037] Compared with the conventional method of calculating the die bonding position based on the global alignment mark, setting the local die alignment mark for each die bonding area improves the position accuracy of the die bonding of each die bonding area. In addition, by setting the local die alignment mark, the influence of panel deformation or other positioning errors is minimized, and the position accuracy of the die on the alignment carrier is improved, thereby improving the yield and scalability.

[0038] The die bonding area of ​​the alignment carrier can be constructed in a matrix form, with rows and columns of the die bonding area in a first direction and a second direction. For example, the die bonding area 240 is arranged in a matrix form, and each die bonding area is configured to accommodate a die. The alignment carrier may include at least two specified alignment device bonding areas, such as the alignment die bonding area 245 (it may also be other alignment device bonding areas, such as alignment passive components, alignment metal parts bonding areas, etc.). For example, the alignment carrier may include 2 to 4 alignment die bonding areas. It may also be practical to set other numbers of alignment die bonding areas. The alignment die bonding area may be located at the corner of the die bonding area matrix. Other configurations of the alignment die bonding area may also be adopted.

[0039] The alignment die area is similar to other die areas of the panel, except that the alignment die bonding area is designated for the alignment die. For example, the alignment die (or alignment device, such as alignment passive device, alignment metal part, etc.) is a die (or device, such as passive device, metal part, etc.) bonded to the alignment die bonding area (or alignment device bonding area). The alignment die can be a common die, such as a die bonded in other die bonding areas of the carrier. The common die is packaged and sold to customers and becomes a product. For example, the alignment die can be a common die that is also used for alignment purposes.

[0040] In other cases, alignment die may be specially constructed for alignment purposes. It would be advantageous to provide specific alignment die because they can be easily distinguished from ordinary die. In this case, the alignment die is not suitable for normal use. Preferably, the top of the alignment die is processed to have features that are easily detected by the alignment camera. This will form a contrast in the alignment image, making it easy to detect. Other types of alignment die are also practical. The alignment die can be processed on the same wafer as the ordinary die or on a different wafer.

[0041] In one embodiment, the alignment carrier may be divided or partitioned into die bonding area blocks 220. For example, the blocks are distinct blocks with spaces separating adjacent blocks. In some embodiments, the blocks may not be distinct blocks. For example, the die bonding area may be divided into blocks that are not separated by spaces. For example, the blocks may appear as a continuous matrix of die bonding areas.

[0042] The blocks are constructed to accommodate multiple dies for die bonding. Dividing the panel into blocks is advantageous because it divides the panel into smaller sized blocks to reduce shift errors caused by large panels. For example, the blocks provide scale advantages for large panels while retaining the advantages of smaller sized panels. As shown in the figure, the panel is divided into 4 panel blocks. It may also be practical to divide the panel into other numbers of blocks. For 600*600mm 2 Alignment carrier, these blocks can be about 270*270mm 2 . Preferably, the blocks are constructed as blocks of the same size. Other numbers of blocks and block sizes may also be practical. The number of blocks and block sizes may depend on different factors, such as the material, the size of the panel and the process conditions. The size of the block should be selected to achieve high processing output while maintaining scale advantages.

[0043] In one embodiment, a block includes at least one alignment mark bonding area 245 for bonding the alignment die to the area. It may also be practical to set more than one alignment die bonding area. For example, a block may include 1 to 4 or more alignment die areas. Preferably, the alignment die bonding area can be set at the corner position of the block. For example, the alignment die bonding area can be set at the four corners of the block or 1 to 3 corners of the block. It may also be practical to position the alignment die bonding area at other positions of the block. The more alignment die areas there are, the more accurate the die bonding process is. However, in the case where the alignment die is used specifically for alignment purposes, because more die areas will be assigned to the alignment die, this may be at the expense of reducing the number of die outputs per alignment carrier. In some embodiments, adjacent blocks can share alignment die bonding areas. For example, in the case where a block is provided with an alignment die bonding area, it can share a second alignment die area from an adjacent block. Other configurations for sharing alignment die areas between blocks may also be practical.

[0044] The alignment die is used as an additional reference point for each block. Providing the alignment die for the block enables linear and nonlinear errors that occur in downstream processing (such as molding) to be reduced to a minimum. For example, linear and nonlinear positioning errors are significantly reduced. In addition, the alignment die is used as an origin reference for each die within the block.

[0045] As described, the alignment carrier is formed of a metal material with localized alignment marks. Using a metal material is advantageous because it enables the use of a magnetic table to hold the carrier securely in place for processing. For example, a magnetic table can be used to hold the carrier securely in place for grinding mold compounds.

[0046] In other embodiments, the alignment carrier can be formed of glass or other types of transparent materials. Local alignment marks can be formed on the transparent carrier. In other cases, the local alignment marks can be independent of the transparent carrier, such as a glass carrier. For example, the local alignment marks can be formed on a separate marking sheet (such as paper or resin) and can be attached to the bottom or inactive surface of the transparent carrier. The use of independent local marks eliminates the need for marking on the panel, thereby significantly reducing manufacturing costs. The light from the camera module of the die bonder can penetrate the transparent carrier to detect the local alignment marks on the marking sheet. The use of independent local marks can be easily implemented and eliminates the need for marking on the carrier. In addition, it is advantageous to set local alignment marks independent of the transparent carrier because it avoids the need to mass-produce glass panels with local alignment marks. Since glass panels are fragile and marking is expensive, this can save a lot of money.

[0047] Figure 3 An embodiment of a process 300 for preparing an alignment carrier for die bonding is shown. At step 310, a basic alignment carrier is set. As discussed, the basic alignment carrier can be a low CTE alignment carrier. For example, the alignment carrier can be formed of Alloy 42 (CTE3-4.5) or Alloy 46 (CTE7-8). Other types of low CTE materials can also be used to form the alignment carrier. At step 320, the surface of the panel is prepared. For example, the bonding or active surface of the alignment carrier is prepared. In one embodiment, the surface preparation includes grinding to ensure flatness and thickness uniformity and a scratch-free surface. In some cases, the active surface can be treated to further harden the surface to prevent it from being scratched and discolored. For non-bonding or non-active surfaces, they can be ground to ensure that they are free of dents and burrs.

[0048] Proceeding to step 330, the process continues to form alignment marks on the active surface of the panel. The alignment marks are formed with high precision to obtain accurate spacing between the marks. For example, the alignment marks are formed in the virtual die area on the active surface of the panel. The die area can be constructed into separate virtual blocks. The pattern of the mark can be based on the panel layout of the panel computer-aided design (CAD) file. The alignment marks can be formed, for example, using lasers, mechanical drilling or etching. Other techniques for forming the marks may also be practical.

[0049] After forming the alignment marks, in step 340, adhesive tape is applied to the active surface of the alignment carrier. The adhesive tape is applied to the active surface of the alignment carrier to prepare for die bonding. For example, the adhesive tape covers the active surface, including the local alignment marks and the die area. In one embodiment, the adhesive tape is a thermal release tape. Other types of tapes can also be used to promote die bonding. The adhesive tape should be transparent enough to enable the alignment unit with a camera of the bonding module to detect the alignment marks used to align the die with the alignment carrier. For example, the adhesive tape can be translucent so that the light of the alignment unit can penetrate the adhesive tape to detect the local alignment marks. In one embodiment, the camera of the alignment unit is configured to image the alignment marks on the alignment carrier vertically downward and the bonding surface of the die vertically upward so as to accurately bond the die to the die bonding area of ​​the alignment carrier. In addition, the adhesiveness of the adhesive tape should be strong enough to keep the die in place once it is aligned and placed on it by the bonding tool. After applying the adhesive tape, the alignment carrier is ready for die bonding.

[0050] Figure 4 A simplified diagram of an embodiment of a die bonder 400 is shown. As shown, the die bonder includes a base assembly 420 for supporting an alignment carrier 410. For example, the base assembly is configured to support the alignment carrier 410 for bonding. The die bonder includes a bonding assembly 430, which is mounted on a support or rack assembly 435. For example, the bonding assembly is located above the base assembly. The bonding assembly includes a bonding head 441 and a bonding assembly actuator 440. The bonding assembly actuator is configured to move the bonding head toward or away from the alignment carrier in the z direction (vertical direction). The bonding head includes a bonding head actuator 444 and a bonding tool (bonder) 442. The bonding head actuator controls the bonder to pick up or release the die.

[0051] The support or rack assembly is configured to actuate the bonding assembly to position the bonding head at a continuous die bonding area on the alignment carrier. For example, the support assembly includes a support alignment assembly, which is configured to align the bonding head on the xy plane to position the bonding head at a continuous die bonding area for die bonding. For example, the support alignment assembly can perform a rough alignment of the bonding head to the die bonding area for die bonding. After the rough alignment, the support alignment assembly performs a fine alignment of the bonding head to bond the die to the die attachment area. The rough alignment may include moving the bonding head in the x-direction and / or the y-direction to the die bonding area, and the fine alignment may include moving the bonding head in the x-direction and / or the y-direction by the die bonding tool and rotating the die along the xy plane.

[0052] In one embodiment, the support alignment assembly includes an x-axis actuator, a y-axis actuator, and an angular (θ) actuator for performing planar motion along a horizontal xy plane and / or angular motion around an axis of the bonding head to facilitate coarse alignment and fine alignment. Coarse alignment and fine alignment can be performed continuously or discontinuously. For example, continuous coarse alignment and fine alignment can be the case where both are performed after the die is picked up by the bonding head from a feeder assembly (not shown); discontinuous coarse alignment and fine alignment can be the case where coarse alignment is performed before the die is picked up by the bonding head, and fine alignment is performed afterwards.

[0053] In order to achieve the alignment of the die to the die bonding area, the bonding assembly includes an integrated camera module 450. For example, the camera unit extends to image the die area on the alignment carrier and the die on the bonder 442 of the bonding head 441. Rough alignment can be performed using a camera module or without a camera module. For example, the position of the die bonding area can be roughly or roughly determined based on the alignment die bonding area or position. Alternatively, the rough alignment can be determined by using a camera module. As for fine alignment, it is achieved by a camera module.

[0054] The camera unit includes a camera and a light source for emitting light to capture an image. For example, the light source can emit light that can penetrate the adhesive layer on the panel to identify the local die alignment mark through the camera module, so that the die is aligned with the die attachment area of ​​the die bonding area by moving the bonding head. For example, one or more light sources can generate light with a wavelength of about 600nm to penetrate the adhesive tape. Other wavelengths that can penetrate the adhesive tape may also be practical. In one embodiment, the camera module includes a lookdown camera for observing the alignment carrier.

[0055] The light also enables the camera module to observe the die on the bonding head so that the die can be aligned with the die attachment area by rotating the die in the xy plane. For example, the camera captures an image of the target position and an image of the die. In one embodiment, the camera module includes a lookup camera for observing the die panel. The die bonder controller calculates the offset values ​​in the x-direction and y-direction relative to the target position and the angle in the xy plane. Once the calculation is completed, the controller adjusts the bonding head accordingly to place the die on the target die attachment area.

[0056] The system can accommodate attaching a die to a die carrier using an active or inactive side. For example, a die can be attached to an alignment carrier in a face-up or face-down configuration. For example, face-up refers to the inactive side of the die being attached to the alignment carrier, while face-down refers to the active side of the die being attached to the alignment carrier. For a face-down configuration, a transparent layer such as ABF can be coated on the active side of the die. This enables the camera module to further utilize features on the die as alignment features. For example, an upward-looking camera can observe features on the active side of the die for use as alignment marks. In some cases, the inactive side of the die can be processed to include alignment features to be detected by the upward-looking camera. By using an upward-looking camera, the die bonder can improve accuracy by employing a cluster of multiple features on the bottom or bonding side of the die.

[0057] As discussed, the die bonder is constructed with a bonding assembly having a die bonding head. In order to increase production, a plurality of die bonding assemblies mounted on a support assembly can be constructed for the die bonder. For example, the die bonder can be constructed with 4 or 6 bonding assemblies for performing die bonding on a plurality of dies in parallel on an alignment carrier. In some cases, a plurality of bonding assemblies can be used to perform die bonding on a plurality of alignment carriers in parallel. The individual bonding assemblies can be constructed to operate independently of each other. For example, each bonding assembly includes its respective support assembly and camera module for independently aligning the die with the die attachment area.

[0058] Also as described, the support alignment assembly performs both coarse alignment and fine alignment. In some embodiments, the base assembly may include a translatable stage for performing coarse alignment of the carrier while the support alignment assembly performs fine alignment. Other configurations for aligning the bonding head with the bonding area on the alignment carrier may also be employed.

[0059] Figure 5a and Figure 5b Different simplified views of the camera unit 500 are shown. For example, Figure 5a shows a top view of the camera unit, and Figure 5b A side view of a camera unit is shown. For example, Figure 5b The side view of the camera unit shown may be viewed from the front or from the x-direction.

[0060] Reference Figure 5a and Figure 5b, the camera unit includes a first integrated alignment camera subunit 530a and a second integrated alignment camera subunit 530b. The integrated camera subunits are high-resolution collinear camera subunits, one for observing the alignment carrier 510 and the other for observing the die 514. For example, the first camera subunit (looking down) 530a is configured to observe the alignment carrier or image the alignment carrier, and the second camera subunit (looking up) 530b is configured to observe the die or image the die in the optical deflector subunit (optical deflector subunit) 540. As shown in the figure, the camera subunits are arranged side by side in the xy plane. The integrated camera subunit includes a collinear camera (534a or 534b) connected to a high-resolution lens (536a or 536b). The light source (538a or 538b) is configured to emit light that can penetrate the adhesive tape of the alignment mark on the cover panel. For example, the light source can generate light with a wavelength of 600nm. Other wavelengths sufficient to penetrate the adhesive tape or transparent dielectric layer may also be practical.

[0061] The light is passed to the reflector subunit 540. The reflector subunit is configured to reflect light from the first light source 538a via a first reflector or mirror 542a to a prism 546, which further reflects the light from the first light source downward to the panel (looking down at the camera), while the light from the second light source 538b is reflected from a second reflector or mirror 542b to the prism 546 and further upward to the die (looking down at the camera). This enables the camera unit to capture images from both the die and the die attach area on the carrier, giving it a direct line of sight for alignment.

[0062] As discussed, the camera module utilizes the use of an upward-looking camera and a downward-looking camera for simultaneous recognition of local alignment marks on the die and the alignment carrier. The ability to simultaneously recognize local alignment marks on the alignment carrier and the die imparts high precision in die bonding. In addition, by configuring the camera of the camera unit in the xy plane (horizontal plane or side by side), the integrated camera module is a compact module in the z direction or vertical direction. This advantageously reduces the movement of the bonding head toward the panel along the vertical distance between the bonding head and the alignment carrier, thereby improving productivity.

[0063] Figure 5cAn exemplary configuration of distances 501 of components of a camera unit is shown. For example, the distance from lens to prism, the distance from prism surface to reflector surface, the distance from reflector surface to prism surface, the distance from prism surface to prism surface, the distance from prism surface to reflector surface, the distance from reflector surface to prism surface, the distance from prism surface to ring glass, the distance from glass surface to glass surface, and the distance from prism surface to panel are shown. The unit of distance is millimeter (mm). Distance includes actual distance and aerial distance. The camera unit can include other distance configurations for components.

[0064] Figure 6 A simplified diagram of a portion of an embodiment of an alignment carrier 610 is shown. The alignment carrier includes a plurality of die bonding areas 640 arranged in a matrix. The die bonding areas can be divided into blocks of die bonding areas. Surrounding the die areas are local die alignment marks 650. For example, four local alignment marks are provided for each die bonding area, surrounding the corners of the die attachment area. It may also be practical to provide other numbers of local alignment marks and other configurations of local alignment marks.

[0065] In one embodiment, the die attachment area is configured to attach multiple dies. For example, as shown in the figure, the die attachment area includes a first die attachment area and a second die attachment area configured to attach a first die 6141 and a second die 6142. It may also be practical to attach other numbers of dies to the die attachment area. Multiple dies in the die area are attached using the same local die alignment mark. The relatively accurate positioning of the die on the die attachment area is ensured using the same local die alignment mark. In addition, accurate die positioning for interconnection between dies, such as high solder ring tolerance, is achieved using the same local die alignment mark. In addition, the use of the same alignment mark eliminates the error caused by the hole position. For example, if a single alignment mark is used to position multiple dies, the error caused by the hole position can be added to the position error between the dies.

[0066] As described, local alignment marks are disposed outside of the die attach area of ​​the die bonding area. This is advantageous because, as already discussed, this enables the same local die alignment marks to be used to attach the die. However, in some cases, alignment marks may be disposed within the die attach area. In these cases, each die attach area of ​​the die bonding area may require a corresponding set of local alignment marks. In other cases, there may be a combination of alignment marks inside and outside the die attach area of ​​the die bonding area. It is to be understood that various configurations of local alignment marks for the die attach area of ​​the die bonding area may be employed.

[0067] Figure 7a and Figure 7b An embodiment is shown in which multiple dies are attached to the die attach area using the same local die alignment marks. Figure 7a A configuration is shown for attaching a first die 7141 and a second die 7142 to a die attach region 740 using the same local die alignment marks. As shown, the first die may be an AP die formed using 14nm technology, while the second die may be a BB die formed using 28nm technology. Figure 7b , which illustrates a configuration for attaching die 7141-7145. As shown, the die include an AP die formed using 14nm technology, a BB die formed using 28nm technology, a power management integrated circuit (PMIC) die, an integrated passive device (IPD) die, and a radio frequency (RF) die. Other configurations of multiple die on the die attach area may also be practical.

[0068] As described, an alignment carrier can be used to package an MCM. For example, a current alignment carrier with local alignment marks and a bonding assembly can be used to package different types of dies with different functions into a single package structure. An alignment carrier and a die bonder can be used to achieve precise alignment of the MCM.

[0069] Various techniques can be used to bond different types of dies to the alignment carrier. In one embodiment, a separate die bonder can be used to bond different types of dies to the carrier. For example, a first die bonder is used to bond the first type of die of the MCM to the alignment carrier. After the first type of die is bonded to the alignment carrier, the carrier is transferred to a second die bonder, which is used to bond the second type of die of the MCM to the carrier. The process can be repeated until all types of dies of the MCM are bonded to the carrier in sequence. In another embodiment, the same die bonder can be used to bond different types of dies of the MCM to the carrier. For example, after completing the bonding of the first type of die of the MCM to the carrier, the die bonder is reprogrammed to bond the second type of die. Repeat the process until all types of dies are bonded to the alignment carrier. The use of local alignment marks in MCM applications advantageously enables different dies to be bonded by different die bonders while still maintaining the same benchmark and relative accuracy. This is impossible for conventional technologies such as technologies using global alignment marks.

[0070] Figures 8a to 8f A simplified diagram depicting an embodiment of a process 800 for performing die bonding on an alignment carrier is shown. Figure 8a , showing that, for example, Figure 4 and Figure 5a-Figure 5b8. The die bonder 802 is a die bonder such as the die bonder described in . An alignment carrier or panel 810 is disposed on a base assembly 820. The support alignment assembly can align the bond head with the die bonding area on the carrier. For example, a rough alignment of the bond head 842 with the carrier is performed. The die feeder assembly 860 feeds the die 814 to the bond head. For example, the die feeder extends below the bond head.

[0071] Reference Figure 8b , the bonder picks up the die 814 from the feeder 860. For example, the bond assembly actuator 840 positions the bond head 842 on top of the die, and the bond head actuator actuates the bonder of the bond head to pick up the die. The bonder can use vacuum pressure to pick up the die from the die feeder. After picking up the die, the die feeder is retracted to expose the die attachment area on the carrier to which the die is to be attached. It is understood that a rough alignment of the alignment carrier can be performed after picking up the die.

[0072] exist Figure 8c In the embodiment of the present invention, the camera module 850 is extended for alignment. For example, the camera module is extended to a position for fine alignment. Fine alignment includes positioning the bonding head so that the die is aligned with the die attach area in both the x and y directions and the rotational angle.

[0073] like Figure 8d As shown, after fine alignment of the die and the die attach area is achieved, the camera module 850 is retracted to expose the die attach area on the carrier 810. Figure 8e In the process, the bonding assembly is actuated to move the bonding head vertically to attach the die to the die attach area on the alignment carrier. After attaching the die, the process continues to attach the next die, such as Figure 8f As shown. For example, the bonding head is translated to the next die attach area station on the carrier 820, and the die feeder 860 provides another die 816 to the die bonder. The process is repeated by aligning and attaching the die to the die attach area until all the die attach areas on the carrier are bonded with a die. In addition, the controller of the system is programmed to know whether to supply an aligned die or a normal die to the bonding tool based on which die area on the panel is used for bonding.

[0074] As previously discussed, the die bonder can be configured with a translating base assembly to perform coarse alignment while supporting an alignment assembly to perform fine alignment. Additionally, the alignment die can be the same as a regular die, or specialized for alignment purposes.

[0075] Fig. 9An embodiment of a process flow 900 for die bonding using an alignment carrier is shown. The bonding process begins at step 905. Initialization can be performed at step 910. Initialization can include information about the bonding process. For example, the size of the carrier, the number of blocks, the size of the blocks, the number of dies in the rows, and the number of dies in the columns. In addition, the initialization information can include the starting point of the bonding process (such as the starting block and the starting die position in the block) and which die positions are normal die positions and aligned die positions. Other information can include carrier alignment points in the carrier CAD file and die alignment points in the die CAD file to facilitate alignment.

[0076] In step 915, the die is provided to the bonding tool. For example, an appropriate die (normal or alignment die) is provided to the bonding head unit by a die feeder. The bonding head picks up the die from the die feeder. After picking up the die, the die feeder is retracted to expose the die area to be bonded with the die. For example, a rough alignment of the die area is performed before the die is picked up. In other cases, a rough alignment of the die area can be performed after the die is picked up. In step 920, the support alignment assembly performs fine alignment of the die with the die bonding area. For example, a camera module extends between the die and the alignment carrier. Based on the input from the camera module, the controller aligns the die with the die attachment area in both the x-direction and the y-direction and the rotation angle.

[0077] At step 925, once the die is aligned with the die attach area, the camera module is retracted so that the bonding head can move vertically downward to place the die on the die attach area of ​​the carrier. At step 930, the die bonder determines whether there are more die to be bonded. For example, if there are more die in the block to be bonded. If so, the bonding head is translated to the next die position for bonding at step 935. Thereafter, the process repeats from step 915 to step 930 until the block is completed. If the block is completed, the process proceeds to step 940 to determine whether there are more blocks on the carrier to be bonded. If there are additional blocks to be bonded, the process proceeds to step 945. The bonding head is translated to the first die position of the next block on the carrier and proceeds to step 915. Thereafter, the process repeats from step 915 to step 930 until the block is completed. The process continues until all blocks are processed. Once all blocks are processed, the process terminates at step 950.

[0078] As described, the carrier is constructed into multiple blocks. However, it is understood that the carrier can be constructed as a single block of die bonding areas. In this way, the process can be modified to exclude the step of determining whether there are more die blocks.

[0079] In addition, as described, die bonding is performed on both the alignment die and the common die. For example, the die bonder loads the appropriate die for bonding based on the type of die bonding position until the entire block is bonded, and then to the next block until the die bonding of the alignment carrier is completed. Alternative methods can be used for die bonding of the alignment carrier. For example, the same die bonder can be used to bond the alignment die before bonding the common die. Alternatively, the common die can be bonded first and then the alignment die. In other cases, different die bonders can be used to bond the alignment die and the common die. In the case where the alignment die and the common die are the same die, the same bonder can be used and they can all be bonded in sequence according to the order of the die bonding areas.

[0080] Figures 10a to 10d A simplified illustration of an embodiment of an alignment process 1000 is shown. As discussed, the alignment performed by the die bonder is a local die alignment of the die using a direct or straight line of sight to the die bonding area on the alignment carrier and the die. For example, Fig.10a The camera module 1050, the die 1014, and the alignment carrier or panel 1010 are depicted in an aligned position before bonding. For example, the camera module 1050 is disposed between the die 1014 and the die bonding area 1040 on the alignment carrier 1010 where the die bonding is to be performed. The camera module uses the local die alignment marks 1055 of the die bonding area 1040 to accurately align the die 1014 to the die attachment area. As shown, the bottom surface of the die bonded to the carrier is the active surface. The active surface of the die can be covered by a transparent dielectric layer such as an ABT layer. This enables the upward-looking camera to observe the features of the active surface for use as alignment marks. The bottom surface of the die 1015 and the view of the die area 1040 as captured by the camera unit are shown in detail. For example, the view of the bottom surface includes features such as through holes 1018, and the view of the die area includes local die alignment marks 1055 around the die attachment area. In other embodiments, the bottom surface can be the inactive surface of the die.

[0081] Fig.10bHow to perform alignment is shown. For example, alignment involves matching the die pattern 1022 of the die 1015 from the die CAD file with the die area pattern 1062 of the die attachment area 1040 from the carrier CAD file. As shown, the die area pattern includes features such as alignment marks 1066, and the die pattern includes features such as through holes 1026. In addition, the die pattern includes a die alignment point 1028, and the die area pattern includes a die area alignment point 1068. As shown, the die alignment point is set at the center of the die pattern, and the die area alignment point is set at the center of the die area pattern. It may also be practical to position the alignment mark in other areas of the die pattern and the die area pattern. For example, the controller can determine the offset as an input to accurately position the die on the target die bonding area before placement.

[0082] like Fig.10c As shown, the die pattern and the die area pattern are matched for alignment. For example, the die area pattern is overlaid on the die area, the local die alignment mark 1055 matches the alignment mark of the die area pattern, and the die pattern is overlaid on the bottom surface of the die, and the through hole 1026 of the die pattern matches the through hole 1018 of the die. Thereafter, the die alignment point 1028 on the die pattern is then matched with the die area alignment point 1068 on the die area pattern. This aligns the die with the die area.

[0083] Once aligned, the bond head places the seated die on the die attach area. Fig.10d As shown in the top view 1005a and the side view 1005b in FIG. 1 , the die 1014 is aligned on the adjacent die areas. In addition, as shown, the adjacent die areas can share a common local die alignment mark 1055 located between them. This further reduces the footprint of the die area, making it possible to mount a greater number of die on the block of the panel.

[0084] Figures 11a to 11f A simplified cross-sectional view of an embodiment of a die reconstruction process 1100 using an alignment carrier is shown. Fig.11a, an alignment carrier 1110 is shown. The alignment carrier includes an active surface 1111 on which a plurality of die areas 1140 are defined. The active surface may be referred to as a front face or a first surface, for example. The die areas may be defined according to a carrier CAD file. In one embodiment, the alignment panel is divided into a plurality of blocks, each block having a plurality of die areas. However, for simplicity, only two die areas are shown. The active surface of the alignment carrier includes local die alignment holes or marks 1155. In one embodiment, the local alignment marks surround the die attachment area or are outside the die attachment area. Other configurations of local alignment marks may also be practical. For example, the alignment marks may be within the die attachment area or inside and outside the die attachment area.

[0085] As shown, adjacent die areas share common alignment marks. On the active surface of the alignment carrier, adhesive tape 1112 is applied. The adhesive tape covers the die area, including the alignment marks. In one embodiment, the adhesive tape is a transparent adhesive tape, so that the alignment marks can be detected by the camera module of the die bonder to perform local die alignment of the die to the die area. Die 1114 is attached to the die attachment area. In this way, the active surface of the die is attached to the carrier. It can also be practical to attach the inactive surface of the die to the carrier. Based on the alignment using the local die alignment marks, the die is aligned with the die attachment area of ​​the die area.

[0086] exist Fig.11b In, the carrier with the die bonded thereto undergoes a molding process. For example, a molding compound 1170 is formed over the alignment carrier, covering it and the die. The molding compound and the die may be referred to as a molding panel, and the molding panel on the carrier may be referred to as a panel assembly. The molding compound may be in the form of a powder / granules, a liquid, or a film. In one embodiment, compression molding is performed to form the molding compound. Other techniques for forming the molding compound may also be practical. The molding process is a high temperature process. For example, the alignment panel undergoes high temperature and high pressure, such as approximately 150-180°C and 240-320TF. The material of the alignment carrier can withstand the conditions of the molding process without deformation, warping, or damage. In addition, due to the low CTE material of the alignment carrier, linear changes during temperature changes are minimized. After the molding compound is formed, the top surface is ground. For example, as Fig.11c As shown, a grinding wheel 1180 such as a resin bonded grinding wheel and a polishing tool are used to grind the top surface of the panel. For example, the top surface is ground to a desired height and to ensure uniform thickness and stress relief.

[0087] As discussed, the die can be attached to the alignment carrier face-up (inactive side attached to the carrier) or face-down (active side attached to the alignment carrier). In the case of face-down bonding, the mold compound covers the inactive side of the die attached to the alignment carrier. In this case, the desired height of the panel can be any height, including leaving the inactive side of the die exposed. In the case of face-up bonding, grinding will expose the active side of the die.

[0088] like Fig.11d As shown, the adhesive tape 1112 is released from the alignment carrier 1110. For example, a release process is performed to separate the alignment carrier from the adhesive tape 1112. In one embodiment, the release process includes subjecting the alignment carrier to a high temperature treatment, such as about 210°C. Fig.11e As shown, once the alignment carrier is released from the adhesive tape, it is peeled off the mold panel 1160. This results in the active surface of the die in the mold panel 1160 being exposed.

[0089] exist Fig.11f In the embodiment, the molded panel 1160 is transferred to the carrier substrate 1190 to form a second molded panel assembly. For example, an adhesive tape 1192 is provided on the carrier substrate so that the molded panel can be attached to the carrier substrate. The active surface of the die of the molded panel is exposed. The carrier substrate facilitates the processing of the molded panel, such as transportation to downstream processing. In one embodiment, the carrier substrate can be similar to an alignment carrier. It can also be practical to use a carrier substrate different from the alignment carrier.

[0090] Figures 12a to 12c An embodiment of a process 1200 for performing die location checking (DLC) on a carrier substrate is shown. Fig.12a , a second molded panel assembly is shown. For example, the second molded panel assembly includes a molded panel 1260 attached to a carrier substrate 1220. The molded panel is constructed with a plurality of blocks 1230. A block includes a plurality of dies 1214 arranged in a matrix form. For example, the dies of a block are arranged in rows and columns. A block is provided with at least one alignment die 1216 in a designated alignment die area. The number of alignment die per block may depend on the DLC scheme used. The alignment die is used as a reference point for the block.

[0091] Schematically, a block includes 4 alignment dies at the corners of the block. For example, each block of the panel includes 4 alignment dies at the corners of the block. Blocks can be provided with other numbers of dies and / or other positions. Providing four alignment dies helps downstream processing. For the purpose of DLC, two alignment dies should be sufficient to determine the angle of the block. Preferably, the alignment dies are on the same x or y axis rather than on a diagonal. In some cases, the alignment dies can be shared by adjacent blocks.

[0092] Reference Figure 12b , a die position inspection scheme is shown. A DLC scan is performed using multiple cameras. The DLC scans the panel assembly and identifies the alignment die of the block. For example, the alignment die of each block is identified. As shown, the first area and the second area (area A and area B) correspond to the first camera and the second camera (camera A and camera B) scanned by the DLC. The outline represents the area scanned by the camera. For example, the outline of area A represents the area scanned by camera A, and the outline of area B represents the area scanned by camera B. As shown, area 1251a scanned by camera A covers blocks 1 and 3, while area 1251b scanned by camera B covers blocks 2 and 4. The alignment die is used to determine the origin of the block. For example, one of the alignment die is used as the origin die 1216 of the block.

[0093] exist Fig.12c , as shown, the alignment die 1216 is used as the origin die of block 1214 (e.g., block 2). A portion 1247 of block 2 containing the origin die 1216 is shown in more detail. For example, the origin die is used to determine the (0,0) coordinates of block 2. For example, 0 or the origin on the x-axis and 0 or the origin on the y-axis are determined from the origin die. The die is referenced by at least one reference point. In one embodiment, the die is referenced by two reference points 12301-12302. Using two reference points helps determine the angular position of the die. In one embodiment, the adjacent alignment die of the origin die is measured. The two adjacent alignment die are used to determine the axis representing the orthogonality of the block. As shown, the two alignment die are used to determine the x-axis. In other cases, the two alignment die can be used to determine the y-axis. Once the axis of block 2 is determined, the system generates the X-coordinates and Y-coordinates of all die positions of block 2. In one embodiment, the die is referenced using two reference points. Using two reference points helps determine the angular position of the die. The die positions of all blocks are calculated based on the origin die of the corresponding block. The results are generated block by block, and each block has its own origin and die coordinate data. In an alternative embodiment, the coordinates of all die positions of the block are generated based only on the origin die. For example, the axis representing the orthogonality of the block is not determined.

[0094] In one embodiment, a DLC export file is created. The DLC export file contains the X-coordinates, Y-coordinates of all die positions for all blocks of the alignment panel. The die position is represented by at least one reference point. The reference point corresponds to a set of X-coordinates, Y-coordinates. In one embodiment, the die position is represented by two reference points. For example, the die position corresponds to two sets of X-coordinates, Y-coordinates. The DLC export file can be, for example, in CSV format. By reducing the panel into smaller blocks or fragments, higher bonding accuracy can be achieved.

[0095] As described, the advantage of the present DLC process is that it can generate alignment die as well as common die positions. Common die positions of different blocks can be calculated based on the block's origin alignment die with or without considering block orthogonality. In addition, Fig.12d As shown, a separation line 1283 for separating the molded panel can be calculated. The separation line can be calculated by averaging the positions of all the dies in a row or column.

[0096] Figures 13a to 13e A simplified cross-sectional view of an embodiment of downstream processing 1300 of dies on a second panel assembly is shown. Fig.13a , a carrier substrate 1390 is shown with a molded panel 1360 mounted thereon. For example, a second panel assembly is shown. The molded panel includes a die encapsulated with a molded compound 1370. The molded panel is attached to the carrier substrate by an adhesive tape 1392 to form a downstream workpiece. Types of adhesive tapes (such as thermal release tapes) can be used to facilitate die bonding. In one embodiment, the bottom surface of the molded panel is attached to the carrier substrate. This top surface of the molded panel includes exposed active surfaces of die 1314 and die 1316. The exposed active die surfaces include through holes that expose bonding pads.

[0097] The molded panel can be constructed with multiple blocks. A block includes multiple dies arranged in a matrix form. For example, the dies of a block are arranged in rows and columns. In one embodiment, a block is provided with at least one alignment die 1316 in a specified alignment die area. The number of alignment die of each block can depend on the DLC scheme used. The alignment die is used as a reference point for the block.

[0098] For simplicity, the cross-sectional view may depict a simple block with a 4×4 die matrix. The block includes alignment die 1316 disposed at its corners and common die 1314 disposed at the remaining die locations. It is understood that the molded panel may include multiple blocks and that a block may include a die matrix having a size much larger than a 4×4 matrix.

[0099] A DLC scan is performed on a downstream workpiece using a camera module 1398. The camera module may be configured with multiple cameras for identifying aligned die. The scan is configured to scan the entire molded panel and generate a map of die locations based on an origin on the molded panel. The system generates X-coordinates, Y-coordinates for all die locations relative to the origin die of the molded panel. A DLC export file is created that contains the X-coordinates, Y-coordinates, or a map of all die locations for the molded panel on the carrier substrate.

[0100] Reference Fig.13b, the DLC export file is sent to a downstream processing tool for processing. In one embodiment, the processing may include forming interconnects. In one embodiment, the downstream processing includes forming an interconnect layer 1375. The interconnect layer may be, for example, a copper-based alloy, such as a copper-titanium alloy. Other types of interconnects or metal layers may also be practical. For example, interconnects are formed by sputtering, filling through holes in a die, and covering the surface of a molded panel.

[0101] The exported DLC file is input into a laser direct imaging (LDI) system to pattern the dielectric layer. In one embodiment, the DLC file is converted into a circuit file readable by the LDI system. The converted circuit file is used by the LDI system, which obtains references from the alignment die and extracts the DLC data to determine the actual die position for patterning the dielectric layer 1380, thereby forming an opening 1382 for exposing the filled via, such as Fig.13c As shown, a trace area for trace interconnection is formed.

[0102] Reference Fig.13d , the downstream workpiece undergoes a plating process. For example, a plating process such as electroplating forms trace interconnects 1378 in the openings of the dielectric layer. After forming the trace interconnects, such as Fig.13e As shown, the dielectric layer is removed. The removal of the dielectric layer can be achieved by, for example, stripping. Other techniques for removing the dielectric layer may also be practical. Subsequent processing may include removing the carrier substrate and cutting the panel to separate the devices.

[0103] Fig.14a and Fig.14b Simplified side and top views 1400 of trace interconnect tolerances of bonded contacts with respect to downstream processing using an alignment panel with local die alignment marks and alignment dies are shown. Fig.14a and Fig.14b, showing trace interconnects of a single die configuration 1405a and trace interconnects of a multi-die configuration 1405b. For example, the single die configuration shows a die 1414 encapsulated by a mold compound 1470. As for the multi-die configuration, a first die 14141 and a second die 14142 encapsulated by a mold compound 1470 are exemplarily shown. The active surface of one or more dies includes a trace interconnect 1477 disposed above a bonding contact 1475, which fills a bonding through hole that exposes a bonding pad. As shown, since the die position is accurately calculated based on the use of local die alignment marks on the alignment carrier and the alignment die, downstream processing (such as forming trace interconnects) is more accurate. For example, the annular ring (AR) tolerance is + / -10μm. In addition, DLC can further improve the annular ring tolerance to less than + / -5μm.

[0104] As described, die bonding is performed using an alignment carrier with local alignment marks to improve accuracy. The local alignment marks can also be applied to wafer level packaging (WLP) processes. For example, local alignment marks can be set on the die of a wafer to improve bonding accuracy.

[0105] Without departing from the spirit or essential characteristics of the present disclosure, the present disclosure may be embodied in other specific forms. Therefore, the foregoing embodiments should be considered in all respects to be illustrative, rather than limiting, the invention described herein. Therefore, the scope of the present invention is indicated by the appended claims rather than by the foregoing description, and all changes falling within the equivalent meaning and scope of the claims should be covered herein.

[0106] This application claims priority to Singapore Provisional Application No. 10201902757X filed on March 27, 2019 and priority to U.S. Application No. 16 / 814,961 filed on March 10, 2020.

Claims

1. An alignment system for a semiconductor device bonder, characterized in that: The alignment system includes: An integrated camera module is configured as follows: observing downward in a vertical direction to detect the local alignment mark of the semiconductor device bonding area of ​​the alignment carrier where the semiconductor device is to be bonded when the alignment carrier having the semiconductor device bonding area with the local alignment mark is mounted on the base assembly of the semiconductor device bonder, and looking upward in the vertical direction to observe the bottom surface of the semiconductor device when attached to a bonding head for semiconductor device bonding of the semiconductor device bonder; and an alignment controller that receives input from the camera module, the alignment controller being configured to align the semiconductor device when attached to the bonding head with a semiconductor device bonding region where semiconductor device bonding is to be performed based on the input from the camera module for semiconductor device bonding; The camera module comprises: a first camera sub-unit including a first in-line vision camera having a first light source, the first light source being configured to generate a first light having a first wavelength sufficient to penetrate an adhesive tape on the alignment carrier for semiconductor device bonding, the first camera sub-unit being configured to look downward in a vertical direction to detect the local alignment mark on the alignment carrier; and a second camera sub-unit including a second in-line vision camera having a second light source, wherein the second camera sub-unit is configured to look upward in a vertical direction to observe a bottom surface of the semiconductor device when attached to the bond head of the semiconductor device bonder; The alignment vehicle comprises: Planar vehicles; and a semiconductor device bonding area defined on the planar carrier; Wherein, each semiconductor device bonding area of ​​the planar carrier includes a local alignment mark for semiconductor device bonding; wherein the semiconductor device bonding area is divided into blocks of semiconductor device areas, and each block includes an alignment device bonding area designated for an alignment device; The blocks of the semiconductor device area are virtual blocks, which are spatially separated to form different blocks on the alignment carrier, each block including an alignment device bonding area located at a corner of the block, the alignment device bonding area being used to bond an alignment device.

2. The alignment system according to claim 1, wherein: The first light source generates light having a wavelength of about 600 nm to penetrate the adhesive tape.

3. The alignment system according to claim 1, wherein: The alignment controller is configured to facilitate aligning the bond head at a location on a bond area for semiconductor device bonding when the semiconductor device is attached to the bond head, wherein aligning the bond head includes moving horizontally and angularly in an xy plane based on input from the camera module.

4. The alignment system of claim 1, wherein: The base assembly is configured to hold the alignment carrier in a fixed position for semiconductor device bonding; and The alignment controller is configured to move the bond head to an alignment position, wherein moving the bond head to the alignment position comprises: Horizontal movement in the x-direction and the y-direction and angular movement of the bond head to angularly rotate the semiconductor device in the xy plane are used for fine alignment of semiconductor device attach regions with semiconductor device bonding regions on the alignment carrier to be bonded to the semiconductor device.

5. The alignment system of claim 1, wherein: The semiconductor device includes a bare chip on which a bare chip pattern is provided; The semiconductor device bonding area includes a die bonding area, on which a die area pattern is disposed; The alignment of the semiconductor device and the semiconductor device bonding region is performed by aligning the die pattern and the die region pattern.

6. The alignment system of claim 5, wherein: The die pattern includes a die alignment point, which is arranged at the center of the die pattern; the die area pattern includes a die area alignment point, which is arranged at the center of the die area pattern; And, aligning the die with the die bonding area by matching the die alignment points on the die pattern with the die area alignment points on the die area pattern.

7. The alignment system according to claim 5 or 6, further comprising: A semiconductor device position inspection device includes a camera module configured to scan an alignment device of a mold panel to generate a coordinate axis, thereby generating position information of the semiconductor device on the mold panel relative to the alignment device.

8. The alignment system of claim 1, wherein: Each semiconductor device bonding region includes a semiconductor device attachment region configured for bonding a semiconductor device to the attachment region.

9. The alignment system of claim 8, wherein: The local alignment mark of each semiconductor device bonding region is disposed outside the semiconductor device attachment region to allow the local alignment mark to be visible after semiconductor device bonding.

10. The alignment system of claim 8, wherein: Local alignment marks of each semiconductor device bonding region are disposed in the semiconductor device attachment region and are covered after semiconductor device bonding.

11. The alignment system of claim 1 , wherein: Each semiconductor device bonding region is configured with four local alignment marks arranged as corners of a rectangle.

12. The alignment system of claim 1, wherein: The planar carrier includes a low coefficient of expansion (CTE) material, and the CTE material includes a material with a CTE less than or equal to 8.

13. The alignment system of claim 1, wherein: The semiconductor device bonding area is configured to bond a plurality of semiconductor devices to form a multi-chip module (MCM) package, and the plurality of semiconductor devices have at least one common local alignment mark at the semiconductor device bonding area.

14. The alignment system of claim 1, wherein: The flat carrier includes a magnetic panel that holds it securely in place while grinding the molding compound.

15. A method for bonding a semiconductor device, using the alignment system according to any one of claims 1 to 14, the method comprising the following steps: providing an alignment carrier, the alignment carrier including a semiconductor device bonding area defined thereon, wherein the semiconductor device bonding area includes local alignment marks to facilitate alignment of a semiconductor device for semiconductor device bonding with the semiconductor device bonding area, wherein the alignment carrier is mounted on a base assembly of a semiconductor device bonder; Picking up a first semiconductor device for semiconductor device bonding by a bonding head of a semiconductor device bonder to a first semiconductor device bonding area on the alignment carrier; aligning the first semiconductor device with the first semiconductor device bonding area, wherein the step of aligning the first semiconductor device with the first semiconductor device bonding area comprises using an alignment system; and After alignment of the first semiconductor device with the first semiconductor device bonding region is achieved, the first semiconductor device is vertically moved downward to the alignment carrier by the bonding head to bond the first semiconductor device to the first semiconductor device bonding region of the alignment carrier.

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