Heat dissipation device and method for manufacturing heat dissipation device

Abstract

A method for manufacturing a heat dissipation device includes stamping a composite plate with solder on its surface to form a first plate having multiple oblique grooves, disposing powder in the oblique grooves of the first plate, stacking and fixing the first plate and a second plate, welding the first plate and the second plate, and sintering the powder located in the oblique grooves of the first plate into a capillary structure.

Description

[Technical Field]

[0001] This invention relates to a heat dissipation device and a manufacturing method thereof, particularly a heat dissipation device having a capillary structure and a manufacturing method thereof. [Background Technology]

[0002] With the advancement of technology, the efficiency of electronic components has significantly improved, but this has also led to the generation of a large amount of heat during operation. To dissipate the heat generated by electronic components, heat dissipation devices, such as heat sinks, are typically used in conjunction with them. Heat sinks have circulating channels filled with coolant. When the heat sink comes into hot contact with the electronic component (also known as the heat source), the coolant in the circulating channels absorbs the heat generated by the electronic component, thus dissipating heat. [Summary of the Invention]

[0003] The present invention provides a heat dissipation device for effectively dissipating heat from electronic components.

[0004] An embodiment of the present invention discloses a heat dissipation device for containing a cooling fluid, comprising a first plate, a second plate, and at least a capillary structure. The first plate has a plurality of first oblique grooves arranged along a first direction. The second plate has a plurality of second oblique grooves arranged along the first direction. The second plate is stacked on top of the first plate, and the first and second oblique grooves are at least partially connected to each other to form a fluid channel. The fluid channel is used to contain the cooling fluid. The capillary structure is located in at least a portion of the fluid channel.

[0005] Another embodiment of the present invention discloses a heat dissipation device for containing a cooling fluid. The heat dissipation device includes a first plate, a second plate, and at least one capillary structure. The first plate has a plurality of first oblique grooves arranged along a first direction and at least one first straight groove extending along the first direction. A common end of each first oblique groove is connected to the at least one first straight groove. The second plate is stacked on top of the first plate to collectively form a fluid channel. The fluid channel is used to contain the cooling fluid. The capillary structure is located in at least a portion of the fluid channel.

[0006] Another embodiment of the present invention discloses a heat dissipation device comprising a first plate, a second plate, and at least one capillary structure. The first plate has a first groove and a first surface forming the first groove. The second plate has a second surface, and the second plate is stacked on top of the first plate with the second surface facing the first surface, such that at least a portion of the first groove forms a fluid channel. The capillary structure is located within the fluid channel and stacked on the first surface of the first plate.

[0007] Another embodiment of the present invention discloses a method for manufacturing a heat dissipation device, comprising stamping a composite plate with solder on its surface to form a first plate having a plurality of oblique grooves, disposing a powder in the oblique grooves of the first plate, stacking and fixing the first plate and a second plate, welding the first plate and the second plate, and sintering the powder located in the oblique grooves of the first plate into a capillary structure.

[0008] Another embodiment of the present invention discloses a method for manufacturing a heat dissipation device, comprising stamping a non-composite plate without solder to form a first plate having a plurality of oblique grooves, disposing of a powder in the oblique grooves of the first plate, sintering the powder disposed in the oblique grooves of the first plate into a capillary structure, stacking and fixing the first plate and a second plate, and welding the first plate and the second plate.

[0009] Another embodiment of the present invention discloses a method for manufacturing a heat dissipation device, comprising disposing a plurality of capillary structures on a first plate and a second plate respectively, rolling the first plate and the second plate together to form a heat dissipation device, and performing a blow-blowing process on the heat dissipation device to form at least one oblique groove in the heat dissipation device.

[0010] Another embodiment of the present invention discloses a method for manufacturing a heat dissipation device, comprising rolling and joining a first plate and a second plate to form a heat dissipation device, inflating the heat dissipation device to form at least one oblique groove in the heat dissipation device, cutting the heat dissipation device to form a slit in the at least one oblique groove, inserting a capillary structure into the at least one oblique groove through the slit, and sealing the slit through rolling.

[0011] According to the heat sink and its manufacturing method in the above embodiments, capillary structures are additionally provided in the oblique grooves, so that in addition to dissipating heat from the heat source below the surface of the cooling fluid through the fluid channels under the action of gravity, the heat sink can also dissipate heat through the capillary structures in the oblique grooves. (Page 2 of 28, Specification)

[0012] However, the fluid flows back against gravity to the heat source above the liquid surface, thus taking into account the heat dissipation efficiency of both the heat source above and below the liquid surface.

[0013] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. [Attached Image Description]

[0014] The present invention can be better understood through the following embodiments and accompanying drawings. It should be emphasized that, according to standard industrial practice, the various features in the drawings are not drawn to scale and are for illustrative purposes only. In fact, the scale of various features can be arbitrarily increased or decreased for clarity of explanation and representation.

[0015] Figure 1 This is a perspective view of a heat dissipation device according to an embodiment of the present invention.

[0016] Figure 2 for Figure 1 A schematic diagram of its breakdown.

[0017] Figure 3 for Figure 1 A partial cross-sectional schematic diagram.

[0018] Figure 4 This is an exploded view of a heat dissipation device according to an embodiment of the present invention.

[0019] Figure 5 for Figure 1 A side view of the heat dissipation device with a heat source and cooling fluid.

[0020] Figure 6 This is a perspective view of a heat dissipation device according to an embodiment of the present invention.

[0021] Figure 7 for Figure 6 A schematic diagram of its breakdown.

[0022] Figure 8 for Figure 6 A partial cross-sectional schematic diagram.

[0023] Figure 9 for Figure 6 A side view diagram of the heat dissipation device, heat source, and cooling fluid.

[0024] Figure 10 This is a perspective view of a heat dissipation device according to an embodiment of the present invention.

[0025] Figure 11 for Figure 10 A schematic diagram of its breakdown.

[0026] Figure 12 for Figure 10 A partial cross-sectional schematic diagram.

[0027] Figure 13 for Figure 10 A side view diagram of the heat dissipation device, heat source, and cooling fluid.

[0028] Figure 14 This is a perspective view of a heat dissipation device according to an embodiment of the present invention.

[0029] Figure 15 for Figure 14 A front view of the heat dissipation device.

[0030] Figure 16 for Figure 15 A partial cross-sectional schematic diagram of the heat dissipation device drawn along section line 16-16.

[0031] Figure 17 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention.

[0032] Page 3 of 28 (Instruction Manual)

[0033] Figure 18 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention.

[0034] Figure 19 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention.

[0035] Figure 20 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention.

[0036] Figure 21 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention.

[0037] Figure 22 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention.

[0038] Figure 23 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention.

[0039] Figure 24 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention.

[0040] Figure 25 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention.

[0041] Figure 26 This is a three-dimensional cross-sectional view of a heat dissipation device according to an embodiment of the present invention.

[0042] Figure 27 , 28 29 is Figure 26 A three-dimensional cross-sectional diagram of the capillary structure insertion process.

[0043] Figure 30 This is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention.

[0044] Figure 31 This is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention.

[0045] Figure 32This is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention.

[0046] Figure 33 This is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention.

Detailed Implementation Methods

[0047] It should be understood that the following disclosure provides many different embodiments and examples for implementing various features of the present invention. The specific embodiments or examples of components and configurations described below are intended to simplify the invention, and are illustrative only and not intended to limit the invention. For example, the dimensions of components are not limited to the disclosed range or values, but may depend on process conditions and / or the required characteristics of the apparatus. Furthermore, in the following description, if a relationship of interconnection between two components is mentioned, it means that the two components may be directly connected or indirectly connected through another component. For simplicity and clarity, various features may be drawn at any scale.

[0048] Furthermore, spatial relative terms, such as below or above, can be used to describe the relationship between one component or feature and another component or feature as shown in the figure. In addition to the orientation shown in the figure, spatial relative terms also include different orientations of the device in use or operation. The device may be turned in other ways (e.g., rotated 90 degrees or other angles), and the spatial relative descriptions used herein can be interpreted accordingly. Furthermore, the term "made of" can mean "comprising" or "consisting of".

[0049] The embodiments disclosed in this invention relate to heat dissipation devices that improve the circulation of cooling fluid (also known as coolant) within the device. According to these exemplary embodiments, the heat dissipation device allows the cooling fluid to flow in the opposite direction to gravity even when its interior is not completely filled with cooling fluid. In conventional heat dissipation devices, the surface of the cooling fluid is in thermal contact with a heat source. Due to gravity, the cooling fluid circulating within the device cannot flow towards the heat source, making it difficult for the cooling fluid to absorb the heat generated by the heat source and thus hindering heat dissipation.

[0050] Figure 1 This is a perspective view of a heat dissipation device according to an embodiment of the present invention. Figure 2 for Figure 1 A schematic diagram of its breakdown. Figure 3 for Figure 1 A partial cross-sectional schematic diagram. This embodiment discloses a heat dissipation device 10. Figure 1The heat dissipation device 10 shown is a plate-shaped device, also referred to herein as heat dissipation plate 10. It should be understood that the heat dissipation device in the embodiments disclosed in this invention is not limited to a plate shape, and the heat dissipation device can be of any shape without departing from the spirit and scope of this invention.

[0051] The heat sink 10 includes a first plate 100, a second plate 200, and a capillary structure 300. The first plate 100 and the second plate 200 are disposed opposite to each other, and the capillary structure 300 is disposed between the first plate 100 and the second plate 200.

[0052] The first plate 100 has two opposing long sides 101 and 102, and the first plate 100 has a plurality of first oblique grooves 110 spaced apart along a first direction. The first direction is, for example, the direction of the major axis of the first plate 100 (i.e., as shown in the image). Figure 1 (As shown along the X-axis). These first oblique grooves 110 are recesses and extend from one side of the first plate 100 adjacent to the long side 101 toward the long side 102 (i.e., along the Y-axis). Figure 2 As shown, each first inclined groove 110 has a first end 151 and a second end 152 opposite to each other, with the first end 151 adjacent to the long side 101 and the second end 152 adjacent to the long side 102. The first end 151 of the first inclined groove 110 is higher than its second end 152, so it can be seen that the first inclined groove 110 is inclined in the first plate 100.

[0053] The first plate 100 also has two first straight grooves 120 and 130 extending along a first direction, such as the X-axis. The first straight groove 120 is adjacent to the long side 101, and the first straight groove 130 is adjacent to the long side 102. The first ends 151 of these first oblique grooves 110 are connected to the first straight groove 120, and the second ends of these first oblique grooves 110 are connected to the first straight groove 120. (Page 5 of 28, specification)

[0054] End 152 is connected to the first straight groove 130. Therefore, these first oblique grooves 110 are interconnected through the first straight grooves 120 and 130. For example... Figure 2 As shown, the first plate 100 is placed upright, and the direction G indicated by the arrow is the direction of gravity.

[0055] The second plate 200 has two opposing long sides 201 and 202, and the second plate 200 has a direction along the first direction (i.e., as shown in the figure). Figure 1 Multiple second oblique grooves 210 are spaced apart along the X-axis (as shown). These second oblique grooves 210a are recesses and extend from the side of the second plate 200 adjacent to the long side 201 toward the long side 202 (i.e., along the Y-axis). Figure 2As shown, each second inclined groove 210 has a first end 171 and a second end 172 opposite to each other, with the first end 171 adjacent to the long side 201 and the second end 172 adjacent to the long side 202. The first end 171 of the second inclined groove 210 is higher than its second end 172, so it can be seen that the second inclined groove 210 is inclined in the second plate 200.

[0056] The second plate 200 also has two second straight grooves 220 and 230 extending along a first direction (X-axis). The second straight groove 220 is adjacent to the long side 201, and the second straight groove 230 is adjacent to the long side 202. The first ends 171 of these second oblique grooves 210 are connected to the second straight groove 220, and the second ends 172 of these second oblique grooves 210 are connected to the second straight groove 230. Therefore, these second oblique grooves 210 are interconnected with each other through the second straight grooves 220 and 230.

[0057] The second plate 200 is stacked on the first plate 100 such that the first oblique grooves 110 are parallel to the second oblique grooves 210, and the first oblique grooves 110 and the second oblique grooves 210 are not aligned. In this configuration, the first oblique grooves 110 and the second oblique grooves 210 are staggered. In one embodiment, the first oblique grooves and the second oblique grooves may partially overlap, or the second oblique grooves may be located between two first oblique grooves. Furthermore, in this configuration, the two first vertical grooves 120 and 130 of the first plate 100 are aligned with and connected to the two second vertical grooves 220 and 230 of the second plate 200, respectively. In this way, these first oblique grooves 110 and these second oblique grooves 210 are respectively connected to the two first straight grooves 120 and 130 and the two second straight grooves 220 and 230 through the two first straight grooves 120 and 130, and together they form a fluid channel C (e.g. Figure 3 (As shown). Fluid channel C is used to contain cooling fluid L.

[0058] Page 6 of 28 (Instruction Manual)

[0059] Although the fluid channels C are continuously and uninterruptedly arranged at various locations on the heat sink 10, the entire fluid channel C does not need to be completely filled with cooling fluid L.

[0060] Furthermore, one end of the first straight groove 130 and the second straight groove 230 together form an inlet O. Cooling fluid L can be injected into the fluid channel C through the inlet O. As shown in the figure, the inlet O is aligned with the first straight groove 130 and the second straight groove 230.

[0061] The capillary structure 300 is located in the fluid channel C. The cooling fluid L does not completely fill the entire fluid channel C; only a portion of the fluid channel C is occupied by the cooling fluid L. The capillary structure 300 extends from below the liquid surface S of the cooling fluid L to above the liquid surface S of the cooling fluid L. That is, a portion of the capillary structure 300 is submerged in the cooling fluid L. In this embodiment, the capillary structure 300 is stacked within the second oblique grooves 210 and the two second vertical grooves 220 and 230 of the second plate 200. However, the design of the capillary structure 300 is not intended to limit the invention. In other embodiments, the capillary structure may also be stacked within the second oblique grooves and one of the second vertical grooves of the second plate. For example, such as Figure 4 As shown, Figure 4 This is an exploded view of a heat dissipation device according to an embodiment of the present invention. Figure 4 The capillary structure 300A is stacked within the second oblique grooves 210 and the second straight grooves 230 of the second plate 200. The first oblique groove 110 can be regarded as a vapor channel, while the second oblique groove 210 can be regarded as a liquid channel.

[0062] The number of capillary structures 300 is used to limit the invention. In other embodiments, the number of capillary structures may be two, with one capillary structure superimposed on the first oblique grooves and the two first straight grooves, and the other capillary structure superimposed on the second oblique grooves and the two second straight grooves. Furthermore, in some embodiments, the capillary structures may not be superimposed or laid on all of the second oblique grooves 210 and the two second straight grooves 220, 230 of the second plate 200. For example, the capillary structures may be superimposed or laid on a portion of the second oblique grooves 210 and the two second straight grooves 220, 230 of the second plate 200. In another embodiment, if the second straight groove 220 is adjacent to a heat source, the portions of the second oblique grooves 210 and the second straight grooves 220 located on the liquid surface S of the cooling fluid L may be completely covered with capillary structures, while the second straight groove 230 may not be covered with capillary structures. Similarly, if the second straight groove 230 is adjacent to a heat source, the portions of the second oblique groove 210 and the second straight groove 230 located on the liquid surface S of the cooling fluid L can be completely covered with capillary structures. (Page 7 of 28, Specification)

[0063] The second vertical trench 220 may not have a capillary structure.

[0064] Figure 3 A partial cross-sectional view of the heat sink 10 illustrates the capillary structure 300 located within the fluid channel C defined by the second oblique groove 210 of the second plate 200. (As shown in the image) Figure 3 As shown, the capillary structure 300 is laid in the second oblique groove 210, but does not completely fill (or occupy) the fluid channel C.

[0065] Figure 5 for Figure 1 A side view diagram of the heat dissipation device, heat source, and cooling fluid. (See diagram below.) Figure 5 As shown, the cooling fluid L only fills a portion of the fluid channel C. The heat sink 10 is placed vertically, and it is in thermal contact with a first heat source H1 located below the liquid surface S of the cooling fluid L and a second heat source H2 located above the liquid surface S. When the first heat source H1 generates heat (i.e., during operation), the liquid cooling fluid L absorbs the heat generated by the first heat source H1 and vaporizes, flowing upwards in the opposite direction G to the relatively low-temperature region of the heat sink 10. Because the second heat source H2 also generates heat, the relatively low-temperature region of the heat sink 10 is... Figure 5 The heat sink 10 is located on the right side and adjacent to the second vertical groove 230. The gaseous cooling fluid L then condenses back into a liquid state and flows back along the second vertical groove 230 to the region below the fluid channel C (the relatively high-temperature region of the heat sink 10). The circulation of the cooling fluid within the heat sink 10 is as shown in direction F.

[0066] Because the second heat source H2 generates heat during operation, and the cooling fluid is drawn from the area below the fluid channel C by the capillary structure 300 to a position close to the second heat source H2, the cooling fluid L, after absorbing heat, transforms into a gaseous state and flows along direction D1 towards the relatively low-temperature region of the heat sink 10, away from the second heat source H2. Then, after the gaseous cooling fluid reaches the relatively low-temperature region of the heat sink 10, it condenses back into a liquid state and subsequently flows along direction D2 towards the second heat source H2. In this way, the circulation path of the cooling fluid caused by the operation of the second heat source H2 is smaller than that caused by the operation of the first heat source H1. Furthermore, the heat sink 10 can dissipate heat from heat sources located above or below the surface of the cooling fluid.

[0067] There are two methods for manufacturing the heat sink 10. The first method is to make it with a composite material plate with solder, and the second method is to make it with a non-composite material plate (such as aluminum or a material that cannot be directly welded) without solder. The following describes the manufacturing method of manufacturing the heat sink 10 with a composite material plate with solder.

[0068] First, the two composite plates with solder are stamped once or multiple times to form a first plate 100 having the first oblique grooves 110 and two first straight grooves 120, 130, and a second plate 200 having the second oblique grooves 210 and two second straight grooves 220, 230.

[0069] The shape and size of the inclined grooves 110, 210 and the straight grooves 120, 130, 220, 230 are not limited to any specific shape and size; the shape and size of these grooves can be changed according to design requirements or actual needs. In some embodiments, these inclined grooves and these straight grooves may have different shapes or sizes to create a pressure difference through the difference in size and shape, and to control the flow direction of the vaporized cooling fluid by the pressure difference.

[0070] For example, one or more oblique grooves in the first plate may have different cross-sectional shapes or different cross-sectional dimensions. Similarly, the oblique grooves and straight grooves in the first plate may have different cross-sectional shapes or different cross-sectional dimensions. In other examples, the oblique grooves in the first plate and the oblique grooves in the second plate may have different cross-sectional shapes or different cross-sectional dimensions.

[0071] Next, the powder is placed in the second oblique groove 210 and the second straight grooves 220 and 230 of the second plate 200. The powder will be sintered in subsequent steps, forming a capillary structure 300 in the second oblique groove 210 and the second straight grooves 220 and 230 of the second plate 200.

[0072] Next, flux is applied to the unfilled soldering surfaces of the second plate 200. The flux primarily serves to clean the surface of the second plate 200 to improve the soldering quality between the first plate 100 and the second plate 200. However, in other embodiments, the flux application step may be omitted.

[0073] Next, the first plate 100 and the second plate 200 are joined (e.g., the first plate 100 and the second plate 200 are overlapped), and the first plate 100 and the second plate 200 are aligned using a jig before welding. The jig can resist the stress generated during the heating and welding process, thereby reducing the deformation of the first plate 100 and the second plate 200. The jig can be made of a material that does not react with the solder, such as graphite.

[0074] During the welding of the first plate 100 and the second plate 200, the sintering of the powder is carried out simultaneously. Specifically, when the first plate 100 and the second plate 200 are heated, the solder melts to weld the first plate 100 and the second plate 200, and the heating action also sintersulates the powder to form a capillary structure 300.

[0075] Next, the gas in the fluid channel C is removed through the injection port O, and the cooling fluid L is injected through the injection port O. In one embodiment, a filling degassing tube may be welded to the injection port to facilitate gas removal and cooling fluid injection.

[0076] Next, the manufacturing method of heat sink 10 is described below using a non-composite material without solder (solder is, for example, an additional coating).

[0077] One or more stampings are performed on two non-composite plates without solder to form a first plate 100 having the first oblique grooves 110 and two first straight grooves 120, 130, and a second plate 200 having the second oblique grooves 210 and two second straight grooves 220, 230.

[0078] The shape and size of the oblique grooves 110, 210 and the straight grooves 120, 130, 220, 230 are not limited to any specific shape and size; the shape and size of these grooves can be changed according to design requirements or actual needs. In some embodiments, these oblique grooves and these straight grooves may have different shapes or sizes to create a pressure difference through the difference in size and shape, and to control the flow direction of the vaporized cooling fluid by the pressure difference.

[0079] For example, one or more oblique grooves in the first plate may have different cross-sectional shapes or different cross-sectional dimensions. Similarly, the oblique grooves and straight grooves in the first plate may have different cross-sectional shapes or different cross-sectional dimensions. In other examples, the oblique grooves in the first plate and the oblique grooves in the second plate may have different cross-sectional shapes or different cross-sectional dimensions.

[0080] Next, powder is disposed in the second oblique groove 210 and the second straight grooves 220 and 230 of the second plate 200, and then the powder is sintered to form a capillary structure 300 in the second oblique groove 210 and the second straight grooves 220 and 230 of the second plate 200. As described above, in one embodiment, the powder forming the capillary structure may be disposed in only one of the second oblique groove and the second straight groove of the second plate.

[0081] Next, solder is applied to the unfilled soldering surface of the second plate 200.

[0082] Next, flux is applied to the areas of the second plate 200 to be soldered. The flux is mainly used to clean the surface of the first plate 100 or the second plate 200 to improve the soldering quality between the first plate 100 and the second plate 200.

[0083] Next, the first plate 100 and the second plate 200 are joined (e.g., the first plate 100 and the second plate 200 are overlapped), and the first plate 100 and the second plate 200 are aligned using a jig before welding. The jig can resist the stress generated during the heating and welding process, thereby reducing the deformation of the first plate 100 and the second plate 200. The jig can be made of a material that does not react with the solder, such as graphite.

[0084] Next, the first plate 100 and the second plate 200 are welded together. Then, the gas in the fluid channel C is evacuated through the injection port O, and the cooling fluid L is injected through the injection port O. In one embodiment, a filling degassing pipe may be welded to the injection port to facilitate the gas evacuation and cooling fluid injection operations.

[0085] The above-described method of forming capillary structure 300 is not intended to limit the present invention. In other embodiments, the powder that can form capillary structure may be pre-formed into capillary structure, and then the capillary structure may be inserted into the second oblique groove and the second straight groove of the second plate to facilitate the setting of capillary structure between the first plate and the second plate.

[0086] exist Figure 1 In some embodiments, the first oblique grooves 110 and the second oblique grooves 210 are arranged parallel to each other and staggered, but this is not a limitation. In other embodiments, the first oblique grooves and the second oblique grooves may intersect each other. Furthermore, the number of first straight grooves 120 and 130 and the number of second straight grooves 220 and 230 are not limited to two. In other embodiments, the number of first straight grooves and the number of second straight grooves may each be only one. For example, Figure 6 This is a perspective view of a heat dissipation device according to an embodiment of the present invention. Figure 7 for Figure 6 A schematic diagram of its breakdown. Figure 8 for Figure 6 A partial cross-sectional schematic diagram.

[0087] This embodiment discloses a heat sink 10a, which includes a first plate 100a, a second plate 200a, and a capillary structure 300a. The first plate 100a and the second plate 200a are disposed opposite to each other, and the capillary structure 300a is disposed on the first plate 100a and the second plate 200a. (Page 11 of 28, specification)

[0088] Plate size between 200a.

[0089] The first plate 100a has two opposing long sides 101a and 102a, and the first plate 100a has a plurality of first oblique grooves 110a spaced apart along a first direction. The first direction is, for example, the direction of the major axis of the first plate 100a (i.e., as shown in the image). Figure 6 (As shown along the X-axis). These first oblique grooves 110a are recesses and extend from one side of the first plate 100a adjacent to the long side 101a toward the long side 102a (i.e., along the Y-axis). Figure 7As shown, each first oblique groove 110a has a first end 151a and a second end 152a, with the first end 151a adjacent to the long side 101a and the second end 152a adjacent to the long side 102a. The first end 151a of the first oblique groove 110a is lower than its second end 152a, thus it can be seen that the first oblique groove 110a is inclined in the first plate 100a. It can be understood that these first oblique grooves 110a are inclined relative to the upper edge (or lower edge) of the first plate 100a; or the first oblique groove 110a is inclined relative to the long side 101a (or 102a) of the first plate 100a.

[0090] The first plate 100a also has a first vertical groove 130a extending along a first direction, such as the X-axis. The first vertical groove 130a is adjacent to the long side 102a. The second ends 152a of these first oblique grooves 110a are connected to the first vertical groove 130a. Therefore, these first oblique grooves 110a are interconnected with each other through the first vertical groove 130a. Figure 6 As shown, the first plate 100a is placed upright, and the direction G indicated by the arrow is the direction of gravity.

[0091] The second plate 200a has two opposing long sides 201a and 202a, and the second plate 200a has a direction along the first direction (i.e., as shown in the figure). Figure 6 Multiple second oblique grooves 210a are arranged at intervals along the X-axis (as shown). These second oblique grooves 210a are grooves (or concave surfaces) and extend from the side of the second plate 200a adjacent to the long side 201a toward the long side 202a (i.e., along the Y-axis). Figure 7 As shown, each second inclined groove 210a has a first end 171a and a second end 172a, with the first end 171a adjacent to the long side 201a and the second end 172a adjacent to the long side 202a. The first end 171a of the second inclined groove 210a is higher than its second end 172a, therefore it can be seen that the second inclined groove 210a is inclined in the second plate 200a. Figure 7 As shown, it can be understood that the first oblique groove 110a and the second oblique groove 210a are obliquely directed in two opposite directions. Furthermore, these second oblique grooves 210a are inclined relative to the upper (or lower) edge of the second plate 200a. (Page 12 of 28, Specification)

[0092] It is set at an angle; or the first oblique groove 110a is set at an angle relative to the long side 101a (or 102a) of the first plate 100a.

[0093] The second plate 200a also has a second straight groove 220a extending along a first direction (X-axis). The second straight groove 220a is adjacent to the long side 201a. The first ends 171a of these second oblique grooves 210a are connected to the second straight groove 220a. Therefore, these second oblique grooves 210a are interconnected with each other through the second straight groove 220a.

[0094] like Figure 6 As shown, the second plate 200a is stacked on the first plate 100a, such that portions of the first oblique grooves 110a intersect portions of the second oblique grooves 210a, thereby indirectly connecting the first oblique grooves 110a through the second oblique grooves 210a and the first straight groove 130a. These first oblique grooves 110a, the second oblique grooves 210a, the first straight groove 130a, and the second straight groove 220a together constitute a fluid channel C. The fluid channel C is used to contain the cooling fluid L. Although the fluid channel C is continuously and uninterruptedly arranged throughout the heat sink 10, the entire fluid channel C does not need to be completely filled with the cooling fluid L.

[0095] like Figure 6 As shown, the first straight groove 130a and the second straight groove 220a are located on opposite sides of these first oblique grooves 110a, but are not limited thereto. In other embodiments, the first straight groove and the second straight groove may be located on the same side of these first oblique grooves and aligned with each other. Under such a configuration, these first oblique grooves and these second oblique grooves may be arranged in parallel and staggered order, similar to... Figure 5 The first oblique groove 110 and the second oblique groove 210.

[0096] One end of the uppermost first oblique groove 110a and one end of the uppermost second oblique groove 210a together form an injection port O, through which cooling fluid L can be injected into the fluid channel C.

[0097] The capillary structure 300a is located in the fluid channel C. The cooling fluid L does not completely fill the entire fluid channel C; only a portion of the fluid channel C is occupied by the cooling fluid L. The capillary structure 300a extends from below the liquid surface S of the cooling fluid L to above the liquid surface S of the cooling fluid L. That is, a portion of the capillary structure 300a is submerged in the cooling fluid L. As shown in the figure, the capillary structure 300a is located in the second oblique grooves 210a and the second vertical grooves of the second plate 200a. (Page 13 of 28, specification)

[0098] 220a.

[0099] However, the location of the capillary structure 300a is not intended to limit the invention. In other embodiments, the capillary structure may also be stacked on the first plate. Furthermore, there may be two capillary structures, with one capillary structure stacked on the first oblique grooves and the first straight groove, and the other capillary structure stacked on the second oblique grooves and the second straight groove.

[0100] Furthermore, the capillary structure 300a may not be entirely superimposed or laid on the second oblique groove 210a and the second vertical groove 220a of the second plate 200a. In other embodiments, the capillary structure may also be superimposed or laid only on a portion of the second oblique groove and the second vertical groove of the second plate.

[0101] Figure 8 A partial cross-sectional view of the heat sink 10a shows a capillary structure 300a located within the fluid channel C defined by the first oblique groove 110a and the second oblique groove 210a. As shown, the capillary structure 300a is laid in the second oblique groove 210a, but does not completely fill (or occupy) the fluid channel C.

[0102] Figure 9 for Figure 6 A side view diagram of the heat dissipation device, heat source, and cooling fluid. (See diagram below.) Figure 9 As shown, the cooling fluid L only fills a portion of the fluid channel C. The heat sink 10a is placed vertically, and it is in thermal contact with a first heat source H1 located below the liquid surface S of the cooling fluid L and a second heat source H2 located above the liquid surface S. When the first heat source H1 generates heat (i.e., during operation), the liquid cooling fluid L absorbs the heat generated by the first heat source H1 and vaporizes, flowing upwards in a direction opposite to direction G to a relatively low-temperature region of the heat sink 10a. Then, the gaseous cooling fluid L condenses back into a liquid state and flows back to the region below the fluid channel C (the relatively high-temperature region of the heat sink 10a). The circulation of the cooling fluid within the heat sink 10a is as shown in direction F.

[0103] Because the second heat source H2 generates heat during operation, and the cooling fluid is drawn from the area below the fluid channel C by the capillary structure 300a to a position close to the second heat source H2, the cooling fluid L, after absorbing heat, transforms into a gaseous state and flows along direction D1 towards the relatively low-temperature region of the heat sink 10a, away from the second heat source H2. Then, after the gaseous cooling fluid reaches the relatively low-temperature region of the heat sink 10a, it condenses back into a liquid state and subsequently flows along direction D2 towards the second heat source H2. In this way, the circulation path of the cooling fluid caused by the operation of the first heat source H1 is smaller than that caused by the operation of the second heat source H2. Furthermore, the heat sink 10a can dissipate heat from heat sources located above or below the surface of the cooling fluid.

[0104] Since the manufacturing method of the heat sink 10a in this embodiment is similar to that of the heat sink 10, it will not be described again.

[0105] Figure 10 This is a perspective view of a heat dissipation device according to an embodiment of the present invention. Figure 11 for Figure 10 A schematic diagram of its breakdown. Figure 12 for Figure 10 A partial cross-sectional schematic diagram.

[0106] This embodiment discloses a heat sink 10b, which includes a first plate 100b, a second plate 200b, and a plurality of capillary structures 300b. The first plate 100b and the second plate 200b are disposed opposite to each other, and the capillary structures 300b are disposed between the first plate 100b and the second plate 200b.

[0107] The first plate 100b has two opposing long sides 101b and 102b, and the first plate 100b has a plurality of first oblique grooves 110b spaced apart along a first direction. The first direction is, for example, the direction of the major axis of the first plate 100b (i.e., as shown in the image). Figure 10 (As shown along the X-axis). These first oblique grooves 110b are recesses (or concave surfaces) and extend from the side of the first plate 100b adjacent to the long side 101b toward the long side 102b (i.e., along the Y-axis). Figure 11 As shown, each first oblique groove 110b has a first end 151b and a second end 152b opposite to each other, with the first end 151b adjacent to the long side 101b and the second end 152b adjacent to the long side 102b. The first end 151b of the first oblique groove 110b is lower than its second end 152b, thus it can be seen that the first oblique groove 110b is inclined in the first plate 100b. It can be understood that these first oblique grooves 110b are inclined relative to the upper edge (or lower edge) of the first plate 100b, or that these first oblique grooves 110b are inclined relative to the long side 101b (or 102b) of the first plate 100b. Figure 10 As shown, the first plate 100a is placed upright, and the direction G indicated by the arrow is the direction of gravity.

[0108] The second plate 200b has two opposing long sides 201b and 202b, and the second plate 200b has a direction along the first direction (i.e., as shown in the figure). Figure 10 The X-axis (as shown) is arranged at intervals. (Page 15 of 28, instruction manual)

[0109] A second oblique groove 210b. These second oblique grooves 210b are recesses and extend from one side of the second plate 200b adjacent to the long side 201b toward the long side 202b (i.e., along the Y-axis). Figure 11As shown, each second oblique groove 210b has an opposing first end 171b and a second end 172b, with the first end 171b adjacent to the long side 201b and the second end 172b adjacent to the long side 202b. The first end 171b of the second oblique groove 210b is higher than its second end 172b, thus it can be seen that the second oblique groove 210b is inclined in the second plate 200b. It is understood that these second oblique grooves 210b are inclined relative to the upper edge (or lower edge) of the second plate 200a, or that these second oblique grooves 210b are inclined relative to the long side 201b (or 202b) of the second plate 200a. Figure 11 As shown, the first oblique groove 110b and the second oblique groove 210b are obliquely directed in two opposite directions.

[0110] like Figure 10 As shown, the second plate 200b is stacked on top of the first plate 100b, such that portions of the first oblique grooves 110b intersect portions of the second oblique grooves 210b, thereby indirectly connecting the first oblique grooves 110b through the second oblique grooves 210b. These first oblique grooves 110b and second oblique grooves 210b together form a fluid channel C. The fluid channel C is used to contain the cooling fluid L. Although the fluid channel C is continuous within the heat sink 10, the entire fluid channel C may not be completely filled with the cooling fluid L.

[0111] One end of the uppermost first oblique groove 110b and one end of the uppermost second oblique groove 210b together form an injection port O, which is used to inject cooling fluid L into the fluid channel C.

[0112] These capillary structures 300b are located in the fluid channel C. The cooling fluid L does not completely fill the entire fluid channel C; only a portion of the fluid channel C is occupied by the cooling fluid L. These capillary structures 300b extend from below the liquid surface S of the cooling fluid L to above the liquid surface S of the cooling fluid L. That is, a portion of these capillary structures 300b is submerged in the cooling fluid L. In this embodiment, these capillary structures 300b are located in the second oblique grooves 210b of the second plate 200b. However, the location of the capillary structures 300b is not intended to limit the invention. In other embodiments, these capillary structures may also be superimposed on the first oblique groove of the first plate, or superimposed on the first oblique groove of the first plate and the second oblique groove of the second plate.

[0113] Furthermore, in other embodiments, the capillary structure may not be superimposed or laid on the entire second oblique groove of the second plate. For example, the capillary structure may also be superimposed or laid only on a portion of the second oblique groove of the second plate.

[0114] Figure 12A partial cross-sectional view of the heat sink 10b shows a capillary structure 300b located in the fluid channel C defined by the first oblique groove 110b and the second oblique groove 210b. As shown, the capillary structure 300b is laid in the second oblique groove 210b, but does not completely fill (or occupy) the fluid channel C.

[0115] Figure 13 for Figure 10 A side view diagram of the heat dissipation device, heat source, and cooling fluid. (See diagram below.) Figure 13 As shown, cooling fluid L fills fluid channel C. The heat sink 10b is placed vertically and is in thermal contact with a first heat source H1 located below the liquid surface S of the cooling fluid L and a second heat source H2 located above the liquid surface S. When the first heat source H1 generates heat (i.e., during operation), the liquid cooling fluid L absorbs the heat generated by the first heat source H1 and vaporizes, flowing upwards in a direction opposite to direction G to a relatively low-temperature region of the heat sink 10b. Then, the gaseous cooling fluid L condenses back into a liquid state and flows back to the region below fluid channel C (the relatively high-temperature region of the heat sink 10b). The circulation of the cooling fluid within the heat sink 10b is as shown in direction F.

[0116] Because the second heat source H2 generates heat during operation, and the cooling fluid is drawn from the area below the fluid channel C by the capillary structure 300b to a position close to the second heat source H2, the cooling fluid L, after absorbing heat, transforms into a gaseous state and flows along direction D1 towards the relatively low-temperature region of the heat sink 10b, away from the second heat source H2. Then, after the gaseous cooling fluid reaches the relatively low-temperature region of the heat sink 10b, it condenses back into a liquid state and subsequently flows along direction D2 towards the second heat source H2. In this way, the circulation path of the cooling fluid caused by the operation of the first heat source H1 is smaller than that caused by the operation of the second heat source H2. Furthermore, the heat sink 10b can dissipate heat from heat sources located above or below the surface of the cooling fluid.

[0117] Since the manufacturing method of the heat sink 10b in this embodiment is similar to that of the heat sink 10, it will not be described again.

[0118] In the above embodiments, both the first plate and the second plate have oblique grooves, but this is not a limitation. For example, in other embodiments, only the first plate or the second plate may have oblique grooves.

[0119] According to the heat sink of the above embodiment, a capillary structure is provided within the fluid channel, allowing the cooling fluid to flow against gravity through the capillary structure to the side of the fluid channel adjacent to the heat source located above the liquid surface. Therefore, the heat sink of the above embodiment can dissipate heat from heat sources located above or below the surface of the cooling fluid.

[0120] Figure 14 This is a perspective view of a heat dissipation device according to an embodiment of the present invention. Figure 15 for Figure 14 A front view of the heat dissipation device. Figure 16 for Figure 15 The diagram shows a partial cross-sectional view of the heat dissipation device along section line 16-16. It should be understood that although the heat dissipation device of the example embodiment described below is exemplified by a rolling process, it is not intended to be limiting. The heat dissipation device can be manufactured in other ways without departing from the spirit and scope of the invention.

[0121] This embodiment discloses a heat dissipation device 140a, which is described using a rolled processing method as an example. The heat dissipation device 140a is used to dissipate heat generated by a heat source (not shown) that it is in thermal contact with. The heat source may be, for example, but is not limited to, a central processing unit (CPU) or electronic circuitry. Figure 16 As shown, the heat dissipation device 140a includes a heat-conducting plate 1400a and a capillary structure 1610a attached within the heat-conducting plate 1400a. The heat-conducting plate 1400a has a flow channel 1405a and an inlet 1406a communicating with the flow channel 1405a. The flow channel 1405a is used to store a cooling fluid (not shown). The cooling fluid is, for example but not limited to, water or refrigerant, and the amount of cooling fluid is 30% to 70% of the total volume of the flow channel 1405a. However, in other embodiments, the amount of cooling fluid can be adjusted to more or less as needed. The cooling fluid can be filled into the flow channel 1405a through the inlet 1406a.

[0122] The heat-conducting plate 1400a includes a first plate 1410a and a second plate 1420a that are sealed together. The first plate 1410a has a first groove (or concave surface) 1411a and a first surface 1412a forming the first groove 1411a. The second plate 1420a has a second surface 1422a that is planar. When the first plate 1410a and the second plate 1420a are joined, the second surface 1422a faces the first surface 1412a. As shown, in this configuration, the first groove 1411a is located between the first surface 1412a and the second surface 1422a.

[0123] Page 18 of 28 (Instruction Manual)

[0124] Furthermore, the first surface 1412a and the second surface 1422a together constitute the flow channel 1405a.

[0125] like Figure 15As shown, the heat dissipation device 140a has a refrigerant zone A1, a cooling zone A2, and a heating zone A3. The refrigerant zone A1 is located below the heating zone A3, and the cooling zone A2 is located between the refrigerant zone A1 and the heating zone A3. When the heat dissipation device 140a is used to dissipate heat from a heat source, the heating zone A3, cooling zone A2, and refrigerant zone A1 are arranged along the direction of gravity G, with the refrigerant zone A1 located at the bottom of the heat dissipation device 140a. The direction of gravity G refers to the direction in which an object falls under the influence of gravity. The refrigerant zone A1 of the heat dissipation device 140a is used to store the cooling fluid. The cooling zone A2 of the heat dissipation device 140a is used to release the heat of the cooling fluid to the outside, allowing the gaseous cooling fluid to condense back into a liquid cooling fluid. The heating zone A3 of the heat dissipation device 140a is used to come into thermal contact with the heat source to absorb the heat energy transferred from the heat source.

[0126] The capillary structure 1610a is located within the flow channel 1405a and superimposed on the entire first surface 1412a, and the capillary structure 1610a extends from the refrigerant region A1 to the heating region A3.

[0127] When the cooling fluid in the heating zone A3 of the heat dissipation device 140a absorbs heat energy from the heat source, it evaporates from a liquid state to a gaseous state. Then, under pressure, the gaseous cooling fluid flows from the upper heating zone A3 to the lower cooling zone A2. Next, after being cooled in the cooling zone A2, the gaseous coolant re-condenses into a liquid state. Then, a portion of the liquid cooling fluid is guided by the capillary structure 1610a and flows back to the heating zone A3 along the anti-gravity direction H, while the other portion flows to the refrigerant zone A1. In this way, the cooling fluid forms a cooling cycle within the flow channel 1405a to dissipate heat from the heat source.

[0128] In other embodiments, capillary structures may also be provided on the second surface of the second plate. Figure 17 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 17 As shown, in addition to the capillary structure 1610a being stacked on all the first surfaces 1412a of the first plate 1410a, the capillary structure 1610b is also stacked on all the second surfaces 1422a of the second plate 1420a. However, the second surfaces 1422a of the second plate 1420a are not limited to being stacked with capillary structures on all of them. In other embodiments, the capillary structure may be stacked on only a portion of the second surface.

[0129] It should be understood that the number of capillary structures is not intended to limit the invention. Figure 18 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 18As shown, the heat dissipation device 140a includes two capillary structures 1610c and 1620c. The two capillary structures 1610c and 1620c are spaced apart and located in the first groove 1411a and disposed at opposite ends of the first surface 1412a.

[0130] Figure 19 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 19 As shown, the heat dissipation device 140a includes a single capillary structure 1610d. The capillary structure 1610d is located within a first groove 1411a and disposed on a first surface 1412a, and the capillary structure 1610d does not contact the opposite side edges 1421d of the first groove 1411a. In this embodiment or other embodiments, the capillary structure 1610d may be located in the central region of the first groove 1411a and on the first surface 1412a.

[0131] Figure 20 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 20 As shown, the heat dissipation device 140a includes a plurality of capillary structures located within the first groove 1411a and on the first surface 1412a. Specifically, the heat dissipation device 140a includes four capillary structures 1610e, 1620e, 1630e, and 1640e located within the first groove 1411a and on the first surface 1412a. The capillary structures 1610e, 1620e, 1630e, and 1640e are spaced apart. Two capillary structures 1610e and 1620e are located at opposite ends of the first surface 1412a. Two capillary structures 1630e and 1640e are located between the two capillary structures 1610e and 1620e.

[0132] In other embodiments, the second surface 1422a of the heat dissipation device 140a may be non-planar. Figure 21 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 21 As shown, the second plate 1420a may have a second groove (concave surface) 1421f, and the second surface 1422a forms this second groove 1421f. The second groove 1421f is aligned with the first groove 1411a, and the two ends of the first groove 1411a are respectively connected to the two ends of the second groove 1421f. The first surface 1412a in the first groove 1411a and the second surface 1422a in the second groove 1421f together define the flow channel 1405a of the heat dissipation device 140a. The capillary structure 1610a is located in the flow channel 1405a and is disposed on all the first surfaces 1412a in the first groove 1411a. However, the first surfaces 1412a in the first groove 1411a are not limited to being completely disposed on the capillary structure. (Page 20 of 28, specification)

[0133] 1610a. In other embodiments, the capillary structure may be configured on a localized first surface.

[0134] Figure 22 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Compared to Figure 21 Implementation examples, Figure 22 In this embodiment, in addition to all of the first surface 1412a being provided with capillary structures 1610a, all of the second surface 1422a is also provided with capillary structures 1610b. However, the present invention is not limited thereto; in other embodiments, the two capillary structures may be provided only in portions of the first surface 1412a and portions of the second surface 1422a, respectively.

[0135] Figure 23 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Compared to Figure 22 Implementation examples, Figure 23 In one embodiment, the flow channel 1405a contains two capillary structures 1610h and 1620h. The two capillary structures 1610h and 1620h are spaced apart from each other and are disposed at opposite ends of the first surface 1412a. However, in other embodiments, the two capillary structures may be disposed at opposite ends of the second surface. Alternatively, capillary structures may be disposed at opposite ends of both the first surface and opposite ends of the second surface.

[0136] Figure 24 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 24 As shown, the heat dissipation device 140a includes a single capillary structure 1610d. The capillary structure 1610d is located on the first surface 1412a of the first groove 1411a, and the capillary structure 1610d does not contact the two side edges 1421d of the first groove 1411a. In this embodiment or other embodiments, the capillary structure 1610d may be disposed at the center of the first surface 1412a of the first groove 1411a. However, in other embodiments, the capillary structure may be disposed on the second surface of the second groove. Alternatively, both the first and second surfaces may be provided with capillary structures.

[0137] Figure 25 This is a partial cross-sectional schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 25As shown, the heat dissipation device 140a includes capillary structures 1610e, 1620e, 1630e, and 1640e. The capillary structures 1610e, 1620e, 1630e, and 1640e are located on the first surface 1412a within the first groove 1411a and are spaced apart from each other. Capillary structures 1610e and 1620e are located at opposite ends of the first surface 1412a. Capillary structures 1630e and 1640e are located between capillary structures 1610e and 1620e. However, in other embodiments, four capillary structures may be disposed on the second surface within the second groove 1421a, or four capillary structures may be disposed on both the first and second surfaces. Alternatively, multiple (e.g., two or more) capillary structures may be disposed on both the first and second surfaces.

[0138] The capillary structures 1610a, 1610b, 1610c, 1620c, 1610d, 1610e, 1620e, 1630e, 1640e, 1610h, and 1620h can be made of metals, such as aluminum, copper, nickel, and titanium. Alternatively, the capillary structures 1610a, 1610b, 1610c, 1620c, 1610d, 1610e, 1620e, 1630e, 1640e, 1610h, and 1620h can be made of non-metals, such as carbon nanotubes, graphite, glass fiber, and polymers. The capillary structures 1610a, 1610b, 1610c, 1620c, 1610d, 1610e, 1620e, 1630e, 1640e, 1610h, and 1620h may have vents, grooves, planar or three-dimensional woven meshes (or tube bundles) or combinations thereof (e.g., a combination of vents and grooves or planar or three-dimensional woven meshes; or a combination of grooves and planar or three-dimensional woven meshes; or a combination of planar and three-dimensional woven meshes).

[0139] The capillary structures 1610a, 1610b, 1610c, 1620c, 1610d, 1610e, 1620e, 1630e, 1640e, 1610h, and 1620h can be formed in the heat dissipation device by (1) filling powder into the flow channel 1405a and sintering the powder, or (2) inserting the formed capillary structure into the flow channel, or (3) placing the formed capillary structure into the graphite printing tubes in the upper and lower metal plates (such as the first plate 1410a and the second plate 1420a). Simply put, in terms of graphite printing, the pattern of the capillary structure is pre-printed on the surface of the two plates before rolling the plates, which can prevent the two plates from completely bonding together.

[0140] The capillary structures 1610a, 1610b, 1610c, 1620c, 1610d, 1610e, 1620e, 1630e, 1640e, 1610h, and 1620h can also be formed in the heat dissipation device by directly replacing the material of the graphite printed tube with a capillary structure made of carbon tube or polymer, stamping it, and sandblasting or etching the surfaces of the upper and lower metal plates.

[0141] Figure 26 This is a three-dimensional cross-sectional view of a heat dissipation device according to an embodiment of the present invention. Figure 27 , 28 29 is Figure 26 A three-dimensional cross-sectional diagram of the process of inserting capillary structures.

[0142] The heat dissipation device 140k includes a heat-conducting plate 1400k. The bottom plate of the heat-conducting plate 1400k has multiple oblique flow channels 1405k, and the top plate of the heat-conducting plate 1400k also has multiple... (Page 22 of 28, instruction manual)

[0143] The inclined flow channels 1403k and 1045k and 1403k are grooves (or concave surfaces). The inclined flow channels 1405k and 1403k are inclined in opposite directions. Both the inclined flow channels 1405k and 1403k are straight (i.e., without any bends). It is understood that the inclined flow channels 1405k and 1403k are inclined relative to the upper (or lower) edge of the heat-conducting plate 1400k. Each inclined flow channel 1405k contains a capillary structure 1610k.

[0144] The heat dissipation device 140k is similar to the heat dissipation device 140a, and may include two combined plates (such as plates 1410a and 1420a). The process of placing the capillary structure 1610k into the heat dissipation device 140k can be broadly divided into two types. The first type involves placing the capillary structure 1610k into the heat dissipation device 140k before rolling the top and bottom plates. The second type involves placing the capillary structure 1610k into the inclined flow channel 1405k after rolling the top and bottom plates of the heat dissipation device 140k.

[0145] First, let's describe the first method. For example, a metal braided mesh is first placed on at least one facing surface of the two plates constituting the heat-conducting plate 1400k. Next, for example, two sets of oblique flow channels 1403k and 1405k are formed on the top and bottom plates of the heat dissipation device 140k by stamping or blowing. In this way, the metal braided mesh is placed in at least one set of the oblique flow channels 1403k and 1405k. For ease of explanation, the first method is specifically described below using the example of the metal braided mesh placed in the oblique flow channel 1405k. First, the metal braided mesh is formed into a capillary structure of the heat dissipation device 140k. In this embodiment or other embodiments, the metal braided mesh is welded to the surface of the plate to form the capillary structure of the heat dissipation device 140k. Alternatively, the surface of the plate is chemically etched to create multiple micropores or microstructures to form a capillary structure. Even more importantly, the surface of the plate is sandblasted to form a capillary structure.

[0146] Next, the two plates forming the heat-conducting plate 1400k are stacked, and the edges of the two plates are sealed, for example, by rolling. Then, a blow-blowing process is performed to form the oblique flow channel 1405k. Simply put, during the blow-blowing process, recesses are first formed at predetermined positions on the surfaces of the top and bottom plates. After the two plates are sealed, air is injected through the inlet 1406a, and the pressure of this air blows out the oblique flow channel 1405k along the path defined by the recesses. Next, the heat dissipation device 140k is degassed through the inlet 1406a, and then... (Page 23 of 28, Instruction Manual)

[0147] Weld and seal the injection port 1406a.

[0148] Next, let's explain the second method. First, as follows: Figure 26 As shown, first cut the heat-conducting plate body at 1400k along the cutting line B to allow the heat to pass through the opening at 1407k (as shown). Figure 27 As shown, the oblique flow channels 1403k and 1405k are exposed. Next, the capillary structure 1610k is inserted into the oblique flow channel 1405k through the opening 1407k along direction D. Figure 28 The diagram illustrates capillary structure 1610k inserted into these inclined channels 1405k. Since liquid can flow through the capillary structure in the inclined channels 1405k, these channels are considered liquid channels. Furthermore, since the gas vaporized by the heat absorbed from the heat source flows within the inclined channels 1403k, these channels can be considered vapor channels. Next, as... Figure 29 As shown, a rolling process is performed to flatten the tear 1407k and form a rolling structure 1450k to seal the tear 1407k. Next, the rolling structure is welded to seal the heat dissipation device 140k.

[0149] The capillary structure 1610k can be inserted into the inclined flow channel 1405k through the opening 1407k in three ways. The first method involves inserting braided copper wire, a rolled metal mesh, or copper cloth into the inclined flow channel 1405k through the opening 1407k. The second method involves pre-sintering copper powder into columnar capillary structures 1610k, and then inserting them into the inclined flow channel 1405k through the opening 1407k. The third method involves inserting a jig (such as a rod) into the inclined flow channel 1405k, and then filling the inclined flow channel 1405k with copper powder. Next, a vibrating disc is used to evenly distribute the copper powder within the inclined flow channel 1405k. Finally, the copper powder is sintered to form the capillary structure 1610k.

[0150] Figure 30 This is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention. In some embodiments, the method may include at least one of the steps shown in method 3000, and these steps may be performed in any order. For example, the method may include one or more steps of method 3000, and these steps may be performed in parallel, simultaneously, or overlapping time.

[0151] Step 3002 includes stamping a composite plate with solder on its surface to form a first plate having a plurality of oblique grooves. Step 3004 includes disposing powder in the oblique grooves of the first plate. Step 3006 includes stacking and fixing the first plate and a second plate. Step 3008 includes welding the first plate and the second plate and sintering the powder located in the oblique grooves of the first plate into a capillary structure.

[0152] Figure 31 This is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention. In some embodiments, the method may include at least one of the steps shown in method 3100, and these steps may be performed in any order. For example, the method may include one or more steps in method 3100, and these steps may be performed in parallel, simultaneously, or overlapping time.

[0153] Step 3102 includes stamping a non-composite sheet without solder to form a first plate having multiple oblique grooves. Step 3104 includes disposing powder in the oblique grooves of the first plate. Step 3106 includes sintering the powder disposed in the oblique grooves of the first plate into a capillary structure. Step 3108 includes stacking and fixing the first plate and the second plate. Step 3110 includes welding the first plate and the second plate.

[0154] Figure 32This is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention. In some embodiments, the method may include at least one of the steps shown in method 3200, and these steps may be performed in any order. For example, the method may include one or more steps in method 3200, and these steps may be performed in parallel, simultaneously, or overlapping time.

[0155] Step 3202 includes setting a plurality of capillary structures on a first plate and a second plate. Step 3204 includes a preparatory operation (e.g., cleaning, alignment, etching, or sandblasting) for rolling bonding the first plate and the second plate. Step 3206 includes rolling bonding the first plate and the second plate to form a heat dissipation device. Step 3208 includes inflating the heat dissipation device to form at least one oblique groove within the heat dissipation device.

[0156] Figure 33 This is a flowchart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention. In some embodiments, the method may include at least one of the steps shown in method 3300, and these steps may be performed in any order. For example, the method may include one or more steps in method 3300, and these steps may be performed in parallel, simultaneously, or overlapping time.

[0157] Step 3302 includes rolling a first plate and a second plate together to form a heat dissipation device. Step 3304 includes inflating the heat dissipation device to dissipate heat. (Page 25 of 28, Specification)

[0158] At least one oblique groove is formed within the heat dissipation device. Step 3306 includes cutting the heat dissipation device body to form at least one opening in the at least one oblique groove. Step 3308 includes inserting a capillary structure into the oblique groove through the opening. Step 3310 includes sealing the opening by rolling.

[0159] According to the heat dissipation device of the above embodiments, by adding capillary structures or the like into the flow channel, the cooling fluid can be helped to flow in the anti-gravity direction, so that the cooling fluid in the cooling zone located below the heating zone can flow back to the heating zone and circulate in the heat dissipation device, thus improving the heat dissipation effect of the heat dissipation device. Compared with existing heat dissipation devices, the heat dissipation devices of these embodiments of the present invention can improve the heat dissipation efficiency by about 30%.

[0160] The foregoing outlines several embodiments or examples, enabling those skilled in the art to better understand the content of this invention. Those skilled in the art should understand that they can readily design or modify processes and structures based on this invention to achieve the same objectives and / or realize the same advantages of the embodiments or examples described herein.

[0161] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the patent claims appended to this specification.

[0162] [Icon Symbol Explanation]

[0163] 10 heat dissipation devices

[0164] 10, 10a, 10b heat sinks

[0165] 100, 100a, 100b First Plate

[0166] The long sides of 101, 102, 101a, 102a, 101b, and 102b

[0167] 110, 110a, 110b First oblique trench

[0168] 151, 171, 151a, 171a, 151b, 171b First end

[0169] 152, 172, 152a, 172a, 152b, 172b second end

[0170] 120, 130, 130a First straight trench

[0171] 200, 200a, 200b Second Plate

[0172] The long sides of 201, 202, 201a, 202a, 201b, and 202b

[0173] 210, 210a, 210b Second oblique trenches

[0174] 220, 230, 220a Second Vertical Trench

[0175] 300, 300A, 300a, 300b capillary structure

[0176] C fluid channel

[0177] O Injection Port

[0178] L Cooling fluid

[0179] S liquid level

[0180] H1 primary heat source

[0181] H2 secondary heat source

[0182] G, F, D1, D2, H directions

[0183] 140a, 140k heat dissipation devices

[0184] 1400a, 1400k heat-conducting plate

[0185] 1405a flow channel

[0186] 1406a injection port

[0187] 1610a, 1610b, 1610c, 1620c, 1610d, 1610e capillary structures

[0188] 1620e, 1630e, 1640e, 1610h, 1620h, 1610k capillary structure

[0189] 1410a First Plate

[0190] 1411a First Groove

[0191] 1412a First Surface

[0192] 1420a Second Plate

[0193] 1421f Second Groove

[0194] 1422a Second Surface

[0195] A1 Refrigerant Zone

[0196] A2 Cooling Area

[0197] A3 heating zone

[0198] 1421d lateral edge

[0199] 1405k and 1403k oblique flow channels

[0200] 1407k breach

[0201] D direction

[0202] 3000, 3100, 3200, 3300 methods

[0203] Steps 3002, 3004, 3006, and 3008

[0204] Steps 3102, 3104, 3106, 3108, and 3110

[0205] Steps 3202, 3204, and 3206

[0206] Steps 3302, 3304, 3306, 3308, and 3310

[0207] B Cutting Line

Claims

1. A heat dissipation device for containing cooling fluid, comprising: a first plate having a plurality of first oblique grooves arranged along a first direction; The second plate has a plurality of second oblique grooves arranged along the first direction. The second plate is stacked on the first plate, and the first oblique grooves and the second oblique grooves are at least partially connected to form a fluid channel for containing the cooling fluid. as well as At least one capillary structure is located in at least a portion of the fluid channel; The first inclined grooves are not directly connected to each other, the second inclined grooves are not directly connected to each other, and a portion of the first inclined groove intersects a portion of the second inclined groove, thereby allowing the first inclined groove to be indirectly connected through the second inclined groove. Wherein, the cooling fluid only fills a portion of the fluid channel, the heat dissipation device is in thermal contact with a first heat source located below the surface of the cooling fluid and a second heat source located above the surface of the fluid, and the cooling fluid can be drawn from the region below the fluid channel to a location close to the second heat source by the at least one capillary structure; The plurality of first oblique grooves and the plurality of second oblique grooves are respectively obliquely directed in two opposite directions. One end of the uppermost first oblique groove and one end of the uppermost second oblique groove together form an injection port, which is used to inject the cooling fluid into the fluid channel.

2. The heat dissipation device of claim 1, wherein the number of the at least one capillary structure is two, and the two capillary structures are respectively located in at least a portion of the first oblique groove and at least a portion of the second oblique groove.

3. The heat dissipation device of claim 1, wherein a portion of the at least one capillary structure is used to be immersed in the cooling fluid.

4. A method for manufacturing the heat dissipation device as described in claim 1, comprising: Multiple capillary structures are respectively disposed on the first plate and the second plate; A preliminary operation for rolling bonding the first plate and the second plate; The first plate and the second plate are rolled together to form the heat dissipation device. as well as The heat dissipation device is inflated to form the plurality of first oblique grooves arranged along the first direction on the first plate and the plurality of second oblique grooves arranged along the first direction on the second plate within the heat dissipation device. The heat dissipation device is degassed; and Seal the injection port of the heat dissipation device.

5. The method for manufacturing a heat dissipation device as claimed in claim 4, wherein the capillary structure is configured by etching the surfaces of the first plate and the second plate to form a plurality of micropores or a plurality of microstructures with the surfaces of the first plate and the second plate.

6. The method for manufacturing the heat dissipation device as described in claim 4, wherein the capillary structure is configured by sandblasting onto the surfaces of the first plate and the second plate.

7. A method for manufacturing the heat dissipation device as described in claim 1, comprising: The first plate and the second plate are rolled together to form the heat dissipation device. The heat dissipation device is inflated to form the plurality of first oblique grooves arranged along the first direction on the first plate and the plurality of second oblique grooves arranged along the first direction on the second plate within the heat dissipation device. Cut the heat dissipation device to form at least one opening in at least one oblique groove; The capillary structure is inserted into the at least one oblique groove through the at least one opening; as well as The at least one tear is sealed by rolling.

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