Wafer notch leveling device

Abstract

The present invention proposes a wafer notch leveling device, which includes: a main body, a first rotating part, a positioning part, a power part and a control unit, wherein the main body has a supporting part, and a pivoting part is respectively arranged at both ends to pivotally connect multiple supporting arms, the pivoting part, the first rotating part and the positioning part are electrically connected to the power part, and the power part is electrically connected to the control unit; in particular, when multiple wafers are placed and fixed on the supporting part, the control unit is electrically connected to the power part to drive the first rotating part to rotate the multiple wafers, so that a notch on the wafer is leveled through the positioning part.

Description

Technical Field

[0001] The present invention relates to a wafer notch leveling device, and more particularly to a device that completes wafer notch leveling by electrically connecting a power part through a positioning member, a supporting part and a rotating part, and the power part is electrically connected to a control unit to control the setting and actuation of each component. Background Art

[0002] During wafer manufacturing, a notch is left to help locate the wafer and determine its orientation and position. This notch is a deliberately left corner on the outer edge of the wafer without affecting the wafer.

[0003] In the existing wafer manufacturing process, lasers are mostly used to level the wafer notches. That is, the wafer is placed on a support table. If the laser beam emitted by the laser transmitter is blocked by the wafer, the wafer starts to rotate. When it rotates to the notch on the edge of the wafer, the light beam emitted by the laser transmitter can pass through the notch to reach the laser receiver. After calculation, the position of the notch on the wafer can be obtained. However, this device requires the cooperation of many devices to complete, and positioning only by laser devices is prone to errors and cannot be accurately completed.

[0004] In addition, another existing device is to place the wafer into a manual edge-finding device, and then the user manually rotates the handle to locate the wafer gap based on physical principles to achieve the purpose of leveling. However, the manual device no longer meets the needs of today's manufacturing production lines, so automated equipment is needed to solve this shortcoming. Summary of the invention

[0005] In view of this, the present invention provides a wafer notch leveling device, which includes: a main body, having a supporting part, and a pivot part is respectively provided at both ends, and the pivot part is pivotally connected to multiple supporting arms; a first rotating part, having a driving wheel and an auxiliary wheel; a positioning part, provided with a positioning part and a disengagement fulcrum; a power part, having a first power part electrically connected to the pivot part to drive one or more supporting arms to perform lifting and lowering movements, a second power part electrically connected to the rotating part to rotate it, and a third power part electrically connected to the positioning part to perform lifting and lowering movements; and a control unit electrically connected to the power part to control the setting and operation of each component.

[0006] In the wafer notch leveling device, the pivoting portion further comprises a first pivoting portion and a second pivoting portion.

[0007] In the wafer notch leveling device, the support arm further comprises a first direction support arm and a second direction support arm.

[0008] In the wafer notch leveling device, the first angle between the first direction support arm and the second direction support arm when connected is 90 degrees.

[0009] In the wafer notch leveling device, when the support arms rise, the second included angle of the two arms is greater than 180 degrees.

[0010] In the wafer notch leveling device, the support portion and the second direction support arm are further provided with a separating comb plate for fixing the wafer.

[0011] In the wafer notch leveling device, the separating comb plates are further designed as V-shaped grooves to reduce the contact area with the wafer.

[0012] In the wafer notch leveling device, the material of the separating comb plates is a material with a low friction coefficient selected from polytetrafluoroethylene (PTFE), fluorinated ethylene propylene copolymer (FEP), and ethylene tetrafluoroethylene copolymer (ETFE).

[0013] The wafer notch leveling device, wherein the support arm includes a second rotating part.

[0014] In the wafer notch leveling device, the material of the surface of the driving wheel and the auxiliary wheel is a high friction coefficient material selected from polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polyamide (PA), acetal polyoxymethylene (POM) and polyethylene terephthalate (PET).

[0015] The wafer notch leveling device, wherein the driving wheel and the auxiliary wheel are both provided with fixing grooves.

[0016] In the wafer notch leveling device, only the driving wheel in the first rotating part is electrically connected to the second power member.

[0017] In the wafer notch leveling device, the first rotating part further has a belt connecting the driving wheel and the auxiliary wheel, so that the driving wheel drives the auxiliary wheel to rotate through the belt.

[0018] In the wafer notch leveling device, the positioning piece is selected from one of the configurations of a cylinder, a triangular prism, a sheet and a quadrangular bar.

[0019] In the wafer notch leveling device, the material of the positioning member and the disengagement fulcrum is a material with a low friction coefficient selected from polytetrafluoroethylene (PTFE), fluorinated ethylene propylene copolymer (FEP), and ethylene tetrafluoroethylene copolymer (ETFE).

[0020] In the wafer notch leveling device, the first power member, the second power member and the third power member further have motors and gear components for driving the pivoting portion, the first rotating portion and the positioning portion respectively.

[0021] The wafer notch leveling device further comprises a laser positioning device for detecting whether the notches of the wafer are completely leveled and positioned.

[0022] In the wafer notch leveling device, the laser positioning device further comprises a transmitting part and a receiving part, which are arranged on a plurality of wall surfaces arranged in parallel.

[0023] In the wafer notch leveling device, the laser positioning device is installed on two opposite walls, the laser beam emitted by the emitting part is parallel to the mounting direction of the driving wheel and the laser beam passes through the gap between the driving wheel and the wafer.

[0024] The wafer notch leveling device, wherein the laser positioning device is installed on both sides of the inner wall of the main body, the transmitting part is installed at one end of the inner wall extending downward from the bottom of the pivot part, and the receiver is installed at the other end of the inner wall extending downward from the bottom of the pivot part, and the height is located at the position when the positioning piece locates the wafer notch.

[0025] In this way, by using the wafer notch leveling device of the present invention, the position of the wafer notch can be accurately found through a physical device, and then with the assistance of a laser device, the positioning action can be more accurate. In particular, the present invention introduces automation into the wafer notch leveling device so that it can be perfectly combined with the current automated production line. Accordingly, this device can accelerate the completion of a large number of wafer notch leveling operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a side perspective view of the wafer notch leveling device of the present invention;

[0027] Figure 2 It is a three-dimensional diagram of the wafer notch leveling device of the present invention;

[0028] Figure 3 is a partial enlarged view of the support arm of the present invention;

[0029] Figure 4 It is a schematic diagram of the rise of the support arm of the wafer notch leveling device of the present invention;

[0030] Figure 5 This is a schematic diagram of the wafer notch leveling device of the present invention before starting;

[0031] Figure 6 It is a schematic diagram of a wafer fixing device for wafer notch leveling of the present invention;

[0032] Figure 7 It is a schematic diagram of the positioning member of the wafer notch leveling device of the present invention being ready to rise;

[0033] Figure 8 It is a schematic diagram of the wafer notch leveling device of the present invention completing leveling;

[0034] Fig. 9 It is a schematic diagram of the recovery of the wafer notch leveling device of the present invention.

[0035] Reference numerals

[0036] 1 Wafer notch leveling device

[0037] 10 body

[0038] 11 Support

[0039] 12. Pivot

[0040] 121 first pivoting portion

[0041] 122 second pivoting portion

[0042] 13 Support arm

[0043] 131 First direction support arm

[0044] 132 Second direction support arm

[0045] 14 Dividing comb plate

[0046] 20 First rotating part

[0047] 21 Drive wheel

[0048] 22 Training wheels

[0049] 23 Fixing groove

[0050] 30 Positioning unit

[0051] 31 Positioning piece

[0052] 32 Breakaway

[0053] 40 Power Department

[0054] 41 First power piece

[0055] 42 Second power element

[0056] 43 Third power element

[0057] 50 Control Unit

[0058] 60 Laser positioning device

[0059] 61 Launch Department

[0060] 62 Receiving Department

[0061] A The first angle

[0062] B Second angle DETAILED DESCRIPTION

[0063] Since the present invention discloses a wafer notch leveling device, the various structural connections, linkage relationships and principles used therein are well understood by those with ordinary knowledge in the field, so the following Chinese description will not be described in full. At the same time, the figures used in the following text are schematic diagrams of structures related to the features of the present invention, and are not and do not need to be fully drawn according to actual sizes. It is stated in advance.

[0064] Please refer to Figure 1 , is a schematic diagram of the wafer notch leveling device 1 proposed in the present invention. The wafer notch leveling device 1 proposed in the present invention comprises: a main body 10, the main body 10 is a machine platform mainly used to set up various devices and components required by the present invention, and is a hollow machine platform with an opening facing upward, wherein a support portion 11 is arranged in the machine platform, and the support portion 11 is a long strip-shaped member for placing one or more wafers to be leveled, and the support portion 11 is supported at the center bottom of the wafer, and a pivoting portion 12 is arranged on the top of two non-adjacent sides of the main body 10, and the pivoting portion 12 is used to pivotally connect two support arms 13, and the left and right sides of the pivoting portion 12 are each pivotally connected to a support arm 13, and the support arm 13 is pivotally connected to the left and right sides of the pivoting portion 12. The support arm 13 is used to assist the support part 11 to strengthen and fix one or more wafers to be leveled, and can effectively prevent the wafers from shifting and sliding during the leveling process; the first rotating part 20 has a driving wheel 21 and an auxiliary wheel 22, the driving wheel 21 and the auxiliary wheel 22 are cylindrical in configuration, the driving wheel 21 and the auxiliary wheel 22 are arranged in parallel at the same height, the first rotating part 20 is arranged in parallel with the support part 11, and is slightly higher than the support part 11, so as to drive the wafer to rotate; the positioning part 30 is a long strip-shaped carrier mechanism, which can perform the action of rising and falling, and the top of the long side of the positioning part 30 A positioning member 31 is provided, which is a notch finding device (Finder) and is in the shape of a long strip. When the positioning member 31 is set on the positioning portion 30, the angle of the positioning member 31 can be adjusted by an adjuster according to the user's needs. A disengagement fulcrum 32 is provided on the other side of the positioning portion 30. The disengagement fulcrum 32 is a long strip member for assisting in fixing the wafer whose notch has been found by the positioning member 31. A power unit 40 is provided, and the power unit 40 further has a first power member 41 electrically connected to the pivoting portion 12 to provide power to drive the pivoting portion 12. The support arm 13 performs lifting and lowering movements, the second power member 42 is electrically connected to the first rotating part 20 to provide power to rotate the driving wheel 21 and the auxiliary wheel 22, and the third power member 43 is electrically connected to the positioning part 30 to drive the carrier mechanism of the positioning part 30 to perform lifting and lowering movements; and the control unit 50, the control unit 50 is electrically connected to the power part 40, to control the positioning settings of various components on the wafer notch leveling device 1, and then activate the various components according to the operation schedule set on the device to achieve the desired effect of the wafer notch leveling device 1.

[0065] Please refer to Figure 2, which is a three-dimensional diagram of the wafer notch leveling device proposed by the present invention. The pivoting portion 12 further includes a first pivoting portion 121 and a second pivoting portion 122, which are respectively disposed at the top of two non-adjacent sides of the body 10, for pivoting the left and right support arms 13, and controlling the movement of the left and right support arms 13 to rise and fall, wherein the distance between the first pivoting portion 121 and the second pivoting portion 122 is the overall length of the wafer notch leveling device 1, and one or more wafers are arranged in parallel with the pivoting portion 12.

[0066] Please continue to refer to Figure 2 There are two support arms 13, and the support arms 13 are further composed of a pair of first direction support arms 131 and a second direction support arm 132, wherein one end of the first direction support arm 131 is pivotally connected to the left side of the first pivot portion 121, and the other end is connected to the second direction support arm 132, and one end of the other first direction support arm 131 is connected to the left side of the second pivot portion 122, and the other end is connected to the second direction support arm 132, and the structural connection between the right side of the pivot portion 12 and the support arm 13 is the same as that of the left side, wherein the length of the first direction support arm 131 is slightly larger than the radius length of the wafer, and the range defined by the multiple pivot portions 12 connecting the two support arms 13 is the range where one or more wafers can be placed.

[0067] Please refer to Figure 3 The first angle A when the first direction support arm 131 and the second direction support arm 132 are connected is 90 degrees. One end of the first direction support arm 131 is directly in contact with the driving source because it is connected to the pivot portion 12, and the configuration of the support arm 13 is a rectangular parallelepiped configuration. Therefore, the most stable connection method of the support arm 13 is to set the first angle A connecting the first direction support arm 131 and the second direction support arm 132 to 90 degrees.

[0068] Please refer to Figure 4 , when the first direction support arms 131 on the left and right sides of the pivot part 12 rise, the second angle B at the lower edges of the two arms is greater than 180 degrees. Since the function of the support arm 13 is to fix the wafer on the auxiliary support part 11 and form the most stable three-point fixed state, because the first direction support arms 131 on the left and right sides of the pivot part 12 need to link the second direction support arms 132 on the left and right sides of the pivot part 12 to rise to the left and right outer edges of the upper part of the wafer, and then cooperate with the support part 11 at the bottom of the wafer to achieve a three-point fixed state. If the support arm 13 needs to rise and meet the above conditions, then after the first direction support arms 131 on the left and right sides of the pivot part 12 rise, the second angle at the lower edge must be greater than 180 degrees.

[0069] Please refer to Figure 2, the support part 11 and the second direction support arm 122 are further provided with a separating comb plate 14. Since the wafer notch leveling device 1 needs to perform a large number of wafer leveling operations at the same time, in order to avoid collision between multiple wafers during the installation when placing multiple wafers, and to prevent the wafers from slipping out of the device during rotation, a separating comb plate 14 is specially installed on the support part 11 (that is, the base for placing the wafers) and the second direction support arm 132. The separating comb plate 14 has grids of grooves, and the width of the grooves is slightly larger than the thickness of the wafer. In addition, the installation positions of the separating comb plates 14 on the support part 11 and the second direction support arm 132 must correspond, that is, when the wafer is placed in the first grid groove of the separating comb plate 14 on the support part 11, the first grid grooves of the separating comb plates 14 on the other two second direction support arms 132 must fix the same wafer at the same time. Accordingly, the other multiple wafers must also meet the above-mentioned setting conditions when they are placed.

[0070] It is particularly important to mention that in order to avoid wearing out the wafer, the device needs to reduce the contact area between the separation comb plate 14 and the wafer as much as possible during the leveling operation, so the groove on the separation comb plate 14 is specially designed as a V-shaped groove. Due to the V-shape, the wafer can be placed on the bottom end of the V-shaped groove. At this time, the contact area between the separation comb plate 14 and the wafer is the smallest contact area, which reduces the contact and friction between the groove surfaces on both sides of the groove and the wafer surface. Accordingly, the contact area between the separation comb plate 14 and the wafer can be effectively reduced, and the possibility of wear on the wafer during leveling can be minimized.

[0071] In addition, in order to reduce the wear of the wafer by the separation comb plate 14 as much as possible, a material with a low friction coefficient is specially selected when manufacturing the separation comb plate 14. The material is selected from: polytetrafluoroethylene (PTFE), fluorinated ethylene propylene copolymer (FEP), ethylene and tetrafluoroethylene copolymer (ETFE) and other materials with a low friction coefficient to reduce the friction between the separation comb plate 14 and the wafer, thereby reducing the chance of wear of the wafer during operation.

[0072] It is worth mentioning that in another embodiment, a second rotating part (not shown in the figure) is further installed on the support arm 13, and the position of the second rotating part is installed on the second direction support arm 132. This design is to move the power for driving the wafer in the wafer notch leveling device 1 to the top of the entire equipment. Different from the previous embodiment in which the wafer is driven only by the first rotating part 20, since the driving position is to drive the lower half of the wafer, the entire batch of wafers to be leveled gives the first rotating part 20 a greater downward pressure due to gravity. Therefore, in this embodiment, a second rotating part is further pivotally provided on the second direction support arm 132, thereby providing another power to reduce the load of the first rotating part 20.

[0073] In addition, the surface material of the driving wheel 21 and the auxiliary wheel 22 is selected from one of the high friction coefficient materials selected from polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polyamide (PA), acetal polyoxymethylene (POM) and polyethylene terephthalate (PET). Since the driving wheel 21 and the auxiliary wheel 22 need to generate friction between the surface of the driving wheel 21 and the auxiliary wheel 22 and the outer edge of the wafer to rotate the wafer, the material of the driving wheel 21 and the auxiliary wheel 22 needs to be set to a high friction coefficient material, thereby fully using the power generated by the driving wheel 21 and the auxiliary wheel 22 to rotate the wafer, avoiding unnecessary power consumption, while avoiding the loss of equipment materials due to the loss of kinetic energy, and further avoiding unnecessary vibrations causing collisions of wafers.

[0074] Please continue to refer to Figure 2 The driving wheel 21 and the auxiliary wheel 22 are further provided with fixing grooves 23 on their surfaces. The width of the fixing grooves 23 is slightly larger than the thickness of the wafer. This design is used to enhance fixation and avoid displacement of the wafer during rotation. After placing the wafers one by one into the fixing grooves 23, not only can power be provided to the wafers in the fixing grooves 23 more accurately when driving the wafers, but also displacement of the wafers during rotation to cause unnecessary collisions can be avoided. It can also ensure that the entire batch of wafers can be leveled at one time, reducing leveling errors caused by uneven force.

[0075] In one embodiment, only the driving wheel 21 in the first power unit 20 is electrically connected to the second power member 42, that is, the auxiliary wheel 22 has no power. When the first rotating unit 20 drives the wafer, it only electrically connects the driving wheel 21 through the second power member 42 to rotate it. At this time, the auxiliary wheel 22 is only driven to rotate by the wafer carried by its surface made of high friction coefficient material to assist the driving wheel 21. In addition, the directions of the driving wheel 21 and the auxiliary wheel 22 when rotating must be the same. If the driving wheel 21 rotates clockwise, the auxiliary wheel 22 rotates clockwise, so that the wafer carried by the driving wheel 21 and the auxiliary wheel 22 can be rotated.

[0076] In another embodiment, in order to make the driving wheel 21 and the auxiliary wheel 22 cooperate better during operation, the first rotating part 20 further has a belt installed on the bearings of the driving wheel 21 and the auxiliary wheel 22 to connect the driving wheel 21 and the auxiliary wheel 22 so that the belt can synchronously drive the auxiliary wheel 22 with the power generated by the driving wheel 21, so that the speed and rate of rotation of the auxiliary wheel 22 are synchronized with the driving wheel 21.

[0077] In addition to the above-mentioned configurations, the positioning member 31 can change its configuration according to usage requirements, and its shape is at least one of the following configurations: a round bar, a triangular bar, a sheet bar, and a square bar. If the positioning member 31 is a round bar configuration, it can reduce the damage to the notch caused by the wafer during flattening compared to bars of other configurations. When the triangular bar and the square bar are used as the positioning member 31, the notch on the wafer can be more firmly fixed on the positioning member 31. When the sheet bar is used as the positioning member 31, it is used when the wafer is lighter or the material is more fragile. The positioning member 31 and the wafer notch can be accurately positioned through the design of the sheet bar.

[0078] In order to make the wafer notch leveling device 1 operate more smoothly, the material of the positioning member 31 and the disengagement fulcrum 32 is selected from one of the materials with a low friction coefficient selected from polytetrafluoroethylene (PTFE), fluorinated ethylene propylene copolymer (FEP), and ethylene tetrafluoroethylene copolymer (ETFE). Since the positioning member 31 and the disengagement fulcrum 32 lightly touch the edge of the wafer when the wafer rotates, especially the positioning member 31 will slightly push the wafer up, in order to avoid the positioning member 31 from rubbing against the wafer when searching for the wafer notch, thereby causing unnecessary wear, the material of the positioning member 31 and the disengagement fulcrum 32 is specially selected as a material with a low friction coefficient.

[0079] In this embodiment, the first power member 41, the second power member 42 and the third power member 43 further have a motor and a gear assembly (not shown in the figure), and the power generated by the motor drives the gear assembly to link the equipment. Accordingly, the first power member 41 drives the pivot part 12 through the motor and the gear assembly, so that the support arms 13 pivoted on the left and right sides of the pivot part 12 are lifted and lowered. The second power member 42 drives the driving wheel 21 in the first rotating part 20 through the coordinated operation of the motor and the gear assembly. The third power member 43 drives the positioning part 30 to be lifted and lowered through the coordinated operation of the motor and the gear assembly.

[0080] Please refer to Figure 2 The wafer notch leveling device 1 further includes a laser positioning device 60 for detecting whether the notches of the semiconductor wafer are completely leveled and positioned. In addition to physically leveling and positioning the notches through the positioning member 31, a laser positioning device 60 is further provided to confirm whether the notches on the wafer after leveling are completely leveled and positioned through the laser beam emitted by the laser device.

[0081] It is particularly worth mentioning that the laser positioning device 60 further has a transmitting part 61 and a receiving part 62. The transmitting part 61 is used to emit a laser beam, and the receiving part 62 is used to receive a laser beam. The transmitting part 61 and the receiving part 62 are respectively arranged on multiple parallel walls, wherein the transmitting part 61 is installed on one side wall and is parallel to the first pivot part 121, and the receiving part 62 is installed on the other side wall and is parallel to the second pivot part 122. The transmitting part 61 emits a laser beam through multiple wafer leveling notches to the receiving part 62 to complete the notch leveling positioning.

[0082] Please also refer to Figure 1 and Figure 2 , the laser positioning device 60 is installed on the inner walls of both sides of the body 10, the transmitting part 61 is installed on one end of the inner wall of the body 10 extending downward from the bottom of the first pivot part 121, and the receiver 62 is installed on the other end of the inner wall of the body 10 extending downward from the bottom of the second pivot part 122. When the wafer is placed on the wafer notch leveling device 1 to be leveled, the periphery of the wafer will be above the positioning member 31. When the wafer notch needs to be leveled, the positioning member 31 will rise and touch the periphery of the wafer. Accordingly, the height of the laser positioning device 60 is set to the position height when the positioning member 31 locates the wafer notch. After the wafer notch leveling device 1 completes the leveling of the wafer, the positioning member 31 moves downward away from the wafer notch. At this time, the notches after leveling should be arranged in parallel and aligned in a straight line, and the laser beam emitted by the laser positioning device 60 can pass through to confirm again whether the notches after leveling are indeed aligned. After the wafer is leveled, the wafer notch can be rotated to any angle from the bottom positioning member 31 according to user needs.

[0083] In addition, the laser positioning device 60 is installed on two corresponding wall surfaces. The laser beam emitted by the transmitting part 61 is parallel to the installation direction of the driving wheel 21, and the laser beam passes through the contact point between the driving wheel 21 and the semiconductor wafer. When the wafer is not leveled, the laser beam is irradiated on the wafer surface. When the device starts to operate, the positioning part 31 will be stuck in the gap after the wafer finds the gap in the positioning part 31, and the wafer will drop slightly and detach from the driving wheel 21. At this time, there is a gap between the edge of the wafer and the driving wheel 21. This gap is for the laser beam to pass through, and the wafer falls slightly and lands on the detachment fulcrum 32. Therefore, the laser positioning device 60 is installed here. After all wafers are positioned and completely detached from the driving wheel 21, the laser beam emitted by the transmitting part 61 can pass through the gap between the wafer and the driving wheel 21 to reach the receiving part 62. Based on this, the laser positioning device 60 can determine whether multiple wafers have completed positioning.

[0084] In this embodiment, the operation mode of the wafer gap leveling device 1 of the present invention is as follows: Please continue to refer to Figure 5 , place one or more wafers to be leveled on the support part 11 and the first rotating part 20, and fix them with the assistance of the left and right support arms 13. At this time, the wafer is fixed on the wafer notch leveling device 1 through the support part 11, the driving wheel 21, the auxiliary wheel 22 and the support arm 13;

[0085] Please also refer to Figure 1 and Figure 6After placement, the user operates the control unit 50 to electrically connect the first power unit 41 in the power unit 40 to the pivot part 12, and the pivot part 12 drives the two support arms 13 on the left and right sides of the pivot part 12 to rise from the lower outer edges of the left and right sides of the wafer to the upper outer edges of both sides. At this time, the left and right support arms 13 and the support part 11 form a three-point fixed setting to position and fix the wafer.

[0086] Please also refer to Figure 1 and Figure 7 After being fixed, the second power member 42 in the power unit 40 is electrically connected to the positioning part 30 disposed at the bottom of the main body 10, driving the positioning part 30 to rise, so that the positioning member 31 (Finder) slightly lifts the wafer. At the same time, the disengagement fulcrum 32 rises synchronously with the positioning part 30 but does not touch the wafer, and the auxiliary wheel 22 that was originally in contact with the wafer is separated from the wafer because the positioning member 31 (Finder) lifts the wafer. After completing the above positioning, the third power member 43 is electrically connected to the first rotating part 20, driving the driving wheel 21 to drive the wafer to rotate.

[0087] Please refer to Figure 8 As the wafer rotates, the positioning member 31 is inserted into the notch on the edge of the wafer, causing the wafer to move downward. At this time, the disengagement fulcrum 32 supports the wafer that is moving downward and lifts the wafer up. At the same time, the wafer is disengaged from the driving wheel 21 and stops rotating due to the downward displacement. The leveling process is completed until all the multiple wafers on the wafer notch leveling device 1 have completed the above-mentioned action and have all moved to the disengagement fulcrum 32.

[0088] Please refer to Fig. 9 When all the wafers are separated from the driving wheel 21 and fixed on the positioning member 31 and the separation fulcrum 32, the positioning part 30 is electrically connected to the third power member 43 to perform a descending action. At this time, the positioning member 31 and the separation fulcrum 32 are separated from the wafer, and the wafer falls down and is supported by the driving wheel 21 and the auxiliary wheel 22. Then, the driving wheel 21 is rotated to move the wafer notch that has been positioned to the top of the wafer, thereby completing all the actuation procedures of the wafer notch leveling device.

[0089] In summary, the present invention places the wafer to be flattened on the support part 11, and at the same time supports and fixes the wafer to be flattened by the support part 11 in cooperation with the driving wheel 21 and the auxiliary wheel 22 of the first rotating part 20, and electrically connects the power part 40 through the operation control unit 50, and electrically connects the various components through the power part 40 to make it actuated; based on the above arrangement, when the device is actuated, the support arm 13 is first raised to fix the wafer, and at this time, the positioning part 30 is raised, driving the positioning member 31 on the positioning part 30 to slightly lift the wafer , so that the wafer is disengaged from the auxiliary wheel 22, and then the driving wheel 21 is rotated to drive the wafer to rotate to the positioning part 31 to find the notch on the wafer. When the notch of the wafer falls on the positioning part 31, the wafer falls slightly to the disengagement fulcrum 32 and disengages from the driving wheel 21 at the same time. After the wafer is positioned, the positioning part 31 descends, so that the wafer is disengaged from the positioning part 31 and falls on the first rotating part 20. The driving wheel 21 is then used to rotate the wafer to move the notch at the bottom of the wafer to the top of the wafer to complete the wafer notch leveling operation.

[0090] The above description is only a preferred embodiment of the present invention and is not intended to limit the claims of the present invention. At the same time, the above description should be understandable and implementable for those with ordinary knowledge in the field. Therefore, other equivalent changes or modifications that do not deviate from the spirit disclosed in the present invention should be included in the claims.

Claims

1. A wafer notch leveling device, characterized in that: The invention comprises: a main body, having a supporting part, and a pivoting part is respectively arranged at both ends, the pivoting part pivotally connects a plurality of supporting arms, the supporting arm further has a first direction supporting arm and a second direction supporting arm, and the first angle A when the first direction supporting arm and the second direction supporting arm are connected is 90 degrees; a first rotating part, having a driving wheel and an auxiliary wheel; a positioning part, having a positioning member and a disengagement fulcrum; a power part, having a first power member electrically connected to the pivoting part for driving the supporting arm to perform lifting and lowering action, a second power member electrically connected to the first rotating part for rotating it, and a third power member electrically connected to the positioning part for performing lifting and lowering action; and a control unit electrically connected to the power unit for controlling the setting and operation of each component; When a wafer rotates, the positioning piece is stuck in a notch on the edge of the wafer, causing the wafer to move. At this time, the disengagement fulcrum supports the displaced wafer and lifts the wafer. At the same time, the wafer is disengaged from the driving wheel due to the displacement and stops rotating.

2. The wafer notch leveling device according to claim 1, characterized in that: When the support arms are raised to a position, the second angle B between the two arms is greater than 180 degrees.

3. The wafer notch leveling device according to claim 1, characterized in that: A separating comb plate is further arranged on the supporting portion and the second direction supporting arm for fixing the wafer.

4. The wafer notch leveling device according to claim 1, characterized in that: The support arm includes a second rotating part.

5. The wafer notch leveling device according to claim 1, characterized in that: The driving wheel and the auxiliary wheel are each provided with a fixing groove.

6. The wafer notch leveling device according to claim 1, characterized in that: The first rotating part further has a belt connecting the driving wheel and the auxiliary wheel, so that the driving wheel drives the auxiliary wheel to rotate through the belt.

7. The wafer notch leveling device according to claim 1, characterized in that: The first power member, the second power member and the third power member further include a motor and a gear assembly for driving the pivoting portion, the first rotating portion and the positioning portion respectively.

8. The wafer notch leveling device according to claim 1, characterized in that: There is also a laser positioning device for detecting whether a notch of the wafer is completely leveled and positioned.

9. The wafer notch leveling device according to claim 8, characterized in that: The laser positioning device further comprises a transmitting part and a receiving part which are arranged on a plurality of wall surfaces which are arranged in parallel.

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