A floor board and a manufacturing method thereof

Abstract

The present application relates to a floorboard and a manufacturing method thereof. The floorboard includes: a corrugated base plate, and a panel adhesively fixed to the upper surface of the corrugated base plate. The corrugated base plate includes: a corrugated core layer, an upper plate body adhesively fixed to the upper surface of the corrugated core layer by a thermosetting adhesive, and a lower plate body adhesively fixed to the lower surface of the corrugated core layer by a thermosetting adhesive. The panel is adhesively fixed to the upper surface of the upper plate body by a thermosetting or hot-melt adhesive. The present application enables the floorboard to truly combine the wear resistance and aesthetics of the upper panel and the compressive and impact resistance of the lower corrugated base plate, and improves the manufacturing efficiency of the floorboard, enabling the floorboard to be mass-produced industrially.

Description

Technical Field

[0001] This application relates to the field of floors, and particularly to a floorboard and a manufacturing method thereof. Background Art

[0002] The Chinese utility model patent with the patent number CN201320285556.0 discloses a floorboard with a corrugated structure. Although this floorboard is configured with a corrugated structure, the corrugated structure does not directly support the upper and lower wooden panels. The upper and lower panels rely on the reinforcing ribs bonded in the middle for support. Only after the panels undergo relatively large bending deformation, the corrugated structure in the middle generates a supporting effect in the thickness direction. Therefore, it is required that the upper and lower panels must have good bending deformation ability, otherwise the problem of panel fracture is likely to occur.

[0003] Moreover, the floorboard of the aforementioned Chinese utility model patent does not directly utilize the structure of a mature corrugated board, but arranges a simple corrugated structure between the two panels as a filling structure. Its structure is complex and the manufacturing process is cumbersome.

[0004] Some known corrugated boards are composed of an upper plate body and a lower plate body arranged at intervals, and a corrugated core layer adhesively fixed between the aforementioned upper plate body and the lower plate body. The corrugated core layer in the middle of this corrugated board is tightly adhesively bonded to the upper and lower plate bodies to form an integral body, having good compressive strength and bending strength in a specific direction. Therefore, the applicant thought of using a corrugated board with this structure as a substrate (this idea has not been publicly disclosed before the filing of this application), and adhesively fixing a panel made of materials such as marble, ceramic tile or wood on the substrate, so that it has both the wear resistance and beauty of marble, ceramic tile or wood and the compressive and bending resistance of the corrugated board.

[0005] If conventional adhesives and conventional methods are used to bond the panel and the corrugated substrate, the following problems will exist:

[0006] 1. The adhesive layer formed after the conventional adhesive applied between the panel and the corrugated substrate cures usually has more or less grooves and holes, and the adhesive layer is neither continuous nor dense. There is a hollow structure between many parts of the upper panel and the lower corrugated substrate below. When this part of the upper panel is subjected to a downward impact force, it will make a relatively large noise and is easily damaged.

[0007] 2. The conventional adhesive needs to be exposed to the environment over a large area to cure quickly. If the bonding strength between the panel and the corrugated substrate is to be ensured, the adhesive must be applied between the panel and the corrugated substrate before curing. However, the panel and the corrugated substrate are solid structures with poor air permeability, which results in a very long curing time for the adhesive, and further leads to a very low production efficiency of this composite floorboard, which is not suitable for large-scale industrial production.

[0008] In this regard, the applicant initially thought of using a thermosetting or hot-melt adhesive with a fast curing speed and strong controllability to bond its panel and corrugated substrate. However, the bonding process using a thermosetting or hot-melt adhesive requires high temperature, and in the existing corrugated board, the various structural layers are bonded together by a hot-melt adhesive (hot-melt adhesive film) that cannot withstand high temperature. If a thermosetting or hot-melt adhesive is used to bond its panel and corrugated substrate, the corrugated substrate will disintegrate at high temperature. Summary of the Invention

[0009] The technical problem to be solved by this application is: to provide a floorboard and its manufacturing method, so that the floorboard truly combines the wear resistance and aesthetics of the upper panel and the compressive and impact resistance of the lower corrugated substrate, and improves the manufacturing efficiency of the floorboard, enabling the floorboard to be mass-produced industrially.

[0010] The technical solution of this application is:

[0011] A floorboard, comprising:

[0012] A corrugated substrate, and

[0013] A panel fixedly attached to the upper surface of the corrugated substrate;

[0014] The corrugated substrate includes:

[0015] A corrugated core layer,

[0016] An upper plate body fixedly bonded to the upper surface of the corrugated core layer by a thermosetting adhesive, and

[0017] A lower plate body fixedly bonded to the lower surface of the corrugated core layer by a thermosetting adhesive;

[0018] The panel is fixedly bonded to the upper surface of the upper plate body by a thermosetting or hot-melt adhesive.

[0019] Based on the above technical solution, this application further includes the following preferred solutions:

[0020] For the floorboard, the adhesive used to bond the panel and the corrugated substrate forms a continuous and dense adhesive layer between the panel and the corrugated substrate.

[0021] The panel and the corrugated substrate are fixedly bonded by a hot-melt adhesive film sandwiched between them.

[0022] The corrugated core layer is a metal corrugation, and the upper plate body and the lower plate body are metal plates.

[0023] The corrugated core layer is a high-temperature resistant plastic.

[0024] The panel is a marble board, a ceramic tile board, a wooden board or a plastic board.

[0025] The corrugated base plate is a rectangular plate. The corrugated core layer is a wavy structure including a plurality of wave crests and a plurality of wave troughs arranged alternately along the width direction of the corrugated base plate. The plurality of wave crests are adhesively fixed to the upper plate body, and the plurality of wave troughs are adhesively fixed to the lower plate body.

[0026] A floor buckle installation gap is formed between the upper plate body and the lower plate body around the corrugated core layer. A floor buckle welded or adhesively fixed to the upper plate body or / and the lower plate body is installed in the floor buckle installation gap.

[0027] The floor buckle is provided with a panel positioning protrusion that is higher than the upper surface of the upper plate body and abuts against the side edge of the panel in the horizontal direction.

[0028] The first manufacturing method of the floor panel includes:

[0029] Coat a liquid thermosetting adhesive on the upper surface of the lower plate body and the lower surface of the upper plate body. Arrange the corrugated core layer between the lower plate body and the upper plate body. Apply a clamping force to the lower plate body and the upper plate body to approach each other to squeeze the corrugated core layer. Apply high temperature to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body, the upper plate body, and the corrugated core layer.

[0030] Coat a thermosetting adhesive on the lower surface of the panel or / and the upper surface of the upper plate body. Place the panel against the upper surface of the upper plate body and apply a downward pressure to the panel.

[0031] Place a heating plate against the lower surface of the lower plate body. The heat generated by the heating plate is sequentially transmitted through the lower plate body, the corrugated core layer, and the upper plate body to the thermosetting adhesive between the panel and the upper plate body. The thermosetting adhesive between the panel and the upper plate body is cured at high temperature to fixedly connect the panel and the upper plate body.

[0032] The second manufacturing method of the floor panel includes:

[0033] Coat a liquid thermosetting adhesive on the upper surface of the lower plate body and the lower surface of the upper plate body. Arrange the corrugated core layer between the lower plate body and the upper plate body. Apply a clamping force to the lower plate body and the upper plate body to approach each other to squeeze the corrugated core layer. Apply high temperature to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body, the upper plate body, and the corrugated core layer.

[0034] A hot melt adhesive film is sandwiched between the panel and the upper plate body, and a heating plate is arranged against the lower surface of the lower plate body. The heat generated by the heating plate is transmitted to the hot melt adhesive film through the lower plate body, the corrugated core layer and the upper plate body in sequence. The hot melt adhesive film melts at high temperature, and the heat of the heating plate is removed, and the melted hot melt adhesive film solidifies at low temperature, thereby fixing the panel and the upper plate body.

[0035] This application can achieve the following beneficial effects:

[0036] 1. The present application combines a panel for people to walk on with a corrugated board with high structural strength and bending and compression resistance to produce a floor block, which retains the wear resistance and aesthetics of commonly used wooden, marble or tile panels, and makes up for the defect of low structural strength of commonly used wooden, marble or tile panels.

[0037] 2. The present application uses thermosetting adhesives instead of traditional hot melt adhesives to bond and fix the various structural layers of the corrugated substrate, and provides a practical bonding method. As a result, the upper panel can be bonded to the upper surface of the corrugated substrate with another thermosetting or hot melt adhesive that has a fast curing speed and strong controllability, thereby speeding up the production efficiency of the floorboards.

[0038] 3. When the corrugated substrate is made of metal material with rapid heat conduction, the heating plate that provides heat is placed against the side of the corrugated substrate away from the panel. With the help of the corrugated substrate made of metal material, the heat is quickly directed to the thermosetting or hot-melt adhesive between the panel and the corrugated substrate to complete the bonding and fixing of the panel and the corrugated substrate. During the production process, the panel does not bear high temperature, which allows the upper panel to use various heat-resistant or non-heat-resistant materials, which is very clever. Moreover, the metal corrugated board has excellent compressive and bending resistance, which is exactly adapted to the use environment of the floor block laid flat on the ground, and just meets the use requirements of the floor block. Based on this, the upper panel can be made as thin as a few millimeters, greatly saving the use of wood and stone, especially precious wood and stone. Furthermore, when the floor block is used as a floor heating floor, the metal corrugated substrate can quickly direct the heat from the heat source below to the panel, and then the panel is dissipated to the room, quickly raising the indoor temperature. As a result, the floor heating system equipped with this type of floor block can heat up as soon as it is turned on, and the temperature of the heat source below does not need to be high. For normal use, it only needs to be maintained at a low temperature of around 30°C, and the energy consumption is extremely low. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present application, rather than limiting the present application.

[0040] Figure 1It is a schematic cross-sectional structure diagram of the floor board in the width direction in the first embodiment of the present application.

[0041] Figure 2 It is a schematic cross-sectional structure diagram of the floor board in the length direction in the first embodiment of the present application.

[0042] Figure 3 It is a schematic connection structure diagram of two adjacent floor boards in the first embodiment of the present application.

[0043] Figure 4 It is a schematic structure diagram of the corrugated substrate in the first embodiment of the present application.

[0044] Figure 5 It is a demonstration diagram of the manufacturing method of the floor board in the first embodiment of the present application.

[0045] Figure 6 It is a demonstration diagram of the manufacturing method of the floor board in the second embodiment of the present application.

[0046] Figure 7 It is a schematic structure diagram of the floor board after being manufactured in the second embodiment of the present application.

[0047] Wherein: 1 - corrugated substrate, 2 - panel, 3 - floor buckle, 4 - adhesive layer, 5 - heating plate, 6 - hot melt adhesive film;

[0048] 101 - upper plate body, 102 - lower plate body, 103 - corrugated core layer, 301 - panel positioning protrusion. Detailed implementation manners

[0049] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0050] Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art to which the present application belongs. The words such as "a" or "one" used in the patent application specification and claims of the present application do not indicate a limitation in quantity, but rather indicate the existence of at least one.

[0051] In the description of the specification and claims of the present application, the orientation or positional relationship indicated by terms such as "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0052] Now, embodiments of the present application will be described with reference to the drawings. Embodiment 1:

[0053] Figures 1 to 5 A preferred embodiment of the floorboard of the present application is shown. Similar to the floorboard structure mentioned in the background art, this floorboard also includes a corrugated base plate 1 and a panel 2 that abuts against and is fixed to the upper surface of the corrugated base plate.

[0054] Different from traditional corrugated boards:

[0055] In this embodiment, the corrugated base plate 1 includes: a corrugated core layer 103, an upper plate body 101 adhesively fixed to the upper surface of the corrugated core layer by a thermosetting adhesive (instead of a hot-melt adhesive), and a lower plate body 102 adhesively fixed to the lower surface of the corrugated core layer by a thermosetting adhesive (instead of a hot-melt adhesive). The panel 2 is adhesively fixed to the upper surface of the upper plate body 101 by a thermosetting adhesive.

[0056] When manufacturing this floorboard:

[0057] First, a liquid thermosetting adhesive is coated on the upper surface of the lower plate body 102 and the lower surface of the upper plate body 101. The corrugated core layer 103 is arranged between the lower plate body 102 and the upper plate body 101. A clamping force is applied to the lower plate body 102 and the upper plate body 101 to squeeze the intermediate corrugated core layer 103, and high temperature is applied to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body 102, the upper plate body 101, and the corrugated core layer 103. First, the production of the corrugated base plate 1 is completed. The coating thickness of the aforementioned liquid thermosetting adhesive, especially the liquid thermosetting adhesive on the lower surface of the upper plate body, should be well controlled. If the coating is too little, the bonding strength between the upper and lower plate bodies and the corrugated core layer is low. If the coating is too much, the adhesive on the lower surface of the upper plate body is likely to drip downward.

[0058] After that, an additional thermosetting adhesive is coated on the lower surface of the panel 2 and / or the upper surface of the upper plate body 101. The panel 2 is arranged against the upper surface of the upper plate body 101, and a downward pressure is applied to the panel 2, so that the thermosetting adhesive between the panel 2 and the upper plate body 101 spreads evenly under the action of the aforementioned pressure. A heating plate 5 is arranged against the lower surface of the lower plate body 102. The heat generated by the heating plate 5 is transmitted to the thermosetting adhesive between the panel 2 and the upper plate body 101 successively through the lower plate body 102, the corrugated core layer 103 and the upper plate body 101. The thermosetting adhesive cures at high temperature and fixedly connects the panel 2 and the upper plate body 101.

[0059] Since the thermosetting adhesive between the panel 2 and the upper plate body 101 spreads evenly under the action of pressure during the manufacturing process, after the manufacturing is completed, the cured thermosetting adhesive will form a continuous and dense adhesive layer 4 between the panel 2 and the upper plate body 101 of the corrugated base plate. There will be no holes or grooves between the panel 2 and the corrugated base plate 1, so that the floor board can bear a large vertical load and vertical impact force.

[0060] In order to accelerate the transmission rate of the heat on the heating plate 5 to the thermosetting adhesive between the panel 2 and the upper plate body 101, and then improve the manufacturing efficiency of the floor board, in this embodiment, the corrugated base plate is made of a metal corrugated board with rapid heat conduction and strong temperature resistance. Specifically, both the upper plate body 101 and the lower plate body 102 of the corrugated base plate 1 are aluminum plates, and the middle corrugated core layer 103 is an aluminum corrugation. Of course, if the upper plate body 101 and the lower plate body 102 are made of steel plates and the middle corrugated core layer 103 is made of steel corrugation, it also has a very high heat transfer rate.

[0061] In some other embodiments of the present application, the corrugated core layer 103 can also be made of other high-temperature resistant materials, such as high-temperature resistant plastics.

[0062] The panel 2 in this embodiment is a wooden board. Of course, it can also be a marble board, a ceramic tile board or a plastic board, or even a wear-resistant coating coated on the upper surface of the honeycomb base plate.

[0063] Different from the floor board mentioned in the background art, in this embodiment, floor buckles 3 are fixedly connected to the four side edges of the corrugated base plate 1, so that each floor board can be docked with each other by means of the floor buckles 3 on the side edges to form a large-area floor system laid on the ground.

[0064] The above floor buckle 3 is connected to the side position of the corrugated substrate 1 in the following way: the area of the corrugated core layer 103 in the corrugated substrate is smaller than the areas of the upper plate body 101 and the lower plate body 102, and each side of the corrugated core layer 103 is located inside the corresponding sides of the upper plate body 101 and the lower plate body 102, so that a floor buckle installation gap surrounding the corrugated core layer 103 is formed between the upper plate body 101 and the lower plate body 102. The floor buckle 3 is embedded in the aforementioned buckle installation gap. Moreover, the part of the floor buckle embedded in the aforementioned floor buckle installation gap is adhesively fixed to the upper plate body 101 and the lower plate body 102.

[0065] It should be noted that the above floor buckle 3 can also be welded to only one of the upper plate body 101 or the lower plate body 102. The advantage of such a design is that: the assembly efficiency of the floor buckle 3 and the corrugated substrate 1 is improved. However, the defect is that: the connection strength between the floor buckle 3 and the corrugated substrate 1 is slightly poor.

[0066] The adhesive used to bond the floor buckle 3 and the corrugated substrate 1 can be a heat-resistant thermosetting adhesive. In this way, after the assembly of the floor buckle 3 and the corrugated substrate 1 is completed, the above process can be used to bond the upper panel 2.

[0067] When manufacturing this floor board, first complete the assembly of the floor buckle 3 and the corrugated substrate 1, and then cover the panel 2 on the upper surface of the corrugated substrate 1. If there is no structure for positioning the installation position of the panel 2 on the corrugated substrate 1 or the floor buckle 3, it will lead to inconsistent relative positions between the panel 2 and the corrugated substrate 1 on each floor board, and then lead to different sizes of the gaps between adjacent floor boards after the floor boards are connected together, affecting the appearance. Seriously, it may even cause the floor boards to be unable to be assembled together.

[0068] For the above reasons, in this embodiment, a panel positioning protrusion 301 that protrudes upward and is higher than the upper surface of the corrugated substrate 1 is provided on each floor buckle 3, and after the assembly is completed, the side of the panel 2 abuts against the panel positioning protrusion 301 in the horizontal direction.

[0069] During assembly, after the connection between the floor buckle 3 and the corrugated substrate 1 is completed, the panel positioning protrusion 301 on the floor buckle 3 protrudes above the upper surface of the corrugated substrate 1, thus providing pre-positioning for the installation of the panel 2, and then the adhesive assembly of the panel 2 is completed under the positioning action of the panel positioning protrusion 301.

[0070] Of course, it is also possible to install the floor buckle 3 after the assembly of the corrugated substrate 1 and the panel 2 is completed, or even not configure the floor buckle 3.

[0071] In this embodiment, the shape of the corrugated substrate 1 is adapted to the shape of the floorboard, and both are long rectangular plates. Similar to most corrugated boards, the corrugated core layer 103 in this embodiment is also a wavy structure, which has a plurality of alternately arranged peaks and valleys. As we know, the flexural strength of a long rectangular plate in the length direction is weaker than that in the width direction, and the flexural strength of the wavy corrugated core layer in the direction perpendicular to the arrangement direction of the peaks and valleys is much higher than that in the direction parallel to the arrangement direction of the peaks and valleys. Based on this, in this embodiment, the peaks and valleys of the wavy corrugated core layer are alternately arranged along the width direction of the corrugated substrate 1, thereby greatly improving the flexural performance of the rectangular floorboard in the length direction.

[0072] As previously mentioned, the upper plate body 101 is adhesively fixed to the upper surface of the corrugated core layer 103 by a thermosetting adhesive, and the lower plate body 102 is adhesively fixed to the lower surface of the corrugated core layer 103 by a thermosetting adhesive. Therefore, as long as the bonding process is well controlled when bonding the upper and lower plate bodies and the middle wavy corrugated core layer, each peak of the wavy corrugated core layer can be adhesively fixed to the upper plate body 101, and each valley can be adhesively fixed to the lower plate body 102, so that each peak and each valley of the corrugated core layer are tightly combined with the upper and lower plate bodies, enabling the rectangular floorboard to withstand a large bending torque in the width direction.

[0073] The "thermosetting adhesive" mentioned in the specification and claims of this application includes both adhesives that can only be cured by heating and adhesives that can accelerate the curing speed by heating. Embodiment 2:

[0074] Figure 6 and Figure 7 shows another preferred embodiment of the floorboard of this application. The structure of this floorboard is basically the same as that of Embodiment 1, and the main difference is only that:

[0075] The panel 2 is adhesively fixed to the upper surface of the upper plate body 101 by a hot-melt adhesive (instead of the thermosetting adhesive in Embodiment 1).

[0076] Furthermore, the panel 2 and the upper plate body 101 of the corrugated substrate 1 are adhesively fixed by a hot-melt adhesive film 6 interposed therebetween.

[0077] Referring to Figure 6 as shown, when manufacturing this floorboard:

[0078] First, apply a liquid thermosetting adhesive on the upper surface of the lower plate body 102 and the lower surface of the upper plate body 101. Arrange the corrugated core layer 103 between the lower plate body 102 and the upper plate body 101. Apply a clamping force to the lower plate body 102 and the upper plate body 101 to squeeze the intermediate corrugated core layer 103 towards each other, and apply high temperature to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body 102, the upper plate body 101 and the corrugated core layer 103, and first complete the production of the corrugated base plate 1.

[0079] After that, complete the assembly of the floor buckle 3 and the corrugated base plate 1.

[0080] Then, provide the panel 2, sandwich a hot melt adhesive film between the panel 2 and the upper plate body 101, arrange a heating plate 5 against the lower surface of the lower plate body 102. The heat generated by the heating plate 5 is transmitted to the hot melt adhesive film 6 through the lower plate body 102, the corrugated core layer 103 and the upper plate body 101 in sequence. The hot melt adhesive film 6 melts at high temperature. Remove the heat of the heating plate 5, and the melted hot melt adhesive film cures at low temperature, thereby fixedly connecting the panel 2 and the upper plate body 101.

[0081] The above-mentioned "removing the heat of the heating plate 5" includes two methods: One is to withdraw the heating plate from the lower surface of the lower plate body 102; the other is to disconnect or reduce the heating current of the heating plate 5 to lower the temperature of the heating plate 5. The above-mentioned "high temperature" and "low temperature" are relative and there is no fixed temperature value, and those skilled in the art generally understand the meanings of the above-mentioned "high temperature" and "low temperature".

[0082] After production, the melted and then cured hot melt adhesive film also forms a continuous and dense adhesive layer 4 between the panel 2 and the upper plate body 101 of the corrugated base plate, and there will be no holes or grooves between the panel 2 and the upper plate body 101 of the corrugated base plate.

[0083] The above is only an exemplary embodiment of the present application, and is not used to limit the protection scope of the present application. The protection scope of the present application is determined by the appended claims.

Claims

1. A floor board, comprising: A corrugated base plate (1), and A panel (2) adhesively fixed to the upper surface of the corrugated base plate; It is characterized in that the corrugated base plate (1) comprises: A corrugated core layer (103), the corrugated core layer (103) comprising a wavy structure of a plurality of wave crests and a plurality of wave troughs arranged alternately, An upper plate body (101) adhesively fixed to the upper surface of the corrugated core layer by a thermosetting adhesive, the plurality of wave crests being adhesively fixed to the upper plate body, and A lower plate body (102) adhesively fixed to the lower surface of the corrugated core layer by a thermosetting adhesive, the plurality of wave troughs being adhesively fixed to the lower plate body; The panel (2) is adhesively fixed to the upper surface of the upper plate body (101) by a thermosetting or hot-melt adhesive; A floor buckle installation gap is formed between the upper plate body (101) and the lower plate body (102) around the corrugated core layer (103), and a floor buckle (3) welded or adhesively fixed to the upper plate body (101) or / and the lower plate body (102) is installed in the floor buckle installation gap; A panel positioning protrusion (301) is provided on the floor buckle (3), which is higher than the upper surface of the upper plate body (101) and abuts against the side edge of the panel (2) in the horizontal direction.

2. The floorboard according to claim 1, characterized in that, The adhesive for bonding the panel (2) and the corrugated base plate (1) forms a continuous and dense adhesive layer (4) between the panel (2) and the corrugated base plate (1).

3. The floorboard according to claim 2, wherein, The panel (2) and the corrugated base plate (1) are adhesively fixed by means of a hot-melt adhesive film clamped therebetween.

4. The floor board according to claim 1, characterized in that, The corrugated core layer (103) is a metal corrugation, the upper plate body (101) and the lower plate body (102) are metal plates, and the panel (2) is a marble plate, a ceramic tile plate, a wood plate or a plastic plate.

5. The floorboard according to claim 1, characterized in that, The corrugated core layer (103) is a high-temperature resistant plastic.

6. The floorboard according to claim 1, characterized in that, The corrugated base plate (1) is a rectangular plate, and the plurality of wave crests and the plurality of wave troughs are arranged alternately along the width direction of the corrugated base plate (1).

7. A manufacturing method of a floor board as described in any one of claims 1 to 6, characterized in that, Comprising: Coating a liquid thermosetting adhesive on the upper surface of the lower plate body (102) and the lower surface of the upper plate body (101), arranging the corrugated core layer (103) between the lower plate body (102) and the upper plate body (101), applying a clamping force to the lower plate body (102) and the upper plate body (101) to squeeze the corrugated core layer (103), and applying high temperature to cure the thermosetting adhesive, so as to fixedly connect the lower plate body (102), the upper plate body (101) and the corrugated core layer (103); Coating a thermosetting adhesive on the lower surface of the panel (2) or / and the upper surface of the upper plate body (101), arranging the panel (2) against the upper surface of the upper plate body (101), and applying a downward pressure to the panel (2); A heating plate (5) is disposed in abutting contact with the lower surface of the lower plate body (102), and the heat generated by the heating plate (5) is sequentially transmitted through the lower plate body (102), the corrugated core layer (103), and the upper plate body (101) to the thermosetting adhesive between the panel (2) and the upper plate body (101). The thermosetting adhesive between the panel (2) and the upper plate body (101) cures at a high temperature to fixedly connect the panel (2) and the upper plate body (101).

8. A manufacturing method of a floorboard as described in any one of claims 1 to 6, characterized in that, Comprising: A liquid thermosetting adhesive is coated on the upper surface of the lower plate body (102) and the lower surface of the upper plate body (101). A corrugated core layer (103) is disposed between the lower plate body (102) and the upper plate body (101). A clamping force is applied to the lower plate body (102) and the upper plate body (101) to approach each other to squeeze the corrugated core layer (103). A high temperature is applied to cure the thermosetting adhesive, thereby fixedly connecting the lower plate body (102), the upper plate body (101), and the corrugated core layer (103). A hot melt adhesive film (6) is clamped between the panel (2) and the upper plate body (101). A heating plate (5) is disposed in abutting contact with the lower surface of the lower plate body (102). The heat generated by the heating plate (5) is sequentially transmitted through the lower plate body (102), the corrugated core layer (103), and the upper plate body (101) to the hot melt adhesive film. The hot melt adhesive film melts at a high temperature. The heat of the heating plate (5) is removed, and the melted hot melt adhesive film cures at a low temperature, thereby fixedly connecting the panel (2) and the upper plate body (101).

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