Semiconductor process execution method and semiconductor process equipment

Abstract

This invention provides a semiconductor process execution method, applied in semiconductor process equipment, characterized by comprising: receiving a process recipe corresponding to the current process and storing it locally; receiving process information of the current process and creating a process task, wherein the process information includes the name of the process recipe; storing the process recipe and the process information in memory; deleting the locally stored process recipe; and calling the process recipe based on the process information to execute the process task. In this invention, after receiving the process recipe, the host control device directly transfers the process recipe from local storage to memory and deletes the locally stored process recipe. Operators cannot read or modify the process recipe stored in memory through the operating system of the host control device, thereby improving the confidentiality of the process recipe and the security of the semiconductor manufacturing process. This invention also provides a semiconductor process equipment.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a semiconductor process execution method and a semiconductor process equipment. Background Art

[0002] Semiconductor process equipment usually includes a lower-level control device (such as a lower-level computer, generally implemented based on a PLC) for controlling the equipment hardware to perform various semiconductor processes, and an upper-level control device (such as an upper-level computer, generally implemented based on a PC) for controlling the lower-level control device.

[0003] In different semiconductor processes, the processes that the wafers go through in the semiconductor process equipment are also different. The upper control device usually downloads the process parameters of the wafers processed in multiple process tanks to the local memory (such as a hard disk) before the semiconductor process starts, so that the upper control device and the lower control device can read the process to be executed from the memory. In this way, there is a risk of leakage of the process parameter information; the process parameter information may also be improperly modified, resulting in serious accidents in subsequent processes. Summary of the invention

[0004] The present invention aims to provide a semiconductor process execution method and a semiconductor process equipment, wherein the semiconductor process execution method can improve the confidentiality of the process recipe and the security of the semiconductor production process.

[0005] To achieve the above object, as one aspect of the present invention, a semiconductor process execution method is provided, which is applied to semiconductor process equipment and is characterized by comprising:

[0006] Receive the process formula corresponding to the current process and store it locally;

[0007] receiving process information of the current process and creating a process task, wherein the process information includes the name of the process recipe;

[0008] Storing the process recipe and the process information in a memory;

[0009] Deleting the process recipe stored locally;

[0010] The process recipe is called based on the process information to execute the process task.

[0011] Preferably, the process recipe includes: process execution parameters of each process module in the semiconductor process equipment.

[0012] Preferably, deleting the locally stored process recipe includes:

[0013] Receive process recipe deletion instructions;

[0014] According to the process recipe deletion instruction, the locally stored process recipe is deleted.

[0015] Preferably, the method further comprises:

[0016] If the process task is not completed, the process recipe is received again and stored locally.

[0017] Preferably, the method further comprises:

[0018] If the process task is completed, the process recipe stored in the memory is deleted.

[0019] As a second aspect of the present invention, there is provided a semiconductor process equipment, comprising an upper control device, a lower control device, and a process module, characterized in that:

[0020] The upper control device is used to receive the process formula corresponding to the current process and store it locally; receive the process information of the current process and create a process task, wherein the process information includes the name of the process formula; store the process formula and the process information in the memory; delete the process formula stored locally; call the process formula based on the process information, and control the process module to execute the process task through the lower control device.

[0021] Preferably, the process recipe includes: process execution parameters of each of the process modules.

[0022] Preferably, the upper control device is further used to receive a process recipe deletion instruction; and delete the locally stored process recipe according to the process recipe deletion instruction.

[0023] Preferably, the upper control device is further used to receive the process recipe again and store it locally when the process task is not completed.

[0024] Preferably, the upper control device is also used to delete the process recipe stored in the memory when the process task is completed.

[0025] In the semiconductor process execution method and semiconductor process equipment provided by the present invention, after receiving the process formula, the upper control device directly transfers the process formula from the local to the memory and deletes the locally stored process formula. When the upper control device and the lower control device execute the semiconductor process, the relevant process parameters are directly read from the memory of the upper control device. The operator cannot read or change the process formula stored in the memory through the operating system of the upper control device, thereby improving the confidentiality of the process formula and the security of the semiconductor production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 is a schematic diagram of a structure of a cleaning machine device provided by an embodiment of the present invention;

[0028] Figure 2 It is a schematic diagram of a process flow of a cleaning machine device provided by an embodiment of the present invention performing a semiconductor process;

[0029] Figure 3 It is a flowchart of a semiconductor process execution method provided by an embodiment of the present invention;

[0030] Figure 4 is a flow chart of a semiconductor process execution method provided by another embodiment of the present invention;

[0031] Figure 5 It is a flowchart of a semiconductor process execution method provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0032] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0033] In the actual production process, in order to efficiently control the production rhythm, the semiconductor process equipment in the factory is usually connected to the management platform. For example, the semiconductor process equipment communicates with the management platform through the factory communication terminal device (FAB), and downloads the various process parameters that must be executed by the current batch of wafers to the memory of the upper control device of the semiconductor process equipment through the S7F23 instruction. The process parameters are stored in the memory of the upper control device in the subsequent semiconductor process until the process parameters of the subsequently loaded wafers are different from those of the previous batch, and then the currently stored process parameters are deleted and the new process parameter information is downloaded again by the management platform.

[0034] However, the inventors of the present invention have found in their research that the management scheme of the process parameters has a great safety hazard: taking the typical control architecture of the factory end, the host computer, and the slave computer as an example, when an abnormality occurs in the semiconductor process (for example, the semiconductor process equipment is abnormally down), the operator is usually required to actively investigate the abnormality by operating the operating system of the host computer or control the slave computer to resume normal operation. In this case, the operator can directly view the process parameters stored in the memory of the host computer through the operating system of the host computer, resulting in the risk of leakage of the process parameter information; the operator may even accidentally change the process parameters stored in the memory, resulting in serious safety accidents in the subsequent semiconductor process of the chip.

[0035] In order to solve the above technical problems, as one aspect of the present invention, a semiconductor process execution method is provided, which is applied to semiconductor process equipment. Preferably, the semiconductor process execution method can be implemented by a host control device (such as a host computer) of the semiconductor process equipment, such as Figure 3 As shown, the method includes:

[0036] S1. Receive the process formula corresponding to the current process and store it locally;

[0037] S2. Receive process information of the current process and create a process task, wherein the process information includes the name of the process recipe;

[0038] S3, storing the process formula and process information in the memory;

[0039] S4. Delete the locally stored process recipe;

[0040] S5. Based on the process information, the process recipe stored in the memory is called to execute the process task.

[0041] The embodiment of the present invention does not specifically limit the types of hardware referred to by the above-mentioned local and memory. For example, as an implementation mode of the present invention, when the upper control device is a computer, the local may refer to the hard disk of the upper control device, and the memory may be the RAM memory of the upper control device.

[0042] In an embodiment of the present invention, after receiving the process formula, the upper control device directly transfers the process formula from the local to the memory and deletes the locally stored process formula. When the upper control device and the lower control device execute the process task, the relevant process parameters are directly read from the memory. The operator cannot read or change the process formula stored in the memory through the operating system of the upper control device, thereby improving the confidentiality of the process formula and the security of the semiconductor production process.

[0043] The embodiment of the present invention does not specifically limit the machine to which the above-mentioned upper-level control device is applied. For example, the above-mentioned upper-level control device can be applied to a cleaning machine.

[0044] To improve the stability of semiconductor process, preferably, Figure 4 As shown, step S2 may include:

[0045] S21, verify whether the process formula is successfully received, if the process formula is successfully received, proceed to the next step, if the process formula is not successfully received, re-execute step S1;

[0046] S22. Create a task according to the process information and verify whether the task is successfully created. If the verification passes, proceed to the next step. If the verification fails, re-execute step S22.

[0047] To improve the management efficiency of factory equipment, it is preferred that Figure 5 As shown, step S4 of deleting the locally stored process recipe includes:

[0048] S41, receiving a process recipe deletion instruction;

[0049] S42. Delete the locally stored process recipe according to the process recipe deletion instruction.

[0050] In an embodiment of the present invention, after the upper control device transfers the process formula from the local to the memory, the management platform can send a deletion instruction to the upper control device (through the factory communication terminal device), so that the upper control device deletes the locally stored process formula, thereby preventing unknown persons from plagiarizing the factory's process formula when accessing local files through the upper computer's operating system, thereby improving the confidentiality of the stored process formula.

[0051] like Figure 1 The figure shows a schematic diagram of the structure of a cleaning machine in the prior art, including: a loading platform (LoadPort), a wafer storage box docking assembly (PDO), a wafer storage box robot (FOUP Robot), a buffer (Stocker), a wafer robot (WTS), a process robot (Process Robot), a process tank (Tank), and a process robot cleaning tank, wherein:

[0052] The loading platform (LoadPort) is the port for loading and unloading materials. It is divided into LoadPort1 and LoadPort2. The FOUP for loading materials (wafers) can be placed on it. Each FOUP has 25 slots and can store 25 wafers. The E84Control module is installed inside the loading platform to communicate with the factory automatic material handling system (OHT) to achieve fully automated production in the factory. There is also a grating sensor on the top of the loading platform to protect operators during the automated production process.

[0053] The wafer box docking assembly (PDO) is a module that realizes the opening and closing of the wafer box door and realizes the scanning (Mapping) function. When the material enters the machine and is placed on the wafer box docking assembly, the wafer box docking assembly performs the door opening operation and scans the 25 wafer slots in the wafer box through two scanning sensors (Mapping Sensors), and reports the scanning results to the factory for verification. When the material is about to be moved out of the machine, it is also scanned (Mapping) again through the wafer box docking assembly to avoid material residue and abnormal wafer placement.

[0054] The FOUP Robot is responsible for the transfer of FOUPs. It is mainly used to achieve: when materials are loaded (CarrierIn), the FOUP is transferred from the loading platform to the FOUP docking assembly or buffer (Stocker); when materials are unloaded (CarrierOut), the materials are transferred from the FOUP docking assembly or buffer (Stocker) to the loading platform; when materials are held by the factory due to discrepancies in accounts or other reasons, the abnormal FOUP is transferred to the buffer (Stocker) or removed from the machine;

[0055] The buffer (Stocker) is used to temporarily place the stocker. A maximum of 16 stockers can be placed on the buffer. The component on the buffer where the stockers are placed is called a Shelf. Each Shelf has a sensor that can detect whether there is a stocker currently. This component is mainly used to support the simultaneous running (Run) of multiple tasks (Job);

[0056] The wafer robot (WTS) is responsible for the transfer of wafers, mainly responsible for transferring wafers between the wafer storage box and the wafer carrier (Process Carrier). A wafer carrier can store up to 2 wafer storage boxes with a total of 50 wafers, and is the basic unit of semiconductor process equipment to perform semiconductor processes;

[0057] The process robot is responsible for transferring the wafer carrier between each process tank.

[0058] Nine process tanks are used to perform corresponding process operations. Usually, process tanks Tank1, Tank3, Tank5, and Tank7 are acid or alkali process tanks, respectively, process tanks Tank2, Tank4, Tank6, and Tank8 are water tanks, and process tank Tank9 is a drying process tank. The wafer carrier enters each process tank under the transmission of the process robot and performs corresponding operations, and finally passes through the drying process tank after drying and out of the machine.

[0059] Since the chemicals in different process tanks are not exactly the same, in order to avoid contamination between the chemicals, the cleaning machine equipment also includes a robot cleaning tank. When the process robot needs to enter different process tanks, the process robot is first controlled to enter the process robot cleaning tank to clean the residual chemical liquid on the robot.

[0060] The recipe information (Recipe) downloaded by the upper control device usually includes wafer transfer flow information (Flow Recipe) and process flow information (Process Recipe). The wafer transfer flow information (Flow Recipe) mainly includes the path that the wafer carrier (Process Carrier) carrying the wafer needs to transfer between multiple process slots, while the process flow information (Process Recipe) is associated with a specific process slot, including information such as the process steps and process time that the wafer needs to perform in each process slot. The inventor found in the study that the wafer transfer flow information in different recipe information can usually be reused and is not highly confidential. Therefore, the process flow information (Process Recipe) is the main thing that needs to be kept confidential in the recipe information, that is, the retention time of the process flow information in the local area needs to be reduced as much as possible.

[0061] In order to improve the confidentiality of recipe information and improve the efficiency of semiconductor processes, preferably, the process recipe includes at least: process execution parameters of each process module in the semiconductor process equipment (i.e., process flow information (Process Recipe)), which may specifically include information such as the process steps and process time that the wafer needs to execute in each process tank.

[0062] In the embodiment of the present invention, in step S4, only the process flow information in the recipe information stored locally can be deleted, and the transmission flow information (Flow Recipe) can be retained, which reduces the operation time of deleting the recipe information and further improves the task execution efficiency.

[0063] In order to improve the safety of semiconductor processes and prevent the interruption of semiconductor process tasks due to abnormal situations from affecting the production rhythm of the factory, preferably, the semiconductor process execution method may also include the following steps after executing the process task (step S5):

[0064] S61. If the process task is not completed, the process recipe is received again and stored locally.

[0065] The embodiment of the present invention does not specifically limit how to process the information in the memory after completing the semiconductor production task. For example, the semiconductor process execution method may also include the following steps after executing the process task (step S5):

[0066] S62. If the process task is completed, the process recipe stored in the memory is deleted.

[0067] As a second aspect of the present invention, a host control device is provided, which includes a computer-readable storage medium and a processor, wherein a wafer processing control program is stored in the computer-readable storage medium. When the processor runs the wafer processing control program in the computer-readable storage medium, the host control device can execute the semiconductor process execution method provided in the previous embodiment.

[0068] After receiving the process formula, the upper control device provided by the embodiment of the present invention directly transfers the process formula from the local to the memory. When the upper control device and the lower control device execute the semiconductor process, the relevant process parameters are directly read from the memory of the upper control device. The operator cannot read or change the process formula stored in the memory through the operating system of the upper control device, thereby improving the confidentiality of the process formula and the security of the semiconductor production process.

[0069] As a third aspect of the present invention, a process recipe management method is provided, the process recipe management method is executed by a factory communication terminal device, and the process recipe management method includes:

[0070] Download the process recipe of the current process and send the process recipe to the upper control device;

[0071] Send the process information of the current process to the upper control device.

[0072] In order to improve the confidentiality of the process formula, preferably, the process formula management method further includes:

[0073] A deletion instruction is sent to the upper control device to control the upper control device to delete the process recipe stored locally in the upper control device.

[0074] As a fourth aspect of the present invention, a factory communication terminal device is provided, which includes a computer-readable storage medium and a processor, wherein a process recipe management program is stored in the computer-readable storage medium. When the processor runs the process recipe management program in the computer-readable storage medium, the factory communication terminal device can execute the process recipe management method provided in the previous embodiment.

[0075] The embodiment of the present invention does not specifically limit the device software in the upper control device. Taking the upper computer as an example, the upper computer can be installed with a factory information console (FAConsole) for information communication and instruction decoding with the factory communication terminal device (FAB), upper computer software for executing software scheduling algorithms and task management, and lower computer software for directly controlling the device hardware.

[0076] In order to improve the cohesion of the software and reduce the coupling relationship, preferably, taking the architecture of the factory end, the host computer and the slave computer as an example, in the embodiment of the present invention, only the host computer software is processed, and the interface of the factory information console (FAConsole) and the slave computer is kept unchanged. When the management platform sends the download recipe information (DownLoadRecipe) instruction through the factory communication terminal device, the factory information console (FAConsole) parses the downloaded recipe information and calls the interface of the host computer to store the recipe information locally in the upper control device. When the management platform sends the recipe information, the host computer stores the process information and the corresponding recipe information of the semiconductor process task in the system memory. When the task starts, the host computer and the slave computer both obtain the recipe information from the memory of the host computer.

[0077] After the host computer deletes the recipe information stored locally in response to a deletion instruction (or only deletes part of the recipe information, such as the process recipe), if an equipment failure occurs during the semiconductor process, causing the equipment to shut down, the task to be abnormally interrupted, and the equipment to be unable to resume automatic operation, the operators in the factory need to manually operate the host control device through the operating system to notify the factory side, so that the factory side re-downloads the recipe information of the remaining processes to the host control device so that the equipment can continue to complete the remaining processes.

[0078] To facilitate understanding by those skilled in the art, the embodiment of the present invention further provides a specific process for executing the above-mentioned semiconductor process execution method and recipe information management method:

[0079] (1) The factory communication terminal device dispatches the film storage box to the machine (including the upper control device and the lower control device), and completes two related information verifications (such as Figure 2 As shown, after checking whether the wafer can be loaded on the loading platform (LoadPort) and the scanning result of the wafer storage box docking component (PDO), the wafer storage box is placed on the Shelf in the buffer zone and waits for the factory management platform to send the recipe information.

[0080] (2) The factory communication device downloads the process recipe information (Process Recipe) that needs to be executed for the batch of wafers to the machine through the S7F23 command, which corresponds to the existing wafer transmission flow information (Flow Recipe) of the machine. If the download fails, the abnormality will be reported and the recipe information will be downloaded again.

[0081] (3) After the machine successfully creates a task, it stores the recipe information in the memory of the upper control device and waits for the arrangement of the corresponding scheduling software in the upper control device.

[0082] (4) The factory communication device sends a deletion command S7F17, and the machine deletes the corresponding recipe information stored locally according to the command (only the process flow information (Process Recipe) can be deleted, and the chip transfer flow information (Flow Recipe) is still stored locally).

[0083] (5) After the task is started, the upper control device and the lower control device directly obtain the corresponding recipe information from the system memory and execute the operations recorded in the recipe information.

[0084] (6) When the equipment crashes abnormally, since there is no recipe information stored locally (or no process recipe stored), the operator cannot directly view the complete recipe information of the remaining processes through the software, and thus cannot continue to manually start the semiconductor process. At this time, the operator needs to notify the factory communication device on the factory dispatch software interface to download the unexecuted recipe information (or process recipe) again. After the operator completes the manual execution, the equipment will automatically handle the abnormal crash.

[0085] (7) After the process is completed, the wafer box is automatically transferred out of the machine to the loading platform. The factory dispatches an automatic material conveying system to take the wafer box away. After the wafer box leaves the machine, the upper control device automatically deletes the recipe information temporarily stored in the memory.

[0086] As a fifth aspect of the present invention, there is provided a semiconductor process equipment, comprising an upper control device, a lower control device and a process module, wherein the upper control device is used to: receive a process formula corresponding to a current process and store it locally; receive process information of the current process and create a process task, wherein the process information includes the name of the process formula; store the process formula and the process information in a memory; delete the locally stored process formula; call the process formula based on the process information, and control the process module to execute the process task through the lower control device.

[0087] The embodiment of the present invention does not specifically limit the type of process that the semiconductor process equipment is used to perform. For example, the semiconductor process equipment may be a cleaning machine for cleaning wafers, and the process module may include multiple cleaning tanks. In the semiconductor process equipment provided by the embodiment of the present invention, after receiving the process formula, the upper control device directly transfers the process formula from the local to the memory. When the upper control device and the lower control device execute the semiconductor process, the relevant process parameters are directly read from the memory. The operator cannot read or change the process formula stored in the memory through the operating system of the upper control device, thereby improving the safety of the process formula and the safety of the semiconductor production process.

[0088] To enhance the confidentiality of recipe information and improve the efficiency of semiconductor processes, preferably, the process recipe includes: process execution parameters of each process module (i.e., process flow information), which may specifically include information such as the process steps and process time that the wafer needs to execute in each process tank.

[0089] In the embodiment of the present invention, the upper control device only deletes the process flow information in the recipe information stored locally and retains the transmission flow information (Flow Recipe), thereby reducing the operation time of deleting the recipe information and improving the task execution efficiency.

[0090] In order to improve the management efficiency of factory equipment, preferably, the upper control device is also used to receive a process recipe deletion instruction (issued by the management platform); and delete the locally stored process recipe according to the process recipe deletion instruction.

[0091] In an embodiment of the present invention, after the upper control device transfers the process formula from the local to the memory, the management platform can send a deletion instruction to the upper control device (through the factory communication terminal device), so that the upper control device deletes the locally stored process formula, thereby preventing unknown persons from plagiarizing the factory's process formula when accessing local files through the upper computer's operating system, thereby improving the confidentiality of the stored process formula.

[0092] In order to improve the safety of semiconductor processes and avoid interruptions of semiconductor process tasks due to abnormal situations affecting the factory's production rhythm, preferably, the upper control device is also used to receive the process recipe again and store it locally when the process task is not completed.

[0093] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A semiconductor process execution method, applied to semiconductor process equipment, characterized in that: include: Receive the process formula corresponding to the current process and store it locally; receiving process information of the current process and creating a process task, wherein the process information includes the name of the process recipe; Storing the process recipe and the process information in a memory; Deleting the process recipe stored locally; Calling the process recipe based on the process information to execute the process task, the process recipe including wafer transmission flow information and process flow information; The locally stored process recipe is deleted, and only the process flow information in the locally stored process recipe is deleted, and the wafer transmission flow information is retained.

2. The method according to claim 1, characterized in that The process recipe includes: process execution parameters of each process module in the semiconductor process equipment.

3. The method according to claim 2, characterized in that The deleting the locally stored process recipe includes: Receive process recipe deletion instructions; According to the process recipe deletion instruction, the locally stored process recipe is deleted.

4. The method according to any one of claims 1 to 3, characterized in that Also includes: If the process task is not completed, the process recipe is received again and stored locally.

5. The method according to any one of claims 1 to 3, characterized in that: Also includes: If the process task is completed, the process recipe stored in the memory is deleted.

6. A semiconductor process equipment, comprising an upper control device, a lower control device, and a process module, characterized in that: The upper control device is used to receive the process formula corresponding to the current process and store it locally; Receive process information of the current process and create a process task, wherein the process information includes the name of the process recipe; store the process recipe and the process information in a memory; delete the locally stored process recipe; call the process recipe based on the process information, and control the process module to execute the process task through the lower control device, wherein the process recipe includes wafer transmission flow information and process flow information; The upper control device is also used to delete only the process flow information in the locally stored process recipe when deleting the locally stored process recipe, and retain the wafer transmission flow information.

7. The semiconductor process equipment according to claim 6, characterized in that: The process recipe includes: process execution parameters of each process module.

8. The semiconductor process equipment according to claim 7, characterized in that: The upper control device is also used to receive a process recipe deletion instruction; and delete the locally stored process recipe according to the process recipe deletion instruction.

9. The semiconductor process equipment according to any one of claims 6 to 8, characterized in that: The upper control device is also used to receive the process recipe again and store it locally when the process task is not completed.

10. The semiconductor process equipment according to any one of claims 6 to 8, characterized in that: The upper control device is also used to delete the process recipe stored in the memory when the process task is completed.

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