A microenvironment control system for wafer production

Abstract

The present invention discloses a microenvironment control system for wafer production, comprising a built-in display screen, a left grip, a panel, buttons, a switch button, a control seat, a right grip, a top inlay, a heat dissipation mechanism and a twisting ring. The present invention optimizes the heat dissipation mechanism, and adds an integral structure for cooperating with heat dissipation at the inner side end of the control seat. The large heat dissipation silica gel and the small heat dissipation silica gel body have the function of efficient heat dissipation. The large heat conductive sheet and the small heat conductive sheet form corresponding flow guide channels, and a matching structure for guiding heat discharge is formed at the side end, so that the use effect is good. The adjustment component is optimized, and a simple threaded rod is at the side end of the control seat. By twisting the twisting ring, the threaded rod can be driven to push the large heat conductive sheet, so that it rotates around a rotating column for adjustment, and the airflow adjustment and guiding effect is good.

Description

Technical Field

[0001] The present invention relates to the field related to wafer production technology, and in particular to a microenvironment control system used in wafer production. Background Art

[0002] Wafer refers to the substrate (also called base chip) for manufacturing semiconductor transistors or integrated circuits. Because it is a crystalline material and its shape is round, it is called a wafer. The substrate materials include silicon, germanium, GaAs, InP, GaN, etc. Since silicon is the most commonly used, if the crystalline material is not specifically specified, it usually refers to silicon wafer. Various circuit component structures can be processed on the silicon wafer to become an integrated circuit product with specific electrical functions. Wafer production, due to the rapid development of semiconductor technology in recent years, the size of the wafer has increased from the early 5 inches, 6 inches, 8 inches to the current 12 inches, and the increase in the wafer size also represents the increase in chip production capacity and the reduction in cost. With the development of different wafer sizes, there will be production equipment used to make wafers of that era. The microenvironment control system used in wafer production needs to be used in conjunction with the corresponding device. Therefore, microenvironment control is particularly important in wafer production.

[0003] When in use, since the wafer production requires the use of corresponding control devices, the internal shell will inevitably generate heat after long-term work. Although a cooling fan was installed inside in the past, the heat dissipation effect of the structure and it was general, and it was difficult to form a matching structure at the side end to facilitate the guidance of heat discharge, and the airflow adjustment and guiding effect was general. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] Therefore, in order to solve the above-mentioned shortcomings, the present invention provides a microenvironment control system for wafer production.

[0006] (II) Technical solution

[0007] The present invention is implemented in this way: a microenvironment control system for wafer production is constructed, the device includes a built-in display screen, a left grip, a panel, a button, a switch button, a control seat, a right grip, a top embedded opening, a heat dissipation mechanism and a twisting ring, the built-in display screen is fastened to the control seat, the left grip and the right grip are locked and installed on the left and right side ends of the control seat, the panel is embedded with a button, the button is located on the left side of the switch button, the top embedded opening is prefabricated on the control seat, the twisting ring is installed on the left side of the control seat, and the heat dissipation mechanism is embedded and installed in the control seat. In the control seat, the heat dissipation mechanism includes an outer shell, an inner heat dissipation port, a large heat dissipation silicone, a large heat conductive sheet, a rotating column, an air outlet, a small heat conductive sheet, a small heat dissipation silicone and an adjustment component. The right side of the outer shell is prefabricated with an inner heat dissipation port, and the inner heat dissipation port is connected to the inside of the control seat. The left side of the large heat dissipation silicone is bonded and installed on the large heat conductive sheet. The large heat conductive sheet is rotatably installed in the outer shell through the rotating column. The air outlet is prefabricated on the left side of the outer shell. The small heat conductive sheet is bonded and installed with a small heat dissipation silicone. The right side of the adjustment component is in contact with the large heat conductive sheet.

[0008] Preferably, the adjustment assembly includes a threaded rod, an internal threaded seat and a gasket, the left side of the threaded rod is welded to the screwing ring, the threaded rod is threadedly connected to the internal threaded seat, the right side of the threaded rod is fastened with a gasket, and the gasket is located inside the control seat.

[0009] Preferably, the control seat includes a control seat body, a first fixed plate, a second fixed plate, an anti-slip inner plate and a grab opening, the first fixed plate is inserted and fixed in the control seat body, the second fixed plate has the same structure as the first fixed plate, the anti-slip inner plate is fitted onto the second fixed plate, the grab opening is an integrated structure with the control seat body, and a left grab is fastened to the grab opening.

[0010] Preferably, the rotating column is a cylindrical structure, and the thickness of the large heat dissipation silica gel is greater than five millimeters.

[0011] Preferably, the large heat dissipation silica gel is installed in a Z shape, and the small heat dissipation silica gel is installed in a Z shape.

[0012] Preferably, the threaded rod is threadably connected to the control seat.

[0013] Preferably, the inner heat dissipation port is a rectangular opening, and the air outlet is a rectangular opening.

[0014] Preferably, a large heat conducting sheet and a small heat conducting sheet are sequentially installed on the shell from top to bottom, and the installation angle between the adjustment component and the shell is ninety degrees.

[0015] Preferably, the right handle is made of plastic, which has good insulation and light weight.

[0016] Preferably, the rotating column is made of stainless steel and has strong rust resistance.

[0017] (III) Beneficial effects

[0018] Compared with the prior art, the present invention provides a microenvironment control system for wafer production, which has the following beneficial effects:

[0019] Advantage 1: The microenvironment control system used in wafer production described in the present invention optimizes the heat dissipation mechanism and adds an overall structure for heat dissipation at the inner side of the control seat. The large heat dissipation silicone and the small heat dissipation silicone body have the function of efficient heat dissipation. The large heat conductive sheet and the small heat conductive sheet form corresponding guide channels, and a matching structure is formed at the side end to facilitate the heat discharge, and the use effect is good.

[0020] Advantage 2: The microenvironment control system used in wafer production described in the present invention has an optimized adjustment component. A simple threaded rod is located at the side end of the control seat. By turning the turning ring, the threaded rod can push the large heat conductive plate to rotate around the rotating column for adjustment, and the airflow adjustment and guiding effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the structure of the control seat of the present invention;

[0023] Figure 3 It is a schematic diagram of the heat dissipation mechanism structure of the present invention;

[0024] Figure 4 is a side view of the present invention;

[0025] Figure 5 The present invention Figure 3 A partial enlarged view of point A in the middle.

[0026] Among them: built-in display screen-1, left grip-2, panel-3, button-4, switch button-5, control seat-6, right grip-7, top embedding-8, heat dissipation mechanism-9, twisting ring-10, shell-901, inner heat dissipation port-902, large heat dissipation silicone-903, large heat conductive sheet-904, rotating column-905, air outlet-906, small heat conductive sheet-907, small heat dissipation silicone-908, adjustment component-909, threaded rod-9091, internal thread seat-9092, gasket-9093, control seat body-601, first fixed plate-602, second fixed plate-603, anti-slip inner plate-604, grip opening-605. DETAILED DESCRIPTION

[0027] The following will be combined with the attached Figure 1-5The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Please refer to Figure 1 , Figure 2 and Figure 4 The present invention provides a microenvironment control system for wafer production by improvement, including a built-in display screen 1, a left grip 2, a panel 3, a key 4, a switch button 5, a control seat 6, a right grip 7, a top inlay 8 ( Figure 2 )、Heat dissipation mechanism 9( Figure 2 ) and twist ring 10( Figure 4 ), the built-in display screen 1 is fixedly installed on the control seat 6, the left handle 2 and the right handle 7 are locked and installed on the left and right sides (sides) of the control seat 6, the panel 3 is embedded with a button 4, the button 4 is located on the left side of the switch button 5, the top embedding opening 8 is prefabricated on the control seat 6, the turning ring 10 is installed on the left side surface of the control seat 6, and the heat dissipation mechanism 9 is embedded and installed in the control seat 6.

[0029] Please refer to Figure 3 The heat dissipation mechanism 9 includes a shell 901, an inner heat dissipation port 902, a large heat dissipation silica gel 903, a large heat conductive sheet 904, a rotating column 905, an air outlet 906, a small heat conductive sheet 907, a small heat dissipation silica gel 908 and an adjustment component 909. The right side of the shell 901 is prefabricated with an inner heat dissipation port 902, which is connected to the inside of the control seat 6, and the left side of the large heat dissipation silica gel 903 is bonded and installed on the large heat conductive sheet 904. The large heat conductive sheet 904 is rotatably installed in the shell 901 through the rotating column 905, which is convenient for adjusting the tilt direction of the plate body. The air outlet 906 is prefabricated on the left side of the shell 901. The small heat conductive sheet 907 is bonded with a small heat dissipation silica gel 908. The right side of the adjustment component 909 is in contact with the large heat conductive sheet 904, which is convenient for adjusting by using the gasket 9093.

[0030] like Figure 3 As shown, the large heat dissipation silicone 903 and the large heat conductive sheet 904 have a common section facing the air outlet 906. Similarly, the small heat conductive sheet 907 and the small heat dissipation silicone 908 have a common section facing the air outlet 906, so as to achieve better thermal conductivity and heat dissipation effects.

[0031] like Figure 3 As shown, the structures of the large heat dissipation silicone 903 and the large heat conductive sheet 904 are mostly oriented toward the inner heat dissipation opening 902. Similarly, the structures of the small heat conductive sheet 907 and the small heat dissipation silicone 908 are mostly oriented toward the inner heat dissipation opening 902, so as to achieve better heat conduction and heat dissipation effects.

[0032] Combining the above two aspects, it can be known that the large heat dissipation silica gel 903 , the large heat conductive sheet 904 , the small heat conductive sheet 907 and the small heat dissipation silica gel 908 are arranged between the air outlet 906 and the inner heat dissipation outlet 902 .

[0033] Please refer to Figure 5 Furthermore, the adjustment component 909 includes a threaded rod 9091, an internal threaded seat 9092 and a gasket 9093. The left side of the threaded rod 9091 is welded to the screwing ring 10, the threaded rod 9091 is threadedly connected to the internal threaded seat 9092, and the right side of the threaded rod 9091 is fastened with a gasket 9093, and the gasket 9093 is located inside the control seat 6.

[0034] Please refer to Figure 4 Further, the control seat 6 includes a control seat body 601, a first fixed plate 602, a second fixed plate 603, an anti-skid inner plate 604 and a gripping opening 605. The first fixed plate 602 is inserted and fixed in the control seat body 601. The second fixed plate 603 has the same structure as the first fixed plate 602. The anti-skid inner plate 604 is fitted on the second fixed plate 603. The gripping opening 605 is an integrated structure with the control seat body 601. The left gripping handle 2 is fastened on the gripping opening 605. The anti-skid inner plate 604 has a rough surface and plays a corresponding anti-skid role.

[0035] Further, such as Figure 3 As shown, the rotating column 905 is a cylindrical structure, and the thickness of the large heat dissipation silicone 903 is greater than five millimeters, which is convenient for forming a corresponding heat dissipation system inside.

[0036] Further, such as Figure 3 As shown, the large heat dissipation silicone 903 is installed in a Z shape, and the small heat dissipation silicone 908 is installed in a Z shape, so as to enhance the heat dissipation area.

[0037] Further, combined with reference Figure 2 , Figure 3 and Figure 5 The threaded rod 9091 is threadedly connected to the control seat 6, and the coordinated adjustment effect is good.

[0038] Furthermore, in this embodiment, the inner heat dissipation opening 902 is a rectangular opening, and the air outlet 906 is a rectangular opening.

[0039] For further information, please refer to Figure 3 A large heat conducting sheet 904 and a small heat conducting sheet 907 are sequentially installed on the housing 901 from top to bottom, and the installation angle between the adjustment component 909 and the housing 901 is ninety degrees.

[0040] Furthermore, the right handle 7 is made of plastic, which has good insulation and light weight.

[0041] Furthermore, the rotating column 905 is made of stainless steel and has strong rust resistance.

[0042] The present invention provides a microenvironment control system for wafer production through improvement, and the working principle is as follows:

[0043] First, during assembly, the control seat body 601 ( Figure 2 ) A heat dissipation mechanism 9 is provided inside the left side ( Figure 2 ), the main board and the corresponding heat dissipation fan (not shown) are embedded in the first fixed plate 602 and the second fixed plate 603, and the heat dissipation of the heat dissipation fan should be directed toward the side of the additional heat dissipation mechanism 9, so that when the heat dissipation fan is working, the heat inside the control seat body 601 is sent to the left;

[0044] Second, heat enters the interior of the housing 901 through the inner heat dissipation port 902. At this time, the large heat dissipation silicone 903 and the small heat dissipation silicone 908 have the function of efficient heat dissipation. The large heat conductive sheet 904 can be screwed by the screwing ring 10, so that the threaded rod 9091 cooperates with the housing 901 and the internal threaded seat 9092 to achieve progressive displacement on the control seat body 601, thereby pushing the large heat conductive sheet 904 to adjust its position around the rotating column 905, thereby achieving better heat dissipation adjustment;

[0045] Third, the heat is sent to the left through the large heat conducting sheet 904 and the small heat conducting sheet 907, and finally discharged through the air outlet 906;

[0046] Fourth, when controlling the use, press the button 4 and the switch button 5 on the panel 3 to operate, and the built-in display screen 1 can display the corresponding operation information feedback. The right handle 7 and the left handle 2 are convenient for fixing the control seat 6 as a whole during installation.

[0047] The present invention provides a microenvironment control system for wafer production through improvement. The heat dissipation mechanism 9 is optimized and arranged, and an overall structure for heat dissipation is added to the inner side end of the control seat 6. The large heat dissipation silicone 903 and the small heat dissipation silicone 908 have the function of efficient heat dissipation. The large heat conductive sheet 904 and the small heat conductive sheet 907 form corresponding guide channels, and a matching structure for guiding heat discharge is formed at the side end, which has a good use effect. The adjustment component 909 is optimized and arranged, and a simple threaded rod 9091 is at the side end of the control seat 6. The threaded rod 9091 can be driven by twisting the twisting ring 10 to push the large heat conductive sheet 904, so that it rotates around the rotating column 905 for adjustment, and the airflow adjustment and guiding effect is good.

[0048] The above shows and describes the basic principle, main features and advantages of the present invention, and the standard parts used in the present invention can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0049] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A microenvironment control system for wafer production, comprising a built-in display screen (1), a left grip (2), a panel (3), a button (4), a switch button (5), a control seat (6), a right grip (7), a top embedding opening (8) and a twisting ring (10), wherein the built-in display screen (1) is fixedly mounted on the control seat (6), the left grip (2) and the right grip (7) are fixedly mounted on the left and right side ends of the control seat (6), the panel (3) is embedded with a button (4), the button (4) is located on the left side of the switch button (5), the top embedding opening (8) is prefabricated on the control seat (6), and the twisting ring (10) is mounted on the left side surface of the control seat (6); Features: It also includes a heat dissipation mechanism (9), which is embedded and installed in the control seat (6). The heat dissipation mechanism (9) includes an outer shell (901), an inner heat dissipation port (902), a large heat dissipation silica gel (903), a large heat conductive sheet (904), a rotating column (905) and an air outlet (906). The right side of the outer shell (901) is prefabricated with an inner heat dissipation port (902), and the inner heat dissipation port (902) is connected to the inside of the control seat (6). The left side of the large heat dissipation silica gel (903) is bonded and installed on the large heat conductive sheet (904). The large heat conductive sheet (904) is rotatably installed in the outer shell (901) through the rotating column (905). The air outlet (906) is prefabricated on the left side of the outer shell (901); The large heat dissipation silica gel (903) and the large heat conductive sheet (904) have a common structure facing the air outlet (906); The structures of the large heat dissipation silica gel (903) and the large heat conductive sheet (904) are mostly oriented toward the inner heat dissipation opening (902); The structures of the large heat dissipation silica gel (903) and the large heat conductive sheet (904) are mostly oriented toward the inner heat dissipation opening (902); Most of the structures of the small heat conductive sheet (907) and the small heat dissipating silica gel (908) are oriented toward the inner heat dissipation port (902); The heat dissipation mechanism (9) further comprises a small heat conductive sheet (907), a small heat dissipation silica gel (908) and an adjustment component (909), wherein the small heat conductive sheet (907) is bonded with the small heat dissipation silica gel (908), and the right side surface of the adjustment component (909) is in contact with the large heat conductive sheet (904); The adjustment assembly (909) comprises a threaded rod (9091), an internally threaded seat (9092) and a gasket (9093); the left side of the threaded rod (9091) is welded to the screwing ring (10); the threaded rod (9091) is threadedly connected to the internally threaded seat (9092); the right side of the threaded rod (9091) is fastened with a gasket (9093); and the gasket (9093) is located inside the control seat (6).

2. According to claim 1, a microenvironment control system for wafer production, Features: The control seat (6) comprises a control seat body (601), a first fixed plate (602) and a second fixed plate (603); the first fixed plate (602) is inserted and fixed in the control seat body (601); and the second fixed plate (603) has the same structure as the first fixed plate (602).

3. According to claim 2, a microenvironment control system for wafer production, Features: The control seat (6) further comprises an anti-skid inner plate (604) and a gripping opening (605); the anti-skid inner plate (604) is fitted onto the second fixed plate (603); the gripping opening (605) and the control seat body (601) are an integrated structure; the left gripping opening (2) is fastened onto the gripping opening (605).

4. According to claim 2, a microenvironment control system for wafer production, Features: The rotating column (905) is a cylindrical structure, and the thickness of the large heat dissipation silica gel (903) is greater than five millimeters.

5. According to claim 2, a microenvironment control system for wafer production, Features: The large heat dissipation silica gel (903) is installed in a Z shape, and the small heat dissipation silica gel (908) is installed in a Z shape.

6. A microenvironment control system for wafer production according to claim 3, Features: The threaded rod (9091) is threadedly connected to the control seat (6).

7. A microenvironment control system for wafer production according to claim 2, Features: The inner heat dissipation port (902) is a rectangular opening, and the air outlet (906) is a rectangular opening.

8. According to claim 2, a microenvironment control system for wafer production, Features: A large heat conducting sheet (904) and a small heat conducting sheet (907) are sequentially installed on the outer shell (901) from top to bottom, and the installation angle between the adjustment component (909) and the outer shell (901) is ninety degrees.

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