Display device and method for manufacturing the same

Abstract

A display device and a method for manufacturing the display device are provided, wherein the display device includes: a display panel, a light control layer, a light blocking portion and a protective layer, wherein the display panel has a pixel area and a peripheral area adjacent to the pixel area, the light control layer is arranged on the display panel and at least partially overlaps with the pixel area, the light blocking portion at least partially overlaps with the peripheral area, and the protective layer is arranged between the light control layer and the light blocking portion.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0038168, filed on April 2, 2019, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention generally relate to display devices, and more particularly, to a display device having improved light efficiency and a method for manufacturing the display device. Background Art

[0004] Display panels include transmissive display panels that selectively transmit source light generated by a light source, and emissive display panels that generate source light from the display panel itself. The display panel may include different types of color control layers, depending on the pixel, to produce a color image. The color control layers may transmit only a portion of the source light within a certain wavelength range, or may convert the color of the source light. Some color control layers may change the characteristics of the light without changing the color of the source light.

[0005] The above information disclosed in this Background section is only for understanding the background of the inventive concept and therefore it may contain information that does not constitute prior art. Summary of the Invention

[0006] Applicants have discovered that in a display device having a color control layer in direct contact with a light blocking portion formed from a hydrophobic organic material, the hydrophobic organic material may degrade the desired properties of the light emitting material in the color control layer.

[0007] A display device constructed according to an exemplary embodiment of the present invention and a method for manufacturing a display device according to an exemplary embodiment of the present invention can prevent a luminescent material included in a light-controlling member (e.g., a light-controlling layer) from being damaged by a hydrophobic organic material in a light-blocking portion. For example, a protective layer formed of an inorganic material and disposed between the light-controlling member and the light-blocking portion can reduce or prevent damage to the hydrophobic organic material in the light-blocking portion of the light-controlling member.

[0008] A display device constructed according to an exemplary embodiment of the present invention has improved light efficiency due to enhanced stability of a light emitting material included in a light conversion member (eg, a light management layer) of the display device.

[0009] Additional features of the inventive concepts will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concepts.

[0010] According to one aspect of the present invention, a display device includes: a display panel, a light control layer, a light blocking portion and a protective layer, wherein the display panel has a pixel area and a peripheral area adjacent to the pixel area; the light control layer is arranged on the display panel and at least partially overlaps with the pixel area; the light blocking portion at least partially overlaps with the peripheral area; and the protective layer is arranged between the light control layer and the light blocking portion.

[0011] The display panel may include a base substrate and at least one display element that is disposed on the base substrate in a pixel area and generates first light.

[0012] The light-controlling layer may include a first light-controlling portion that transmits the first light, a second light-controlling portion that converts the first light into the second light, and a third light-controlling portion that converts the first light into the third light.

[0013] The first light may be light having a wavelength range of about 410 nm-480 nm, the second light may be light having a wavelength range of about 500 nm-570 nm, and the third light may be light having a wavelength range of about 625 nm-675 nm.

[0014] The display device may further include a color filter layer disposed on the light control layer.

[0015] The color filter layer may include a first color filter portion transmitting the first light and overlapping the first light-controlling portion, a second color filter portion transmitting the second light and overlapping the second light-controlling portion, and a third color filter portion transmitting the third light and overlapping the third light-controlling portion.

[0016] The light control layer may include a side surface adjacent to the light blocking portion and an upper surface adjacent to the color filter layer. The protective layer may cover the side surface and the upper surface of the light control layer.

[0017] The protective layer may include SiN x 、SiO x 、Al2O3、TiO x and ZrO x At least one of .

[0018] The light blocking portion may include a side surface adjacent to the light control layer and a lower surface adjacent to the display panel and connected to the side surface. The protective layer may cover the side surface of the light blocking portion without contacting the lower surface of the light blocking portion.

[0019] The display device may further include a metal layer disposed between the protective layer and the light blocking portion.

[0020] The display device may further include a first capping layer disposed on the light management layer and a second capping layer disposed between the light management layer and the display panel. The second capping layer may be in contact with the light management layer.

[0021] The light management layer may include a plurality of quantum dots.

[0022] According to another aspect of the present invention, a display device includes a base substrate, at least one display element, a light control layer, a light blocking portion and a protective layer, wherein the base substrate has a pixel area and a peripheral area adjacent to the pixel area; at least one display element is arranged on the base substrate at least partially overlapping with the pixel area and generates a first light; the light control layer is arranged on the display element and includes a first light control portion that transmits the first light, a second light control portion that converts the first light into a second light, and a third light control portion that converts the first light into a third light; the light blocking portion is arranged between the first light control portion and the second light control portion, between the second light control portion and the third light control portion, and between the third light control portion and the first light control portion, and at least partially overlaps with the peripheral area; the protective layer is arranged on the side surface of the light blocking portion.

[0023] The light blocking portion may include a side surface and an upper surface connecting the side surface, and the protection layer may be spaced apart from the upper surface of the light blocking portion.

[0024] The display device may further include a first capping layer disposed on the light-controlling layer and the light-blocking portion, and a second capping layer disposed between the light-controlling layer and the display element.

[0025] The second capping layer may be in contact with the light management layer.

[0026] According to another aspect of the present invention, a method for manufacturing a display device includes the following steps: preparing an upper display substrate including a pixel region and a peripheral region adjacent to the pixel region; preparing a lower display substrate including a display element that transmits light toward the pixel region; and coupling the upper display substrate and the lower display substrate. The step of preparing the upper display substrate also includes the following steps: preparing a base substrate; forming a light-blocking portion on a lower surface of the base substrate so that the light-blocking portion at least partially overlaps the peripheral region; forming an inorganic film by depositing an inorganic material on the light-blocking portion and the base substrate; forming a protective layer by patterning the inorganic film to expose the upper surface of the light-blocking portion; and forming a light-control layer so that the light-control layer at least partially overlaps the pixel region in a plane.

[0027] The method for manufacturing a display device may further include the steps of forming a first capping layer on the base substrate before forming the light blocking portion; and forming a second capping layer on the light controlling layer and the light blocking portion after forming the light controlling layer.

[0028] The method for manufacturing a display device may further include forming a metal layer by depositing a metal to cover a side surface of the light blocking portion before forming the inorganic film.

[0029] The method for manufacturing a display device may further include forming a color filter layer on the base substrate before forming the light blocking portion.

[0030] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0032] Figure 1 is a perspective view of an exemplary embodiment of a display device constructed according to the principles of the present invention.

[0033] Figure 2 is a plan view of an exemplary embodiment of a display device constructed according to the principles of the present invention.

[0034] Figure 3A It is along Figure 2 1 is a cross-sectional view of the first exemplary embodiment of the display device taken along line II′.

[0035] Figure 3B yes Figure 3A An enlarged cross-sectional view of portion A.

[0036] Figure 4A It is along Figure 2 1 is a cross-sectional view of a second exemplary embodiment of a display device taken along line II′.

[0037] Figure 4B yes Figure 4A An enlarged cross-sectional view of portion A.

[0038] Figure 5A It is along Figure 2 1 is a cross-sectional view of a third exemplary embodiment of a display device taken along line II′.

[0039] Figure 5B yes Figure 5A An enlarged cross-sectional view of portion A.

[0040] Figure 6A It is along Figure 2 1 is a cross-sectional view of a fourth exemplary embodiment of a display device taken along line II′.

[0041] Figure 6B yes Figure 6A An enlarged cross-sectional view of portion A.

[0042] Figure 7 It is along Figure 2 1 is a cross-sectional view of a fifth exemplary embodiment of a display device taken along line II′.

[0043] Figure 8 is a cross-sectional view corresponding to an exemplary embodiment of one pixel in a display device constructed according to the principles of the present invention.

[0044] Figure 9 is a flowchart of a method for manufacturing a display device according to an exemplary embodiment of the present invention.

[0045] 10A to 10F is shown in sequence for making Figure 7 sectional views of some steps in an exemplary method of displaying a device as shown in FIG.

[0046] Figure 11 and Figure 12 are cross-sectional views illustrating some steps in another method for manufacturing a display device according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0047] In the following description, for the purpose of explanation, many specific details are set forth for a thorough understanding of the various exemplary embodiments or embodiments of the present invention. As used herein, "embodiment" and "embodiment" are interchangeable terms that are non-limiting examples of one or more devices or methods to which the inventive concepts disclosed herein are applied. However, it is apparent that the various exemplary embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other cases, in order to avoid unnecessary confusion of the various exemplary embodiments, well-known structures and devices are shown in block diagram form. In addition, the various exemplary embodiments may be different, but do not have to be exclusive. For example, without departing from the inventive concepts, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0048] Unless otherwise indicated, the exemplary embodiments shown are to be interpreted as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise indicated, the features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments (hereinafter individually or collectively referred to as "elements") may be combined, separated, exchanged and / or rearranged without departing from the inventive concept.

[0049] The use of hatching and / or shading in the accompanying drawings is generally used to make the boundaries between adjacent elements clear. Thus, unless otherwise specified, the presence or absence of hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the accompanying drawings, the size and relative size of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be performed differently, the specific process order can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0050] When an element such as a layer is referred to as being on another element or layer, being connected to or being coupled to another element or layer, it may be directly on the other element or layer, being connected to or being coupled to the other element or layer, or there may be an intervening element or layer. However, when an element or layer is referred to as being directly on another element or layer, being directly connected to or being directly coupled to another element or layer, there may not be an intervening element or layer. For this reason, the term "connection" may represent a physical connection, electrical connection and / or fluid connection with or without an intervening element. In addition, the D1 axis, D2 axis and D3 axis are not limited to the three axes of a rectangular coordinate system, such as an x-axis, a y-axis and a z-axis, but can be interpreted in a broader sense. For example, the D1 axis, the D2 axis and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0051] Although the terms "first," "second," etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, the first element discussed below may be referred to as the second element without departing from the teachings of the present disclosure.

[0052] Spatially relative terms, such as "beneath," "below," "under," "lower," "above," "upper," "over," "higher," "side" (e.g., as in "sidewall"), etc., may be used herein for descriptive purposes and, as such, may be used to describe the relationship of one element to another element as shown in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and as such, the spatially relative descriptors used herein should be interpreted accordingly.

[0053] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural meaning as well. In addition, the terms "comprises", "comprising", "includes", and / or "including", when used in this specification, indicate the presence of the described features, wholes, steps, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or combinations thereof. It is also worth noting that, as used herein, the terms "substantially", "about", and other similar terms are used as terms of approximation and not as terms of degree, and as such, are used to allow for inherent deviations in measured, calculated, and / or provided values ​​that would be appreciated by those of ordinary skill in the art.

[0054] The exemplary embodiments are described herein with reference to cross-sectional and / or exploded views that are schematic representations of idealized exemplary embodiments and / or intermediate structures. As such, variations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are contemplated. Accordingly, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the specifically illustrated shapes of regions, but rather include deviations in shapes due to, for example, manufacturing. In this manner, the regions illustrated in the accompanying drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of the device and, as such, are not necessarily intended to be limiting.

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0056] Figure 1 is a perspective view of an exemplary embodiment of a display device constructed according to the principles of the present invention. Figure 2 is a plan view of an exemplary embodiment of a display device constructed according to the principles of the present invention. Figure 3A It is along Figure 2 1 is a cross-sectional view of the first exemplary embodiment of the display device taken along line II′. Figure 3B yes Figure 3A An enlarged cross-sectional view of portion A.

[0057] refer to Figure 1 The display device DD includes a display panel DP and a light control layer CCL disposed on the display panel DP. The display device DD may further include a first substrate SUB1 and a second substrate SUB2 opposing the first substrate SUB1. The second substrate SUB2 constitutes a portion of the display panel DP and may further include a display element disposed on the second substrate SUB2.

[0058] The display element may be an organic light-emitting diode (OLED) as a self-luminous element, and the organic light-emitting diode OLED may generate a first light. For example, the first light provided by the organic light-emitting diode OLED may be blue light, and the blue light may correspond to light in the wavelength range of 410 nm to 480 nm. However, the exemplary embodiment is not limited thereto, and various light-emitting elements including, as non-limiting examples, LCDs, LEDs, micro-LEDs, nano-LEDs, quantum dots, quantum rods, etc. may be applied to the display device DD according to the exemplary embodiment. Hereinafter, a case where the display device DD includes an organic light-emitting diode OLED will be described as an example.

[0059] like Figure 1 As shown, the organic light emitting diode OLED may be disposed on the second substrate SUB2.

[0060] refer to Figure 2 The display device DD may include a display area DA that displays an image and a non-display area NDA that does not display an image. The non-display area NDA may be disposed on the outer periphery of the display area DA. The display area DA and non-display area NDA of the display device DD may also be referred to as the display area DA and non-display area NDA of the display panel DP.

[0061] The display device DD may have a substantially rectangular shape in a plane defined by an axis in the first direction DR1 and an axis in the second direction DR2. However, exemplary embodiments are not limited thereto, and the shapes of the display area DA and the non-display area NDA may differ according to various designs.

[0062] Figure 2 The display device DD in the embodiment is shown as having a flat display surface, but exemplary embodiments are not limited thereto. In exemplary embodiments, the display device DD may include a curved display surface or a stereoscopic display surface. The stereoscopic display surface may include multiple display areas each indicating a different direction, and may include, for example, a polygonal column display surface.

[0063] The display area DA may include a plurality of pixel regions Pxa-B, Pxa-G, and Pxa-R. The pixel regions Pxa-B, Pxa-G, and Pxa-R may be defined by, for example, a plurality of gate lines and a plurality of data lines. The pixel regions Pxa-B, Pxa-G, and Pxa-R may be arranged in a matrix form. A pixel (to be described later) may be provided in each of the pixel regions Pxa-B, Pxa-G, and Pxa-R.

[0064] The display device DD may include a first pixel region, a second pixel region, and a third pixel region that are disposed adjacent to each other in the same plane and emit light having different wavelengths. In an exemplary embodiment, the first pixel region may be a blue pixel region Pxa-B, the second pixel region may be a green pixel region Pxa-G, and the third pixel region may be a red pixel region Pxa-R. For example, in an exemplary embodiment, the display device DD may include a blue pixel region Pxa-B, a green pixel region Pxa-G, and a red pixel region Pxa-R. The blue pixel region Pxa-B may be a blue light-emitting region for emitting blue light, and the green pixel region Pxa-G and the red pixel region Pxa-R may represent a green light-emitting region and a red light-emitting region, respectively.

[0065] In an exemplary embodiment, the display device DD may be a rigid display device. However, the exemplary embodiment is not limited thereto, and the display device DD may be a flexible display device.

[0066] refer to Figure 3A and Figure 3B, the display device DD of the exemplary embodiment may include a first substrate SUB1 and a second substrate SUB2 opposite to the first substrate SUB1. The first substrate SUB1 and the second substrate SUB2 may each independently be a polymer substrate, a plastic substrate, a glass substrate, a quartz substrate, etc. The first substrate SUB1 and the second substrate SUB2 may be transparent insulating substrates. Each of the first substrate SUB1 and the second substrate SUB2 may be rigid. Each of the first substrate SUB1 and the second substrate SUB2 may be flexible. Figure 3A , the display device DD is illustrated as including a first substrate SUB1 and a second substrate SUB2, but exemplary embodiments are not limited thereto, and in the display device DD, at least either one of the first substrate SUB1 and the second substrate SUB2 may be omitted.

[0067] The display device DD may include a circuit layer CL disposed on a second substrate SUB2.

[0068] In exemplary embodiments, the display device DD may include a first organic light emitting diode OLED overlapping the first pixel region Pxa-B, a second organic light emitting diode OLED overlapping the second pixel region Pxa-G, and a third organic light emitting diode OLED overlapping the third pixel region Pxa-R.

[0069] Each of the first to third organic light emitting diodes OLED may include a first electrode EL1 , a hole transport member HTR, an emission layer EML, an electron transport member ETR, and a second electrode EL2 , which are sequentially stacked.

[0070] The emission layers EML in the first to third organic light emitting diodes OLED may have a unified shape and may be commonly disposed in the pixel regions Pxa-B, Pxa-G, and Pxa-R and the peripheral region NPxa. The emission layer EML may generate first light. For example, the emission layer EML may generate blue light.

[0071] The encapsulation member TFE may be disposed on the organic light-emitting diode OLED and seal the organic light-emitting diode OLED. The encapsulation member TFE may include an inorganic film IL disposed at the outermost periphery. The encapsulation member TFE may also include an organic film OL, or may have a structure in which the inorganic film IL and the organic film OL are alternately repeated. The encapsulation member TFE may be used to protect the organic light-emitting diode OLED from moisture / oxygen and foreign matter such as dust particles.

[0072] In exemplary embodiments, the inorganic film IL may include any material without any particular limitation as long as it protects the upper portion of the organic light emitting diode OLED, and may include, for example, silicon nitride (SiN x ), silicon oxynitride (SiOy N x ), silicon oxide (SiO y ), titanium oxide (TiO y ), aluminum oxide (AlO y )wait.

[0073] The organic film OL may include an acrylic organic material, but exemplary embodiments are not particularly limited thereto. The inorganic film IL may be formed by a deposition method, etc., and the organic film OL may be formed by a deposition method, a coating method, etc.

[0074] A display device DD according to example embodiments may include a light-controlling layer CCL and a light-blocking portion BP.

[0075] The light-control layer CCL may include a first light-control portion CCP1 that transmits a first light, a second light-control portion CCP2 that converts the first light into a second light, and a third light-control portion CCP3 that converts the first light into a third light. For example, the second light may be green light, and the green light may correspond to light in the wavelength range of approximately 500 nm to 570 nm. The third light may be red light, and may correspond to light in the wavelength range of approximately 625 nm to 675 nm.

[0076] The second light-control part CCP2 and the third light-control part CCP3 may include a luminescent material. The luminescent material may be particles that convert the wavelength of light. In an exemplary embodiment, the luminescent material included in the second light-control part CCP2 and the third light-control part CCP3 may be quantum dots.

[0077] Quantum dots, which have a crystal structure measuring just a few nanometers and are composed of hundreds to thousands of atoms, exhibit a quantum confinement effect, in which the energy band gap increases due to their small size. When the quantum dots are irradiated with light having a wavelength higher than the energy band gap, they absorb the light, become excited, and emit light of a specific wavelength before returning to their ground state. The wavelength of the emitted light corresponds to the band gap. The luminescence characteristics resulting from the quantum confinement effect of the quantum dots can be adjusted by adjusting the size and composition of the quantum dots.

[0078] The core of the quantum dot can be selected from among Group II-VI compounds, Group III-V compounds, Group IV-VI compounds, Group IV elements, Group IV compounds, and combinations thereof.

[0079] The II-VI compound can be selected from the group consisting of: a binary element compound selected from the group consisting of CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and combinations thereof; a binary element compound selected from the group consisting of AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, Cd Ternary element compounds selected from the group consisting of ZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS and combinations thereof; quaternary element compounds selected from the group consisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and combinations thereof.

[0080] The III-V compounds can be selected from the group consisting of: binary element compounds selected from the group consisting of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb and combinations thereof; ternary element compounds selected from the group consisting of GaNPs, GaNAs, GaNSb, GaPAs, GaPSb, AlNPs, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InPSb and combinations thereof; quaternary element compounds selected from the group consisting of GaAlNPs, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNPs, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNPs, InAlNAs, InAlNSb, InAlPAs, InAlPSb and combinations thereof.

[0081] The IV-VI compound may be selected from the group consisting of: a binary element compound selected from the group consisting of SnS, SnSe, SnTe, PbS, PbSe, PbTe, and combinations thereof; a ternary element compound selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and combinations thereof; and a quaternary element compound selected from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe, and combinations thereof. The Group IV element may be selected from the group consisting of Si, Ge, and combinations thereof. The Group IV compound may be a binary compound selected from the group consisting of SiC, SiGe, and combinations thereof.

[0082] In this case, the binary, ternary, or quaternary element compound may be present in the particle at a uniform concentration, or may be present in particles whose concentration distribution is partially divided into different states. Alternatively, the quantum dots may have a core-shell structure in which one quantum dot surrounds the other quantum dots. The interface between the core and the shell may have a concentration gradient in which the concentration of the element present in the shell decreases toward the core.

[0083] In some exemplary embodiments, quantum dots may have a core-shell structure comprising a core comprising the described nanocrystals and a shell surrounding the core. The shell of the quantum dot may serve as a protective layer for maintaining semiconductor properties by preventing chemical denaturation of the core and / or as a charging layer for imparting electrophoretic properties to the quantum dot. The shell may be a single layer or a multilayer. The interface between the core and the shell may have a concentration gradient in which the concentration of the element present in the shell decreases toward the core. The shell of the quantum dot may, for example, comprise a metal or non-metal oxide, a semiconductor compound, or a combination thereof.

[0084] The metal or non-metal oxide may include, for example, binary element compounds such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, and NiO; or ternary element compounds such as MgAl2O4, CoFe2O4, NiFe2O4, and CoMn2O4, but exemplary embodiments are not limited thereto.

[0085] In addition, the semiconductor compound may include, for example, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, etc., but exemplary embodiments are not limited thereto.

[0086] The quantum dots may have a full width at half maximum (FWHM) of an emission wavelength spectrum of about 45 nm or less, preferably about 40 nm or less, and more preferably about 30 nm or less, and color purity or color reproducibility may be improved within the described range. In addition, light emitted by such quantum dots may be emitted in all directions, thereby increasing the viewing angle of the light.

[0087] Furthermore, the shape of quantum dots is not limited to specific shapes commonly used in the field, but more specifically, spherical, pyramidal, multi-arm or cubic nanoparticles, nanotubes, nanobelts, nanofibers, nanoplate particles, etc. may be used.

[0088] The color of light generated from quantum dots can be adjusted based on their particle size, and thus, quantum dots can have various emission colors, such as blue, red, and green. When the particle size of quantum dots is small, light in a short wavelength range can be emitted. For example, the particle size of quantum dots that emit green light can be smaller than that of quantum dots that emit red light. Furthermore, the particle size of quantum dots that emit blue light can be smaller than that of quantum dots that emit green light.

[0089] For example, the particle size of the quantum dots included in the second light-control part CCP2 may be smaller than the particle size of the quantum dots included in the third light-control part CCP3. In this case, the quantum dots included in the second light-control part CCP2 may emit light having a shorter wavelength than the quantum dots included in the third light-control part CCP3.

[0090] In an exemplary embodiment, the light control layer CCL may include a base resin and a luminescent material. The light control layer CCL may also include scattering particles. The luminescent material and the scattering particles may be included only in a portion of the light control layer CCL. In an exemplary embodiment, the first light control part CCP1 may not include the luminescent material but may include only the scattering particles. The second light control part CCP2 and the third light control part CCP3 may include both the luminescent material and the scattering particles.

[0091] The light-control layer CCL may include a plurality of light-control parts CCP1, CCP2, and CCP3. In an exemplary embodiment, each of the first light-control part CCP1, the second light-control part CCP2, and the third light-control part CCP3 may be disposed to be spaced apart from each other on a plane. Figure 3A , each of the first light-control part CCP1, the second light-control part CCP2, and the third light-control part CCP3 may be spaced apart from each other in a plane defined by an axis in the first direction DR1 and an axis in the third direction DR3.

[0092] The first light-controlling part CCP1 may be disposed corresponding to the first pixel region Pxa-B, the second light-controlling part CCP2 may be disposed corresponding to the second pixel region Pxa-G, and the third light-controlling part CCP3 may be disposed corresponding to the third pixel region Pxa-R.

[0093] exist Figure 3A , although the first light-control section CCP1, the second light-control section CCP2, and the third light-control section CCP3 are shown as having the same area or thickness, exemplary embodiments are not limited thereto, and the first light-control section CCP1, the second light-control section CCP2, and the third light-control section CCP3 may have different areas and / or thicknesses, respectively. For example, the third light-control section CCP3 may have a larger area than the first light-control section CCP1 and the second light-control section CCP2. The first light-control section CCP1 may have a smaller area than the second light-control section CCP2 and the third light-control section CCP3.

[0094] The light control layer CCL may include a light emitting material, scattering particles and a base resin. Figure 3A and Figure 3B , the second light-controlling part CCP2 included in the light-controlling layer CCL may include a light-emitting material EP, scattering particles SC, and a base resin BR.

[0095] The base resin BR is a medium in which the luminescent material EP is dispersed and can be formed from various resin components, generally referred to as adhesives. However, the exemplary embodiment is not limited thereto, and a medium capable of dispersing and disposing the luminescent material EP may be referred to as a base resin in the specification, regardless of its name, other functions attached thereto, or its structure. The base resin BR may be a polymer resin. For example, the base resin BR may be an acrylic resin, a urethane resin, a silicone resin, an epoxy resin, or the like. The base resin BR may be a transparent resin.

[0096] The light emitting material EP may be particles that convert the wavelength of light. In an exemplary embodiment, the light emitting material EP may be quantum dots.

[0097] The luminescent material EP may be particles that convert the first light into the second light. In an exemplary embodiment, the luminescent material EP may be quantum dots that convert the blue light into the green light. The luminescent material EP may be uniformly dispersed in the second light-controlling part CCP2.

[0098] The scattering particles SC may be TiO 2 , silicon dioxide-based nanoparticles, etc. The scattering particles SC may scatter light. In another exemplary embodiment, the scattering particles SC may be omitted.

[0099] The light blocking portion BP may be disposed between the first light-controlling portion CCP1 and the second light-controlling portion CCP2, and between the second light-controlling portion CCP2 and the third light-controlling portion CCP3. The light blocking portion BP may vertically overlap the peripheral area NPxa. The light blocking portion BP may prevent light leakage and define a boundary between adjacent two of the light-controlling portions CCP1, CCP2, and CCP3. The light blocking portion BP may include an organic light-blocking material containing a black pigment or dye. The light blocking portion BP may include a hydrophobic organic material.

[0100] In an exemplary embodiment, the display device DD may include a protective layer PL disposed between the light-controlling layer CCL and the light-blocking portion BP. The protective layer PL may be formed of an inorganic material, but the type of the inorganic material is not particularly limited. In an exemplary embodiment, the protective layer PL may include SiN x 、SiO x , Al2O3 and ZrO x At least one of .

[0101] The protective layer PL may be disposed between the first light-controlling part CCP1 and the light-blocking part BP, between the second light-controlling part CCP2 and the light-blocking part BP, and between the third light-controlling part CCP3 and the light-blocking part BP. The light-blocking part BP may include a side surface BP-LS adjacent to the second light-controlling part CCP2 and a lower surface BP-US connected to the side surface BP-LS. The protective layer PL may cover the side surface BP-LS of the light-blocking part BP and not contact or cover the lower surface BP-US. The protective layer PL may be spaced apart from the lower surface BP-US. For example, the protective layer PL may be patterned to cover the side surface BP-LS of the light-blocking part BP, which serves as an interface between the light-blocking part BP and each of the light-controlling parts CCP1, CCP2, and CCP3, but to expose the lower surface BP-US of the light-blocking part BP.

[0102] In an exemplary embodiment, the display device DD may include a color filter layer CFL. The color filter layer CFL may be disposed on the light-controlling layer CCL and may include first, second, and third color filter parts B-CFP, G-CFP, and R-CFP, and a light-blocking pattern BM.

[0103] In an exemplary embodiment, the first color filter portion B-CFP, the second color filter portion G-CFP, and the third color filter portion R-CFP may be spaced apart from each other on a plane. Figure 3A , the first color filter portion B-CFP, the second color filter portion G-CFP, and the third color filter portion R-CFP may be spaced apart from each other along the first direction DR1.

[0104] The first color filter portion B-CFP may be disposed corresponding to the first light-controlling portion CCP1 and transmit a first light (e.g., blue light); the second color filter portion G-CFP may be disposed corresponding to the second light-controlling portion CCP2, block the first light, and transmit a second light (e.g., green light); and the third color filter portion R-CFP may be disposed corresponding to the third light-controlling portion CCP3, block the first light and the second light, and transmit the third light (e.g., red light). The display device DD includes the color filter layer CFL, and therefore, can effectively reduce reflection of external light and prevent color mixing.

[0105] The light blocking pattern BM may be provided in an area corresponding to the peripheral area NPxa. The light blocking pattern BM may be formed by including an organic light blocking material or an inorganic light blocking material containing a black pigment or dye. The light blocking pattern BM may prevent light leakage and define a boundary between adjacent color filter portions. Figure 3A As shown, the light-blocking pattern BM may be disposed between adjacent color filter portions without overlapping the color filter portions, but exemplary embodiments are not limited thereto. For example, at least a portion of the light-blocking pattern BM may overlap an adjacent color filter portion. Specifically, at least a portion of the light-blocking pattern BM may be disposed so as to overlap an adjacent color filter portion in a thickness direction in a plane defined by an axis in the first direction DR1 and an axis in the third direction DR3. Figure 3A and Figure 3B The exemplary embodiment shows that the light-blocking pattern BM is disposed between adjacent color filter portions without overlapping the color filter portions in the thickness direction, and the thickness of the light-blocking pattern BM is the same as the thickness of the entire color filter layer CFL, but the exemplary embodiment is not limited thereto. For example, the thickness of the light-blocking pattern BM may be thinner than the thickness of the entire color filter layer CFL. The exemplary embodiment teaches that the light-blocking pattern BM is included in the color filter layer CFL, but the exemplary embodiment is not limited thereto.

[0106] A filling layer BFL may be disposed between the encapsulation member TFE and the light-control layer CCL to prevent the light-control layer CCL from contacting the encapsulation member TFE and improve light extraction efficiency of the display device DD.

[0107] In an exemplary embodiment, a filling layer BFL may be disposed between the encapsulation member TFE and the light-control layer CCL. “The filling layer BFL is disposed between the encapsulation member TFE and the light-control layer CCL” may mean that the space between the encapsulation member TFE and the light-control layer CCL is completely filled with the filling layer BFL, so that there is no internal space between the encapsulation member TFE and the light-control layer CCL, and may mean that the filling layer BFL is in contact with the encapsulation member TFE and the light-control layer CCL.

[0108] The filling layer BFL may prevent the light emitting material EP and / or the scattering particles SC, etc., included in the light control layer CCL from being oxidized by the internal air, and thus may maintain the light extraction efficiency of the display device DD without a large change.

[0109] In an exemplary embodiment, the filling layer BFL may be directly disposed on the inorganic film IL disposed at the outermost periphery of the encapsulation member TFE. The filling layer BFL may include an inorganic binder, an organic binder, or a liquid crystal compound, but the exemplary embodiment is not particularly limited thereto.

[0110] Figure 3A In the exemplary embodiment, the filling layer BFL is provided between the encapsulation member TFE and the light-control layer CCL, but the exemplary embodiment is not limited thereto. In the display device DD according to the exemplary embodiment, the filling layer BFL may be omitted. In this case, the light-control layer CCL may be directly provided on the upper surface of the encapsulation member TFE.

[0111] The display device DD according to an exemplary embodiment may include a protective layer PL between each of the light-control parts CCP1, CCP2, and CCP3 and the light-blocking part BP in the light-control layer CCL. More specifically, in the display device DD according to an exemplary embodiment, the protective layer PL may be disposed between the light-blocking part BP including a hydrophobic organic material and each of the light-control parts CCP1, CCP2, and CCP3. In the display device DD according to an exemplary embodiment, the protective layer PL may cover the side surface BP-LS of the light-blocking part BP and may expose the lower surface BP-US of the light-blocking part BP.

[0112] When the light-controlling parts CCP1, CCP2, and CCP3 directly contact the side surface BP-LS of the light-blocking part BP containing a hydrophobic organic material, the performance of the luminescent material EP included in the light-controlling parts CCP1, CCP2, and CCP3 may be degraded due to the hydrophobic organic material. Furthermore, when the light-controlling parts CCP1, CCP2, and CCP3 are formed using an inkjet method or the like, the light-controlling parts CCP1, CCP2, and CCP3 may be unevenly formed due to the hydrophobicity of the light-blocking part BP. In the display device DD according to the exemplary embodiment, a protective layer PL formed of an inorganic material or the like is provided between the light-blocking part BP and each of the light-controlling parts CCP1, CCP2, and CCP3. Therefore, the performance degradation of the luminescent material EP included in the light-controlling parts CCP1, CCP2, and CCP3 can be reduced or prevented, and the light-controlling parts CCP1, CCP2, and CCP3 can be uniformly formed due to the protective layer PL having a hydrophilic property compared to the light-blocking part BP. The protection layer PL may be patterned to expose the lower surface BP-US of the light blocking part BP, thereby preventing overflow from occurring when forming the light-controlling parts CCP1, CCP2, and CCP3. Therefore, light efficiency of the entire display device DD may be improved.

[0113] Figure 4A It is along Figure 2 1 is a cross-sectional view of a second exemplary embodiment of a display device taken along line II′. Figure 4B yes Figure 4A An enlarged cross-sectional view of part A of FIG. Figure 4A and Figure 4B In describing the display device DD-1 of the exemplary embodiment, the components described above are given the same reference numerals, and descriptions thereof will be omitted to avoid redundancy.

[0114] refer to Figure 4A and Figure 4B In the display device DD-1 according to an exemplary embodiment, the protective layer PL-1 may surround three surfaces of each of the light-control parts CCP1, CCP2, and CCP3 included in the light-control layer CCL. More specifically, the protective layer PL-1 may surround three surfaces of each of the first light-control part CCP1, the second light-control part CCP2, and the third light-control part CCP3 included in the light-control layer CCL. The second light-control part CCP2 may include an upper surface CCP2-US adjacent to the color filter layer CFL and a side surface CCP2-LS adjacent to the light-blocking part BP, and the protective layer PL-1 may cover the upper surface CCP2-US and the side surface CCP2-LS.

[0115] Figure 5A It is along Figure 21 is a cross-sectional view of a third exemplary embodiment of a display device taken along line II′. Figure 5B yes Figure 5A An enlarged cross-sectional view of part A of FIG. Figure 5A and Figure 5B In describing the display device DD-2 of the exemplary embodiment, the components described above are given the same reference numerals, and descriptions thereof will be omitted to avoid redundancy.

[0116] refer to Figure 5A and Figure 5B The display device DD-2 according to an exemplary embodiment may include a metal layer ML. The metal layer ML may be disposed between the protective layer PL-2 and the light-blocking portion BP. The metal layer ML may contact the side surface BP-LS of the light-blocking portion BP. The metal layer ML may cover the side surface BP-LS of the light-blocking portion BP and expose the lower surface BP-US of the light-blocking portion BP. The protective layer PL-2 may completely overlap with the metal layer ML and cover the side surface BP-LS of the light-blocking portion BP. In the display device DD-2 according to an exemplary embodiment, the metal layer ML may be disposed on the inner surfaces of the light-control parts CCP1, CCP2, and CCP3 included in the light-control layer CCL, that is, on the side surface BP-LS of the light-blocking portion BP, and thus, may reflect light emitted from the light-emitting material EP included in the light-control parts CCP1, CCP2, and CCP3 toward the inside. Therefore, the light efficiency of the entire display device may be improved.

[0117] Figure 6A It is along Figure 2 1 is a cross-sectional view of a fourth exemplary embodiment of a display device taken along line II′. Figure 6B yes Figure 6A An enlarged cross-sectional view of part A of FIG. Figure 6A and Figure 6B In describing the display device DD-3 of the exemplary embodiment, the components described above are given the same reference numerals, and descriptions thereof will be omitted to avoid redundancy.

[0118] refer to Figure 6A and Figure 6B The display device DD-3 according to an exemplary embodiment may include a metal layer ML. The metal layer ML may be disposed between the protective layer PL-3 and the light blocking portion BP. The metal layer ML may be in contact with the side surface BP-LS of the light blocking portion BP, and the protective layer PL-3 may be in contact with the metal layer ML and the color filter layer CFL. The protective layer PL-3 may cover the upper surface and side surfaces of the light control layer CCL. The protective layer PL-3 may cover the upper surface CCP2-US and the side surface CCP2-LS of the second light control portion CCP2.

[0119] Figure 7 It is along Figure 2 A cross-sectional view of a fifth exemplary embodiment of a display device taken along line II' of FIG. Figure 7 In describing the display device DD-4 of the exemplary embodiment, the components described above are given the same reference numerals, and descriptions thereof will be omitted to avoid redundancy.

[0120] refer to Figure 7 , the display device DD-4 according to the exemplary embodiment may further include at least one of capping layers CAP1 and CAP2.

[0121] In an exemplary embodiment, a capping layer CAP2 and / or CAP1 may be provided between the light control layer CCL and the filling layer BFL and / or between the light control layer CCL and the color filter layer CFL. In an exemplary embodiment, the first capping layer CAP1 may be provided on the upper surface of the light control layer CCL, that is, between the light control layer CCL and the color filter layer CFL, and the second capping layer CAP2 may be provided on the lower surface of the light control layer CCL, that is, between the light control layer CCL and the filling layer BFL. The second capping layer CAP2 may be in contact with the light control layer CCL. The capping layers CAP1 and CAP2 may be made of an inorganic material, and the type of the inorganic material is not particularly limited. The capping layers CAP1 and CAP2 may surround the light control layer CCL to protect the light control layer CCL. In an exemplary embodiment, the capping layers CAP1 and CAP2 and the protective layer PL-4 may substantially cover all of the top side, bottom side, left side, and right side of each of the light control parts CCP1, CCP2, and CCP3 included in the light control layer CCL.

[0122] Figure 8 is a cross-sectional view corresponding to an exemplary embodiment of one pixel in a display device constructed according to the principles of the present invention.

[0123] In the display device according to example embodiments, the circuit layer CL, the organic light emitting diode OLED, and the encapsulation member TFE may be sequentially disposed on the second substrate SUB2.

[0124] In an exemplary embodiment, the circuit layer CL may include a first insulating layer IS1, a second insulating layer IS2, and a third insulating layer IS3. The first insulating layer IS1 and the second insulating layer IS2 may include an inorganic material, and their types are not particularly limited. The third insulating layer IS3 may include an organic material, and their types are not particularly limited. A barrier layer serving as an inorganic layer may also be provided on the second substrate SUB2. The first insulating layer IS1, the second insulating layer IS2, and the third insulating layer IS3 may have a single-layer or multi-layer structure.

[0125] The first transistor T1 may include a semiconductor pattern SP, a control electrode GE, an input electrode SE, and an output electrode DE. The semiconductor pattern SP may be disposed on the second substrate SUB2. The semiconductor pattern SP may include a crystalline semiconductor material or amorphous silicon.

[0126] A first insulating layer IS1 may be disposed on the second substrate SUB2. The first insulating layer IS1 may commonly overlap the display area DA and the non-display area NDA, and may cover the semiconductor pattern SP.

[0127] The control electrode GE may be disposed on the first insulating layer IS1. The control electrode GE may overlap the semiconductor pattern SP. The control electrode GE may be manufactured according to the same photolithography process as the scan line (not shown).

[0128] A second insulating layer IS2 may be disposed on the first insulating layer IS1. The second insulating layer IS2 may cover the first insulating layer IS1 and the control electrode GE. An input electrode SE and an output electrode DE may be disposed on the second insulating layer IS2. Each of the input electrode SE and the output electrode DE may be connected to the semiconductor pattern SP via a corresponding one of a plurality of contact holes CH1 and CH2 defined in the insulating layers IS1 and IS2. The first transistor T1 may be modified to have a bottom gate structure.

[0129] A third insulating layer IS3 covering the first transistor T1 may be disposed on the second insulating layer IS2. The third insulating layer IS3 may provide a flat surface.

[0130] The organic light emitting diode OLED and the pixel defining layer PDL may be disposed on the third insulating layer IS3. The pixel defining layer PDL may include an organic material. An opening OP of the pixel defining layer PDL may expose at least a portion of the first electrode EL1. The opening OP of the pixel defining layer PDL may define a pixel region Pxa of a pixel. In an exemplary embodiment, the pixel defining layer PDL may be omitted to avoid redundancy.

[0131] In an exemplary embodiment, the pixel region Pxa may overlap at least one of the first transistor T1 and a second transistor (not shown) adjacent thereto. In this case, the opening OP may become wider, and the first electrode EL1 may also become wider.

[0132] The first electrode EL1 may be disposed on the third insulating layer IS3 and contact the output electrode DE through a third contact hole CH3 defined in the third insulating layer IS3. The first electrode EL1 may be formed of a metal alloy or a conductive compound. The first electrode EL1 may be an anode. The first electrode EL1 may be a transmissive electrode, a semi-transmissive reflective electrode, or a reflective electrode.

[0133] The hole transport member HTR may be disposed on the first electrode EL1. The hole transport member HTR may include at least one of a hole injection layer, a hole transport layer, a hole buffer layer, and an electron blocking layer.

[0134] The hole transport member HTR may have a structure of a single layer formed of a single material; a single layer formed of a plurality of different materials; or a multilayer having a plurality of layers formed of a plurality of different materials.

[0135] For example, the hole transport member HTR may have a single-layer structure as a hole injection layer or a hole transport layer, or may have a single-layer structure formed of a hole injection material and a hole transport material. Alternatively, the hole transport member HTR may have a single-layer structure formed of a plurality of different materials, or may have a structure in which the first electrode EL1, hole injection layer / hole transport layer, hole injection layer / hole transport layer / hole buffer layer, hole injection layer / hole buffer layer, hole transport layer / hole buffer layer, or hole injection layer / hole transport layer / electron blocking layer are stacked in sequence, but exemplary embodiments are not limited thereto.

[0136] As described above, the hole transport member HTR according to the exemplary embodiment may further include at least one of a hole buffer layer and an electron blocking layer in addition to the hole injection layer and the hole transport layer.

[0137] The emission layer EML may be provided on the hole transport member HTR. The emission layer EML may have, for example, about The emission layer EML may have a structure of a single layer formed of a single material, a single layer formed of a plurality of different materials, or a multilayer having a plurality of layers formed of a plurality of different materials.

[0138] The emission layer EML may include a fluorescent light emitting material or a phosphorescent light emitting material. In an exemplary embodiment, the emission layer EML may emit blue light. The emission layer EML may emit light in a wavelength range of 410 nm to 480 nm.

[0139] The electron transport member ETR may be disposed on the emission layer EML. The electron transport member ETR may include at least one of a hole blocking layer, an electron transport layer, and an electron injection layer, but example embodiments are not limited thereto.

[0140] The electron transport member ETR may have a structure such as a single layer formed of a single material; a single layer formed of a plurality of different materials; or a multilayer having a plurality of layers formed of a plurality of different materials. For example, the electron transport member ETR may have a single layer structure as an electron injection layer or an electron transport layer, or may have a single layer structure formed of an electron injection material and an electron transport material. Alternatively, the electron transport member ETR may have a single layer structure formed of a plurality of different materials, or may have a structure in which an emission layer EML, an electron transport layer / electron injection layer, or a hole blocking layer / electron transport layer / electron injection layer are stacked in sequence, but exemplary embodiments are not limited thereto.

[0141] The second electrode EL2 may be disposed on the electron transport member ETR. The second electrode EL2 may be conductive. The second electrode EL2 may be formed of a metal alloy or a conductive compound. The second electrode EL2 may be a cathode. The second electrode EL2 may be a transmissive electrode, a semi-transmissive reflective electrode, or a reflective electrode.

[0142] The second electrode EL2 may be connected to the auxiliary electrode. When the second electrode EL2 is connected to the auxiliary electrode, the resistance of the second electrode EL2 may be reduced.

[0143] The encapsulation member TFE may be provided on the second electrode EL2. The encapsulation member TFE may be provided in common in the pixel regions Pxa-B, Pxa-G, and Pxa-R and the peripheral region NPxa. The encapsulation member TFE may directly cover the second electrode EL2. The encapsulation member TFE may include at least one inorganic film and may further include an organic film, or may have a structure in which inorganic and organic films are alternately repeated. In an exemplary embodiment, the encapsulation member TFE may include the inorganic film IL at the outermost periphery.

[0144] Hereinafter, a method for manufacturing a display device according to exemplary embodiments will be described with reference to the accompanying drawings.

[0145] Figure 9 is a flowchart of a method for manufacturing a display device according to an exemplary embodiment of the present invention. 10A to 10F is shown in sequence for making Figure 7 sectional views of some steps in the method of displaying a device as shown in FIG. Figure 11 and Figure 12 are cross-sectional views illustrating some steps in another method for manufacturing a display device according to an exemplary embodiment of the present invention. 10A to 10F Steps for preparing an upper display substrate in a method for manufacturing a display device according to an exemplary embodiment are sequentially illustrated. Figure 11 and Figure 12 Some steps for preparing an upper display substrate in a method for manufacturing a display device according to an exemplary embodiment are shown.

[0146] The method of manufacturing a display device according to an exemplary embodiment includes: preparing an upper display substrate S1; preparing a lower display substrate S2; and coupling the upper and lower display substrates S3. Preparing the lower display substrate S2 may include forming a display element on a base substrate.

[0147] refer to Figure 10A , the step S1 of preparing the upper display substrate may include preparing a base substrate SUB1. The step of preparing the base substrate SUB1 may include: forming a color filter layer CFL on the base substrate SUB1. The color filter layer CFL may include a first color filter part B-CFP, a second color filter part G-CFP, and a third color filter part R-CFP and a light blocking pattern BM. Each of the first color filter part B-CFP, the second color filter part G-CFP, and the third color filter part R-CFP may be formed to correspond to the first pixel area Pxa-B, the second pixel area Pxa-G, and the third pixel area Pxa-R (see Figure 3A ) overlap. Each of the first color filter part B-CFP, the second color filter part G-CFP, and the third color filter part R-CFP in the color filter layer CFL can be formed by a solution process such as a spin coating process, a slit coating process, an inkjet process, or a photolithography process. The first capping layer CAP1 may be disposed on the first color filter part B-CFP, the second color filter part G-CFP, and the third color filter part R-CFP and the light blocking pattern BM.

[0148] refer to Figure 10A and Figure 10B , a light blocking portion BP may be formed on the base substrate SUB1. The light blocking portion BP may be formed on the color filter layer CFL. A first capping layer CAP1 may be formed between the light blocking portion BP and the color filter layer CFL. The first capping layer CAP1 may be formed by depositing an inorganic material on the base substrate SUB1. The light blocking portion BP may be formed in the peripheral area NPxa (see Figure 3A ), and may define regions where the first light-controlling part CCP1, the second light-controlling part CCP2, and the third light-controlling part CCP3 are to be formed. The light-blocking part BP may be formed of an organic light-blocking material containing a black pigment or dye. The light-blocking part BP may be formed of an organic material having hydrophobicity.

[0149] refer to Figure 10B and Figure 10C , an inorganic film IOL may be formed on the light blocking portion BP and the base substrate SUB1. The inorganic film IOL may be formed to cover the upper surface and side surfaces of the light blocking portion BP and to cover the upper surface of the first capping layer CAP1 exposed in the region where the light blocking portion BP is not formed. Hereinafter, Figures 10A to 12 The "upper surface" of the light blocking portion BP in the embodiment may refer to the upper surface of the light blocking portion BP. Figures 3A to 7 The "lower surface" BP-US of the light blocking portion BP described in the above is the same surface. The inorganic film IOL may be formed by depositing an inorganic material. The inorganic material may include SiN x 、SiO x 、Al2O3、TiO x and ZrO x At least one of .

[0150] refer to Figure 10C and Figure 10D , the protective layer PL-4 may be formed by patterning a portion of the inorganic film IOL. In an exemplary embodiment, the inorganic film IOL may be patterned to expose the upper surface BP-US of the light-blocking portion BP. Because the inorganic film IOL is patterned to expose the upper surface BP-US of the light-blocking portion BP, the protective layer PL-4 may be formed to cover the side surface BP-LS of the light-blocking portion BP and not to contact the upper surface BP-US of the light-blocking portion BP. The light-blocking portion BP may be formed of a hydrophobic organic material, and the hydrophobic upper surface BP-US of the light-blocking portion BP may be exposed according to the patterning process of the inorganic film IOL.

[0151] refer to Figure 10D and Figure 10E , the light control layer CCL can be formed to vertically overlap with the pixel areas Pxa-B, Pxa-G, and Pxa-R. The light control layer CCL can be formed to overlap with the area defined by the protective layer PL-4. The light control layer CCL may include a first light control part CCP1, a second light control part CCP2, and a third light control part CCP3, and each of the light control parts CCP1, CCP2, and CCP3 can be formed to overlap with each area where the protective layer PL-4 is patterned. The light control layer CCL can be formed by applying a base resin material having a luminescent material and a scattering material dispersed therein to each area where the protective layer PL-4 is patterned, such as by an inkjet process. When forming the light control layer CCL, the light control layer CCL can be separated from the light blocking part BP by the protective layer PL-4, thereby preventing the luminescent material and the like included in the light control layer CCL from being damaged by the hydrophobic organic material included in the light blocking part BP. In addition, since the upper surface BP-US of the hydrophobic light-blocking portion BP is exposed, the light-controlling layer CCL may be formed in each region where the protection layer PL-4 is patterned without overflowing from the light-controlling layer CCL.

[0152] refer to Figure 10E and Figure 10FThe method for manufacturing a display device according to an exemplary embodiment may further include forming a second capping layer CAP2 after forming the light-controlling layer CCL. The second capping layer CAP2 may be formed on the light-controlling layer CCL and the light-blocking portion BP. The second capping layer CAP2 may be formed by depositing an inorganic material. The second capping layer CAP2 may be formed to cover the light-blocking portion BP and the upper surface BP-US of the light-controlling layer CCL.

[0153] Reference together Figure 10B 、 Figure 10C and Figure 11 According to another exemplary embodiment, a method for manufacturing a display device may further include forming a metal layer ML to cover a side surface BP-LS of the light blocking portion BP after forming the light blocking portion BP and before forming the inorganic film IOL. The metal layer ML may be formed by depositing a metal and then patterning the metal to expose an upper surface CAP1-US of the first capping layer CAP1 on which the light blocking portion BP is not formed and an upper surface BP-US of the light blocking portion BP. The metal layer ML may be formed of a reflective metal.

[0154] Reference together Figure 10C 、 Figure 10D and Figure 12 When forming the protective layer PL by patterning the inorganic film IOL in the method for manufacturing a display device according to yet another exemplary embodiment, the inorganic film IOL may be patterned to expose the upper surface BP-US of the light blocking portion BP and simultaneously expose the upper surface CAP1-US of the first capping layer CAP1 on which the light blocking portion BP is not formed. Thus, the protective layer PL may be formed to cover the side surface BP-LS of the light blocking portion BP.

[0155] According to exemplary embodiments, a protective layer is included between the light conversion member and the light blocking portion so that the luminescent material does not contact the light blocking portion. Therefore, the luminescent material is prevented from being damaged by the organic material included in the light blocking portion, thereby improving the light efficiency of the display device.

[0156] Although certain exemplary embodiments and examples have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather lies within the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those skilled in the art.

Claims

1. Display devices, including: A display panel having a pixel area and a peripheral area adjacent to the pixel area; a light control layer, disposed on the display panel and at least partially overlapping the pixel area; a light blocking portion at least partially overlapping the peripheral area; as well as A protective layer is disposed between the light-controlling layer and the light-blocking portion, wherein the protective layer exposes a lower surface of the light-controlling layer.

2. The display device according to claim 1, wherein The display panel includes a base substrate and at least one display element that is disposed on the base substrate in the pixel region and generates first light.

3. The display device according to claim 2, wherein The light-controlling layer includes a first light-controlling portion that transmits the first light, a second light-controlling portion that converts the first light into second light, and a third light-controlling portion that converts the first light into third light.

4. The display device according to claim 3, further comprising: The color filter layer is disposed on the light control layer.

5. The display device according to claim 4, wherein The light control layer includes a side surface adjacent to the light blocking portion and an upper surface adjacent to the color filter layer, and The protection layer covers the side surfaces and the upper surface of the light control layer. The display device according to claim 1 , wherein: The protective layer includes SiN x 、SiO x 、Al2O3、TiO x and ZrO x At least one of .

7. The display device according to claim 1, wherein The light blocking portion includes a side surface adjacent to the light control layer and a lower surface adjacent to the display panel and connected to the side surface, and The protection layer covers the side surfaces of the light blocking portion without contacting the lower surface of the light blocking portion.

8. The display device according to claim 1, further comprising: A metal layer is disposed between the protective layer and the light blocking portion.

9. The display device according to claim 1, wherein The light control layer includes a plurality of quantum dots.

10. The display device according to claim 1, wherein The protective layer has higher hydrophilicity than that of the light blocking portion.

11. A method for manufacturing a display device, the method comprising the steps of: preparing an upper display substrate, the upper display substrate including a pixel region and a peripheral region adjacent to the pixel region; preparing a lower display substrate, the lower display substrate including a display element that transmits light toward the pixel area; as well as connecting the upper display substrate and the lower display substrate, The step of preparing the upper display substrate includes the following steps: preparing a base substrate; forming a light blocking portion on a lower surface of the base substrate so that the light blocking portion at least partially overlaps the peripheral area; forming an inorganic film by depositing an inorganic material on the light blocking portion and the base substrate; forming a protective layer by patterning the inorganic film to expose an upper surface of the light blocking portion; and A light control layer is formed so that the light control layer at least partially overlaps the pixel area.

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