Ultrasonic suspension conveying mechanism

Abstract

The present application discloses an ultrasonic suspension conveying mechanism for conveying solar cell silicon wafers, comprising a base, on which an ultrasonic suspension component and a silicon wafer conveying component are mounted, wherein the ultrasonic suspension component comprises an ultrasonic generator and a suspension plate, the ultrasonic generator emits ultrasonic waves to generate a predetermined suspension support force at a predetermined height above the suspension plate, so that the silicon wafer is suspended at the predetermined height; the silicon wafer conveying component comprises a conveyor belt for conveying the silicon wafer suspended at the predetermined height. The ultrasonic suspension conveying mechanism realizes contactless conveying of solar cell silicon wafers, can effectively avoid problems such as cracking, breakage, scratching and contamination of silicon wafers, improves the quality of silicon wafers, and reduces waste of resources. The ultrasonic suspension conveying mechanism can be applied to the circulation of silicon wafers between various processing procedures, and can be used to convey silicon wafers of various specifications, with a wide range of applications.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell conveying, and in particular to an ultrasonic suspension conveying mechanism. Background Art

[0002] In the processing and production of crystalline silicon solar cells, solar cell silicon wafers need to flow between different processing stations. In the circulation process of existing solar cell silicon wafers, silicon wafers are transferred from one station to another through a contact transmission line (such as a conveyor belt), and the friction between the transmission line and the silicon wafer drives the movement of the silicon wafer. Various uncontrollable factors can easily cause quality problems such as cracking, breakage, scratches and contamination of the silicon wafer. Some defective products need to be scrapped directly, resulting in a waste of resources, while some defective products need to be downgraded, affecting the power generation efficiency and service life of the finished solar cell wafers. Summary of the invention

[0003] In view of the above-mentioned deficiencies in the prior art, the present application provides an ultrasonic suspension conveying mechanism to achieve contactless conveyance of solar cell silicon wafers and improve the quality of silicon wafers.

[0004] The technical solution adopted in the present application is to provide an ultrasonic suspension conveying mechanism for conveying solar cell silicon wafers, comprising a base, on which an ultrasonic suspension component and a silicon wafer conveying component are installed, wherein:

[0005] The ultrasonic suspension assembly includes an ultrasonic generator and a suspension plate, wherein the ultrasonic generator emits ultrasonic waves to generate a predetermined suspension support force at a predetermined height above the suspension plate, so that the silicon chip is suspended at the predetermined height;

[0006] The silicon wafer conveying assembly includes a conveyor belt for conveying silicon wafers suspended at the predetermined height, wherein the silicon wafers are suspended above the conveyor belt.

[0007] As an improvement to the above scheme, a silicon wafer conveying assembly is provided at one end of the conveyor belt, and the silicon wafer conveying assembly includes a fork tooth, which is used to convey the silicon wafer conveyed to the one end of the conveyor belt to the carrier or to convey the silicon wafer on the carrier to the one end of the conveyor belt. The silicon wafer conveyed to the one end or the silicon wafer on the carrier is placed on the fork tooth, and the fork tooth is connected to the lifting mechanism and the translation mechanism.

[0008] As an improvement to the above scheme, the fork tine is connected to a negative pressure generating device, and the fork tine is located above or below the silicon wafer suspended at the predetermined height. When the fork tine is arranged above the silicon wafer, negative pressure adsorption holes are arranged on the bottom surface of the fork tine; when the fork tine is arranged below the silicon wafer, negative pressure adsorption holes are arranged on the top surface of the fork tine.

[0009] As an improvement to the above scheme, an in-position sensor is provided on one end of the conveyor belt where the silicon wafer conveying assembly is arranged. The in-position sensor is used to detect the silicon wafer at the one end of the conveyor belt. When the in-position sensor detects the silicon wafer, the negative pressure generating device, the lifting mechanism and the translation mechanism are operated.

[0010] As an improvement to the above solution, the lifting mechanism includes a lifting cylinder, the fork teeth are connected to the movable end of the lifting cylinder, and the translation mechanism includes a horizontally retractable conveying cylinder, the lifting cylinder is connected to the movable end of the conveying cylinder.

[0011] As an improvement to the above solution, the conveying cylinder is fixedly arranged on a mounting seat, a guide rail is installed on the mounting seat, and the lifting cylinder is slidably connected to the guide rail via a slider.

[0012] As an improvement to the above scheme, multiple groups of silicon wafer positioning parts are arranged on the conveyor belt, and each group of silicon wafer positioning parts includes two baffles arranged at intervals. The baffles are protruding on the surface of the conveyor belt and extend perpendicular to the running direction of the conveyor belt. The two baffles are used to position the short side of the silicon wafer suspended at the predetermined height.

[0013] As an improvement to the above scheme, the silicon wafer is suspended at a height of 0.05mm to 0.1mm above the suspension plate, the surface of the conveyor belt and the top surface of the suspension plate are located in the same plane, the height of the baffle protruding from the surface of the conveyor belt is 3.5mm to 6.0mm, and the short side of the silicon wafer abuts against the baffle.

[0014] As an improvement to the above scheme, two conveyor belts are arranged at intervals along the running direction thereof, and the silicon wafer positioning parts on the two conveyor belts correspond to each other one by one, so as to position the silicon wafer from both sides, and the distance between the two conveyor belts is 1 / 3 to 9 / 10 times of the width of the silicon wafer; a limit plate is respectively arranged on the outer side of the two conveyor belts, and the limit plate extends along the running direction of the conveyor belt, so as to position the long side of the silicon wafer suspended at the predetermined height.

[0015] As an improvement to the above scheme, the ultrasonic generating device includes an ultrasonic controller and an ultrasonic transducer, and the suspension plate is connected to the ultrasonic transducer; the suspension plate is detachably connected to the base, and a buffer layer is compounded inside the suspension plate, and the thickness of the buffer layer is not less than 1 / 4 of the total thickness of the suspension plate.

[0016] Beneficial effect: In the ultrasonic suspension conveying mechanism provided by the present application, the ultrasonic suspension component includes an ultrasonic generator and a suspension plate, the ultrasonic generator emits ultrasonic waves to generate a predetermined suspension support force at a predetermined height above the suspension plate, so that the silicon wafer is suspended at the predetermined height, and the silicon wafer conveying component includes a conveyor belt for conveying the silicon wafer suspended at the predetermined height. The ultrasonic suspension conveying mechanism realizes the contactless conveying of solar cell silicon wafers, which can effectively avoid problems such as cracking, breakage, scratches and contamination of silicon wafers, improve the quality of silicon wafers, and reduce resource waste. The ultrasonic suspension conveying mechanism can be applied to the circulation of silicon wafers between various processing procedures, and can be used to convey silicon wafers of various specifications, with a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional diagram of the ultrasonic suspension conveying mechanism in the embodiment of the present application;

[0018] Figure 2 yes Figure 1 A magnified view of part A in FIG.

[0019] Figure 3 It is a side view of the ultrasonic suspension conveying mechanism in the embodiment of the present application. DETAILED DESCRIPTION

[0020] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of the present application.

[0021] In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically limited. In the embodiments of the present application, all directional indications (such as up, down, top, bottom, horizontal, vertical, long side, short side ...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0022] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0023] The present application provides an ultrasonic suspension conveying mechanism for conveying solar cell silicon wafers between different technician workstations. The "silicon wafer" mentioned in the present application refers to the "solar cell silicon wafer", see Figure 1 , Figure 1 The three-dimensional structure of the ultrasonic suspension conveying mechanism in the embodiment of the present application is shown. The ultrasonic suspension conveying mechanism includes a base 10, on which an ultrasonic suspension component and a silicon wafer conveying component are installed.

[0024] The ultrasonic suspension component includes an ultrasonic generator and a suspension plate 22. The suspension plate 22 is connected to the ultrasonic generator. The ultrasonic generator emits ultrasonic waves to generate a predetermined suspension support force at a predetermined height above the suspension plate 22, so that the silicon wafer 100 is suspended at the predetermined height.

[0025] Furthermore, the suspension plate 22 is detachably connected to the base 10, and the ultrasonic generating device includes an ultrasonic controller and an ultrasonic transducer 21. The ultrasonic transducer 21 is driven by the ultrasonic controller to emit ultrasonic waves, and the ultrasonic waves generate a suspension support force. The suspension plate 22 is connected to the ultrasonic transducer 21 and is arranged within the range of the suspension support force that can be generated by the ultrasonic waves, and a predetermined suspension support force is generated at a predetermined height above the suspension plate 22, so that the silicon wafer 100 is suspended at the predetermined height. It can be understood that the predetermined suspension support force is equal to the gravity of the silicon wafer 100.

[0026] In practical applications, the absolute suspension height of the silicon wafer 100 can be adjusted by adjusting the height at which the suspension plate 22 is connected to the base 10 to adapt to different silicon wafer conveying components.

[0027] Furthermore, the frequency of the ultrasonic transducer 21 is 20KHZ to 60KHZ, and the suspension plate 22 is connected to the ultrasonic transducer 21 via special screws.

[0028] Furthermore, a buffer layer is compounded in the suspension plate 22, and preferably the buffer layer is compounded in the middle of the suspension plate 22. The setting of the buffer layer can reduce the shaking of the suspension plate 22, improve the installation stability of the suspension plate 22, and absorb the noise generated by the ultrasonic wave, thereby improving the applicability of the ultrasonic suspension conveying mechanism.

[0029] Furthermore, the buffer layer is a functional material layer such as a polyurethane layer, a fluororubber layer, etc. Preferably, the thickness of the buffer layer is not less than 1 / 4 of the total thickness of the suspension board.

[0030] The silicon wafer conveying assembly includes a conveyor belt 31 for conveying the silicon wafer 100 suspended at the predetermined height. Similarly, the silicon wafer 100 is suspended above the conveyor belt 31 without contacting the conveyor belt 31, and a predetermined distance is maintained between the bottom surface of the silicon wafer 100 and the top surface of the conveyor belt 31.

[0031] In a preferred embodiment, the top surface of the conveyor belt 31 and the top surface of the suspension board 22 are located in the same plane, that is, the predetermined distance is equal to the predetermined height. In other embodiments, the top surface of the conveyor belt 31 may also be lower than or higher than the top surface of the suspension board 22. It can be understood that when the top surface of the conveyor belt 31 is lower than the top surface of the suspension board 22, the predetermined distance is greater than the predetermined height, and when the top surface of the conveyor belt 31 is higher than the top surface of the suspension board 22, the predetermined distance is less than the predetermined height.

[0032] Furthermore, the suspension plate 22 extends along the running direction of the conveyor belt 31 to ensure that the silicon wafer 100 is always suspended above the suspension plate 22 at the same height in parallel during the process of the conveyor belt 31 transporting the silicon wafer 100 .

[0033] In a preferred embodiment, the silicon wafer 100 is suspended above the suspension plate 22 at a height of 0.05 mm to 0.1 mm.

[0034] Please refer to Figure 2 , Figure 2 Shows Figure 1 The A-part enlarged structure in the figure, further, a plurality of groups of silicon wafer positioning parts are arranged on the conveyor belt 31, and each group of the silicon wafer positioning parts includes two spaced-apart baffles 310, and the baffles 310 are protruded on the surface of the conveyor belt 31 and extend perpendicular to the running direction of the conveyor belt 31. In this embodiment, the two baffles 310 are used to position the short side of the silicon wafer 100 suspended at the predetermined height.

[0035] It can be understood that in other embodiments, the two blocking bars 310 can also be used to position the long side of the silicon wafer 100 suspended at the predetermined height.

[0036] Furthermore, the two short sides of the silicon wafer 100 abut against the two baffles 310, that is, the two baffles 310 of the silicon wafer positioning portion act on the two short sides of the silicon wafer 100, and play a clamping and positioning role on the silicon wafer 100, so that the conveyor belt 31 transports the silicon wafer 100 to a predetermined position. In a preferred embodiment, a slot for accommodating the short side of the silicon wafer 100 is also provided on the side of the baffle 310 that contacts the silicon wafer 100.

[0037] Furthermore, the height of the baffle 310 protruding from the surface of the conveyor belt 31 is 3.5mm to 6.0mm, and preferably the height of the baffle 310 protruding from the surface of the conveyor belt 31 is 5.0mm, so as to effectively clamp and position the silicon wafer 100 to prevent the silicon wafer 100 from escaping from the silicon wafer positioning part and causing a conveying failure.

[0038] Optionally, the baffle 310 is integrally formed with the conveyor belt 31; or, the baffle 310 is connected to the conveyor belt 31 by bonding, hot pressing, ultrasonic pressing, screw connection, etc. The material of the baffle 310 and the conveyor belt 31 may be the same or different, and preferably the baffle 310 is made of soft material.

[0039] In this embodiment, two conveyor belts 31 are arranged at intervals along the running direction thereof, and the silicon wafer positioning parts on the two conveyor belts 31 correspond to each other one by one, so as to position the silicon wafer 100 from both sides. Furthermore, the distance between the two conveyor belts 31 is 1 / 3 to 9 / 10 times the width of the silicon wafer, and preferably the distance between the two conveyor belts 31 is 1 / 2 times the width of the silicon wafer. It can be understood that the distance between the two conveyor belts 31 can be adaptively adjusted according to the specifications of the silicon wafer.

[0040] Furthermore, a limiting plate 32 is respectively provided on the outer side of the two conveyor belts 31 , and the limiting plate 32 extends along the running direction of the conveyor belts 31 , and is used to position the long side of the silicon wafer 100 suspended at the predetermined height.

[0041] It is understandable that in other embodiments, only one conveyor belt 31 may be provided along its running direction. In this case, the conveyor belt 31 is located below the middle of the silicon wafer 100 , and the width of the conveyor belt 31 is smaller than the width of the silicon wafer 100 .

[0042] In other embodiments, the limiting plate 32 may also be used to position the wide side of the silicon wafer 100 suspended at the predetermined height.

[0043] The limiting plates 32 and the plurality of silicon wafer positioning parts jointly position the silicon wafer 100 suspended at a predetermined height above the suspension plate 22. Specifically, the wide side of the silicon wafer 100 suspended above the conveyor belt 31 abuts against the blocking bar 310 of the silicon wafer positioning part, and the long side is positioned by two limiting plates 32.

[0044] Furthermore, the limiting plate 32 can be detachably connected to the base 10, and the distance between the two limiting plates 32 can be adjusted to match silicon wafers of different specifications.

[0045] In this embodiment, the conveyor belt 31 is an endless rotating belt driven by a servo motor 30. In practical applications, the ultrasonic suspension conveying mechanism can be set between two solar cell processing stations. One end of the conveyor belt 31 is connected to one solar cell processing station, and the other end is connected to another solar cell processing station, so as to facilitate the flow of solar cell silicon wafers between different processing stations.

[0046] In one embodiment, a silicon wafer transfer assembly is provided at one end of the conveyor belt 31, and the silicon wafer transfer assembly is used to transfer the silicon wafer 100 transported to the one end of the conveyor belt 31 to a carrier or to transfer the silicon wafer on the carrier to the one end of the conveyor belt 31, so as to transfer the silicon wafer to the next process.

[0047] Optionally, the carrier may be a silicon wafer carrier used in solar cell processing procedures, such as a silicon wafer basket, a metal boat, or a graphite boat.

[0048] Please refer to Figure 3 , Figure 3 The side view structure of the ultrasonic suspension conveying mechanism described in the embodiment of the present application is shown. The figure shows the side view structure of the one end of the conveyor belt 31. The silicon wafer conveying assembly includes a fork tine 41. The silicon wafer 100 conveyed to the one end of the conveyor belt 31 or the silicon wafer on the carrier is placed on the fork tine 41. The fork tine 41 is connected to the lifting mechanism and the translation mechanism.

[0049] The fork tine 41 matches the structure of the carrier, which is convenient for taking and placing the silicon wafer. Furthermore, the fork tine 41 is made of a material with high finish, such as ceramic.

[0050] Furthermore, the fork tine 41 is connected to a negative pressure generating device, and a negative pressure adsorption hole is opened on one of the surfaces of the fork tine 41. The negative pressure adsorption hole is connected to the negative pressure generating device. When the negative pressure generating device is running, a suction force is generated at the negative pressure adsorption hole to adsorb and fix the silicon wafer 100 placed on the fork tine 41 on the fork tine 41, so as to facilitate the transfer of the silicon wafer 100 to a carrier or the removal of the silicon wafer from the carrier.

[0051] Optionally, the tine 41 is arranged above or below the silicon wafer 100. It can be understood that when the tine 41 is arranged above the silicon wafer 100, negative pressure adsorption holes are arranged on the bottom surface of the tine 41; when the tine 41 is arranged below the silicon wafer 100, negative pressure adsorption holes are arranged on the top surface of the tine 41.

[0052] Please continue reading Figure 2 In this embodiment, two fork teeth 41 are arranged at intervals, and the two fork teeth are arranged parallel to the running direction of the silicon wafer 100. The two fork teeth 41 arranged at intervals are arranged between the two conveyor belts 31. The two fork teeth 41 are located above the suspended silicon wafer 100, and negative pressure adsorption holes are arranged on the bottom surface of the fork teeth 41.

[0053] In this embodiment, the working principle of the silicon wafer conveying assembly is explained by taking the example that the silicon wafer 100 conveyed to the one end of the conveyor belt 31 is conveyed to the carrier. Specifically, the conveyor belt 31 drives the silicon wafer 100 to run to the one end, at which time, the silicon wafer 100 is transported to the bottom of the fork tine 41; then the negative pressure generating device is operated to generate a negative pressure suction force at the negative pressure adsorption hole to adsorb and fix the silicon wafer 100 on the bottom surface of the fork tine 41; then the lifting mechanism is operated to lift the fork tine 41 and the silicon wafer 100 upward to the entrance of the carrier; the translation mechanism is operated to push the fork tine 41 and the silicon wafer 100 into the corresponding position in the carrier; the negative pressure generating device stops running, and the fork tine 41 releases the silicon wafer 100; the translation mechanism and the lifting mechanism are respectively operated in opposite directions to reset.

[0054] In other embodiments, the silicon wafer conveying assembly can also be used to transfer the silicon wafer on the carrier to the one end portion of the conveyor belt 31. Specifically, the lifting mechanism operates to lift the fork tine 41 upward to the entrance of the carrier; the translation mechanism operates to push the fork tine 41 into the corresponding position in the carrier, so that the silicon wafer in the carrier is located above or below the fork tine; the negative pressure generating device operates to adsorb and fix the silicon wafer on the surface of the fork tine 41; then the translation mechanism and the lifting mechanism operate in the opposite direction to reset, and transfer the silicon wafer to the one end portion; the negative pressure generating device stops operating, and the silicon wafer is placed on the silicon wafer positioning portion of the conveyor belt 31, and is transported to the next workstation by the conveyor belt 31.

[0055] Furthermore, the lifting mechanism includes a lifting cylinder 51 , the fork teeth 41 are connected to the movable end of the lifting cylinder 51 , and the translation mechanism includes a horizontally retractable conveying cylinder 61 , the lifting cylinder 51 is connected to the movable end of the conveying cylinder 61 .

[0056] It can be understood that the movable end of the cylinder is relative to the fixed end, the fixed end corresponds to the cylinder body part of the cylinder, and the movable end corresponds to the piston part of the cylinder.

[0057] In this embodiment, the lifting cylinder 51 and the conveying cylinder 61 are arranged below the suspension plate 22. The conveying cylinder 61 is fixedly arranged on a mounting seat 60, on which a guide rail 62 is mounted, and the lifting cylinder 51 is slidably connected to the guide rail 62 via a slider 52.

[0058] The guide rail 62 can limit the horizontal movement range of the fork tine 41, so that the fork tine 41 can accurately transport the silicon wafer 100 to a predetermined position. When the translation mechanism is running, the transport cylinder 61 pushes the lifting cylinder 51 and the fork tine 41 to slide horizontally along the guide rail 62 along with the slider 52.

[0059] The base 10 is fixedly connected to the mounting seat 60 , and a mounting hole is provided on the mounting seat 60 . The ultrasonic suspension conveying mechanism can be installed on different workstations through the mounting seat 60 , and has a wide range of applications.

[0060] In this embodiment, a limit assembly 53 for limiting the position of the movable end of the conveying cylinder 61 is also provided on the mounting seat 60. The limit assembly 53 is provided at the starting point and the end point corresponding to the stroke of the movable end of the conveying cylinder 61. Figure 1 Only the limit assembly 53 disposed at the starting point corresponding to the stroke of the movable end of the conveying cylinder 61 is shown, and the limit assembly 53 includes an elastic limit buffer head, and the movable end of the conveying cylinder 61 can abut against the elastic limit buffer head. While limiting the stroke of the movable end of the conveying cylinder 61, the elastic limit buffer head can effectively absorb the inertia force generated by the operation of the movable end of the conveying cylinder 61, so that the operation of the conveying cylinder 61 is smoother and more stable.

[0061] Furthermore, the lifting cylinder 51 is connected to the movable end of the conveying cylinder 61 through the connecting portion 54. When the movable end of the conveying cylinder 61 drives the lifting cylinder 51 and the fork tine 41 to move horizontally to a predetermined position, the elastic limit buffer head abuts against the connecting portion 54. The movable end of the conveying cylinder 61 and the limit assembly 53 are respectively arranged on both sides of the connecting portion 54.

[0062] In one embodiment, the ultrasonic suspension conveying mechanism also includes an in-place sensor (not shown in the figure), which is arranged on one end of the conveyor belt 31 where the silicon wafer conveying assembly is arranged, and is used to detect the silicon wafer on the one end. When the in-place sensor detects the silicon wafer, the negative pressure generating device, the lifting mechanism, and the translation mechanism are operated.

[0063] Furthermore, the ultrasonic suspension conveying mechanism also includes a controller, the in-position sensor is electrically connected to the input end of the controller, and the ultrasonic controller, servo motor 30, negative pressure generating device, lifting mechanism, and translation mechanism are electrically connected to the output end of the controller. The controller controls the start and stop of the ultrasonic transducer 21 through the ultrasonic controller.

[0064] When the in-place sensor detects the silicon wafer, a feedback signal is sent to the controller, so that when the controller receives the feedback signal, it sends a corresponding control signal to the negative pressure generating device, the lifting mechanism, and the translation mechanism to operate the negative pressure generating device, the lifting mechanism, and the translation mechanism, which has a high degree of automation and is easy to control.

[0065] Optionally, the in-position sensor is an optical fiber sensor, a photoelectric sensor, an infrared detector, or any other instrument that can detect the silicon wafer 100 and send a feedback signal to the controller, and the present application does not limit this.

[0066] Optionally, the controller is any programmable logic controller or intelligent terminal integrated with an MCU (micro control unit) circuit, a single-chip microcomputer, a PLC (programmable logic controller) or a terminal processor, and this application does not limit this.

[0067] In a preferred embodiment, when the controller receives the feedback signal from the in-position sensor, it sends a control signal to the servo motor 30 to stop the servo motor 30 from running, so that the conveyor belt 31 stops transporting the silicon wafer 100. After a predetermined time interval, the controller sends a control signal to the servo motor 30 to start the servo motor 30 to allow the conveyor belt 31 to resume transporting the silicon wafer 100.

[0068] Optionally, the predetermined time interval is set to be no less than the time it takes for the silicon wafer transfer assembly to transfer the silicon wafer 100 to the carrier and reset, or the predetermined time interval is set to be no less than the time it takes for the silicon wafer transfer assembly to transfer the silicon wafer on the carrier to the conveyor belt 31.

[0069] The ultrasonic suspension conveying mechanism provided in the present application realizes contactless conveying of solar cell silicon wafers, which can effectively avoid problems such as cracking, breakage, scratching and contamination of silicon wafers, improve the quality of silicon wafers, and reduce resource waste. The ultrasonic suspension conveying mechanism can be applied to the flow of silicon wafers between various processing steps, and can be used to transport silicon wafers of various specifications, with a wide range of applications.

[0070] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An ultrasonic suspension conveying mechanism for conveying solar cell silicon wafers, comprising a base, characterized in that: An ultrasonic suspension component and a silicon wafer conveying component are installed on the base, wherein: The ultrasonic suspension assembly includes an ultrasonic generator and a suspension plate, wherein the ultrasonic generator emits ultrasonic waves to generate a predetermined suspension support force at a predetermined height above the suspension plate, so that the silicon chip is suspended at the predetermined height; The silicon wafer conveying assembly includes a conveyor belt for conveying silicon wafers suspended at the predetermined height, the silicon wafers are suspended above the conveyor belt, and a silicon wafer conveying assembly is arranged at one end of the conveyor belt, the silicon wafer conveying assembly includes a fork for conveying the silicon wafer conveyed to the one end of the conveyor belt to the carrier or conveying the silicon wafer on the carrier to the one end of the conveyor belt, the silicon wafer conveyed to the one end or the silicon wafer on the carrier is placed on the fork, the fork is connected to the lifting mechanism and the translation mechanism, the fork is connected to the negative pressure generating device, the fork is located above or below the silicon wafer suspended at the predetermined height, when the fork is arranged above the silicon wafer, negative pressure adsorption holes are arranged on the bottom surface of the fork; when the fork is arranged below the silicon wafer, negative pressure adsorption holes are arranged on the top surface of the fork.

2. The ultrasonic levitation conveying mechanism according to claim 1, characterized in that: An in-position sensor is provided on one end of the conveyor belt where the silicon wafer conveying assembly is provided. The in-position sensor is used to detect the silicon wafer at the one end of the conveyor belt. When the in-position sensor detects the silicon wafer, the negative pressure generating device, the lifting mechanism and the translation mechanism are operated.

3. The ultrasonic levitation conveying mechanism according to claim 1, characterized in that: The lifting mechanism comprises a lifting cylinder, the fork teeth are connected to the movable end of the lifting cylinder, and the translation mechanism comprises a horizontally retractable conveying cylinder, the lifting cylinder is connected to the movable end of the conveying cylinder.

4. The ultrasonic levitation conveying mechanism according to claim 3, characterized in that: The conveying cylinder is fixedly arranged on a mounting seat, a guide rail is installed on the mounting seat, and the lifting cylinder is slidably connected to the guide rail via a sliding block.

5. The ultrasonic levitation conveying mechanism according to claim 1, characterized in that: A plurality of groups of silicon wafer positioning parts are arranged on the conveyor belt, and each group of the silicon wafer positioning parts includes two spaced-apart baffles, which are protruded on the surface of the conveyor belt and extend perpendicularly to the running direction of the conveyor belt. The two baffles are used to position the short side of the silicon wafer suspended at the predetermined height.

6. The ultrasonic levitation conveying mechanism according to claim 5, characterized in that: The silicon wafer is suspended at a height of 0.05mm to 0.1mm above the suspension plate, the conveyor belt surface and the top surface of the suspension plate are located in the same plane, the baffle protrudes from the conveyor belt surface by 3.5mm to 6.0mm, and the short side of the silicon wafer abuts against the baffle.

7. The ultrasonic levitation conveying mechanism according to claim 5, characterized in that: Two conveyor belts are arranged at intervals along the running direction thereof, and the silicon wafer positioning parts on the two conveyor belts correspond to each other one by one, so as to position the silicon wafer from both sides, and the distance between the two conveyor belts is 1 / 3 to 9 / 10 times of the width of the silicon wafer; a limit plate is respectively arranged on the outer side of the two conveyor belts, and the limit plate extends along the running direction of the conveyor belt, so as to position the long side of the silicon wafer suspended at the predetermined height.

8. The ultrasonic levitation conveying mechanism according to claim 1, characterized in that: The ultrasonic generating device comprises an ultrasonic controller and an ultrasonic transducer, and the suspension plate is connected to the ultrasonic transducer; the suspension plate is detachably connected to the base, and a buffer layer is compounded inside the suspension plate, and the thickness of the buffer layer is not less than 1 / 4 of the total thickness of the suspension plate.

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