Inspection device and processing device

Abstract

Provided are an inspection device and a processing device. The inspection device inspects an object to be inspected to which a tape is attached and which is mounted to a frame by the tape, and the inspection device has: an object-to-be-inspected holding mechanism having a placement portion with a transparent body exposed upward and downward, an upper surface of the transparent body being a placement surface on which the object to be inspected is placed, the object-to-be-inspected holding mechanism being capable of holding the object to be inspected placed on the placement surface; and a photographing mechanism having a first photographing unit provided above the placement portion, a second photographing unit provided below the placement portion, and a linking portion linking the first photographing unit and the second photographing unit, the photographing mechanism being capable of photographing the object to be inspected held by the object-to-be-inspected holding mechanism from the upper surface side by the first photographing unit and from the lower surface side by the second photographing unit, the photographing mechanism being capable of photographing the same position on the upper surface side and the lower surface side of the object to be inspected.

Description

TECHNICAL FIELD

[0001] The present application relates to an inspection device that inspects a workpiece on which a process has been performed by photographing the workpiece, and a processing device having the inspection device. BACKGROUND

[0002] A plurality of devices are formed on the front surface of a wafer in a thin plate shape, and when the wafer is divided for each device, a device chip mounted on an electronic device can be formed. In the division of a workpiece such as a wafer, a processing device such as a cutting device that can cut a workpiece with a ring-shaped cutting tool or a laser processing device that processes a workpiece by irradiating a laser beam on the workpiece is used, for example (see, for example, Patent Literature 1).

[0003] In order to confirm that the processing of the workpiece has been properly performed, an inspection device that inspects a processed site of the workpiece processed by the processing device by photographing the processed site is used. The inspection device inspects the workpiece as an object to be inspected by photographing the workpiece. In the inspection device, the shape and size, distribution, and the like of a defect called a chipping formed on the workpiece along a processing mark formed on the workpiece are investigated. In addition, the size of a device chip formed by dividing the workpiece is confirmed.

[0004] Patent Literature 1: Japanese Patent Application Laid-Open No. 2018-166178

[0005] When the workpiece is inspected as an object to be inspected by the inspection device, it is desirable to inspect a specific site of the object to be inspected by photographing the site from the front surface and the back surface. In the past, in the case where the specific site of the object to be inspected is inspected from the front surface and the back surface, first, the specific site of the object to be inspected is photographed from the front surface side by a photographing unit, and then the front surface and the back surface of the object to be inspected are turned over and the object to be inspected is photographed from the back surface side. Therefore, effort and time are required to turn over the front surface and the back surface in the inspection of the object to be inspected.

[0006] In addition, in order to observe the specific site on the back surface side of the object to be inspected, after the front surface and the back surface of the object to be inspected are turned over, the position of the photographing unit must be aligned with high precision at the specific site. Sometimes, a defect called a notch is formed on the outer peripheral portion of a wafer on which a device is formed. Therefore, it is considered that the alignment of the photographing unit is performed with the notch as a reference. However, the accuracy of the formation position of the notch is lower than the accuracy of a pattern formed on the object to be inspected, and sometimes the photographing unit cannot be positioned with high precision even with the notch as a reference. SUMMARY

[0007] The present application was made in view of the problem, and an object thereof is to provide an inspection device that can easily observe the same position of an object to be inspected from the front surface and the back surface side, and a processing device having the inspection device.

[0008] According to one embodiment of the present application, there is provided an inspection apparatus which inspects an object to be inspected to which a tape is attached and which is mounted to a frame by the tape, characterized by comprising: an object holding mechanism which has a placement portion having a transparent body exposed upward and downward, an upper surface of the transparent body serving as a placement surface on which the object to be inspected is placed through the tape, the object holding mechanism being capable of holding the object to be inspected placed on the placement surface; a photographing mechanism which has a first photographing unit provided above the placement portion, a second photographing unit provided below the placement portion, and a connection portion connecting the first photographing unit and the second photographing unit; and a moving unit which is capable of relatively moving the photographing mechanism with respect to the placement portion in a direction parallel to the placement surface, the photographing mechanism being capable of photographing the object to be inspected held by the object holding mechanism on the placement surface of the placement portion from the upper surface side by the first photographing unit and capable of photographing the object to be inspected from the lower surface side by the second photographing unit, the photographing mechanism being capable of photographing the same position on the upper surface side and the lower surface side of the object to be inspected.

[0009] Preferably, the object holding mechanism has a tape holding portion having a tape suction holding surface on an outer peripheral side of the placement portion, the tape suction holding surface being capable of suction holding the tape in a region between an outer periphery of the object to be inspected placed on the object holding mechanism and an inner periphery of the frame mounted to the object to be inspected by the tape, and a frame supporting portion disposed around the tape holding portion, capable of supporting the frame. In addition, it is preferable that the height of the placement surface of the placement portion be lower than the height of the tape suction holding surface of the tape holding portion.

[0010] In addition, it is preferable that the placement surface of the placement portion be coated with a fluororesin.

[0011] In addition, there is provided a processing apparatus which has the inspection apparatus of one embodiment of the present application, an object to be processed holding unit which holds an object to be processed, a processing unit which processes the object to be processed held by the object to be processed holding unit, and a conveyance unit which conveys the object to be processed from the object to be processed holding unit to the placement portion of the object holding mechanism, characterized in that the inspection apparatus is capable of photographing the object to be processed processed by the processing unit as the object to be inspected by the photographing mechanism.

[0012] The placement portion of the object holding mechanism of the inspection apparatus of one embodiment of the present application has a transparent body. When the object to be inspected is placed on the placement surface of the placement portion, not only the upper surface of the object to be inspected but also the lower surface of the object to be inspected can be observed from the outside through the placement portion. Therefore, when the object to be inspected is photographed from both sides, it is not necessary to turn over the front surface and the back surface of the object to be inspected.

[0013] And, the inspection device has a photographing mechanism having a first photographing unit provided above the placement portion and a second photographing unit provided below the placement portion. When an object to be inspected is placed on the placement surface of the placement portion and held by the object to be inspected holding mechanism, the object to be inspected can be photographed from the upper surface by the first photographing unit, and the object to be inspected can be photographed from the lower surface through the transparent body by the second photographing unit.

[0014] In particular, in the photographing mechanism, the first photographing unit and the second photographing unit are connected by a connecting portion. Therefore, even if the photographing mechanism is moved by the moving unit, the relative positions of the first photographing unit and the second photographing unit do not change. Therefore, it is not necessary to align the positions of the first photographing unit and the second photographing unit with each other, and the same position of the object to be inspected can be easily photographed from the upper surface and the lower surface.

[0015] Therefore, according to the present application, an inspection device capable of easily observing the same position of an object to be inspected from the front and back sides and a processing device having the same are provided. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a perspective view schematically showing an object to be inspected.

[0017] Figure 2 is a perspective view schematically showing a processing device having an inspection device.

[0018] Figure 3 is a plan view schematically showing a processing device having an inspection device.

[0019] Figure 4 is a perspective view schematically showing an inspection device.

[0020] Figure 5 (A) of FIG. 1 is a perspective view schematically showing an object to be inspected holding mechanism, Figure 5 (B) of FIG. 1 is a perspective view schematically showing a photographing mechanism.

[0021] Figure 6 (A) of FIG. 2 is a plan view schematically showing a placement portion, Figure 6 (B) of FIG. 2 is a sectional view schematically showing the placement portion.

[0022] Figure 7 is a sectional view schematically showing the positional relationship of the object to be inspected holding mechanism, the photographing mechanism, and the object to be inspected when the object to be inspected is inspected.

[0023] REFERENCE NUMERALS

[0024] 1: object to be inspected; 1a: front surface; 1b: back surface; 3: division; 3a: processing mark; 5: device; 7: tape; 9: frame; 11: frame unit; 2: processing device; 4: base; 6: cassette support table; 8: conveyance track; 10: opening; 10a: dust and drip shield; 12: moving table; 14: object to be processed holding unit; 16, 42: conveyance unit; 18, 44, 66a, 66b, 86, 98a, 98b: guide rail; 20, 46, 68a, 68b, 88, 100a, 100b: moving body; 22, 48, 70, 90, 102a, 102b: ball screw; 24, 50, 72, 92, 104a, 104b: pulse motor; 26, 52: arm portion; 28: suction portion; 30: push-pull mechanism; 32: processing unit; 34: cutting tool; 36: spindle housing; 38: opening; 40: cleaning device; 54: holding mechanism; 56: inspection device; 58: object to be inspected holding mechanism; 60: base; 62: opening; 64a, 64b: moving unit; 74, 84, 94a, 94b: support structure; 76: placement portion; 76a: placement surface; 78: tape holding portion; 78a: suction groove; 78b: tape suction holding surface; 80: frame support portion; 82: imaging mechanism; 96a, 96b: elevation mechanism; 106a, 106b: imaging unit; 108: link portion; 110: display portion; 112: alarm lamp. DETAILED DESCRIPTION

[0025] An embodiment of one mode of the present application will be described with reference to the drawings. The inspection device of the present embodiment is capable of, for example, inspecting an object to be inspected, which is a wafer that has been processed by a processing device, by simultaneously imaging the object to be inspected from the upper surface and the lower surface.

[0026] First, the object to be inspected will be described. The object to be inspected is, for example, a substantially round plate-shaped wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or another semiconductor. Alternatively, the object to be inspected is a substrate made of a material such as sapphire, glass, quartz, or the like. Further, the object to be inspected can be a package substrate or the like that contains a plurality of device chips sealed with a molded resin or the like.

[0027] Figure 1is a perspective view schematically showing a wafer as an example of the object 1 to be inspected. The front surface la of the object 1 is divided by a plurality of partition lines 3, which are called streets, crossing each other, for example. In each region of the front surface la of the wafer, which is the object 1 to be inspected, divided by the streets 3, a device 5 such as an IC (Integrated Circuit) or LSI (Large-Scale Integrated circuit) is formed. When the wafer is divided along the streets 3, individual device chips can be formed.

[0028] In the division of the object 1 to be inspected, a laser processing apparatus that performs laser processing on the object 1 to be inspected by irradiating a laser beam along the streets 3, for example, is used. Alternatively, a cutting apparatus that can cut the object 1 to be inspected along the streets 3 by a circular ring-shaped cutting tool is used.

[0029] Before the object 1 to be inspected is carried into a processing apparatus such as a cutting apparatus or a laser processing apparatus, as shown in Figure 1 the object 1 to be inspected is integrated with a ring-shaped frame 9 and a tape 7 that is attached so as to close an opening of the frame 9 to form a frame unit 11. The object 1 to be inspected, which is attached to the frame 9 with the tape 7, is carried into the processing apparatus in this state to be processed. Also, each device chip formed by the division of the object 1 to be inspected is supported by the tape 7.

[0030] To confirm that the object 1 to be inspected is properly processed along the streets 3, in the inspection apparatus of the present embodiment, the object 1 to be inspected is inspected by photographing a processed site of the object 1 to be inspected. In this inspection apparatus, the object 1 to be inspected is inspected along the streets 3, for example, and the formation position of a processing mark is investigated, and the shape and size, distribution, and the like of a defect called a chipping formed in the object 1 to be inspected are investigated along the processing mark. In addition, the size of a device chip formed by the division of the object 1 to be inspected is confirmed. However, the use of the inspection apparatus is not limited to this.

[0031] Hereinafter, the present embodiment will be described with the case where a wafer on which a plurality of devices 5 are formed and which is divided along the streets 3 is used as the object 1 to be inspected, but the object 1 to be inspected is not limited to this. The object 1 to be inspected inspected by the inspection apparatus of the present embodiment can not be processed by a processing apparatus or the like.

[0032] The inspection apparatus of the present embodiment is used, for example, by being assembled into a processing apparatus having a processing unit that processes the object 1 to be processed. However, the inspection apparatus can not be assembled into the processing apparatus, and can be independent. Figure 2 is a perspective view schematically showing a processing apparatus 2 to which the inspection apparatus of the present embodiment is assembled.

[0033] The processing device 2 has a base 4 that supports each component. A cassette support table 6 that can be raised and lowered is provided at the front corner of the base 4. A cassette that houses a plurality of frame units 11 is placed on the upper surface of the cassette support table 6.

[0034] A rectangular opening 10 that is long in the X-axis direction (processing feed direction) is formed at a position on the upper surface of the base 4 that is adjacent to the cassette support table 6. A workpiece holding unit 14, an X-axis direction moving mechanism (not shown) that moves a moving table 12 on which the workpiece holding unit 14 is placed in the X-axis direction, and a dust and drip prevention cover 10a that covers the X-axis direction moving mechanism are provided in the opening 10.

[0035] A conveyance unit 16 that conveys the frame units 11 housed in the cassette placed on the cassette support table 6 in and out is provided in the processing device 2. The conveyance unit 16 has a pair of guide rails 18 that are parallel to the Y-axis direction, which are provided on the front surface of the erected portion of the base 4. A moving body 20 is slidably attached to the pair of guide rails 18. A nut portion (not shown) on which a ball screw 22 that is parallel to the guide rails 18 is screwed is provided on the rear surface side of the moving body 20.

[0036] A pulse motor 24 is connected to one end portion of the ball screw 22. When the ball screw 22 is rotated by the pulse motor 24, the moving body 20 moves in the Y-axis direction along the guide rails 18. An arm portion 26 that extends in the X-axis direction is connected to the lower end of the moving body 20 via a raising and lowering mechanism. A plurality of suction portions 28 that are provided in correspondence with the size of the frame 9 are provided on the lower surface of the arm portion 26. In addition, a push-pull mechanism 30 that faces the cassette support table 6 is provided in the center of the arm portion 26.

[0037] In addition, a pair of conveyance rails 8 that are provided in a manner that straddles the opening 10 is provided on the upper surface of the base 4. The pair of conveyance rails 8 is provided so as to be separated from each other by a width that is smaller than the diameter of the frame 9, and is movable in directions away from each other.

[0038] The conveyance unit 16 moves in the Y-axis direction so that the front end of the push-pull mechanism 30 is inserted into the cassette placed on the cassette support table 6, so that the frame 9 of the frame unit 11 housed in the cassette can be gripped. When the frame 9 is gripped by the push-pull mechanism 30 and the arm portion 26 is moved in the Y-axis direction in the opposite direction, the frame unit 11 is pulled out onto the pair of conveyance rails 8.

[0039] Then, the push-pull mechanism 30 is released from gripping the frame 9, and the suction portion 28 of the conveyance unit 16 contacts the frame 9 from above, and the frame 9 is suction-held by the suction portion 28. Also, the frame unit 11 is lifted upward from the conveyance rails 8, the interval between the pair of conveyance rails 8 is expanded, and the frame unit 11 is lowered, so that the frame unit 11 can be conveyed to the workpiece holding unit 14.

[0040] The workpiece holding unit 14 is, for example, a chuck table that holds the workpiece 1 (wafer). A porous member is provided on the upper surface of the workpiece holding unit 14, and the upper surface of the porous member becomes a holding surface that holds the frame unit 11. The porous member is connected to a suction source (not shown) via a suction passage (not shown) formed in the inside of the workpiece holding unit 14. The workpiece holding unit 14 can suction-hold the frame unit 11.

[0041] Figure 3 is a plan view schematically showing the structure of the processing device 2. The processing device 2 has a processing unit 32 that processes the workpiece 1 as a workpiece. The processing unit 32 is, for example, a cutting unit that has a circular ring-shaped cutting tool 34, a spindle housing 36 that houses a spindle that is inserted through a through-hole of the cutting tool 34 and serves as a rotation axis when the cutting tool 34 is rotated, and a motor (not shown) that rotates the spindle. When the rotating cutting tool 34 is cut into the workpiece held by the workpiece holding unit 14, the workpiece is subjected to cutting processing.

[0042] wherein, in Figure 3 Two processing units 32 that cut the workpiece 1 are installed in the processing device 2 shown in

[0043] As shown in Figure 2 and Figure 3 The processing device 2 has an opening 38 at a position adjacent to the opening 10 on the upper surface of the base 4. A cleaning device 40 that can clean the workpiece 1 processed by the processing unit 32 is provided inside the opening 38. When the processed workpiece 1 is conveyed to a cleaning table of the cleaning device 40 by the conveyance unit 16 or the like, and high-pressure cleaning water is sprayed from a nozzle (not shown) toward the workpiece 1 while the cleaning table on which the workpiece 1 is placed is rotated at high speed, the workpiece 1 can be cleaned.

[0044] Further, the carrying-in of the object 1 to the cleaning device 40 can be performed by the carrying unit 42. The carrying unit 42 has a pair of rails 44 parallel to the Y-axis direction, which are provided on the front surface of the erected portion of the base 4. A moving body 46 is slidably mounted on the pair of rails 44. A nut portion (not shown) in which a ball screw 48 parallel to the rails 44 is screwed is provided on the rear surface side of the moving body 46.

[0045] A pulse motor 50 is connected to one end of the ball screw 48. When the ball screw 48 is rotated by the pulse motor 50, the moving body 46 moves in the Y-axis direction along the rails 44. An arm portion 52 is connected to the lower end of the moving body 46 via a lifting mechanism. A holding mechanism 54 provided with a plurality of suction portions (not shown) corresponding to the size of the frame 9 is provided on the arm portion 52.

[0046] For example, a plurality of devices 5 are formed on the front surface of the object 1, and when the object 1 is divided for each device 5 by the processing unit 32 of the processing device 2, individual device chips are formed. In order to confirm that the object 1 has been processed appropriately, the processed object 1 is inspected by the inspection device 56 of the present embodiment.

[0047] After the cleaning of the object 1 by the cleaning device 40 is completed, the object 1 is held by the holding mechanism 54 and carried to the inspection device 56 by the carrying unit 42. Further, the object 1 can be carried to the inspection device 56 by the carrying unit 16 instead of the carrying unit 42. Here, if the orientation of the cleaning stage is adjusted in advance before the object 1 is held by the carrying units 16, 42, the orientation of the object 1 carried into the inspection device 56 is made to coincide with a prescribed orientation.

[0048] For example, in the inspection device 56, the object 1 is inspected along the division groove formed in the object 1, and thus the shape and size, distribution, etc. of a defect called edge collapse formed in the object 1 along the division groove are investigated. Further, the size of the device chip formed by the division of the object 1 is confirmed.

[0049] The inspection device 56 is an inspection device capable of observing the same position of the object 1 from both the upper surface side (front surface la side) and the lower surface side (back surface lb side) at the same time. As shown in, for example, JP-A No. 2005- 339, 1 1, the inspection device 56 is assembled into the processing device 2, and can immediately inspect the processed object 1. Next, the inspection device 56 of the present embodiment will be described with the case of being assembled into the processing device 2 as an example, but the inspection device 56 is not limited thereto. Figure 2

[0050] Figure 4 ​is a perspective view schematically showing the inspection apparatus 56. The inspection apparatus 56 has a base 60 that supports each structure of the inspection apparatus 56. An opening 62 along the X-axis direction is formed on the base 60. The inspection apparatus 56 has an object holding mechanism 58 that is disposed so as to span the opening 62 of the base 60, and is capable of holding the object 1, and a photographing mechanism 82 that is capable of photographing the object 1 held by the object holding mechanism 58.

[0051] The inspection apparatus 56 has an X-axis moving unit 64a that is capable of relatively moving the object holding mechanism 58 and the photographing mechanism 82 along the X-axis direction, and a Y-axis moving unit 64b that is capable of relatively moving the object holding mechanism 58 and the photographing mechanism 82 along the Y-axis direction. In Figure 5 (A) of FIG. 6 is a perspective view schematically showing the X-axis moving unit 64a of the inspection apparatus 56 and the object holding mechanism 58. In Figure 5 (B) of FIG. 6 is a perspective view schematically showing the photographing mechanism 82.

[0052] The X-axis moving unit 64a has a guide rail 66a that extends along the X-axis direction on the side of the opening 62 of the upper surface of the base 60. In addition, a guide rail 66b that extends in parallel with the guide rail 66a is provided on the side of the opening 62 of the side of the upper surface of the base 60 opposite to the guide rail 66a. A moving body 68a is slidably mounted on the guide rail 66a, and a moving body 68b is slidably mounted on the guide rail 66b.

[0053] A bridge-like support structure 74 is disposed so as to span the moving bodies 68a and 68b. In addition, a nut portion (not shown) in which a ball screw 70 that is parallel to the guide rails 66a and 66b is screwed is provided on the lower end of one of the moving bodies 68a and 68b.

[0054] The ball screw 70 is connected to one end portion of the pulse motor 72. When the ball screw 70 is rotated by the pulse motor 72, the moving bodies 68a and 68b move along the guide rails 66a and 66b in the X-axis direction, and the bridge-like support structure 74 moves in the X-axis direction. The object holding mechanism 58 is supported to the support structure 74 at a position overlapping the opening 62 of the base 60. The X-axis moving unit 64a moves the support structure 74 along the X-axis direction, and thus is capable of moving the object holding mechanism 58 along the X-axis direction.

[0055] The object-to-be-inspected holding mechanism 58 has a placement portion 76 having a transparent body exposed on the upper and lower sides. The transparent body is formed of, for example, glass, resin, or the like. An upper surface of the transparent body serves as a placement surface 76a on which the object to be inspected 1 is placed via the tape 7. The object-to-be-inspected holding mechanism 58 is capable of supporting the object to be inspected 1 placed on the placement surface 76a.

[0056] Figure 6 (A) is a plan view schematically showing the object-to-be-inspected holding mechanism 58, Figure 6 (B) is a sectional view schematically showing the object-to-be-inspected holding mechanism 58. The transparent body is also exposed on the back side opposite to the placement surface 76a, and thus the object to be inspected 1 placed on the placement surface 76a can be observed from the lower surface side.

[0057] The object-to-be-inspected holding mechanism 58 has a tape holding portion 78 having a tape suction holding surface 78b on the outer peripheral side of the placement portion 76. The tape holding portion 78 has a suction groove 78a formed in the tape suction holding surface 78b. An unillustrated suction source is connected to the suction groove 78a via an unillustrated suction path. The object-to-be-inspected holding mechanism 58 further has a ring-shaped frame supporting portion 80 disposed around the tape holding portion 78 and capable of supporting the frame 9 of the frame unit 11.

[0058] The frame unit 11 is placed on the object-to-be-inspected holding mechanism 58 in such a manner that the frame supporting portion 80 and the frame 9 overlap each other, and when the suction source is activated, the object to be inspected 1 is suction-held to the object-to-be-inspected holding mechanism 58 via the tape 7. At this time, the tape 7 is tightly attached to the entire placement surface 76a by suction between the object-to-be-inspected holding mechanism 58 and the tape 7, and thus the object to be inspected 1 held by the object-to-be-inspected holding mechanism 58 does not shift during inspection.

[0059] For example, in the case where the object to be inspected 1 is a wafer or the like having warping, the tape 7 is also tightly attached to the entire placement surface 76a when the object to be inspected 1 is held to the object-to-be-inspected holding mechanism 58. Thus, the object to be inspected 1 is suction-held to the object-to-be-inspected holding mechanism 58 in a state where the warping is relaxed. When the warping of the object to be inspected 1 held by the object-to-be-inspected holding mechanism 58 is relaxed, the focus of the photographing unit is less likely to shift from the object to be inspected 1 when each region of the object to be inspected 1 is photographed one by one, and thus the object to be inspected 1 can be more clearly photographed.

[0060] Here, the height of the placement surface 76a of the placement portion 76 can be lower than the height of the tape suction holding surface 78b of the tape holding portion 78. Alternatively, as shown in Figure 6As shown in (A), the suction grooves 78a formed in the belt suction holding surface 78b can reach the placement portion 76. In this case, when the frame unit 11 is placed on the object holding mechanism 58, a gap is formed between the belt 7 and the placement surface 76a, and when the suction source connected to the suction grooves 78a is activated, the area of the belt 7 overlapping the object 1 is rapidly sucked through the gap.

[0061] Specifically, the height of the placement surface 76a of the placement portion 76 can be about 1 mm lower than the height of the belt suction holding surface 78b of the belt holding portion 78. Here, an experiment in which the frame unit 11 containing wafers each having a diameter of 300 mm as the object 1 is prepared and held on the object holding mechanism 58 is described.

[0062] In this experiment, the height of the placement surface 76a of the placement portion 76 is made 1 mm lower than the height of the belt suction holding surface 78b of the belt holding portion 78, and the frame unit 11 is suction-held on the object holding mechanism 58, and the time required to bring the belt 7 into close contact with the entire placement surface 76a is measured. In this case, the belt 7 is brought into close contact with the entire placement surface 76a in about several seconds.

[0063] Further, for comparison, the height of the placement surface 76a is made the same as the height of the belt suction holding surface 78b, and the frame unit 11 is suction-held on the object holding mechanism 58, and the time required to bring the belt 7 into close contact with the entire placement surface 76a is measured. In this case, it takes about 10 minutes to bring the belt 7 into close contact with the entire placement surface 76a. That is, it is confirmed that the time required for the object holding mechanism 58 to suction-hold the frame unit 11 can be greatly shortened by making the height of the placement surface 76a lower than the height of the belt suction holding surface 78b.

[0064] In Figure 7 a cross-sectional view of the frame unit 11 and the object holding mechanism 58 when the object 1 is suction-held by the object holding mechanism 58 is schematically shown. As shown in Figure 7 When the suction source is activated, the gap between the belt 7 and the placement surface 76a is evacuated, and the belt 7 and the placement surface 76a are brought into close contact.

[0065] Further, for example, the placement surface 76a can be coated with a fluororesin so that the belt 7 is easily peeled off from the placement surface 76a when the suction source is stopped and the frame unit 11 is carried out from the object holding mechanism 58 after the inspection of the object 1 is completed.

[0066] Next, the imaging mechanism 82 is described. As shown in Figure 4As shown, the photographing mechanism 82 is supported by, for example, a support structure 84 of a gate type, which is provided on the base 60 in a manner so as to straddle the opening 62, the X-axis moving unit 64a, and the object holding mechanism 58. A Y-axis moving unit 64b, which moves the photographing mechanism 82 in the Y-axis direction, is provided on the support structure 84.

[0067] The Y-axis moving unit 64b has a pair of rails 86 provided on the upper surface of the support structure 84 in the Y-axis direction. A moving body 88, which supports the photographing mechanism 82, is slidably mounted on the pair of rails 86. A nut portion (not shown) in which a ball screw 90 parallel to the pair of rails 86 is screwed is provided on the lower surface of the moving body 88.

[0068] A pulse motor 92 is connected to one end of the ball screw 90. When the ball screw 90 is rotated by the pulse motor 92, the moving body 88 moves in the Y-axis direction along the rails 86, and thus the photographing mechanism 82 moves in the Y-axis direction. The X-axis moving unit 64a and the Y-axis moving unit 64b function as moving units that relatively move the object holding mechanism 58 and the photographing mechanism 82 in a direction parallel to the placement surface 76a.

[0069] The photographing mechanism 82 has a first photographing unit 106a provided above the placement portion 76 of the object holding mechanism 58 and a second photographing unit 106b provided below the placement portion 76. As shown in (B) of FIG. 1, the photographing mechanism 82 further has a connecting portion 108 that connects the first photographing unit 106a and the second photographing unit 106b. Figure 5

[0070] The first photographing unit 106a is supported by a columnar support structure 94a. A lift mechanism 96a that lifts the first photographing unit 106a is provided on the front surface of the columnar support structure 94a. The lift mechanism 96a has a pair of rails 98a in the Z-axis direction, a moving body 100a slidably mounted on the rails 98a, and a ball screw 102a screwed with a nut portion provided on the rear surface of the moving body 100a.

[0071] The first photographing unit 106a is fixed to the front surface of the moving body 100a. A pulse motor 104a is connected to one end of the ball screw 102a. When the ball screw 102a is rotated by the pulse motor 104a, the moving body 100a moves in the Z-axis direction along the rails 98a, and the first photographing unit 106a fixed to the moving body 100a is lifted.

[0072] ​The upper end of the connecting portion 108 is connected to the rear surface side lower end of the support structure 94a, for example, and the lower end of the connecting portion 108 is connected to the rear surface side upper end of the columnar support structure 94b that supports the second imaging unit 106b. A lifting mechanism 96b is provided on the front surface of the support structure 94b, and is configured similarly to the lifting mechanism 96a provided on the support structure 94a.

[0073] The lifting mechanism 96b includes a pair of rails 98b extending in the Z-axis direction, a moving body 100b slidably mounted on the rails 98b, and a ball screw 102b engaged with a nut portion provided on the rear surface of the moving body 100b. A pulse motor 104b is connected to one end of the ball screw 102b. When the pulse motor 104b is operated to rotate the ball screw 102b, the second imaging unit 106b fixed to the front surface of the moving body 100b is lifted.

[0074] The first imaging unit 106a faces downward and can image the object 1 placed on the upper surface of the object holding mechanism 58 from above. In addition, the second imaging unit 106b faces upward and can image the object 1 from below through the placement portion 76 and the belt 7 made of a transparent material. The first imaging unit 106a and the second imaging unit 106b are, for example, an area camera, a line camera, a 3D camera, or an infrared camera.

[0075] In addition, in the case where the object 1 is imaged through the placement portion 76 and the belt 7, the contrast of the obtained image can sometimes be reduced due to the influence of spherical aberration. Therefore, the second imaging unit 106b can have a correction unit made of a correction ring or the like that can reduce the influence of the spherical aberration.

[0076] In addition, in the imaging mechanism 82, the first imaging unit 106a and the second imaging unit 106b are connected to each other by the connecting portion 108 in such a manner that the positions in the direction parallel to the placement surface 76a are substantially the same. That is, the same position on the upper surface side and the lower surface side of the object 1 can be imaged. Furthermore, the connecting portion 108 has a shape that does not interfere with the object holding mechanism 58 regardless of the position of the object 1 to be imaged.

[0077] Use Figure 2 The processing device 2 is further described. The processing device 2 has a display portion 110 having a touch panel. An operator who operates the processing device 2 inputs conditions of processing to be performed in the processing device 2, and the like, through the touch panel of the display portion 110, for example. In addition, the display portion 110 has a function of displaying an alarm in the case where an abnormality occurs during the performance of processing, and can warn the operator.

[0078] An alarm lamp 112 is provided on the upper surface of the housing of the processing apparatus 2. The alarm lamp 112 includes, for example, a green lamp and a red lamp. When the processing apparatus 2 is operating normally, the green lamp is lit, and when the processing apparatus 2 is generating an abnormality, the red lamp is lit.

[0079] Next, a process in which the inspected object 1 as a processed object is processed in the processing apparatus 2 in which the inspection apparatus 56 of the present embodiment is assembled, and the processed inspected object 1 is inspected by the inspection apparatus 56 will be described.

[0080] First, the cassette in which the frame unit 11 including the inspected object 1 is housed is placed on the cassette support table 6 of the processing apparatus 2. Then, the frame unit 11 is pulled out from the cassette by the conveyance unit 16 and conveyed to the processed object holding unit 14. Then, the inspected object 1 is processed by the processing unit 32, and the frame unit 11 is conveyed to the cleaning apparatus 40 by the conveyance unit 42, and the inspected object 1 is cleaned by the cleaning apparatus 40.

[0081] Then, the frame unit 11 is conveyed from the cleaning apparatus 40 to the inspected object holding mechanism 58 of the inspection apparatus 56 by the conveyance unit 42. Then, the suction source connected to the suction grooves 78a formed in the tape holding portion 78 is operated, and the frame unit 11 is suction-held to the inspected object holding mechanism 58.

[0082] Then, the positions of the first and second photographing units 106a and 106b of the photographing mechanism 82 are aligned at an arbitrary inspection site of the inspected object 1 by the moving units 64a and 64b. Then, the focal points of the first and second photographing units 106a and 106b are aligned at each inspected surface of the inspected object 1 by operating the lifting mechanisms 96a and 96b.

[0083] Figure 7 is a cross-sectional view schematically showing the positional relationship of the inspected object holding mechanism 58, the photographing mechanism 82, and the inspected object 1 when the inspected object 1 is inspected. The photographing mechanism 82 can photograph the same position of the inspected object 1 from the front surface la side (upper surface side) and the back surface lb side (lower surface side) by the first and second photographing units 106a and 106b.

[0084] Further, the photographing mechanism 82 can relatively move with respect to the object holding mechanism 58 by the X-axis moving unit 64a and the Y-axis moving unit 64b while maintaining this state. Therefore, the photographing mechanism 82 can simultaneously photograph an arbitrary same position of the object 1 from both sides to perform inspection. However, the photographing mechanism 82 does not necessarily simultaneously photograph both sides of the object 1, and the timing of photographing by the first photographing unit 106a and the second photographing unit 106b can be different. In addition, only one of the photographing units 106a and 106b can be made to operate.

[0085] According to the inspection device 56, for example, in a case where a cutting groove as a processing mark 3a is formed on the object 1 along the division groove 3 by cutting the object 1 by the processing unit 32 of the processing device 2, the processing mark 3a can be observed from both sides at the same position of the object 1. Further, the size of a chipped edge formed along the processing mark 3a and the size of a device chip formed by dividing the object 1, and the like can be measured.

[0086] After the object 1 is photographed to perform inspection, the frame unit including the object 1 is carried into a cassette supported by the cassette support table 6 by the carrying unit 42 and the carrying unit 16.

[0087] In a case where the object 1 is inspected to determine whether processing performed on the object 1 is good, when only the front surface la side of the object 1 is photographed to be observed, it can sometimes be insufficient. Conventionally, in a case where the same position of the front surface la side (upper surface side) and the back surface lb side (lower surface side) of the object 1 is photographed, after one surface of the object 1 is photographed by the inspection device, the front surface and the back surface of the object 1 must be flipped. Further, in order to photograph the object 1 from the other surface at the same position, the photographing unit must be precisely aligned at the same position.

[0088] Therefore, flipping the front surface and the back surface of the object 1 and precisely aligning the relative positions of the photographing unit and the object 1 require effort and time. In addition, the alignment of the photographing unit and the like can fail. In contrast, the inspection device 56 of the present embodiment has the photographing mechanism 82 that links the first photographing unit 106a and the second photographing unit 106b by the link 108, and can photograph the same position of the object 1 from the upper surface side and the lower surface side. Therefore, the effort and time required in the past are not spent, and there is no risk of failure of the alignment of the photographing unit.

[0089] Further, the processing device 2 assembled with the inspection device 56 of the present embodiment can have a control unit that controls each component. Also, the control unit can control the inspection device 56 to perform inspection by taking images of the object 1 from both sides, and thereby determine whether the processing performed on the object 1 is appropriate. Also, in a case where the control unit determines that the processing performed on the object 1 is not appropriate, the control unit can notify the operator of the processing device 2 of the determination result through the display section 110 or the alarm lamp 112.

[0090] Further, the control unit can adjust the orientation of the cleaning stage when the object 1 is carried from the cleaning device 40 to the inspection device 56, before the object 1 is held by the carrying units 16, 42, and thereby control the orientation of the object 1 held by the object holding mechanism 58. In this case, the control unit can record the position of the processing performed on the object 1 and the position on the object 1 where the image is taken by the inspection device 56 in association with the image taken by the inspection device 56.

[0091] For example, in a case where the control unit recognizes that there is some abnormality in the processing performed on the object 1 based on the taken image, the position of the object 1 where the abnormality occurs can be determined. Thus, the cause of the abnormality can be analyzed from multiple angles. Further, when the taken image, the position of the object 1 where the image is taken, and the position of the processing performed on the object 1 are recorded and stored in the control unit, analysis can be performed at any timing.

[0092] Further, one embodiment of the present application is not limited to the description of the above-described embodiments, and various changes and modifications can be made thereto. For example, in the above-described embodiments, a case where the object 1 is attached to the frame 9 with the use of the belt 7 is described, but the object 1 that can be inspected by the inspection device 56 of one embodiment of the present application is not limited thereto. That is, the object 1 can be attached to the frame 9 without the use of the belt 7.

[0093] Further, a case where the object 1 that has been processed by the processing unit 32 of the processing device 2 is taken by the inspection device 56 is described, but the object 1 is not limited thereto. That is, the object 1 can be processed by a processing device other than the processing device 2, or can not be processed. Further, the inspection device 56 can not be assembled in the processing device 2, and can be independent. Also, in the inspection device 56, only the taking of the object 1 can be performed, or inspection of the object 1 using the taken image can be performed by another device.

[0094] In addition, the configuration, method, and the like of the above-described embodiments can be appropriately changed and implemented without departing from the scope of the present application.

Claims

1. An inspection device for inspecting an object to be inspected which is attached with a tape and mounted on a frame with the tape, characterized in that: The inspection device has: An inspection object holding mechanism includes a placing portion having a transparent body exposed at the top and bottom, wherein the upper surface of the transparent body serves as a placing surface for placing the inspection object via the belt, and the inspection object holding mechanism is capable of holding the inspection object placed on the placing surface; an imaging mechanism including a first imaging unit disposed above the placement portion, a second imaging unit disposed below the placement portion, and a connecting portion connecting the first imaging unit and the second imaging unit; as well as a moving unit capable of moving the imaging mechanism relative to the mounting portion in a direction parallel to the mounting surface; The photographing mechanism can photograph the object to be inspected, which is placed on the placing surface of the placing portion and held by the object holding mechanism, from the upper surface side by the first photographing unit, and can photograph the object to be inspected from the lower surface side by the second photographing unit. The imaging mechanism can simultaneously image any same position on the upper surface side and the lower surface side of the inspection object.

2. The inspection device according to claim 1, characterized in that The inspection object holding mechanism has: a belt holding portion having a belt suction and holding surface on the outer peripheral side of the placement portion, the belt suction and holding surface being capable of suction and holding the belt in an area between the outer periphery of the inspection object placed on the inspection object holding mechanism and the inner periphery of the frame mounted on the inspection object via the belt; as well as The frame support portion is disposed around the belt holding portion and can support the frame.

3. The inspection device according to claim 2, characterized in that The height of the placing surface of the placing portion is lower than the height of the tape suction and holding surface of the tape holding portion.

4. The inspection device according to claim 1, wherein: The placement surface of the placement portion is coated with fluororesin.

5. A processing device comprising: The inspection device according to any one of claims 1 to 4; a workpiece holding unit for holding the workpiece; a processing unit that processes the workpiece held by the workpiece holding unit; and a transport unit that transports the workpiece from the workpiece holding unit to the placement portion of the inspection object holding mechanism, It is characterized in that The inspection device can image the workpiece processed by the processing unit as the inspection object by the imaging mechanism.

Images