Light-emitting module and method for manufacturing the same

Abstract

An object of the present invention is to provide a light-emitting module that looks more beautiful when viewed through a lens and a method for manufacturing the light-emitting module. The light-emitting module (100) includes: a substrate (5); a light-emitting element (1) and an electronic component (20) provided on the substrate (5); a lens (30) provided separately from the light-emitting element (1) and the electronic component (20) at a position opposite to the light-emitting element (1) and the electronic component (20); and a plate-shaped covering member (40) disposed between the lens (30) and the electronic component (20) and containing a coloring substance.

Description

Technical Field

[0001] The present invention relates to a light-emitting module and a method for manufacturing the same. Background Art

[0002] Conventionally, as a light-emitting module used in a camera flash, a structure in which a light-emitting element and a lens are combined is known (for example, refer to Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2015-508509

[0004] However, in the existing light-emitting module, electronic components arranged within the range of the lens can be seen through the lens, which is not aesthetically pleasing. Therefore, in a light-emitting device, it is desirable that the electronic components are not clearly visible through the lens. Summary of the Invention

[0005] An object of an embodiment of the present invention is to provide a light-emitting module and a method for manufacturing the same that are more aesthetically pleasing when viewed through a lens.

[0006] The light-emitting module according to an embodiment of the present invention includes: a substrate; a light-emitting element and an electronic component provided on the substrate; a lens provided separately from the light-emitting element and the electronic component at a position opposite to the light-emitting element and the electronic component; and a plate-shaped covering member disposed between the lens and the electronic component and containing a coloring substance.

[0007] The method for manufacturing a light-emitting module according to an embodiment of the present invention is a method for manufacturing a light-emitting module including a substrate, a light-emitting element and an electronic component mounted on the substrate, and a lens opposite to the light-emitting element and the electronic component, and includes: a preparation step of preparing a substrate provided with the light-emitting element and a plurality of the electronic components; a covering member forming step of providing a plate-shaped covering member covering the upper surface of the electronic component; and a lens arrangement step of relatively arranging the lens and the light-emitting element via a lens frame holding the lens.

[0008] According to an embodiment of the present invention, it is possible to provide a light-emitting module and a method for manufacturing the same that have an aesthetically pleasing appearance. Brief Description of the Drawings

[0009] Figure 1 is an exploded perspective view schematically showing the structure of the light-emitting module according to the first embodiment;

[0010] Figure 2 is a top view schematically showing the light-emitting module according to the first embodiment;

[0011] Figure 3 is schematically shown in cross-section Figure 2 a cross-sectional view of the internal structure of the light-emitting module taken along line III-III of;

[0012] Figure 4A is a perspective view schematically showing the relationship between a cover member provided on the upper surface of the electronic component of the light emitting module according to the first embodiment and the electronic component;

[0013] Figure 4B is a perspective view schematically showing a first modified example of a cover member for covering the upper surface of an electronic component of a light emitting module;

[0014] Figure 4C is a perspective view schematically showing a second modified example of a cover member covering the upper surface of an electronic component of a light emitting module;

[0015] Figure 4D is a perspective view schematically showing a third modified example of a cover member for covering the upper surface of an electronic component of a light emitting module;

[0016] Figure 4E is a side view schematically showing a fourth modified example of a cover member covering the upper surface of the electronic component of the light emitting module;

[0017] Figure 4F is a perspective view schematically showing a fifth modified example of a cover member for covering the upper surface of an electronic component of a light emitting module;

[0018] Figure 4G is a perspective view schematically showing a sixth modified example of a cover member for covering the upper surface of an electronic component of a light emitting module;

[0019] Figure 4H is a perspective cross-sectional view schematically showing a seventh modified example of the cover member covering the upper surface of the electronic component of the light emitting module by cutting the cover member and the electronic component;

[0020] Figure 5 is a flowchart showing a method for manufacturing a light emitting module according to a first embodiment;

[0021] Figure 6 is a flow chart showing another method for manufacturing a light emitting module;

[0022] Figure 7 is an exploded perspective view schematically showing the structure of a light emitting module according to a second embodiment;

[0023] Figure 8 is a top view schematically showing a light emitting module according to a second embodiment;

[0024] Figure 9 The cross section is schematically shown Figure 8 A cross-sectional view of the internal structure of the light emitting module taken along line IX-IX.

[0025] Description of Reference Numerals

[0026] 1: Light-emitting element;

[0027] 2: Translucent member;

[0028] 3: Protective member;

[0029] 5: Substrate;

[0030] 5B1: First region;

[0031] 5B2: Second region;

[0032] 10B1: First light-emitting device;

[0033] 10B2: Second light-emitting device;

[0034] 10B3: Third light-emitting device;

[0035] 10B4: Fourth light-emitting device;

[0036] 10: Light-emitting device;

[0037] 20: Electronic component;

[0038] 20a: Upper surface of the electronic component;

[0039] 20b1: One side surface of the electronic component;

[0040] 20a1: A part of the upper surface of the electronic component;

[0041] 20a2: Another part of the upper surface of the electronic component;

[0042] 20b: Side surface of the electronic component;

[0043] 30: Lens;

[0044] 30B: Fly-eye lens;

[0045] 30B1 to 30B4: Lens portions;

[0046] 35, 35B: Lens frame;

[0047] 40, 40B, 40C, 40D, 40E, 40F, 40G, 40H: Covering member;

[0048] 40B1, 40D1, 40E1, 40G1, 40H1: Central covering portion;

[0049] 40B2, 40D2: Extending covering portion;

[0050] 40E2, 40H2: Side covering portion;

[0051] 40F1: First covering portion;

[0052] 40F2: Second covering part;

[0053] 40F3: Third covering part;

[0054] 40G11: First side covering part;

[0055] 40G14: Fourth side covering part;

[0056] 40H3: Flange part;

[0057] 45: Resin bonding material;

[0058] 50: Covering resin;

[0059] 100, 100B: Light-emitting module;

[0060] S11: Preparation process;

[0061] S12: Covering component forming process;

[0062] S13: Covering component processing process;

[0063] S14: Lens arrangement process;

[0064] wr: Lead wire. Detailed implementation manners

[0065] Hereinafter, embodiments of the light-emitting module of the present invention will be described.

[0066] It should be noted that the accompanying drawings referred to in the following description schematically show the present invention. Therefore, there are cases where the ratio, interval, positional relationship, etc. of each component are exaggeratedly represented or a part of the component is omitted in the drawing. Also, between the top view and the cross-sectional view, there are cases where the ratio and interval of each component are inconsistent. And in the following description, for the same names and reference numerals, in principle, the same or homogeneous components are represented, and detailed descriptions are appropriately omitted.

[0067] Moreover, in the light-emitting module of each embodiment of the present invention, "up", "down", "left", "right", etc. are replaced according to the situation. In this specification, "up", "down", etc. indicate the relative position between components in the accompanying drawings referred to for the purpose of explanation, and do not intend to represent an absolute position unless otherwise specified.

[0068] (First Embodiment)

[0069] [Structure of the light-emitting module]

[0070] First, refer to Figures 1 to 3 , Figure 4A, the structure of the light emitting module according to the first embodiment of the present invention is described. Figure 1 It is an exploded perspective view schematically showing the structure of the light emitting module according to the first embodiment. Figure 2 It is a plan view schematically showing the light emitting module according to the first embodiment. Figure 3 It is schematically shown in cross section Figure 2 A cross-sectional view of the internal structure of the light emitting module taken along line III-III. Figure 4A This is a perspective view schematically showing the relationship between the cover member provided on the upper surface of the electronic component of the light emitting module according to the first embodiment and the electronic component.

[0071] The light emitting module 100 constitutes, for example, a flash module of a camera and is incorporated into a housing of a smartphone, a tablet terminal, or the like.

[0072] It should be noted that the frame includes, for example, a main body made of stainless steel or the like, and a glass cover that covers the lens 30 of the light emitting module 100 assembled in the frame. Furthermore, the frame may not include the glass cover, in which case the light emitting module 100 may have a structure in which the lens 30 is directly exposed from the main body without being separated by the glass cover.

[0073] The light emitting module 100 includes: a substrate 5; a light emitting element 1 and an electronic component 20 provided on the substrate 5; a lens 30 provided at a position opposite to the light emitting element 1 and the electronic component 20 and separated from the light emitting element 1 and the electronic component 20; and a plate-shaped cover member 40 disposed between the lens 30 and the electronic component 20 and containing a coloring material. It should be noted that the light emitting element 1 is provided on the substrate 5 as a light emitting device 10 having at least one light emitting element 1, and is thus provided on the light emitting module 100. The following describes the components of the light emitting module 100.

[0074] The substrate 5 includes a substrate and a conductor wiring arranged on the upper surface of the substrate. The substrate 5 is a component that supports the light-emitting element 1 and the electronic component 20. The substrate 5 can utilize a package substrate that is generally used as a light-emitting device. For example, a ceramic substrate such as AlN, a metal substrate such as Al, a resin substrate such as glass epoxy, etc. can be cited. In addition, the conductor wiring is a wiring that supplies power to the light-emitting element 1 and the electronic component 20 from the outside, and a pattern of a predetermined shape is formed on the substrate. In addition, the conductor wiring is connected to an external power supply via a wiring portion that penetrates the substrate 5 and a wiring portion that is exposed from the lower surface of the substrate 5. The conductor wiring can use a metal material, for example, preferably a metal single substance such as Ag, Al, Ni, Rh, Au, Cu, Ti, Pt, Pd, Mo, Cr, W, or an alloy containing these metals. More preferably, a metal single substance such as Ag, Al, Pt, Rh, or an alloy containing these metals that has excellent light reflectivity can be used.

[0075] Further, preferably, the substrate 5 has a resist layer on its surface that is the same color system as the light-transmissive member 2 containing the phosphor. It should be noted that the resist layer provided on the surface of the substrate 5 may also be white. The resist layer provided on the surface of the substrate 5 serves to protect the conductor wiring. Further, the resist layer may also contain a reflective member, whereby the light extraction efficiency of the light-emitting module 100 can be improved.

[0076] The light-emitting device 10 includes one or more light-emitting elements 1, a light-transmissive member 2 placed on the light extraction surface of the light-emitting element 1, and a protective member 3 covering the side surfaces of the light-emitting element 1 and the light-transmissive member 2. The light-emitting device 10 is placed on the substrate 5 so as to be electrically connected to the wiring on the back surface of the substrate 5 through a through hole or the like formed in the substrate 5. The light-emitting device 10 is arranged on the substrate 5 at a position that overlaps with the lens 30 in a plan view, for example, overlapping with the center of the lens 30. Further, the light-emitting device 10 is formed here to emit white light.

[0077] The light-emitting element 1 has a semiconductor layer on a light-transmissive substrate such as sapphire. The semiconductor layer sequentially includes an n-side semiconductor layer, an active region, and a p-side semiconductor layer from the substrate side. As the light-emitting element 1 that can emit visible light such as green light from ultraviolet light or blue light, for example, GaN-based or InGaN-based represented by In X Al Y Ga 1-X-Y N (0 ≤ X ≤ 1, 0 ≤ Y ≤ 1, X + Y ≤ 1) etc. can be used. It should be noted that the plan view shape of the light-emitting element 1 is, for example, rectangular, but it may also be a polygon such as a circle, an ellipse, a triangle, or a hexagon.

[0078] Preferably, the light-emitting element 1 has positive and negative electrodes on the same surface side, whereby it can be flip-chip mounted on the substrate 5. It should be noted that the light-emitting element 1 electrically connects the positive and negative electrodes to the conductor wiring of the substrate 5 through bonding members such as bumps, conductive pastes, and solders.

[0079] The light-transmissive member 2 is a plate-shaped member having a substantially rectangular shape in plan view, and is provided to cover the upper surface of the light-emitting element 1. The light-transmissive member 2 can be formed using an inorganic material such as a light-transmissive resin material, ceramics, or glass. As the resin material, thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, and phenolic resin can be used. Also, thermoplastic resins such as polycarbonate resin, acrylic resin, methylpentene resin, and polyethylidene norbornene resin can be used. A silicone resin or its modified resin having excellent light resistance and heat resistance is particularly preferred. Here, the light transmittance means a property that allows 60% or more of the light from the light-emitting element 1 to pass through. In addition, the light-transmissive member 2 may contain a phosphor that wavelength-converts at least a part of the light from the light-diffusing member and the light-emitting element 1. As the light-transmissive member 2 containing a phosphor, a member containing a phosphor in the above resin material, ceramics, glass, etc., a sintered body of a phosphor, etc. can be cited.

[0080] For example, when a blue light-emitting element is used as the light-emitting element 1, since the light-transmissive member 2 contains a yellow phosphor, a light-emitting device 10 that emits white light can be obtained.

[0081] As the phosphor contained in the light-transmissive member 2, for example, YAG phosphors represented by Y 3 Al 5 O 12 :Ce, yellow phosphors such as silicates, CASN phosphors represented by CaAlSiN 3 :Eu, and red phosphors such as KSF phosphors represented by K 2 SiF 6 :Mn can be cited.

[0082] As the light-diffusing member contained in the light-transmissive portion 2, for example, titanium oxide, barium titanate, alumina, silica, etc. can be used.

[0083] The protection member 3 is a member that protects the sides of the light-emitting element 1 and the light-transmissive member 2, and directly or indirectly covers the sides of the light-emitting element 1 and the light-transmissive member 2. The upper surface of the light-transmissive member 2 is exposed from the protection member 3 to constitute the light-emitting surface (i.e., the main light extraction surface) of the light-emitting device 10. It is preferable that the protection member 3 is made of a member having a high light reflectance. For example, the protection member 3 can use a resin material containing a light-reflective substance. As the light-reflective substance, titanium oxide, silica, zirconia, potassium titanate, alumina, aluminum nitride, boron nitride, zinc oxide, mullite, etc. can be cited. Also, as the resin material, a resin material mainly composed of a thermosetting resin such as epoxy resin, silicone resin, silicone-modified resin, or phenolic resin is preferably used as the base material. It should be noted that the protection member 3 can be made of a member having light transmittance for visible light as needed.

[0084] The electronic component 20 is electrically connected to the substrate and is, for example, a photosensor, a Zener diode, a thermistor, a capacitor, etc. As an example, the electronic component 20 is formed in a rectangular parallelepiped shape or a cylindrical shape. Moreover, the electronic component 20 is separately provided from the lens 30 and is disposed on the substrate 5 at a position opposite to the lens 30 or is provided on the substrate 5 at a position not opposite to the lens 30. For example, the photosensor is disposed at a position opposite to the lens 30 and is used when controlling the drive current of the light-emitting device 10 according to the intensity of the light received via the lens 30. The electronic component 20 is mostly covered with a black resin or formed of a black component. It should be noted that depending on the configuration of the electrodes, etc., there are a part 20a1 of the upper surface 20a of the electronic component 20 such as a photosensor that becomes a part of the flat surface serving as the light-receiving surface and another part 20a2 that becomes a connection portion (or functional portion) of the wire wr, etc.

[0085] As Figure 3 and Figure 4A shown, with respect to the electronic component 20 in a position opposite to the lens 30, the covering member 40 is disposed between the lens 30 and the electronic component 20 so that the appearance of the electronic component 20 seen through the lens 30 is not black. The covering member 40 is a plate-like member containing a coloring substance. The covering member 40 is, for example, configured to cover at least a part or all of the upper surface 20a of the electronic component 20. The covering member 40 can be bonded to the electronic component 20 via a resin adhesive 45, for example. It is preferable that the covering member 40 is separately disposed from the lower surface of the lens 30. The covering member 40 is formed in a plate shape from, for example, resin or glass. Moreover, the covering member 40 is formed containing a coloring substance so as to be the same color system as the light-transmitting member 2 containing a phosphor or a light diffusing member and / or the resist layer formed on the substrate. Or, the covering member 40 is formed white containing a coloring substance. And, as an example, when the covering member 40 covers the entire surface of the upper surface 20a of the electronic component 20, it is formed to be the same size as or larger than the upper surface 20a. Here, being the same as the upper surface 20a of the electronic component 20 means a dimension within a range of a difference of plus or minus 30 μm on one side of the upper surface 20a.

[0086] And, here, the covering member 40 is provided on the upper surface 20a of the four electronic components 20 via the resin bonding material 45, and the four covering members 40 are formed into plate-like shapes with substantially the same thickness. The thickness of the covering member 40 only needs to be within the range until the upper surface of the covering member 40 placed on the electronic component 20 abuts against the lower surface of the lens 30. It should be noted that, more preferably, the thickness of the covering member 40 is adjusted so that the upper surface of the covering member 40 placed on the electronic component 20 is lower than the height of the upper surface of the light-transmissive member 2 by a height of +200 μm. And, the lower limit of the thickness of the covering member 40 only needs to be a thickness containing a coloring substance that does not allow the black color of the electronic component 20 to pass through. It should be noted that the four covering members 40 can use members with different thicknesses according to the type, shape, and height of the electronic component 20. And, the covering member 40 shown here is an example formed into a rectangle, but as long as it can cover the electronic component 20, the top view shape can also be shapes such as an oval, an ellipse, a trapezoid, a parallelogram, a triangle, etc. It should be noted that, as described later, the covering member 40 can not only be in a flat plate shape, but also can be in other shapes including a plate-like portion as shown in Figure 4E , Figure 4F , or the plate-like covering member 40 can be processed so that it covers at least a part of one side surface of the side surface of the electronic component 20 as shown in Figure 4G , Figure 4H .

[0087] As the base member, the covering member 40 can use resin materials such as silicone resin, epoxy resin, polycarbonate resin, or glass, ceramics, etc. And, the covering member 40 contains a coloring substance. As the coloring substance, it includes any one or more of phosphors, pigments, and dyes. As the phosphor, a substance the same as the phosphor contained in the light-transmissive member 2 can be cited. As the pigment, for example, pigments using inorganic materials and organic materials can be cited. As the inorganic material, for example, iron oxide red (Fe 2 O 3 ), red lead (Pb 3 O 4 ), titanium oxide (TiO 2 ), chromium oxide (Cr 2 O 3) Titanium-nickel-antimony-based oxides, titanium-nickel-barium-based oxides, titanium-chromium-antimony-based oxides, titanium-chromium-niobium-based oxides, etc. As organic materials, for example, anthraquinone-based, azo-based, quinacridone-based, perylene-based, pyrrolopyrrole-dione-based, monoazo-based, bisazo-based, pyrazolone-based, benzimidazolone-based, quinoxaline-based, azomethine-based, isoindolinone-based, etc. can be cited. As dyes, for example, anthraquinone dyes, methylene dyes, azomethine dyes, oxazine dyes, azo dyes, styryl dyes, coumarin dyes, porphyrin dyes, benzofuranone dyes, pyrrolopyrrole-dione dyes, rhodamine dyes, xanthene dyes, pyrromethene dyes, etc. can be cited. It should be noted that it is preferable that pigments and dyes basically do not convert the light from the light-emitting element 1 into different wavelengths.

[0088] The covering member 40 is formed in a plate shape by containing a coloring matter in the base member. Moreover, it is preferable that the covering member 40 is formed in white or a color of the same color system as the translucent member 2 by the coloring matter.

[0089] Here, the so-called color of the same color system includes colors within a range corresponding to 15 steps of the MacAdam ellipse.

[0090] As an example of disposing the covering member 40 between the electronic component 20 and the lens 30, the covering member 40 is bonded to the upper surface 20a of the electronic component 20 via a resin bonding material 45. As the resin bonding material 45, an epoxy resin, a silicone resin, etc. can be used. Also, the covering member 40 can be bonded to the upper surface 20a of the electronic component 20 via a double-sided tape. In addition, the covering member 40 can also be formed by a resin having adhesiveness to form the covering member 40 itself, and thus bonded to the upper surface 20a of the electronic component 20. Moreover, in the case where the covering member 40 and the electronic component 20 are ceramics or glass, the upper surface 20a of the covering member 40 and the electronic component 20 can also be bonded by inorganic bonding. In addition, the covering member 40 can also be bonded to the upper surface 20a of the electronic component 20 by thermocompression bonding (fusion bonding).

[0091] It should be noted that, as Figure 1 and Figure 3As shown, when the electronic component 20 is connected to the substrate via a wire wr or other connecting components, the covering component 40 covers a flat portion 20a1 of the upper surface 20a of the electronic component 20 where the wire wr is not connected. Moreover, another portion 20a2 of the upper surface 20a exposed from the covering component 40 is covered with the covering resin 50. That is, on another portion 20a2 of the upper surface 20a of the electronic component 20 where the wire wr is connected, the uncured covering resin 50 is provided to cover the entire upper surface 20a of the electronic component 20 together with the covering component 40. The covering resin 50 is supplied with an uncured resin material by spraying from a nozzle or the like, and thus is provided on another portion 20a2 of the upper surface 20a of the electronic component 20 and covers the wire wr. The covering resin 50 can use a material containing the same coloring substance as the covering component 40 among resin materials such as silicone resin, epoxy resin, and polycarbonate resin. In order not to deform the wire wr, it is preferable that the covering resin 50 is used in an uncured state with fluidity when supplied.

[0092] As described above, the covering component 40 contains a coloring substance and covers at least a part of the electronic component 20 at a position opposite to the lens 30, making it difficult to see the electronic component 20 through the lens 30. And by disposing the plate-shaped covering component 40 between the electronic component 20 and the lens 30, the covering component 40 covering the electronic component 20 has no deviation in thickness and becomes a substantially constant thickness. Therefore, it is possible to suppress the deviation of the operation of electronic components such as a light sensor that receives light transmitted through the covering component 40. It should be noted that when there are connection parts such as wire wr and surface irregularities on the upper surface of the electronic component 20, it is difficult to directly mount the covering component 40 on the electronic component 20. In this case, depending on the state of the upper surface of the electronic component 20, it can be dealt with using the covering component 40 and the covering resin 50 together, or a covering component preformed into a specified shape can be used as described later (for example, refer to Figure 4F ).

[0093] As Figures 1 to 3 shown, the lens 30 is provided on the light-emitting device 10 via the lens holder 35. The lens holder 35 is separated from the light-emitting device 10 and is mounted on the substrate 5 using an adhesive component such as resin. As Figure 1 shown, when viewed from above, the lens holder 35 is provided so that the lens 30 covers the entire light-emitting surface of the light-emitting element 1. The outer shape of the lens 30 when viewed from above is, for example, rectangular, circular, elliptical, etc. The lens 30 can be manufactured using materials well-known in the art and by well-known manufacturing methods. As materials, resin or glass, etc. can be cited. A light diffusion component or the like can also be contained in these materials.

[0094] Here, as an example, the lens 30 uses a Fresnel lens. The Fresnel lens is configured such that the side with concavities and convexities faces the light-emitting device 10 side, allowing the light emitted from the light-emitting device 10 to enter and exit from the flat other side. By using a Fresnel lens as the lens 30, the thickness of the lens 30 can be made thinner. Therefore, the length of the light taken out from the light source, i.e., the light-emitting element, of the light-emitting module can be shortened. Also, by forming the lens 30 thinly, it is easy to dispose an air layer between it and the light-emitting device 10. By disposing this air layer, the diffusion of the light from the light-emitting device 10 can be adjusted.

[0095] <Operation of the Light-Emitting Module>

[0096] For the light-emitting module 100 configured as described above, when the lighting switch is turned on, current is supplied to the light-emitting element 1 via the wiring, and the light-emitting element 1 emits light. The light of the light-emitting element 1 is taken out to the outside from the upper surface of the light-emitting element 1 via the lens 30. Also, as the electronic component 20, the light-emitting module 100 is equipped with a light sensor, so when used as a flash module of a camera, the light of the flash can be automatically emitted according to the brightness of the subject's environment. Moreover, since the light-emitting module 100 disposes the covering member 40 between the electronic component 20 and the lens 30, the electronic component 20 is difficult to be seen, and the appearance seen through the lens is good. Also, since the covering member 40 is formed in a plate shape, the deviation in thickness is small, and the operation control of the electronic components such as the light sensor that operate by the light from the outside is constant.

[0097] [Manufacturing Method of the Light-Emitting Module]

[0098] Next, with reference to Figure 5 the manufacturing method of the light-emitting module will be described. It should be noted that, as Figure 5 shown, the manufacturing method of the light-emitting module includes: a preparation process S11 of preparing a substrate 5 provided with the light-emitting element 1 and one or more electronic components 20; a covering member forming process S12 of disposing a plate-shaped covering member 40 covering the upper surface 20a of the electronic component 20; a lens disposition process S14 of relatively disposing the lens 30 and the light-emitting element 1 via a lens holder 35 that holds the lens 30.

[0099] The preparation process S11 is a process of preparing the substrate 5 on which the light-emitting element 1 and the electronic component 20 are placed. In the preparation process S11, the substrate 5 is prepared on which the light-emitting element 1 is placed in the setting area and the electronic component 20 such as a photosensor or a Zener diode is placed. The light-emitting element 1 can be placed on the substrate 5 in an unpackaged chip state, or can be placed on the substrate 5 in a state of the light-emitting device 10 in which the light-emitting element 1 is packaged. In the light-emitting device 10, a translucent member 2 containing a phosphor is provided on the light extraction surface of the light-emitting element 1, and a protective member 3 is provided on the side surfaces of the light-emitting element 1 and the translucent member 2. Moreover, in the light-emitting device 10, the upper surface of the translucent member 2 is exposed from the protective member 3.

[0100] The cover member forming process S12 is a process of providing the plate-shaped cover member 40 between the electronic component 20 placed on the substrate 5 and the lens 30. In the cover member forming process S12, the plate-shaped cover member 40 that covers the upper surface 20a of the electronic component 20 is provided. In the cover member forming process S12, the plate-shaped cover member 40 that is previously formed is provided so as to cover at least a part of the upper surface 20a of the electronic component 20. For example, when the electronic component 20 is a thermistor or a Zener diode or the like, its shape is a rectangular parallelepiped, the entire upper surface is flat, and electrical connection terminals with the substrate are provided on the lower surface. Therefore, as an example, the plate-shaped cover member 40 is provided so as to cover the entire upper surface 20a of the electronic component 20 via the resin bonding material 45. The cover member 40 contains a coloring substance, and in a state of being disposed on the electronic component 20, for example, it is formed to have an appearance color in the same color system as the appearance color of the translucent member 2 that constitutes the light-emitting surface of the light-emitting device 10. It should be noted that the cover member 40 can also be formed to have a color in the same color system as the protective member 3 of the light-emitting device 10, such as white.

[0101] That is, when the light emitting module 100 is observed from the outside, the cover member 40 is in a state where the appearance shape and appearance color (mainly black) of the covered electronic component 20 are difficult to recognize through the lens 30. Therefore, in order to make it difficult to see the electronic component 20 through the lens 30, the material of the coloring material contained in the cover member 40 is selected. In addition, the electronic component 20 on the substrate 5 is a structure in which a part 20a1 of the upper surface 20a is a flat part, and the other part 20a2 is not flat or has a connection part such as a wire wr. In this case, the cover member forming step S12 covers a part 20a1 of the flat upper surface 20a of the electronic component 20 by the flat cover member 40, and covers the other part 20a2 of the upper surface 20a exposed from the cover member 40 by the cover resin 50. It should be noted that even if the entire upper surface of the electronic component 20 is flat, there is a case where the part opposite to the lens 30 (that is, the part directly below the lens when viewed from above) is only a part 20a1 of the upper surface 20a. In this case, a portion 20a1 of the upper surface 20a can be covered by a plate-like covering member 40 without covering another portion 20a2, but considering the appearance when viewed from an inclined direction, it is preferred to cover the entire upper surface. Moreover, in the covering member forming step S12, the covering member 40 is provided on the upper surface 20a of the electronic component 20 via a resin adhesive material or by welding. It should be noted that the covering member 40 can be provided on the upper surface 20a of the electronic component 20 by double-sided tape or other methods. In the covering member forming step S12, the covering member 40 is provided on a portion or all of the upper surface 20a of the electronic component 20 opposite to the lens 30, and the appearance color (mainly black) of the electronic component 20 is hidden via the lens 30, which can enhance the aesthetics of the light-emitting module 100.

[0102] The lens configuration step S14 is a step of fixing the lens 30 on the substrate 5 provided with the light emitting device 10. In the lens configuration step S14, the lens 30 is arranged opposite to the light emitting element 1 via a lens holder 35 that holds the lens 30. An example of the lens 30, namely a substantially circular Fresnel lens, is arranged above the light emitting device 10. At this time, in order to separate the upper surface of the light emitting device 10 from the lens 30, the lens holder 35 is fixed to the substrate 5. It should be noted that the lens holder 35 has a rectangular holding portion that holds the lens at the center and a side wall surface portion that is changed in direction by 90 degrees from the four sides of the holding portion and is arranged on the side of the substrate 5, and is fixed by bonding the end surface of the side wall surface portion to the substrate 5 via an adhesive material. Through the above steps, the light emitting module 100 can be manufactured.

[0103] Note that when forming a resist layer on the surface of the substrate 5, a mask or the like is used to form the resist layer outside the mounting regions of the light-emitting device 10 and the electronic component 20. The resist layer can be formed using a known material by a known method. The resist layer can be formed in the preparation step S11, or a substrate 5 on which the resist layer has been previously formed can be prepared in the preparation step S11.

[0104] Note that the covering member 40 described in the light-emitting module 100 and the method of manufacturing the light-emitting module can be, for example, Figures 4B to 4H the structure shown.

[0105] Hereinafter, a first modification to a seventh modification of the covering member will be described.

[0106] As Figure 4B shown, as a first modification, the covering member 40B is provided on the upper surface 20a of the electronic component 20 via a resin bonding material 45, for example. The covering member 40B includes a central covering portion 40B1 facing the upper surface 20a of the electronic component 20 and an extended covering portion 40B2 formed by extending to the periphery (all four sides) of the central covering portion 40B1. Since the covering member 40B is formed to have an area larger than the area of the upper surface 20a of the electronic component 20, it is possible to more reliably shield the electronic component 20 so that it cannot be seen through the lens 30.

[0107] As Figure 4C shown, as a second modification, the covering member 40C is formed by covering a part 20a1 of the upper surface 20a of the electronic component 20a via a resin bonding material 45. The covering member 40C is used when a part 20a1 of the upper surface 20a of the electronic component 20 faces the lens 30 and the remaining part 20a2 of the upper surface 20a does not face the lens 30.

[0108] As Figure 4D shown, as a third modification, the covering member 40D is used in the case of covering a part 20a1 of the upper surface 20a of the electronic component 20 via a resin bonding material 45 in the same manner as Figure 4C . The covering member 40D includes a central covering portion 40D1 facing a part 20a1 of the upper surface 20a of the electronic component 20 and an extended covering portion 40D2 formed by extending in three directions toward the central covering portion 40D1. Since the covering member 40D is formed with the extended covering portion 40D2, when observing the light-emitting surface of the module obliquely, it is possible to more reliably conceal the electronic component 20 so that it cannot be seen.

[0109] As Figure 4EAs shown, as a fourth modification example, the covering member 40E includes a central covering portion 40E1 that covers the upper surface 20a of the electronic component 20 and a side covering portion 40E2 that covers one side surface 20b1 of the side surface 20b of the electronic component 20. The side covering portion 40E2 of the covering member 40E is formed along one side surface 20b1 of the electronic component 20 from one end of the central covering portion 40E1 that is rectangular when viewed from above, and is arranged to cover one side surface 20b1. As an example, the covering member 40E bonds the central covering portion 40E1 and the upper surface 20a of the electronic component 20 via a resin bonding material 45. Since the covering member 40E can cover the upper surface 20a and one side surface 20B1 of the electronic component 20 for concealment, it can be shielded in such a way that the black color of the electronic component 20 cannot be seen through the lens 30. It should be noted that the covering member 40E may have a structure in which the side covering portion 40E2 is connected to one side surface 20b1 of the electronic component 20 by the resin bonding material 45, or may have a structure in which a substrate 5 opposite to the end surface of the side covering portion 40E2 is bonded via the resin bonding material 45.

[0110] As Figure 4F shown, as a fifth modification example, the covering member 40F has a shape obtained by bending a plate-shaped covering member 40F. Specifically, the covering member 40F includes a first covering portion 40F1, a second covering portion 40F2 connected to the first covering portion 40F1, and a third covering portion 40F3 connected to the second covering portion 40F2. The first covering portion 40F1 faces a part 20a1 of the upper surface 20a of the electronic component 20 and directly or via a bonding member 45 covers a part 20a1 of the upper surface 20a. The second covering portion 40F2 is spaced apart from another part 20a2 of the upper surface 20a of the electronic component 20, faces the other part 20a2, and covers the other part. The third covering portion 40F3 faces one side surface 20b1 of the side surface 20b of the electronic component 20 and covers one side surface 20b1. The second covering portion 40F2 is formed, for example, at a position above the first covering portion 40F1 (that is, a position closer to the lens 30 than the first covering portion 40F1) in order to cover the connection portion of the wire wr when there is a connection member such as the wire wr in another part 20a2 of the upper surface 20a of the electronic component 20. The third covering portion 40F3 of the covering member 40F is formed from the end of the second covering portion 40F2 toward the substrate 5 side and is formed to face one side surface 20b1 of the side surface 20b of the electronic component 20.

[0111] In the covering member 40F, the side covering portion 40F3 may be formed in such a manner as to abut against one side surface 20B1 of the electronic component 20, or the side covering portion 40F3 may be formed in such a manner as to face one side surface 20b1 with a predetermined interval therebetween. It should be noted that the covering member 40F may have a structure in which the side covering portion 40F3 and the side surface 20b of the electronic component 20 are connected by the resin bonding material 45, or may have a structure in which the end surface of the side covering portion 40F3 and the opposing substrate 5 are bonded via the resin bonding material 45.

[0112] In the above-mentioned covering members 40E and 40F, the position connected by the resin bonding material 45 or the like may be on the substrate 5 side or on the side surface 20b of the electronic component 20. And the covering members 40E and 40F may not abut against the upper surface 20a of the electronic component 20, as long as they are located between the lens 30 and the upper surface 20a of the electronic component 20.

[0113] As Figure 4G shown, as a sixth modification example, the covering member 40G includes a central covering portion 40G1 that covers the upper surface 20a of the substantially rectangular parallelepiped-shaped electronic component 20, and first to fourth side covering portions 40G11 to 40G14 that are continuous from the central covering portion 40G1 and cover approximately half of the height of the four side surfaces 20b connected to the upper surface 20a. The covering member 40G may also bond a plate-like structure having the first to fourth side covering portions 40G11 to 40G14 that pre-cover a part of the side surface of the electronic component 20 to the upper surface 20a of the electronic component 20 via the resin bonding material 45. And the covering member 40G may also be formed by performing the following covering member processing step S13 (refer to Figure 6 ), that is, in a state where the extension portion shown in Figure 4B is formed, after being bonded to the electronic component 20 via the resin bonding material 45, it is processed in such a way as to heat the extension portion or the like so that it follows the side surface 20b of the electronic component 20.

[0114] As Figure 4H shown, as a seventh modification example, the covering member 40H includes a central covering portion 40H1 formed opposite to the upper surface 20a of the electronic component 20, a side covering portion 40H2 that is continuously formed with the central covering portion 40H1 and covers two opposing side surfaces 20b connected to the upper surface 20a of the electronic component 20, and a flange portion 40H3 that is continuously formed with the side covering portion 40H2 and abuts against the substrate 5. The covering member 40H may also be a plate-like member in which the central covering portion 40H1, the side covering portion 40H2, and the flange portion 40H3 are pre-formed. And the covering member 40H may also be formed by performing the following covering member processing step S13 (refer to Figure 6)It is formed by, that is, after bonding the central covering portion 40H1 to the upper surface 20a of the electronic component 20, the processing side covering portion 40H2 and the flange portion 40H3 are processed along the side surface 20b of the electronic component 20 and the substrate 5, so that the side covering portion 40H2 and the flange portion 40H3 extend from the central covering portion 40H1 and are formed in a flexible sheet-like member in the same planar shape.

[0115] It should be noted that in the first to seventh modification examples, the covering member 40 contains the coloring matter described above and is formed in a color of the same color system as the phosphor contained in the light-transmitting member 2 of the light-emitting device 10 or white.

[0116] As described above, in the light-emitting module 100, in the first to seventh modification examples of the covering member 40, if it is a shape that covers the upper surface 20a of the electronic component 20 or covers from the upper surface 20a of the electronic component 20 to the side surface 20b side, even when observed from an angle other than the front through the lens 30, it is possible to more reliably hide so that the black color of the electronic component 20 cannot be seen.

[0117] And, as Figure 6 shown, the light-emitting module 100 can be manufactured by the following method, that is, after performing the preparation process S11 and the covering member forming process S12 described above, the covering member processing process S13 is performed, and then the lens arranging process S14 is performed.

[0118] (Second Embodiment)

[0119] Next, the light-emitting module 100B of the second embodiment will be described.

[0120] Figure 7 is an exploded perspective view schematically showing the structure of the light-emitting module of the second embodiment. Figure 8 is a top view schematically showing the light-emitting module of the second embodiment. Figure 9 is a cross-sectional view schematically showing the internal structure of the light-emitting module of the second embodiment.

[0121] It should be noted that in the light-emitting module 100B of the second embodiment, the number of light-emitting elements and the shape of the lens are compound eye lenses, which are different from the light-emitting module 100 of the first embodiment. Hereinafter, the same structural components as those of Figure 1 the light-emitting module 100 shown are denoted by the same reference numerals and description thereof is omitted.

[0122] The light-emitting module 100B includes first to fourth light-emitting devices 10B1 to 10B4 arranged in an array on a substrate 5, and a compound eye lens 30B. The first to fourth light-emitting devices 10B1 to 10B4 are light-emitting devices each including a light-emitting element 1 and a light-transmissive member 2 containing a phosphor. The compound eye lens 30B is disposed on the substrate 5 via a lens holder 35B, and faces each light-emitting element 1 and has a plurality of (e.g., four in the drawing) lens portions 30B1 to 30B4. When viewed from above, the four light-emitting elements 1 are respectively disposed opposite to any one of the lens portions 30B1 to 30B4. Here, the first light-emitting device 10B1 and the second light-emitting device 10B2 have a light-emitting element 1 and a light-transmissive portion 2 containing a phosphor, and the light-emitting colors of the light-emitting devices are of the same color system. Also, the third light-emitting device 10B3 and the fourth light-emitting device 10B4 have a light-emitting element 1 and a light-transmissive unit 2 containing a phosphor, and the light-emitting colors are different from those of the first light-emitting device 10B1 and the second light-emitting device 10B2. Moreover, the first light-emitting device 10B1 and the second light-emitting device 10B2 are arranged in an array on the substrate 5 so as to face the third light-emitting device 10B3 and the fourth light-emitting device 10B4. It should be noted that, as Figure 8 shown, when viewed from above, the centers of the respective light-emitting elements 1 are arranged such that they are located at the centers of the respective lenses of the opposing compound eye lens 30B.

[0123] The first to fourth light-emitting devices 10B1 to 10B4 each include a light-emitting element 1 and a light-transmissive member 2 containing at least one of a phosphor and a light diffusing member. The first to fourth light-emitting devices 10B1 to 10B4 select the emission wavelength of the light-emitting element 1 and the phosphor contained in the light-transmissive portion such that the first light-emitting device 10B1 and the second light-emitting device 10B2 emit white light, and the third light-emitting device 10B3 and the fourth light-emitting device 10B4 emit reddish-brown light.

[0124] It should be noted that the first light-emitting device 10B1 and the second light-emitting device 10B2 have the same structure as the structure already described, and include a light-emitting element 1, a light-transmissive member 2 containing a phosphor, and a protection member 3. Also, the third light-emitting device 10B3 and the fourth light-emitting device 10B4 are different only in the type of the light-emitting element and / or the phosphor contained therein, and other structures are the same as those of the first light-emitting device 10B1 and the second light-emitting device 10B2.

[0125] Here, the so-called reddish-brown corresponds to the chromaticity range of the region composed of the long wavelength region in yellow and the short wavelength region of yellowish-red in JIS Z8110, and the region between the yellow region of JIS Z9101 for safety colors and the short wavelength region of yellowish-red. For example, the main wavelength refers to the region within the range of 580 nm to 600 nm.

[0126] As an example of the red phosphor contained in the light-transmitting member 2 of the third light-emitting device 10B3 and the fourth light-emitting device 10B4, for example, a nitride-based phosphor is preferably included. In addition to sialon-based phosphors (SiAlON-based phosphors), (Sr 0.97 Eu 0.03 ) 2 Si 5 N 8 , (Ca 0.985 Eu 0.015 ) 2 Si 5 N 8 , (Sr 0.679 Ca 0.291 Eu 0.03 ) 2 Si 5 N 8 etc. It should be noted that as the base member of the light-transmitting member 2 containing the red phosphor, the above resin materials, glass, etc. can be used.

[0127] It should be noted that as the phosphor contained in the light-transmitting member, in addition to the yellow phosphor and red phosphor described above, other known phosphors can also be used. And by combining these phosphors, a light-emitting device with a desired emission color can be obtained.

[0128] The substrate 5 has a first region 5B1 for mounting the first light-emitting device 10B1 and the second light-emitting device 10B2, and a second region 5B2 for mounting the third light-emitting device 10B3 and the fourth light-emitting device 10B4.

[0129] The first region 5B1 is provided with a yellow resist layer of the same color system as the light-transmitting member 2 containing the phosphors of the first light-emitting device 10B1 and the second light-emitting device 10B2 on the surface of the base material. And the second region 5B2 is provided with a reddish-brown resist layer of the same color system as the light-transmitting member 2 containing the phosphors of the third light-emitting device 10B3 and the fourth light-emitting device 10B4 on the surface of the base material. It should be noted that the resist layers provided in the first region 5B1 and the second region 5B2 can function as a protective film for the formed wiring. In addition, the resist layer can also contain a reflective member, thereby improving the light extraction efficiency of the light-emitting module 100B.

[0130] The lens parts 30B1 to 30B4 of the compound eye lens 30B are formed as Fresnel lenses here. The Fresnel lenses are arranged such that the side with unevenness faces the sides of the first light-emitting device 10B1 to the fourth light-emitting device 10B4, and the light emitted from the first light-emitting device 10B1 to the fourth light-emitting device 10B4 enters and exits from the flat other side. The compound eye lens 30B has a lens holder 35B on its outer periphery. The perspective holder 35B can be separated from the compound eye lens 30B with an air layer existing between the upper surface of the first light-emitting device 10B1 to the fourth light-emitting device 10B4 and the light incident surface of the compound eye lens 30B.

[0131] As Figures 4A to 4H shown, the covering member 40 (40B to 40H) is formed by the same structure and the same components as the structure already described. And the thickness of the covering member 40 (40B to 40H) can be formed corresponding to the height of the electronic component 20 from the substrate 5 and corresponding to the type of the electronic component 20, so that the covering member 40 (40B to 40H) does not come into contact with the lens 30. And the covering member 40 (40B to 40H) can be constant within the range where the covering member 40 (40B to 40H) does not come into contact with the lens 30 corresponding to the height of the electronic component 20 from the substrate 5.

[0132] The covering member 40 is arranged on the electronic component 20 close to the first light-emitting device 10B1 and the second light-emitting device 10B2, and contains a coloring substance of the same color system as the translucent member 2 containing the yellow phosphor. And the covering member 40 arranged on the electronic component 20 close to the third light-emitting device 10B3 and the fourth light-emitting device 10B4 contains a reddish-brown coloring substance of the same color system as the translucent member 2 containing the yellow phosphor and the red phosphor.

[0133] The light-emitting module 100B can independently control the first light-emitting device 10B1 and the second light-emitting device 10B2, the third light-emitting device 10B3 and the fourth light-emitting device 10B4, and when used as a flash module of a camera, it can be adjusted to a desired emission color according to the subject. For example, when only the third light-emitting device 10B3 and the fourth light-emitting device 10B4 emit light, reddish-brown light is emitted, and when only the first light-emitting device 10B1 and the second light-emitting device 10B2 emit light, white light is emitted. And when the first light-emitting device 10B1 to the fourth light-emitting device 10B4 all emit light simultaneously, both white light and reddish-brown light are emitted, and the compound eye lens 30B diffuses these lights.

[0134] And the manufacturing method of the light-emitting module 100B is substantially the same as the manufacturing method of the light-emitting module 100 already described, and only by changing the number of light-emitting devices, it can be achieved through Figure 5 and Figure 6Manufacture is performed through the respective processes shown.

[0135] In addition, the number of the light-emitting devices 10 may be four, two, three, or five as described above. Moreover, the number of the lens portions of the compound eye lens also increases corresponding to the number of the light-emitting devices. Further, in the case of using four light-emitting devices, among the light-emitting devices arranged in the row and column directions, the first light-emitting device 10B1 that irradiates white light and the second light-emitting device 10B2 may be arranged in the first column of the first row and the second column of the second row, and the third light-emitting device 10B3 that irradiates reddish brown and the fourth light-emitting device 10B4 may be arranged in the second column of the first row and the first column of the second row to be alternately in an array. Therefore, the light-emitting module 100B can prevent deviation in illuminance distribution from occurring in each light-emitting color by covering the electronic component 20 with the covering member 40 having the same color system as the color of the surrounding components. Further, the light-emitting module 100B can irradiate the irradiation range with a uniform light-emitting color even in the color-mixed light of the first light-emitting device 10B1 to the fourth light-emitting device 10B4.

Claims

1. A light-emitting module, characterized in that, it has: a substrate; a light-emitting element and an electronic component provided on the substrate; a lens separately provided at a position opposite to the light-emitting element and the electronic component and separated from the light-emitting element and the electronic component; a plate-shaped covering member disposed between the lens and the electronic component and containing a coloring substance, the electronic component includes a photosensor having a light-receiving surface for receiving light via the lens, the covering member is provided at least on a part of the upper surface of the electronic component and covers the light-receiving surface with a certain thickness, the color of the covering member is a color in the same color system as the color of the light-emitting element or the substrate.

2. The light-emitting module according to claim 1, wherein, the covering member is separately disposed from the lens.

3. The light-emitting module according to claim 1, wherein, the covering member is formed to have a size equal to or larger than the upper surface of the electronic component when viewed from above.

4. The light-emitting module according to claim 1, wherein, the covering member extends from the upper surface of the electronic component and is formed into a plate shape covering at least one side surface of the electronic component.

5. The light-emitting module according to any one of claims 1 to 4, wherein, the lens is a Fresnel lens.

6. The light-emitting module according to any one of claims 1 to 4, wherein, the lens contains a light diffusion component.

7. The light-emitting module according to any one of claims 1 to 4, wherein, the covering member is bonded to the electronic component via a resin adhesive material or by fusion bonding.

8. The light-emitting module according to any one of claims 1 to 4, wherein, there are a plurality of the light-emitting elements, the lens is a compound eye lens having a plurality of lens portions corresponding to the number of the light-emitting elements.

9. The light-emitting module according to any one of claims 1 to 4, wherein, the light-emitting element has a light-transmissive component on the light extraction surface, the light-transmissive component contains at least one of a phosphor and a diffusion component, the color of the light-transmissive component is a color in the same color system as the color of the covering member.

10. The light-emitting module according to claim 1, wherein, the covering member covers a part of the upper surface of the electronic component, and another part of the upper surface of the electronic component is covered by a covering resin.

11. A method for manufacturing a light-emitting module, the light-emitting module including a substrate, a light-emitting element and an electronic component mounted on the substrate, and a lens opposite to the light-emitting element and the electronic component, characterized in that, it includes: a preparation process of preparing a substrate provided with the light-emitting element and the electronic component; a covering member forming process of disposing at least a plate-shaped covering member covering a part of the upper surface of the electronic component with a certain thickness; a lens disposing process of relatively disposing the lens and the light-emitting element via a lens frame for holding the lens; the electronic component includes a photosensor having a light-receiving surface for receiving light via the lens, the color of the covering member is a color in the same color system as the color of the light-emitting element or the substrate.

12. The manufacturing method of the light-emitting module according to claim 11, wherein, in the covering part forming step, the covering member is bonded to the upper surface of the electronic component via a resin bonding material or by fusion bonding.

13. The manufacturing method of the light-emitting module according to claim 11, wherein, after the covering member forming step, a covering member processing step is performed to process at least a part of the covering member along at least one side surface of the upper surface and the side surface of the electronic component.

14. The manufacturing method of the light-emitting module according to any one of claims 11 to 13, wherein, the covering member is formed by including a coloring substance in a base material.

15. The manufacturing method of the light-emitting module according to claim 11, wherein, the covering member forming step includes a step of covering a part of the upper surface of the electronic component with the covering member and covering another part of the upper surface of the electronic component with a covering resin.

Images