Electronic equipment and liquid cooling device for the electronic equipment

Abstract

An embodiment of the present invention provides an electronic device, comprising: at least one computing unit layer, each computing unit layer including one computing unit or multiple computing units arranged side by side, each computing unit including a first shell in the shape of a rectangular parallelepiped, the height direction of the first shell extending along a first direction, and the width direction extending along a second direction perpendicular to the first direction, the first shell having a first opening and a second opening at both ends in the height direction to form a cooling liquid passage extending along the first direction; a power supply, the power supply and the at least one computing unit layer being stacked along the second direction or a third direction, the height direction of the power supply being arranged in accordance with the height direction of each computing unit, the power supply having a third opening and a fourth opening at both ends in the height direction to form a cooling liquid passage extending along its height direction, wherein the opening directions of the first opening correspond to those of the third opening.

Description

Technical Field

[0001] The present invention relates to the field of electronic equipment, and in particular to an electronic equipment and a liquid cooling device for the electronic equipment. Background Art

[0002] With the rapid development of artificial intelligence and the continuous upgrading of electronic devices, the amount of data processed by these devices is increasing, the computing density is increasing, and the heat generated by chips such as CPUs (central processing units) and GPUs (graphics processing units) is also increasing. Currently, most electronic devices use traditional air-cooling systems for heat dissipation. However, air-cooling systems have disadvantages such as high noise, low heat dissipation efficiency, and high environmental requirements. They also have difficulty meeting the heat dissipation requirements of high-power density devices.

[0003] In recent years, new liquid cooling technologies have gradually emerged. Compared to traditional air cooling, liquid cooling offers inherent advantages such as low noise, low power consumption, and low environmental requirements. Liquid cooling solutions are suitable for electronic devices with high power density. However, most existing liquid-cooled electronic devices are simply modified from air-cooled devices by removing the fan and other operations. The fluid structure within these devices is not suitable for sufficient heat exchange between the coolant and the heat-generating components in the liquid cooling system, affecting heat dissipation efficiency. Since the electronic devices need to be immersed in the coolant, they need to be removed for maintenance, which is cumbersome. Therefore, a new type of liquid-cooled electronic device is needed to address these issues. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide an electronic device and a liquid cooling device for the electronic device.

[0005] One embodiment of the present invention provides an electronic device, including:

[0006] At least one computing unit layer, each computing unit layer including one computing unit or multiple computing units arranged side by side, each computing unit including a first housing in a rectangular parallelepiped shape, the first housing extending in a height direction along a first direction, extending in a width direction along a second direction perpendicular to the first direction, and extending in a length direction along a third direction perpendicular to both the first and second directions, and the first housing having a first opening and a second opening at both ends in a height direction to form a cooling liquid passage extending along the first direction;

[0007] A power supply, wherein the power supply and the at least one computing unit layer are stacked along the second direction or the third direction, the height direction of the power supply is arranged consistently with the height direction of each computing unit, and the two ends of the height direction of the power supply have a third opening and a fourth opening to form a coolant passage extending along its height direction, wherein the opening directions of the first opening correspond to the opening directions of the third opening.

[0008] In one embodiment, the system further includes a computing unit connection mechanism, wherein the computing unit connection mechanism includes:

[0009] a splicing groove, the splicing groove being concave from the outer surface of the first shell and arranged along the height direction of the first shell, the splicing groove having a contraction portion opened on the outer surface of the first shell;

[0010] A splicing column, the height of which corresponds to the height of the first shell, the two ends of the cross section of which respectively correspond to the shapes of the splicing grooves of two adjacent computing units, and the splicing column is inserted into the corresponding splicing grooves of the two adjacent computing units to connect the two computing units together.

[0011] In one embodiment, the splicing groove is provided at a corresponding position of the contact surface when the first shells are stacked.

[0012] In one embodiment, the electronic device includes a plurality of computing unit layers, the plurality of computing unit layers are stacked along the second direction, and the power supply is located on one side of all the computing unit layers in the second direction; or

[0013] The electronic device includes a plurality of operation unit layers, and the power supply is arranged between two operation unit layers in the second direction.

[0014] In one embodiment, the computing unit includes:

[0015] a first shell;

[0016] A computing module or a plurality of computing modules stacked along the second direction, wherein the computing modules are installed in the first housing along the first direction;

[0017] The radiators are arranged in pairs, and the pair of radiators are respectively attached to the upper and lower surfaces of a corresponding computing module to absorb the heat of the computing module. The cooling liquid passage of the radiator extends along the first direction, and the inner walls of the upper and lower surfaces of the first shell are attached to the radiator.

[0018] In one embodiment, the inner wall of the first housing extending along the first direction and the second direction further includes a guide rail extending along the first direction;

[0019] One of the paired radiators further includes mounting guide grooves on both sides extending along the first direction that slide with the guide rails, and the computing module is inserted into the first shell from the first opening through the sliding fit between the mounting guide grooves and the guide rails.

[0020] In one embodiment, the splicing groove includes a first splicing groove provided at a corresponding position of the outer surface of the first shell extending along the first direction and the second direction, and a second splicing groove provided at a corresponding position of the outer surface of the first shell extending along the first direction and the third direction;

[0021] The position of the first splicing groove corresponds to the position of the guide rail.

[0022] In one embodiment, the computing unit layer further includes:

[0023] a first fixing plate, the first fixing plate being connected to the computing unit from one side of the first opening;

[0024] a second fixing plate, the second fixing plate being connected to the computing unit from one side of the second opening, the second fixing plate further comprising a plurality of first flow-limiting holes for the coolant to flow through;

[0025] The power supply further comprises:

[0026] a power supply panel, the power supply panel being connected to the power supply from one side of the third opening,

[0027] a connecting terminal electrically connected to a power source and exposed to the power panel;

[0028] a current limiting plate, the current limiting plate being connected to the power supply from one side of the fourth opening, the current limiting plate further comprising a plurality of second current limiting holes for the coolant to flow through;

[0029] The side of the computing module facing the first opening further includes a connecting piece, and the computing unit is electrically connected to the power supply through the connection between the connecting piece and the connecting terminal.

[0030] In one embodiment, the system further includes a control module, wherein the control module is integrated in the power supply and electrically connected to the power supply.

[0031] Another embodiment of the present invention further provides an electronic device, including:

[0032] At least one computing unit layer, each computing unit layer including one computing unit or multiple computing units arranged side by side, each computing unit including a first housing in a rectangular parallelepiped shape, the first housing extending in a height direction along a first direction, extending in a width direction along a second direction perpendicular to the first direction, and extending in a length direction along a third direction perpendicular to both the first and second directions, and the first housing having a first opening and a second opening at both ends in a height direction to form a cooling liquid passage extending along the first direction;

[0033] a power supply, the power supply and the at least one computing unit layer being stacked along the second direction or the third direction, the height direction of the power supply being aligned with the height direction of each computing unit, the power supply having a third opening and a fourth opening at both ends in the height direction to form a coolant passage extending along the height direction thereof, wherein the opening directions of the first opening and the third opening correspond to each other;

[0034] The computing unit includes:

[0035] a first shell;

[0036] a computing module or a plurality of computing modules stacked along the second direction, the computing module being installed in the first housing along the first direction, the computing module being inserted into the first housing through the first opening, and the computing module further comprising a wiring piece on a side facing the first opening;

[0037] Radiators are arranged in pairs, each of the pair of radiators being attached to the upper and lower surfaces of a corresponding computing module to absorb heat from the computing module, wherein a coolant passage of the radiator extends along the first direction, and the inner walls of the upper and lower surfaces of the first housing are attached to the radiator;

[0038] The computing unit layer further includes:

[0039] a first fixing plate, the first fixing plate being connected to the computing unit from one side of the first opening;

[0040] a second fixing plate, the second fixing plate being connected to the computing unit from one side of the second opening, the second fixing plate further comprising a plurality of first flow-limiting holes for the coolant to flow through;

[0041] The power supply further comprises:

[0042] a power supply panel, the power supply panel being connected to the power supply from one side of the third opening;

[0043] a connecting terminal electrically connected to a power source and exposed to the power panel;

[0044] a current limiting plate, the current limiting plate being connected to the power supply from one side of the fourth opening, the current limiting plate further comprising a plurality of second current limiting holes for the coolant to flow through;

[0045] The operation unit is electrically connected to the power supply through the connection between the connecting piece and the connecting terminal.

[0046] Another embodiment of the present invention further provides a liquid cooling device for the electronic device described above, comprising:

[0047] A box body, wherein a coolant is installed in the box body, and a top of the box body has an operation port for the electronic device to enter and exit. The box body further has a coolant inlet and a coolant outlet, and a coolant passage is formed between the coolant inlet and the coolant outlet;

[0048] The electronic device is installed in the housing in such a way that the coolant passage of each computing unit is aligned with the coolant passage of the cooling device, and the first opening is closer to the operation port than the second opening. As can be seen from the above technical solution, in this embodiment, the computing unit layer composed of one or more computing units and the power supply are stacked along the width direction of each computing unit. This embodiment optimizes the arrangement of the computing units and the power supply located in the same plane into a stacked arrangement. In this way, the size difference of the electronic device in various directions can be shortened while the total volume of the electronic device remains unchanged, thereby making the structure of the electronic device more compact, making it easier to place in the cooling device, and making the structure of the cooling device used in conjunction with it more compact.

[0049] Furthermore, the modular arrangement of the present embodiment can flexibly adjust the overall size of the electronic device. Specifically, since the power supply is stacked with the computing unit layer, the number of computing units contained in each computing unit layer can be adjusted so that the size of the computing unit layer in the length direction of the computing unit is comparable to the length of the power supply, so that the electronic device can have a more regular shape. When the number of computing units exceeds the number of computing units that can be contained in one computing unit layer, it is only necessary to group the computing units into multiple computing unit layers. Such an arrangement can not only make the structure of the electronic device more compact, but also facilitate the expansion and disassembly of the electronic device.

[0050] Furthermore, the stacked arrangement of the present embodiment greatly shortens the distance between each computing unit and the power supply, thereby shortening the wiring height between the computing unit and the power supply and facilitating installation operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The following drawings are only used to schematically illustrate and explain the present invention and are not intended to limit the scope of the present invention.

[0052] Figure 1 It is a schematic structural diagram of the electronic device of the present invention.

[0053] Figure 2 It is a schematic structural diagram of the electronic device of the present invention.

[0054] Figure 3 It is a structural schematic diagram of an arithmetic unit of the electronic device of the present invention.

[0055] Figure 4 It is a structural schematic diagram of an existing electronic device.

[0056] Figure 5 It is a schematic structural diagram of an arithmetic unit in the electronic device of the present invention.

[0057] Figure 6 It is an exploded view of an embodiment of the computing unit layer in the electronic device of the present invention.

[0058] Figure 7 It is a schematic structural diagram of a power supply in an electronic device of the present invention.

[0059] Figure 8 and Figure 9 It is a schematic structural diagram of an embodiment of an electronic device of the present invention.

[0060] Figure 10 It is a schematic structural diagram of a cooling device for electronic equipment according to the present invention.

[0061] Figure 11 It is a schematic structural diagram of an embodiment of an electronic device of the present invention. DETAILED DESCRIPTION

[0062] In order to have a clearer understanding of the technical features, purposes and effects of the invention, specific embodiments of the present invention are now described with reference to the accompanying drawings, in which the same reference numerals represent the same parts.

[0063] In this document, “illustrative” means “serving as an example, instance or illustration”, and any diagram or implementation described in this document as “illustrative” should not be interpreted as a more preferred or more advantageous technical solution.

[0064] To simplify the drawings, only the parts relevant to the present invention are schematically shown in each figure and do not represent the actual structure of the product. In addition, to simplify the drawings and facilitate understanding, in some figures, only one of the components with the same structure or function is schematically depicted or labeled.

[0065] Figure 1 and Figure 2 is a schematic structural diagram of an electronic device of the present invention, Figure 3Schematic diagram of the structure of an arithmetic unit of the electronic device of the present invention. Figure 1 、 Figure 2 and Figure 3 As shown, the present invention provides an electronic device, comprising:

[0066] At least one computing unit layer 1, each computing unit layer 1 including one computing unit 10 or multiple computing units 10 arranged side by side, each computing unit 10 including a first housing 11 in the shape of a rectangular parallelepiped (including a cube), wherein the height direction of the first housing 11 extends along a first direction x, the width direction extends along a second direction y perpendicular to the first direction x, and the length direction extends along a third direction z perpendicular to both the first direction x and the second direction y. In this embodiment, the longest side of the first housing 11 is the height direction, and the shortest side is the width direction. The first housing 11 has a first opening 11a and a second opening 11b at both ends along the height direction to form a cooling liquid passage extending along the first direction x;

[0067] Power supply 2, power supply 2 and at least one computing unit layer 1 are stacked along the second direction or the third direction, the height direction of the power supply 2 is arranged consistently with the height direction of each computing unit 10, and the two ends of the power supply 2 in the height direction have a third opening 2a and a fourth opening 2b to form a coolant passage extending along the first direction x, wherein the opening direction of the first opening 11a corresponds to the opening direction of the third opening 2a.

[0068] The first direction x, the second direction y and the third direction z are indicated in the coordinate system directions in the figures herein. It should be noted that these three directions are bidirectional along the straight line extension direction, rather than just including the positive direction or negative direction represented by a single arrow.

[0069] Figure 1 and Figure 2 The electronic device is illustrated as an example in which the electronic device includes one operation unit layer 1, and the operation unit layer 1 includes three operation units 10 arranged side by side. However, the electronic device of the present invention may also include multiple operation unit layers 1, and each operation unit layer 1 may include only one operation unit 10, or include multiple operation units 10.

[0070] The electronic device of this embodiment may be a liquid-cooled server, etc., which is an electronic device that is cooled by immersion in a cooling liquid. The electronic device of this embodiment needs to be placed in a liquid-cooled device as a whole for cooling and heat dissipation.

[0071] The electronic device of this embodiment adopts a modular configuration and includes a computing unit 10 and a power supply 2. The power supply 2 is used to provide power to one or more computing units 10. The power supply 2 may also integrate components such as a control board and a controller. Typically, the computing unit 10 is a rectangular parallelepiped. In this embodiment, the longest side of the rectangular parallelepiped is defined as the height, and the shortest side is defined as the width. This definition is for distinction and explanation purposes only and is not intended to be limiting.

[0072] In the prior art, the computing unit modules and the power supply modules are usually arranged in sequence along the height direction of the computing unit, for example Figure 4 As shown, the overall length of the coolant path of the electronic device is not just the length of the coolant path of the computing unit or the power supply, but the combined length of the coolant paths of the computing unit and the power supply along the first direction (x direction). This length is greater than the length of the coolant path of the computing unit. As a result, the electronic device as a whole is too long and has a non-compact structure. This further increases the number of paths for the coolant to circulate inside the electronic device, increases the coolant resistance, and prolongs the single circulation time of the coolant, resulting in low heat dissipation efficiency.

[0073] In this embodiment, the operation unit layer 1 composed of one or more operation units 10 and the power supply 2 are stacked along the second direction or the third direction. Figure 1 The embodiment shown is that the computing unit layer 1 and the power supply 2 are stacked along the second direction y. Figure 11 In the illustrated embodiment, the computing unit layer 1 and the power supply 2 are stacked along the third direction z.

[0074] contrast Figure 1 and Figure 4 It can be seen that this embodiment optimizes the arrangement of the computing unit and the power supply in sequence along the extension direction of the coolant passage to a stacked arrangement perpendicular to the extension direction of the coolant passage. In this way, the dimension of the coolant passage of the computing unit can be shortened in the extension direction, so that the length of the coolant passage of the entire electronic device is the maximum length of the computing unit and the power supply, rather than the sum. Not only can the length of the coolant passage be shortened, but also the size difference of the electronic device in various directions can be shortened while the total volume of the electronic device remains unchanged, thereby making the structure of the electronic device more compact, thereby making it easier to place in the cooling device, and making the structure of the cooling device used in conjunction more compact.

[0075] Furthermore, the modular arrangement of this embodiment can flexibly adjust the overall size of the electronic device. Specifically, when the sizes of the power supply 2 and the computing unit 10 are fixed, since the power supply 2 is stacked with the computing unit layer 1, the number of computing units 10 contained in each computing unit layer 1 can be adjusted to make the size of the computing unit layer 1 in the length direction of the computing unit 10 equal to the length of the power supply 2, so that the electronic device can be as Figure 1 The device shown has a relatively regular appearance. When the number of computing units 10 exceeds the number of computing units 10 that can be contained in one computing unit layer 1, it is sufficient to simply group the computing units 10 into multiple computing unit layers 1. Due to the modular configuration, the size of the power supply 2 and each computing unit 10 can also be adjusted. By adjusting the size of each module, the dimensions of the computing unit layer 1 and the power supply 2, for example, in the first direction, can be matched. This configuration not only makes the electronic device more compact, but also facilitates expansion and assembly / disassembly of the electronic device.

[0076] Furthermore, the stacked arrangement of the present embodiment greatly shortens the distance between each operation unit 10 and the power supply 2 , thereby shortening the wiring height between the operation unit 10 and the power supply 2 and facilitating installation operations.

[0077] Figure 3 and Figure 5 Schematic diagram of the structure of the computing unit in the electronic device of the present invention. Figure 3 and Figure 5 As shown, the computing unit 10 includes:

[0078] The first housing 11 is a rectangular parallelepiped structure having a first opening 11a and a second opening 11b at both ends in the height direction (along the first direction x), with a cooling liquid passage for the computing unit formed between the two openings;

[0079] One computing module 12 or a plurality of computing modules 12 stacked along the width direction of the first housing 11, the computing module 12 is installed in the first housing 11 along the first direction x, wherein, Figure 3 The first housing 11 includes a computing module 12. Figure 5 The first housing 11 includes a plurality of computing modules 12, wherein: Figure 5 FIG. 1 shows a case where a computing unit 10 includes two computing modules 12, wherein the computing module 12 is a flat plate structure extending in a first direction x. The upper and lower surfaces of the computing module 12 are two side surfaces thereof along the first direction x and the third direction z.

[0080] The radiators 13 are arranged in pairs, and the pair of radiators 13 are respectively attached to the upper and lower surfaces of a corresponding computing module 12 to absorb the heat of the computing module 12. The cooling liquid passage of the radiator 13 extends along the height direction of the first shell 11, and the radiator 13 is attached to the inner walls of the upper and lower surfaces of the first shell 11.

[0081] In this embodiment, the direction of the cooling liquid passage of the electronic device is the direction of the cooling liquid passage of each computing unit 10. In each computing unit 10, the direction of the cooling liquid passage is the direction of its longest side, so that the cooling liquid passage in each computing unit 10 is the longest, so that the computing module can be fully cooled by the cooling liquid; and in the entire electronic device, the length of the cooling liquid passage is the maximum value of the computing unit and the power supply, rather than the sum. This can shorten the path length of the cooling liquid in the entire electronic device, thereby improving heat dissipation efficiency.

[0082] In order to improve heat dissipation efficiency and reduce coolant flow resistance, the coolant passage of the radiator 13 extends along the height direction of the first shell 11. For example, if the radiator 13 is in the form of multiple heat dissipation fins, the gap between each heat dissipation fin is the coolant passage of the radiator 13. Therefore, the extension direction of the heat dissipation fins of the radiator 13 is the height direction of the first shell 11.

[0083] Each computing module 12 corresponds to a pair of radiators 13 , which are respectively attached to the upper and lower surfaces of the computing module 12 to fully absorb the heat of the computing module 12 and perform heat exchange with the cooling liquid flowing therethrough.

[0084] In order to facilitate the disassembly and assembly of the computing module, the computing unit of this embodiment can be installed in a plug-in manner. Figure 3 and Figure 6 As shown, the inner walls of the left and right surfaces of the first shell 11 further include guide rails 111 extending along the height direction of the first shell 11;

[0085] One of the paired radiators 13 (shown in the figure as a radiator located below the computing module 12) further includes mounting guide grooves 131 on the left and right sides that slide with the guide rails 111. The radiator 13 and the computing module 12 are fixed as a whole. The computing module 12 is inserted into the first shell 11 from the first opening 11a through the sliding fit between the mounting guide grooves 131 and the guide rails 111.

[0086] In a preferred embodiment, the guide rail 111 is a structure protruding inward from the inner wall of the first housing 11 .

[0087] Figure 6 FIG. 1 is an exploded view of an embodiment of the computing unit layer in the electronic device of the present invention. Figure 6 As shown, the electronic device of this embodiment further includes an operation unit connecting mechanism 30, and the operation unit connecting mechanism 30 includes:

[0088] The splicing groove 31 is concave from the outer surface of the first shell 11 and is arranged along the height direction of the first shell 11. The splicing groove 31 has a contraction portion 311 opened on the outer surface of the first shell 11;

[0089] The splicing column 32 has a height corresponding to the height of the first shell 11, and both ends of the cross section of the splicing column 32 correspond to the shapes of the splicing grooves 31 of the two adjacent computing units 10. The splicing column 32 is inserted into the corresponding splicing grooves 31 of the two adjacent computing units 10 to connect the two computing units 10 together.

[0090] Specifically, if Figure 6 As shown in the enlarged view in FIG, the splicing groove 31 has a contraction portion 311 formed on the outer surface of the first shell 11. That is, the diameter of the contraction portion 311 is smaller than the diameter of the splicing groove 31. Therefore, when the splicing post 32 is inserted into the splicing groove 31, the contraction portion 311 can limit the movement of the splicing post 32 in a direction perpendicular to the outer surface of the first shell 11, thereby confining the splicing post 32 within the splicing groove 31. The two ends of the cross section of each splicing post 32 have shapes corresponding to the two opposing splicing grooves 31, respectively, so that two adjacent first shells 11 are connected together through a splicing post 32.

[0091] In this embodiment, the splicing groove 31 is recessed from the outer surface of the first shell 11. It is formed by utilizing the side wall space of the first shell 11 and does not form a protruding structure on the outside of the first shell 11. In this way, when splicing between multiple computing units, two adjacent first shells 11 can achieve planar fitting, thereby forming a compact structure.

[0092] The computing unit connection mechanism 30 of this embodiment is simple in structure and easy to operate, enabling rapid and secure assembly of the first housing 11 in either the width or length direction. Furthermore, the connection mechanism of this embodiment is embedded within the sidewall space of the first housing, without protruding from the outer surface of the first housing. This allows for a flat, flat connection without increasing the bulk of the first housing.

[0093] In this embodiment, two adjacent operation units 10 may be spliced ​​in the width direction or the length direction. Figure 6 As shown, the splicing groove 31 is arranged at the corresponding position of the contact surface when the first shell 11 is stacked, for example, at the corresponding position of the left surface and the right surface of the first shell 11; and / or at the corresponding position of the upper surface and the lower surface of the first shell 11.

[0094] For example, Figure 5 As shown, the splicing groove 31 includes a first splicing groove 31a arranged at corresponding positions on the left side surface and the right side surface of the first shell 11 (surfaces determined by the first direction x and the second direction y), and a second splicing groove 31b arranged at corresponding positions on the upper surface and the lower surface of the first shell 11 (surfaces determined by the first direction x and the third direction z).

[0095] Among them, each surface can be provided with one or more splicing grooves. For example, the second splicing groove 31b located on the upper surface of the first shell 11 can be provided at two end corners of the upper surface of the first shell 11. Figure 5 As shown, the thickness can be increased at the end corners of the inner wall of the first shell 11 to set the concave second splicing groove 31b. This will not increase the thickness of the entire first shell 11, but only locally realize the two functions of structural setting and strength enhancement.

[0096] Alternatively, as Figure 5 and Figure 6 As shown, the position of the first splicing groove 31a corresponds to the position of the guide rail 111. In a preferred embodiment, the guide rail 111 is a structure protruding inward from the inner wall of the first shell 11, and the first splicing groove 31a can be correspondingly recessed in the guide rail 111, thereby increasing the strength at the position of the first splicing groove 31a through the guide rail 111 and further avoiding increasing the thickness of the first shell.

[0097] Combine Figure 1 and Figure 6 As shown, the computing unit layer 1 further includes:

[0098] A first fixing plate 41 , the first fixing plate 41 is connected to the computing unit 10 from one side of the first opening 11 a ;

[0099] A second fixing plate 42, the second fixing plate 42 is connected to the computing unit 10 from one side of the second opening 11b, and the second fixing plate 42 further includes a plurality of first flow-limiting holes 421 for the coolant to flow through;

[0100] Combine Figure 1 and Figure 7 As shown, the power supply 2 further includes:

[0101] The power panel 21 is connected to the power supply 2 from one side of the third opening 2a;

[0102] a connection terminal 211 , which is electrically connected to the power source 2 and exposed to the power source panel 21 ;

[0103] The current limiting plate 22 is connected to the power supply 2 from one side of the fourth opening 2b, and the current limiting plate 22 further includes a plurality of second flow limiting holes 221 for the coolant to flow through;

[0104] Combine Figure 3 As shown, the side of the computing module 12 facing the first opening 11 a further includes a wiring piece 411 , and the computing unit 10 is electrically connected to the power supply 2 through the connection between the wiring piece 411 and the connection terminal 211 .

[0105] The number, location, and size of the first flow-restricting holes 421 and the second flow-restricting holes 221 can all affect the coolant flow rate. By changing these parameters, the coolant flow rate flowing through the electronic device can be adjusted, thereby correspondingly adjusting the heat dissipation effect. For example, to accommodate the difference in heat dissipation between the upper and lower surfaces of the computing module, the parameters of the first flow-restricting holes 421 corresponding to the heat sink positions on the upper and lower surfaces of the computing module can be adjusted accordingly. Alternatively, the first flow-restricting holes 421 and the second flow-restricting holes 221 can correspond to only one of the heat sinks on the upper and lower surfaces of the computing module.

[0106] Furthermore, the first fixing plate 41 may be provided with a maintenance access hole to facilitate removal of the computing module 12. The computing module 12 is inserted and removed from the side of the first opening 11a. Therefore, when the computing module needs to be maintained or replaced, it can be removed by simply removing the first fixing plate and the connecting cables connected thereto, without having to move the entire electronic device.

[0107] The number of connection terminals 211 is greater than or equal to the number of computing units 10 in the electronic device. That is, some connection terminals 211 can be used as spare interfaces to accommodate situations where some connection terminals are damaged or computing units are added or removed.

[0108] In this embodiment, the electronic device may include a plurality of computing unit layers 1, and the plurality of computing unit layers 1 are stacked along the width direction of the first housing 11, wherein the power supply 2 may be as follows: Figure 8 As shown, it is located at the bottom or top of all the computing unit layers 1 in the width direction of the first housing 11; or Figure 9 As shown, it is arranged between two arithmetic unit layers 1 in the width direction of the first housing 11 . Figure 9 The illustrated approach can further shorten the distance between the computing unit 10 and the power supply 2 , thereby more reasonably arranging the layout of the connecting cables.

[0109] In a preferred embodiment, Figure 7 As shown, the electronic device of this embodiment further includes a control module 50, which is integrated into the power supply 2 and electrically connected to the power supply 2. The arrangement of the control module 50 on the power supply 2 can shorten the height of the connecting cable between the control module 50 and the power supply 2, and the electrical connection can be arranged inside the power supply 2.

[0110] Another embodiment of the present invention further provides a cooling device for the above electronic equipment, such as Figure 10 As shown, the cooling device includes:

[0111] A box body 100 is provided with a coolant 110. The top of the box body 100 has an operation port 101 for entering and exiting electronic equipment. The box body 100 further has a coolant inlet 102 and a coolant outlet 103. A coolant passage is formed between the coolant inlet 102 and the coolant outlet 103. The coolant inlet 102 is located below the coolant outlet 103.

[0112] The electronic device is installed in the housing 100 such that the cooling liquid passage of each computing unit 10 is aligned with the cooling liquid passage of the cooling device, and the first opening 11 a is closer to the operation port 101 than the second opening 11 b .

[0113] In this embodiment, the top of the housing 100 has an operation port 101. Here, the top of the housing 100 refers to the side facing the operator, and does not necessarily have to be the top in the vertical direction. Since the plug-in port of the computing module, the connection cable of the electronic device, etc. are all arranged on the side of the first opening 11a of the computing unit, the electronic device is placed into the housing 100 of the cooling device with the first opening 11a facing the operation port 101. This can achieve the most efficient heat dissipation efficiency through the consistent direction of the coolant passage. When the computing module needs to be maintained, the operator only needs to unplug the cable connected to the computing module after turning off the power to remove the computing module for maintenance, without having to remove the entire electronic device, thereby facilitating maintenance operations.

[0114] As can be seen from the above technical solutions, the electronic device of the present invention addresses the problem in the prior art that the internal layout of liquid-cooled electronic devices is not conducive to the uniformity of the flow of coolant flowing through the electronic device, and the problem that the non-compact structure of the electronic device causes the uneven distribution of coolant inside the electronic device. By stacking the power supply and the computing unit, the size difference of the electronic device in all directions is shortened, thereby making the structure of the electronic device more compact, making it easier to place in the cooling device, and making the structure of the cooling device used in conjunction more compact. In addition, in each computing unit, the computing modules are evenly arranged inside the first housing, and the entire first housing is filled with a radiator, so that the coolant can flow evenly through the radiator, thereby improving the heat dissipation efficiency.

[0115] The electronic device of the present invention makes the structure of the electronic device more compact by changing the layout, reducing the overall height of the electronic device while keeping the overall volume unchanged, making it easier for operators to lift it from the cooling device. In addition, by setting the plug-in and unplug-out direction of the computing module toward the operating port of the cooling device, each computing module can be easily plugged in and out, and the computing module can be easily removed for maintenance without having to remove the entire electronic device.

[0116] Herein, “a” or “an” does not mean limiting the number of the relevant parts of the present invention to “only one”, and “a” or “an” does not mean excluding the situation where the number of the relevant parts of the present invention is “more than one”.

[0117] Unless otherwise stated, numerical ranges herein include not only the entire range between its two endpoints but also the several sub-ranges contained therein.

[0118] The series of detailed descriptions listed above are merely specific descriptions of feasible implementation methods of the present invention and are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not depart from the technical spirit of the present invention, such as the combination, division or repetition of features, should be included in the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that: include: At least one operation unit layer (1), each operation unit layer (1) includes one operation unit (10) or a plurality of operation units (10) arranged side by side, each operation unit (10) includes a first shell (11) in a rectangular parallelepiped shape and an operation module (12) installed in the first shell (11), the height direction of the first shell (11) extends along a first direction (x), the width direction extends along a second direction (y) perpendicular to the first direction (x), and the length direction extends along a third direction (z) perpendicular to both the first direction (x) and the second direction (y), and the first shell (11) has a first opening (11a) and a second opening (11b) at both ends in the height direction to form a cooling liquid passage extending along the first direction (x); the operation module (12) can be plugged in and out relative to the first shell (11) along the first direction of the first shell (11) through the first opening (11a); A power supply (2), wherein the power supply (2) and the at least one operation unit layer (1) are stacked along the second direction (y) or the third direction (z), the height direction of the power supply (2) is aligned with the height direction of each operation unit (10), and the power supply (2) has a third opening (2a) and a fourth opening (2b) at both ends in the height direction to form a cooling liquid passage extending along the height direction thereof, wherein the opening directions of the first opening (11a) and the third opening (2a) correspond to the opening directions of the third opening (2a).

2. The electronic device according to claim 1, wherein It further comprises an operation unit connection mechanism (30), wherein the operation unit connection mechanism (30) comprises: a splicing groove (31), the splicing groove (31) being concave from the outer surface of the first shell (11) and arranged along the height direction of the first shell (11), the splicing groove (31) having a contraction portion (311) opened on the outer surface of the first shell (11); A splicing column (32), wherein the height of the splicing column (32) corresponds to the height of the first shell (11), and the two ends of the cross section of the splicing column (32) respectively correspond to the shapes of the splicing grooves (31) of two adjacent computing units (10), and the splicing column (32) is inserted into the corresponding splicing grooves (31) of the two adjacent computing units (10) to connect the two computing units (10) together.

3. The electronic device according to claim 2, wherein: The splicing groove (31) is provided at a corresponding position of the contact surface of the first shells (11) when they are stacked.

4. The electronic device according to claim 2, wherein: The electronic device comprises a plurality of operation unit layers (1), the plurality of operation unit layers (1) are stacked along the second direction (y), and the power supply (2) is located on one side of all the operation unit layers (1) in the second direction; or The electronic device comprises a plurality of operation unit layers (1), and the power supply (2) is arranged between two operation unit layers (1) in the second direction.

5. The electronic device according to claim 2, wherein: The computing unit (10) comprises: A first housing (11); A computing module (12) or a plurality of computing modules (12) stacked along a second direction (y), wherein the computing module (12) is installed in the first housing (11) along a first direction (x); The radiators (13) are arranged in pairs, and the pair of radiators (13) are respectively attached to the upper and lower surfaces of a corresponding operation module (12) to absorb the heat of the operation module (12), the cooling liquid passage of the radiator (13) extends along the first direction, and the inner walls of the upper and lower surfaces of the first shell (11) are attached to the radiator (13).

6. The electronic device according to claim 5, characterized in that The inner wall of the first shell (11) extending along the first direction (x) and the second direction (y) further comprises a guide rail (111) extending along the first direction; Two sides of one of the paired radiators (13) extending along the first direction further include mounting guide grooves (131) that slidably cooperate with the guide rail (111), and the computing module (12) is inserted into the first housing (11) from the first opening (11a) through the sliding cooperation between the mounting guide grooves (131) and the guide rail (111).

7. The electronic device according to claim 6, characterized in that The splicing groove (31) comprises a first splicing groove (31a) provided at corresponding positions of the outer surface of the first shell (11) extending along the first direction (x) and the second direction (y), and a second splicing groove (31b) provided at corresponding positions of the outer surface of the first shell (11) extending along the first direction (x) and the third direction (z); The position of the first splicing groove (31a) corresponds to the position of the guide rail (111).

8. The electronic device according to claim 5, wherein: The operation unit layer (1) further comprises: a first fixing plate (41), the first fixing plate (41) being connected to the computing unit (10) from one side of the first opening (11a); a second fixing plate (42), the second fixing plate (42) being connected to the computing unit (10) from one side of the second opening (11b), the second fixing plate (42) further comprising a plurality of first flow-limiting holes (421) for coolant to flow through; The power supply (2) further comprises: a power supply panel (21), the power supply panel (21) being connected to the power supply (2) from one side of the third opening (2a), a connecting terminal (211), the connecting terminal (211) being electrically connected to the power source (2) and exposed to the power source panel (21); a flow limiting plate (22), the flow limiting plate (22) being connected to the power source (2) from one side of the fourth opening (2b), the flow limiting plate (22) further comprising a plurality of second flow limiting holes (221) for coolant to flow through; The side of the operation module (12) facing the first opening (11a) further includes a wiring piece (411), and the operation unit (10) is electrically connected to the power supply (2) through the connection of the wiring piece (411) and the connection terminal (211).

9. The electronic device according to any one of claims 1 to 8, characterized in that: It further comprises a control module (50), wherein the control module (50) is integrated in the power supply (2), and the control module (50) is electrically connected to the power supply (2).

10. An electronic device, characterized in that: include: At least one operation unit layer (1), each operation unit layer (1) includes one operation unit (10) or a plurality of operation units (10) arranged side by side, each operation unit (10) includes a first shell (11) in the shape of a rectangular parallelepiped, the height direction of the first shell (11) extends along a first direction (x), the width direction extends along a second direction (y) perpendicular to the first direction (x), and the length direction extends along a third direction (z) perpendicular to both the first direction (x) and the second direction (y), and the first shell (11) has a first opening (11a) and a second opening (11b) at both ends in the height direction to form a cooling liquid passage extending along the first direction (x); A power supply (2), the power supply (2) and the at least one operation unit layer (1) are stacked along the second direction (y) or the third direction (z), the height direction of the power supply (2) is aligned with the height direction of each operation unit (10), and the power supply (2) has a third opening (2a) and a fourth opening (2b) at both ends in the height direction to form a cooling liquid passage extending along the height direction thereof, wherein the opening direction of the first opening (11a) corresponds to the opening direction of the third opening (2a); The computing unit (10) comprises: A first housing (11); A computing module (12) or a plurality of computing modules (12) stacked along a second direction (y), the computing module (12) being installed in the first shell (11) along a first direction (x), the computing module (12) being inserted into the first shell (11) from the first opening (11a), the computing module (12) further comprising a wiring piece (411) on a side facing the first opening (11a), and the computing module (12) being capable of being plugged in and out relative to the first shell (11) along the first direction of the first shell (11) through the first opening (11a); Radiators (13) are arranged in pairs, wherein the pair of radiators (13) are respectively attached to the upper and lower surfaces of a corresponding computing module (12) to absorb heat from the computing module (12), the cooling liquid passages of the radiators (13) extend along the first direction, and the inner walls of the upper and lower surfaces of the first housing (11) are attached to the radiators (13); The operation unit layer (1) further comprises: a first fixing plate (41), the first fixing plate (41) being connected to the computing unit (10) from one side of the first opening (11a); a second fixing plate (42), the second fixing plate (42) being connected to the computing unit (10) from one side of the second opening (11b), the second fixing plate (42) further comprising a plurality of first flow-limiting holes (421) for coolant to flow through; The power supply (2) further comprises: a power supply panel (21), the power supply panel (21) being connected to the power supply (2) from one side of the third opening (2a); a connecting terminal (211), the connecting terminal (211) being electrically connected to the power source (2) and exposed to the power source panel (21); a flow limiting plate (22), the flow limiting plate (22) being connected to the power source (2) from one side of the fourth opening (2b), the flow limiting plate (22) further comprising a plurality of second flow limiting holes (221) for coolant to flow through; The operation unit (10) is electrically connected to the power supply (2) through the connection of the connecting piece (411) and the connecting terminal (211).

11. A liquid cooling device for an electronic device according to claim 10, comprising: A box (100), wherein a coolant (110) is installed in the box (100), and the top of the box (100) has an operation port (101) for the electronic device to enter and exit, and the box (100) further has a coolant inlet (102) and a coolant outlet (103), and a coolant passage is formed between the coolant inlet (102) and the coolant outlet (103); The electronic device is installed in the box (100) in a direction in which the cooling liquid passage of each computing unit (10) is consistent with the cooling liquid passage of the cooling device, and the first opening (11a) is closer to the operating port (101) than the second opening (11b).

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