Connector for a substrate support having an embedded temperature sensor

Abstract

A substrate support for a plasma system includes a first layer, which is made of ceramic and has a first surface and a second surface opposite to the first surface. The first layer is configured to support a substrate on the first surface during processing. A thermal heating element is embedded in the ceramic. A temperature sensor is embedded in the ceramic. A conductive pad is electrically connected to the temperature sensor via a first wire embedded in the ceramic and is formed on the second surface of the first layer. The second layer includes a through hole, which passes through the second layer. A connector extends through the through hole and includes a holder and an electrical conductor, which is held by the holder and includes: first ends, which are electrically connected to the conductive pads respectively; and second ends, which are electrically connected to a temperature controller via a wire.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Patent Application No. 15 / 936,990, filed on March 27, 2018, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to substrate supports of processing chambers, and more particularly to apparatus for connecting a temperature sensor of a substrate support to a temperature controller. Background Art

[0004] The background description provided here is for the purpose of generally presenting the context of the present disclosure. The work of the presently designated inventors is neither explicitly nor implicitly admitted to be prior art against the present disclosure to the extent that it is described in this background section and in aspects of the description that could not be determined as prior art at the time the application was filed.

[0005] The substrate processing system can be used to process substrates such as semiconductor wafers. Exemplary processes that can be performed on the substrate include, but are not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), conductor etching, and / or other etching, deposition, or cleaning processes. The substrate can be arranged on a substrate support in a processing chamber of the substrate processing system, such as a pedestal, an electrostatic chuck (ESC), etc. During etching, a gas mixture can be introduced into the processing chamber, and a plasma can be used to induce a chemical reaction.

[0006] The substrate support may include a ceramic layer configured to support a substrate. For example, a wafer may be clamped to the ceramic layer during processing. The substrate support may include an edge ring configured around an outer portion of the substrate support (e.g., outside and / or adjacent to a perimeter of the substrate support). The edge ring may be configured to confine the plasma to a volume above the substrate, protect the substrate support from being eroded by the plasma, and the like. Summary of the invention

[0007] In one feature, a substrate support for a plasma system is described. The substrate support includes a first layer, which is made of ceramic and has a first surface and a second surface opposite to the first surface. The first layer is configured to support a substrate on the first surface during processing. A thermal heating element is embedded in the ceramic. A temperature sensor is embedded in the ceramic. A conductive pad is electrically connected to the temperature sensor via a first wire embedded in the ceramic and is formed on the second surface of the first layer. The second layer includes a through hole, which passes through the second layer. A connector extends through the through hole and includes a retainer and an electrical conductor, which is retained by the retainer and includes: first ends, which are respectively electrically connected to the conductive pads; and second ends, which are electrically connected to a temperature controller via a wire.

[0008] In further features, the first ends are electrically connected to the conductive pads respectively via reflow soldering.

[0009] In further features, the retainer is one-piece.

[0010] In further features, the retainer is made of epoxy.

[0011] In further features, the retainer is made of one of silicone, polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), and ceramic.

[0012] In further features, the retainer includes: a first cylindrical disk; a second cylindrical disk; and a third cylindrical disk. The electrical conductor extends through the first cylindrical disk, the second cylindrical disk, and the third cylindrical disk, and the second cylindrical disk is sandwiched between the first cylindrical disk and the third cylindrical disk.

[0013] In further features, an adhesive bonds the electrical conductor to at least one of the first cylindrical disk, the second cylindrical disk, and the third cylindrical disk.

[0014] In further features, the first cylindrical disk includes first openings spaced apart by a first distance; the second cylindrical disk includes second openings spaced apart by a second distance, wherein the second distance is greater than the first distance or less than the first distance; and the third cylindrical disk includes third openings spaced apart by the first distance.

[0015] In further features, the first cylindrical disk, the second cylindrical disk, and the third cylindrical disk are made of ceramic.

[0016] In further features, the first cylindrical disk, the second cylindrical disk, and the third cylindrical disk are made of one of epoxy, silicone, polytetrafluoroethylene (PTFE), and polyetheretherketone (PEEK).

[0017] In further features, the first end is encapsulated within the encapsulation material.

[0018] In further features, the first end of the electrical conductor extends radially outward from an axis of the retainer.

[0019] In further features, a second temperature sensor is embedded in the ceramic, wherein the conductive pad is electrically connected to the second temperature sensor via a second wire embedded in the ceramic.

[0020] In further features, the temperature sensor is an inter-integrated circuit (I2C) temperature sensor.

[0021] In further features, the conductive pad includes a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad. The electrical conductor includes: a first electrical conductor electrically connected to the first conductive pad via reflow soldering; a second electrical conductor electrically connected to the second conductive pad via reflow soldering; a third electrical conductor electrically connected to the third conductive pad via reflow soldering; and a fourth electrical conductor electrically connected to the fourth conductive pad via reflow soldering.

[0022] In further features, the first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor are rotated 90 degrees relative to each other.

[0023] In further features, the temperature controller is configured to control heating of the thermal heating element based on the temperature measured by the temperature sensor.

[0024] In further features, the first end includes a first portion and a second portion, the first portion directly contacts the conductive pad, and the second portion is parallel to the first portion and does not directly contact the conductive pad.

[0025] In one feature, an electrical connector includes a first electrical conductor including: a first end configured to electrically connect to a first conductive pad formed on a surface of a ceramic layer of a substrate support; and a second end configured to electrically connect to a first conductive wire located within a through hole in the substrate support. A second electrical conductor includes: a third end configured to electrically connect to a second conductive pad formed on the surface of the ceramic layer of the substrate support; and a fourth end configured to electrically connect to a second conductive wire located within the through hole in the substrate support. A third electrical conductor includes: a fifth end configured to electrically connect to a third conductive pad formed on the surface of the ceramic layer of the substrate support; and a sixth end configured to electrically connect to a third conductive wire located within the through hole in the substrate support. The fourth electrical conductor includes: a seventh end configured to be electrically connected to a fourth conductive pad formed on the surface of the ceramic layer of the substrate support; and an eighth end configured to be electrically connected to a fourth wire located within the through hole in the substrate support; and a retainer configured to hold the first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor in place.

[0026] In further features, a plurality of temperature sensors embedded within the ceramic layer of the substrate support are connected in parallel and are connected to the first conductive pad, the second conductive pad, the third conductive pad, and the fourth conductive pad.

[0027] In further features, the retainer is one-piece.

[0028] In further features, the retainer is made of one of epoxy, silicone, polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), and ceramic.

[0029] In further features, the retainer includes: a first cylindrical disk; a second cylindrical disk; and a third cylindrical disk. The first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor extend through the first cylindrical disk, the second cylindrical disk, and the third cylindrical disk, and the second cylindrical disk is sandwiched between the first cylindrical disk and the third cylindrical disk.

[0030] In further features, an adhesive bonds the first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor to at least one of the first cylindrical disk, the second cylindrical disk, and the third cylindrical disk.

[0031] In further features, the first cylindrical disk includes first openings spaced apart by a first distance; the second cylindrical disk includes second openings spaced apart by a second distance, wherein the second distance is greater than the first distance or less than the first distance; and the third cylindrical disk includes third openings spaced apart by the first distance.

[0032] In further features, the first cylindrical disk, the second cylindrical disk, and the third cylindrical disk are made of one of ceramic, epoxy, silicone, polytetrafluoroethylene (PTFE), and polyetheretherketone (PEEK).

[0033] In further features, the first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor are rotated 90 degrees relative to each other.

[0034] In further features, the first end, the third end, the fifth end and the seventh end include a first portion configured to directly contact the first conductive gasket, the second conductive gasket, the third conductive gasket and the fourth conductive gasket, respectively, and a second portion that is parallel to the first portion and not in direct contact with any of the first conductive gasket, the second conductive gasket, the third conductive gasket and the fourth conductive gasket, respectively.

[0035] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims and drawings.The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The present disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0037] Figure 1 is a functional block diagram of an exemplary processing chamber;

[0038] Figure 2 a cross-sectional view of an exemplary portion including a substrate support;

[0039] Figure 3 An exemplary cross-sectional view including a connector and a through hole through a substrate support;

[0040] Figure 4 including a cross-sectional view illustrating exemplary bonding of a first end of an electrical conductor to a conductive pad caused by reflow soldering;

[0041] Figure 5 A perspective side view of a connector including electrical conductors and a retainer;

[0042] Figure 6 A perspective view of the first end containing the electrical conductors towards the connector:

[0043] Figure 7 including a perspective view of the second end of the electrical conductor facing the connector;

[0044] Figure 8 A perspective view of one of the electrical conductors is included:

[0045] Fig. 9 A perspective side view of one of the electrical conductors is included:

[0046] Fig.10 and 11 including a perspective side view including a first end of one of the electrical conductors;

[0047] Fig.12 A cross-sectional view of a retainer including a first retainer disk, a second retainer disk, and a third retainer disk;

[0048] Fig.13 An exemplary perspective view of a retainer including a first retainer disk, a second retainer disk, and a third retainer disk;

[0049] Fig.14 contains a perspective view of an exemplary retainer plate;

[0050] Fig.15 a cross-sectional view including the electrical conductor and the first retainer disk;

[0051] Fig.16 A perspective view of an exemplary retainer plate is included:

[0052] Fig.17 includes a perspective view of an exemplary potting fixture including a plurality of connectors with a one-piece retainer;

[0053] Fig.18 a cross-sectional view including the packaging fixture; and

[0054] Fig.19 A flow chart is included that depicts an exemplary method of electrically connecting a temperature sensor to a temperature controller using a connector through a through hole in a substrate support.

[0055] Among the drawings, reference numerals may be repeated to identify similar and / or identical elements. DETAILED DESCRIPTION

[0056] A substrate support, such as an electrostatic chuck, supports a substrate within a substrate processing system. The substrate support includes a ceramic portion on which the substrate rests during processing. A plurality of temperature sensors are embedded at a plurality of locations within the ceramic portion. The temperature sensors measure the temperature at their respective locations.

[0057] A plurality of electric heating elements are also embedded in a plurality of locations within the ceramic part. The temperature sensor transmits the measured temperature digitally to the temperature controller via a wire. Based on the measured temperature, the temperature controller controls the electric heating elements accordingly to achieve the target temperature.

[0058] The wire connecting the temperature sensor to the temperature controller is located in a through hole extending through the substrate support. The ceramic portion is formed with an embedded temperature sensor connected to a conductive pad, which is accessible through the through hole. In some examples, the wire can be welded to the conductive pad (e.g., by hand) to connect the temperature controller to the temperature sensor. However, due to thermal stress (e.g., from thermal expansion and contraction), the welded connection of the wire to the pad may fail over time. As a result, the temperature controller may become disconnected from the temperature sensor. The entire substrate support and temperature controller may then be replaced.

[0059] According to the present disclosure, the first end of the electrical conductor of the connector in the through hole can be reflow soldered to the conductive pad, respectively. The wire is electrically connected (e.g., soldered) to the second end of the electrical conductor of the connector. After the electrical conductor is soldered to the conductive pad, a packaging material can be inserted into the through hole. The packaging material can help maintain the electrical connection between the first end of the electrical conductor and the conductive pad.

[0060] Reference now Figure 1 , an exemplary substrate processing system 100 is shown. By way of example only, the substrate processing system 100 may be used to perform etching using radio frequency (RF) plasma and / or to perform other suitable substrate processing.

[0061] The substrate processing system 100 includes a processing chamber 102 that surrounds the other components of the substrate processing system 100 and contains an RF plasma. The processing chamber 102 includes an upper electrode 104 and a substrate support 106, such as an electrostatic chuck (ESC). During operation, a substrate 108 is disposed on the substrate support 106. Although the examples of the substrate processing system 100 and the processing chamber 102 are shown as examples, the present disclosure may also be applied to other types of substrate processing systems and processing chambers, such as substrate processing systems that generate plasma in situ, substrate processing systems that implement remote plasma generation and delivery (e.g., using plasma tubes, microwave tubes), and the like.

[0062] The upper electrode 104 may include a gas distribution device, such as a showerhead 109, which introduces and distributes the process gas. The showerhead 109 may include a stem portion including one end connected to the top surface of the process chamber 102. The base portion is generally cylindrical and extends radially outward from the opposite end of the stem portion at a position spaced apart from the top surface of the process chamber 102. The surface or faceplate of the base portion of the showerhead 109 facing the substrate includes a plurality of holes for the process gas or purge gas to flow through. Alternatively, the upper electrode 104 may include a conductive plate, and the process gas may be introduced in another manner.

[0063] The substrate support 106 includes a conductive substrate 110 that serves as a lower electrode. The substrate 110 supports a ceramic layer 112. A thermal resistance layer 114 (e.g., a bonding layer) may be disposed between the ceramic layer 112 and the substrate 110. The substrate 110 may include one or more coolant channels 116 for flowing a coolant through the substrate 110. In some examples, a protective seal 176 may be disposed around the perimeter of the thermal resistance layer 114 between the ceramic layer 112 and the substrate 110.

[0064] The RF generation system 120 generates an RF voltage and outputs the RF voltage to one of the upper electrode 104 and the lower electrode (e.g., the substrate 110 of the substrate support 106). The other of the upper electrode 104 and the substrate 110 can be DC grounded, AC grounded, or floating. By way of example only, the RF generation system 120 can include an RF voltage generator 122 that generates an RF voltage that is fed to the upper electrode 104 or the substrate 110 by a matching and distribution network 124. In other examples, the plasma can be generated inductively or remotely. Although, as shown for exemplary purposes, the RF generation system 120 corresponds to a capacitively coupled plasma (CCP) system, the present disclosure may also be applicable to other types of systems, such as, by way of example only, a transformer coupled plasma (TCP) system, a CCP cathode system, a remote microwave plasma generation and delivery system, and the like.

[0065] The gas delivery system 130 includes one or more gas sources 132-1, 132-2, ... and 132-N (collectively referred to as gas sources 132), where N is an integer greater than zero. The gas source 132 supplies one or more etching gases, carrier gases, inert gases, etc. and mixtures thereof. The gas source 132 can also supply purge gas. The gas source 132 is connected to the manifold 140 through valves 134-1, 134-2, ... and 134-N (collectively referred to as valves 134) and mass flow controllers 136-1, 136-2, ... and 136-N (collectively referred to as mass flow controllers 136). The output of the manifold 140 is supplied to the processing chamber 102. By way of example only, the output of the manifold 140 is supplied to the showerhead 109 and is output from the showerhead 109 to the processing chamber 102.

[0066] The temperature controller 142 is connected to a plurality of heating elements, such as thermal control elements (TCEs) 144 disposed in the ceramic layer 112. For example, the TCEs 144 may include, but are not limited to, large heating elements corresponding to the individual zones in the multi-zone heating plate and / or an array of micro-heating elements disposed across multiple zones of the multi-zone heating plate. The TCEs 144 may be, for example, resistive heaters (which generate heat when power is applied to each of the heaters), or another suitable type of heating element. The temperature controller 142 controls the TCEs 144 to control the temperature of multiple locations on the substrate support 106 and the substrate 108.

[0067] The temperature controller 142 may be in communication with a coolant assembly 146 to control the flow of coolant through the coolant channels 116. For example, the coolant assembly 146 may include a coolant pump and a reservoir. The temperature controller 142 operates the coolant assembly 146 to selectively flow coolant through the coolant channels 116 to cool the substrate support 106. The temperature controller 142 may control the TCE 144 together with the coolant assembly 146 to, for example, achieve one or more target temperatures.

[0068] The valve 150 and the pump 152 may be used to evacuate reactants from the process chamber 102. The system controller 160 may be used to control the components of the substrate processing system 100. The robot 170 may be used to transport substrates to and remove substrates from the substrate support 106. For example, the robot 170 may transfer substrates between the substrate support 106 and the load lock 172. Although the temperature controller 142 is shown as a separate controller, the temperature controller 142 may be implemented within the system controller 160.

[0069] In some examples, the substrate support 106 includes an edge ring 180. The edge ring 180 can move relative to the substrate 108 (e.g., can move upward and downward in a vertical direction). For example, the movement of the edge ring 180 can be controlled via an actuator in response to the system controller 160. In some examples, a user can input control parameters to the system controller 160 via a user interface 184, which can include one or more input mechanisms, a display, and the like.

[0070] Figure 2 A cross-sectional view of an exemplary portion of the substrate support 106 is shown. Figure 2As shown, the temperature controller 142 (e.g., including a circuit board and componentry) can be fixed to the bottom of the substrate 110, opposite to the thermal resistance layer 114. A plurality of temperature sensors 204 are embedded in the ceramic layer 112. Each of the temperature sensors 204 is separated from each other of the temperature sensors 204. For example only, one or more temperature sensors can be set for each TCE 144. The temperature sensor 204 measures the temperature at its respective location. In various implementations, the temperature sensor 204 can be an internal integrated circuit (I2C) temperature sensor, which uses the I2C protocol to communicate with the temperature controller 142.

[0071] The through hole 208 is formed through the substrate 110 and the thermal resistance layer 114. The temperature sensor 204 is electrically connected to the temperature controller 142 via four wires 212 and a connector 216. Although an example of a through hole 208 is provided, one or more other through holes may also be formed to connect other temperature sensors embedded in the ceramic layer 112 to the temperature controller 142. Similarly, although an example of connecting four temperature sensors to the temperature controller 142 through the through hole 208 is provided, a greater number or a lesser number of temperature sensors 204 may be connected through the through hole 208. For example only, four through holes may be provided in the ceramic layer 112, and four temperature sensors 204 may be connected through each through hole. The through hole 208 may be circular (cylindrical) and have a predetermined through hole diameter.

[0072] The temperature sensor 204 is connected (e.g., in parallel) to four conductive pads 220 via wires 224 embedded in the ceramic layer 112. A first one of the conductive pads 220 may be connected to a reference potential to power the temperature sensor 204, while a second one of the conductive pads 220 may connect the temperature sensor 204 to a ground potential. A third and a fourth one of the conductive pads 220 may be connected to the temperature controller 142 in order to communicate with the temperature controller 142. For example, the third one of the conductive pads 220 may transmit a signal from the temperature controller 142 to the temperature sensor 204. The fourth one of the conductive pads 220 may transmit a signal from the temperature sensor 204 to the temperature controller 142.

[0073] Figure 3 An exemplary cross-sectional view of the connector 216 and the through hole 208 is shown. Three of the four conductive pads 220 and three of the conductive lines 212 are also shown. Figure 3 In. Figure 3 As shown, the first ends of the electrical conductors 304 of the connector 216 are respectively electrically connected to the conductive pads 220. The first ends of the electrical conductors 304 may be respectively electrically connected to the conductive pads 220 via reflow soldering.

[0074] Once the first ends of the electrical conductors 304 are electrically connected to the conductive pads 220 (eg, by reflow soldering), encapsulation material 308 may be added. Encapsulation material 308 may improve the reliability of the electrical connection between the first ends of the electrical conductors 304 and the conductive pads 220 accordingly.

[0075] The second ends of the electrical conductors 304 of the connector 216 are electrically connected to the wires 212, respectively. The second ends of the electrical conductors 304 can be electrically connected to the wires 212, respectively, for example, by welding, reflow soldering, welding, or by another type of conductive coupling. The electrical conductors 304 can be made of copper or copper-tungsten alloy, for example. The electrical conductors 304 can be formed, for example, by molding and / or bending. In various implementations, the wires 212 can be bundled in the sheath 312.

[0076] The connector 216 also includes a retainer 316, which is configured to retain the electrical conductor 304 in a position corresponding to the conductive pad 220. The retainer 316 can be made of, for example, silicone, polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), ceramic, or epoxy resin. The retainer 316 can be formed, for example, by extrusion, cutting, encapsulation, or another process.

[0077] Figure 4 Included is a cross-sectional view illustrating an exemplary soldering 404 of a first end of one of the electrical conductors 304 to one of the conductive pads 220 resulting from reflow soldering.

[0078] Figure 5 is a perspective side view of the connector 216 including the electrical conductors 304 and the retainer 316 . Figure 6 A perspective view toward a first end of electrical conductor 304 is included. Figure 7 A perspective view of the second end of the electrical conductor is included. Figure 6 and 7 As shown, the electrical conductors 304 may be rotated approximately 90 degrees relative to each other.

[0079] Figure 8 804. In various implementations, each of the electrical conductors 304 can include a through hole 804 disposed at a predetermined distance from a second end thereof. The electrical conductor of one of the wires 212 can be inserted through the through hole 804 before the electrical conductor of the one of the wires 212 is electrically coupled to one of the electrical conductors 304. Each of the other electrical conductors 304 and the connections to the other wires 212 can be the same.

[0080] Fig. 9 Another perspective side view of one of the electrical conductors 304 is included. Fig.10 and 11A perspective side view is included including a first end of one of the electrical conductors 304 .

[0081] like Fig.11 As shown, the first end of one of the electrical conductors 304 may include a first flat portion 1104 that is configured to contact one of the conductive pads 220. One of the electrical conductors 304 may also include at least one of a second flat portion 1108 and a third flat portion 1112 that are parallel to the first flat portion 1104. A first inclined portion 1116 may connect the first flat portion 1104 to the second flat portion 1108. A second inclined portion 1120 may connect the first flat portion 1104 to the third flat portion 1112. Each of the other electrical conductors 304 may be the same. Although exemplary shapes of the first end are provided, the present disclosure may also be applied to other shapes. Figure 5 As shown, the electrical conductor 304 may extend radially inward toward the axis 504 (relative to the second end) through the retainer 316 .

[0082] The retainer 316 may be a single piece or may include multiple parts that form the retainer 316. The retainer 316 may be cylindrical and have a predetermined retainer diameter that is smaller than a predetermined through-hole diameter of the through-hole 208.

[0083] An example of a holder 316 containing multiple components is provided in Fig.12 and 13 middle. Fig.12 A cross-sectional view of the retainer 316 is included, which includes the first retainer disk 1204, the second retainer disk 1208 and the third retainer disk 1212. Fig.13 An exemplary perspective view of the retainer 316 including the first retainer disk 1204 , the second retainer disk 1208 , and the third retainer disk 1212 is included.

[0084] like Fig.12 As shown in the example of, the first retainer disk 1204 may be the same as the third retainer disk 1212, and the second retainer disk 1208 may be different from the first retainer disk 1204 and the third retainer disk 1212. The first retainer disk 1204, the second retainer disk 1208 and the third retainer disk 1212 may be made of ceramic, epoxy resin, or another suitable material. Although the example of three retainer disks is provided, the retainer 316 may include two or more than three retainer disks.

[0085] Fig.14 A perspective view of an exemplary retainer plate is included. Fig.12 and 14As shown, the first retainer disk 1204 and the third retainer disk 1212 may be a first type of cylindrical retainer disk 1404 (B), and the second retainer disk 1208 may be a second type of cylindrical retainer disk 1408 (A). The second retainer disk 1208 is sandwiched between the first retainer disk 1204 and the third retainer disk 1212. The diameters of the first type of retainer disk 1404 and the second type of retainer disk 1408 may be equal.

[0086] The first type of retainer disk 1404 has a first opening 1412, a second opening 1416, a third opening 1420, and a fourth opening 1424. Opposite ones of the first opening 1412, the second opening 1416, the third opening 1420, and the fourth opening 1424 are separated by a first predetermined distance 1428. In other words, opposite ones of the first opening 1412, the second opening 1416, the third opening 1420, and the fourth opening 1424 have a first predetermined spacing.

[0087] The second type of retainer disk 1408 has a fifth opening 1430, a sixth opening 1432, a seventh opening 1436, and an eighth opening 1440. Opposite ones of the fifth opening 1430, the sixth opening 1432, the seventh opening 1436, and the eighth opening 1440 are separated by a second predetermined distance 1444. In other words, the opposite ones of the fifth opening 1430, the sixth opening 1432, the seventh opening 1436, and the eighth opening 1440 have a second predetermined spacing. The second predetermined distance 1444 is greater than the first predetermined distance 1428, and the second predetermined spacing is greater than the first predetermined spacing. By way of example only, the first predetermined distance 1428 may be approximately 2.6 mm or another suitable distance, and the second predetermined distance may be approximately 2.8 mm or another suitable distance.

[0088] The first opening 1412, the second opening 1416, the third opening 1420, the fourth opening 1424, the fifth opening 1430, the sixth opening 1432, the seventh opening 1436, and the eighth opening 1440 may be of equal size. The second predetermined distance 1444 may be greater than the first predetermined distance 1428 by at least one of the widths 1448 of the opening or at least twice the width 1448 of the opening. The openings may be formed, for example, using laser cutting or another type of cutting.

[0089] like Fig.12As shown, the electrical conductor 304 extends through the openings of the first retainer disk 1204, the second retainer disk 1208, and the third retainer disk 1212. In the case where the electrical conductor is not bonded to the first retainer disk 1204, the second retainer disk 1208, and the third retainer disk 1212, the different first distances 1428 and second distances 1444 apply force to the sides of the electrical conductor 304 and retain the electrical conductor 304 within the connector 216. Although an example is provided in which the second type of cylindrical retainer disk 1408 is sandwiched between two first type of cylindrical retainer disks 1404, the present disclosure is also applicable to the case in which the first type of cylindrical retainer disk 1404 is sandwiched between two second type of cylindrical retainer disks 1408.

[0090] Fig.15 A cross-sectional view of the electrical conductor 304 and the first retainer disk 1504 is included. The electrical conductor 304 is bonded to the first retainer disk 1504 using an adhesive 1508, such as an epoxy or glue (e.g., super glue). The adhesive 1508 can be dispensed, for example, using a syringe 1512, a toothpick, or another type of dispenser or applicator.

[0091] like Fig.15 As shown, the first retainer disk 1504 can be bonded to the electrical conductor 304, while the first end of the electrical conductor 304 is supported on the surface 1516. Alternatively, the first retainer disk 1504 can be bonded to the electrical conductor 304, while the second end of the electrical conductor 304 is supported on the surface. In various implementations, the first retainer disk 1504 can be the first type of cylindrical retainer disk 1404 or the second type of cylindrical retainer disk 1408.

[0092] Alternatively, the first retainer disk 1504 may be configured to bond the electrical conductor 304 to the first retainer disk 1504 . Fig.16 A perspective view of another example of a first retainer disk 1504 is included. The first retainer disk 1504 may include a ninth opening 1604, a tenth opening 1608, an eleventh opening 1612, and a twelfth opening 1616. The ninth opening 1604, the tenth opening 1608, the eleventh opening 1612, and the twelfth opening 1616 may each include a circular (cylindrical) portion 1620 for the adhesive 1508. The diameter of the circular portion 1620 may be approximately 0.5 mm or another suitable diameter. The adhesive 1508 may be applied to one opening, more than one opening, or all of the openings in the first retainer disk 1504.

[0093] Two or more other retainer disks may be added to form the retainer 316. The two or more other retainer disks may be, for example, the same as the first retainer disk 1504. Although an example of bonding the electrical conductor 304 to the first retainer disk 1504 is provided, the electrical conductor 304 may additionally or alternatively be bonded to one or more other retainer disks.

[0094] In examples where the retainer 316 is a single piece, the retainer 316 may be formed using a packaging method and a packaging fixture. Fig.17 An exemplary packaging fixture, generally illustrated by 1704 , is included that includes a plurality of connectors 1708 having a one-piece retainer. Fig.18 An exemplary cross-sectional view of packaging fixture 1704 is included.

[0095] The packaging fixture 1704 may, for example, include Teflon or another material that will not adhere to the material of the retainer 316. Once the electrical conductors of each of the connectors 1708 are inserted into the packaging fixture 1704, the material of the retainer 316 (e.g., epoxy) may be added to the packaging fixture 1704 to form a retainer for the connectors 1708. An exemplary epoxy includes Master Bond's SUP12APHT-LO. The packaging fixture 1704 may include one or more springs 1712 and posts 1716 that facilitate pushing the connectors 1708 out of the packaging fixture 1704.

[0096] like Fig.18 As shown, the packaging fixture 1704 can include a well plate 1804 having an opening (or well) 1806 for a holder for a connector 1708. By way of example only, the well plate 1804 can be approximately 0.12 inches (3 mm) thick or another suitable thickness. The well 1806 can be provided with a predetermined draft (e.g., a 1 degree draft) to, for example, facilitate ejection of the connector 1708 from the packaging fixture 1704.

[0097] The connector holder plate 1808 may include an opening into which the electrical conductor is inserted. By way of example only, the connector holder plate 1808 may be approximately 0.08 inches (3 mm) thick or another suitable thickness. The spring 1712 may be disposed between the upper stop plate 1812 and the lower stop plate 1816. By way of example only, the upper stop plate 1812 may be approximately 0.5 inches (12.7 mm) thick or another suitable thickness. By way of example only, the lower stop plate 1816 may be approximately 0.25 inches (6.35 mm) thick or another suitable thickness. The packaging fixture 1704 may also include a substrate 1820. By way of example only, the substrate 1820 may be approximately 0.5 inches (12.7 mm) thick or another suitable thickness.

[0098] When the spring 1712 is in an extended state (e.g., and Fig.18), the post 1716 can extend through the upper stop plate 1812, the lower stop plate 1816, and the connector retainer plate 1808. When the spring 1712 is in a compressed state, the post 1716 extends through the well plate 1804 and pushes the connector 1708 out of the well plate 1804 and the connector retainer plate 1808.

[0099] Fig.19 A flow chart is included that describes an exemplary method of electrically connecting the temperature sensor 204 to the temperature controller 142 using the connector 216. Control begins at 1904 where solder paste (e.g., a paste of solder and flux) is applied to the conductive pads 220 formed on the ceramic layer 112 of the substrate support 106. The substrate support 106 may be relative to Figure 2 At 1904, the wire 212 may have been electrically connected to the corresponding second end of the electrical conductor 304 of the connector 216, and the other end of the wire 212 may be electrically connected to the temperature controller 142. Alternatively, the wire 212 may be electrically connected to the temperature controller 142 and / or the second end of the electrical conductor 304 of the connector 216 later (e.g., after 1920).

[0100] At 1908, the connector 216 is inserted into the through hole 208 so that the first end of the electrical conductor 304 directly and respectively contacts the conductive pad 220 and at least one of the solder paste. At 1912, heat can be applied to reflow solder the first end of the electrical conductor 304 to the conductive pad 220, respectively. At 1916, the encapsulation material 308 can be added through the through hole 208 to contact the first end of the electrical conductor 304 and the surface of the ceramic layer 112. At 1920, the encapsulation material 308 is hardened, for example, by applying heat and / or allowing the encapsulation material 308 to stand.

[0101] The foregoing description is merely illustrative in nature and is by no means intended to limit the present disclosure, its application or use. The broad teachings of the present disclosure can be implemented in various forms. Therefore, although the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, because when studying the drawings, the specification and the appended claims, other modifications will become apparent. It should be understood that one or more steps in the method can be performed in different orders (or simultaneously) without changing the principles of the present disclosure. In addition, although each embodiment is described above as having certain features, any one or more of those features described relative to any embodiment of the present disclosure can be implemented in the features of any other embodiment and / or combined with the features of any other embodiment, even if the combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and the replacement of one or more embodiments with each other remains within the scope of the present disclosure.

[0102] Various terms are used to describe the spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.), including "connected", "engaged", "coupled", "adjacent", "next to", "on top of", "above", "below", and "disposed". Unless the relationship between a first and a second element is explicitly described as "direct", when such a relationship is described in the above disclosure, the relationship can be a direct relationship, in which there are no other intermediate elements between the first and second elements, but can also be an indirect relationship, in which there are one or more intermediate elements (spatially or functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logical (A or B or C) using a non-exclusive logical OR, and should not be interpreted to mean "at least one of A, at least one of B, and at least one of C". As used herein, approximately can mean + / -10%.

[0103] In some implementations, the controller is part of a system, which can be part of the above examples. Such a system can include a semiconductor processing device, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems can be integrated with electronic devices for controlling their operations before, during, and after the processing of semiconductor wafers or substrates. The electronic device can be referred to as a "controller", which can control various components or subcomponents of one or more systems. Depending on the processing requirements and / or system type, the controller can be programmed to control any process disclosed herein, including the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer in and out of tools and other transfer tools and / or load locks connected to or connected to a specific system through an interface.

[0104] In general, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuit can include a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), a chip defined as an application specific integrated circuit (ASIC), and / or one or more microprocessors, or a microcontroller that executes program instructions (e.g., software). The program instructions can be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing a specific process on or for a semiconductor wafer or system. In some embodiments, the operating parameters can be part of a recipe defined by a process engineer to complete one or more processing steps during the manufacture of one or more (kinds of) layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0105] In some implementations, the controller may be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the "cloud" or all or part of a wafer fab host system that may allow remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, check the history of past manufacturing operations, check trends or performance criteria for multiple manufacturing operations, change parameters of a current process, set processing steps to follow the current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide a process recipe to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose (e.g., the process and control described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber communicating with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control the process on the chamber.

[0106] Example systems may include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that may be associated with or used in the manufacture and / or preparation of semiconductor wafers.

[0107] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in material transport to transport wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

Claims

1. A substrate support for a plasma system, the substrate support comprising: a first layer made of ceramic and having a first surface and a second surface opposite the first surface, the first layer being configured to support a substrate on the first surface during processing; a thermal heating element embedded within the ceramic; a temperature sensor embedded in the ceramic; Conductive spacers, which: The first lead is electrically connected to the temperature sensor via the first lead embedded in the ceramic, and formed on the second surface of the first layer; and a second layer comprising a through hole, the through hole passing through the second layer; A connector extending through the through hole and comprising: a retainer comprising more than one disc; and an electrical conductor extending through the more than one discs, held by the more than one discs of the holder, and comprising: first ends, which are electrically connected to the conductive pads respectively; and The second end is electrically connected to the temperature controller via a wire. 2 . The substrate support member according to claim 1 , wherein the first ends are electrically connected to the conductive pads, respectively, via reflow soldering.

3. The substrate support according to claim 1, wherein: The more than one disks of the holder are made of one of silicone, polytetrafluoroethylene, polyetheretherketone and ceramic.

4. The substrate support of claim 1 , wherein the holder comprises: a first cylindrical disk; a second cylindrical disk; and The third cylindrical disk, wherein the electrical conductor extends through the first cylindrical disk, the second cylindrical disk and the third cylindrical disk, and The second cylindrical disk is sandwiched between the first cylindrical disk and the third cylindrical disk.

5. The substrate support of claim 4, further comprising an adhesive bonding the electrical conductor to at least one of the first cylindrical disk, the second cylindrical disk, and the third cylindrical disk.

6. The substrate support according to claim 4, wherein: The first cylindrical disk includes first openings spaced a first distance apart; the second cylindrical disk comprising second openings spaced a second distance apart, wherein the second distance is greater than the first distance or less than the first distance; and The third cylindrical disk includes third openings spaced apart by the first distance.

7. The substrate support of claim 4, wherein the first cylindrical disk, the second cylindrical disk, and the third cylindrical disk are made of ceramic.

8. The substrate support according to claim 4, wherein The first cylindrical disk, the second cylindrical disk, and the third cylindrical disk are made of one of epoxy resin, silicone, polytetrafluoroethylene, and polyetheretherketone.

9. The substrate support according to claim 4, further comprising an encapsulation material, The first end is encapsulated in the encapsulation material.

10. The substrate support of claim 1, wherein the first end of the electrical conductor extends radially outward from an axis of the holder.

11. The substrate support of claim 1 , further comprising: A second temperature sensor is embedded in the ceramic, wherein the conductive pad is electrically connected to the second temperature sensor via a second wire embedded in the ceramic.

12. The substrate support of claim 1, wherein the temperature sensor is an inter-integrated circuit temperature sensor.

13. The substrate support of claim 12, wherein: The conductive pads include a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad; and The electrical conductor comprises: a first electrical conductor electrically connected to the first conductive pad via reflow soldering; a second electrical conductor electrically connected to the second conductive pad via reflow soldering; a third electrical conductor electrically connected to the third conductive pad via reflow soldering; as well as The fourth electrical conductor is electrically connected to the fourth conductive pad via reflow soldering.

14. The substrate support of claim 13, wherein the first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor are rotated 90 degrees relative to each other.

15. The substrate support of claim 1, further comprising the temperature controller, wherein the temperature controller is configured to control heating of the thermal heating element based on a temperature measured by the temperature sensor.

16. The substrate support of claim 1, wherein The first end includes a first portion and a second portion, the first portion directly contacts the conductive pads respectively, and the second portion is parallel to the first portion and does not directly contact the conductive pads.

17. An electrical connector, comprising: A first electrical conductor comprising: a first end electrically connected to a first conductive pad formed on a surface of the ceramic layer of the substrate support; and a second end electrically connected to a first conductive line located in a through hole in the substrate support; A second electrical conductor comprising: a third end electrically connected to a second conductive pad formed on the surface of the ceramic layer of the substrate support; and a fourth end electrically connected to a second wire located in the through hole in the substrate support; A third electrical conductor comprising: a fifth end electrically connected to a third conductive pad formed on the surface of the ceramic layer of the substrate support; and a sixth end electrically connected to a third wire located in the through hole in the substrate support; a fourth electrical conductor comprising: a seventh end electrically connected to a fourth conductive pad formed on the surface of the ceramic layer of the substrate support; as well as an eighth end electrically connected to a fourth wire located in the through hole in the substrate support; as well as a holder including more than one disc to hold the first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor in place, Wherein the first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor extend through the more than one disk.

18. The electrical connector of claim 17, wherein a plurality of temperature sensors embedded in the ceramic layer of the substrate support are connected in parallel and connected to the first conductive pad, the second conductive pad, the third conductive pad, and the fourth conductive pad.

19. The electrical connector of claim 17, wherein the retainer is made of one of epoxy, silicone, polytetrafluoroethylene, polyetheretherketone, and ceramic.

20. The electrical connector of claim 17, wherein the retainer comprises: a first cylindrical disk; and a second cylindrical disk; The first electrical conductor, the second electrical conductor, the third electrical conductor and the fourth electrical conductor extend through the first cylindrical disk and the second cylindrical disk.

21. The electrical connector of claim 20, wherein the retainer further comprises a third cylindrical disk, and Wherein the first electrical conductor, the second electrical conductor, the third electrical conductor and the fourth electrical conductor extend through the third cylindrical disk.

22. The electrical connector of claim 21, wherein the second cylindrical disk is sandwiched between the first cylindrical disk and the third cylindrical disk.

23. The electrical connector according to claim 22, wherein: The first cylindrical disk includes first openings spaced a first distance apart; the second cylindrical disk comprising second openings spaced a second distance apart, wherein the second distance is one of (a) greater than the first distance and (b) less than the first distance; as well as The third cylindrical disk includes third openings spaced apart by the first distance.

24. The electrical connector of claim 20, further comprising an adhesive bonding the first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor to at least one of the first cylindrical disk and the second cylindrical disk.

25. The electrical connector according to claim 20, wherein: The first cylindrical disk includes first openings spaced a first distance apart; The second cylindrical disk includes second openings spaced a second distance apart; and The second distance is one of (a) greater than the first distance and (b) less than the first distance.

26. The electrical connector of claim 25, wherein the first opening comprises a corresponding circular portion, and The electrical connector further comprises an adhesive in at least one of the circular portions.

27. The electrical connector of claim 20, wherein the first cylindrical disk and the second cylindrical disk are made of one of ceramic, epoxy, silicone, polytetrafluoroethylene, and polyetheretherketone.

28. The electrical connector of claim 20, wherein a first outer diameter of the first cylindrical disk is equal to a second outer diameter of the second cylindrical disk.

29. The electrical connector of claim 17, wherein the first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor are rotated 90 degrees relative to each other.

30. An electrical connector according to claim 17, wherein the first end, the third end, the fifth end and the seventh end include first parts that directly contact the first conductive gasket, the second conductive gasket, the third conductive gasket and the fourth conductive gasket, respectively, and second parts that are parallel to the first parts and not in direct contact with any of the first conductive gasket, the second conductive gasket, the third conductive gasket and the fourth conductive gasket, respectively.

31. The electrical connector according to claim 30, wherein: The first end, the third end, the fifth end, and the seventh end further include third portions connecting the first portion to the second portion, respectively.

32. The electrical connector according to claim 30, wherein: The first end, the third end, the fifth end and the seventh end also include a third portion which is parallel to the first portion and the second portion respectively and is not in direct contact with any of the first conductive pad, the second conductive pad, the third conductive pad and the fourth conductive pad.

33. The electrical connector according to claim 30, wherein: The first end, the third end, the fifth end, and the seventh end further include fourth portions connecting the first portion to the second portion, respectively, and fifth portions connecting the second portion to the third portion, respectively.

34. The electrical connector according to claim 17, wherein: The first electrical conductor, the second electrical conductor, the third electrical conductor, and the fourth electrical conductor are made of one of copper and copper-tungsten alloy.

35. The electrical connector of claim 17, wherein: the first electrical conductor comprising a first through hole formed through the first electrical conductor at a predetermined distance from the second end; the second electrical conductor comprising a second through hole formed through the second electrical conductor at a predetermined distance from the fourth end; the third electrical conductor comprising a third through hole formed through the third electrical conductor at a predetermined distance from the sixth end; and The fourth electrical conductor includes a fourth through hole formed through the fourth electrical conductor at a predetermined distance from the eighth end.

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