A pretreatment device for passivation of semiconductor material surface

Abstract

The present invention relates to the technical field of semiconductor materials, and in particular to a pretreatment device for passivating the surface of semiconductor materials, comprising a box body, a driving motor is installed at the bottom of one side of the box body, a rotating shaft is installed at the output end of the driving motor, a fixing sleeve is installed at the bottom of the box body, a rotating seat is installed with a thread inside the fixing sleeve, a second rotating column is arranged on the top of the rotating seat, first fixed shafts are installed at both ends of the second rotating column, the first fixed shaft at one end of the second rotating column is fixedly connected with the rotating seat, a receiving seat is installed on the top of the first fixed shaft at the other end of the second rotating column, a friction sleeve is rotatably installed on the outer side of the first fixed shaft, a one-way rotating mechanism is installed between the friction sleeve and the first fixed shaft, a first driving mechanism is installed between the second rotating column and a third transmission gear, a soaking box is rotatably installed on the top of the receiving seat, support plates are installed on the tops of both ends of the soaking box, and a reciprocating screw is installed in the middle of the support plate. The present invention is convenient for adjustment and improves the pretreatment efficiency of semiconductor materials.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor materials, and in particular to a pretreatment device for passivating the surface of a semiconductor material. Background Art

[0002] In integrated circuits, many devices need to be assembled on a single crystal substrate. These devices need to be connected to each other by wiring. With the increase of integration and the decrease of feature size, the wiring density must be increased. Therefore, the insulating passivation film used for electrical isolation between devices and wiring is very important. In addition, due to the difference between the surface and internal structure of the semiconductor (surface lattice atoms terminate and there are dangling bonds, i.e. unsaturated bonds), the surface and internal properties are different, and the surface condition plays an important role in the performance of the device. As long as there is a trace of contamination on the surface (such as harmful impurity ions Na+, water vapor, dust, etc.), it will affect the electrical properties of the device surface, such as surface conductivity and surface state. In order to improve the stability and reliability of device performance, the device must be isolated from the surrounding atmosphere to enhance the device's ability to block foreign ion contamination, control and stabilize the characteristics of the semiconductor surface, protect the internal interconnection of the device, and prevent the device from mechanical and chemical damage. Therefore, the surface of the semiconductor device needs to be passivated.

[0003] Prior to the passivation treatment of semiconductor materials, they need to be soaked, cleaned and other pretreatment operations. However, the existing semiconductor material pretreatment is first soaked, and then the semiconductor material is moved and cleaned. The overall pretreatment operation steps are many and the pretreatment efficiency is low. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcoming of low efficiency of semiconductor material pretreatment in the prior art, and to propose a pretreatment device for semiconductor material surface passivation.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A pretreatment device for passivation of the surface of a semiconductor material is designed, comprising a box body, characterized in that a driving motor is installed at the bottom of one side of the box body, a rotating shaft is installed at the output end of the driving motor, the rotating shaft extends into the interior of the box body, and a third transmission gear is fixed on the outer side of a section of the rotating shaft located inside the box body, a fixing sleeve is installed at the bottom of the box body, the top of the fixing sleeve corresponds to the position of the third transmission gear, a rotating seat is installed with a rotating seat through the internal thread of the fixing sleeve, a second rotating column is arranged on the top of the rotating seat, first fixed shafts are installed at both ends of the second rotating column, the first fixed shaft at one end of the second rotating column is fixedly connected to the rotating seat, a receiving seat is installed on the top of the first fixed shaft at the other end of the second rotating column, and the first fixed A friction sleeve is rotatably installed on the outer side of the shaft, and a one-way rotation mechanism is installed between the friction sleeve and the first fixed shaft. The one-way rotation directions of the friction sleeves at both ends of the second rotating column are opposite, and a first driving mechanism is installed between the second rotating column and the third transmission gear. A soaking box is rotatably installed on the top of the receiving seat, and support plates are installed on the top of both ends of the soaking box. A limiting mechanism is installed between the soaking box and the box body, a reciprocating screw is installed in the middle of the support plate, and a moving seat is threadedly installed in the middle of the reciprocating screw, an inlet pipe is installed through the inside of the moving seat, and a cleaning mechanism is installed on the moving seat, a transmission shaft is fixed on the outer side of one end of the reciprocating screw on the same side as the driving motor, and a second driving mechanism is installed between the transmission shaft and the rotating shaft.

[0007] Preferably, the one-way rotation mechanism includes a limit groove, a second fixed shaft, a limit block and a spring, the limit groove is evenly opened along the inner circumference of the friction sleeve, the limit groove is a triangular groove, and half of the limit groove is opened on the outside of the first fixed shaft, the second fixed shaft is installed at the top of the limit groove on one side of the friction sleeve, and one end of the limit block is rotatably installed on the second fixed shaft, the spring is fixed on the top of the end of the limit groove opposite to the first fixed shaft, and the other end of the spring is connected to the limit block.

[0008] Preferably, the side of the limit block opposite to the first fixed axis is an arc-shaped structure, and the curvature thereof matches the curvature of the first fixed axis.

[0009] Preferably, the first driving mechanism includes a fourth transmission gear, a fifth transmission gear and a friction wheel, the fourth transmission gear is installed on one side of the third transmission gear, the fifth transmission gear is installed on one side of the fourth transmission gear, and a friction wheel is coaxially installed on the top of the fifth transmission gear, the friction wheel is in contact with the second rotating column, and the heights of the fourth transmission gear and the fifth transmission gear correspond to the height of the third transmission gear.

[0010] Preferably, the third transmission gear, the fourth transmission gear, and the fifth transmission gear are meshed in sequence.

[0011] Preferably, the limiting mechanism includes a slide groove, a limiting column and a slider, the limiting column is fixed on the outside of both ends of the support plate, and the slider is fixed on the top of the support plate, the slide groove is opened inside both ends of the box body, and the position of the slide groove corresponds to the position of the limiting column.

[0012] Preferably, the cross-sectional dimensions of the slider match the cross-sectional dimensions of the slide groove, and the slider extends into the interior of the slide groove.

[0013] Preferably, the cleaning mechanism includes a sealing sleeve, a nozzle and a cleaning brush, the cleaning brushes are evenly arranged along the length direction of both sides of the bottom of the movable seat, the nozzles are evenly installed along the middle length direction of the bottom of the movable seat, and the sealing sleeve is installed on the outside of the connection between the movable seat and the reciprocating screw.

[0014] Preferably, the second driving mechanism includes a first rotating column, a second bevel gear, a first transmission gear, a first bevel gear, a second transmission gear and a fixed plate, the first rotating column being a cylinder with a plurality of racks installed circumferentially along the length direction, the first rotating column being installed on the top of the rotating shaft, the fixed plate being installed under the transmission shaft, the first transmission gear and the second transmission gear being meshingly installed on both sides of the fixed plate, and the first transmission gear being meshed with the first rotating column, the first bevel gear being coaxially installed on the top of the second transmission gear, the second bevel gear being fixed on one side of the transmission shaft, and the second bevel gear being meshed with the first bevel gear.

[0015] Preferably, an anti-drop cover is installed at the end of the transmission shaft opposite to the reciprocating screw.

[0016] The present invention provides a semiconductor material surface passivation pretreatment device, which has the following beneficial effects:

[0017] 1. The first driving mechanism installed on the top of the box body can be used to adjust the up and down movement of the soaking box, and the position of the soaking box can be limited by the one-way rotation mechanism, while ensuring the normal operation of the driving motor.

[0018] 2. The second driving mechanism installed between the rotating shaft and the first fixed shaft can drive the reciprocating screw to rotate, thereby driving the moving seat to reciprocate, completing the cleaning operation of the semiconductor material, streamlining the pretreatment steps of the semiconductor material, and improving the pretreatment efficiency of the semiconductor material. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of a pretreatment device for semiconductor material surface passivation proposed by the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of a first driving mechanism of a semiconductor material surface passivation pretreatment device proposed by the present invention;

[0021] Figure 3 This is a schematic cross-sectional structure diagram of a second rotating column of a semiconductor material surface passivation pretreatment device proposed by the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of an immersion box for a semiconductor material surface passivation pretreatment device proposed by the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of a second driving mechanism of a semiconductor material surface passivation pretreatment device proposed by the present invention;

[0024] Figure 6 A schematic diagram of the bottom structure of a movable base of a semiconductor material surface passivation pretreatment device proposed by the present invention;

[0025] Figure 7 This is a schematic diagram of the fixed axis structure of a pretreatment device for semiconductor material surface passivation proposed by the present invention;

[0026] Figure 8 This is a schematic diagram of the structure of a one-way rotating mechanism of a pretreatment device for semiconductor material surface passivation proposed by the present invention;

[0027] Fig. 9 for Figure 8 Enlarged structural diagram at A in the middle.

[0028] In the figure: box body 1, drive motor 2, water outlet 3, immersion box 4, limit column 5, slider 6, reciprocating screw 7, moving seat 8, slide rod 9, support plate 10, water inlet pipe 11, second bevel gear 12, first transmission gear 13, first bevel gear 14, cleaning brush 15, second transmission gear 16, fixed plate 17, slide groove 18, first rotating column 19, rotating shaft 20, third transmission gear 21, fourth transmission gear 22, fifth transmission gear 23, friction sleeve 24, receiving seat 25, fixed sleeve 26, second rotating column 27, spring 28, nozzle 29, first fixed shaft 30, limit groove 31, second fixed shaft 32, limit block 33, rotating seat 34, sealing sleeve 35, transmission shaft 36, friction wheel 37. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0030] Example 1

[0031] Reference Figure 1-9 , a pretreatment device for passivation of the surface of a semiconductor material, comprising a box body 1, a driving motor 2 is installed at the bottom of one side of the box body 1, a rotating shaft 20 is installed at the output end of the driving motor 2, the rotating shaft 20 extends into the box body 1, and a third transmission gear 21 is fixed on the outer side of the rotating shaft 20 located in the box body 1, a fixing sleeve 26 is installed at the bottom of the box body 1, the top of the fixing sleeve 26 corresponds to the position of the third transmission gear 21, a rotating seat 34 is installed on the inner thread of the fixing sleeve 26, a second rotating column 27 is arranged on the top of the rotating seat 34, the second rotating column 27 is a friction roller, first fixed shafts 30 are installed at both ends of the second rotating column 27, the first fixed shaft 30 at one end of the second rotating column 27 is fixedly connected to the rotating seat 34, a receiving seat 25 is installed on the top of the first fixed shaft 30 at the other end of the second rotating column 27, friction sleeves 24 are rotatably installed on the outer side of the first fixed shaft 30, a one-way rotation mechanism is installed between the friction sleeve 24 and the first fixed shaft 30, and the one-way rotation directions of the friction sleeves 24 at both ends of the second rotating column 27 are opposite.

[0032] The one-way rotation mechanism includes a limit groove 31, a second fixed shaft 32, a limit block 33 and a spring 28. The limit groove 31 is evenly arranged along the inner circumference of the friction sleeve 24. The limit groove 31 is a triangular groove, and half of the limit groove 31 is arranged outside the first fixed shaft 30. The second fixed shaft 32 is installed at the top of the limit groove 31 on one side of the friction sleeve 24, and one end of the limit block 33 is rotatably installed on the second fixed shaft 32. The spring 28 is fixed at the top of the end of the limit groove 31 opposite to the first fixed shaft 30, and the other end of the spring 28 is fixed to the limit block 33. The second rotating column 27 is connected to each other, and the side of the limit block 33 opposite to the first fixed shaft 30 is an arc structure, and its curvature matches the curvature of the first fixed shaft 30. When the second rotating column 27 moves to an appropriate position, the rotating sleeve 24 rotates, so that the rotating sleeve 24 rotates unidirectionally, thereby not affecting the position change of the second rotating column 27, improving the inventiveness of the device, a first driving mechanism is installed between the second rotating column 27 and the third transmission gear 21, and the first driving mechanism includes a fourth transmission gear 22, a fifth transmission gear 23 and a friction wheel 37. The fourth transmission gear 22 is installed on one side of the third transmission gear 21, and the fifth transmission gear 23 is installed on one side of the fourth transmission gear 22, and a friction wheel 37 is coaxially installed on the top of the fifth transmission gear 23, and the friction wheel 37 is in contact with the second rotating column 27. The heights of the fourth transmission gear 22 and the fifth transmission gear 23 correspond to the height of the third transmission gear 21. The third transmission gear 21, the fourth transmission gear 22, and the fifth transmission gear 23 are meshed in sequence, and the rotation of the second rotating column 27 can be driven by the rotation of the rotating shaft 20. , thereby driving the immersion box 4 to move up and down to ensure the normal use of the device. The immersion box 4 is rotatably installed on the top of the receiving seat 25. The immersion box 4 is a mesh box, and dense filter screens are installed on the four sides of the immersion box 4. Support plates 10 are installed on the tops of both ends of the immersion box 4. A limiting mechanism is installed between the immersion box 4 and the box body 1. A reciprocating screw 7 is installed in the middle of the support plate 10. A moving seat 8 is threadedly installed in the middle of the reciprocating screw 7. A water inlet pipe 11 is installed inside the moving seat 8. The water inlet pipe 11 is connected to an external water source, and a cleaning mechanism is installed on the moving seat 8.

[0033] The cleaning mechanism includes a sealing sleeve 35, a nozzle 29 and a cleaning brush 15. The cleaning brush 15 is evenly arranged along the length direction of both sides of the bottom of the moving seat 8. The nozzle 29 is evenly installed along the middle length direction of the bottom of the moving seat 8. The sealing sleeve 35 is installed on the outside of the connection between the moving seat 8 and the reciprocating screw 7, which is convenient for directly cleaning and rinsing the semiconductor material after the immersion is completed, reducing the pretreatment steps of the semiconductor material and improving the pretreatment efficiency of the semiconductor material. A transmission shaft 36 is fixed to the outside of one end of the reciprocating screw 7 on the same side as the drive motor 2. A second driving mechanism is installed between the transmission shaft 36 and the rotating shaft 20. The second driving mechanism includes a first rotating column 19, a second bevel gear 12, a first transmission gear 13, a first bevel gear 14, a second transmission gear 16 and a fixed plate 17. The first rotating column 19 is circumferential along the length direction. A cylinder with multiple racks is installed, and the first rotating column 19 is installed on the top of the rotating shaft 20. The height of the first rotating column 19 is greater than the maximum height of the immersion box 4. The fixed plate 17 is installed below the transmission shaft 36. The first transmission gear 13 and the second transmission gear 16 are meshed and installed on both sides of the fixed plate 17, and the first transmission gear 13 is meshed with the first rotating column 19. The first bevel gear 14 is coaxially installed on the top of the second transmission gear 16, and the second bevel gear 12 is fixed on one side of the transmission shaft 36. An anti-drop cover is installed at the end of the transmission shaft 36 opposite to the reciprocating screw 7, and the second bevel gear 12 is meshed with the first bevel gear 14. The rotation of the rotating shaft 20 can be used to indirectly drive the rotation of the reciprocating screw 7, so that the moving seat 8 can move back and forth above the immersion box 4, thereby improving the cleaning efficiency of the semiconductor material.

[0034] Working process: the operator controls the driving motor 2 to rotate forward to drive the rotating shaft 20 to rotate, drives the fourth transmission gear 22 to rotate through the third transmission gear 21 installed on the rotating shaft 20, drives the fifth transmission gear 23 to rotate through the fourth transmission gear 22, and drives the friction wheel 27 to rotate through the rotation of the fifth transmission gear 23. The second rotating column 27 is driven to rotate through the friction of the rotation of the friction wheel 27, and at the same time drives the rotating seat 34 to rotate inside the fixed sleeve 26, thereby driving the position of the second rotating column 27 to move up. When the friction sleeve 24 installed at the bottom of the second rotating column 27 is connected with the friction wheel 27, the rotating sleeve 24 and the limiting groove 31 opened inside the first fixed shaft 30 cannot prevent the rotation of the limiting block 33, and the limiting block 33 rotates forward along the circumference of the first fixed shaft 30. The rotating sleeve 24 cannot drive the first fixed shaft 30 to rotate, and the two rotate relative to each other. The rotating seat 34 stops moving up, thereby the second rotating column 27 stops moving up, and the immersion box 4 stops moving up. At this time, the position of the immersion box 4 rises to The highest point is separated from the inside of the box body 1, which is convenient for completing the placement and cleaning operations of the semiconductor materials. The operator controls the driving motor to reverse. At this time, the third transmission gear 21 drives the fourth transmission gear 22 to rotate, and the fourth transmission gear 22 drives the fifth transmission gear 23 to rotate. The reversal of the fifth transmission gear drives the friction wheel 37 to reverse, thereby causing the friction sleeve 24 to reverse. At this time, when the limit block 33 moves inside the limit groove 31, the end of the limit block 33 connected to the spring 28 is at the bottom of the limit groove 31 under the push of the spring 28, and the two are fixed, so that the friction sleeve 24 and the first fixed shaft 30 rotate synchronously, and the first fixed shaft 30 drives the rotating seat 34 to reverse, thereby driving the second rotating column 27 to move downward. When the friction sleeve 24 installed on the top of the second rotating column 27 is connected to the friction wheel 37, the limit block 33 inside the rotating sleeve 24 rotates normally along the circumference of the first fixed shaft 30, and the relative rotation between the rotating sleeve 24 and the first fixed shaft 30 is restored, and the rotating seat 34 stops moving downward.

[0035] Regardless of whether the driving motor 2 rotates forward or reverse, the rotation of the rotating shaft 20 drives the first rotating column 19 to rotate, the first rotating column 19 drives the first transmission gear 13 to rotate, the first transmission gear 13 drives the second transmission gear 16 to rotate, the rotation of the second transmission gear 16 drives the coaxially installed first bevel gear 14 to rotate, the first bevel gear 14 drives the second bevel gear 12 to rotate, thereby driving the transmission shaft 36 to rotate, and the reciprocating screw 7 is driven to rotate through the transmission shaft 36. The reciprocating screw 7 can drive the moving seat 8 to move back and forth inside the immersion box 4, thereby completing the cleaning operation of the semiconductor material through the cleaning brush 15 and the nozzle 29 installed at the bottom of the moving seat 8.

[0036] Example 2

[0037] Reference Figure 1-2As another preferred embodiment of the present invention, the difference from Embodiment 1 is that the limiting mechanism includes a slide groove 18, a limiting column 5 and a slider 6. The limiting column 5 is fixed to the outer sides of the two ends of the support plate 10, and the slider 6 is fixed to the top of the support plate 10. The slide groove 18 is opened inside the two ends of the box body 1, and the position of the slide groove 18 corresponds to the position of the limiting column 5. The cross-sectional size of the slider 6 matches the cross-sectional size of the slide groove 18, and the slider 6 extends into the slide groove 18. The length of the slide groove 18 is greater than the sum of the lengths of the fixing sleeve 26 and the second rotating column 27, which ensures that the immersion box 4 can move up and down smoothly inside the box body 1, prevents the immersion box 4 from rotating, and improves the overall operation stability of the device and the normal operation of the device.

[0038] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor material surface passivation pretreatment device, comprising a housing (1), characterized in that: A driving motor (2) is installed at the bottom of one side of the housing (1), and a rotating shaft (20) is installed at the output end of the driving motor (2), the rotating shaft (20) extends into the interior of the housing (1), and a third transmission gear (21) is fixed on the outer side of a section of the rotating shaft (20) located inside the housing (1), a fixing sleeve (26) is installed at the bottom of the housing (1), the top of the fixing sleeve (26) corresponds to the position of the third transmission gear (21), a rotating seat (34) is installed in the internal thread of the fixing sleeve (26), a second rotating column (27) is arranged on the top of the rotating seat (34), and first fixed shafts (30) are installed at both ends of the second rotating column (27), the first fixed shaft (30) at one end of the second rotating column (27) is fixedly connected to the rotating seat (34), a receiving seat (25) is installed on the top of the first fixed shaft (30) at the other end of the second rotating column (27), and friction bearings are rotatably installed on the outer side of the first fixed shaft (30). A sleeve (24) is provided, a one-way rotation mechanism is installed between the friction sleeve (24) and the first fixed shaft (30), the one-way rotation directions of the friction sleeve (24) at both ends of the second rotating column (27) are opposite, a first driving mechanism is installed between the second rotating column (27) and the third transmission gear (21), a soaking box (4) is rotatably installed on the top of the receiving seat (25), support plates (10) are installed on the tops of both ends of the soaking box (4), and the soaking box (4) and the A limiting mechanism is installed between the box bodies (1), a reciprocating screw (7) is installed in the middle of the support plate (10), a moving seat (8) is threadedly installed in the middle of the reciprocating screw (7), a water inlet pipe (11) is installed inside the moving seat (8), and a cleaning mechanism is installed on the moving seat (8), a transmission shaft (36) is fixed to the outer side of one end of the reciprocating screw (7) on the same side as the drive motor (2), and a second driving mechanism is installed between the transmission shaft (36) and the rotating shaft (20); The one-way rotation mechanism comprises a limit groove (31), a second fixed shaft (32), a limit block (33) and a spring (28); the limit groove (31) is evenly arranged along the inner circumference of the friction sleeve (24); the limit groove (31) is a triangular groove, and half of the limit groove (31) is arranged outside the first fixed shaft (30); the second fixed shaft (32) is mounted on the top of the limit groove (31) on one side of the friction sleeve (24); one end of the limit block (33) is rotatably mounted on the second fixed shaft (32); the spring (28) is fixed on the top of one end of the limit groove (31) opposite to the first fixed shaft (30); and the other end of the spring (28) is connected to the limit block (33).

2. A semiconductor material surface passivation pretreatment device according to claim 1, characterized in that: The side of the limit block (33) opposite to the first fixed shaft (30) is an arc-shaped structure, and the curvature thereof matches the curvature of the first fixed shaft (30).

3. A semiconductor material surface passivation pretreatment device according to claim 1, characterized in that: The first driving mechanism comprises a fourth transmission gear (22), a fifth transmission gear (23) and a friction wheel (37); the fourth transmission gear (22) is mounted on one side of the third transmission gear (21); the fifth transmission gear (23) is mounted on one side of the fourth transmission gear (22); a friction wheel (37) is coaxially mounted on the top of the fifth transmission gear (23); the friction wheel (37) is in contact with the second rotating column (27); and the heights of the fourth transmission gear (22) and the fifth transmission gear (23) correspond to the height of the third transmission gear (21).

4. A semiconductor material surface passivation pretreatment device according to claim 3, characterized in that: The third transmission gear (21), the fourth transmission gear (22), and the fifth transmission gear (23) are meshed in sequence.

5. A semiconductor material surface passivation pretreatment device according to claim 1, characterized in that: The limiting mechanism comprises a slide groove (18), a limiting column (5) and a sliding block (6); the limiting column (5) is fixed to the outside of both ends of the support plate (10), and the sliding block (6) is fixed to the top of the support plate (10); the slide groove (18) is opened inside both ends of the box body (1), and the position of the slide groove (18) corresponds to the position of the limiting column (5).

6. A semiconductor material surface passivation pretreatment device according to claim 5, characterized in that: The cross-sectional dimensions of the slider (6) match the cross-sectional dimensions of the slide groove (18), and the slider (6) extends into the interior of the slide groove (18).

7. A semiconductor material surface passivation pretreatment device according to claim 1, characterized in that: The cleaning mechanism comprises a sealing sleeve (35), a nozzle (29) and a cleaning brush (15); the cleaning brush (15) is evenly arranged along the length direction of both sides of the bottom of the movable seat (8); the nozzle (29) is evenly installed along the length direction of the middle of the bottom of the movable seat (8); and the sealing sleeve (35) is installed on the outer side of the connection between the movable seat (8) and the reciprocating screw (7).

8. A semiconductor material surface passivation pretreatment device according to claim 1, characterized in that: The second driving mechanism comprises a first rotating column (19), a second bevel gear (12), a first transmission gear (13), a first bevel gear (14), a second transmission gear (16) and a fixed plate (17); the first rotating column (19) is a cylinder with a plurality of racks installed along the length direction of the circumference; the first rotating column (19) is installed on the top of the rotating shaft (20); the fixed plate (17) is installed below the transmission shaft (36); the first transmission gear (13) and the second transmission gear (16) are meshedly installed on both sides of the fixed plate (17); the first transmission gear (13) is meshed with the first rotating column (19); the first bevel gear (14) is coaxially installed on the top of the second transmission gear (16); the second bevel gear (12) is fixed on one side of the transmission shaft (36); and the second bevel gear (12) is meshed with the first bevel gear (14).

9. A semiconductor material surface passivation pretreatment device according to claim 1, characterized in that: An anti-drop cover is installed at one end of the transmission shaft (36) opposite to the reciprocating screw rod (7).

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