Display device

Abstract

A display device is provided. The display device includes: a substrate; a display layer disposed on the substrate; and a thin film encapsulation layer covering the display layer. The display layer includes a plurality of emission parts and a non-emission part around each of the plurality of emission parts. The thin film encapsulation layer includes a first organic film, a second organic film, and a first inorganic film, the first organic film covering the emission part, the second organic film covering the non-emission part and being spaced apart from the first organic film, and the first inorganic film is interposed between the first organic film and the second organic film.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0062051 filed on May 27, 2019, in the Korean Intellectual Property Office, the contents of which are incorporated herein in their entirety by reference. Technical Field

[0002] One or more embodiments relate to a display device and a method of manufacturing the display device. Background Art

[0003] Display devices such as organic light emitting display devices may be flexible or bendable and manufactured to have a foldable structure for portability.

[0004] Display devices generally include a thin film encapsulation layer to prevent external penetration of moisture, oxygen, etc. Generally, the thin film encapsulation layer has a stacked structure of at least one inorganic film and at least one organic film. The inorganic film mainly prevents the penetration of moisture and oxygen, and the organic film mainly relieves stress on the inorganic film and covers possible fine particles on the inorganic film. Summary of the invention

[0005] When a display device is used while being continuously folded and unfolded, cracks may be generated due to repeated stress applied to the folded portion, and when the cracks gradually spread, the product may be severely damaged and cannot operate normally. Specifically, cracks often start in the inorganic film of the thin film encapsulation layer, and therefore, a solution to the above problem is desired.

[0006] One or more embodiments include a display device and a method of manufacturing the display device, which can prevent occurrence and spread of cracks in a thin film encapsulation layer.

[0007] According to one or more embodiments, a display device includes: a substrate; a display layer disposed on the substrate; and a thin film encapsulation layer covering the display layer. The display layer includes a plurality of emission parts and a non-emission part around each of the plurality of emission parts. The thin film encapsulation layer includes: a first organic film covering the plurality of emission parts; a second organic film covering the non-emission part and spaced apart from the first organic film; and a first inorganic film interposed between the first organic film and the second organic film.

[0008] The first organic film, the second organic film, and the first inorganic film may be on different layers from each other.

[0009] One of the first organic film and the second organic film may be an inner organic film disposed closer to the display layer than the other of the first organic film and the second organic film and covered by the first inorganic film, and the other of the first organic film and the second organic film may be an outer organic film disposed farther from the display layer. The first inorganic film may include a wavy pattern in which a region on the inner organic film is convex and a region not on the inner organic film is concave due to the presence and absence of the inner organic film.

[0010] The first organic film may be an inner organic film, and the second organic film may be an outer organic film.

[0011] The second organic film may be an inner organic film, and the first organic film may be an outer organic film.

[0012] The outer organic film may be separated into a plurality of island-shaped outer organic films along the wavy pattern, or may be integrally connected as a single layer across the wavy pattern.

[0013] The thin film encapsulation layer may further include a second inorganic film disposed as an outermost layer on the first organic film, the second organic film, and the first inorganic film. The thin film encapsulation layer may further include a region where the first inorganic film and the second inorganic film are in direct contact with each other.

[0014] The thin film encapsulation layer may further include a gas barrier film in direct contact with the display layer.

[0015] The gas barrier film may include one of an organic film and an inorganic film. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic plan view of a display device according to an embodiment.

[0017] Figure 2A and Figure 2B yes Figure 1 A cross-sectional view of a folded state of the display device shown in FIG.

[0018] Figure 3A and Figure 3B They are Figure 1 A plan view and a cross-sectional view of the internal structure of a pixel of a display device shown in FIG.

[0019] Figure 4A yes Figure 3B A cross-sectional view of the detailed structure of the thin film encapsulation layer is shown in FIG.

[0020] Figure 4B yes Figure 4A 0 is a plan view of the arrangement of organic films in the thin film encapsulation layer shown in FIG.

[0021] Figure 4C yes Figure 4BA plan view of a modified structure of the organic film arrangement shown in FIG.

[0022] FIG. 5A to FIG. 5E The manufacturing sequence is shown in Figure 4A A cross-sectional view of the process of thin film encapsulation layer shown in FIG.

[0023] Fig. 6A is a cross-sectional view of a thin film encapsulation layer according to another embodiment.

[0024] Figure 6B yes Fig. 6A A plan view of an organic film in a thin film encapsulation layer is shown in FIG.

[0025] Figure 6C yes Figure 6B A plan view of a modified structure of the organic film arrangement shown in FIG. DETAILED DESCRIPTION

[0026] Now will refer to exemplary embodiments in detail, examples of which are shown in the accompanying drawings, wherein like reference numerals may indicate like elements throughout. In this regard, exemplary embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein.

[0027] In the drawings, components may be exaggerated, omitted, or schematically illustrated for convenience or clarity of description, and the size of each component may not utterly reflect the actual size.

[0028] It will be understood that when a component is referred to as being “on” or “under” another component, it can be directly or indirectly on the other component.

[0029] Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals may refer to like elements throughout and repeated description thereof will be omitted.

[0030] Figure 1 is a plan view of a display panel 100 of a display device.

[0031] According to an embodiment, a display device includes a flexible bendable display panel 100. The display panel 100 has a structure in which a display layer 120 including a plurality of pixels Px displaying an image and a thin film encapsulation layer 130 covering and protecting the display layer 120 are stacked on a general flexible substrate 110, and because the flexible substrate 110 is used instead of a hard glass substrate, the display panel 100 can be freely folded and unfolded as long as the flexibility of the display panel 100 allows. Therefore, the folded state of the display panel 100 includes folding the display panel 100 outward so that the display layer 120 is as shown in FIG. Figure 2AAs shown in FIG. 1 , the display panel 100 is folded on the outside, or the display panel 100 is folded inwardly so that the display layer 120 is as shown in FIG. Figure 2B In addition, the display panel 100 may be supported by the housing to be folded and unfolded.

[0032] However, whenever such folding and unfolding are performed, the folded portion of the display panel 100 that is repeatedly folded and unfolded is subjected to compressive stress and tensile stress. Figure 2A or Figure 2B In the folded state shown in , compressive stress is applied to the layer on the inner surface of the folded portion, and tensile stress is applied to the layer on the outer surface of the folded portion. In this way, when stresses in different directions are repeatedly applied, cracks may occur and spread in the stressed area. Specifically, as described above, cracks often occur in Figure 4A The thin film encapsulation layer 130 shown in FIG. 1 starts with the first inorganic film 133 and the second inorganic film 134 .

[0033] According to the embodiment, to solve this phenomenon, FIG. 3A to FIG. 4B A thin film encapsulation layer 130 is formed as shown in FIG. Figure 3B is a cross-sectional view of the thin film encapsulation layer 130 showing the structure of the pixel Px of the display layer 120 . Figure 4A and Figure 4B A detailed structure of the thin film encapsulation layer 130 is shown, but the structure of the pixel Px is schematically shown.

[0034] According to the embodiment, reference will be made to Figure 3A and Figure 3B The structure of the pixel Px of the display layer 120 covered by the thin film encapsulation layer 130 is described. Figure 3A is the plan view of pixel Px, and Figure 3B is along Figure 3A A cross-sectional view taken along line AA' and line BB'. Figure 3A The structures of the thin film transistors T1 to T7 and the capacitor Cst in the pixel Px are shown. Figure 3B An emission portion 122 and a thin film encapsulation layer 130 are shown above the thin film transistors T1 to T7 and the capacitor Cst.

[0035] Reference Figure 3B According to an embodiment, each pixel Px includes an emission portion 122 in which light displaying an image is emitted and a non-emission portion 121 surrounding each emission portion 122 .

[0036] According to an embodiment, the substrate 110 includes a flexible material that is bent and curved, and is foldable or rollable. The flexible material used to form the substrate 110 may be ultra-thin glass, metal, or plastic. When the substrate 110 includes plastic, the substrate 110 may include polyimide (PI). In another embodiment, the substrate 110 may include different types of plastic.

[0037] Now refer to Figure 3A and Figure 3B The internal structure of the pixel Px of the display layer 120 is described. According to the embodiment, the driving thin film transistor T1, the switching thin film transistor T2, the compensation thin film transistor T3, the first initialization thin film transistor T4, the operation control thin film transistor T5, the emission control thin film transistor T6 and the second initialization thin film transistor T7 are disposed on the semiconductor layer 1130. Figure 3B As shown in , semiconductor layers 1130 a , 1130 c , and 1130 f are disposed over a substrate 110 , and a buffer layer 2111 including an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride is disposed under the semiconductor layer 1130 .

[0038] According to an embodiment, some areas of the semiconductor layer 1130 correspond to the semiconductor layers of the driving thin film transistor T1, the switching thin film transistor T2, the compensation thin film transistor T3, the first initialization thin film transistor T4, the operation control thin film transistor T5, the emission control thin film transistor T6, and the second initialization thin film transistor T7. According to an embodiment, the semiconductor layers of the driving thin film transistor T1, the switching thin film transistor T2, the compensation thin film transistor T3, the first initialization thin film transistor T4, the operation control thin film transistor T5, the emission control thin film transistor T6, and the second initialization thin film transistor T7 are connected to each other and bent into various shapes. Figure 3B A driving semiconductor layer 1130 a of the driving thin film transistor T1 , a compensation semiconductor layer 1130 c of the compensation thin film transistor T3 , and an emission control semiconductor layer 1130 f of the emission control thin film transistor T6 corresponding to some regions of the semiconductor layer 1130 are shown.

[0039] According to an embodiment, the semiconductor layer 1130 includes a channel region and a source region and a drain region on each side of the channel region, wherein each source region and drain region respectively corresponds to a source electrode and a drain electrode of a corresponding thin film transistor. Hereinafter, for the convenience of description, the source region and the drain region will be referred to as a source electrode and a drain electrode, respectively.

[0040] According to an embodiment, the driving thin film transistor T1 includes a driving gate electrode G1 overlapping a driving channel region C1 and a driving source electrode S1 and a driving drain electrode D1 on each side of the driving channel region C1. The driving channel region C1 has a curved shape such as an omega shape and thus has a long channel length in a narrow space. The increase in the length of the driving channel region C1 increases the driving range of the gate voltage, and therefore, the grayscale of light emitted from the organic light emitting diode (OLED) can be more accurately controlled and the display quality can be improved.

[0041] According to an embodiment, the switching thin film transistor T2 includes a switching gate electrode G2 overlapping a switching channel region, and a switching source electrode S2 and a switching drain electrode D2 on each side of the switching channel region. The switching drain electrode D2 is connected to the driving source electrode S1.

[0042] According to an embodiment, the compensation thin film transistor T3 as a dual thin film transistor includes a compensation gate electrode G3 overlapping two compensation channel regions C3 and a compensation source electrode S3 and a compensation drain electrode D3 on each side of the compensation channel region C3. The compensation thin film transistor T3 is connected to the driving gate electrode G1 of the driving thin film transistor T1 via a node connection line 1174 described below.

[0043] According to an embodiment, the first initialization thin film transistor T4 as a double thin film transistor includes a first initialization gate electrode G4 overlapping two first initialization channel regions, and a first initialization source electrode S4 and a first initialization drain electrode D4 on each side of the first initialization channel region.

[0044] According to an embodiment, the operation control thin film transistor T5 includes an operation control gate electrode G5 overlapping an operation control channel region, and an operation control source electrode S5 and an operation control drain electrode D5 on each side of the operation control channel region. The operation control drain electrode D5 is connected to the driving source electrode S1.

[0045] According to an embodiment, the emission control thin film transistor T6 includes an emission control gate electrode G6 overlapping the emission control channel region and an emission control source electrode S6 and an emission control drain electrode D6 on each side of the emission control channel region. The emission control source electrode S6 is connected to the driving drain electrode D1.

[0046] According to an embodiment, the second initialization thin film transistor T7 includes a second initialization gate electrode G7 overlapping the second initialization channel region, and a second initialization source electrode S7 and a second initialization drain electrode D7 on each side of the second initialization channel region.

[0047] According to an embodiment, the above thin film transistors are connected to the signal lines SWL, SIL, EL, and DL, the initialization voltage line VL, and the driving voltage line PL.

[0048] Now refer to Figure 3B According to an embodiment, a gate insulating layer 2141 is disposed on the semiconductor layer 1130, and the scan line SWL, the previous scan line SIL, the emission control line EL, and the driving gate electrode G1 are disposed on the gate insulating layer 2141. The gate insulating layer 2141 includes an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride. The scan line SWL, the previous scan line SIL, the emission control line EL, and the driving gate electrode G1 include a metal such as molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or an alloy thereof.

[0049] Return to reference Figure 3A According to an embodiment, the scan line SWL extends along the x direction. Some regions of the scan line SWL correspond to the switch gate electrode G2 and the compensation gate electrode G3. For example, regions of the scan line SWL overlapping the channel regions of the switch thin film transistor T2 and the compensation thin film transistor T3 are used as the switch gate electrode G2 and the compensation gate electrode G3, respectively.

[0050] According to an embodiment, the previous scan line SIL extends along the x direction, and some regions of the previous scan line SIL correspond to the first initialization gate electrode G4 and the second initialization gate electrode G7, respectively. For example, regions of the previous scan line SIL overlapping the channel regions of the first initialization thin film transistor T4 and the second initialization thin film transistor T7 are used as the first initialization gate electrode G4 and the second initialization gate electrode G7, respectively.

[0051] According to an embodiment, the emission control line EL extends in the x direction. Some regions of the emission control line EL correspond to the operation control gate electrode G5 and the emission control gate electrode G6, respectively. For example, regions of the emission control line EL overlapping the channel regions of the operation control thin film transistor T5 and the emission control thin film transistor T6 are used as the operation control gate electrode G5 and the emission control gate electrode G6, respectively.

[0052] According to an embodiment, the driving gate electrode G1 as an island type electrode is connected to the compensation thin film transistor T3 via the node connection line 1174 .

[0053] According to an embodiment, the initialization voltage line VL and the electrode voltage line HL are arranged on the scanning line SWL, the previous scanning line SIL, the emission control line EL and the electrode voltage line HL. Figure 3B 2. The first interlayer insulating layer 2143 is shown above the driving gate electrode G1. The first interlayer insulating layer 2143 includes an inorganic material.

[0054] According to an embodiment, the initialization voltage line VL extends in the x direction and is connected to the first initialization thin film transistor T4 and the second initialization thin film transistor T7 via the initialization connection line 1173 .

[0055] According to an embodiment, the initialization voltage line VL is disposed on the first interlayer insulating layer 2143 , and in some embodiments, on the planarization insulating layer 2180 and includes the same material as the pixel electrode 210 .

[0056] like Figure 3A As shown in , according to an embodiment, the electrode voltage line HL extends in the x direction and crosses the data line DL and the driving voltage line PL. A portion of the electrode voltage line HL covers at least a portion of the driving gate electrode G1 and forms a storage capacitor Cst together with the driving gate electrode G1. For example, the driving gate electrode G1 is a first storage capacitor plate Cst1 of the storage capacitor Cst, and a portion of the electrode voltage line HL is a second storage capacitor plate Cst2 of the storage capacitor Cst.

[0057] According to an embodiment, the second storage capacitor plate Cst2 is electrically connected to the driving voltage line PL. In this regard, Figure 3A The electrode voltage line HL is shown connected to the driving voltage line PL via the contact hole 1158, and the driving voltage line PL is disposed on the electrode voltage line HL. The electrode voltage line HL has the same voltage level as the driving voltage line PL, which is a constant voltage such as +5 V. The electrode voltage line HL is a lateral driving voltage line.

[0058] According to an embodiment, the driving voltage line PL extends in the y direction crossing the x direction, and the electrode voltage line HL electrically connected to the driving voltage line PL extends in the x direction, and accordingly, a plurality of driving voltage lines PL and a plurality of electrode voltage lines HL form a grid structure in the display area. Figure 3B , the z direction is a direction perpendicular to both the x direction and the y direction.

[0059] According to an embodiment, the data line DL, the driving voltage line PL, the initialization connection line 1173 and the node connection line 1174 are arranged above the electrode voltage line HL, and the second interlayer insulating layer 2150 is interposed between the data line DL, the driving voltage line PL, the initialization connection line 1173 and the node connection line 1174 and the electrode voltage line HL. The second interlayer insulating layer 2150 includes an inorganic material. The data line DL, the driving voltage line PL, the initialization connection line 1173 and the node connection line 1174 include aluminum (Al), copper (Cu) or titanium (Ti), etc., and may have a multilayer structure or a single-layer structure. According to an embodiment, the driving voltage line PL, the data line DL, etc. have a multilayer structure of Ti / Al / Ti.

[0060] According to an embodiment, the data line DL extends in the y direction and is connected to the switching source electrode S2 of the switching thin film transistor T2 via the contact hole 1154. A portion of the data line DL serves as the switching source electrode S2.

[0061] According to an embodiment, the driving voltage line PL extends in the y direction and is connected to the electrode voltage line HL via the contact hole 1158 as described above. In addition, the driving voltage line PL is connected to the operation control thin film transistor T5 via the contact hole 1155. The driving voltage line PL is connected to the operation control source electrode S5 via the contact hole 1155.

[0062] According to an embodiment, one end of the initialization connection line 1173 is connected to the first initialization thin film transistor T4 and the second initialization thin film transistor T7 via the contact hole 1152 , and the other end is connected to the initialization voltage line VL via the contact hole 1151 .

[0063] According to an embodiment, one end of the node connection line 1174 is connected to the compensation drain electrode D3 via the contact hole 1156 , and the other end is connected to the driving gate electrode G1 via the contact hole 1157 .

[0064] According to an embodiment, the pixel electrode 210 contacts the contact metal 1175 via the contact hole 1163, and the contact metal 1175 contacts the emission control drain electrode D6 via the contact hole 1153 penetrating the second interlayer insulating layer 2150, the first interlayer insulating layer 2143, and the gate insulating layer 2141. The emission control thin film transistor T6 is electrically connected to the pixel electrode 210 of the organic light emitting diode (OLED) through the contact metal 1175.

[0065] According to an embodiment, the planarization insulating layer 2180 includes an organic insulating material and is disposed on the data line DL, the driving voltage line PL, the initialization link line 1173 , and the node connection line 1174 , and the pixel electrode 210 is disposed on the planarization insulating layer 2180 .

[0066] Reference Figure 3B According to an embodiment, the edge of the pixel electrode 210 is covered by a pixel defining film 2190 disposed on the planarization insulating layer 2180, and the central area of ​​the pixel electrode 210 is exposed by an opening in the pixel defining film 2190. The pixel electrode 210 includes a reflective film containing at least one of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), and a mixture thereof. According to another embodiment, the pixel electrode 210 also includes a film on or under the above-mentioned reflective film, wherein the film includes ITO, IZO, ZnO or In 2 O 3 The intermediate layer 220 is disposed on the portion of the pixel electrode 210 exposed by the opening.

[0067] According to an embodiment, the intermediate layer 220 includes an emission layer 222 disposed above the exposed portion of the pixel electrode 210. The emission layer 222 includes a polymer or a low molecular weight organic material that emits light having a predetermined color. Figure 3B As shown in , the intermediate layer 220 may include a first functional layer 221 below the emission layer 222 and an optional second functional layer 223 on the emission layer 222 .

[0068] According to an embodiment, the first functional layer 221 may have a single-layer structure or a multi-layer structure. For example, when the first functional layer 221 includes a polymer material, the first functional layer 221 is a hole transport layer (HTL) having a single-layer structure and including poly-(3,4)-ethylene-dihydroxythiophene (PEDOT) or polyaniline (PANI). When the first functional layer 221 includes a low molecular weight material, the first functional layer 221 includes a hole injection layer (HIL) and the HTL.

[0069] According to an embodiment, the second functional layer 223 is optional. For example, when the first functional layer 221 and the emission layer 222 include a polymer material, the second functional layer 223 is formed to improve the characteristics of the organic light emitting diode (OLED). The second functional layer 223 may have a single layer structure or a multilayer structure. The second functional layer 223 includes an electron transport layer (ETL) or an electron injection layer (EIL).

[0070] According to an embodiment, the counter electrode 230 faces the pixel electrode 210, and the intermediate layer 220 is interposed between the counter electrode 230 and the pixel electrode 210. The counter electrode 230 includes a conductive material having a low work function. For example, the counter electrode 230 includes a (semi) transparent layer containing at least one of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca) and their alloys. Optionally, the counter electrode 230 also includes a (semi) transparent layer containing ITO, IZO, ZnO or In on the (semi) transparent layer. 2 O 3 layer.

[0071] According to an embodiment, the thin film encapsulation layer 130 covering and sealing the display layer 120 is disposed on the opposite electrode 230 .

[0072] Now refer to Figure 4A and Figure 4B The structure of the thin film encapsulation layer 130 is described in detail.

[0073] According to an embodiment, in order to describe the layers constituting the thin film encapsulation layer 130, Figure 4A and Figure 4B1 and 2 simply show the structure of the pixel Px of the display layer 120 under the thin film encapsulation layer 130. The region where emission occurs due to the above-mentioned organic emission layer is the emission portion 122, and the region where the pixel definition film 2190 surrounds the emission portion 122 is the non-emission portion 121.

[0074] According to an embodiment, the thin film encapsulation layer 130 prevents external oxygen and moisture from penetrating into the display layer 120 and includes a layer in which the first organic film 131 and the second organic film 132 and the first inorganic film 133 and the second inorganic film 134 are stacked. Generally, the first inorganic film 133 and the second inorganic film 134 mainly prevent the penetration of moisture and oxygen, and the first organic film 131 and the second organic film 132 mainly relieve stress on the inorganic film. In addition, a gas barrier film 135 including hexamethyldisiloxane (HMDSO) is formed on the inner side in contact with the display layer 120, forming a flat base layer of the thin film encapsulation layer 130 and preventing the gas generated in the display layer 120 from being released to the outside.

[0075] According to an embodiment, the first organic film 131 and the second organic film 132 include the first organic film 131 covering the top of the emission portion 122 and the second organic film 132 covering the top of the non-emission portion 121. That is, instead of each of the first organic film 131 and the second organic film 132 covering the entire top surface of the display layer 120, the first organic film 131 and the second organic film 132 are provided on different layers from each other and cover the emission portion 122 and the non-emission portion 121, respectively. Figure 4B The arrangement of the organic films of the thin film encapsulation layer on the same plane is shown. Although there are some overlapping areas on the same plane, the first organic film 131 and the second organic film 132 are separated into different layers from each other.

[0076] According to an embodiment, the material of the first organic film 131 and the second organic film 132 includes poly(methyl methacrylate) (PMMA), polycarbonate (PC), polystyrene (PS), acrylic resin, epoxy resin, polyimide, polyethylene, or the like.

[0077] In addition, according to the embodiment, the first inorganic film 133 prevents the penetration of moisture and oxygen, and is interposed between the first organic film 131 and the second organic film 132. Since the first inorganic film 133 is provided on the first organic film 131, the first inorganic film 133 has a waveform pattern that is bent along the steps of the region having the first organic film 131 and the region not having the first organic film 131. That is, a convex shape is formed on the emission portion 122 having the first organic film 131, and a concave shape is formed on the non-emission portion 121 not having the first organic film 131. In addition, the second organic film 132 fills the concave region.

[0078] According to the embodiment, when the first inorganic film 133 has a wave pattern as described above, the flexibility required for the folding display device can be significantly increased. That is, compared to the flat case, in the case of the wave, because the wave becomes smooth and narrow due to compression and elongation, respectively, it has the ability to absorb stress, and because the first organic film 131 and the second organic film 132 include a tough material filling the space between the waves, the folding stress can be easily absorbed.

[0079] According to an embodiment, the second inorganic film 134 is the outermost layer of the thin film encapsulation layer 130 and covers both the first inorganic film 133 and the second organic film 132. Therefore, the second inorganic film 134 is in direct contact with a portion of the first inorganic film 133 and the second organic film 132. As described above, when the first inorganic film 133 and the second inorganic film 134 are in direct contact with each other even partially, the adhesive strength increases, and therefore, even when the second inorganic film 134 is thin, an effective inorganic film barrier can be formed. Forming a thin second inorganic film 134 is an additional factor for increasing flexibility.

[0080] According to an embodiment, the first and second inorganic films 133 and 134 include one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride (SiON).

[0081] According to an embodiment, the FIG. 5A to FIG. 5E The thin film encapsulation layer 130 having the above structure is manufactured through the process shown in FIG.

[0082] First, according to the embodiment, Figure 5A As shown in FIG. 1 , a gas barrier film 135 including HMDSO is formed on the display layer 120. That is, the material gas HMDSO and the reaction gas N 2 or N 2 O forms a gas barrier film 135 by plasma enhanced chemical vapor deposition (PECVD), when N 2 When used as a reaction gas, HMDSO has the properties of an inorganic membrane. 2 When O is used as a reactive gas, HMDSO has the properties of an organic film. It does not matter whether the gas barrier film 135 is formed to have the properties of an organic film or an inorganic film, in both cases, less gas is generated on itself compared to a normal monomer and gas escape can be further blocked.

[0083] Next, according to the embodiment, Figure 5B As shown in FIG. 1 , the first organic film 131 is formed over the emission portion 122. However, the first organic film 131 is not formed over the non-emission portion 121.

[0084] In this state, according to an embodiment, when Figure 5C When the first inorganic film 133 is formed as shown in , the first inorganic film 133 has a wave pattern along the curve caused by the presence and absence of the first organic film 131 .

[0085] In addition, according to the embodiment, Figure 5D As shown in FIG. 1 , the second organic film 132 is formed over the non-emitting portion 121 corresponding to the groove of the wave pattern. Thus, the flexible thin film encapsulation layer 130 is manufactured in which the first organic film 131 and the second organic film 132 fill the space between the waves of the first inorganic film 133.

[0086] Finally, according to an embodiment, when Figure 5E When the second inorganic film 134 is provided as the outermost layer as shown in FIG. 1 , the thin film encapsulation layer 130 is completed.

[0087] According to an embodiment, when storing or transporting the display device manufactured as described above, it can be as follows Figure 2A or Figure 2B The foldable display device shown in FIG. Therefore, significant stress may be applied to the folded portion of the thin film encapsulation layer 130. However, the thin film encapsulation layer 130 has a flexible structure in which the first organic film 131 and the second organic film 132 fill the space between the waveforms of the first inorganic film 133. Therefore, cracks may not occur despite repeated folding, and even when cracks occur, the cracks may not spread. Therefore, the product will not be seriously damaged.

[0088] According to experiments, only the thin film encapsulation layer having a generally flat inorganic film had cracks after about 60,000 repetitive folding, whereas the thin film encapsulation layer having an inorganic film having a wavy pattern according to an embodiment had no cracks even after about 400,000 repetitive folding.

[0089] Therefore, despite repeated folding and unfolding, phenomena such as occurrence and spread of cracks in the thin film encapsulation layer 130 can be controlled, and thus, a highly stable display device can be implemented.

[0090] The previous embodiment shows a case where the second organic film 132 is separated from each other in an island shape along the wave pattern. However, when the second organic film 132 is formed by dropping ink droplets, backflow may be generated before hardening, and thus, the second organic films 132 may be connected to each other. That is, as Figure 4C As shown in FIG, the second organic films 132 are connected to each other across the bends of the wave pattern. The embodiments have the same structure in which the first organic film 131 and the second organic film 132 fill the space between the waves of the first inorganic film 133, and therefore, have the same crack preventing effect.

[0091] FIG. 6A to FIG. 6C The previous embodiment shows a case where the first organic film 131 covering the emission portion 122 is an inner organic film closer to the display layer 120, and the second organic film 132 covering the non-emission portion 121 is an outer organic film farther from the display layer 120. Fig. 6A and Figure 6B As shown in , such a configuration can be reversed.

[0092] That is, according to the embodiment, the second organic film 132 is first formed as an inner organic film, and the first organic film 131 is formed as an outer organic film on the first inorganic film 133. However, in the same manner, the first inorganic film 133 has a wavy pattern due to the curvature caused by the presence and absence of the second organic film 132 as the inner organic film, and the first organic film 131 and the second organic film 132 fill the space between the folds.

[0093] Therefore, even when the positions of the first organic film 131 and the second organic film 132 are reversed, the same effect can be obtained.

[0094] In addition, according to the embodiment, Figure 6B 1 shows a case where the first organic films 131 are separated from each other in an island shape along a wave pattern; however, when the first organic film 131 is formed by dropping ink droplets, backflow may occur before hardening, and thus, the first organic films 131 may be connected to each other. That is, Figure 6C As shown in , the first organic films 131 may be connected to each other across the bends of the wave pattern. This embodiment has the same structure in which the first organic film 131 and the second organic film 132 fill the space between the waves of the first inorganic film 133, and therefore, has the same crack prevention effect.

[0095] In summary, according to one or more embodiments, a display device and a method of manufacturing the display device can prevent a phenomenon in which cracks occur and spread in a thin film encapsulation layer even in a case of repeated folding and unfolding operations, and thus can improve product quality.

[0096] It should be understood that the exemplary embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more exemplary embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope as defined by the claims.

Claims

1. A display device, comprising: substrate; a display layer disposed on the substrate, wherein the display layer includes a plurality of emission portions and a non-emission portion located around each of the plurality of emission portions; and a thin film encapsulation layer, covering the display layer, The thin film encapsulation layer includes: a first organic film covering the plurality of emission parts; a second organic film covering the non-emission part and spaced apart from the first organic film; a first inorganic film interposed between the first organic film and the second organic film; and a second inorganic film disposed on the first organic film, the second organic film and the first inorganic film, and The thin film encapsulation layer further includes a region where the first inorganic film and the second inorganic film are in direct contact with each other.

2. The display device according to claim 1, in, The first organic film, the second organic film, and the first inorganic film are provided on different layers from each other.

3. The display device according to claim 2, in, one of the first organic film and the second organic film is an inner organic film disposed closer to the display layer than the other of the first organic film and the second organic film and covered by the first inorganic film, and the other of the first organic film and the second organic film is an outer organic film disposed farther from the display layer, The first inorganic film includes a wavy pattern due to the presence and absence of the inner organic film, in which a region located on the inner organic film is convex and a region not located on the inner organic film is concave.

4. The display device according to claim 3, in, The first organic film is the inner organic film, and the second organic film is the outer organic film.

5. The display device according to claim 3, in, The second organic film is the inner organic film, and the first organic film is the outer organic film.

6. The display device according to claim 3, in, The outer organic film is divided into a plurality of island-shaped outer organic films along the wave pattern.

7. The display device according to claim 3, in, The outer organic film is integrally connected as a single layer across the wavy pattern.

8. The display device according to claim 1, wherein: The thin film encapsulation layer further comprises: The gas barrier film is in direct contact with the display layer.

9. The display device according to claim 8, in, The gas barrier film includes one of an organic film and an inorganic film.

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