A solder joint performance evaluation method, device, electronic device and storage medium

Abstract

The present invention relates to a method, device, electronic device, and storage medium for evaluating solder joint performance. The method comprises: obtaining a two-dimensional finite element model of a solder joint area and the corresponding solder joint performance; constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area; and mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area. The technical solution provided by the present invention adopts a method of mapping the two-dimensional finite element model of the solder joint and the solder joint performance corresponding to the two-dimensional finite element model from two dimensions to three dimensions. Based on the solder joint performance corresponding to the two-dimensional finite element model, the solder joint performance corresponding to the three-dimensional finite element model can be correspondingly obtained, thereby greatly reducing the amount of calculation required for the solder joint and improving calculation efficiency.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of mechanical processing, and in particular to a solder joint performance evaluation method, device, electronic device and storage medium. Background Art

[0002] The detection of some characteristics of solder joints requires the establishment of a three-dimensional model of the solder joint. However, the three-dimensional mathematical and physical models of solder joints are very complex, which makes the calculation of the characteristics of solder joints very large and time-consuming. Summary of the Invention

[0003] In order to solve the above technical problems or at least partially solve the above technical problems, embodiments of the present invention provide a solder joint performance evaluation method, device, electronic device and storage medium.

[0004] This application provides a solder joint performance evaluation method, including:

[0005] Obtain a two-dimensional finite element model of the solder joint area and the corresponding solder joint performance;

[0006] Constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area;

[0007] The solder joint performance corresponding to the two-dimensional finite element model is mapped to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0008] Furthermore, the obtaining of the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance includes:

[0009] Construct a finite element model of the joint between two parts;

[0010] The finite element model of the connection between the two parts is subjected to two-dimensional welding and heat treatment to obtain a two-dimensional finite element model of the welding point area and corresponding welding point performance.

[0011] Furthermore, constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area includes:

[0012] The two-dimensional finite element model of the solder joint area is rotated about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area.

[0013] Furthermore, mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area includes:

[0014] For each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area are determined, and the solder joint performance corresponding to the two-dimensional node is determined as the solder joint performance corresponding to the multiple three-dimensional nodes.

[0015] Furthermore, the two-dimensional finite element model of the solder joint area is rotated about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area, including:

[0016] Rotating the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain an alternative model of the solder joint area;

[0017] Meshing the candidate model according to a preset three-dimensional mesh division unit to obtain a three-dimensional finite element model of the solder joint area;

[0018] The preset three-dimensional grid division unit is smaller than the two-dimensional grid division unit in the two-dimensional finite element model.

[0019] Furthermore, the three-dimensional nodes in the three-dimensional finite element model include: three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model, and three-dimensional nodes that have no corresponding relationship with the two-dimensional nodes;

[0020] Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area includes:

[0021] For each two-dimensional node in the two-dimensional finite element model of the solder joint area, determine a plurality of three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area, and determine the solder joint performance corresponding to the two-dimensional node as the solder joint performance corresponding to the plurality of three-dimensional nodes;

[0022] The weld performance of three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model of the weld area is interpolated to obtain the weld performance of three-dimensional nodes in the three-dimensional finite element model that have no corresponding relationship with the two-dimensional nodes.

[0023] Furthermore, the solder joint performance includes at least one of the following: mechanical properties and thermal properties,

[0024] The mechanical properties include at least one of the following: stress distribution results and deformation distribution results.

[0025] The present application also provides a solder joint performance evaluation device, comprising:

[0026] An acquisition module, used to obtain a two-dimensional finite element model of the solder joint area and corresponding solder joint performance;

[0027] A construction module, configured to construct a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area;

[0028] A mapping module is used to map the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0029] The present application also provides an electronic device, comprising a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other via the communication bus;

[0030] Memory for storing computer programs;

[0031] The processor is configured to implement any of the steps of the above-mentioned solder joint performance evaluation method when executing the program stored in the memory.

[0032] The present application also provides a storage medium, on which a solder joint performance evaluation method program is stored. When the solder joint performance evaluation method program is executed by a processor, the steps of any of the above-mentioned solder joint performance evaluation methods are implemented.

[0033] Compared with the closest existing technology, the embodiment of the present invention first obtains a two-dimensional finite element model of the weld in the weld area and the corresponding weld performance, then constructs a three-dimensional finite element model based on the two-dimensional finite element model, and then maps the weld performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model, and finally obtains the weld performance corresponding to the three-dimensional finite element model of the weld area. The technology provided by this application adopts a method of mapping the two-dimensional finite element model of the weld and the weld performance corresponding to the two-dimensional finite element model from two dimensions to three dimensions. Based on the weld performance corresponding to the two-dimensional finite element model, the weld performance corresponding to the three-dimensional finite element model can be correspondingly obtained, which greatly reduces the amount of calculation for the weld and improves computational efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0035] Figure 1 is a flow chart showing a method for evaluating solder joint performance according to an exemplary embodiment;

[0036] Figure 2 is a schematic diagram of a two-dimensional finite element model of a solder joint area according to an exemplary embodiment;

[0037] Figure 3 is a schematic diagram of a quarter symmetrical portion of a three-dimensional finite element model of a solder joint area according to an exemplary embodiment;

[0038] Figure 4 According to an exemplary embodiment Figure 3 Schematic diagram of a top view of a three-dimensional finite element model;

[0039] Figure 5 is a structural schematic diagram of a solder joint performance evaluation device according to an exemplary embodiment;

[0040] Figure 6 is a schematic structural diagram of an electronic device according to an exemplary embodiment;

[0041] 1-Welding point radius of the welding point area; 2-Center axis of the welding point area; 3-Boundary between the welding point area and the non-welding point area; 4-Upper plate to be welded; 5-Lower plate to be welded; 6-Center point of the welding point area; 7-Total thickness of the plate; 8-Plate area. DETAILED DESCRIPTION

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0043] Figure 1 FIG. 1 is a flow chart showing a method for evaluating solder joint performance according to an exemplary embodiment. Figure 1 As shown, the method is applied to calculate some properties of solder joints on a component, such as stress distribution, strain distribution, temperature distribution, etc. The solder joint performance evaluation method may include the following steps:

[0044] S101: Obtain a two-dimensional finite element model of the solder joint area and corresponding solder joint performance.

[0045] S102: Constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area.

[0046] S103: Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0047] The solder joint performance evaluation method provided in the present application first obtains a two-dimensional finite element model of the solder joint in the solder joint area and the corresponding solder joint performance, then constructs a three-dimensional finite element model based on the two-dimensional finite element model, and then maps the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model, so as to simply and quickly obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area, thereby greatly reducing the calculation amount of the solder joint and improving the calculation efficiency.

[0048] In step S101 , a two-dimensional finite element model of a solder joint area and corresponding solder joint performance are obtained.

[0049] In the disclosed embodiments, a finite element model of the joint of the plates to be welded is first constructed, and then two-dimensional welding and heat treatment are performed on the finite element model of the joint using finite element analysis software. The finite element model of the joint can be meshed using a preset meshing unit. In some embodiments of the present invention, a fine scale is used, and the meshing unit can be as fine as 0.05 mm (i.e., 50 μm).

[0050] In practical applications, after two-dimensional welding and heat treatment of the finite element model of the connection, the distribution of solder joint components can be calculated, and a two-dimensional finite element model of the solder joint area and the corresponding solder joint performance can be obtained. The solder joint performance includes at least one of the following: mechanical properties and thermal properties.

[0051] Among them, two-dimensional welding and heat treatment can adopt technical means commonly used by those skilled in the art, which will not be described in detail here.

[0052] like Figure 2 Figure 2 shows a schematic diagram of a two-dimensional finite element model of a solder joint area. 1 is the solder joint radius of the solder joint area. The solder joint radius 1 of the solder joint area is divided into multiple nodes i1, i2, ...im along the radial direction, where i represents the radial direction, m represents the number of nodes divided by the solder joint radius, and im represents the boundary point of the solder joint area along radial direction i. 2 is the central axis of the solder joint area. The central axis 2 of the solder joint area is divided into multiple solder joint centers k1, k2, ...kL along the axial direction k, where k represents the axial direction, L represents the number of nodes divided by the solder joint axis, and kL represents the boundary point of the solder joint area along the axial direction k. 3 is the boundary between the solder joint area and the non-solder joint area.

[0053] In practical applications, the component distribution of solder joints generally includes martensite, pearlite, bainite and ferrite.

[0054] The component distribution of the solder joint in the solder joint area is affected by the two-dimensional welding and heat treatment process of the solder joint, and is related to the temperature, welding speed, cooling speed, etc. The component distribution will affect the mechanical strength and performance of the solder joint, among which martensite has the greatest impact and ferrite has the least impact.

[0055] It is understandable that the finite element analysis software may be Sysweld software or other finite element analysis software.

[0056] In a possible embodiment of the present disclosure, obtaining a two-dimensional finite element model of the solder joint area and corresponding solder joint performance specifically includes:

[0057] Construct a finite element model of the joint between two parts;

[0058] The finite element model of the connection between the two parts is subjected to two-dimensional welding and heat treatment to obtain a two-dimensional finite element model of the welding point area and corresponding welding point performance.

[0059] It is understood that the two parts may refer to two independent components or two parts of a component that need to be welded together. For example, the two parts may be two plates to be welded together.

[0060] In step S102, a three-dimensional finite element model of the solder joint area is constructed based on the two-dimensional finite element model of the solder joint area.

[0061] In practical applications, Visual Viewer software can be used in conjunction with Python scripting to rotate and replicate the two-dimensional finite element model obtained in step S101 around the central axis 2 of the solder joint area. Multiple copies of the two-dimensional finite element model can be made to obtain a three-dimensional finite element model of the solder joint area. In practical applications, the rotational replication can be performed according to a preset rotation angle step size.

[0062] like Figure 3 Figure 1 shows a schematic diagram of a 1 / 4 symmetrical portion of a three-dimensional finite element model of the weld zone. Reference numeral 4 represents the upper plate to be welded, reference numeral 5 represents the lower plate to be welded, reference numeral 6 represents the center point of the weld zone, and reference numeral 7 represents the overall thickness of the plate.

[0063] Figure 3 In the embodiment, the overall thickness of the plate is 3 mm, the thickness of the upper plate to be welded is 1.5 mm, and the thickness of the lower plate to be welded is 1.5 mm.

[0064] Figure 4 As shown, Figure 3 Figure 8 shows a top view of a 3D finite element model. Reference numeral 8 denotes the plate area. The boundary of the cross-section of the weld zone (rotating counterclockwise around the central axis) is divided into multiple nodes j1, j2, …, jn, where n represents the number of nodes divided and is determined by the rotation angle step size.

[0065] In a possible implementation of the present disclosure, constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area specifically includes:

[0066] The two-dimensional finite element model of the solder joint area is rotated about the central axis 2 of the solder joint area to obtain a three-dimensional finite element model of the solder joint area.

[0067] In the embodiment of the present disclosure, the two-dimensional finite element model of the solder joint area is rotated 360 degrees (ie, one circle) about the central axis 2 of the solder joint area to obtain a three-dimensional finite element model.

[0068] In a possible embodiment of the present disclosure, rotating the two-dimensional finite element model of the solder joint area about the central axis 2 of the solder joint area to obtain a three-dimensional finite element model of the solder joint area specifically includes:

[0069] The two-dimensional finite element model of the solder joint area is rotated about the central axis 2 of the solder joint area to obtain an alternative model of the solder joint area; the alternative model is meshed according to a preset three-dimensional mesh division unit to obtain a three-dimensional finite element model of the solder joint area.

[0070] The preset three-dimensional grid division unit is smaller than the two-dimensional grid division unit in the two-dimensional finite element model.

[0071] In practical applications, the size of the mesh units in the 3D finite element model can be adjusted according to actual needs. Usually, the mesh units in the 3D finite element model are smaller than those in the 2D finite element model. Therefore, the 2D nodes in the 2D finite element model do not completely correspond to the 3D nodes in the 3D finite element model.

[0072] In step S103, the solder joint performance corresponding to the two-dimensional finite element model is mapped to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0073] In one possible embodiment of the present disclosure, when a three-dimensional finite element model is obtained by rotating a two-dimensional finite element model about the central axis of the weld area, the weld performance of the two-dimensional nodes in the two-dimensional finite element model can be directly mapped to the weld performance of the corresponding three-dimensional nodes in the three-dimensional finite element model.

[0074] Specifically, for each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area can be determined, and the solder joint performance corresponding to the two-dimensional node can be determined as the solder joint performance corresponding to the multiple three-dimensional nodes.

[0075] In practical applications, the node definitions in the three-dimensional finite element model are: m represents the number of nodes whose weld radius is cut, n represents the number of nodes whose weld circumference is cut in the three-dimensional finite element model, L represents the number of nodes whose weld axis is divided, and i, j, and k represent any point on the weld radius, weld circumference, and weld axis, respectively.

[0076] In the embodiment of the present application, the performance of the weld points in the two-dimensional finite element model is marked with the subscript 2D, and the performance of the weld points in the three-dimensional finite element model is marked with the subscript 3D.

[0077] Stress value σ 3D (i,j,k)=σ 2D (i,k)

[0078] Strain value ε 3D (i,j,k)=ε 2D (i,k)

[0079] Temperature value T 3D (i,j,k)=T 2D (i,k)

[0080] Among them, 0≤i≤m, 1≤j≤n, 0≤k≤L.

[0081] For a two-dimensional node (i, k) in a two-dimensional finite element model, there are n three-dimensional nodes corresponding to the two-dimensional node (i, k) in a three-dimensional finite element model.

[0082] In a possible embodiment of the present disclosure, when a three-dimensional finite element model is obtained by meshing an alternative model according to a preset three-dimensional mesh division unit, the three-dimensional nodes in the three-dimensional finite element model include: three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model, and three-dimensional nodes that have no corresponding relationship with the two-dimensional nodes.

[0083] For 3D nodes that have a corresponding relationship with 2D nodes, direct mapping can be used to determine solder joint performance; while for 3D nodes that do not have a corresponding relationship with 2D nodes, interpolation mapping can be used to determine solder joint performance.

[0084] Specifically, for each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area are determined, and the solder joint performance corresponding to the two-dimensional node is determined as the solder joint performance corresponding to the multiple three-dimensional nodes; based on the solder joint performance of the three-dimensional node corresponding to the two-dimensional node in the two-dimensional finite element model of the solder joint area, the solder joint performance of the three-dimensional node in the three-dimensional finite element model that has no corresponding relationship with the two-dimensional node is interpolated.

[0085] By combining the above direct mapping and interpolation mapping methods, the solder joint performance corresponding to the three-dimensional finite element model with a finer scale is obtained.

[0086] In a possible implementation manner of the present disclosure, the solder joint performance includes at least one of the following: mechanical properties and thermal properties.

[0087] In a possible implementation manner of the present disclosure, the mechanical characteristics include at least one of the following: a stress distribution result and a deformation distribution result.

[0088] In a possible implementation manner of the present disclosure, the thermal characteristics mainly refer to temperature distribution results.

[0089] Based on the same inventive concept as the above method, in another embodiment of the present disclosure, a solder joint calculation device is also disclosed, such as Figure 5 As shown, the solder joint calculation device includes: an acquisition module 101 , a construction module 102 , and a mapping module 103 .

[0090] The acquisition module 101 is configured to acquire a two-dimensional finite element model of a solder joint area and corresponding solder joint performance.

[0091] The construction module 102 is configured to construct a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area.

[0092] The mapping module 103 is configured to map the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0093] In another embodiment of the present disclosure, the acquisition module 101 includes a construction submodule and a determination submodule.

[0094] The construction submodule is configured to construct a finite element model of a connection between two parts;

[0095] The determination submodule is configured to perform two-dimensional welding and heat treatment on the finite element model of the connection between the two parts to obtain a two-dimensional finite element model of the weld area and corresponding weld performance.

[0096] In another embodiment of the present disclosure, the building module 102 includes a rotation submodule.

[0097] The rotation submodule is configured to rotate the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area.

[0098] In another embodiment of the present disclosure, the rotation submodule includes: a rotation unit and a grid division unit.

[0099] The rotation unit is configured to rotate the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain an alternative model of the solder joint area.

[0100] The mesh division unit is configured to perform mesh division on the candidate model according to a preset three-dimensional mesh division unit to obtain a three-dimensional finite element model of the solder joint area.

[0101] The preset three-dimensional grid division unit is smaller than the two-dimensional grid division unit in the two-dimensional finite element model.

[0102] In another embodiment of the present disclosure, the mapping module 103 is specifically configured to:

[0103] For each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area are determined, and the solder joint performance corresponding to the two-dimensional node is determined as the solder joint performance corresponding to the multiple three-dimensional nodes.

[0104] The three-dimensional nodes in the three-dimensional finite element model include: three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model, and three-dimensional nodes that have no corresponding relationship with the two-dimensional nodes.

[0105] In another embodiment of the present disclosure, the mapping module 103 includes: a corresponding submodule and a non-corresponding submodule.

[0106] The corresponding submodule is configured to determine, for each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area, and determine the solder joint performance corresponding to the two-dimensional node as the solder joint performance corresponding to the multiple three-dimensional nodes.

[0107] The non-corresponding submodule is configured to interpolate the weld performance of three-dimensional nodes in the three-dimensional finite element model that have no corresponding relationship with the two-dimensional nodes based on the weld performance of the three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model of the weld area.

[0108] In another embodiment of the present disclosure, an electronic device is provided. Figure 6 As shown, it includes a processor 501, a communication interface 502, a memory 503 and a communication bus 504, wherein the processor 501, the communication interface 502, and the memory 503 communicate with each other through the communication bus 504;

[0109] Memory 503, used for storing computer programs;

[0110] The processor 501 is configured to execute the program stored in the memory 503 by performing the following steps:

[0111] Obtain a two-dimensional finite element model of the solder joint area and the corresponding solder joint performance;

[0112] Constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area;

[0113] The solder joint performance corresponding to the two-dimensional finite element model is mapped to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

[0114] The communication bus 504 mentioned in the above electronic device can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus. The communication bus 504 can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 5 Only one thick line is used in the diagram, but this does not mean that there is only one bus or one type of bus.

[0115] The communication interface 502 is used for communication between the electronic device and other devices.

[0116] The memory 503 may include a random access memory (RAM) or a non-volatile memory, such as at least one disk storage. Alternatively, the memory may be at least one storage device located away from the processor.

[0117] The above-mentioned processor 501 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components.

[0118] In another embodiment of the present disclosure, a storage medium is provided, on which a solder joint performance evaluation method program is stored. When the solder joint performance evaluation method program is executed by a processor, the steps of any of the above-mentioned solder joint performance evaluation methods are implemented.

[0119] When implementing the embodiments of the present disclosure, reference may be made to the above embodiments, and the embodiments have corresponding technical effects.

[0120] It is understood that the embodiments described herein may be implemented using hardware, software, firmware, middleware, microcode, or a combination thereof. For hardware implementation, the processing unit may be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers, microprocessors, other electronic units for performing the functions described herein, or a combination thereof.

[0121] For software implementation, the technology described herein can be implemented by a unit that performs the functions described herein. The software code can be stored in a memory and executed by a processor. The memory can be implemented in the processor or outside the processor.

[0122] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0123] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0124] In the embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0125] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0126] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0127] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of the present invention, or the part that contributes to the prior art, or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present invention. The aforementioned storage media include various media that can store program code, such as USB flash drives, mobile hard drives, ROM, RAM, magnetic disks, or optical disks.

[0128] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0129] It should be noted that, in this document, relational terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0130] Through the description of the above implementation methods, those skilled in the art can clearly understand that the methods described in the various embodiments of the present invention can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of the present invention or the methods described in certain parts of the embodiments.

[0131] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for evaluating solder joint performance, characterized in that: include: Obtain a two-dimensional finite element model of the solder joint area and the corresponding solder joint performance; Constructing a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area; Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area; The obtaining of the two-dimensional finite element model of the solder joint area and the corresponding solder joint performance includes: Construct a finite element model of the joint between two parts; Performing two-dimensional welding and heat treatment on the finite element model of the connection between the two parts to obtain a two-dimensional finite element model of the weld area and corresponding weld performance; The constructing of a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area includes: Rotating the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area; Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area includes: For each two-dimensional node in the two-dimensional finite element model of the solder joint area, multiple three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area are determined, and the solder joint performance corresponding to the two-dimensional node is determined as the solder joint performance corresponding to the multiple three-dimensional nodes.

2. A solder joint performance evaluation method according to claim 1, characterized in that: The step of rotating the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain a three-dimensional finite element model of the solder joint area includes: Rotating the two-dimensional finite element model of the solder joint area about the central axis of the solder joint area to obtain an alternative model of the solder joint area; Meshing the candidate model according to a preset three-dimensional mesh division unit to obtain a three-dimensional finite element model of the solder joint area; The preset three-dimensional grid division unit is smaller than the two-dimensional grid division unit in the two-dimensional finite element model.

3. A solder joint performance evaluation method according to claim 2, characterized in that: The three-dimensional nodes in the three-dimensional finite element model include: three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model, and three-dimensional nodes that have no corresponding relationship with the two-dimensional nodes; Mapping the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area includes: For each two-dimensional node in the two-dimensional finite element model of the solder joint area, determine a plurality of three-dimensional nodes corresponding to the two-dimensional node in the three-dimensional finite element model of the solder joint area, and determine the solder joint performance corresponding to the two-dimensional node as the solder joint performance corresponding to the plurality of three-dimensional nodes; The weld performance of three-dimensional nodes corresponding to the two-dimensional nodes in the two-dimensional finite element model of the weld area is interpolated to obtain the weld performance of three-dimensional nodes in the three-dimensional finite element model that have no corresponding relationship with the two-dimensional nodes.

4. A solder joint performance evaluation method according to any one of claims 1 to 3, characterized in that: The solder joint performance includes at least one of the following: mechanical properties and thermal properties, and the mechanical properties include at least one of the following: stress distribution results and deformation distribution results.

5. A solder joint performance evaluation device, the device adopting the method according to any one of claims 1 to 3, characterized in that: include: An acquisition module, used to obtain a two-dimensional finite element model of the solder joint area and corresponding solder joint performance; A construction module, configured to construct a three-dimensional finite element model of the solder joint area based on the two-dimensional finite element model of the solder joint area; A mapping module is used to map the solder joint performance corresponding to the two-dimensional finite element model to the three-dimensional finite element model to obtain the solder joint performance corresponding to the three-dimensional finite element model of the solder joint area.

6. An electronic device, characterized in that: It includes a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other via the communication bus; Memory for storing computer programs; The processor is configured to implement the steps of the solder joint performance evaluation method according to any one of claims 1 to 3 when executing the program stored in the memory.

7. A storage medium, characterized in that: The storage medium stores a solder joint performance evaluation method program, which, when executed by a processor, implements the steps of the solder joint performance evaluation method according to any one of claims 1 to 3.

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