Integrated circuit chip heat dissipation structure

Abstract

The present invention discloses a heat dissipation structure for an integrated circuit chip, comprising a base and a substrate. The base is hollow, and one end is open to form a receiving groove. A first interface and a second interface connected to the receiving groove are respectively provided on the two opposite side walls of the base, the first interface is used to inject a cooling medium into the receiving groove, and the second interface is used to discharge the cooling medium in the receiving groove. The substrate is used to cover the opening of the base and to contact the integrated circuit chip. A plurality of microchannels are formed on one side of the substrate close to the receiving groove, and these microchannels are spaced apart along the flow direction of the cooling medium. Each microchannel includes a plurality of spaced apart microflow units, each microflow unit includes a cylindrical flow divider, each flow divider extends along the flow direction of the cooling medium to form a plate-shaped drainage portion, and these drainage portions are parallel to each other. In this way, the flow resistance and pressure fluctuation of the cooling medium can be reduced, and the heat dissipation effect can be improved.

Description

Technical Field

[0001] The invention belongs to the field of microelectronic technology, and in particular relates to a heat dissipation structure of an integrated circuit chip. Background Art

[0002] With the high integration of chips and the continuous improvement of processing and manufacturing technology, the number of transistors integrated on the chip has increased exponentially, which has increased the heat flow per unit volume and rapidly increased the chip temperature. The micro heat sink in the prior art pumps the coolant into the microchannel through a micropump, and the liquid flow takes away a large amount of heat. There are many factors that affect the heat dissipation capacity of the microchannel, such as the structure, layout, speed and pressure drop of the microchannel, the thermal wake effect, etc. These geometric factors are interrelated and affect the heat transfer performance and pressure drop of the micro heat exchanger.

[0003] Traditional micro heat exchangers set up heat exchange structures of different sizes in the channel, such as square, conical cylinder, triangle, diamond, elliptical hexagon, etc., to reduce the fluid boundary layer to improve the heat exchange performance, but it is often accompanied by an increase in pressure loss, causing eddy separation and pressure fluctuations. Therefore, micro heat exchangers need to obtain better enhanced heat transfer effects at a lower pressure cost. Summary of the invention

[0004] In view of this, it is necessary to provide an integrated circuit chip heat dissipation structure that can reduce the flow resistance and pressure fluctuation of the cooling medium and improve the heat dissipation effect.

[0005] The technical solution proposed by the present invention to achieve the above-mentioned purpose is as follows:

[0006] An integrated circuit chip heat dissipation structure is used to dissipate heat from an integrated circuit chip, the integrated circuit chip heat dissipation structure comprising:

[0007] A base, wherein the base is hollow and one end is open to form a receiving groove, and two opposite side walls of the base are respectively provided with a first interface and a second interface connected to the receiving groove, the first interface is used to inject a cooling medium into the receiving groove, and the second interface is used to discharge the cooling medium injected into the receiving groove;

[0008] A substrate, the substrate is used to cover the opening of the base and to contact the integrated circuit chip, the substrate is formed with a plurality of microchannels on one side close to the receiving groove, the plurality of microchannels are distributed at intervals along the flow direction of the cooling medium, so as to conduct the heat emitted by the integrated circuit chip to the cooling medium;

[0009] Each microchannel includes a plurality of microflow units, which are spaced apart and each microflow unit includes a flow divider, which is cylindrical. Each flow divider extends along the flow direction of the cooling medium to form a drainage portion, which is plate-shaped and parallel to each other.

[0010] Furthermore, a plurality of micro-flow units in each micro-channel are distributed at equal intervals with gaps of a first width along a direction perpendicular to the extension of the guide portion.

[0011] Furthermore, the plurality of microchannels are equally spaced and staggered so that each microflow unit corresponds to a gap of the first width between microflow units in adjacent microchannels.

[0012] Furthermore, the first width is in the range of 50 um to 300 um.

[0013] Furthermore, the thickness of the drainage portion is smaller than the cross-sectional diameter of the flow divider.

[0014] Furthermore, the ratio of the length of the drainage portion to the cross-sectional diameter of the flow divider is greater than 9.

[0015] Further, the length of the drainage portion is in the range of 90um to 360um, the thickness of the drainage portion is in the range of 20um to 80um, and the cross-sectional diameter of the flow divider is in the range of 40um to 160um.

[0016] Furthermore, the heights of the plurality of micro-flow units are less than or equal to the depth of the receiving groove.

[0017] Furthermore, the heights of the plurality of micro flow-around units are in the range of 50 um to 500 um.

[0018] Furthermore, the cooling medium injected into the receiving groove by the first interface may be any one of liquid, gas and a gas-liquid mixture.

[0019] Beneficial effects of the present invention:

[0020] (1) By introducing a cylindrical flow divider and drainage structure, the turbulence of the fluid is enhanced, the heat exchange capacity between the channel wall and the fluid in the microchannel is improved, and the fluid heat exchange capacity is improved; at the same time, the auxiliary heat dissipation capacity between adjacent microchannels is enhanced, thereby greatly improving the heat dissipation performance of the microchannel heat dissipation structure.

[0021] (2) By introducing a cylindrical flow divider and drainage structure, the shedding of vortices is effectively improved, the energy dissipation in the wake area is weakened, the drag coefficient of the flow is gradually reduced, and the pressure fluctuation basically disappears, achieving better enhanced heat transfer effect at a lower pressure cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of an exploded view of a preferred embodiment of the integrated circuit chip heat dissipation structure of the present invention.

[0023] Figure 2 yes Figure 1 A schematic structural diagram of a preferred embodiment of the middle substrate.

[0024] Figure 3 yes Figure 1 A cross-sectional view of a preferred embodiment of the middle substrate.

[0025] Figure 4 yes Figure 1 Another cross-sectional view of a preferred embodiment of the middle substrate.

[0026] Main component symbols

[0027] Integrated circuit chip heat dissipation structure 100

[0028] Base 10

[0029] Storage tank 12

[0030] The first interface 14

[0031] Second interface 16

[0032] Substrate 20

[0033] Microchannel 22

[0034] Micro flow unit 24

[0035] Divider 242

[0036] Drainage section 244

[0037] Integrated circuit chip 200

[0038] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0040] Please refer to Figure 1 The present invention provides an integrated circuit chip heat dissipation structure 100. The integrated circuit chip heat dissipation structure 100 is used to dissipate heat from an integrated circuit chip 200. In this embodiment, the integrated circuit chip 200 is a silicon carbide chip.

[0041] The integrated circuit chip heat dissipation structure 100 includes a base 10 and a base plate 20. The base 10 is hollow and one end is open to form a receiving groove 12. A first interface 14 and a second interface 16 connected to the receiving groove 12 are respectively provided on the opposite side walls of the base 10. The first interface 14 is used to inject a cooling medium into the receiving groove 12 (not shown). The second interface 16 is used to discharge the cooling medium injected into the receiving groove 12. The base plate 20 is used to cover the opening of the base 10 and to contact the integrated circuit chip 200. The base plate 20 is formed with a plurality of microchannels 22 on one side close to the receiving groove 12. The plurality of microchannels 22 are spaced apart along the flow direction of the cooling medium to provide a flow channel for the cooling medium.

[0042] During operation, the heat generated by the integrated circuit chip 200 is transferred to the plurality of microchannels 22 through the substrate 20. Then, the cooling medium injected through the first interface 14 flows through the plurality of microchannels 22 to exchange heat with the plurality of microchannels 22, and is finally discharged through the second interface 16.

[0043] Please refer to Figure 2 and Figure 4 Each microchannel 22 includes a plurality of microflow units 24, which are spaced apart. The height H of the plurality of microflow units 24 is less than or equal to the depth of the receiving groove 12. In this embodiment, the height H of the plurality of microflow units 24 is in the range of 50 um to 500 um.

[0044] Furthermore, each micro-flow unit 24 includes a flow divider 242. The flow divider 242 is cylindrical. In the present embodiment, the cross-sectional diameter of the flow divider 242 is in the range of 40um to 160um. The flow divider 242 is used to divert the cooling medium flowing through, and to form a vortex when the cooling medium flows through, so as to achieve the effect of stirring the cooling medium. Each flow divider 242 extends along the flow direction of the cooling medium to form a drainage portion 244. The drainage portions 244 are all plate-shaped and parallel to each other. In the present embodiment, the length of the drainage portion is in the range of 90um to 360um, and the thickness of the drainage portion is in the range of 20um to 80um. The drainage portion 244 is used to drain the cooling medium after the diversion of the flow divider 242, so as to improve the shedding of the vortex and weaken the energy dissipation in the wake area.

[0045] In this embodiment, the thickness of the drainage portion 244 is smaller than the cross-sectional diameter of the flow divider 242. The ratio of the length of the drainage portion 244 to the cross-sectional diameter of the flow divider 242 is greater than 9. In this way, a flow field structure similar to a streamline can be formed at the fluid vortex at the tail of the cylindrical flow divider 242. As the length of the drainage portion 244 increases, the starting point of the vortex shedding further moves backward along the flow direction, and the resistance coefficient of the flow is gradually reduced, which is 40% lower than when there is no drainage portion 244, and the pressure fluctuation is basically eliminated.

[0046] In this embodiment, the plurality of micro-flow bypass units 24 in each micro-channel 22 are evenly spaced with gaps of a first width in a direction perpendicular to the extension of the flow guide portion 244. The first width is in the range of 50 um to 300 um.

[0047] In this way, the cooling medium flows through the flow divider 242, absorbing the heat generated by the integrated circuit chip 200. Due to the cylindrical structure of the flow divider 242, the cooling medium forms a vortex when flowing through, so as to achieve the effect of stirring the coolant, thereby thinning the temperature boundary layer and enhancing the heat exchange performance; then, the cooling medium flows through the drainage portion 244, and due to the plate-like structure of the drainage portion 244, it will effectively improve the shedding of the vortex and weaken the energy dissipation in the wake area. After the coolant flows through a microchannel 22, it will flow into the next adjacent microchannel 22. Because these microchannels 22 are distributed at intervals, the convection of the coolant between adjacent microchannels 22 is enhanced, thereby improving the heat dissipation effect.

[0048] In this embodiment, the plurality of microchannels 22 are equally spaced and staggered so that each microflow unit 24 corresponds to a gap of the first width between the microflow units 24 in adjacent microchannels 22. In this way, when the coolant flows into the next adjacent microchannel 22, it can fully contact the flow divider 242 in the next adjacent microchannel 22, thereby enhancing the effect of stirring the coolant and further enhancing the heat dissipation effect.

[0049] In this embodiment, the cooling medium injected into the receiving groove 12 by the first interface 14 may be any one of liquid, gas and a gas-liquid mixture.

[0050] It should be noted that, in this embodiment, the substrate 20 is used to contact the substrate of the integrated circuit chip 200 to conduct the heat generated by the integrated circuit chip 200. In other embodiments, the substrate of the integrated circuit chip 200 can also be etched to form the structure of the substrate 20 at the bottom of the substrate.

[0051] The above integrated circuit chip heat dissipation structure 100 forms a microchannel 22 through a plurality of microflow units 24 to provide a heat dissipation channel for the cooling medium; and a flow divider 242 is provided in the microflow unit 24 to form a vortex for the cooling medium flowing through, thereby generating a local disturbance to destroy the flow boundary layer and make the temperature boundary layer thinner; and a plate-shaped flow guide 244 is formed extending from one side of the flow divider 242 to reduce the pressure fluctuation caused by flow separation when the viscous fluid flows around the columnar structure. In this way, the flow resistance and pressure fluctuation of the cooling medium can be reduced, and the heat dissipation effect can be improved.

[0052] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit chip heat dissipation structure for dissipating heat from an integrated circuit chip, characterized in that: The integrated circuit chip heat dissipation structure comprises: A base, wherein the base is hollow and one end is open to form a receiving groove, and two opposite side walls of the base are respectively provided with a first interface and a second interface connected to the receiving groove, the first interface is used to inject a cooling medium into the receiving groove, and the second interface is used to discharge the cooling medium injected into the receiving groove; A substrate, the substrate is used to cover the opening of the base and to contact the integrated circuit chip, the substrate is formed with a plurality of microchannels on one side close to the receiving groove, the plurality of microchannels are distributed at intervals along the flow direction of the cooling medium, so as to conduct the heat emitted by the integrated circuit chip to the cooling medium; Each microchannel includes a plurality of microflow units, which are spaced apart and each microflow unit includes a flow divider, which is cylindrical, and each flow divider extends along the flow direction of the cooling medium to form a flow guide portion, which is plate-shaped and parallel to each other, and the thickness of the flow guide portion is less than the cross-sectional diameter of the flow divider, and the ratio of the length of the flow guide portion to the cross-sectional diameter of the flow divider is greater than 9; A plurality of micro-flow units in each micro-channel are distributed at equal intervals with gaps of a first width along a direction perpendicular to the extension of the guide portion.

2. The integrated circuit chip heat dissipation structure according to claim 1, characterized in that: The plurality of microchannels are equally spaced and staggered so that each microflow unit corresponds to a gap of a first width between microflow units in adjacent microchannels.

3. The integrated circuit chip heat dissipation structure according to claim 1, characterized in that: The first width is in the range of 50 um to 300 um.

4. The integrated circuit chip heat dissipation structure according to claim 1, characterized in that: The length of the drainage portion is within a range of 90um to 360um, the thickness of the drainage portion is within a range of 20um to 80um, and the cross-sectional diameter of the flow divider is within a range of 40um to 160um.

5. The integrated circuit chip heat dissipation structure according to claim 1, characterized in that: The heights of the plurality of micro-flow units are less than or equal to the depth of the receiving groove.

6. The integrated circuit chip heat dissipation structure according to claim 5, characterized in that: The heights of the plurality of micro flow-around units are in the range of 50um to 500um.

7. The integrated circuit chip heat dissipation structure according to claim 1, characterized in that: The cooling medium injected into the receiving groove by the first interface is any one of liquid, gas and gas-liquid mixture.

Images