Feeding mechanism and feeding method of soft light strip of die bonder / resistor bonder and die bonder and resistor bonder

Abstract

A feeding mechanism and feeding method of a crystal bonder / resistor bonder for a soft light strip, a crystal bonder and a resistor bonder, wherein the feeding mechanism comprises a Y-axis moving unit and a material positioning mechanism arranged on the Y-axis moving unit, the material positioning mechanism comprises a base, a liftable material adsorption positioning unit arranged on the base, an intermediate guide fixture, and a front guide fixture and a rear guide fixture arranged in front of and behind the intermediate guide fixture and connected to the intermediate guide fixture, a front clamping mechanism is arranged on the front guide fixture, a front U-shaped material trough is arranged in front of the front clamping mechanism, a rear clamping mechanism is arranged on the rear guide fixture, and a rear U-shaped material trough is arranged behind the rear clamping mechanism. The present invention has the advantage of being able to perform crystal bonding / resistance bonding on rolled or long soft light strips.

Description

Technical Field

[0001] The present invention relates to the field of a crystal bonder / resistor bonder, and in particular to a feeding mechanism and a feeding method for a soft light strip of a crystal bonder / resistor bonder, and a crystal bonder and a resistor bonder. Background Art

[0002] At present, due to structural defects, the die-bonding machine / resistor bonding machine cuts the soft light strip into 0.5 meters or shorter lengths before bonding / resisting, that is, the existing die-bonding machine / resistor bonding machine can only bond / resist short soft light strips, and cannot directly bond / resist roll or long soft light strips. In this way, the die-bonding machine / resistor bonding machine has a narrow scope of application and cannot meet the needs of bonding / resisting soft light strips in rolls or long lengths. Summary of the invention

[0003] In order to solve the above problems, the present invention provides a feeding mechanism for a soft light strip of a die-bonding machine / resistor-bonding machine which can perform die-bonding / resistor-bonding on a rolled or long soft light strip.

[0004] The present invention also provides a feeding method for performing crystal bonding / resistance bonding on a rolled or long soft light strip.

[0005] The present invention also provides a die-bonding machine which can perform die bonding / resistance bonding on a rolled or long soft light strip.

[0006] The present invention also provides a resistor fixing machine which can perform crystal fixing / resistance fixing on a rolled or long soft light strip.

[0007] The technical solution of the present invention is: to provide a feeding mechanism for a soft light strip of a crystal bonding machine / resistor bonding machine, comprising a Y-axis moving unit and a material positioning mechanism arranged on the Y-axis moving unit, wherein the material positioning mechanism comprises a base, a liftable material adsorption and positioning unit arranged on the base, and an intermediate guide fixture, wherein the liftable material adsorption and positioning unit rises or falls to clamp the material between the liftable material clamping unit and the intermediate guide fixture, or releases the material from between the liftable material clamping unit and the intermediate guide fixture, and further comprises a front guide fixture and a rear guide fixture which are arranged in front of and behind the intermediate guide fixture and are connected to the intermediate guide fixture, wherein a front clamping mechanism is arranged on the front guide fixture, and a front U-shaped material trough is arranged in front of the front clamping mechanism, and a rear clamping mechanism is arranged on the rear guide fixture, and a rear U-shaped material trough is arranged behind the rear clamping mechanism.

[0008] As an improvement of the present invention, the liftable material adsorption and positioning unit includes a first power source located on a base, a suction nozzle, and a top plate with a cavity therein arranged above the first power source, wherein a plurality of through holes are provided on the upper surface of the top plate, and the suction nozzle extends into the cavity of the top plate and is connected with the cavity and the through holes to form a plurality of adsorption channels. The first power source can push the top plate to rise or fall so that the top plate is close to or away from the intermediate guide fixture, thereby clamping or releasing the material.

[0009] As an improvement of the present invention, the front clamping mechanism includes a front clamping seat, a first clamping power source and a second clamping power source located on and opposite to the front clamping seat, a first pressure block located in front of the first clamping power source and driven by the first clamping power source, and a second pressure block located in front of the second clamping power source and driven by the second clamping power source; when working, the first clamping power source and the second clamping power source can simultaneously drive the first pressure block and the second pressure block to move closer to or away from each other, thereby clamping or releasing the material.

[0010] As an improvement of the present invention, the front clamping mechanism and the rear clamping mechanism have the same structure.

[0011] As an improvement of the present invention, the front U-shaped trough includes a front U-shaped trough body and a feed sensor arranged on the front U-shaped trough body.

[0012] As an improvement of the present invention, the front U-shaped material trough and the rear U-shaped material guide trough have the same structure.

[0013] Another technical solution of the present invention is to provide a feeding method for a feeding mechanism of a die bonder / resistor bonder soft light strip, comprising:

[0014] (S1), place the front end of the material on the top plate of the middle guide fixture, and insert the rear part of the front end into the rear guide fixture;

[0015] (S2), when the feeding sensor senses that there is material and the discharging sensor senses that there is no material, the control system controls the negative pressure source to provide negative pressure to the suction nozzle, and the cavity and the plurality of through holes are connected to form a plurality of adsorption channels to adsorb the material on the top plate, and at the same time, the first power source pushes the top plate to rise until the top plate rises to sandwich the material between the top plate and the middle guide fixture;

[0016] (S3), solidifying or resisting the material;

[0017] (S4), after the die bonding or resistance bonding is completed, the Y-axis moving unit drives the base, the liftable material adsorption and positioning unit on the base, and the material backward guiding fixture to move;

[0018] (S5), after the base, the liftable material adsorption positioning unit on the base, and the material are moved to a predetermined position, the front clamping mechanism clamps the front end of the material, and the rear clamping mechanism clamps the rear end of the material;

[0019] (S6), the control system controls the negative pressure source to stop providing negative pressure to the suction nozzle, and the plurality of adsorption channels stop adsorbing the material on the top plate, and at the same time the first power source drives the top plate to descend until the top plate descends to the point where the material between the top plate and the middle guide fixture is released;

[0020] (S7), the Y-axis moving unit drives the base and the liftable material adsorption positioning unit on the base to move toward the middle guide fixture to achieve reset;

[0021] (S8) Repeat the above steps (S1) to (S7) in a loop.

[0022] As an improvement of the present invention, the present invention further includes (S9), calibrating the material on the top plate by using the crystal fixing lens barrel / resistance fixing lens barrel.

[0023] A third technical solution of the present invention is to provide a crystal bonding machine, which contains the above-mentioned feeding mechanism.

[0024] The fourth technical solution of the present invention is to provide a solid resistance machine, which contains the above-mentioned feeding mechanism.

[0025] The present invention includes a Y-axis moving unit and a material positioning mechanism arranged on the Y-axis moving unit, wherein the material positioning mechanism includes a base, a liftable material adsorption and positioning unit arranged on the base, and an intermediate guide fixture, and also includes a front guide fixture and a rear guide fixture arranged in front of and behind the intermediate guide fixture and connected to the intermediate guide fixture, a front clamping mechanism is arranged on the front guide fixture, a front U-shaped material trough is arranged in front of the front clamping mechanism, and a rear clamping mechanism is arranged on the rear guide fixture, and a rear U-shaped material trough is arranged behind the rear clamping mechanism. When the present invention is in use, the front end of the material is placed on the top plate at the middle guide fixture, and the part behind the front end is inserted into the rear guide fixture; the control system controls the negative pressure source to provide negative pressure to the suction nozzle, and the cavity and the plurality of through holes are connected to form a plurality of adsorption channels to adsorb the material on the top plate, and at the same time the first power source pushes the top plate to rise until the top plate rises to sandwich the material between the top plate and the middle guide fixture; then the material is solidified or blocked; after the solidification or blocking is completed, the Y-axis moving unit drives the base, the liftable material adsorption and positioning unit on the base, and the material to move to the rear guide fixture; wait The base, the liftable material adsorption and positioning unit on the base, and the material move to the predetermined position, the front clamping mechanism clamps the front end of the material, and the rear clamping mechanism clamps the rear end of the material; the control system controls the negative pressure source to stop providing negative pressure to the suction nozzle, and the plurality of adsorption channels stop adsorbing the material on the top plate, and at the same time the first power source drives the top plate to descend until the top plate descends to the point where the material between the top plate and the middle guide fixture is released; at this time the Y-axis moving unit drives the base and the liftable material adsorption and positioning unit on the base to move toward the middle guide fixture to achieve reset; and then the above actions are repeated in a cycle. In this way, the present invention can perform crystal bonding / resistance bonding on rolled or long soft light strips. Therefore, the present invention has the advantage of being able to perform crystal bonding / resistance bonding on rolled or long soft light strips. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a three-dimensional structural schematic diagram of an embodiment of the feeding mechanism of the present invention.

[0027] Figure 2 yes Figure 1 Schematic diagram of the three-dimensional decomposition of some structures.

[0028] Figure 3 yes Figure 2 Schematic diagram of the fully assembled three-dimensional structure.

[0029] Figure 4 yes Figure 3 Side view of.

[0030] Figure 5 yes Figure 1 Schematic diagram of the three-dimensional structure of the front clamping mechanism.

[0031] Figure 6 yes Figure 5 Schematic diagram of the three-dimensional structure from another angle.

[0032] Figure 7 It is a side view of the solid resistance machine in the present invention. DETAILED DESCRIPTION

[0033] See also Figures 1 to 6 , Figures 1 to 6 Disclosed is an implementation of a feeding mechanism for a die bonder / resistor bonder with a soft light strip, comprising a Y-axis moving unit 1 and a material positioning mechanism 2 disposed on the Y-axis moving unit 1, wherein the material positioning mechanism 2 comprises a base 21, a liftable material adsorption positioning unit 23 disposed on the base 21, and an intermediate guide fixture 24. In this embodiment, an X-axis moving unit 6 is further included, and the material positioning mechanism 2 is disposed on the Y-axis moving unit 1 through the X-axis moving unit 6. The purpose of such an arrangement is to enable the material positioning mechanism 2 to also move along the X-axis direction. The liftable material adsorption and positioning unit 23 rises or falls so as to clamp the material 9 between the liftable material adsorption and positioning unit 23 and the intermediate guide fixture 24, or release the material 9 from between the liftable material adsorption and positioning unit 23 and the intermediate guide fixture 24, and also includes a front guide fixture 31 and a rear guide fixture 32 which are arranged in front of and behind the intermediate guide fixture 24 and connected to the intermediate guide fixture 24, a front clamping mechanism 41 is provided on the front guide fixture 31, a front U-shaped material trough 51 is provided in front of the front clamping mechanism 41, and a rear clamping mechanism 42 is provided on the rear guide fixture 32, and a rear U-shaped material trough 52 is provided behind the rear clamping mechanism 42. In this embodiment, the intermediate guide fixture 24 has two guide grooves, namely an inverted L-shaped guide groove 242 and a 7-shaped guide groove 241. The inverted L-shaped guide groove 242 includes a first side plate 2421 and a first cover plate 2422. The 7-shaped guide groove 241 includes a second side plate 2411 and a second cover plate 2412. The intermediate guide fixture 24, the front guide fixture 31 and the rear guide fixture 32 have the same structure. The material 9 in the present invention is a soft light strip.

[0034] In the present invention, preferably, the liftable material adsorption and positioning unit 23 comprises a first power source 231 located on the base 21, a suction nozzle 232, and a top plate 233 provided with a cavity therein, which is arranged above the first power source 231. The upper surface of the top plate 233 is provided with a plurality of through holes 234. The suction nozzle 231 extends into the cavity of the top plate 233 and is connected with the cavity and the through holes 234 to form a plurality of adsorption channels. The first power source 221 can push the top plate 233 to move upward. The top plate 233 is raised or lowered so that the top plate 233 is close to or away from the intermediate guide fixture 24, thereby clamping or loosening the material. Specifically, the top plate 233 is close to the first cover plate 2422 of the inverted L-shaped guide groove 242 and the second cover plate 2412 of the 7-shaped guide groove 241, and the material is clamped between the top plate 233 and the first cover plate 2422 of the inverted L-shaped guide groove 242, and between the top plate 233 and the second cover plate 2412 of the 7-shaped guide groove 241. In this embodiment, there are two first power sources 231, and specifically, the first power sources 231 are cylinders. Specifically, the top plate 233 is a hollow cuboid, and a through hole is provided on the lower surface of the top plate 233 for the suction nozzle 232 to extend into. The present embodiment also includes a guide column 25, one end of which is fixed on the base 21, and the other end is inserted into the cavity of the top plate 233 through the lower surface of the top plate 233. When the first power source 231 drives the top plate 233 to rise or fall, the guide column 25 plays a guiding role.

[0035] In the present invention, preferably, the front clamping mechanism 41 includes a front clamping seat 410, a first clamping power source 411 and a second clamping power source 412 located on and opposite to the front clamping seat 410, a first pressing block 413 located in front of the first clamping power source 411 and driven by the first clamping power source 411, and a second pressing block 414 located in front of the second clamping power source 412 and driven by the second clamping power source; when working, the first clamping power source 411 and the second clamping power source 412 can simultaneously drive the first pressing block 413 and the second pressing block 414 to move closer to or away from each other, thereby clamping or releasing the material. In the present invention, preferably, the front clamping mechanism 41 and the rear clamping mechanism 42 have the same structure. The rear clamping mechanism 42 includes a rear clamping seat 420, a third clamping power source 421 and a fourth clamping power source 422 located on and opposite to the rear clamping seat 420, a third pressure block 423 located in front of the third clamping power source 421 and driven by the third clamping power source 421, and a fourth pressure block 424 located in front of the fourth clamping power source 422 and driven by the fourth clamping power source 422; when working, the third clamping power source 421 and the fourth clamping power source 422 can simultaneously drive the third pressure block 423 and the fourth pressure block 424 to move closer to or away from each other, thereby clamping or releasing the material.

[0036] In the present invention, preferably, the front U-shaped trough 51 includes a front U-shaped trough body 511 and a feed sensor 512 disposed on the front U-shaped trough body 511. In the present invention, the front U-shaped trough 51 and the rear U-shaped guide trough 52 have the same structure. Specifically, the rear U-shaped guide trough 52 includes a rear U-shaped trough body 521 and a discharge sensor 522 disposed on the rear U-shaped trough body 521.

[0037] When the present invention is in use, the front end of the material 9 is first placed on the top plate 233 at the middle guide fixture 24, and the part behind the front end of the material 9 is inserted into the rear guide fixture 32; when the feed sensor 512 senses the presence of material and the discharge sensor 522 senses the absence of material, the control system (not shown in the figure) controls the negative pressure source (not shown in the figure) to provide negative pressure to the suction nozzle 232, and the cavity and the plurality of through holes 234 are connected to form a plurality of adsorption channels to adsorb the material 9 on the top plate 233. At the same time, the first power source 231 pushes the top plate 233 to rise until the top plate 233 rises to clamp the material 9 between the top plate 233 and the middle guide fixture 24; then the equipment performs solid crystal or solid resistance on the material 9; after the solid crystal or solid resistance is completed, the Y-axis moving unit 1 drives the base 21, the liftable material adsorption and positioning unit 23 on the base 21, and The material 9 moves toward the rear guide fixture 32; after the base 21, the liftable material adsorption and positioning unit 23 on the base 21, and the material 9 move to the predetermined position, the front clamping mechanism 41 clamps the front end of the material 9, and the rear clamping mechanism 42 clamps the rear end of the material 9; the control system controls the negative pressure source to stop providing negative pressure to the suction nozzle 232, and several adsorption channels stop adsorbing the material 9 on the top plate 233, and at the same time the first power source 231 drives the top plate 233 to descend until the top plate 233 descends to the material 9 between the top plate 233 and the middle guide fixture 24 and is released; then the Y-axis moving unit 1 drives the base 21 and the liftable material adsorption and positioning unit 23 on the base 21 to move toward the middle guide fixture 24 to achieve resetting; the above actions are repeated in a cycle, so that the rolled or long-length materials can be solidified or blocked.

[0038] The present invention also provides a feeding method for a feeding mechanism of a soft light strip of a die bonder / resistor bonder.

[0039] (S1), placing the front end of the material 9 on the top plate 233 of the middle guide fixture 24, and inserting the rear part of the front end into the rear guide fixture 32;

[0040] (S2), when the feeding sensor 512 senses that there is material and the discharging sensor 522 senses that there is no material, the control system controls the negative pressure source to provide negative pressure to the suction nozzle 232, and the cavity and the plurality of through holes 234 are connected to form a plurality of adsorption channels to adsorb the material 9 on the top plate 233, and at the same time, the first power source 231 pushes the top plate 233 to rise until the top plate 233 rises to sandwich the material 9 between the top plate 233 and the middle guide fixture 24;

[0041] (S3), performing solid crystal or solid resistance on the material 9;

[0042] (S4), after the solidification or solidification is completed, the Y-axis moving unit 1 drives the base 21, the liftable material adsorption and positioning unit 23 on the base 21, and the material 9 to move toward the rear guide fixture 32;

[0043] (S5), after the base 21, the liftable material adsorption positioning unit 23 on the base 21, and the material 9 are moved to the predetermined position, the front clamping mechanism 41 clamps the front end of the material 9, and the rear clamping mechanism 42 clamps the rear end of the material 9;

[0044] (S6), the control system controls the negative pressure source to stop providing negative pressure to the suction nozzle 232, and the plurality of adsorption channels stop adsorbing the material 9 on the top plate 233, and at the same time the first power source 231 drives the top plate 233 to descend until the top plate 233 descends to the point where the material 9 between the top plate 233 and the middle guide fixture 24 is released;

[0045] (S7), the Y-axis moving unit 1 drives the base 21 and the liftable material adsorption positioning unit 23 on the base 21 to move toward the middle guide fixture 24 to achieve reset;

[0046] (S8) Repeat the above steps (S1) to (S7) in a loop.

[0047] In the present invention, preferably, the process further includes (S9), calibrating the material 9 on the top plate 233 by using a crystal fixing lens barrel / resistance fixing lens barrel.

[0048] The present invention also provides a solid resistance machine (see Figure 7 ), the solid resistance machine contains the aforementioned feeding mechanism.

[0049] The present invention also provides a crystal bonding machine, which comprises the above-mentioned feeding mechanism.

Claims

1. A feeding mechanism for a soft light strip of a die bonder / resistor bonder, characterized by: The invention comprises a Y-axis moving unit (1) and a material positioning mechanism (2) arranged on the Y-axis moving unit (1), wherein the material positioning mechanism (2) comprises a base (21), a liftable material adsorption positioning unit (23) arranged on the base (21), and an intermediate guide fixture (24), wherein the liftable material adsorption positioning unit (23) rises or falls so as to clamp the material (9) between the liftable material adsorption positioning unit (23) and the intermediate guide fixture (24), or to move the material (9) from the liftable material adsorption positioning unit to the intermediate guide fixture (24). The intermediate guide jig (23) is loosened between the intermediate guide jig (24), and further comprises a front guide jig (31) and a rear guide jig (32) which are arranged in front of and behind the intermediate guide jig (24) and connected to the intermediate guide jig (24); a front material clamping mechanism (41) is provided on the front guide jig (31), and a front U-shaped material trough (51) is provided in front of the front material clamping mechanism (41); a rear material clamping mechanism (42) is provided on the rear guide jig (32), and a rear U-shaped material trough (52) is provided behind the rear material clamping mechanism (42).

2. The feeding mechanism of the soft light strip of the die bonder / resistor bonder according to claim 1 is characterized by: The liftable material adsorption and positioning unit (23) comprises a first power source (231) located on a base (21), a suction nozzle (232), and a top plate (233) provided with a cavity therein and arranged above the first power source (231); a plurality of through holes (234) are provided on the upper surface of the top plate (233); the suction nozzle (232) extends into the cavity of the top plate (233) and is connected with the cavity and the through holes (234) to form a plurality of adsorption channels; the first power source (231) can push the top plate (233) to rise or fall so that the top plate (233) is close to or away from the intermediate guide fixture (24), thereby clamping or releasing the material.

3. The feeding mechanism of the soft light strip of the die bonder / resistor bonder according to claim 1 or 2, characterized in that: The front clamping mechanism (41) comprises a front clamping seat (410), a first clamping power source (411) and a second clamping power source (412) located on and opposite to the front clamping seat (410), a guide rail (415), a first pressing block (413) located in front of the first clamping power source (411) and driven by the first clamping power source (411), and a second pressing block (414) located in front of the second clamping power source (412) and driven by the second clamping power source, wherein the first pressing block (413) and the second pressing block (414) can slide on the guide rail (415); when in operation, the first clamping power source (411) and the second clamping power source (412) can simultaneously drive the first pressing block (413) and the second pressing block (414) to slide along the guide rail (415) toward or away from each other, thereby clamping or releasing the material.

4. The feeding mechanism of the soft light strip of the die bonder / resistor bonder according to claim 3 is characterized by: The front material clamping mechanism (41) and the rear material clamping mechanism (42) have the same structure.

5. The feeding mechanism of the soft light strip of the die bonder / resistor bonder according to claim 1 or 2, characterized in that: The front U-shaped trough (51) comprises a front U-shaped trough body (511) and a feeding sensor (512) arranged on the front U-shaped trough body (511).

6. The feeding mechanism of the soft light strip of the die bonder / resistor bonder according to claim 5, characterized in that: The front U-shaped material trough (51) and the rear U-shaped material guide trough (52) have the same structure.

7. A feeding method for a feeding mechanism of a soft light strip of a die bonder / resistor bonder, characterized in that: (S1), placing the front end of the material (9) on the top plate (233) at the middle guide fixture (24), and inserting the rear portion of the front end into the rear guide fixture (32); (S2), when the feeding sensor (512) senses the presence of material and the discharging sensor (522) senses the absence of material, the control system controls the negative pressure source to provide negative pressure to the suction nozzle (232), and the cavity and the plurality of through holes (234) are connected to form a plurality of adsorption channels to adsorb the material (9) on the top plate (233), and at the same time, the first power source (231) pushes the top plate (233) to rise until the top plate (233) rises to sandwich the material (9) between the top plate (233) and the middle guide fixture (24); (S3), performing solid crystal or solid resistance on the material (9); (S4), after the solidification or solidification of the resistor is completed, the Y-axis moving unit (1) drives the base (21), the liftable material adsorption and positioning unit (23) on the base (21), and the material (9) to move toward the rearward guiding fixture (32); (S5), after the base (21), the liftable material adsorption positioning unit (23) on the base (21), and the material (9) are moved to a predetermined position, the front clamping mechanism (41) clamps the front end of the material (9), and the rear clamping mechanism (42) clamps the rear end of the material (9); (S6), the control system controls the negative pressure source to stop providing negative pressure to the suction nozzle (232), and the plurality of suction channels stop sucking the material (9) on the top plate (233), and at the same time the first power source (231) drives the top plate (233) to descend until the top plate (233) descends to the point where the material (9) between the top plate (233) and the middle guide fixture (24) is released; (S7), the Y-axis moving unit (1) drives the base (21) and the liftable material adsorption positioning unit (23) on the base (21) to move toward the middle guide fixture (24) to achieve resetting; (S8) Repeat the above steps (S1) to (S7) in a loop.

8. The feeding method of the feeding mechanism of the die bonder / resistor bonder soft light strip according to claim 7, characterized in that: The method also includes (S9), calibrating the material (9) on the top plate (233) by using a crystal fixing lens barrel / resistance fixing lens barrel.

9. A die bonding machine, characterized in that: The die bonding machine comprises the feeding mechanism described in any one of claims 1 to 6.

10. A solid resistance machine, characterized in that: The solid resistance machine comprises the feeding mechanism described in any one of claims 1 to 6.

Images