Camera module and imaging device including the same

Abstract

A camera module and an imaging device including the camera module are provided. The camera module includes a printed circuit board (PCB); a first imaging device on the PCB, the first imaging device being configured to generate first image data based on a received optical signal; a second imaging device on the PCB, the second imaging device being configured to generate second image data based on the received optical signal; a power management integrated circuit (PMIC) on the PCB, the PMIC being configured to generate a plurality of power supply voltages based on an external power supply voltage received from an external power supply source, and providing the plurality of power supply voltages to the first imaging device and the second imaging device; and a connector being configured to receive an external power supply voltage from the external power supply source and provide the external power supply voltage to the PMIC.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Korean Patent Application No. 10-2019-0075786 filed in the Korean Intellectual Property Office on June 25, 2019, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The inventive concept relates to a camera module and / or an imaging device including the camera module. Background Art

[0004] Recently, due to the widespread use of camera functions in electronic devices such as smart phones, multiple camera assemblies, each of which includes an image sensor, are often installed in the electronic device. The electronic device can generate 3D images, panoramic images, zoom images, and high-resolution images by synthesizing multiple images captured by the multiple camera assemblies. In order to provide high-quality images, a technology that minimizes or reduces noise generation of the image sensor is required. Summary of the invention

[0005] The inventive concept provides a camera module for minimizing or reducing noise of an image sensor and / or minimizing or reducing the number of components to be mounted; and / or an imaging device including the camera module.

[0006] According to an exemplary aspect of the present inventive concept, there is provided a camera module, comprising: a printed circuit board (PCB); a first imaging device on the PCB, configured to generate first image data based on a received light signal; a second imaging device on the PCB, configured to generate second image data based on the received light signal; a power management integrated circuit (PMIC) on the PCB, configured to generate a plurality of power supply voltages based on an external power supply voltage received from an external power supply source, the plurality of power supply voltages including a first power supply voltage and a second power supply voltage. The PMIC is configured to provide at least the first power supply voltage to the first imaging device and at least the second power supply voltage to the second imaging device; and a connector, configured to receive the external power supply voltage from the external power supply source and provide the external power supply voltage to the PMIC.

[0007] According to an example embodiment of the inventive concept, there is provided a camera module, including: a first imaging device mounted on a first printed circuit board, the first imaging device configured to generate a first image signal based on a received light signal; and a second imaging device configured to generate a second image signal based on the light signal; a first refraction device configured to refract the received light signal toward the first imaging device; a PMIC on the first PCB configured to provide a first power supply voltage to the first imaging device; and a connector configured to receive a power supply voltage from an external source and provide the power supply voltage to the PMIC.

[0008] According to an example embodiment of the present invention, there is provided an imaging device, comprising: a first camera module, comprising at least one first camera component and a first PMIC, the at least one first camera component being configured to generate image data, the first PMIC being configured to generate a plurality of power supply voltages based on a power supply voltage received through a connector to provide the plurality of power supply voltages to the at least one first camera component; a power supply source being configured to provide the power supply voltage to the first camera module through the connector; and a processor being configured to provide a control signal to the first camera module through the connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Some embodiments of the present inventive concept will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0010] Figure 1 is a block diagram illustrating a camera module according to an example embodiment of the inventive concept;

[0011] Figure 2 is a side cross-sectional view schematically showing an imaging device;

[0012] FIG. 3A to FIG. 3C illustrates an example of an imaging device included in a camera module according to an example embodiment of the inventive concept and an example of a voltage supplied to the imaging device by a PMIC;

[0013] Figure 4 Schematically illustrates a camera module according to an example embodiment of the inventive concept;

[0014] Figure 5A and Figure 5B is a block diagram schematically illustrating a PMIC according to an example embodiment of the inventive concept;

[0015] FIG. 6A to FIG. 6D is a diagram schematically illustrating a layout of a camera module according to an example embodiment of the inventive concept;

[0016] Figure 7 is a block diagram schematically illustrating an imaging device including a camera module according to an example embodiment of the inventive concept;

[0017] Fig. 8A is a block diagram illustrating an imaging device including a camera module according to a comparative example, Figure 8B is a block diagram illustrating an imaging device including a camera module according to an example embodiment of the inventive concept;

[0018] Fig. 9 is a block diagram schematically illustrating a camera module according to an example embodiment of the inventive concept;

[0019] Fig.10 is a diagram schematically illustrating a layout of a camera module according to an example embodiment of the inventive concept;

[0020] Fig.11 is a block diagram schematically illustrating a camera module according to an example embodiment of the inventive concept;

[0021] Fig. 12A and Fig. 12B is a diagram schematically illustrating a layout of a camera module according to an example embodiment of the inventive concept;

[0022] Fig.13A , Fig. 13B and Fig. 13C is a block diagram schematically illustrating an imaging device including a camera module according to an example embodiment of the inventive concept;

[0023] Fig.14 schematically illustrates a camera module having a folded structure using a refraction device according to an example embodiment of the inventive concept;

[0024] Fig.15A and Fig. 15B schematically illustrates a cross-sectional view of a camera module according to an example embodiment of the inventive concept;

[0025] Fig.16A and Fig. 16B schematically illustrates a camera module according to an example embodiment of the inventive concept; and

[0026] Fig.17 is a block diagram illustrating a portable terminal including a camera module according to an exemplary embodiment of the inventive concept. DETAILED DESCRIPTION

[0027] When an element is referred to as being "on," "connected to," "coupled to," or "adjacent to" another element, the element may be directly on, connected to, coupled to, or adjacent to the other element, or one or more other intervening elements may be present. In contrast, when an element is referred to as being "directly on," "directly connected to," "directly coupled to," or "immediately adjacent to" another element, there are no intervening elements.

[0028] Figure 1 is a block diagram illustrating a camera module 100 according to an example embodiment of the inventive concept.

[0029] refer to Figure 1, the camera module 100 may include a first imaging device 120-1, a second imaging device 120-2, a power management integrated circuit (PMIC) 130, and a connector 140. The first imaging device 120-1, the second imaging device 120-2, and the PMIC 130 may be on a printed circuit board (PCB) 110. Figure 1 , the camera module 100 is shown as including two imaging devices, a first imaging device 120-1 and a second imaging device 120-2, but is not limited thereto. For example, the camera module 100 may include three or more imaging devices. Thus, the camera module 100 having multiple imaging devices may be referred to as a multi-camera module.

[0030] The imaging device may be a camera assembly including a lens and an image sensor. Each of the first imaging device 120-1 and the second imaging device 120-2 may include a lens and an image sensor, and the image sensors may generate (or obtain) an image (or image data) based on light signals collected through their respective lenses.

[0031] The first image generated by the first imaging device 120-1 may have different image characteristics from the second image generated by the second imaging device 120-2. For example, the first imaging device 120-1 may generate a black and white image, and the second imaging device 120-2 may generate a color image. As another example, the first imaging device 120-1 may generate an image using a lens having a first viewing angle, and the second imaging device 120-2 may generate an image using a lens having a second viewing angle wider than the first viewing angle. Therefore, the second image generated by the second imaging device 120-2 may have a wider viewing angle than the first image generated by the first imaging device 120-1. However, the embodiment is not limited thereto, for example, the lenses of the first imaging device 120-1 and the second imaging device 120-2 may have the same viewing angle, and the viewing angles of the first image and the second image may be the same. Other replacements for the first imaging device 120-1 and the second imaging device 120-2 may have shared or varied characteristics, such as focal length, lens angle, etc., without departing from the example embodiment.

[0032] The PMIC 130 may generate a plurality of power supply voltages VDD1, VDD2, and VDD3 used in the first and second imaging devices 120-1 and 120-2 based on an external power supply voltage VDDe received from the outside through the connector 140, and provide the power supply voltages VDD1, VDD2, and VDD3 to the first and second imaging devices 120-1 and 120-2.

[0033] In this case, the first power supply voltage VDD1 refers to at least one voltage provided to the first imaging device 120-1, the second power supply voltage VDD2 refers to at least one voltage provided to the second imaging device 120-2, and the third power supply voltage VDD3 refers to at least one voltage commonly provided to the first imaging device 120-1 and the second imaging device 120-2. Some of the plurality of power supply voltages VDD1, VDD2, and VDD3 may be analog power supply voltages provided to analog circuits, and others may be digital power supply voltages provided to digital circuits.

[0034] In an embodiment, the PMIC 130 may receive a feedback signal from at least one of the first imaging device 120-1 and the second imaging device 120-2, and may adjust the voltage levels of the power supply voltages VDD1, VDD2, and VDD3 provided to the corresponding imaging device based on the feedback signal. For example, when the voltage level of the received first power supply voltage VDD1 is lower than or higher than the target level, the first imaging device 120-1 may send a feedback signal notifying the situation to the PMIC 130. Therefore, the PMIC 130 may adjust the first power supply voltage VDD1 to match the target level.

[0035] The connector 140 may electrically connect the camera module 100 to a main board of an electronic device including the camera module 100. The connector 140 may be electrically connected to the PCB 110. Figure 1 As shown, in an embodiment, the connector 140 may be connected to the PCB 110 through the FPCB (FPCB) 150. However, the connector is not limited thereto. For example, in another embodiment, the connector 140 may be directly connected to the PCB 110.

[0036] The connector 140 may include a plurality of pins 141 that transmit and receive signals or voltages. The connector 140 may receive an external power supply voltage VDDe through some of the plurality of pins 141, and the connector 140 may provide the external power supply voltage VDDe to the PMIC 130 through wiring patterned on the PCB 110 and the FPCB 150. A control signal for controlling the camera module 100 may be received through other pins of the plurality of pins 141.

[0037] Wiring for transmitting signals between the first imaging device 120 - 1 , the second imaging device 120 - 2 , the PMIC 130 , and the connector 140 may also be patterned on the PCB 110 .

[0038] In an example embodiment, the camera module 100 may further include a heat dissipation member (not shown) for dissipating heat generated by the first imaging device 120-1, the second imaging device 120-2, and the PMIC 130. For example, the heat dissipation member may be attached to one surface of the PCB 110, for example, a surface opposite to a surface on which the first imaging device 120-1, the second imaging device 120-2, and the PMIC 130 are mounted. The camera module 100 may also include a connection member for grounding the PCB 110 with a main frame of an electronic device including the camera module 100.

[0039] The camera module 100 may be a part of an electronic device having an image capturing or light sensing function. For example, the camera module 100 may be a part of an electronic device such as a digital camera, a digital video camera, a smart phone, a wearable device, an Internet of Things (IoT) device, a tablet personal computer (PC), a personal digital assistant (PDA), a portable multimedia player (PMP), a navigation device, etc. In addition, the camera module 100 may be a part of an electronic device that is provided as a component of a larger system or device such as a vehicle, furniture, a manufacturing facility, a door, various measuring devices, a security system, etc.

[0040] Figure 2 1 is a side cross-sectional view schematically showing the imaging device 120. Figure 2 The imaging device 120 is applied to Figure 1 at least one of the first imaging device 120 - 1 and the second imaging device 120 - 2 .

[0041] refer to Figure 2 , the imaging device 120 may include a lens 121, an image sensor 122, a filter 123, an actuator 124, a driving circuit 125, a passive element 126, and a housing 127. In an example embodiment, the imaging device 120 may include a plurality of lenses, and may also include components for providing other functions such as adjustable focal length, variable aperture, focusing, and the like.

[0042] Among the optical signals collected by the lens 121, the optical signal passing through the optical filter 123 can be directed to the image sensor 122. The optical filter 123 can block the components of a specific wavelength band in the frequency components of the received optical signal. As an example, the optical filter 123 is an IR cutoff filter and can block the infrared component of the optical signal. Therefore, the optical filter 123 can prevent, reduce or minimize the noise in the image data caused by the infrared component. However, example embodiments are not limited thereto, and the optical filter 123 can block the components of the wavelength bands corresponding to different colors or ranges in the frequency components of the received optical signal.

[0043] The image sensor 122 may convert the received optical signal into an electrical signal. The image sensor 122 may convert the optical signal into an electrical signal to generate an electronic image or image data. The conversion may be an analog-to-digital conversion.

[0044] The image sensor 122 may include a pixel array that receives a light signal. The pixel array may be implemented as, for example, a photoelectric conversion element, such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS), or may be implemented as various types of photoelectric conversion elements. The pixel array may include a plurality of pixels for converting the received light signal into an electrical signal, and the plurality of pixels may be arranged in a matrix. Each of the plurality of pixels includes a photosensitive element. For example, the photosensitive element may include a photodiode, a phototransistor, a port gate, a pinned photodiode, etc.

[0045] The image sensor 122 may be mounted on the PCB 110. In example embodiments, the image sensor 122 may be mounted on the PCB 110 by a wire bonding method using wires 128.

[0046] The actuator 124 may be connected to the lens 121, and may move the lens 121 in the optical axis or in a plane perpendicular to the optical axis under the control of the driving circuit 125. Therefore, the imaging device 120 may provide additional functions such as auto focus (AF), optical image stabilizer (OIS), iris diaphragm, etc. for improving image quality. In an embodiment, the actuator 124 may be integrated with a housing 127 forming the exterior of the imaging device 120. When the imaging device 120 does not provide the additional functions, the imaging device 120 may not include the driving circuit 125 and the actuator 124.

[0047] The image sensor 122, the actuator 124 and the driving circuit 125 can be based on the PMIC ( Figure 1 The passive element 126 may be operated by a power supply voltage received by the MCU 130 and may include a passive element 126 for noise removal and voltage level stabilization of the received voltage. For example, the passive element 126 may be a capacitor.

[0048] exist Figure 2 In the embodiment, the driving circuit 125 and the passive element 126 are outside the housing 127, but the present invention is not limited thereto. For example, the driving circuit 125 and / or the passive element 126 may be inside the housing 127 or integrated in the housing 127.

[0049] FIG. 3A to FIG. 3C An implementation example of an imaging device included in a camera module according to example embodiments and an example of a voltage supplied to the imaging device by the PMIC 130 are shown. FIG. 3A to FIG. 3C Components that operate based on a received voltage among components included in the image forming apparatus are shown.

[0050] refer to Figure 3A , the first imaging device 120 - 1 may include an image sensor 122 - 1 , an actuator 124 - 1 , and a driving circuit 125 - 1 , and the second imaging device 120 - 2 may also include an image sensor 122 - 2 , an actuator 124 - 2 , and a driving circuit 125 - 2 .

[0051] The PMIC 130 may generate a plurality of power supply voltages V1 to V7 used in the first imaging device 120-1 and the second imaging device 120-2, for example, the first voltage V1 to the seventh voltage V7, and provide the plurality of power supply voltages V1 to V7 to the first imaging device 120-1 and the second imaging device 120-2. For example, the PMIC 130 may generate the first voltage V1, the fourth voltage V4, and the sixth voltage V6 as the first power supply voltage ( Figure 1 VDD1), generating a second voltage V2, a fifth voltage V5, and a seventh voltage V7 as a second power supply voltage (VDD2) provided to the second imaging device 120-2 Figure 1 VDD2), and generates a third voltage V3 as a third power supply voltage (VDD2) commonly provided to the first imaging device 120-1 and the second imaging device 120-2. Figure 1 However, this is merely an example, and the type and amount of voltages generated by the PMIC 130 may vary.

[0052] The PMIC 130 may output a plurality of power supply voltages V1 to V7 and may provide the plurality of power supply voltages V1 to V7 to corresponding ones of the components of the first imaging device 120 - 1 and the second imaging device 120 - 2 through wirings patterned on the PCB 110 , respectively.

[0053] In the first imaging device 120-1, the image sensor 122-1 may use the first voltage V1 and the third voltage V3 as power supply voltages, the driving circuit 125-1 may use the fourth voltage V4 as the power supply voltage, and the actuator 124-1 may use the sixth voltage V6 as the power supply voltage. The actuator 124-1 may operate under the control of the driving circuit 125-1, for example, based on the first control signal S1.

[0054] In the second imaging device 120-2, the image sensor 122-2 may use the second voltage V2 and the third voltage V3 as power supply voltages, the driving circuit 125-2 may use the fifth voltage V5 as the power supply voltage, and the actuator 124-2 may use the seventh voltage V7 as the power supply voltage. The actuator 124-2 may operate under the control of the driving circuit 125-2, for example, based on the second control signal S2.

[0055] refer to Figure 3B, the first imaging device 120 - 1 may include an image sensor 122 - 1 , an actuator 124 - 1 , and a driving circuit 125 - 1 , and the second imaging device 120 - 2a may include an image sensor 122 - 2 and an actuator 124 - 2 .

[0056] and Figure 3A Compared to the second imaging device 120-2 of the first imaging device 120-1, the second imaging device 120-2a does not include a driving circuit, and the actuator 124-2 of the second imaging device 120-2a may operate under the control of the driving circuit 125-1 provided in the first imaging device 120-1. The actuator 124-2 of the second imaging device 120-2a may operate based on the second control signal S2 provided from the driving circuit 125-1.

[0057] refer to Figure 3C , the first imaging device 120 - 1 may include an image sensor 122 - 1 , an actuator 124 - 1 , and a driving circuit 125 - 1 , and the second imaging device 120 - 2 b may include an image sensor 122 - 2 .

[0058] and Figure 3A Compared with the second imaging device 120 - 2 , the second imaging device 120 - 2 b may not include a driving circuit and an actuator.

[0059] exist FIG. 3B to FIG. 3C In the embodiment, the PMIC 130 may be configured to include a first imaging device 120-1 and a second imaging device ( Figure 3B 120-2a and Figure 3C 120-2b) to generate a voltage and provide the voltage to the first imaging device 120-1 and the second imaging device ( Figure 3B 120-2a and Figure 3C 120-2b) of each component. For example, in Figure 3B In the embodiment, the PMIC 130 may generate the first voltage V1 to the sixth voltage V6 used in the first imaging device 120-1 and the second imaging device 120-2a, and provide the first voltage V1 to the sixth voltage V6 to each corresponding component of the first imaging device 120-1 and the second imaging device 120-2a. Figure 3C In the present invention, the PMIC 130 may generate first to fifth voltages V1 to V5 used in the first imaging device 120 - 1 and the second imaging device 120 - 2 b and provide the first to fifth voltages V1 to V5 to each corresponding component in the first imaging device 120 - 1 and the second imaging device 120 - 2 b.

[0060] Figure 4 A camera module 100 according to an example embodiment of the inventive concept is schematically illustrated.

[0061] refer to Figure 4 , the PMIC 130 may include a plurality of input terminals 31, and receive external power from a first external power voltage VDDe1 and a second external power voltage VDDe2, for example, through some of the plurality of input terminals 31. Passive elements 131-1 to 131-4 may be connected to the plurality of input terminals 31 to remove noise from the received power voltage, or to generate a voltage internally and stabilize the voltage level. The passive elements 131-1 to 131-4 may be, for example, capacitors.

[0062] The PMIC 130 may include a plurality of output terminals 32 , and may output a power supply voltage to the first imaging device 120 - 1 and the second imaging device 120 - 2 through the plurality of output terminals 32 .

[0063] As referenced above Figure 2 As described above, the first imaging device 120-1 and / or the second imaging device 120-2 may include passive components 126-1 to 126-4. Figure 4 As shown, passive components 126 - 1 to 126 - 4 may be connected to input terminals 129 of image sensors 122 - 1 and 122 - 2 .

[0064] At least some of the plurality of output terminals 32 of the PMIC 130 may be connected to the passive elements 126-1 to 126-4. The PMIC 130 may share the passive elements 126-1 to 126-4 with the first imaging device 120-1 and / or the second imaging device 120-2. The PMIC 130 may use the passive elements 126-1 to 126-4 of the first imaging device 120-1 and / or the second imaging device 120-2 to remove noise of the output power supply voltage and stabilize the voltage level. In this way, a separate passive element for removing noise and stabilizing the voltage level from the power supply voltage output to the plurality of output terminals 32 of the PMIC 130 may be omitted, and the PMIC 130 may remove noise of the output power supply voltage and stabilize the voltage level by using the passive elements 126-1 to 126-4 of the first imaging device 120-1 and / or the second imaging device 120-2. Therefore, the number of passive elements included in the camera module 100 may be reduced.

[0065] Figure 5A and Figure 5B is a block diagram schematically illustrating a PMIC 130 a and a PMIC 130 b according to an example embodiment of the inventive concept.

[0066] refer to Figure 5A , the PMIC 130a may include a first voltage generator 131 and a second voltage generator 132. The first voltage generator 131 may generate a voltage provided to the first imaging device ( Figure 1The first power supply voltage VDD1 of the first imaging device 120-1 and the second imaging device ( Figure 1 The third power supply voltage VDD3 of the second imaging device 120-2) and the second voltage generator 132 may generate a second power supply voltage VDD2 provided to the second imaging device 120-2.

[0067] PMIC 130a can receive data from an external processor (e.g., Figure 7 200) receives a control signal and may receive a first enable signal EN1 and a second enable signal EN2.

[0068] The first voltage generator 131 may be activated or deactivated in response to the first enable signal EN1, and the second voltage generator 132 may be activated or deactivated in response to the second enable signal EN2. For example, the first voltage generator 131 and the second voltage generator 132 may be activated in response to the first enable signal EN1 and the second enable signal EN2 of the first level (e.g., logic high), respectively, and may be deactivated in response to the first enable signal EN1 and the second enable signal EN2 of the second level (e.g., logic low), respectively.

[0069] For example, when both the first imaging device 120-1 and the second imaging device 120-2 are operating, the PMIC 130a can receive the first enable signal EN1 and the second enable signal EN2 of the first logic level, and when the first imaging device 120-1 is operating and the second imaging device 120-2 is not operating, the PMIC 130a can receive the first enable signal EN1 of the first logic level and the second enable signal EN2 of the second logic level.

[0070] refer to Figure 5B , the PMIC 130b may include a first voltage generator 131, a second voltage generator 132, and a third voltage generator 133. The first voltage generator 131 may generate a voltage provided to the first imaging device ( Figure 1 The second voltage generator 132 may generate a first power supply voltage VDD1 provided to the second imaging device ( Figure 1 The third voltage generator 133 may generate a third power supply voltage VDD3 commonly provided to the first imaging device 120-1 and the second imaging device 120-2. The first voltage generator 131, the second voltage generator 132, and the third voltage generator 133 may be activated or deactivated in response to the first enable signal EN1, the second enable signal EN2, and the third enable signal EN3, respectively.

[0071] FIG. 6A to FIG. 6D1 is a diagram schematically illustrating a layout of a camera module 100 according to an exemplary embodiment of the inventive concept. Figures 6A to 6D The position of the PMIC 130 on the layout of the camera module 100 is described.

[0072] refer to Fig. 6A , the first imaging device 120-1 and the second imaging device 120-2 may be arranged on the PCB 110 in parallel to the first direction (X-axis direction), and the PMIC 130 may be located between the connector 140 and the first imaging device 120-1 and the second imaging device 120-2 in a second direction (Y-axis direction) perpendicular to the first direction. In an example embodiment, the PMIC 130 may be between the first imaging device 120-1 and the second imaging device 120-2 in the first direction.

[0073] like Figure 6B As shown, the PMIC 130 may be between the first imaging device 120 - 1 and the second imaging device 120 - 2 .

[0074] like Fig. 6A and Figure 6B As shown, the PMIC 130, the connector 140, and the first and second imaging devices 120-1 and 120-2 may be arranged so that the distance between the connector 140 and the PMIC 130 and the distance between the first and second imaging devices 120-1 and 120-2 and the PMIC 130 may be minimized or reduced.

[0075] refer to Figure 6C , the PMIC 130 may be in the housing 127 of the first imaging device 120-1 or the second imaging device 120-2. For example, as shown, the PMIC 130 may be in the housing 127 of the first imaging device 120-1. In one embodiment, the PMIC 130 may be adjacent to the first imaging device 120-1. In another embodiment, the PMIC 130 may be within the housing 127 of the imaging device that shares space with the first imaging device 120-1 and the second imaging device 120-2.

[0076] refer to Fig.6D , the connector 140 and the FPCB 150 may be connected to one side of the PCB 110. The PMIC 130 may also be on one side of the PCB 110, for example, the side closest to the connector 140, so as to minimize or reduce the distance between the PMIC 130 and the connector 140.

[0077] refer to FIG. 6A to FIG. 6D, the position of the PMIC 130 on the layout of the camera module 100 according to the example embodiment is described above. However, the embodiment is not limited thereto, and the position of the PMIC 130 on the camera module 100 may be changed based on considerations such as wiring efficiency, manufacturing restrictions, etc.

[0078] Figure 7 is a block diagram schematically illustrating an imaging device 1000 including a camera module 100 according to an example embodiment of the inventive concept.

[0079] refer to Figure 7 , the imaging device 1000 may include a camera module 100, a processor 200, and a power supply 300. The processor 200 and the power supply 300 may be mounted on a main board 400 of the imaging device 1000. The camera module 100 may be mounted on the main board 400 or connected to the main board 400 through a connector 140.

[0080] Processor 200 may be any other processor configured to execute program instructions stored in a central processing unit (CPU), a microprocessor, an ARM processor, an X86 processor, a MIPS processor, a graphics processing unit (GPU), or a microprocessor of a general purpose GPU.

[0081] The processor 200 may provide the camera module 100 with a control signal CS for controlling the camera module 100. The camera module 100 may receive an instruction or command for the control signal CS through the connector 140. For example, the control signal CS may include setting registers of the first imaging device 120-1, the second imaging device 120-2, and the PMIC 130, or an enable signal for controlling the operation thereof, etc.

[0082] The power supply source 300 may be a battery or a main PMIC of the imaging device 1000. The power supply source 300 may supply a power supply voltage (ie, an external power supply voltage VDDe) output from the power supply source 300 through the connector 140 to the PMIC 130.

[0083] The camera module 100 may be connected to other components of the imaging device 1000. For example, the camera module 100 may be connected to the power supply source 300 and the processor 200 through the connector 140, and may transmit or receive signals or voltages through a plurality of pins 141 of the connector 140.

[0084] Fig. 8A is a block diagram showing an imaging device 1000' including a camera module 100' according to a comparative example, Figure 8B is a block diagram illustrating an imaging device 1000 including a camera module 100 according to an example embodiment of the inventive concept.

[0085] refer to Fig. 8A , the camera module 100' according to the comparative example may include a first imaging device 120-1 and a second imaging device 120-2, and a PMIC 130' that provides a power supply voltage (eg, voltages V1 to V7) to the camera module 100' may be mounted on a mainboard 400 of the imaging apparatus 1000'.

[0086] The PMIC 130' may generate voltages V1 to V7 based on the external power supply voltages VDDe1 and VDDe2 provided from the power supply source 300, and provide the voltages V1 to V7 to the first imaging device 120-1 and the second imaging device 120-2 of the camera module 100' through the connector 140' of the camera module 100'. Therefore, at least seven pins among the plurality of pins 141 of the connector 140' may transmit the voltages V1 to V7.

[0087] refer to Figure 8B , the camera module 100 according to the example embodiment may include a first imaging device 120-1, a second imaging device 120-2, and a PMIC 130. The PMIC 130 may receive external power supply voltages VDDe1 and VDDe2 from a power supply source 300 mounted on a main board 400 of the imaging device 1000 through a connector 140, generate voltages V1 to V7 based on the received external power supply voltages VDDe1 and VDDe2, and provide the voltages V1 to V7 to the first imaging device 120-1 and the second imaging device 120-2. Therefore, two of the plurality of pins 141 of the connector 140 may transmit the external power supply voltages VDDe1 and VDDe2. Therefore, the number of pins of the connector of the camera module 100 according to the example embodiment may be reduced compared to the camera module 100' according to the comparative example.

[0088] At the same time, reference Fig. 8A and Figure 8B , in the camera module 100, since the PMIC 130 is installed in the camera module 100, the distance D2 between the first imaging device 120-1 and the second imaging device 120-2 and the PMIC 130 can be minimized or reduced. Therefore, in the imaging apparatus 1000 to which the camera module 100 is attached, the distance D2 between the PMIC 130 and the first imaging device 120-1 and the second imaging device 120-2 can be relatively shorter than the distance D1 between the PMIC 130' and the first imaging device 120-1 and the second imaging device 120-2 in the imaging apparatus 1000'. Therefore, the relatively short distance D2 can minimize or reduce noise in the voltages V1 to V7 transmitted to the first imaging device 120-1 and the second imaging device 120-2, and can minimize or reduce IR drop on the wires, and thus eliminate, reduce or minimize power supply noise.

[0089] In addition, Fig. 8A In the imaging device 1000', passive elements may be connected to the output terminal side of the PMIC 130' to remove noise and stabilize the voltage levels of the voltages V1 to V7 output from the PMIC 130'. Figure 4 As described above, in the camera module 100 , the PMIC 130 may use passive components of the first imaging device 120 - 1 and the second imaging device 120 - 2 , thereby sharing the passive components and reducing the number of passive components mounted on the imaging apparatus 1000 .

[0090] Fig. 9 is a block diagram schematically illustrating a camera module 100 b according to example embodiments.

[0091] refer to Fig. 9 , the camera module 100b may include a first imaging device 120-1, a second imaging device 120-2, a third imaging device 120-3, a PMIC 130, and a connector 140. The first imaging device 120-1, the second imaging device 120-2, the third imaging device 120-3, and the PMIC 130 may be on the PCB 110, and may transmit and receive signals or voltages to and from the outside of the camera module 100b through the connector 140. In an embodiment, the connector 140 may be connected to the PCB 110 through the FPCB 150.

[0092] The PMIC 130 may generate a plurality of power supply voltages VDD1, VDD2, VDD3, and VDD4 based on an external power supply voltage VDDe received from outside the camera module 100b through the connector 140, and provide the power supply voltages VDD1, VDD2, VDD3, and VDD4 to the first, second, and third imaging devices 120-1, 120-2, and 120-3.

[0093] Fig.10 It is a schematic diagram showing the Fig. 9 FIG. 1 is a diagram of a layout of a camera module 100 b of an example embodiment.

[0094] refer to Fig.10, the first imaging device 120-1, the second imaging device 120-2, and the third imaging device 120-3 may be arranged on the PCB 110 in parallel with the first direction (i.e., along the X-axis). The PMIC 130 may be between the connector 140 and the first, second, and third imaging devices 120-1 to 120-3 in a second direction (Y-axis direction) perpendicular to the first direction. In one embodiment, the PMIC 130 may be at the lower end of the second imaging device 120-2. Therefore, the distance between the connector 140 and the PMIC 130 and the distance between the first, second, and third imaging devices 120-1 to 120-3 and the PMIC 130 may be minimized or reduced.

[0095] Fig.11 is a block diagram schematically illustrating a camera module 100c according to example embodiments.

[0096] refer to Fig.11 , the camera module 100c may include an imaging device 120, a PMIC 130, and a connector 140. The imaging device 120 and the PMIC 130 may be on a PCB 110. The connector 140 may be connected to the PCB 110 directly or through a FPCB 150.

[0097] The camera module 100c may include an image sensor 122, an actuator 124, and a driving circuit 125, and the PMIC 130 may generate a power supply voltage for the actuator 124, the image sensor 122, and the driving circuit 125 based on an external power supply voltage VDDe received through the connector 140, and provide the voltage to the image sensor 122, the actuator 124, and the driving circuit 125.

[0098] At the same time, as referenced Figure 4 As described, the PMIC 130 may share passive elements with the imaging device 120. For example, an output terminal for outputting a voltage supplied to the image sensor 122 among the output terminals of the PMIC 130 may be connected to the passive element 126 connected to the input terminal of the image sensor 122. As a result, the passive element 126 connected to the input terminal of the image sensor 122 may stabilize the voltage level of the voltage supplied to the image sensor 122 and remove or reduce noise.

[0099] Fig. 12A and Fig. 12B It is a schematic diagram showing the Fig.11 FIG. 1 is a diagram of a layout of a camera module 100 c of an example embodiment.

[0100] refer to Fig. 12A , the PMIC 130 may be on the PCB 110 between the imaging device 120 and the connector 140. Alternatively, as Fig. 12BAs shown, the PMIC 130 may be within the housing 127 of the imaging device 120 .

[0101] Fig.13A , Fig. 13B and Fig. 13C 1 is a block diagram schematically illustrating imaging devices 1000a, 1000b, and 1000c including camera modules 101, 102, and 103 according to an example embodiment of the inventive concept. The imaging devices 1000a, 1000b, and 1000c may include a plurality of camera modules 101, 102, and 103 including PMICs 130-1, 130-2, and 130-3.

[0102] refer to Fig.13A The imaging device 1000a may include a first camera module 101, a second camera module 102, and a power supply 300. The imaging device 1000a may further include a processor configured to generate a control signal for controlling the first camera module 101 and the second camera module 102.

[0103] The first camera module 101 may include a plurality of imaging devices, for example, a first imaging device 120-1 and a second imaging device 120-2, a first PMIC 130-1, and a first connector 140-1. The first imaging device 120-1, the second imaging device 120-2, and the first PMIC 130-1 may be on a first PCB 111. The first connector 140-1 may be directly connected to the first PCB 111 through an FPCB 151 or by other means.

[0104] The second camera module 102 may include at least one imaging device, such as a third imaging device 120-3, a second PMIC 130-2, and a second connector 140-2. The third imaging device 120-3 and the second PMIC 130-2 may be on the second PCB 112. The second connector 140-2 may be connected to the second PCB 112 through the FPCB 152 or directly. In one embodiment, the power consumption of at least one imaging device (e.g., the third imaging device 120-3) may be relatively higher than the power consumption of other imaging devices (e.g., the first imaging device 120-1 and the second imaging device 120-2), or may be relatively higher than the sum of the power consumption of the first imaging device 120-1 and the power consumption of the second imaging device 120-2.

[0105] The first camera module 101 and the second camera module 102 may be connected to the main board 400 of the imaging device 1000a through connectors 140-1 and 140-2, respectively. The power supply source 300 may provide a first external power supply voltage VDDe1 to the first PMIC 130-1 of the first camera module 101 through the first connector 140-1, and may provide a second external power supply voltage VDDe2 to the second PMIC 130-2 of the second camera module 102 through the second connector 140-2.

[0106] refer to Fig. 13B , the imaging device 1000 b may include a first camera module 101 , a second camera module 102 , and a power supply source 300 .

[0107] The first camera module 101 may include a first imaging device 120-1, a first PMIC 130-1, and a first connector 140-1, and the second camera module 102 may include a second imaging device 120-2, a second PMIC 130-2, and a second connector 140-2. In this way, each of the first camera module 101 and the second camera module 102 may include one imaging device, and the PMIC may be mounted on the camera module.

[0108] In one embodiment, the first camera module 101 and the second camera module 102 may operate synchronously with each other. For example, a synchronization signal SYNC may be transmitted and received between the first camera module 101 and the second camera module 102 through the connectors 140-1 and 140-2, and the first PMIC 130-1 and the second PMIC 130-2 may generate a power supply voltage based on an operation time according to the synchronization signal SYNC. For example, the first PMIC 130-1 in the first camera module 101 may provide the synchronization signal SYNC to the second PMIC 130-2 in the second camera module 102, and the second PMIC 130-2 may generate a power supply voltage for the second imaging device 120-2 based on the synchronization signal SYNC. For example, the synchronization signal SYNC may include a timing signal, an on / off signal of the camera module, etc.

[0109] refer to Fig. 13C, the imaging device 1000c may include a first camera module 101, a second camera module 102, and a third camera module 103. Each of the first camera module 101, the second camera module 102, and the third camera module 103 may include one of the imaging devices 120-1, 120-2, and 120-3 and one of the PMICs 130-1, 130-2, and 130-3. The PMICs 130-1, 130-2, and 130-3 provided in the first camera module 101, the second camera module 102, and the third camera module 103, respectively, may generate power supply voltages VDD1, VDD2, and VDD3 based on voltages VDDe1, VDDe2, and VDDe3 received from the power supply source 300 through the connectors 140-1, 140-2, and 140-3, respectively, and provide the power supply voltages VDD1, VDD2, and VDD3 to the imaging devices 120-1, 120-2, and 120-3.

[0110] In one embodiment, similar to reference Fig. 13B As described above, the first camera module 101, the second camera module 102, and the third camera module 103 may be operated synchronously with each other. For example, a synchronization signal SYNC may be transmitted and received between the first camera module 101, the second camera module 102, and the third camera module 103 through the connectors 140-1, 140-2, and 140-3, and the PMICs 130-1, 130-2, and 130-3 may generate a power supply voltage based on an operation time according to the synchronization signal SYNC.

[0111] Fig.14 A camera module 20 having a folded structure using a refraction device according to an example embodiment of the inventive concept is schematically illustrated.

[0112] refer to Fig.14 , the camera module 20 may include a first imaging device 120-1, a second imaging device 120-2, a PMIC 130, a first refraction device 161, and a second refraction device 162. The first refraction device 161 and the second refraction device 162 may include a prism, a reflector, a beam splitter, and the like.

[0113] The first refraction device 161 may refract (or reflect) an optical signal received from the outside of the camera module 20 in a direction (e.g., Y-axis direction) in which the first imaging device 120-1 is located. The second refraction device 162 may refract the refracted optical signal in a direction (e.g., X-axis direction) in which the second imaging device 120-2 is located, or transmit the optical signal in the direction of the first imaging device 120-1.

[0114] The first imaging device 120-1 may be mounted on the first PCB 111, and the second imaging device 120-2 may be mounted on the second PCB 112. The PMIC 130 may be mounted on at least one of the first PCB 111 and the second PCB 112. A connector may be connected to at least one of the first PCB 111 and the second PCB 112. In one embodiment, the first PCB 111 and the second PCB 112 may be connected by an FPCB.

[0115] Fig.15A and 15B A cross-sectional view of a camera module according to an example embodiment of the inventive concept is schematically illustrated. Fig.15A and Fig. 15B Observe in the third direction (Z axis direction) Fig.14 20 is a cross-sectional view of a camera module 20.

[0116] refer to Fig.15A , in the camera module 20a, the connector 140 may be connected to the first PCB 111 directly or through the FPCB 150, and the PMIC 130 may be mounted on the first PCB 111. The first PCB 111 and the second PCB 112 may be connected through the FPCB 150-1.

[0117] The PMIC 130 may generate power supply voltages VDD1 and VDD2 for the first imaging device 120-1 and the second imaging device 120-2 using external power supply voltages VDDe1 and VDDe2 received from the outside through the connector 140. The PMIC 130 may provide the power supply voltage VDD1 to the first imaging device 120-1 through wiring patterned on the first PCB 111, and provide the power supply voltage VDD2 to the second imaging device 120-2 through wiring patterned on the FPCB 150-1 and the second PCB 112.

[0118] refer to Fig. 15B In the camera module 20b, the first connector 140-1 and the second connector 140-2 may be connected to the first PCB 111 and the second PCB 112 directly or through the FPCBs 151 and 152, respectively. The first imaging device 120-1 and the first PMIC 130-1 may be mounted on the first PCB 111, and the second imaging device 120-1 and the second PMIC 130-2 may be mounted on the second PCB 112.

[0119] The first PMIC 130-1 may generate a power supply voltage VDD1 for the first imaging device 120-1 based on an external power supply voltage VDDe received from the outside through the first connector 140-1. The second PMIC 130-2 may generate a power supply voltage VDD2 for the second imaging device 120-2 based on an external power supply voltage received from the outside through the second connector 140-2.

[0120] Fig.16A and Fig. 16B A camera module according to an example embodiment of the inventive concept is schematically illustrated.

[0121] refer to Fig.16A , the camera module 30 a may include a first imaging device 120 - 1 , a second imaging device 120 - 2 , a PMIC 130 , a connector 140 , a first refraction device 161 , and a second refraction device 162 .

[0122] The first imaging device 120-1, the second imaging device 120-2, and the PMIC 130 may be mounted on the PCB 110. The connector 140 may be connected to the PCB 110 through the FPCB 150. The PMIC 130 may be on the PCB 110 between the first imaging device 120-1 and the second imaging device 120-2.

[0123] The first refraction device 161 and the second refraction device 162 may refract the received light in the direction in which the first imaging device 120-1 and the second imaging device 120-2 are located (for example, in the Y-axis direction). The first imaging device 120-1 and the second imaging device 120-2 may receive optical signals by refracting the light by the first refraction device 161 and the second refraction device 162, and respectively generate images based on the optical signals.

[0124] refer to Fig. 16B , in the camera module 30b, the connector 140 may be connected to one side of the PCB 110. The PMIC 130 may be in an area on the PCB 110 close to the connector 140.

[0125] Fig.17 is a block diagram illustrating a portable terminal including a camera module according to an exemplary embodiment of the inventive concept.

[0126] refer to Fig.17 , the portable terminal 2000 may include an application processor 2100, a camera module 2200, a working memory 2400, a storage 2500, a display device 2600, a wired / wireless transceiver 2700, and a user interface 2800. The portable terminal 2000 may also include other components for providing functions, for example, an audio sensor device, etc.

[0127] The application processor 2100 may control the overall operation of the portable terminal 2000 and may include a system on chip (SoC) for driving an application program, an operating system, etc. The application processor 2100 may control the camera module 2200, generate a control signal for controlling the camera module 2200, and provide the control signal to the camera module 2200 through a connector of the camera module 2200.

[0128] The camera module according to the above-described various embodiments may be used as the camera module 2200. The camera module 2200 may include a PMIC 2300. The PMIC 2300 may be mounted on a PCB together with one or more imaging devices, and may generate a power supply voltage VDD used in the camera module 2200 based on an external power supply voltage VDDe received through a connector.

[0129] The working memory 2400 may include a volatile memory such as a dynamic random access memory (DRAM), a static RAM (SRAM), etc., or a nonvolatile resistive memory such as a ferroelectric RAM (FeRAM), a resistive RAM (RRAM), a phase change RAM (PRAM), etc. The working memory 2400 may store programs and / or data processed or executed by the application processor 2100.

[0130] The storage 2500 may include a non-volatile storage device such as a NADN flash memory, a resistive memory, etc. For example, the storage 2500 may be configured as a memory card such as a multimedia card (MMC), an embedded MMC (eMMC), a secure digital (SD) card, etc. The storage 2500 may store images received from the application processor 2100 or the camera module 2200. In addition, the storage 2500 may store data and / or programs for running algorithms that implement the functions of the application processor 2100. When the application processor 2100 is running, the data and / or programs may be loaded onto the working memory 2400 when the application processor 2100 is running.

[0131] The display device 2600 may include a liquid crystal display (LCD), a light emitting diode (LED) display, an organic LED (OLED) display, an active matrix OLED (AMOLED) display, an electrochromic display (ECD), a digital mirror device (DMD) display, an actuated mirror device (AMD), a grating valve (GLV) display, a plasma display panel (PDP) display, an electroluminescent display (ELD), a vacuum fluorescent display (VFD), or any other type of flat panel or flexible panel. The display device 2600 may receive an image from the application processor 2100 or the camera module 2200 and display the received image.

[0132] The wireless transceiver 2700 may include a transceiver 2710, a modem 2720, and an antenna 2730. The wireless transceiver 2700 may communicate with external devices.

[0133] The user interface 2800 may include various devices capable of receiving user input, such as a keyboard, a keypad, a touch panel, a fingerprint sensor, a microphone, etc. The user interface 2800 may receive the user input and provide a signal input corresponding to the received user input to the application processor 2100 .

[0134] While the inventive concept has been particularly shown and described, it will be understood that various changes in form and details may be made therein without departing from the spirit and scope of the appended claims.

Claims

1. A camera module, comprising: Printed circuit board (PCB); a first imaging device on the PCB, the first imaging device being configured to generate first image data based on the received light signal; a second imaging device on the PCB, the second imaging device being configured to generate second image data based on the received light signal; a power management integrated circuit (PMIC) on the PCB, the PMIC configured to generate a plurality of power supply voltages based on an external power supply voltage received from an external power supply source, the plurality of power supply voltages including a first power supply voltage and a second power supply voltage, and the PMIC configured to provide at least the first power supply voltage to the first imaging device and the second power supply voltage to the second imaging device; a capacitor connected to at least one output terminal of the PMIC and at least one input terminal of an image sensor included in the first imaging device, the capacitor being shared by the PMIC and the first imaging device; as well as The connector is configured to receive an external power supply voltage from an external power supply source and provide the external power supply voltage to the PMIC.

2. The camera module according to claim 1, wherein: The plurality of power supply voltages further include a third power supply voltage, and the PMIC is configured to provide the third power supply voltage of the plurality of power supply voltages to the first imaging device and the second imaging device.

3. The camera module according to claim 1, wherein The first imaging device includes a first lens and a first image sensor, the first lens is configured to collect a light signal, and the first image sensor is configured to convert the light signal into a first image signal, and The second imaging device includes a second lens and a second image sensor, the second lens is configured to collect the light signal, and the second image sensor is configured to convert the light signal into a second image signal.

4. The camera module according to claim 3, wherein The first imaging device also includes an actuator coupled to the first lens to move the first lens; and The drive circuit is configured to control the actuator.

5. The camera module according to claim 1, wherein The PMIC includes a first voltage generator and a second voltage generator; A first voltage generator is configured to provide a first power supply voltage to a first imaging device; as well as a second voltage generator configured to provide a second supply voltage to a second imaging device; The first voltage generator and the second voltage generator are activated or deactivated in response to an enable signal received through the connector.

6. The camera module according to claim 2, wherein: The PMIC is configured to adjust a voltage level of a first power supply voltage, a second power supply voltage, or a third power supply voltage provided to at least one of the first imaging device and the second imaging device based on a feedback signal received from at least one of the first imaging device and the second imaging device.

7. The camera module according to claim 1, wherein: The first imaging device and the second imaging device are arranged on the PCB in parallel with the first direction, and the PMIC is between the connector and the first imaging device and the second imaging device.

8. The camera module according to claim 1, wherein: The PMIC is located in a housing of the first imaging device or the second imaging device.

9. The camera module according to claim 1, wherein: The connector is adjacent to the first imaging device, and the PMIC is between the first imaging device and the connector.

10. The camera module according to claim 1, wherein: The first image data and the second image data are different in image characteristics.

11. The camera module according to claim 1, further comprising a third imaging device on the PCB, the third imaging device being configured to generate a third image signal based on the received light signal; in, The plurality of power supply voltages include a third power supply voltage supplied to a third imaging device. 12 . The camera module of claim 1 , further comprising a refracting device configured to refract the received light signal toward the first imaging device and the second imaging device.

13. A camera module, comprising: a first imaging device mounted on a first printed circuit board (PCB), the first imaging device being configured to generate a first image signal based on the received light signal; a second imaging device configured to generate a second image signal based on the received light signal; a first refraction device configured to refract the received optical signal toward the first imaging device; a power management integrated circuit (PMIC) mounted on the first PCB, the PMIC configured to provide a first power supply voltage to the first imaging device; a capacitor connected to at least one output terminal of the PMIC and at least one input terminal of an image sensor included in the first imaging device, the capacitor being shared by the PMIC and the first imaging device; as well as A connector is configured to receive a power supply voltage and provide the power supply voltage to the PMIC.

14. The camera module of claim 13, wherein The PMIC includes a plurality of output terminals, the plurality of output terminals including a first output terminal, and The first imaging device includes passive components, in, A first output terminal among the plurality of output terminals is configured to output a first power supply voltage provided to the first imaging device.

15. The camera module of claim 13, wherein The second imaging device is mounted on a second PCB connected to the first PCB through a connecting member, and The PMIC is configured to provide a second voltage to the second imaging device.

16. The camera module according to claim 13, further comprising The second refraction device is configured to refract the refracted light signal toward the second imaging device.

17. An imaging device comprising: a first camera module including at least one first camera assembly and a first PMIC on a first printed circuit board (PCB) and a connector electrically connected to the first PCB and including a plurality of pins, The at least one first camera assembly is configured to generate image data, and The first PMIC is configured to generate a plurality of power supply voltages based on a power supply voltage received through the connector and provide the plurality of power supply voltages to the at least one first camera component; a power supply configured to provide a power supply voltage to the first camera module through at least one pin of the plurality of pins of the connector; as well as a processor configured to provide a control signal to the first camera module through at least one of the plurality of pins of the connector, The first PMIC is configured to share a capacitor with an image sensor included in at least one first camera assembly, the capacitor being connected to at least one output terminal of the PMIC and at least one input terminal of the image sensor.

18. The imaging device according to claim 17, further comprising a second camera module comprising at least a second camera assembly and a second PMIC, The second PMIC is configured to provide a plurality of voltages to the at least one second camera component.

19. The imaging device according to claim 17, wherein: The first PMIC is configured to share passive elements with an image sensor included in at least one camera assembly among the plurality of camera assemblies.

Images