Chip solution device for driving a display panel

Abstract

The present invention discloses a chip solution device for driving a display panel. The device for driving a display panel includes: a display driver integrated circuit (IC) configured to send image data to the display panel; a display control IC configured to receive compressed image data from a host and including a timing controller configured to control the display driver IC; and a non-volatile memory configured to send data to and receive data from the display control IC and configured to store driving parameters necessary for the operation of the display driver IC.

Description

[0001] Cross - reference to related applications

[0002] This application claims the benefit of Korean Patent Application Nos. 10 - 2019 - 0079872, filed on July 3, 2019, and 10 - 2020 - 0031864, filed on March 16, 2020, under 35 USC 119(a), and the entire disclosure of the applications is incorporated herein by reference for all purposes. Technical field

[0003] The following description relates to a chip - solution device for driving a display panel. Background art

[0004] Recently, as the size of the screen of a mobile terminal has increased and the number of channels for high resolution has increased, two or more driving chips for driving a display panel can be used.

[0005] A typical method may include an example of a chip in which a timing controller is embedded for driving a display panel, and this chip may provide an example of a chip - solution device for driving a display panel. Summary of the invention

[0006] The present invention content is provided to introduce some concepts that will be further described in the detailed description in a simplified form. The present invention content is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to help determine the scope of the claimed subject matter.

[0007] In one general aspect, a device for driving a display panel includes: a display driving integrated circuit (IC) configured to send received image data to the display panel; a display control IC configured to receive compressed image data from a host and including a timing controller configured to control the display driving IC; and a non - volatile memory configured to send data to and receive data from the display control IC and configured to store driving parameters necessary for the operation of the display driving IC.

[0008] The display driving IC may include a first logic module and a driving interface module, the first logic module being configured to send image data to the display panel, and the display control IC may include a second logic module, a volatile memory, and a control interface module, the second logic module being configured to perform image processing based on the compressed image data received from the host and based on access to the non - volatile memory.

[0009] The driving interface module may communicate with the display control IC using a Mobile Industry Processor Interface (MIPI) method.

[0010] The driving interface module may have a frequency bandwidth that is approximately 0.75 times to 2 times the frequency bandwidth of the control interface module.

[0011] The first logic module may include analog control logic configured to drive a display driver IC, and the second logic module may include a timing controller configured to generate a clock signal for driving the display driver IC.

[0012] The display driver IC may further include a first one-time programmable (OTP) memory configured to store analog parameters for driving a display panel, and the display control IC may further include a second OTP memory configured to store at least one imaging parameter for image processing.

[0013] The at least one imaging parameter may include any one or any combination of two or more of image enhancement parameters, image compression / restore parameters, and panel compensation parameters.

[0014] The display control IC may be configured to: receive compressed image data from a host, store the compressed image data in a volatile memory, process and restore the compressed image data based on imaging parameters in the second logic module, and send the compressed image data to the display driver IC.

[0015] The control interface module may communicate with the host and the display driver IC using the Mobile Industry Processor Interface (MIPI) method, and the control interface module may communicate with the non-volatile memory using the Serial Peripheral Interface (SPI) method.

[0016] The display driver IC may include a source amplifier and a gamma module, and the source amplifier is configured to send image data to be displayed on the display panel.

[0017] The display driver IC may include a power / analog module configured to self-generate a power voltage for driving the display panel.

[0018] According to the display panel specifications, the power voltage generated by the power / analog module may be from 1.8V to 30V.

[0019] The display driver IC may be manufactured using a fine process, and the display control IC may be manufactured using an ultra-fine process.

[0020] In another general aspect, a device for driving a display panel includes: a display driving integrated circuit (IC) configured to send received image data to the display panel; a display control IC configured to receive compressed image data from a host and configured to restore the received data for sending to the display driving IC; and a non-volatile memory configured to send data to and receive data from the display control IC and configured to store driving parameters for operating the display driving IC.

[0021] The display control IC may include a data compressor configured to recompress the compressed image data received from the host after restoration, wherein the display driving IC may include a data restorer configured to restore the recompressed and sent image data.

[0022] The ratio of recompressing the image data in the data compressor may be a ratio lower than the ratio for the compressed image data received from the host.

[0023] The display control IC may communicate with the host and the display driving IC using a Mobile Industry Processor Interface (MIPI) method and may communicate with the non-volatile memory using a Serial Peripheral Interface (SPI) method.

[0024] The display driving IC may be manufactured using a fine process, and the display control IC may be manufactured using an ultra-fine process.

[0025] In another general aspect, a device for driving a display panel includes: a display driving integrated circuit (IC) configured to send received image data to the display panel; a display control IC configured to receive compressed image data from a host and including a timing controller configured to control the display driving IC; and a non-volatile memory configured to send data to and receive data from the display control IC and configured to store driving parameters for operating the display driving IC.

[0026] The display driving IC and the display control IC may communicate using a Mobile Industry Processor Interface (MIPI) method.

[0027] In another general aspect, a device for driving a display panel includes: a display driving integrated circuit (IC) configured to send image data to the display panel and including analog control logic configured to drive the display driving IC; a display control IC configured to receive compressed image data and including a timing controller configured to control the display driving IC by generating a clock signal; and a memory configured to exchange data with the display control IC and configured to store driving parameters used by the display driving IC.

[0028] The memory can be a non-volatile memory.

[0029] The display control IC may further include a volatile memory and a control interface module, and the display control IC is configured to perform image processing based on access to the non-volatile memory and based on the compressed image data received from a host.

[0030] The display driving IC may further include a driving interface module configured to send image data to the display panel.

[0031] Other features and aspects will become apparent from the following detailed description, the drawings, and the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Shows an example of a chip for driving a display panel.

[0033] Figure 2 Shows an example of a chip solution device for driving a display panel.

[0034] Figure 3 Shows a schematic configuration of the chip solution device for driving a display panel in this example.

[0035] Figure 4 Shows Figure 3 Another configuration of the chip solution device for driving a display panel shown in the example of.

[0036] Figure 5 Shows in more detail Figure 3 The schematic configuration diagram shown in the example of.

[0037] Figure 6 Is Figure 5 The first example of the chip solution device for driving a display panel shown in the example of reconstructed according to the image data stream.

[0038] Figure 7 Is Figure 5A second example of a chip solution device for driving a display panel, reconstructed according to an image data stream, as shown in the example of

[0039] Figure 8 is Figure 5 A third example of a chip solution device for driving a display panel, reconstructed according to an image data stream, as shown in the example of

[0040] Figures 9 to 11 The first to third examples of the module packaging method of the chip solution device for driving a display panel shown in this example are shown.

[0041] Throughout the drawings and the detailed description, the same reference numerals refer to the same elements. The drawings may not be drawn to scale, and for clarity, illustration, and convenience, the relative dimensions, proportions, and depictions of the elements in the drawings may be exaggerated. Detailed Description

[0042] The following detailed description is provided to assist the reader in obtaining a comprehensive understanding of the methods, devices, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, devices, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, except for operations that must occur in a certain order, the sequence of operations described herein is merely an example and is not limited to the sequence of operations set forth herein, but may be changed as will be apparent after understanding the disclosure of this application. Moreover, descriptions of features known in the art may be omitted for increased clarity and brevity.

[0043] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided only to illustrate some of the many possible ways of implementing the methods, devices, and / or systems described herein, which will be apparent after understanding the disclosure of this application.

[0044] Throughout the specification, when an element such as a layer, region, or substrate is described as "on", "connected to", or "coupled to" another element, the element may be directly "on", "connected to", or "coupled to" the other element, or there may be one or more other elements between the element and the other element. In contrast, when an element is described as "directly on", "directly connected to", or "directly coupled to" another element, there can be no other elements between the element and the other element.

[0045] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more of the associated listed items.

[0046] Although terms such as "first", "second", and "third" may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Rather, these terms are only used to distinguish one component, part, region, layer, or section from another. Thus, a first component, part, region, layer, or section referred to in an example described herein may also be referred to as a second component, part, region, layer, or section without departing from the teachings of the example.

[0047] For ease of description, spatial relative terms such as "above", "on", "below", and "beneath" may be used herein to describe the relationship of one element to another as shown in the figures. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation shown in the figures. For example, if the device in the figures is flipped, an element described as "above" or "on" another element will be "below" or "beneath" the other element. Thus, the term "above" includes both the above and below orientations depending on the spatial orientation of the device. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein are to be interpreted accordingly.

[0048] The terms used herein are only for the purpose of describing various examples and are not intended to limit the disclosure. Unless the context clearly dictates otherwise, the articles "a", "an", and "the" are also intended to include the plural forms. The terms "comprises", "comprising", and "having" specify the presence of the stated features, numbers, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, components, elements, and / or combinations thereof.

[0049] Due to manufacturing techniques and / or tolerances, the shapes shown in the figures may vary. Thus, the examples described herein are not limited to the specific shapes shown in the figures, but include variations in the shapes that occur during manufacturing.

[0050] It should be noted herein that for an example or embodiment, the use of the term "may", such as what an example or embodiment may include or achieve, means that there is at least one example or embodiment that includes or achieves such a feature, and all examples and embodiments are not limited thereto.

[0051] In another aspect, unless otherwise defined, all terms used in this specification should be considered to have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains after understanding this disclosure. Thus, unless explicitly defined herein after understanding this disclosure, certain terms should not be construed in an overly ideal or formal sense.

[0052] In addition, when introducing manufacturing or material tolerances specific to the stated meaning, terms such as "about" and "substantially" in this specification are used in the sense of or close to the numerical value, and are used to prevent unreasonable abusers from overusing the disclosure with exact or absolute numbers to aid in understanding this disclosure.

[0053] As will become apparent after understanding the disclosure of this application, the features of the examples described herein can be combined in various ways. In addition, although the examples described herein have various configurations, as will become apparent after understanding the disclosure of this application, other configurations are possible.

[0054] Figure 1 An example of a chip in which a timing controller is embedded for driving a display panel is shown.

[0055] Refer to Figure 1 In a non-limiting example, the display device may include a display panel 1, a display driving integrated circuit (IC) 10, a non-volatile memory 20, and a host 2.

[0056] The non-volatile memory 20 may store information having a large size in the command signal, such as parameters such as register values or driving information of the display driving IC 10. The display driving IC 10 may process the data and command signals received from the host 2 based on the information of the non-volatile memory 20, and may send such signals to the display panel 1. The display panel 1 may display an image based on the data and command signals received from the display driving IC 10.

[0057] Between the host 2 and the display driving IC 10, data compressed by the display stream compression (DSC) method may be transmitted / received according to the Mobile Industry Processor Interface (MIPI) convention. Between the display driving IC 10 and the non-volatile memory 20, data may be transmitted and received by the Serial Peripheral Interface (SPI) method.

[0058] The host 2 can send the image data to be displayed on the display panel 1 to the display driving IC 10 in a compressed format. Then, the display driving IC 10 can restore the compressed image data at the frame memory module and subsequently send the image data to the display panel 1. In this way, as a non-limiting example, the display driving IC for mobile operations can generally be implemented as a single chip, and due to the increase in resolution, the increase in data processing functions, and the use of high-speed interfaces and large-capacity memories such as dynamic random access memory DRAM, static random access memory SRAM, etc., the display driving IC for high-resolution mobile operations can use a very fine process. However, even if the analog block can be implemented by means of such a very fine process, the physical area of the analog block will not decrease, and due to the use of the very fine process, the area occupied by the analog block in the display driving IC for mobile operations may increase. Compared with the manufacturing cost of the display driving IC for mobile operations, this increase may act as a factor that hinders efficiency.

[0059] To help solve this problem, recently, as shown in the example of Figure 2 a chip solution technology for a display driving device that can be used to arrange a memory separated from the display driving chip outside the display driving IC can be used.

[0060] Figure 2 An example of a chip solution device for driving a display panel is shown.

[0061] When comparing the example of Figure 2 with the example of Figure 1 the volatile memory 30 can be implemented as a chip separated from the display driving IC 10.

[0062] The volatile memory 30 can include a memory implemented by DRAM or SRAM as described above and a separate high-speed interface for communicating between the memory and the display driving IC 10.

[0063] The display driving IC 10 can receive the compressed image data from the host 2 and send the received compressed image data to the volatile memory 30. When the volatile memory 30 restores the received compressed image data and sends it back to the display driving IC 10, the display driving IC 10 can send the restored image data to the display panel 1 through the source amplifier. At this time, a separate high-speed interface may be required to perform high-speed data transmission and reception for the volatile memory 30 in order to perform fast image processing in the display driving IC 10. Depending on the resolution of the image and the image processing functions to be processed, the fast image processing in the display driving IC 10 may require high-speed processing that is 3 to 5 times faster than the DSC communication in the example of Figure 1 The example of

[0064] However, in such an example, due to the high-speed interface between the volatile memory 30 and the display driver IC 10, problems such as current increase and electromagnetic interference (EMI) may occur. Even if the volatile memory 30 is implemented separately, and the volatile memory 30 can be implemented using an analog function, a timing controller is still included within the display driver IC 10, such that there still exists a difficulty in manufacturing a chip solution device for driving a display panel in an example that may have to use an ultra-fine process. Figure 2 of the example.

[0065] Figure 3 A schematic configuration of a chip solution device for driving a display panel according to the present example is shown.

[0066] Referring Figure 3 to the example, a chip solution device 1000 for driving a display panel according to one or more examples can be connected to a display panel 1 and a host 2, and can display an image on the display panel 1 based on a control signal and a data signal received from the host 2.

[0067] According to a non-limiting example, a chip solution device 1000 for driving a display panel can include a display driver IC 10, a display control IC 100, and a non-volatile memory 20. The display driver IC 10 and the display control IC 100 can each be implemented as a separate chip. For example, the display driver IC 10 can be implemented by using a fine process such as a process of about 40 nm or greater, and the display control IC 100 can be implemented in an ultra-fine process such as a process of about 28 nm, and then these elements can be configured as a chip solution device 1000 for driving a display panel.

[0068] For example, in an example where an analog block is connected to each channel of the display panel 1, since the occupied area may be large, such an example can be implemented in the display driver IC 10 by using a fine process implemented at a relatively low cost. However, configurations related to image processing that may require high-speed processing, such as configurations using a timing controller and a frame memory, can be implemented in the display control IC 100 as a separate chip that can be manufactured by using an ultra-fine process. Similarly, by implementing each separate chip using a fine process and an ultra-fine process respectively, one or more examples can have the effect of providing a simpler system configuration and reduced processing costs.

[0069] In Figure 3 the example, a more detailed description of the display driver IC 10 and the display control IC 100 is provided.

[0070] According to one or more examples, the non-volatile memory 20 may be implemented separately from the display control IC 100 or may be embedded in the display control IC 100.

[0071] Figure 4 Shown Figure 3 Another configuration of the chip solution device for driving a display panel shown in the example of.

[0072] Referring to Figure 4 the example of, the chip solution device 1000 for driving a display panel may include a plurality of display driving ICs 11. In such an example, the display control IC 100 may control the plurality of display driving ICs 11. In addition, each display control IC 100 and the plurality of display driving ICs 11 may communicate using the MIPI method.

[0073] Figure 5 Shown in more detail Figure 3 A schematic configuration diagram of the chip solution device for driving a display panel shown in the example of.

[0074] Referring to Figure 5 the example of, the display driving IC 10 may send a signal to the display panel 1. As a non-limiting example, the display driving IC 10 may include a source amplifier 11, a gamma module 12, a driving logic unit or driving logic 13, a first OTP memory 14, a power / analog module 15, and a driving interface module 16.

[0075] The source amplifier 11 and the gamma module 12 may each be connected to a channel of the display panel 1. The source amplifier 11 may send a data signal of the image to be displayed to the display panel 1.

[0076] In addition to the timing control function and the image processing function, the driving logic 13 may include the remaining analog control logic for driving the display driving IC. The driving logic 13 may also be referred to as the first logic module.

[0077] The first OTP memory 14 may store analog parameters for driving the display panel 1. Such analog parameters may be parameters required by the driving logic 13 and the power / analog module 15. The analog parameters may include, for example, driving voltage adjustment parameters.

[0078] The power / analog module 15 may self-generate the power supply voltage required for driving the display panel. Depending on the display panel specifications, a high voltage from 1.8V to 20V to 30V may be generated.

[0079] The driving interface module 16 can be connected to the display control IC 100 to send and receive data and driving signals. The driving interface module 16 can communicate with the display control IC 100 by using the MIPI method (M). In one or more examples, the driving interface module 16 may not communicate directly with the external memory, but may communicate through the display control IC 100. That is, the driving interface module 16 can have a frequency bandwidth of about 0.75 times to 2 times the bandwidth of the control interface module 150, so that compared with Figure 2 the example of, the current consumption caused by the increased bandwidth of the transmitted / received data will not increase significantly, and additionally the electromagnetic interference (EMI) problem that may occur may not occur. That is, the image data compressed in the host can be stored in the memory inside the display control IC. Subsequently, the display driver IC 10 can receive the restored image data from the display control IC 100 and then display the image only on the panel. This method can be used because one or more examples may make it unnecessary to directly receive the compressed image data and write it directly into the memory.

[0080] The display control IC 100 can perform image processing based on the signals received from the host and can access the non-volatile memory 20 to control the driving of the display driver IC 10. As a non-limiting example, the display control IC 100 can include a control logic unit or control logic 110, a second OTP memory 111, a volatile memory 130, and a control interface module 150.

[0081] The control logic 110 can include logic for performing image processing. For example, a timing controller for generating a clock for driving the display driver IC 10 can be included in the control logic 110. The control logic 110 can also be referred to as a second logic module.

[0082] The second OTP memory 111 can store imaging parameters required for image processing. The imaging parameters can be parameters related to image processing and can be, for example, any one or any combination of two or more of image enhancement parameters, image compression / restoration parameters, and panel compensation parameters.

[0083] According to one or more non-limiting examples, the volatile memory 130 can store the compressed image received from the host 2 before performing image processing, or can partially store the image processed by the control logic 110, that is, the restored image, and according to one or more other non-limiting examples, then send all the information to the display driver IC 10 at once.

[0084] The control interface module 150 can receive compressed images and control signals from the host 2, and can send the processed images and drive signals to the display driving IC 10 and receive the processed images and drive signals from the display driving IC 10. The control interface module 150 can communicate with the host 2 and the display driving IC 10 by using the Mobile Industry Processor Interface (MIPI) method (M). As described in more detail above, the control interface module 150 can implement a frequency bandwidth for docking with the display driving IC 10 so as to provide a data frequency bandwidth that is approximately 0.75 times to 2 times that of the docking of the control interface module 150 with the host 2.

[0085] In one or more examples, the control interface module 150 can communicate with the non-volatile memory 20 by using the Serial Peripheral Interface (SPI) method (S). In one or more examples, the non-volatile memory 20 can also communicate directly with the display driving IC 10.

[0086] For the chip solution device for driving a display panel according to this example, the data provided from the display control IC 100 to the display driving IC 10 can isolate the interface while utilizing the existing MIPI method, which can provide a constant high-speed interface frequency, regardless of the size of the internal memory and the increase in the image processing function, different from Figure 2 a typical example where, when the image processing function is added, the interface speed with the volatile memory 30 will be increased.

[0087] According to the image data transfer process, Figure 6 is a first example of a detailed configuration diagram of the chip solution device for driving a display panel shown in the example of Figure 5

[0088] To help understand this part of the present disclosure, each component shown in the example of Figure 6 is pre-compared and described with reference to the equivalent parts of the example of Figure 5

[0089] In Figure 6 the components of the display control IC 200 in the example of Figure 5 the display control IC (DCI) controller 230, the data processor 250, and the display driving IC (DDI) controller 210 can be included in the Figure 5 control logic 110 in the example of Figure 6 and the high-speed interface transmitter 240 and the high-speed interface receiver 260 are included in the Figure 5in the driving logic 13 of the example, and the high-speed interface receiver 51 may be included in Figure 5 in the driving interface module 16 of the example, and the voltage generator 53 may be included in Figure 5 the power / analog module 15 of the example.

[0090] In a non-limiting example, referring to Figure 6 the example of, the display control IC 200 may include a DDI controller 210, a volatile memory 220, a DCI controller 230, a high-speed interface transmitter 240, a data processor 250, and a high-speed interface receiver 260.

[0091] The DDI controller 210 may generate a driving signal for controlling the display driving IC 10. For example, including a timing controller, it may generate a clock signal based on a control signal received from the host 2, and may also generate a gate signal for panel control and a diode emission control signal.

[0092] The DCI controller 230 may control the driving of the display control IC 200 based on a command input from the host 2 and a signal input from the non-volatile memory 20.

[0093] The data processor 250 may analyze image processing and control signals based on data received from the host 2. For example, the data processor 250 may perform image processing for restoring a compressed image received from the host 2 and perform image enhancement for processing the image at a high resolution, etc.

[0094] By comparing with the example of Figure 5 the example of, Figure 6 the example of shows a control interface module 150, which is divided into a high-speed interface transmitter 240 and a high-speed interface receiver 260. The high-speed interface receiver 260 may interface with the host 2, and the high-speed interface transmitter 240 may interface with the display driving IC 10. In such an example, the high-speed interface transmitter 240 may have a frequency bandwidth that is 0.75 times to 2 times the frequency bandwidth of the high-speed interface receiver 260.

[0095] The volatile memory 220 may store frame images during image processing. That is, compared with Figure 5 the configuration corresponding to the volatile memory of the example, it may be implemented as SRAM or DRAM.

[0096] As a non-limiting example, the display driving IC 10 may include a high-speed interface receiver 51, a DDI controller 52, a voltage generator 53, a gamma voltage generator 54, and a source amplifier 55.

[0097] The high-speed interface receiver 51 can be connected to the display control IC 200 using the MIPI method to receive the processed image, i.e., the restored image, and the control signal.

[0098] The DDI controller 52 can generate drive signals for driving the display panel 1 based on the control signals and drive parameters stored in the non-volatile memory. For example, the DDI controller 52 can be responsible for generating the gamma control signal and controlling the analog block.

[0099] The voltage generator 53 can generate the drive voltage required to drive the display panel 1 based on the drive signal.

[0100] The gamma voltage generator 54 can generate the gamma voltage corresponding to the grayscale information.

[0101] The source amplifier 55 can be connected to each channel of the display panel 1 and can transmit the image data.

[0102] Figure 7 is the second example of the detailed configuration diagram of the chip solution device for driving the display panel shown in the example of Figure 5 , which is shown in the order of the image data transfer process. For the convenience of description, Figure 7 the example of Figure 6 will be described based on the differences from the example of Figure 7 . Referring to the example of Figure 6 , in addition to the example of

[0103] , it can also include a data compressor 370 and a data recovery unit or data restorer 56. The data compressor 370 can be included in the control logic 110, and the data restorer 56 can be included in the drive logic 13. To reduce the high-speed interface frequency between the display control IC 300 and the display driver IC, the data compressor 370 can compress the image processed by the data processor 350 at a predetermined ratio, and the predetermined ratio can be lower than the ratio of compression in the host. Because the compression ratio is lower, the initially compressed data is compressed more. Then, the data restorer 56 can restore the compressed and transmitted processed image based on the predetermined ratio. The DDI controller 52 can generate drive signals based on the processed image data.

[0104] The description of the remaining part of the configuration in the example of Figure 7 is omitted because it is the same as the corresponding part of the example of Figure 6 .

[0105] Figure 8 Yes Figure 5 The third example of the detailed configuration diagram of the chip solution device for driving a display panel shown in the example of Figure 5 is shown according to the order of the image data transfer process. For convenience of description, Figure 8 Based on its difference from Figure 6 to describe.

[0106] Figure 8 The display control IC 400 of the example of Figure 8 can be implemented by embedding a non-volatile memory 470. Therefore, the number of components of the mobile device can be reduced, and thus, the area on the substrate and the pins connecting the display control IC to external devices can also be reduced.

[0107] In addition, referring to Figure 9 , Figure 10 and Figure 11 The example of Figure 11 can describe and elaborate that the chip solution device for driving a display panel can be configured by a display control IC 400 and a non-volatile memory 470 or other chips, or can be configured by a non-volatile memory 470 and chips other than the display control IC, and has one package.

[0108] Figures 9 to 11 The first to third examples of the module packaging method of the chip solution device for driving the display panel of this example are shown.

[0109] Referring to Figure 9 For each chip, when the chip solution device for driving a display panel is assembled on a flexible printed circuit board (FPCB) or a printed circuit board (PCB), the chip solution device can be packaged by stacking a non-volatile memory IC or a touch IC on a display control IC (DCI). An additional soldering area can be provided at the edge of the substrate on which the display control IC can be arranged, so that other chips can be stacked. Shown Figure 9 in order to distinguish the DCI from the IC components from each other.

[0110] Figure 10 and Figure 11 The examples of Figure 11 show one or more examples in which separate chips are implemented as one package.

[0111] Referring to Figure 10 For the example of Figure 10 , the chip with a large area in the chips can be stacked on the top, and the wiring of the chips with a small area can be arranged to face the bottom surface. In addition, the pads can be packaged by using a redistribution layer (RDL) or the like in the edge of the lower chip to connect to the upper part. As a non-limiting example, the chip with a small area can be a non-volatile memory chip or a touch chip.

[0112] Referring toFigure 11 As an example, chips with a small area in the chip stack can be stacked on top, and the wirings of chips with a large area can be arranged to face the bottom surface. In addition, via holes can be formed through the lower chip to connect the pads to the upper chip. At this time, the via holes can form bump pads on the bottom of the lower chip in the same number as the number of pads of the lower chip and the upper chip, so that at least two chips can be implemented on the FPCB or PCB with a minimum package area.

[0113] As described above, the chip solution device for driving a display panel according to this example can have the following effects: by separately using an ultra-fine process to implement the display control IC and a fine process to implement the display driver IC in the chip solution device and embedding them together, the system configuration can become simpler and the processing cost can be reduced.

[0114] The chip solution device for driving a display panel according to this example may have the following effects: the data provided from the display control IC to the display driver IC can have a constant high-speed interface frequency, regardless of the size of the internal memory and the addition of the image processing function.

[0115] Since the frequency of the high-speed interface is constant, the chip solution device for driving a display panel according to this example may have the effect of reducing power consumption due to the increase in frequency.

[0116] The chip solution device for driving a display panel according to this example can have the effect of becoming stronger and / or more EMI-resistant by reducing current consumption.

[0117] Although this disclosure includes specific examples, it will be apparent after understanding the disclosure of this application that various changes in form and detail can be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are only considered to be of a descriptive nature and not for the purpose of limitation. The description of the features or aspects in each example is considered applicable to similar features or aspects in other examples. Appropriate results can be achieved if the described techniques are performed in a different order, and / or if the components in the described system, architecture, device, or circuit are combined in a different way and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific description, but by the claims and their equivalents, and all changes within the scope of the claims and their equivalents should be construed as being included in this disclosure.

Claims

1. An apparatus for driving a display panel, the apparatus comprising: A display driving IC configured to send received image data to the display panel; A display control IC configured to receive compressed image data from a host, and including a timing controller configured to control the display driving IC; And A non-volatile memory configured to send data to and receive data from the display control IC, and configured to store driving parameters necessary for the operation of the display driving IC, Wherein, the display driving IC is implemented as a separate chip using a process different from that of the display control IC, Wherein, the display driving IC is manufactured using a fine process, Wherein, the display control IC is manufactured using an ultra-fine process, and Wherein, the display control IC includes a volatile memory configured to store the compressed image data from the host, such that the display control IC is configured to: perform image processing based on the compressed image data stored in the volatile memory, and access the non-volatile memory.

2. The apparatus according to claim 1, Among them, The display driving IC includes a first logic module and a driving interface module, the driving interface module being configured to send image data to the display panel, and Wherein, the display control IC includes a second logic module, the volatile memory, and a control interface module, the second logic module being configured to perform image processing based on the compressed image data received from the host and based on the access to the non-volatile memory.

3. The apparatus according to claim 2, Among them, The driving interface module communicates with the display control IC using the Mobile Industry Processor Interface (MIPI) method.

4. The apparatus according to claim 3, Among them, The driving interface module has a frequency bandwidth that is approximately 0.75 times to 2 times the frequency bandwidth of the control interface module.

5. The apparatus according to claim 2, Among them, The first logic module includes analog control logic configured to drive the display driving IC, and Wherein, the second logic module includes a timing controller configured to generate a clock signal for driving the display driving IC.

6. The apparatus according to claim 5, Among them, The display driving IC further includes a first One-Time Programmable (OTP) memory configured to store analog parameters for driving the display panel, and Wherein, the display control IC further includes a second OTP memory configured to store at least one imaging parameter for image processing.

7. The apparatus according to claim 6, Among them, The at least one imaging parameter includes any one or any combination of two or more of image enhancement parameters, image compression / restoration parameters, and panel compensation parameters.

8. The apparatus according to claim 6, Among them, The display control IC is configured to: process and restore the compressed image data in the second logic module based on the imaging parameters, and send the compressed image data to the display driver IC.

9. The device according to claim 5, Among them, The control interface module communicates with the host and the display driver IC using the Mobile Industry Processor Interface (MIPI) method, and communicates with the non-volatile memory using the Serial Peripheral Interface (SPI) method.

10. The device according to claim 1, Among them, The display driver IC includes a source amplifier and a gamma module, and the source amplifier is configured to send the image data to be displayed on the display panel.

11. The device according to claim 1, Among them, The display driver IC includes a power / analog module, and the power / analog module is configured to self-generate the power voltage for driving the display panel.

12. The device according to claim 11, Among them, According to the display panel specifications, the power voltage generated by the power / analog module is 1.8V to 30V.

13. A device for driving a display panel, the device comprising: A display driver IC configured to send the received image data to the display panel; A display control IC configured to receive compressed image data from a host and configured to restore the received data for sending to the display driver IC; And A non-volatile memory configured to send data to and receive data from the display control IC and configured to store the driving parameters for operating the display driver IC, wherein the display driver IC is implemented as a separate chip using a process different from that of the display control IC, wherein the display driver IC is manufactured using a fine process, wherein the display control IC is manufactured using an ultra-fine process, wherein the display control IC includes a data compressor configured to re-compress the compressed image data received from the host at a predetermined ratio lower than the compression ratio in the host after the restoration, and wherein the display driver IC includes a data restorer configured to restore the re-compressed and sent image data.

14. The device according to claim 13, Among them, The display control IC communicates with the host and the display driver IC using the Mobile Industry Processor Interface (MIPI) method and communicates with the non-volatile memory using the Serial Peripheral Interface (SPI) method.

15. A device for driving a display panel, the device comprising: A display driver IC configured to send image data to the display panel, the display driver integrated circuit including analog control logic configured to drive the display driver IC; A display control IC configured to receive compressed image data and including a timing controller configured to control the display driver IC by generating a clock signal; And A non-volatile memory, which is configured to exchange data with the display control IC and is configured to store driving parameters used by the display driver IC, wherein the display driver IC is implemented as a separate chip using a process different from that of the display control IC, wherein the display driver IC is manufactured using a fine process, wherein the display control IC is manufactured using an ultra-fine process, and wherein the display control IC further includes a volatile memory and a control interface module, and the display control IC is configured to: based on access to the non-volatile memory, perform image processing based on compressed image data received from a host.

16. The device according to claim 15, wherein, The display driver IC further includes a driving interface module, and the driving interface module is configured to send image data to the display panel.

Images