Impingement jet manifold for near-edge jets for chip cooling

Abstract

The present disclosure relates to an impingement jet manifold for near edge jets for chip cooling. A system and method for chip cooling using near edge jets in a direct liquid cooling module is disclosed. One of the functions of the direct liquid cooling module is to provide cooling liquid to components located on the chip. Direct impingement of the jets onto the back side of the chip is a cooling method that can provide more efficient cooling. The orifice plate includes an array of small diameter holes corresponding to the locations of the high-speed jets and large diameter holes for inserting tubes to connect to a low-pressure cavity.

Description

Technical Field

[0001] The present disclosure relates to impingement jet manifolds for chip cooling near-edge jets. Background Art

[0002] Complementary metal oxide semiconductor ("CMOS") circuits are found in several types of electronic components, including microprocessors, batteries, and digital camera image sensors. The main characteristics of CMOS technology are low static power consumption and high noise immunity.

[0003] In addition to industry-standard chip packaging, specialized silicon can generate significant amounts of heat in servers. This can be encountered in graphics processing units (“GPUs”), custom application-specific integrated circuits (“ASICs”), and high-bandwidth memory (“HBM”). In addition, services such as imaging and artificial intelligence (“AI”) can require large amounts of computing resources at high densities, with many servers in close proximity to each other. Data centers around the world are being asked to simultaneously improve energy efficiency, consolidate operations, and reduce costs. To accommodate these high-performance, high-density servers, data center operators must deal not only with the increased power densities, but also with the thermal challenges they present.

[0004] Because liquids are many times better than air at storing and transferring heat, liquid cooling solutions can provide immediate and measurable benefits to computing efficiency, density, and performance. Using direct liquid cooling modules can increase computing performance and density, and reduce energy consumption.

[0005] Electronic component packages are subject to a wide range of temperature differences. Due to differences in the coefficient of thermal expansion ("CTE") of the various package components, the electronic component package may warp as the temperature of the electronic component package changes. Summary of the invention

[0006] To control warping, a direct liquid cooling module including an orifice plate, a manifold, and a reinforcement member can be incorporated into an electronic component package. The direct liquid cooling module is designed with a sealing member so that the fluid does not leak therefrom. A sealing member such as an O-ring or a gasket can help to hermetically seal the liquid delivery manifold or orifice plate to, for example, the top of a heat sink component. The sealing member can reside in a groove located in one of the adjacent components that are sealed together. In one example, the presence of a sealing member received in a groove of the heat sink component provides an airtight seal between the manifold device and the component substrate, thereby enabling direct liquid cooling of the heat sink component by different methods.

[0007] O-ring and / or gasket sealing technology enables direct liquid cooling of one or more heat dissipating components such as microprocessors, memory chips, etc. that allow direct liquid contact with the component. This facilitates cooling through hermetically attached structures on the chip, for example, with O-ring grooves and seals.

[0008] Direct impingement of the jet onto the surface of a substrate or semiconductor containing a circuit is a cooling method that can provide efficient cooling. For example, in order to seal the perimeter of a chip with a gasket, it may be necessary to cover the outer edges of the chip. In one example, the coverage required to seal the perimeter is 1-2 mm. Since the gasket covers some of the edges, it is preferred that the jet holes are as close to the edges as possible to cool that area of ​​the chip. In addition, there can be a significant pressure drop (possibly in excess of 100 psi) across the jet holes in order to obtain the jet velocity required to provide the heat transfer coefficient. This pressure loss requires the orifice plate to be made thicker so that it does not deflect or yield, especially when the area of ​​the chip (and therefore the orifice plate) increases. In one example, the density of the cooling jet array and the diameter of the jet holes are designed to take into account this pressure loss.

[0009] In other examples, the layout, location, and number of impingement jets take into account what kind of chips are integrated into a single package, such as multiple ASICs, I / O chips, and memory chips. Some of these chips have not only different heat transfer coefficients, but also different surface temperature requirements.

[0010] One aspect of the present disclosure provides a component comprising: an orifice plate having a top surface and a bottom surface and a plurality of supply orifices and return orifices, the plurality of supply orifices being used to receive a fluid flowing through the plate from the top surface to the bottom surface, the bottom surface of the orifice plate being adapted to seal to a top surface of a substrate containing an electrical circuit; a coolant delivery manifold having a top surface and a bottom surface and at least one supply cavity in fluid communication with at least a subset of the plurality of supply orifices and at least one return cavity in fluid communication with the plurality of return orifices; and a first sealing member forming an airtight seal between the top surface of the plate and the bottom surface of the manifold.

[0011] The bottom surface of the coolant delivery manifold may have an outer groove that forms an outer closed perimeter adapted to receive at least a portion of the first sealing member therein. When the top surface of the plate is sealed to the bottom surface of the coolant delivery manifold, the plurality of supply and return apertures of the plate are all contained within the outer closed perimeter of the outer groove of the coolant delivery manifold. The bottom surface of the manifold may have an inner groove that forms an inner closed perimeter that is at least partially surrounded by the outer closed perimeter and adapted to receive at least a portion of the second sealing member therein. When the top surface of the plate is sealed to the bottom surface of the manifold, at least a subset of the plurality of supply and return apertures of the plate are contained within the inner closed perimeter of the inner groove of the manifold.

[0012] According to some examples, the assembly further comprises a plurality of return pipes directly connecting at least one return cavity of the manifold with a plurality of return orifices of the plate. In addition, the third sealing member may be adapted to form an airtight seal between the bottom surface of the plate and the top surface of the substrate. In the case where the bottom surface of the plate has a groove, the groove forms a closed outer periphery adapted to receive at least a portion of the third sealing member therein. When the plate is sealed to the substrate, all of the plurality of supply and return orifices of the plate may be located within the closed outer periphery of the groove.

[0013] Another aspect of the present disclosure provides a coolant delivery manifold comprising a top surface and a bottom surface, the top surface comprising at least one supply cavity and at least one return cavity, the bottom surface comprising an inner cavity and a surrounding outer cavity, wherein each of the at least one supply cavity comprises an opening between a bottom portion of the supply cavity and at least one of the inner cavity or the surrounding outer cavity on the bottom surface, the opening being adapted to transfer a fluid at a first temperature through the supply cavity to the inner cavity and to transfer a fluid at a second temperature different from the first temperature to the surrounding outer cavity, and wherein the at least one return cavity comprises a plurality of apertures between the inner cavity on the bottom surface and the top surface, the plurality of apertures being sized to receive a plurality of fluid return tubes.

[0014] The bottom surface of the manifold may be adapted to couple to the top surface of the orifice plate, and wherein the bottom surface of the orifice plate is adapted to seal to the top surface of a substrate containing circuitry. The substrate may have first and second circuit regions, the first circuit region corresponding to an inner cavity of the coolant delivery manifold, and the second circuit region corresponding to an outer peripheral cavity of the coolant delivery manifold.

[0015] The aperture plate may include a groove including a first closed perimeter and a second closed perimeter, and the aperture plate may be sealed to the substrate such that at least a portion of the first circuit area is located within the first closed perimeter of the groove and at least a portion of the second circuit area is located within the second closed perimeter of the groove.

[0016] The coolant delivery manifold may also include a plurality of return tubes directly connecting the at least one return cavity of the manifold with the plurality of return apertures in the orifice plate.

[0017] Another aspect of the present disclosure provides an orifice plate having a top surface and a bottom surface and a plurality of supply and return orifices, the bottom surface of the plate being adapted to be sealed to the top surface of a semiconductor containing a circuit, the plurality of supply and return orifices being in fluid communication with the circuit when the plate and the substrate are sealed together, wherein the bottom surface of the plate has at least one cavity having an inner wall surrounding the periphery of the cavity, and wherein at least some of the plurality of supply orifices are adjacent to the inner wall of the at least one cavity. A manifold may be assembled with the orifice plate, the manifold having a top surface and a bottom surface and at least one supply cavity in fluid communication with at least a portion of the plurality of supply orifices and at least one return cavity in fluid communication with the plurality of return orifices. A sealing member may be adapted to form an airtight seal between the plate and the manifold. In addition, a second sealing member may be positioned around the periphery of at least one cavity on the bottom surface of the plate, wherein the second sealing member forms a seal between the plate and the substrate comprising one or more chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a perspective view of one example of a direct liquid cooling module assembly.

[0019] Figure 2 yes Figure 1 An exploded perspective view of the direct liquid cooling module components.

[0020] Figure 3A is a top perspective view of an example of an orifice plate.

[0021] Figure 3B yes Figure 3A Bottom perspective view of the orifice plate.

[0022] Figure 4 is a cross-sectional view of one example of an aperture plate coupled to a chip package.

[0023] Figure 5 yes Figure 1 Exploded bottom perspective view of the top plate, manifold, and orifice plate of the direct liquid cooling module assembly.

[0024] Fig. 6A yes Figure 1 A top perspective view of one example of a manifold of the assembly is shown.

[0025] Figure 6B yes Fig. 6A A top plan view of the manifold.

[0026] Figure 6C yes Fig. 6A Bottom perspective view of the manifold.

[0027] Fig.6D yes Fig. 6A Bottom plan view of the manifold.

[0028] Figure 7 yes Figure 5 A cross-sectional perspective assembly drawing of the top plate, manifold, and orifice plate.

[0029] Figure 8 yes Figure 1 A cross-sectional perspective view of a direct liquid cooling module assembly.

[0030] Fig. 9A Yes Figure 1 A schematic flow diagram of one example of one or more components of a fluid delivery system.

[0031] Fig. 9B yes Fig. 9A A schematic flow chart of one example of a grouping of a fluid delivery system.

[0032] Fig. 9C yes Fig. 9A A schematic flow chart of another example of a grouping of a fluid delivery system.

[0033] Fig.10 is a schematic flow chart of an example of an HBM cooler. DETAILED DESCRIPTION

[0034] Figure 1 and Figure 2 1 and 2 are perspective assembled and exploded perspective views, respectively, of one example of a direct liquid cooling module assembly 100. The assembly 100 includes a chip or chip package 200, an aperture plate 300, a manifold 400, and a top plate 500.

[0035] Figure 2 A top perspective view of chip 200 is shown in FIG. Chip 200 includes various processing components. In one example, chip 200 can be bonded to a carrier substrate or substrate. Chip 200, alone and / or bonded to a substrate, can be an integrated circuit ("IC") chip, a system on chip ("SoC"), or a portion thereof, which can include various passive and active microelectronic devices, such as resistors, capacitors, inductors, diodes, metal oxide semiconductor field effect transistors ("MOSFET"), CMOS transistors, bipolar junction transistors ("BJT"), laterally diffused metal oxide silicon ("LDMOS") transistors, high-power MOS transistors, other types of transistors, or other types of devices. As an example, chip 200 can include memory devices, logic devices, or other types of circuits. The substrate to which chip 200 can be bonded can be, for example, a silicon substrate, a plastic substrate, a flexible substrate having, for example, a polyimide and copper layer, a laminate substrate, a ceramic substrate, an interposer, or any other suitable support structure.

[0036] In the example shown, the processing components of the chip 200 are HBM 202 and ASIC 204. In this example, there are four HBMs 202 and one central ASIC 204. A portion of the perimeter of each of the HBMs 202 and ASIC 204 together form a chip periphery or perimeter 206. The processing components of the chip 200 are located on a top surface 208 of the chip 200. Each HBM 202 is adjacent to another HBM 202 and a portion of the ASIC 204. In other examples, the chip 200 may include more or fewer HBMs and ASICs, and may be located on the chip 200 in other configurations. The perimeter 206 may be the top surface 208 of a substrate to which the chip 200 is bonded, or the perimeter 206 may be the top surface 208 of the chip 200 itself. In one example, the perimeter 206 may be the perimeter of both the bottom surface 207 and the top surface 208 of the chip 200. Any portion of the top surface 208 that is not surrounded by the perimeter 206 may be referred to as "dead space" on the chip 200 and / or the substrate to which the chip 200 is bonded, since there are no processing components in that portion of the top surface 208. Because there are no processing components located in this area, this area is preferably used to load other direct liquid cooling module system components, and, for example, use this area as a base for applying sealing features. Direct liquid cooling modules are typically used to bring coolant to components of the chip. The module is typically hermetically sealed so that coolant can only be discharged from the system through an outlet. If coolant should be introduced to components of the chip to provide a cooling effect, it is typically not preferred to apply a seal directly on the component so that the coolant cannot directly touch the component. Therefore, the perimeter 206 is a preferred location on the top surface 208 to provide a seal so that coolant can be applied directly to components of the chip.

[0037] Although Figure 1 The assembly 100 is shown, but the chip 200 and the aperture plate 300 cannot be seen in this assembled view. Figure 2 When the orientation of the component parts in the exploded view of FIG. 1 is shown, it can be understood that when assembled together, the top surface 208 of the chip 200 is sealed to the bottom surface 307 of the orifice plate 300, the top surface 308 of the orifice plate 300 is sealed to the bottom surface 407 of the manifold 400, and the top surface 408 of the manifold 400 is sealed to the bottom surface 507 of the top plate 500. When the top surface 308 of the orifice plate 300 is sealed to the bottom surface 407 of the manifold 400, the locations where the seal exists on the top surface 308 of the orifice plate 300 are represented by the outer seal perimeter 338 and the inner seal perimeter 348. When the bottom surface 507 of the orifice plate 300 is sealed to the top surface 408 of the manifold 400, the locations where the seal exists on the top surface 408 of the manifold 400 are represented by the perimeter seals 426, 456, 466. Figure 1 and Figure 2Also generally shown are three arrows that indicate the direction of fluid entering respective inlets 530 and 540 and outlet 550 of top plate 500. The flow of liquid through assembly 100 will be discussed in greater detail below.

[0038] Figure 3A and Figure 3B They are Figure 2 1 and 2 are top and bottom perspective views of one example of an orifice plate 300 of the assembly 100. The orifice plate 300 has a perimeter or outer periphery 306, a bottom surface 307, and a top surface 308. The orifice plate 300 includes a plurality of supply orifices 310 and return orifices 320 extending through the orifice plate 300. Each of the supply orifices 310 and the return orifices 320 extends from the top surface 308 of the orifice plate 300 and enters a corresponding cavity 315 and 325 in the bottom surface 307 of the orifice plate 300. Figure 3B As shown, when the chip 20 and the aperture plate 300 are sealed together, the cavity 315 is located in the area above the HBM 202, and the cavity 325 will be in the area above the ASIC 204. A plurality of supply apertures 310 and at least one return aperture lead to each cavity 315. Several supply apertures 310 and return apertures 320 are located within the cavity 325. In other examples, there may be more or fewer supply apertures 310 and return apertures 320 located within the cavities 315, 325.

[0039] A plurality of supply orifices 310 are used to receive fluid flowing from the manifold 400 to the top surface 308 of the orifice plate 300. These supply orifices 310 may also be referred to as impact jets. The supply orifices 310 are arrays of small diameter holes placed at specific locations through the orifice plate 300. A relatively high pressure differential is applied across the top surface 308 of the orifice plate 300, for example from 5 to greater than 100 psi. This produces high-speed water jets passing through the small diameter holes or supply orifices 310. In one example, these jets impinge on the top surface 208 of the chip 200, producing a high heat transfer coefficient.

[0040] In one example, the orifice plate 300 can cool a total chip area of ​​approximately 20-30 mm x 30-50 mm. In other examples, the orifice plate 300 can be designed to cool a total chip area greater than or less than 20-30 mm x 30-55 mm. The bottom surface 307 of the orifice plate 300 includes a groove 340 (e.g., Figure 7 300 ), for receiving an O-ring or gasket 350. The groove 340 is designed so that at least a portion of a portion of the O-ring or gasket 350 is received within the groove 340. When the bottom surface 307 of the well plate 300 is in direct contact with the top surface 208 of the chip 200, the O-ring or gasket 350 forms an airtight seal between the chip 200 and the well plate 300.

[0041] like Figure 3BAs shown, gasket 350 forms a pane arrangement to form a hermetic seal between chip components, namely, HBM 202 and ASIC 204. These components may be bonded to chip 200 using epoxy-type materials that are generally incompatible with water, so the pane arrangement of gasket 350 forms a protective seal around the respective perimeters of these components.

[0042] The array of small diameter holes or supply orifices 310 corresponds to the high-speed jet locations. In one example, the high-speed jets are formed by the high-pressure cavities 455, 465 of the manifold (e.g., Fig. 6A ) and the low pressure cavities 315, 325 (in Figure 3B In one example, the small holes 310 may be spaced between 0.5 and 2 mm on the high power density area of ​​the chip 200, and spaced between 2 mm and 5 mm on the area of ​​the chip 200 with a lower power density. In one example, the diameter of the holes 310 is between about 50 and 300 microns. In other examples, the diameter of the holes 310 may be less than 50 microns or greater than 300 microns.

[0043] The orifice plate 300 includes larger diameter holes or a plurality of return orifices 320 into which a return tube 360 ​​may be inserted to connect the cavities 315, 325 of the orifice plate 300 and the low pressure return reservoir 425 of the manifold 400, for example, in Fig. 6A In one example, the diameter of the hole 320 can be from 500 microns to 4 millimeters in diameter. In other examples, the diameter of the hole 320 can be less than 500 microns or greater than 4 mm. Typically, the hole 320 is separated from the edge of each cavity 315, 325 by at least one row of small diameter holes 310.

[0044] The placement of the large diameter holes 320 is designed based on the longitudinal distance from the orifice plate 300 to the top surface 208 of the chip 200, which is about 500 microns to 2 mm. Due to the low gap, a large amount of fluid flow may interact with the jet or small diameter hole 310 and hinder the fluid velocity interacting with the top surface 208 of the chip, which may lead to a decrease in the heat transfer coefficient.

[0045] Figure 42 is a cross-sectional view of an example of an aperture plate 300 coupled to a chip package 200. A gasket 350 is shown within a groove 340 of the aperture plate. In this example, the gasket 350 is shown covering the edge of the HBM 202 and the edge of the ASIC 204 and the overmold 203 located between the HBM 202 and the ASIC 204. The area 205 is shown surrounding the edge of the HBM 202, the edge of the ASIC 204, and the overmold 203. An example of an edge jet or supply orifice 310 is shown near the edge of the ASIC 204. Other supply orifices 310 are shown in more central portions of both the HBM 202 and the ASIC 204. Return tubes 360 are also shown, each within a large hole or return orifice 320. Each return tube 360 ​​is located adjacent one of the low-pressure chambers 315 , 325 , such that fluid entering the corresponding chamber 315 , 325 through the supply orifice 310 leaves the chamber 315 , 325 through one of the return tubes 360 .

[0046] Figure 5 yes Figure 1 FIG. 1 is an exploded bottom perspective view of the top plate 500, manifold 400, and orifice plate 300 of the direct liquid module assembly 100. In this figure, it can be seen how the orifice plate 300 is aligned with the manifold 400. The orifice plate 300 is shown as having eight peripheral orifices 370, which align with corresponding eight recesses 475 in the bottom surface 407 of the manifold 400. A fastener (not shown) can be inserted through each orifice 370 in the orifice plate 300 into a corresponding recess 475 of the manifold 400 to help secure the orifice plate 300 and the manifold 400.

[0047] exist Figure 5 In the embodiment, the orifice plate 300 has some transparency so that when the bottom surface of the orifice plate 300 is observed, some return pipes 360 can be seen. Figure 3A Each return tube 360 ​​is shown coupled to each return orifice 320 of the orifice plate 300. In this example, there is one return tube 360 ​​corresponding to each position of the four HBMs 202, and there are thirteen return tubes 360 corresponding to the positions of the ASICs 204. When the orifice plate 300 is sealed to the manifold 400, the four return tubes 360 located in the HBM 202 positions are received in the outer cavity 435 of the manifold 400, while the thirteen return tubes 360 located in the ASIC 204 positions are received in the inner cavity 445 of the manifold 400. Figure 5 Also shown in FIG. 5 is a bottom surface 507 of the top plate 500. By viewing the bottom surface 507 of the top plate 500, it is also possible to see where the fluid exits the inlets 530 and 540 and is received in the outlet 550 of the top plate 500. There is a corresponding recess 470 in the top surface 408 of the manifold 400 (at Fig. 6A400). A fastener (not shown) can be inserted through each of the apertures 580 in the top plate 500 into a corresponding recess 470 of the manifold 400 to help secure the top plate 500 and the manifold 400. The manifold 400 also includes four peripheral apertures 480 into which fasteners (not shown) can be inserted to help secure the manifold to other components of the direct liquid cooling module, such as the backing plate 600, for example, in Figure 8 Shown in.

[0048] FIG. 6A to FIG. 6D yes Figure 1 Various views of one example of a manifold 400 of the assembly 100 are shown. Fig. 6A and Figure 6B As shown, manifold 400 includes a low pressure return reservoir 425 between a first high pressure supply reservoir 455 and a second high pressure supply reservoir 465. Reservoir 455 includes an elongated opening 457, and reservoir 465 includes an elongated opening 468. Arrows in reservoir 455 show the direction of flow of fluid from reservoir 455 through opening 457, while arrows in reservoir 465 show the direction of flow of fluid from reservoir 465 through opening 468. Fluid flowing from reservoir 455 through opening 457 enters inner cavity 445, while fluid flowing from reservoir 465 through opening 468 enters outer cavity 435. The fluid then flows from inner cavity 445 onto top surface 308 of orifice plate 300 and enters cavity 325 leading to ASIC 204 of chip 200 through supply orifice 310. The fluid then also flows from the outer cavity 435 onto the top surface 308 of the orifice plate 300 and enters the cavity 315 of the HBM 202 leading to the chip 200 through the supply orifice 310. All fluid in the cavity 315, 325 then enters the first end of the corresponding return tube 360 ​​and exits the second end of the return tube connected to the return orifice 420 and enters the low pressure return reservoir 425 of the manifold 400.

[0049] Surrounding the outer cavity 435 and the inner cavity 445 are corresponding grooves 438 and 448 in the bottom surface 407 of the manifold 400. The O-ring or gasket 432 is at least partially received in the groove 438 of the outer cavity 435, and the O-ring or gasket 442 is at least partially received in the groove 448 of the inner cavity 445. When the bottom surface 407 of the manifold is sealed to the top surface 308 of the orifice plate 300, all of the return tubes 360 are contained within the perimeter of the groove 438, and the four outer return tubes 460 are contained within the outer cavity 435, while the thirteen inner return tubes 460 are contained within both the perimeter of the groove 448 and the inner cavity 445.

[0050] Surrounding each of the low pressure return reservoir 425, the first high pressure supply reservoir 455, and the second high pressure supply reservoir 465 is a respective groove 428, 458, and 468. The O-rings or gaskets 422, 452, and 462 are at least partially received within the respective grooves 428, 458, and 468, for example, as Figure 2 When the bottom surface 507 of the top plate 500 is in direct contact with the top surface 408 of the manifold, each of the O-rings or gaskets 422, 452, and 462 is in direct contact with the bottom surface 507 of the top plate 500 to hermetically seal the corresponding low pressure return reservoir 425, the first high pressure supply reservoir 455, and the second high pressure supply reservoir 465.

[0051] Although grooves 428, 438, 448, 458, and 468 are shown as having a rectangular shape, in other examples, one or more of these grooves can take the form of a shape other than a rectangle, such as, for example, a square, an oval, or a circle. In this example, grooves 428, 438, 448, 458, and 468 are continuous because each groove does not have any spaces or gaps at its corresponding perimeter (including at any corners thereof). In other examples, these grooves can have one or more spaces or gaps at their corresponding perimeters.

[0052] Figure 7 is a cross-sectional perspective assembly diagram of the orifice plate 300, the manifold 400 and the top plate 500, and Figure 8 2 is a cross-sectional assembly diagram of each of these system components, including additional components of the system, such as chip 200 and pad 600. Figure 7 , the curved arrows show an example fluid path for a fluid that enters the system through inlet 530 of top plate 500 and enters reservoir 455. From reservoir 455, the fluid flows through opening 457 of reservoir 455 and enters inner cavity 445 before flowing through supply orifice 310 of orifice plate 300. Once through orifice plate 300, the fluid enters cavity 325 and then reaches the surface of ASIC 204 of chip 200, as shown in FIG. Figure 8 The fluid within cavity 325 then enters return tube 360 ​​located within the perimeter of cavity 325 of orifice plate 300 and exits into low pressure return reservoir 425 of manifold 400 before then flowing out outlet 550 of top plate 500 .

[0053] Figure 7 and Figure 8Also shown is an example fluid path for a fluid that enters the system through inlet 540 of top plate 500 and enters reservoir 465. From reservoir 465, the fluid flows through opening 468 of reservoir 465 and enters outer cavity 435 before flowing through supply orifice 310 of orifice plate 300. Once through orifice plate 300, the fluid enters cavity 315 of orifice plate 300 and then reaches the surface of HBM 202 of chip 200, as shown in FIG. Figure 8 The fluid within cavity 315 then enters return tube 360 ​​located within the perimeter of cavity 315 and exits into low pressure return reservoir 425 of manifold 400 before then flowing out outlet 550 of top plate 500 .

[0054] The system includes two supply lines and a common return line. The main supply line, which may be referred to as inlet 530, directs about 80-95% of the fluid flow to components of chip 200, such as, for example, ASIC 204. The components of chip 200 that are supplied with fluid from the main supply line typically consume most of the power of chip 200. The second supply line, which may be referred to as inlet 540, directs about 5-20% of the fluid flow to other components of chip 200, such as one or more HBM 202. Compared to, for example, ASIC 204, HBM 202 is generally more sensitive to temperature and may require a lower temperature fluid. Due to the small percentage of flow in the second supply line, it is more cost-effective to deliver a cooler water supply through the second supply line than to provide such lower temperature water to the entire package assembly 100 (including, for example, both HBM 202 and one or more ASIC 204). There is a common return line, which may be referred to as outlet 550, where the fluid flows from all components of chip 200 such as HBM 202 and ASIC 204 are mixed.

[0055] In other examples, the system 100 can have other configurations. Instead of the previously described example of the system 100 having two supply lines and a single return line, the system 100 can have a single supply line and a single return line. In another example, the system 100 can have two supply lines and two return lines. In other examples, the system 100 can have one or two supply lines and more than two return lines. In other examples, the system 100 can have one or two return lines and more than two supply lines. In yet other examples, the system 100 can have more than two supply lines and more than two return lines.

[0056] In other examples, chip 200 may have various other configurations of components such as one or more HBMs, ASICs, and chiplets. In other examples, O-rings and gaskets used to form an airtight seal between chip 200 and aperture plate 300, aperture plate 300 and manifold 400, and manifold 400 and top plate 500 may be located only around the respective perimeters of each feature of system 100. In such cases, the mold material used to bond the components to chip 200 may be allowed to wet, rather than being, for example, Figure 4 The O-ring or gasket shown is covered. In another example, if there are two supply lines and two return lines, and one pair of supply lines and return lines operates with a cooler fluid and the other pair of supply lines and return lines operates with a hotter fluid, a window gasket can be used.

[0057] Fig. 9A 800 is a schematic flow chart of an example of a fluid delivery system 800 to one or more chip packages 900. Each chip package has at least one first chip component 920 and a second chip component 940. In one example, the first chip component 920 is one or more ASICs, and the second chip component 940 is one or more HBMs. However, it should be understood that the chip components may include any combination of various chips such as GPUs, ASICs, etc. in any number or configuration. For example, a coolant in fluid form is supplied to the system 800 from a laboratory refrigerator. In one example, the coolant supplied to the system 800 is 16°C. The coolant then enters the second heat exchanger 820 and mixes with the higher temperature coolant supplied from the first heat exchanger 810. The fluid either leaves the heat exchanger 820 and travels to the second chip component 940, or travels to the first heat exchanger 810. In one example, approximately 10% of the coolant supplied to the system 800 leaves the heat exchanger 810 and travels to the second chip component 940. In this example, the coolant traveling to the second chip component 940 is 17°C. While in other examples, the coolant supplied to the system 800 may be above or below 16°C, and the coolant supplied to the second chip component 940 may be above or below 17°C, there is generally a low temperature difference between the coolant supplied to the system 800 and the coolant supplied to the second chip component 940. It should be understood that the foregoing is merely an example, and the percentage of coolant from the heat exchanger 810 supplied to the second chip component 940 may vary, and the temperature of the coolant supplied to each component may vary.

[0058] The coolant entering the first heat exchanger 810 from the second heat exchanger 820 is mixed with the fluid returned from the previous cooling of the first chip component 920. In one example, the fluid returned from the previous cooling of both the first chip component 920 and the second chip component 940 enters the first heat exchanger 810 at approximately 35°C. In this example, the coolant entering the first heat exchanger 810 either leaves the first heat exchanger 810 to the coolant return line at approximately 32°C, or leaves the first heat exchanger 810 at approximately 34.5°C before flowing to the third heat exchanger 830. Approximately 90% of the fluid flow in the system 800 flows to the first chip component 920. There is a very low temperature difference (approximately 0.5°C) between the fluid returned from the previous cooling and the fluid traveling to the third heat exchanger 830. In other examples, the coolant leaving the first heat exchanger 810 to the coolant return line may be above or below 32° C., the coolant leaving the first heat exchanger 810 before flowing to the third heat exchanger 830 may be above or below 34.5° C., and the fluid or coolant returned from the previous cooling of both the first chip component 920 and the second chip component 940 enters the first heat exchanger 810 at above or below 35° C. As mentioned above, such values ​​for the percentages of fluid flow and the temperatures of the coolants are merely examples and may vary.

[0059] like Fig. 9A As further shown, the third heat exchanger 830 exchanges heat between the fluid flowing to the first chip component 920 and the fluid returning from the cooling second chip component 940. Here, the hotter fluid flowing to the first chip component 920 or ASIC is mixed with the cooler fluid returning from the second chip component 940 or HBM. The fluid leaving the first chip component 920 then travels to the reservoir 970 and then to the filter 980 before entering the first heat exchanger 810. The fluid leaving the third heat exchanger 830 is mixed with the fluid that has left the first chip component 920 before entering the reservoir 970, and flows together to the filter 980 before entering the first heat exchanger 810.

[0060] Fig. 9B and Fig. 9C is a schematic flow diagram including example groupings of components of a fluid delivery system 800. These groupings may enable the use of common pumps, reservoirs, and / or filters for multiple machines.

[0061] exist Fig. 9BIn the example of, the first chip component 920 and the second chip component 940 are grouped together, and all other components of the system 800 are grouped together, such as the first heat exchanger 810, the second heat exchanger 820 and the third heat exchanger 830 and the reservoir 970 and the filter 980. Because the heat exchangers 810-830 are grouped with the pump, the reservoir and the filter, they can support multiple other groupings, including several instances of multiple jet manifolds in this example. This grouping can reduce the hardware cost of the heat exchanger. However, this may also result in reduced flow control.

[0062] exist Fig. 9C In the example of , all components of the system 800 are grouped together in a first group except for the reservoir 970 and the filter 980 which are grouped together in a second group. For example, several instances of a group including heat exchangers 810-830 and a manifold may use a common reservoir 970, filter 980, and pump. Such grouping may provide a better ability to control and optimize the amount of process coolant required at the expense of more heat exchangers.

[0063] Fig.10 800 is a schematic flow chart of an example of an HBM refrigerator added to the system 800. In this example, the HBM refrigerator is a refrigeration circuit including a condenser 880, an evaporator 860, and an expansion valve 882. The HBM refrigerator removes heat and cools the liquid passing through the evaporator 860, and pumps the heat into the condenser 880. The HBM refrigerator can be implemented, for example, only for supercooling the HBM. In some examples, the HBM portion can represent about 10-20% of the heat. Therefore, cooling only the HBM portion requires much less refrigerator capacity than cooling all flows to that level. In this example, the fourth heat exchanger 840 receives fluid leaving the second heat exchanger 820. The fourth heat exchanger 840 also receives fluid leaving from cooling one or more second chip components 940. Some of the fluid leaving the fourth heat exchanger 840 does not flow directly to one or more second chip components 940, but enters the evaporation chamber 860, and the output of the evaporation chamber 860 flows to the condenser 880 and returns to the evaporation chamber 860 in a cycle.

[0064] Unless otherwise stated, the foregoing alternative examples are not mutually exclusive, but can be implemented in various combinations to obtain unique advantages. Since these and other variations and combinations of the features discussed above can be utilized without departing from the subject matter defined by the claims, the foregoing description should be regarded as an illustration, rather than a limitation on the subject matter defined by the claims. In addition, the provision of examples described herein and clauses phrased as "such as", "including", etc. should not be interpreted as limiting the subject matter of the claims to specific examples; on the contrary, these examples are intended to illustrate only one of many possible implementations. In addition, the same reference numerals in different figures may identify the same or similar elements.

Claims

1. A component comprising: an orifice plate having a top surface and a bottom surface and a plurality of supply orifices and a plurality of return orifices, the plurality of supply orifices for receiving fluid flowing through the orifice plate from the top surface to the bottom surface, the bottom surface of the orifice plate being adapted to seal to a top surface of a substrate containing circuitry; a coolant delivery manifold having top and bottom surfaces and at least one supply cavity in fluid communication with at least a subset of the plurality of supply apertures and at least one return cavity in fluid communication with the plurality of return apertures; as well as a first sealing member that forms an airtight seal between the top surface of the orifice plate and the bottom surface of the coolant delivery manifold, wherein: the bottom surface of the coolant delivery manifold having an outer groove forming an outer closed perimeter adapted to receive at least a portion of the first sealing member therein; and and The bottom surface of the coolant delivery manifold has an inner groove forming an inner closed perimeter at least partially surrounded by the outer closed perimeter and adapted to receive at least a portion of a second seal therein.

2. The assembly according to claim 1, wherein When the top surface of the orifice plate is sealed to the bottom surface of the coolant delivery manifold, all of the plurality of supply apertures and the plurality of return apertures of the orifice plate are contained within the outer closed perimeter of the outer recess of the coolant delivery manifold.

3. The assembly according to claim 1, wherein: When the top surface of the orifice plate is sealed to the bottom surface of the coolant delivery manifold, at least a subset of the plurality of supply apertures and the plurality of return apertures of the orifice plate are contained within the inner closed perimeter of the inner recess of the coolant delivery manifold.

4. The assembly of claim 1 further comprising a plurality of return tubes directly connecting at least one return cavity of the coolant delivery manifold with the plurality of return apertures of the orifice plate.

5. The assembly of claim 1, further comprising a third sealing member adapted to form a hermetic seal between the bottom surface of the aperture plate and the top surface of the substrate.

6. The assembly according to claim 5, wherein: The bottom surface of the orifice plate has a recessed groove forming a closed outer perimeter adapted to receive at least a portion of the third sealing member therein.

7. The assembly according to claim 6, wherein: When the orifice plate is sealed to the substrate, the plurality of supply orifices and the plurality of return orifices of the orifice plate are all located within the closed outer perimeter of the recess.

8. A coolant delivery manifold, comprising: a top surface comprising at least one supply cavity and at least one return cavity; as well as a bottom surface, the bottom surface comprising an inner cavity and a surrounding outer cavity, wherein the at least one supply cavity comprises an opening between a bottom portion of the supply cavity and at least one of the inner cavity and the surrounding outer cavity on the bottom surface, the opening being adapted to transfer a fluid at a first temperature through the supply cavity to the inner cavity and to transfer a fluid at a second temperature different from the first temperature to the surrounding outer cavity, and Wherein, the at least one return cavity includes a plurality of apertures between the inner cavity on the bottom surface and the top surface, the plurality of apertures being sized to receive a plurality of fluid return tubes.

9. The coolant delivery manifold according to claim 8, wherein: The bottom surface of the coolant delivery manifold is adapted to be coupled to a top surface of an orifice plate, and wherein the bottom surface of the orifice plate is adapted to be sealed to a top surface of a substrate containing an electrical circuit.

10. The coolant delivery manifold according to claim 9, wherein: The substrate has a first circuit area corresponding to the inner cavity of the coolant delivery manifold and a second circuit area corresponding to the surrounding outer cavity of the coolant delivery manifold.

11. The coolant delivery manifold according to claim 10, wherein: The orifice plate includes a recess including a first closed perimeter and a second closed perimeter.

12. The coolant delivery manifold according to claim 11, wherein: When the aperture plate is sealed to the substrate, at least a portion of the first circuit area is located within the first closed perimeter of the recess, and at least a portion of the second circuit area is located within the second closed perimeter of the recess.

13. The coolant delivery manifold of claim 9, further comprising a sealing member forming a seal between the bottom surface of the coolant delivery manifold and the top surface of the orifice plate.

14. The coolant delivery manifold of claim 9, further comprising a plurality of return tubes directly connecting the at least one return cavity of the coolant delivery manifold with a plurality of return apertures in the orifice plate.

15. A component comprising: an orifice plate having a top surface and a bottom surface and a plurality of supply orifices, a plurality of return orifices, and a plurality of return tubes, each return orifice opening into one of the return tubes, the bottom surface of the orifice plate being adapted to seal to a top surface of a substrate containing an electrical circuit, the plurality of supply orifices and the plurality of return orifices being in fluid communication with the electrical circuit when the orifice plate and the substrate are sealed together, and washer, wherein the bottom surface of the aperture plate has at least one first cavity and a second cavity, the at least one first cavity having an inner wall surrounding the periphery of the at least one first cavity, the second cavity being separated from the at least one first cavity by the gasket, so that when the bottom surface of the aperture plate is sealed to the top surface of the substrate at a position where the at least one first cavity extends over the first chip component and the second cavity extends over the second chip component, the gasket hermetically seals the first chip component of the circuit with the second chip component of the circuit, and Wherein, at least some of the plurality of supply orifices are adjacent to the inner wall of the at least one first cavity.

16. The assembly of claim 15, further comprising: a manifold having top and bottom surfaces and at least one supply cavity in fluid communication with at least a portion of the plurality of supply apertures and at least one return cavity in fluid communication with the plurality of return apertures; as well as A sealing member is adapted to form a gas-tight seal between the orifice plate and the manifold.

17. The assembly of claim 16, further comprising a second sealing member positioned around a perimeter of the at least one first cavity on the bottom surface of the orifice plate.

18. The assembly of claim 17, wherein: The second sealing member forms a seal between the aperture plate and the substrate.

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