Dual-polarized packaged antenna and preparation method thereof

Abstract

The present invention provides a dual-polarized packaged antenna and a preparation method thereof. The dual-polarized packaged antenna comprises: a rewiring layer and a dual-polarized antenna structure; the dual-polarized antenna structure comprises a first air cavity located in a first packaging layer, with a first antenna metal layer as a top and a metal wiring layer as a bottom, and a second air cavity located in a second packaging layer, with a second antenna metal layer as a top and the first antenna metal layer as a bottom, thereby reducing the loss of the packaged antenna in a mobile channel and making the signal transmission speed faster, so as to occupy a favorable position in the 5G market by virtue of its high speed and low latency characteristics.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor packaging and relates to a dual-polarization packaged antenna and a preparation method thereof. Background Art

[0002] With the popularization of high-tech electronic products, especially in order to meet the needs of mobility, most high-tech electronic products have added wireless communication functions.

[0003] Antenna in Package (AiP) is a technology that integrates antennas and integrated circuits (ICs) in a package based on packaging materials and processes to achieve system-level wireless functions. It can carry highly integrated radio or radar transceiver modules. AiP technology conforms to the trend of increasing integration of silicon-based semiconductor processes and provides good antenna and packaging solutions for system-level wireless chips. Therefore, AiP technology has been widely used in radio and radar by chip manufacturers. AiP technology has achieved a good balance in performance, size, cost, etc., and is an important achievement in antenna technology in recent years.

[0004] With the advent of 5G (5th Generation) communications, higher requirements are placed on low latency, high speed, and large capacity communications. Among them, the main issue focuses on how to use antenna layout to reduce the loss of millimeter waves in mobile channels.

[0005] In view of this, it is necessary to design a novel dual-polarization packaged antenna and a preparation method thereof to reduce the signal loss of the packaged antenna. Summary of the invention

[0006] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a dual-polarization packaged antenna and a preparation method thereof, so as to solve the problem of signal loss of the packaged antenna in the prior art.

[0007] To achieve the above object and other related objects, the present invention provides a method for preparing a dual-polarized packaged antenna, comprising the following steps:

[0008] Providing a supporting substrate, and forming a separation layer on the supporting substrate;

[0009] forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a first surface in contact with the separation layer and a second surface opposite to the separation layer;

[0010] forming a first metal connection column on the second surface of the rewiring layer, wherein the first metal connection column is electrically connected to the rewiring layer;

[0011] forming a first packaging layer, wherein the first packaging layer covers the second surface of the rewiring layer and the first metal connecting column and exposes the top surface of the first metal connecting column;

[0012] removing a portion of the first encapsulation layer to form a first groove penetrating the first encapsulation layer to expose the metal wiring layer of the rewiring layer;

[0013] forming a first air dielectric layer, wherein the first air dielectric layer fills the first groove;

[0014] forming a first antenna metal layer on the first packaging layer, wherein the first antenna metal layer covers the first air dielectric layer, and the first antenna metal layer is electrically connected to the first metal connecting column;

[0015] Removing the first air dielectric layer to form a first air cavity in the first packaging layer, wherein the first air cavity has the first antenna metal layer as a top and the metal wiring layer as a bottom;

[0016] forming a second packaging layer, wherein the second packaging layer covers the first packaging layer and the first antenna metal layer;

[0017] removing a portion of the second packaging layer to form a second groove penetrating the second packaging layer to expose the first antenna metal layer;

[0018] forming a second air dielectric layer, wherein the second air dielectric layer fills the second groove;

[0019] forming a second antenna metal layer on the second packaging layer, wherein the second antenna metal layer covers the second air dielectric layer;

[0020] removing the second air dielectric layer to form a second air cavity in the second packaging layer, wherein the second air cavity has the second antenna metal layer as a top and the first antenna metal layer as a bottom;

[0021] The separation layer and the supporting substrate are removed to expose the first surface of the rewiring layer.

[0022] Optionally, the first air medium layer includes a PI medium layer; and the second air medium layer includes a PI medium layer.

[0023] Optionally, the step of forming the first air dielectric layer includes the steps of coating, exposure, development and surface polarization to form the first air dielectric layer filling the first groove; the step of forming the second air dielectric layer includes the steps of coating, exposure, development and surface polarization to form the second air dielectric layer filling the second groove.

[0024] Optionally, a method for forming the first antenna metal layer includes one of PVD, CVD, electroplating and chemical plating; a method for forming the second antenna metal layer includes one of PVD, CVD, electroplating and chemical plating.

[0025] Optionally, the method for removing the first encapsulation layer includes one or a combination of dry etching and wet etching; the method for removing the second encapsulation layer includes one or a combination of dry etching and wet etching.

[0026] The present invention also provides a dual-polarization packaged antenna, the dual-polarization packaged antenna comprising:

[0027] a redistribution layer, the redistribution layer comprising a first surface and an opposite second surface;

[0028] A first metal connection column is formed on the second surface of the rewiring layer and is electrically connected to the rewiring layer;

[0029] A first packaging layer covers the second surface of the rewiring layer and the first metal connecting column, and the first metal connecting column is exposed on the top surface of the first packaging layer;

[0030] a first air cavity, penetrating the first packaging layer to expose the metal wiring layer of the rewiring layer;

[0031] A first antenna metal layer is located on the first packaging layer and is electrically connected to the first metal connection column, and the first air cavity has the first antenna metal layer as a top and the metal wiring layer as a bottom;

[0032] A second packaging layer, covering the first packaging layer and the first antenna metal layer;

[0033] a second air cavity, penetrating the second packaging layer to expose the first antenna metal layer;

[0034] The second antenna metal layer is located on the second packaging layer, and the second air cavity has the second antenna metal layer as the top and the first antenna metal layer as the bottom.

[0035] Optionally, a metal seed layer is further included between the first antenna metal layer and the first packaging layer; and a metal seed layer is further included between the second antenna metal layer and the second packaging layer.

[0036] Optionally, the metal wiring layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the first antenna metal layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the second antenna metal layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.

[0037] Optionally, the first metal connecting column includes one or a combination of a copper metal column, a gold metal column, a silver metal column and an aluminum metal column.

[0038] Optionally, the first encapsulation layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer; the second encapsulation layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer.

[0039] As described above, the dual-polarized packaged antenna and the preparation method thereof of the present invention form a first air cavity with the first antenna metal layer as the top and the metal wiring layer as the bottom in the first packaging layer; and form a second air cavity with the second antenna metal layer as the top and the first antenna metal layer as the bottom in the second packaging layer, thereby reducing the loss of the packaged antenna in the mobile channel and making the signal transmission faster, so as to occupy a favorable position in the 5G market with its high speed and low latency characteristics. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 Shown is a process flow chart of the preparation of the dual-polarized packaged antenna in the present invention.

[0041] Figures 2 to 18 It is a schematic diagram showing the structure of each step of preparing a dual-polarized packaged antenna in the present invention, wherein: Fig.18 Shown is a schematic structural diagram of the dual-polarized packaged antenna in the present invention.

[0042] Component number description

[0043] 101 Support base

[0044] 102 Separation Layer

[0045] 103 Rewiring Layer

[0046] 113 PI-0 Rewiring Dielectric Layer

[0047] 123 Metal seed layer

[0048] 133 M-1 Metal Wiring Layer

[0049] 143 PI-1 Rewiring Dielectric Layer

[0050] 153 M-2 Metal Wiring Layer

[0051] 163 PI-3 Rewiring Dielectric Layer

[0052] 173 M-3 Metal Wiring Layer

[0053] 104 Dual-polarized antenna structure

[0054] 114 first metal connecting column

[0055] 124 First packaging layer

[0056] 134 First Groove

[0057] 144 PI dielectric layer material

[0058] 154 PI dielectric layer

[0059] 164 Metal seed layer

[0060] 174 Photoresist

[0061] 184 First antenna metal layer

[0062] 194 First air cavity

[0063] 204 Second packaging layer

[0064] 214 Second air cavity

[0065] 224 Metal seed layer

[0066] 234 Second antenna metal layer DETAILED DESCRIPTION

[0067] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0068] See also Figures 1 to 18 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0069] like Figure 1 This embodiment provides a method for preparing a dual-polarized packaged antenna, forming a first air cavity with a first antenna metal layer as a top and a metal wiring layer as a bottom in a first packaging layer; and forming a second air cavity with a second antenna metal layer as a top and the first antenna metal layer as a bottom in a second packaging layer, thereby reducing the loss of the packaged antenna in a mobile channel and making the signal transmission speed faster, so as to occupy a favorable position in the 5G market with its high speed and low latency characteristics.

[0070] like Figures 2 to 18, which illustrates the structural schematic diagram presented in each step of preparing the dual-polarized packaged antenna in this embodiment.

[0071] like Figure 2 First, a supporting substrate 101 is provided, and a separation layer 102 is formed on the supporting substrate 101 .

[0072] Specifically, the support substrate 101 may include one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate and a ceramic substrate; the separation layer 102 may include a polymer layer whose viscosity decreases under heating or light irradiation conditions, and the polymer layer may include an LTHC light-to-heat conversion layer. Since the glass substrate has a low cost, it is easy to form the separation layer 102 on its surface, and it can reduce the difficulty of the subsequent stripping process. Therefore, in this embodiment, the support substrate 101 is preferably a glass substrate, and the separation layer 102 is preferably coated on the surface of the support substrate 101 by a spin coating process, and the LTHC light-to-heat conversion layer is cured by an ultraviolet curing or a thermal curing process, so that in the subsequent stripping process, the LTHC light-to-heat conversion layer can be heated based on a laser to separate the support substrate 101 from the LTHC light-to-heat conversion layer.

[0073] like Figure 3 to Figure 7 , a rewiring layer 103 is formed on the separation layer 102, and the rewiring layer 103 includes a first surface in contact with the separation layer 102 and a second surface opposite to the separation layer 102.

[0074] Specifically, the rewiring layer 103 includes at least two metal wiring layers stacked together. Figure 7 In this embodiment, the rewiring layer 103 includes 3 layers of the metal wiring layer, but it is not limited to this. According to needs, the rewiring layer 103 may also include only 2 layers or more layers of the metal wiring layer, such as 4 layers, 5 layers, etc. Among them, the material of the rewiring dielectric layer constituting the rewiring layer 103 may include one or a combination of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass and fluorine-containing glass, and the material of the metal wiring layer constituting the rewiring layer 103 may include one or a combination of copper, aluminum, nickel, gold, silver and titanium. The method of making the rewiring dielectric layer may include one or a combination of physical vapor deposition and chemical vapor deposition, and the method of making the metal wiring layer may include one or a combination of physical vapor deposition, chemical vapor deposition, electroplating and chemical plating. The specific preparation method, material, number of layers and distribution morphology of the rewiring dielectric layer and the metal wiring layer can be selected according to specific needs and are not limited here.

[0075] like Figure 3 In this embodiment, a PI-0 rewiring dielectric layer 113 is first formed on the separation layer 102. Then, Figure 4 The metal seed layer 123 may be formed on the surface of the PI-0 rewiring dielectric layer 113 by evaporation or sputtering. The metal seed layer 123 may include a Ti / Cu layer. Figure 5 , forming an M-1 metal wiring layer 133 on the metal seed layer 123. The method for forming the M-1 metal wiring layer 133 may be electroplating, that is, depositing the M-1 metal wiring layer material on the metal seed layer 123, and patterning it to form the M-1 metal wiring layer 133. Of course, the method for forming the M-1 metal wiring layer 133 may also be physical vapor deposition, chemical vapor deposition, chemical plating, or a combination of physical vapor deposition, chemical vapor deposition, electroplating and chemical plating. The specific formation method is not overly limited here. Then, as Figure 6-7 , forming a PI-1 rewiring dielectric layer 143, an M-2 metal wiring layer 153, a PI-3 rewiring dielectric layer 163 and an M-3 metal wiring layer 173. The preparation method can be selected according to needs and will not be repeated here.

[0076] like Figure 8 to Figure 17 , a dual-polarized antenna structure 104 with a first air cavity 194 and a second air cavity 214 is formed on the second surface of the rewiring layer 103 .

[0077] Specifically, Figure 8 , a first metal connection column 114 is formed on the second surface of the re-distribution layer 103 , and the first metal connection column 114 is electrically connected to the re-distribution layer 103 .

[0078] As a further embodiment of this embodiment, the method of forming the first metal connecting column 114 may include one or a combination of wire bonding, physical vapor deposition, chemical vapor deposition, electroplating and chemical plating, and the material of the first metal connecting column 114 may include one or a combination of copper, gold, silver and aluminum.

[0079] Afterwards, a first packaging layer 124 is formed. The first packaging layer 124 covers the second surface of the re-distribution layer 103 and the first metal connecting pillars 114 , and exposes the top surfaces of the first metal connecting pillars 114 .

[0080] As a further embodiment of this embodiment, the material of the first encapsulation layer 124 may include one or a combination of polyimide, silicone and epoxy resin. The method of forming the first encapsulation layer 124 may include one or a combination of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating. After forming the first encapsulation layer 124, a chemical mechanical polishing method may be used to act on the upper surface of the first encapsulation layer 124 to provide a flat first encapsulation layer 124 to further improve product quality.

[0081] like Fig. 9 , a portion of the first encapsulation layer 124 is removed to form a first groove 134 penetrating the first encapsulation layer 124 to expose the metal wiring layer of the re-wiring layer 103 .

[0082] Specifically, the method of removing the first encapsulation layer 124 may include one or a combination of dry etching and wet etching. By removing a portion of the first encapsulation layer 124, the first groove 134 exposing the M-3 metal wiring layer 173 is formed in the first encapsulation layer 124. The specific morphology and size of the first groove 134 can be selected as needed and are not limited here.

[0083] Then, if Figure 10 to Figure 13 , forming a first air dielectric layer, wherein the first air dielectric layer fills the first groove 134 .

[0084] As a further embodiment of this embodiment, the step of forming the first air medium layer may include:

[0085] Depositing a first air dielectric layer material on the surface of the first encapsulation layer 124 , wherein the first air dielectric layer material fills the first groove 134 ;

[0086] exposing and developing the first air dielectric layer material located in the first groove 134;

[0087] The first air dielectric layer material is subjected to surface polarization to form the first air dielectric layer filling the first groove 134 .

[0088] As a further example of this embodiment, the first air medium layer may include a PI medium layer 154 .

[0089] Specifically, the first air dielectric layer may be made of positive photoresist, negative photoresist or the PI dielectric layer 154. In this embodiment, the PI dielectric layer 154 with stable performance is preferably used to avoid affecting the first air dielectric layer when the first antenna metal layer is subsequently formed.

[0090] Specifically, Fig.10 , forming a PI dielectric layer material 144 on the surface of the first packaging layer 124 to fill the first groove 134. Then, Figure 11 to Figure 13 , the PI dielectric layer material 144 located in the first groove 134 is exposed and developed, and a surface polarization process is used to form the PI dielectric layer 154 filling the first groove 134. It is preferred that the PI dielectric layer 154 and the first packaging layer 124 have the same horizontal plane to reduce the difficulty of the subsequent process of preparing the first antenna metal layer.

[0091] Afterwards, if Figure 13 to Figure 15 , a first antenna metal layer 184 is formed on the first packaging layer 124 , the first antenna metal layer 184 covers the first air dielectric layer, and the first antenna metal layer 184 is electrically connected to the first metal connecting column 114 .

[0092] As a further embodiment of this embodiment, the method of forming the first antenna metal layer 184 may include one of PVD, CVD, electroplating and chemical plating, wherein the step of preparing the first antenna metal layer 184 by electroplating may include:

[0093] forming a metal seed layer 164 on the surfaces of the first packaging layer 124 and the first air dielectric layer;

[0094] forming a mask layer on the metal seed layer 164 and patterning the mask layer;

[0095] A first antenna metal layer material is deposited, and the mask layer and the metal seed layer 164 under the mask layer are removed to form the first antenna metal layer 184 .

[0096] As a further embodiment of this embodiment, the mask layer may include one of a photoresist and a PI layer.

[0097] Specifically, Fig.13 , forming the metal seed layer 164 on the surface of the first packaging layer 124 and the PI dielectric layer 154. Then, Fig.14 , forming a photoresist material on the metal seed layer 164, and patterning the photoresist material to form the photoresist 174. Fig.15 and Fig.16 , depositing a first antenna metal layer material, and removing the photoresist 174 and the metal seed layer 164 located below the photoresist 174 to form the first antenna metal layer 184 covering the PI dielectric layer 154 .

[0098] Afterwards, if Fig.16 , the air dielectric layer is removed to form the first air cavity 194 in the first packaging layer 124, wherein the first air cavity 194 has the first antenna metal layer 184 as a top and the metal wiring layer as a bottom.

[0099] Specifically, the method for removing the photoresist 174 and the PI dielectric layer 154 may be wet etching, but is not limited thereto. In the present embodiment, the method for forming the first antenna metal layer 184 is the electroplating method, and the mask layer is the photoresist 174, but is not limited thereto. For example, the method for forming the first antenna metal layer 184 may also be physical vapor deposition, chemical vapor deposition, chemical plating, or a combination of physical vapor deposition, chemical vapor deposition, electroplating, and chemical plating, and the specific formation method is not overly limited here. The mask layer may also be the PI layer, and when the PI layer and the PI dielectric layer 154 are made of the same material, only one wet etching process may be performed to remove the PI dielectric layer 154 located in the first groove 134 and located on the surface of the first packaging layer 124.

[0100] Afterwards, if Fig.17 , forming a second packaging layer 204, a second air cavity 214, a metal seed layer 224 and a second antenna metal layer 234. The second packaging layer 204 covers the first packaging layer 124 and the first antenna metal layer 184; the second air cavity 214 penetrates the second packaging layer 204 to expose the first antenna metal layer 184; the second antenna metal layer 234 is located on the second packaging layer 204, and the second air cavity 214 uses the second antenna metal layer 234 as the top and the first antenna metal layer 184 as the bottom.

[0101] Specifically, they may include:

[0102] forming the second packaging layer 204 , wherein the second packaging layer 204 covers the first packaging layer 124 and the first antenna metal layer 184 ;

[0103] removing a portion of the second packaging layer 204 to form a second groove penetrating the second packaging layer 204 to expose the first antenna metal layer 184;

[0104] forming a second air dielectric layer, wherein the second air dielectric layer fills the second groove;

[0105] forming the second antenna metal layer 234 on the second packaging layer 204, wherein the second antenna metal layer 234 covers the second air dielectric layer;

[0106] The second air dielectric layer is removed to form the second air cavity 214 in the second packaging layer 204 . The second air cavity 214 has the second antenna metal layer 234 as a top and the first antenna metal layer 184 as a bottom.

[0107] Specifically, the second air dielectric layer includes a PI dielectric layer, and the steps of forming the second air dielectric layer include coating, exposure, development and surface polarization. The method of forming the second antenna metal layer 234 includes one of PVD, CVD, electroplating and chemical plating. The steps of preparing the second packaging layer 204, the second air cavity 214, the metal seed layer 224 and the second antenna metal layer 234 and the selection of materials can refer to the steps of the first packaging layer 124, the first air cavity 194, the metal seed layer 164 and the first antenna metal layer 184, which will not be repeated here.

[0108] Afterwards, if Fig.18 , remove the separation layer 102 and the supporting substrate 101 to expose the first surface of the rewiring layer 103.

[0109] Specifically, after removing the separation layer 102 and the supporting substrate 101 to expose the bottom surface of the PI-0 rewiring dielectric layer 113 of the rewiring layer 103, a semiconductor chip and metal bumps electrically connected to the metal wiring layer can be formed on the rewiring layer 103 as needed, which will not be introduced here.

[0110] This embodiment also provides a dual-polarized packaged antenna, and the preparation method of the dual-polarized packaged antenna can adopt the above preparation method, but is not limited thereto. The dual-polarized packaged antenna of this embodiment forms a first air cavity with a first antenna metal layer as the top and a metal wiring layer as the bottom in the first packaging layer; and forms a second air cavity with a second antenna metal layer as the top and the first antenna metal layer as the bottom in the second packaging layer, thereby reducing the loss of the packaged antenna in the mobile channel and making the signal transmission speed faster, so as to occupy a favorable position in the 5G market with its high speed and low latency characteristics.

[0111] like Fig.18 The dual-polarized packaged antenna includes: a rewiring layer 103 and a dual-polarized antenna structure 104.

[0112] Specifically, the dual-polarized packaged antenna includes:

[0113] A rewiring layer 103, wherein the rewiring layer 103 includes a first surface and an opposite second surface;

[0114] A first metal connection column 114 is formed on the second surface of the re-distribution layer 103 and is electrically connected to the re-distribution layer 103;

[0115] A first packaging layer 124 covers the second surface of the re-distribution layer 103 and the first metal connecting pillar 114 , and the first metal connecting pillar 114 is exposed on the top surface of the first packaging layer 124 ;

[0116] A first air cavity 194 penetrates the first packaging layer 124 to expose the metal wiring layer of the re-wiring layer 103;

[0117] A first antenna metal layer 184 is located on the first packaging layer 124 and is electrically connected to the first metal connection column 114, and the first air cavity 194 has the first antenna metal layer 184 as a top and the metal wiring layer as a bottom;

[0118] A second packaging layer 204 covering the first packaging layer 124 and the first antenna metal layer 184;

[0119] A second air cavity 214 penetrates the second packaging layer 204 to expose the first antenna metal layer 184;

[0120] The second antenna metal layer 234 is located on the second packaging layer 204 , and the second air cavity 214 has the second antenna metal layer 234 as the top and the first antenna metal layer 184 as the bottom.

[0121] As a further embodiment of this embodiment, a metal seed layer 164 may be further included between the first antenna metal layer 184 and the first packaging layer 124 ; a metal seed layer 224 may be further included between the second antenna metal layer 234 and the second packaging layer 204 .

[0122] As a further embodiment of this embodiment, the metal wiring layer may include one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the first antenna metal layer 184 may include one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the second antenna metal layer 234 may include one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.

[0123] As a further embodiment of this embodiment, the first metal connection column 114 may include one or a combination of a copper metal column, a gold metal column, a silver metal column and an aluminum metal column.

[0124] As a further embodiment of this embodiment, the first packaging layer 124 may include one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer; the second packaging layer 204 may include one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer.

[0125] As a further embodiment of this embodiment, a semiconductor chip and metal bumps located on the first surface of the rewiring layer 103 may also be included.

[0126] In summary, the dual-polarized packaged antenna and its preparation method of the present invention form a first air cavity with the first antenna metal layer as the top and the metal wiring layer as the bottom in the first packaging layer; and form a second air cavity with the second antenna metal layer as the top and the first antenna metal layer as the bottom in the second packaging layer, thereby reducing the loss of the packaged antenna in the mobile channel and making the signal transmission speed faster, so as to occupy a favorable position in the 5G market with its high speed and low latency characteristics. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0127] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for preparing a dual-polarized packaged antenna, characterized in that: The following steps are involved: Providing a supporting substrate, and forming a separation layer on the supporting substrate; forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a first surface in contact with the separation layer and a second surface opposite to the separation layer; forming a first metal connection column on the second surface of the rewiring layer, wherein the first metal connection column is electrically connected to the rewiring layer; forming a first packaging layer, wherein the first packaging layer covers the second surface of the rewiring layer and the first metal connecting column and exposes the top surface of the first metal connecting column; removing a portion of the first encapsulation layer to form a first groove penetrating the first encapsulation layer to expose the metal wiring layer of the rewiring layer; forming a first air dielectric layer, wherein the first air dielectric layer fills the first groove; forming a first antenna metal layer on the first packaging layer, wherein the first antenna metal layer covers the first air dielectric layer, and the first antenna metal layer is electrically connected to the first metal connecting column; Removing the first air dielectric layer to form a first air cavity in the first packaging layer, wherein the first air cavity has the first antenna metal layer as a top and the metal wiring layer as a bottom; forming a second packaging layer, wherein the second packaging layer covers the first packaging layer and the first antenna metal layer; removing a portion of the second packaging layer to form a second groove penetrating the second packaging layer to expose the first antenna metal layer; forming a second air dielectric layer, wherein the second air dielectric layer fills the second groove; forming a second antenna metal layer on the second packaging layer, wherein the second antenna metal layer covers the second air dielectric layer; removing the second air dielectric layer to form a second air cavity in the second packaging layer, wherein the second air cavity has the second antenna metal layer as a top and the first antenna metal layer as a bottom; The separation layer and the supporting substrate are removed to expose the first surface of the rewiring layer.

2. The method for preparing the dual-polarized packaged antenna according to claim 1, wherein: The first air medium layer includes a PI medium layer; the second air medium layer includes a PI medium layer.

3. The method for preparing the dual-polarized packaged antenna according to claim 1, characterized in that: The step of forming the first air dielectric layer includes the steps of coating, exposure, development and surface polarization to form the first air dielectric layer filling the first groove; the step of forming the second air dielectric layer includes the steps of coating, exposure, development and surface polarization to form the second air dielectric layer filling the second groove.

4. The method for preparing the dual-polarized packaged antenna according to claim 1, characterized in that: The method of forming the first antenna metal layer includes one of PVD, CVD, electroplating and chemical plating; the method of forming the second antenna metal layer includes one of PVD, CVD, electroplating and chemical plating.

5. The method for preparing the dual-polarized packaged antenna according to claim 1, characterized in that: The method of removing the first encapsulation layer includes one or a combination of dry etching and wet etching; the method of removing the second encapsulation layer includes one or a combination of dry etching and wet etching.

6. A dual-polarized packaged antenna, characterized in that: The dual-polarized packaged antenna comprises: a redistribution layer, the redistribution layer comprising a first surface and an opposite second surface; A first metal connection column is formed on the second surface of the rewiring layer and is electrically connected to the rewiring layer; A first packaging layer covers the second surface of the rewiring layer and the first metal connecting column, and the first metal connecting column is exposed on the top surface of the first packaging layer; a first air cavity, penetrating the first packaging layer to expose the metal wiring layer of the rewiring layer; The first antenna metal layer is located on the first packaging layer and is electrically connected to the first metal connection column. The first air cavity has the first antenna metal layer as the top and the metal wiring layer as the bottom; A second packaging layer, covering the first packaging layer and the first antenna metal layer; a second air cavity, penetrating the second packaging layer to expose the first antenna metal layer; A second antenna metal layer is located on the second packaging layer, and the second air cavity has the second antenna metal layer as a top and the first antenna metal layer as a bottom; The first metal connection column includes one or a combination of a copper metal column, a gold metal column, a silver metal column and an aluminum metal column; The first packaging layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer; the second packaging layer includes one or a combination of a polyimide layer, a silicone layer and an epoxy resin layer.

7. The dual-polarization packaged antenna according to claim 6, characterized in that: A metal seed layer is further provided between the first antenna metal layer and the first packaging layer; and a metal seed layer is further provided between the second antenna metal layer and the second packaging layer.

8. The dual-polarized packaged antenna according to claim 6, characterized in that: The metal wiring layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the first antenna metal layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer; the second antenna metal layer includes one or a combination of a copper layer, an aluminum layer, a nickel layer, a gold layer, a silver layer and a titanium layer.

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