Inductive Component and Its Manufacturing Method

Abstract

The present invention provides an inductance component and a manufacturing method thereof, including: a circuit board, on which a groove is provided; a magnetic element, embedded in the groove; wherein, a winding is provided on the magnetic element and surrounds the magnetic element along the thickness direction of the magnetic element, and the winding is electrically connected to the circuit board. Thus, the manufacturing of an embedded inductance component is realized, and the miniaturization of the product is achieved.

Description

Technical Field

[0001] This application relates to the technical field of inductance embedding, and particularly to an inductance component and a manufacturing method thereof. Background Art

[0002] Hybrid integrated circuits are entering the stage of system packaging by integrating system chips, microsensors, micro actuators, and peripheral thin-film passive components together. The packaging technology adopts a unique method for the system, which can reduce the size of a large circuit board connecting many components. Passive devices (capacitors, inductors, resistors, etc.) account for 70% to 90% of the number of components on the circuit board and 70% to 80% of the substrate area. If the circuit board passive device embedding technology is widely applied, the size reduction of the product is expected to be reduced by dozens of times.

[0003] Nowadays, inductors are widely used in circuit board design, and the formed passive filter circuit mainly functions to adjust signals and filter. The inductance component in the power supply part occupies more than 40% of the surface area of the power supply, which is not conducive to the miniaturization design of the product. Summary of the Invention

[0004] This application mainly provides an inductance component and a manufacturing method thereof to realize the manufacture of an embedded inductance component and the miniaturization of the product.

[0005] To solve the above technical problems, the first technical solution provided by the present invention is: providing an inductance component, including: a circuit board, on which a groove is provided; a magnetic element, embedded in the groove; wherein, a winding is provided on the magnetic element along the thickness direction of the magnetic element around the magnetic element, and the winding is electrically connected to the circuit board.

[0006] Wherein, the inductance component further includes: a magnetic core; the magnetic component is annular, and the axial direction of the magnetic core is perpendicular to the plane direction of the circuit board; the circuit board is provided with a first through hole corresponding to the annular part of the magnetic component; the magnetic core is inserted into the first through hole and is flush with the two surfaces of the circuit board; wherein, a first insulating layer is filled between the magnetic core and the magnetic element and between the magnetic element and the groove.

[0007] Wherein, a first pad and a second pad are provided on the surface of the magnetic element perpendicular to the thickness direction of the circuit board; the first pad is electrically connected to the input end of the winding, and the second pad is electrically connected to the output end of the winding.

[0008] Among them, the positions of the first pad and the second pad corresponding to the circuit board are provided with a first blind hole and a second blind hole; a circuit image layer is provided on the circuit board; the side walls of the first blind hole and the second blind hole are provided with a conductive layer; the first pad is electrically connected to the circuit image layer through the first blind hole to electrically connect the input end of the winding to the circuit pattern layer; the second pad is electrically connected to the circuit pattern layer through the second blind hole to electrically connect the output end of the winding to the circuit pattern layer.

[0009] Among them, the first pad and the second pad are located on the same surface of the magnetic component; or the first pad and the second pad are located on opposite surfaces of the magnetic component.

[0010] Among them, the groove does not penetrate through the two surfaces of the circuit board.

[0011] Among them, a second insulating layer is coated on the magnetic component, the winding is located on the surface of the second insulating layer, and the winding material is copper.

[0012] To solve the above technical problems, the second technical solution provided by the present invention is: to provide a manufacturing method of an inductor component, including: providing a circuit board, and a groove is provided on the circuit board; arranging a winding around the magnetic component along the thickness direction of the magnetic component on the magnetic component; embedding the magnetic component into the groove and performing high temperature; wherein, the winding is electrically connected to the circuit board.

[0013] Among them, the magnetic component is annular; the step of arranging a winding around the magnetic component along the thickness direction of the magnetic component on the magnetic component includes: arranging a second insulating layer on the magnetic component; performing electroplating on the second insulating layer to form a winding around the magnetic component along the thickness direction; arranging a first pad connecting the input end of the winding and a second pad connecting the output end of the winding on the surface of the magnetic component perpendicular to the thickness direction; embedding the magnetic component into the groove and performing high temperature pressing; wherein, the step of electrically connecting the winding to the circuit board further includes: arranging a first through hole on the circuit board corresponding to the annular part of the magnetic component; arranging a magnetic core in the first through hole; wherein, a first insulating layer is filled between the magnetic core and the magnetic component.

[0014] Among them, the circuit board includes a circuit pattern layer; embedding the magnetic component into the groove body and performing high temperature treatment; after the step of electrically connecting the winding to the circuit board, the method further includes: providing a first blind hole at a position of the circuit board corresponding to the first pad, and providing a second blind hole at a position of the circuit board corresponding to the second pad; providing a conductive layer in the first blind hole and the second blind hole to electrically connect the input end and the output end of the winding to the circuit pattern layer.

[0015] Different from the prior art, in the present application, a circuit board is provided, and a groove body is provided on the circuit board; a magnetic component is embedded into the groove body; wherein, a winding is provided on the magnetic component and surrounds the magnetic component along the thickness direction of the magnetic component, and the winding is electrically connected to the circuit board. In this way, the production of the embedded inductor component is realized, and the miniaturization of the product is achieved. Description of the Drawings

[0016] Figure 1 is a schematic structural diagram of a first embodiment of the inductor component of the present invention;

[0017] Figure 2 is a schematic structural diagram of a second embodiment of the inductor component of the present invention;

[0018] Figure 3 is a schematic structural diagram of a first embodiment of the magnetic component of the inductor component of the present invention;

[0019] Figure 4 is a schematic flow diagram of a second embodiment of the magnetic component of the inductor component of the present invention;

[0020] Figure 5 is a schematic flow diagram of a first embodiment of the manufacturing method of the inductor component of the present invention;

[0021] Figure 6 is a schematic flow diagram of a second embodiment of the manufacturing method of the inductor component of the present invention. Detailed Description of the Embodiments

[0022] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0023] Please refer to Figure 1, which is a schematic structural diagram of the first embodiment of the inductor component of the present application. It includes: a circuit board 11 and a magnetic component 13. Among them, a groove 12 is provided on the circuit board 11, and the magnetic component 13 is disposed in the groove 12. When the magnetic component 13 is disposed in the groove 12, the axial direction of the magnetic component 13 is perpendicular to the plane direction of the circuit board 11. The groove 12 does not penetrate the two surfaces of the circuit board 11. In a specific embodiment, the circuit board 11 includes a core board 111 and a prepreg 112. Among them, the core board 111 is a copper-clad laminate, which is the basic material for manufacturing the circuit board 11, including a base board and a copper foil covering the base board. The base board is made by impregnating materials such as paper base board, glass fiber cloth base board, synthetic fiber cloth base board, non-woven fabric base board, and composite base board with resin to make bonding sheets, and then combining multiple bonding sheets to make the base board. After making the base board, copper foil is covered on one or both sides, and then hot-pressed and cured to make the copper-clad laminate. In an embodiment, the copper foils on both surfaces of the core board 111 may or may not have circuit pattern layers, which are specifically set according to requirements and are not limited herein. The prepreg 112 is an interlayer bonding layer during lamination. Specifically, the prepreg 112 is mainly composed of resin and reinforcing materials. When manufacturing a multi-layer circuit board, glass fiber cloth is usually used as the reinforcing material, which is impregnated with resin glue, and then pre-baked by heat treatment to make a thin sheet. It will soften under heating and pressure, and will solidify after cooling, and has viscosity, and can bond adjacent two layers during the high-temperature pressing process.

[0024] Among them, the magnetic component 13 is annular, and it can be, for example, Figure 3 the circular ring shown, or it can be, for example, Figure 4 the square ring shown, or it can be other shaped rings, which are not limited herein.

[0025] A winding 131 is provided on the magnetic component 13 and surrounds the magnetic component 13 along the thickness direction of the magnetic component 13. The material of the winding 131 is copper, which is formed by electroplating, has an input end and an output end, and both the input end and the output end are connected to pads. In an embodiment, the winding 131 has more than 3 turns. Specifically, as Figure 3 and Figure 4 shown, the input end of the winding 131 is connected to the first pad 132, and the output end of the winding 131 is connected to the second pad 133. The magnetic component 13 is located in the groove 12, and there is a first insulating layer 14 between the magnetic component 13 and the groove 12. Among them, the first insulating layer 14 is filled by the melting and flowing of the prepreg during high-temperature pressing.

[0026] Among them, the circuit board 11 includes a circuit pattern layer. Specifically, the circuit pattern layer is located on the surface of the core board. After the magnetic component 13 is embedded in the groove 12, it is necessary to electrically connect the winding 131 on the magnetic component 13 to the circuit pattern layer of the circuit board 11. Therefore, first blind vias 16 and second blind vias 17 are provided at positions corresponding to the first pad 132 and the second pad 133 on the circuit board 11.

[0027] In a specific embodiment, the first pad 132 and the second pad 133 on the magnetic component 13 can be provided on the same surface of the magnetic component 13, or can be provided on opposite surfaces of the magnetic component 13. Specifically, when the first pad 132 and the second pad 133 are provided on the same surface of the magnetic component 13 as shown in Figure 3 and Figure 4 , the first blind vias 16 and the second blind vias 17 can be set at the positions as shown in Figure 2 . When the first pad 132 and the second pad 133 are provided on opposite surfaces of the magnetic component 13, the first blind vias 16 and the second blind vias 17 can be set at the positions as described in Figure 1 . As long as the first blind vias 16 and the second blind vias 17 can electrically connect the input end and the output end of the winding 131 to the circuit pattern layer of the circuit board 11, the specific positions are not limited herein. It can be understood that if the first blind vias 16 and the second blind vias 17 are to be conductive, the side walls of the first blind vias 16 and the second blind vias 17 have a conductive layer (not shown in the figure).

[0028] In an embodiment, the surface of the magnetic component 13 is further covered with a second insulating layer (not shown in the figure). The second insulating layer can be polyimide, which can protect the magnetic component 13, and the winding 131 is provided on the surface of the second insulating layer by electroplating.

[0029] In an embodiment, the material of the magnetic component 13 can be manganese-zinc alloy, nickel-zinc alloy, etc. The materials of the winding 131, the first pad 132, and the second pad 133 are copper.

[0030] In the inductance component shown in this embodiment, the magnetic component 13 is embedded in the circuit board 11, and the magnetic component 13 is provided with a winding 131. The winding 131 is electrically connected to the circuit pattern layer of the circuit board 11, thereby realizing the manufacture of the embedded inductance component and realizing the miniaturization of the product.

[0031] Please refer to Figure 2 , which is a schematic structural diagram of the second embodiment of the inductance component of the present invention. And Figure 1Compared with the first embodiment shown, the difference is that the inductance component in this embodiment further includes a magnetic core 15. In this embodiment, the circuit board 11 is provided with a first through hole 18 corresponding to the annular portion of the magnetic element 13, and the magnetic core 15 is inserted into the first through hole 18 and is flush with the two surfaces of the circuit board 11. Among them, when the magnetic core 15 is inserted into the first through hole 18, it passes through the annular portion of the magnetic element 13, and the magnetic core 15 and the annular portion of the magnetic element 13 have a first insulating layer 14. The same as the first embodiment, the first insulating layer 14 is the melted substance of the prepreg flowing in during high-temperature pressing.

[0032] In this embodiment, a magnetic core is arranged in the middle of the magnetic element 13 to further enhance the magnetic field and thus improve the performance of the inductance component.

[0033] Please refer to Figure 5 , which is a schematic flowchart of the first embodiment of the manufacturing method of the inductance component of the present invention. It includes:

[0034] Step S51: Provide a circuit board, and a groove is arranged on the circuit board.

[0035] Among them, the circuit board is made of a core board and prepregs. When manufacturing the circuit board, a groove is arranged at a specified position on the circuit board according to requirements.

[0036] Among them, the core board is a copper-clad laminate, which is the basic material for manufacturing the circuit board, including a base material board and copper foil covered on the base material board. The base material board is made by impregnating materials such as paper substrate, glass fiber cloth substrate, synthetic fiber cloth substrate, non-woven fabric substrate, and composite substrate with resin to make adhesive sheets, and then combining multiple adhesive sheets to make the base material board. Copper foil is covered on one or both sides of the made base material board, and then hot-pressed and cured to make the copper-clad laminate. In one embodiment, the copper foil on the two surfaces of the core board may or may not have a circuit pattern layer, which is specifically set according to requirements and is not limited here. The prepreg is an interlayer bonding layer during lamination. Specifically, the prepreg is mainly composed of resin and reinforcing materials. When manufacturing a multi-layer circuit board, glass fiber cloth is usually used as the reinforcing material, which is impregnated with resin glue, and then pre-baked by heat treatment to make a thin sheet. It will soften under heating and pressure, cure after cooling, and has viscosity, and can bond adjacent two layers during high-temperature pressing.

[0037] Step S52: Arrange a winding around the magnetic element along the thickness direction of the magnetic element.

[0038] Among them, the magnetic element is annular, specifically it can be circular or square, etc., which is not limited here. Arranging a winding around the magnetic element, specifically, electroplating is carried out around the magnetic element to form a metal winding around the magnetic element. Specifically, the winding starts to wind along the thickness direction of the magnetic element.

[0039] Step S53: embedding the magnetic element into the slot and performing high-temperature pressing; wherein the winding is electrically connected to the circuit board.

[0040] The magnetic element is placed in the slot and pressed at high temperature. Specifically, after the core plate and the prepreg are prepared and slotted, the magnetic element is placed in the slot, and then the core plate and the prepreg are stacked as required and pressed at high temperature. During the pressing process, the prepreg will melt into the first insulating layer, thereby filling the gap between the magnetic element and the slot.

[0041] The manufacturing method of the inductor component shown in this embodiment is used to realize the manufacturing of the embedded inductor component, thereby realizing the miniaturization of the product.

[0042] See also Figure 6 , is a schematic flow chart of a first embodiment of a method for manufacturing an inductor component of the present invention. Figure 5 Compared with the first embodiment shown, the difference lies in that:

[0043] Step S61: Disposing a second insulating layer on the magnetic element.

[0044] A second insulating layer is coated on the magnetic element, and specifically, the material of the second insulating layer is polyimide. The material of the magnetic element is one of manganese-zinc alloy and nickel-zinc alloy or any combination thereof.

[0045] Step S62: Electroplating is performed on the second insulating layer to form a winding that surrounds the magnetic element in the thickness direction.

[0046] Electroplating is performed on the surface of the second insulating layer to form a winding around the magnetic element. Specifically, the winding includes an input end and an output end, and surrounds the magnetic element along the thickness direction of the magnetic element. In one embodiment, the winding needs to be greater than or equal to 3 turns.

[0047] Step S63: Disposing a first pad connected to the input end of the winding and a second pad connected to the output end of the winding on the surface of the magnetic element perpendicular to the thickness direction.

[0048] A first pad and a second pad are provided at the input and output ends of the magnetic element to connect the input and output ends. Specifically, the first pad and the second pad can be manufactured at the same time when the winding is manufactured by electroplating.

[0049] Step S64: a first through hole is provided in the annular portion of the circuit board corresponding to the magnetic element.

[0050] Specifically, after the magnetic element is embedded in the circuit board, a first through hole penetrating the circuit board is provided at a position of the circuit board corresponding to the annular portion of the magnetic element. The diameter of the first through hole is smaller than the diameter of the annular portion of the magnetic element.

[0051] Step S65: Set a magnetic core in the first through hole; wherein, a first insulating layer is filled between the magnetic core and the magnetic component.

[0052] Set the magnetic core in the first through hole. In a specific embodiment, after setting the magnetic core in the first through hole, to ensure the adhesion between the magnetic core and the circuit board, the circuit board is subjected to high-temperature pressing. At this time, the semi-cured sheet melts to fill the gap between the magnetic core and the magnetic component to form a second insulating layer.

[0053] Step S66: Set a first blind hole at the position of the circuit board corresponding to the first pad, and set a second blind hole at the position of the circuit board corresponding to the second pad.

[0054] Specifically, after setting the magnetic core, set a first blind hole and a second blind hole at the positions of the first pad and the second pad of the circuit board corresponding to the magnetic component. The first blind hole and the second blind hole are used to electrically connect the circuit pattern layer on the circuit board to the input end and the output end of the winding. Specifically, the positions of the first blind hole and the second blind hole can be determined according to the positions of the first pad and the second pad. They can be set on the same side of the circuit board or on the opposite sides of the circuit board. There is no specific limitation.

[0055] Step S67: Set a conductive layer in the first blind hole and the second blind hole to electrically connect the input end and the output end of the winding to the circuit pattern layer.

[0056] To make the first blind hole and the second blind hole conductive, after making the first blind hole and the second blind hole, set a conductive layer on the side walls of the first blind hole and the second blind hole.

[0057] The inductor component and its manufacturing method provided by the present invention realize the manufacture of an embedded inductor component and the miniaturization of the product by opening a groove in the circuit board, embedding a magnetic component in the groove, and arranging a winding on the magnetic component.

[0058] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be included in the patent protection scope of the present application by the same token.

Claims

1. An inductance component, characterized in that, it comprises: a circuit board, on which a groove is provided; the circuit board includes a core board and prepreg, the core board is a copper clad laminate; the groove does not penetrate the opposite two surfaces of the circuit board; a magnetic element, embedded in the groove; wherein, a winding is provided on the magnetic element and surrounds the magnetic element along the thickness direction of the magnetic element, and the winding is electrically connected to the circuit board; the inductance component further includes: a magnetic core; the magnetic element is annular, and the axial direction of the magnetic core is perpendicular to the plane direction of the circuit board; the circuit board is provided with a first through hole corresponding to the annular part of the magnetic element; the magnetic core is inserted into the first through hole and is flush with the two surfaces of the circuit board; wherein, a first insulating layer is filled between the magnetic core and the magnetic element and between the magnetic element and the groove.

2. The inductance component according to claim 1, characterized in that, a first pad and a second pad are provided on the surface of the magnetic element perpendicular to the thickness direction of the circuit board; the first pad is electrically connected to the input end of the winding, and the second pad is electrically connected to the output end of the winding.

3. The inductance component according to claim 2, characterized in that, the positions of the first pad and the second pad corresponding to the circuit board have a first blind hole and a second blind hole; a circuit image layer is provided on the circuit board; the side walls of the first blind hole and the second blind hole have a conductive layer; the first pad is electrically connected to the circuit image layer through the first blind hole to electrically connect the input end of the winding to the circuit pattern layer; the second pad is electrically connected to the circuit pattern layer through the second blind hole to electrically connect the output end of the winding to the circuit pattern layer.

4. The inductance component according to claim 3, characterized in that, the first pad and the second pad are located on the same surface of the magnetic element; or the first pad and the second pad are located on the opposite two surfaces of the magnetic element.

5. The inductance component according to claim 1, characterized in that, a second insulating layer is coated on the magnetic element, the winding is located on the surface of the second insulating layer, and the winding material is copper.

6. A manufacturing method of an inductance component, characterized in that, it includes: providing a circuit board, on which a groove is provided; the circuit board includes a core board and prepreg, the core board is a copper clad laminate; the groove does not penetrate the opposite two surfaces of the circuit board; providing a winding on the magnetic element and surrounding the magnetic element along the thickness direction of the magnetic element; embedding the magnetic element into the groove and performing high-temperature pressing; wherein, the winding is electrically connected to the circuit board; the magnetic element is annular; the step of providing a winding on the magnetic element and surrounding the magnetic element along the thickness direction of the magnetic element includes: providing a second insulating layer on the magnetic element; performing electroplating on the second insulating layer to form a winding surrounding along the thickness direction of the magnetic element; A first pad for connecting the input end of the winding and a second pad for connecting the output end of the winding are provided on the surface of the magnetic component perpendicular to the thickness direction; The magnetic component is embedded in the groove body and subjected to high-temperature pressing; wherein, the step of electrically connecting the winding to the circuit board further includes: A first through hole is provided in the circuit board corresponding to the annular portion of the magnetic component; A magnetic core is provided in the first through hole; wherein, a first insulating layer is filled between the magnetic core and the magnetic component; the magnetic core is inserted into the first through hole and is flush with the two surfaces of the circuit board.

7. According to the manufacturing method described in claim 6, characterized in that, the circuit board includes a circuit pattern layer; The magnetic component is embedded in the groove body and subjected to high-temperature pressing; wherein, after the step of electrically connecting the winding to the circuit board, it further includes: A first blind hole is provided at the position of the circuit board corresponding to the first pad, and a second blind hole is provided at the position of the circuit board corresponding to the second pad; A conductive layer is provided in the first blind hole and the second blind hole to electrically connect the input end and the output end of the winding to the circuit pattern layer.

Images