Display Devices

Abstract

The present application relates to a display device. The display device includes: a flexible substrate including a first surface and a second surface opposite to the first surface, and sequentially including a first portion located in a display area, a second portion located in a non-display area, a third portion bent in a direction opposite to the display surface, a fourth portion, a fifth portion bent in a direction toward the display surface, and a sixth portion; a plurality of signal wirings located on the first surface at the second portion to the sixth portion; and a plurality of first connection wirings located on the second surface at the second portion, and the second portion overlaps with the fourth portion, the fifth portion, and the sixth portion, and the signal wirings and the first connection wirings are connected to each other on the second surface at the second portion.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0082701 filed on July 9, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0003] Aspects of embodiments of the present disclosure relate to a display device. Background Art

[0004] The display device can be used in portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), smart watches, watch phones, mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, and ultra mobile PCs (UMPCs), and can also be used as display screens for various products such as televisions, notebook computers, monitors, billboards, and devices for the Internet of Things (IoT).

[0005] Among display devices, a flexible display device that can be bent or folded like paper and display a screen by providing a display and a driver on a flexible substrate including a flexible material has attracted attention. In the flexible display device, a signal wiring connected from the display is provided on one surface of the flexible substrate, and a driver integrated circuit is installed at an end of the signal wiring. In this case, when the driver integrated circuit is installed on the other surface of the flexible substrate, cracks may occur in the signal wiring in the driver provided in the flexible substrate due to the stepped portion of the driver integrated circuit itself. Summary of the invention

[0006] According to an aspect of an embodiment of the present disclosure, there is provided a display device in which cracks of a signal wiring of a driver of a flexible substrate are prevented or substantially prevented when a driver integrated circuit is mounted.

[0007] It should be understood that the aspects and objects of the present disclosure are not limited to the above-mentioned aspects and objects, and other aspects and objects of the present disclosure will be apparent to those skilled in the art from the following description.

[0008] According to one or more embodiments of the present disclosure, a display device includes a display area having a plurality of pixels and a non-display area located at a side of the display area, the display device including: a flexible substrate including a first surface and a second surface opposite to the first surface, the flexible substrate sequentially including a first portion located in the display area, a second portion located in the non-display area, a third portion bent in a direction opposite to the display surface, a fourth portion, a fifth portion bent in a direction toward the display surface, and a sixth portion; a plurality of signal wirings located on the first surface at the second portion to the sixth portion of the flexible substrate; and a plurality of first connection wirings located on the second surface at the second portion of the flexible substrate, wherein the second portion overlaps with the fourth portion, the fifth portion, and the sixth portion, and the signal wirings and the first connection wirings are connected to each other on the second surface at the second portion of the flexible substrate.

[0009] The first portion, the second portion, the fourth portion, and the sixth portion of the flexible substrate may include planar surfaces.

[0010] A width of the third portion of the flexible substrate in the direction toward the display surface may be greater than a width of the fifth portion in the direction toward the display surface.

[0011] The display device may further include a driving integrated circuit on the second surface at the second portion of the flexible substrate, wherein the first connection wiring is electrically connected to the driving integrated circuit.

[0012] The display device may further include a printed circuit board and a second connection wiring on the second surface of the flexible substrate, wherein the second connection wiring electrically connects the printed circuit board and the driving integrated circuit.

[0013] The first connection wiring and the second connection wiring may be directly located on the second surface of the flexible substrate.

[0014] The display device may further include a space and a double-sided tape, wherein the space is positioned between the third portion and the sixth portion of the flexible substrate, and the double-sided tape is located in the space.

[0015] The display device may further include a spacer between the third portion of the flexible substrate and the double-sided tape, wherein the spacer is in direct contact with the third portion of the flexible substrate and side surfaces of the double-sided tape.

[0016] The display device may further include a conductive coupling layer between the signal wiring and the first connection wiring, wherein the conductive coupling layer electrically couples the signal wiring and the first connection wiring.

[0017] The display device may further include a bent protection layer located on the first surface at the third to fifth portions of the flexible substrate and exposing the first connection wiring at the sixth portion.

[0018] The display device may further include a rigid substrate located on the second surface at the first and second portions of the flexible substrate and including a third surface in contact with the flexible substrate and a fourth surface opposite to the third surface, wherein the first connection wiring is directly located on the fourth surface of the rigid substrate.

[0019] The first connection wiring may be recessed from the second surface of the flexible substrate and may be located inside the flexible substrate.

[0020] Each pixel of the display area may include at least one thin film transistor, and the signal wiring may be electrically connected to the thin film transistor.

[0021] According to one or more embodiments of the present disclosure, a display device includes a display area having a thin film transistor and a non-display area located at a side of the display area, the display device including: a flexible substrate including a first surface and a second surface opposite to the first surface, the flexible substrate sequentially including a first portion located in the display area, a second portion located in the non-display area, a third portion bent in a direction opposite to the display surface, a fourth portion, a fifth portion bent in a direction toward the display surface, and a sixth portion; a first conductive layer located on the first surface of the flexible substrate; a second conductive layer located on the first conductive layer; and a plurality of first connection wirings located on the second surface at the second portion of the flexible substrate, wherein the first conductive layer includes a gate electrode located on the first portion, the second conductive layer includes a source electrode and a drain electrode located on the first portion and a plurality of signal wirings located on the second portion to the sixth portion, the second portion overlaps the fourth portion, the fifth portion and the sixth portion, and the signal wirings and the first connection wirings are connected to each other on the second surface at the second portion of the flexible substrate.

[0022] The first portion, the second portion, the fourth portion, and the sixth portion of the flexible substrate may include planar surfaces.

[0023] A width of the third portion of the flexible substrate in the direction toward the display surface may be greater than a width of the fifth portion in the direction toward the display surface.

[0024] The display device may further include a driving integrated circuit on the second surface at the second portion of the flexible substrate, wherein the first connection wiring is electrically connected to the driving integrated circuit.

[0025] The display device may further include a printed circuit board and a second connection wiring on the second surface of the flexible substrate, wherein the second connection wiring electrically connects the printed circuit board and the driving integrated circuit.

[0026] The first connection wiring and the second connection wiring may be directly located on the second surface of the flexible substrate.

[0027] Other aspects and details of exemplary embodiments are included in the following detailed description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other aspects and features of the present disclosure will become more apparent by describing some exemplary embodiments of the present disclosure in more detail with reference to the accompanying drawings, in which:

[0029] Figure 1 is a plan view showing a display product including a plurality of display devices according to an exemplary embodiment;

[0030] Figure 2 is a plan view showing a display device according to an exemplary embodiment;

[0031] Figure 3 Shown along Figure 2 A cross-sectional view of the display device taken along lines II-II' and III-III';

[0032] Figure 4 is a plan view showing components disposed on a first surface of a display panel according to an exemplary embodiment;

[0033] Figure 5 is a plan view showing components disposed on a second surface of a display panel;

[0034] Figures 6 to 9 is a cross-sectional view showing a manufacturing process of a display device according to an exemplary embodiment;

[0035] Fig.10 is a cross-sectional view showing a display device according to another exemplary embodiment;

[0036] Fig.11 is a cross-sectional view showing a display device according to another exemplary embodiment;

[0037] Fig.12 is a cross-sectional view showing a display device according to another exemplary embodiment;

[0038] Fig.13 is a cross-sectional view showing a display device according to another exemplary embodiment; and

[0039] Figures 14 to 17 is a cross-sectional view illustrating a manufacturing process of a display device according to an exemplary embodiment. DETAILED DESCRIPTION

[0040] According to some exemplary embodiments described below with reference to the accompanying drawings, the aspects and features of the present disclosure and the methods for implementing the present disclosure will be more clearly understood. However, the present disclosure is not limited to the following exemplary embodiments described below, but can be implemented in other forms. That is, the scope of the present disclosure is limited by the claims.

[0041] It should be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, directly connected to, or directly coupled to another element, or there may be one or more intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0042] For ease of description, spatially relative terms such as "beneath", "below", "lower", "upper", "upper", etc. may be used herein to describe the relationship between one element or feature and another element or feature as shown in the figure. It should be understood that in addition to the orientation depicted in the figure, the spatially relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as being "below" or "below" other elements or features will then be oriented "above" the other elements or features. Therefore, the exemplary term "below" can include both upper and lower orientations. For example, the device can be oriented otherwise (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptors used in this article should be interpreted accordingly.

[0043] It should be understood that, although the terms "first", "second", etc. can be used in this article to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the "first" element, "first" component, "first" region, "first" layer or "first" part discussed below can be referred to as "second" element, "second" component, "second" region, "second" layer or "second" part.

[0044] The meaning of “include” or “comprise” may specify a property, a fixed number, steps, operations, elements, components or a combination thereof, but does not exclude other properties, fixed numbers, steps, operations, elements, components or a combination thereof.

[0045] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as those commonly understood by those skilled in the art to which the exemplary embodiments of the inventive concept belong. It should also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such in this article.

[0046] Like reference numerals refer to like elements throughout the specification and drawings.

[0047] Herein, some exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0048] Figure 1 is a plan view illustrating a display product including a plurality of display devices according to an exemplary embodiment. Figure 2 is a plan view showing a display apparatus according to an exemplary embodiment. Figure 3 Shown along Figure 2 A cross-sectional view of the display device taken along lines II-II' and III-III'. Figure 4 is a plan view showing components disposed on a first surface of a display panel according to an exemplary embodiment; and Figure 5 is a plan view showing components disposed on the second surface of the display panel.

[0049] The display device 1 is a device for displaying still images or moving images. The display device 1 can be used in any portable electronic device such as a mobile phone, a smart phone, a tablet personal computer (PC), a smart watch, a watch phone, a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player (PMP), a navigation device, an ultra mobile PC (UMPC), and can also be used as a display screen for various products such as a television, a notebook computer, a monitor, a billboard, and a device for the Internet of Things (IoT).

[0050] Reference Figures 1 to 5 In an exemplary embodiment, the display device 1 may be a spliced ​​display in which a plurality of display panels or a plurality of display devices are connected. Figure 1 As shown in , a plurality of display panels may be arranged in a matrix arrangement in a first direction DR1 and a second direction DR2. Figure 1 , five columns of display panels are arranged in the first direction DR1, and three rows of display panels are arranged in the second direction DR2. However, there is no limitation on the number of display panels arranged in the first direction DR1 and the second direction DR2.

[0051] exist Figure 1 In the following drawings, one display panel or a display device constituting the display device 1 according to the exemplary embodiment will be mainly described.

[0052] Reference Figure 2 The display device 1 may include a display panel 100 configured to display an image, a supporting film 300 disposed under the display panel 100 , a driving integrated circuit 500 disposed on the display panel 100 , and a printed circuit board 700 disposed on the display panel 100 and connected to the driving integrated circuit 500 .

[0053] The display panel 100 may be, for example, an organic light emitting diode display panel. A case where the display panel 100 is an organic light emitting diode display panel will be described in the following exemplary embodiments. However, the present disclosure is not limited thereto, and examples of the display panel 100 may include other types of display panels, such as a liquid crystal display (LCD) panel, a quantum dot organic light emitting diode (QD-OLED) display panel, a quantum dot LCD (QD-LCD) panel, a quantum nanoluminescent display (QNED) panel, and a micro-luminescent display (LED) panel.

[0054] The display panel 100 includes a display area DA and a non-display area NA disposed around the display area DA, the display area DA including a plurality of pixel areas PX. In an embodiment, the display area DA may have a rectangular shape whose corners have right angles in a plan view, or whose corners are rounded in a plan view. In an embodiment, the display area DA may have a short side and a long side. The short side of the display area DA may be a side extending in the first direction DR1. The long side of the display area DA may be a side extending in the second direction DR2. However, the planar shape of the display area DA is not limited to a rectangular shape, and the display area DA may have a circular shape, an elliptical shape, or other various shapes.

[0055] In an embodiment, the non-display area NA may be disposed adjacent to the lower short side of the two short sides of the display area DA in the second direction DR2 of the drawings. However, the present disclosure is not limited thereto, and the non-display area NA may be disposed adjacent to the two short sides of the display area DA. Herein, the non-display area NA adjacent to the lower short side of the two short sides of the display area DA in the second direction DR2 will be mainly described. Of course, the description of the non-display area NA adjacent to the lower short side of the two short sides of the display area DA in the second direction DR2 of the drawings may be similarly applied to the non-display area NA adjacent to the upper short side of the display area DA in the second direction DR2.

[0056] The supporting film 300 may be disposed in the display area DA of the display panel 100. The supporting film 300 may be used to support the display panel 100 in the display area DA. The supporting film 300 may be made of at least one selected from polyethylene terephthalate (PET), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), and cycloolefin polymer (COP). In an embodiment, the supporting film 300 may be made of at least one selected from polyethylene terephthalate (PET), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), and cycloolefin polymer (COP). Figure 2 Unlike shown in , the supporting film 300 may be partially disposed in the non-display area NA.

[0057] The driving integrated circuit 500 may be disposed in the non-display area NA of the display panel 100. When the display panel 100 includes a flexible substrate as described below, the driving integrated circuit 500 includes a chip on plastic (COP) disposed on the flexible substrate of the display panel 100. The driving integrated circuit 500 may be a data driving chip in which a data driving circuit and the like are integrated.

[0058] The driver integrated circuit 500 may be provided on a surface opposite to the display surface of the display panel 100. That is, the driver integrated circuit 500 may be provided on the lower surface of the display panel 100. The driver integrated circuit 500 may be connected to a plurality of signal wirings provided on a surface in the direction of the display surface of the display panel 100. In the display device 1 according to the embodiment, connection wirings may also be provided on a surface in the direction opposite to the display surface of the display panel 100, and a plurality of signal wirings and the driver integrated circuit 500 may be electrically connected through the connection wirings.

[0059] The printed circuit board 700 may be disposed in the non-display area NA of the display panel 100. The printed circuit board 700 may be electrically connected to the driving integrated circuit 500. The printed circuit board 700 may be used to apply a control signal for controlling the driving integrated circuit 500 to the driving integrated circuit 500.

[0060] Reference Figure 3 , the display panel 100 may include a flexible substrate 110, a plurality of conductive layers, a plurality of insulating layers configured to insulate the conductive layers from each other, and a light emitting organic layer EL.

[0061] The flexible substrate 110 is disposed in the display area DA and the non-display area NA (eg, disposed in the entire display area DA and the non-display area NA). The flexible substrate 110 may be used to support various elements disposed thereon. In an implementation, the flexible substrate 110 may be made of a flexible material.

[0062] Examples of polymer materials of the flexible substrate 110 may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), and combinations thereof. In an embodiment, the flexible substrate 110 may be a bendable, foldable, and rollable flexible substrate.

[0063] The flexible substrate 110 may have a first surface 110 a in a direction of a display surface or in a direction toward the display surface and a second surface 110 b in a direction opposite to the display surface.

[0064] The flexible substrate 110 may include first to sixth portions 111 to 116 sequentially disposed in a direction from one end in the display area DA to the other end in the non-display area NA. The first portion 111 may be disposed in the display area DA, and the second to sixth portions 112 to 116 may be disposed in the non-display area NA.

[0065] The first portion 111 of the flexible substrate 110 may be used to support an upper conductive layer, an insulating layer, a light-emitting organic layer EL, etc., which will be described below.

[0066] The second portion 112 may be located at a side of the first portion 111 of the flexible substrate 110 in the second direction DR2. The third portion 113 may be located at a side of the second portion 112 of the flexible substrate 110. The fourth portion 114 may be located at a side of the third portion 113 of the flexible substrate 110. The fifth portion 115 may be located at a side of the fourth portion 114 of the flexible substrate 110. The sixth portion 116 may be located at a side of the fifth portion 115 of the flexible substrate 110. It can be understood that adjacent portions of the first portion 111 to the sixth portion 116 of the flexible substrate 110 are physically connected to each other.

[0067] In an embodiment, if Figure 3 As shown in , the second portion 112, the fourth portion 114, and the sixth portion 116 of the flexible substrate 110 may include a flat surface, and the third portion 113 and the fifth portion 115 of the flexible substrate 110 may include a curved surface. However, the present disclosure is not limited thereto, and it is understood that the second portion 112, the fourth portion 114, and the sixth portion 116 of the flexible substrate 110 may be partially curved to have a specific curvature, but compared to the third portion 113 and the fifth portion 115, the second portion 112, the fourth portion 114, and the sixth portion 116 of the flexible substrate 110 may be substantially flat and may not be curved.

[0068] The third portion 113 and the fifth portion 115 of the flexible substrate 110 may include a curved surface that is bent to have a specific curvature. Figure 3 As shown in , the third portion 113 of the flexible substrate 110 may be bent in the direction opposite to the display surface, and the fifth portion 115 of the flexible substrate 110 may be bent in the direction of the display surface. That is, the flexible substrate 110 may be flat at the first portion 111 and the second portion 112, may be bent in the direction opposite to the display surface at the third portion 113, may be flat at the fourth portion 114, may be bent in the direction of the display surface at the fifth portion 115, and may be flat at the sixth portion 116 which is the end portion of the flexible substrate 110.

[0069] In an embodiment, if Figure 3 , the length of the third portion 113 in the direction from the third portion 113 to the fourth portion 114 of the flexible substrate 110 may be greater than the length of the fifth portion 115 in the direction from the fifth portion 115 to the sixth portion 116. In an embodiment, the sixth portion 116 located at the side of the fifth portion 115 of the flexible substrate 110 may not contact the second surface 110b of the flexible substrate 110 located at the second portion 112, and may be located below the second surface 110b of the second portion 112 to be spaced apart (e.g., slightly spaced apart) from the second surface 110b of the second portion 112.

[0070] Similarly, in an embodiment, the length of the fourth portion 114 in the direction from the fourth portion 114 to the fifth portion 115 of the flexible substrate 110 may be greater than the length of the sixth portion 116 in the direction from the fifth portion 115 to the sixth portion 116. Therefore, the sixth portion 116 of the flexible substrate 110 may not contact the second surface 110b of the flexible substrate 110 at the third portion 113, and may be positioned to be spaced apart (e.g., slightly spaced apart) from the second surface 110b of the third portion 113.

[0071] The second portion 112 of the flexible substrate 110 may be disposed to overlap with the fourth portion 114 and the sixth portion 116 of the flexible substrate 110 in the thickness direction thereof. In addition, the second surface 110b of the flexible substrate 110 located at the second portion 112 and the first surface 110a of the flexible substrate 110 located at the sixth portion 116 may be disposed to face each other. In addition, the second surface 110b of the flexible substrate 110 located at the fourth portion 114 and the second surface 110b of the flexible substrate 110 located at the sixth portion 116 may be arranged to face each other.

[0072] The buffer layer BF may be disposed on the flexible substrate 110. The buffer layer BF may prevent or substantially prevent external moisture and oxygen from penetrating through the flexible substrate 110. In an embodiment, the buffer layer BF may include silicon nitride (SiN x ) film, silicon oxide (SiO 2 ) film and silicon oxynitride (SiO x N y ) membrane.

[0073] The semiconductor layer ACT may be disposed on the buffer layer BF. The semiconductor layer ACT forms a channel of the thin film transistor. The semiconductor layer ACT may be disposed in each pixel of the display area DA, and in some cases may be disposed in the non-display area NA. The semiconductor layer ACT may include a source / drain region and an active region. In an embodiment, the semiconductor layer ACT may include polycrystalline silicon.

[0074] The first insulating layer 121 may be disposed on the semiconductor layer ACT. The first insulating layer 121 may be a gate insulating film having a gate insulating function. In an embodiment, the first insulating layer 121 may include a silicon compound, a metal oxide, or the like as an inorganic material. For example, the first insulating layer 121 may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, or the like. These may be used alone or in combination with each other.

[0075] The first insulating layer 121 may be disposed over the first portion 111 and the second portion 112 of the flexible substrate 110, and the first insulating layer 121 may be removed or omitted from over the third portion 113 to the sixth portion 116. That is, by removing or omitting the first insulating layer 121 over the third portion 113 where the flexible substrate 110 begins to bend, the flexibility of the flexible substrate 110 may be ensured when the flexible substrate 110 is bent. Similar to the first insulating layer 121, the second insulating layer 122 to be described below may be disposed over the first portion 111 and the second portion 112, and the second insulating layer 122 may be removed or omitted from over the third portion 113 to the sixth portion 116.

[0076] The first conductive layer may be disposed on the first insulating layer 121. The first conductive layer may include, for example, a gate electrode 131 of a thin film transistor and a first electrode of a storage capacitor. In an embodiment, the first conductive layer may include at least one metal selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W) and copper (Cu). The first conductive layer may be a single film or a stacked film made of one or more materials selected from the above materials.

[0077] The second insulating layer 122 may be disposed on the first conductive layer. The second insulating layer 122 may insulate the first conductive layer and the second conductive layer from each other. In an embodiment, the second insulating layer 122 may be made of a material selected from the above materials for the first insulating layer 121.

[0078] The second conductive layer may be disposed on the second insulating layer 122. The second conductive layer may include a source electrode 141, a drain electrode 143, and a plurality of signal wirings 145. In an embodiment, the second conductive layer may include at least one selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). In an embodiment, the second conductive layer may be a single film made of one of the above materials. However, the present disclosure is not limited thereto, and the second conductive layer may be a stacked film. For example, the second conductive layer may have a stacked structure of Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu, etc. In an exemplary embodiment, the second conductive layer may have a stacked structure of Ti / Al / Ti.

[0079] The source electrode 141 and the drain electrode 143 of the second conductive layer are disposed over the first portion 111 of the flexible substrate 110, and the plurality of signal wirings 145 of the second conductive layer may be disposed over the second portion 112 to the sixth portion 116 of the flexible substrate 110. The plurality of signal wirings 145 may be flat or curved along the shape of the flat surface or the curved surface of the flexible substrate 110 under the plurality of signal wirings 145. That is, the signal wirings 145 disposed over the second portion 112, the fourth portion 114, and the sixth portion 116 of the flexible substrate 110 may be flat, and the signal wirings 145 disposed over the third portion 113 and the fifth portion 115 may be curved.

[0080] The signal wiring 145 disposed over the sixth portion 116 of the flexible substrate 110 may face the second surface 110b of the flexible substrate 110. As described below, the signal wiring 145 disposed over the sixth portion 116 of the flexible substrate 110 may be electrically coupled to the first connection wiring 180 disposed on the second surface 110b located at the second portion 112 of the flexible substrate 110.

[0081] In an embodiment, the bending protection layer 170 may be disposed on the first surface 110a located at the third portion 113 to the fifth portion 115 of the flexible substrate 110. The bending protection layer 170 may be bent to surround, cover, and protect the signal wiring 145 disposed on the first surface 110a of the third portion 113 to the fifth portion 115 of the flexible substrate 110 from external influences, and may expose the signal wiring 145 above the sixth portion 116. The signal wiring 145 exposed by the bending protection layer 170 may define a first pad PAD1. The exposed first pad PAD1 of the signal wiring 145 may be coupled to a first connection wiring 180 to be described below.

[0082] Reference Figure 4 , the plurality of signal wirings 145 may be arranged in the first direction DR1. Similarly, the first pads PAD1 as end portions of the plurality of signal wirings 145 may be arranged in the first direction DR1.

[0083] Reference again Figure 3 , the third insulating layer 123 may be disposed on the second conductive layer. In an embodiment, the third insulating layer 123 may include an organic insulating material. The organic insulating material may include at least one selected from a polyacrylate-based resin, an epoxy resin, a phenolic resin, a polyamide-based resin, a polyimide-based resin, an unsaturated polyester-based resin, a polyphenylene ether-based resin, a polyphenylene sulfide-based resin, and benzocyclobutene (BCB).

[0084] In an embodiment, similar to the first insulating layer 121 and the second insulating layer 122 described above, the third insulating layer 123 and the bank layer BANK described below may be removed or omitted from above the third portion 113 to the sixth portion 116 where the flexible substrate 110 starts to bend, and the third insulating layer 123 and the bank layer BANK are upper structures relative to the second conductive layer. The anode ANO is disposed on the third insulating layer 123. The anode ANO may be electrically connected to the drain electrode 143 through a contact hole passing through the third insulating layer 123.

[0085] The bank layer BANK may be disposed on the anode ANO. The bank layer BANK may be disposed in the display area DA and the non-display area NA, and may be disposed over the first portion 111 and the second portion 112 of the flexible substrate 110. The bank layer BANK may have a contact hole through which the anode ANO is exposed. The bank layer BANK may be made of an organic insulating material or an inorganic insulating material. For example, the bank layer BANK may be made of at least one selected from a photoresist, a polyimide-based resin, an acrylic-based resin, a silicon compound, and a polypropylene-based resin.

[0086] The light emitting organic layer EL may be disposed on the upper surface of the anode ANO and in the opening of the bank layer BANK. The cathode CAT is disposed on the light emitting organic layer EL and the bank layer BANK. The cathode CAT may be a common electrode disposed on a plurality of pixels.

[0087] The thin film encapsulation layer 160 is disposed on the cathode CAT. The thin film encapsulation layer 160 may be disposed in the display area DA. The thin film encapsulation layer 160 may cover the organic light emitting diode. In an embodiment, the thin film encapsulation layer 160 may be a stacked film in which an inorganic film and an organic film are alternately stacked. In an embodiment, the thin film encapsulation layer 160 may include a first encapsulation inorganic film, an encapsulation organic film, and a second encapsulation inorganic film stacked in sequence.

[0088] The first connection wiring 180 may be provided on the second surface 110b located at the second portion 112 of the flexible substrate 110. The plurality of first connection wirings 180 may be electrically connected to the plurality of signal wirings 145 described above. Figure 3 As shown in FIG. 1 , the first connection wiring 180 and the signal wiring 145 may be coupled to each other on the second surface 110b located at the second portion 112 of the flexible substrate 110. In an embodiment, a conductive coupling member CM for coupling the first connection wiring 180 and the signal wiring 145 may be provided between the first connection wiring 180 and the signal wiring 145. In an embodiment, the conductive coupling member CM may be an anisotropic conductive film (ACF).

[0089] In an embodiment, the first connection wiring 180 may include at least one selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W) and copper (Cu). In an embodiment, the first connection wiring 180 may be a single film made of one of the above materials. However, the present disclosure is not limited thereto, and in an embodiment, the first connection wiring 180 may be a stacked film made of silver. For example, the first connection wiring 180 may have a stacked structure of Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu, etc.

[0090] In an embodiment, a protective organic layer PL may be disposed on the second surface 110b located at the second portion 112 of the flexible substrate 110. The protective organic layer PL may cover and protect the first connection wiring 180 located on the second surface 110b located at the second portion 112 of the flexible substrate 110, and may expose the first connection wiring 180 located at an end region of the second portion 112 adjacent to the third portion 113 of the flexible substrate 110. The first connection wiring 180 exposed by the protective organic layer PL may define a second pad PAD2. The exposed second pad PAD2 of the first connection wiring 180 may be coupled to the above-described first pad PAD1.

[0091] like Figure 5 As shown in FIG. 1 , the protective organic layer PL may be disposed between the printed circuit board 700 and the second pad PAD2 in a plan view. However, the present disclosure is not limited thereto, and in an embodiment, in a plan view, the protective organic layer PL may also be disposed to extend further upward in the second direction DR2 than the driving integrated circuit 500 located on the second surface 110b of the flexible substrate 110.

[0092] The driving integrated circuit 500 may be disposed on the second surface 110 b of the second portion 112 of the flexible substrate 110 , and may be electrically connected to the first connection wiring 180 .

[0093] In an embodiment, a second connection wiring 190 may be further provided between the driving integrated circuit 500 and the printed circuit board 700. The second connection wiring 190 may electrically connect the driving integrated circuit 500 and the printed circuit board 700. In an embodiment, the second connection wiring 190 may be made of at least one selected from the above-mentioned materials for the first connection wiring 180. In an embodiment, the second connection wiring 190 may be made of the same material as the first connection wiring 180, but the present disclosure is not limited thereto.

[0094] In the display device 1 according to the exemplary embodiment, the signal wiring 145 may be disposed on the first surface 110a of the flexible substrate 110, and the first connection wiring 180 electrically connected to the signal wiring 145 and the driving integrated circuit 500 may be disposed on the second surface 110b of the flexible substrate 110. In an embodiment, the driving integrated circuit 500 may be directly mounted on the second surface 110b of the flexible substrate 110, rather than on a printed circuit board that increases the non-display area NA of the display device 1, thereby realizing a frameless display device 1.

[0095] Furthermore, the signal wiring 145 and the first connection wiring 180 for electrically connecting the driving integrated circuit 500 and each transistor of the display area DA may be coupled to each other on the second surface 110 b at the second portion 112 of the flexible substrate 110 , thereby realizing a frameless display device 1 .

[0096] In an embodiment, the driver integrated circuit 500 may be disposed on the second surface 110b of the flexible substrate 110, but not at the end portion (e.g., the sixth portion 116) of the flexible substrate 110, and thus, the driver integrated circuit 500 may be stably attached. In addition, physical damage to the flexible substrate 110 itself generated in the process of attaching the driver integrated circuit 500 to the end portion (e.g., the sixth portion 116 susceptible to physical damage due to bending, etc.) of the flexible substrate 110 may be prevented or substantially prevented, and cracks in the signal wiring 145 caused by the physical damage may be prevented or substantially prevented.

[0097] In this article, we will refer to Figures 6 to 9 A method of manufacturing the display device 1 according to an exemplary embodiment is described.

[0098] Figures 6 to 9 is a cross-sectional view illustrating a manufacturing process of a display device according to an exemplary embodiment.

[0099] Reference Figure 6 , a protection film PF is disposed over the first portion 111 to the sixth portion 116 of the flexible substrate 110 .

[0100] like Figure 6 As shown in the figure, the protective film PF can be disposed on the cathode CAT disposed above the first portion 111, the bank layer BANK disposed above the second portion 112, and the curved protective layer 170 and the conductive connecting member CM disposed above the third portion 113 to the sixth portion 116 of the flexible substrate 110 and disposed on the signal wiring 145.

[0101] The protective film PF can be used to support the flexible substrate 110 so that the second surface 110b (see Figure 3 ) is formed on a supporting film 300a to be described below.

[0102] After the process of forming the support film 300a and the process of depositing the first connection wiring 180 and the second connection wiring 190 described below, the protection film PF may be peeled off and removed from the flexible substrate 110. The protection film PF may be attached to the cathode CAT disposed over the first portion 111, the bank layer BANK disposed over the second portion 112, and the curved protection layer 170 and the conductive coupling member CM disposed over the third portion 113 to the sixth portion 116 of the flexible substrate 110 and disposed on the signal wiring 145 with a certain bonding force, but after the peeling process, the adhesive material may not remain on the above-mentioned members. For this reason, the bonding force between the protection film PF and the cathode CAT located over the first portion 111, between the protection film PF and the bank layer BANK disposed over the second portion 112, and between the protection film PF and the curved protection layer 170 and the conductive coupling member CM disposed over the third portion 113 to the sixth portion 116 of the flexible substrate 110 and disposed on the signal wiring 145 may be considered to be weak enough to easily peel off the protection film PF. Furthermore, the first bending axis BL1 corresponds to a boundary between the second portion 112 and the third portion 113 , and the second bending axis BL2 corresponds to a boundary between the fifth portion 115 and the sixth portion 116 and a boundary between the fourth portion 114 and the fifth portion 115 (not shown).

[0103] Reference Figure 7 , on the second surface 110b of the flexible substrate 110 (see Figure 3 ) is provided with the above-mentioned supporting film 300a. The supporting film 300a may be provided on the second surface 110b located at the first portion 111 to the sixth portion 116 of the flexible substrate 110. Figure 3 The supporting film 300 of FIG. 300 describes the material and function of the supporting film 300 a , and thus a redundant description thereof will be omitted.

[0104] Reference Figure 8 , except for the supporting film 300 a disposed to overlap with the first portion 111 of the flexible substrate 110 , the region of the supporting film 300 a disposed to overlap with the second portion 112 to the sixth portion 116 of the flexible substrate 110 is peeled off and removed.

[0105] Regions of the supporting film 300 a disposed to overlap the second to sixth portions 112 to 116 of the flexible substrate 110 may be peeled and removed, and thus first and second connection wirings 180 and 190 to be described below may be deposited on the second portion 112 of the flexible substrate 110 .

[0106] In an embodiment, a scribing process may be used to perform the operation of removing the region of the support film 300a disposed to overlap the second to sixth portions 112 to 116 of the flexible substrate 110. The scribing process may include scribing the support film 300a at a position corresponding to a boundary between the first and second portions 111 and 112 of the flexible substrate 110.

[0107] In an embodiment, the scribing process may be performed using a hot knife or a laser component.

[0108] For example, when a scribing process is performed using a laser member or a hot knife, a burr (not shown) may be formed at a boundary of the supporting film 300 a corresponding to a boundary between the first portion 111 and the second portion 112 of the flexible substrate 110 .

[0109] Reference Fig. 9 , a first connection wiring 180 and a second connection wiring 190 are deposited on the second surface 110 b at the second portion 112 of the flexible substrate 110 .

[0110] In an embodiment, the first connection wiring 180 and the second connection wiring 190 may be deposited by the same deposition process. That is, the first connection wiring 180 and the second connection wiring 190 may be formed in the same layer and may be made of the same material. Figures 3 to 5 The materials and functions of the first connection wiring 180 and the second connection wiring 190 are described, and thus, redundant descriptions thereof will be omitted.

[0111] Herein, other exemplary embodiments will be described. In the following exemplary embodiments, the same reference numerals will be given to the same components as those of the above-described exemplary embodiments, and descriptions thereof will be omitted or simplified.

[0112] Fig.10 is a cross-sectional view showing a display device according to another exemplary embodiment.

[0113] Reference Fig.10 The display apparatus 2 according to the present exemplary embodiment is different from the above-described display apparatus 1 in that the display apparatus 2 further includes a curved coupling member 800 .

[0114] More specifically, the display device 2 according to the present exemplary embodiment may further include a second surface 110b disposed at the third portion 113 of the flexible substrate 110 (see Figure 3) and the end of the sixth portion 116 of the flexible substrate 110. The bending coupling member 800 may be disposed to overlap with the third portion 113 of the flexible substrate 110. Therefore, when the flexible substrate 110 is bent, the bending coupling member 800 may be used to support the flexible substrate 110 and simultaneously prevent or substantially prevent deformation of the bent shape of the flexible substrate 110 in the irregular space of the third portion 113 of the flexible substrate 110.

[0115] In an embodiment, the bending coupling member 800 may include a buffer material and may be used to absorb external impact and / or internal impact applied to the flexible substrate 110 attached in its thickness direction. However, the present disclosure is not limited thereto, and the bending coupling member 800 may not overlap with the third portion 113 of the flexible substrate 110 and may be disposed between the adjacent second portion 112 and fourth portion 114.

[0116] In an embodiment, the curved coupling member 800 is not limited to one type of member as long as the member has an adhesive function. For example, the curved coupling member 800 may include a double-sided tape. The curved coupling member 800 may include a tape substrate 810, a first adhesive layer 820 disposed between the flexible substrate 110 and one surface of the tape substrate 810 facing the display surface, and a second adhesive layer 830 disposed between the flexible substrate 110 and the other surface of the tape substrate 810 facing the direction opposite to the display surface.

[0117] In an embodiment, the tape substrate 810 may be made of at least one selected from PET, PI, PC, PE, PP, PSF, PMMA, TAC and COP. The first adhesive layer 820 and the second adhesive layer 830 may include at least one of a bonding layer, an adhesive layer and a resin layer. For example, the first adhesive layer 820 and the second adhesive layer 830 may be made of at least one selected from the following polymer materials: a silicone-based polymer, a urethane-based polymer, a silicone-urethane (SU) hybrid polymer, an acrylic-based polymer, an isocyanate-based polymer, a polyvinyl alcohol-based polymer, a gelatin-based polymer, a vinyl-based polymer, a latex-based polymer, a polyester-based polymer, a water-based polyester-based polymer, etc.

[0118] In the embodiment of the display device 2 according to the present exemplary embodiment, the signal wiring 145 may be provided on the first surface 110a of the flexible substrate 110 (see Figure 3), and the first connection wiring 180 electrically connected to the signal wiring 145 and the driving integrated circuit 500 may be disposed on the second surface 110b of the flexible substrate 110. That is, the driving integrated circuit 500 may be directly mounted on the second surface 110b of the flexible substrate 110, rather than being mounted on a printed circuit board that increases the non-display area NA of the display device 2, thereby realizing a frameless display device 2.

[0119] Furthermore, the signal wiring 145 and the first connection wiring 180 for electrically connecting the driving integrated circuit 500 and each transistor of the display area DA may be coupled to each other on the second surface 110 b at the second portion 112 of the flexible substrate 110 , thereby realizing a frameless display device 2 .

[0120] In addition, the driver integrated circuit 500 can be disposed on the second surface 110b of the flexible substrate 110, rather than at the end portion (e.g., the sixth portion 116) of the flexible substrate 110, and therefore, the driver integrated circuit 500 can be stably attached. In addition, physical damage to the flexible substrate 110 itself generated in the process of attaching the driver integrated circuit 500 to the end portion (e.g., the sixth portion 116 susceptible to physical damage due to bending, etc.) of the flexible substrate 110 can be prevented or substantially prevented, and cracks in the signal wiring 145 caused by the physical damage can be prevented or substantially prevented.

[0121] Fig.11 is a cross-sectional view showing a display device according to another exemplary embodiment.

[0122] Reference Fig.11 According to the present exemplary embodiment, the display device 3 and Fig.10 The difference between the display device 2 and the display device 3 is that the display device 3 also includes a fill reference Fig.10 A spacer SP is described as a space between the curved coupling member 800 and the second surface 110 b located at the third portion 113 of the flexible substrate 110 .

[0123] More specifically, the display device 3 according to the present exemplary embodiment may further include a spacer SP filling a space between the curved coupling member 800 and the second surface 110 b at the third portion 113 of the flexible substrate 110 .

[0124] In an embodiment, the gasket SP may be in direct contact with the second surface 110b at the third portion 113 of the flexible substrate 110 and the side surface of the curved coupling member 800. The gasket SP may fill the space between the curved coupling member 800 and the second surface 110b at the third portion 113 of the flexible substrate 110. Therefore, when the flexible substrate 110 is bent, the gasket SP may be used to support the flexible substrate 110 while preventing or substantially preventing deformation of the bent shape of the flexible substrate 110 in the irregular space of the third portion 113 of the flexible substrate 110.

[0125] Fig.12 is a cross-sectional view showing a display device according to another exemplary embodiment.

[0126] Reference Fig.12 The display device 4 according to the present exemplary embodiment is different from the above-described display device 1 in that a rigid substrate 900 is provided under the flexible substrate 110 .

[0127] More specifically, in the display device 4 according to the present exemplary embodiment, the rigid substrate 900 may be further provided under the flexible substrate 110. The rigid substrate 900 may be made of a rigid material such as glass, quartz, or the like.

[0128] In the display device 4 according to the present exemplary embodiment, the supporting film 300 disposed in the display area DA may be omitted, and the rigid substrate 900 may even be disposed in the non-display area NA. Fig.12 As shown in FIG. 1 , the rigid substrate 900 may be disposed below the first portion 111 and the second portion 112 of the flexible substrate 110 . The third portion 113 to the sixth portion 116 of the flexible substrate 110 may extend outward from the side surface of the rigid substrate 900 .

[0129] The rigid substrate 900 disposed under the flexible substrate 110 may serve to prevent or substantially prevent an external impact on the flexible substrate 110 and physical damage due to the external impact.

[0130] Reference Figure 3 The lower structure of the flexible substrate 110 described (the first and second connection wirings 180 and 190, the driving integrated circuit 500, and the printed circuit board 700) may be disposed in a region of the rigid substrate 900 disposed to overlap with the second portion 112 of the flexible substrate 110. That is, in an embodiment, the first and second connection wirings 180 and 190, the driving integrated circuit 500, and the printed circuit board 700 may be disposed directly on the lower surface of the rigid substrate 900.

[0131] In the display device 4 according to the present exemplary embodiment, the signal wiring 145 may be provided on the first surface 110a of the flexible substrate 110 (see Figure 3 ) and the first connection wiring 180 electrically connected to the signal wiring 145 and the driving integrated circuit 500 may be provided on the second surface 110b of the flexible substrate 110 (see Figure 3 That is, the driving integrated circuit 500 can be mounted on the second surface 110b of the flexible substrate 110 (directly mounted on the lower surface of the rigid substrate 900), rather than being mounted on a printed circuit board that increases the non-display area NA of the display device 4, thereby realizing a borderless display device 4.

[0132] Furthermore, the signal wiring 145 and the first connection wiring 180 for electrically connecting the driving integrated circuit 500 and each transistor of the display area DA may be coupled to each other on the second surface 110 b at the second portion 112 of the flexible substrate 110 , thereby realizing a frameless display device 4 .

[0133] In addition, the driver integrated circuit 500 can be disposed on the second surface 110b of the flexible substrate 110, rather than at the end portion (e.g., the sixth portion 116) of the flexible substrate 110, and therefore, the driver integrated circuit 500 can be stably attached. In addition, physical damage to the flexible substrate 110 itself generated in the process of attaching the driver integrated circuit 500 to the end portion (e.g., the sixth portion 116 susceptible to physical damage due to bending, etc.) of the flexible substrate 110 can be prevented or substantially prevented, and cracks in the signal wiring 145 caused by the physical damage can be prevented or substantially prevented.

[0134] In some exemplary embodiments, reference Figure 2 The described supporting film 300 may be disposed under the flexible substrate 110 instead of the rigid substrate 900 .

[0135] Fig.13 is a cross-sectional view showing a display device according to another exemplary embodiment; and Figures 14 to 17 is a cross-sectional view illustrating a manufacturing process of a display device according to another exemplary embodiment.

[0136] Reference Figures 13 to 17 , the display device 5 according to the present exemplary embodiment is different from the above-described display device 1 in that the connection wirings 180_1 and 190_1 and the driving integrated circuit 500 are disposed inward from the second surface 110 b of the flexible substrate 110_1 .

[0137] More specifically, in the display device 5 according to the present exemplary embodiment, the connection wirings 180_1 and 190_1 and the driving integrated circuit 500 are disposed inward from the second surface 110 b of the second portion 112_1 of the flexible substrate 110_1 .

[0138] Will refer to Figures 14 to 17 This structure is described with reference to a cross-sectional view of a manufacturing process of the display device 5.

[0139] Reference Fig.14 , connection wirings 180_1 and 190_1 are formed on the upper surface of the support substrate 900_1. In an embodiment, the connection wirings 180_1 and 190_1 have the same Figure 3 The connection wirings 180 and 190 are described as being substantially the same in material and function, and therefore, redundant description thereof will be omitted.

[0140] Reference Fig.15 , a flexible substrate 110_1 is provided on the upper surface of the support substrate 900_1 on which the connection wirings 180_1 and 190_1 are formed.

[0141] The flexible substrate 110_1 may be provided to cover the side surfaces and the upper surface of the connection wirings 180_1 and 190_1. That is, due to the connection wirings 180_1 and 190_1, the portion of the flexible substrate 110_1 overlapping with the connection wirings 180_1 and 190_1 is thinner than the portion of the flexible substrate 110_1 not overlapping with the connection wirings 180_1 and 190_1. Fig.13 As shown in FIG. 1 , due to the connection wirings 180_1 and 190_1 , a second thickness t2 of a portion of the flexible substrate 110_1 overlapping the connection wirings 180_1 and 190_1 may be smaller than a first thickness t1 of a portion of the flexible substrate 110_1 not overlapping the connection wirings 180_1 and 190_1 .

[0142] Reference Fig.16 , forming various components of the display panel 100.

[0143] In the embodiment of the display device 5 according to the present exemplary embodiment, the signal wiring 145 may be provided on the upper surface of the flexible substrate 110_1, and the first connection wiring 180_1 electrically connected to the signal wiring 145 and the driving integrated circuit 500 may be provided on the lower surface of the flexible substrate 110_1. That is, the driving integrated circuit 500 may be directly mounted on the lower surface of the flexible substrate 110_1, rather than being mounted on a printed circuit board that increases the non-display area NA of the display device 5, thereby realizing a frameless display device 5.

[0144] Furthermore, the signal wiring 145 and the first connection wiring 180_1 for electrically connecting the driving integrated circuit 500 and each transistor of the display area DA may be coupled to each other on the lower surface of the flexible substrate 110_1 , thereby realizing a frameless display device 5 .

[0145] In addition, the driver integrated circuit 500 can be disposed on the lower surface of the flexible substrate 110_1, not at the end portion of the flexible substrate 110_1, and therefore, the driver integrated circuit 500 can be stably attached. In addition, physical damage to the flexible substrate 110_1 itself generated in the process of attaching the driver integrated circuit 500 to the end portion of the flexible substrate 110_1 that is susceptible to physical damage due to bending, etc. can be prevented or substantially prevented, and cracks in the signal wiring 145 caused by the physical damage can be prevented or substantially prevented.

[0146] Then, refer to Fig.17 , the support substrate 900_1 is removed from the flexible substrate 110_1.

[0147] According to an embodiment of the present disclosure, a display device in which cracks of a signal wiring of a driver of a flexible substrate are prevented or substantially prevented when a driver integrated circuit is mounted may be provided.

[0148] However, the aspects and effects of the present disclosure are not limited to the exemplary embodiments set forth herein, and other various aspects and effects are included in or can be learned from the description.

[0149] Although some exemplary embodiments of the present disclosure have been described above, these are merely examples and do not limit the present disclosure. In addition, without departing from the features of the present disclosure, those skilled in the art may change and modify the present disclosure in various ways. For example, the components described in the exemplary embodiments of the present disclosure may be modified. Differences associated with these modifications and applications should be interpreted as being within the scope of the present disclosure as defined by the claims.

Claims

1. A display device comprising a display area having a plurality of pixels and a non-display area located at a side of the display area, the display device comprising: A flexible substrate, comprising a first surface and a second surface opposite to the first surface, the flexible substrate sequentially comprising a first portion located in the display area, a second portion located in the non-display area, a third portion bent in a direction away from the display surface, a fourth portion, a fifth portion bent in a direction toward the display surface, and a sixth portion; a plurality of signal wirings located on the first surface of the flexible substrate from the second portion to the sixth portion; as well as a plurality of first connection wirings located on the second surface at the second portion of the flexible substrate, wherein the second portion overlaps with the fourth portion, the fifth portion and the sixth portion, and The signal wiring and the first connection wiring are coupled to each other on the second surface at the second portion of the flexible substrate.

2. The display device according to claim 1, wherein: The first portion, the second portion, the fourth portion, and the sixth portion of the flexible substrate include planar surfaces.

3. The display device according to claim 2, wherein: A width of the third portion of the flexible substrate in the direction toward the display surface is greater than a width of the fifth portion in the direction toward the display surface.

4. The display device according to claim 3, further comprising a driver integrated circuit located on the second surface at the second portion of the flexible substrate, in, The first connection wiring is electrically connected to the driving integrated circuit.

5. The display device according to claim 4, further comprising a printed circuit board and a second connection wiring located on the second surface of the flexible substrate, in, The second connection wiring electrically connects the printed circuit board and the driving integrated circuit.

6. The display device according to claim 5, wherein: The first connection wiring and the second connection wiring are directly located on the second surface of the flexible substrate.

7. The display device according to claim 3, further comprising a space and a double-sided tape, wherein: The space is located between the third portion and the sixth portion of the flexible substrate, and the double-sided tape is located in the space.

8. The display device according to claim 7, further comprising a spacer located between the third portion of the flexible substrate and the double-sided tape, in, The gasket is in direct contact with the third portion of the flexible substrate and a side surface of the double-sided tape.

9. A display device comprising a display area and a non-display area located at a side of the display area, the display area comprising a thin film transistor, the display device comprising: a flexible substrate comprising a first surface and a second surface opposite to the first surface, the flexible substrate sequentially comprising a first portion located in the display area, a second portion located in the non-display area, a third portion bent in a direction opposite to the display surface, a fourth portion, a fifth portion bent in a direction toward the display surface, and a sixth portion; a first conductive layer, located on the first surface of the flexible substrate; a second conductive layer, located on the first conductive layer; as well as a plurality of first connection wirings located on the second surface at the second portion of the flexible substrate, wherein the first conductive layer comprises a gate electrode located on the first portion, The second conductive layer includes a source electrode and a drain electrode located on the first portion and a plurality of signal wirings located on the second portion to the sixth portion. The second portion overlaps the fourth portion, the fifth portion, and the sixth portion, and The signal wiring and the first connection wiring are coupled to each other on the second surface at the second portion of the flexible substrate.

10. The display device according to claim 9, wherein: The first portion, the second portion, the fourth portion, and the sixth portion of the flexible substrate include planar surfaces.

Images