Automatic tube changing mechanism for semiconductor cutting system

Abstract

An automatic tube changing mechanism for a semiconductor rib cutting system, wherein the base plate is installed behind the bottom plate, the support seat is installed on the bottom plate and fixes the belt feeding mechanism with the bearing seat also installed on the bottom plate; the inclined plate is installed on the base plate, and the support plate is installed between the base plate and the inclined plate for fixing; the discharge cylinder and the discharge mechanism connected to the cylinder are installed on the bottom plate; the flipping fixing mechanism is installed on the left side of the bottom plate, and the cylinder drives the push rod to fix the material tube flipping mechanism, the flipping bearing seat is fixed on the bottom plate to support the material tube flipping mechanism and make it rotate in the bearing, the flipping support mechanism is installed on the bottom plate, and the reversing support mechanism cylinder is below the material tube flipping mechanism when it is pushed out; the material storage box is installed at the end of the bottom plate, the first and second receiving mechanisms are installed on the bottom plate and are located at both ends of the material storage box, and the material box lifting mechanism is installed at the bottom of the material storage box to adjust the height of the material tube in the material storage box. The material tube of this application completes the automatic material tube replacement action of the loading tube, thereby improving the efficiency of material tube replacement.

Description

Technical Field

[0001] The invention relates to the field of semiconductor rib cutting, and in particular to an automatic tube changing mechanism for a semiconductor rib cutting system. Background Art

[0002] At present, most foreign and domestic manufacturers use material tube loading and unloading to change the tube mechanism of semiconductor cutting systems. However, due to the improvement of the automation of semiconductor cutting, manual tube replacement is slow and tube loading is cumbersome, which wastes manpower and working hours. Therefore, in order to improve the cumbersome operation and optimize the machine operation working hours, it is urgent to redesign the automatic tube replacement mechanism. Summary of the invention

[0003] The purpose of the present invention is to overcome the technical problem of low efficiency of manual tube replacement in the prior art and to provide an automatic tube replacement mechanism for a semiconductor cutting system.

[0004] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions:

[0005] A semiconductor rib cutting system automatic tube changing mechanism comprises a bottom plate, a base plate is installed at the rear of the bottom plate, a support seat is installed on the bottom plate and fixes a belt feeding mechanism with a bearing seat also installed on the bottom plate; an inclined plate is installed on the base plate, and a support plate is installed between the base plate and the inclined plate for fixing; two guide rails are fixed on the bottom plate, a slide is installed on a slider of guide rail one, a feeding mechanism is installed on the bottom plate, and a discharge cylinder and a discharge mechanism connected to the cylinder are installed on the bottom plate; a motor mounting plate is fixed on the slide, a lower connecting plate A is fixed on the slide, a base plate A is fixed through the lower connecting plate A, a transition plate is installed on the base plate A for fixing a pressure plate, a blowing tube mechanism is fixed on the inner pressure plate, and a belt feeding mechanism is fixed on the base plate A It is driven by a motor installed on the motor mounting plate; the cylinder discharge mechanism is fixed on the side of the belt feeding mechanism; the rotating block 1, rotating block 2 and rotating block 3 are fixed on the synchronous belt linkage mechanism, the synchronous belt linkage mechanism is fixed on the base plate A and base plate B and driven by three servo motors fixed on the motor mounting plate, and the synchronous belt linkage mechanisms on both sides are connected by connecting shafts and bearings; the belt feeding mechanisms on both sides are connected by shafts and couplings; the collecting box is installed on the base plate A and base plate B on both sides, the lower connecting plate B is fixed on the bottom plate to fix the base plate B, the material tube height detection mechanism is fixed on the left pressure plate, the material blocking cylinder is fixed on the material tube height detection mechanism, and the material tube detection mechanism is fixed on the lower connecting plate B; The encoder is fixed on the synchronous belt linkage mechanism on the left; the height adjustment mechanism is installed under the base plate and passes through the base plate to connect the guide rail mounting block, the guide rail 2 is installed on the guide rail mounting block and the slider connecting plate is fixed on the slider of the guide rail, the feeding block is fixed on both sides of the slider connecting plate, and the guide shaft is installed under the slider connecting plate. The guide shaft can slide up and down in the moving block, and the moving block is fixed to the belt of the feeding mechanism so that the feeding block can move forward and backward under the drive of the feeding mechanism; the rotating cylinder mechanism is fixed on the slide and drives the material tube turning mechanism through the transmission mechanism to turn and load the material, the material tube cylinder pushing mechanism is installed on the slide to push the material tube into the receiving position, the connecting blocks are installed on both sides of the material tube turning mechanism, and the air groove is processed in the connecting block Air is ventilated to the material pipe pressing block through the connecting rods connecting the flipping mechanisms on both sides to drive the pneumatic push rod installed in the material pipe pressing block; the light shield is installed at the right connecting block, and gives the sensor signal after following the rotation of the material pipe flipping mechanism; the flipping fixing mechanism is installed on the left side of the base plate, and the push rod is driven by the cylinder to fix the material pipe flipping mechanism, the flipping bearing seat is fixed on the base plate to support the material pipe flipping mechanism and make it rotate in the bearing, the flipping support mechanism is installed on the base plate, and the reversing support mechanism is under the material pipe flipping mechanism when the cylinder is pushed out of position; the material storage box is installed at the end of the base plate, the material receiving mechanism one and the material receiving mechanism two are installed on the base plate and are located at both ends of the material storage box, and the material box lifting mechanism is installed at the bottom of the material storage box to adjust the height of the material pipe in the material storage box.

[0006] The automatic tube changing mechanism of the semiconductor cutting system described in the present invention comprises a base plate installed behind a bottom plate, a support seat installed on the bottom plate and a bearing seat also installed on the bottom plate to fix a belt feeding mechanism, and the material tube is transported forward by the belt feeding mechanism.

[0007] The automatic tube changing mechanism of the semiconductor cutting system described in the present invention, wherein the belt feeding mechanism is fixed on the base plate A and driven by the motor installed on the motor mounting plate, and the material tube is transported upward through the belt feeding mechanism.

[0008] The automatic tube changing mechanism of the semiconductor rib cutting system described in the present invention, wherein the substrate A is fixed by the lower connecting plate A, the transition plate is installed on the substrate A to fix the pressure plate, the blowing tube mechanism is fixed on the inner pressure plate, the belt feeding mechanism is fixed on the substrate A and driven by the motor installed on the motor mounting plate, and the collection box is installed on the substrate A and the substrate B on both sides; the material tube is sent into the channel in the middle of the pressure plate by the belt feeding mechanism, and the waste material is blown to the collection box by the blowing tube mechanism when unqualified is detected.

[0009] The automatic tube changing mechanism of the semiconductor cutting system described in the present invention, wherein the material tube height detection mechanism is fixed on the left pressure plate, the material blocking cylinder is fixed on the material tube height detection mechanism, and the material tube detection mechanism is fixed on the lower connecting plate B. After detecting that the material tube height is too high, the material blocking cylinder extends to prevent the material tube from falling.

[0010] The automatic tube changing mechanism of the semiconductor rib cutting system described in the present invention, wherein the height adjustment mechanism is installed under the base plate and passes through the base plate to connect the guide rail mounting block, the guide rail 2 is installed on the guide rail mounting block and the slider connecting plate is fixed on the slider of the guide rail, the feeding block is fixed on both sides of the slider connecting plate, and the guide shaft is installed under the slider connecting plate. The guide shaft can slide up and down in the moving block, and the moving block is fixed to the belt of the feeding mechanism so that the feeding block can move forward and backward under the drive of the feeding mechanism. The feeding mechanism ensures that the material tube is placed horizontally in the groove of the feeding block, and the height adjustment mechanism enables the feeding block to send the material tube to the material tube turning mechanism, then descend and return to the origin.

[0011] The automatic tube changing mechanism of the semiconductor cutting system described in the present invention, wherein the rotating cylinder mechanism is fixed on the slide table and drives the tube flipping mechanism to flip and load the material through the transmission mechanism. The tube flipping mechanism is loaded with an empty tube, flipped to the feeding position, and the empty tube continues to be loaded on the other side.

[0012] The automatic tube changing mechanism of the semiconductor cutting system described in the present invention, wherein the connecting blocks are installed on both sides of the material tube turning mechanism, the air grooves processed in the connecting blocks are ventilated to the material tube pressing block through the connecting rods connected to the turning mechanisms on both sides to drive the pneumatic push rods installed in the material tube pressing block, and the pneumatic push block is pressed down after the material tube turning mechanism receives the material, so as to separate and limit the material tubes.

[0013] The automatic tube changing mechanism of the semiconductor cutting system described in the present invention, wherein the flipping and fixing mechanism is installed on the left side of the base plate, the push rod is driven by the cylinder to fix the material tube flipping mechanism, the flipping bearing seat is fixed on the base plate to support the material tube flipping mechanism and make it rotate in the bearing, the flipping support mechanism is installed on the base plate, and the reverse support mechanism cylinder is pushed out of position below the material tube flipping mechanism. After the material tube flipping mechanism is in place, the push rod and the support fix the two sides of the flipping mechanism to stabilize the loading process.

[0014] The automatic tube changing mechanism of the semiconductor cutting system described in the present invention comprises two guide rails fixed on a bottom plate, a slide table mounted on a slider of one of the guide rails, and a mechanism on the slide table can change the spacing as the slide table is adjusted to adapt to tubes of different lengths.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] When the embodiment of the present invention is implemented, the mechanism fixes the belt feeding mechanism through the bearing seat installed on the bottom plate to transport the material pipe toward the belt loading mechanism, and then the belt loading mechanism transports the material pipe upward and falls into the track in the middle of the pressure plate, and falls into the groove of the feeding block through adjustment in the track. The feeding block sends the material pipe to the material pipe flipping mechanism through the feeding mechanism and then returns to continue to receive the material pipe. After receiving the material, the material pipe flipping mechanism flips to the loading position for loading. After loading, the discharge mechanism pushes the material pipe into the storage box and then the material pipe on the other side of the flipping mechanism is in place at the loading position for loading. The material pipe completes the automatic replacement of the loading tube with the material tube under this mechanism, thereby improving the efficiency of material tube replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A view of an embodiment of an automatic tube changing mechanism for a semiconductor cutting system provided by the present invention;

[0018] Figure 2 An implementation view of a feeding mechanism embodiment provided by the present invention;

[0019] Figure 3 A view of an embodiment of a belt feeding mechanism provided by the present invention during implementation;

[0020] Figure 4 A three-dimensional view of an embodiment of a cylinder discharge mechanism provided by the present invention;

[0021] Figure 5 for Figure 4 An isometric view of an embodiment of the present invention;

[0022] Figure 6 A view of an encoder embodiment provided by the present invention;

[0023] Figure 7 is an isometric view of an embodiment of soil 6;

[0024] Figure 8 A view of an embodiment of a slider connecting plate provided by the present invention;

[0025] Fig. 9 A view of a second embodiment of the guide rail provided by the present invention;

[0026] Fig.10 A view of an embodiment of the transmission mechanism provided by the present invention;

[0027] Fig.11 A view of an embodiment of the flipping and fixing mechanism provided by the present invention;

[0028] Fig.12 A view of an embodiment of the material tube turning mechanism provided by the present invention;

[0029] Fig.13 A view of an embodiment of a material receiving mechanism 1 and a material receiving mechanism 2 provided by the present invention; DETAILED DESCRIPTION

[0030] See also Figure 1-13 As shown, those skilled in the art should understand that, in the disclosure of the present invention, the terms "upper", "lower", "one end", "the other end" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms cannot be understood as limiting the present invention.

[0031] It should be noted that, at present, most of the tube changing mechanisms of semiconductor cutting systems are realized by foreign and domestic manufacturers by tube loading and unloading. However, due to the improvement of automation of semiconductor cutting, manual tube changing is slow and tube loading is cumbersome, which wastes manpower and working hours. Therefore, in order to improve the cumbersome operation and optimize the machine operation working hours, it is urgent to redesign the automatic tube changing mechanism.

[0032] Based on this, an embodiment of the present invention provides an automatic tube changing mechanism of a semiconductor cutting system, including a bottom plate 1, a base plate 3 installed behind the bottom plate 1, a support seat 2 installed on the bottom plate 1 and fixing a belt feeding mechanism 7 with a bearing seat 4 also installed on the bottom plate 1; an inclined plate 6 is installed on the base plate 3, a support plate 5 is installed and fixed between the base plate 3 and the inclined plate 6, two guide rails 8 are fixed on the bottom plate 1, a slide 9 is installed on a slider of a guide rail 8, so that the overall mechanism can be adjusted to adapt to various lengths of material tubes, a feeding mechanism 10 is installed on the bottom plate 1, a discharge cylinder 11 and a discharge mechanism 12 connected to the cylinder 11 are installed on the bottom plate 1, a motor mounting plate 26 is fixed on the slide 9, and a lower connecting plate A23 is fixed on the slide 9 On the upper side, the base plate A24 is fixed by the lower connecting plate A23, the transition plate 19 is installed on the base plate A24 to fix the pressure plate 22, the blowing pipe mechanism 20 is fixed on the inner pressure plate 22, the belt feeding mechanism 14 is fixed on the base plate A24 and driven by the motor 27 installed on the motor mounting plate 26, the cylinder discharge mechanism 13 is fixed on the side of the belt feeding mechanism 14, the rotating block 16, the rotating block 28 and the rotating block 3 17 are fixed on the synchronous belt linkage mechanism 29, the synchronous belt linkage mechanism 29 is fixed on the base plate A24 and the base plate B30 and driven by three servo motors 28 fixed on the motor mounting plate, and the synchronous belt linkage mechanisms 29 on both sides are connected by the connecting shaft 15 and the bearing 35;The belt feeding mechanism 14 on both sides is connected by a shaft 34 and a coupling 35. The collecting box 21 is installed on the substrate A24 and the substrate B30 on both sides, so that the discharging mechanism can detect unqualified material pipes and blow the material pipes into the collecting box 21. The lower connecting plate B33 is fixed on the bottom plate 1 to fix the substrate B30. The material pipe height detection mechanism 32 is fixed on the left pressure plate 22. The material blocking cylinder 31 is fixed on the material pipe height detection mechanism 32. The material pipe detection mechanism 36 is fixed on the lower connecting plate B33. When it is detected that the material pipes are stacked too much, the material blocking cylinder 31 extends out to prevent the upper part from continuing to discharge. The encoder 37 is fixed on the left. The height adjustment mechanism 41 is installed on the synchronous belt linkage mechanism 29 on the side of the bottom plate 1 and passes through the bottom plate 1 to connect the guide rail mounting block 43. The guide rail 24 is installed on the guide rail mounting block 43 and the slider connecting plate 40 is fixed on the slider of the guide rail. The feeding block 39 is fixed on both sides of the slider connecting plate 40. The guide shaft 42 is installed below the slider connecting plate 40. The guide shaft 42 can slide up and down in the moving block 38. The moving block 38 is fixed to the belt of the feeding mechanism 10, so that the feeding block 39 can move forward and backward under the drive of the feeding mechanism 10. The height adjustment mechanism 41 is convenient for the feeding block 39 to drop down after feeding the material tube. At the return pipe, the rotating cylinder mechanism 46 is fixed on the slide 9 and drives the pipe turning mechanism 58 to turn and load the material through the transmission mechanism 45. The pipe cylinder pushing mechanism 49 is installed on the slide 9 to push the pipe 61 into the receiving position. The connecting block 47 is installed on both sides of the pipe turning mechanism 58. The air groove processed in the connecting block 47 is ventilated to the pipe pressing block 59 through the connecting rods 57 connected to the turning mechanism on both sides to drive the pneumatic push rod 60 installed in the pipe pressing block 59. The light shielding sheet 48 is installed at the right connecting block 47, and gives the sensor signal after following the rotation of the pipe turning mechanism 49. The turning fixing mechanism 54 is installed at the bottom On the left side of the plate 1, the push rod is driven by the cylinder to fix the material tube turning mechanism 58, the turning bearing seat 55 is fixed on the bottom plate 1 to support the material tube turning mechanism 49 and make it rotate in the bearing, the turning support mechanism 56 is installed on the bottom plate 1, and the reverse support mechanism 56 is below the material tube turning mechanism 49 when the cylinder pushes out the position, the material storage box 52 is installed at the end of the bottom plate 1, the material receiving mechanism 1 50 and the material receiving mechanism 2 51 are installed on the bottom plate 1 and located at both ends of the material storage box 52, so as to stop loading after the material in the material storage box is accumulated, and the material box lifting mechanism 53 is installed at the bottom of the material storage box 52 to adjust the height of the material tube in the material storage box 52. ;

[0033] The specific action flow of an automatic tube changing mechanism of a semiconductor rib cutting system of the present invention is that the mechanism fixes the belt feeding mechanism 7 through the bearing seat 4 installed on the bottom plate 1 to transport the material tube toward the belt loading mechanism 14, and then the belt loading mechanism 14 transports the material tube upward and falls into the track in the middle of the pressure plate 22, and falls into the groove of the feeding block 39 through adjustment in the track. The feeding block 39 sends the material tube to the material tube turning mechanism 58 through the feeding mechanism 10 and then returns to continue to receive the material tube. After receiving the material, the material tube turning mechanism 58 turns to the tube loading position for loading. After loading, the discharge mechanism 12 pushes the material tube into the storage box 52, and then the material tube on the other side of the turning mechanism is in place at the tube loading position for loading. The material tube completes the automatic tube changing action of the loading tube under this mechanism, thereby improving the efficiency of material tube replacement.

[0034] In some embodiments, the base plate 3 is installed behind the bottom plate 1, the support seat 2 is installed on the bottom plate 1 and fixes the belt feeding mechanism 7 with the bearing seat 4 also installed on the bottom plate 1, and the material pipe is transported forward by the belt feeding mechanism 7.

[0035] The material tube can be transported forward by the belt feeding mechanism.

[0036] In some embodiments, the belt feeding mechanism 14 is fixed on the base plate A24 and driven by a motor 27 mounted on the motor mounting plate 26 to transport the material tube upward through the belt feeding mechanism 14.

[0037] The motor 27 supplies power to the belt feeding mechanism 14 to drive the belt transmission.

[0038] In some embodiments, the substrate A24 is fixed by the lower connecting plate A23, the transition plate 19 is installed on the substrate A24 to fix the pressure plate 22, the blowing pipe mechanism 20 is fixed on the inner pressure plate 22, the belt feeding mechanism 14 is fixed on the substrate A24 and driven by the motor 27 installed on the motor mounting plate 26, and the collecting box 21 is installed on the substrate A24 and the substrate B30 on both sides; the material pipe is sent into the channel in the middle of the pressure plate 22 by the belt feeding mechanism 14, and if unqualified material is detected, the blowing pipe mechanism 20 blows the waste material to the collecting box 21.

[0039] The unqualified material pipes are blown into the collection box 21, so that the collected material pipes are qualified material pipes.

[0040] In some embodiments, the material pipe height detection mechanism 32 is fixed on the left pressure plate 22, the material blocking cylinder 31 is fixed on the material pipe height detection mechanism 32, and the material pipe detection mechanism 36 is fixed on the lower connecting plate B33. After detecting that the material pipe height is too high, the material blocking cylinder extends to prevent the material pipe from falling.

[0041] The material pipe detection mechanism 36 is fixed on the lower connecting plate B33 and is used to detect the height of the material pipe. When the height of the material pipe is too high, the cylinder extends to prevent the material pipe from falling.

[0042] In some embodiments, a height adjustment mechanism 41 is installed below the base plate 1 and passes through the base plate 1 to connect to the guide rail mounting block 43. The guide rail 2 44 is installed on the guide rail mounting block 43 and the slider connecting plate 40 is fixed on the slider of the guide rail. The feeding block 39 is fixed on both sides of the slider connecting plate 40. A guide shaft 42 is installed below the slider connecting plate 40. The guide shaft 42 can slide up and down in the moving block 38. The moving block 38 is fixed to the belt of the feeding mechanism 10, so that the feeding block 39 can move back and forth under the drive of the feeding mechanism 10. The feeding mechanism 10 ensures that the material pipe is placed horizontally in the groove of the feeding block 39. The height adjustment mechanism 41 enables the feeding block 39 to send the material pipe to the material pipe flipping mechanism 58, then descend and return to the origin.

[0043] During implementation, the moving block 38 is fixed to the belt of the feeding mechanism 10, so that the feeding block 39 can move back and forth driven by the feeding mechanism 10. The feeding mechanism 10 ensures that the material pipe is placed horizontally in the groove of the feeding block 39. The height adjustment mechanism 41 enables the feeding block 39 to send the material pipe to the material pipe turning mechanism 58 and then descend and return to the origin.

[0044] In some embodiments, the rotating cylinder mechanism 46 is fixed on the slide 9 and drives the material tube flipping mechanism 58 to flip and load materials through the transmission mechanism 45. The material tube flipping mechanism 58 loads an empty material tube, flips to the feeding position, and continues to load empty material tubes on the other side.

[0045] In some embodiments, the connecting block 47 is installed on both sides of the material tube turning mechanism 58. The air groove processed in the connecting block 47 is ventilated to the material tube pressing block 59 through the connecting rods 57 connecting the turning mechanisms on both sides to drive the pneumatic push rod 60 installed in the material tube pressing block 59. After the material tube turning mechanism 58 collects the material, the pneumatic push block 60 is pressed down to separate and limit the material tube.

[0046] In some embodiments, the flipping and fixing mechanism 54 is installed on the left side of the base plate 1, and the push rod is driven by the cylinder to fix the material tube flipping mechanism 58. The flipping bearing seat 55 is fixed on the base plate 1 to support the material tube flipping mechanism 49 and make it rotate in the bearing. The flipping support mechanism 56 is installed on the base plate 1. When the reversing support mechanism 56 is pushed out of the cylinder into position, it is below the material tube flipping mechanism 49. After the material tube flipping mechanism 58 is in place, the push rod and the support fix the two sides of the flipping mechanism to stabilize the loading process.

[0047] In some embodiments, two guide rails 8 are fixed on the base plate 1, and a slide 9 is installed on a slider of the guide rail 8. The mechanism on the slide 9 can change the spacing as the slide is adjusted to adapt to material pipes of different lengths.

[0048] The embodiments described above are merely descriptions of preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the scope of protection determined by the claims of the present invention.

Claims

1. An automatic tube changing mechanism for a semiconductor cutting system, characterized in that: The invention comprises a bottom plate (1), a base plate (3) installed at the rear of the bottom plate (1), a support seat (2) installed on the bottom plate (1) and fixing a belt feeding mechanism (7) with a bearing seat (4) also installed on the bottom plate (1), and a material pipe is transported forward by the belt feeding mechanism (7); an inclined plate (6) installed on the base plate (3), a support plate (5) installed between the base plate (3) and the inclined plate (6) for fixing; two guide rails (8) fixed on the bottom plate (1), a slide table (9) installed on the slide block of the guide rail (8), a feeding mechanism (10) installed on the bottom plate (1), a discharge cylinder (11) and a discharge machine connected to the discharge cylinder (11) The mechanism (12) is mounted on the bottom plate (1); the motor mounting plate (26) is fixed on the slide table (9); the lower connecting plate A (23) is fixed on the slide table (9); the base plate A (24) is fixed through the lower connecting plate A (23); the transition plate (19) is mounted on the base plate A (24) to fix the pressure plate (22); the blowing pipe mechanism (20) is fixed on the inner pressure plate (22); the belt feeding mechanism (14) is fixed on the base plate A (24) and driven by the motor (27) mounted on the motor mounting plate (26); the material pipe is conveyed upward through the belt feeding mechanism (14); the material pipe passes through the belt feeding mechanism (14) to feed the material The waste material is sent into the channel in the middle of the pressure plate (22) by a pipe, and when unqualified waste material is detected, the waste material is blown into the collection box (21) by a blowing pipe mechanism (20); the cylinder discharge mechanism (13) is fixed on the side of the belt feeding mechanism (14); the rotating block 1 (16), the rotating block 2 (18) and the rotating block 3 (17) are fixed on the synchronous belt linkage mechanism (29), the synchronous belt linkage mechanism (29) is fixed on the base plate A (24) and the base plate B (30) and driven by three servo motors (28) fixed on the motor mounting plate, and the synchronous belt linkage mechanisms (29) on both sides are connected by connecting shafts (15) and bearings (35); the belts on both sides are connected by connecting shafts (15) and bearings (35). The belt feeding mechanism (14) is connected by a shaft (34) and a coupling; the collecting box (21) is installed on the base plate A (24) and the base plate B (30) on both sides; the lower connecting plate B (33) is fixed on the bottom plate (1) to fix the base plate B (30); the material pipe height detection mechanism (32) is fixed on the left pressure plate (22); the material blocking cylinder (31) is fixed on the material pipe height detection mechanism (32); the material pipe detection mechanism (36) is fixed on the lower connecting plate B (33); after detecting that the material pipe height is too high, the material blocking cylinder extends to prevent the material pipe from falling; the encoder (37) is fixed on the left synchronous belt linkage mechanism (29);The height adjustment mechanism (41) is installed below the bottom plate (1) and passes through the bottom plate (1) to connect the guide rail mounting block (43). The guide rail 2 (44) is installed on the guide rail mounting block (43) and a slider connecting plate (40) is fixed on the slider of the guide rail. The feed block (39) is fixed on both sides of the slider connecting plate (40). A guide shaft (42) is installed below the slider connecting plate (40). The guide shaft (42) can slide up and down in the moving block (38). The moving block (38) is fixed to the belt of the feeding mechanism (10), so that the feeding block (39) can move forward and backward under the drive of the feeding mechanism (10). The feeding mechanism (10) ensures that the material tube is placed horizontally in the groove of the feeding block (39); the height adjustment mechanism (41) enables the feeding block (39) to send the material tube to the material tube turning mechanism (58) and then descend and return to the origin; the rotating cylinder mechanism (46) is fixed on the slide (9) and drives the material tube turning mechanism (58) to turn and load the material through the transmission mechanism (45); the material tube cylinder tightening mechanism (49) is installed on the slide (9) to push the material tube (61) into the receiving position; the connecting block (47) is installed on both sides of the material tube turning mechanism (58); the air groove processed in the connecting block (47) is connected on both sides The connecting rod (57) of the turning mechanism is ventilated to the material pipe pressing block (59) to drive the pneumatic push rod (60) installed in the material pipe pressing block (59). After the material pipe turning mechanism (58) receives the material, the pneumatic push rod (60) is pressed downward to separate and limit the material pipe. The light shielding sheet (48) is installed at the right connecting block (47) and gives a sensor signal after following the rotation of the material pipe turning mechanism (58). The turning fixing mechanism (54) is installed on the left side of the bottom plate (1) and drives the push rod to fix the material pipe turning mechanism (58) through the cylinder. The turning bearing seat (55) is fixed on the bottom plate (1) to support the material pipe turning mechanism (58). 58) and makes it rotate in the bearing, the flip support mechanism (56) is installed on the bottom plate (1), and the cylinder of the flip support mechanism (56) is pushed out of position below the material tube flip mechanism (58), and after the material tube flip mechanism (58) is in place, the push rod and the support fix the two sides of the flip mechanism to make the loading process stable; the material storage box (52) is installed at the end of the bottom plate (1), the material receiving mechanism 1 (50) and the material receiving mechanism 2 (51) are installed on the bottom plate (1) and are located at both ends of the material storage box (52), and the material box lifting mechanism (53) is installed at the bottom of the material storage box (52) to adjust the height of the material tube in the material storage box (52). ; 2. The automatic tube changing mechanism of the semiconductor cutting system according to claim 1, characterized in that: The material tube turning mechanism (58) is used to load an empty material tube, turn it over to the feeding position, and then continue to load empty material tubes on the other side.

3. The automatic tube changing mechanism of the semiconductor cutting system according to claim 2, characterized in that: The mechanism on the slide (9) can change the spacing as the slide is adjusted to adapt to material pipes of different lengths.

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