A PCBA production management process

Abstract

This invention provides a PCBA production management process. The PCBA production management process includes the following steps: Step S1, obtaining the customer's product dimensions and shape requirements, and performing calculations and modeling for PCB board thickness control and electronic component design; Step S2, through precise calculation and scientific management, designing and implementing the PCB manufacturing stage processes and parameters to produce PCB boards with qualified thickness specifications; Step S3, through precise calculation and scientific management, designing and implementing the assembly and placement stage processes and parameters, and achieving precise control of solder paste thickness by including strict control of stencil openings, printing machine parameters, and specifying solder paste materials, ultimately achieving the required thickness and shape of the finished PCBA. This invention employs automated control to adjust the PCB thickness and manufacture finished PCBA components according to product shape requirements, meeting diverse customer needs and improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of PCBA (Printed Circuit Board Assembly) production technology, and in particular to a PCBA production management process. Background Technology

[0002] With the rise of mobile terminal electronic products, represented by smartphones, the requirements for various optical electronic components such as cameras, fingerprint recognition, and facial recognition are becoming increasingly demanding. To achieve better optical effects, electronic components such as LEDs, sensors (laser focusing components), and IR lamps need to reach a matching height to achieve optimal functionality. Existing electronic component specifications are limited and cannot adapt to the diverse stacking requirements of mobile phone products. Furthermore, the uniform (rectangular) shape of electronic components makes it difficult to match the diverse shape requirements of structural designs. Moreover, current production processes suffer from low efficiency in controlling the dimensions of electronic components and PCBs (Printed Circuit Boards), and involve high manual labor intensity. Summary of the Invention

[0003] This invention provides a PCBA production management process, the purpose of which is to solve the problems in the background art where the specifications of existing electronic components are limited and difficult to adapt to the diverse stacking requirements of mobile phone products, and difficult to match the diverse structural requirements for shape. The existing production process has low efficiency in controlling the size of electronic components and PCB boards, and high manual labor intensity.

[0004] To achieve the above objectives, embodiments of the present invention provide a PCBA production management process, comprising the following steps:

[0005] Step S1: Obtain the dimensions and shape requirements of the client's product, and perform calculation modeling for PCB board thickness control and electronic component design; specifically including PCBA structure, the PCBA structure includes motherboard, padding board and electronic components, the padding board is fixedly connected to the motherboard by solder paste, and the electronic components are connected to the motherboard by being fixed to the padding board;

[0006] Step S2: Through precise calculation and scientific management, design and implement the PCB manufacturing process and parameters to produce PCB boards with qualified thickness specifications.

[0007] Step S3: Through precise calculation and scientific management, design and implement the assembly and placement process and parameters. By strictly controlling the stencil opening, printing machine parameters and specifying solder paste materials, the solder paste thickness is precisely controlled, and the thickness and shape requirements of the finished PCBA are finally met.

[0008] Preferably, step S2 specifically includes the following steps:

[0009] Step S21: Input the client's dimensions and shape requirements to obtain the PCB board thickness and shape;

[0010] Step S22: Transmit the data obtained from the calculation model to the PCB board manufacturing control terminal;

[0011] Step S23: The PCB board manufacturing control terminal controls the PCB board manufacturing equipment to produce PCB boards with qualified thickness specifications.

[0012] Preferably, step S3 specifically includes the following steps:

[0013] Step S31: Input the client's dimensions and shape requirements to obtain the electronic component design scheme on the PCB board;

[0014] Step S32: Transmit the data obtained from the calculation model to the assembly and placement manufacturing end;

[0015] Step S33: The assembly and placement manufacturing end controls the assembly and placement manufacturing equipment to produce PCBA boards with qualified placement specifications.

[0016] Preferably, in step S22, the PCB board manufacturing process includes the following steps in sequence: material cutting, drilling, electroplating, dry film coating, etching, solder mask coating, surface treatment, milling, electrical testing, and packaging. The PCB board manufacturing control terminal includes a raw material control terminal, a drilling depth control terminal, an electroplating thickness control terminal, a dry film thickness control terminal, and a surface treatment control terminal that control the process parameters of the PCB board manufacturing equipment.

[0017] Preferably, in step S32, the assembly component manufacturing sequentially includes the following process steps: solder paste printing, SPI inspection, device mounting, cutting and separating the board and testing and packaging. The assembly component manufacturing end includes a solder paste printing thickness control end and a device mounting control end that control the process parameters of the assembly component manufacturing equipment.

[0018] Preferably, the solder paste printing thickness control terminal includes stencil opening control, printing machine parameter control, and specified solder paste material control, which correspond to the control of process parameters of the assembly component manufacturing equipment.

[0019] Preferably, in step S1, the calculation and modeling of PCB board thickness control and electronic component design specifically involves:

[0020] Step S11: Establish a database of PCB board size specifications, a database of PCBA component size specifications, and a database of PCBA shape combination modules;

[0021] Step S12: Create a template for inputting customer product dimensions and shape requirements, including inputting the overall PCBA board thickness, electronic component types, location requirements, and thickness;

[0022] Step S13: Based on the type and thickness of electronic components, the overall thickness of the PCBA board, and the database of the padding board shape combination module, establish the padding board combination shape design module.

[0023] Step S14: Establish calculation formulas for various parameters of the PCB board. Combine the PCB board substrate size specifications, electroplating thickness specifications, dry film size and thickness specifications and surface treatment specifications provided by the PCB board size specification database in step S11 to obtain parameters including PCB board size and thickness, electroplating thickness, dry film size and thickness and surface treatment.

[0024] Step S15: Establish calculation formulas for various parameters of the PCBA board, and combine the PCBA component size specifications provided in the PCBA component size specification database in step S11 to obtain parameters including solder paste printing thickness.

[0025] Preferably, the method further includes step S4, whereby an automatic detection device performs automatic detection, wherein the automatic detection device measures the shape and size of the PCB manufacturing stage and the assembled components.

[0026] The technical effects achievable by using this invention are as follows: This invention produces finished PCBA components by adjusting the thickness of the PCB portion and according to the product shape requirements, and then fulfills diverse customer needs after secondary SMT or assembly; it adopts automated production control, which has high efficiency in controlling the size of electronic components and PCB boards and low manual labor intensity. Attached Figure Description

[0027] Figure 1 This is a flowchart illustrating a PCBA production management process according to the present invention.

[0028] Figure 2 This is a flowchart illustrating the PCBA production process of a PCBA production management technology according to the present invention.

[0029] Figure 3 This is a schematic diagram of a PCBA structure according to a PCBA production management process of the present invention;

[0030] Figure 4 This is a schematic diagram of the PCBA structure before dimensional improvements in a PCBA production management process according to the present invention.

[0031] Figure 5 This is a schematic diagram of another preferred embodiment of the PCBA structure in a PCBA production management process according to the present invention;

[0032] Figure 6 This is a schematic diagram of the PCBA structure before the improvement of the PCBA shape in the PCBA production management process of the present invention. Detailed Implementation

[0033] To make the technical problems, technical solutions and advantages of the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0034] This invention addresses existing problems by providing a PCBA production management process, such as... Figure 1 As shown, it includes the following steps:

[0035] Step S1: Obtain the dimensions and shape requirements of the client product, and perform calculation modeling for PCB board thickness control and electronic component design; the client product specifically includes a PCBA structure.

[0036] The PCBA structure includes a motherboard 1, a support plate 2, electronic components 3, and a cover plate 4. The support plate 2 is fixedly connected to the motherboard 1 with solder paste, and the electronic components 3 are connected to the motherboard 1 by being fixed to the support plate 2. The support plate 2 and the electronic components 3 are both located between the motherboard 1 and the cover plate 4.

[0037] Regarding the dimensions of the client product, the thickness of the pad 2 is the distance between the motherboard 1 and the cover plate 4 minus the thickness of the electronic component 3, minus the gap between the electronic component 3 and the cover plate 4, and minus the thickness of the solder paste.

[0038] Regarding the client product's appearance requirements, the motherboard 1 includes a padding PIN connection point, and the padding 2 includes padding PINs and electronic component PIN connection points respectively disposed on both sides of the padding 2. The electronic component includes electronic component PINs. The positions of the padding PINs correspond to the positions of the padding PIN connection points, and the positions of the electronic component PINs correspond to the positions of the electronic component PIN connection points.

[0039] In another typical embodiment of the PCBA structure, the motherboard 1 includes a motherboard hole 10. The positions of the motherboard hole 10 and the electronic component 3 are fixed, and the dimensions of the riser plate 2 can completely cover the motherboard hole 10 and the electronic component 3.

[0040] The raised plate 2 has a different shape from the electronic component 3.

[0041] Step S2: Through precise calculation and scientific management, design and implement the PCB manufacturing process and parameters to produce PCB boards with qualified thickness specifications.

[0042] Step S3: Through precise calculation and scientific management, design and implement the assembly and placement process and parameters. By strictly controlling the stencil opening, printing machine parameters and specifying solder paste materials, the solder paste thickness is precisely controlled, and the thickness and shape requirements of the finished PCBA are finally met.

[0043] Step S4: The automatic detection equipment implements the automatic detection function, and the automatic detection equipment measures the shape and size of the PCB manufacturing stage and the assembled components.

[0044] In step S1, the calculation and modeling of PCB board thickness control and electronic component design specifically involves:

[0045] Step S11: Establish a database of PCB board size specifications, a database of PCBA component size specifications, and a database of PCBA shape combination modules.

[0046] Step S12: Create a template for inputting customer product dimensions and shape requirements, including inputting the overall PCBA board thickness, electronic component types, location requirements, and thickness;

[0047] Step S13: Based on the type and thickness of electronic components, the overall thickness of the PCBA board, and the database of the padding board shape combination module, establish the padding board combination shape design module.

[0048] Step S14: Establish calculation formulas for various parameters of the PCB board. Combine the PCB board substrate size specifications, electroplating thickness specifications, dry film size and thickness specifications and surface treatment specifications provided by the PCB board size specification database in step S11 to obtain parameters including PCB board size and thickness, electroplating thickness, dry film size and thickness and surface treatment.

[0049] Step S15: Establish calculation formulas for various parameters of the PCBA board, and combine the PCBA component size specifications provided in the PCBA component size specification database in step S11 to obtain parameters including solder paste printing thickness.

[0050] Step S2 specifically includes the following steps:

[0051] Step S21: Input the client's dimensions and shape requirements to obtain the PCB board thickness and shape;

[0052] Step S22: Transmit the data obtained from the calculation model to the PCB board manufacturing control terminal;

[0053] Step S23: The PCB board manufacturing control terminal controls the PCB board manufacturing equipment to produce PCB boards with qualified thickness specifications.

[0054] Step S3 specifically includes the following steps:

[0055] Step S31: Input the client's dimensions and shape requirements to obtain the electronic component design scheme on the PCB board;

[0056] Step S32: Transmit the data obtained from the calculation model to the assembly and placement manufacturing end;

[0057] Step S33: The assembly and placement manufacturing end controls the assembly and placement manufacturing equipment to produce PCBA boards with qualified placement specifications.

[0058] like Figure 2 As shown, the PCB manufacturing process includes the following steps in sequence: material cutting, drilling, electroplating, dry film coating, etching, solder mask coating, surface treatment, milling, electrical testing, and packaging. The PCB manufacturing control terminal includes a raw material control terminal, a drilling depth control terminal, an electroplating thickness control terminal, a dry film thickness control terminal, and a surface treatment control terminal that control the process parameters of the PCB manufacturing equipment.

[0059] PCB manufacturing stage: By improving factory processes and controlling processes, PCB boards with qualified thickness specifications are produced. Specifications are shown in Table 1.

[0060] Table 1: PCB Thickness Specifications for Raised Boards (Unit: mm)

[0061] PCB thickness range Standard PCB product thickness PCB thickness of the pad 0～0.80 ±0.10 ±0.05 0.81～1.80 ±10％ ±0.07 1.81～2.65 ±10％ ±0.08 2.66～3.65 ±10％ ±0.10 3.66～6.50 ±10％ ±0.12

[0062] In step S32, the assembly and placement manufacturing process includes the following steps in sequence: solder paste printing, SPI (Solder Paste Inspection, SPI) inspection, device placement, cutting and separating the board and testing and packaging. The assembly and placement manufacturing end includes a solder paste printing thickness control end and a device placement control end that control the process parameters of the assembly and placement manufacturing equipment.

[0063] The solder paste printing thickness control terminal includes stencil opening control, printing machine parameter control, and specified solder paste material control, which correspond to the process parameters of the assembly component manufacturing equipment.

[0064] Assembly and placement stage:

[0065] By strictly controlling the stencil opening, printing press parameters, and specifying the solder paste material, precise control of solder paste thickness is achieved, avoiding uneven solder paste from affecting the thickness of the finished raised board. This results in finished IC (integrated circuit) grade components (dimensions + / -0.075mm, thickness + / -0.10mm), as shown in Table 2. Table 2: Thickness Specifications of Raised Board PCBA Components (Unit: mm)

[0066]

[0067] The technical advantages of the PCBA production management process provided by this invention are as follows:

[0068] This invention creates finished PCBA assemblies by adjusting the thickness of a portion of the PCB and according to the product's shape requirements. Secondary SMT (Surface Mount Technology) or assembly is then used to meet diverse client needs. By adding a PCB to a raised platform and electronic components, a PCBA product is formed, satisfying the client's requirements for diverse component thicknesses and shapes. This includes variations in component pin positions, covering motherboard holes on the PCB that cannot be covered by the component's shape, and allowing the electronic components and the raised platform to have different shapes, thus enabling diverse PCBA shapes. Ultimately, this results in better camera performance, more sensitive fingerprint / facial recognition unlocking, and better signal strength in end products (phones / tablets). Figure 3 and Figure 4 As shown, after using PCBA products, the LED signal source is closer to the housing, resulting in stronger and more sensitive signals. Figure 5 and Figure 6 As shown, using PCBA products allows for more diverse product shapes and improves product reliability.

[0069] Automated production control ensures high efficiency and excellent dimensional control for electronic components and PCB boards, while minimizing manual labor intensity. The packaged finished products are essentially identical in specifications to the incoming IC materials. The final assembly plant can simultaneously assemble or package PCBA products with IC devices, thereby enabling changes in electronic component thickness, shape, and pin configurations. The key feature of this process is that precise calculations and scientific management, starting from the raw material preparation stage, ensure strict control and monitoring of PCBA component production. Ultimately, this allows finished PCBAs to overcome the limitations of variable thickness and shape for components such as LEDs, sensors, and IR sensors, thus meeting the functional requirements of mobile phones and tablets.

[0070] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A PCBA production management process, characterized in that, Includes the following steps: Step S1: Obtain the dimensions and shape requirements of the client's product, and perform calculation modeling for PCB board thickness control and electronic component design; specifically, this includes the PCBA structure, which includes a motherboard, a support plate, and electronic components. The support plate is fixedly connected to the motherboard via solder paste, and the electronic components are connected to the motherboard by being fixed to the support plate. The calculation modeling for PCB board thickness control and electronic component design specifically involves: Step S11: Establish a database of PCB board size specifications, a database of PCBA component size specifications, and a database of PCBA shape combination modules; Step S12: Create a template for inputting customer product dimensions and shape requirements, including inputting the overall PCBA board thickness, electronic component types, location requirements, and thickness; Step S13: Based on the type and thickness of electronic components, the overall thickness of the PCBA board, and the database of the padding board shape combination module, establish the padding board combination shape design module. Step S14: Establish calculation formulas for various parameters of the PCB board. Combine the PCB board substrate size specifications, electroplating thickness specifications, dry film size and thickness specifications and surface treatment specifications provided by the PCB board size specification database in step S11 to obtain parameters including PCB board size and thickness, electroplating thickness, dry film size and thickness and surface treatment. Step S15: Establish calculation formulas for various parameters of the PCBA board, and combine the PCBA component size specifications provided in the PCBA component size specification database in step S11 to obtain parameters including solder paste printing thickness. Step S2: Through precise calculations and scientific management, design and implement the PCB manufacturing process and parameters to produce PCBs with qualified thickness specifications. Specifically, this includes: Step S21: Input the client's dimensions and shape requirements to obtain the PCB board thickness and shape; Step S22: Transmit the data obtained from the calculation model to the PCB board manufacturing control terminal; Step S23: The PCB board manufacturing control terminal controls the PCB board manufacturing equipment to produce PCB boards with qualified thickness specifications. Step S3: Through precise calculation and scientific management, design and implement the assembly and placement process and parameters. By strictly controlling the stencil opening, printing machine parameters, and specifying solder paste materials, precise control of solder paste thickness is achieved, ultimately meeting the thickness and shape requirements of the finished PCBA. Specifically, this includes: Step S31: Input the client's dimensions and shape requirements to obtain the electronic component design scheme on the PCB board; Step S32: Transmit the data obtained from the calculation model to the assembly and placement manufacturing end. The assembly and placement manufacturing includes the following process steps in sequence: solder paste printing, SPI inspection, device placement, cutting and separating the board and testing and packaging. The assembly and placement manufacturing end includes a solder paste printing thickness control end and a device placement control end that control the process parameters of the assembly and placement manufacturing equipment. The solder paste printing thickness control end includes stencil opening control, printer parameter control and specified solder paste material control that control the process parameters of the assembly and placement manufacturing equipment, thereby precisely controlling the solder paste thickness. Step S33: The assembly and placement manufacturing end controls the assembly and placement manufacturing equipment to produce PCBA boards with qualified placement specifications.

2. The PCBA production management process according to claim 1, characterized in that, In step S22, the PCB board manufacturing process includes the following steps in sequence: material cutting, drilling, electroplating, dry film coating, etching, solder mask coating, surface treatment, milling, electrical testing, and packaging. The PCB board manufacturing control terminal includes a raw material control terminal, a drilling depth control terminal, an electroplating thickness control terminal, a dry film thickness control terminal, and a surface treatment control terminal that control the process parameters of the PCB board manufacturing equipment.

3. The PCBA production management process according to claim 1, characterized in that, It also includes step S4, whereby an automatic detection device performs automatic detection, wherein the automatic detection device measures the shape and size of the PCB manufacturing stage and the assembled components.

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