Polishing apparatus, method, apparatus and method for assisting polishing, system and method

Abstract

The application provides a polishing system for polishing a workpiece, the polishing system comprising a sensing module and a processor, the sensing module being configured to sense a stress condition of the workpiece to form a pressure sequence, and the processor being coupled to the sensing module and configured to receive the pressure sequence, form guidance information for guiding a polishing head to polish the workpiece along a preset track, form a deviation sequence of the pressure sequence according to the pressure sequence and the guidance information, and form an adjustment instruction for adjusting a position of the polishing head according to the deviation sequence. The application also provides a polishing method, an auxiliary polishing device, an auxiliary polishing system and an auxiliary polishing method.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of polishing, and in particular to a polishing device, a polishing method, an auxiliary polishing device, a system and a method. BACKGROUND

[0002] With the advancement of technology, users have increasingly high quality requirements for workpieces, especially the performance of the workpieces such as the touch feeling and the smoothness. The polishing process is an important link for improving the performance.

[0003] The conventional polishing process cannot quantify the force information of the workpiece in the polishing process, cannot accurately control the polishing track and the polishing position of the polishing head, and thus causes the polished workpiece to have features such as whitening, uneven lines, and uneven depth, and easily causes the polishing device to be stuck or the workpiece to be damaged when polishing a chamfer (such as an R corner of a 3C workpiece such as a mobile phone), thereby affecting the use experience of the workpiece. SUMMARY

[0004] In view of the above, it is necessary to provide a polishing device, a polishing method, an auxiliary polishing device, a system and a method to solve the above problems.

[0005] The first aspect of the present application provides a polishing system for polishing a workpiece, comprising:

[0006] a sensing module configured to sense a force condition of the workpiece and form a pressure sequence;

[0007] a processor coupled to the sensing module and configured to: receive the pressure sequence; form a guide information, the guide information being used to guide a polishing head to polish the workpiece in a preset track; form a deviation sequence of the pressure sequence according to the pressure sequence and the guide information; and form an adjustment instruction according to the deviation sequence to adjust a position of the polishing head.

[0008] Further, the guide information comprises a preset position and a conversion relationship, the preset position being a calculated position of the polishing head for polishing the workpiece, and the conversion relationship being a conversion formula of a pressure of the polishing head and deformation information of a polishing material on the polishing head. The processor is further configured to: determine the conversion relationship according to a rigidity parameter of the polishing material on the polishing head; form the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relationship; and form the deviation sequence according to the deformation information and the preset position.

[0009] Further, the processor is further configured to: form an adjusted pressure sequence by a filter according to the pressure sequence; and determine the deviation sequence according to the adjusted pressure sequence and the guide information.

[0010] Further, the guidance information comprises a first running track, the processor is further configured to: form the guidance information comprising: determining that the device combination for polishing the workpiece comprises the machine assembly and the polishing head; based on that the device combination for polishing the workpiece comprises the machine assembly and the polishing head, forming the first running track, the first running track being a running track of the polishing head; and the processor is further configured to form the deviation sequence according to the pressure sequence and the first running track.

[0011] Further, the processor is further configured to: based on that the device combination for polishing the workpiece comprises the machine assembly and the polishing head, form a base track and a first adjustment amount, the base track being a running track of the polishing head formed on a plane constituted by a first direction and a third direction, the first adjustment amount being an adjustment sequence loaded on the base track on a plane constituted by a second direction and the third direction, the first direction, the second direction and the third direction being perpendicular to each other, the first direction being a direction of the polishing head towards the workpiece; and form the first running track according to the base track and the first adjustment amount.

[0012] Further, the processor is further configured to: based on that the device combination for polishing the workpiece comprises the machine assembly and the polishing head, form a base track and a second adjustment amount, the base track being a running track of the polishing head formed on a plane constituted by a first direction and a third direction, the second adjustment amount being a carrier signal superimposed on the base track in a second direction, the first direction, the second direction and the third direction being perpendicular to each other, the first direction being a direction of the polishing head towards the workpiece; and form the first running track according to the base track and the second adjustment amount.

[0013] Further, the processor is further configured to: based on that the device combination for polishing the workpiece comprises the machine assembly and the polishing head, form a base track and a third adjustment amount, the base track being a running track of the polishing head formed on a plane constituted by a first direction and a third direction, the third adjustment amount being a fixed value superimposed on the base track in the first direction, the first direction being perpendicular to the third direction, the first direction being a direction of the polishing head towards the workpiece; and form the first running track according to the base track and the third adjustment amount.

[0014] Further, the processor is further configured to: based on that the device combination for polishing the workpiece comprises the machine assembly and the polishing head, form a base track and a fourth adjustment amount, the base track being a running track of the polishing head formed on a plane constituted by a first direction and a third direction, the fourth adjustment amount being a variable value superimposed on the base track in the first direction, the first direction being perpendicular to the third direction, the first direction being a direction of the polishing head towards the workpiece; and form the first running track according to the base track and the fourth adjustment amount.

[0015] Further, the guidance information further comprises a second running track, and the processor is further configured to: form the guidance information further comprising: determining that the device combination further comprises a carrying module, the carrying module being configured to carry the workpiece and rotate or move the workpiece; based on the device combination further comprising the carrying module, forming the second running track, the second running track being a running track of the workpiece; and the processor is further configured to form the deviation sequence according to the pressure sequence, the first running track and the second running track.

[0016] Further, the guidance information further comprises chamfer information, and the processor is further configured to: determine the chamfer information based on the device combination further comprising the carrying module; calculate a chamfer track corresponding to the chamfer information according to the chamfer information and the first running track; and form the second running track according to the chamfer track.

[0017] Further, the processor is further configured to: adjust the first running track to a third running track according to the second running track and the chamfer track; and form the deviation sequence according to the pressure sequence, the third running track and the second running track.

[0018] The second aspect of the present application provides a polishing method for controlling a polishing head on a machine assembly to polish a workpiece, comprising: receiving a pressure sequence, the pressure sequence being formed by a sensing module sensing a stress condition of the workpiece; forming guidance information, the guidance information being used to guide the polishing head to polish the workpiece along a preset track; forming a deviation sequence of the pressure sequence according to the pressure sequence and the guidance information; and forming an adjustment instruction according to the deviation sequence to adjust a position of the polishing head.

[0019] Further, the guidance information comprises a preset position and a conversion relationship, the preset position being a calculated position of the polishing head polishing the workpiece, and the conversion relationship being a conversion formula of a pressure of the polishing head and deformation information of a polishing material on the polishing head, and the method further comprises: determining the conversion relationship according to a rigidity parameter of the polishing material on the polishing head; forming the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relationship; and forming the deviation sequence according to the deformation information and the preset position.

[0020] Further, the step of forming the deviation sequence of the pressure sequence comprises: forming an adjusted pressure sequence by a filter according to the pressure sequence; and determining the deviation sequence according to the adjusted pressure sequence and the guidance information.

[0021] Further, the guidance information comprises a first movement trajectory, the step of forming the guidance information comprises: determining that the device combination for polishing the workpiece comprises the machine assembly and the polishing head; based on the device combination for polishing the workpiece comprising the machine assembly and the polishing head, forming the first movement trajectory, the first movement trajectory being a movement trajectory of the polishing head; the step of forming the deviation sequence of the pressure sequence comprises forming the deviation sequence according to the first movement trajectory and the pressure sequence.

[0022] Further, the step of forming the first movement trajectory comprises: based on the device combination for polishing the workpiece comprising the machine assembly and the polishing head, forming a base trajectory and a first adjustment amount, the base trajectory being a movement trajectory of the polishing head formed on a plane constituted by a first direction and a third direction, the first adjustment amount being an adjustment sequence loaded on the base trajectory on a plane constituted by a second direction and the third direction, the first direction, the second direction and the third direction being perpendicular to each other, the first direction being a direction of the polishing head towards the workpiece; forming the first movement trajectory according to the base trajectory and the first adjustment amount.

[0023] Further, the step of forming the first movement trajectory comprises: based on the device combination for polishing the workpiece comprising the machine assembly and the polishing head, forming a base trajectory and a second adjustment amount, the base trajectory being a movement trajectory formed on a plane constituted by a first direction and a third direction, the second adjustment amount being a carrier signal superimposed on the base trajectory in a second direction, the first direction, the second direction and the third direction being perpendicular to each other, the first direction being a direction of the polishing head towards the workpiece; forming the first movement trajectory according to the base trajectory and the second adjustment amount.

[0024] Further, the step of forming the first movement trajectory comprises: based on the device combination for polishing the workpiece comprising the machine assembly and the polishing head, forming a base trajectory and a third adjustment amount, the base trajectory being a movement trajectory formed on a plane constituted by a first direction and a third direction, the third adjustment amount being a fixed value superimposed on the base trajectory in the first direction, the first direction being perpendicular to the third direction, the first direction being a direction of the polishing head towards the workpiece; forming the first movement trajectory according to the base trajectory and the third adjustment amount.

[0025] Further, the step of forming the first running track comprises: based on the device combination comprising the machine assembly and the polishing head for polishing the workpiece, forming a base track and a fourth adjustment amount, the base track being a moving track formed on a plane constituted by a first direction and a third direction, the fourth adjustment amount being a change value superimposed on the base track in the first direction, the first direction being perpendicular to the third direction, the first direction being a direction of the polishing head towards the workpiece; forming the first running track according to the base track and the fourth adjustment amount.

[0026] Further, the guiding information further comprises a second running track, the second running track being a running track of the workpiece, the step of forming the deviation sequence further comprises: determining that the device combination further comprises a bearing module, the bearing module being used for bearing the workpiece and being capable of rotating or moving the workpiece; forming the second running track based on the device combination further comprising the bearing module; forming the deviation sequence according to the pressure sequence, the first running track and the second running track.

[0027] Further, the guiding information further comprises chamfer information, the step of forming the second running track comprises: determining the chamfer information based on the device combination further comprising the bearing module; calculating a chamfer track corresponding to the chamfer information according to the first running track and the chamfer information; forming the second running track according to the chamfer track.

[0028] Further, the step of forming the deviation sequence further comprises: adjusting the first running track to a third running track according to the second running track and the chamfer track; forming the deviation sequence according to the pressure sequence, the third running track and the second running track.

[0029] The third aspect of the present application provides a device for assisting polishing, which is used for bearing and sensing a workpiece to be polished, and comprises: a bearing part used for bearing the workpiece and bearing at least one of force and torque from the workpiece; a sensing module connected to the bearing part; a connecting part arranged between the bearing part and the sensing module; a base connected to the mounting part and comprising a first hollow part in communication with the first channel; a mounting part arranged between the sensing module and the base, the mounting part being a hollow structure, and the hollow part being arranged as a first channel; the sensing module is further connected to a cable, the cable being used for coupling the sensing module through the first hollow part and the first channel; the sensing module is used for sensing the at least one of the force and the torque, forming a pressure value, and transmitting the pressure value to the polishing device through the cable.

[0030] Further, the carrier includes a first hole; the sensor module includes a second hollow portion; the connecting portion is a hollow structure, and the hollow portion is configured as a second channel; the air extraction module includes an air pipe coupled to the first hole for penetrating at least one of the first hollow portion, the first channel, the second hollow portion, and the second channel to form a bonding force between the workpiece placed on the carrier and the carrier through the first hole.

[0031] Further, the base includes a sealing cover connected to the mounting portion and including a second hole; an inner cavity including the first hollow portion; the second hole is disposed between the first hollow portion and the first channel; a moving portion connected to the inner cavity; and the inner cavity further includes a sealing portion disposed between the moving portion and the first hollow portion.

[0032] The fourth aspect of the present application provides a system for assisting polishing, configured to assist a polishing device in polishing a workpiece, including a communicator configured to obtain a first trajectory and a second trajectory; and a processor coupled to the communicator and configured to control a carrier module to perform at least one of pausing, moving, and rotating along the first trajectory, the carrier module being configured to carry the workpiece; obtain a trigger signal and determine whether the trigger signal meets a trigger condition; and based on the trigger signal meeting the trigger condition, control the carrier module to change to perform at least one of pausing, moving, and rotating along the second trajectory.

[0033] Further, the trigger signal is a time of polishing the workpiece along the first trajectory, and the system further includes a timer coupled to the processor and configured to obtain the time; and the processor is further configured to determine that the time is equal to a preset time; and based on the time being equal to the preset time, control the carrier module to change to perform at least one of pausing, moving, and rotating along the second trajectory.

[0034] Further, the trigger signal is a speed of polishing the workpiece along the first trajectory, and the system further includes a detector coupled to the processor and configured to detect the speed; and the processor is further configured to determine that the speed is less than or equal to a preset speed; and based on the speed being less than or equal to the preset speed, control the carrier module to change to perform at least one of pausing, moving, and rotating along the second trajectory.

[0035] The fifth aspect of the present application provides a method for assisting polishing, configured to control a system for assisting polishing to cooperate with a polishing device in polishing a workpiece, including obtaining a first trajectory and a second trajectory; controlling a carrier module to perform at least one of pausing, moving, and rotating along the first trajectory, the carrier module being configured to carry the workpiece; obtaining a trigger signal and determining whether the trigger signal meets a trigger condition; and based on the trigger signal meeting the trigger condition, controlling the carrier module to change to perform at least one of pausing, moving, and rotating along the second trajectory.

[0036] Further, the trigger signal is a time of polishing the workpiece along the first trajectory, the step of obtaining the trigger signal and determining that the trigger signal reaches a trigger condition comprises: obtaining the time; determining that the time is equal to a preset time; based on the time being equal to the preset time, controlling the carrier module to change to performing at least one of pausing, moving and rotating along the second trajectory.

[0037] Further, the trigger signal is a speed of polishing the workpiece along the first trajectory, the step of obtaining the trigger signal and determining that the trigger signal reaches a trigger condition comprises: detecting the speed; determining that the speed is less than or equal to a preset speed; based on the speed being less than or equal to the preset speed, controlling the carrier module to change to performing at least one of pausing, moving and rotating along the second trajectory.

[0038] The polishing system and the polishing method provided by the present application can sense the force information of the workpiece, and adjust the running trajectory of the polishing head based on the force information, so as to control the force condition of each polishing point of the workpiece in the polishing process by controlling the running trajectory of the polishing head, thereby improving the quality of the polished workpiece. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 A schematic diagram of a polishing system according to one or more embodiments of the present application is shown.

[0040] Figure 2 A state schematic diagram of a polishing system according to one or more embodiments of the present application is shown.

[0041] Figure 3 A schematic diagram of a running trajectory according to one or more embodiments of the present application is shown.

[0042] Figure 4 A schematic diagram of a polishing method according to one or more embodiments of the present application is shown.

[0043] Figure 5 A schematic diagram of a polishing method according to one or more embodiments of the present application is shown.

[0044] Figure 6 A schematic diagram of a polishing method according to one or more embodiments of the present application is shown.

[0045] Figure 7 A perspective schematic diagram of an auxiliary polishing device according to one or more embodiments of the present application is shown.

[0046] Figure 8 A cross-sectional view of an auxiliary polishing device according to one or more embodiments of the present application is shown.

[0047] Figure 9A schematic diagram showing a system for assisted polishing according to one or more embodiments of the present application.

[0048] Figure 10 A schematic diagram showing a method for assisted polishing according to one or more embodiments of the present application. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0050] It should be noted that when one element or component is said to be "connected to" another element or component, it can be directly connected to the other element or component or intervening elements or components can be present. When one element or component is said to be "positioned on" another element or component, it can be directly positioned on the other element or component or intervening elements or components can be present.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0052] Various embodiments of the present application can take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment containing both hardware and software elements (e.g., a firmware embodiment). Furthermore, various embodiments of the present application (e.g., systems and methods) can take the form of a computer program product on a computer-readable storage medium having computer-readable program code embodied in the medium, e.g., computer-readable and / or computer-executable instructions.

[0053] These instructions can be read or accessed and executed by one or more processors to perform or allow performance of the operations described herein. The instructions can be provided in any suitable form, such as source code, compiled code, interpreted code, executable code, static code, dynamic code, assembled code, interpreted code, machine code, data, or any other desirable format, and organized in any suitable manner, such as by type of computer instructions. The instructions can be stored in any suitable storage medium or memory, media, or memory that is operatively coupled with one or more computers or processors. The various memories of a computer programmed to play a game, for example, can include one or more of the following: ROM; RAM; magnetic disk storage; optical storage; flash memory; etc.

[0054] The operations in the diagrams and flowcharts described herein are not necessarily presented in any particular order. A process can have additional steps not presented, or the steps presented in the diagrams and flowcharts can be eliminated from a particular implementation. The diagrams and flowcharts can include additional steps to account for various exceptions or to account for various transitory states of a system. The steps can be performed in any order that is practical or that is otherwise desirable.

[0055] Unless explicitly stated otherwise, any aspects, programs, processes, or techniques presented herein are not to be construed as requiring their acts or steps to be performed in a particular order. Accordingly, where a process or method claim does not actually recite a specific order thereof, or where a process or method claim does not recite an order but the steps are presented in an order that is not the order in which the steps are performed, no inference should be drawn that the order of performance of the steps is limited to that order. This applies to any possible non-explicitly stated orderings of steps in any possible non-explicitly stated combination of steps. This applies to any possible non-explicitly stated orderings of steps in any possible non-explicitly stated combination of steps.

[0056] As used in this application, the terms "environment," "system," "engine," "module," "component," "architecture," "interface," "unit," and the like can refer to either computer-related entities or to operational devices associated with a computer that can have one or more defined functions. The terms "environment," "system," "engine," "module," "component," "architecture," "interface," and "unit" can be used interchangeably and can generally refer to functional elements. Such entities can be either hardware, a combination of hardware and software, software, or software in execution. For example, a module can be implemented as a process running on a processor, a processor, an object, an executable portion of software, a thread of execution, a program, and / or a computing device. As another example, both a software application running on a computing device and the computing device can be implemented as modules. As yet another example, one or more modules can reside within a process and / or thread of execution. A module can be located on one computing device or distributed across two or more computing devices. As disclosed herein, a module can execute from various computer-readable non-transitory storage media having various data structures stored thereon. Modules can communicate via local and / or remote processes such as, for example, in accordance with a signal (analogic or digitalic) having one or more data packets (e.g., data from components interacting with a module in a local system, distributed system, and / or data to be sent to another component, e.g., over a wide area network having other systems, via the signal).

[0057] As yet another example, a module can be implemented as or can include a device having defined functions provided by mechanical components that are operated by electrical or electronic circuitry, the electrical or electronic circuitry being controlled by a software application or a firmware application executed by a processor. Such a processor can be internal or external to the device and can execute at least a portion of the software or firmware application. As yet another example, a module can be implemented as or can include a device that provides defined functions through electronic components without mechanical components. The electronic components can include a processor to execute software or firmware that allows or at least partially facilitates the functionality of the electronic components. In some implementations, a module can communicate via local and / or remote processes such as, for example, in accordance with a signal (analogic or digitalic) having one or more data packets (e.g., data from components interacting with a module in a local system, distributed system, and / or data to be sent to another component, e.g., over a wide area network having other systems, via the signal). Additionally, or in other implementations, a module can communicate or otherwise be coupled by way of thermal, mechanical, electrical, and / or electromechanical couplings (e.g., conduits, connectors, combinations thereof, etc.). An interface can include Input / Output (I / O) components and associated processors, applications, and / or other programming components.

[0058] As used in this application, the term "communicator" can refer to any type of communication circuitry or device. The communicator can be implemented as or can include several types of network elements, including a base station; a router device; a switch device; a server device; an aggregator device; a bus architecture; a combination of the foregoing; or the like. One or more bus architectures can include an industrial bus architecture, such as an Ethernet-based industrial bus, a Controller Area Network (CAN) bus, Modbus, other types of fieldbus architectures, etc.

[0059] As used in this application, the term "processor" can refer to any type of processing circuitry or device. Processors can be implemented as combinations of processing circuitry or computing processing units (e.g., (Central Processing Units, CPUs), (Graphics Processing Units, GPUs), or combinations thereof). Thus, for purposes of this description, a processor can refer to a single-core processor; a single processor with software multithread execution capability; a multi-core processor; a multi-core processor with software multithread execution capability; a multi-core processor with hardware multithread technology; a parallel computing platform; and parallel computing platforms with distributed shared memory. Also, or for example, a processor can refer to an Integrated Circuit (IC), an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a Field Programmable Gate Array (FPGA), a Programmable Logic Controller (PLC), a Complex Programmable Logic Device (CPLD), discrete gate or transistor logic, discrete hardware components, or any combination thereof designed or configured (e.g., manufactured) to perform the functions described herein. In some embodiments, a processor can use nanoscale architectures to optimize space usage or enhance performance of systems, devices, or other electronic devices in accordance with the present application. For example, a processor can include molecular transistors and / or quantum dot-based transistors, switches, and gate circuits.

[0060] Furthermore, in the present specification and drawings, terms such as "storage," "memory," "data storage," "data memory," "memory," "repository," and the like, as well as substantially any other information storage components related to the operation and functionality of the components of the present application, refer to the memory components, entities embodied in one or more memory devices, or the components forming the memory devices. It should be noted that the memory components or memory devices described herein embody or include a non-transitory computer storage medium that is readable or accessible by a computing device. Such media can be implemented in any methods or technology for storage of information, such as machine-accessible instructions (e.g., computer-readable instructions), information structures, program modules, or other information objects.

[0061] Further, in the present specification and drawings, terms such as "store," "storage," "data store," data storage," "database," "repository," and substantially any other information storage component relevant to operation and functionality of components of the present application refer to "memory components," entities embodied in one or more memories, or component formed of one or more memories. The memories can be volatile or nonvolatile storage, or both. Further, memory components or memory devices can be removable or non-removable, and / or integral to computing devices or components thereof. Examples of various types of non-transitory storage media can include hard disk drives, zip drives, CD-ROMs, Digital Video Discs (DVDs) or other optical storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, flash memory cards or other types of memory cards, magnetic tape cassettes or other non-transitory media suitable for storing data desired to be retained by computing devices and accessible by the computing devices. For example, non-volatile memory can include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM), which acts as external buffer memory for the processor. By way of illustration, and not limitation, RAM is available in many forms such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), and direct Rambus RAM (DRRAM).The disclosed memory devices or memories of the operating or computing environments described herein are intended to encompass one or more of these and / or any other suitable type of memory.

[0062] Conditional language used herein, such as, among others, "can," "could," "might," "may," "e.g.," and the like, unless specifically stated otherwise, generally are intended to convey that certain implementations could include, will include, and sometimes may include a certain feature, element, and / or operation. Thus, such conditional language is not generally intended to imply that features, elements, and / or operations are in any way required for one or more implementations or that one or more implementations necessarily include logic for deciding, with or without user input or prompting, whether these features, elements, and / or operations are included or are to be performed in any implementation.

[0063] Computer readable program instructions described herein can be downloaded to respective computing / processing devices from a computer readable storage medium or to an external computer or external storage device via a network, for example, the Internet, a local area network, a wide area network and / or a wireless network. The network can comprise copper transmission cables, optical transmission fibers, wireless transmission, routers, firewalls, switches, gateway computers and / or edge servers. A network adapter card or network interface in each computing / processing device receives computer readable program instructions from the network and forwards the computer readable program instructions to a computer readable non-transitory storage medium within the respective computing / processing device. What has been described herein includes examples of systems, devices, techniques and computer program products that, alone or in combination, allow for tracking and tracing components of products manufactured in industrial devices. Of course, not all possible combinations of components and / or methods are described in order to not obscure the disclosure of various elements of the present application. However, many other combinations of the disclosed elements are possible. Thus, it is apparent that there are a number of modifications which can be made to the present application and which have been made in an effort to convey the substance of the application from a conceptual point of view. As such, all changes coming within the meaning and equivalency range of the appended claims are intended to be embraced therein. Furthermore, it is evident that various modifications in addition to those described can be made by those skilled in the art in view of the flexible nature of the present application without departing from its spirit. Without intending to limit the scope of the application, exemplary embodiments are next presented.

[0064] The examples set forth herein are considered to be illustrative and not restrictive. Although the terms "comprises" and "comprising" are used herein to describe and refer to certain features, elements, and / or processes, they are also used in the sense of "including" and "including but not limited to." That is, when used in this manner, the term "comprises" or "comprising" means that at least the named process is included, but not other processes not specifically named.

[0065] See Figure 1 In some embodiments, the polishing system 700 is configured to polish the workpiece 12. The polishing system 700 includes the sensing module 30 and the first processor 720.

[0066] The sensing module 30 is configured to sense the force condition of the workpiece 12 and form a pressure sequence.

[0067] The first processor 720 is coupled to the sensing module 30 and configured to receive the pressure sequence and form a guide information, wherein the guide information is used to guide the polishing head 10 to polish the workpiece 12 along a preset trajectory. According to the pressure sequence and the guide information, a deviation sequence is formed. According to the deviation sequence, an adjustment instruction is formed to adjust the position of the polishing head 10.

[0068] It can be understood that in other embodiments, the sensing module 30 can include a 6-axis force sensor or a single-axis force sensor, as long as it can directly sense the force condition of the workpiece 12. The sensing module 30 can also be a force sensor with an IP65 or higher protection level to meet the safety requirements of the workpiece 12 polishing.

[0069] Therefore, referring to Figure 2 , the sensing module 30 can be arranged on the bearing module 80 bearing the workpiece 12 to sense the force condition of the workpiece 12, wherein the force condition includes the force condition of multiple points of the polishing part 410 of the workpiece 12, and the force condition of multiple points forms a pressure sequence.

[0070] The sensing module 30 sends the pressure sequence to the first processor 720, and the first processor 720 receives the pressure sequence and forms a guide information, wherein the guide information is used to guide the running trajectory of the polishing head 10 polishing the workpiece 12, for example, the running trajectory is consistent with the shape of the part to be polished of the workpiece 12, such as a circular, square or annular shape, or the running trajectory is a composite motion trajectory of the polishing head 10 moving along a circular or square, annular shape while moving along a direction perpendicular to the annular motion direction.

[0071] The first processor 720 adjusts or pre-configures the force condition of the workpiece 12 applied by the polishing head 10 during the running process in real time based on the motion trajectory and the force condition of the workpiece 12 in the motion trajectory, i.e. the received pressure sequence, i.e. forms a deviation sequence.

[0072] The first processor 720 forms an adjustment instruction according to the deviation sequence to adjust the polishing head 10 to polish the workpiece 12, so that the polishing head 10 corresponds to different positions at different parts to be polished of the workpiece 12, so that the force condition of each point of the polishing part of the workpiece 12 conforms to the preset pressure sequence, so as to realize the quantitative control of the force condition of the workpiece 12 polished by the polishing head 10.

[0073] The adjustment amount of the running track is formed by the deviation sequence, the preset running track is superimposed or adjusted in other ways, and an adjusted running track is formed. The adjusted running track is converted into a force control sequence for polishing the workpiece 12 through a conversion relationship. The force control sequence is the adjustment instruction. According to the adjustment instruction, the polishing head 10 can polish the workpiece 12 in a process that meets the polishing accuracy requirement and adapts to the current scene and working condition, so as to obtain the workpiece 12 that meets the polishing accuracy requirement.

[0074] Further, the guide information includes a preset position and a conversion relationship. The preset position is a calculated position of the polishing head 10 for polishing the workpiece 12, that is, position information of the polishing head 10 at different polishing points of the workpiece 12. The conversion relationship is a conversion formula of the pressure of the polishing head 10 and deformation information of the polishing material on the polishing head 10. The first processor 720 is further configured to determine the conversion relationship according to a rigidity parameter of the polishing material on the polishing head 10.

[0075] According to the pressure sequence and the conversion relationship, the deformation information corresponding to the pressure sequence is formed.

[0076] According to the deformation information and the preset position, the deviation sequence is formed.

[0077] In this way, the first processor 720 determines the conversion relationship based on the rigidity parameter of the polishing material on the polishing head 10. The rigidity parameter mainly determines the hardness of the material pressed into the object (such as sandpaper) (similar to the concept of elastic coefficient) to provide a conversion relationship for controlling the force / position in the calculation. The first processor 720 forms deformation information corresponding to the pressure sequence according to the conversion relationship and the pressure sequence. The deformation information is set by a material coefficient s (which determines the hardness / rigidity of the stressed material, similar to the elastic coefficient, with a unit of mm / N) in the force control parameter.

[0078] For example, the polishing head 10 is attached with sandpaper, and 0.1 mm is pressed into the workpiece 12. Then, how many N the stress rises can be seen to obtain the material coefficient s of the sandpaper. Therefore, the deformation information is force*s. The first processor 720 forms a deviation sequence according to the deformation information and the preset position of the polishing head 10. The deviation sequence is adjustment information of the polishing head 10 based on the deformation information and the preset position. For example, the polishing head 10 generates a deformation amount of 0.2 mm due to the application of a preset pressure of 10 N. The polishing head 10 needs to move 0.2 mm based on the preset position and the deformation direction.

[0079] Further, the first processor 720 is further configured to:

[0080] According to the pressure sequence, an adjusted pressure sequence is formed through a filter.

[0081] Based on the adjusted pressure sequence and the guidance information, the deviation sequence is determined.

[0082] Thus, by adjusting the pressure sequence through a filter, high-frequency interference, such as that caused by the vibration of a windmill, can be eliminated. This filter can be a virtual filter or a physical filter. For example, a virtual filter for noise removal can be implemented using LabVIEW Express programming.

[0083] Furthermore, the guidance information includes a first running trajectory, and the first processor 720 is further used for:

[0084] This guidance information includes:

[0085] The apparatus assembly for grinding the workpiece 12 is determined to include machine components and the grinding head 10;

[0086] The apparatus assembly for grinding the workpiece 12 includes the machine component and the grinding head 10, forming the first running trajectory, which is the running trajectory of the grinding head 10;

[0087] The first processor 720 is further configured to form the deviation sequence based on the pressure sequence and the first running trajectory.

[0088] For example, when forming guidance information, it includes: first determining that the device assembly for grinding the workpiece 12 includes a machine component and a grinding head 10, wherein the machine component may be a robotic arm connected to the grinding head 10 for controlling the movement of the grinding head 10 according to control commands. Of course, the machine component may also be replaced with other drive components, as long as they can drive the grinding head 10 to move.

[0089] The trajectory of the machine component driving the grinding head 10 to move is the first running trajectory. The first running trajectory is exemplified as a grinding trajectory preset according to the finished product requirements of the workpiece 12, so that after grinding the workpiece 12 through the first running trajectory, a workpiece 12 that meets the accuracy requirements can be obtained.

[0090] The first processor 720 forms the deviation sequence based on the pressure sequence and the first running trajectory. For example, when the grinding head 10 grinds the straight edge of the frame-type workpiece 12, the workpiece 12 is fixed by the bearing module 80, and the machine component drives the grinding head 10 to move to grind the workpiece 12.

[0091] Specifically, such as Figure 2 As shown, it includes two coordinate systems: the work coordinate system and the tool coordinate system. The work coordinate system is a three-dimensional coordinate system established based on the sensing module 30 or the workpiece 12 on the bearing module 80, while the tool coordinate system is a three-dimensional coordinate system established based on the grinding head 10.

[0092] The first direction is schematically the X-axis direction of the work coordinate system, the second direction is the Z-axis direction of the work coordinate system, and the third direction is the Y-axis direction of the work coordinate system. Figure 2 The Y-axis direction is understood as the vertical direction of the paper.

[0093] The basic trajectory is schematically a movement trajectory (for example, a translational trajectory) of the polishing head 10 formed in the XY plane of the work coordinate system. For the convenience of description, the compound motion of the polishing head 10 in the tool coordinate system is divided into the motion of the workpiece 12 in the XY plane, the ZY plane, and the XZ plane. As shown in the figure, Figure 2 The tool coordinate system follows the motion of the polishing head 10, and in the figure, the tool coordinate system is shown as being converted to match the first state or the second state to become the tool 1 coordinate system or the tool 2 coordinate system at different motion positions of the polishing head 10 (for example, the first state and the second state).

[0094] Further, the first processor 720 is further configured to:

[0095] Based on the device combination for polishing the workpiece 12 comprising the machine assembly and the polishing head 10, a basic trajectory and a first adjustment amount are formed, the basic trajectory is a movement trajectory formed in a plane composed of a first direction and a third direction, the first adjustment amount is an adjustment sequence loaded on the basic trajectory in a plane composed of a second direction and the third direction, the first direction, the second direction, and the third direction are perpendicular to each other, and the first direction is the direction of the polishing head 10 towards the workpiece 12;

[0096] According to the basic trajectory and the first adjustment amount, the first movement trajectory is formed.

[0097] Among them, the first adjustment amount of the XY plane of the tool coordinate system can be at least one of a straight line, a circle, an ellipse, a rhombus, or other plane rubbing movement trajectories set according to the polishing face requirements of the polishing head 10. In this way, the movement trajectory of the polishing head 10 can be adjusted according to the first adjustment amount to polish the workpiece 12 into different shapes.

[0098] Further, the first processor 720 is further configured to:

[0099] Based on the device combination for polishing the workpiece 12 comprising the machine assembly and the polishing head 10, a basic trajectory and a second adjustment amount are formed, the basic trajectory is a movement trajectory formed in a plane composed of a first direction and a third direction, the second adjustment amount is a carrier signal superimposed on the basic trajectory in a second direction, the first direction, the second direction, and the third direction are perpendicular to each other, and the first direction is the direction of the polishing head 10 towards the workpiece 12;

[0100] According to the base trajectory and the second adjustment amount, the first operation trajectory is formed.

[0101] Specifically, referring again to Figure 2 , the second adjustment amount is a carrier signal with frequency and amplitude applied along the Y-axis direction of the tool coordinate system, which can be a sine wave, a square wave, or other axial swing operation trajectory set according to the polishing face requirements of the polishing head 10, so that the polishing head 10 can realize axial swing. In this way, by adjusting the second adjustment amount, the polishing head 10 can customize the workpiece 12, for example, the shape, smoothness, etc. of the workpiece 12 after polishing can be controlled to enhance the generalization of the workpiece 12.

[0102] Further, the first processor 720 is further configured to:

[0103] Based on the device combination for polishing the workpiece 12 comprising the machine assembly and the polishing head 10, a base trajectory and a third adjustment amount are formed, the base trajectory is a movement trajectory formed on a plane constituted by a first direction and a third direction, the third adjustment amount is a fixed value superimposed on the base trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is the direction of the polishing head 10 towards the workpiece 12;

[0104] According to the base trajectory and the third adjustment amount, the first operation trajectory is formed.

[0105] Specifically, referring again to Figure 2 , the third adjustment amount is an increment of the polishing head 10 pressed into the workpiece 12 along the Z-axis direction of the tool coordinate system, so that the polishing head 10 is close to the workpiece 12 along the polishing direction, i.e. the Z-axis direction of the tool coordinate system, by the third increment, to control the quality of the polishing head 10 polishing the workpiece 12.

[0106] Further, the first processor 720 is further configured to:

[0107] Based on the device combination for polishing the workpiece 12 comprising the machine assembly and the polishing head 10, a base trajectory and a fourth adjustment amount are formed, the base trajectory is a movement trajectory formed on a plane constituted by a first direction and a third direction, the fourth adjustment amount is a variable value superimposed on the base trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is the direction of the polishing head 10 towards the workpiece 12;

[0108] According to the base trajectory and the fourth adjustment amount, the first operation trajectory is formed.

[0109] Specifically, referring again to Figure 2, the fourth adjustment amount is a change value applied along the Z-axis direction of the tool coordinate system. It can be understood that there are two polishing methods in the actual polishing process. One is that the overpressure amount of the polishing head 10 to the workpiece 12 is a fixed value (such as the third adjustment amount). For example, the polishing surface of the polishing head 10 is covered with sandpaper, and the sandpaper is polished on the workpiece 12. The sandpaper is divided into two areas, one is the area that has not been polished, and the other is the area that has been polished. The overpressure amount is a fixed value, for example, 0.1mm, which is convenient for controlling the polishing relationship. The other polishing method is that the overpressure amount is a change value (such as the fourth adjustment amount). When the polished area of the sandpaper deviates to the unpolished area, the overpressure amount gradually increases, for example, from 0.05mm to 0.1mm, so that the sandpaper polishing wear is more uniform, the service life of the sandpaper is increased, and the polishing accuracy of the sandpaper is better controlled. It can be understood that the workpiece 12 can also be polished directly by the polishing surface of the polishing head 10.

[0110] Further, the guidance information further comprises a second running track, and the first processor 720 is further configured to:

[0111] The device combination further comprises a bearing module 80, and the bearing module 80 is configured to bear the workpiece 12 and rotate or move the workpiece 12.

[0112] Based on the device combination further comprising the bearing module 80, the second running track is determined as a running track of the workpiece 12.

[0113] The first processor 720 is further configured to determine the deviation sequence according to the pressure sequence, the first running track and the second running track.

[0114] Specifically, referring again to Figure 2 The bearing module 80 is a rotatable jig, which can bear the workpiece 12 and drive the workpiece 12 to rotate. Of course, the bearing module 80 can also be other mechanisms as long as the workpiece 12 can be rotated or moved.

[0115] Further, the guidance information further comprises chamfer information, and the first processor 720 is further configured to:

[0116] Based on the device combination further comprising the bearing module 80, the chamfer information is determined.

[0117] According to the chamfer information, the first running track and a chamfer track corresponding to the chamfer information are calculated.

[0118] According to the chamfer track, the second running track is formed.

[0119] Further, the first processor 720 is further configured to:

[0120] According to the second running track and the chamfer track, the first running track is adjusted to be a third running track;

[0121] According to the pressure sequence, the third running track and the second running track, the deviation sequence is formed.

[0122] For example, when the polishing head 10 polishes the corner of the workpiece 12, the polishing head 10 and the bearing module 80 bearing the workpiece 12 are both moved, and the bearing module 80 bearing the workpiece 12 is moved, and the polishing head 10 and the bearing module 80 are matched to keep the Z direction of the polishing head 10 based on the tool coordinate system unchanged, so that the polishing quality of the workpiece 12 can be controlled.

[0123] Specifically, when the polishing head 10 polishes the corner of the workpiece 12, the bearing module 80 drives the workpiece 12 to run along the second running track while the polishing head 10 runs along the first running track. In order to keep the Z direction of the polishing head 10 based on the tool coordinate system unchanged, the first running track is adjusted again, and the sum of the adjustment amounts during the running is the deviation sequence. The first running track (such as the A track in Figure 3 ) is adjusted to be a third running track (such as the B track in Figure 3 ) through the deviation sequence, so that the Z direction of the polishing head 10 based on the tool coordinate system remains unchanged, and the polishing quality of the workpiece 12 can be controlled.

[0124] For example, please refer to Figure 3 , Figure 3 is a running track schematic diagram of one embodiment or multiple embodiments, wherein the track A is the first track, the track B is the third track, the track A and the track B are both the running track of the polishing head 10 and have the same movement direction, the second running track is the track of the bearing module 80 driving the workpiece 12 to move, and the movement direction of the second running track is opposite to that of the track A and the track B. According to the track of the bearing module 80 driving the workpiece 12 to move and the chamfer track of the workpiece 12, the running track of the polishing head 10 is adjusted, so that when the polishing head 10 polishes the chamfer of the workpiece 12, the polishing head 10 is unchanged along the Z axis direction of the tool coordinate system relative to the bearing module 80, so as to ensure the quality of the chamfer of the workpiece 12 polished by the polishing head 10.

[0125] Specifically, the chamfer information is the arc length of the R-angle for any one of the four corners of the frame-shaped workpiece 12, such as the R-angle of a 3C product like a mobile phone. The R-angle is divided into a combination of 5 arc lengths, and the angles of rotation of the machine assembly along the Z-axis of the tool coordinate system when the machine assembly moves along the 5 equal arcs are calculated, which can be equal or unequal arc length combinations, such as 0-10-30-55-80-90 degrees. Then the negative values of these angles, such as 0, -10, -30, -55, -80, and -90, are taken as the trajectory interpolation points of the bearing module 80 to control the rotation of the bearing module 80 along the Z-axis of the work coordinate system. In this way, the bearing module 80 cooperates with the polishing head 10, and the bearing module 80 and the polishing head 10 move along different trajectories, respectively, so that the polishing head 10 remains stationary along the Z-axis of the tool coordinate system and only translates in the XY-axis plane of the tool coordinate system during polishing, thereby effectively preventing the occurrence of dead angles when the polishing head 10 polishes the workpiece 12 and preventing the machine assembly from being stuck. It also simplifies the control process.

[0126] Please refer to Figure 4 For the polishing method provided in one or more embodiments of the present application, the polishing method is used to control the polishing head 10 on the machine assembly to polish the workpiece 12, which can be used in the polishing system described above and taken as an example. The polishing method comprises the following steps:

[0127] Step 1002, receiving a pressure sequence.

[0128] Wherein the pressure sequence is formed by the sensing module sensing the stress condition of the workpiece 12.

[0129] Step 1004, forming guidance information.

[0130] Wherein the guidance information is used to guide the polishing head 10 to polish the workpiece 12 along a preset trajectory.

[0131] Step 1006, according to the pressure sequence and the guidance information, forming a deviation sequence of the pressure sequence.

[0132] Step 1008, according to the deviation sequence, forming an adjustment instruction to adjust the position of the polishing head 10.

[0133] Please refer to Figure 4 The sensing module 30 senses the stress condition of the workpiece 12, wherein the stress condition includes the stress conditions of multiple points of the part to be polished of the workpiece 12, and the stress conditions of the multiple points form a pressure sequence.

[0134] According to the received pressure sequence, guiding information is formed, wherein the guiding information is used to guide the running track of the polishing head 10 polishing the workpiece 12, for example, the running track is consistent with the shape of the polished part of the workpiece 12, circular or square, or the compound motion track of the polishing head 10 along the circular or square, annular motion process while moving along the direction perpendicular to the annular motion direction.

[0135] Based on the motion track and the stress condition of the workpiece 12 in the motion track, that is, the pressure sequence, the force applied to the workpiece 12 by the running process of the polishing head 10 is adjusted in time or pre-configured, that is, the deviation sequence is formed.

[0136] According to the deviation sequence, adjustment instructions are formed to adjust the polishing head 10 to polish the workpiece 12, so that the polishing head 10 corresponds to different positions at different parts to be polished of the workpiece 12, so that the stress condition of each point of the polished part of the workpiece 12 conforms to the preset pressure sequence, so as to realize quantitative control of the force applied to different parts of the workpiece 12 by the polishing head 10.

[0137] Exemplarily, the adjustment amount of the running track can be formed by the deviation sequence, and the adjustment amount is superimposed or otherwise adjusted on the preset running track to form an adjusted running track. The adjusted running track is converted into a force control sequence by a conversion relationship when polishing the workpiece 12, and the force control sequence is the adjustment instruction. According to the adjustment instruction, the polishing head 10 can polish the workpiece 12 in a process that meets the polishing accuracy requirements and adapts to the current scene and working conditions, and the workpiece 12 that meets the polishing accuracy requirements is obtained.

[0138] Further, the guiding information includes a preset position and a conversion relationship. The preset position is the calculated position of the polishing head 10 polishing the workpiece 12, that is, the position information of the polishing head 10 at different polishing points of the workpiece 12. The conversion relationship is a conversion formula of the pressure of the polishing head 10 and the deformation information of the polishing material on the polishing head 10. Please refer to Figure 5 The polishing method further includes the following steps.

[0139] Step 1010, determining the conversion relationship according to the rigidity parameter of the polishing material on the polishing head 10;

[0140] Step 1012, forming the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relationship;

[0141] Step 1014, forming the deviation sequence according to the deformation information and the preset position.

[0142] Thus, the conversion relationship is determined based on the rigidity parameter of the polishing material on the polishing head 10, wherein the rigidity parameter mainly determines the hardness of the material pressed into the object (such as sandpaper) (similar to the concept of elastic coefficient) to provide the conversion relationship of force / position in the control calculation. According to the conversion relationship and the pressure sequence, the deformation information corresponding to the pressure sequence is formed, wherein the deformation information is set by a material coefficient s (determining the hardness of the material under stress / rigidity, similar to the elastic coefficient, unit: mm / N) in the force control parameter.

[0143] For example, the polishing head 10 is attached with sandpaper, and is pressed into the workpiece 12 by 0.1 mm, and then the increase of stress in N is observed to obtain the material coefficient s of the sandpaper. Therefore, the deformation information is force*s. According to the deformation information and the preset position of the polishing head 10, the first processor 720 forms the deviation sequence, wherein the deviation sequence is the adjustment information of the polishing head 10 based on the deformation information and the preset position. For example, the polishing head 10 generates a deformation amount of 0.2 mm due to the application of the preset pressure 10 N, and then the polishing head 10 needs to move 0.2 mm based on the preset position and the deformation direction.

[0144] Further, the step of forming the deviation sequence of the pressure sequence, specifically includes:

[0145] According to the pressure sequence, the adjusted pressure sequence is formed by a filter;

[0146] According to the adjusted pressure sequence and the guide information, the deviation sequence is determined.

[0147] Thus, the pressure sequence is adjusted by the filter to eliminate high-frequency interference, such as interference caused by the vibration of the air grinder, wherein the filter can be a virtual filter or a physical filter. For example, a virtual filter for removing noise is realized based on LabVIEW Express programming.

[0148] Further, the guide information includes a first running track, and the step of forming the guide information specifically includes: Figure 6 As shown in the figure, specifically includes:

[0149] Step 1020, the device combination for polishing the workpiece 12 includes the machine component and the polishing head 10;

[0150] Step 1022, based on the device combination for polishing the workpiece 12, the first running track is formed, which is the running track of the polishing head 10;

[0151] Step 1024, the step of forming the deviation sequence of the pressure sequence includes forming the deviation sequence according to the first running track and the pressure sequence.

[0152] For example, the device combination for polishing the workpiece 12 comprises a machine assembly and the polishing head 10, wherein the machine assembly can be a mechanical arm connected with the polishing head 10 for controlling the movement of the polishing head 10 according to the control instruction, and of course the machine assembly can also be other driving assembly as long as it can drive the movement of the polishing head 10.

[0153] Wherein the trajectory of the movement of the machine assembly driving the polishing head 10 is the first running trajectory, and the first running trajectory is exemplarily a polishing trajectory preset according to the product requirement of the workpiece 12, so that the workpiece 12 satisfying the accuracy requirement can be obtained after polishing the workpiece 12 through the first running trajectory. According to the pressure sequence and the first running trajectory, the deviation sequence is formed, for example, when the polishing head 10 polishes the straight edge of the frame-shaped workpiece 12, the workpiece 12 is fixed by the bearing module 80, and the machine assembly drives the movement of the polishing head 10 to polish the workpiece 12.

[0154] Please refer again to Figure 2 , which comprises two coordinate systems, a work coordinate system and a tool coordinate system, wherein the work coordinate system is a three-dimensional coordinate system established based on the sensing module 30 or based on the workpiece 12 on the bearing module 80, and the tool coordinate system is a three-dimensional coordinate system established based on the polishing head 10.

[0155] The first direction is exemplarily the X-axis direction of the work coordinate system, the second direction is the Z-axis direction of the work coordinate system, and the third direction is the Y-axis direction of the work coordinate system. Figure 2 It is a two-dimensional view and the Y-axis direction is not shown, but it can be understood as the direction perpendicular to the paper surface.

[0156] The basic trajectory is exemplarily the running trajectory (exemplarily the translation trajectory) of the polishing head 10 formed in the XY plane of the work coordinate system, for the convenience of description, the compound movement of the polishing head 10 in the tool coordinate system is decomposed into the movement of the workpiece 12 in the XY plane, the ZY plane and the XZ plane. Figure 2 As shown in the figure, the tool coordinate system follows the movement of the polishing head 10, and in the figure, it is shown that when the polishing head 10 is in different movement positions (such as the first state and the second state), the tool coordinate system will be converted to match the first state or the second state, becoming tool 1 coordinate system or tool 2 coordinate system.

[0157] Further, in step 1022, the step of forming the first running trajectory comprises:

[0158] The device combination for polishing the workpiece 12 comprises the machine assembly and the polishing head 10, and a base trajectory and a first adjustment amount are formed, the base trajectory is a movement trajectory formed in a plane constituted by a first direction and a third direction, and the first adjustment amount is an adjustment sequence superimposed on the base trajectory in a plane constituted by a second direction and the third direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is the direction in which the polishing head 10 faces the workpiece 12;

[0159] According to the base trajectory and the first adjustment amount, the first movement trajectory is formed.

[0160] The first adjustment amount of the XY plane in the tool coordinate system can be at least one of a straight line, a circle, an ellipse, a rhombus, or other plane wobble movement trajectories according to the polishing surface requirements of the polishing head 10. In this way, the movement trajectory of the polishing head 10 can be adjusted according to the first adjustment amount to polish the workpiece 12 into different shapes.

[0161] Further, in step 1022, the step of forming the first movement trajectory comprises:

[0162] The device combination for polishing the workpiece 12 comprises the machine assembly and the polishing head 10, and a base trajectory and a second adjustment amount are formed, the base trajectory is a movement trajectory formed in a plane constituted by a first direction and a third direction, and the second adjustment amount is a carrier signal superimposed on the base trajectory in a second direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is the direction in which the polishing head 10 faces the workpiece 12;

[0163] According to the base trajectory and the second adjustment amount, the first movement trajectory is formed.

[0164] Specifically, referring again to Figure 2 The second adjustment amount is a carrier signal with frequency and amplitude applied along the Y-axis direction of the tool coordinate system, which can be a sine wave, a square wave, etc., or other axial wobble movement trajectories according to the polishing surface requirements of the polishing head 10, so that the polishing head 10 can realize axial wobble. In this way, by adjusting the second adjustment amount, the polishing head 10 can customize the polishing of the workpiece 12, for example, the shape, smoothness, etc. of the polished workpiece 12 can be controlled to enhance the generalization of the workpiece 12.

[0165] Further, in step 1022, the step of forming the first movement trajectory comprises:

[0166] The device combination based on polishing the workpiece 12 comprises the machine assembly and the polishing head 10, a basic trajectory and a third adjustment amount are formed, the basic trajectory is a movement trajectory formed on a plane constituted by a first direction and a third direction, the third adjustment amount is a fixed value superimposed on the basic trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is a direction in which the polishing head 10 faces the workpiece 12; and the first running trajectory is formed according to the basic trajectory and the third adjustment amount.

[0167] Specifically, referring again to Figure 2 , the running trajectory of the polishing head 10 is formed in the YZ plane of the Z axis and the Y axis of the tool coordinate system, the polishing head 10 rubs the workpiece 12 in the YZ plane, and the third adjustment amount is an increment of pressing the polishing head 10 into the workpiece 12 in the direction of the Z axis of the tool coordinate system, so that the polishing head 10 is close to the workpiece 12 in the polishing direction, i.e., the direction of the Z axis of the tool coordinate system, through the third increment, so as to control the quality of polishing the workpiece 12 by the polishing head 10.

[0168] Further, in step 1022, the step of forming the first running trajectory comprises:

[0169] The device combination based on polishing the workpiece 12 comprises the machine assembly and the polishing head 10, a basic trajectory and a third adjustment amount are formed, the basic trajectory is a movement trajectory formed on a plane constituted by a first direction and a third direction, the third adjustment amount is a fixed value superimposed on the basic trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is a direction in which the polishing head 10 faces the workpiece 12; and the first running trajectory is formed according to the basic trajectory and the third adjustment amount.

[0170] Specifically, referring again to Figure 2 , the fourth adjustment amount is a variable value in the direction of the Z axis of the tool coordinate system. It can be understood that there are two polishing methods in the actual polishing process. One is that the over-pressing amount of the polishing head 10 to the workpiece 12 is a fixed value (such as the third adjustment amount), for example, the polishing surface of the polishing head 10 is covered with sandpaper, and the sandpaper is divided into two regions when polishing the workpiece 12 with the sandpaper, one is a region that has not been polished, and the other is a region that has been polished. The over-pressing amount is a fixed value, for example, 0.1 mm, which is convenient for controlling the polishing relationship; the other polishing method is that the over-pressing amount is a variable value (such as the fourth adjustment amount), and when the sandpaper is shifted from the polished region to the unpolished region, the over-pressing amount gradually increases, for example, from 0.05 mm to 0.1 mm, so that the sandpaper polishing wear is more uniform, the service life of the sandpaper is increased, and the precision of sandpaper polishing is better controlled. It can be understood that the workpiece 12 can also be directly polished by the polishing surface of the polishing head 10.

[0171] Further, the guiding information further comprises a second running track, the second running track being a running track of the workpiece 12, the step of forming the deviation sequence further comprises:

[0172] The device combination further comprises a carrying module 80, the carrying module 80 being used for carrying the workpiece 12 and being capable of rotating or moving the workpiece 12;

[0173] The second running track is formed based on the device combination further comprising the carrying module 80;

[0174] The deviation sequence is formed according to the pressure sequence, the first running track and the second running track.

[0175] Specifically, referring again to Figure 2 , the carrying module 80 is a rotatable jig, the jig is capable of carrying the workpiece 12 and driving the workpiece 12 to rotate, of course, the carrying module 80 can also be other mechanisms as long as the workpiece 12 can be rotated or moved.

[0176] Further, the guiding information further comprises chamfer information, the step of forming the second running track comprises:

[0177] The chamfer information is determined based on the device combination further comprising the carrying module 80;

[0178] According to the chamfer information, a chamfer track corresponding to the first running track and the chamfer information is calculated;

[0179] The second running track is formed according to the chamfer track.

[0180] When the polishing head 10 polishes the corner of the workpiece 12, the carrying module 80 drives the workpiece 12 to run along the second running track when the polishing head 10 runs along the first running track, in order to keep the Z direction of the polishing head 10 based on the tool coordinate system unchanged, the first movement track of the polishing head 10 is adjusted, the set of adjustment amounts in the running process is the deviation sequence, the polishing head 10 is kept unchanged based on the Z direction of the tool coordinate system through the deviation sequence, so that the polishing quality of the polished workpiece 12 is controllable.

[0181] Further, the step of forming the deviation sequence further comprises:

[0182] The first running track is adjusted to be a third running track according to the second running track and the chamfer track;

[0183] The deviation sequence is formed according to the pressure sequence, the third running track and the second running track.

[0184] For example, when the polishing head 10 polishes the corner of the workpiece 12, both the polishing head 10 and the carrier module 80 carrying the workpiece 12 move, and the carrier module 80 carrying the workpiece 12 moves, and the polishing head 10 and the carrier module 80 cooperate to keep the Z direction of the polishing head 10 based on the tool coordinate system unchanged, so that the polishing quality of the workpiece 12 can be controlled.

[0185] Specifically, when the polishing head 10 polishes the corner of the workpiece 12, the carrier module 80 drives the workpiece 12 to move along the second running track while the polishing head 10 moves along the first running track. In order to keep the Z direction of the polishing head 10 based on the tool coordinate system unchanged, the first movement track is adjusted again, and the sum of the adjustment amount during the movement is the deviation sequence. The first running track (e.g. A track in Figure 3 ) is adjusted to the third running track (e.g. B track in Figure 3 ) through the deviation sequence, so that the Z direction of the polishing head 10 based on the tool coordinate system remains unchanged, and the polishing quality of the workpiece 12 can be controlled.

[0186] For example, please refer to Figure 3 , Figure 3 is a running track schematic diagram in an embodiment or multiple embodiments, wherein track A is the first track, track B is the third track, track A and track B are both running tracks of the polishing head 10 and have the same movement direction, the second running track is the track of the carrier module 80 driving the workpiece 12 to move, and the movement direction of the second running track is opposite to that of track A and track B. According to the track of the carrier module 80 driving the workpiece 12 to move and the chamfer track of the workpiece 12, the running track of the polishing head 10 is adjusted, so that when the polishing head 10 polishes the chamfer of the workpiece 12, the polishing head 10 is unchanged along the Z axis direction of the tool coordinate system relative to the carrier module 80, so as to ensure the quality of the chamfer of the workpiece 12 polished by the polishing head 10.

[0187] Specifically, the four corners of the workpiece 12 are any one of the frame type chamfer (such as the R corner of 3C products such as mobile phones), and the chamfer information is the arc length of the R corner. The R corner is divided into a combination of 5 arc lengths, and the angles of rotation of the machine assembly along the Z axis of the tool coordinate system when moving along the 5 equal arcs are calculated, which can be equal or unequal arc length combinations, such as 0-10-30-55-80-90 degrees, and then the negative values of these angles, such as 0, -10, -30, -55, -80, -90, are taken as the trajectory interpolation points of the bearing module 80 to control the rotation of the bearing module 80 along the Z axis of the work coordinate system, so that the bearing module 80 cooperates with the polishing head 10, and the bearing module 80 and the polishing head 10 move along different trajectories respectively, so that the polishing head 10 remains stationary along the Z axis of the tool coordinate system and only translates in the XY plane of the tool coordinate system during polishing, thereby effectively preventing the occurrence of dead angles when the polishing head 10 polishes the workpiece 12 and preventing the machine assembly from being stuck, and also simplifying the control process.

[0188] See Figure 7 The auxiliary polishing device provided for one or more embodiments of the present application is used to carry and sense the workpiece 12 being polished. The auxiliary polishing device is exemplified by the above-mentioned bearing module 80.

[0189] Specifically, the auxiliary polishing device 800 comprises a bearing part 810, a sensing module 30, and a base 830, wherein the bearing part 810 is used to carry the workpiece 12 and bear at least one of the force and torque from the workpiece 12; the sensing module 30 is connected to the bearing part 810, the sensing module 30 is coupled to a polishing device, and the sensing module 30 is used to sense the force and torque, form a pressure value, and output the pressure value to the polishing device. The base 830 is connected to the sensing module 30, and the base 830 is used to fix the sensing module 30.

[0190] In this way, the workpiece 12 is carried by the bearing part 810, and the sensing module 30 senses at least one of the force and torque borne by the bearing part 810, wherein the force is the action force between the workpiece 12 and the polishing device when the workpiece 12 is polished by the polishing device, the action force is transmitted to the bearing part 810 through the workpiece 12 and sensed by the sensing module 30, and the sensing module 30 sends the pressure value to the polishing device, so that the polishing device adjusts the polishing force and angle according to the force and torque borne by the workpiece 12 to achieve the polishing of the workpiece 12 by the auxiliary polishing device.

[0191] It can be understood that the sensing module 30 can transmit the pressure value to the polishing device through wired or wireless means, such as Bluetooth transmission, wireless communication transmission, or transmission through a cable. However, such transmission needs to solve the problem of signal shielding by the metal outer surface of the sensing module and the connecting part, and the use of a wireless transmission method with higher penetration ability can avoid the defects of signal transmission, which will not be described here.

[0192] Further, the sensing module 30 comprises at least one of a force sensor and a torque meter, as long as the force and torque can be sensed. The force sensor and the torque meter can respectively sense the force and torque from the bearing part. According to the force information, a force curve is formed to determine whether the polishing is performed along the preset trajectory. According to the torque information, a torque condition is formed to determine whether an inappropriate deflection occurs in a certain direction during polishing. In a scenario with low polishing precision requirement, only the force sensor is needed. However, in a scenario with high polishing precision requirement, the force and torque need to be accurately sensed. Therefore, the combination of the force sensor and the torque meter is needed to complete the sensing process, so as to control the current or next polishing precision in a real-time feedback or post-adjustment manner, thereby forming a positive cycle of benign iteration.

[0193] Alternatively, the sensing module 30 comprises a 6-axis force sensor. The 6-axis force sensor can sense the components of the received force on the X-axis, Y-axis and Z-axis in the work coordinate system, and sense the deflection angles of the received torque around the X-axis, Y-axis and Z-axis in the work coordinate system. Compared with the combination of the force sensor and the torque meter, the installation is simpler and the precision is higher. The 6-axis force sensor is used to illustrate the technical solution, but the application is not limited thereto.

[0194] Further, the sensing module 30 is a force sensor with an IP65 or above protection level. The use of the force sensor with the IP65 or above protection level can effectively prevent the cutting fluid or grinding dust from invading the sensing module, thereby preventing the sensing inaccuracy or damage to the sensing module.

[0195] Further, the force range of the bearing part 810 is 0-100 N. According to the calculation, the force of the bearing part 311 during the calibration process is 1 kg, that is, about 9.8 N. However, in the actual polishing process, the highest peak value can reach 10 kg, that is, about 98 N. Therefore, the force range of the bearing part 311 can be determined as about 0-100 N, but it can also be adjusted according to the actual situation. The force range is used to limit the acting force between the polishing head 10 and the bearing part 311, so as to avoid damaging the polishing head 10 or the bearing part 311 or the workpiece 12 during polishing.

[0196] Please refer to Figure 8 The auxiliary polishing device 800 provided for one or more embodiments of the application is shown in a cross-sectional view. The auxiliary polishing device 800 further comprises a mounting part 840 and a cable 850. The mounting part 840 is arranged between the sensing module 30 and the base 830. The mounting part 840 is a hollow structure, and the hollow part is arranged as a first channel 841.

[0197] The base 830 comprises a first hollow part 831, and the first hollow part 831 is in communication with the first channel 841.

[0198] The cable 850 is connected to the sensing module 30 for transmitting the pressure value from the sensing module 30 through the first hollow portion 831 and the first channel 841.

[0199] Thus, the cable 850 is accommodated through the first hollow portion 831 and the first channel 841, and the pressure value sensed by the sensing module 30 is transmitted to the polishing device through the cable 850, so as to enhance the compactness of the overall structure of the device 800 for assisting polishing, while the cable 850 is sealed to prolong the service life of the cable 850 and reduce the external influence on the cable 850 for transmitting the pressure value.

[0200] Further, the device 800 for assisting polishing further comprises a connecting portion 820 and an air extraction module 860, the connecting portion 820 is arranged between the bearing portion 810 and the sensing module 30, the connecting portion 820 is a hollow structure, and the hollow portion of the connecting portion 820 is arranged as a second channel 821.

[0201] The bearing portion 810 comprises a first hole 811, and the sensing module 30 comprises a second hollow portion 31.

[0202] The air extraction module 860 comprises an air pipe 861, the air pipe 861 is coupled to the first hole 811 for penetrating at least one of the first hollow portion 831, the first channel 841, the second hollow portion 31 and the second channel 821, so as to form the bonding force between the workpiece 12 placed on the bearing portion 810 and the bearing portion 810 through the first hole 811. Thus, the air extraction module 860 extracts the air between the workpiece 12 and the bearing portion 810 through the air pipe 861, so as to improve the bonding force between the bearing portion 810 and the workpiece 12 placed on the bearing portion 810, that is, the bearing portion 810 assists or directly fixes the workpiece 12 placed on the bearing portion 810 through the vacuum adsorption mode.

[0203] Further, the base 830 comprises a sealing cover 831, an inner cavity 832 and a moving portion 833. The sealing cover 831 is connected to the mounting portion 840, and the sealing cover 831 comprises a second hole 8311 (not shown in the figure). The inner cavity 832 comprises the first hollow portion 831. The second hole 8311 is arranged between the first hollow portion 831 and the first channel 841. The moving portion 833 is connected to the inner cavity 832. The inner cavity 832 further comprises a sealing portion 8322, and the sealing portion 8322 is arranged between the moving portion 833 and the first hollow portion 831. Thus, the sealing cover 831 and the moving portion 833 cooperate to prevent the external dust or the leaked polishing liquid from entering the first hollow portion 831 from the bottom to the top through the moving portion 833.

[0204] Further, the auxiliary polishing device 800 further comprises a motor 870, a synchronous belt 880 and a speed reducer 890, the synchronous belt 880 is connected to the motor 870. The moving part 833 comprises a pulley 8311 (not shown in the figure), the pulley 8311 is connected to the synchronous belt 880. The speed reducer 890 is connected to the pulley 8311, the speed reducer 890 is used to transmit the torque from the motor 870 to control the rotation of the base 830. In this way, the synchronous belt 880 is driven to move by the motor 870, the synchronous belt 880 drives the pulley 8311 to rotate, the pulley 8311 drives the speed reducer 890 to rotate, thereby achieving the control of the rotation of the base 830.

[0205] Further, the auxiliary polishing device 800 further comprises a protection device 90, the protection device 90 is arranged on the connecting part 820 and surrounds the sensing module 30. In this way, the protection device 90 prevents the cutting fluid or the grinding dust from invading the sensing module 30.

[0206] Please refer to Figure 9 The auxiliary polishing system 900 provided for one or more embodiments of the present application is used for assisting the polishing device to polish the workpiece 12, and the auxiliary polishing system 900 comprises a communicator 910 and a second processor 920. When the auxiliary polishing system 900 is used in cooperation with the polishing system 700, the second processor 920 can also be the same processor as the first processor 720, and the functions of the first processor 720 and the second processor 920 are realized together.

[0207] The communicator 910 is used to obtain the first trajectory and the second trajectory. The second processor 920 is coupled to the communicator, and the second processor 920 is used to: control the bearing module 80 to perform at least one of pausing, moving and rotating along the first trajectory, the bearing module 80 is used to bear the workpiece 12; obtain a trigger signal, and determine that the trigger signal meets a trigger condition; based on the trigger signal meeting the trigger condition, control the bearing module 80 to change to perform at least one of pausing, moving and rotating along the second trajectory.

[0208] Please refer to Figure 7The carrier module 80 carries the workpiece 12, and the second processor 920 controls the carrier module 80 to perform at least one of pausing, moving and rotating along the first trajectory, that is, the second processor 920 is configured to control the movement of the carrier module 80. The second processor 920 receives a trigger signal, which is a signal triggered when the polishing head 10 is about to switch from polishing a straight edge of the workpiece 12 to polishing a chamfer (or from polishing a chamfer to polishing a straight edge). The time, speed or position of the polishing head 10 changes when the polishing head 10 is about to switch from polishing a straight edge of the workpiece 12 to polishing a chamfer (or from polishing a chamfer to polishing a straight edge). For example, when the polishing head 10 is polishing a straight edge along the first trajectory, the speed is 20 mm / s. When the machine component is about to switch from polishing a straight edge to polishing a chamfer, the trigger signal is triggered at a position 20 mm away from the actual start of polishing the chamfer. Since the speed of polishing the chamfer is different from the speed of polishing the straight edge, for example, the speed of polishing the chamfer is 15 mm / s, the speed is automatically adjusted from 20 mm / s to 15 mm / s at a position 20 mm away from the actual start of polishing the chamfer, and the polishing trajectory is switched from polishing a straight edge along the first trajectory to polishing a chamfer along the second trajectory, so as to achieve the purpose of smooth transition polishing. Reducing the time of adjusting the speed can improve the polishing effect.

[0209] In an embodiment, the trigger signal is the time of polishing the workpiece 12 along the first trajectory. The system 900 for assisting polishing further comprises a timer 930.

[0210] The timer 930 is coupled to the second processor 920, and the timer 930 is configured to obtain the time.

[0211] The second processor 920 is further configured to:

[0212] determine that the time is equal to a preset time;

[0213] based on the time being equal to the preset time, control the carrier module 80 to change to perform at least one of pausing, moving and rotating along the second trajectory.

[0214] For example, the time is the time when the polishing head 10 polishes a straight edge of the workpiece 12 and is about to switch from polishing a straight edge to polishing a chamfer. When the time is equal to the preset time, for example, the preset time is 15 seconds, the carrier module 80 changes the polishing trajectory. Since the speed of polishing the chamfer is different from the speed of polishing the straight edge, for example, the speed of polishing the chamfer is 15 mm / s, and the speed of polishing the straight edge is 20 mm / s, the speed is automatically adjusted from 20 mm / s to 15 mm / s at a position 15 s away from the actual start of polishing the chamfer, or the time of polishing the straight edge is 15 s, but not limited to this. The polishing trajectory is switched from polishing a straight edge to polishing a chamfer, so as to achieve the purpose of smooth transition polishing process. Reducing the time of adjusting the speed can improve the polishing effect.

[0215] In another embodiment, wherein the trigger signal is a speed of the polishing head 10 along the first trajectory, the system further comprises a detector 940.

[0216] The detector 940 is coupled to the second processor 920 for detecting the speed.

[0217] The second processor 920 is further configured to:

[0218] determine that the speed is less than or equal to a preset speed;

[0219] based on the speed being less than or equal to the preset speed, control the carrier module 80 to change to perform at least one of pausing, moving and rotating along the second trajectory.

[0220] In the embodiment, the speed and position of the polishing head 10 change when the polishing head 10 polishes the straight edge and the chamfer of the workpiece 12. For example, when the polishing head 10 polishes the straight edge along the first trajectory, the speed of the polishing head 10 gradually increases from 0 to 20 mm / s along the polishing trajectory (for example, the Y direction in the tool coordinate system). When the machine assembly is about to switch from polishing the straight edge to polishing the chamfer, the speed is automatically adjusted, i.e., gradually decreases from 20 mm / s to 15 mm / s. The trigger signal is the moving speed of the polishing head 10. When the speed of the polishing head 10 is less than or equal to the preset speed, the polishing trajectory is switched from polishing the straight edge along the first trajectory to polishing the chamfer along the second trajectory, so as to achieve smooth transition of the polishing process, reduce the time of adjusting the speed, and improve the polishing effect.

[0221] Referring to Figure 10 The application also provides an auxiliary polishing method for controlling the auxiliary polishing system 700 to polish the workpiece 12 in cooperation with the polishing device. The auxiliary polishing method comprises the following steps.

[0222] In step 1030, a first trajectory and a second trajectory are obtained.

[0223] In step 1032, the carrier module 80 is controlled to perform at least one of pausing, moving and rotating along the first trajectory.

[0224] The carrier module 80 is configured to carry the workpiece 12.

[0225] In step 1034, a trigger signal is obtained, and it is determined whether the trigger signal meets a trigger condition.

[0226] In step 1036, based on the trigger signal meeting the trigger condition, the carrier module 80 is controlled to change to perform at least one of pausing, moving and rotating along the second trajectory.

[0227] Thus, by setting the trigger condition of the machine assembly when switching between polishing straight edges and polishing chamfers, the polishing speed and polishing trajectory are switched through the trigger condition, changing from the first trajectory to the second trajectory, achieving a smooth transition polishing process, reducing the time of adjusting the speed, and achieving a better polishing effect.

[0228] Further, the trigger signal is the time of polishing the workpiece 12 along the first trajectory, the step of obtaining the trigger signal and determining whether the trigger signal reaches the trigger condition comprises:

[0229] obtaining the time;

[0230] determining that the time is equal to a preset time;

[0231] based on the time being equal to the preset time, controlling the carrier module 80 to change to at least one of pausing, moving and rotating along the second trajectory.

[0232] For example, the time is the time when the polishing head 10 polishes the straight edge of the workpiece 12 and is about to switch from polishing the straight edge to polishing the chamfer, when the time is equal to the preset time, for example, the preset time is 15 seconds, the carrier module 80 changes the polishing trajectory, because the speed of polishing the chamfer is different from the speed of polishing the straight edge, for example, the speed of polishing the chamfer is 15 mm / s, and the speed of polishing the straight edge is 20 mm / s, then when the actual polishing of the chamfer starts 15 seconds, or when the time of polishing the straight edge is 15 seconds, but not limited to this, by automatically adjusting the speed, i.e. gradually decreasing from 20 mm / s to 15 mm / s, and switching the polishing trajectory from polishing the straight edge to polishing the chamfer, achieving a smooth transition polishing process, reducing the time of adjusting the speed, and achieving a better polishing effect.

[0233] Further, the trigger signal is the speed of polishing the workpiece 12 along the first trajectory, the step of obtaining the trigger signal and determining whether the trigger signal reaches the trigger condition comprises:

[0234] detecting the speed;

[0235] determining that the speed is less than or equal to a preset speed;

[0236] based on the speed being less than or equal to the preset speed, controlling the carrier module 80 to change to at least one of pausing, moving and rotating along the second trajectory.

[0237] Illustratively, when the polishing head 10 polishes the straight edge and the chamfer of the workpiece 12, the speed and position of the polishing head 10 change, for example, when the polishing head 10 polishes the straight edge along the first trajectory, the speed of the polishing head 10 gradually increases from 0 to 20 mm / s along the Y direction of the tool coordinate system, when the machine assembly is about to switch from polishing the straight edge to polishing the chamfer, the speed is automatically adjusted, that is, gradually decreases from 20 mm / s to 15 mm / s, the trigger signal is that the moving speed of the polishing head 10 is less than or equal to the preset speed, the polishing trajectory is switched from polishing the straight edge along the first trajectory to polishing the chamfer along the second trajectory, achieving smooth transition of the polishing process, reducing the time of adjusting the speed, and making the polishing effect better.

[0238] In addition, those skilled in the art can make other changes within the spirit of the present application, of course, these changes according to the spirit of the present application, all should be included in the scope of protection claimed by the present application. For the purpose of explanation, the foregoing description is described with reference to specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the application to the precise forms disclosed. Many modifications and variations are possible in light of the above teachings, for example, the order structure of the flowchart can be omitted or adjusted. The embodiments are selected and described in order to illustrate the principles of the present application and its practical application, so as to enable other skilled in the art to best use the present application with various modifications suitable for the specific use conceived, and various described embodiments.

Claims

1. A polishing system for polishing a workpiece, comprising: a sensing module configured to sense a force condition of the workpiece to form a pressure sequence; a processor coupled to the sensing module and configured to: receive the pressure sequence; form a guide information, the guide information being used to guide a polishing head to polish the workpiece along a preset trajectory; form a deviation sequence of the pressure sequence according to the pressure sequence and the guide information; form an adjustment instruction to adjust a position of the polishing head according to the deviation sequence; wherein the guide information comprises a first running trajectory and a second running trajectory, and the processor is further configured to: form the guide information, comprising: determining that a device combination for polishing the workpiece comprises a machine assembly and the polishing head; forming the first running trajectory as a running trajectory of the polishing head based on that the device combination for polishing the workpiece comprises the machine assembly and the polishing head; determining that the device combination further comprises a bearing module configured to bear the workpiece and rotate or move the workpiece; forming the second running trajectory as a running trajectory of the workpiece based on that the device combination further comprises the bearing module; and forming the deviation sequence according to the pressure sequence, the first running trajectory and the second running trajectory. 2.The polishing system of claim 1, wherein the guide information comprises a preset position and a conversion relationship, the preset position being a calculated position of the polishing head for polishing the workpiece, and the conversion relationship being a conversion formula of a pressure of the polishing head and deformation information of a polishing material on the polishing head, and the processor is further configured to: determine the conversion relationship according to a rigidity parameter of the polishing material on the polishing head; form the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relationship; and form the deviation sequence according to the deformation information and the preset position. 3.The polishing system of claim 1, wherein the processor is further configured to: form an adjusted pressure sequence by a filter according to the pressure sequence; and determine the deviation sequence according to the adjusted pressure sequence and the guide information. 4.The polishing system of claim 1, wherein the processor is further configured to: form a base trajectory and a first adjustment amount based on that the device combination for polishing the workpiece comprises the machine assembly and the polishing head, the base trajectory being a running trajectory of the polishing head formed on a plane constituted by a first direction and a third direction, and the first adjustment amount being an adjustment sequence loaded on the base trajectory on a plane constituted by a second direction and the third direction, the first direction, the second direction and the third direction being perpendicular to each other, and the first direction being a direction of the polishing head towards the workpiece; and form the first running trajectory according to the base trajectory and the first adjustment amount. 5.The polishing system of claim 1, wherein the processor is further configured to: The device combination for polishing the workpiece comprises the machine assembly and the polishing head, a base trajectory and a second adjustment amount are formed, the base trajectory is a movement trajectory formed on a plane constituted by a first direction and a third direction, and the second adjustment amount is a carrier signal superimposed on the base trajectory in a second direction, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is the direction of the polishing head towards the workpiece; The first running trajectory is formed according to the base trajectory and the second adjustment amount.

6. The polishing system of claim 1, wherein the processor is further configured to: The device combination for polishing the workpiece comprises the machine assembly and the polishing head, a base trajectory and a third adjustment amount are formed, the base trajectory is a movement trajectory formed on a plane constituted by a first direction and a third direction, and the third adjustment amount is a fixed value superimposed on the base trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is the direction of the polishing head towards the workpiece; The first running trajectory is formed according to the base trajectory and the third adjustment amount.

7. The polishing system of claim 1, wherein the processor is further configured to: The device combination for polishing the workpiece comprises the machine assembly and the polishing head, a base trajectory and a fourth adjustment amount are formed, the base trajectory is a movement trajectory formed on a plane constituted by a first direction and a third direction, and the fourth adjustment amount is a variable value superimposed on the base trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is the direction of the polishing head towards the workpiece; The first running trajectory is formed according to the base trajectory and the fourth adjustment amount.

8. The polishing system of claim 1, wherein the guide information further comprises chamfer information, and the processor is further configured to: Determine the chamfer information based on the device combination further comprising a bearing module; Calculate a chamfer trajectory corresponding to the chamfer information according to the first running trajectory and the chamfer information; Form the second running trajectory according to the chamfer trajectory.

9. The polishing system of claim 8, wherein the processor is further configured to: Adjust the first running trajectory to a third running trajectory according to the second running trajectory and the chamfer trajectory; Form the deviation sequence according to the pressure sequence, the third running trajectory and the second running trajectory.

10. A polishing method for controlling a polishing head on a machine assembly to polish a workpiece, comprising: Receiving a pressure sequence formed by a sensing module sensing the force condition of the workpiece; Forming guide information for guiding the polishing head to polish the workpiece in a preset trajectory; Forming a deviation sequence of the pressure sequence according to the pressure sequence and the guide information; Forming an adjustment instruction according to the deviation sequence to adjust the position of the polishing head; The guide information comprises a first running trajectory and a second running trajectory, and the second running trajectory is the running trajectory of the workpiece. The forming the guiding information comprises: determining that the device combination for polishing the workpiece comprises the machine assembly and the polishing head; forming the first running track based on the device combination for polishing the workpiece comprising the machine assembly and the polishing head, the first running track being a running track of the polishing head; The forming the deviation sequence further comprises: determining that the device combination further comprises a bearing module for bearing the workpiece and rotating or moving the workpiece; forming the second running track based on the device combination further comprising the bearing module; forming the deviation sequence according to the pressure sequence, the first running track and the second running track.

11. The polishing method of claim 10, wherein the guiding information comprises a preset position and a conversion relationship, the preset position being a calculated position of the polishing head for polishing the workpiece, the conversion relationship being a conversion formula of the pressure of the polishing head and deformation information of a polishing material on the polishing head, and the method further comprises: determining the conversion relationship according to a rigidity parameter of the polishing material on the polishing head; forming the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relationship; forming the deviation sequence according to the deformation information and the preset position.

12. The polishing method of claim 10, wherein the forming the deviation sequence of the pressure sequence comprises: forming an adjusted pressure sequence through a filter according to the pressure sequence; determining the deviation sequence according to the adjusted pressure sequence and the guiding information.

13. The polishing method of claim 10, wherein the forming the first running track comprises: forming a base track and a first adjustment amount based on the device combination for polishing the workpiece comprising the machine assembly and the polishing head, the base track being a running track of the polishing head formed on a plane constituted by a first direction and a third direction, and the first adjustment amount being an adjustment sequence loaded on the base track on a plane constituted by a second direction and the third direction, the first direction, the second direction and the third direction being perpendicular to each other, and the first direction being a direction of the polishing head towards the workpiece; forming the first running track according to the base track and the first adjustment amount.

14. The polishing method of claim 10, wherein the forming the first running track comprises: forming a base track and a second adjustment amount based on the device combination for polishing the workpiece comprising the machine assembly and the polishing head, the base track being a moving track formed on a plane constituted by a first direction and a third direction, and the second adjustment amount being a carrier signal superimposed on the base track in a second direction, the first direction, the second direction and the third direction being perpendicular to each other, and the first direction being a direction of the polishing head towards the workpiece; forming the first running track according to the base track and the second adjustment amount.

15. The polishing method of claim 10, wherein the forming the first running trajectory comprises: forming a base trajectory and a third adjustment based on a combination of a polishing device and the machine assembly, the base trajectory being a movement trajectory formed on a plane constituted by a first direction and a third direction, the third adjustment being a fixed value superimposed on the base trajectory in the first direction, the first direction being perpendicular to the third direction, the first direction being a direction in which the polishing head faces the workpiece; forming the first running trajectory according to the base trajectory and the third adjustment.

16. The polishing method of claim 10, wherein the forming the first running trajectory comprises: forming a base trajectory and a fourth adjustment based on a combination of a polishing device and the machine assembly, the base trajectory being a movement trajectory formed on a plane constituted by a first direction and a third direction, the fourth adjustment being a variable value superimposed on the base trajectory in the first direction, the first direction being perpendicular to the third direction, forming the first running trajectory according to the base trajectory and the fourth adjustment.

17. The polishing method of claim 10, wherein the guide information further comprises chamfer information, and the forming the second running trajectory comprises: determining the chamfer information based on the combination of the polishing device further comprising a bearing module; calculating a chamfer trajectory corresponding to the chamfer information according to the first running trajectory and the chamfer information; forming the second running trajectory according to the chamfer trajectory.

18. The polishing method of claim 17, wherein the forming the deviation sequence further comprises: adjusting the first running trajectory to a third running trajectory according to the second running trajectory and the chamfer trajectory; forming the deviation sequence according to the pressure sequence, the third running trajectory, and the second running trajectory.

19. An auxiliary polishing device for bearing and sensing a workpiece to be polished, applied to the polishing system of any one of claims 1 to 9, the device comprising: a bearing portion for bearing the workpiece and bearing at least one of a force and a moment from the workpiece; a sensing module connected to the bearing portion; a connecting portion provided between the bearing portion and the sensing module; a base comprising a first hollow portion; a mounting portion provided between the sensing module and the base, the mounting portion being a hollow structure, a hollow part of which is configured as a first channel, the base being connected to the mounting portion, the first hollow portion being in communication with the first channel; the sensing module further being connected to a cable, the cable being configured to pass through the first hollow portion and the first channel to connect the sensing module; the sensing module being configured to sense the at least one of the force and the moment, form a pressure value, and transmit the pressure value to a polishing device through the cable.

20. The device of claim 19, wherein the bearing portion comprises a first hole; the sensing module comprises a second hollow portion; The connecting portion is a hollow structure, and the hollow portion is configured as a second channel; The suction module includes a gas pipe coupled to the first hole for penetrating at least one of the first hollow portion, the first channel, the second hollow portion, and the second channel to form a bonding force between the workpiece placed on the bearing portion and the bearing portion through the first hole.

21. The device of claim 19, wherein the base comprises: a sealing cover connected to the mounting portion and comprising a second hole; an inner cavity comprising the first hollow portion; the second hole is disposed between the first hollow portion and the first channel; a moving portion connected to the inner cavity; the inner cavity further comprises a sealing portion disposed between the moving portion and the first hollow portion.

22. An auxiliary polishing system for assisting a polishing device to polish a workpiece, the auxiliary polishing system being used in cooperation with the polishing system of any one of claims 1-9, the auxiliary polishing system comprising: a communicator configured to obtain a first trajectory and a second trajectory; a processor coupled to the communicator and configured to: control a bearing module to perform at least one of pausing, moving, and rotating along the first trajectory, the bearing module being configured to bear the workpiece; obtain a trigger signal and determine whether the trigger signal meets a trigger condition; based on the trigger signal meeting the trigger condition, control the bearing module to change to perform at least one of pausing, moving, and rotating along the second trajectory.

23. The auxiliary polishing system of claim 22, wherein the trigger signal is a time of polishing the workpiece along the first trajectory, the system further comprising: a timer coupled to the processor and configured to obtain the time; the processor is further configured to: determine that the time is equal to a preset time; and based on the time being equal to the preset time, control the bearing module to change to perform at least one of pausing, moving, and rotating along the second trajectory.

24. The auxiliary polishing system of claim 22, wherein the trigger signal is a speed of polishing the workpiece along the first trajectory, the system further comprising: a detector coupled to the processor and configured to detect the speed; the processor is further configured to: determine that the speed is less than or equal to a preset speed; and based on the speed being less than or equal to the preset speed, control the bearing module to change to perform at least one of pausing, moving, and rotating along the second trajectory.

25. An auxiliary polishing method for controlling an auxiliary polishing system to polish a workpiece by a polishing device, the auxiliary polishing system being used in cooperation with the polishing system of any one of claims 1-9, the auxiliary polishing method comprising: obtaining a first trajectory and a second trajectory; controlling a bearing module to perform at least one of pausing, moving, and rotating along the first trajectory, the bearing module being configured to bear the workpiece; obtaining a trigger signal and determining whether the trigger signal meets a trigger condition; based on the trigger signal meeting the trigger condition, controlling the bearing module to change to perform at least one of pausing, moving, and rotating along the second trajectory.

26. The method of claim 25, wherein the trigger signal is a time of polishing the workpiece along the first trajectory, the steps of obtaining the trigger signal and determining that the trigger signal reaches a trigger condition comprises: obtaining the time; determining that the time is equal to a preset time; and controlling the carrier module to change to performing at least one of pausing, moving and rotating along the second trajectory based on the time being equal to the preset time.

27. The method of claim 25, wherein the trigger signal is a speed of polishing the workpiece along the first trajectory, the steps of obtaining the trigger signal and determining that the trigger signal reaches a trigger condition comprises: detecting the speed; determining that the speed is less than or equal to a preset speed; and controlling the carrier module to change to performing at least one of pausing, moving and rotating along the second trajectory based on the speed being less than or equal to the preset speed.

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