A continuous automatic transport sputtering film forming device with a revolution and rotation structure

Abstract

The present invention relates to a continuous, self-rotating structure automatic transport sputtering film-forming device, comprising a sheet entry and exit chamber, a coating chamber, a transport chamber, and an external substrate rack, wherein the transport chamber is arranged between the sheet entry and exit chamber and the coating chamber, and a substrate vacuum transport system is arranged inside the transport chamber, the substrate vacuum transport system is used to realize substrate exchange between the sheet entry and exit chamber and the coating chamber, and substrate exchange between the sheet entry and exit chamber and the external substrate rack is realized by an external manipulator. The advantages of the present invention are: 1) while realizing automatic transport, the transport efficiency is significantly improved; 2) the space required for the interface of different cavities is very small; in this way, more cavity space can be reserved in the sheet entry and exit chamber and the coating chamber for the arrangement of units required for the process, which is beneficial to the layout planning and process expansion of the equipment; 3) the uniformity of film formation is better; at the same time, the production capacity of a single coating process is increased; 4) the optimization of the process is ensured, and the film formation quality of the sputtering process is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of thin film preparation, in particular to a continuous automatic transport sputtering film forming device with a revolution and rotation structure. Background Art

[0002] At present, the goals pursued in the field of magnetron sputtering equipment film formation are to improve the automation integration of magnetron sputtering equipment, increase production capacity and improve the film formation quality of sputtering equipment.

[0003] As a result, automated continuous magnetron sputtering equipment has become increasingly popular in the coating market. The following types are widely used: 1. Equipment with a flat-plate substrate carrier and single-end inlet and outlet, or single-inlet and single-outlet, multiple coating chambers. These equipment are commonly found in two categories: horizontal continuous coating lines and vertical continuous coating lines. Examples include common architectural glass coating lines. 2. Continuous production coating lines with a rotating carrier for integrated transport.

[0004] Of the two types of continuous coating equipment mentioned above, the first type often occupies a large amount of equipment space and cannot rotate the substrate during the coating process. It is often used for flat substrates, but the film uniformity is often poor on substrates with special shapes. The second type of equipment, because the integral rotating frame occupies a large equipment width, requires a large gate valve width, which results in insufficient space in the film-forming chamber for the cathode unit, ion source unit, or other process units. Summary of the Invention

[0005] The purpose of the present invention is to provide a continuous automatic transport sputtering film-forming device with a revolution and rotation structure in response to the above-mentioned deficiencies in the prior art, which realizes continuous vacuum sputtering coating by configuring mutually cooperative transport mechanisms and device layout.

[0006] The purpose of the present invention is achieved by the following technical solutions:

[0007] A continuous, revolving, and rotating automatic transport sputtering film-forming device, characterized in that: the sputtering film-forming device includes a sheet entry and exit chamber, a coating chamber, a transport chamber, and an external substrate rack, wherein the transport chamber is arranged between the sheet entry and exit chamber and the coating chamber, a substrate vacuum transport system is arranged inside the transport chamber, the substrate vacuum transport system is used to realize substrate exchange between the sheet entry and exit chamber and the coating chamber, and substrate exchange between the sheet entry and exit chamber and the external substrate rack is realized through an external manipulator.

[0008] A turret system is provided in the film entry and exit chamber and the coating chamber, wherein the turret system can drive the substrate to orbit, rotate, or rotate simultaneously.

[0009] The turntable system located in the coating chamber includes a turntable, a fixed gearwheel and a transmission gear. The fixed gearwheel and the transmission gear are in transmission cooperation with each other, wherein the turntable is used to load the substrate, the fixed gearwheel is used to drive the turntable to rotate to realize the revolution of the substrate, and the transmission gear is used to realize the rotation of the substrate.

[0010] The substrate vacuum handling system includes a front and rear pushing module, a rotating module, and two film picking mechanisms. The two film picking mechanisms are connected to the front and rear pushing module and can be pushed back and forth under the drive of the front and rear pushing module. The rotating module is connected to the front and rear pushing module and can drive the two film picking mechanisms to rotate, thereby realizing the substrate exchange between the entry and exit chamber and the coating chamber.

[0011] The sheet entry and exit chamber and the coating chamber are independently connected to vacuum pumps, and sputtering coating process units are respectively provided in the sheet entry and exit chamber and the coating chamber.

[0012] The sputtering coating process unit arranged in the coating chamber includes an inductively coupled plasma and a sputtering cathode unit; the sputtering coating process unit arranged in the entry and exit chamber includes one or a combination of two or more of a heating unit, a plasma source and an anti-fouling film source.

[0013] A vacuum gate valve that can be opened and closed is provided between the sheet entry and exit chamber and the coating chamber, and the vacuum gate valve controls the communication state between the sheet entry and exit chamber and the coating chamber.

[0014] The sputtering film forming device further includes a system cooling water unit and an automation control cabinet, wherein the system cooling water unit is used to provide cooling water, and the automation control cabinet is used to integrate the control system of the sputtering film forming device.

[0015] The system cooling water unit, the automatic control cabinet and the coating chamber are integrated and fixed on an equipment rack, and the sheet entry and exit chamber and the transport chamber are integrated and fixed on another equipment rack.

[0016] The external substrate rack is a rotatable substrate turret, and the substrate loading positions on the substrate turret are arranged one by one along the rotation direction thereof.

[0017] The advantages of the present invention are:

[0018] 1) It can realize the continuous handling of substrates or substrate strings, so that the substrate strings can flow to the external turntable, enter and exit the film chamber and the coating chamber, and significantly improve the handling efficiency while realizing automatic handling;

[0019] 2) The substrate vacuum handling system transfers substrates in single pieces or in single strings, which reduces the space required for the interfaces between different chambers. This allows more chamber space to be left for the layout of the units required for the process when entering and exiting the chamber and the coating chamber, which is beneficial for equipment layout planning and process expansion.

[0020] 3) The turret system can rotate in both orbits and on both sides, which improves the uniformity of film formation. At the same time, it increases the production capacity of a single coating process by more than three times that of a rotating structure.

[0021] 4) It can be applied to the situations of entering and exiting the film chamber and different coating chambers (systems with multiple coating chamber structures). For some incompatible or mutually contaminating coating processes, they can be carried out in separate chambers, thereby ensuring the optimization of the process and effectively improving the film quality of the sputtering process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the present invention;

[0023] Figure 2 Schematic diagram of the structure of the transfer rack system of the present invention;

[0024] Figure 3 for Figure 2 Schematic diagram of the bottom structure;

[0025] Figure 4 Schematic diagram of the structure of the substrate string in the present invention;

[0026] Figure 5 It is a structural schematic diagram of the substrate vacuum handling system in the present invention. DETAILED DESCRIPTION

[0027] The features of the present invention and other related features are further described in detail below through embodiments in conjunction with the accompanying drawings to facilitate understanding by those skilled in the art:

[0028] like Figure 1-5 As shown in the figure, marks 1-24 respectively represent: the inlet and outlet chamber 1, the coating chamber 2, the transport chamber 3, the vacuum plug valve 4, the inlet and outlet chamber vacuum pump 5, the coating chamber vacuum pump 6, the external manipulator 7, the external turret 8, the inductively coupled plasma 9, the sputtering cathode unit 10, the inlet and outlet chamber heating unit 11, the automation control cabinet 12, the system cooling water unit 13, the equipment stand 14, the baffle 15, the substrate mounting plate 16, the turret frame 17, the fixed large gear 18, the transmission gear 19, the substrate string 20, the front and rear propulsion module 21, the right side film picking mechanism 22, the left side film picking mechanism 23, and the rotation module 24.

[0029] Example: In this embodiment, the automatic transport sputtering film forming device with a continuous revolution and rotation structure can realize the automatic and continuous transport of substrates (or substrate strings) between the atmospheric side and the vacuum side and cooperate with the sputtering film forming process to realize film formation of substrates (or substrate strings).

[0030] like Figure 1 As shown, the main body of the sputtering film forming apparatus in this embodiment includes a wafer inlet and outlet chamber 1, a coating chamber 2, a transport chamber 3, and an external turret 8. Substrates are transported and circulated within the main body. Specifically, substrate transportation and circulation include two circulation paths: one is that substrates to be filmed are transported from the external turret 8 and sequentially pass through the wafer inlet and outlet chamber 1 and the transport chamber 3 into the coating chamber 2 for sputtering film formation in the coating chamber 2; the other is that film-formed substrates are transported from the coating chamber 2 and sequentially pass through the transport chamber 3, the wafer inlet and outlet chamber 1, and the external turret 8 to complete the discharge of the film-formed substrates.

[0031] In this embodiment, the two substrate transport paths are implemented simultaneously, which can significantly improve the substrate transport efficiency and further improve the production efficiency of sputtering film formation.

[0032] Based on this, Figure 1 As shown, in this embodiment, the wafer inlet and outlet chamber 1 and the coating chamber 2 are connected by a transport chamber 3, and the wafer inlet and outlet chamber 1 and the coating chamber 2 can be connected through the transport chamber 3. Among them, the interior of the coating chamber 2 is the film forming space for substrates. The wafer inlet and outlet chamber 1 is used to realize the entry and exit of substrates between the vacuum side and the atmospheric side. The transport chamber 3 realizes the exchange of substrates between the wafer inlet and outlet chamber 1 and the coating chamber 2 through its internal substrate vacuum transport system, that is, it realizes the transport of substrates to be film-formed from the wafer inlet and outlet chamber 1 to the coating chamber 2, and at the same time, it transports the film-formed substrates in the coating chamber 2 from the coating chamber 2 to the wafer inlet and outlet chamber 1. The external rotary rack 8 is arranged on the atmospheric side, and the substrate exchange between it and the wafer inlet and outlet chamber 1 is realized by the external robot 7.

[0033] Combine Figure 2 、 Figure 3 and Figure 4As shown, taking the substrate structure of substrate train 20 in this embodiment as an example, a turret system is installed within each of the entry and exit chamber 1 and the coating chamber 2. The turret system consists of a baffle 15, a turret frame 17, a fixed gear 18, and a transmission gear 19. The turret frame 17 is the main structure of the turret system, with several loading positions for the substrate train 20 arranged along its circumference. The surface of the substrate train 20 serves as a substrate mounting plate 16, on which the substrates can be mounted. The baffle 15 is located at the bottom of the turret frame 17 to block sputtering film material and prevent it from splashing to other locations. A fixed gear 18 is located at the bottom center of the turret frame 17. This fixed gear 18 can be connected to an external power device to provide power to drive the turret frame 17 for rotation. Furthermore, the fixed gear 18 also forms a transmission connection with each transmission gear 19 located at the loading position of the substrate train 20 through a gear transmission system.

[0034] Therefore, the turret system of this embodiment can drive the substrate train 20 to rotate in both the orbital and autorotational directions within the film loading and unloading chamber 1 and the coating chamber 2, effectively improving film formation quality. The orbital revolution of the substrate train 20 refers to the simultaneous rotation of the turret frame 17 around the fixed gear 18 as the fixed gear 18 drives the overall rotation of the turret frame 17. The autorotation of the substrate train 20 refers to the rotation of the fixed gear 18, which drives the transmission gear 19 through transmission, and the transmission gear 19 drives the substrate train 20 to rotate.

[0035] like Figure 5 As shown, the substrate vacuum transport system in the transport chamber 3 includes a front-to-back propulsion module 21, a right-side wafer pickup mechanism 22, a left-side wafer pickup mechanism 23, and a rotation module 24. The right-side wafer pickup mechanism 22 and the left-side wafer pickup mechanism 23 can respectively clamp the substrate string 20, and the right-side wafer pickup mechanism 22 and the left-side wafer pickup mechanism 23 are independently connected to the front-to-back propulsion module 21. These two wafer pickup mechanisms can be extended or retracted under the drive of their corresponding front-to-back propulsion modules 21 to hang the substrate string 20, including hanging the substrate string 20 on the turret system in the coating chamber 2 and hanging the substrate string 20 on the turret system in the entry and exit chamber 1. The front-to-back propulsion module 21 is mounted on the rotation module 24, and the rotation module 24 can rotate to exchange the positions of the right-side wafer pickup mechanism 22 and the left-side wafer pickup mechanism 23, thereby completing the substrate exchange between the entry and exit chamber 1 and the coating chamber 2.

[0036] like Figure 1 As shown, a vacuum pump 5 for the film entry and exit chamber 1 and a vacuum pump 6 for the coating chamber are separately connected to one side of the film entry and exit chamber 1 and the coating chamber 2, respectively. The vacuum pump 5 for the film entry and exit chamber can form a vacuum environment in the film entry and exit chamber 1 by vacuuming, and the vacuum pump 6 for the coating chamber can form a vacuum environment in the coating chamber 2 by vacuuming.

[0037] like Figure 1 As shown, a vacuum gate valve 4 is provided between the coating chamber 2 and the transport chamber 3. The vacuum gate valve 4 can be controlled to open and close, and controls the communication state between the coating chamber 2 and the transport chamber 3. When the coating chamber 2 performs a sputtering film forming process, the vacuum gate valve 4 is closed to separate the coating chamber 2 and the transport chamber 3, thereby ensuring that the vacuum environment in the coating chamber 2 meets the requirements of the sputtering film forming process. When the substrate needs to be transported, the vacuum gate valve 4 is opened to connect the coating chamber 2 and the transport chamber 3.

[0038] like Figure 1 As shown, process units required for the sputtering film forming process are respectively provided at the positions of the sheet entry and exit chamber 1 and the coating chamber 2. Specifically, one or more sputtering units consisting of an inductively coupled plasma 9 and a sputtering cathode unit 10 are provided at the coating chamber 2 to complete the sputtering film forming process. A sheet entry and exit chamber heating unit 11 is provided at the sheet entry and exit chamber 1. The sheet entry and exit chamber heating unit 11 can preheat the substrate located in the sheet entry and exit chamber 1, so that the sheet entry and exit chamber 1 has not only the sheet entry and exit function, but also an additional substrate pretreatment function, thereby further improving the film forming quality and production efficiency of the substrate. In addition, other pretreatment devices can also be configured to pretreat the substrate, for example, by configuring a plasma source to perform surface pretreatment on the substrate to improve the film forming quality.

[0039] It should be additionally explained here that in addition to the pre-processing step of preheating the substrate, the inlet and outlet chamber 1 can also be equipped with a post-processing function by configuring a post-processing device at the inlet and outlet chamber 1, for example, an anti-fouling film source can be configured to give the film-formed substrate an anti-fouling function.

[0040] like Figure 1 As shown, the sputtering film forming device in this embodiment also includes an automation control cabinet 12 and a system cooling water unit 13, wherein the automation control cabinet 12 is integrated with a control system for controlling the working state of the sputtering film forming device, and the system cooling water unit 13 is used to provide the cooling water required by the sputtering film forming device during operation, such as the cooling water required for the sputtering target tube in the sputtering film forming process.

[0041] In combination with the above structure of this embodiment, the specific process of this embodiment during actual operation is as follows:

[0042] 1) External robot 7 swaps the substrate train waiting for film coating on external turret 8 with the pre-coated substrate train in access chamber 1. After the swap, the external turret 8 now holds the pre-coated substrate train, while the turret system in access chamber 1 holds the pre-coated substrate train. Access chamber 1 can then pre-treat the pre-coated substrate train using its pre-treating device.

[0043] 2) Afterwards, the inlet and outlet chamber 1 is evacuated by the inlet and outlet chamber vacuum pump 5. When the pressure in the inlet and outlet chamber 1 and the coating chamber 2 is balanced and the coating in the coating chamber 2 has completed coating, the vacuum plug valve 4 is opened, and the substrate string exchange between the inlet and outlet chamber 1 and the coating chamber 2 is completed through the substrate vacuum handling system in the handling chamber 3.

[0044] Upon completion, vacuum gate valve 4 closes, and coating chamber 2 continues the next sputtering process under vacuum. The loading and unloading chamber 1 can then perform post-processing on the array of substrates with film deposited thereon using its associated post-processing equipment. Simultaneously, step 1) is repeated, transferring the array of film-deposited substrates from loading and unloading chamber 1 to external turret 8 and transferring the array of substrates awaiting film depositing from external turret 8 back into loading and unloading chamber 1.

[0045] During the above process, the turret systems within the loading / unloading chamber 1 and the coating chamber 2 are rotary, as is the external turret 8. Furthermore, the substrate vacuum handling system within the transfer chamber 3 and the external manipulator 7 each include two gripping sections. Therefore, substrates (or strands of substrates) are handled and exchanged one by one. For substrate exchange between the loading / unloading chamber 1 and the coating chamber 2, the substrate vacuum handling system simultaneously grasps a pre-filmed substrate (or strand of substrates) and a substrate (or strand of substrates) to be filmed, then swaps the two substrates and installs them in their corresponding positions. This effectively improves handling efficiency.

[0046] During the specific implementation of this embodiment: the automation control cabinet 12 and the coating chamber 2 are integrated and fixed to the equipment rack 14, and the sheet entry and exit chamber 1 and the transport chamber 3 are integrated and fixed to another stand 14, effectively improving the intensiveness of the space.

[0047] The external turret 8 can be a standalone mechanism or a production line transport mechanism, while the external manipulator 7 is a corresponding gripping mechanism. Substrates can be transported within the vacuum environment (between the inlet and outlet chamber 1 and the coating chamber 2) by simultaneous gripping within the two chambers, as in the substrate vacuum handling system employed in this embodiment, or distributed within dedicated zones.

[0048] Although the above embodiments have described in detail the concepts and embodiments of the present invention with reference to the accompanying drawings, ordinary technicians in this field can recognize that various improvements and modifications can still be made to the present invention without departing from the scope of the claims, so they are not described in detail here.

Claims

1. A continuous automatic transport sputtering film forming device with a revolution and rotation structure, characterized by: The sputtering film forming device includes a sheet entry and exit chamber, a coating chamber, a transport chamber and an external substrate rack, wherein the transport chamber is arranged between the sheet entry and exit chamber and the coating chamber, a substrate vacuum transport system is arranged inside the transport chamber, and the substrate vacuum transport system is used to realize substrate exchange between the sheet entry and exit chamber and the coating chamber, and substrate exchange between the sheet entry and exit chamber and the external substrate rack is realized through an external manipulator. The substrate vacuum handling system includes a front and rear pushing module, a rotating module, and two film picking mechanisms. The two film picking mechanisms are connected to the front and rear pushing modules and can be pushed back and forth under the drive of the front and rear pushing modules. The rotating module is connected to the front and rear pushing modules and can drive the two film picking mechanisms to rotate, thereby realizing the substrate exchange between the in-and-out film chamber and the coating chamber. The substrate exchange refers to the exchange between the film-formed substrates or substrate strings in the coating chamber and the substrates or substrate strings to be film-formed in the in-and-out film chamber.

2. The continuous automatic transport sputtering film forming device with a revolution and rotation structure according to claim 1, characterized in that: A turret system is provided in the film entry and exit chamber and the coating chamber, wherein the turret system can drive the substrate to orbit, rotate, or rotate simultaneously.

3. The continuous automatic transport sputtering film forming system with a revolution and rotation structure according to claim 2, characterized in that: The turntable system located in the coating chamber includes a turntable, a fixed gearwheel and a transmission gear. The fixed gearwheel and the transmission gear are in transmission cooperation with each other, wherein the turntable is used to load the substrate, the fixed gearwheel is used to drive the turntable to rotate to realize the revolution of the substrate, and the transmission gear is used to realize the rotation of the substrate.

4. The continuous automatic transport sputtering film forming device with a revolution and rotation structure according to claim 1, characterized in that: The sheet entry and exit chamber and the coating chamber are independently connected to vacuum pumps, and sputtering coating process units are respectively provided in the sheet entry and exit chamber and the coating chamber.

5. The continuous automatic transport sputtering film forming device with a revolution and rotation structure according to claim 4, characterized in that: The sputtering coating process unit arranged in the coating chamber includes an inductively coupled plasma and a sputtering cathode unit; the sputtering coating process unit arranged in the entry and exit chamber includes one or a combination of two or more of a heating unit, a plasma source and an anti-fouling film source.

6. The continuous automatic transport sputtering film forming device with a revolution and rotation structure according to claim 1, characterized in that: A vacuum gate valve that can be opened and closed is provided between the sheet entry and exit chamber and the coating chamber, and the vacuum gate valve controls the communication state between the sheet entry and exit chamber and the coating chamber.

7. The continuous automatic transport sputtering film forming device with a revolution and rotation structure according to claim 1, characterized in that: The sputtering film forming device further includes a system cooling water unit and an automation control cabinet, wherein the system cooling water unit is used to provide cooling water, and the automation control cabinet is used to integrate the control system of the sputtering film forming device.

8. The continuous automatic transport sputtering film forming device with a revolution and rotation structure according to claim 7, characterized in that: The system cooling water unit, the automatic control cabinet and the coating chamber are integrated and fixed on an equipment rack, and the sheet entry and exit chamber and the transport chamber are integrated and fixed on another equipment rack.

9. The continuous automatic transport sputtering film forming device with a revolution and rotation structure according to claim 1, characterized in that: The external substrate rack is a rotatable substrate turret, and the substrate loading positions on the substrate turret are arranged one by one along the rotation direction thereof.

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