Emissivity control device and emissivity control method

Abstract

The emissivity control device and method of the present invention relate to the application field of measurement. The emissivity used in the prior art measurement can be determined by manually setting it in a thermal imager according to the emissivity table corresponding to various materials. However, when the temperature of the object to be measured is in a changing state, the emissivity of many materials changes with the temperature. At this time, determining the emissivity of this material is a difficult point. The emissivity control device of the present invention determines the second emissivity of the object to be measured according to the corresponding relationship between the first analysis data and the emissivity, solving the problems existing in the prior art.

Description

Technical Field

[0001] The emissivity control device and method of the present invention relate to the application field of thermal imaging detection. Background Art

[0002] When thermal imaging analysis of the object to be measured is required, the user can set analysis regions such as points, lines, and planes for specific parts of the thermal image of the object to be measured to obtain analysis results.

[0003] Taking the temperature analysis of the thermal image data obtained by shooting as an example, as is well known to those skilled in the art, specified processing such as correction and interpolation can be performed. Based on the position parameters of the analysis region in the infrared thermal image, for example, the thermal image data determined by the set analysis region is extracted, and conversion processing of temperature values is performed to obtain the temperature values corresponding to these thermal image data. Then, the obtained temperature values are analyzed and calculated according to the analysis mode.

[0004] The thermal image data in the analysis region is processed to be converted into temperature values. For example, according to the emissivity coefficient, ambient temperature, humidity, distance from the thermal imaging device, etc. of the object to be measured set, as well as the conversion coefficient between the AD value of the thermal image data and the temperature, the temperature value is obtained through a specified conversion formula.

[0005] Among them, the ambient temperature, humidity, distance from the thermal imaging device, etc. can all obtain their specific parameters through prior presetting or according to corresponding sensors, which is relatively easy to implement;

[0006] The emissivity used during measurement can be determined by setting it manually in the thermal imager according to the emissivity table corresponding to various materials; however, when the temperature of the object to be measured is in a changing state, especially when the temperature is above 500 degrees, the emissivity of many materials changes with the temperature. At this time, determining the emissivity of this material is a difficult point.

[0007] Therefore, it is understood that a need exists for an emissivity control device that can solve the problems of the prior art. Summary of the Invention

[0008] In view of the defects existing in the prior art, the present invention provides an emissivity control device and an emissivity control method, which can solve the problems of the prior art.

[0009] To this end, the present invention adopts the following technical solutions. The emissivity control device includes:

[0010] An acquisition unit for acquiring thermal image data of the object to be measured;

[0011] An analysis unit for analyzing and obtaining first analysis data of the object to be measured based on the first emissivity according to the thermal image data;

[0012] An emissivity determination unit for determining a second emissivity of the object under test according to the correspondence between the first analysis data and the emissivity.

[0013] An emissivity control method, comprising:

[0014] An acquisition step for acquiring thermal image data of the object under test;

[0015] An analysis step for analyzing and obtaining first analysis data of the object under test based on a first emissivity according to the thermal image data;

[0016] An emissivity determination step for determining a second emissivity of the object under test according to the correspondence between the first analysis data and the emissivity.

[0017] Other aspects and advantages of the present invention will be elaborated in the following description. Description of the Drawings

[0018] Figure 1 It is a block diagram of the electrical structure of the emissivity control device 13 in Embodiment 1.

[0019] Figure 2 It is an external view of the emissivity control device 13 in Embodiment 1.

[0020] Figure 3 It is an example of information such as temperature and emissivity corresponding to material information stored in the storage medium in Embodiment 1.

[0021] Figure 4 It is a flowchart of Embodiment 1.

[0022] Figure 5 It is another flowchart of Embodiment 1.

[0023] Figure 6 It is a flowchart of Embodiment 2.

[0024] Figure 7 It is a schematic diagram of the test material and analysis regions S01\S02 in Embodiment 2.

[0025] Figure 8 It is a block diagram of the electrical structure of the emissivity control device 100 in Embodiment 3.

[0026] Figure 9 It is a schematic diagram of the emissivity control device 100 in Embodiment 3. Detailed Description of the Invention

[0027] The following embodiments are for better understanding of the present invention and can be in various forms within the scope of the present invention without limiting the scope of the present invention. Among them, the so-called thermal image data can include, for example, thermal image AD value data, can include image data of infrared thermal images, can include data such as temperature value array data, etc. It can be obtained by shooting, can also be obtained by external reception, or can be obtained from stored thermal image files.

[0028] Embodiment 1

[0029] Embodiment 1 takes the portable thermal imaging device 13 with a shooting function as an example of the emissivity control device. Refer to Figure 1 to illustrate the structure of the thermal imaging device 13. The thermal imaging device 13 has a shooting unit 1, an image processing unit 2, a display and control unit 3, a display unit 4, a communication I / F 5, a temporary storage unit 6, a memory card I / F 7, a memory card 8, a flash memory 9, an operation unit 10, and a control unit 11. The control unit 11 is connected to the above corresponding parts through a control and data bus 12 and is responsible for the overall control of the thermal imaging device 13.

[0030] The shooting unit 1 is composed of optical components (not shown), a lens driving component, an infrared detector, a signal preprocessing circuit, etc. The optical components are composed of infrared optical lenses and are used to focus the received infrared radiation onto the infrared detector. The lens driving component drives the lens according to the control signal of the control unit 11 to perform focusing or zooming, or can also be an optically manually adjustable component. The infrared detector is, for example, a refrigerated or uncooled type infrared focal plane detector, which converts the infrared radiation passing through the optical components into an electrical signal. The signal preprocessing circuit includes a sampling circuit, an AD conversion circuit, a timing trigger circuit, etc., and performs signal processing such as sampling the electrical signal output from the infrared detector within a specified period, and converts it into digital thermal image data through the AD conversion circuit. This thermal image data is, for example, 14-bit or 16-bit binary data (also known as thermal image AD value data). In Embodiment 1, the shooting unit 1 is used as a thermal image acquisition unit to acquire thermal image data.

[0031] The image processing unit 2 is used to perform specified processing on the thermal image data obtained through the shooting unit 1. The processing of the image processing unit 2 is such as correction, interpolation, false color, synthesis, compression, decompression, etc., and performs processing to convert it into data suitable for display, recording, etc. For example, the image processing unit 2 performs specified processing such as false color processing on the thermal image data obtained by shooting by the shooting unit 1 to obtain image data of the infrared thermal image. The image processing unit 2 can be implemented, for example, using a DSP or other microprocessors or programmable FPGAs, etc.

[0032] According to the control performed by the display control unit 3, the image data for display stored in the temporary storage unit 6 is used to generate a video signal output, which can be displayed on the display unit 4. A liquid crystal display with an aspect ratio of 4:3 can be selected; preferably, in order to clearly display information such as infrared thermal images and identification marks simultaneously, a liquid crystal display with an aspect ratio of 16:9 can be selected, which is divided into two display areas, one for displaying infrared thermal images and the other for displaying information such as identification marks; however, the identification marks can also be overlapped and displayed on the infrared thermal images.

[0033] The communication I / F 5 is an interface that connects the thermal imaging device 13 to external devices such as personal computers, servers, PDAs (Personal Digital Assistant devices), other thermal imaging devices, and visible light imaging devices and exchanges data in accordance with communication specifications such as USB, 1394, and network.

[0034] The temporary storage unit 6 is a volatile memory such as a RAM or DRAM, serving as a buffer memory for temporarily storing the thermal image data output by the imaging unit 1. At the same time, it acts as a working memory for the image processing unit 2 and the control unit 11, temporarily storing the data processed by the image processing unit 2 and the control unit 11.

[0035] The memory card I / F 7 is an interface for the memory card 8. A memory card 8, which is a rewritable non-volatile memory, is connected to the memory card I / F 7 and can be freely installed and removed in the card slot of the main body of the thermal imaging device 13, and records data such as thermal image data under the control of the control unit 11.

[0036] The flash memory 9 stores programs for control and various data used in the control of each part. For example, a temperature-emissivity table of various materials can be pre-stored, as Figure 3 shown. In the table, the relationship between the temperature and emissivity of various materials can be seen; note that Figure 3 the corresponding data in the table is only an example. For the actual corresponding relationship between the temperature and emissivity of various materials, other test methods can be combined, such as the calibration method of thermocouples, to obtain it.

[0037] The storage medium in the following text can be a storage medium in the emissivity control device (thermal imaging device 13), such as non-volatile storage media like the flash memory 9 and the memory card 8, and volatile storage media like the temporary storage unit 6; it can also be other storage media that are wired or wirelessly connected to the emissivity control device (thermal imaging device 13), such as the storage media in other devices such as other storage devices, thermal imaging devices, and computers or the storage media at the network destination that are wired or wirelessly connected to the communication I / F 5.

[0038] The operation unit 10: is used for the user to perform various operations, and the control unit 11 executes corresponding programs according to the operation signals of the operation unit 10. Refer toFigure 2 To describe the operation unit 10, the keys provided for the user to operate include a recording key 1, an analysis key 2, etc.; not limited thereto, a touch screen 3 or a voice recognition component (not shown) can also be used to implement related operations.

[0039] The control unit 11 controls the overall operation of the thermal imaging device 13. A program for control and various data used in the control of each part are stored in a storage medium such as a flash memory 9. The control unit 11 is implemented by, for example, a CPU, an MPU, an SOC, a programmable FPGA, etc.; the image processing unit 2 and the display control unit 3 can also be a processor integrated with the control unit 11.

[0040] The control unit 11 serves as an analysis unit and is used to analyze and obtain first analysis data of the object under test based on the first emissivity according to the thermal imaging data; the first analysis data is not limited to temperature data, and can also be various analysis data related to emissivity such as pixel value percentage, etc.; preferably, the control unit 11 serves as a temperature measurement unit and is used to analyze and obtain first temperature data of the object under test based on the first emissivity according to the thermal imaging data.

[0041] The emissivity determination unit is used to determine the second emissivity of the object under test according to the correspondence between the first analysis data and the emissivity. Preferably, the control unit 11 serves as the emissivity determination unit and is used to determine the second emissivity of the object under test according to the correspondence between the first temperature data and the emissivity.

[0042] Next, the specific operations and control processes of Embodiment 1 will be introduced in detail. This application scenario takes, for example, the heating test of Material 1.

[0043] Refer to Figure 4 the flowchart to illustrate the control steps of Embodiment 1.

[0044] Step A01, capture thermal imaging data. For example, the display unit 4 can display a dynamic infrared thermal image, and the user can set an analysis area for Material 1; if there is no object with a temperature higher than that of Material 1 around, the automatic maximum temperature can also be used for measurement.

[0045] Step A02, in the initial test state, for example, a default emissivity such as 0.9 can be used as the first emissivity to calculate the temperature value of Material 1 in the captured thermal imaging data.

[0046] Step A03, compare the temperature value measured according to the first emissivity with the corresponding relationship in the emissivity table. If the measured temperature satisfies the relationship between 0 - 500°C and the emissivity of 0.9; then the analysis of the temperature measurement of this frame can be ended, and the first analysis data can be obtained, which can be used as the analysis data finally obtained through analysis processing.

[0047] If the measured temperature is 510°C, it no longer satisfies the relationship of emissivity 0.9 corresponding to 0 - 500°C; then go to step A04;

[0048] Steps A04 - A05, according to the emissivity table, the re - determined second emissivity is 0.88; then recalculate the temperature value. If the temperature calculated according to the newly determined emissivity Figure 3 satisfies the corresponding relationship in the table, then obtain the final temperature value of this frame of thermal image; if not, it is still necessary to continue to determine the emissivity until the calculated temperature value and the corresponding emissivity satisfy Figure 3 the corresponding relationship in the table.

[0049] As Figure 5 shown;

[0050] Step B01, obtain thermal image data, for example, but not limited to, obtained by shooting, or it can also be obtaining a thermal image file, transmission, etc.;

[0051] Step B02, obtain analysis data according to the measured emissivity;

[0052] Step B03, check whether the emissivity and the analysis data satisfy the corresponding relationship. If so, the obtained analysis data can be used as the final analysis data for analysis and processing; if not, re - determine the emissivity. For example, determine the second emissivity through the corresponding relationship between the emissivity and the analysis data, and return to step B02 until the obtained analysis data corresponds to the finally determined emissivity.

[0053] Here, there may be multiple loops. The first analysis data obtained according to the first emissivity, if the two do not satisfy the corresponding relationship, then determine the second emissivity according to the corresponding relationship. Then, the second analysis data obtained according to the second emissivity, if the two do not satisfy the corresponding relationship, then determine the third emissivity according to the corresponding relationship and calculate the third analysis data, and so on in a loop until the obtained analysis data corresponds to the finally determined emissivity.

[0054] As described above, according to the corresponding relationship between temperature and emissivity, determining the emissivity according to the temperature value can greatly improve the accuracy of temperature measurement and ensure that accurate temperature values are obtained during the temperature change of Material 1.

[0055] Embodiment 2

[0056] Embodiment 2 involves the measurement of 2 materials. Refer to Figures 6 - 7 to illustrate Embodiment 2;

[0057] As Figure 7As shown, in the experiment, heating materials 1 and 2 are involved. For example, the analysis regions S01 and S02 for materials 1 and 2 can be preset respectively; and according to the analysis regions S01 and S02, the associated material types are selected.

[0058] Step C01, obtaining thermal image data by shooting.

[0059] Step C02, measuring the temperature values of each analysis region according to the first emissivity of the materials in each analysis region; in the initial test state, a default emissivity such as 0.9 can be used as the first emissivity to calculate the temperature values of materials 1 and 2 respectively in the newly obtained thermal image data.

[0060] Step C03, comparing the temperature values measured according to the first emissivity with the corresponding relationship in the emissivity table. If the temperatures measured for both materials satisfy the relationship of emissivity 0.9 corresponding to 0 - 500 °C, then jump to step C06, and calculate the specific first analysis data according to the first emissivity. The analysis data is not limited to temperature values, and can also be in various forms such as temperature difference, pixel percentage, etc.

[0061] If one or more of them do not satisfy the corresponding relationship, then go to steps C04 - C05.

[0062] For example, the temperature measured for material 1 is 510 °C, which no longer satisfies the relationship of emissivity 0.9 corresponding to 0 - 500 °C. In steps C04 - C05, according to the emissivity table, re - determine the emissivity to be 0.88; then recalculate the temperature value. If the temperature calculated according to the newly determined emissivity Figure 3 satisfies the corresponding relationship in the table, then obtain the final first analysis data of material 1 in this frame of thermal image; if not, continue to determine the emissivity until the calculated temperature value and the corresponding emissivity Figure 3 satisfy the corresponding relationship in it. At this time, if the temperature value of material 2 obtained according to the first emissivity Figure 3 satisfies the corresponding relationship in it, then material 2 obtains the first analysis data according to the first emissivity.

[0063] Obviously, if none of the multiple materials in the experiment satisfy the corresponding relationship between the temperature value and the emissivity, then all need to re - determine their respective emissivities according to Figure 3 and recalculate the temperature values.

[0064] As described above, when there are multiple materials in the experiment, according to the corresponding relationship between their respective temperatures and emissivities, the emissivity can be determined according to the temperature value, which can greatly improve the accuracy of temperature measurement and ensure accurate temperature values are obtained during the temperature change of multiple materials.

[0065] Example 3

[0066] Embodiments of the present invention are not limited to portable thermal imaging devices, and can also be applied to various on-line thermal imaging devices; and the function of obtaining thermal image data by the present invention is not essential, and the present invention can also be applied to thermal image processing devices that receive and process thermal image data from the outside, etc.

[0067] As Figures 8 - 9 shown, thermal image processing devices such as computers, personal digital assistants, display devices used in conjunction with thermal imaging devices having a shooting function, etc., are used as examples of emissivity control devices to determine and analyze the emissivity of the acquired thermal image data.

[0068] Reference Figure 8 is a block diagram of an electrical structure of an embodiment of a thermal image processing system constituted by connecting an emissivity control device 100 (thermal image processing device 100) and a thermal imaging device 101.

[0069] The thermal image processing device 100 has a communication interface 1, an auxiliary storage unit 2, a display unit 3, a RAM 4, a hard disk 5, an operation unit 6, and a CPU 7 that is connected to the above components through a bus and performs overall control. As the thermal image processing device 100, examples can include personal computers, personal digital assistants, display devices used in conjunction with thermal image control devices, etc. The thermal image processing device 100 receives thermal image transmission data output by the thermal imaging device 101 connected to the thermal image processing device 100 through the communication interface 1 based on the control of the CPU 7.

[0070] The communication interface 1 is used to continuously receive thermal image transmission data output by the thermal imaging device 101; among them, it includes receiving thermal image transmission data sent through a relay device (the thermal image data output by the thermal imaging device 101 is sent through the relay device); at the same time, it can also be used as a communication interface for controlling the thermal imaging device 101. Here, the communication interface 1 includes various wired or wireless communication interfaces on the thermal image processing device 100, such as network interfaces, USB interfaces, 1394 interfaces, video interfaces, etc.

[0071] The auxiliary storage unit 2 includes storage media such as CD-ROMs, memory cards, and related interfaces.

[0072] The display unit 3 is a liquid crystal display, and the display unit 3 can also be other displays connected to the thermal image processing device 100, and the thermal image processing device 100 itself may not have a display in its electrical structure.

[0073] The RAM 4 serves as a buffer memory for temporarily storing the thermal image transmission data received by the communication interface 1. At the same time, it acts as a working memory of the CPU 7 and temporarily stores the data processed by the CPU 7.

[0074] The hard disk 5 stores programs for control and various data used in control.

[0075] The operation unit 6 is used for the user to perform various instruction operations or input various operations such as setting information. The CPU 7 executes corresponding programs according to the operation signals of the operation unit 6.

[0076] The CPU 7 also executes the functions of the image processing unit, which is used to perform specified processing on the received thermal image transmission data to obtain image data of the infrared thermal image. The specified processing includes correction, interpolation, pseudocolor, synthesis, compression, decompression, etc., and performs processing to convert it into data suitable for display, recording, etc. Among them, according to different formats of the thermal image transmission data, in one implementation, for example, when the received thermal image transmission data is compressed thermal image data, the specified processing is that the CPU 7 decompresses the thermal image transmission data received by the acquisition unit and performs corresponding specified processing; in one implementation, after decompressing the compressed thermal image data (thermal image transmission data), the corresponding specified processing such as pseudocolor processing is performed to obtain image data of the infrared thermal image. In addition, the specified processing also includes various specified processing such as correction and interpolation on the decompressed thermal image transmission data. In another implementation, for example, when the received thermal image transmission data itself is already compressed image data of the infrared thermal image, it is decompressed to obtain image data of the infrared thermal image. In yet another implementation, for example, when the communication interface 1 receives an analog infrared thermal image, it controls to convert the digital infrared thermal image data obtained after AD conversion by the relevant AD conversion circuit and transmits it to the temporary storage unit 6.

[0077] The structure of removing the shooting unit 1 from the emissivity control device 13 is substantially the same as that of the thermal image processing device 100. Obviously, the thermal image processing device 100, by acquiring thermal image transmission data, also applies to the above embodiments. Therefore, the description of the implementation is omitted.

[0078] The thermal image shooting device 101 can be various types of thermal image shooting devices, which are used to shoot the object to be measured and output thermal image transmission data. See Figure 8The electrical block diagram of the thermal imaging device 101 is composed of a communication interface 10, a shooting unit 20, a flash memory 30, an image processing unit 40, a RAM 50, a CPU 60, etc. Among them, the CPU 60 controls the overall operation of the thermal imaging device 101, and the control program and various data used in the control of each part are stored in the flash memory 30. The shooting unit 20 includes optical components, driving components, a thermal imaging sensor, and a signal preprocessing circuit (not shown) for obtaining thermal imaging data by shooting. The thermal imaging data is temporarily stored in the RAM 50, and then after passing through the image processing unit 40 (such as a DSP) and undergoing specified processing (such as compression processing, etc.), thermal imaging transmission data is obtained and output through the communication interface 10. Depending on the design and purpose of use, for example, what the thermal imaging device 101 outputs can be thermal imaging data, or image data of an infrared thermal image, or one or more of the data obtained by compressing the thermal imaging data or the image data of the infrared thermal image in a specified format, collectively referred to as thermal imaging transmission data. Here, the thermal imaging transmission data that the thermal imaging device 101 is used to shoot and output has a function similar to that of the shooting unit 1 in the thermal imaging control device 13.

[0079] Figure 9 It is a schematic diagram of an implementation of a thermal imaging system formed by connecting the thermal imaging processing device 100 and the thermal imaging device 101.

[0080] The thermal imaging device 101 can be mounted on a tripod (or a pan-tilt head, etc. mounted on a detection vehicle) and connected to the thermal imaging processing device 100 through a communication line such as a dedicated cable, or a local area network formed by wired and wireless means. The user views and monitors the thermal image of the object to be measured through the thermal imaging processing device 100. The thermal imaging device 101, when connected to the thermal imaging processing device 100 to form the thermal imaging system in the implementation mode, is used to shoot the object to be measured to obtain thermal imaging data.

[0081] Other implementation modes

[0082] The emissivity control device can also be used as a component or functional module in a thermal imaging device or a thermal imaging processing device with a thermal imaging acquisition unit. In this case, it also constitutes an example of the present invention.

[0083] In a preferred mode, the first temperature data of each pixel of the obtained thermal imaging data can also be analyzed; an emissivity determination unit is used to determine the second emissivity corresponding to each pixel according to the correspondence between the first temperature data and the emissivity. Furthermore, more accurate second analysis data of each pixel in the thermal imaging data can be obtained;

[0084] In a preferred mode, after the second emissivity is determined, when determining the emissivity of the next frame of thermal imaging data, the emissivity finally adopted in the previous frame can be used as the first emissivity adopted in the next frame.

[0085] In a preferred embodiment, the emissivity control device may not calculate the temperature. For example, it can obtain the temperature data of the object to be measured by acquiring measurement data from an external sensor, such as a thermocouple connected to it. Then, based on the corresponding relationship between the temperature data and the emissivity, the emissivity of the object to be measured can be determined. In one example, the first emissivity can be obtained according to the temperature value of the thermocouple through the corresponding relationship between temperature and emissivity, and then the data analysis and processing can be carried out. In this way, the disadvantages of incomplete thermocouple layout and inapplicability of some materials for extensive layout can be avoided, and the accuracy of the emissivity determined by the emissivity control device can be improved by obtaining the temperature of the external device. For example, when performing functions such as temperature analysis, the measurement accuracy can be improved and the processing burden can be reduced.

[0086] Although the functional blocks in the drawings can be implemented by hardware, software, or a combination thereof, it is usually not necessary to set up a structure that implements the functional blocks in a one-to-one correspondence. For example, multiple functional blocks can be implemented by a single software or hardware unit, or a single functional block can be implemented by multiple software or hardware units. In addition, the processing and control functions of some or all parts of the examples of the present invention can also be implemented by dedicated circuits, general-purpose processors, or programmable FPGAs.

[0087] In addition, the heating test application is used as a scenario example in the embodiments, and it is also widely applicable to various industries of infrared detection.

[0088] The above descriptions are only specific examples of the invention, and various examples do not constitute a limitation to the essential content of the invention. The above embodiments are relatively typical implementation manners. Of course, any product implementing the embodiments of the present invention does not necessarily need to achieve all the advantages of one or more of the above embodiments at the same time. Those skilled in the art can make other modifications and changes to the specific implementation manners after reading the specification without departing from the essence and scope of the invention.

Claims

1. A emissivity control device, comprising: An acquisition unit for acquiring the thermal image data of the object to be measured; A control unit for analyzing and obtaining the first analysis data of the object to be measured based on the first emissivity according to the thermal image data; An emissivity determination unit for judging whether the first analysis data and the first emissivity satisfy the corresponding relationship according to the corresponding relationship between the first analysis data and the emissivity. If they do not satisfy the corresponding relationship, the second emissivity is confirmed through the corresponding relationship between the emissivity and the analysis data. Then, according to the second analysis data obtained from the second emissivity, if the two do not satisfy the corresponding relationship, the third emissivity is determined according to the corresponding relationship, and the third analysis data is calculated. This cycle continues until the obtained analysis data corresponds to the finally determined emissivity; If the analysis data obtained from the configured emissivity and the emissivity satisfy the corresponding relationship, the emissivity determination unit determines that the emissivity is the emissivity of the object to be measured when the analysis data is obtained according to this emissivity; The emissivity control device is a portable thermal imaging device, or an on-line thermal imaging device, or a thermal image processing device for receiving and processing thermal image data from the outside.

2. The emissivity control device according to claim 1, wherein The control unit includes a temperature measurement unit for analyzing and obtaining the first temperature data of the object to be measured based on the first emissivity according to the thermal image data; The emissivity determination unit is used to determine the second emissivity of the object to be measured according to the corresponding relationship between the first temperature data and the emissivity.

3. The emissivity control device according to claim 1, wherein A selection unit for selecting the material information of the object to be measured; The emissivity determination unit is used to determine the second emissivity of the object to be measured according to the selected material information and the corresponding relationship between the first temperature data and the emissivity of this material.

4. The emissivity control device according to claim 2, wherein The temperature measurement unit is used to analyze and obtain the first temperature data of each pixel of the thermal image data; the emissivity determination unit is used to determine the second emissivity corresponding to each pixel according to the corresponding relationship between the first temperature data and the emissivity.

5. The emissivity control device according to claim 2, wherein It has an analysis area setting unit for setting an analysis area; the temperature measurement unit is used to analyze and obtain the first temperature data of the analysis area; the emissivity determination unit is used to determine the second emissivity of the object to be measured in the analysis area according to the corresponding relationship between the first temperature data and the emissivity.

6. The emissivity control device according to claim 5, wherein The temperature measurement unit is used to analyze and obtain the first temperature data of each pixel of the thermal image data; the emissivity determination unit is used to determine the second emissivity corresponding to each pixel according to the corresponding relationship between the first temperature data and the emissivity.

7. The emissivity control device according to any one of claims 1-6, wherein The control unit is used to obtain the second analysis data of the object to be measured according to the second emissivity.

8. An emissivity control method, comprising: 1). For acquiring the thermal image data of the object to be measured; 2). For analyzing and obtaining the first analysis data of the object to be measured based on the first emissivity according to the thermal image data; 3) Determine whether the first analysis data and the first emissivity satisfy the corresponding relationship according to the corresponding relationship between the first analysis data and the emissivity. If they do not satisfy the corresponding relationship, confirm the second emissivity through the corresponding relationship between the emissivity and the analysis data. Then, for the second analysis data obtained based on the second emissivity, if the two do not satisfy the corresponding relationship, determine the third emissivity according to the corresponding relationship and calculate the third analysis data. Repeat this process until the obtained analysis data corresponds to the finally determined emissivity; For the emissivity determination step, if the analysis data obtained from the configured emissivity and the emissivity satisfy the corresponding relationship, determine that the emissivity is the emissivity of the measured object when the analysis data is obtained based on this emissivity; The emissivity control method is applied to a portable thermal imaging device, or an online thermal imaging device, or applied to a thermal imaging processing device that receives and processes thermal image data from the outside.

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