Intelligent headset system to prevent head-down and myopia

Abstract

The present invention discloses an anti-bowing and anti-myopia intelligent headset system, comprising a charging power supply module, a single-chip computer module, a mercury switch, an ultrasonic distance detection module, and a Bluetooth headset module, wherein the mercury switch, the ultrasonic distance detection module, and the Bluetooth headset module are respectively connected to the single-chip computer module, and the charging power supply module supplies power to the remaining modules. The present invention can provide corresponding voice prompts when the head of a mobile phone user bows or is too close to the mobile phone, and can help the mobile phone user develop a correct mobile phone use habit, thereby reducing the risk of problems with the cervical spine and myopia of the mobile phone user.

Description

Technical Field

[0001] The invention relates to the field of earphones, and in particular to an intelligent earphone system that prevents head-down and myopia. Background Art

[0002] The headset is worn on the human head and can receive external audio and voice information by wire or wireless means, and is used to play audio and voice transmitted by broadcast or audio sources. At present, the headset can be used to play the voice information of the mobile phone. When the mobile phone user wears the headset and uses the mobile phone for a long time, there is a phenomenon of lowering the head, which is easy to cause cervical fatigue and problems after using the mobile phone for a long time. In addition, if the user uses the mobile phone at a close distance for a long time, it is also easy to have myopia problems. Especially for young children, cervical problems and myopia problems caused by long-term use of mobile phones have been reported frequently. The existing headsets do not have a reminder function and cannot remind the mobile phone user when he lowers his head or is too close to the mobile phone. Summary of the invention

[0003] The purpose of the present invention is to provide an intelligent headset system for protecting the cervical vertebrae from bowing, side tilting, myopia and so on, so as to solve the problem that the headsets in the prior art do not have the functions of preventing bowing and myopia.

[0004] In order to achieve the above object, the technical solution adopted by the present invention is:

[0005] The intelligent headset system for preventing head-down and myopia is characterized by comprising a charging power supply module, a single-chip computer module, a mercury switch, an ultrasonic distance detection module, and a Bluetooth headset module, wherein:

[0006] The charging power supply module includes a charging socket J1 of model TYPE-C6P and a lithium battery charging chip IC2 of model TP4056; wherein the GND pin of the charging socket J1 is connected to the digital ground, and the VBUS pin of the charging socket J1 is connected to the VCC pin of the lithium-ion charging chip IC2; the VCC pin of the lithium-ion charging chip IC2 is connected to the digital ground through a capacitor C8, and the VCC pin of the lithium-ion charging chip IC2 is also connected to the CE pin of the lithium-ion charging chip IC2, and the PROG pin of the lithium-ion charging chip IC2 is connected to the digital ground with the TEMP pin and the GND pin through a resistor R5, and a wire leads out of the VCC pin of the lithium-ion charging chip IC2 and is connected to the two positive poles of a red and green dual-color LED lamp LED1 through a resistor R1, and the two negative poles of the red and green dual-color LED lamp LED1 correspond one to one with the lithium-ion charging chip IC2. Pins, Pin connection, the BAT pin of the lithium-ion charging chip IC2 is connected in parallel with the capacitor C9 to the digital ground, the digital ground is connected in series with a resistor R19 to the analog ground of the Bluetooth module, and at the same time, the BAT pin of the lithium-ion charging chip IC2 is also connected to the positive electrode of a lithium battery BT1, the negative electrode of the lithium battery BT1 is connected to the digital ground, the positive electrode of the lithium battery BT1 is also connected to the source of a MOS tube Q1 of model CJ2301, the source of the MOS tube Q1 is also connected to the gate of the MOS tube Q1 through the resistor R4, the gate of the MOS tube Q1 is also connected to the collector of a transistor Q2, the emitter of the transistor Q2 is connected to the digital ground, the base of the transistor Q2 is connected to the microcontroller module through the resistor R6, and the drain power supply of the MOS tube Q1 is connected to the Bluetooth module;

[0007] The single-chip microcomputer module includes a single-chip microcomputer IC3 of model STM8S003F3P. The VDD pin of the single-chip microcomputer IC3 is connected to the digital ground through a capacitor C13, and the VCAP pin is connected to the digital ground through a capacitor C14. At the same time, the VDD pin of the single-chip microcomputer IC3 is connected to the regulated VCC3.3V output of the Bluetooth module, and the VSS pin of the single-chip microcomputer IC3 is connected to the digital ground; the T1_2 / PC7 pin of the single-chip microcomputer IC3 is pulled up to VCC3.3V through a resistor R12, and the T1_1 / PC6 pin of the single-chip microcomputer IC3 is pulled up to VCC3.3V through a resistor R11. Pin 1 of the four-pin connector J2 is connected to the VCC3.3V output of the Bluetooth module, the SWIM / PD1 pin of the single-chip microcomputer IC3 is connected to pin 2 of the four-pin connector J2, and pin 3 of the four-pin connector J2 is connected to the digital ground. The four-pin connector Pin 4 of connector J2 is connected to pin 1 of four-pin connector J2 through resistor R7, and pin 4 of four-pin connector J2 is also connected to NRST pin of single-chip microcomputer IC3, and pin 4 of four-pin connector J2 is also connected to digital ground through capacitor C7; T1_3 / PC3 pin of single-chip microcomputer IC3 is connected to resistor R6 on base of transistor Q2 in charging power supply module; PA3 / T2_3 pin of single-chip microcomputer IC3 is connected to pin 1 of two-pin connector J6, pin 2 of two-pin connector J6 is connected to digital ground, and the mercury switch is plugged into two-pin connector J6; PA1 pin and PA2 pin of single-chip microcomputer IC3 are connected to pin 2 and pin 3 of four-pin connector J4 in one-to-one correspondence, pin 1 of four-pin connector J4 is connected to VCC3.3V output of Bluetooth module, and pin 4 of four-pin connector J4 is connected to digital ground;

[0008] The ultrasonic distance detection module includes an ultrasonic probe chip IC5 of model CS100A. The RNO pin and RP pin of the ultrasonic probe chip IC5 are respectively connected to the two ends of an ultrasonic probe ULS1 of model T40-10WR, the TN pin and TP pin of the ultrasonic probe chip IC5 are respectively connected to the two ends of an ultrasonic probe ULS2 of model T40-10WT, the RP pin of the ultrasonic probe chip IC5 is also connected to the digital ground with the AVSS pin of the ultrasonic probe chip IC5 through a resistor R20, the AVDD pin of the ultrasonic probe chip IC5 is connected to pin 1 of a four-pin connector J5 through a resistor R21, and the AVDD pin of the ultrasonic probe chip IC5 is also connected to the digital ground through a capacitor C25; pin 1 of the four-pin connector J5 is also connected to the VCC3.3V output of the Bluetooth module, and the four Pin 4 of the four-pin connector J5 is connected to the digital ground, pin 2 of the four-pin connector J5 is connected to pin 2 of the four-pin connector J4, pin 3 of the four-pin connector J5 is connected to pin 3 of the four-pin connector J4, and pin 3 of the four-pin connector J5 is also connected to the digital ground through the key switch S7; the ECHO pin of the ultrasonic probe chip IC5 is connected to pin 3 of the four-pin connector J5 through the resistor R23, the TRIG pin of the ultrasonic probe chip IC5 is connected to pin 2 of the four-pin connector J5, the DVDD pin of the ultrasonic probe chip IC5 is connected in parallel with the AVDD pin of IC5, and is connected to the digital ground through the capacitor C26, and the DVSS pin of the ultrasonic probe chip IC5 is connected to the digital ground; the crystal oscillator XT2 is connected between the XI pin and the XO pin of the ultrasonic probe chip IC5, and both ends of the crystal oscillator XT2 are connected to the digital ground through the capacitor C23 and the capacitor C24 respectively;

[0009] The Bluetooth headset module includes a 5.0 Bluetooth audio chip IC1 with model number AC6925A, an audio input AUX interface JK1 with model number PJ-3420-A, and a microphone MK1; the VCOM pin of the Bluetooth audio chip IC1 is connected to the analog ground through capacitor C11, the DACVDD pin is connected to the analog ground through capacitor C10 and the DACVSS pin; the VDDIO pin of the Bluetooth audio chip IC1 outputs a regulated voltage of 3.3V and is connected to the digital ground through capacitor C12; the VBAT pin of the Bluetooth audio chip IC1 is connected to the drain of the MOS tube Q1 in the charging power supply module; it is used to power the Bluetooth chip; the PC5 and PC4 pins of the Bluetooth audio chip IC1 are respectively connected to the single-chip microcomputer module The PD5 / TX pin and PD6 / RX pin of the single-chip microcomputer IC3 in the block are connected one by one, the DACR pin of the Bluetooth audio chip IC1 is connected to pin 1 of a four-pin connector J3 through capacitor C4, the DACL pin of the Bluetooth audio chip IC1 is connected to pin 3 of the four-pin connector J3 through capacitor C17, and pins 2 and 4 of the four-pin connector J3 are connected to the digital; pins 1 and 2 of the four-pin connector J3 are used to connect the right channel speaker, and pins 3 and 4 are used to connect the left channel speaker; the P3 pin of the Bluetooth audio chip IC1 is connected to pin 2 of the audio input AUX interface JK1, and the PB4 pin of the Bluetooth audio chip IC1 is connected to the audio input AU through capacitor C2. The PB5 pin of the Bluetooth audio chip IC1 is connected to the pin 3 of the audio input AUX interface JK1 through the capacitor C1, and the pin 3 of the audio input AUX interface JK1 is also connected to the analog ground through the resistor R2, and the pin 4 is also connected to the pin 1 of the audio input AUX interface JK1 through the resistor R3; the BT_AVDD pin of the Bluetooth audio chip IC1 is connected to the digital ground through the capacitor C5, the VBAT pin of the Bluetooth audio chip IC1 is connected to the digital ground through the capacitor C6, the BT_RF pin of the Bluetooth audio chip IC1 is connected to the Bluetooth antenna E1 through the capacitor C3, the VSSIO pin of the Bluetooth audio chip IC1 is connected to the digital ground, and the Bluetooth audio chip IC 1's PB1 pin is connected to the anode of a light-emitting diode LED2 through a resistor R14, and the cathode of the light-emitting diode LED2 is connected to the digital ground; a crystal oscillator XT1 is connected between the BT_OSCO pin and the BT_OSCI pin of the Bluetooth audio chip IC1, and the two ends of the crystal oscillator XT1 are connected to the digital ground through capacitors C15 and C16 respectively; the positive electrode of the microphone MK1 is connected to the PA0 / PA4 pin of the Bluetooth audio chip IC1 through a capacitor C19, and the positive electrode of the microphone MK1 is also connected to the DACVDD pin of the Bluetooth audio chip IC1 through a resistor R10, and the positive electrode of the microphone MK1 is also connected to the analog ground with the negative electrode of the microphone MK1 through a capacitor C20.

[0010] The anti-bowing and anti-myopia intelligent headset system is characterized in that the AD4 / PD3 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is connected to the digital ground through a resistor R22.

[0011] The described intelligent headset system for preventing head-down and myopia is characterized in that: the AD3 / PD2 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a diode D2, and the cathode of the diode D2 is connected to two wires, one of the wires of the cathode of the diode D2 is connected to the cathode of a diode D1, and the anode of the diode D1 is connected between the resistor R4 and the gate of the MOS tube Q1 in the charging power supply module, and the other wire of the cathode of the diode D2 is connected to one end of a key switch S5, and the other end of the key switch S5 is grounded, and the PD4 / BP pin of the single-chip microcomputer IC3 is also connected to one end of a key switch S6, and the other end of the key switch S6 is connected to the digital ground.

[0012] The anti-bowing and anti-myopia intelligent headset system is characterized by: further comprising key switches S1, S2, S3, and S4, wherein one end of each of the key switches S1, S2, S3, and S4 is connected to a digital ground, the other end of the key switch S1 is connected through a resistor R9, the other end of the key switch S2 is connected through a resistor R13, the other end of the key switch S3 is connected through a resistor R15, and the other end of the key switch S4 is connected through a resistor R17, and then connected to the drain of the MOS tube Q1 in the charging power supply module through a resistor R8, and at the same time, the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 is also connected to an analog ground through a capacitor C18, and the SCL / PB4 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 through a resistor R18.

[0013] The present invention is used for a headset worn on a human head. The Bluetooth headset module can wirelessly connect to a mobile phone audio source and play audio voice. The mercury switch can generate a trigger signal when the wearer's head is lowered, and the trigger signal is received by a single-chip microcomputer in the single-chip microcomputer module. At the same time, the ultrasonic distance detection module collects the distance between the headset and the mobile phone, and sends the collected signal to the single-chip microcomputer. The single-chip microcomputer controls the Bluetooth headset module to stop playing normal voice information based on the trigger signal, and plays reminder voice information through the microphone in the Bluetooth headset module. At the same time, the single-chip microcomputer compares the distance information with a preset threshold. If the distance information is greater than the preset threshold, the single-chip microcomputer controls the Bluetooth headset module to stop playing normal voice information, and plays reminder voice information through the microphone in the Bluetooth headset module.

[0014] Compared with the prior art, the present invention can give corresponding voice prompts when the mobile phone user lowers his head or is too close to the mobile phone, reminding the mobile phone user to adjust his posture, and can help the mobile phone user develop correct mobile phone usage habits by stopping playing normal voice, thereby reducing the risk of cervical spine and myopia problems for mobile phone users. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a system principle block diagram of the present invention.

[0016] Figure 2 It is the circuit diagram of the charging module of the present invention.

[0017] Figure 3 It is a circuit diagram of a single chip microcomputer module of the present invention.

[0018] Figure 4 It is a circuit diagram of the ultrasonic distance detection module of the present invention.

[0019] Figure 5 It is a circuit diagram of a Bluetooth headset module of the present invention.

[0020] Figure 6 The invention discloses a circuit diagram of a light emitting diode connected to a single chip microcomputer.

[0021] Figure 7 The invention discloses a key switch circuit diagram for connecting a single chip microcomputer and a charging power supply module.

[0022] Figure 8 This is another group of key switch circuit diagrams connected to the single chip microcomputer of the present invention. DETAILED DESCRIPTION

[0023] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0024] like Figure 1 As shown, the anti-head-down and anti-myopia smart headset system includes a charging power supply module, a single-chip computer module, a mercury switch, an ultrasonic distance detection module, and a Bluetooth headset module, wherein:

[0025] like Figure 2As shown, the charging power supply module includes a charging socket J1 of model TYPE-C6P and a lithium battery charging chip IC2 of model TP4056; wherein the GND pin of the charging socket J1 is connected to the digital ground, and the VBUS pin of the charging socket J1 is connected to the VCC pin of the lithium ion charging chip IC2; the VCC pin of the lithium ion charging chip IC2 is connected to the digital ground through a capacitor C8, and the VCC pin of the lithium ion charging chip IC2 is also connected to the CE pin of the lithium ion charging chip IC2, and the PROG pin of the lithium ion charging chip IC2 is connected to the digital ground with the TEMP pin and the GND pin through a resistor R5, and a wire is led out of the VCC pin of the lithium ion charging chip IC2 and connected to the two positive poles of a red and green dual-color LED lamp LED1 through a resistor R1, and the two negative poles of the red and green dual-color LED lamp LED1 correspond one to one with the lithium ion charging chip IC2 in Pins, Pin connection, the BAT pin of the lithium-ion charging chip IC2 is connected in parallel with the capacitor C9 to the digital ground, the digital ground is connected in series with a resistor R19 to the analog ground of the Bluetooth module, and at the same time, the BAT pin of the lithium-ion charging chip IC2 is also connected to the positive electrode of a lithium battery BT1, the negative electrode of the lithium battery BT1 is connected to the digital ground, the positive electrode of the lithium battery BT1 is also connected to the source of a MOS tube Q1 of model CJ2301, the source of the MOS tube Q1 is also connected to the gate of the MOS tube Q1 through the resistor R4, the gate of the MOS tube Q1 is also connected to the collector of a transistor Q2, the emitter of the transistor Q2 is connected to the digital ground, the base of the transistor Q2 is connected to the microcontroller module through the resistor R6, and the drain power supply of the MOS tube Q1 is connected to the Bluetooth module.

[0026] like Figure 3As shown, the single-chip microcomputer module includes a single-chip microcomputer IC3 of model STM8S003F3P, the VDD pin of the single-chip microcomputer IC3 is connected to the digital ground through the capacitor C13, the VCAP pin is connected to the digital ground through the capacitor C14, and the VDD pin of the single-chip microcomputer IC3 is connected to the regulated VCC3.3V output of the Bluetooth module, and the VSS pin of the single-chip microcomputer IC3 is connected to the digital ground; the T1_2 / PC7 pin of the single-chip microcomputer IC3 is pulled up and connected to VCC3.3V through the resistor R12, the T1_1 / PC6 pin of the single-chip microcomputer IC3 is pulled up and connected to VCC3.3V through the resistor R11, the pin 1 of the four-pin connector J2 is connected to the VCC3.3V output of the Bluetooth module, the SWIM / PD1 pin of the single-chip microcomputer IC3 is connected to the pin 2 of the four-pin connector J2, the pin 3 of the four-pin connector J2 is connected to the digital ground, and the four-pin connector J2 is connected to the digital ground. Pin 4 of the pin connector J2 is connected to pin 1 of the four-pin connector J2 through resistor R7, and pin 4 of the four-pin connector J2 is also connected to the NRST pin of the single-chip microcomputer IC3, and pin 4 of the four-pin connector J2 is also connected to the digital ground through capacitor C7; the T1_3 / PC3 pin of the single-chip microcomputer IC3 is connected to the resistor R6 on the base of the transistor Q2 in the charging power supply module; the PA3 / T2_3 pin of the single-chip microcomputer IC3 is connected to pin 1 of a two-pin connector J6, and pin 2 of the two-pin connector J6 is connected to the digital ground, and the mercury switch is plugged into the two-pin connector J6; the PA1 pin and PA2 pin of the single-chip microcomputer IC3 are connected to pin 2 and pin 3 of a four-pin connector J4 in a one-to-one correspondence, pin 1 of the four-pin connector J4 is connected to the VCC3.3V output of the Bluetooth module, and pin 4 of the four-pin connector J4 is connected to the digital ground.

[0027] like Figure 4As shown, the ultrasonic distance detection module includes an ultrasonic probe chip IC5 of model CS100A, the RNO pin and RP pin of the ultrasonic probe chip IC5 are respectively connected to the two ends of an ultrasonic probe ULS1 of model T40-10WR, the TN pin and TP pin of the ultrasonic probe chip IC5 are respectively connected to the two ends of an ultrasonic probe ULS2 of model T40-10WT, the RP pin of the ultrasonic probe chip IC5 is also connected to the digital ground with the AVSS pin of the ultrasonic probe chip IC5 through a resistor R20, the AVDD pin of the ultrasonic probe chip IC5 is connected to pin 1 of a four-pin connector J5 through a resistor R21, and the AVDD pin of the ultrasonic probe chip IC5 is also connected to the digital ground through a capacitor C25; pin 1 of the four-pin connector J5 is also connected to the VCC3.3V output of the Bluetooth module, Pin 4 of the four-pin connector J5 is connected to the digital ground, pin 2 of the four-pin connector J5 is connected to pin 2 of the four-pin connector J4, pin 3 of the four-pin connector J5 is connected to pin 3 of the four-pin connector J4, and pin 3 of the four-pin connector J5 is also connected to the digital ground through the key switch S7; the ECHO pin of the ultrasonic probe chip IC5 is connected to pin 3 of the four-pin connector J5 through the resistor R23, the TRIG pin of the ultrasonic probe chip IC5 is connected to pin 2 of the four-pin connector J5, the DVDD pin of the ultrasonic probe chip IC5 is connected in parallel with the AVDD pin of IC5, and is connected to the digital ground through the capacitor C26, and the DVSS pin of the ultrasonic probe chip IC5 is connected to the digital ground; the crystal oscillator XT2 is connected between the XI pin and the XO pin of the ultrasonic probe chip IC5, and the two ends of the crystal oscillator XT2 are connected to the digital ground through the capacitors C23 and C24 respectively.

[0028] like Figure 5As shown, the Bluetooth headset module includes a 5.0 Bluetooth audio chip IC1 of model AC6925A, an audio input AUX interface JK1 of model PJ-3420-A, and a microphone MK1; the VCOM pin of the Bluetooth audio chip IC1 is connected to the analog ground through a capacitor C11, the DACVDD pin is connected to the DACVSS pin through a capacitor C10, the VDDIO pin of the Bluetooth audio chip IC1 outputs a regulated voltage of 3.3V and is connected to the digital ground through a capacitor C12, the VBAT pin of the Bluetooth audio chip IC1 is connected to the drain of the MOS tube Q1 in the charging power supply module; it is used to power the Bluetooth chip; the PC5 and PC4 pins of the Bluetooth audio chip IC1 are respectively connected to the single chip The PD5 / TX pin and PD6 / RX pin of the single-chip microcomputer IC3 in the machine module are connected one by one, the DACR pin of the Bluetooth audio chip IC1 is connected to pin 1 of a four-pin connector J3 through capacitor C4, the DACL pin of the Bluetooth audio chip IC1 is connected to pin 3 of the four-pin connector J3 through capacitor C17, and pins 2 and 4 of the four-pin connector J3 are connected to the digital; pins 1 and 2 of the four-pin connector J3 are used to connect the right channel speaker, and pins 3 and 4 are used to connect the left channel speaker; the P3 pin of the Bluetooth audio chip IC1 is connected to pin 2 of the audio input AUX interface JK1, and the PB4 pin of the Bluetooth audio chip IC1 is connected to the audio input through capacitor C2. The PB5 pin of the Bluetooth audio chip IC1 is connected to the pin 3 of the audio input AUX interface JK1 through the capacitor C1, the pin 3 of the audio input AUX interface JK1 is also connected to the analog ground through the resistor R2, and the pin 4 is also connected to the pin 1 of the audio input AUX interface JK1 through the resistor R3; the BT_AVDD pin of the Bluetooth audio chip IC1 is connected to the digital ground through the capacitor C5, the VBAT pin of the Bluetooth audio chip IC1 is connected to the digital ground through the capacitor C6, the BT_RF pin of the Bluetooth audio chip IC1 is connected to the Bluetooth antenna E1 through the capacitor C3, the VSSIO pin of the Bluetooth audio chip IC1 is connected to the digital ground, and the Bluetooth audio chip I The PB1 pin of C1 is connected to the anode of a light-emitting diode LED2 through a resistor R14, and the cathode of the light-emitting diode LED2 is connected to the digital ground; a crystal oscillator XT1 is connected between the BT_OSCO pin and the BT_OSCI pin of the Bluetooth audio chip IC1, and the two ends of the crystal oscillator XT1 are connected to the digital ground through capacitors C15 and C16 respectively; the positive electrode of the microphone MK1 is connected to the PA0 / PA4 pin of the Bluetooth audio chip IC1 through a capacitor C19, and the positive electrode of the microphone MK1 is also connected to the DACVDD pin of the Bluetooth audio chip IC1 through a resistor R10, and the positive electrode of the microphone MK1 is also connected to the analog ground with the negative electrode of the microphone MK1 through a capacitor C20.

[0029] like Figure 6As shown, the AD4 / PD3 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is connected to the digital ground through a resistor R22.

[0030] like Figure 7 As shown, the AD3 / PD2 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a diode D2, and the cathode of the diode D2 is connected to two wires, one of the wires of the cathode of the diode D2 is connected to the cathode of a diode D1, the anode of the diode D1 is connected between the resistor R4 and the gate of the MOS tube Q1 in the charging power supply module, and the other wire of the cathode of the diode D2 is connected to one end of a key switch S5, and the other end of the key switch S5 is grounded. The PD4 / BP pin of the single-chip microcomputer IC3 is also connected to one end of a key switch S6, and the other end of the key switch S6 is connected to the digital ground.

[0031] like Figure 8 As shown, it also includes key switches S1, S2, S3, and S4. One end of each of the key switches S1, S2, S3, and S4 is connected to the digital ground. The other end of the key switch S1 is connected through a resistor R9, the other end of the key switch S2 is connected through a resistor R13, the other end of the key switch S3 is connected through a resistor R15, and the other end of the key switch S4 is connected through a resistor R17, and then connected to the drain of the MOS tube Q1 in the charging power supply module through a resistor R8. At the same time, the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 is also connected to the digital ground through a capacitor C18. The SCL / PB4 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 through a resistor R18.

[0032] The embodiments described in the present invention are merely descriptions of the preferred implementation modes of the present invention, and are not intended to limit the concept and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made to the technical solutions of the present invention by engineers and technicians in this field should fall within the protection scope of the present invention. The technical contents for which protection is sought in the present invention have all been recorded in the claims.

Claims

1. Anti-head-down and anti-myopia smart headset system, Features: It includes charging power supply module, single chip microcomputer module, mercury switch, ultrasonic distance detection module and Bluetooth headset module, among which: The charging power supply module includes a charging socket J1 of model TYPE-C6P and a lithium battery charging chip IC2 of model TP4056; wherein the GND pin of the charging socket J1 is connected to the digital ground, and the VBUS pin of the charging socket J1 is connected to the VCC pin of the lithium-ion charging chip IC2; the VCC pin of the lithium-ion charging chip IC2 is connected to the digital ground through a capacitor C8, and the VCC pin of the lithium-ion charging chip IC2 is also connected to the CE pin of the lithium-ion charging chip IC2, and the PROG pin of the lithium-ion charging chip IC2 is connected to the digital ground with the TEMP pin and the GND pin through a resistor R5, and a wire leads out of the VCC pin of the lithium-ion charging chip IC2 and is connected to the two positive poles of a red and green dual-color LED lamp LED1 through a resistor R1, and the two negative poles of the red and green dual-color LED lamp LED1 correspond one to one with the lithium-ion charging chip IC2. Pins, Pin connection, the BAT pin of the lithium-ion charging chip IC2 is connected in parallel with the capacitor C9 to the digital ground, the digital ground is connected in series with a resistor R19 to the analog ground of the Bluetooth headset module, and at the same time, the BAT pin of the lithium-ion charging chip IC2 is also connected to the positive electrode of a lithium battery BT1, the negative electrode of the lithium battery BT1 is connected to the digital ground, the positive electrode of the lithium battery BT1 is also connected to the source of a MOS tube Q1 of model CJ2301, the source of the MOS tube Q1 is also connected to the gate of the MOS tube Q1 through a resistor R4, the gate of the MOS tube Q1 is also connected to the collector of a transistor Q2, the emitter of the transistor Q2 is connected to the digital ground, the base of the transistor Q2 is connected to the microcontroller module through a resistor R6, and the drain power supply of the MOS tube Q1 is connected to the Bluetooth headset module; The single-chip microcomputer module includes a single-chip microcomputer IC3 of model STM8S003F3P. The VDD pin of the single-chip microcomputer IC3 is connected to the digital ground through a capacitor C13, and the VCAP pin is connected to the digital ground through a capacitor C14. At the same time, the VDD pin of the single-chip microcomputer IC3 is connected to the regulated VCC3.3V output of the Bluetooth headset module, and the VSS pin of the single-chip microcomputer IC3 is connected to the digital ground; the T1_2 / PC7 pin of the single-chip microcomputer IC3 is pulled up to VCC3.3V through a resistor R12, and the T1_1 / PC6 pin of the single-chip microcomputer IC3 is pulled up to VCC3.3V through a resistor R11. Pin 1 of the four-pin connector J2 is connected to the VCC3.3V output of the Bluetooth headset module, the SWIM / PD1 pin of the single-chip microcomputer IC3 is connected to pin 2 of the four-pin connector J2, and pin 3 of the four-pin connector J2 is connected to the digital ground. Pin 4 of connector J2 is connected to pin 1 of four-pin connector J2 through resistor R7, and pin 4 of four-pin connector J2 is also connected to NRST pin of single-chip microcomputer IC3, and pin 4 of four-pin connector J2 is also connected to digital ground through capacitor C7; T1_3 / PC3 pin of single-chip microcomputer IC3 is connected to resistor R6 on base of transistor Q2 in charging power supply module; PA3 / T2_3 pin of single-chip microcomputer IC3 is connected to pin 1 of two-pin connector J6, pin 2 of two-pin connector J6 is connected to digital ground, and the mercury switch is plugged into two-pin connector J6; PA1 pin and PA2 pin of single-chip microcomputer IC3 are connected to pin 2 and pin 3 of four-pin connector J4 in one-to-one correspondence, pin 1 of four-pin connector J4 is connected to VCC3.3V output of Bluetooth headset module, and pin 4 of four-pin connector J4 is connected to digital ground; The ultrasonic distance detection module includes an ultrasonic probe chip IC5 of model CS100A. The RNO pin and RP pin of the ultrasonic probe chip IC5 are respectively connected to the two ends of an ultrasonic probe ULS1 of model T40-10WR, and the TN pin and TP pin of the ultrasonic probe chip IC5 are respectively connected to the two ends of an ultrasonic probe ULS2 of model T40-10WT. The RP pin of the ultrasonic probe chip IC5 is also connected to the digital ground with the AVSS pin of the ultrasonic probe chip IC5 through a resistor R20. The AVDD pin of the ultrasonic probe chip IC5 is connected to pin 1 of a four-pin connector J5 through a resistor R21. The AVDD pin of the ultrasonic probe chip IC5 is also connected to the digital ground through a capacitor C25; pin 1 of the four-pin connector J5 is also connected to the VCC3.3V output of the Bluetooth headset module. Pin 4 of the four-pin connector J5 is connected to the digital ground, pin 2 of the four-pin connector J5 is connected to pin 2 of the four-pin connector J4, pin 3 of the four-pin connector J5 is connected to pin 3 of the four-pin connector J4, and pin 3 of the four-pin connector J5 is also connected to the digital ground through the key switch S7; the ECHO pin of the ultrasonic probe chip IC5 is connected to pin 3 of the four-pin connector J5 through the resistor R23, the TRIG pin of the ultrasonic probe chip IC5 is connected to pin 2 of the four-pin connector J5, the DVDD pin of the ultrasonic probe chip IC5 is connected in parallel with the AVDD pin of IC5, and is connected to the digital ground through the capacitor C26, and the DVSS pin of the ultrasonic probe chip IC5 is connected to the digital ground; the crystal oscillator XT2 is connected between the XI pin and the XO pin of the ultrasonic probe chip IC5, and both ends of the crystal oscillator XT2 are connected to the digital ground through the capacitors C23 and C24 respectively; The Bluetooth headset module includes a 5.0 Bluetooth audio chip IC1 with model number AC6925A, an audio input AUX interface JK1 with model number PJ-3420-A, and a microphone MK1; the VCOM pin of the Bluetooth audio chip IC1 is connected to the analog ground through capacitor C11, the DACVDD pin is connected to the analog ground through capacitor C10 and the DACVSS pin; the VDDIO pin of the Bluetooth audio chip IC1 outputs a regulated voltage of 3.3V and is connected to the digital ground through capacitor C12; the VBAT pin of the Bluetooth audio chip IC1 is connected to the drain of the MOS tube Q1 in the charging power supply module; it is used to power the Bluetooth chip; the PC5 and PC4 pins of the Bluetooth audio chip IC1 are respectively connected to the microcontroller module The PD5 / TX pin and PD6 / RX pin of the microcontroller IC3 are connected one by one, the DACR pin of the Bluetooth audio chip IC1 is connected to pin 1 of a four-pin connector J3 through capacitor C4, the DACL pin of the Bluetooth audio chip IC1 is connected to pin 3 of the four-pin connector J3 through capacitor C17, and pins 2 and 4 of the four-pin connector J3 are connected to the digital ground; pins 1 and 2 of the four-pin connector J3 are used to connect the right channel speaker, and pins 3 and 4 are used to connect the left channel speaker; the PB3 pin of the Bluetooth audio chip IC1 is connected to pin 2 of the audio input AUX interface JK1, and the PB4 pin of the Bluetooth audio chip IC1 is connected to the audio input AUX interface JK1 through capacitor C2. The PB5 pin of the Bluetooth audio chip IC1 is connected to the pin 3 of the audio input AUX interface JK1 through the capacitor C1, and the pin 3 of the audio input AUX interface JK1 is also connected to the analog ground through the resistor R2, and the pin 4 is also connected to the analog ground with the pin 1 of the audio input AUX interface JK1 through the resistor R3; the BT_AVDD pin of the Bluetooth audio chip IC1 is connected to the digital ground through the capacitor C5, the VBAT pin of the Bluetooth audio chip IC1 is connected to the digital ground through the capacitor C6, the BT_RF pin of the Bluetooth audio chip IC1 is connected to the Bluetooth antenna E1 through the capacitor C3, the VSSIO pin of the Bluetooth audio chip IC1 is connected to the digital ground, and the Bluetooth audio chip IC 1 is connected to the anode of a light-emitting diode LED2 through a resistor R14, and the cathode of the light-emitting diode LED2 is connected to the digital ground; a crystal oscillator XT1 is connected between the BT_OSCO pin and the BT_OSCI pin of the Bluetooth audio chip IC1, and the two ends of the crystal oscillator XT1 are connected to the digital ground through capacitors C15 and C16 respectively; the positive electrode of the microphone MK1 is connected to the PA0 / PA4 pin of the Bluetooth audio chip IC1 through a capacitor C19, and the positive electrode of the microphone MK1 is also connected to the DACVDD pin of the Bluetooth audio chip IC1 through a resistor R10, and the positive electrode of the microphone MK1 is also connected to the analog ground with the negative electrode of the microphone MK1 through a capacitor C20; The AD3 / PD2 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a diode D2, and the cathode of the diode D2 is connected to two wires, one of which is connected to the cathode of a diode D1, and the anode of the diode D1 is connected between the resistor R4 and the gate of the MOS tube Q1 in the charging power supply module, and the other is connected to one end of a key switch S5, and the other end of the key switch S5 is grounded. The PD4 / BP pin of the single-chip microcomputer IC3 is also connected to one end of a key switch S6, and the other end of the key switch S6 is connected to the digital ground; The anti-bowing and anti-myopia smart headset system also includes key switches S1, S2, S3, and S4. One end of each of the key switches S1, S2, S3, and S4 is connected to the digital ground. The other end of the key switch S1 is connected through a resistor R9, the other end of the key switch S2 is connected through a resistor R13, the other end of the key switch S3 is connected through a resistor R15, and the other end of the key switch S4 is connected through a resistor R17, and then connected to the VDDIO pin VCC3.3V regulated output of the Bluetooth audio chip IC1 through a resistor R8. At the same time, the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 is also connected to the digital ground through a capacitor C18. The SCL / PB4 pin of the microcontroller IC3 in the microcontroller module is connected to the common end of the resistor R9, the resistor R13, the resistor R15, and the resistor R17 through a resistor R18.

2. The anti-head-down and anti-myopia smart headset system according to claim 1, Features: The AD4 / PD3 pin of the single-chip microcomputer IC3 in the single-chip microcomputer module is connected to the anode of a light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is connected to the digital ground through a resistor R22.

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