Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method

Abstract

The present application discloses a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. The silicon rod cutting and grinding integrated machine integrates a cutting device and a grinding device. The silicon rod conversion device can transfer the silicon rod orderly and seamlessly between various processing devices. The cutting device is used to perform two-fold surface cutting on the silicon rod to form a square silicon rod, and the grinding device is used to grind the square silicon rod after square cutting, so as to complete the integrated operation of multiple processes of square cutting and grinding of the silicon rod, improve production efficiency and the quality of product processing operations.

Description

Technical Field

[0001] The present application relates to the technical field of silicon workpiece processing, and particularly to a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. Background Art

[0002] At present, with the increasing attention and development of the society on the utilization and development of green renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, ordinary crystalline silicon solar cells are made on high-quality silicon wafers, and such silicon wafers are formed by multi-wire saw cutting and subsequent processing after pulling or casting silicon ingots.

[0003] Taking single-crystalline silicon products as an example, the existing production process of silicon wafers generally includes the following operations: first, use a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after cutting, use a silicon rod squaring machine to square the cut short silicon rods to form single-crystalline silicon rods; then, perform processing operations such as grinding and chamfering on each single-crystalline silicon rod to make the surface shaping of the single-crystalline silicon rod meet the corresponding flatness and dimensional tolerance requirements; subsequently, use a slicing machine to slice the single-crystalline silicon rod to obtain single-crystalline silicon wafers.

[0004] However, in general, in the related art, the operations required for each process operation (such as cutting and squaring, grinding, chamfering, etc.) are independently arranged, and the corresponding processing devices are scattered in different production units or production workshops or different production areas of the production workshop. The transfer of workpieces for different process operations requires handling and allocation, and pre-treatment work may be required before each process operation. In this way, the processes are complicated, the efficiency is low, and it is easy to affect the quality of silicon rod processing operations. More manpower or transfer equipment is required, and there are great safety hazards. In addition, there are many flow links between the operation devices of each process, which increases the risk of workpiece damage during the transfer of workpieces, easily generates unqualified products caused by non-production factors, reduces the product qualification rate and the unreasonable losses brought by the existing processing methods, which is a major improvement issue faced by each company. Summary of the Invention

[0005] In view of the above-mentioned disadvantages of the related art, the purpose of the present application is to provide a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method, which are used to solve the problems of low efficiency between process operations and poor silicon rod processing effects in the existing related art.

[0006] To achieve the above object and other related objects, the present application discloses a silicon rod cutting and grinding integrated machine, including:

[0007] A machine base having a silicon rod processing table;

[0008] A cutting device for performing a first bevel cutting on a silicon rod at a first processing location of the silicon rod processing table and a second bevel cutting on a silicon rod at a second processing location of the silicon rod processing table to form a square silicon rod; any one of the first bevel cutting and the second bevel cutting refers to cutting two orthogonal sides of the silicon rod.

[0009] A grinding device for grinding and chamfering the square silicon rod at a third processing location of the silicon rod processing table; and

[0010] A silicon rod conversion device provided on the silicon rod processing table for converting the silicon rod among the first processing location, the second processing location, and the third processing location.

[0011] The silicon rod cutting and grinding integrated machine disclosed in the present application integrates a cutting device and a grinding device, and can use the silicon rod conversion device to transfer the silicon rod orderly and seamlessly among various processing devices, and use the cutting device to perform two bevel cuts on the silicon rod to form a square silicon rod and use the grinding device to grind the square silicon rod after square cutting, so as to complete the integrated operation of multiple processes of square cutting and grinding of the silicon rod, improving production efficiency and the quality of product processing operations.

[0012] In some embodiments of the first aspect of the present application, the cutting device includes: a first cutting device provided at a first processing location of the silicon rod processing platform and a second cutting device provided at a second processing location of the silicon rod processing platform.

[0013] In some embodiments of the first aspect of the present application, the first cutting device includes: a first cutting frame; a first cutting support seat that moves up and down on the first cutting frame; a first cutting unit provided on the first cutting support seat; the first cutting unit includes a first wire frame provided on the first cutting support seat, a plurality of first cutting wheels provided on the first wire frame, and a first cutting wire, and the first cutting wire is sequentially wound around the plurality of first cutting wheels to form two orthogonal first cutting line segments.

[0014] In some embodiments of the first aspect of the present application, the first cutting device further includes a first edge skin discharging device for discharging the edge skin formed after the first bevel cutting of the silicon rod by the first cutting device.

[0015] In certain embodiments of the first aspect of the present application, the second cutting device includes: a second cutting frame; a second cutting support seat that moves up and down on the first cutting frame; a second cutting unit disposed on the second cutting support seat; the second cutting unit includes a second wire frame disposed on the second cutting support seat, a plurality of second cutting wheels disposed on the second wire frame, and a second cutting wire, and the second cutting wire is sequentially wound around the plurality of second cutting wheels to form two orthogonal second cutting line segments.

[0016] In certain embodiments of the first aspect of the present application, the second cutting device further includes a second side skin discharging device for discharging the side skins formed after the second cutting device performs second bevel cutting on the silicon rod.

[0017] In certain embodiments of the first aspect of the present application, the cutting device includes: a cutting frame; a cutting support seat that moves up and down on the cutting frame; the cutting support seat includes a seat main body and first and second support seat flanks located on opposite sides of the seat main body; a first cutting unit disposed on the first side of the cutting support seat; the first cutting unit includes a plurality of first cutting wheels disposed on the first support seat flank and the seat main body and a first cutting wire, and the first cutting wire is sequentially wound around the plurality of first cutting wheels to form two orthogonal first cutting line segments; a second cutting unit disposed on the second side of the cutting support seat; the second cutting unit includes a plurality of second cutting wheels disposed on the second support seat flank and the seat main body and a second cutting wire, and the second cutting wire is sequentially wound around the plurality of second cutting wheels to form two orthogonal second cutting line segments.

[0018] In certain embodiments of the first aspect of the present application, the first cutting wire and the second cutting wire are the same cutting wire, and a guide wheel for winding the cutting wire is further disposed on the cutting support seat between the first cutting unit and the second cutting unit.

[0019] In certain embodiments of the first aspect of the present application, the first cutting unit further includes a first side skin discharging device for discharging the side skins formed after the first cutting unit performs first bevel cutting on the silicon rod; the second cutting unit further includes a second side skin discharging device for discharging the side skins formed after the second cutting unit performs second bevel cutting on the silicon rod.

[0020] In certain embodiments of the first aspect of the present application, when the first cutting unit performs first bevel cutting on the silicon rod, the intersection point of the two orthogonal first cutting line segments is located within the cross-section of the silicon rod, and when the second cutting unit performs second bevel cutting on the silicon rod, the intersection point of the two orthogonal second cutting line segments is located within the cross-section of the silicon rod.

[0021] In certain embodiments of the first aspect of the present application, the grinding device includes: a grinding support seat disposed on the machine base; at least a pair of grinding tools oppositely arranged on the grinding support seat; the at least a pair of grinding tools are movably lifted relative to the grinding support seat for grinding the surface and chamfering the square silicon rod.

[0022] In certain embodiments of the first aspect of the present application, the grinding tool includes: a main shaft; at least one grinding wheel disposed at the working end of the main shaft.

[0023] In certain embodiments of the first aspect of the present application, the grinding tool includes: a rotary chassis; a double-headed main shaft disposed on the rotary chassis, at least one rough grinding wheel is provided at its first end, and at least one fine grinding wheel is provided at its second end; a driving motor for driving the rotary chassis to rotate so that the first end and the second end of the double-headed main shaft are interchanged.

[0024] In certain embodiments of the first aspect of the present application, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform are distributed at 120° to each other in pairs, and the rotation angle range of the silicon rod conversion device is ±240°.

[0025] In certain embodiments of the first aspect of the present application, the silicon rod processing platform is further provided with a waiting area, and the silicon rod cutting and grinding integrated machine further includes a silicon rod transfer device adjacently disposed at the waiting area of the silicon rod processing platform for transferring the silicon rod to be processed to the waiting area of the silicon rod processing platform or transferring the processed silicon rod on the waiting area out of the silicon rod processing platform.

[0026] In certain embodiments of the first aspect of the present application, the silicon rod transfer device includes: a transfer base slidably disposed on the machine base through a sliding mechanism; a silicon rod platform movably disposed on the transfer base for horizontally placing the silicon rod; a silicon rod fastening mechanism disposed on the silicon rod platform for fastening the silicon rod during the transfer of the silicon rod; a platform flipping mechanism for driving the silicon rod platform to flip relative to the transfer base so that the silicon rod is vertically placed on the silicon rod transfer device.

[0027] In certain embodiments of the first aspect of the present application, the silicon rod cutting and grinding integrated machine further includes a positioning and detection device for performing ridge line detection and center positioning on the silicon rod located at the waiting area.

[0028] In certain embodiments of the first aspect of the present application, the positioning and detection device includes: a ridge line detection unit, including a contact detection mechanism, a rotation mechanism, and a detection controller electrically connected to the contact detection mechanism and the rotation mechanism. The contact detection structure is configured to send a conduction and interruption signal to the detection controller by contacting the ridge line of the silicon rod, and the rotation mechanism is configured to adjust the position of the silicon rod according to the control of the detection controller; an axis adjustment unit, configured to position the axis of the silicon rod at the center of the pretreatment area, including a clamping mechanism, and the clamping mechanism is configured to form a clamping space for clamping the silicon rod and the center of the clamping space coincides with the center of the pretreatment area.

[0029] In certain embodiments of the first aspect of the present application, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform are distributed at 90° to each other in pairs, and the rotation angle range of the silicon rod conversion device is ±270°.

[0030] In certain embodiments of the first aspect of the present application, the silicon rod conversion device includes: a conveying body; a silicon rod positioning mechanism provided on the conveying body for positioning the silicon rod; and a conversion driving mechanism for driving the conveying body to rotate to drive the silicon rod positioned by the silicon rod positioning mechanism to be converted between each processing area.

[0031] The second aspect of the present application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a machine base having a silicon rod processing platform. The silicon rod processing platform is provided with a first processing area, a second processing area, and a third processing area. The silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device. The silicon rod cutting and grinding method includes the following steps:

[0032] Let the silicon rod conversion device convert the first silicon rod to the first processing area, and let the cutting device perform a first bevel cutting on the first silicon rod in the first processing area; the first bevel cutting refers to cutting two orthogonal side surfaces of the silicon rod;

[0033] Let the silicon rod conversion device rotate a first preset angle to convert the first silicon rod from the first processing area to the second processing area and convert the second silicon rod to the first processing area, and let the cutting device perform a second bevel cutting on the first silicon rod in the second processing area and a first bevel cutting on the second silicon rod in the first processing area; the second bevel cutting refers to cutting two orthogonal side surfaces of the silicon rod;

[0034] Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the second processing position to the third processing position, transfer the second silicon rod from the first processing position to the second processing position, and transfer the third silicon rod to the first processing position. Then, let the grinding device perform surface grinding and chamfering on the first silicon rod at the third processing position. At this stage, let the cutting device perform second-fold cutting on the second silicon rod at the second processing position and first-fold cutting on the third silicon rod at the first processing position.

[0035] Rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing position to the first processing position, transfer the second silicon rod from the second processing position to the third processing position, transfer the third silicon rod from the first processing position to the second processing position, unload the first silicon rod from the first processing position and load the fourth silicon rod. Let the cutting device perform first-fold cutting on the fourth silicon rod at the first processing position. At this stage, let the grinding device perform surface grinding and chamfering on the second silicon rod at the third processing position, and let the cutting device perform second-fold cutting on the third silicon rod at the second processing position.

[0036] The silicon rod cutting and grinding method disclosed in this application, which is applied to a silicon rod cutting and grinding integrated machine, can make the silicon rod conversion device transfer the silicon rod orderly and seamlessly between various processing devices, and make the cutting device perform two-fold cutting on the silicon rod to form a square silicon rod, and make the grinding device grind the square silicon rod after square cutting, so as to complete the integrated operation of multiple processes of square cutting and grinding of the silicon rod, improving production efficiency and the quality of product processing operations.

[0037] In some embodiments of the second aspect of this application, the first processing position, the second processing position, and the third processing position on the silicon rod processing platform are distributed at 120° to each other; when the direction in the order of the first processing position, the second processing position, and the third processing position is defined as the positive direction, the first preset angle for rotating the silicon rod conversion device is a positive rotation of 120°, and the second preset angle for rotating the silicon rod conversion device is a positive rotation of 120° or a reverse rotation of 240°.

[0038] A silicon rod cutting and grinding method is disclosed in the third aspect of this application, which is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a machine base with a silicon rod processing platform. The silicon rod processing platform is provided with a waiting position, a first processing position, a second processing position, and a third processing position. The silicon rod cutting and grinding integrated machine also includes a cutting device, a grinding device, and a silicon rod conversion device. The silicon rod cutting and grinding method is characterized by including the following steps:

[0039] Load the first silicon rod at the waiting position and perform pretreatment on the first silicon rod.

[0040] Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the waiting position to the first processing position, and cause the cutting device to perform a first chamfer cutting on the first silicon rod at the first processing position. During this stage, load the second silicon rod at the waiting position and perform preprocessing on the second silicon rod; the first chamfer cutting refers to cutting two orthogonal sides of the silicon rod.

[0041] Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the first processing position to the second processing position and transfer the second silicon rod from the waiting position to the first processing position, and cause the cutting device to perform a second chamfer cutting on the first silicon rod at the second processing position and a first chamfer cutting on the second silicon rod at the first processing position. During this stage, load the third silicon rod at the waiting position and perform preprocessing on the third silicon rod; the second chamfer cutting refers to cutting two orthogonal sides of the silicon rod.

[0042] Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the second processing position to the third processing position, transfer the second silicon rod from the first processing position to the second processing position, transfer the third silicon rod from the waiting position to the first processing position, and cause the grinding device to perform surface grinding and chamfering on the first silicon rod at the third processing position. During this stage, cause the cutting device to perform a second chamfer cutting on the second silicon rod at the second processing position and a first chamfer cutting on the third silicon rod at the first processing position. At the same time, load the fourth silicon rod at the waiting position and perform preprocessing on the fourth silicon rod.

[0043] Rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing position to the waiting position, transfer the second silicon rod from the second processing position to the third processing position, transfer the third silicon rod from the first processing position to the second processing position, transfer the fourth silicon rod from the waiting position to the first processing position, unload the first silicon rod from the waiting position and load the fifth silicon rod, and perform preprocessing on the fifth silicon rod. During this stage, cause the grinding device to perform surface grinding and chamfering on the second silicon rod at the third processing position, and cause the cutting device to perform a second chamfer cutting on the third silicon rod at the second processing position and a first chamfer cutting on the fourth silicon rod at the first processing position.

[0044] The silicon rod cutting and grinding method applied to the silicon rod cutting and grinding integrated machine disclosed in this application can cause the silicon rod conversion device to transfer the silicon rod orderly and seamlessly between various processing devices, cause the cutting device to perform two chamfer cuttings on the silicon rod to form a square silicon rod, and cause the grinding device to grind the square silicon rod after chamfer cutting, so as to complete the integrated operation of multiple processes of chamfer cutting and grinding of the silicon rod, and improve the production efficiency and the quality of product processing operations.

[0045] In some embodiments of the third aspect of the present application, the waiting location, the first processing location, the second processing location, and the third processing location on the silicon rod processing platform are distributed at 90° to each other; when the direction in the order of the waiting location, the first processing location, the second processing location, and the third processing location is defined as the positive direction, the first preset angle for rotating the silicon rod conversion device is a positive rotation of 90°, and the second preset angle for rotating the silicon rod conversion device is a positive rotation of 90° or a reverse rotation of 270°. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It shows a three-dimensional structural schematic diagram of the silicon rod cutting and grinding integrated machine of the present application in an embodiment.

[0047] Figure 2 It shows a top view of the silicon rod cutting and grinding integrated machine of the present application in an embodiment.

[0048] Figure 3 It shows Figure 1 A partial enlarged view of part B of

[0049] Figure 4 It shows a structural schematic diagram of the cutting device in the silicon rod cutting and grinding integrated machine of the present application in an embodiment.

[0050] Figure 5 It shows a cross-sectional schematic diagram in which the intersection point of the first cutting line when the first cutting unit performs the first fold surface cutting on the silicon rod and the second cutting line when the second cutting unit performs the second fold surface cutting on the silicon rod is located inside the cross-section of the silicon rod

[0051] Figure 6 It shows a cross-sectional schematic diagram in which the intersection point of the first cutting line when the first cutting unit performs the first fold surface cutting on the silicon rod and the second cutting line when the second cutting unit performs the second fold surface cutting on the silicon rod is located on the circumference of the cross-section of the silicon rod.

[0052] Figures 7 to 14 It shows a structural schematic diagram of the silicon rod cutting and grinding integrated machine of the present application in each step of performing the silicon rod cutting and grinding method. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0053] The following specific embodiments illustrate the implementation manners of the present application. Those skilled in the art can easily understand the other advantages and effects of the present application from the content disclosed in this specification.

[0054] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the present application. It should be understood that other embodiments may also be used, and mechanical compositions, structures, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is only defined by the claims of the published patent. The terms used herein are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "beneath", "lower part", "above", "upper part", etc., may be used in the text to facilitate the description of the relationship between one element or feature shown in the figure and another element or feature.

[0055] Although in some instances the terms first, second, etc. are used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another. For example, the first direction may be referred to as the second direction, and similarly, the second direction may be referred to as the first direction, without departing from the scope of the various described embodiments.

[0056] Furthermore, as used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms, unless the context indicates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the described features, steps, operations, elements, components, items, types, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, types, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or meaning any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition only occurs when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0057] In the related processing technology for silicon rods, several processes such as squaring cutting, grinding the surface, and chamfering are involved.

[0058] Generally, most of the existing silicon rods are cylindrical structures. The silicon rods are squared and cut by a silicon rod squaring device, so that the cross-section of the silicon rod after squaring treatment is quasi-rectangular (including quasi-square), and the processed silicon rod as a whole is quasi-cuboid (which may also include quasi-cubic).

[0059] Taking a single-crystal silicon rod as an example, the forming process of the single-crystal silicon rod may include: first, using a silicon rod cutting machine to perform a cutting operation on the original long silicon rod to form multiple short silicon rods; after the cutting is completed, using a silicon rod squaring machine to perform a squaring operation on the cut short silicon rods to form a single-crystal silicon rod with a quasi-rectangular cross-section. Among them, the specific implementation of using a silicon rod cutting machine to perform a cutting operation on the original long silicon rod to form multiple short silicon rods can refer to patent disclosure documents such as CN105856445A, CN105946127A, and CN105196433A, etc. The specific implementation of using a silicon rod squaring machine to perform a squaring operation on the cut short silicon rods to form a single-crystal silicon rod with a quasi-rectangular cross-section can refer to patent disclosure documents such as CN105818285A, etc. However, the forming process of the single-crystal silicon rod is not limited to the foregoing technologies. In alternative examples, the forming process of the single-crystal silicon rod may further include: first, using a full silicon rod squaring machine to perform a squaring operation on the original long silicon rod to form a long single-crystal silicon rod with a quasi-rectangular cross-section; after the squaring is completed, using a silicon rod cutting machine to perform a cutting operation on the long single-crystal silicon rod after squaring and cutting to form short single-crystal silicon rods. Among them, the specific implementation of using the full silicon rod squaring machine to perform a squaring operation on the original long silicon rod to form a long single-crystal silicon rod with a quasi-rectangular cross-section can refer to patent disclosure documents such as CN106003443A, etc.

[0060] After using a squaring device to perform squaring and cutting on a cylindrical single-crystal silicon rod to form a quasi-rectangular silicon rod, a grinding device can be used to perform operations such as grinding the surface and chamfering the quasi-rectangular silicon rod.

[0061] The inventors of the present application found that in the related processing technologies for silicon rods, the processing devices involved in squaring, grinding (such as surface grinding, chamfering, etc.) are scattered and independently arranged. The conversion of silicon rods for performing different process operations requires handling and preprocessing before processing, resulting in problems such as complicated processes and low efficiency.

[0062] In view of this, the present application proposes a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. Through equipment transformation, multiple processing devices are integrated in one device, which can automatically realize the squaring and cutting and grinding (such as surface grinding, chamfering, etc.) of silicon rods. The various processing operations are seamlessly connected, saving labor costs and improving production efficiency, and improving the quality of silicon rod processing operations.

[0063] Please refer to Figures 1 to 2 , in which, Figure 1 shows a schematic three-dimensional structure diagram of the silicon rod cutting and grinding integrated machine of the present application in an embodiment, Figure 2 shows a top view of the silicon rod cutting and grinding integrated machine of the present application in an embodiment.

[0064] In this embodiment, the silicon rod cutting and grinding integrated machine of the present application is used for performing processing operations such as squaring cutting and grinding on the silicon rod. Here, the silicon rod is a single crystal silicon rod, but it is not limited thereto. For example, a polycrystalline silicon rod should also fall within the protection scope of the present application.

[0065] As shown in the figure, the silicon rod squaring device disclosed in the present application includes: a machine base 1, a cutting device 2, a grinding device 3, and a silicon rod conversion device 4. The machine base 1 has a silicon rod processing platform. The cutting device 2 is arranged on the machine base 1 and is used for performing a first bevel cutting on the silicon rod at the first processing area of the silicon rod processing platform and performing a second bevel cutting on the silicon rod at the second processing area of the silicon rod processing platform to form a square silicon rod. The grinding device 3 is arranged on the machine base 1 and is used for grinding the surface and chamfering the square silicon rod at the third processing area of the silicon rod processing platform.

[0066] The machine base 1, as the main component of the multi-station silicon rod processing machine of the present application, has a silicon rod processing platform. Among them, the silicon rod processing platform can be divided into multiple functional areas according to the specific operation content of the silicon rod processing operation. Specifically, in Figure 1 and Figure 2 the shown embodiment, the silicon rod processing platform at least includes a waiting area, a first processing area, a second processing area, and a third processing area.

[0067] The silicon rod conversion device 4 is arranged in the central area of the silicon rod processing platform and is used for converting the silicon rod 100 among the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform. In an implementation manner, the silicon rod conversion device 4 is rotatably arranged on the silicon rod processing platform. The silicon rod conversion device 4 can further include: a conveying body 41, which is in a disk shape, a square disk shape or other similar shapes; a silicon rod positioning mechanism 43 arranged on the conveying body 41 and used for positioning the silicon rod; and a conversion driving mechanism used for driving the conveying body 41 to rotate to drive the silicon rod positioned by the silicon rod positioning mechanism 43 to change positions.

[0068] As described above, the silicon rod processing platform in this embodiment includes a waiting area, a first processing area, a second processing area, and a third processing area. To be adapted to these functional areas, the number of silicon rod positioning mechanisms 43 on the conveying body 41 can be set to four, and each silicon rod positioning mechanism 43 can position at least one silicon rod. Further, the angles between the four silicon rod positioning mechanisms 43 are also consistent with the angle distribution between the four functional areas. Thus, when a certain silicon rod positioning mechanism 43 corresponds to a certain functional area, necessarily, the other three silicon rod positioning mechanisms 43 also correspond to the other three functional areas respectively. In this way, in the flow operation, at any moment, when at least one silicon rod is positioned on each silicon rod positioning mechanism 43 and the silicon rod positioning mechanism 43 corresponds to the functional area, then these silicon rods are located at the corresponding functional area to perform the corresponding processing operations. For example: the silicon rod located in the waiting area can perform pre-processing operations, the silicon rod located in the first processing area can perform the first processing operation, the silicon rod located in the second processing area can perform the second processing operation, and the silicon rod located in the third processing area can perform the third processing operation. In an alternative embodiment, the waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are distributed at 90° to each other. Therefore, correspondingly, the four silicon rod positioning mechanisms 43 on the conveying body 41 are also distributed at 90° to each other. Of course, the number of silicon rod positioning mechanisms 43 can be changed according to actual needs and is not limited thereto. For example, the number of silicon rod positioning mechanisms 43 can be determined according to the number of functional areas set on the silicon rod processing platform.

[0069] In some embodiments, the silicon rod positioning mechanism 43 may further include: a rotating carrier 431, a rotating pressing device 433, a lifting drive device (not shown in the figure), and a rotating drive device (not shown in the figure).

[0070] The rotary carrier 431 is arranged on the conveying body 41 in the silicon rod conversion device 4 and is used to carry the silicon rod 100(200) and make the silicon rod 100(200) stand upright, that is, the bottom of the silicon rod 100(200) is located on the rotary carrier 431. In this embodiment, the rotary carrier 431 rotates together when the conveying body 41 in the silicon rod conversion device 4 rotates. In some embodiments, the rotary carrier 431 can also be designed to be capable of self-rotation movement. For example, the rotary carrier 431 has a rotating shaft relative to the conveying body 41 to achieve self-rotation movement. Thus, after the rotary carrier 431 supports the silicon rod 100(200), the rotary carrier 431 and the silicon rod 100(200) thereon can rotate together. Further, the contact surface of the rotary carrier 431 for contacting the silicon rod has damping to provide a certain frictional force that can drive the silicon rod. The rotary carrier 431 is adapted to the silicon rod 100(200). In some embodiments, the rotary carrier 431 can be a circular carrier or a square carrier adapted to the cross-sectional size of the silicon rod 100(200).

[0071] The rotary pressing device 433 is oppositely arranged above the rotary carrier 431 and is used to press against the top of the silicon rod 100(200) to press the silicon rod 100(200). The rotary pressing device 433 can further include a movably arranged support and a pressing movable block arranged at the bottom of the support. The support is movably arranged on a central mounting frame, and the central mounting frame is located in the central area of the conveying body 41 and rotates together with the conveying body 41. The pressing movable block is adapted to the silicon rod 100(200). In an alternative embodiment, the pressing movable block can be a round cake-shaped pressing block or a square pressing block adapted to the cross-sectional size of the silicon rod 100(200). Further, the pressing movable block in the rotary pressing device 433 is rotatably connected to the support and can make a rotational movement relative to the support.

[0072] As can be seen from the foregoing, the rotary carrier 431 is designed to be capable of self-rotation movement and the pressing movable block in the rotary pressing device 433 is rotatably connected to the support. Therefore, the rotary carrier 431 or the pressing movable block can be linked to a rotary drive device. In one case, when the rotary carrier 431 is linked to a rotary drive device, the rotary carrier 431 is the active rotating component and the pressing movable block is the driven rotating component; in another case, when the pressing movable block is linked to a rotary drive device, the pressing movable block is the active rotating component and the rotary carrier 431 is the driven rotating component.

[0073] In practical applications, the rotary pressing device 433 can cooperate with the rotary carrier table 431 below it. Specifically, after the silicon rod 100 (200) is placed vertically on the rotary carrier table 431, the lifting drive device drives the support to move downward along the central mounting frame until the top pressing movable block on the support presses against the top of the silicon rod 100 (200). Subsequently, when it is necessary to rotate the silicon rod 100 (200), the rotary carrier table 431 or the top pressing movable block linked by the rotary drive device is driven to rotate. By using the frictional force between the rotary carrier table 431, the silicon rod 100 (200), and the top pressing movable block, the silicon rod 100 (200) is driven to rotate accordingly, realizing the adjustment of the working surface or working area in the silicon rod 100 (200), so as to perform processing operations on the adjusted working surface or working area in the silicon rod 100. The rotation speed and rotation angle of the silicon rod 100 (200) can be controlled by the rotary drive device. In a specific implementation manner, the lifting drive device can be, for example, a cylinder or a lifting motor, and the rotary drive device can be, for example, a rotary motor.

[0074] Furthermore, as can be seen from the above, in some cases, the rotary carrier table 431 or the top pressing movable block can be controlled by the rotary drive device to rotate to drive the silicon rod 100 (200) to rotate to change the working surface or working area. Sometimes, when the silicon rod 100 (200) rotates to the required working surface or working area, it is necessary to stop the actuation and be positioned to receive the processing operations of the processing device in the corresponding functional area. Therefore, in this application, the silicon rod positioning mechanism may also be configured with a locking mechanism if necessary. In one implementation manner, a carrier table locking mechanism (not shown in the figure) can be configured at the bottom of the central mounting frame and adjacent to the rotary carrier table 431. The carrier table locking mechanism can include a locking pin and a locking cylinder connected to the locking pin. In practical applications, when it is necessary to lock the rotary carrier table 431, the locking cylinder in the carrier table locking mechanism drives the locking pin to extend and act on the bottom or neck of the rotary carrier table 431 to ensure that the rotary carrier table 431 is firmly immovable; when it is necessary to rotate the silicon rod to change the working surface or working area, the locking cylinder in the carrier table locking mechanism drives the locking pin to contract to unlock the rotary carrier table 431, so that the rotary carrier table 431 can rotate.

[0075] The conveying body 41 is driven to rotate under the control of the conversion drive mechanism, and through the rotation of the conveying body 41, the silicon rod positioning mechanism 43 on the conveying body 41 and the silicon rod 100 (200) positioned by the silicon rod positioning mechanism 43 are converted between different functional areas.

[0076] In some embodiments, the conversion driving mechanism further includes: a conversion toothed belt disposed on the circumferential side of the conveying body 41; a driving motor and a linkage structure connected to and driven by the driving motor, disposed on the silicon rod processing platform of the machine base 1, and the linkage structure includes a rotating gear meshing with the conversion toothed belt. Thus, the rotating gear drives the conveying body 41 to rotate under the drive of the driving motor to drive the silicon rod positioning mechanism 43 and the silicon rod 100 (200) thereon to be converted to other functional positions to complete the conveying, and the driving motor can be a servo motor.

[0077] In some embodiments, the silicon rod conversion device 4 may further include a locking mechanism (not shown in the drawings) for locking the conveying body 41. For example, the locking mechanism may include a locking pin and a locking cylinder connected to the locking pin. The number of locking pins may be multiple and evenly distributed on the edge of the conveying body 41 (for example, the number of locking pins is four and evenly distributed at a 90° angle). In practical applications, when it is necessary to convert the silicon rod from a certain processing position to another processing position, the locking cylinder drives the locking pin to contract, unlocking the disc-shaped or annular conveying body, so that the conveying body 41 can rotate; when the silicon rod conversion is completed, that is, when the silicon rod is converted from a certain processing position to the target processing position, the locking cylinder in the locking mechanism drives the locking pin to extend and act on the conveying body 41 to lock the conveying body 41.

[0078] As described above, the silicon rod located in the waiting position can be pre-treated. The silicon rod cutting and grinding integrated machine of the present application further includes a silicon rod transfer device 6, adjacent to the waiting position of the silicon rod processing platform, for transferring the silicon rod 100 (200) to be processed to the waiting position of the silicon rod processing platform or transferring the processed silicon rod on the waiting position out of the silicon rod processing platform.

[0079] Please refer to Figure 3 shown as Figure 1 a partial enlarged view of part B in Figure 3 As shown, the silicon rod transfer device 6 further includes: a transfer base 61, a silicon rod platform 63, and a platform flipping mechanism.

[0080] As described above, the silicon rod transfer device is used to transfer the silicon rod 100 to be processed to the waiting position of the silicon rod processing platform or transfer the processed silicon rod 200 on the waiting position out of the silicon rod processing platform. Among them, the cross-section of the silicon rod 100 is circular, and the cross-section of the silicon rod 200 is square.

[0081] In some embodiments, a first silicon rod transfer device dedicated to the circular silicon rod 100 and a second silicon rod transfer device dedicated to the square silicon rod 200 are provided.

[0082] In some embodiments, a silicon rod transfer device that can be shared by a circular silicon rod 100 and a square silicon rod 200 is provided.

[0083] Now, take Figure 3 one of the silicon rod transfer devices as an example.

[0084] The transfer base 61 is slidably disposed on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can achieve sliding in at least two directions. For example, the sliding mechanism includes a support portion 621, a conversion portion 623, a first-direction sliding unit disposed between the support portion 621 and the conversion portion 623, and a second-direction sliding unit disposed between the conversion portion 623 and the transfer base 61. Among them, the first-direction sliding unit may include a first-direction slide rail, a first-direction slider or slide bar corresponding to the first-direction slide rail, and a first-direction driving source. The second-direction sliding unit may include a second-direction slide rail, a second-direction slider or slide bar corresponding to the second-direction slide rail, and a second-direction driving source.

[0085] Among them, the first slide rail, the first-direction slider or slide bar, the second slide rail, and the second-direction slider or slide bar are arranged in a horizontal state. Any one of the first-direction driving source and the second-direction driving source may include: a sliding rack, a rotating gear (not shown in the figure) meshing with the sliding rack, and a sliding driving motor. For the first-direction sliding unit, the first driving source can drive the conversion portion 623 and the transfer base 61 thereon to slide along the first direction through the first-direction slider or slide bar and the first-direction slide rail. For the second-direction sliding unit, the second driving source can drive the transfer base 61 to slide along the second direction through the second-direction slider or slide bar and the second-direction slide rail.

[0086] In some examples, the first direction may be, for example, the left-right direction (i.e., Figure 2 and Figure 3 the X-axis direction in Figure 2 and Figure 3 ), and the second direction may be, for example, the front-back direction (i.e.,

[0087] the Y-axis direction in

[0088] The silicon rod platform 63 is movably disposed on the transfer base 61 for horizontally (i.e., horizontally) placing the silicon rod 100 (200). In this embodiment, the silicon rod platform 63 is a plate-like structure or a frame structure. At least one silicon rod support bracket is respectively provided at the front and rear ends of the silicon rod platform 63 at least to support the front and rear ends of the silicon rod 100 (200), so that the silicon rod 100 (200) can be horizontally placed. At the same time, stop structures may also be respectively provided on the left and right sides of the silicon rod platform to limit the movement of the silicon rod 100 (200) in the left-right direction.As we know, in subsequent processing operations, it is necessary to convert the silicon rod 100 from a horizontal state (lying horizontally) to an upright state (standing vertically). Therefore, in the present application, a silicon rod fastening mechanism can also be provided for fastening the silicon rod during the transfer process of the silicon rod (not shown in the drawings). In some embodiments, the silicon rod fastening mechanism may include fastening claws and a fastening motor or a fastening cylinder for controlling the fastening claws. Further, at least two pairs of fastening claws are included in the silicon rod fastening mechanism, and the at least two pairs of fastening claws respectively correspond to the two aforementioned silicon rod support brackets, that is, one pair of fastening claws corresponds to one silicon rod support bracket, and the two fastening claws in one pair of fastening claws are oppositely arranged on the left and right sides of the silicon rod support bracket, and each fastening claw is provided with a fastening motor or a fastening cylinder. In practical applications, when the silicon rod 100 (200) lies horizontally on the silicon rod platform, the fastening motor or the fastening cylinder drives the corresponding fastening claws towards the silicon rod 100 (200) on the silicon rod platform. In this way, through the cooperation of at least two pairs of fastening claws, the overall fastening of the silicon rod 100 (200) is achieved. Preferably, a buffer member can be provided at the pressing contact where the fastening claw contacts the silicon rod 100 (200) to avoid or reduce damage to the silicon rod 100 (200).

[0089] To convert the silicon rod 100 from a horizontal state (horizontally placed) to an upright state (vertically placed), the silicon rod transfer device 6 further includes a platform flipping mechanism. The platform flipping mechanism is used to drive the silicon rod platform 63 to flip relative to the transfer base 61, so that the silicon rod 100 (200) is vertically placed on the silicon rod conversion device 4. In this embodiment, the platform flipping mechanism includes: a mounting frame, a moving frame, a flipping cylinder or a flipping motor, a flipping rack, and a flipping gear. The mounting frame is fixedly provided on the transfer base. In some embodiments, the mounting frame is a plate-like structure or a frame structure. The moving frame is movably arranged above the mounting frame. In some embodiments, the moving frame is a hollow plate-like structure or a frame structure. Further, flipping racks are respectively provided on the left and right opposite sides of the moving frame adjacent to the silicon rod conversion device 4. Correspondingly, flipping gears are respectively provided on the left and right opposite sides of the flipping end of the silicon rod platform 63 adjacent to the silicon rod conversion device 4, and the flipping gears are engaged with the corresponding flipping racks above them. The flipping cylinder or the flipping motor is used to drive the moving frame to move relative to the mounting frame. Taking the flipping cylinder as an example, the flipping cylinder is integrally arranged in the hollow area of the moving frame. Specifically, the cylinder body of the flipping cylinder (for example, including a cylinder barrel and a piston) is arranged on the mounting frame, and the piston rod of the flipping cylinder is connected to the moving frame. In practical applications, for the silicon rod platform to be flipped from a horizontal state to a vertical state: the flipping cylinder acts, the piston rod extends and pushes the moving frame, so that the moving frame moves relative to the mounting frame under the push, and the flipping rack on the moving frame also moves with the moving frame. The flipping gear on the silicon rod platform engaged with the flipping rack rotates under the drive of the flipping rack, thereby driving the silicon rod platform to flip, and finally realizing the flipping of the silicon rod platform from a horizontal state to a vertical state. For the silicon rod platform to be flipped from a vertical state to a horizontal state: the flipping cylinder acts, the piston rod contracts and pulls the moving frame, so that the moving frame moves relative to the mounting frame under the push, and the flipping rack on the moving frame also moves with the moving frame. The flipping gear on the silicon rod platform engaged with the flipping rack rotates under the drive of the flipping rack, thereby driving the silicon rod platform to flip, and finally realizing the flipping of the silicon rod platform from a vertical state to a horizontal state.

[0090] It should be added that: In addition, in order to enable the moving frame to move smoothly and stably relative to the mounting frame, slide rails are provided on the left and right opposite sides of the mounting frame, and sliders or slide bars for sliding on the slide rails are provided on the left and right opposite sides of the bottom of the moving frame. Of course, the above is only an exemplary illustration and is not intended to limit the present invention. For example, in other embodiments, the slide rails can be arranged on the moving frame and the sliders or slide bars can be arranged on the mounting frame. Furthermore, in order to avoid or reduce the collision damage to the moving frame, the mounting frame, the flipping cylinder or the flipping motor during the flipping process of the silicon rod platform (for example, when the silicon rod platform flips back from a vertical state to a horizontal state), a relatively protruding buffer can be further provided on the moving frame or the mounting frame.

[0091] The silicon rod transfer device 6 may further include a lifting mechanism. The lifting mechanism is disposed on the silicon rod platform and is used to perform a lifting movement on the silicon rod 100(200) after flipping. In this embodiment, the lifting mechanism may include a slide rail or a slide bar and a lifting motor or a lifting cylinder. Among them, in order to achieve the lifting movement of the silicon rod 100(200), the silicon rod support bracket is arranged on the silicon rod platform through the slide rail or the slide bar (the silicon rod fastening mechanism is installed and connected to the silicon rod support bracket), and the lifting motor or the lifting cylinder controls the silicon rod support bracket (together with the silicon rod fastening mechanism) to perform a lifting movement, thereby driving the silicon rod 100(200) to achieve lifting. Still taking the lifting cylinder as an example, the lifting cylinder is integrally arranged in the middle of the silicon rod platform. Specifically, the cylinder body of the lifting cylinder (such as including a cylinder barrel and a piston) is arranged on the silicon rod platform, and the piston rod of the lifting cylinder is connected to the silicon rod support bracket. In practical applications, when the lifting cylinder actuates, the piston rod expands and contracts (extends or contracts) and pushes and pulls (pushes or pulls) the silicon rod support bracket, so that the silicon rod support bracket moves up and down relative to the mounting rack under the push and pull, and the silicon rod 100(200) on the silicon rod support bracket also moves up and down following the silicon rod support bracket.

[0092] The foregoing silicon rod transfer device 6 is only an exemplary illustration, but is not limited thereto, and the silicon rod transfer device may still make other changes.

[0093] In some embodiments, the silicon rod transfer device may include: a reversing carrier, a silicon rod clamp disposed on the reversing carrier, and a reversing drive mechanism for driving the reversing carrier to perform a reversing movement.

[0094] The reversing carrier is a main device for arranging various other components in the silicon rod transfer device. Various other components mainly may include a silicon rod clamp, but are not limited thereto. Other components may also be, for example, mechanical structures, electrical control systems, and numerical control devices. In this embodiment, the reversing carrier may include a base, a top frame opposite to the base, and a support structure disposed between the base and the top frame. In addition, another important function of the reversing carrier is to support the reversing conversion of the silicon rod clamp through a reversing movement. The reversing carrier may perform a reversing movement, for example, through a reversing drive mechanism. By using the reversing drive mechanism, the reversing carrier can be driven to perform a reversing movement so that the silicon rod clamp on the reversing carrier clamps the silicon rod 100 to be processed and transfers it from the loading and unloading area to the corresponding waiting position, or, clamps the processed silicon rod 200 at the waiting position and transfers it from the waiting position to the loading and unloading area.

[0095] In a specific implementation manner, the commutation drive mechanism for enabling the commutation vehicle to perform commutation movement may include a rotating shaft and a rotating motor. The commutation vehicle is shaft-connected to the underlying installation base structure through the rotating shaft. When implementing the steering movement, the rotating motor is started to drive the rotating shaft to rotate, thereby driving the commutation vehicle to rotate to achieve the commutation movement. The driving of the rotating shaft to rotate can be designed as one-way rotation or two-way rotation. The one-way rotation can be, for example, one-way clockwise rotation or one-way counterclockwise rotation, and the two-way rotation can be, for example, to achieve clockwise rotation and counterclockwise rotation. In addition, the rotation angle of the driving rotating shaft can be set according to the actual structure of the silicon rod transfer device. Furthermore, the base in the commutation vehicle can adopt a disc structure, a rectangular disc or an elliptical disc, and its central position is connected to the rotating shaft. However, the shape of the base is not limited to this. In other embodiments, the base can also adopt other shapes.

[0096] A silicon rod clamp is provided on the commutation vehicle for clamping the corresponding silicon rod. For example, in some embodiments, a silicon rod clamp is provided on a certain mounting surface of the commutation vehicle. The silicon rod clamp can include at least two silicon rod clamping members, and among them, the at least two silicon rod clamping members are arranged at intervals. The silicon rod clamping members in the silicon rod clamp can be used to clamp round silicon rods (i.e., silicon rods to be processed) and square silicon rods (i.e., processed silicon rods). In this way, by driving the commutation vehicle to perform commutation movement, the silicon rod clamp on the commutation vehicle is switched between the loading and unloading area and the waiting area to transfer the silicon rods to be processed, and is switched between the waiting area and the loading and unloading area to transfer the processed silicon rods. In actual applications, the rotation angle of the commutation vehicle during commutation movement is determined according to the positional relationship between the loading and unloading area and the waiting area. In some implementation manners, the loading and unloading area and the waiting area are oppositely arranged, and the silicon rod transfer device is located between the two. Therefore, the commutation vehicle is driven by the commutation drive mechanism to rotate by an angle of 180°. In some implementation manners, the loading and unloading area and the waiting area are arranged at a 90° angle. Then, the commutation vehicle is driven by the commutation drive mechanism to rotate by an angle of 90°. However, anyway, there is no specific limitation on the positional relationship between the loading and unloading area and the waiting area. Their setting order and the setting angle between each other can still be changed in other ways. As long as there is no unnecessary interference between each work station, in this way, the rotation direction and rotation angle of the commutation vehicle will also be adjusted adaptively.

[0097] In some embodiments, both the silicon rod to be processed and the processed silicon rod are placed vertically. Therefore, at least two silicon rod clamping members in the silicon rod clamp are arranged at intervals up and down. Any one of the silicon rod clamping members may further include: a clamp arm mounting seat and two clamp arms. Among them, the clamp arm mounting seat is arranged on the commutation carrier, and at least two clamp arms are movably arranged on the clamp arm mounting seat. These two clamp arms are symmetrically arranged left and right, and the two clamp arms can form a clamping space for clamping a single-wafer silicon rod or a silicon cube. Additionally, the silicon rod clamping member can also play a role in centering adjustment. Generally, when the clamp arms in the silicon rod clamping member are in the clamped state, the center of the clamping space formed by the two clamp arms coincides with the center of the silicon rod to be processed and the processed silicon rod. Therefore, when using the silicon rod clamping member to clamp the vertically placed silicon rod to be processed or the processed silicon rod, the two clamp arms in the silicon rod clamping member contract, and the clamp arms abut against the silicon rod to be processed or the processed silicon rod. During the process of the clamp arms contracting and clamping the silicon rod to be processed or the processed silicon rod, the silicon rod to be processed or the processed silicon rod is pushed by the two clamp arms on both sides and moves towards the central area of the clamping space until the silicon rod to be processed or the processed silicon rod is clamped by the two clamp arms in the silicon rod clamping member. At this time, the center of the silicon rod to be processed or the processed silicon rod can be located at the center of the clamping space of the silicon rod clamping member.

[0098] To enable at least two clamp arms in the silicon rod clamping member to smoothly and stably clamp silicon rods to be processed or processed silicon rods of different sizes and specifications, at least one of the clamp arms in each of the clamp arms in the silicon rod clamping member is designed to be adjustable. Taking two clamp arms as an example, at least one of the two clamp arms is a movable design (one or both of the two clamp arms are movable designs), so that the clamping distance between the two clamp arms can be adjusted.

[0099] In addition, the silicon rod clamp in the silicon rod transfer device of the present application may have other variations. For example, the silicon rod transfer device may be configured with two silicon rod clamps, and these two silicon rod clamps may be respectively arranged on two opposite mounting surfaces in the commutation carrier. Moreover, these two silicon rod clamps may be the same or different. In the embodiment where the two silicon rod clamps are the same, these two silicon rod clamps are used to clamp round silicon rods and square silicon rods. In the embodiment where the two silicon rod clamps are different, one of the two silicon rod clamps is used to clamp round silicon rods, and the other silicon rod clamp is used to clamp square silicon rods.

[0100] Furthermore, the silicon rod transfer device 6 in the present application can further provide movement in at least one direction. For example, the silicon rod transfer device may further include a forward and backward movement mechanism. The forward and backward movement mechanism may include: a forward and backward guide rail and a forward and backward motor. Among them, the forward and backward guide rail is arranged in the front and back direction, and the base of the commutation carrier can be placed on the forward and backward guide rail through a slider. In this way, when it is necessary to adjust the position of the commutation carrier, the forward and backward motor drives the commutation carrier to move forward and backward along the forward and backward guide rail.

[0101] The silicon rod cutting and grinding integrated machine of the present application further includes a positioning and detection device. In this embodiment, the positioning and detection device (not shown in the drawings) is used to perform ridge line detection and center positioning on the silicon rod 100 located at the waiting position.

[0102] The positioning and detection device further includes: a ridge line detection unit and an axis adjustment unit.

[0103] In some embodiments, the ridge line detection unit includes a contact detection mechanism, a rotation mechanism, and a detection controller electrically connected to the contact detection mechanism and the rotation mechanism. The contact detection structure is used to send a conduction and interruption signal to the detection controller by contacting the ridge line of the silicon rod, and the rotation mechanism is used to adjust the position of the silicon rod according to the control of the detection controller.

[0104] The number of the silicon rod positioning mechanisms 43 can be changed according to actual needs and is not limited thereto. For example, the number of the silicon rod positioning mechanisms 43 can be determined according to the number of functional positions set on the silicon rod processing platform.

[0105] In some embodiments, the silicon rod positioning mechanism 43 may further include: a rotary carrier 431

[0106] In some embodiments, the axis adjustment unit is used to position the axis of the silicon rod 100 at the center of the pretreatment area, and includes a clamping mechanism. The clamping mechanism is used to form a clamping space for clamping the silicon rod, and the center of the clamping space coincides with the center of the pretreatment area.

[0107] In a specific implementation manner, the clamping mechanism may include at least two clamping members, and each clamping member may include at least two clamping arms.

[0108] Given that the cross-section of the silicon rod is circular, in some examples, the clamping member as a whole is a circular workpiece fixture. The clamping arms that make up the clamping member are two symmetrically designed ones. A single clamping arm is designed to have an arc-shaped clamping surface. Preferably, the arc-shaped clamping surface of a single clamping arm exceeds a quarter of the arc of the silicon rod by 100. In this way, the arc-shaped clamping surface of the clamping member composed of two clamping arms exceeds half of the arc of the silicon rod by 100. Of course, a buffer pad can be additionally provided on the arc-shaped clamping surface in the clamping arm to avoid damaging the surface of the silicon rod during the process of clamping the silicon rod, achieving a good effect of protecting the silicon rod. Generally, when the clamping arms in the clamping member are in the clamped state, the center of the clamping space formed by the two clamping arms coincides with the center of the silicon rod 100. Therefore, when using the clamping member to clamp the silicon rod 100 vertically placed at the to-be-processed location, the two clamping arms in the clamping member contract, and the arc-shaped clamping surface in the clamping arm abuts against the silicon rod. During the process of the clamping arms contracting and clamping the silicon rod 100, the silicon rod 100 is pushed by the two clamping arms on both sides and moves towards the central area of the clamping space until the silicon rod 100 is clamped by the clamping arms in the clamping member. At this time, the center of the silicon rod 100 can be located at the center of the clamping space of the clamping member.

[0109] When the silicon rod 100 to be processed is transferred by the silicon rod transfer device 6 to the waiting location of the silicon rod processing platform and undergoes pre-treatment, the silicon rod can be transferred from the waiting location to other processing locations by the silicon rod conversion device 4.

[0110] The cutting device 2 is arranged on the machine base 1 and is used for performing a first bevel cutting on the silicon rod 100 at the first processing location of the silicon rod processing platform and a second bevel cutting on the silicon rod 100 at the second processing location of the silicon rod processing platform to form a square silicon rod. Among them, any one of the first bevel cutting and the second bevel cutting refers to cutting two orthogonal side surfaces of the silicon rod.

[0111] Please refer to Figure 4 , which shows the structural schematic diagram of the cutting device in an embodiment of the silicon rod cutting and grinding integrated machine of the present application. In the silicon rod cutting and grinding integrated machine as shown in Figure 1 , Figure 2 and Figure 4 shown, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25.

[0112] The cutting frame 21 is arranged on the machine base 1. In this embodiment, the cutting frame 21 is a columnar structure or a frame structure. As the support main body of the cutting device 2, it can provide support to other components in the cutting device 2.

[0113] The cutting support 22 is vertically movably arranged on the cutting frame 21 through a lifting mechanism. In some embodiments, the lifting mechanism may include a mechanism that can realize the vertical movement of the cutting support 22, such as a lifting motor, lifting guide rails, and lifting sliders. Among them, the lifting guide rails are vertically arranged on the cutting frame 21, and the lifting sliders are arranged on the back of the cutting support 22 and cooperate with the lifting guide rails. To enable the cutting support 22 to be stably lifted and lowered in the installation structure of the machine base 1, a double-guide rail design can be adopted, that is, two lifting guide rails are used, and these two lifting guide rails are arranged in parallel. Driven by the lifting motor (the lifting motor can be, for example, a servo motor), the cutting support 22 can move up and down relative to the cutting frame 21 and the machine base 1 by means of the lifting guide rails and the lifting sliders.

[0114] In this embodiment, since the cutting support 22 can be configured with the first cutting unit 23 and the second cutting unit 25, that is, the first cutting unit 23 and the second cutting unit 25 share the cutting support 22. Therefore, in this embodiment, on the one hand, the cutting frame 21 and the cutting support 22 in the cutting device 2 are arranged at the central position between the first processing area and the second processing area. On the other hand, the cutting support 22 is specially designed. As Figures 1 to 4 shown, the cutting support 22 in this embodiment may include a support main body 221 and a first support flank 223 and a second support flank 225 located on the opposite sides of the support main body 221.

[0115] The first cutting unit 23 is arranged on the first side of the cutting support 22 and is used for performing a first faceted cutting on the silicon rod 100 at the first processing area of the silicon rod processing platform.

[0116] In this embodiment, as described above, the cutting support 22 includes a support main body 221 and a first support flank 223 and a second support flank 225 located on the opposite sides of the support main body 221. Therefore, the first cutting unit 23 is installed at the first support flank 223 of the cutting support 22. Specifically, the first cutting unit 23 includes a first wire frame 231 arranged on the first support flank 223, a plurality of first cutting wheels 233 arranged on the first wire frame 231, and a first cutting wire 235. The first cutting wire 235 is sequentially wound around the plurality of first cutting wheels 233 to form two orthogonal first cutting line segments.

[0117] In practical applications, the first cutting unit 23 may include at least four first cutting wheels 233. These four first cutting wheels 233 can be combined into two orthogonal first cutting wheel groups. That is, two first cutting wheels arranged oppositely along the M axis form one first cutting wheel group, and two first cutting wheel groups along the N axis form a pair of first cutting wheel groups, where the M axis is orthogonal to the N axis. Specifically, the first cutting unit 23 includes two orthogonal first cutting wheel groups. One first cutting wheel group includes two first cutting wheels 233 arranged front and back (along the M axis), and the other first cutting wheel group includes two first cutting wheels 233 arranged front and back (along the N axis).

[0118] The first cutting wire 235 is sequentially wound around each first cutting wheel 233 in the first cutting unit 23 to form a first cutting wire mesh. In practical applications, the first cutting wire 235 is sequentially wound around the four first cutting wheels 233 in the first cutting unit 23 to form two mutually orthogonal first cutting wire segments, constituting the first cutting wire mesh. Specifically, the first cutting wire 235 is wound around two first cutting wheels 233 arranged front and back (along the M axis) in one first cutting wheel group to form a first cutting wire segment, and the first cutting wire 235 is wound around two first cutting wheels 233 arranged front and back (along the N axis) in the other first cutting wheel group to form another second cutting wire segment. Thus, these two mutually orthogonal first cutting wire segments cooperate to form a first cutting wire mesh in the shape of a "Γ".

[0119] Of course, the first cutting unit 23 is not limited to Figures 1 to 4 the embodiment shown, and it can still have other variations in other embodiments.

[0120] In addition, in this embodiment, the first cutting unit 23 may further include at least one of the following components: a wire guiding wheel provided on the first wire frame 231 and / or the first support flank 223 for guiding the first cutting wire 235; a tension wheel provided on the first wire frame 231 and / or the first support flank 223 for adjusting the tension of the first cutting wire 235; and a wire storage cylinder provided on the machine base 1 (the wire storage cylinder may further include a wire pay-off cylinder and a wire take-up cylinder) for taking in and paying out the first cutting wire.

[0121] The second cutting unit 25 is provided on the second side of the cutting support 22 for performing a second chamfer cutting on the silicon rod 100 at the second processing position of the silicon rod processing platform.

[0122] In this embodiment, as described above, the cutting support 22 includes a support main body 221 and a first support flank 223 and a second support flank 225 located on opposite sides of the support main body 221. Therefore, the second cutting unit 25 is installed at the second support flank 225 of the cutting support 22. Specifically, the second cutting unit 25 includes a second wire rack 251 provided on the second support flank 225, a plurality of second cutting wheels 253 provided on the second wire rack 251, and a second cutting wire 255. The second cutting wire 255 is sequentially wound around the plurality of second cutting wheels 253 to form two orthogonal second cutting line segments.

[0123] In actual applications, the second cutting unit 25 may include at least four second cutting wheels 253. These four second cutting wheels 253 can be combined into two orthogonal second cutting wheel groups. That is, two second cutting wheels arranged opposite to each other along the M axis form a second cutting wheel group, and two second cutting wheel groups along the N axis form a pair of second cutting wheel groups, where the M axis is orthogonal to the N axis. Specifically, the second cutting unit 25 includes two orthogonal second cutting wheel groups. Among them, one first cutting wheel group includes two first cutting wheels 253 arranged front and back (along the M axis), and the other first cutting wheel group includes two first cutting wheels 253 arranged front and back (along the N axis).

[0124] The second cutting wire 255 is sequentially wound around each second cutting wheel 253 in the second cutting unit 25 to form a second cutting wire mesh. In actual applications, the second cutting wire 255 is sequentially wound around the four second cutting wheels 253 in the second cutting unit 25 to form two mutually orthogonal second cutting line segments, constituting the second cutting wire mesh. Specifically, the second cutting wire 255 is wound around the two second cutting wheels 253 arranged front and back (along the M axis) in one second cutting wheel group to form a second cutting line segment, and the second cutting wire 255 is wound around the two second cutting wheels 253 arranged front and back (along the N axis) in the other second cutting wheel group to form another second cutting line segment. In this way, these two mutually orthogonal second cutting line segments cooperate to form a second cutting wire mesh in the shape of a "Γ".

[0125] Of course, the second cutting unit 25 is not limited to Figures 1 to 4 the embodiment shown, and it can still be changed in other embodiments.

[0126] In addition, in this embodiment, the second cutting unit 25 may further include at least one of the following components: a wire guiding wheel provided on the second wire rack 251 and / or the second support flank 225 for guiding the second cutting wire 255; a tension wheel provided on the second wire rack 251 and / or the second support flank 225 for adjusting the tension of the second cutting wire 255; and a wire storage cylinder provided on the machine base 1 (the wire storage cylinder may further include a wire pay-off cylinder and a wire take-up cylinder) for taking in and paying out the second cutting wire.

[0127] Furthermore, regarding the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25.

[0128] In some embodiments, the first cutting unit 23 and the second cutting unit 25 are two independent cutting units, and the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25 can be two independent cutting lines.

[0129] In some embodiments, the first cutting line 235 in the first cutting unit 23 and the second cutting line 255 in the second cutting unit 25 can be the same cutting line. In this case, the shared cutting line is sequentially wound around a plurality of first cutting wheels 233 in the first cutting unit 23 to form a first cutting line network and then transferred to the adjacent second cutting unit to be sequentially wound around a plurality of second cutting wheels 253 in the second cutting unit 25 to form a second cutting line network. Therefore, in this embodiment, one or more guide wheels for winding the shared cutting line are further provided on the cutting support 22 between the first cutting unit 23 and the second cutting unit 25. Specifically, in Figure 4 the illustrated embodiment, a guide wheel 26 for winding the shared cutting line is provided on the support body 221 of the cutting support 22 between the first cutting unit 23 and the second cutting unit 25. The first cutting unit 23 and the second cutting unit 25 share the same cutting line, which can simplify the structure of the cutting unit (for example, omitting a set of wire pay-off reel and wire take-up reel), has good integrity, simplifies the wire winding process, improves efficiency, and can better control the wire tension of the two cutting units, etc.

[0130] When using Figure 2When the cutting device 2 in the illustrated embodiment cuts the silicon rods on the first processing area and the second processing area of the silicon rod processing platform, the driving cutting support 22 is lowered relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the silicon rods on the corresponding first processing area and the second processing area. Among them, the first cutting unit 23 performs a first fold surface cutting on the silicon rod on the first processing area (the first cutting unit 23 is provided with a first cutting wire mesh in a "Γ" shape), and the second cutting unit 25 performs a second fold surface cutting on the silicon rod on the second processing area (the second cutting unit 25 is provided with a second cutting wire mesh in a "Γ" shape). It can be seen that in this embodiment, the first cutting unit 23 and the second cutting unit 25 in the cutting device 2 share the cutting support 22. By driving the shared cutting support 22 to move up and down, the first cutting unit 23 and the second cutting unit 25 thereon can respectively perform a first fold surface cutting on the silicon rod on the first processing area and a second fold surface cutting on the silicon rod on the second processing area at the same time. The cutting device 2 is simple in structure and convenient to control as a whole, and can improve the cutting efficiency and quality of the silicon rod.

[0131] It should be noted that in this embodiment, the intersection point of the first cutting line 235 when the first cutting unit 23 performs the first fold surface cutting on the silicon rod 100 and the second cutting line 255 when the second cutting unit 25 performs the second fold surface cutting on the silicon rod 100 is located within the cross-section of the silicon rod 100 (including the case where the intersection point is located on the cross-section circumference), so that the formed square silicon rod can obtain the largest possible cross-section (the surface area of the silicon wafer obtained after subsequent slicing is larger), and the material loss in subsequent grinding (such as surface grinding and chamfering, etc.) operations can be reduced, and the utilization rate of the silicon material can be improved. Please refer to Figure 5 and Figure 6 , where Figure 5 The cross-sectional schematic diagram shows that the intersection point of the first cutting line when the first cutting unit performs the first fold surface cutting on the silicon rod and the second cutting line when the second cutting unit performs the second fold surface cutting on the silicon rod is located inside the cross-section of the silicon rod. Figure 6 The cross-sectional schematic diagram shows that the intersection point of the first cutting line when the first cutting unit performs the first fold surface cutting on the silicon rod and the second cutting line when the second cutting unit performs the second fold surface cutting on the silicon rod is located on the cross-section circumference of the silicon rod. Among them, Figure 5 and Figure 6 The 101 shown in is the edge skin formed after cutting the silicon rod.

[0132] After performing the first cutting operation (the first cutting unit 23 performs the first fold surface cutting on the silicon rod 100) and the second cutting operation (the second cutting unit 25 performs the second fold surface cutting on the silicon rod 100) on the silicon rod 100 through the above cutting device 2, a square silicon rod (that is, a silicon rod in the shape of a quasi-rectangular body) is formed.

[0133] In this embodiment, as can be known from the foregoing, the silicon rod will form side skins after squaring cutting. In order not to hinder the rising of the wire cutting device, it is necessary to discharge the side skins in time. For the discharging of the side skins, the general method of discharging the side skins is mostly that the operator manually operates to separate the side skins from the squared silicon rod and carry them out of the silicon rod squaring equipment. This not only has low efficiency, but also increases the risk of damage to the squared silicon rod due to the collision between the side skins and the squared silicon rod during the handling process. In view of this, the silicon rod cutting and grinding integrated machine of the present application further includes a side skin discharging device for discharging the side skins formed after the wire cutting device performs squaring cutting on the silicon rod. That is, in this embodiment, the first cutting unit further includes a first side skin discharging device for discharging the side skins formed after the first cutting unit performs first fold surface cutting on the silicon rod; the second cutting unit further includes a second side skin discharging device for discharging the side skins formed after the second cutting unit performs second fold surface cutting on the silicon rod.

[0134] Since the first side skin discharging device and the second side skin discharging device have the same structure, only the first side skin discharging device will be taken as an example for illustration here.

[0135] Generally, the first side skin discharging device may include a side skin lifting mechanism for lifting the side skin so that the top end of the side skin protrudes from the cut silicon rod. The side skin lifting mechanism includes a jacking member disposed on the first wire rack in the first cutting unit. The jacking member can be driven by a telescopic member to perform telescopic movement. After the jacking member is controlled to perform an extending movement, it supports the bottom of the side skin to lift the side skin.

[0136] In some embodiments, the jacking member includes a abutting plate and a supporting plate. The abutting plate extends upward from the bottom of the supporting plate. Further, the abutting plate can be an arc-shaped plate adapted to the arc-shaped surface of the side skin. When the abutting plate abuts against the side skin, it can be in full contact with the arc-shaped surface of the side skin. The contact part between the abutting plate and the side skin is designed to be smooth or a buffer pad is added to the inner surface of the abutting plate in contact with the side skin. The supporting plate is used to support the bottom of the side skin. Further, the supporting plate can be a bow-shaped plate adapted to the bottom surface of the side skin. In other embodiments, bumps can be added to the chord side of the bow-shaped plate serving as the supporting plate to increase the contact area with the bottom surface of the side skin.

[0137] In some embodiments, the telescopic member may be, for example, a cylinder with a telescopic rod. Herein, the telescopic rod may be connected to the supporting plate in the lifting member through a connecting structure, and the cylinder may drive the telescopic rod to drive the lifting member to perform telescopic motion. Here, the telescopic motion of the lifting member includes the contraction motion and the extension motion of the lifting member. Among them, the contraction motion of the lifting member specifically refers to the cylinder driving the telescopic rod to contract to drive the lifting member away from the edge skin, and the extension motion of the lifting member specifically refers to the cylinder driving the telescopic rod to extend to drive the lifting member close to the edge skin. Of course, the foregoing telescopic member may also adopt other implementation manners. For example, the telescopic member may also be, for example, a servo motor with a lead screw, and the lead screw is connected to the lifting member. The servo motor drives the lead screw to rotate to drive the connected lifting member to perform telescopic motion. For example, driving the lead screw to rotate forward drives the lifting member to perform contraction motion and driving the lead screw to rotate reversely drives the lifting member to perform extension motion, or driving the lead screw to rotate forward drives the lifting member to perform extension motion and driving the lead screw to rotate reversely drives the lifting member to perform contraction motion. Regarding the specific structure and implementation manner of the first edge skin discharging device, reference may be made to patent disclosure documents such as CN208148230U etc.

[0138] In practical applications, in the initial state, the telescopic rod drives the lifting member to be in a contracted state. The first cutting unit is driven to descend along with the cutting support so that the first cutting line segment in the first cutting unit performs a first fold cutting on the silicon rod located at the first processing position until the first cutting line segment penetrates the silicon rod, completing the first fold cutting of the silicon rod and forming an edge skin. At this time, the edge skin lifting mechanism has followed the first wire rack to descend to the bottom. The cylinder drives the telescopic rod to extend to drive the lifting member close to the edge skin until the abutting plate in the lifting member contacts and abuts against the edge skin. Subsequently, the first cutting unit is driven to rise along with the cutting support, and the edge skin lifting mechanism rises along with the cutting support, driving the edge skin to have an upward displacement relative to the silicon rod that has been cut once, so that the top end of the edge skin protrudes from the silicon rod. When the protruding part of the top end of the edge skin compared to the silicon rod meets the set condition, the rising of the cutting support can be controlled to stop. In this way, the top end of the edge skin can be used as the force application part for grasping, so that the edge skin is grasped and discharged. Then, while the cylinder drives the telescopic rod to contract to drive the lifting member back to the initial state, the cutting support is controlled to drive the first cutting unit and the edge skin lifting mechanism to continue rising above the silicon rod to prepare for the next cutting operation.

[0139] In other embodiments, the edge skin lifting mechanism may include a suction attachment and a telescopic member for driving the suction attachment to perform a telescopic motion. The suction attachment is controlled by the telescopic member to abut against the edge skin and adsorb the edge skin. The suction attachment may further include an abutment plate and an adsorption element. The abutment plate may be, for example, an arc-shaped plate adapted to the arc-shaped surface of the edge skin. When the abutment plate abuts against the edge skin, it can be in full contact with the arc-shaped surface of the edge skin. The adsorption element may be, for example, a vacuum suction cup. A plurality of vacuum suction cups may be disposed on the contact surface of the abutment plate that is to contact the edge skin. The telescopic member may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking the cylinder with a telescopic rod as an example, the telescopic rod may be connected to the abutment plate in the lifting member through a connection structure. The cylinder can drive the telescopic rod to contract to drive the abutment plate away from the edge skin, and the cylinder can drive the telescopic rod to extend to drive the abutment plate close to the edge skin. After the abutment plate contacts the edge skin, the adsorption element adsorbs the edge skin. Subsequently, the cutting support is driven to rise, and the edge skin lifting mechanism and the first cutting unit rise following the cutting support. The edge skin lifting mechanism can drive the edge skin to have an upward displacement relative to the silicon rod by using the adsorption force, so that the top end of the edge skin protrudes from the silicon rod.

[0140] In addition, the edge skin discharging device may further include a clamping and transporting unit, which is disposed above the machine base and is used to clamp the top end of the edge skin and lift the edge skin to separate it from the silicon rod and transport the edge skin to the edge skin discharging area.

[0141] In some embodiments, the clamping and transporting unit may include a moving mechanism for providing movement in at least one direction and an edge skin clamping mechanism. The edge skin clamping mechanism is connected to the moving mechanism and is driven to move in at least one direction.

[0142] The edge skin clamping mechanism may include a lifting drive structure and a clamping assembly disposed at the bottom of the lifting drive structure.

[0143] Among them, the lifting drive structure is used to drive the clamping assembly to perform a lifting motion. The lifting drive structure may be, for example, a lifting cylinder with a lifting rod. The lifting rod is connected to the clamping assembly. The lifting cylinder can be used to control the telescopic movement of the lifting rod to drive the clamping assembly to perform a lifting motion, but it is not limited thereto. For example, the lifting drive structure may also be a lead screw assembly driven by a motor. The lead screw assembly is connected to the clamping assembly, and the motor is used to drive the lead screw assembly to lift to drive the clamping assembly to perform a lifting motion.

[0144] The clamping assembly may include a cover body and a retractable clamping member. The retractable clamping member is disposed inside the cover body, and a clamping space for clamping the edge skin is formed between the clamping member and the cover body. In an embodiment, the cover body is used to cover the edge skin, and the size of the cover body that can be inserted is slightly larger than the cross-sectional circle of the silicon rod to be cut. The cover body is provided as a closed or non-closed circular cover, but is not limited thereto.

[0145] The structure of the clamping assembly is not limited thereto. In other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, and a clamping space for clamping the edge skin is formed between the clamping member and the arc-shaped plate.

[0146] In Figure 1 and Figure 2 In the silicon rod cutting and grinding integrated machine shown, the cutting device 2 includes: a cutting frame 21, a cutting support 22, a first cutting unit 23, and a second cutting unit 25. However, it is not limited thereto. In other embodiments, the cutting device of the silicon rod cutting and grinding integrated machine of the present application can still have other variations.

[0147] In some embodiments, the cutting device may include a first cutting device disposed at a first processing location of the silicon rod processing platform and a second cutting device disposed at a second processing location of the silicon rod processing platform. Among them, the first cutting device and the second cutting device are two independent devices.

[0148] The first cutting device includes: a first cutting frame, a first cutting support, and a first cutting unit.

[0149] The first cutting frame is disposed on the machine base. The first cutting frame is a columnar structure or a frame structure, and as the support main body of the first cutting device, it can provide support to other components in the first cutting device.

[0150] The first cutting support is movably lifted and lowered on the first cutting frame. In some embodiments, the first cutting support can be movably lifted and lowered on the first cutting frame through a lifting mechanism. The lifting mechanism may include a mechanism that can realize the vertical movement of the first cutting support, such as a lifting motor, a lifting guide rail, and a lifting slider. Among them, the lifting guide rail is vertically disposed on the first cutting frame, and the lifting slider is disposed on the back of the first cutting support and is matched with the lifting guide rail. To enable the first cutting support to stably lift and lower on the installation structure of the machine base, a double guide rail design can be adopted, that is, two lifting guide rails are used, and these two lifting guide rails are arranged in parallel. Driven by the lifting motor (the lifting motor can be, for example, a servo motor), the first cutting support can be lifted and lowered relative to the first cutting frame and the machine base by means of the lifting guide rail and the lifting slider.

[0151] The first cutting unit may include at least four first cutting wheels, and these four first cutting wheels can be combined into two orthogonal first cutting wheel groups. That is, two first cutting wheels arranged opposite to each other along the M axis form a first cutting wheel group, and two first cutting wheel groups along the N axis form a pair of first cutting wheel groups, where the M axis is orthogonal to the N axis. Specifically, the first cutting unit includes two orthogonal first cutting wheel groups. One first cutting wheel group includes two first cutting wheels arranged front and back (along the M axis), and the other first cutting wheel group includes two first cutting wheels arranged front and back (along the N axis).

[0152] The first cutting wire is sequentially wound around each first cutting wheel in the first cutting unit to form a first cutting wire mesh. In actual applications, the first cutting wire is sequentially wound around the four first cutting wheels in the first cutting unit to form two mutually orthogonal first cutting line segments, constituting the first cutting wire mesh. Specifically, the first cutting wire is wound around two first cutting wheels arranged front and back (along the M axis) in one first cutting wheel group to form a first cutting line segment, and the first cutting wire is wound around two first cutting wheels arranged front and back (along the N axis) in the other first cutting wheel group to form another second cutting line segment. In this way, these two mutually orthogonal first cutting line segments cooperate to form a first cutting wire mesh in the shape of "Γ".

[0153] Of course, in some embodiments, the arrangement positions, directions, and quantities of the first cutting wheels and the first cutting line segments in the first cutting unit can also be changed in other ways.

[0154] The second cutting device includes: a second cutting frame, a second cutting support, and a second cutting unit.

[0155] The second cutting frame is provided on the machine base. The second cutting frame is in a columnar structure or a frame structure and, as the support main body of the second cutting device, can provide support to other components in the second cutting device.

[0156] The second cutting support moves up and down movably on the second cutting frame. In some embodiments, the second cutting support can move up and down movably on the second cutting frame through a lifting mechanism. The lifting mechanism may include a mechanism that can realize the vertical movement of the second cutting support, such as a lifting motor, a lifting guide rail, and a lifting slider. Among them, the lifting guide rail is vertically arranged on the second cutting frame, and the lifting slider is arranged on the back of the second cutting support and cooperates with the lifting guide rail. To enable the second cutting support to achieve stable lifting on the machine base installation structure, a double-guide rail design can be adopted, that is, two lifting guide rails are used, and these two lifting guide rails are arranged in parallel. Driven by the lifting motor (the lifting motor can be, for example, a servo motor), the second cutting support can be made to move up and down relative to the first cutting frame and the machine base by means of the lifting guide rail and the lifting slider.

[0157] The second cutting unit may include at least four second cutting wheels, and these four second cutting wheels can be combined into two orthogonal second cutting wheel groups. That is, a second cutting wheel group is composed of two second cutting wheels arranged oppositely along the M axis, and a pair of second cutting wheel groups is composed of two second cutting wheel groups along the N axis. Among them, the M axis is orthogonal to the N axis. Specifically, the second cutting unit includes two orthogonal second cutting wheel groups. Among them, one first cutting wheel group includes two first cutting wheels arranged front and back (along the M axis), and the other first cutting wheel group includes two first cutting wheels arranged front and back (along the N axis).

[0158] The second cutting wire is sequentially wound around each second cutting wheel in the second cutting unit to form a second cutting wire mesh. In actual applications, the second cutting wire is sequentially wound around the four second cutting wheels in the second cutting unit to form two mutually orthogonal second cutting line segments, constituting the second cutting wire mesh. Specifically, the second cutting wire is wound around two second cutting wheels 253 arranged front and back (along the M axis) in a second cutting wheel group to form a second cutting line segment, and the second cutting wire is wound around two second cutting wheels arranged front and back (along the N axis) in another second cutting wheel group to form another second cutting line segment. In this way, these two mutually orthogonal second cutting line segments cooperate to form a second cutting wire mesh in the shape of "Γ".

[0159] Of course, in some embodiments, the arrangement positions, directions, and quantities of the second cutting wheels and second cutting line segments in the second cutting unit can also be changed in other ways.

[0160] The grinding device 3 is arranged on the machine base 1 and is used for grinding the square silicon rod that has been completed the squaring cutting at the third processing position of the silicon rod processing platform. In this embodiment, the grinding operation includes grinding the surface and chamfering.

[0161] The grinding device 3 has an accommodation space for receiving the silicon rod that has been completed the squaring cutting and has been transferred from the second processing position to the third processing position through the silicon rod conversion device 4. The grinding device 3 mainly includes a grinding machine frame 31 and at least a pair of grinding tools 33. The at least a pair of grinding tools 33 are arranged oppositely on the grinding machine frame 31 and are used for grinding the silicon rod that has been completed the squaring cutting at the third processing position.

[0162] In this embodiment, the cross-section of the silicon rod that has been completed the squaring cutting is square (the whole silicon rod is in the shape of a quasi-rectangular body), with four vertical cutting surfaces and four connecting edge surfaces. Therefore, the grinding tools 33 are at least a pair of relatively arranged ones, and there is an accommodation space between them for accommodating the silicon rod 200. When the silicon rod 200 is transferred to the third processing position and located in the accommodation space between the at least a pair of grinding tools 33, the at least a pair of grinding tools 33 can contact a pair of opposite vertical cutting surfaces or a pair of connecting edge surfaces of the silicon rod 200, and then move up and down for grinding.

[0163] Among them, the grinding frame 31 can be slidably arranged on the machine base 1 through a sliding mechanism. In this embodiment, the sliding mechanism can achieve sliding in at least one direction. For example, the sliding mechanism can achieve the sliding of the grinding frame 31 along the first direction (such as Figure 2 shown in the X-axis direction). Specifically, the sliding mechanism can include a first-direction slide rail, a first-direction slider or slide bar corresponding to the first-direction slide rail, and a first-direction driving source. The first-direction driving source can be, for example, a driving motor.

[0164] The grinding tool 33 can be slidably arranged on the grinding frame 31 through a sliding mechanism.

[0165] In some embodiments, at least a pair of grinding tools 33 in the grinding device 3 are independently arranged. Taking a pair of grinding tools 33 as an example, the two grinding tools 33 are respectively slidably arranged on the grinding frame 31 through their respective sliding mechanisms, where the sliding mechanism can achieve sliding in at least two directions. Specifically, the sliding mechanism can include a first-direction sliding unit and a second sliding unit. Among them, the first-direction sliding unit is an up-and-down sliding unit, including an up-and-down guide rail arranged on the grinding frame 31, an up-and-down slider or slide bar arranged on a movable mounting bracket, and an up-and-down driving source. The up-and-down driving source can be, for example, a driving motor. The second-direction sliding unit includes a second-direction guide rail arranged on the movable mounting bracket (the second direction is the Y-axis direction as Figure 2 shown), a second-direction slider or slide bar arranged on the grinding tool 33, and a second-direction driving source. The second-direction driving source can be, for example, a driving motor.

[0166] In some embodiments, at least a pair of grinding tools 33 in the grinding device 3 are jointly arranged. Taking a pair of grinding tools 33 as an example, the two grinding tools 33 are slidably arranged on the grinding frame 31 through a sliding mechanism, where the sliding mechanism can achieve sliding in at least two directions. Specifically, the sliding mechanism can include a first-direction sliding unit and a second sliding unit. Among them, the first-direction sliding unit is an up-and-down sliding unit, including an up-and-down guide rail arranged on the grinding frame 31, an up-and-down slider or slide bar arranged on a common movable mounting bracket, and an up-and-down driving source. The up-and-down driving source can be, for example, a driving motor. The two grinding tools 33 are slidably arranged on the common movable mounting bracket through the second-direction sliding unit. The second-direction sliding unit includes a second-direction guide rail arranged on the common movable mounting bracket (the second direction is the Y-axis direction as Figure 2 shown), a second-direction slider or slide bar arranged on the grinding tool 33, and a second-direction driving source. The second-direction driving source can be, for example, a driving motor.

[0167] In this embodiment, the grinding frame 31 can be slidably disposed on the machine base 1 through a sliding mechanism to realize the advancement and retreat of the grinding frame 31, that is, approaching or departing from the silicon rod. The grinding tool 33 can be slidably disposed on the grinding frame 31 through a first-direction sliding mechanism to realize the lifting of the grinding tool 33. The grinding tool 33 can also be slidably disposed on the grinding frame 31 through a second-direction sliding mechanism to realize the advancement and retreat of the grinding tool 33, that is, approaching or departing from the silicon rod, so as to control the grinding amount of the silicon rod.

[0168] In some embodiments, the grinding tool may include a main shaft and at least one grinding wheel, wherein at least one grinding wheel is disposed at the working end of the main shaft.

[0169] Specifically, as Figure 2 shown, in this embodiment, each grinding tool 33 in the grinding device 3 has a double-head structure. Specifically, each grinding tool includes: a rotatable chassis; a double-head main shaft 332 disposed on the rotatable chassis, a rough grinding wheel 331 is provided at the first end of the double-head main shaft 332, and a fine grinding wheel 333 is provided at the second end of the double-head main shaft 332; a driving motor for driving the rotatable chassis to rotate so that the rough grinding wheel 331 and the fine grinding wheel 333 in the double-head main shaft 332 are swapped positions. In practical applications, during grinding, first, the rough grinding wheel 331 of the double-head main shaft 332 in at least one pair of grinding tools 33 in the grinding device 3 is used to perform rough grinding on the silicon rod 200 that has completed squaring cutting. After that, the rotatable chassis is driven to rotate so that the rough grinding wheel 331 and the fine grinding wheel 333 in the double-head main shaft 332 are swapped positions, and the fine grinding wheel 333 of the double-head main shaft 332 in at least one pair of grinding tools 33 in the grinding device 3 is used to perform fine grinding on the silicon rod 200 that has completed squaring cutting. Among them, the rough grinding operation may include rough grinding the vertical cutting surface and rough chamfering the connecting edge surface of the silicon rod 200 that has completed squaring cutting, and the fine grinding operation may include fine grinding the vertical cutting surface and fine chamfering the connecting edge surface of the silicon rod 200 that has completed squaring cutting.

[0170] Taking the rough grinding of the vertical section of the silicon rod 200 that has completed square cutting as an example: First, use the silicon rod conversion device 4 to convert the silicon rod from the second processing position to the third processing position, and the silicon rod positioning mechanism 43 positions and adjusts the silicon rod 200, so that the grinding machine frame 31 moves relative to the silicon rod 200 along the first direction (i.e., along the X-axis direction) with respect to the machine base 1, so that the silicon rod 200 is located between two grinding tools 33 of a pair of grinding tools 33, that is, the first pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; make the grinding tool 33 feed along the second direction (i.e., along the Y-axis direction) relative to the grinding machine frame 31 according to the feed amount, rotate the rough grinding wheel 331 in the grinding tool 33 and drive the grinding tool 33 to move up and down to rough grind the first pair of vertical sections in the silicon rod 200; drive the silicon rod 200 to rotate forward (or reversely) by 90° by the rotating carrier table 431 in the silicon rod positioning mechanism 43, so that the second pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3, rotate the rough grinding wheel 331 in the grinding tool 33 and drive the grinding tool 33 to move up and down to rough grind the second pair of vertical sections in the silicon rod 200.

[0171] Among them, the rough grinding operation of any pair of vertical sections may include, for example: providing a feed amount, driving the rough grinding wheel 331 in a pair of grinding tools 33 to move downward from top to bottom to grind a pair of vertical sections of the silicon rod; after a pair of rough grinding wheels 331 grind to the bottom of the silicon rod and pass through the silicon rod and stay at the lower limit position, increasing the feed amount by one, driving a pair of rough grinding wheels 331 to move upward from bottom to top to grind the silicon rod; after a pair of rough grinding wheels 331 grind to the top of the silicon rod and pass through the silicon rod and stay at the upper limit position, continuing to increase the feed amount by one, driving a pair of rough grinding wheels 331 to move downward from top to bottom to grind the silicon rod; thus, grinding, increasing the feed amount, reverse grinding, increasing the feed amount, after repeating several times, a pair of vertical sections of the silicon rod can be ground to a preset size.

[0172] Taking the rough chamfering of the vertical section of the silicon rod 200 that has completed square cutting as an example: Initially, when the silicon rod transfer device 4 transfers the silicon rod 200 to the first processing position, the vertical section of the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3. Therefore, the positioning adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 can, for example, include driving the silicon rod 200 to rotate forward (or backward) by 45°, so that the first pair of connecting edges in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; making the grinding machine frame 31 move relative to the silicon rod 200 along the first direction (i.e., along the X-axis direction) relative to the machine base 1, so that the silicon rod 200 is located between the two grinding tools 33 of a pair of grinding tools 33, that is, the first pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; making the grinding tool 33 feed along the second direction (i.e., along the Y-axis direction) relative to the grinding machine frame 31 according to the feed amount, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first rough cutting on the first pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the second rough cutting on the first pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 80° by the silicon rod positioning mechanism 43, so that the second pair of connecting edges in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first rough cutting on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the second rough cutting on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the third rough cutting on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 80° by the silicon rod positioning mechanism 43, rotating the rough grinding wheel 331 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the third rough cutting on the first pair of connecting edges in the silicon rod 200.

[0173] It should be particularly noted that in the rough chamfering operation of the foregoing connecting edges, driving the first silicon rod 101 to rotate by a corresponding angle by the first silicon rod positioning mechanism 53, for example: driving the first silicon rod 101 to rotate forward by 5° by the first silicon rod positioning mechanism 53 is not the only implementation method. In other alternative embodiments, the angle can be adaptively adjusted, for example, to be from 3° to 7°, including 3°, 4°, 5°, 6°, 7° or other angles. Correspondingly, in the case of driving the first silicon rod 101 to rotate forward by 80° by the first silicon rod positioning mechanism 53, the angle is adaptively adjusted.

[0174] Taking the fine grinding of the vertical section of the silicon rod 200 that has completed square cutting as an example: First, use the silicon rod conversion device 4 to convert the silicon rod from the second processing position to the third processing position. The silicon rod positioning mechanism 43 positions and adjusts the silicon rod 200, and makes the grinding machine frame 31 move relative to the machine base 1 along the first direction (i.e., along the X-axis direction) towards the silicon rod 200, so that the silicon rod 200 is located between the two grinding tools 33 of a pair of grinding tools 33. That is, the first pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3. Make the grinding tool 33 feed along the second direction (i.e., along the Y-axis direction) relative to the grinding machine frame 31 according to the feed amount, rotate the fine grinding wheel 333 in the grinding tool 33 and drive the grinding tool 33 to move up and down to finely grind the first pair of vertical sections in the silicon rod 200. Drive the silicon rod 200 to rotate forward (or reversely) by 90° by the rotating carrier 431 in the silicon rod positioning mechanism 43, so that the second pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3. Rotate the fine grinding wheel 333 in the grinding tool 33 and drive the grinding tool 33 to move up and down to finely grind the second pair of vertical sections in the silicon rod 200.

[0175] Among them, the fine grinding operation of any pair of vertical sections may, for example, include: providing a feed amount, driving the fine grinding wheel 333 in a pair of grinding tools 33 to move from top to bottom to grind a pair of vertical sections of the silicon rod; after a pair of fine grinding wheels 333 grind to the bottom of the silicon rod and pass through the silicon rod and stay at the lower limit position, increase the feed amount by one, and drive a pair of fine grinding wheels 333 to move from bottom to top to grind the silicon rod; after a pair of fine grinding wheels 333 grind to the top of the silicon rod and pass through the silicon rod and stay at the upper limit position, continue to increase the feed amount by one, and drive a pair of fine grinding wheels 333 to move from top to bottom to grind the silicon rod; thus, grind, increase the feed amount, grind in the reverse direction, increase the feed amount, and after repeating several times, a pair of vertical sections of the silicon rod can be ground to a preset size.

[0176] Taking the example of precision chamfering the vertical section of the silicon rod 200 that has completed square cutting: Initially, when the silicon rod transfer device 4 transfers the silicon rod 200 to the first processing position, the vertical section of the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3. Therefore, the positioning adjustment of the silicon rod 200 by the silicon rod positioning mechanism 43 can, for example, include driving the silicon rod 200 to rotate forward (or backward) by 45°, so that the first pair of connecting edges in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; making the grinding machine frame 31 move relative to the base 1 along the first direction (i.e., along the X-axis direction) towards the silicon rod 200, so that the silicon rod 200 is located between the two grinding tools 33 of a pair of grinding tools 33, that is, the first pair of vertical sections in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3; making the grinding tool 33 feed along the second direction (i.e., along the Y-axis direction) relative to the grinding machine frame 31 according to the feed amount, rotating the precision grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first precision cutting on the first pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the precision grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the second precision cutting on the first pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 80° by the silicon rod positioning mechanism 43, so that the second pair of connecting edges in the silicon rod 200 corresponds to a pair of grinding tools 33 in the grinding device 3, rotating the precision grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the first precision cutting on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the precision grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the second precision cutting on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 5° by the silicon rod positioning mechanism 43, rotating the precision grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the third precision cutting on the second pair of connecting edges in the silicon rod 200; driving the silicon rod 200 to rotate forward by 80° by the silicon rod positioning mechanism 43, rotating the precision grinding wheel 333 in the grinding tool 33 and driving the grinding tool 33 to move up and down to perform the third precision cutting on the first pair of connecting edges in the silicon rod 200.

[0177] It should be noted that the above is only an exemplary description and is not used to limit the protection scope of the present application. For example, in the description of the grinding operation of the grinding device, the grinding operation of the silicon rod is performed first and then the chamfering operation of the polysilicon rod is performed, but it is not limited to this. In other embodiments, it is also feasible to perform the chamfering operation of the silicon rod first and then the grinding operation of the silicon rod, and it should still fall within the protection scope of the present application.

[0178] Subsequently, after the silicon rod 200 undergoes grinding operation by the grinding device 3, the silicon rod conversion device 4 converts the silicon rod 200 from the third processing location to the waiting location, and then the silicon rod loading and unloading device unloads the processed silicon rod from the waiting location of the silicon rod processing platform. Of course, before unloading the silicon rod 200, if necessary, at the waiting location, the detection device can detect the silicon rod 200 after the processing operation. For example, a flatness detector can be used to detect the planar flatness of the silicon rod. By using the flatness detector, on the one hand, it can be used to check whether the silicon rod meets the product requirements after passing through each processing operation to determine the effect of each processing operation by detecting the planar flatness of the silicon rod 200; on the other hand, by detecting the planar flatness of the silicon rod 200, the wear condition of the processing components in each processing device can also be indirectly obtained, so as to facilitate real-time calibration or correction, and even maintenance or replacement.

[0179] Furthermore, in the cutting and grinding integrated machine of the present application, in an alternative embodiment, a silicon rod cleaning device may also be included. The silicon rod cleaning device can be arranged on the machine base and is used for cleaning the silicon rod. For the silicon rod cleaning device, generally, after the silicon rod undergoes the above-mentioned processing operations, cutting debris generated during the operation process will adhere to the surface of the silicon rod. Therefore, if necessary, the silicon rod needs to be cleaned as required. Generally, the silicon rod cleaning device includes a cleaning brush head and a cleaning liquid spraying device cooperating with the cleaning brush head. During cleaning, the cleaning liquid spraying device sprays cleaning liquid onto the silicon rod, and at the same time, the cleaning brush head is driven by a motor to act on the silicon rod to complete the cleaning operation. In practical applications, the cleaning liquid can be, for example, pure water, and the cleaning brush head can be, for example, a rotary brush head.

[0180] In addition, it should be particularly noted that for the cutting and grinding integrated machine of the present application, if the corresponding processing devices are increased or decreased, then the functional locations on the silicon rod processing platform and the number and positional relationship of the silicon rod positioning mechanisms on the conveying body need to be adjusted accordingly.

[0181] In some embodiments, it is assumed that the multi-station processing machine for silicon rods eliminates the waiting area, and the silicon rod conversion device also correspondingly reduces one silicon rod positioning mechanism. Further, preferably, the angles set between any two of these three silicon rod positioning mechanisms are also consistent with the angular distribution between any two of the three functional areas. Thus, when a certain silicon rod positioning mechanism corresponds to a certain functional area, the other two silicon rod positioning mechanisms also respectively correspond to the other two functional areas. In this way, in the flow operation, at any moment, when each silicon rod positioning mechanism has a silicon rod positioned thereon and the silicon rod positioning mechanism corresponds to the functional area, these silicon rods are located at the corresponding functional area to perform the corresponding processing operations. In an alternative embodiment, the three functional areas on the silicon rod processing platform are distributed at 120° to each other. Therefore, correspondingly, the four silicon rod positioning mechanisms on the disk-shaped or annular conveying body are also distributed at 120° to each other.

[0182] Moreover, for the cutting and grinding integrated machine of the present application, it should be particularly noted that if a corresponding processing device is added to the cutting and grinding integrated machine, then the number and positional relationship of the functional areas on the silicon rod processing platform and the silicon rod positioning mechanisms on the conveying body need to be adjusted accordingly. Assume that a processing device is added to the multi-station processing machine for silicon rods, a corresponding functional area will be added to the silicon rod processing platform and a silicon rod positioning mechanism will also be added to the silicon rod conversion device. Further, preferably, the angles set between any two of these five silicon rod positioning mechanisms are also consistent with the angular distribution between any two of the five functional areas. Thus, when a certain silicon rod positioning mechanism corresponds to a certain functional area, the other four silicon rod positioning mechanisms also respectively correspond to the other four functional areas. In this way, in the flow operation, at any moment, when each silicon rod positioning mechanism has a silicon rod positioned thereon and the silicon rod positioning mechanism corresponds to the functional area, these silicon rods are located at the corresponding functional area to perform the corresponding processing operations. In an alternative embodiment, the five functional areas on the silicon rod processing platform are distributed at 72° to each other. Therefore, correspondingly, the four silicon rod positioning mechanisms on the disk-shaped or annular conveying body are also distributed at 72° to each other.

[0183] The silicon rod cutting and grinding integrated machine disclosed in the present application integrates a cutting device and a grinding device, and can use the silicon rod conversion device to transfer the silicon rod orderly and seamlessly between various processing devices, and use the cutting device to perform squaring cutting on the silicon rod to form a square silicon rod and use the grinding device to grind the square silicon rod after squaring cutting, so as to complete the integrated operation of multiple processes of squaring and grinding of the silicon rod, improving the production efficiency and the quality of the product processing operation.

[0184] The present application discloses a silicon rod cutting and grinding method, which is applied to a silicon rod cutting and grinding integrated machine.

[0185] In some embodiments, such as Figure 2 shown, the integrated silicon rod cutting and grinding machine includes a base with a silicon rod processing platform. The silicon rod processing platform is provided with a waiting area, a first processing area, a second processing area, and a third processing area. The integrated silicon rod cutting and grinding machine further includes a cutting device, a grinding device, and a silicon rod conversion device. The waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are adjacent to each other in a 90° distribution. In this embodiment, it is assumed that the direction following the order of the waiting area, the first processing area, the second processing area, and the third processing area is defined as the positive direction.

[0186] The silicon rod cutting and grinding method of the present application may at least include the following steps:

[0187] Step S101, loading a first silicon rod onto the waiting area and preprocessing the first silicon rod. In this embodiment, in step S101, a silicon rod transfer device is used to transfer the first silicon rod to be processed to the waiting area of the silicon rod processing platform.

[0188] Specifically, reference can be made to Figure 7 and Figure 8 , and the silicon rod transfer device 6 can be used to transfer the first silicon rod 100 to be processed to the waiting area of the silicon rod platform. The specific method of using the silicon rod transfer device 6 to transfer the first silicon rod 100 to be processed to the waiting area of the silicon rod platform can be seen in the previous description and will not be elaborated here.

[0189] In addition, the preprocessing may include using a positioning and detection device to perform ridge line detection and center positioning on the first silicon rod located in the waiting area.

[0190] Step S103, making the silicon rod conversion device rotate a first preset angle to convert the first silicon rod from the waiting area to the first processing area, and making the cutting device perform a first bevel cutting on the first silicon rod in the first processing area. At this stage, a second silicon rod is loaded onto the waiting area and preprocessed.

[0191] In step S103, since the angle between the waiting area and the first processing area is 90°, therefore, the first preset angle for making the silicon rod conversion device rotate is to make the silicon rod conversion device rotate 90° in the positive direction.

[0192] Specifically, reference can be made to Figure 8 and Figure 9 , making the silicon rod conversion device 4 rotate 90° in the positive direction (i.e., Figure 8 the clockwise arrow in Figure 8 ), and converting the first silicon rod 100 to be processed from the waiting area in Figure 9 to the first processing area in

[0193] Thus, the cutting device 2 in the embodiment shown in Figure 9 can be used to cut the first silicon rod 100 at the first processing location.

[0194] When using the cutting device 2 in the embodiment shown in Figure 9 to cut the first silicon rod 100 at the first processing location, in combination with Figure 1 , drive the cutting support 22 to descend relative to the cutting frame 21, and use the first cutting unit 23 on one side of the cutting support 22 to perform a first bevel cut on the first silicon rod 100 at the first processing location (the first cutting unit 23 is provided with a first cutting wire mesh in a "Γ" shape).

[0195] As for loading the second silicon rod 102 at the waiting location and preprocessing the second silicon rod 102, reference can be made to the description of the first silicon rod 100 in step S101, which will not be elaborated here.

[0196] Step S105: Rotate the silicon rod conversion device by a first preset angle to convert the first silicon rod from the first processing location to the second processing location and convert the second silicon rod from the waiting location to the first processing location, and make the cutting device perform a second bevel cut on the first silicon rod at the second processing location and a first bevel cut on the second silicon rod at the first processing location. At this stage, load the third silicon rod at the waiting location and preprocess the third silicon rod.

[0197] In step S105, since the waiting location, the first processing location, and the second processing location of the silicon rod processing platform are sequentially 90° apart, therefore, the first preset angle for rotating the silicon rod conversion device is to make the silicon rod conversion device rotate forward 90°.

[0198] Specifically, refer to Figure 9 and Figure 10 , make the silicon rod conversion device 4 rotate forward (i.e., the clockwise arrow in Figure 9 ) 90°, convert the first silicon rod 100 from the first processing location to the second processing location and convert the second silicon rod 102 from the waiting location to the first processing location.

[0199] Thus, the cutting device 2 in the embodiment shown in Figure 10 can be used to cut the first silicon rod 100 at the second processing location of the silicon rod processing platform and the second silicon rod 102 at the first processing location.

[0200] When using the cutting device 2 in the embodiment shown in Figure 10 to cut the second silicon rod 102 at the first processing location of the silicon rod processing platform and the second silicon rod 100 at the first processing location, in combination with Figure 1, drive the cutting support 22 to descend relative to the cutting frame 21, and simultaneously cut the second silicon rod 102 in the corresponding first processing area and the first silicon rod 100 in the second processing area by the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22. Among them, the first cutting unit 23 performs a first fold surface cutting on the second silicon rod 102 in the first processing area (the first cutting unit 23 is provided with a first cutting wire mesh in a "Γ" shape), and the second cutting unit 25 performs a second fold surface cutting on the first silicon rod 100 in the second processing area (the second cutting unit 25 is provided with a second cutting wire mesh in a "Γ" shape). It should be noted that, before using the second cutting unit 25 to perform the second fold surface cutting on the first silicon rod 100 in the second processing area, due to the aforementioned fold surface cutting problem, it is also necessary to drive the first silicon rod to rotate forward or reversely by 180° by the silicon rod positioning mechanism in the silicon rod conversion device 6 to adjust the cutting surface. In this way, after the first silicon rod 100 in the second processing area is subjected to the second fold surface cutting by the second cutting unit 25, a silicon rod with an overall square shape is formed.

[0201] As for loading the third silicon rod 104 on the waiting area and preprocessing the third silicon rod 104, reference can be made to the description of the first silicon rod 100 in step S101, which will not be elaborated here.

[0202] Step S107, make the silicon rod conversion device rotate a first preset angle to convert the first silicon rod from the second processing area to the third processing area, convert the second silicon rod from the first processing area to the second processing area, convert the third silicon rod from the waiting area to the first processing area, and make the grinding device perform surface grinding and chamfering on the first silicon rod in the third processing area. At this stage, make the cutting device perform a second fold surface cutting on the second silicon rod in the second processing area and a first fold surface cutting on the third silicon rod in the first processing area. At the same time, load the fourth silicon rod on the waiting area and preprocess the fourth silicon rod.

[0203] In step S107, since the waiting area, the first processing area, the second processing area, and the third processing area of the silicon rod processing platform differ by 90° in sequence, the first preset angle for making the silicon rod conversion device rotate is to make the silicon rod conversion device rotate forward by 90°.

[0204] Specifically, refer to Figures 10 to 12 , make the silicon rod conversion device 4 rotate forward (i.e., Figure 10 the clockwise arrow in Figure 11 is shown as Figure 10 and Figure 12The intermediate process, i.e., it is shown as Figure 10 in the state diagram of the silicon rod conversion device in the silicon rod cutting and grinding integrated machine in Figure 10 rotating 45° in the positive direction (i.e., the clockwise arrow in

[0205] In this way, the grinding device 3 in the embodiment shown in Figure 12 can be used to grind the first silicon rod 100 on the third processing area of the silicon rod processing platform. For the specific method of using the grinding device 3 to grind the first silicon rod 100 on the third processing area of the silicon rod processing platform, reference can be made to the previous description and will not be elaborated here.

[0206] Meanwhile, the cutting device 2 in the embodiment shown in Figure 12 can be used to cut the third silicon rod 104 on the first processing area and the second silicon rod 102 on the second processing area of the silicon rod processing platform.

[0207] When using the cutting device 2 in the embodiment shown in Figure 12 to cut the third silicon rod 104 on the first processing area and the second silicon rod 102 on the second processing area of the silicon rod processing platform, in combination with Figure 1 , the cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the corresponding third silicon rod 104 on the first processing area and the second silicon rod 102 on the second processing area. Among them, the first cutting unit 23 performs a first fold surface cutting on the third silicon rod 104 on the first processing area (the first cutting unit 23 is provided with a first cutting wire mesh in a "Γ" shape), and the second cutting unit 25 performs a second fold surface cutting on the second silicon rod 102 on the second processing area (the second cutting unit 25 is provided with a second cutting wire mesh in a "Γ" shape). It should be noted that before using the second cutting unit 25 to perform the second fold surface cutting on the second silicon rod 102 on the second processing area, due to the aforementioned fold surface cutting problem, the silicon rod positioning mechanism 43 in the silicon rod conversion device 6 is also required to drive the second silicon rod 102 to rotate 180° in the positive or reverse direction to adjust the cutting surface. In this way, after the second silicon rod 102 on the second processing area is subjected to the second fold surface cutting by the second cutting unit 25, a silicon rod with an overall square shape is formed.

[0208] As for loading the fourth silicon rod 106 on the waiting area for preprocessing of the fourth silicon rod 106, reference can be made to the description of the first silicon rod 100 in step S101 and will not be elaborated here.

[0209] In step S109, rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing position to the waiting position, transfer the second silicon rod from the second processing position to the third processing position, transfer the third silicon rod from the first processing position to the second processing position, transfer the fourth silicon rod from the waiting position to the first processing position, unload the first silicon rod from the waiting position and load the fifth silicon rod, and perform preprocessing on the fifth silicon rod. At this stage, the grinding device is used to grind the surface and chamfer the second silicon rod at the third processing position, and the cutting device is used to perform a second chamfer cutting on the third silicon rod at the second processing position and a first chamfer cutting on the fourth silicon rod at the first processing position.

[0210] In step S109, since the waiting position, the first processing position, the second processing position, and the third processing position of the silicon rod processing platform are sequentially different by 90°, therefore, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 90° or reverse by 270°. Among them, rotating the silicon rod conversion device reverse by 270° can make the silicon rod conversion device return to the initial position and release the cable wound during the forward rotation.

[0211] For details, please refer to Figure 12 and Figure 13 , rotate the silicon rod conversion device 4 in the reverse direction (i.e., the counterclockwise arrow in Figure 10 ) by 270°, transfer the first silicon rod 100 from the third processing position to the waiting position, transfer the second silicon rod 102 from the second processing position to the third processing position, transfer the third silicon rod 104 from the first processing position to the second processing position, and transfer the fourth silicon rod 106 from the waiting position to the first processing position.

[0212] In this way, the processed first silicon rod 100 at the waiting position can be transferred out of the silicon rod processing platform by the silicon rod transfer device 6, and the fifth silicon rod 108 to be processed can be transferred to the waiting position of the silicon rod processing platform (as shown in Figure 14 ).

[0213] Meanwhile, the grinding device 3 in the embodiment shown in Figure 13 can be used to perform a grinding operation on the second silicon rod 102 at the third processing position of the silicon rod processing platform. The specific method of using the grinding device 3 to perform a grinding operation on the second silicon rod 102 at the third processing position of the silicon rod processing platform can be seen in the previous description and will not be elaborated here.

[0214] Meanwhile, the cutting device 2 in the embodiment shown in Figure 13 can be used to cut the fourth silicon rod 106 at the first processing position and the third silicon rod 104 at the second processing position of the silicon rod processing platform.

[0215] When usingFigure 13 When the cutting device 2 in the illustrated embodiment cuts the fourth silicon rod 106 at the first processing location of the silicon rod processing platform and the third silicon rod 104 at the second processing location, in combination with Figure 1 , the cutting support 22 is driven to descend relative to the cutting frame 21, and the first cutting unit 23 and the second cutting unit 25 on the left and right sides of the cutting support 22 simultaneously cut the fourth silicon rod 106 at the corresponding first processing location and the third silicon rod 104 at the second processing location. Among them, the first cutting unit 23 performs a first folded surface cutting on the fourth silicon rod 106 at the first processing location (the first cutting unit 23 is provided with a first cutting wire mesh in a "Γ" shape), and the second cutting unit 25 performs a second folded surface cutting on the third silicon rod 104 at the second processing location (the second cutting unit 25 is provided with a second cutting wire mesh in a "Γ" shape). It should be noted that, before using the second cutting unit 25 to perform the second folded surface cutting on the third silicon rod 104 at the second processing location, due to the aforementioned problem of folded surface cutting, it is also necessary to drive the third silicon rod 104 to rotate forward or reversely by 180° by the silicon rod positioning mechanism 43 in the silicon rod conversion device 4 to adjust the cutting surface. In this way, after the third silicon rod 104 located at the second processing location is subjected to the second folded surface cutting by the second cutting unit 25, a silicon rod with an overall square shape is formed.

[0216] In some embodiments, the silicon rod cutting and grinding integrated machine includes a machine base having a silicon rod processing platform. The silicon rod processing platform is provided with a first processing location, a second processing location, and a third processing location. The silicon rod cutting and grinding integrated machine further includes a cutting device, a grinding device, and a silicon rod conversion device. The first processing location, the second processing location, and the third processing location on the silicon rod processing platform are distributed at 120° to each other in pairs and adjacent to each other. In this embodiment, it is assumed that the direction of the order of the first processing location, the second processing location, and the third processing location is defined as the positive direction.

[0217] The silicon rod cutting and grinding method of the present application may at least include the following steps:

[0218] Step S201: Load the first silicon rod onto the first processing location and cause the cutting device to perform a first folded surface cutting on the first silicon rod at the first processing location.

[0219] In this embodiment, in step S201, the silicon rod transfer device is used to transfer the first silicon rod to be processed to the first processing location of the silicon rod processing platform.

[0220] When using the cutting device to cut the first silicon rod at the first processing location, the cutting support is driven to descend relative to the cutting frame, and the first cutting unit on the left and right sides of the cutting support performs a first folded surface cutting on the first silicon rod at the first processing location (the first cutting unit is provided with a first cutting wire mesh in a "Γ" shape).

[0221] In step S203, rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the first processing position to the second processing position and transfer the second silicon rod to the first processing position, and make the cutting device perform second bevel cutting on the first silicon rod at the second processing position and perform first bevel cutting on the second silicon rod at the first processing position.

[0222] In step S203, since the waiting position and the first processing position form an angle of 120°, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 120°.

[0223] When using the cutting device to cut the second silicon rod on the first processing position of the silicon rod processing platform and the second silicon rod on the first processing position, drive the cutting support to descend relative to the cutting frame, and simultaneously cut the second silicon rod on the corresponding first processing position and the first silicon rod on the second processing position by the first cutting unit and the second cutting unit on the left and right sides of the cutting support. Among them, the first cutting unit performs first bevel cutting on the second silicon rod on the first processing position (the first cutting unit is provided with a first cutting wire mesh in a "Γ" shape), and the second cutting unit performs second bevel cutting on the first silicon rod on the second processing position (the second cutting unit is provided with a second cutting wire mesh in a "Γ" shape). It should be noted that before using the second cutting unit to perform second bevel cutting on the first silicon rod on the second processing position, due to the aforementioned bevel cutting problem, it is also necessary to drive the first silicon rod to rotate forward or backward by 180° by the silicon rod positioning mechanism in the silicon rod conversion device to adjust the cutting surface.

[0224] In step S205, rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the second processing position to the third processing position, transfer the second silicon rod from the first processing position to the second processing position, and transfer the third silicon rod to the first processing position, and make the grinding device perform surface grinding and chamfering on the first silicon rod at the third processing position. At this stage, make the cutting device perform second bevel cutting on the second silicon rod at the second processing position and perform first bevel cutting on the third silicon rod at the first processing position.

[0225] In step S205, since the first processing position, the second processing position, and the second processing position of the silicon rod processing platform differ by 90° in sequence, the first preset angle for rotating the silicon rod conversion device is to rotate the silicon rod conversion device forward by 90°.

[0226] The grinding device can be used to perform grinding operations on the first silicon rod at the third processing position of the silicon rod processing platform.

[0227] When using the cutting device to cut the third silicon rod on the first processing area and the second silicon rod on the second processing area of the silicon rod processing platform, drive the cutting support to descend relative to the cutting frame, and use the first cutting unit and the second cutting unit on the left and right sides of the cutting support to simultaneously cut the corresponding third silicon rod on the first processing area and the second silicon rod on the second processing area. Among them, the first cutting unit performs a first fold surface cutting on the third silicon rod on the first processing area (the first cutting unit is provided with a first cutting wire mesh in a "Γ" shape), and the second cutting unit performs a second fold surface cutting on the second silicon rod on the second processing area (the second cutting unit is provided with a second cutting wire mesh in a "Γ" shape). It should be noted that before using the second cutting unit to perform the second fold surface cutting on the second silicon rod on the second processing area, due to the aforementioned fold surface cutting problem, it is also necessary to use the silicon rod positioning mechanism in the silicon rod conversion device to drive the second silicon rod to rotate forward or backward by 90° to adjust the cutting surface.

[0228] Step S207: Make the silicon rod conversion device rotate by a second preset angle to transfer the first silicon rod from the third processing area to the first processing area, transfer the second silicon rod from the second processing area to the third processing area, transfer the third silicon rod from the first processing area to the second processing area, unload the first silicon rod from the first processing area and load the fourth silicon rod, and make the cutting device perform a first fold surface cutting on the fourth silicon rod on the first processing area. At this stage, make the grinding device perform surface grinding and chamfering on the second silicon rod on the third processing area, and make the cutting device perform a second fold surface cutting on the third silicon rod on the second processing area.

[0229] In step S207, since the first processing area, the second processing area, and the third processing area of the silicon rod processing platform differ by 120° in sequence, the first preset angle for making the silicon rod conversion device rotate is to make the silicon rod conversion device rotate forward by 120° or rotate backward by 240°. Among them, making the silicon rod conversion device rotate backward by 240° can make the silicon rod conversion device return to the initial position and release the cable wound during the forward rotation process.

[0230] In step S207, the processed first silicon rod on the first processing area can be transferred out of the silicon rod processing platform by using the silicon rod transfer device, and the fourth silicon rod to be processed can be transferred to the waiting area of the silicon rod processing platform.

[0231] The grinding device can be used to perform a grinding operation on the second silicon rod on the third processing area of the silicon rod processing platform.

[0232] When using the cutting device to cut the fourth silicon rod on the first processing area of the silicon rod processing platform and the third silicon rod on the second processing area, the driving cutting support is lowered relative to the cutting frame, and the first cutting unit and the second cutting unit on the left and right sides of the cutting support simultaneously cut the corresponding fourth silicon rod on the first processing area and the third silicon rod on the second processing area. Among them, the first cutting unit performs a first fold surface cutting on the fourth silicon rod on the first processing area (the first cutting unit is provided with a first cutting wire mesh in a "Γ" shape), and the second cutting unit performs a second fold surface cutting on the third silicon rod on the second processing area (the second cutting unit 25 is provided with a second cutting wire mesh in a "Γ" shape). It should be noted that before using the second cutting unit to perform the second fold surface cutting on the third silicon rod on the second processing area, due to the aforementioned fold surface cutting problem, it is also necessary to use the silicon rod positioning mechanism 43 in the silicon rod conversion device to drive the third silicon rod to rotate 90° forward or backward to adjust the cutting surface.

[0233] The silicon rod cutting and grinding method disclosed in this application can transfer the silicon rod orderly and seamlessly between various processing devices, and at the same time can perform squaring cutting on the silicon rod to form a square silicon rod and grind the square silicon rod after squaring cutting, so as to complete the integrated operation of multiple processes of squaring and grinding the silicon rod, improving production efficiency and the quality of product processing operations.

[0234] The above embodiments are only illustrative of the principles and effects of this application, and are not used to limit this application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in this application should still be covered by the claims of this application.

Claims

1. A silicon rod cutting and grinding integrated machine, characterized in that, Comprising: A machine base having a silicon rod processing platform; A cutting device for performing a first chamfer cutting on a silicon rod at a first processing area of the silicon rod processing platform and performing a second chamfer cutting on a silicon rod at a second processing area of the silicon rod processing platform to form a square silicon rod; Any one of the first chamfer cutting and the second chamfer cutting refers to cutting two orthogonal side surfaces of the silicon rod; wherein, the cutting device includes: a cutting frame; a cutting support movably lifting on the cutting frame; the cutting support includes a support main body and a first support flank and a second support flank located on opposite sides of the support main body; a first cutting unit provided on a first side of the cutting support; the first cutting unit includes a plurality of first cutting wheels and a first cutting wire provided on the first support flank and the support main body, and the first cutting wire is sequentially wound around the plurality of first cutting wheels to form two orthogonal first cutting line segments; a second cutting unit provided on a second side of the cutting support; the second cutting unit includes a plurality of second cutting wheels and a second cutting wire provided on the second support flank and the support main body, and the second cutting wire is sequentially wound around the plurality of second cutting wheels to form two orthogonal second cutting line segments; A grinding device for grinding and chamfering the square silicon rod at a third processing area of the silicon rod processing platform; wherein, the grinding device includes: a grinding support provided on the machine base; at least a pair of grinding wheel assemblies oppositely arranged on the grinding support; the at least a pair of grinding wheel assemblies are movably lifted relative to the grinding support for grinding and chamfering the square silicon rod; A silicon rod conversion device provided on the silicon rod processing platform for converting the silicon rod among the first processing area, the second processing area and the third processing area.

2. The silicon rod cutting and grinding integrated machine according to claim 1, wherein The first cutting wire and the second cutting wire are the same cutting wire, and a guide wheel for winding the cutting wire is further provided on the support main body between the first cutting unit and the second cutting unit.

3. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that The first cutting unit further includes a first side skin discharging device for discharging the side skin formed after the first cutting unit performs the first chamfer cutting on the silicon rod; the second cutting unit further includes a second side skin discharging device for discharging the side skin formed after the second cutting unit performs the second chamfer cutting on the silicon rod.

4. A silicon rod cutting and grinding integrated machine, characterized in that, Comprising: A machine base having a silicon rod processing platform; Cutting device, used for performing first bevel cutting on the silicon rod at the first processing area of the silicon rod processing platform and performing second bevel cutting on the silicon rod at the second processing area of the silicon rod processing platform to form a square silicon rod; any one of the first bevel cutting and the second bevel cutting refers to cutting two orthogonal sides of the silicon rod; wherein, the cutting device includes a first cutting device disposed at the first processing area of the silicon rod processing platform and a second cutting device disposed at the second processing area of the silicon rod processing platform; the first cutting device includes: a first cutting frame; a first cutting support seat, which is movably lifted on the first cutting frame; a first cutting unit, disposed on the first cutting support seat; the first cutting unit includes a first wire frame disposed on the first cutting support seat, a plurality of first cutting wheels disposed on the first wire frame, and a first cutting wire, and the first cutting wire is sequentially wound around the plurality of first cutting wheels to form two orthogonal first cutting line segments; the second cutting device includes: a second cutting frame; a second cutting support seat, which is movably lifted on the first cutting frame; a second cutting unit, disposed on the second cutting support seat; the second cutting unit includes a second wire frame disposed on the second cutting support seat, a plurality of second cutting wheels disposed on the second wire frame, and a second cutting wire, and the second cutting wire is sequentially wound around the plurality of second cutting wheels to form two orthogonal second cutting line segments; Grinding device, used for grinding the surface and chamfering the square silicon rod at the third processing area of the silicon rod processing platform; wherein, the grinding device includes: a grinding surface support seat, disposed on the machine base; at least a pair of grinding wheel assemblies, oppositely arranged on the grinding surface support seat; the at least a pair of grinding wheel assemblies are movably lifted relative to the grinding surface support seat for grinding the surface and chamfering the square silicon rod; Silicon rod conversion device, disposed on the silicon rod processing platform, used for converting the silicon rod among the first processing area, the second processing area and the third processing area.

5. The silicon rod cutting and grinding integrated machine according to claim 4, wherein The first cutting device further includes a first side skin discharging device, used for discharging the side skin formed after the first cutting device performs first bevel cutting on the silicon rod; the second cutting device further includes a second side skin discharging device, used for discharging the side skin formed after the second cutting device performs second bevel cutting on the silicon rod.

6. The silicon rod cutting and grinding integrated machine according to claim 1 or 4, characterized in that When the first cutting unit performs first bevel cutting on the silicon rod, the intersection point of the two orthogonal first cutting line segments is located within the cross section of the silicon rod; when the second cutting unit performs second bevel cutting on the silicon rod, the intersection point of the two orthogonal second cutting line segments is located within the cross section of the silicon rod.

7. The silicon rod cutting and grinding integrated machine according to claim 6, characterized in that, The grinding wheel assembly includes: A main shaft; and At least one grinding wheel, disposed at the working end of the main shaft.

8. The silicon rod cutting and grinding integrated machine according to claim 6, characterized in that, The grinding wheel assembly includes: A rotary chassis; A double-headed main shaft, disposed on the rotary chassis, with at least one rough grinding wheel provided at its first end and at least one fine grinding wheel provided at its second end; A driving motor, used for driving the rotary chassis to rotate so that the first end and the second end of the double-headed main shaft are interchanged.

9. The silicon rod cutting and grinding integrated machine according to claim 1 or 4, characterized in that The first processing area, the second processing area, and the third processing area of the silicon rod processing platform are adjacent to each other and are distributed at 120°, and the rotation angle range of the silicon rod conversion device is ±240°.

10. The silicon rod cutting and grinding integrated machine according to claim 9, wherein, The silicon rod conversion device includes: A disc-shaped or ring-shaped conveying body; A silicon rod positioning mechanism, arranged on the conveying body, for positioning the silicon rod; and A conversion driving mechanism, for driving the conveying body to rotate to drive the silicon rod positioned by the silicon rod positioning mechanism to be converted between each processing position.

11. The silicon rod cutting and grinding integrated machine according to claim 1 or 4, characterized in that, The silicon rod processing platform is also provided with a preprocessing position, and the silicon rod cutting and grinding integrated machine further includes a silicon rod transfer device, which is adjacent to the preprocessing position of the silicon rod processing platform, and is used for transferring the silicon rod to be processed to the preprocessing position of the silicon rod processing platform or transferring the processed silicon rod on the preprocessing position out of the silicon rod processing platform.

12. The silicon rod cutting and grinding integrated machine according to claim 11, wherein The silicon rod transfer device includes: A transfer base, slidably arranged on the machine base through a sliding mechanism; A silicon rod platform, movably arranged on the transfer base, for horizontally placing the silicon rod; A silicon rod fastening mechanism, arranged on the silicon rod platform, for fastening the silicon rod during the transfer of the silicon rod; and A platform flipping mechanism, for driving the silicon rod platform to flip relative to the transfer base, so that the silicon rod is vertically placed on the silicon rod conversion device.

13. The silicon rod cutting and grinding integrated machine according to claim 11, characterized in that, The silicon rod cutting and grinding integrated machine further includes a positioning detection device, which is arranged at the preprocessing position of the silicon rod processing platform and is used for detecting the edge line and central positioning of the silicon rod.

14. The silicon rod cutting and grinding integrated machine according to claim 13, wherein The positioning detection device includes: An edge line detection unit, including a contact detection mechanism, a rotation mechanism, and a detection controller electrically connected to the contact detection mechanism and the rotation mechanism. The contact detection mechanism is used for sending a conduction and interruption signal to the detection controller by contacting the edge line of the silicon rod, and the rotation mechanism is used for adjusting the position of the silicon rod according to the control of the detection controller; and An axis adjustment unit, for positioning the axis of the silicon rod at the center of the preprocessing position, including a clamping mechanism driven by a lifting mechanism to move up and down. The clamping mechanism is used for forming a clamping space for clamping the silicon rod, and the center of the clamping space coincides with the center of the preprocessing position.

15. The silicon rod cutting and grinding integrated machine according to claim 11, characterized in that, The first processing area, the second processing area, and the third processing area of the silicon rod processing platform are adjacent to each other and are distributed at 90°, and the rotation angle range of the silicon rod conversion device is ±270°.

16. The silicon rod cutting and grinding integrated machine according to claim 15, characterized in that The silicon rod conversion device includes: A disc-shaped or ring-shaped conveying body; A silicon rod positioning mechanism, arranged on the conveying body, for positioning the silicon rod; and A conversion driving mechanism, for driving the conveying body to rotate to drive the silicon rod positioned by the silicon rod positioning mechanism to be converted between each processing position.

17. A silicon rod cutting and grinding method, applied to the silicon rod cutting and grinding integrated machine as described in claim 1, wherein, The silicon rod processing platform is provided with a first processing position, a second processing position, and a third processing position. It is characterized in that the silicon rod cutting and grinding method includes the following steps: Let the silicon rod conversion device convert the first silicon rod to the first processing position, drive the cutting support in the cutting device to descend relative to the cutting frame, and perform a first bevel cutting on the first silicon rod at the first processing position by the first cutting unit on the first side of the cutting support; the first bevel cutting refers to cutting two orthogonal sides of the silicon rod. Let the silicon rod conversion device rotate by a first preset angle to convert the first silicon rod from the first processing position to the second processing position and convert the second silicon rod to the first processing position, drive the cutting support in the cutting device to descend relative to the cutting frame, perform a second bevel cutting on the first silicon rod at the second processing position by the second cutting unit on the second side of the cutting support and perform a first bevel cutting on the second silicon rod at the first processing position by the first cutting unit on the first side of the cutting support; the second bevel cutting refers to cutting two orthogonal sides of the silicon rod. Let the silicon rod conversion device rotate by a first preset angle to convert the first silicon rod from the second processing position to the third processing position, convert the second silicon rod from the first processing position to the second processing position, and convert the third silicon rod to the first processing position, let the grinding device perform surface grinding and chamfering on the first silicon rod at the third processing position. At this stage, drive the cutting support in the cutting device to descend relative to the cutting frame, perform a second bevel cutting on the second silicon rod at the second processing position by the second cutting unit on the second side of the cutting support and perform a first bevel cutting on the third silicon rod at the first processing position by the first cutting unit on the first side of the cutting support. Let the silicon rod conversion device rotate by a second preset angle to convert the first silicon rod from the third processing position to the first processing position, convert the second silicon rod from the second processing position to the third processing position, convert the third silicon rod from the first processing position to the second processing position, unload the first silicon rod from the first processing position and load the fourth silicon rod, let the grinding device perform surface grinding and chamfering on the second silicon rod at the third processing position. At this stage, drive the cutting support in the cutting device to descend relative to the cutting frame, perform a second bevel cutting on the third silicon rod at the second processing position by the second cutting unit on the second side of the cutting support and perform a first bevel cutting on the fourth silicon rod at the first processing station by the first cutting unit on the first side of the cutting support.

18. The silicon rod cutting and grinding method according to claim 17, wherein, The first processing position, the second processing position, and the third processing position on the silicon rod processing platform are distributed at 120° to each other; when the direction in the order of the first processing position, the second processing position, and the third processing position is defined as the positive direction, the first preset angle for the silicon rod conversion device to rotate is a positive rotation of 120°, and the second preset angle for the silicon rod conversion device to rotate is a positive rotation of 120° or a negative rotation of 240°.

19. A method for cutting and grinding a silicon rod, which is applied to the silicon rod cutting and grinding integrated machine as described in claim 1, wherein, The silicon rod processing platform is provided with a waiting position, a first processing position, a second processing position, and a third processing position. It is characterized in that the silicon rod cutting and grinding method includes the following steps: Load the first silicon rod at the waiting position and perform pretreatment on the first silicon rod. Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the waiting position to the first processing position, drive the cutting support in the cutting device to descend relative to the cutting frame, and use the first cutting unit on the first side of the cutting support to perform a first bevel cutting on the first silicon rod at the first processing position. At this stage, load the second silicon rod at the waiting position and perform pretreatment on the second silicon rod; the first bevel cutting refers to cutting two orthogonal sides of the silicon rod. Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the first processing position to the second processing position and transfer the second silicon rod from the waiting position to the first processing position, drive the cutting support in the cutting device to descend relative to the cutting frame, use the second cutting unit on the second side of the cutting support to perform a second bevel cutting on the first silicon rod at the second processing position and use the first cutting unit on the first side of the cutting support to perform a first bevel cutting on the second silicon rod at the first processing position. At this stage, load the third silicon rod at the waiting position and perform pretreatment on the third silicon rod; the second bevel cutting refers to cutting two orthogonal sides of the silicon rod. Rotate the silicon rod conversion device by a first preset angle to transfer the first silicon rod from the second processing position to the third processing position, transfer the second silicon rod from the first processing position to the second processing position, transfer the third silicon rod from the waiting position to the first processing position, and let the grinding device perform surface grinding and chamfering on the first silicon rod at the third processing position. At this stage, drive the cutting support in the cutting device to descend relative to the cutting frame, use the second cutting unit on the second side of the cutting support to perform a second bevel cutting on the second silicon rod at the second processing position and use the first cutting unit on the first side of the cutting support to perform a first bevel cutting on the third silicon rod at the first processing position. At the same time, load the fourth silicon rod at the waiting position and perform pretreatment on the fourth silicon rod. Rotate the silicon rod conversion device by a second preset angle to transfer the first silicon rod from the third processing position to the waiting position, transfer the second silicon rod from the second processing position to the third processing position, transfer the third silicon rod from the first processing position to the second processing position, transfer the fourth silicon rod from the waiting position to the first processing position, unload the first silicon rod from the waiting position and load the fifth silicon rod, and perform pretreatment on the fifth silicon rod. At this stage, let the grinding device perform surface grinding and chamfering on the second silicon rod at the third processing position, drive the cutting support in the cutting device to descend relative to the cutting frame, use the second cutting unit on the second side of the cutting support to perform a second bevel cutting on the third silicon rod at the second processing position and use the first cutting unit on the first side of the cutting support to perform a first bevel cutting on the fourth silicon rod at the first processing position.

20. The silicon rod cutting and grinding method according to claim 19, wherein The waiting area, the first processing area, the second processing area, and the third processing area on the silicon rod processing platform are distributed at 90° to each other in pairs; when the direction in the order of the waiting area, the first processing area, the second processing area, and the third processing area is defined as the positive direction, the first preset angle for rotating the silicon rod conversion device is a positive rotation of 90°, and the second preset angle for rotating the silicon rod conversion device is a positive rotation of 90° or a reverse rotation of 270°.

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