Single layer capacitive touch matrix

Abstract

Embodiments of the present application relate to a single-layer capacitive touch matrix. The capacitive touch matrix has first conductive row elements spaced apart from each other, and a first row interconnect circuit device electrically connects the first conductive row elements. Second conductive row elements are spaced apart from each other, and a second row interconnect circuit device electrically connects the second conductive row elements. A first conductive column element is positioned between two adjacent first conductive row elements in the first conductive row elements, and the first conductive column elements are spaced apart from each other. The second conductive column element is positioned in the same column as the first conductive column element, and between two adjacent first conductive row elements in the first conductive row elements, the second conductive column elements are spaced apart from each other. The first column interconnect circuit device electrically connects each first conductive column element, and the second column interconnect circuit device electrically connects each second conductive column element. The conductive elements and the interconnect circuit device are coplanar with each other.

Description

Technical Field

[0001] The present application relates to the field of capacitive touch sensing, and in particular to a thin single layer capacitive touch matrix for capacitive touch sensing applications. Background Art

[0002] Touch screens are common in today's computing environments. Laptops, desktop computers, tablet computers, smartphones, and smart watches often use touch screens to collect user input for navigation and control of these devices. Therefore, recognizing the user's intent via touch input is an important feature of touch screen devices.

[0003] Touch screens are typically operated based on capacitive touch sensing and include a patterned array of conductive features. For example, the patterned array of conductive features may include a collection of lines, conductive pads, overlapping structures, staggered structures, diamond structures, lattice structures, etc. By evaluating the change in capacitance at different lines or collections of lines, a user touch or hover (such as by a finger or stylus) can be detected.

[0004] A common capacitive touch sensing technology that can be performed on a touch screen is mutual capacitance sensing. Figure 1A As shown, in mutual capacitance sensing, a drive or transmit signal is applied from the touch screen controller to a subset of lines called drive or transmit lines, and capacitance values ​​are measured at a subset of lines called sense or receive lines, it being understood that in this specific example, the receive lines cross the transmit lines in a manner spaced apart from the transmit lines. Each intersection of the transmit line and the receive line forms a capacitive node. Since bringing a finger or conductive stylus close to the surface of the touch screen changes the local electric field, this causes the capacitance between the transmit line and the receive line (the "mutual" capacitance) to decrease, and the capacitance change at each individual capacitive node can be measured to accurately determine the touch location. Therefore, the output of mutual capacitance sensing is a two-dimensional matrix of values, with one value for each capacitive node.

[0005] The conductive lines can be collectively referred to as a capacitive touch matrix. Figure 1B As shown, one way to arrange these lines is to have the transmit line perpendicular to the receive line and spaced apart from (not coplanar with) the receive line.

[0006] like Figure 1C Another way to arrange the conductive lines is to arrange the conductive lines in a diamond shape, as shown in FIG. Here, the transmit line and the receive line are in a diamond shape, where one line (transmit line or receive line) is located in one plane, and the other line is generally located in the same plane, but a wire or bridge extending through another plane provides a spaced-apart intersection between the transmit line and the receive line. As shown in FIG. Figure 1CAs can be seen in FIG. 1 , the lines marked as X-ITO extend in a single plane, while the lines marked as Y-ITO have portions extending into a second plane to cross the lines marked as X-ITO.

[0007] although Figure 1B to Figure 1C Capacitive touch matrix arrangements provide accurate touch sensing, but they have the disadvantage that they may be more expensive to produce than desired, have lower manufacturing yields than desired, be thicker than desired (because the capacitive touch matrix requires more than a single layer), and may result in a larger than desired border around a touch screen incorporating such a capacitive touch matrix arrangement. Further development is therefore needed. Summary of the invention

[0008] In one embodiment, the electronic device disclosed herein includes a capacitive touch matrix. The capacitive touch matrix includes a first conductive row unit and a second conductive row unit. The first conductive row unit includes a plurality of first conductive row elements and a first row interconnection circuit device, the first conductive row elements are spaced apart from each other along a first direction, the first row interconnection circuit device is electrically connected to each of the first conductive row elements in the plurality of first conductive row elements, and the first row interconnection circuit device electrically connects each of the first conductive row elements in the plurality of first conductive row elements to each other. The second conductive row unit includes a plurality of second conductive row elements and a second row interconnection circuit device, the second conductive row elements are spaced apart from each other along a first direction, the second row interconnection circuit device is electrically connected to each of the second conductive row elements in the plurality of second conductive row elements, and the second row interconnection circuit device electrically connects each of the second conductive row elements in the plurality of second conductive row elements to each other.

[0009] The capacitive touch matrix also includes a first conductive column unit. The first conductive column unit includes a plurality of first conductive column elements, which are positioned between two adjacent first conductive row elements in the plurality of first conductive row elements, and the plurality of first conductive column elements are spaced apart from each other along a second direction different from the first direction. The first conductive column unit also includes a plurality of second conductive column elements, which are arranged in the same column as the plurality of first conductive column elements, and the plurality of second conductive column elements are also positioned between two adjacent first conductive row elements in the plurality of first conductive row elements, and the plurality of second conductive column elements are spaced apart from each other along the second direction.

[0010] The first column interconnect circuit means is electrically connected to each of the plurality of first conductive column elements, and the first column interconnect circuit means electrically connects each of the plurality of first conductive column elements to each other. The second column interconnect circuit means is electrically connected to each of the plurality of second conductive column elements, and the second column interconnect circuit means electrically connects each of the plurality of second conductive column elements to each other. The first conductive row cell, the second conductive row cell, and the first conductive column cell are coplanar with each other.

[0011] The second conductive column elements of the second plurality of conductive column elements may be interleaved with the first conductive column elements of the first plurality of conductive column elements. In fact, the second conductive column elements of the second plurality of conductive column elements may be interleaved with the first conductive column elements of the first plurality of conductive column elements such that each second conductive column element of the second plurality of conductive column elements is positioned between two first conductive column elements of the first plurality of conductive column elements.

[0012] Alternatively, the plurality of first conductive column elements and the plurality of second conductive column elements may be arranged in pairs such that a pair of second conductive column elements in the plurality of second conductive column elements are positioned between two pairs of first conductive column elements in the plurality of first conductive column elements. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1A is a diagram of two prior art touch sensors illustrating mutual capacitance touch sensing.

[0014] Figure 1B is a diagram of a capacitive touch matrix with a standard bar pattern.

[0015] Figure 1C is a diagram of a capacitive touch matrix with a standard diamond pattern.

[0016] Figure 2 is a block diagram of a first embodiment of a capacitive touch matrix disclosed herein when connected to a touch sensing controller.

[0017] Figure 3A is shown by Figure 2 Block diagram of single-ended mutual capacitance touch sensing performed by a sensing circuit device included in .

[0018] Figure 3B is shown by Figure 2 Block diagram of differential mutual capacitance touch sensing performed by a sensing circuit device included in .

[0019] FIG. 4A to FIG. 4C yes Figure 2 Alternative configurations of capacitive touch matrices.

[0020] Figure 5 yes Figure 2 Schematic cross-sectional view of a capacitive touch matrix.

[0021] Figure 6 yes Figure 2 A diagrammatic, real-world view of the arrangement of rows and columns of a capacitive touch matrix. DETAILED DESCRIPTION

[0022] The following disclosure enables those skilled in the art to make and use the subject matter disclosed herein. Without departing from the spirit and scope of the present disclosure, the general principles described herein can be applied to embodiments and applications other than those described in detail above. The present disclosure is not intended to limit the embodiments shown, but should obtain the broadest scope consistent with the principles and features disclosed or suggested herein.

[0023] Reference now Figure 2 A first embodiment of an electronic device 50 is described which comprises a capacitive touch matrix 51 connected to a touch screen controller 55 integrated circuit.

[0024] The capacitive touch matrix 51 is implemented in a single layer, and for ease of viewing and understanding, the capacitive touch matrix 51 illustratively includes rows 100a to 100b and columns 200a to 200b, 201a to 201b, wherein it should be understood that there may be any number of rows and columns in actual implementations.

[0025] Each row 100a to 100b includes a plurality of conductive row elements 100a1 to 100a2 and 100b1 to 100b2 that are spaced apart from each other along a first direction (i.e., the X direction) but are electrically connected to each other. For example, row 100a includes conductive row elements 100a1 and 100a2, each of which has the same rectangular shape and size, and row 100b includes conductive row elements 100b1 and 100b2, each of which also has the same rectangular shape and size. In this example, conductive row elements 100a1 to 100a2 and 100b1 to 100b2 have the same rectangular shape and the same size as each other, but they are not physically continuous with each other. It should be noted that each of the conductive row elements 100a1 to 100a2 and 100b1 to 100b2 has a row interconnection circuit device 98 extending in the same direction from them to connect to the drive circuit device 52 within the touch screen controller, and only through this interconnection circuit device, the conductive row elements 100a1 to 100a2 are electrically connected to form the first row 100a, and the conductive row elements 100b1 to 100b2 are electrically connected to form the second row 100b. The rows 100a to 100b extend in the X direction (relative to the drawing), and the row interconnection circuit device 98 extends in the Y direction (relative to the drawing) perpendicular to the X direction.

[0026] It should be noted that the columns 200a and 200b are illustrated as a single physical column, but they are two electrically isolated columns and are therefore labeled as columns 200a and 200b. Each column 200a-200b and 201a-201b includes a plurality of conductive column elements 200a1-200a2, 200b1-200b2 and 201a1-201a2, 201b1-201b2 spaced apart from each other along a second direction perpendicular to the first direction. The conductive column elements 200a1-200a2 of the column 200a are electrically connected to each other, the conductive column elements 200b1-200b2 of the column 200b are electrically connected to each other, the conductive column elements 201a1-201a2 of the column 201a are electrically connected to each other, and the conductive column elements 201b1-201b2 of the column 201b are electrically connected to each other.

[0027] For example, column 200a includes conductive column elements 200a1 and 200a2, each of which has the same rectangular shape and size, while column 200b includes conductive column elements 200b1 and 200b2, each of which also has the same rectangular shape and size, and column 201a includes conductive column elements 201a1 and 201a2, each of which has the same rectangular shape and size, while column 201b includes conductive column elements 201b1 and 201b2, each of which also has the same rectangular shape and size. In this example, the conductive column elements 200a1 to 200a2, 200b1 to 200b2, 201a1 to 201a2, and 201b1 to 201b2 have the same rectangular shape and the same size as each other, but they are not physically continuous with each other.

[0028] Columns 200a-200b are located between the conductive row elements of rows 100a-100b. For example, conductive column elements 200a1 and 200b1 are located between (bordering) conductive row elements 100a1 and 100a2 in the positive and negative X directions, while conductive column elements 200a2 and 200b2 are located between (bordering) conductive row elements 100b1 and 100b2 in the positive and negative X directions.

[0029] Each of the conductive column elements 200a1-200a2, 200b1-200b2, 201a1-201a2, and 201b1-201b2 has an associated column interconnect circuit device 99 extending in the same direction therefrom to connect to the sensing circuit device 53 within the touch screen controller, and the conductive column elements 200a1-200a2 are electrically connected to form the column 200a, the conductive column elements 200b1-200b2 are electrically connected to form the column 200b, the conductive column elements 201a1-201a2 are electrically connected to form the column 201a, and the conductive column elements 201b1-201b2 are electrically connected to form the column 201b only through the interconnect circuit device 99. The columns 200a-200b and 201a-200b extend in the Y direction (relative to the drawing), and the column interconnect circuit device 99 also extends in the Y direction (relative to the drawing).

[0030] As can be seen from the capacitive touch matrix 51, the columns 200a to 200b are staggered with each other, which means that the conductive column element 200b1 borders the conductive column elements 200a1 and 200a2 in the positive Y direction and the negative Y direction, and the conductive column element 200a2 borders the conductive column elements 200b1 and 200b2 in the positive Y direction and the negative Y direction, and so on.

[0031] It can be seen in this example that there are twice as many electrical columns 200a, 200b, 201a, 201b as there are electrical rows (remember that although the components of columns 200a and 200b are interleaved, columns 200a and 200b are not electrically connected to each other), and the area of ​​a single conductive column element is no more than half the area of ​​a single conductive row element. In other words, for each conductive row element, there are two conductive column elements.

[0032] The rows 100a-100b are coplanar with each other and in the same layer. The columns 200a-200b and 201a-201b are coplanar with each other and in the same layer. In addition, the rows 100a-100b are coplanar with the columns 200a-200b and 201a-201b and in the same layer. The row interconnect circuitry 98 and the column interconnect circuitry 99 are coplanar with each other and in the same layer. In addition, the row interconnect circuitry 98 and the column interconnect circuitry 99 are coplanar with the rows 100a-100b and the columns 200a-200b and 201a-201b and in the same layer.

[0033] It should be noted that the row interconnect circuit device 98 and the column interconnect circuit device 99 extend in the same direction (relative to the negative Y direction of the figure) so that all interconnections appear from the same side of the capacitive touch matrix 51, which helps to form a touch screen display with minimal to no borders on the other three sides of the capacitive touch matrix 51.

[0034] In operation, drive circuitry 52 applies drive signals to rows 100a-100b, and capacitance values ​​are measured at columns 200a-200b and 201a-201b by sense circuitry 53. Because bringing a finger or conductive stylus close to the surface of the sensor changes the local electric field, this causes the mutual capacitance between rows 100a-100b and columns 200a-200b and 201a-201b to decrease, and the change in capacitance at each individual node on the grid can be measured to accurately determine the touch location.

[0035] like Figure 3A As shown, the sensing circuit device 53 can use single-ended sensing by amplifying the signal at each column 200a-200b and 201a-201b. Although this can be simple, it has the disadvantage of amplifying the desired signal and noise (such as display noise from the display layer associated with the capacitive touch matrix 51). Therefore, the sensing circuit device 53' can alternatively use differential sensing to amplify the difference in the signal at two adjacent columns 200a-200b and 201a-201b, as shown in FIG. Figure 3B As shown, it has the advantage of amplifying the desired signal but suppressing noise.

[0036] Figure 4A An alternative configuration for a capacitive touch matrix 51' is shown in FIG. Figure 2 Compared with the capacitive touch matrix 51 of FIG. 5 , it should be noted that here, the conductive column elements of columns 200a-200b and 201a-201b are arranged to be staggered in pairs rather than one by one. For example, the conductive column elements 200b1-200b2 are adjacent to each other and border the conductive column elements 200a1 and 200a2 in the positive Y direction and the negative Y direction (relative to the drawing).

[0037] exist Figure 4B In another alternative configuration for a capacitive touch matrix 51 ″ shown in FIG. 5 , the arrangement of the conductive elements of rows 100 a to 100 b and 101 a to 101 b is similar to Figure 2 The capacitive touch matrix 51 is the same as that of FIG. 1 , however, here, the conductive row elements 100a1 to 100a2 and 100b1 to 100b2 are coupled to the sensing circuit device 53, and the conductive column elements 200a1 to 200a2, 200b1 to 200b2, 201a1 to 201a2 and 201b1 to 201b2 are coupled to the driving circuit device 52.

[0038] exist Figure 4C In the configuration of the capacitive touch matrix 51'' shown in FIG. 1 , the arrangement of the conductive elements of the rows 100a to 100b and 101a to 101b is similar to Figure 4AThe capacitive touch matrix 51' is the same as that of FIG. 1 , but here, the conductive row elements 100a1 to 100a2 and 100b1 to 100b2 are coupled to the sensing circuit device 53, and the conductive column elements 200a1 to 200a2, 200b1 to 200b2, 201a1 to 201a2 and 201b1 to 201b2 are coupled to the driving circuit device 52.

[0039] Figure 5 When implemented in the touch screen 300, Figure 2 300. Here, the bottom layer is a display layer 301 (illustrated as an organic light emitting diode layer), which has a thin film layer 302 on it to protect the display layer 301 and provide a substrate on which the capacitive touch matrix 51 is placed. A polarizing filter 303 is stacked on the capacitive touch matrix, and an optically clear adhesive layer 304 bonds a cover lens 305 to the polarizing filter 303 to complete the touch screen 300.

[0040] As mentioned above, Figure 2 and FIG. 4A to FIG. 4C The examples shown in are simplified so that they contain fewer electrical rows and columns than actual implementations. Figure 6 A diagrammatic representation of an actual implementation is shown in . Here, electrical rows are labeled by channel numbers (e.g., channel "0" starting from the upper left of the figure from left to right, channel "1" starting from below channel "0" from left to right, etc.), and it should be understood that different row elements with the same channel number are electrically connected to each other. Electrical columns are also labeled by channel numbers (e.g., channels "0" and "31" starting from top to bottom after the first channel "0" row element, channels "1" and "30" starting from top to bottom after the second "0" row element, etc.), and it should be understood that different column elements with the same channel number are electrically connected to each other. It should be noted that in this example, the electrical columns are staggered in a one-to-one manner (e.g., column 0 and column 30 are staggered with each other, and the first column element 31 is between two adjacent column elements 30).

[0041] While the present disclosure has been described with reference to a limited number of embodiments, those skilled in the art having benefit of this disclosure will appreciate that other embodiments may be conceived which do not depart from the scope of the present disclosure as disclosed herein. Accordingly, the scope of the present disclosure is limited only by the appended claims.

Claims

1. An electronic device, comprising: Capacitive touch matrix, including: The first conductive row unit comprises: a plurality of first conductive row elements spaced apart from each other along a first direction; and a first row interconnect circuit means electrically connected to each of the plurality of first conductive row elements, and the first row interconnect circuit means electrically connecting each of the plurality of first conductive row elements to each other; The second conductive row unit comprises: a plurality of second conductive row elements spaced apart from each other along the first direction; and a second row interconnect circuitry electrically connected to each of the plurality of second conductive row elements, and the second row interconnect circuitry electrically connects each of the plurality of second conductive row elements to each other; and The first conductive column unit comprises: a plurality of first conductive column elements, positioned between two adjacent first conductive row elements of the plurality of first conductive row elements, the plurality of first conductive column elements being spaced apart from each other along a second direction different from the first direction; a plurality of second conductive column elements, arranged in the same column as the plurality of first conductive column elements, and the plurality of second conductive column elements are also positioned between the two adjacent first conductive row elements in the plurality of first conductive row elements, and the plurality of second conductive column elements are spaced apart from each other along the second direction; a first column interconnect circuitry electrically connected to each of the plurality of first conductive column elements, and the first column interconnect circuitry electrically connecting each of the plurality of first conductive column elements to each other; and a second column interconnect circuitry electrically connected to each of the plurality of second conductive column elements, and the second column interconnect circuitry electrically connects each of the plurality of second conductive column elements to each other; The first conductive row unit, the second conductive row unit and the first conductive column unit are coplanar with each other. 2 . The electronic device of claim 1 , wherein second conductive column elements of the second plurality of conductive column elements are interleaved with first conductive column elements of the first plurality of conductive column elements.

3. The electronic device of claim 1 , wherein the second conductive column elements of the plurality of second conductive column elements are staggered with the first conductive column elements of the plurality of first conductive column elements such that each second conductive column element of the plurality of second conductive column elements is positioned between two first conductive column elements of the plurality of first conductive column elements.

4. The electronic device according to claim 1, wherein the plurality of first conductive column elements and the plurality of second conductive column elements are arranged in pairs, such that a pair of second conductive column elements in the plurality of second conductive column elements are positioned between two pairs of first conductive column elements in the plurality of first conductive column elements. 5 . The electronic device of claim 1 , wherein the plurality of first conductive row elements, the plurality of first conductive column elements, and the plurality of second conductive column elements are equal in number.

6. The electronic device according to claim 1 further includes a driving circuit device, a sensing circuit device and a processing circuit device, wherein the driving circuit device is coupled to the first row interconnection circuit device to apply a driving signal to the first row interconnection circuit device, the sensing circuit device is coupled to the first column interconnection circuit device and the second column interconnection circuit device, the processing circuit device is coupled to the sensing circuit device, and the processing circuit device is configured to: determine the capacitance between the multiple first conductive row elements and the multiple first conductive column elements and the multiple second conductive column elements, the capacitance representing touch sensing information indicating a touch position on the capacitive touch matrix.

7. The electronic device of claim 6, wherein the sensing circuitry is configured to amplify a signal on the first column interconnect circuitry and a signal on the second column interconnect circuitry.

8. The electronic device of claim 6, wherein the sensing circuitry is configured to differentially amplify a signal on the first column interconnect circuitry and a signal on the second column interconnect circuitry to amplify the signals but eliminate noise.

9. The electronic device according to claim 1 further includes a driving circuit device, a sensing circuit device and a processing circuit device, wherein the driving circuit device is coupled to the first column interconnection circuit device and the second column interconnection circuit device to apply a driving signal to the first column interconnection circuit device and the second column interconnection circuit device, the sensing circuit device is coupled to the first row interconnection circuit device and the second row interconnection circuit device, the processing circuit device is coupled to the sensing circuit device, and the processing circuit device is configured to: determine the capacitance between the multiple first conductive column elements and the multiple second conductive column elements and the multiple first conductive row elements and the multiple second conductive row elements, the capacitance representing touch sensing information indicating a touch position on the capacitive touch matrix.

10. The electronic device of claim 9, wherein the sensing circuitry is configured to amplify a signal on the first row interconnect circuitry and a signal on the second row interconnect circuitry.

11. The electronic device of claim 9, wherein the sensing circuitry is configured to differentially amplify a signal on the first column interconnect circuitry and a signal on the second column interconnect circuitry to amplify the signals but eliminate noise.

12. The electronic device of claim 1, wherein the first row interconnect circuitry, the second row interconnect circuitry, the first column interconnect circuitry, and the second column interconnect circuitry all extend toward a same side of the capacitive touch matrix.

13. The electronic device of claim 1, wherein the first plurality of conductive row elements and the second plurality of conductive row elements have a rectangular shape.

14. The electronic device of claim 1, wherein the first plurality of conductive column elements and the second plurality of conductive column elements have a rectangular shape.

15. The electronic device of claim 1, wherein the first plurality of conductive row elements, the second plurality of conductive row elements, the first plurality of conductive column elements, and the second plurality of conductive column elements have a rectangular shape.

16. The electronic device of claim 1, wherein each first conductive row element of the plurality of first conductive row elements is at least twice as large in area as a corresponding first conductive column element of the plurality of first conductive column elements.

17. The electronic device of claim 1, wherein an area of ​​each of the plurality of first conductive column elements is no greater than half an area of ​​a corresponding first conductive row element of the plurality of first conductive row elements.

18. A capacitive touch matrix, comprising: The first conductive row unit comprises: A plurality of first conductive row elements extending along a first direction; and a first row interconnection circuit device extending from the plurality of first conductive row elements in a second direction different from the first direction and electrically connecting each of the plurality of first conductive row elements to each other; The second conductive row unit comprises: a plurality of second conductive row elements extending along the first direction; and a second row interconnect circuit means extending in the second direction and electrically connecting each of the plurality of second conductive row elements to each other; and The first conductive column unit comprises: a plurality of first conductive column elements extending along the second direction and positioned between two adjacent first conductive row elements among the plurality of first conductive row elements; a plurality of second conductive column elements extending along the second direction and arranged in the same column as the plurality of first conductive column elements, and the plurality of second conductive column elements are also positioned between the two adjacent first conductive row elements in the plurality of first conductive row elements; a first column interconnect circuitry extending from the plurality of first conductive column elements in the second direction and electrically connecting each of the plurality of first conductive column elements to each other; and a second column interconnect circuit means extending in the second direction from the plurality of second conductive column elements, and the second column interconnect circuit means electrically connecting each of the plurality of second conductive column elements to each other; The first conductive row unit, the second conductive row unit and the first conductive column unit are coplanar with each other. 19 . The capacitive touch matrix of claim 18 , wherein second conductive column elements of the second plurality of conductive column elements are interleaved with first conductive column elements of the first plurality of conductive column elements.

20. The capacitive touch matrix of claim 18, wherein the second conductive column elements of the plurality of second conductive column elements are interlaced with the first conductive column elements of the plurality of first conductive column elements such that each second conductive column element of the plurality of second conductive column elements is positioned between two first conductive column elements of the plurality of first conductive column elements.

21. The capacitive touch matrix of claim 18, wherein the plurality of first conductive column elements and the plurality of second conductive column elements are arranged in pairs such that a pair of second conductive column elements among the plurality of second conductive column elements are positioned between two pairs of first conductive column elements among the plurality of first conductive column elements.

22. The capacitive touch matrix of claim 18, wherein the plurality of first conductive row elements, the plurality of first conductive column elements, and the plurality of second conductive column elements are equal in number.

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