Optical element driving mechanism
By embedding circuit components in the optical element drive mechanism and optimizing space utilization, the problem of the lens drive module being too large is solved, and the mechanism is miniaturized and the cost is reduced.
Patent Information
- Application Number
- CN202010756749.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-11-08
- Filing Date
- 2020-07-31
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2040-07-31
AI Technical Summary
The size of the lens driving module in existing electronic devices is difficult to reduce, which affects the convenience and lightweight design.
An optical element driving mechanism is designed, including a fixed part, a movable part, a driving component and a circuit component, wherein the circuit component is buried in the fixed part, and the space utilization and assembly process are optimized through the design of polygonal structure and elastic elements.
The miniaturization of the optical element driving mechanism is achieved, the difficulty of circuit setting and assembly cost are reduced, and the assembly process is simplified.
Smart Images

Figure CN112333353B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to an optical element driving mechanism, and more particularly to an optical element driving mechanism with a circuit assembly embedded in a fixed portion. BACKGROUND
[0002] With the development of technology, many electronic devices (e.g. smart phones or digital cameras) nowadays have the function of taking pictures or videos. These electronic devices are increasingly popular and are developing towards the direction of convenience and thinness, to provide users with more choices.
[0003] The aforementioned electronic devices with the function of taking pictures or videos usually have a lens driving module to drive a lens to move along an optical axis, thereby achieving the function of autofocus (AF). In addition, light can pass through the aforementioned lens to form an image on a photosensitive element. However, as the size of the display of the electronic device gradually increases according to consumer demand, the size of the lens driving module needs to be reduced. In order to meet market demand, reducing the size of the lens driving module has become an important issue. SUMMARY
[0004] The present disclosure aims to provide an optical element driving mechanism to solve at least one of the above problems.
[0005] Some embodiments of the present disclosure provide an optical element driving mechanism, comprising a fixed portion, a movable portion, a driving assembly, and a circuit assembly. The fixed portion has a main shaft and a polygonal structure surrounding the main shaft. The movable portion has a bearing seat to carry an optical element and is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The circuit assembly is electrically connected to the driving assembly.
[0006] In an embodiment, the circuit assembly is embedded in the outer frame. In an embodiment, the outer frame includes a top surface and a plurality of side walls, the top surface being perpendicular to the main shaft, and the side walls being non-parallel to the top surface, wherein the circuit assembly is embedded in one of the side walls.
[0007] In an embodiment, the circuit assembly is disposed at at least one corner of the rectangular structure. In an embodiment, the optical element driving mechanism further comprises a resilient element connected to the fixed portion and the movable portion, wherein the side wall of the outer frame and the resilient element overlap when viewed along the main shaft. In an embodiment, the base reveals the resilient element when viewed along the main shaft. In an embodiment, the outer frame further has a positioning column extending towards the base along the main shaft, and the resilient element corresponds to the positioning column. In an embodiment, the base and the positioning column do not overlap when viewed along the main shaft.
[0008] In one embodiment, the movable portion includes a carrier seat carrying the optical element, the carrier seat having a winding post extending along the main axis toward the base, the base having a recess, and the recess and the winding post overlap when viewed along the main axis. In one embodiment, the base has a stop portion extending along the main axis toward the frame, and the stop portion and the winding post are on the same side of the rectangular structure when viewed along the main axis.
[0009] In one embodiment, one side of the frame has a protrusion protruding toward the carrier seat, the carrier seat has a recess, and the protrusion is received in the recess. In one embodiment, the protrusion protrudes inwardly from a sidewall of the frame when viewed along the main axis.
[0010] In one embodiment, the drive assembly includes a magnetic element and a drive coil, one of the magnetic element and the drive coil is disposed on the fixed portion, and the other of the magnetic element and the drive coil is disposed on the movable portion. In one embodiment, the optical element driving mechanism further includes a sensing assembly sensing movement of the movable portion relative to the fixed portion, wherein the drive assembly is disposed at one corner of the rectangular structure, the sensing assembly is disposed at another corner of the rectangular structure, and the corner and the other corner are different corners.
[0011] In one embodiment, the circuit assembly further includes a drive assembly connecting portion and a sensing assembly connecting portion. The drive assembly connecting portion is embedded in the base and electrically connected to the drive assembly. The sensing assembly connecting portion is embedded in the frame and electrically connected to the sensing assembly.
[0012] In one embodiment, the rectangular structure has an opening, a first side, and a second side opposite to the first side when viewed along the main axis, and a shortest distance between the opening and the first side is greater than a shortest distance between the opening and the second side. In one embodiment, the exposed portion of the circuit assembly is disposed at the first side of the rectangular structure.
[0013] In one embodiment, the optical element driving mechanism further includes an elastic element connected to the fixed portion and the movable portion, wherein the elastic element is formed with a plurality of glue holes, the glue holes are located at two sides of the rectangular structure, and the sides are perpendicular to the first side and the second side when viewed along the main axis.
[0014] In one embodiment, the elastic element further includes a plurality of chord portions, and at least two of the chord portions extend to one of the glue holes. In one embodiment, the frame and the glue hole do not overlap when viewed along the main axis.
[0015] Some embodiments of the present disclosure provide an optical element driving mechanism, comprising: a fixed part, a movable part, a driving assembly, a sensing assembly, and a circuit assembly. The fixed part has a main shaft and a polygonal structure surrounding the main shaft. The movable part has a carrier to carry an optical element and is movable relative to the fixed part. The driving assembly drives the movable part to move relative to the fixed part. The sensing assembly senses the movement of the movable part relative to the fixed part. The circuit assembly is electrically connected to the driving assembly and the sensing assembly.
[0016] In an embodiment, the circuit assembly further comprises: a first driving assembly connecting element, a second driving assembly connecting element, a first sensing assembly connecting element, and a second sensing assembly connecting element. The first driving assembly connecting element and the second driving assembly connecting element are electrically connected to the driving assembly and partially exposed on the fixed part. The first sensing assembly connecting element and the second sensing assembly connecting element are electrically connected to the sensing assembly and partially exposed on the fixed part. The first driving assembly connecting element and the first sensing assembly connecting element are respectively disposed on different sides of the polygonal structure when viewed along the main shaft.
[0017] In an embodiment, the first driving assembly connecting element is disposed between the first sensing assembly connecting element and the second sensing assembly connecting element. In an embodiment, the second sensing assembly connecting element is disposed between the first driving assembly connecting element and the second driving assembly connecting element. In an embodiment, the first sensing assembly connecting element and the second sensing assembly connecting element are respectively disposed on different sides of the fixed part when viewed along the main shaft.
[0018] In an embodiment, the first driving assembly connecting element at least partially overlaps the sensing assembly when viewed along a direction perpendicular to the main shaft. In an embodiment, the first driving assembly connecting element does not overlap the sensing assembly when viewed along the main shaft. In an embodiment, the first sensing assembly connecting element does not overlap the sensing assembly when viewed along a direction perpendicular to the main shaft. In an embodiment, the first sensing assembly connecting element at least partially overlaps the sensing assembly when viewed along the main shaft.
[0019] In one embodiment, the aforementioned sensing assembly further comprises a sensor disposed on the aforementioned fixed portion. The aforementioned fixed portion further comprises an outer frame and a base. The outer frame has a top surface and extends along a main axis of the base from an edge of the top surface of the base. The base is fixedly connected with the aforementioned outer frame and has a base surface, a base opening, and a recess. The base surface faces the aforementioned top surface. The base opening is formed in the aforementioned base surface and corresponds to the aforementioned optical element. The recess is recessed from the aforementioned base surface. The aforementioned sensor is disposed in the aforementioned recess, and the shortest distance between the aforementioned base surface and the aforementioned movable portion is less than the shortest distance between the aforementioned sensor and the aforementioned movable portion along the aforementioned main axis. In one embodiment, the aforementioned circuit assembly and the aforementioned sensing assembly are both disposed at the aforementioned base.
[0020] In one embodiment, the aforementioned first sensing assembly connecting element has a first elongated structure, and the aforementioned second sensing assembly connecting element has a second elongated structure. The first elongated structure and the second elongated structure extend along a direction that is not parallel to the aforementioned main axis, and the aforementioned first elongated structure and the aforementioned second elongated structure extend toward different directions when viewed along the aforementioned main axis.
[0021] In one embodiment, at most one of the aforementioned first elongated structure and the aforementioned second elongated structure is disposed on each side of the aforementioned polygonal structure. In one embodiment, the aforementioned first sensing assembly connecting element and the aforementioned second sensing assembly connecting element comprise a material with weak or no magnetic permeability.
[0022] In one embodiment, the aforementioned first driving assembly connecting element, the aforementioned first sensing assembly connecting element, and the aforementioned second sensing assembly connecting element are all disposed at the same corner of the fixed portion when viewed along the aforementioned main axis.
[0023] In one embodiment, the aforementioned optical element driving mechanism further comprises an elastic element. The aforementioned movable portion is movably connected to the aforementioned fixed portion via the aforementioned elastic element, and the aforementioned elastic element at least partially overlaps with the aforementioned sensing assembly when viewed along the aforementioned main axis.
[0024] In one embodiment, the aforementioned optical element driving mechanism further comprises an elastic element. The aforementioned fixed portion further comprises an outer frame, and the aforementioned outer frame has a top surface located above the aforementioned movable portion. The aforementioned carrier has a plurality of contact points, and the aforementioned elastic element is connected to the aforementioned carrier via the aforementioned contact points. The aforementioned top surface does not overlap with the aforementioned contact points when viewed along the aforementioned main axis.
[0025] In one embodiment, the aforementioned sensing assembly further comprises a reference element, the aforementioned reference element has a pair of magnetic poles, and the connecting line connecting the aforementioned magnetic poles is parallel to the aforementioned main axis. In one embodiment, the aforementioned reference element is exposed to the aforementioned carrier when viewed along a direction perpendicular to the aforementioned main axis. In one embodiment, the aforementioned driving assembly and the aforementioned sensing assembly are both disposed at the corner of the aforementioned fixed part when viewed along the aforementioned main axis.
[0026] Some embodiments of the present disclosure provide an optical element driving mechanism, comprising a fixed part, a movable part, a driving assembly, a sensing assembly, and a damping material. The optical element driving mechanism has a main axis. The fixed part has a rectangular structure surrounding the aforementioned main axis. The movable part comprises a carrier to carry an optical element, and is movable relative to the aforementioned fixed part. The driving assembly drives the aforementioned movable part to move relative to the aforementioned fixed part. The sensing assembly senses the movement of the aforementioned movable part relative to the aforementioned fixed part. The damping material is disposed between the aforementioned fixed part and the aforementioned movable part.
[0027] In one embodiment, the aforementioned carrier further has a groove arranged to accommodate the aforementioned sensing assembly, and the aforementioned damping material is disposed in the aforementioned groove. In one embodiment, the aforementioned sensing assembly is exposed to the side of the aforementioned carrier, and the aforementioned side is substantially parallel to the aforementioned main axis. In one embodiment, the aforementioned damping material at least partially overlaps the aforementioned sensing assembly when viewed along the aforementioned main axis.
[0028] In one embodiment, the aforementioned fixed part comprises a base and an outer frame disposed above the aforementioned base, and the aforementioned damping material is disposed between the aforementioned outer frame and the aforementioned carrier. In one embodiment, the aforementioned damping material is disposed between the aforementioned sensing assembly and the aforementioned base. In one embodiment, the aforementioned damping material at least partially overlaps the aforementioned outer frame and the aforementioned carrier when viewed along the aforementioned main axis.
[0029] In one embodiment, the aforementioned carrier and the aforementioned outer frame are respectively provided with corresponding recesses to accommodate the aforementioned damping material. In one embodiment, the aforementioned recesses gradually widen towards the aforementioned base. In one embodiment, the size of the recess of the aforementioned carrier is different from the size of the recess of the aforementioned outer frame.
[0030] In one embodiment, one side of the aforementioned outer frame has a protrusion protruding towards the aforementioned carrier, the aforementioned carrier has a recess, and the aforementioned protrusion is accommodated in the aforementioned recess. In one embodiment, the aforementioned damping material does not overlap the aforementioned protrusion and the aforementioned recess when viewed along the aforementioned main axis.
[0031] In one embodiment, the aforementioned sensing assembly includes a reference element and a sensor, one of the aforementioned reference element and sensor is disposed on the aforementioned fixed portion, the other of the aforementioned reference element and sensor is disposed on the aforementioned movable portion, and the aforementioned reference element and the aforementioned sensor at least partially overlap as viewed from the direction of movement of the aforementioned movable portion. In one embodiment, the aforementioned reference element has two opposite magnetic poles, and the aforementioned magnetic poles and the aforementioned sensor at least partially overlap as viewed from the direction of movement of the aforementioned movable portion. In one embodiment, the aforementioned sensor detects magnetic field changes in at least two directions, and the aforementioned directions are perpendicular to each other.
[0032] In one embodiment, the aforementioned optical element driving mechanism further includes a plurality of driving assemblies disposed at four corners of the aforementioned rectangular structure, and the aforementioned sensing assembly is disposed between two of the aforementioned driving assemblies.
[0033] In one embodiment, the aforementioned optical element driving mechanism further includes an elastic element connected to the aforementioned fixed portion and the aforementioned movable portion, wherein the aforementioned carrier has a winding post extending toward the aforementioned base along the aforementioned main axis, and the aforementioned elastic element and the aforementioned winding post do not overlap as viewed along the aforementioned main axis. In one embodiment, the aforementioned elastic element and the aforementioned sensing assembly at least partially overlap as viewed along the aforementioned main axis. In one embodiment, the aforementioned elastic element and the aforementioned damping material at least partially overlap as viewed along the aforementioned main axis.
[0034] In one embodiment, the aforementioned driving assembly includes a magnetic element and a driving coil, one of the aforementioned magnetic element and driving coil is disposed on the aforementioned fixed portion, and the other of the aforementioned magnetic element and driving coil is disposed on the aforementioned movable portion.
[0035] The present disclosure provides an optical element driving mechanism. The optical element driving mechanism includes a fixed portion, a movable portion, and a driving assembly. The fixed portion has a main axis, includes an outer frame and a base. The outer frame is made of a non-metallic material. The base is connected to the outer frame and is arranged with the outer frame along the main axis. The movable portion moves relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion.
[0036] According to some embodiments of the present disclosure, the optical element driving mechanism further comprises a sensing element configured to sense a motion condition of the movable portion relative to the fixed portion. The optical element driving mechanism further comprises a reinforcing element disposed in the outer frame and partially exposed from the outer frame. The reinforcing element corresponds to the sensing element and at least partially overlaps the sensing element when viewed along a direction perpendicular to the main axis. The optical element driving mechanism further comprises a circuit assembly electrically connected to the sensing element. The outer frame comprises a receiving structure configured to receive the circuit assembly and at least partially overlaps the circuit assembly when viewed along the main axis. The receiving structure further comprises a narrow portion corresponding to the circuit assembly. The outer frame further comprises a fixing structure configured to fix the driving assembly. The outer frame comprises a top wall perpendicular to the main axis and a side wall extending from an edge of the top wall along a direction parallel to the main axis, and a gap is defined between the side wall and the fixing structure.
[0037] According to some embodiments of the present disclosure, the optical element driving mechanism further comprises an elastic element configured to connect the movable portion to the fixed portion, and a portion of the elastic element is disposed in the gap. The optical element driving mechanism further comprises an adhesive element disposed in the gap and configured to contact the outer frame, the driving assembly and the elastic element. The outer frame further comprises a groove adjacent to the base. The base comprises a recess corresponding to the groove. The adhesive element can be disposed in the groove.
[0038] According to some embodiments of the present disclosure, the outer frame has a polygonal shape, and the outer frame further comprises a recess disposed at a corner of the outer frame when viewed along the main axis. There are a plurality of recesses disposed at different corners of the outer frame when viewed along the main axis. The outer frame comprises a protrusion, and the base further comprises an opening corresponding to the protrusion and at least partially overlaps the protrusion when viewed along a direction perpendicular to the main axis. The optical element driving mechanism further comprises an adhesive element disposed in the opening and the protrusion. The protrusion is disposed on the side wall, and the adhesive element connects the side wall, the opening and the protrusion. The outer frame further comprises an inner recess in which the adhesive element is disposed. The protrusion further comprises a slope configured to accommodate the adhesive element.
[0039] The present disclosure provides an optical element driving mechanism. The optical element driving mechanism comprises a fixed portion, a movable portion and a driving assembly. The fixed portion has a main axis and comprises an outer frame and a base. The base is connected to the outer frame and arranged along the main axis with the outer frame. The movable portion is configured to move relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion. The base comprises a first stop assembly configured to limit a range of motion of the movable portion relative to the fixed portion.
[0040] According to some embodiments of the present disclosure, a first stop assembly limits the range of movement of the movable portion relative to the fixed portion in a direction non-parallel to the main axis. The base further includes a second stop assembly, which limits the range of movement of the movable portion relative to the fixed portion in a direction parallel to the main axis. The base further includes a third stop assembly, which limits the range of movement of the movable portion relative to the fixed portion. When viewed along the main axis, the first stop assembly and the third stop assembly are disposed on the same side of the base and are spaced apart.
[0041] According to some embodiments of the present disclosure, the movable portion includes an electrical connection portion and a lower stop portion. The electrical connection portion is electrically connected to the drive assembly, and the lower stop portion corresponds to the second stop assembly. When viewed in a direction perpendicular to the main axis, the lower stop portion and the electrical connection portion are disposed on the same side of the movable portion and partially overlap when viewed in a direction perpendicular to the main axis. The shortest distance between the electrical connection portion and the bottom surface of the base is shorter than the shortest distance between the lower stop portion and the bottom surface of the base. The shortest distance between the electrical connection portion and the base is longer than the shortest distance between the lower stop portion and the base.
[0042] According to some embodiments of the present disclosure, the outer frame includes a top wall and a side wall, the top wall is perpendicular to the main axis, the side wall extends from the edge of the top wall in a direction parallel to the main axis, and the first stop assembly includes a protrusion extending toward the top wall of the outer frame. The protrusion is adjacent to the side wall of the outer frame. When viewed in a direction perpendicular to the main axis, the side wall and the protrusion at least partially overlap. The optical element driving mechanism also includes a circuit assembly disposed between the side wall and the protrusion. The optical element driving mechanism also includes an adhesive element disposed between the protrusion and the circuit assembly or between the protrusion and the outer frame. The base also includes a support structure that contacts the circuit assembly, and when viewed in a direction perpendicular to the main axis, the support structure and the circuit assembly at least partially overlap. When viewed along the main axis, the protrusion and the support structure are disposed on the same side of the base. When viewed along the main axis, the protrusion and the support structure at least partially overlap.
[0043] According to some embodiments of the present disclosure, the optical element drive mechanism further includes a sensed object disposed on a movable portion, wherein the movable portion includes an upper stop portion that at least partially overlaps the sensed object when viewed along the principal axis. The movable portion further includes a guide structure, and a portion of the drive assembly is located within the guide structure. The guide structure is adjacent to the drive assembly. When viewed in a direction perpendicular to the principal axis, the drive assembly and the guide structure do not overlap.
[0044] The optical element driving mechanism according to the embodiment of the present disclosure has the beneficial effects that the optical element driving mechanism according to the embodiment of the present disclosure provides an optical element driving mechanism in which circuit components are embedded in a fixed portion. Different lines of the circuit components are embedded in different portions of the fixed portion, which can reduce the difficulty of arranging the lines and effectively utilize the space inside the optical element driving mechanism, thereby facilitating the miniaturization of the optical element driving mechanism. In addition, the outer frame is designed to expose the glue holes of the elastic elements, which can simplify the assembly process of the optical element driving mechanism, thereby reducing the required time and cost.
[0045] In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the following preferred embodiments are specifically described below with reference to the attached drawings. BRIEF DESCRIPTION OF DRAWINGS
[0046] Figure 1 A perspective view of an optical element driving mechanism according to an embodiment of the present disclosure is shown.
[0047] Figure 2 An exploded view of the optical element driving mechanism shown. Figure 1
[0048] Figure 3 A sectional view along line 1-A-1-A shown. Figure 1
[0049] Figure 4 A top view of the optical element driving mechanism shown. Figure 1
[0050] A perspective view of an internal structure of an optical element driving mechanism according to an embodiment of the present disclosure is shown. Figure 5
[0051] A perspective view of a base and a circuit component according to an embodiment of the present disclosure is shown. Figure 6
[0052] A perspective view of an internal structure of an optical element driving mechanism according to an embodiment of the present disclosure is shown. Figure 7
[0053] A perspective view of an optical element driving mechanism according to an embodiment of the present disclosure is shown. Figure 8
[0054] An exploded view of the optical element driving mechanism shown. Figure 9 Figure 8 A sectional view along line 2-B-2-B shown.
[0055] Figure 10 Figure 8 A sectional view along line 2-B-2-B shown.
[0056] Figure 11 A sectional view along line 2-B-2-B shown. Figure 8 A bottom view of the optical element driving mechanism shown.
[0057] Figure 12 A perspective view showing the internal structure of the optical element driving mechanism according to an embodiment of the present disclosure.
[0058] Figure 13 A perspective view showing the base and the carrier seat according to an embodiment of the present disclosure.
[0059] Figure 14 A bottom view of the optical element driving mechanism shown.
[0060] Figure 15 A top view of the optical element driving mechanism shown.
[0061] Figure 16 A perspective view of the optical element driving mechanism shown.
[0062] Figure 17 A perspective view of Figure 16 An exploded view of the optical element driving mechanism shown.
[0063] Figure 18 A sectional view along Figure 16 A sectional view along line 3-C-3-C shown.
[0064] Figure 19 A bottom view of the optical element driving mechanism shown.
[0065] Figure 20 A bottom view of the optical element driving mechanism shown.
[0066] Figure 21 A partial enlarged perspective view of the internal structure of the optical element driving mechanism according to an embodiment of the present disclosure.
[0067] Figure 22 A partial enlarged perspective view of the internal structure of the optical element driving mechanism according to an embodiment of the present disclosure.
[0068] Figure 23 A partial enlarged perspective view of the internal structure of the optical element driving mechanism according to another embodiment of the present disclosure.
[0069] Figure 24 A perspective view of the carrier seat and the driving assembly according to another embodiment of the present disclosure.
[0070] Figure 25 A perspective view of the optical element driving mechanism and the optical element according to some embodiments of the present disclosure.
[0071] Figure 26 is a perspective view of the optical element drive mechanism in Figure 25
[0072] Figure 27 is a top view of the outer frame.
[0073] Figure 28 and Figure 29 are perspective views of the outer frame from different angles.
[0074] Figure 30 is a perspective view of a portion of the outer frame.
[0075] Figure 31 is a bottom view of the outer frame.
[0076] Figure 32 is a perspective view of a portion of the outer frame.
[0077] Figure 33 is a schematic view of the stiffening element and the circuit assembly.
[0078] Figure 34 is a cross-sectional view of the optical element drive mechanism along the line segment 4-A-4-A' in Figure 25
[0079] is a perspective view of a portion of the outer frame. Figure 35
[0080] is a perspective view of a portion of the base. Figure 36
[0081] is a schematic view of a portion of the outer frame and the base. Figure 37
[0082] is a perspective view of a portion of the outer frame and the base. Figure 38
[0083] is a cross-sectional view of a portion of the optical element drive mechanism along the line segment 4-A-4-A' in Figure 39 Figure 25 and
[0084] are perspective views of the carrier seat from different angles. Figure 40 Figure 41 is a side view of the carrier seat.
[0085] Figure 42 is a schematic view of a portion of the carrier seat and the base.
[0086] Figure 43 is a schematic view of the guide structure.
[0087] Figure 44 The reference signs are as follows:
[0088] The reference signs are as follows:
[0089] 1-101: optical element drive mechanism
[0090] 1-110: outer frame
[0091] 1-111: top surface
[0092] 1-112: sidewall
[0093] 1-113: aperture
[0094] 1-120: base
[0095] 1-121: base surface
[0096] 1-122: base opening
[0097] 1-123: recess
[0098] 1-130: carrier
[0099] 1-131: sidewall
[0100] 1-132: opening
[0101] 1-133: contact
[0102] 1-140: electromagnetic drive assembly
[0103] 1-141: magnetic element
[0104] 1-142: drive coil
[0105] 1-150: first resilient element
[0106] 1-160: second resilient element
[0107] 1-170: circuit assembly
[0108] 1-171: first drive assembly connection element
[0109] 1-171A: electrical contact
[0110] 1-172: second drive assembly connection element
[0111] 1-172A: electrical contact
[0112] 1-173: first sense assembly connection element
[0113] 1-173A: first elongated structure
[0114] 1-174: second sense assembly connection element
[0115] 1-173B: second elongated structure
[0116] 1-180: Sensing Components
[0117] 1-181:Sensor
[0118] 1-182: Reference Component
[0119] 1-182A, 1-182B: Magnetic poles
[0120] 1-F: Fixed part
[0121] 1-M: Activities Department
[0122] 1-O: Spindle
[0123] 2-201: Optical element drive mechanism
[0124] 2-210: Outer frame
[0125] 2-211: Top surface
[0126] 2-212: Sidewall
[0127] 2-213: Opening
[0128] 2-214: Positioning column
[0129] 2-215: Protrusion
[0130] 2-220: Base
[0131] 2-221: Stopper
[0132] 2-222: Groove
[0133] 2-230: Bearing seat
[0134] 2-231: Winding column
[0135] 2-232: Depression
[0136] 2-240: Electromagnetic drive assembly
[0137] 2-241: Magnetic components
[0138] 2-242: Drive coil
[0139] 2-250: First elastic element
[0140] 2-251: Glue hole
[0141] 2-252: Strings
[0142] 2-260: Second elastic element
[0143] 2-270: Circuit Components
[0144] 2-271: Drive assembly connection portion
[0145] 2-272: Sensing assembly connection portion
[0146] 2-273: Electrical contact
[0147] 2-280: Sensing assembly
[0148] 2-281: Sensor
[0149] 2-282: Reference element
[0150] 2-F: Fixed portion
[0151] 2-M: Movable portion
[0152] 2-O: Main shaft
[0153] 2-S1: First side
[0154] 2-S2: Second side
[0155] 3-301: Optical element drive mechanism
[0156] 3-310: Outer frame
[0157] 3-311: Top surface
[0158] 3-312: Side wall
[0159] 3-313: Opening
[0160] 3-314: Concave portion
[0161] 3-315: Convex portion
[0162] 3-320: Base
[0163] 3-330: Bearing seat
[0164] 3-331: Winding post
[0165] 3-332: Concave portion
[0166] 3-333: Groove
[0167] 3-334: Side surface
[0168] 3-335: Concave portion
[0169] 3-340: Electromagnetic drive assembly
[0170] 3-341: Magnetic element
[0171] 3-342: Drive coil
[0172] 3-350: First elastic element
[0173] 3-360: second elastic element
[0174] 3-370: circuit assembly
[0175] 3-371: drive assembly connecting portion
[0176] 3-372: sensing assembly connecting portion
[0177] 3-380: sensing assembly
[0178] 3-381: sensor
[0179] 3-382: reference element
[0180] 3-382A, 3-382B: magnetic pole
[0181] 3-390: damping material
[0182] 3-F: fixed portion
[0183] 3-M: movable portion
[0184] 3-O: main shaft
[0185] 4-1: optical element driving mechanism
[0186] 4-2: optical element
[0187] 4-10: outer frame
[0188] 4-11: top wall
[0189] 4-12: side wall
[0190] 4-13: recess
[0191] 4-14: accommodating structure
[0192] 4-15: fixing structure
[0193] 4-16: gap
[0194] 4-17: groove
[0195] 4-18: protrusion
[0196] 4-19: hole
[0197] 4-20: reinforcing element
[0198] 4-21: hollow hole
[0199] 4-30: first elastic element
[0200] 4-40: bearing seat
[0201] 4-41: through hole
[0202] 4-42: upper stop portion
[0203] 4-43: lower stop portion
[0204] 4-44: electrical connection portion
[0205] 4-45: guide structure
[0206] 4-50: coil
[0207] 4-51: lead wire
[0208] 4-60: magnetic element
[0209] 4-70: sensed object
[0210] 4-80: sensing element
[0211] 4-90: circuit component
[0212] 4-100: second elastic element
[0213] 4-110: circuit member
[0214] 4-120: base
[0215] 4-121: first stop component
[0216] 4-122: second stop component
[0217] 4-123: support structure
[0218] 4-125: protrusion
[0219] 4-127: recess
[0220] 4-128: opening
[0221] 4-130: damping element
[0222] 4-140: adhesive element
[0223] 4-141: narrow portion
[0224] 4-181: inner recess
[0225] 4-182: inclined surface
[0226] 4-1201: bottom surface
[0227] 4-1211: protrusion
[0228] 4-D: drive assembly
[0229] 4-M: main shaft
[0230] 4-P1: fixed portion
[0231] 4-P2: movable portion
[0232] 4-S: sensing assembly
[0233] 4-W: winding shaft DETAILED DESCRIPTION
[0234] The following describes an optical element driving mechanism of embodiments of the present disclosure. However, it can be readily appreciated that embodiments of the present disclosure provide many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The particular embodiments disclosed are merely for illustration in a particular manner of using the present disclosure and are not intended to limit the scope of the present disclosure.
[0235] Furthermore, relative terms, such as "below" or "bottom" and "above" or "top", can be used herein to describe one element's or member's relationship to another element's or member's orientation as the device of the figures is turned on its side, i.e., is turned from a portrait orientation to a landscape orientation, or vice versa. It is understood that if the device of the figures is turned on its side, elements described as "below" other elements and "above" other elements can then be oriented horizontally, e.g., "above" can be oriented as "left" and "below" can be oriented as "right," and vice versa.
[0236] It is to be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Pronouns in the masculine form include the feminine form, and vice versa, and the singular form also includes the plural form, unless the context clearly dictates otherwise.
[0237] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure and will not be interpreted in an overly literal or overly formal sense unless expressly so defined herein. Additionally, the terms "generally," "about," or "approximately" as used herein, are intended to permit a degree of variability in a given measurement, value, or range. It should be noted that even if these terms are not recited, the same meaning should be read into the description as if these terms were recited.
[0238] Figure 1A perspective view of an optical element driving mechanism 1-101 according to an embodiment of the present disclosure is shown. It should be noted that the optical element driving mechanism 1-101 is, for example, a voice coil motor (VCM) that can be disposed in an electronic device having a photographing function, used to drive an optical element (e.g., a lens), and can have an autofocusing (AF) function. In addition, in the present embodiment, the optical element driving mechanism 1-101 has a substantially rectangular structure. As shown in Figure 1 the top surface 1-111 has an opening 1-113 corresponding to the optical element (not shown). That is, light can pass through the opening 1-113 via a main axis 1-O into the optical element driving mechanism 1-101. It should be understood that in other embodiments, the optical element driving mechanism 1-101 can have a polygonal structure around the main axis 1-O.
[0239] Figure 2 An exploded view of the optical element driving mechanism 1-101 is shown. Figure 1 As can be seen from Figure 2 , the optical element driving mechanism 1-101 includes an outer frame 1-110, a base 1-120, a carrier 1-130, a driving assembly 1-140, a first elastic element 1-150, a second elastic element 1-160, and a circuit assembly 1-170. The fixed part 1-F can include the outer frame 1-110 and the base 1-120, and the movable part 1-M can include the carrier 1-130 and the optical element carried thereby.
[0240] The outer frame 1-110 and the base 1-120 can be connected to each other and combined into a hollow box, whereby the aforementioned carrier 1-130, driving assembly 1-140, first elastic element 1-150, and second elastic element 1-160 can be accommodated in the box surrounded by the outer frame 1-110. As a result, the outer frame 1-110, carrier 1-130, and base 1-120 are sequentially arranged along the main axis 1-O. In other words, light sequentially passes through the outer frame 1-110, carrier 1-130, and base 1-120 to reach an imaging device (not shown) disposed outside the optical element driving mechanism 1-101, thereby generating an image.
[0241] The carrier 1-130 has a hollow structure and carries an optical element having an optical axis (which is parallel to the main axis 1-O). In addition, the carrier 1-130 is movably connected to the outer frame 1-110 and the base 1-120. A first elastic element 1-150 is disposed between the outer frame 1-110 and the carrier 1-130, and a second elastic element 1-160 is disposed between the carrier 1-130 and the base 1-120. More specifically, the carrier 1-130 can be connected to the outer frame 1-110 and the base 1-120 via the first elastic element 1-150 and the second elastic element 1-160, respectively, so as to movably suspend the carrier 1-130 between the outer frame 1-110 and the base 1-120, such that the carrier 1-130 can move along the main axis 1-O between the outer frame 1-110 and the base 1-120.
[0242] The drive assembly 1-140 includes a drive coil 1-141 and a magnetic element 1-142, wherein the drive coil 1-141 can be disposed around the carrier 1-130, and the magnetic element 1-142 can be disposed between the outer frame 1-110 and the carrier 1-130. In some embodiments, the magnetic element 1-142 is fixed to the outer frame 1-110. When a current is applied to the drive coil 1-141, an electromagnetic driving force can be generated by the drive coil 1-141 and the magnetic element 1-142, so as to drive the carrier 1-130 and the optical element carried thereby to move along the Z-axis (i.e., the main axis O) relative to the base 1-120, so as to perform the function of auto-focusing (AF). In other embodiments, the positions of the drive coil 1-141 and the magnetic element 1-142 can be interchanged. In other words, the drive coil 1-141 can be disposed between the outer frame 1-110 and the carrier 1-130, and the magnetic element 1-142 can be disposed on the carrier 1-130, so as to also achieve the effect of auto-focusing.
[0243] The circuit assembly 1-170 is embedded in the base 1-120 and can extend outwardly from the base 1-120 (e.g., in a direction parallel to the main axis 1-O). In addition, a sensor 1-181 is disposed on the base 1-120 and the circuit assembly 1-170, and forms a sensing assembly 1-180 with a reference element 1-182 (as shown) disposed on the carrier 1-130. Figure 3 For example, the sensor 1-181 can be a Hall effect sensor, a magnetoresistance (MR) sensor (e.g., a tunneling magnetoresistance sensor), or any other sensor capable of sensing a magnetic field.
[0244] Figure 3 The display is shown inFigure 1 The cross-sectional view of the line 1-A-1-A shown in FIG. Figure 3 As shown, when viewed along the main axis 1-O, the magnetic element 1-142 of the drive assembly 1-140 and the sensor 1-181 are both positioned at the corners of the fixed portion 1-F. In some embodiments, the sensor 1-181 and the reference element 1-182 are arranged along the main axis 1-O so that the sensor 1-181 can detect the position of the reference element 1-182 and thereby determine the position of the support 1-130 and the optical element. In this embodiment, the circuit assembly 1-170 can be electrically connected to the drive assembly 1-140 and the sensing assembly 1-180 to transmit electrical signals.
[0245] In addition, the support seat 1-130 includes a side wall 1-131 configured to surround the optical element, and a plurality of openings 1-132 are provided on the side wall 1-131, and the aforementioned openings 1-132 will reveal the driving coil 1-141 surrounding the support seat 1-130. For example, the openings 1-132 are respectively located on each side of the optical element driving mechanism 1-101. In some embodiments, the openings 1-132 located on opposite sides of the optical element driving mechanism 1-101 at least partially overlap, but the present disclosure is not limited to this. By providing the openings 1-132, the size of the support seat 1-130 in the XY plane can be effectively reduced, thereby achieving miniaturization of the optical element driving mechanism 1-101.
[0246] Figure 4 show Figure 1 A top view of the optical element driving mechanism 1-101 is shown. Figure 4 As shown, the support base 1-130 has a plurality of contacts 1-133, and the first elastic element 1-150 is connected to the support base 1-130 via the contacts 1-133. In this embodiment, when viewed along the main axis 1-0, the top surface 1-111 of the outer frame 1-110 does not overlap with the contacts 1-133. This design facilitates the application of adhesive at the contacts 1-133 to bond the first elastic element 1-150 and the support base 1-130 without interference from the outer frame 1-110.
[0247] Figure 5 A perspective view showing a base 1-120, a second elastic element 1-160, and a circuit assembly 1-170 according to an embodiment of the present disclosure. Figure 5As shown, the circuit component 1-170 includes a first drive component connecting element 1-171, a second drive component connecting element 1-172, a first sensing component connecting element 1-173, and a second sensing component connecting element 1-174, wherein the first drive component connecting element 1-171 and the second drive component connecting element 1-172 are electrically connected to the drive component 1-140. For example, the first drive component connecting element 1-171 and the second drive component connecting element 1-172 are electrically connected to the second elastic element 1-160 at electrical contacts 1-171A and 1-172A, respectively, and are further electrically connected to the drive coil 1-141 of the drive component 1-140. The first sensing component connecting element 1-173 and the second sensing component connecting element 1-174 are electrically connected to the sensor 1-181 of the sensing component 1-180. In this embodiment, when observed along the main axis 1-O, the first driving component connecting element 1-171 and the first sensing component connecting element 1-173 are respectively arranged on different sides of the aforementioned rectangular structure.
[0248] In this embodiment, the base 1-120 has a base surface 1-121 facing the top surface 1-111 of the outer frame 1-110 (such as Figure 4 As shown). A base opening 1-122 is formed in the base surface 1-121, which passes through the base 1-120 and corresponds to the optical element in the optical element driving mechanism 1-101. The base 1-120 also has a groove 1-123, which is recessed by the base surface 1-121, wherein the sensor 1-181 is disposed in the groove 1-123. In addition, along the direction of the main axis 1-O, the shortest distance between the base surface 1-121 and the supporting seat 1-130 is smaller than the shortest distance between the sensor 1-181 and the supporting seat 1-130. In this way, when the supporting seat 1-130 moves downward to its farthest point, it will contact the base surface 1-121 without hitting the sensor 1-181, thereby preventing the sensor 1-181 from being damaged by the collision.
[0249] Furthermore, in this embodiment, when viewed along the principal axis 1-O (Z-axis), the second elastic element 1-160 and the sensor 1-181 at least partially overlap. When viewed in a direction perpendicular to the principal axis 1-O (e.g., viewed from the electrical contact 1-171A toward the center of the optical element drive mechanism 1-101), the first drive assembly connecting element 1-171 and the sensor 1-181 at least partially overlap. When viewed along the principal axis 1-O, the first drive assembly connecting element 1-171 and the sensor 1-181 do not overlap.
[0250] Figure 6 A perspective view of a base 1-120 and a circuit assembly 1-170 according to an embodiment of the present disclosure is shown. Figure 6As shown, the first drive assembly connecting element 1-171 is disposed between the first sensing assembly connecting element 1-173 and the second sensing assembly connecting element 1-174. The second sensing assembly connecting element 1-174 is disposed between the first drive assembly connecting element 1-171 and the second drive assembly connecting element 1-172. In this embodiment, the first sensing assembly connecting element 1-173 and the second sensing assembly connecting element 1-174 are disposed at different sides of the base 1-120 when viewed along the main axis 1-O. In this embodiment, the first drive assembly connecting element 1-171, the first sensing assembly connecting element 1-173 and the second sensing assembly connecting element 1-174 are all disposed at the same corner of the base 1-120.
[0251] In addition, the first sensing assembly connecting element 1-173 has a first elongated structure 1-173A and the second sensing assembly connecting element 1-174 has a second elongated structure 1-174A. In this embodiment, the first elongated structure 1-173A and the second elongated structure 1-174A extend in a direction that is not parallel to the main axis 1-O (e.g., along the X-Y plane). The first elongated structure 1-173A and the second elongated structure 1-174A extend in different directions when viewed along the main axis 1-O. For example, the first elongated structure 1-173A extends along the Y-axis and the second elongated structure 1-174A extends along the X-axis. In embodiments in which the optical element driving mechanism 1-101 has an arbitrary polygonal structure, at most one of the first sensing assembly connecting element 1-173 and the second sensing assembly connecting element 1-174 is disposed at each side of the polygonal structure when viewed along the main axis 1-O. In other words, each side of the polygonal structure can be provided with the first sensing assembly connecting element 1-173 or the second sensing assembly connecting element 1-174, or can not be provided with the first sensing assembly connecting element 1-173 or the second sensing assembly connecting element 1-174.
[0252] As shown, the first drive assembly connecting element 1-171 is disposed between the first sensing assembly connecting element 1-173 and the second sensing assembly connecting element 1-174. The second sensing assembly connecting element 1-174 is disposed between the first drive assembly connecting element 1-171 and the second drive assembly connecting element 1-172. In this embodiment, the first sensing assembly connecting element 1-173 and the second sensing assembly connecting element 1-174 are disposed at different sides of the base 1-120 when viewed along the main axis 1-O. In this embodiment, the first drive assembly connecting element 1-171, the first sensing assembly connecting element 1-173 and the second sensing assembly connecting element 1-174 are all disposed at the same corner of the base 1-120. Figure 6As shown, the groove 1-123 of the base 1-120 will reveal a portion of the first sensing component connecting element 1-173 and the second sensing component connecting element 1-174, so that the sensor 1-181 can be set on the first sensing component connecting element 1-173 and the second sensing component connecting element 1-174. Therefore, the first sensing component connecting element 1-173 and the second sensing component connecting element 1-174 include materials with weak magnetic conductivity or no magnetic conductivity, thereby preventing the first sensing component connecting element 1-173 and the second sensing component connecting element 1-174 from affecting the operation of the sensor 1-181. For example, the first sensing component connecting element 1-173 and the second sensing component connecting element 1-174 include steel, nickel, copper, aluminum, any other suitable metal material or a combination of the foregoing. In some embodiments, under a magnetic field of 0.002T, the magnetic permeability of the first sensing component connecting element 1-173 and the second sensing component connecting element 1-174 may be less than 5000x10 -6 H / m. In this embodiment, when viewed along a direction perpendicular to the principal axis 1-O (e.g., along the X-axis and / or the Y-axis), the first sensing component connecting element 1-173, the second sensing component connecting element 1-174, and the sensing component 1-180 (including the sensor 1-181 and the reference element 1-182) do not overlap. When viewed along the principal axis 1-O, the first sensing component connecting element 1-173, the second sensing component connecting element 1-174, and the sensing component 1-180 at least partially overlap.
[0253] Figure 7 A three-dimensional diagram of a support seat 1-130 and a base 1-120 according to an embodiment of the present disclosure is shown. Figure 7 As shown, when viewed in a direction perpendicular to the main axis 1-O (e.g., viewed from the electrical contact 1-171A toward the center of the optical element drive mechanism 1-101), the reference element 1-182 is exposed on the support base 1-130. Because the drive coil 1-141 is disposed around the support base 1-130, the reference element 1-182 will be in contact with the drive coil 1-141 in this embodiment. In this embodiment, the reference element 1-182 has a pair of magnetic poles 1-182A and 1-182B. A virtual connecting line connecting the magnetic poles 1-182A and 1-182B is parallel to the main axis 1-O and passes through the sensor 1-181 (e.g., Figure 5 In some other embodiments, the reference element 1-182 may be a multi-pole magnet, and the arrangement direction of its magnetic poles may be substantially perpendicular to the main axis 1-0.
[0254] In summary, the embodiments of the present disclosure provide an optical element driving mechanism with circuit pins arranged on different sides of a base. By the above design, the lines connecting different circuit pins can be arranged on different sides, reducing the size of the base in the X-Y plane, and thus achieving the miniaturization of the optical element driving mechanism. In addition, the contact points of the carrier and the elastic element are arranged to be staggered with the outer frame, thereby reducing the difficulty of manufacturing the optical element driving mechanism.
[0255] Figure 8 A perspective view of an optical element driving mechanism 2-201 according to an embodiment of the present disclosure is shown. It should be noted that the optical element driving mechanism 2-201 is, for example, a voice coil motor (VCM) that can be arranged in an electronic device with photographing function, used to drive an optical element (e.g., a lens), and can have an autofocus (AF) function. In addition, in the present embodiment, the optical element driving mechanism 2-201 has a substantially rectangular structure. As shown in Figure 8 The outer frame 2-210 of the optical element driving mechanism 2-201 has a top surface 2-211 and four side walls 2-212 extending from the edges of the top surface 2-211 along the main axis 2-O. The top surface 2-211 has an opening 2-213 corresponding to the optical element (not shown). That is, light can pass through the opening 2-213 via a main axis 2-O into the optical element driving mechanism 2-201. It should be understood that in other embodiments, the optical element driving mechanism 2-201 can have a polygonal structure around the main axis 2-O.
[0256] Figure 9 An exploded view of the optical element driving mechanism 2-201 shown in Figure 8 It can be seen from Figure 9 The optical element driving mechanism 2-201 includes an outer frame 2-210, a base 2-220, a carrier 2-230, a driving assembly 2-240, a first elastic element 2-250, a second elastic element 2-260, and a circuit assembly 2-270. The fixed part 2-F can include the outer frame 2-210 and the base 2-220, and the movable part 2-M can include the carrier 2-230 and the optical element carried thereby.
[0257] The outer frame 2-210 and the base 2-220 can be connected to each other and combined into a hollow box, and thus the aforementioned carrier 2-230, the driving assembly 2-240, the first elastic element 2-250, and the second elastic element 2-260 can be accommodated in the box surrounded by the outer frame 2-210. As such, the outer frame 2-210, the carrier 2-230, and the base 2-220 can be sequentially arranged along the main axis 2-0. In other words, light can sequentially pass through the outer frame 2-210, the carrier 2-230, and the base 2-220 to reach an imaging device (not shown) disposed outside the optical element driving mechanism 2-201, thereby generating an image.
[0258] The carrier 2-230 has a hollow structure and carries an optical element having an optical axis (which is parallel to the main axis 2-0). In addition, the carrier 2-230 is movably connected to the outer frame 2-210 and the base 2-220. The first elastic element 2-250 is disposed between the outer frame 2-210 and the carrier 2-230, and the second elastic element 2-260 is disposed between the carrier 2-230 and the base 2-220. More specifically, the carrier 2-230 can be connected to the outer frame 2-210 and the base 2-220 through the first elastic element 2-250 and the second elastic element 2-260 made of metal, respectively, so as to movably suspend the carrier 2-230 between the outer frame 2-210 and the base 2-220, so that the carrier 2-230 can move along the main axis 2-0 between the outer frame 2-210 and the base 2-220.
[0259] The driving assembly 2-240 includes a driving coil 2-241 and a magnetic element 2-242, wherein the driving coil 2-241 can be disposed on the carrier 2-230, and the magnetic element 2-242 can be disposed between the outer frame 2-210 and the carrier 2-230. In some embodiments, the magnetic element 2-242 is fixed to the outer frame 2-210. When a current is applied to the driving coil 2-241, an electromagnetic driving force can be generated by the aforementioned driving coil 2-241 and the aforementioned magnetic element 2-242, driving the carrier 2-230 and the optical element carried thereby to move along the Z-axis (i.e., the main axis 2-0) relative to the base 2-220 to perform the function of automatic focusing (AF). In other embodiments, the positions of the driving coil 2-241 and the magnetic element 2-242 can be interchanged. In other words, the driving coil 2-241 can be disposed between the outer frame 2-210 and the carrier 2-230, and the magnetic element 2-242 can be disposed on the carrier 2-230, thereby also achieving the effect of automatic focusing.
[0260] The circuit component 2-270 includes a driving component connection portion 2-271 and a sensing component connection portion 2-272, wherein the driving component connection portion 2-271 is embedded in the base 2-220 and can extend outward from the base 2-220 (for example, in a direction parallel to the main axis O); and the sensing component connection portion 2-272 is embedded in the outer frame 2-210, for example, embedded in the side wall 2-212 of the outer frame 2-210. In addition, a sensor 2-281 is disposed on the base 2-220 and, together with a reference element 2-282 disposed on the support base 2-230, forms a sensing component 2-280. For example, the sensor 2-281 can be a Hall effect sensor, a magnetoresistance (MR) sensor (for example, a tunnel magnetoresistance (TMR) sensor), or any other sensor capable of sensing a magnetic field.
[0261] like Figure 9 As shown, the sensing component 2-280 and the driving component 2-240 are arranged at different corners of the optical element driving mechanism 2-201, thereby preventing the magnetic component 2-242 from interfering with the operation of the sensing component 2-280. In addition, by evenly distributing the positions of the various components within the optical element driving mechanism 2-201, the size of the optical element driving mechanism 2-201 can be effectively reduced, thereby achieving a miniaturization effect. In this embodiment, the driving component connecting portion 2-271 is electrically connected to the driving component 2-240, while the sensing component connecting portion 2-272 is electrically connected to the sensing component 2-280. By burying the different circuits of the circuit component 2-270 in different parts of the fixing portion 2-F, the difficulty of setting the circuits can be reduced, and the space inside the optical element driving mechanism 2-201 can be effectively utilized.
[0262] Figure 10 Display edge Figure 8 The cross-sectional view of the line 2-B-2-B shown in FIG. Figure 10 As shown, the outer frame 2-210 further includes a positioning post 2-214 extending along the main axis 2-O (Z-axis) toward the base 2-220 (i.e., extending downward), and a second elastic element 2-260 is provided corresponding to the positioning post 2-214. In this embodiment, the second elastic element 2-260 extends below the side wall 2-212 of the outer frame 2-210. In other words, when viewed along the main axis 2-O, the side wall 2-212 of the outer frame 2-210 overlaps with the second elastic element 2-260.
[0263] Figure 11 show Figure 8 The bottom view of the optical element driving mechanism 2-201 is shown. Figure 11As shown, the second elastic element 2-260 is sleeved on the positioning post 2-214. By setting the positioning post 2-214, the second elastic element 2-260 can be more easily set. In this embodiment, when observed along the main axis 2-O, the base 2-220 and the positioning post 2-214 do not overlap, thereby reducing the height of the optical element driving mechanism 2-201 on the Z axis, which is conducive to miniaturization. Based on the above design, when observed along the main axis 2-O, the base 2-220 will reveal the second elastic element 2-260. It should be noted that the above design is only an example, and technicians in the technical field to which the present invention belongs can also make the base 2-220 cover the second elastic element 2-260 to achieve a good protection effect.
[0264] In addition, if Figure 11 As shown, when viewed along the main axis 2-O, the optical element driving mechanism 2-201 has a first side 2-S1 and a second side 2-S2 opposite thereto, wherein the shortest distance between the opening 2-213 and the first side 2-S1 is greater than the shortest distance between the opening 2-213 and the second side 2-S2. In other words, the second side 2-S2 is closer to the opening 2-213 than to the first side 2-S1. In this embodiment, the exposed portion of the circuit component 2-270 is disposed on the first side 2-S1. By disposing the exposed portion of the circuit component 2-270 on the first side 2-S1, which has a larger space, the ease of disposing the circuit component 2-270 can be improved.
[0265] Figure 12 A perspective view showing the internal structure of the optical element driving mechanism 2-201 according to an embodiment of the present disclosure. It should be understood that in order to clearly show the internal structure of the optical element driving mechanism 2-201, the outer frame 2-210 is not shown in this embodiment. Figure 12 As shown, the circuit component 2-270 has an electrical contact 2-273, which is arranged at the corner of the optical element driving mechanism 2-201, and the sensing component connecting portion 2-272 is electrically connected to the second elastic element 2-260 at the electrical contact 2-273, and is further electrically connected to the sensing component 2-280 through the second elastic element 2-260.
[0266] In addition, the first elastic element 2-250 includes a plurality of glue holes 2-251 and a chord portion 2-252. In the present embodiment, the first elastic element 2-250 has two symmetrically arranged glue holes 2-251, but the present disclosure is not limited thereto. A technician in the technical field to which the present invention belongs can adjust the position of the glue hole 2-251 as needed. An adhesive (not shown) can be provided in the glue hole 2-251 to join the first elastic element 2-250 and the supporting seat 2-230. The two chord portions 2-252 can drive the supporting seat 2-230 to move relative to the fixed portion 2-F, wherein at least the two chord portions 2-252 will extend to one of the aforementioned glue holes 2-251, thereby driving the supporting seat 2-230 to move.
[0267] Figure 13 A three-dimensional diagram of the base 2-220 and the supporting seat 2-230 according to an embodiment of the present disclosure is shown. Figure 13 As shown, the support base 2-230 has a winding post 2-231 extending along the main axis 2-O toward the base 2-220, wherein the winding post 2-231 is configured for setting a circuit (not shown) so that the coil of the drive component 2-240 is electrically connected to the circuit component 2-270 (e.g., the drive component connecting portion 2-271). The base 2-220 has a stop portion 2-221 extending along the main axis 2-O toward the top surface 2-211 of the outer frame 2-210 (e.g., Figure 8 As shown in the figure, the optical element driving mechanism 2-201 is extended along the main axis 2-O, and when viewed along the main axis 2-O, the stop portion 2-221 and the winding post 2-231 are located on the same side of the optical element driving mechanism 2-201. By providing the stop portion 2-221, the range of motion of the supporting seat 2-230 can be effectively limited, thereby preventing the supporting seat 2-230 from hitting the sensing component 2-280 provided on the base 2-220 and causing damage to the sensing component 2-280. In addition, the base 2-220 also has a groove 2-222, which is configured to accommodate the winding post 2-231, that is, when viewed along the main axis 2-O, the groove 2-222 and the winding post 2-231 overlap. By providing the groove 2-222, the height of the optical element driving mechanism 2-201 on the Z axis can be reduced, which is conducive to miniaturization.
[0268] Figure 14 A bottom view showing the internal structure of the optical element driving mechanism 2-201 according to an embodiment of the present disclosure. It should be understood that in order to clearly show the internal structure of the optical element driving mechanism 2-201, the base 2-220 is not shown in this embodiment. Figure 14As shown, one side of the outer frame 2-210 has a protrusion 2-215 that protrudes toward the support seat 2-230. The support seat 2-230 has a recessed portion 2-232 that is configured to accommodate the protrusion 2-215 in the recessed portion 2-232. More specifically, when viewed along the main axis 2-O, the protrusion 2-215 protrudes inward (i.e., toward the opening 2-213) from the side wall 2-212 of the outer frame 2-210. By providing the protrusion 2-215 and the recessed portion 2-232, the rotation range of the support seat 2-230 can be effectively limited, preventing the support seat 2-230 from affecting the function of the optical element driving mechanism 2-201 due to excessive rotation. It should be understood that the configuration of the protrusion 2-215 and the recess 2-232 shown in this embodiment is only an example, and technicians in the technical field to which the present invention belongs can adjust the positions of the protrusion 2-215 and the recess 2-232 without deviating from their original functions, and will not be repeated below.
[0269] Figure 15 A top view of an optical element driving mechanism 2-201 according to an embodiment of the present disclosure is shown. Figure 15 As shown, the glue hole 2-251 of the first elastic element 2-250 is located on both side edges of the optical element driving mechanism 2-201, and when viewed along the main axis 2-O, the aforementioned side edges are approximately perpendicular to the first side edge 2-S1 and the second side edge 2-S2. That is, in this embodiment, the glue hole 2-251 is not located on the first side edge 2-S1 or the second side edge 2-S2. In addition, when viewed along the main axis 2-O, the outer frame 2-210 and the glue hole 2-251 do not overlap. In other words, in a top view, the outer frame 2-210 will reveal the glue hole 2-251, so that technicians can place adhesive in the glue hole 2-251 with the top surface 2-211 facing the top surface to join the first elastic element 2-250 and the supporting seat 2-230. Through the above design, the assembly process of the optical element driving mechanism 2-201 can be effectively simplified, reducing the time and cost required.
[0270] In summary, the embodiments of the present disclosure provide an optical element drive mechanism in which a circuit assembly is embedded within a fixed portion. Embedding different circuits of the circuit assembly in different parts of the fixed portion reduces the difficulty of circuit arrangement and effectively utilizes the space within the optical element drive mechanism, thereby facilitating the miniaturization of the optical element drive mechanism. Furthermore, designing the outer frame to expose the adhesive holes for the elastic element simplifies the assembly process of the optical element drive mechanism, thereby reducing the required time and cost.
[0271] Figure 16A three-dimensional diagram of an optical element driving mechanism 3-301 according to an embodiment of the present disclosure is shown. It should be noted that the optical element driving mechanism 3-301 is, for example, a voice coil motor (VCM), which can be provided in an electronic device with a camera function to drive an optical element (such as a lens) and can have an autofocus (AF) function. In addition, in this embodiment, the optical element driving mechanism 3-301 has a generally rectangular structure. Figure 16 As shown, the outer frame 3-310 of the optical element driving mechanism 3-301 has a top surface 3-311 and four side walls 3-312 extending from the edge of the top surface 3-311 along the main axis 3-O. The top surface 3-311 has an opening 3-313 corresponding to the optical element (not shown). In other words, light can pass through the opening 3-313 via the main axis 3-O and enter the optical element driving mechanism 3-301. It should be understood that in other embodiments, the optical element driving mechanism 3-301 may have a polygonal structure surrounding the main axis 3-O.
[0272] Figure 17 show Figure 16 An exploded view of the optical element drive mechanism 3-301 is shown. Figure 17 As can be seen in the figure, the optical element driving mechanism 3-301 includes an outer frame 3-310, a base 3-320, a supporting seat 3-330, a driving assembly 3-340, a first elastic element 3-350, a second elastic element 3-360, and a circuit assembly 3-370. The fixed portion 3-F may include the outer frame 3-310 and the base 3-320, while the movable portion 3-M may include the supporting seat 3-330 and the optical element it supports.
[0273] The outer frame 3-310 and the base 3-320 can be interconnected and assembled into a hollow box body, whereby the aforementioned support base 3-330, drive assembly 3-340, first elastic element 3-350, and second elastic element 3-360 can be surrounded by the outer frame 3-310 and housed within this box body. Thus, it can be seen that the outer frame 3-310, the support base 3-330, and the base 3-320 are arranged in sequence along the main axis 3-O. In other words, light passes through the outer frame 3-310, the support base 3-330, and the base 3-320 in sequence to reach the imaging device (not shown) disposed outside the optical element drive mechanism 3-301, thereby generating an image.
[0274] The carrier 3-330 has a hollow structure and carries an optical element having an optical axis (parallel to the main axis 3-O). In addition, the carrier 3-330 is movably connected to the outer frame 3-310 and the base 3-320. A first elastic element 3-350 is disposed between the outer frame 3-310 and the carrier 3-330, and a second elastic element 3-360 is disposed between the carrier 3-330 and the base 3-320. More specifically, the carrier 3-330 can be movably suspended between the outer frame 3-310 and the base 3-320 by the first elastic element 3-350 and the second elastic element 3-360, and the outer frame 3-310 and the base 3-320, so that the carrier 3-330 can move along the main axis 3-O between the outer frame 3-310 and the base 3-320.
[0275] The driving assembly 3-340 includes a driving coil 3-341 and a magnetic element 3-342, wherein the driving coil 3-341 can be disposed on the carrier 3-330, and the magnetic element 3-342 can be disposed between the outer frame 3-310 and the carrier 3-330. In some embodiments, the magnetic element 3-342 is fixed to the outer frame 3-310. When a current is applied to the driving coil 3-341, an electromagnetic driving force can be generated by the driving coil 3-341 and the magnetic element 3-342, driving the carrier 3-330 and the optical element carried thereby to move along the Z-axis (i.e., the main axis 3-O) relative to the base 3-320 to perform the function of automatic focusing (AF). In other embodiments, the positions of the driving coil 3-341 and the magnetic element 3-342 can be interchanged. In other words, the driving coil 3-341 can be disposed between the outer frame 3-310 and the carrier 3-330, and the magnetic element 3-342 can be disposed on the carrier 3-330, thereby also achieving the effect of automatic focusing.
[0276] The circuit component 3-370 includes a driver component connection portion 3-371 and a sensor component connection portion 3-372. The driver component connection portion 3-371 is embedded in the base 3-320 and can extend outward from the base 3-320 (e.g., in a direction parallel to the main axis 3-O). The sensor component connection portion 3-372 is embedded in the outer frame 3-310, for example, embedded in the side wall 3-312 of the outer frame 3-310. In addition, a sensor 3-381 is disposed on the base 3-320 and, together with a reference element 3-382 disposed on the support base 3-330, forms a sensor component 3-380. For example, the sensor 3-381 can be a Hall effect sensor, a magnetoresistance (MR) sensor (e.g., a tunnel magnetoresistance (TMR) sensor), or any other sensor capable of sensing a magnetic field. In some embodiments, the sensor 3-381 may be disposed on the support base 3-330, and the reference element 3-382 may be disposed on the fixing portion 3-F.
[0277] like Figure 17 As shown, the sensing component 3-380 and the driving component 3-340 are arranged at different corners of the optical element driving mechanism 3-301, thereby preventing the magnetic component 3-342 from interfering with the operation of the sensing component 3-380. In addition, by evenly distributing the positions of the various components within the optical element driving mechanism 3-301, the size of the optical element driving mechanism 3-301 can be effectively reduced, thereby achieving a miniaturization effect. In this embodiment, the driving component connecting portion 3-371 is electrically connected to the driving component 3-340, while the sensing component connecting portion 3-372 is electrically connected to the sensing component 3-380. By burying the different circuits of the circuit component 3-370 in different parts of the fixing portion 3-F, the difficulty of setting the circuits can be reduced and the space inside the optical element driving mechanism 3-301 can be effectively utilized.
[0278] Furthermore, in this embodiment, a damping material 3-390 is disposed between the fixed portion 3-F and the movable portion 3-M. More specifically, the damping material 3-390 is disposed between the outer frame 3-310 and the support base 3-330. The provision of the damping material 3-390 enables the support base 3-330 to reach a predetermined position more quickly and reduces the probability of collision between the support base 3-330 and the outer frame 3-310, thereby protecting the support base 3-330 and the optical element it carries.
[0279] Figure 18 Display edge Figure 16 The cross-sectional view of the line 3-C-3-C is shown. Figure 18As shown, the damping material 3-390 is disposed between the sensor 3-381 and the reference element 3-382 disposed on the carrier 3-330. That is, in the vertical direction (Z-axis), the damping material 3-390 overlaps the sensor 3-381 and the reference element 3-382. It should be understood that the disposition of the damping material 3-390 in this embodiment is merely exemplary. Because the damping material 3-390 has fluid-like properties, the position of the damping material 3-390 can vary slightly from one actual disposition to another, as long as the damping material 3-390 is disposed between the frame 3-310 and the carrier 3-330.
[0280] Figure 19 A bottom view showing the internal structure of the optical element driving mechanism 3-301 according to an embodiment of the present disclosure is shown. It should be understood that the base 3-320 is not shown in this embodiment in order to more clearly show the internal structure of the optical element driving mechanism 3-301. As shown, Figure 19 As shown, the second elastic element 3-360 is connected to the frame 3-310 and the carrier 3-330 and allows the carrier 3-330 to move along the Z-axis. The carrier 3-330 has a winding post 3-331 that extends along the Z-axis toward the base 3-320 (as shown). Figure 17 As shown, the winding post 3-331 can be used to dispose a wire such that the circuit component 3-370 is electrically connected to the driving coil 3-341.
[0281] In this embodiment, the second elastic element 3-360 and the winding post 3-331 do not overlap when viewed along the main axis 3-O, thereby reducing the probability that the winding post 3-331 will interfere with the second elastic element 3-360 and thus maintaining the normal operation of the optical element driving mechanism 3-301. Furthermore, the second elastic element 3-360 and the damping material 3-390 and the reference element 3-382 of the sensing component 3-380 at least partially overlap when viewed along the main axis 3-O. In other words, the damping material 3-390 is disposed between the second elastic element 3-360 and the reference element 3-382, thereby preventing the reference element 3-382 from being damaged by the movement of the second elastic element 3-360.
[0282] Figure 20 A bottom view showing the internal structure of the optical element driving mechanism 3-301 according to an embodiment of the present disclosure is shown. It should be understood that the base 3-320 and the second elastic element 3-360 are not shown in this embodiment in order to more clearly show the internal structure of the optical element driving mechanism 3-301. As shown, Figure 20As shown, one side of the outer frame 3-310 has a protrusion 3-315 that protrudes toward the support seat 3-330. Correspondingly, the support seat 3-330 has a recessed portion 3-332, and the protrusion 3-315 is accommodated in the recessed portion 3-332. Through the above design, the support seat 3-330 is prevented from rotating relative to the outer frame 3-310 about the main axis 3-O, thereby maintaining the normal operation of the optical element drive mechanism 3-301. In this embodiment, when viewed along the main axis 3-O, the damping material 3-390 does not overlap with the protrusion 3-315 and the recessed portion 3-332.
[0283] like Figure 20 As shown, the bearing base 3-330 further comprises a recess 3-333 configured to accommodate the reference element 3-382 of the sensing assembly 3-380, and a damping material 3-390 is disposed within the recess 3-333 and covers the reference element 3-382. In other words, as viewed along the major axis 3-O, the damping material 3-390 at least partially overlaps the sensing assembly 3-380. In this manner, the reference element 3-382 is protected by the recess 3-333 and the damping material 3-390, thereby reducing the likelihood of damage to the reference element 3-382.
[0284] Figure 21 show Figure 20 The partially enlarged stereogram of the region 3-R is shown. Figure 21 As shown, the bearing seat 3-330 and the outer frame 3-310 are respectively provided with corresponding recesses 3-335 and 3-314 to accommodate the damping material 3-390. The recesses 3-335 and 3-314 gradually widen toward the base 3-320 to facilitate the arrangement of the damping material 3-390. It should be noted that in this embodiment, the size of the recess 3-335 of the bearing seat 3-330 is different from the size of the recess 3-314 of the outer frame 3-310. For example, since the bottom surfaces of the bearing seat 3-330 and the outer frame 3-310 are located on different horizontal planes (XY planes), the recess 3-314 will extend further downward than the recess 3-335. This embodiment is only an example, and those skilled in the art in the technical field to which the present disclosure belongs can adjust the sizes of the recesses 3-335 and 3-314 as needed. Furthermore, in order to clearly illustrate the structure of the recesses 3-335 and 3-314, the damping material 3-390 is shown between the recesses 3-335 and 3-314. In some embodiments, the damping material 3-390 may also be disposed within the recesses 3-335 and 3-314, that is, when viewed along the Z-axis (major axis 3-O), the damping material 3-390 at least partially overlaps the outer frame 3-310 and the support base 3-330.
[0285] Figure 22 A partially enlarged stereoscopic view showing the internal structure of the optical element driving mechanism 3-301 according to an embodiment of the present disclosure is shown. Figure 22As shown, the reference element 3-382 is exposed on the side 3-334 of the carrier 3-330, and the side 3-334 is substantially perpendicular to the X-Y plane (i.e., substantially parallel to the main shaft 3-0). In the present embodiment, the reference element 3-382 and the sensor 3-381 at least partially overlap as viewed in the direction (Z-axis) of the movement of the carrier 3-330. The reference element 3-382 has two magnetic poles 3-382A, 3-382B with opposite magnetic polarities, and the magnetic poles 3-382A, 3-382B at least partially overlap the sensor 3-381 as viewed in the direction (Z-axis) of the movement of the carrier 3-330.
[0286] Figure 23 Figure 23 A partial enlarged perspective view showing the internal structure of the optical element driving mechanism 3-301 according to another embodiment of the present disclosure is shown. As shown, Figure 23 Figure 23 As shown, the reference element 3-382 is a multi-pole magnet, in other words, the two magnetic poles 3-382A, 3-382B with opposite magnetic polarities in the reference element 3-382 are separated from each other and generate magnetic fields in different directions, respectively. In the present embodiment, the sensor 3-381 detects the magnetic field changes in at least two directions (i.e., the magnetic field changes generated by the magnetic poles 3-382A, 3-382B), and the aforementioned directions are perpendicular to each other. For example, at least one of the aforementioned directions is substantially perpendicular to the direction of the movement of the carrier 3-330.
[0287] Figure 24 A perspective view showing the carrier 3-330 and the driving assembly 3-340 according to another embodiment of the present disclosure is shown. As shown, Figure 24 As shown, the optical element driving mechanism 3-301 can include a plurality of driving assemblies 3-340, which are respectively arranged at the four corners of the optical element driving mechanism 3-301. The sensor 3-381 is arranged between two of the aforementioned driving assemblies 3-340 (i.e., on one side of the optical element driving mechanism 3-301), so that the operation of the sensing assembly 3-380 can be avoided from being affected by the driving assemblies 3-340. It should be understood that, although the driving coil 3-341 is arranged on the carrier 3-330 and the magnetic element 3-342 is arranged outside the carrier 3-330 in the present embodiment, in other embodiments, the magnetic element 3-342 can be arranged on the carrier 3-330 and the driving coil 3-341 can be arranged outside the carrier 3-330, which will not be described herein again.
[0288] In summary, the present disclosure provides an optical element driving mechanism with damping material. With the above design, the carrier can reach the predetermined position faster, and the probability of collision between the carrier and the outer frame can be reduced, thereby protecting the carrier and the optical element carried thereby. In addition, the reference element is disposed in the groove and covered by the reference element, so that the reference element is protected by the groove and the damping material, thereby reducing the probability of damage to the reference element.
[0289] Figure 25 A perspective view of an optical element driving mechanism 4-1 and an optical element 4-2 according to some embodiments of the present disclosure. The optical element 4-2 has an optical axis 4-O, which is a virtual axis passing through the center of the optical element 4-2. Figure 26 is Figure 25 An exploded view of the optical element driving mechanism 4-1 in FIG. 1. The optical element driving mechanism 4-1 includes a fixed part 4-P1, a movable part 4-P2, a driving assembly 4-D, and a sensing assembly 4-S. The movable part 4-P2 moves relative to the fixed part 4-P1 and can carry the optical element 4-2. The driving assembly 4-D drives the movable part 4-P2 to move relative to the fixed part 4-P1. The sensing assembly 4-S senses the movement status of the movable part 4-P2 relative to the fixed part 4-P1.
[0290] The fixed part 4-P1 has a main shaft 4-M passing through the center of the optical element driving mechanism 4-1. It is worth noting that when the optical element driving mechanism 4-1, the optical element 4-2, and a photosensitive element (not shown) are aligned, for example, a charge-coupled detector (CCD), the optical axis 4-O of the optical element 4-2 also passes through the center of the optical element driving mechanism 4-1, so that the optical axis 4-O of the optical element 4-2 coincides with the main shaft 4-M of the fixed part 4-P1. However, since the optical element 4-2 is installed in the movable part 4-P2, the optical axis 4-O of the optical element 4-2 may not coincide with the main shaft 4-M of the fixed part 4-P1 due to the movement, shaking, or tilting of the movable part 4-P2. In the drawings, the optical axis 4-O or the main shaft 4-M can be used to assist in illustrating the related features of the optical element driving mechanism 4-1.
[0291] In this embodiment, the fixed part 4-P1 includes an outer frame 4-10, a reinforcing element 4-20, a circuit assembly 4-90, and a base 4-120. The movable part 4-P2 includes a first elastic element 4-30, a carrier 4-40, and two second elastic elements 4-100. The driving assembly 4-D includes two coils 4-50 and two magnetic elements 4-60. The sensing assembly 4-S includes a sensed object 4-70 and a sensing element 4-80. It should be understood that elements can be added or deleted according to user needs.
[0292] The outer frame 4-10 of the fixed part 4-P1 and the base 4-120 are arranged along the main shaft 4-M. The outer frame 4-10 is located above the base 4-120. The outer frame 4-10 is made of metal or non-metal material, such as plastic. The outer frame 4-10 made of non-metal material can block electromagnetic waves. In this way, the interference of electromagnetic waves generated by the antennas around the optical element driving mechanism 4-1 can be reduced.
[0293] The outer frame 4-10 made of plastic is usually made by injection molding. The corresponding mold is designed according to the actual needs (such as the structure of the outer frame 4-10). The outer frame 4-10 is manufactured by combining the mold to generate high pressure (clamping), injecting high-temperature molten plastic (injection), maintaining pressure (pressure holding), reducing temperature and shaping (cooling), opening the mold (opening), and ejecting the finished product (ejection). During the injection molding process, parameters such as material flow characteristics, material injection amount, and melting temperature can be controlled.
[0294] The outer frame 4-10 has a top wall 4-11 and four side walls 4-12 extending from the edges of the top wall 4-11 in a direction parallel to the main shaft 4-M. The side walls 4-12 of the outer frame 4-10 are fixedly connected to the base 4-120, and after the connection, the space formed inside can accommodate elements such as the movable part 4-P2, the driving assembly 4-D, and the sensing assembly 4-S.
[0295] The reinforcing element 4-20 is arranged in the outer frame 4-10, and the whole or part of the reinforcing element 4-20 does not protrude out of the outer frame 4-10. In some embodiments, the entire surface of the reinforcing element 4-20 directly contacts the side walls 4-12 of the outer frame 4-10. The reinforcing element 4-20 is made of a material with higher hardness than the outer frame 4-10, such as metal. In some embodiments, the reinforcing element 4-20 is made of iron. In order to prevent interference, the antennas around the optical element driving mechanism 4-1 are not arranged adjacent to one side of the reinforcing element 4-20.
[0296] It is worth noting that the side wall 4-12 of the outer frame 4-10 adjacent to the reinforcing element 4-20 has a plurality of holes 4-19, which are beneficial for the mold (such as a cylindrical mold) to pass through to fix the reinforcing element 4-20 and can have a heat dissipation effect. In addition, the reinforcing element 4-20 has two hollow holes 4-21. In the process of the optical element driving mechanism 4-1, the plastic material forming the outer frame 4-10 can enter the hollow holes 4-21 in a high-temperature molten state, thereby generating the engagement force between the outer frame 4-10 and the reinforcing element 4-20. That is, the arrangement of the hollow holes 4-21 can increase the contact area between the outer frame 4-10 and the reinforcing element 4-20 and strengthen the connection between the outer frame 4-10 and the reinforcing element 4-20.
[0297] The circuit assembly 4-90 is disposed on one side of the optical element driving mechanism 4-1. The circuit assembly 4-90 can be a circuit board, such as a flexible printed circuit (FPC) or a rigid-flex printed circuit, and the like. The base 4-120 further includes two circuit members 4-110. The circuit members 4-110 are wholly or partially embedded in the base 4-120 to electrically connect with other elements. For example, the base 4-120 includes four protruding columns 4-125, and the circuit members 4-110 are partially embedded in the protruding columns 4-125 to not only electrically connect with the base 4-120 but also improve the mechanical strength of the optical element driving mechanism 4-1 as a whole.
[0298] In some embodiments, the optical element driving mechanism further includes four damping elements 4-130 disposed on the protruding columns 4-125. For simplicity, only one of the four damping elements 4-130 is shown. The damping element 4-130 is located between the carrier 4-40 and the protruding column 4-125. The protruding column 4-125 can have a shape similar to a ladder to prevent the damping element 4-130 from flowing. The damping element 4-130 is a material, such as a gel, that can absorb impact and has a shock-absorbing effect. When the optical element driving mechanism 4-1 is impacted by external force, the damping element 4-130 can prevent the movable part 4-P2 from colliding with the fixed part 4-P1 too violently. Furthermore, the damping element 4-130 can help the carrier 4-40 quickly return to its original position when impacted and can prevent the optical element 4-2 in the carrier 4-40 from being unstable. Therefore, the damping element 4-130 can improve the reaction time and accuracy of the carrier 4-40 when moving.
[0299] The first elastic element 4-30 of the movable part 4-P2, the carrier 4-40, and the second elastic element 4-100 are sequentially arranged along the main shaft 4-M. The carrier 4-40 has a through hole 4-41 to carry the optical element 4-2, and the through hole 4-41 and the optical element 4-2 can be configured with corresponding screw structures to fix the optical element 4-2 to the carrier 4-40.
[0300] The first elastic element 4-30 and the second elastic element 4-100 can be made of a metal material. The carrier 4-40 is elastically clamped by the first elastic element 4-30 and the second elastic element 4-100 to be movably connected to the outer frame 4-10 of the fixed part 4-P1 and the base 4-120. In detail, the first elastic element 4-30 connects the portion of the base 4-120 and the top surface of the carrier 4-40, and the second elastic element 4-100 connects the portion of the base 4-120 and the bottom surface of the carrier 4-40.
[0301] The clamping of the first elastic element 4-30 and the second elastic element 4-100 prevents the carrier 4-40 from directly contacting the frame 4-10 and the base 4-120, and limits the movement range of the carrier 4-40, so as to avoid damage to the carrier 4-40 and the optical element 4-2 in the carrier 4-40 due to collision with the frame 4-10 or the base 4-120 when the optical element driving mechanism 4-1 moves or is impacted by external force.
[0302] The coil 4-50 and the magnetic element 4-60 of the driving assembly 4-D are arranged in positions corresponding to each other and adjacent to the carrier 4-40. The magnetic element 4-60 can be a permanent magnet. The magnetic element 4-60 can be a multi-pole magnet or a plurality of magnets bonded together. The arrangement direction of the two pairs of magnetic poles (N-pole and S-pole) of the magnetic element 4-60 is perpendicular to the main shaft 4-M. The coil 4-50 and the magnetic element 4-60 are substantially rectangular in profile, and the long side of the coil 4-50 corresponds to the long side of the magnetic element 4-60. When the coil 4-50 is supplied with current, a magnetic force can be generated between the coil 4-50 and the magnetic element 4-60, thereby driving the carrier 4-40 and the optical element 4-2 in the carrier 4-40 to move in a direction parallel to the optical axis 4-O, achieving the function of auto focus (AF) to focus on the object being photographed. The coil 4-50 has a winding shaft 4-W, and the winding shaft 4-W is substantially perpendicular to the main shaft 4-M. The coil 4-50 is formed around the winding shaft 4-W. Compared with the arrangement mode in which the winding shaft 4-W is parallel to the main shaft 4-M, the coil 4-50 in the embodiment can reduce the size of the optical element driving mechanism 4-1 in the direction perpendicular to the main shaft 4-M.
[0303] The sensed object 4-70 and the sensing element 4-80 of the sensing assembly 4-S are arranged in positions corresponding to each other (as shown in FIG. 4B). Figure 34 The carrier 4-40 accommodates the sensed object 4-70. The sensing element 4-80 is mounted to the circuit assembly 4-90 in a surface mount technology (SMT) or the like and is electrically connected to the electric assembly 4-90. The sensed object 4-70 can be a magnetic element, for example, a magnet. The sensing element 4-80 can be a giant magneto resistance (GMR) sensing element or a tunneling magneto resistance (TMR) sensing element. When the carrier 4-40 moves, the sensed object 4-70 also moves with the carrier 4-40, and the magnetic field of the sensed object 4-70 changes. The sensing element 4-80 can detect the change of the magnetic field of the sensed object 4-70, thereby obtaining the position of the carrier 4-40 and adjusting the position of the carrier 4-40, achieving the effect of accurately controlling the displacement of the carrier 4-40.
[0304] Figure 27 is a top view of the outer frame 4-10. The outer frame 4-10 is a polygon. In this embodiment, the outer frame 4-10 is a rectangle. The outer frame 4-10 includes two recesses 4-13, which are located at different corners of the outer frame 4-10 when viewed along the major axis 4-M. The recesses 4-13 are used as gates for injecting material during the injection molding of the outer frame 4-10. If there is only one gate, it is difficult to control the flow of the material.
[0305] Figure 28 and Figure 29 are perspective views of the outer frame 4-10 from different angles. The outer frame 4-10 includes a receiving structure 4-14 for receiving the circuit assembly 4-90. In order to clearly show the receiving structure 4-14, the circuit assembly 4-90 is not shown in Figure 28 and Figure 29 . The receiving structure 4-14 can be understood by referring to Figure 34 and Figure 39 . Please refer back to Figure 28 and Figure 29 . The receiving structure 4-14 extends from the top wall 4-11 of the outer frame 4-10. The receiving structure 4-14 includes at least one narrow portion 4-141, which corresponds to the circuit assembly 4-90 and can secure the circuit assembly 4-90. The narrow portion 4-141 is advantageous for increasing the structural strength of the mold during plastic molding. This is because a mold with a specific shape is required to produce the receiving structure 4-14. If the receiving structure 4-14 does not have the narrow portion 4-141, the space inside the receiving structure 4-14 is approximately a cuboid, and the mold used to form the receiving structure 4-14 is also a cuboid. The cuboid mold can be more prone to breaking or damage after repeated use. However, if the cuboid mold has protrusions, such a mold structure is more robust during molding and can form the narrow portion 4-141 in the receiving structure 4-14.
[0306] The optical element driving mechanism 4-1 can further include an adhesive element 4-140. The adhesive element 4-140 can be an adhesive material or an insulating material, such as a resin material. The adhesive element 4-140 can adhere different elements. In addition, the adhesive element 4-140 generally has good elasticity and covering power, and applying the adhesive element 4-140 to the elements can protect the elements and reduce the probability of impurities such as dust and moisture entering the elements. If the adhesive element 4-140 is an insulating material, an insulating effect can be achieved. The operation of applying the adhesive element 4-140 is generally referred to as "gluing", which can be performed manually or mechanically.
[0307] After the circuit assembly 4-90 is placed in the receiving structure 4-14, adhesive elements 4-140 may be placed on the circuit assembly 4-90, for example, in the center and at three locations on both sides of the circuit assembly 4-90, to strengthen the connection between the circuit assembly 4-90 and the outer frame 4-10. In some embodiments, the adhesive elements 4-140 directly contact the circuit assembly 4-90, the sidewalls 4-12 of the outer frame 4-10, and the receiving structure 4-14, so that the circuit assembly 4-90 does not move or collide with other components.
[0308] like Figure 29 As shown, the outer frame 4-10 includes four fixing structures 4-15 for fixing the magnetic element 4-60 of the drive assembly 4-D. If the outer frame 4-10 is made of a metal material or a magnetic material, the outer frame 4-10 can generate a magnetic force with the magnetic element 4-60, thereby fixing the magnetic element 4-60. However, if the magnetic force generated between the outer frame 4-10 and the magnetic element 4-60 is insufficient or if the outer frame 4-10 is made of a non-metallic material, the outer frame 4-10 having the fixing structures 4-15 can better fix the magnetic element 4-60. Figure 30 It is a perspective view of a portion of the outer frame 4-10, showing how the fixing structure 4-15 fixes the magnetic element 4-60. In addition, an adhesive element 4-140 can also be applied between the magnetic element 4-60 and the outer frame 4-10.
[0309] exist Figure 31 as well as Figure 32 The first elastic element 4-30 is further shown. Figure 31 This is a bottom view of the outer frame 4-10. Figure 32 This is a bottom view of the outer frame 4-10. Figure 31 as well as Figure 32 As shown, the fixing structure 4-15 does not directly contact the side wall 4-12, but has a gap 4-16 (indicated by a dotted line) between it and the side wall 4-12. In order to take into account the integrity of the first elastic element 4-30 and avoid the first elastic element 4-30 from breaking, a portion of the first elastic element 4-30 is arranged in the gap 4-16.
[0310] It is worth noting that the adhesive element 4-140 can be set in the gap 4-16 so that the adhesive element 4-140 contacts the outer frame 4-10, the first elastic element 4-30 and the magnetic element 4-60. Because the adhesive element 4-140 has fluidity, it can be evenly distributed on the surface of the first elastic element 4-30 and the magnetic element 4-60. In this way, it is only necessary to apply the adhesive element 4-140 once (i.e., dispensing) to simultaneously adhere the outer frame 4-10, the first elastic element 4-30 and the magnetic element 4-60. Compared with separately adhering the outer frame 4-10 and the first elastic element 4-30 and adhering the outer frame 4-10 and the magnetic element 4-60, adhering multiple elements at the same time can simplify the process, improve production efficiency, and also increase the bonding strength.
[0311] Figure 33 Schematic diagram of the reinforcing element 4-20 and the circuit assembly 4-90. The reinforcing element 4-20 corresponds to the sensing element 4-80 on the circuit assembly 4-90. That is, when viewed in a direction perpendicular to the principal axis 4-M, the reinforcing element 4-20 and the sensing element 4-80 at least partially overlap, and the reinforcing element 4-20 thus protects the sensing element 4-80.
[0312] Figure 34 Along Figure 25 A cross-sectional view of the optical element drive mechanism 4-1 taken along line segment 4-A-4-A' in FIG. When viewed in a direction perpendicular to the principal axis 4-M, the outer frame 4-10 and the circuit assembly 4-90 at least partially overlap. Furthermore, the strengthening element 4-20 can also enhance the structural strength of the outer frame 4-10. In this embodiment, when viewed in a direction perpendicular to the principal axis 4-M, the strengthening element 4-20, the sensed object 4-70, the sensing element 4-80, and the circuit assembly 4-90 at least partially overlap.
[0313] Next, please refer to Figures 35 to 37 . Figure 35 It is a perspective view of a portion of the outer frame 4-10. Figure 36 It is a three-dimensional view of a portion of the base 4-120. Figure 37is a cross-sectional view of the portion of the outer frame 4-10 and the base 4-120. The sidewall 4-12 of the outer frame 4-10 includes a groove 4-17 adjacent to the base 4-120. The base 4-120 includes a recess 4-127 corresponding to the groove 4-17. When the outer frame 4-10 is coupled to the base 4-120, there is a space between the groove 4-17 and the base 4-120 so that the outer frame 4-10 and the base 4-120 are not completely sealed. Because the plastic outer frame 4-10 can generate some burrs, burs, etc. during the process, the groove 4-17 is generated by cutting part of the outer frame 4-10 to prevent the burrs, burs, etc. of the outer frame 4-10 from exceeding the assembly surface of the outer frame 4-10 and the base 4-120 when the outer frame 4-10 is assembled with the base 4-120. Moreover, it is difficult for the plastic part to generate a straight angle of 90 degrees, and the groove 17 is designed to facilitate assembly. In addition, an adhesive element 4-140 can be disposed in the groove 4-17 to strengthen the connection of the outer frame 4-10 and the base 4-120.
[0314] Figure 38 is a perspective view of the portion of the outer frame 4-10 and the base 4-120. Please refer to Figure 28 , the outer frame 4-10 includes four protrusions 4-18, which are disposed on opposite sides of the sidewall 4-12 of the outer frame 4-10. The outer frame 4-10 includes a concave portion 4-181 located in the central portion of the protrusion 4-18. The edge of the protrusion 4-18 includes a bevel 4-182. The concave portion 4-181 can serve as a position for the ejection operation in the process of the outer frame 4-10. Please refer to Figure 38 , the base 4-120 includes two openings 4-128, only one of which is shown. The protrusion 4-18 of the outer frame 4-10 and the opening 4-128 of the base 4-120 correspond to each other in shape, and the protrusion 4-18 and the concave portion 4-181 are located in the opening 4-128. When viewed in the direction of the vertical main axis 4-M, the protrusion 4-18 and the opening 4-128 at least partially overlap. Such a design can make the outer frame 4-10 and the base 4-120 more closely combined.
[0315] The adhesive member 4-140 can be disposed on the protrusion 4-18 of the side wall 4-12 of the outer frame 4-10 and the opening 4-128 of the base 4-120, such that the adhesive member 4-140 contacts the side wall 4-12 of the outer frame 4-10, the protrusion 4-18 of the outer frame 4-10, and the opening 4-128 of the base 4-120. As described above, because the adhesive member 4-140 has fluidity, the adhesive member 4-140 can flow to the inner recess 4-181 in the center of the protrusion 4-18 and the inclined surface 4-182 of the edge. The inclined surface 4-182, because it has an inclination, facilitates the flow of the adhesive member 4-140 and can accommodate the adhesive member 4-140. In addition, when the amount of the adhesive member 4-140 is excessive, it can accumulate on the inclined surface 4-182 and can be removed by manual or mechanical means.
[0316] Figure 39 is a cross-sectional view of a portion of the optical element driving mechanism 4-1 along the line segment 4-A-4-A' in Figure 25 Although the carrier 4-40 is elastically clamped by the first elastic member 4-30 and the second elastic member 4-100, the carrier 4-40 can still wobble and collide with the base 4-120 due to gravity and external forces. The base 4-120 includes a first stopper assembly 4-121 and a second stopper assembly 4-122 to limit the range of motion of the carrier 4-40 relative to the base 4-120. In detail, the first stopper assembly 4-121 extends along a direction parallel to the main axis 4-M and can limit the range of motion of the carrier 4-40 relative to the base 4-120 along a direction perpendicular to the main axis 4-M. The second stopper assembly 4-122 extends along a direction perpendicular to the main axis 4-M and can limit the range of motion of the carrier 4-40 relative to the base 4-120 along a direction parallel to the main axis 4-M.
[0317] In addition, on the side of the base 4-120 where the first stopper assembly 4-121 is disposed, the base 4-120 can further include a third stopper assembly (not shown) spaced apart from the first stopper assembly 4-121 and likewise used to limit the range of motion of the carrier 4-40 relative to the base 4-120, as viewed along the main axis 4-M.
[0318] The first stopper assembly 4-121 includes a protrusion 4-1211. The protrusion 4-1211 extends toward the top wall 4-11 of the outer frame 4-10 and is adjacent to the side wall 4-12 of the outer frame 4-10. As viewed along a direction perpendicular to the main axis 4-M, the side wall 4-12 at least partially overlaps the protrusion 4-1211.
[0319] The circuit component 4-90 is received in the receiving structure 4-14 and is located between the side wall 4-12 and the protrusion 4-1211. Notably, an adhesive element 4-140 (not shown) can be additionally provided between the protrusion 4-1211 and the circuit component 4-90 or between the protrusion 4-1211 and the side wall 4-12 of the outer frame 4-10 to further secure the circuit component 4-90.
[0320] The base 4-120 further comprises a support structure 4-123 which contacts the circuit component 4-90. The support structure 4-123 extends away from the top wall 4-11 of the outer frame 4-10. In the direction of the main axis 4-M, the width of the support structure 4-123 is narrower as it is further away from the top wall 4-11 of the outer frame 4-10, although the shape of the support structure 4-123 is not limited to the present embodiment. The protrusion 4-1211 and the support structure 4-123 are located on the same side of the base 4-120 when viewed along the main axis 4-M. Furthermore, the protrusion 4-1211 and the support structure 4-123 at least partially overlap when viewed along the main axis 4-M. In addition, the protrusion 4-1211 and the support structure 4-123 are located on different sides of the base 4-120 when viewed in a direction perpendicular to the main axis 4-M.
[0321] The circuit component 4-90 can be a flexible circuit board and has a flexible property. The support structure 4-123 supports the circuit component 4-90 to prevent the circuit component 4-90 from deforming. There can be a plurality of support structures 4-123. The support structure 4-123 and the circuit component 4-90 at least partially overlap when viewed in a direction perpendicular to the main axis 4-M.
[0322] Figure 40 and Figure 41 Different perspective views of the carrier 4-40. The carrier 4-40 comprises a plurality of upper stop portions 4-42, a plurality of lower stop portions 4-43 and two electrical connection portions 4-44. The upper stop portions 4-42 and the lower stop portions 4-43 are located on different sides of the carrier 4-40 when viewed in a direction perpendicular to the main axis 4-M. In detail, the upper stop portions 4-42 are closer to the light entrance than the lower stop portions 4-43. The upper stop portions 4-42 and the lower stop portions 4-43 can limit the range of movement of the carrier 4-40 relative to the outer frame 4-10 and the base 4-120, respectively. The upper stop portions 4-42 correspond to portions of the top wall 4-11 of the outer frame 4-10, while the lower stop portions 4-43 correspond to the second stop component 4-122 of the base 4-120. However, the top wall 4-11 of the outer frame 4-10 can also have a structure similar to the second stop component 4-122 to correspond to the upper stop portions 4-42.
[0323] When the driving assembly 4-D drives the carrier 4-40 to move to the extreme range along the optical axis 4-O, the upper stopper 4-42 contacts the top wall 4-11 of the outer frame 4-10, or the lower stopper 4-43 contacts the second stopper 4-122 of the base 4-120. Therefore, the remaining portion of the carrier 4-40 does not contact the outer frame 4-10 or the base 4-120, thereby preventing the remaining portion of the carrier 4-40 from colliding with the outer frame 4-10 or the base 4-120.
[0324] As described above, the upper stop portion 4-42, the lower stop portion 4-43, the first stop assembly 4-121, and the second stop assembly 4-122 can prevent the support seat 4-40 and the optical element 4-2 therein from being damaged by colliding with the outer frame 4-10 or the base 4-120. Furthermore, the number and position of the upper stop portion 4-42, the lower stop portion 4-43, the first stop assembly 4-121, and the second stop assembly 4-122 can be further adjusted. For example, in order to effectively disperse the impact force and enhance the overall stability of the optical element driving mechanism 4-1, more than three upper stop portions 4-42, the lower stop portion 4-43, the first stop assembly 4-121, and the second stop assembly 4-122 can be provided.
[0325] The electrical connection portion 4-44 is used to electrically connect to the coil 4-50 of the drive component 4-D. The two coils 4-50 are located on opposite sides of the support base 4-40, and the two electrical connection portions 4-44 are also located on opposite sides of the support base 4-40. The coil 4-50 includes a lead 4-51, which is connected from the coil 4-50 and surrounds the electrical connection portion 4-44. The coil 4-50 can be electrically connected to other components by soldering on the electrical connection portion 4-44. When viewed in a direction perpendicular to the main axis 4-M, the lower stop portion 4-43 and the electrical connection portion 4-44 are arranged on the same side of the support base 4-40. Moreover, when viewed in a direction perpendicular to the main axis 4-M, the lower stop portion 4-43 and the electrical connection portion 4-44 partially overlap.
[0326] It is worth noting that Figure 40 As shown, the object to be sensed 4-70 accommodated by the support base 4-40 is located below the upper stop portion 4-42. When viewed along the main axis 4-M, the upper stop portion 4-42 and the object to be sensed 4-70 at least partially overlap. In this way, there is no need to design additional space on the support base 4-40 to accommodate the object to be sensed 4-70, and the thickness of the support base 4-40 in the direction of the main axis 4-M can be reduced.
[0327] Figure 42 It is a side view of the support seat 4-40. Figure 43 It is a schematic diagram of the support seat 4-40 and the base 4-120. Figure 42As shown, the electrical connection portion 4-44 is more protruding than the lower stop portion 4-43, so that the lead wire 4-51 can be wound more turns on the electrical connection portion 4-44, and the coil 4-50 can be electrically connected to other elements (e.g. the second elastic element 4-100) without poor contact. However, the electrical connection portion 4-44 should be avoided from colliding with other elements as much as possible. By providing the second stop assembly 4-122 on the base 4-120, when the carrier 4-40 moves to the limit range, the lower stop portion 4-43 will touch the second stop assembly 4-122, so that the electrical connection portion 4-44 will not touch the base 4-120.
[0328] The base 4-120 includes a bottom surface 4-1201, which is the surface of the base 4-120 farthest away from the carrier 4-40 in the direction of the main shaft 4-M. As shown, Figure 43 As shown, the shortest distance 4-L1 between the electrical connection portion 4-44 and the base 4-120 is greater than the shortest distance 4-L2 between the lower stop portion 4-43 and the base 4-120, but the shortest distance 4-L3 between the electrical connection portion 4-44 and the bottom surface 4-1201 of the base 4-120 is less than the shortest distance 4-L4 between the lower stop portion 4-43 and the bottom surface 4-1201 of the base 4-120.
[0329] The carrier 4-40 includes a guide structure 4-45. Figure 44 is a schematic view of the guide structure 4-45. The guide structure 4-45 is adjacent to the coil 4-50 of the driving assembly 4-D, and has a recess. When viewed in the direction of the main shaft 4-M, the part of the coil 4-50 other than the lead wire 4-51 does not overlap the guide structure 4-45. After the lead wire 4-51 of the coil 4-50 is taken out, it passes through the guide structure 4-45, and is connected to the electrical connection portion 4-44. The guide structure 4-45 can protect the lead wire 4-51 from being damaged. In addition, although the optical element driving mechanism 4-1 has two coils 4-50, the two lead wires 4-51 are taken out from the upper half and the lower half of the two coils 4-50 respectively, and only the lead wire 4-51 taken out from the upper half of the coil 4-50 needs to be provided with the guide structure 4-45.
[0330] In summary, the present disclosure provides an optical element driving mechanism. When the outer frame is made of non-metallic material, the electromagnetic wave interference can be blocked. Moreover, the outer frame has a special structure, which can cooperate with other elements, such as the driving assembly, the circuit assembly, etc. Reinforcing elements can be additionally provided to reinforce the structure. The outer frame, the carrier, and the base can respectively have portions for stopping to prevent the collision between the movable part and the fixed part. By providing the guide structure, the driving assembly can be protected.
[0331] Although the present disclosure has been disclosed with reference to the above embodiments, it will be understood that many changes can be made and equivalents employed, without departing from the scope of the disclosure as defined by the appended claims. Therefore, individual features of the above described embodiments should not necessarily be considered as limiting the scope of the disclosure, but rather the scope of the disclosure is to be construed as encompassing all features which would be treated as equivalents thereof by those skilled in the art to which the present disclosure pertains. Furthermore, the disclosure is not intended to be limited to the embodiments described herein, but should be given the broadest possible interpretation within the terms of the appended claims so as to include any and all implementations thereof.
Claims
1. An optical element driving mechanism having a main shaft, comprising: a fixing portion, comprising an outer frame and a base, wherein the outer frame and the base form a rectangular structure surrounding the main axis, wherein the outer frame includes a top surface and a plurality of side walls, the top surface being perpendicular to the main axis, and the plurality of side walls being non-parallel to the top surface, the outer frame and the base being connected to each other and combined into a hollow box body; a movable portion connected to an optical element and moving relative to the fixed portion; a driving assembly for driving the movable portion to move relative to the fixed portion; a circuit component disposed in the fixing portion and electrically connected to the driving component; and An elastic element is connected to the fixed portion and the movable portion and is located between the outer frame and the base. The elastic element is surrounded by the outer frame and accommodated in the box body, wherein the elastic element is formed with a plurality of glue holes, and the plurality of glue holes are located on both sides of the rectangular structure. When observed along the main axis, the outer frame and the plurality of glue holes do not overlap. 2 . The optical element driving mechanism as claimed in claim 1 , wherein the circuit component is embedded in the outer frame.
3. The optical element driving mechanism as claimed in claim 2, wherein the circuit component is embedded in one of the plurality of side walls. 4 . The optical element driving mechanism as claimed in claim 1 , wherein the circuit component is disposed at at least one corner of the rectangular structure. 5 . The optical element driving mechanism as claimed in claim 1 , wherein when viewed along the main axis, the plurality of side walls of the outer frame and the elastic element overlap. 6 . The optical element driving mechanism as claimed in claim 5 , wherein the base exposes the elastic element when viewed along the main axis. 7 . The optical element driving mechanism as claimed in claim 5 , wherein the outer frame further has a positioning post extending along the main axis toward the base, and the elastic element corresponds to the positioning post. 8 . The optical element driving mechanism of claim 7 , wherein the base and the positioning post do not overlap when viewed along the main axis.
9. An optical element driving mechanism as described in claim 1, wherein the movable part includes a supporting seat for supporting the optical element, the supporting seat has a winding post extending along the main axis toward the base, the base has a groove, and when viewed along the main axis, the groove and the winding post overlap.
10. The optical element driving mechanism as claimed in claim 9, wherein the base has a stop portion extending along the main axis toward the outer frame, and when viewed along the main axis, the stop portion and the winding post are located on the same side of the rectangular structure.
11. The optical element driving mechanism as claimed in claim 9, wherein one side of the outer frame has a protrusion protruding toward the supporting seat, the supporting seat has a recessed portion, and the protrusion is accommodated in the recessed portion. 12 . The optical element driving mechanism of claim 11 , wherein when viewed along the main axis, the protrusion protrudes inward from the side wall of the outer frame.
13. The optical element driving mechanism as described in claim 1, wherein the driving component includes a magnetic element and a driving coil, one of the magnetic element and the driving coil is disposed on the fixed portion, and the other of the magnetic element and the driving coil is disposed on the movable portion.
14. The optical element driving mechanism as described in claim 1 further includes a sensing component for sensing the movement of the movable part relative to the fixed part, wherein the driving component is arranged at a corner of the rectangular structure, and the sensing component is arranged at another corner of the rectangular structure, and the corner and the other corner are different corners.
15. The optical element driving mechanism according to claim 14, wherein the circuit assembly further comprises: a drive assembly connection portion, embedded in the base and electrically connected to the drive assembly; as well as A sensing component connecting portion is embedded in the outer frame and electrically connected to the sensing component.
16. An optical element driving mechanism as described in claim 1, wherein when viewed along the main axis, the rectangular structure has an opening, a first side and a second side relative to the first side, and the shortest distance between the opening and the first side is greater than the shortest distance between the opening and the second side. 17 . The optical element driving mechanism as claimed in claim 16 , wherein the exposed portion of the circuit component is disposed on the first side of the rectangular structure. 18 . The optical element driving mechanism of claim 16 , wherein when viewed along the main axis, the plurality of side edges are perpendicular to the first side edge and the second side edge. 19 . The optical element driving mechanism of claim 18 , wherein the elastic element further comprises a plurality of chord portions, and at least two of the plurality of chord portions extend to one of the plurality of glue holes.
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