Heat dissipation type PCB assembly structure and assembly method thereof

Abstract

The present invention provides a heat dissipation type PCB assembly structure, comprising a PCB board, a conduction structure arranged on the PCB board, the conduction structure comprising a tubular structure and a metal microfluidic tube, a liquid inlet and a liquid outlet arranged on the tubular structure, a liquid inlet arranged at one end of the metal microfluidic tube, a liquid outlet arranged at the other end of the metal microfluidic tube, the liquid outlet end of the metal microfluidic tube and the liquid inlet end of the tubular structure are interconnected, a microfluidic module is arranged on the upper surface of the tubular structure, a chip is arranged on the microfluidic module, the microfluidic module and the tubular structure form a heat conduction structure, and the liquid inlet end of the metal microfluidic tube is connected to a cold liquid supply device. The heat dissipation type PCB assembly structure and its assembly process of the present invention manufacture a frame with a multi-layer liquid supply pipeline, one end of the frame and the PCB board are nested together, and then the power module is welded layer by layer on the microfluidic frame through a patch process, so that each layer of the module can have an independent heat dissipation microfluidic heat dissipation, thereby increasing the heat dissipation capacity and reliability of the module.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a heat dissipation type PCB assembly structure and an assembly method thereof. Background Art

[0002] Microwave millimeter wave radio frequency integrated circuit technology is the foundation of modern national defense weapons and equipment and the Internet industry. With the rapid rise of the "Internet +" economy such as smart communications, smart homes, smart logistics, and smart transportation, there is also a huge real demand and potential market for microwave millimeter wave radio frequency integrated circuits that undertake data access and transmission functions.

[0003] However, for high-frequency microsystems, the area of ​​the antenna array is getting smaller and smaller, and the distance between antennas must be kept within a certain range to enable the entire module to have excellent communication capabilities. However, for analog device chips such as RF chips, their area cannot be reduced exponentially like digital chips, so the ultra-high frequency RF microsystem will not have enough area to place PA / LNA at the same time, and the PA / LNA needs to be stacked or placed vertically.

[0004] Such a heat dissipation structure requires the use of more advanced liquid cooling or phase change cooling technology. Generally, the base of the RF module is made by metal processing, and a micro-channel is set inside the base. The module is fixed on the metal base by welding to complete the placement of the chip. However, with this stacking technology, the heat on the power chip needs to pass through several layers of medium to be transferred to the heat dissipation liquid, which is inefficient.

[0005] In order to further reduce the distance between the heat dissipation microchannel and the heat-generating chip, the current trend is to directly weld the microchannel heat sink under the chip, which can directly transfer the heat of the chip to the microchannel and increase the heat dissipation capacity of the system. However, for multi-layer modules, the upper chip still cannot contact the microchannel, or can only circulate liquid through the microchannel of the module. This heat dissipation efficiency is greatly different from the direct heat dissipation of the microchannel heat sink at the bottom, which will cause the operating temperature of the upper and lower chips to be inconsistent for a long time, resulting in reliability problems. Summary of the invention

[0006] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a heat dissipation type PCB assembly structure and an assembly method thereof to increase the heat dissipation capacity and reliability of the module. The technical solution adopted by the present invention is:

[0007] A heat dissipation type PCB assembly structure, comprising a PCB board, a conduction structure arranged on the PCB board, the conduction structure comprising a tubular structure and a metal microfluidic tube, a liquid inlet and a liquid outlet arranged on the tubular structure, a liquid inlet arranged at one end of the metal microfluidic tube, a liquid outlet arranged at the other end of the metal microfluidic tube, the liquid outlet end of the metal microfluidic tube and the liquid inlet end of the tubular structure are interconnected, a microfluidic module is arranged on the upper surface of the tubular structure, a chip is arranged on the microfluidic module, the microfluidic module and the tubular structure form a heat-conducting structure, and the liquid inlet end of the metal microfluidic tube is connected to a cold liquid supply device.

[0008] Preferably, in the heat dissipation type PCB assembly structure, the metal microfluidic tube is a straight tube or a curved tube.

[0009] Preferably, in the heat dissipation type PCB assembly structure, the bent pipe includes a vertical liquid inlet pipe and a horizontal connecting pipe, a liquid inlet is arranged at one end of the liquid inlet pipe away from the connecting pipe, and a liquid outlet is arranged at one end of the connecting pipe away from the liquid inlet pipe; the straight pipe is provided with a liquid inlet at one end and a liquid outlet at the other end.

[0010] Preferably, in the heat dissipation type PCB assembly structure, when the metal microfluidic tube is a curved tube, a first through hole and a second through hole are arranged on the PCB board, a liquid inlet pipe of the curved tube is arranged in the first through hole, a connecting pipe of the curved tube is arranged on the outside of the PCB board, and the liquid outlet end of the curved tube is interconnected with the liquid inlet end of the tubular structure through the second through hole.

[0011] Preferably, in the heat dissipation type PCB assembly structure, when the metal microfluidic tube is a curved tube, a third through hole, a fourth through hole and a first groove are arranged on the PCB board, a liquid inlet pipe of the curved tube is arranged in the third through hole, a connecting pipe of the curved tube is arranged in the first groove, and the liquid outlet end of the curved tube is interconnected with the liquid inlet end of the tubular structure through the fourth through hole.

[0012] Preferably, in the heat dissipation type PCB assembly structure, when the metal micro-channel tube is a curved tube, a second groove is provided on the PCB board, and a conducting structure is provided in the second groove.

[0013] Preferably, in the heat dissipation type PCB assembly structure, when the metal microfluidic tube is a straight tube, a fifth through hole and a third groove are provided on the PCB board, the straight tube is provided at the outer end of the PCB board, a tubular structure is provided in the third groove, and the liquid outlet end of the straight tube is interconnected with the liquid inlet end of the tubular structure through the fifth through hole.

[0014] Preferably, the heat dissipation type PCB assembly structure, wherein the microfluidic module includes a first substrate and a second substrate arranged on the first substrate, a plurality of TSV conductive columns are arranged at intervals in the first substrate, microfluidics are arranged on the first substrate between two adjacent TSV conductive columns, and RDL and pads are arranged on the upper and lower surfaces of the first substrate; a plurality of TSV conductive columns are arranged at intervals in the second substrate, and RDL and pads are arranged on the upper and lower surfaces of the second substrate; the first substrate and the second substrate are pressed together to form a closed microfluidic channel, a plurality of sixth through holes are arranged on the first substrate, and the sixth through holes are opened corresponding to the positions of the microfluidic channels.

[0015] A method for assembling a heat dissipation type PCB assembly structure, comprising the following steps:

[0016] (a) providing a first substrate, manufacturing TSV conductive pillars, RDL and pads on the upper surface of the first substrate, performing temporary bonding on the upper surface of the first substrate, thinning the lower surface of the first substrate to expose the back of the TSV conductive pillars, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars, then manufacturing RDL and pads on the lower surface of the first substrate, and etching microchannels;

[0017] (b) providing a second substrate, manufacturing TSV conductive pillars, RDL and interconnect pads on the upper surface of the second substrate, performing temporary bonding on the upper surface of the second substrate, thinning the lower surface of the second substrate to expose the back of the TSV, covering it with a passivation layer, polishing it to expose the metal on the back of the TSV, and then manufacturing RDL and pads on the lower surface of the first substrate;

[0018] (c) pressing the first substrate and the second substrate together by bonding to form a closed microfluidic channel, making a sixth through hole on the surface of the first substrate to connect the microfluidic channel to the outside, planting balls on both sides of the sixth through hole, and cutting to obtain a microfluidic channel module;

[0019] (d) providing an upper cover plate and a carrier plate, wherein a groove is provided on the upper cover plate, and a through hole is provided on the carrier plate, and the upper cover plate and the carrier plate are welded together to form a tubular structure with a microfluidic channel; and providing a metal microfluidic channel tube, wherein the metal microfluidic channel tube and the tubular structure can be interconnected;

[0020] (e) providing a PCB board, and fixing the metal microfluidic tube and the tubular structure on the PCB board by welding;

[0021] (f) A microfluidic module is mounted on the surface of the tubular structure, and then a chip is mounted on top of the microfluidic module. The microfluidic module and the tubular structure are interconnected to form a heat-conducting structure. A liquid cooling supply device is connected to one end of the metal microfluidic tube to obtain a heat-dissipating PCB assembly structure.

[0022] The advantages of the present invention are as follows: the heat dissipation type PCB assembly structure and assembly process of the present invention manufacture a conductive structure frame with a multi-layer liquid supply pipeline, one end of the conductive structure frame and the PCB board are nested together, and then the microfluidic module is welded layer by layer on the conductive structure frame through a patch process, so that each layer of the microfluidic module can have an independent heat dissipation microfluidic channel for heat dissipation, thereby increasing the heat dissipation capacity and reliability of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the first substrate of the present invention.

[0024] Figure 2 Schematic diagram of the second substrate of the present invention.

[0025] Figure 3 This is a schematic diagram of the first substrate and the second substrate being pressed together to form a closed microfluidic channel according to the present invention.

[0026] Figure 4 It is a schematic diagram of setting a sixth through hole on the first substrate of the present invention.

[0027] Figure 5 This is a schematic diagram of ball implantation after the first substrate and the second substrate are pressed together according to the present invention.

[0028] Figure 6 Schematic diagram of the microfluidic module of the present invention.

[0029] Figure 7 Schematic diagram of the tubular structure of the present invention.

[0030] Figure 8 Schematic diagram of the elbow of the present invention.

[0031] Fig. 9 This is a schematic diagram of a PCB board according to Embodiment 1 of the present invention.

[0032] Fig.10 This is a schematic diagram of the metal microfluidic tube and the tubular structure of Example 1 of the present invention being fixed on a PCB board.

[0033] Fig.11 This is a schematic diagram of a tubular structure surface mounted microfluidic module according to Example 1 of the present invention.

[0034] Fig.12 This is a schematic diagram of the heat dissipation type PCB assembly structure of Example 1 of the present invention.

[0035] Fig.13 This is a schematic diagram of a PCB board according to Embodiment 2 of the present invention.

[0036] Fig.14 This is a schematic diagram of the metal microfluidic tube and the tubular structure of Example 2 of the present invention being fixed on a PCB board.

[0037] Fig.15 Schematic diagram of a tubular structure surface mounted microfluidic module according to Example 2 of the present invention.

[0038] Fig.16 This is a schematic diagram of the heat dissipation type PCB assembly structure of Example 2 of the present invention.

[0039] Fig.17 This is a schematic diagram of a PCB board according to embodiment 3 of the present invention.

[0040] Fig.18 This is a schematic diagram of the metal microfluidic tube and the tubular structure of Example 3 of the present invention being fixed on a PCB board.

[0041] Fig.19 Schematic diagram of a tubular structure surface mounted microfluidic module according to Example 3 of the present invention.

[0042] Fig. 20 This is a schematic diagram of the heat dissipation type PCB assembly structure of Example 3 of the present invention.

[0043] Fig.21 Schematic diagram of the straight tube of the present invention.

[0044] Fig. 22 This is a schematic diagram of a PCB board according to embodiment 4 of the present invention.

[0045] Fig.23 This is a schematic diagram of the metal microfluidic tube and the tubular structure of Example 4 of the present invention being fixed on a PCB board.

[0046] Fig.24 Schematic diagram of a tubular structure surface mounted microfluidic module according to Example 4 of the present invention.

[0047] Fig.25 This is a schematic diagram of the heat dissipation type PCB assembly structure of Example 4 of the present invention. DETAILED DESCRIPTION

[0048] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0049] Example 1

[0050] like Figures 1 to 12As shown, the heat dissipation type PCB assembly structure provided in this embodiment includes a PCB board 101, and a conducting structure is arranged on the PCB board 101, and the conducting structure includes a tubular structure 102 and a metal microfluidic tube 103, and a liquid inlet and a liquid outlet are arranged on the tubular structure 102, a liquid inlet 104 is arranged at one end of the metal microfluidic tube 103, and a liquid outlet 105 is arranged at the other end of the metal microfluidic tube 103, and the liquid outlet end of the metal microfluidic tube 103 and the liquid inlet end of the tubular structure 102 are interconnected, a microfluidic module 106 is arranged on the upper surface of the tubular structure 102, and a chip 107 is arranged on the microfluidic module 106, and the microfluidic module 106 and the tubular structure 102 form a heat-conducting structure, and the liquid inlet end of the metal microfluidic tube 103 is connected to a cold liquid supply device.

[0051] The metal microfluidic tube 103 is a curved tube; the curved tube includes a vertical liquid inlet pipe and a horizontal connecting pipe, a liquid inlet is arranged at one end of the liquid inlet pipe away from the connecting pipe, and a liquid outlet is arranged at one end of the connecting pipe away from the liquid inlet pipe; a first through hole 108 and a second through hole 109 are arranged on the PCB board 101, a liquid inlet pipe of the curved tube is arranged in the first through hole 108, the connecting pipe of the curved tube is arranged on the outside of the PCB board 101, and the liquid outlet end of the curved tube is interconnected with the liquid inlet end of the tubular structure 102 through the second through hole 109.

[0052] The microfluidic module 106 includes a first substrate 110 and a second substrate 111 arranged on the first substrate, a plurality of TSV conductive pillars 112 are arranged at intervals in the first substrate 110, a microchannel 113 is arranged on the first substrate between two adjacent TSV conductive pillars 112, and RDL and pads are arranged on the upper and lower surfaces of the first substrate 110; a plurality of TSV conductive pillars 114 are arranged at intervals in the second substrate 112, and RDL and pads are arranged on the upper and lower surfaces of the second substrate 112; the first substrate 110 and the second substrate 111 are pressed together to form a closed microfluidic channel, a plurality of sixth through holes 115 are arranged on the first substrate 110, and the sixth through holes 115 are opened at positions corresponding to the microfluidic channels 113.

[0053] A method for assembling a heat dissipation type PCB assembly structure, comprising the following steps:

[0054] (a) providing a first substrate 110, manufacturing TSV conductive pillars 112, RDL and pads on the upper surface of the first substrate 110, performing temporary bonding on the upper surface of the first substrate 110, thinning the lower surface of the first substrate 110 to expose the back of the TSV conductive pillars 112, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars, then manufacturing RDL and pads on the lower surface of the first substrate 110, and etching a microchannel 113;

[0055] (b) providing a second substrate 111, manufacturing TSV conductive pillars 114, RDL and interconnect pads on the upper surface of the second substrate 111, performing temporary bonding on the upper surface of the second substrate 111, thinning the lower surface of the second substrate 111 to expose the back of the TSV conductive pillars 114, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars 114, and then manufacturing RDL and pads on the lower surface of the first substrate 111;

[0056] (c) The first substrate 110 and the second substrate 111 are pressed together by bonding to form a closed microfluidic channel, and a sixth through hole 115 is made on the surface of the first substrate to connect the microfluidic channel with the outside, and balls 116 are planted on both sides of the sixth through hole 115, and the microfluidic module 106 is obtained by cutting;

[0057] (d) providing an upper cover plate 116 and a carrier plate, wherein a groove 117 is provided on the upper cover plate 116, and a through hole 118 is provided on the carrier plate, and the upper cover plate 116 and the carrier plate are welded together to form a tubular structure 102 with a microfluidic channel; and providing a metal microfluidic channel tube 103, wherein the metal microfluidic channel tube 103 and the tubular structure 102 can be interconnected;

[0058] (e) providing a PCB board 101, setting a first through hole 108 and a second through hole 109 on the PCB board 101, fixing the metal microfluidic tube 103 and the tubular structure 102 on the PCB board 101 by welding, and interconnecting the metal microfluidic tube 103 and the tubular structure 102 through the second through hole 109 of the PCB board 101;

[0059] (f) A microfluidic module 106 is mounted on the surface of the tubular structure 102, and then a chip 107 is mounted on top of the module 106. The microfluidic module 106 and the tubular structure 102 are interconnected to form a heat-conducting structure. A liquid cooling supply device is connected to one end of the metal microfluidic tube 103 to obtain a heat-dissipating PCB assembly structure.

[0060] Embodiment 2:

[0061] like Figures 1 to 8 and Figures 13-16As shown, a heat dissipation type PCB assembly structure provided in this embodiment includes a PCB board 201, a conductive structure is arranged on the PCB board 201, and the conductive structure includes a tubular structure 102 and a metal microfluidic tube 103, a liquid inlet and a liquid outlet are arranged on the tubular structure 102, a liquid inlet 104 is arranged at one end of the metal microfluidic tube 103, and a liquid outlet 105 is arranged at the other end of the metal microfluidic tube 103, the liquid outlet end of the metal microfluidic tube 103 and the liquid inlet end of the tubular structure 102 are interconnected, a microfluidic module 106 is arranged on the upper surface of the tubular structure 102, a chip 203 is arranged on the microfluidic module 106, the microfluidic module 106 and the tubular structure 102 form a heat-conducting structure, and the liquid inlet end of the metal microfluidic tube 103 is connected to a cold liquid supply device.

[0062] The metal microfluidic tube 103 is a curved tube, which includes a vertical liquid inlet pipe and a horizontal connecting pipe. A liquid inlet is arranged at one end of the liquid inlet pipe away from the connecting pipe, and a liquid outlet is arranged at one end of the connecting pipe away from the liquid inlet pipe. A third through hole 204, a fourth through hole 205 and a first groove 206 are arranged on the PCB board 201. The liquid inlet pipe of the curved tube is arranged in the third through hole 204, and the connecting pipe of the curved tube is arranged in the first groove 206. The liquid outlet end of the curved tube is interconnected with the liquid inlet end of the tubular structure 102 through the fourth through hole 205.

[0063] The microfluidic module 106 includes a first substrate 110 and a second substrate 111 arranged on the first substrate, a plurality of TSV conductive pillars 112 are arranged at intervals in the first substrate 110, microchannels 113 are arranged on the first substrate between two adjacent TSV conductive pillars 112, and RDL and pads are arranged on the upper and lower surfaces of the first substrate 110; a plurality of TSV conductive pillars 114 are arranged at intervals in the second substrate 112, and RDL and pads are arranged on the upper and lower surfaces of the second substrate 112; the first substrate 110 and the second substrate 111 are pressed together to form a closed microfluidic channel, a plurality of sixth through holes 115 are arranged on the first substrate 110, and the sixth through holes 115 are opened at positions corresponding to the microfluidic channels 113.

[0064] A method for assembling a heat dissipation type PCB assembly structure, comprising the following steps:

[0065] (a) providing a first substrate 110, manufacturing TSV conductive pillars 112, RDL and pads on the upper surface of the first substrate 110, performing temporary bonding on the upper surface of the first substrate 110, thinning the lower surface of the first substrate 110 to expose the back of the TSV conductive pillars 112, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars, then manufacturing RDL and pads on the lower surface of the first substrate 110, and etching a microchannel 113;

[0066] (b) providing a second substrate 111, manufacturing TSV conductive pillars 114, RDL and interconnect pads on the upper surface of the second substrate 111, performing temporary bonding on the upper surface of the second substrate 111, thinning the lower surface of the second substrate 111 to expose the back of the TSV conductive pillars 114, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars 114, and then manufacturing RDL and pads on the lower surface of the first substrate 111;

[0067] (c) The first substrate 110 and the second substrate 111 are pressed together by bonding to form a closed microfluidic channel, and a sixth through hole 115 is made on the surface of the first substrate to connect the microfluidic channel with the outside, and balls 116 are planted on both sides of the sixth through hole 115, and the microfluidic module 106 is obtained by cutting;

[0068] (d) providing an upper cover plate 116 and a carrier plate, wherein a groove 117 is provided on the upper cover plate 116, and a through hole 118 is provided on the carrier plate, and the upper cover plate 116 and the carrier plate are welded together to form a tubular structure 102 with a microfluidic channel; and providing a metal microfluidic channel tube 103, wherein the metal microfluidic channel tube 103 and the tubular structure 102 can be interconnected;

[0069] (e) providing a PCB board 201, setting a third through hole 203, a fourth through hole 204 and a first groove 205 on the PCB board 201, fixing the metal microfluidic tube 103 and the tubular structure 102 on the PCB board 201 by welding, and interconnecting the metal microfluidic tube 103 and the tubular structure 102 through the fourth through hole 204 of the PCB board;

[0070] (f) The microfluidic module 106 is mounted on the surface of the tubular structure 102, and then the chip 203 is mounted on the top of the module 106. The microfluidic module 106 and the tubular structure 102 are interconnected to form a heat-conducting structure. A liquid cooling supply device is connected to one end of the metal microfluidic tube 103 to obtain a heat-dissipating PCB assembly structure.

[0071] Embodiment 3:

[0072] like Figures 1 to 8 and Figures 17-20As shown, a heat dissipation type PCB assembly structure provided in this embodiment includes a PCB board 301, a conductive structure is arranged on the PCB board 301, and the conductive structure includes a tubular structure 102 and a metal microfluidic tube 103. A liquid inlet and a liquid outlet are arranged on the tubular structure 102, a liquid inlet 104 is arranged at one end of the metal microfluidic tube 103, and a liquid outlet 105 is arranged at the other end of the metal microfluidic tube 103. The liquid outlet end of the metal microfluidic tube 103 and the liquid inlet end of the tubular structure 102 are interconnected, a microfluidic module 106 is arranged on the upper surface of the tubular structure 102, a chip 302 is arranged on the microfluidic module 106, the microfluidic module 106 and the tubular structure 102 form a heat-conducting structure, and the liquid inlet end of the metal microfluidic tube 103 is connected to a cold liquid supply device.

[0073] The metal microfluidic tube 103 is a curved tube, which includes a vertical liquid inlet pipe and a horizontal connecting pipe. A liquid inlet is arranged at one end of the liquid inlet pipe away from the connecting pipe, and a liquid outlet is arranged at one end of the connecting pipe away from the liquid inlet pipe. When the metal microfluidic tube is a curved tube, a second groove 303 is arranged on the PCB board, and a conducting structure is arranged in the second groove 303.

[0074] The microfluidic module 106 includes a first substrate 110 and a second substrate 111 arranged on the first substrate, a plurality of TSV conductive pillars 112 are arranged at intervals in the first substrate 110, microchannels 113 are arranged on the first substrate between two adjacent TSV conductive pillars 112, and RDL and pads are arranged on the upper and lower surfaces of the first substrate 110; a plurality of TSV conductive pillars 114 are arranged at intervals in the second substrate 112, and RDL and pads are arranged on the upper and lower surfaces of the second substrate 112; the first substrate 110 and the second substrate 111 are pressed together to form a closed microfluidic channel, a plurality of sixth through holes 115 are arranged on the first substrate 110, and the sixth through holes 115 are opened at positions corresponding to the microfluidic channels 113.

[0075] A method for assembling a heat dissipation type PCB assembly structure, comprising the following steps:

[0076] (a) providing a first substrate 110, manufacturing TSV conductive pillars 112, RDL and pads on the upper surface of the first substrate 110, performing temporary bonding on the upper surface of the first substrate 110, thinning the lower surface of the first substrate 110 to expose the back of the TSV conductive pillars 112, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars, then manufacturing RDL and pads on the lower surface of the first substrate 110, and etching a microchannel 113;

[0077] (b) providing a second substrate 111, manufacturing TSV conductive pillars 114, RDL and interconnect pads on the upper surface of the second substrate 111, performing temporary bonding on the upper surface of the second substrate 111, thinning the lower surface of the second substrate 111 to expose the back of the TSV conductive pillars 114, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars 114, and then manufacturing RDL and pads on the lower surface of the first substrate 111;

[0078] (c) The first substrate 110 and the second substrate 111 are pressed together by bonding to form a closed microfluidic channel, and a sixth through hole 115 is made on the surface of the first substrate to connect the microfluidic channel with the outside, and balls 116 are planted on both sides of the sixth through hole 115, and the microfluidic module 106 is obtained by cutting;

[0079] (d) providing an upper cover plate 116 and a carrier plate, wherein a groove 117 is provided on the upper cover plate 116, and a through hole 118 is provided on the carrier plate, and the upper cover plate 116 and the carrier plate are welded together to form a tubular structure 102 with a microfluidic channel; and providing a metal microfluidic channel tube 103, wherein the metal microfluidic channel tube 103 and the tubular structure 102 can be interconnected;

[0080] (e) providing a PCB board 301, setting a second groove 303 on the PCB board 301, and fixing the metal micro-channel tube 103 and the tubular structure 102 on the second groove 303 of the PCB board by welding;

[0081] (f) The microfluidic module 106 is mounted on the surface of the tubular structure 102, and then the chip 302 is mounted on the module 106. The microfluidic module 106 and the tubular structure 102 are interconnected to form a heat-conducting structure. A liquid cooling supply device is connected to one end of the metal microfluidic tube 103 to obtain a heat-dissipating PCB assembly structure.

[0082] Embodiment 4:

[0083] like Figures 1 to 7 and Figures 21 to 25 As shown, a heat dissipation type PCB assembly structure provided in this embodiment includes a PCB board 401, a conductive structure is arranged on the PCB board 401, the conductive structure includes a tubular structure 102 and a metal microfluidic tube 402, a liquid inlet and a liquid outlet are arranged on the tubular structure 102, a liquid inlet 403 is arranged at one end of the metal microfluidic tube 402, a liquid outlet 404 is arranged at the other end of the metal microfluidic tube 403, the liquid outlet end of the metal microfluidic tube 402 and the liquid inlet end of the tubular structure 102 are interconnected, a microfluidic module 106 is arranged on the upper surface of the tubular structure 102, a chip 405 is arranged on the microfluidic module 106, the microfluidic module 106 and the tubular structure 102 form a heat-conducting structure, and the liquid inlet end of the metal microfluidic tube 402 is connected to a cold liquid supply device.

[0084] The metal microfluidic tube 404 is a straight tube, a liquid inlet 405 is set at one end of the straight tube 404, and a liquid outlet is set at the other end; the fifth through hole 406 and the third groove 407 are set on the PCB board 401, the straight tube 404 is set at the outer end of the PCB board, and the tubular structure 102 is set in the third groove 407, and the liquid outlet end of the straight tube 404 is interconnected with the liquid inlet end of the tubular structure 102 through the fifth through hole 406.

[0085] The microfluidic module 106 includes a first substrate 110 and a second substrate 111 arranged on the first substrate, a plurality of TSV conductive pillars 112 are arranged at intervals in the first substrate 110, microchannels 113 are arranged on the first substrate between two adjacent TSV conductive pillars 112, and RDL and pads are arranged on the upper and lower surfaces of the first substrate 110; a plurality of TSV conductive pillars 114 are arranged at intervals in the second substrate 112, and RDL and pads are arranged on the upper and lower surfaces of the second substrate 112; the first substrate 110 and the second substrate 111 are pressed together to form a closed microfluidic channel, a plurality of sixth through holes 115 are arranged on the first substrate 110, and the sixth through holes 115 are opened at positions corresponding to the microfluidic channels 113.

[0086] A method for assembling a heat dissipation type PCB assembly structure, comprising the following steps:

[0087] (a) providing a first substrate 110, manufacturing TSV conductive pillars 112, RDL and pads on the upper surface of the first substrate 110, performing temporary bonding on the upper surface of the first substrate 110, thinning the lower surface of the first substrate 110 to expose the back of the TSV conductive pillars 112, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars, then manufacturing RDL and pads on the lower surface of the first substrate 110, and etching a microchannel 113;

[0088] (b) providing a second substrate 111, manufacturing TSV conductive pillars 114, RDL and interconnect pads on the upper surface of the second substrate 111, performing temporary bonding on the upper surface of the second substrate 111, thinning the lower surface of the second substrate 111 to expose the back of the TSV conductive pillars 114, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars 114, and then manufacturing RDL and pads on the lower surface of the first substrate 111;

[0089] (c) The first substrate 110 and the second substrate 111 are pressed together by bonding to form a closed microfluidic channel, and a sixth through hole 115 is made on the surface of the first substrate to connect the microfluidic channel with the outside, and balls 116 are planted on both sides of the sixth through hole 115, and the microfluidic module 106 is obtained by cutting;

[0090] (d) providing an upper cover plate 116 and a carrier plate, wherein a groove 117 is provided on the upper cover plate 116, and a through hole 118 is provided on the carrier plate, and the upper cover plate 116 and the carrier plate are welded together to form a tubular structure 102 with a microfluidic channel; and providing a metal microfluidic channel tube 103, wherein the metal microfluidic channel tube 103 and the tubular structure 102 can be interconnected;

[0091] (e) providing a PCB board 401, setting a fifth through hole 406 and a third groove 407 on the PCB board 401, fixing the metal microfluidic tube 402 and the tubular structure 102 on the PCB board by welding, and interconnecting the metal microfluidic tube 402 and the tubular structure 102 through the fifth through hole 406 of the PCB board 401;

[0092] (f) The microfluidic module 106 is mounted on the surface of the tubular structure 102, and then the chip 405 is mounted on the module 106. The microfluidic module 106 and the tubular structure 102 are interconnected to form a heat-conducting structure. A liquid cooling supply device is connected to one end of the metal microfluidic tube 103 to obtain a heat-dissipating PCB assembly structure.

[0093] The heat dissipation type PCB assembly structure and assembly process of the present invention manufacture a conductive structure frame with a multi-layer liquid supply pipeline, nest one end of the conductive structure frame and the PCB board together, and then weld the microfluidic module layer by layer on the conductive structure frame through a patch process, so that each layer of the microfluidic module can have an independent heat dissipation microfluidic channel for heat dissipation, thereby increasing the heat dissipation capacity and reliability of the module.

[0094] Finally, it should be noted that the above specific implementation methods are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A heat dissipation type PCB assembly structure, characterized in that: It comprises a PCB board, a conducting structure is arranged on the PCB board, the conducting structure comprises a tubular structure and a metal microfluidic tube, a liquid inlet and a liquid outlet are arranged on the tubular structure, a liquid inlet is arranged at one end of the metal microfluidic tube, a liquid outlet is arranged at the other end of the metal microfluidic tube, the liquid outlet end of the metal microfluidic tube and the liquid inlet end of the tubular structure are interconnected, a microfluidic module is arranged on the upper surface of the tubular structure, a chip is arranged on the microfluidic module, the microfluidic module and the tubular structure form a heat-conducting structure, and the liquid inlet end of the metal microfluidic tube is connected to a cold liquid supply device; The microfluidic module includes a first substrate and a second substrate arranged on the first substrate, a plurality of TSV conductive pillars are arranged at intervals in the first substrate, microfluidics are arranged on the first substrate between two adjacent TSV conductive pillars, and RDL and pads are arranged on the upper and lower surfaces of the first substrate; a plurality of TSV conductive pillars are arranged at intervals in the second substrate, and RDL and pads are arranged on the upper and lower surfaces of the second substrate; the first substrate and the second substrate are pressed together to form a closed microfluidic channel, a plurality of sixth through holes are arranged on the first substrate, and the sixth through holes are opened corresponding to the positions of the microfluidic channels.

2. The heat dissipation type PCB assembly structure as claimed in claim 1, characterized in that: The metal microfluidic channel tube is a straight tube or a curved tube.

3. The heat dissipation type PCB assembly structure as claimed in claim 2, characterized in that: The curved pipe comprises a vertical liquid inlet pipe and a horizontal connecting pipe, wherein a liquid inlet is arranged at one end of the liquid inlet pipe away from the connecting pipe, and a liquid outlet is arranged at one end of the connecting pipe away from the liquid inlet pipe; a liquid inlet is arranged at one end of the straight pipe, and a liquid outlet is arranged at the other end.

4. The heat dissipation type PCB assembly structure as claimed in claim 3, characterized in that: When the metal microfluidic tube is a curved tube, a first through hole and a second through hole are arranged on the PCB board, a liquid inlet pipe of the curved tube is arranged in the first through hole, a connecting pipe of the curved tube is arranged on the outside of the PCB board, and a liquid outlet end of the curved tube is interconnected with a liquid inlet end of the tubular structure through the second through hole.

5. The heat dissipation type PCB assembly structure as claimed in claim 3, characterized in that: When the metal microfluidic tube is a curved tube, a third through hole, a fourth through hole and a first groove are arranged on the PCB board, a liquid inlet pipe of the curved tube is arranged in the third through hole, a connecting pipe of the curved tube is arranged in the first groove, and the liquid outlet end of the curved tube is interconnected with the liquid inlet end of the tubular structure through the fourth through hole.

6. The heat dissipation type PCB assembly structure as claimed in claim 3, characterized in that: When the metal micro-channel tube is a curved tube, a second groove is arranged on the PCB board, and a conducting structure is arranged in the second groove.

7. The heat dissipation type PCB assembly structure as claimed in claim 3, characterized in that: When the metal microfluidic tube is a straight tube, a fifth through hole and a third groove are arranged on the PCB board, the straight tube is arranged at the outer end of the PCB board, a tubular structure is arranged in the third groove, and the liquid outlet end of the straight tube is interconnected with the liquid inlet end of the tubular structure through the fifth through hole.

8. An assembly method of a heat dissipation type PCB assembly structure, characterized in that: The following steps are involved: (a) providing a first substrate, manufacturing TSV conductive pillars, RDL and pads on the upper surface of the first substrate, performing temporary bonding on the upper surface of the first substrate, thinning the lower surface of the first substrate to expose the back of the TSV conductive pillars, covering with a passivation layer, polishing to expose the metal on the back of the TSV conductive pillars, then manufacturing RDL and pads on the lower surface of the first substrate, and etching microchannels; (b) providing a second substrate, manufacturing TSV conductive pillars, RDL and interconnect pads on the upper surface of the second substrate, performing temporary bonding on the upper surface of the second substrate, thinning the lower surface of the second substrate to expose the back of the TSV, covering it with a passivation layer, polishing it to expose the metal on the back of the TSV, and then manufacturing RDL and pads on the lower surface of the first substrate; (c) pressing the first substrate and the second substrate together by bonding to form a closed microfluidic channel, making a sixth through hole on the surface of the first substrate to connect the microfluidic channel to the outside, planting balls on both sides of the sixth through hole, and cutting to obtain a microfluidic channel module; (d) providing an upper cover plate and a carrier plate, wherein a groove is provided on the upper cover plate, and a through hole is provided on the carrier plate, the upper cover plate and the carrier plate are welded together to form a tubular structure with a microfluidic channel, and a metal microfluidic channel tube is provided, wherein the metal microfluidic channel tube and the tubular structure are interconnected; (e) providing a PCB board, and fixing the metal microfluidic tube and the tubular structure on the PCB board by welding; (f) A microfluidic module is mounted on the surface of the tubular structure, and then a chip is mounted on top of the microfluidic module. The microfluidic module and the tubular structure are interconnected to form a heat-conducting structure. A liquid cooling supply device is connected to one end of the metal microfluidic tube to obtain a heat-dissipating PCB assembly structure.

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