Silicon rod loading device

Abstract

The present application provides a silicon rod loading device for transferring a silicon rod to be cut placed in a storage area to a cutting working area of a cutting device. The silicon rod loading device includes: a first rotating shaft driven to rotate by a first driving device; and at least two swing arm assemblies pivotally connected to the first rotating shaft at preset intervals. The at least two swing arm assemblies are used to carry the silicon rod to be cut. Driven by the first rotating shaft, the silicon rod to be cut is carried by the swing arm assemblies and transferred to the cutting working area of the cutting device. Wherein, each of the swing arm assemblies includes a swing arm body pivotally connected to the first rotating shaft and a supporting mechanism arranged on the swing arm body. The supporting mechanism follows the movement of the swing arm, so that the supporting part remains in a state of carrying the silicon rod to be cut during the transfer operation.

Description

Technical Field

[0001] The present application relates to the technical field of multi-wire cutting, and in particular to a silicon rod loading device for a silicon rod truncating device used for cutting silicon rods. Background Art

[0002] Wire cutting technology is a relatively advanced silicon material processing technology in the world at present. Its principle is that a high-speed running steel wire drives the cutting abrasive attached to the steel wire or directly uses a diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. During the cutting process, the steel wire or diamond wire is guided by a wire guide wheel to form a wire saw or a wire mesh on the cutting roller, and the workpiece to be processed realizes the feeding of the workpiece through the up and down movement of the workbench or the up and down movement of the wire saw or wire mesh. Under the action of a pressure pump, the cooling water automatic spraying device assembled on the equipment sprays cold water onto the cutting parts of the steel wire or diamond wire and the workpiece, and the reciprocating movement of the steel wire or diamond wire generates cutting to cut the material to be processed into multiple pieces at one time. Compared with traditional saw blades, grinding wheels and internal circle cutting, wire cutting technology has the advantages of high efficiency, high productivity and high precision.

[0003] Generally, in the related art, the operations required for each process operation are independently arranged, and the operation equipment is scattered in different production units or different production areas of the production workshop or production workshop. The transfer of workpieces performing different process operations requires handling and allocation. The processes are complicated, the efficiency is low, a large amount of manpower or transfer equipment is required, and there are great safety hazards. In addition, there are many flow links between the operation equipment of each process, which increases the risk of workpiece damage during the workpiece transfer process and is prone to unqualified or unreasonable losses caused by non-production factors. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present application is to provide a silicon rod loading device for a silicon rod truncating device used for cutting silicon rods, which realizes the automation of the feeding process and connects with the next cutting process, so as to solve the problems that the workpiece is easily damaged during the transfer and the production efficiency is low due to the intermittent process in the prior art.

[0005] To achieve the above and other related purposes, the present application provides a silicon rod loading device for a silicon rod truncating device used for cutting silicon rods, including a silicon rod loading device disposed between a storage area and a cutting work area, for transferring the silicon rod to be cut placed in the storage area to the cutting work area. The silicon rod loading device includes: a first rotating shaft driven to rotate by a first driving device; and at least two swing arm assemblies pivotally connected to the first rotating shaft at preset intervals. The at least two swing arm assemblies are used to carry the silicon rod to be cut and transfer the silicon rod to be cut to the cutting work area of the cutting device under the drive of the first rotating shaft; each of the swing arm assemblies includes a swing arm body pivotally connected to the first rotating shaft and a supporting mechanism disposed on the swing arm body. The supporting mechanism is used to follow the movement of the swing arm so that its supporting part remains in a state of carrying the silicon rod to be cut during the transfer operation.

[0006] In some embodiments of the present application, the supporting mechanism includes a manipulator disposed at the end of the swing arm body, for following the movement of the swing arm so that its supporting part remains in a state of carrying the silicon rod to be cut during the transfer operation.

[0007] In some embodiments of the present application, the silicon rod truncating device further includes at least two transfer platforms corresponding to the swing arm assemblies one by one, disposed on the machine base of the cutting device, for pivotally connecting the at least two swing arm assemblies to the first rotating shaft at preset intervals respectively.

[0008] In some embodiments of the present application, the at least two transfer platforms include a second motion mechanism for linearly displacing at least one swing arm assembly on the first rotating shaft to adjust the interval distance between the at least two swing arm assemblies.

[0009] In some embodiments of the present application, there are 4 swing arm assemblies, including a first swing arm assembly and a second swing arm assembly respectively disposed at both ends of the first rotating shaft, and a third swing arm assembly and a fourth swing arm assembly pivotally connected between both ends of the first rotating shaft at preset intervals.

[0010] In some embodiments of the present application, the transfer platform of the third swing arm assembly or the fourth swing arm assembly includes a second motion mechanism for linearly displacing on the first rotating shaft.

[0011] In some embodiments of the present application, the silicon rod truncating device further includes a second rotating shaft driven by a second driving device, the second rotating shaft is parallel to the first rotating shaft, and the second driving device outputs a corresponding rotational speed or / and rotation angle to the second rotating shaft following the working state of the first driving device.

[0012] In some embodiments of the present application, the first driving device and the second driving device are respectively arranged at opposite ends of the first rotating shaft or the second rotating shaft.

[0013] In some embodiments of the present application, the second rotating shaft is pivotally connected to the swing arm assembly and is located between the first rotating shaft on the swing arm body and the supporting mechanism.

[0014] In some embodiments of the present application, the supporting mechanism includes: a manipulator assembly arranged at the end of the swing arm body, including: a manipulator body, and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut. The supporting member is power-connected to the second rotating shaft and drives the supporting member to rotate on the manipulator body when the second rotating shaft rotates, so that the supporting member remains in a state of carrying the silicon rod to be cut during the transfer operation.

[0015] In some embodiments of the present application, the swing arm body has an internal space.

[0016] In some embodiments of the present application, the supporting mechanism includes: a driving gear arranged in the internal space of the swing arm body and pivotally connected to the second rotating shaft for rotating under the drive of the second rotating shaft; a driven gear pivotally connected in the internal space of the swing arm body and meshing with the driving gear; a manipulator assembly arranged at the end of the swing arm body, including a manipulator body, and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut. The supporting member includes a tooth portion meshing with the driven gear and a supporting portion for conforming to the outer contour of the silicon rod to be cut.

[0017] In some embodiments of the present application, the number of teeth of the tooth portion of the supporting portion is greater than the number of teeth of the driven gear, and the number of teeth of the driven gear is greater than the number of teeth of the driving gear.

[0018] In some embodiments of the present application, the contact surface between the supporting portion and the silicon rod to be cut has a buffer material.

[0019] In some embodiments of the present application, the swing arm assembly is provided with a detection device for detecting the contact between the supporting portion and the silicon rod to be cut.

[0020] In summary, the silicon rod loading device of the present application is provided with at least two swing arm assemblies that can move axially along the silicon rod to be cut and a first rotating shaft passing through the swing arm assemblies. The first rotating shaft is driven by a first driving device to rotate to control the movement of the swing arm assemblies, and through the cooperation of the manipulator or the manipulator assembly and the supporting portion at the end of the swing arm assembly, it is ensured that the silicon rod is always in a loaded state during the transfer process of the silicon rod to be cut to achieve automatic loading, effectively improving economic benefits and safety. Description of the Drawings

[0021] Figure 1 Shown is a schematic structural diagram of the silicon rod cutting device of the present application in an embodiment.

[0022] Figure 2 Shown is a schematic diagram of the first cutting state of the silicon rod cutting device of the present application in an embodiment.

[0023] Figure 3 Shown as Figure 2 An enlarged schematic diagram at position a in

[0024] Figure 4 Shown is a schematic diagram of the second cutting state of the silicon rod cutting device of the present application in an embodiment.

[0025] Figure 5 Shown is a schematic diagram of the intermediate state of the silicon rod cutting device of the present application in an embodiment.

[0026] Figure 6 Shown is a schematic diagram of the cutting frame of the silicon rod cutting device of the present application in an embodiment.

[0027] Figure 7 Shown is a schematic diagram of the first cutting state of the silicon rod cutting device of the present application in an embodiment.

[0028] Figure 8 Shown is a schematic diagram of the second cutting state of the silicon rod cutting device of the present application in an embodiment.

[0029] Figure 9 Shown is a schematic diagram of the intermediate state of the silicon rod cutting device of the present application in an embodiment.

[0030] Figure 10 Shown is a schematic diagram of the cutting frame of the silicon rod cutting device of the present application in an embodiment.

[0031] Figure 11 Shown is a schematic diagram of the silicon rod loading device of the silicon rod cutting device of the present application in an embodiment.

[0032] Figure 12 Shown as Figure 11 An enlarged schematic diagram at position b in

[0033] Figure 13 Shown as Figure 11 An enlarged schematic diagram at position c in

[0034] Figure 14 Shown is a schematic diagram of the swing arm assembly of the silicon rod stage device of the present application in an embodiment.

[0035] Figure 15 Shown is a schematic diagram of the swing arm assembly of the silicon rod stage device of the present application in an embodiment.

[0036] Figure 16 Shown is a schematic diagram of the swing arm assembly of the equipment in the silicon rod stage of the present application in an embodiment.

[0037] Figure 17 Shown is a schematic diagram of the swing arm assembly of the equipment in the silicon rod stage of the present application in an embodiment.

[0038] Figure 18 Shown is a schematic diagram of the swing arm assembly of the equipment in the silicon rod stage of the present application in an embodiment.

[0039] Figure 19 Shown is a schematic diagram of the swing arm assembly of the equipment in the silicon rod stage of the present application in an embodiment.

[0040] Figure 20 Shown is a schematic diagram of the silicon rod blanking device of the silicon rod cutting equipment of the present application in an embodiment.

[0041] Figure 21a And Figure 21b Shown is a schematic diagram of the silicon rod blanking device of the silicon rod cutting equipment of the present application in an embodiment.

[0042] Figure 22 Shown is a schematic diagram of the clamping component of the silicon rod blanking device of the silicon rod cutting equipment of the present application in an embodiment.

[0043] Figure 23 Shown is a schematic diagram of the driving device of the silicon rod blanking device of the silicon rod cutting equipment of the present application in an embodiment.

[0044] Figure 24 Shown is a schematic diagram of the driving device of the silicon rod blanking device of the silicon rod cutting equipment of the present application in an embodiment.

[0045] Figure 25 Shown as Figure 21b An enlarged schematic diagram at position d in

[0046] The following specific embodiments illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0047] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the present application. It should be understood that other embodiments may also be used, and mechanical compositions, structures, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is only defined by the claims of the published patent. The terms used herein are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "beneath", "lower", "above", "upper", etc., may be used in the text to facilitate the description of the relationship between one element or feature shown in the figure and another element or feature.

[0048] Although in some instances the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first multi-wire cutting wheel may be referred to as the second multi-wire cutting wheel, and similarly, the second multi-wire cutting wheel may be referred to as the first multi-wire cutting wheel, without departing from the scope of the various described embodiments. The first multi-wire cutting wheel and the multi-wire cutting wheel are both describing a cutting wheel, but unless the context clearly indicates otherwise in other ways, they are not the same multi-wire cutting wheel. Similar situations also include the first cantilever, the second cantilever and the third cantilever, the first swing arm assembly and the second swing arm assembly, or the first motion mechanism and the second motion mechanism, the first clamping portion and the second clamping portion, etc.

[0049] Furthermore, as used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms, unless the context indicates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the described features, steps, operations, elements, components, items, types, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, types, and / or groups. The terms "or" and "and / or" used herein are interpreted inclusively, or mean any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition only occurs when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0050] In the existing silicon material processing, due to the inherent hard and brittle characteristics of the silicon rod, it is usually completed by wire cutting technology. The process of silicon rod operation starts with truncating the original long silicon rod to form multiple short silicon rods (i.e., silicon rod segments that meet the workpiece specifications after truncating the silicon rod), and the truncating operation uses equipment, namely the silicon rod truncating equipment. Generally, there is a workbench on the silicon rod truncating equipment. For example, a cutting wire such as a steel wire or a diamond wire forms a wire saw on the cutting roller through the guidance of a wire guiding wheel to cut a single silicon rod to be processed. As a pre-process for subsequent silicon wafer processing operations, it is necessary to intercept a sample piece during silicon rod truncating to check whether the material characteristics of the silicon rod meet the process requirements. For the existing means of obtaining sample pieces, generally, after cutting off the head or tail of the silicon rod, by moving the cutting frame or the silicon rod, and then repeating the cutting operation once to intercept a silicon wafer sample piece. The thickness of the intercepted silicon wafer sample piece depends on the manually controlled moving distance. It is difficult to precisely control the short-distance movement of the cutting frame or the silicon rod, and it is difficult to unify the specifications of the intercepted sample pieces. At the same time, it is difficult to achieve the short-distance movement required for the silicon wafer sample piece (such as 2 mm to 20 mm), that is, it is easy to cause excessive movement and waste of the silicon rod material. The sampling operation that requires manual control in the traditional process also reduces the truncating efficiency.

[0051] In addition, generally, the operations required for each process operation are independently arranged, and the operation equipment is scattered in different production units, production workshops, or different production areas of the production workshop. The conversion of workpieces performing different process operations requires handling and allocation. The process is complicated, the efficiency is low, a large amount of manpower or transfer equipment is required, and there are great safety hazards. In addition, there are many flow links between the operation equipment of each process, which increases the risk of workpiece damage during the transfer process of the workpiece and is prone to unqualified or unreasonable losses caused by non-production factors.

[0052] In the embodiment provided in the present application, to clarify the orientation of the space, a three-dimensional space defined by a first dimension direction, a second dimension direction, and a third dimension direction is defined. The first dimension direction, the second dimension direction, and the third dimension direction are all straight-line directions and are perpendicular to each other pairwise. Taking a silicon rod to be cut placed in the cutting area as a reference, the first dimension direction is the axial direction of the silicon rod to be cut or the forward and backward directions; the second dimension direction is the left and right directions. For example, the direction of the linear displacement of the loading device between the storage area and the cutting work area is the left or right direction; the third dimension direction is the ascending and descending direction or the up and down direction. For example, the direction in which the cutting frame rises or falls.

[0053] Please refer to Figure 1 , which shows a schematic structural diagram of the silicon rod truncating equipment of the application in an embodiment, including a wire cutting device 1, a silicon rod loading device 2, and a silicon rod unloading device 3.

[0054] Please refer to Figure 2, which shows a side view of the wire cutting device of the present application in the first cutting state. As shown in the figure, the wire cutting device of the present application is used for cutting silicon rods, and the cutting operation is, for example, a truncation operation, a squaring operation, a slicing operation, etc.; in the embodiment, the silicon rod includes a single crystal silicon rod and a polycrystalline silicon rod. The single crystal silicon rod is a rod-shaped single crystal silicon grown from a melt by the Czochralski method or the floating zone melting method. For example, in the silicon rod processing, a single crystal silicon rod with a length of about 5000 mm (such as a specification of 5360 mm) or a single crystal silicon rod with a length of about 800 mm is common. The polycrystalline silicon is a silicon rod formed by depositing silicon on the surface of a silicon core wire by a precipitation technique such as chemical vapor deposition; however, it is not limited thereto. In other possible embodiments of the present application, the wire cutting device can also be used to truncate a silicon ingot of polycrystalline silicon or other hard materials in a long strip shape that requires truncation processing.

[0055] As Figure 2 shown, the wire cutting device 1 of the silicon rod truncation device applied to the cutting operation of the silicon rod in the present application includes a cutting frame 111, a first multi-wire cutting wheel 112, a second multi-wire cutting wheel 113, and a cutting wire segment wound between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to form a multi-wire saw 1121, a single-wire cutting wheel 114, and a cutting wire segment wound between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 to form a single-wire saw ( Figure 2 not shown in the illustrated embodiment); a wire winding system 12, a frame 13, a lifting mechanism 14, and a machine base 15.

[0056] As previously mentioned, before truncating the silicon rod, it is usually necessary to cut a sample piece to check whether the material properties of the silicon rod meet the process requirements. As Figure 2 shown by the wire cutting device in the first cutting state, the lifting mechanism 14 moves up and down to drive the multi-wire saw 1121 formed by the cutting wire segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 ( Figure 2 a double-wire saw in the illustrated embodiment) to move up and down in the lifting direction, so as to realize multi-wire cutting of the silicon rod to be processed (not shown in the figure) located below the multi-wire saw 1121. In a truncation operation of a single up and down movement, the mutually parallel cutting wire saws cut the silicon rod to be processed simultaneously. While truncating the silicon rod to be processed, silicon rod slices, that is, the required silicon wafer samples, are also obtained. In the embodiment, the first cutting state is the state of taking samples.

[0057] In Figure 2 the illustrated embodiment, the wire winding system 12 of the wire cutting equipment of the present application further includes a cutting wire 121, wire guiding wheels 1221, 1222, and a tension detection component 123.

[0058] A further improvement of the present application lies in that the wire cutting device further includes a cutting frame displacement device, which is arranged between the machine frame and the machine base. In an implementation manner of this embodiment, the machine frame 13 of the wire cutting device is movably connected to the machine base through a horizontal guide rail (not shown in the figure) in the first dimension direction. The machine base includes a horizontal guide rail in the first dimension direction, and a guide rail groove for cooperating with the horizontal guide rail is provided at the bottom of the machine frame 13 of the cutting system. The cutting frame displacement device drives the cutting frame to perform a linear displacement along the front-rear direction on the cutting working area (or cutting workbench) of the machine base, so that the wire saw (single-wire saw or multi-wire saw, but in the truncation work, the cutting frame is usually in the state of a single-wire saw, that is, the second cutting state described in the present application) performs a linear displacement along the axial direction of the silicon rod, and then the length of the truncated silicon rod can be adjusted to obtain a single-segment silicon rod segment that meets the workpiece specifications as expected.

[0059] In one embodiment, a driving mechanism is provided inside or outside the machine frame 13 for driving the machine frame 13 to move on the horizontal guide rail of the machine base 15. In one embodiment, the driving mechanism of the machine frame 13 includes: a traveling lead screw (not shown in the figure) arranged along the machine base guide rail and connected to the machine frame 13, and a traveling motor (not shown in the figure) connected to the traveling lead screw. Using the traveling motor, the machine frame 13 is driven to travel along the guide rail. The traveling motor on the machine frame 13 is connected to the traveling lead screw laid on the guide rail, so as to realize the relative movement of the machine frame 13 along the first dimension direction, that is, the axial direction of the silicon rod to be cut on the loading device, relative to the machine frame 13. The cutting frame 111 is movably connected to the machine frame 13 in the lifting direction and fixed on the machine frame 13 in the first dimension direction, that is, the relative displacement of the cutting wire saw on the cutting frame 111 and the silicon rod to be cut on the loading device in the axial direction of the silicon rod to be cut is realized. In another implementation manner of this embodiment, the horizontal movement of the cutting frame 111 relative to the machine base can be driven by an external force.

[0060] Please refer to Figure 3 , shown as Figure 2 The enlarged schematic view of the wire cutting device at a, the machine frame 13 is provided with a guide rail structure for cooperating with the lifting movement of the lifting mechanism 14. In Figure 3 the embodiment shown, the machine frame 13 includes a lifting guide rail 131, and the lifting mechanism 14 has a guide groove (not shown in the figure) for cooperating with the lifting guide rail.

[0061] In an implementation of this embodiment, to achieve the lifting of the lifting mechanism 14 relative to the frame 13, a driving mechanism (not shown in the figure) is provided inside or outside the lifting mechanism 14 for driving the lifting mechanism 14 to move on the guide rail 131 of the frame 13. In one embodiment, the driving mechanism of the lifting mechanism 14 includes: a traveling lead screw arranged along the guide rail of the frame 13 and connected to the lifting mechanism 14, and a traveling motor connected to the traveling lead screw. By using the traveling motor, the lifting mechanism 14 is driven to travel along the guide rail. The traveling motor on the lifting mechanism 14 is connected to the traveling lead screw laid on the guide rail, realizing the relative movement of the lifting mechanism 14 along the vertical direction with respect to the frame 13 on the guide rail and restricting the movement of the lifting mechanism 14 relative to the frame 13 to a single degree of freedom in the lifting direction.

[0062] In another embodiment of the present application, the connection assembly between the lifting mechanism 14 and the lifting guide rail of the frame 13 further includes a limit block for restricting the lifting mechanism 14 from undergoing excessive displacement during the lifting movement.

[0063] The wire guide pulley 122 is arranged on the cutting frame and the frame to realize the commutation of the cutting wire and guide the cutting wire. In a specific implementation, the wire guide pulley may include a horizontal wire guide pulley, a vertical wire guide pulley, an inclined wire guide pulley, etc. They can be arranged on different mounting structures according to the routing mode of the cutting wire to achieve the purpose of guiding the cutting wire.

[0064] In some embodiments of the present application, the wire cutting device adopts a non-closed wire winding method. The head end of the cutting wire is wound around a wire pay-off reel, and the tail end is wound around a wire take-up reel, and is wound between the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel through the guiding of multiple wire guide pulleys. In the first cutting state, the cutting frame performs a lifting cutting operation to intercept a silicon wafer sample, and in the second cutting state, the cutting frame performs a lifting cutting operation to truncate the silicon rod.

[0065] Please refer to Figure 2 , which shows a side view of an embodiment when the wire cutting device of the present application adopts a non-closed wire winding method, including a cutting frame 111, a first multi-wire cutting wheel 112, a second multi-wire cutting wheel 113, and a cutting wire segment wound between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to form a multi-wire saw 1121, a single-wire cutting wheel 114, and a cutting wire segment wound between the second multi-wire cutting wheel 112 and the single-wire cutting wheel 113 to form a single-wire saw (not shown in the illustrated cutting state); a wire winding system 12, and a machine base 15.

[0066] The cutting frame 111 is rotatably arranged on the lifting mechanism 14. The rotating frame includes: a rotating part 1111, a first cantilever 1112, a second cantilever 1113, and a third cantilever 1114. Among them, the center of the rotation axis of the rotating part 1111 is the rotation center of the cutting frame 111; the first cantilever 1112 is a beam structure extending along the rotating part 1111 in a first direction; the second cantilever 1113 is a beam structure extending along the rotating part 1111 in a second direction; the third cantilever 1114 is a beam structure extending along the rotating part 1111 in a third direction; the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 are all located on the rotating fixed plate of the cutting frame 111, that is, they rotate with the rotation of the rotating part 1111.

[0067] In an embodiment, the center axis of the rotation axis of the rotating part 1111 is axially connected to a driving motor, and the fixed plate of the cutting frame 111 is driven to rotate along the rotating part 1111 by the motor shaft, that is, the power output shaft.

[0068] The spatial positions of the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 on the cutting frame 111 are arranged approximately to form a T-shaped structure, and the rotation center of the cutting frame 111 is set in the intersection end area of the three cantilevers of the cutting frame 111. In a specific implementation manner, the position of the rotation center is set in the center of gravity area of the cutting frame 111 according to the structure and material characteristics of the cutting frame 111, so as to reduce the structural wear caused by the moment of the self-weight of the cutting frame 111 on the rotation axis of the rotating part 1111. Figure 1 In the shown embodiment, the free ends (i.e., the extended ends) of the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 are respectively rotatably connected to the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114. A multi-wire saw 1121 is formed between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, and a single-wire saw 1141 is formed between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. The first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 are all located on the rotating fixed plate of the cutting frame 111, that is, they rotate with the rotation of the rotating part 1111.

[0069] The first multi-wire cutting wheel 112 is a cutting wheel provided with at least two wire grooves (including two or more wire grooves), and is rotatably arranged at the extended end of the first cantilever 1112 away from the rotation center. The arrangements of the respective wire grooves on the cutting wheel are parallel to each other to ensure that the cutting wires wound on the cutting wheel are parallel to each other. The basic structure and installation method of the cutting wheel are well-known or can be easily obtained by those skilled in the art, and will not be elaborated here.

[0070] The second multi-wire cutting wheel 113 is a cutting wheel provided with at least two wire grooves, and is rotatably arranged at the extending end of the second cantilever 1113 away from the rotation center, wherein the arrangements of the wire grooves on the cutting wheel are parallel to each other. In particular, the distance between adjacent wire grooves of the second multi-wire cutting wheel is equal to the distance between adjacent wire grooves of the first multi-wire cutting wheel, so as to enable the cutting segments of the multi-wire saw 1121 formed by the cutting wire wound between the two multi-wire cutting wheels to satisfy a parallel spatial relationship.

[0071] The single-wire cutting wheel 114 is rotatably arranged at the extending end of the third cantilever 1114 away from the rotation center, and conforms to the cutting wire segment wound between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 to form a single-wire saw. The plane where the wire groove of the single-wire cutting wheel 114 is located in the first dimension direction is the same plane as at least one wire groove of the second multi-wire cutting wheel 113 in the first dimension direction.

[0072] In an exemplary embodiment, the single-wire cutting wheel 114 can be a cutting wheel provided with a plurality of wire grooves. In the winding method, the cutting wire winds around the wire groove of the single-wire cutting wheel once, and a single wire saw can be led out.

[0073] In an exemplary embodiment, when the silicon rod is truncated, the cutting frame 111 rotates around its rotating part 1111 to realize the conversion between the first cutting state of cutting by the multi-wire saw 1121 and the second cutting state of cutting by the single-wire saw.

[0074] As Figure 2 shown in the wire cutting device in the first cutting state, the lifting mechanism 14 moves up and down to drive the multi-wire saw 1121 (such as Figure 2 the embodiment shown is a double-wire saw) formed by the cutting wire segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to move up and down in the lifting direction, so as to realize multi-wire cutting of the silicon rod to be processed (not shown in the figure) located below the multi-wire saw 1121. In a truncation operation of one lifting movement, the mutually parallel cutting wires 121 cut the silicon rod to be processed simultaneously, and silicon rod slices, that is, the required silicon wafer samples, can be intercepted.

[0075] In some embodiments of the present application, as Figure 3As shown, the rotating part 1111 where the cutting frame is connected to the lifting mechanism is a rotary flange lock, that is, the cutting frame 111 is movably connected to the lifting mechanism 14 through the rotary flange lock 1111. The rotary flange lock 1111 includes a first flange, a second flange (not shown in the figure), bolts and nuts. The first flange is provided with a plurality of first through holes whose diameters are larger than the diameter of the bolt screw and smaller than the diameter of the bolt head. The second flange is provided with a plurality of second through holes corresponding to the first through holes. The second through holes include a large circular hole and a small circular hole, and the large circular hole and the small circular hole communicate with each other from the side wall. In this embodiment, the nut is a 7-shaped nut, and one end of the nut has a diameter larger than the diameter of the small circular hole and smaller than the diameter of the large circular hole. The combination of the nut and the special-shaped hole makes the disassembly and assembly of the flange lock simpler and more labor-saving. In another embodiment of the present application, the connecting nut in the flange lock can be a wing nut.

[0076] In some other embodiments of the present application, the connection between the cutting frame and the lifting mechanism can be set as a rotating part through worm and worm gear transmission, including a worm wheel, a forward rotating worm, a reverse rotating worm, a driver and a motor. The forward rotating worm and the reverse rotating worm are respectively meshed with the worm wheel, and the driver controls the magnitude and direction of the current in the motor. The motor provides torque to the worm wheel through the worm to realize the rotation of the cutting frame.

[0077] As Figure 2 shown, it is a side view of the wire cutting equipment of the present application in a non-closed winding mode. In the illustrated embodiment, the cutting wire 121 can be a steel wire, or a diamond wire formed by embedding tiny hard particles such as diamond in the cutting steel wire, or a diamond wire described in Chinese Patent 201620281204.1 (invention name: diamond wire and multi-wire cutting equipment), that is, the diamond wire includes: a steel wire, and the steel wire is divided into at least two types of cutting sections arranged at intervals; at least two types of diamond layers respectively plated on at least two types of cutting sections, and the particle grades of each diamond layer are different.

[0078] In a specific embodiment where the diamond wire is selected, in order to avoid the inevitable wear caused by the friction generated by the high-speed running of the diamond wire wound around the wire storage cylinder (including a wire feeding cylinder 124 and a wire winding cylinder 125), the winding of the diamond wire on the wire storage cylinder can preferably be single-layer winding. For the winding method of the diamond wire on the wire storage cylinder, a wire storage cylinder wire arranging mechanism described in Chinese Patent 200910197800.6 (invention name: wire storage cylinder wire arranging mechanism of diamond wire cutting machine) can be adopted.

[0079] In some embodiments of the present application, for each cutting system composed of a rack 13 and a cutting frame, there is at least one tension detection mechanism. The tension detection mechanism includes at least one tension pulley 123. The tension pulley 123 is arranged on the cutting frame 111, the lifting mechanism 14 or the rack 13, and is used to detect and adjust the tension between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114. In a specific implementation manner, the tension pulley 123 can adopt the tension adjustment mechanism described in Chinese Patent 200910199387.7 (invention title: Tension adjustment mechanism of a diamond wire squaring machine); it can also adopt the method described in Chinese Patent 201410245524.7 (invention title: Multi-wire cutting equipment and its tension adjustment mechanism), which can sense in real time the tension of the steel wire or cutting wire between the traction assembly and the wire storage cylinder (winding cylinder) and the tension of the steel wire or diamond wire between the traction assembly and the cutting area, and can adjust the tension of the steel wire or diamond wire on the winding cylinder and the tension of the steel wire or diamond wire in the cutting area according to the sensed tension values.

[0080] In some embodiments of the present application, the tension detection mechanism can also adopt a tension transition pulley (not shown) to ensure that the cutting wire 121 is in a tension balance state during the cutting process. The cutting wire 121 starting from the wire pay-off reel 124, after bypassing the rack 13, is introduced into the cutting frame 111 through the first tension transition pulley before winding around the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 or the single-wire cutting wheel 114 on the cutting frame 111 in sequence. After completing the winding around the cutting wheels on the cutting frame 111, it is led out to the guide pulley 1221 of the rack 13 through the second tension transition pulley, and is wound around the wire take-up reel 125 via the guide pulley 1221. During cutting, the first tension transition pulley cooperates with the wire pay-off reel to adjust the cutting wire 121 between the first tension transition pulley and the first multi-wire cutting wheel to ensure that the cutting wire 121 is in a balanced state, and the second tension transition pulley cooperates with the wire take-up reel to adjust the cutting wire 121 between the second tension transition pulley and the second multi-wire cutting wheel or the single-wire cutting wheel to ensure that the cutting wire 121 is in a balanced state.

[0081] In some embodiments of the present application, the cutting system further includes a winding motor to drive the cutting wire 121 between the wire take-up reel 125 and the wire pay-off reel 124 to run.

[0082] A further improvement of the wire cutting device of the present application lies in that it further includes a locking device, which is arranged on the lifting mechanism and is used to freeze the cutting state after the cutting frame is switched between different cutting states. The freedom degree of the cantilever of the cutting frame is greater than 0. During the cutting process, the contact force between the cutting wire 121 and the silicon rod to be cut may cause the cutting frame to rotate. The use of the locking device is an implementation means to make the cutting frame stop rotating and be in a locked state after reaching the position of the preset cutting state driven by the driving motor of the rotating part.

[0083] In an implementation manner of the embodiment of the present application, the locking device includes a rotating locking cylinder, which is in a relaxed state during the rotation process of the cutting frame for switching the cutting state and enters a braking state after the cutting frame reaches the preset cutting state.

[0084] A further improvement of the present application lies in that the locking device further includes a positioning device. During the conversion of the cutting state, the rotation of the cutting frame is a passive rotation driven by the driving motor, and the rotation state of the cutting frame is controlled by the motor. In the specific implementation, the moment of inertia of the cutting frame itself can maintain the continuous rotation of the cutting frame after the motor stops running. The angular velocity and duration of the rotational motion driven by the moment of inertia are difficult to be artificially controlled, which will affect the positioning of the spatial position of the cutting frame after it stops rotating. The positioning device is arranged on the lifting mechanism and includes a fixed module for automatically detecting the wire and a positioning fixture assembly. When the rotating frame rotates to the first cutting state position or the second cutting state position, after the fixed module for automatically detecting the wire detects that there are parts in the cutting frame placed in the positioning fixture assembly, the cylinder of the rotating locking cylinder extends out, pushing the positioning fixture assembly to clamp the cutting frame so that the freedom degree of the relative movement between the cutting frame and the lifting mechanism is 0.

[0085] Please refer to Figure 3 , in the embodiment shown in the figure, the wire winding method of the wire cutting device is non-closed. Starting from the wire pay-off reel and ending at the wire take-up reel, the cutting wire 121 passes through the machine frame and the cutting frame on the wire cutting device. The cutting wire 121 starts from the wire pay-off reel, winds around the wire guide wheels according to the arrangement on the machine frame, and then winds around the wire guide wheels, the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 from the machine frame 13 to the cutting frame 111. After the winding on the cutting frame is completed, the cutting wire 121 is guided by the wire guide wheels around the machine frame to the wire take-up reel.

[0086] To facilitate the description and understanding of the wire winding method of the present application, let the wire winding method of the cutting wire 121 on the cutting frame start from the machine frame and wind to the wire guide wheel 1222, starting from the tangent point of the wire groove of the wire guide wheel 1222, and the running direction of the cutting wire 121 is the tangent direction;

[0087] The cutting wire 121 is sequentially wound around the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the guide wheel 1221. The cutting wire 121 guided by the guide wheel 1221 forms a single-wire cutting wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in one winding.

[0088] After one wrapping, the cutting wire 121 starting from the wire groove tangent of the guide wheel 1221 wraps around the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in sequence. After being wrapped around by the second multi-wire cutting wheel 113, a second cutting wire saw parallel to the single-wire cutting wire saws of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in the first wrapping is formed, that is, a multi-wire wire saw 1121 is formed, that is, two mutually parallel cutting wires are finally formed;

[0089] The extended wire extending from the tangent pay-off at the lower edge of the second multi-wire cutting wheel is wound around the guide wheel 1223 on the frame as the end point of the winding on the cutting frame 111.

[0090] In certain embodiments of the present application, the number of tensioning wheels around which the cutting wire is wound on a frame of the wire cutting device may be multiple.

[0091] In certain embodiments of the present application, based on the number of wafers required by the process, the circular winding method can pass through the first multi-wire cutting wheel and the second multi-wire cutting wheel for more than two times to form parallel cutting wire saws, and multiple silicon wafer samples can be cut in one lifting and cutting of the cutting frame.

[0092] like Figure 2 The schematic diagram of the wire cutting device in the first cutting state is shown, the first cutting state is the state where the cutting frame 111 rotates to the horizontal plane where the lower edge of the first multi-wire cutting wheel 112 and the lower edge of the second multi-wire cutting wheel 113 are at the same horizontal plane, and the shared horizontal plane is located below the cutting frame 111 structure in the first cutting state, and the cutting line 121 between the first multi-wire cutting wheel 111 and the second multi-wire cutting wheel 113 forms a multi-wire wire saw, and the multi-wire wire saw is a horizontal parallel line, that is, the first cutting state is a wafer taking operation state in which a silicon wafer sample can be cut in one cutting action. In the first cutting state, the single-wire cutting wheel and the cutting line 121 are in a separated state (non-contact state).

[0093] like Figure 4As shown, it is a wire cutting device in the second cutting state. The second cutting state is the state where the cutting frame 111 rotates to a state where the horizontal plane where the lower edge of the second multi-wire cutting wheel 113 is located and the horizontal plane where the lower edge of the single-wire cutting wheel 114 is located are the same horizontal plane, and this common horizontal plane is below the structure of the cutting frame 111 in the first cutting state. The cutting wire 121 section wound between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 forms a horizontal single-wire saw 1141. That is, the second cutting state is the state where the silicon rod can be truncated in one cutting action. In the second cutting state, the extension line of the first cantilever 1112 of the cutting frame 111 and the extension line of the second cantilever 1113 form a 45° angle, the extension line of the second cantilever 1113 and the extension line of the third cantilever 1114 form a 45° angle, and the cantilever structure of the cutting frame 111 is approximately symmetric with the center line of the second cantilever 1113 as the symmetry line. The extension line of the multi-wire saw and the extension line of the single-wire saw form a 90° angle. When the cutting frame 111 rotates around the rotation center to switch between different cutting states, the mutual conversion between the first cutting state and the second cutting state can be achieved by rotating 90° around the rotation axis. Or, the conversion from the intermediate state to the first cutting state or the second cutting state can be achieved by rotating ±45° around the rotation axis.

[0094] Please refer to Figure 5 , which shows a side view of the wire cutting device of the present application in the intermediate state in an embodiment. The intermediate state is the natural static state of the cutting frame 111 under the action of the gravity of the cutting frame 111 when the locking device is in a relaxed state, that is, when the cutting frame 111 is separated from the positioning fixture assembly. At this time, the multi-wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 and the single-wire saw between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 are both at a certain angle with the horizontal line, and the single-wire saw is in a tangent state with the single-wire cutting wheel 114; the cutting frame is approximately in a T-shaped structure placed upright in space, that is, the state where the center of gravity of the part below the horizontal plane where the rotation center of the cutting frame 111 is located is the lowest.

[0095] Figure 2The wire cutting device is shown in the first cutting state, and the single-wire cutting wheel 114 is in a separated state from the cutting wire 121. In the conversion of the cutting process, when the cutting frame 111 is converted to the second cutting state, the single-wire cutting wheel 114 rotates around the rotation center with the third cantilever 1114 of the cutting frame 111 around the rotation center and is tangent to the cutting wire 121 from the separation in the first cutting state to the intermediate state and then to the compression state in the second cutting state. After reaching the position of the second cutting state, it is locked by the rotating locking cylinder and remains stationary. The wire groove in the single-wire cutting wheel 114 that is in the same plane as the cutting wire 121 in the first dimension direction contacts the cutting wire 121 after rotating to the second cutting state and compresses the cutting wire 121 to a horizontal state, so as to form a single-wire wire saw between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114.

[0096] In the process of the wire cutting device of the present application performing a complete cutting of the silicon rod on the carrying device, the process includes the following cutting states: adjusting the position of the silicon rod (silicon rod to be cut) on the carrying device and then clamping it to keep the silicon rod stationary, adjusting the position of the frame in the first dimension direction, so that the cutting wire saw is located above the intersection of the head (or tail, or in the case of two wire frames, the two cutting frames are respectively located on the head and tail sides of the silicon rod to be cut) to be cut and the part that meets the processing specifications, the motor drives the cutting frame to rotate a certain angle (45° in the illustrated embodiment) from the naturally stationary intermediate state to the first cutting state of the multi-wire wire saw cutting and the cutting frame is locked by the rotating locking cylinder, the lifting mechanism descends to drive the wire saw to move to contact the silicon rod and continue cutting, that is, When the head is cut off, a silicon wafer sample is cut off; after the sample is cut off, the lifting mechanism rises away from the silicon rod, and the travel motor on the horizontal guide rail adjusts the position of the frame in the first dimension according to the preset silicon rod segment length, and the motor connected to the cutting frame rotating shaft drives the cutting frame to rotate a certain angle (90° in the illustrated embodiment) to the second cutting state of single-wire cutting, and the cutting line and the single-wire cutting wheel gradually change from separation to compression during rotation until the cutting line is wound around the single-wire cutting wheel, forming a horizontal single-wire wire saw in the second cutting state, and the cutting frame is locked by rotating the locking cylinder, and the lifting mechanism drives the cutting wire saw to descend to cut and obtain silicon rod segments; repeat the steps of the single-wire wire saw to cut the silicon rod according to the requirements of the crystal segment until the cutting operation of the entire silicon rod is completed. After the cutting frame completes the cutting operation, the locking cylinder is in a relaxed state, and the cutting frame rotates a certain angle (45° in the illustrated embodiment) from the second cutting state to the intermediate state.

[0097] In some other embodiments of the wire cutting device of the present application, Figure 6As shown, the included angles formed between the first cantilever 1112, the second cantilever 1113 and the third cantilever 1113 of the cutting frame 111 can be changed to 120° as shown in the figure. The first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 are respectively fixed on the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114. The extension line of the multi-wire saw 1121 between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 forms a 60° included angle with the extension line of the single-wire saw 1141 between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. When the cutting frame 111 rotates around the rotation center 1111 to perform the conversion of different cutting states, the mutual conversion between the first cutting state and the second cutting state can be achieved by rotating 120° around the rotation axis, and the conversion from the intermediate state to the first cutting state or the second cutting state can be achieved by rotating ±60° around the rotation axis.

[0098] In some other embodiments of the present application, as Figure 7 shown, the wire winding system of the wire cutting device of the present application adopts a closed wire winding structure. The cutting wire 121 is wound in a ring-shaped winding manner with the head and tail connected between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 on the cutting frame 111. The cutting wire 121 is wound around the cutting wheels through the cutting grooves of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, and the formed cutting wire saw is in the tangential direction of the cutting groove. The cutting wire 121 is guided by the wire guide wheel and wound around the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 at least twice, and is guided by the wire guide wheel and wound around the single-wire cutting wheel 114 once. The distances between the multiple wire grooves around which the cutting wire 121 is wound on the first multi-wire cutting wheel 112 are correspondingly equal to the distances between the multiple wire grooves around which the cutting wire 121 is wound on the second multi-wire cutting wheel 113, that is, the cutting wire saws 121 led out along the tangential directions of the wire grooves of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 satisfy a parallel spatial relationship with each other.

[0099] The cutting frame 111 is rotatably arranged on a lifting mechanism (not shown in the figure). The cutting frame 111 includes: a rotating part 1111, a first cantilever 1112, a second cantilever 1113, and a third cantilever 1114. Among them, the axis center of the rotating part 1111 is the rotation center of the cutting frame; the first cantilever 1112 is a beam structure extending along the rotating part 1111 in a first direction; the second cantilever 1113 is a beam structure extending along the rotating part 1111 in a second direction; the third cantilever 1114 is a beam structure extending along the rotating part 1111 in a third direction; the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 are all located on the rotating fixing plate of the cutting frame 111, that is, they rotate with the rotation of the rotating part 1111.

[0100] In some embodiments of the present application, the axis center of the rotating part 1111 is axially connected to a driving motor, and the motor shaft, that is, the power output shaft, drives the cutting frame fixing plate to rotate along the rotating part.

[0101] The spatial positions of the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 on the cutting frame are approximately arranged to form a T-shaped structure, and the rotation center of the cutting frame is set in the intersection end area of the three cantilevers of the cutting frame. In a specific implementation manner, the position of the rotation center is set in the center of gravity area of the cutting frame according to the structure and material characteristics of the cutting frame, so as to reduce the structural wear caused by the moment of the self-weight of the cutting frame on the rotating shaft of the rotating part. In Figure 1 In the shown embodiment, the free ends (i.e., the extending ends) of the first cantilever 1112, the second cantilever 1113, and the third cantilever 1114 are respectively fixedly connected to the first multi-wire cutting wheel, the second multi-wire cutting wheel, and the single-wire cutting wheel. A multi-wire saw 1121 is formed between the first multi-wire cutting wheel and the second multi-wire cutting wheel, and a single-wire saw (not shown in the illustrated embodiment) is formed between the second multi-wire cutting wheel and the single-wire cutting wheel.

[0102] The first multi-wire cutting wheel 112 is a cutting wheel provided with at least two wire grooves, and is fixedly arranged at the extending end of the first cantilever 1112 away from the rotation center. The arrangements of the wire grooves on the cutting wheel are parallel to each other to ensure that the cutting wires wound on the cutting wheel are parallel to each other. The basic structure and installation method of the cutting wheel are well known or can be easily obtained by those skilled in the art, and will not be elaborated here.

[0103] The second multi-wire cutting wheel 113 is a cutting wheel provided with at least two wire grooves, and is rotatably arranged at the extending end of the second cantilever 1113 away from the rotation center. The wire grooves are arranged parallel to each other on the cutting wheel. In particular, the distance between adjacent wire grooves of the second multi-wire cutting wheel 113 is equal to the distance between adjacent wire grooves of the first multi-wire cutting wheel 112, so as to ensure that the cutting segments of the multi-wire saw formed by the cutting wire wound between the two multi-wire cutting wheels satisfy a parallel spatial relationship.

[0104] The single-wire cutting wheel 114 is rotatably arranged at the extending end of the third cantilever 1114 away from the rotation center, and conforms to the cutting wire segment wound between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 to form a single-wire saw. The plane where the wire groove of the single-wire cutting wheel 114 is located in the first dimension direction is the same plane as the plane where at least one wire groove of the second multi-wire cutting wheel 113 is located in the first dimension direction.

[0105] In another embodiment of the present application, the single-wire cutting wheel 114 can be a cutting wheel provided with a plurality of wire grooves. In the wire winding mode, the cutting wire winds around the wire groove of the single-wire cutting wheel 114 once, and a single wire saw can be led out.

[0106] In some embodiments of the present application, when truncating the silicon rod, the cutting frame rotates around its rotating part to realize the conversion between the first cutting state of cutting by the multi-wire saw and the second cutting state of cutting by the single-wire saw.

[0107] As Figure 7 shown in the wire cutting device in the first cutting state, the lifting mechanism moves up and down to drive the multi-wire saw 1121 formed by the cutting wire segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 (as Figure 1 shown in the embodiment is a double-wire saw) to move up and down in the lifting direction, so as to realize multi-wire cutting of the silicon rod to be processed (not shown in the figure) located below the multi-wire saw 1121. In the truncating operation of one lifting movement, the parallel cutting wire saws cut the silicon rod to be processed at the same time, and silicon rod slices, that is, the required silicon wafer samples, can be intercepted.

[0108] In some embodiments of the present application, the rotating part 1111 where the cutting frame is connected to the lifting mechanism is a rotary flange lock. The rotary flange lock includes a first flange, a second flange (not shown in the figure), bolts, and nuts. The first flange is provided with a plurality of first through holes whose diameters are larger than the diameter of the bolt screw and smaller than the diameter of the bolt head. The second flange is provided with a plurality of second through holes corresponding to the first through holes. The second through holes include a large circular hole and a small circular hole, and the large circular hole and the small circular hole communicate with each other from the side wall; in this embodiment, the nut is a 7-shaped nut, and one end of the nut has a diameter larger than the diameter of the small circular hole and smaller than the diameter of the large circular hole. The combination of the nut and the special-shaped hole makes the disassembly and assembly of the flange lock simpler and more labor-saving. In another embodiment of the present application, the connecting nut in the flange lock can be a wing nut.

[0109] In some other embodiments of the present application, the connection between the cutting frame and the lifting mechanism can be set as a rotating part driven by a worm and worm gear, including a worm wheel, a forward rotating worm, a reverse rotating worm, a driver, and a motor. The forward rotating worm and the reverse rotating worm are respectively engaged with the worm wheel, and the driver controls the magnitude and direction of the current in the motor. The motor provides torque to the worm wheel through the worm to realize the rotation of the cutting frame.

[0110] In Figure 7 In the illustrated embodiment, the cutting wire 121 is a stranded wire cutting wire formed by at least two cutting wires twisted together. The stranded wire cutting wire is formed by two or more steel wire single wires or diamond wire single wires for twisting rotating around a stranding shaft at the same angular velocity and advancing uniformly in cooperation with the stranding winding method, or formed by twisting multiple single wires in a certain direction and rule. Compared with a single wire cutting wire having the same cross-sectional area as the stranded wire, the stranded wire cutting wire has higher mechanical properties and flexibility, and prolongs the fatigue life of the cutting wire under repeated wear during cutting.

[0111] Please refer to Figure 7 , in the embodiment shown in the figure, the winding method of the cutting wire 121 is a closed loop structure. For the convenience of explaining and understanding the winding method of the present application, assume a point in the cutting wire loop as a cut-off point and use this point as the starting point of winding. In one embodiment, the winding method of the cutting wire 121 starts from the single wire cutting wheel 114 and takes the tangent point of the wire groove of the single wire cutting wheel 1114 as the starting point, and the direction of the cutting wire 121 is the tangent direction;

[0112] It is wound around the second multi-wire cutting wheel 113, the first multi-wire cutting wheel 112, and the wire guiding wheel 122 in sequence. During one round of winding, the cutting wire 121 guided by the wire guiding wheel 122 forms a single wire cutting wire saw 1122 between the first multi-wire cutting wheel and the second multi-wire cutting wheel;

[0113] After one revolution, the cutting line 121 starting from the tangent of the wire groove of the wire wheel sequentially winds around the second multi-wire cutting wheel 113 and the first multi-wire cutting wheel 112. After being wound around by the first multi-wire cutting wheel 112, a second cutting wire saw parallel to the single-wire cutting wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in the first revolution is formed, that is, a multi-wire saw 1121 is formed between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113.

[0114] The cutting line 121 is wound around to the single-wire cutting wheel 114 via the tensioning wheel 123 and reaches the assumed truncation point on the single-wire cutting wheel 114, that is, the head-to-tail connected annular winding method is realized in the actual wire winding.

[0115] The contact between the cutting line 121 and the cutting wheel on the cutting groove is an inferior arc (an arc with an angle less than 180°). The cutting line 121 is in a tensioned state between the cutting wheels, and the winding position is on the outer edge of the convex polygon formed by the single-wire cutting wheel or multi-wire cutting wheel, the tensioning wheel, and the wire wheel.

[0116] In some embodiments of the present application, multiple wire wheels 122 through which the annular winding on one cutting frame 111 in the wire cutting device passes can be provided.

[0117] In some embodiments of the present application, multiple tensioning wheels 123 through which the annular winding on one cutting frame 111 in the wire cutting device passes can be provided.

[0118] In some embodiments of the present application, the annular winding method passing through the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 can be more than two times, forming parallel cutting wire saws, and multiple silicon wafer samples can be intercepted in one lift cutting of the cutting frame.

[0119] In some embodiments of the present application, a drive motor (not shown in the figure) is further included in the winding system formed by the annular winding method, and is arranged adjacent to the first multi-wire cutting wheel 112 or the second multi-wire cutting wheel 113. In this embodiment, the drive motor is the power source for running the cutting line in the winding system. The drive motor directly drives the first multi-wire cutting wheel 112 or the second multi-wire cutting wheel 113 to drive rotation to run the cutting line 121 wound between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114.

[0120] The tension detection mechanism includes a tension wheel 123 disposed on the cutting frame, which is used to detect and adjust the tension of the cutting wire 121 between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114. In wire cutting processing, the tension of the cutting wire 121 affects the yield and processing accuracy during cutting. The tension detection mechanism performs tension detection and adjustment to make the tension of the cutting wire reach a set threshold value and remain constant during cutting or within a certain range allowed with the constant value as the numerical center.

[0121] The tension wheel 123 is used to adjust the tension of the cutting wire 121, which can reduce the probability of the cutting wire 121 breaking and reduce consumables. In the cutting operation, the cutting wire 121 plays a crucial role. However, even the best cutting wire 121 has limited elongation and wear resistance. That is to say, the cutting wire 121 will gradually become thinner during reciprocating movement until it is finally broken. Therefore, current wire cutting equipment generally designs a cutting wire 121 tension compensation mechanism to make up for the elongation of the cutting wire 121 during its round-trip movement. Using the tension wheel 123 is one implementation means.

[0122] In some embodiments of the application, the tension detection mechanism at least includes: a tension wheel, a tension sensor, a servo motor, and a lead screw. Among them, the tension wheel is disposed between the single-wire cutting wheel and the first multi-wire cutting wheel, and is used to traction the steel wire or diamond wire between the single-wire cutting wheel and the first multi-wire cutting wheel; the tension sensor is disposed on the tension wheel, continuously senses the tension value of the diamond wire on the tension wheel, and issues a driving signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor and is used to start working after receiving the driving signal issued by the tension sensor; one end of the lead screw is connected to the tension wheel, and the other end is connected to the servo motor, and the lead screw traction the tension wheel to perform a one-way displacement when the servo motor works, so as to adjust the tension of the steel wire or diamond wire.

[0123] A further improvement of the wire cutting device of the present application is that the tension adjustment mechanism further includes a slide rail, which is disposed between the servo motor and the tension wheel, and is used to make the tension wheel slide on the slide rail when the lead screw traction the tension wheel. The servo motor has a rotating shaft, and the lead screw is axially connected to the rotating shaft of the servo motor; when the tension sensor first senses the tension of the steel wire or diamond wire, the preset value sensed by the tension sensor is the initial tension value. During the cutting operation, the tension value sensed by the tension sensor is the current tension value, and the preset value sensed by the tension sensor is the tension value at the previous moment.

[0124] A further improvement of the wire cutting device of the present application is that it further includes a locking device, which is arranged on the lifting mechanism and is used to freeze the cutting state after the cutting frame is switched between different cutting states. The degree of freedom of the cantilever of the cutting frame is greater than 0. During the cutting process, the contact force between the cutting wire and the silicon rod to be cut may cause the cutting frame to rotate. The use of the locking device is an implementation means to make the cutting frame stop rotating and be in a locked state after reaching the position of the preset cutting state driven by the driving motor of the rotating part.

[0125] In an implementation manner of the embodiment of the present application, the locking device includes a rotating locking cylinder, which is in a relaxed state during the rotation process of the cutting frame for switching the cutting state and enters a braking state after the cutting frame reaches the preset cutting state.

[0126] A further improvement of the present application is that the locking device further includes a positioning device. During the conversion of the cutting state, the rotation of the cutting frame is a passive rotation driven by the driving motor, and the rotation state of the cutting frame is controlled by the motor. In the specific implementation, the moment of inertia of the cutting frame itself can maintain the continuous rotation of the cutting frame after the motor stops running. It is difficult to artificially control the angular velocity and duration of the rotational motion driven by the moment of inertia, which will affect the positioning of the spatial position of the cutting frame after it stops rotating. The positioning device is arranged on the lifting mechanism and includes a fixed module for automatically detecting the wire and a positioning fixture assembly. When the rotating frame rotates to the first cutting state position or the second cutting state position, after the fixed module for automatically detecting the wire detects that there are parts in the cutting frame placed in the positioning fixture assembly, the cylinder of the rotating locking cylinder extends out, pushing the positioning fixture assembly to clamp the cutting frame so that the degree of freedom of the relative movement between the cutting frame and the lifting mechanism is 0.

[0127] As Figure 7 shown, the extension line of the first cantilever 1112 of the cutting frame 111 and the extension line of the second cantilever 1113 form a 45° angle, the extension line of the second cantilever 1113 and the extension line of the third cantilever 1114 form a 45° angle, and the cantilever structure of the cutting frame 111 is approximately symmetric with the center line of the second cantilever 1113 as the symmetry line. The extension line of the multi-wire saw 1121 and the extension line of the single-wire saw 1141 form a 90° angle. When the cutting frame 111 rotates around the rotation center to switch between different cutting states, the mutual conversion between the first cutting state and the second cutting state can be achieved by rotating 90° around the rotation axis, and the conversion from the intermediate state to the first cutting state or the second cutting state can be achieved by rotating ±45° around the rotation axis.

[0128] The first cutting state is a state where the cutting frame 111 rotates to a state that the horizontal plane where the lower edge of the first multi-wire cutting wheel 112 is located is the same as the horizontal plane where the lower edge of the second multi-wire cutting wheel 113 is located, and the common horizontal plane is below the structure of the cutting frame 111 in the first cutting state. The cutting line segment wound between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 forms a multi-wire saw 1121, and the multi-wire saw 1121 is a horizontal parallel line. That is, the first cutting state is a wafer sampling operation state where a silicon wafer sample can be intercepted in one cutting action. In particular, for the wire cutting devices in different embodiments, the first cutting state is the wafer sampling operation state of the wire cutting device.

[0129] Please refer to Figure 8 , which shows a side view of the wire cutting device of the present application in the second cutting state in an embodiment. The second cutting state is a state where the cutting frame 111 rotates to a state that the horizontal plane where the lower edge of the second multi-wire cutting wheel 113 is located is the same as the horizontal plane where the lower edge of the single-wire cutting wheel 114 is located, and the common horizontal plane is below the structure of the cutting frame 111 in the first cutting state. The cutting line segment wound between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 forms a horizontal single-wire saw. That is, the second cutting state is a state where the silicon rod can be truncated in one cutting action. In particular, for the wire cutting devices in different embodiments, the second cutting state is the silicon rod truncation state of the wire cutting device.

[0130] Please refer to Figure 9 , which shows a side view of the intermediate state of the wire cutting device of the present application in an embodiment. The intermediate state is a natural static state where the cutting frame 111 is under the action of its own gravity when the locking device is in a relaxed state, that is, when the cutting frame 111 is separated from the positioning fixture assembly. At this time, the multi-wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 and the single-wire saw between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 are both at an angle to the horizontal line, and the cutting frame 111 is approximately in a T-shaped structure placed upright in space, that is, a state where the center of gravity of the part below the horizontal plane where the rotation center of the cutting frame 111 is located is the lowest.

[0131] In the specific implementation process of the wire cutting device for cutting the silicon rod to be cut, after the transportation and loading of the silicon rod to be cut are completed, the cutting system cuts the silicon rod to be cut placed on the silicon rod bearing device. According to the characteristics of the silicon rod to be cut, such as the length of the head or tail impurity layer to be removed, adjust the position of the silicon rod on the bearing device or the horizontal position of the machine frame on the base of the wire cutting device. After determining the position of the cutting frame in the first dimension direction, the traveling motor on the lifting mechanism of the machine frame drives the displacement of the lifting mechanism in the lifting direction, and cooperates with the driving motor of the cutting wire to drive the running of the cutting wire, and then the cutting operation can be carried out.

[0132] In the process of the wire cutting device of the present application performing a complete cutting of the silicon rod on the carrying device, the process includes the following cutting states: adjusting the position of the silicon rod on the carrying device and then clamping it to keep the silicon rod stationary, adjusting the position of the frame in the first dimension direction, so that the cutting wire saw is located above the intersection of the head to be cut and the part that meets the processing specifications, the motor drives the cutting frame to rotate a certain angle (45° in the illustrated embodiment) from the naturally stationary intermediate state to the first cutting state of the multi-wire wire saw cutting, and the cutting frame is locked by the rotating locking cylinder, and the lifting mechanism descends to drive the wire saw to move to contact the silicon rod And continue cutting, that is, cut off the silicon wafer sample when cutting off the head; after cutting off the sample, the lifting mechanism rises away from the silicon rod, and the travel motor on the horizontal guide rail adjusts the position of the frame in the first dimension according to the preset silicon rod segment length, and the motor connected to the cutting frame rotating shaft drives the cutting frame to rotate a certain angle (90° in the illustrated embodiment) to the second cutting state of single-line cutting, and the cutting frame is locked by rotating the locking cylinder, and the lifting mechanism drives the cutting wire saw to descend to cut and obtain the silicon rod segment; repeat the operation described in the previous step to the tail of the silicon rod, that is, the cutting frame completes the cutting operation of the entire silicon rod. After the cutting frame completes the cutting operation, the locking cylinder is in a relaxed state, and the cutting frame rotates a certain angle (45° in the illustrated embodiment) from the second cutting state to the intermediate state.

[0133] See also Figure 10 In some other embodiments of the wire cutting device of the present application, the angle between the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 of the first cutting frame 111 can be changed, and the first multi-cutting wheel 112, the second multi-cutting wheel 113 and the single-wire cutting wheel 114 are fixed on the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 respectively. The extension line of the multi-wire wire saw between the first multi-cutting wheel 112 and the second multi-cutting wheel 113 and the extension line of the single-wire wire saw between the second multi-cutting wheel 113 and the single-wire cutting wheel 114 form an angle of 60°. When the cutting frame 111 rotates around the rotation center to convert different cutting states, the mutual conversion between the first cutting state and the second cutting state can be achieved by rotating 120° around the rotation axis, and the conversion from the intermediate state to the first cutting state or the second cutting state can be achieved by rotating ±60° around the rotation axis.

[0134] In certain embodiments of the present application, the number of tension wheels around which the annular winding wire is wound on a cutting frame in the wire cutting device may be multiple.

[0135] In some embodiments of the present application, the annular wire winding method may pass through the first multi-wire cutting wheel and the second multi-wire cutting wheel for more than two times, forming mutually parallel cutting wire saws, and multiple silicon wafer samples can be intercepted during one lifting and cutting operation of the cutting frame.

[0136] In the actual production process, the silicon rod is usually not a cylinder with a uniform diameter, but has a large end and a small end or other types. If the bearing surface of the bearing device is set horizontally, the axis of the silicon rod to be cut may not be horizontal. At this time, the cutting cross-section obtained by the vertical lifting movement of the lifting mechanism during cutting is not perpendicular to the axis of the silicon rod being cut, that is, the obtained cutting surface is an inclined plane, and the obtained silicon rod segments do not meet the processing requirements. A further improvement of the wire cutting device of the present application is that it further includes a horizontal detection device (not shown), and the horizontal detection device is arranged on the lifting mechanism and is used to detect the horizontal degree of the axis of the silicon rod to be cut.

[0137] In some embodiments of the present application, further, the horizontal detection device on the lifting mechanism includes a first contact measuring instrument and a second contact measuring instrument, which are used to detect the horizontal degree of the axis of the silicon rod to be cut. The first contact measuring instrument is used to measure the horizontal data of the silicon rod to be cut in the cutting working area at the measuring position corresponding to the first contact measuring instrument, and the second contact measuring instrument is used to measure the horizontal data of the silicon rod to be cut in the cutting working area at the measuring position corresponding to the second contact measuring instrument.

[0138] A further improvement of the wire cutting device of the present application is that it further includes a leveling device (not shown), and the leveling device is arranged in the working area and is used to level the axis of the silicon rod to be cut placed in the cutting working area according to the detection result of the horizontal detection device. The leveling device uses a horizontal centering structure. When the horizontal detection device detects that the axis of the silicon rod to be cut is in a non-horizontal state, the rotation drive mechanism is used to drive the workpiece bearing device to rotate to adjust the horizontal degree of the axis of the workpiece.

[0139] In an embodiment of the present application, the leveling device includes: a rotation fulcrum structure, a rotation drive mechanism, and an offset limiting mechanism. The rotation fulcrum structure is located below the silicon rod bearing device for bearing the silicon rod to be cut in the working area and serves as the rotation fulcrum for the rotation of the silicon rod bearing device. The rotation drive mechanism is located below the silicon rod bearing device and is used to drive the silicon rod bearing device to rotate around the rotation fulcrum structure to adjust the horizontal degree of the axis of the silicon rod to be cut. The offset limiting mechanism is adjacent to the rotation drive mechanism and is used to limit the silicon rod bearing device from shifting in the horizontal direction when rotating around the rotation fulcrum structure (up and down deflection).

[0140] In an embodiment of leveling the wire cutting device of the present application, the first contact measuring instrument corresponds to the rotation fulcrum structure and is used to measure the first height data (which can be the absolute height or the relative height with respect to the silicon rod bearing device) of the vertex of the silicon rod to be cut at the rotation fulcrum structure. The second contact measuring instrument corresponds to the rotation driving mechanism and is used to measure the second height data (which can be the absolute height or the relative height with respect to the silicon rod bearing device) of the vertex of the silicon rod to be cut at the rotation driving mechanism. Subsequently, the adjustment amount of the silicon rod bearing device at the rotation driving mechanism can be calculated by comprehensively considering the first height data measured by the first contact measuring instrument and the second height data measured by the second contact measuring instrument, and the rotation driving mechanism is actuated according to the adjustment amount to drive the silicon rod bearing device to rotate around the rotation fulcrum structure to complete horizontal centering, so that the axis of the silicon rod to be cut is adjusted to a horizontal state.

[0141] Optionally, in another embodiment of the present application, the leveling device (not shown) of the wire cutting device of the present application can also be set as a horizontal centering mechanism for adjusting the levelness of the silicon rod to be cut by adjusting the cushion blocks. The leveling device is arranged on the silicon rod bearing device in the working area and is used to adjust the axis of the silicon rod to be cut to a horizontal state. The horizontal centering mechanism includes: two adjusting cushion blocks, a horizontal detection unit, and a driving motor.

[0142] The two adjusting cushion blocks are respectively arranged at the head and tail ends of the silicon rod bearing device in the corresponding working area and are used to support the silicon rod to be cut.

[0143] The horizontal detection unit is used to detect the levelness of the silicon rod to be cut supported by the two adjusting cushion blocks.

[0144] The driving motor is associated with at least one of the two adjusting cushion blocks and is used to control the lifting movement of the at least one associated adjusting cushion block to ensure that the axis of the silicon rod to be cut is adjusted to a horizontal state.

[0145] In this way, the workpiece horizontal centering mechanism can adjust the axis levelness of the workpiece to be cut carried by the silicon rod bearing device to a horizontal state, and obtain single-segment workpiece sections that meet the workpiece specifications through cutting. In addition, due to the adoption of the workpiece horizontal centering mechanism, it can ensure that the axis of the workpiece to be cut is in a horizontal state and make the cutting sections of each section of the workpiece after cutting perpendicular to the axis, meeting the workpiece processing requirements, and improving the cutting quality and yield rate of the workpiece.

[0146] In summary, for the silicon rod cutting device disclosed in the present application, in the wire cutting device provided in the first aspect, a rotatable cutting frame is designed. By simultaneously arranging a single-wire cutting wheel and a multi-wire cutting wheel on the cutting frame, different wire winding systems are designed to realize the conversion between single-wire sawing and multi-wire sawing through rotation. When the cutting frame rotates to different set states, multi-wire sawing and single-wire sawing can be realized. During the truncation operation of the silicon rod to be cut, the truncation and sample cutting can be achieved by adjusting the cutting frame, so as to obtain a sample in one lifting and cutting according to needs, and the purpose of truncation in silicon rod processing can be achieved. This solves the problems of low efficiency in obtaining samples through multiple cuts and difficulty in controlling the thickness of the samples, which is likely to waste materials. Furthermore, the cutting frame is arranged on the lifting mechanism of the machine frame, and the machine frame can move along the machine base in the first dimension direction, so that the position of the cutting wire saw can be adjusted according to the processing specifications to obtain a qualified processed silicon rod truncation, solving the problem of different required processing sizes of workpieces. The wire cutting device of the present application improves the truncation operation efficiency of the equipment, improves the product qualification rate, and improves the utilization rate of processing raw materials, effectively overcoming various disadvantages of the prior art and having high industrial value.

[0147] In the second aspect of the present application, a silicon rod loading device is applied to transfer the silicon rod to be cut placed in the storage area to the cutting work area (cutting workbench) of the silicon rod cutting device. In the existing silicon rod loading technology, a common method is to use a hoisting device. When using a hoisting device to transport the silicon rod to be cut, a clamp made of non-elastic material is required to clamp the silicon rod. The direct contact between the clamp material and the silicon rod during clamping may cause damage to the surface of the silicon rod. The mass of a common single silicon rod is about 400 kg, and the length is about 5000 mm (such as a specification of 5360 mm, etc.) or about 800 mm, etc. Different specifications exist. When the silicon rod is lifted during the hoisting process, there is a great safety hazard if it is lost. At the same time, the movement of the hoisting device is usually in the lifting direction and the horizontal direction along a straight line, with low mobility; another common existing method for loading silicon rods is manual transportation, which seriously affects the production efficiency of the enterprise.

[0148] Please refer to Figure 11 , which shows a schematic diagram of a silicon rod loading device applied in the second aspect of the present application. The silicon rod loading device includes a first rotating shaft 21 and at least two swing arm assemblies 25A, 25B.

[0149] The first rotating shaft 21 is driven to rotate by a first driving device 23. The length direction of the first rotating shaft 21 is arranged in the length direction of the silicon rod 16 to be cut in the silicon rod cutting work area 17. The first driving device 23 is pivotally connected to the first rotating shaft 21 and is arranged at one end of the first rotating shaft 21.

[0150] In an embodiment of the present application, the first driving device 23 includes a driving motor 231, and a power output shaft of the driving motor 231 is axially connected to the first rotating shaft 21 at one end of the first rotating shaft 21.

[0151] There are at least two swing arm assemblies, which are respectively axially connected to the first rotating shaft 21 according to a preset interval. The at least two swing arm assemblies 25A and 25B are used to carry the silicon rod 16 to be cut, and transfer the silicon rod 16 to be cut to the cutting working area 17 of the cutting device under the drive of the first rotating shaft 21; each swing arm assembly 25 includes a swing arm body axially connected to the first rotating shaft 21 and a supporting mechanism arranged on the swing arm body. The supporting mechanism is used to follow the movement of the swing arm so that when the supporting part is in the transfer operation, it remains in the state of carrying the silicon rod 16 to be cut and the relative position between the silicon rod 16 to be cut and the supporting part does not change during the transfer operation. In other words, the relative position between the silicon rod 16 to be cut and the supporting part does not change during the transfer operation means that during the transfer operation, the silicon rod 16 to be cut is in a static state relative to the supporting part.

[0152] In an exemplary embodiment, the at least two swing arm assemblies 25A and 25B are axially connected to the first rotating shaft 21 according to a preset interval of about 800 mm (the shortest length of the crystal rod required under normal circumstances).

[0153] In some embodiments of the present application, the supporting mechanism includes a manipulator, which is arranged at the end of the swing arm body and follows the movement of the swing arm. The swing arm body and the supporting mechanism rotate around the first rotating shaft under the drive of the first driving device. During the movement of the manipulator following the swing arm, the supporting part rotates relative to the swing arm body under the action of the manipulator, that is, the rotation of the supporting part relative to the center of the circumcircle of the supporting part is jointly determined by the rotation driven by the first driving device and the rotation relative to the swing arm body.

[0154] In an implementation of the present application, during the process of the silicon rod feeding device transporting the silicon rod to be cut from the storage area to the cutting area, the manipulator follows the movement of the swing arm so that the angular velocity of the supporting part rotating relative to the swing arm body is equal in magnitude and opposite in direction to the angular velocity of the swing arm rotating around the first rotating shaft, the angular velocity of the supporting part rotating relative to the center of its circumcircle remains 0, and no relative movement occurs between the supporting part and the silicon rod to be cut on the supporting part.

[0155] In some embodiments of the present application, at least two transfer stations corresponding to the swing arm assemblies one by one are provided on the base of the silicon rod loading device, and are used to respectively pivotally connect the at least two swing arm assemblies to the first rotating shaft at preset intervals. In one implementation, the movable connection between the transfer station and the corresponding swing arm assembly limits the movement of the corresponding swing arm assembly relative to the transfer station to a movement form of rotating around the first rotating shaft, and the swing arm assembly generates a corresponding displacement as the corresponding transfer station moves. The first rotating shaft penetrates through each swing arm assembly, and when the first driving device drives the first rotating shaft to rotate, each swing arm assembly pivotally connected to the rotating shaft through the transfer station simultaneously rotates around the first rotating shaft.

[0156] Please refer to Figure 12 , which shows an enlarged schematic view of the b position of the silicon rod loading device of the present application in Figure 11 . As shown in the figure, the swing arm body 251 is driven by the first rotating shaft 21. Driven by the power output shaft of the first rotating shaft 21, that is, the motor shaft of the first driving device, the swing arm body 251 can rotate around the first rotating shaft 21. One end (the end) of the swing arm body 251 far from the first rotating shaft 21 is fixedly connected to the supporting mechanism 252. When the first rotating shaft 21 drives the swing arm body 251 to rotate in the normal plane of the axis of the first rotating shaft 21, the whole supporting mechanism 252 changes in spatial position, so that the whole supporting mechanism 252 moves in a swinging direction between the storage area and the cutting area.

[0157] In one embodiment of the present application, each transfer station 27 has a first motion mechanism for linear displacement between the storage area and the cutting working area, including horizontal guide rails 271 provided on the front and rear sides of the transfer station 27. The transfer station 27 is movably connected to a carrier 28 provided with corresponding second-dimension guide grooves (not shown in the figure) through the horizontal guide rails 271 in the second dimension direction. A second motion mechanism is provided on the carrier 28 to realize the linear displacement of the transfer station 27 relative to the carrier 28 in the second dimension direction.

[0158] In some embodiments of the present application, a driving mechanism is provided inside or outside the transfer station 27 for driving the transfer station 27 to move on the horizontal guide rail 271 of the base. In one embodiment, the driving mechanism of the transfer station 27 includes: a traveling lead screw (not shown in the figure) arranged along the horizontal guide rail and connected to the transfer station 27, and a traveling motor (not shown in the figure) connected to the traveling lead screw. Using the traveling motor, the transfer station 27 is driven to travel along the guide rail 271. The traveling motor on the transfer station 27 is connected to the traveling lead screw laid on the guide rail to realize the displacement of the transfer station 27 on the guide rail in the second dimension direction, that is, the shortest distance direction between the storage area and the cutting area.

[0159] In another embodiment of the present application, the first motion mechanism for the linear displacement of the transfer table between the storage area and the cutting working area may adopt the form of cooperation between a traveling motor and a ball screw pair. The ball screw pair includes a ball screw and a screw nut adapted to the ball screw. The screw nut is connected to the transfer table. The traveling motor drives the ball screw to rotate, so as to drive the transfer table to move linearly along the guide groove provided on the carrier table through the screw nut.

[0160] In some embodiments of the present application, a second motion mechanism for linearly displacing at least one swing arm assembly 25 on the first rotating shaft 21 (i.e., displacement in the first dimension direction) is provided in the silicon rod loading device. In one implementation manner of this embodiment, the bottom of the carrier table 28 further includes a guide rail assembly in the first dimension direction, and is movably connected to the guide rail in the first dimension direction provided on the machine base 15 through a bottom guide groove (not shown in the figure) of the carrier table 28. The second motion mechanism is the guide rail assembly of the carrier table 28, and includes a driving mechanism provided inside or outside the carrier table 28 for driving the carrier table 28 to move on the guide rail in the first dimension direction of the machine base. The driving mechanism of the carrier table 28 includes: a traveling lead screw (not shown in the figure) arranged along the bottom guide rail of the carrier table 28 and connected to the carrier table 28, and a traveling motor (not shown in the figure) connected to the traveling lead screw. By using the traveling motor, the carrier table 28 is driven to travel along the machine base guide rail. The traveling motor on the carrier table 28 is connected to the traveling lead screw laid on the machine base guide rail, so as to realize the displacement of the carrier table 28 on the machine base guide rail in the first dimension direction, that is, in a straight line direction parallel to the first rotating shaft 21.

[0161] In another embodiment of the present application, the second motion mechanism for linearly displacing at least one swing arm assembly on the first rotating shaft may adopt the form of cooperation between a traveling motor and a ball screw pair. The ball screw pair includes a ball screw and a screw nut adapted to the ball screw. The screw nut is connected to the carrier table. The traveling motor drives the ball screw to rotate, so as to drive the carrier table to move linearly along the guide groove provided on the machine base through the screw nut.

[0162] In the actual production process, the silicon rod is usually not a cylinder with a uniform diameter, but has a larger end and a smaller end or other types. The position of the center of gravity of different silicon rods in the length direction of the silicon rod is determined by the specific shape of the silicon rod. During the transfer of the silicon rod, it is necessary to ensure that the torque generated by the support of different supporting mechanisms for the silicon rod is balanced with the gravitational torque to prevent the silicon rod from falling axially during the transfer. In some embodiments of the present application, at least one of the bearing platforms corresponding to the at least two transfer platforms is provided with a bottom guide rail assembly, i.e., a second motion mechanism, to drive the transfer platform on the bearing platform to displace in the linear direction of the first rotating shaft. The number of bearing platforms that can move along the linear direction of the first rotating shaft can also be greater than one. The bearing platform provided with the second motion mechanism drives the corresponding transfer platform and the swing arm assembly to move in the linear direction of the first rotating shaft to adjust the position of the swing arm assembly on the first rotating shaft, that is, to adjust the position of the supporting mechanism relative to the silicon rod in the length direction of the silicon rod, and further to adjust the position of the supporting mechanism relative to the position of the center of gravity of the silicon rod.

[0163] As described above, in the processing of silicon rods, the common length of silicon rods is about 800 mm to 5000 mm, and the common mass of silicon rods is about 400 kg or heavier. During the transfer of silicon rods, the balance of the silicon rods is ensured by two silicon rod supporting mechanisms. Usually, the two supporting points or surfaces during the transfer of silicon rods are located at both ends of the silicon rod, and the pressure on the surface of the silicon rod in contact with the two supporting points at both ends is relatively large, which may damage the integrity of the silicon rod structure. Please refer to Figure 11 The side view of the silicon rod loading device of the present application shown in the figure. In the illustrated embodiment, the number of swing arm assemblies is four arranged at intervals, including the first swing arm assembly 25A and the second swing arm assembly 25B located at both ends of the first rotating shaft, and the third swing arm assembly 25C and the fourth swing arm assembly 25D respectively axially connected between both ends of the first rotating shaft 21 according to a preset interval. During the transfer of the silicon rod, the pressure at the contact surface between each supporting mechanism 252 and the silicon rod is less than the pressure at the contact surface during the transportation by two supporting mechanisms 252 or jigs in the prior art.

[0164] In some embodiments of the present application, the bearing platform corresponding to the transfer platform of the third swing arm assembly 25C or the fourth swing arm assembly 25D is provided with a second motion mechanism to drive the transfer platform on the bearing platform to displace in the linear direction of the first rotating shaft 21, for adjusting the bearing position according to the position of the center of gravity of the silicon rod to be cut. In an implementation manner of this embodiment, the second motion mechanism can be set as a guide rail assembly with a driving motor.

[0165] In some embodiments of the present application, as Figure 13 shown, it is shown as Figure 11An enlarged schematic view at position c in the figure. The silicon rod feeding device further includes a second rotating shaft 22, which is driven by a second driving device 24, runs through the first, second, third, and fourth swing arm assemblies in parallel with the first rotating shaft 21, is axially connected to the swing arm assembly 25, and is located between the first rotating shaft 21 of the swing arm body 251 and the supporting mechanism 252. The second driving device 24 is arranged at one end of the second rotating shaft 22.

[0166] A further improvement of this application is that the first driving device and the second driving device are respectively arranged at both ends of the first rotating shaft or the second rotating shaft in the length direction, and are respectively located at the ends of the rotating shafts at the axially connected positions of the first rotating shaft and the first swing arm assembly, and the second rotating shaft and the second swing arm assembly, so as to achieve the mass balance of the mechanical layout of the swing arm assembly in the length direction, and improve the structural space utilization rate of the swing arm assembly in the spatial layout while correspondingly reducing the volume of the swing arm assembly.

[0167] In some embodiments of this application, the swing arm body includes an internal space, that is, the swing arm body is set to have a structure with a containing space for storing the axially connected components of the first rotating shaft, the second rotating shaft and the swing arm body.

[0168] In some embodiments of this application, the supporting mechanism of the swing arm assembly includes a driving gear, a driven gear and a manipulator assembly, and the manipulator assembly includes a manipulator body and a supporting member.

[0169] Please refer to Figure 14 , which shows a cross-sectional view of the swing arm body 251 and the supporting mechanism 252 of the silicon rod feeding device of this application. Gears meshing with each other are arranged in the internal space of the swing arm body 251. From the swing arm end to the end direction, there are a driving gear 2522 and a driven gear 2523 respectively. The driving gear 2522 of each swing arm assembly 25 is axially connected to the second rotating shaft 22 and rotates under the drive of the second rotating shaft 22; the driven gear 2523 meshes with the driving gear 2522, and at the same time, the tooth part 252121 of the supporting member 25212 meshes with the driven gear 2523.

[0170] As Figure 14 shown, the manipulator body 25211 is fixedly arranged at the end of the swing arm body 251 of the swing arm structure, and is a steel structure in a U shape, C shape, or crescent shape that is curved in the length direction (not shown in the figure), and the symmetry axis in the arc length direction is coaxially arranged with the symmetry axis of the swing arm structure.

[0171] The supporting member 25212 is movably arranged on the manipulator body 25211 and is used for supporting the silicon rod 16 to be cut, and includes a tooth portion 252121 meshing with the passive gear 2523 and a supporting portion 252122 whose contour can conform to accommodate the silicon rod 16 to be cut. The tooth portion 252121 is an arc-shaped rack structure and is movably arranged on the manipulator body 25211. The arc of the rack is arranged in the U-shaped, C-shaped or crescent-shaped cavity of the manipulator body 25211 in a way that conforms to the arc of the manipulator body 25211. The supporting portion 252122 is fixedly arranged on the tooth portion 252121 and moves along with the tooth portion 252121.

[0172] In an embodiment of the present application, the U-shaped, C-shaped or crescent-shaped steel structure of the manipulator body 25211 is a U-shaped, C-shaped or crescent-shaped structure with a notch. As shown in the figure, the notch is arranged at the axis of symmetry of the arc circumference, so that the passive gear 2523 of the supporting mechanism 252 meshes with the tooth portion 252121 of the supporting member 25212 at the middle notch.

[0173] In an embodiment of the present application, a row of cylindrical balls arranged in parallel is provided on the contour of the supporting portion 252122 of the manipulator assembly 2521. The cylindrical balls are in direct contact with the surface of the silicon rod 16 to be cut during the transfer of the silicon rod. The circular arc radius formed by the common tangent of the cylindrical balls is slightly larger than the common radius range of the silicon rod, so as to ensure that the supporting mechanism 252 can place the silicon rod it supports in its inner circular groove when carrying the silicon rod, and make the arc surfaces of the two similar to limit the displacement such as rolling of the silicon rod during loading.

[0174] In an embodiment of the present application, the second driving device may be arranged as a driving motor, and the motor shaft is axially connected to the second rotating shaft 22 to drive the rotation of the second rotating shaft 22, so as to realize the rotation of the driving gear 2522 axially connected to the second rotating shaft 22. The driving gear 2522 in the built-in space of the swing arm main body rotates at the rotation speed and direction of the second driving rotating shaft under the drive of the second rotating shaft 22. Driven by the driving gear 2522, the driven gear 2523 meshing with it generates a rotation in the direction opposite to the rotation direction of the driving gear 2522, and the angular velocity magnitude of the rotation of the driven gear 2523 is determined by the tooth number relationship between the driving gear 2522 and the driven gear 2523 and the rotation speed magnitude of the driving gear 2522; further, the tooth part 252121 meshing with the driven gear 2523 generates a rotation in the direction opposite to the rotation direction of the driven gear 2523, and the angular velocity magnitude of the rotation of the tooth part 252121 is jointly determined by the size relationship between the radius of the arc where the tooth part 252121 is located and the radius of the driven wheel and the rotation speed magnitude of the driven wheel. That is, the rotation angular velocity of the tooth part 252121 is determined by the motor rotation speed (a variable value) of the second driving device and the tooth number or radius relationship of the driving gear 2522, the driven gear 2523 and the rack (a fixed value), that is, the rotation angular velocity of the supporting member 2521 relative to the manipulator body 25211 is determined by the rotation speed output by the second driving device, and the rotation direction is the same as the rotation direction output by the second driving device.

[0175] A further improvement of the present application is that there may be a cooperative relationship between the torques of the second driving device and the driving motor corresponding to the first driving mechanism. As Figures 14 to 16 shown in the different states of the swing arm assembly rotating around the first rotating shaft 21 driven by the first driving device during the transfer of the silicon rod. During the process of transferring the silicon rod by the silicon rod loading device, when the supporting part 252122 of the supporting mechanism 252 is in the loading state, the swing arm assembly 25 is driven by the rotation around the first rotating shaft 21, and the rotation of the rotating shaft drives the angular displacement of the swing arm body 251 in the normal plane of the first rotating shaft 21. The rotation angular velocity of the swing arm body 251 is determined by the first driving device. The swing arm body 251 and the manipulator assembly 2521 at its end follow the swing arm body 251 to perform a rotational motion with the first rotating shaft 21 as the rotation center and the angular velocity of the rotation of the first rotating shaft 21 as the rotation speed.

[0176] Specifically, in the carrying state, the second driving device drives the second rotating shaft 22 to rotate in a direction opposite to the rotation direction of the first rotating shaft 21, so as to realize the rotation of the supporting member 25212 around the center of the circular arc of the rack. The rotation of the supporting member 25212 with the first rotating shaft 21 as the center is defined as the first rotational movement, and the rotation around the center of the circular arc of the rack is defined as the second rotational movement. The second rotational movement is the synthesis of the first rotational movement controlled by the first rotating shaft 21 and the rotational movement relative to the manipulator body 25211 controlled by the second rotating shaft 22 that the supporting member 25212 follows the swing arm body 251.

[0177] The cooperative relationship between the first driving device and the second driving device is the relationship between the rotational speed magnitude and direction. The first driving device and the second driving device respectively control the two rotational movements of the supporting part 252122, so that the angular velocity of the second rotation of the supporting member 25212 is 0. The silicon rod 16 to be cut in the transfer state is displaced between the storage area and the cutting area along with the movement of the supporting member 25212, and the relative position with the supporting part 252122 remains unchanged.

[0178] In another embodiment of the present application, the first driving device and the second driving device can work independently of each other, respectively controlling the first rotational movement and the rotational movement of the rack relative to the manipulator body, so as to jointly control the change of the spatial position of the supporting part and the angle turned by the second rotational movement. Before transferring the silicon rod to be cut located in the storage area, the manipulator assembly swings to the same horizontal height as the supporting part under the drive of the first rotating shaft, and only the first rotational movement exists during the swing of the supporting part; the turntable guide rail assembly drives the turntable and the swing arm assembly and the manipulator assembly arranged thereon to feed in the direction perpendicular to the silicon rod to be cut on the horizontal plane until the supporting part contacts the silicon rod to be cut; after the supporting part contacts the silicon rod to be cut, the second rotating shaft drives the supporting member to rotate relative to the manipulator body, so that the supporting part is located directly below the silicon rod to be cut, and the contact position between the supporting part and the silicon rod to be cut is located in the symmetry axis and adjacent areas of the arc of the supporting part, and then the silicon rod transfer process is carried out with the first driving device and the second driving device operating in a cooperative relationship. Further, during the silicon rod transfer process, the traveling motors of the transfer table guide rail and the traveling motor of the carrying table guide rail respectively drive the linear movements of the swing arm assembly and the manipulator arranged on the swing arm assembly in the second dimension direction and the first dimension direction. The linear movement of the carrying table along the machine base guide groove in the first dimension direction, the linear movement of the transfer table relative to the carrying table in the second dimension direction and the rotational movement driven by the first driving device or the second driving device are independent of each other.

[0179] A further improvement of the present application lies in that the number of teeth of the tooth part 252121 of the supporting part 252122 is greater than the number of teeth of the passive gear 2523, and the number of teeth of the passive gear 2523 is greater than the number of teeth of the active gear 2522. In the second rotational motion jointly determined by the second driving device and the tooth number or radius relationship of the active gear 2522, the passive gear 2523, and the tooth part 252121, following the basic principle of external gear meshing, the magnitude relationship of the angular velocity of the active gear 2522, the angular velocity of the passive gear 2523, and the angular velocity of the tooth part 252121 decreases in sequence, realizing precise control of the supporting member 25212 in the second rotational motion.

[0180] In an embodiment of the present application, the contact surface between the supporting part 252122 and the silicon rod to be cut has a buffer material. In some implementation manners of this embodiment, the contact surface between the supporting part 252122 and the silicon rod to be cut is made of an elastic rubber material, or silica gel or other materials with elastic deformation, damping characteristics, or buffering characteristics, so as to protect the surface of the silicon rod to be cut in contact with it from being scratched or knocked.

[0181] Please refer to Figure 17 , which shows a cross-sectional view of the swing arm body 251 and the supporting mechanism 252 in another embodiment. The supporting mechanism 252 includes an active gear 2522 disposed in the built-in space of the swing arm body 251 and a manipulator assembly 2521 disposed at the end of the swing arm body 251. The active gear 2522 is axially connected to the second rotating shaft and rotates following the second rotating shaft under the drive of the second rotating shaft. The manipulator assembly 2521 includes a manipulator body 25211 and a supporting member 25212. The manipulator body 25211 is fixedly disposed at the end of the swing arm body 251 and includes a groove structure that is arcuately bent in the length direction.

[0182] The supporting member 25212 is movably disposed on the manipulator body 25211 and is used to carry the silicon rod to be cut, and includes a tooth part 252121 meshing with the passive active gear 2522 and a supporting part 252122 whose contour can conform to accommodate the silicon rod to be cut. The tooth part 252121 is an arc-shaped rack structure and is movably disposed on the manipulator body 25211. The arc of the rack is inlaid on the manipulator body 25211 in accordance with the arc of the structural groove of the manipulator body 25211. The tooth part 252121 meshes with the active gear 2522 in the built-in space of the swing arm body 251, and the supporting member 25212 is driven to rotate relative to the manipulator body 25211 by the active gear 2522 in the built-in space under the rotation of the second rotating shaft. The supporting part 252122 is fixedly disposed on the tooth part 252121 and moves following the tooth part 252121.

[0183] The supporting member 25212 rotates around the first rotating shaft following the manipulator body 25211 under the drive of the first driving device, and at the same time rotates relative to the manipulator body 25211 under the drive of the second driving device. In an implementation manner of this embodiment, the second driving device includes a driving motor, which is axially connected to the second rotating shaft at one end of the second rotating shaft. The second driving device drives the second rotating shaft to rotate, thereby driving the driving gear 2522 in the built-in space of the swing arm structure to rotate at the same angular velocity as the second rotating shaft. The tooth portion 252121 rotates relative to the manipulator body 25211 at a certain angular velocity under the drive of the driving gear 2522 engaged therewith. The rotation speed of the supporting member 25212 around the first rotating shaft 21 is determined by the first driving device, and the rotation of the supporting member 25212 relative to the manipulator body 25211 is determined by the second driving device and the radius ratio between the tooth portion 252121 and the driving gear 2522 in the built-in space. The first driving device and the second driving device independently control the two rotational motions of the supporting member 25212 respectively.

[0184] In an embodiment of the present application, the first driving device and the second driving device drive the first rotating shaft and the second rotating shaft to rotate under a certain cooperative relationship. The rotational speed of the supporting portion 252122 relative to the center of its circumscribed circle is the vector sum of the rotation of the supporting portion 252122 around the first rotating shaft and the rotation relative to the manipulator body 25211. As Figures 17 to 19 shown in the schematic diagram of the swing arm assembly rotating to different angles around the first rotating shaft in the carrying state, the first driving device 23 and the second driving device 24 operating under the cooperative relationship compensate for the change in the angle of the supporting member 25212 relative to the center of its circumscribed circle, so as to achieve that the angular velocity of the rotational motion of the supporting portion 252122 with the center of the circumscribed circle of the supporting portion 252122 as the rotation center is always 0. The first driving device and the second driving device are driven in the cooperative relationship during the transfer operation, so as to ensure that the supporting member 25212 does not rotate relative to the silicon rod to be cut carried during the transfer process in the carrying state.

[0185] In another embodiment of the present application, the number of teeth of the tooth portion 252121 is greater than the number of teeth of the driving gear 2522 in the built-in space of the swing arm body 251. The angular velocity transmission controlled by the second driving device from the second rotating shaft to the tooth portion 252121 is a speed reduction transmission, so as to achieve precise control of the supporting member 25212 during the rotation of the supporting member 25212 relative to the manipulator body 25211.

[0186] In another embodiment of the present application, the supporting mechanism of the swing arm assembly includes a manipulator assembly, and the manipulator assembly is disposed at the end of the swing arm body. The manipulator assembly includes a manipulator body and a supporting member. The manipulator body is fixedly arranged on the swing arm body and moves with the swing arm body; the supporting member is movably arranged on the manipulator body and is used for carrying the silicon rod to be cut. The supporting member is in power connection with the second rotating shaft, and when the second rotating shaft rotates, the supporting member is driven to rotate on the manipulator body.

[0187] In an implementation manner of this embodiment, the rotation of the supporting member relative to the manipulator is controlled by a second driving device to control the rotation speed of the second rotating shaft, and the supporting member is driven to rotate at a certain speed by the second rotating shaft; the manipulator body follows the swing arm body and is driven by a first driving device to rotate around the first rotating shaft. The first driving device and the second driving device can drive the rotation of the swing arm body around the first rotating shaft and the rotation of the supporting member relative to the manipulator body independently of each other.

[0188] In another embodiment of the present application, the first driving device and the second driving device drive the first rotating shaft and the second rotating shaft to rotate under a certain cooperative relationship. The supporting member follows the manipulator body and rotates around the first rotating shaft under the drive of the first driving device, and at the same time rotates relative to the manipulator body under the drive of the second driving device. The first driving device and the second driving device output rotation speeds in a cooperative relationship, so that the operation of the first driving device and the second driving device compensates for each other for the change in the angle of the supporting member relative to the center of its circumcircle, so as to realize that the angular velocity of the rotation of the supporting part relative to the center of rotation of the circumcircle of the supporting part is always 0. The first driving device and the second driving device are driven in the cooperative relationship during the transfer operation, so that the supporting member does not rotate relative to the silicon rod to be cut carried thereon during the transfer process in the carrying state.

[0189] During the process of transferring the silicon rod by the silicon rod loading device of the present application, before transferring the silicon rod to be cut located in the storage area, the manipulator assembly swings following the swing arm body driven by the first rotating shaft until the supporting part and the silicon rod are at the same horizontal height. During the swinging process, the rotational movement of the swing arm assembly is independently driven by the first driving device; the turntable guide rail assembly drives the turntable and the swing arm assembly and the manipulator assembly arranged thereon to feed in the direction perpendicular to the silicon rod to be cut on the horizontal plane until the supporting part contacts the silicon rod to be cut; after the supporting part contacts the silicon rod to be cut, the second rotating shaft drives the supporting member to rotate relative to the manipulator body, so that the supporting part is located directly below the silicon rod to be cut, and the contact position between the supporting part and the silicon rod to be cut is located at the symmetry axis and the adjacent area of the arc of the supporting part, and then a silicon rod transfer process is carried out in which the first driving device and the second driving device operate in a cooperative relationship.

[0190] Further, during the silicon rod transfer process, the traveling motors of the guide rails of the transfer table and the traveling motors of the guide rails of the carrying table respectively drive the linear motions of the swing arm assembly and the manipulator arranged on the swing arm assembly in the second dimension direction and the first dimension direction. The linear motion of the carrying table along the machine base guide groove in the first dimension direction, the linear motion of the transfer table relative to the carrying table in the second dimension direction, and the rotational motion driven by the first driving device or the second driving device are independent of each other.

[0191] A further improvement of the silicon rod loading device of the present application is that the swing arm assembly is provided with a detection device for detecting the contact between the supporting part and the silicon rod to be cut. During the loading work, when the contact between the supporting part and the silicon rod to be cut is detected, and after the manipulator supports the silicon rod to be cut, the driving motors of the first rotating shaft and the second rotating shaft are started to work, that is, the swing arm is lifted to execute the feeding.

[0192] In some embodiments of the present application, the detection device includes a pressure sensor disposed on the supporting portion. The pressure sensor includes a pressure-sensitive element and a signal processing unit. Before transferring the silicon rod to be cut located in the storage area, the manipulator assembly swings following the swing arm body driven by the first rotating shaft until the supporting portion and the silicon rod are at the same horizontal height. During the swinging process, the rotational movement of the swing arm assembly is independently driven by the first driving device; the turntable guide rail assembly drives the turntable and the swing arm assembly and the manipulator assembly disposed thereon to feed in the direction perpendicular to the silicon rod to be cut on the horizontal plane until the supporting portion contacts the silicon rod to be cut; the pressure-sensitive element of the pressure sensor contacts the silicon rod to be cut and outputs a contact signal, and the transfer table performs an operation of retreating a short distance relative to the silicon rod to be cut in the second dimension direction; when the supporting portion and the silicon rod to be cut are in a separated state, the supporting member is driven by the second rotating shaft to rotate relative to the manipulator body, so that the supporting portion is located directly below the silicon rod to be cut, and then the swing arm assembly rotates to lift the silicon rod, and the supporting portion transfers the silicon rod to be cut from the storage area to the cutting area under the combined drive of the first driving device, the second driving device, the turntable guide rail assembly, and the carrier table guide rail assembly. The silicon rod loading device transports the silicon rod to be cut to the cutting area, the swing arm body rotates to place the silicon rod to be cut on the carrier table surface in the cutting working area, the driving motor of the second rotating shaft is driven to rotate reversely to drive the supporting portion to rotate to release the bottom of the silicon rod to be cut, and the transfer table is driven away from the silicon rod to be cut in the second dimension direction.

[0193] By using the detection device, through a pressure-sensitive element or a contact sensor highly sensitive to pressure, during the process of approaching the silicon rod to be cut at the supporting portion before transferring the silicon rod to be cut until contact and then stopping, and subsequently rotating to be under the silicon rod to be cut for supporting, it is possible to prevent the silicon rod to be cut from being stably damaged or the surface structure from being damaged during the support, ensuring the transportation safety throughout the whole process of silicon rod transfer.

[0194] In summary, the equipment in the silicon rod stage disclosed in this application provides a silicon rod loading device in the second aspect. By setting a swing arm assembly structure driven by a first driving device, it realizes carrying and transferring the silicon rod to be cut, and a corresponding motion following device or a manipulator assembly driven by a second driving device is set for the carrying mechanism of the swing arm assembly. When the supporting part of the silicon rod loading device is in the carrying state, the first driving device and the second driving device are simultaneously driven according to the relationship between the preset driving devices based on the mechanical structure, so as to achieve a stable transportation effect that the silicon rod to be cut does not move relative to the supporting part during transportation. Moreover, the swing arm assembly in this application can be arranged on a transfer table that can move in the second dimension direction, and at the same time, the transfer table can be movably arranged on a carrying table that can move in the first dimension direction. Each movement is relatively independent, enabling the silicon rod loading device to have a large transportation range and flexibility during transportation. The silicon rod loading device of this application realizes automatic loading, increases the transportation efficiency of the silicon rod, ensures the safety of transportation, improves the mobility during transportation, effectively overcomes various shortcomings of the prior art, and has high industrial value.

[0195] In the third aspect, the silicon rod cutting equipment of this application claims a silicon rod unloading device. The silicon rod unloading device is arranged at the discharge end of the cutting working area and is used for clamping and transporting a single-section silicon rod segment that meets the workpiece specifications after being cut off, so as to facilitate unloading. In the prior art, the common ways to handle the silicon rod segments after being processed by the silicon rod cutting equipment are usually manual handling or pushing and pulling the cutting table, which affects the production efficiency of the enterprise. The mass of the common silicon rod to be cut is about 400 kg or more. The manual and pushing / pulling handling methods require a large amount of manpower, and the safety and economy are low.

[0196] As Figure 20 shown, it shows a schematic structural diagram of the silicon rod unloading device of the silicon rod cutting equipment of this application in an embodiment. The silicon rod unloading device includes: a pick-up arm 31 and a clamping member 32.

[0197] The pick-up arm 31 is movably arranged in a suspended state on the top frame 19 of the silicon rod cutting equipment and can translate along the top frame 19. The pick-up arm 31 includes a telescopic mechanism. The axis of the translational movement of the pick-up arm 31 is set directly above the axis of the silicon rod to be cut in the cutting area.

[0198] The clamping member 32 is arranged at the bottom end of the pick-up arm 31 and is used for clamping a single-section silicon rod segment that meets the workpiece specifications after being cut off in the cutting area. The pick-up arm 31 and the clamping member 32 are symmetric or mirror-symmetric in overall structure.

[0199] In an implementation manner of this embodiment, the material taking arm 31 is movably connected to the top frame 19 through a guide rail assembly. The guide rail assembly includes: a guide groove 312 provided on the top frame 19, a guide rail 311 fixedly provided on the upper part of the material taking arm 31, and a material taking arm driving mechanism 313 provided on the upper part of the material taking arm 31. The guide rail 311 and the matching guide groove 312 are arranged in the first dimension direction, so that the material taking arm 31 generates a displacement relative to the axis of the silicon rod along the guide groove 312. In practice, the position of the material taking arm 31 is adjusted according to the position of the cut section of the silicon rod after processing to realize the subsequent clamping of the cut section of the silicon rod.

[0200] In an embodiment of the present application, the material taking arm driving mechanism 311 includes: a traveling lead screw (not shown in the figure) arranged along the guide rail 311 on the upper part of the material taking arm 31 and connected to the material taking arm 31, and a traveling motor 313 connected to the traveling lead screw. By using the traveling motor 313, the material taking arm 31 is driven to travel along the guide rail 311. The traveling motor 313 on the material taking arm 31 is connected to the traveling lead screw laid on the guide rail 311, so as to realize the axial movement of the material taking arm 31 on the guide rail 311 in the first dimension direction, that is, along the axis of the silicon rod or the cut section of the silicon rod placed in the cutting area.

[0201] In another embodiment of the present application, the material taking arm driving mechanism can adopt the form of cooperation between a traveling motor and a ball screw pair. The ball screw pair includes a ball screw and a screw nut adapted to the ball screw. The screw nut is connected to the material taking arm, and the traveling motor drives the ball screw to rotate, so as to drive the material taking arm to do a linear motion along the guide groove provided on the top frame through the screw nut.

[0202] In another embodiment of the present application, the guide rail assembly further includes a limit block (not shown in the figure) for restricting the excessive displacement of the material taking arm on the top frame. In the implementation manner of this embodiment, the limit block can be set as a control stroke type, a fixed type or an adjustable type according to the movement requirements of the material taking arm.

[0203] Please refer to FIG. 21, which shows a schematic diagram of the silicon rod blanking device of the present application in an embodiment, where Figure 21a is the front view of the silicon rod blanking device, Figure 21bThis is the rear view of the silicon rod blanking device. In an embodiment of the present application, the telescopic mechanism 314 can be set as a lifting guide rail assembly, and the lifting guide rail assembly includes: a lifting guide rail 3141, a guide groove 3142 that cooperates with the lifting guide rail 3141, and a lifting guide rail driving mechanism 3143, where: the lifting guide rail 3141 is fixedly arranged on the upper part of the clamping member 32 and is arranged along the lifting direction; the guide groove 3142 that cooperates with the lifting guide rail 3141 is structurally arranged on the material taking arm 31 and is arranged along the symmetry axis of the material taking arm 31 in the lifting direction; the lifting guide rail 3141 driving mechanism can be set as a cylinder telescopic assembly, and the cylinder telescopic assembly is arranged between the material taking arm 31 and the clamping member 32, with both ends respectively connected to the material taking arm 31 and the clamping member 32. Through the expansion and contraction of the lifting shaft 31433 of the cylinder telescopic assembly, the movement of the clamping member 32 in the lifting direction is driven.

[0204] In an embodiment of the present application, the cylinder telescopic assembly includes: a cylinder support 31431, a cylinder 31432, and a lifting shaft 31433 connected to the cylinder 31432, where: the cylinder support 31431 is arranged on the material taking arm 31 and is fixedly connected to the material taking arm 31, presenting a quadrilateral shape; the cylinder 31432 is arranged on the cylinder support 31431, and the cylinder support 31431 serves as the lower bottom plate for the fixed arrangement of the cylinder 31432; the cylinder 31432 includes a cylinder taper rod (not shown in the figure), and the cylinder taper rod penetrates through the cylinder support 31431 and extends into the telescopic space below the cylinder support 31431; the lifting shaft 31433 is arranged at the lower end of the cylinder taper rod and includes a composite valve that can achieve two-way control of expansion and contraction, and the composite valve is also rod-shaped; in an implementation manner of this embodiment, the lower end of the cylinder taper rod is connected to the lifting shaft 31433 through a coupling; the lower end of the lifting shaft 31433, that is, the free end, is fixedly connected to the lifting guide rail 3141 of the clamping member 32. In the embodiment shown in the figure, a T-shaped frame is fixedly arranged at the end of the lifting guide rail 3141 of the clamping member 32, and the end of the lifting shaft 31433 is fixedly connected to the T-shaped frame.

[0205] In an embodiment of the present application, the cylinder 31432 drives the cylinder taper rod to drive the expansion and contraction movement of the lifting shaft 31433. The lifting guide rail 3141 of the clamping member 32 is lifted and transported along the lifting guide groove 3142 of the material taking arm 31 under the pushing and pulling action of the lifting shaft 31433, so as to realize the displacement of the entire clamping member 32 in the lifting direction.

[0206] Please refer to Figure 22, which is a schematic diagram of the structure of the clamping member in an embodiment of the silicon rod unloading device of the present application, wherein the clamping member includes a first clamping block 321, a second clamping block 322 and a driving gear, wherein: the first clamping block 321 includes a first rack and a first clamping portion 3212 linked to the first rack; the second clamping block 322 is mirror-imaged relative to the first clamping block 321, and includes a second rack and a second clamping portion 3222 linked to the second rack; one end of the first rack is fixedly disposed on the first clamping portion 3212, and one end of the second rack is fixedly disposed on the second clamping portion 3222; the driving gear is disposed in the On the horizontal building plate 35 in the middle of the clamping member, the driving gear is connected to the power output shaft of a motor and is meshed with the first rack and the second rack at the same time. Driven by the motor, when the driving gear rotates forward, it drives the first clamping portion 3212 and the second clamping portion 3222 to move toward each other, that is, the distance between the first clamping portion 3212 and the second clamping portion 3222 is reduced, and the clamping action can be performed; when the driving gear rotates reversely driven by the motor, it drives the first clamping portion 3212 and the second clamping portion 3222 to move away from each other, that is, the distance between the first clamping portion 3212 and the second clamping portion 3222 is increased, and the releasing action can be performed.

[0207] In one embodiment of the present application, the clamping surfaces at the bottom ends of the first clamping portion 3212 and the second clamping portion 3222 for contacting the silicon rod segment are designed to be arc-shaped, and the radius of the arc of the clamping surface is designed to be the outer diameter of a common silicon rod, so as to be close to the arc surface of the silicon rod segment; the length of the clamping portion is designed to be the common length of the silicon rod segment after cutting according to processing specifications.

[0208] Two mutually parallel guide rails 351 arranged along the second dimension direction are provided on the lower surface of the horizontal construction plate 35. The first clamping part 3212 and the second clamping part 3222 are movably arranged on the horizontal construction plate 35 through the guide rails 351 on the lower surface of the horizontal construction plate 35. First horizontal slider assemblies 3213 and second horizontal slider assemblies 3223 are respectively fixedly arranged at the tops of the first clamping part 3212 and the second clamping part 3222. The first horizontal slider assemblies 3213 and the second horizontal slider assemblies 3223 are movably arranged on the guide rails of the horizontal construction plate 35 and can slide along the guide rails 351 of the horizontal construction plate. Driven by the first rack and the second rack, the first horizontal slider assemblies 3213 and the second horizontal slider assemblies 3223 respectively move along the guide rails of the horizontal construction plate. The first horizontal slider assembly 3213 is two sliders fixedly arranged above the first clamping part 3212, and the connection line of the fixed positions of the two sliders on the first clamping part 3212 is in the first dimension direction; the second horizontal slider assembly 3223 is two sliders fixedly arranged above the second clamping part 3222, and the connection line of the fixed positions of the two sliders on the second clamping part 3222 is in the first dimension direction.

[0209] Please refer to Figures 23 to 24 , which shows a schematic structural diagram of the clamping member driving device in different states. The view direction is the projection of the structure observed from the bottom to the top of the clamping member. The driving gear 323 is arranged on the horizontal construction plate 35 of the clamping member and is axially connected to the power output shaft of a driving motor. The driving motor 324 is fixedly arranged on the lower surface of the horizontal construction plate 35. The first rack 3211 and the second rack 3221 are respectively engaged with the front side and the rear side of the driving gear 323. In the illustrated embodiment, it is shown that the first rack 3211 and the second rack 3221 are respectively engaged with the upper side and the lower side of the driving gear 323 of the driving gear 323. Driven by the driving gear 323, the first rack 3211 and the second rack 3221 respectively generate corresponding movements. Based on the basic law of external meshing between gears or between a gear and a rack, when the driving gear 323 rotates, the first rack 3211 moves in the opposite direction to the linear velocity of the upper side tooth part of the driving gear 323; when the driving gear 323 rotates, the second rack 3221 moves in the opposite direction to the linear velocity of the lower side tooth part of the driving gear 323. The teeth (such as the upper side and the lower side tooth parts in the illustrated embodiment) that are centrosymmetric about the gear center when the driving gear 323 rotates must satisfy the relationship that the linear velocity directions are opposite, that is, the movement directions of the first rack 3211 and the second rack 3221 respectively engaged with both sides of the driving gear 323 are always opposite, showing a movement of approaching each other or moving away from each other. As Figure 23In the illustrated embodiment, the drive gear 323 is in a forward rotation state, and the first rack 3211 and the second rack 3221 approach each other; as Figure 24 In the illustrated embodiment, the drive gear 323 is in a reverse rotation state, and the first rack 3211 and the second rack 3221 move away from each other.

[0210] When the drive gear 323 rotates forward or reversely, the first rack 3211 and the second rack 3221 perform corresponding approaching or separating movements. The movements of the first rack 3211 and the second rack 3221 respectively drive the first horizontal slider assemblies 3213 and the second horizontal slider assemblies 3223 of the first clamping portion and the second clamping portion to slide approaching or separating along the mutually parallel guide rails provided on the bottom surface of the horizontal construction plate 35, that is, the first clamping portion and the second clamping portion perform approaching or separating movements relative to each other.

[0211] In an embodiment of the present application, the process of clamping the sawn segment of the silicon rod by the silicon rod blanking device is as follows:

[0212] The pick-up arm of the silicon rod blanking device moves along the guide groove on the top frame driven by the traveling motor on the upper guide rail of the pick-up arm, and moves in the first dimension direction towards the silicon rod cut-off. The clamping portion of the silicon rod blanking device moves in the first dimension direction driven by the pick-up arm. When the first and clamping portions move to directly above the sawn segment of the silicon rod to be clamped, the movement of the pick-up arm along the guide groove on the top frame stops.

[0213] After the positions of the pick-up arm and the clamping member in the horizontal direction are fixed, the drive gear of the clamping member rotates reversely driven by the motor. In addition, the first clamping portion and the second clamping portion are separated to a distance greater than the diameter of the sawn segment of the silicon rod to prevent the clamping portion from touching the sawn segment of the silicon rod during the downward movement. The telescopic mechanism, such as the cylinder telescopic assembly, drives the lifting shaft to move in the lifting direction, so that the first and second clamping portions move downward close to the sawn segment of the silicon rod to be clamped until the first clamping portion and the second clamping portion are on the same horizontal plane as the sawn segment of the silicon rod, that is, the telescopic movement stops. The reverse movement of the drive motor and the movement of the telescopic mechanism are relatively independent. In terms of implementation, it only needs to satisfy that the first and second clamping portions run to the horizontal plane of the sawn segment of the silicon rod (that is, the first clamping portion and the second clamping portion are respectively located on the left and right sides of the sawn segment of the silicon rod), and it is ensured that the clamping member does not collide with the sawn segment of the silicon rod during the movement.

[0214] The drive gear rotates forward to control the first clamping portion and the second clamping portion to approach each other, that is, to approach the sawn segment of the silicon rod, and stops moving when contacting and clamping the sawn segment of the silicon rod.

[0215] After clamping the silicon rod segment, the clamping member remains in a clamped state. According to the preset placement position of the silicon rod segment, the telescopic mechanism drives the clamping member to move up and down accordingly. The guide rail assembly between the top frame and the material taking arm drives the material taking arm and the clamping member as a whole to move in the first dimension direction. After the silicon rod is cut and placed at the preset position, the first clamping part and the second clamping part are separated and released, and together with the material taking arm and the clamping part, they move away from the placed silicon rod segment.

[0216] A further improvement of this application is that buffer materials are provided on the clamping surfaces of the first clamping part and the second clamping part of the silicon rod blanking device for clamping the single-segment silicon rod segment. Elastic rubber materials, polyethylene foam plastics, silica gels or other materials with elastic deformation, damping characteristics or buffering characteristics can be provided on the clamping surfaces to protect the surface of the silicon rod segment in contact with them from being scratched or knocked.

[0217] A further improvement of this application is that the silicon rod blanking device is also provided with a sensor 33 for detecting the position of the end (i.e., the head or the tail) of the silicon rod to be cut.

[0218] Please refer to Figure 25 , shown as Figure 21b An enlarged schematic view at d. The sensor 33 is fixedly arranged on the mirror symmetry line of the bearing seat connecting the horizontal construction plate of the clamping member 32 and the lifting guide rail. In an implementation manner of this embodiment, the sensor 33 is a contact sensor, including an annular measuring head 331, a signal line 332, and a telescopic rod 333.

[0219] The measuring head 331 is movably arranged at the free end of the telescopic rod 333 and can rotate around the center of the circle of the measuring head 331. The fixed end of the telescopic rod 333 is arranged on the mirror symmetry line of the bearing seat.

[0220] During detection, the surface of the ring of the annular measuring head 331 is the contact surface, which is used to measure the height data (which can be the absolute height or the relative height relative to the silicon rod bearing device) at the contact point between the corresponding measuring head 331 and the silicon rod to be cut 16. In particular, when the annular measuring head 331 rotates along the center of the circle, the linear velocity direction of the lowest point of the measuring head 331 is in the first dimension direction, that is, the axis direction of the silicon rod to be cut 16, so as to avoid damage to the surface of the annular measuring head 331 or the silicon rod to be cut 16 when the measuring head 331 moves along the surface of the silicon rod to be cut 16 to detect the end position of the silicon rod.

[0221] During the detection process, the telescopic rod 333 controls the measuring head 331 to descend until it just touches the surface of the silicon rod 16 to be cut. The contact sensor follows the material taking arm 31 and moves relative to the silicon rod 16 to be cut in the first dimension direction, so that the measuring head 331 moves along the surface of the silicon rod 16 to be cut. By collecting the height data at different positions in real time, due to the diameter change at the end of the silicon rod 16 to be cut, the boundary line between the end part (i.e., the head or the tail) to be cut off and the middle section of the silicon rod that can be processed is detected.

[0222] By detecting the end position of the silicon rod to be cut through the sensor device 33, it avoids the inaccuracy of manual judgment, which may cause waste due to too long cut-off end or the cut-off part being too short, resulting in the silicon rod segments at the head and tail ends after processing not meeting the workpiece specifications. It effectively improves the workpiece qualification rate of the silicon rod segments adjacent to the head and tail ends of the silicon rod and improves the material utilization rate.

[0223] A further improvement in the silicon rod truncation setting of the present application is that it further includes an end material taking device. The end material taking device is arranged at at least one end of the cutting working area and is used to receive the cutting tailings at the end of the silicon rod to be cut. During the silicon rod truncation operation, it is necessary to intercept silicon wafer samples from the silicon rod to be cut. The thickness of the samples is usually 2-20 mm, that is, they cannot be transported through the silicon rod feeding device.

[0224] The end material taking device includes a rotating arm and an arc-shaped groove; the rotating arm is arranged on the adjacent cutting frame at the discharge end of the silicon rod truncation equipment and is movably arranged at the bottom of the adjacent cutting frame at the discharge end through a rotating shaft with an axis in the lifting direction. The arc-shaped groove is fixedly arranged at the free end of the rotating arm, and the arc-shaped groove is a semi-open structure so that the silicon wafer sample can be placed into the arc-shaped groove from the side.

[0225] In an embodiment of the present application, the end material taking device further includes a driving device. The driving device has a power output shaft such as a motor and is used to axially connect the rotating shaft of the rotating arm to drive the rotating arm to rotate around the rotating shaft at the bottom of the cutting frame. Further, the end material taking device further includes a rotating arm locking device for locking the rotating arm when the rotating arm rotates to below the silicon wafer sample to be cut.

[0226] During the process of intercepting the silicon wafer sample, the rotating arm rotates under the drive of the driving device of the end material taking device and stops rotating when the arc-shaped groove is located below the silicon wafer sample to be cut. The rotating arm is locked by the rotating arm locking device. The cutting frame adjacent to the discharge end rotates to the first cutting state of double-wire cutting under the drive of the driving motor of the cutting frame, and the cutting wire saw is driven by the lifting mechanism to feed for cutting. After cutting, the silicon wafer sample located in the groove is intercepted, and the rotating arm rotates away from the cutting frame under the drive of the power output shaft, that is, it receives and obtains the silicon wafer sample.

[0227] In summary, the silicon rod blanking device provided by the silicon rod cutting device of the present application in the third aspect, through the material taking arm and the clamping member arranged on the frame, the material taking arm and the clamping member are movably connected through the cylinder telescopic assembly, and the driving device is used to drive the two clamping parts of the clamping member to move towards or away from each other in the second dimension direction to complete the clamping and release of the cut silicon rod segment; furthermore, the material taking arm of the silicon rod blanking device of the present application can be slidably arranged on the frame driven by the driving device, and in cooperation with the lifting movement of the clamping member and the clamping or releasing action of the clamping part, the transportation of the silicon rod segment between the preset positions can be realized, effectively realizing the automation of the silicon rod blanking process and connecting different processes, effectively improving the production efficiency of the enterprise, and having high industrial value.

[0228] The above embodiments are only illustrative of the principles and effects of the present application and are not used to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present application should still be covered by the claims of the present application.

Claims

1. A silicon rod feeding device for transferring a silicon rod to be cut placed in a storage area to a cutting working area of a cutting device. Characterized in that, Comprising: A first rotating shaft driven to rotate by a first driving device; And At least two swing arm assemblies respectively pivotally connected to the first rotating shaft at a preset interval, the at least two swing arm assemblies being used to carry the silicon rod to be cut and transfer the silicon rod to be cut to the cutting working area of the cutting device under the drive of the first rotating shaft; each swing arm assembly includes a swing arm body pivotally connected to the first rotating shaft and a supporting mechanism arranged on the swing arm body, the supporting mechanism being used to follow the movement of the swing arm so that its supporting part remains in a state of carrying the silicon rod to be cut during the transfer operation; wherein, a detection device is arranged on the swing arm assembly for detecting the contact between the supporting part and the silicon rod to be cut. A second rotating shaft driven by a second driving device; the second rotating shaft is arranged parallel to the first rotating shaft and penetrates through the at least two swing arm assemblies, and the second driving device outputs a corresponding rotational speed or / and rotation angle to the second rotating shaft following the working state of the first driving device. Wherein, the supporting mechanism includes: a driving gear arranged in the built-in space of the swing arm body and pivotally connected to the second rotating shaft for rotating under the drive of the second rotating shaft; a driven gear pivotally connected in the built-in space of the swing arm body and meshing with the driving gear; a manipulator assembly arranged at the end of the swing arm body, including a manipulator body and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut, the supporting member including a tooth part meshing with the driven gear and a supporting part for conforming to the outer contour of the silicon rod to be cut; or, the supporting mechanism includes: a driving gear arranged in the built-in space of the swing arm body and pivotally connected to the second rotating shaft for rotating under the drive of the second rotating shaft; the manipulator assembly arranged at the end of the swing arm body, including a manipulator body and a supporting member movably arranged on the manipulator body for carrying the silicon rod to be cut, the supporting member including a tooth part meshing with the driving gear and a supporting part for conforming to the outer contour of the silicon rod to be cut.

2. The silicon rod feeding device according to claim 1, Characterized in that, It further includes at least two transfer platforms corresponding to the swing arm assemblies one by one, arranged on the machine base of the cutting device for respectively pivotally connecting the at least two swing arm assemblies to the first rotating shaft at a preset interval.

3. The silicon rod feeding device according to claim 2, Characterized in that, The at least two transfer platforms include a first motion mechanism linearly displacing between the storage area and the cutting working area.

4. The silicon rod feeding device according to claim 2, Characterized in that, The at least two transfer platforms include a second motion mechanism for linearly displacing at least one swing arm assembly on the first rotating shaft to adjust the interval distance between the at least two swing arm assemblies.

5. The silicon rod feeding device according to claim 4, Characterized in that, There are 4 swing arm assemblies, including a first swing arm assembly and a second swing arm assembly respectively arranged at both ends of the first rotating shaft, and a third swing arm assembly and a fourth swing arm assembly respectively pivotally connected between both ends of the first rotating shaft at a preset interval.

6. The silicon rod loading device according to claim 5, wherein, the transfer platform of the third swing arm assembly or the fourth swing arm assembly includes a second motion mechanism that linearly displaces on the first rotating shaft.

7. The silicon rod loading device according to claim 1, wherein, the first driving device and the second driving device are respectively arranged at opposite ends of the first rotating shaft or the second rotating shaft.

8. The silicon rod loading device according to claim 1, wherein, the second rotating shaft is pivotally connected to the swing arm assembly and is located between the first rotating shaft on the swing arm body and the supporting mechanism.

9. The silicon rod loading device according to claim 1, wherein, the number of teeth of the tooth part of the supporting member is greater than the number of teeth of the driven gear, and the number of teeth of the driven gear is greater than the number of teeth of the driving gear.

10. The silicon rod loading device according to claim 1, wherein, the contact surface between the supporting portion and the silicon rod to be cut is provided with a buffer material.

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