Sensing module and electronic device including the same

By using a multi-lens array and a position control layer in the sensing module, the problem of increased electronic device height due to lens stacking was solved, resulting in a reduction in the thickness of the sensing module and an increase in the sensing area, thus improving sensing accuracy.

CN112395937BActive Publication Date: 2025-12-30SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
CN202010805123.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-08-12
Filing Date
2020-08-12
Publication Date
2025-12-30
Estimated Expiration
2040-08-12

AI Technical Summary

Technical Problem

In the prior art, the lens stacking structure of the sensing module increases the height of the electronic device, making it difficult to reduce the size of the electronic device. At the same time, the sensing area may be reduced, affecting the sensing accuracy.

Method used

By employing a multi-lens array and a position control layer, multiple lenses and support layers are placed on the substrate, combined with a sensor and processing circuit system, to control the position of the lenses and sensors in order to increase the sensing area and reduce the thickness.

Benefits of technology

This achievement reduces the thickness of the sensing module, increases the sensing area, and improves sensing accuracy and the ability to acquire biometric information.

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Abstract

A sensing module and an electronic device including the same are provided. The electronic device includes a first substrate, a plurality of light sources configured to emit light signals through the substrate to an object, at least one sensor under the first substrate configured to detect biometric information associated with the object by receiving a reflected light signal corresponding to the light signals reflected off the object and transmitted through the first substrate, and a multi-lens array including at least one support layer over the at least one sensor, a plurality of first lenses on an upper surface of the at least one support layer, and a plurality of second lenses on a lower surface of the at least one support layer.
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Description

Technical Field

[0001] Various exemplary embodiments of the present invention relate to a sensing module, an electronic device including the sensing module, a method of operating the sensing module, and / or a non-transitory computer-readable medium for operating the sensing module. Background Technology

[0002] Recently, electronic devices have provided various functions for sensing biometric information. Optical sensing methods are used as an example of methods for sensing biometric information. Optical sensing methods are used to acquire biometric information by sensing light reflected from a part of a user's body using a sensing module provided in the electronic device. To improve the sensing accuracy in optical sensing methods, it may be desirable and / or necessary to increase the number of lenses included in the sensing module. However, when the lenses included in the sensing module are arranged in a stacked structure, the height of the sensing module (e.g., the thickness of the sensing module) can increase, making it potentially difficult to reduce the size of the electronic device (e.g., the thickness of the electronic device). Therefore, the sensing area of ​​the sensing module may be reduced, or in other words, a smaller sensing module with a smaller number of lenses may be needed to maintain the desired thickness of the electronic device. Summary of the Invention

[0003] Various exemplary embodiments of the present invention provide a sensing module that can have a reduced height, a reduced thickness and / or an increased sensing area, an electronic device including the sensing module, a non-transitory computer-readable medium and / or a method for operating the sensing module.

[0004] According to at least one exemplary embodiment of the present invention, an electronic device includes: a substrate; a display panel including a plurality of light sources configured to emit light signals through the substrate to an object; at least one sensor beneath the substrate, the at least one sensor including a processing circuit system configured to detect biometric information associated with the object by receiving reflected light signals corresponding to light signals reflected from the object and transmitted through the substrate; and a multi-lens array including at least one support layer, a plurality of first lenses, and a plurality of second lenses, the at least one support layer being above the at least one sensor, the plurality of first lenses being on an upper surface of the at least one support layer, and the plurality of second lenses being on a lower surface of the at least one support layer.

[0005] According to at least one exemplary embodiment of the present invention, an electronic device includes: a display panel on a substrate and including a plurality of light sources configured to emit light signals to an object; at least one optical sensor on the substrate and configured to sense reflected light corresponding to the light signals, the reflected light being reflected from the object and passing through a detection area defined in the display panel; a lens support layer on the at least one optical sensor; a plurality of lenses on at least one of an upper surface and a lower surface of the lens support layer in a direction parallel to an upper surface of the substrate; and a position control layer on the substrate and including a processing circuit system, the position control layer being configured to control the position of the at least one optical sensor and / or the position of at least one of the plurality of lenses.

[0006] According to at least one exemplary embodiment of the present invention, a sensing module includes: at least one sensor on a substrate, the at least one sensor including a processing circuit system configured to receive light reflected from an object adjacent to a sensing area and obtain biometric information of the object; a multi-lens array including a plurality of lenses and a support layer, the plurality of lenses being on the at least one sensor in a direction parallel to the upper surface of the substrate, and the support layer being configured to support the plurality of lenses; and a position control layer on the substrate, the position control layer including a position processing circuit system configured to control the position of the at least one sensor and / or the position of at least one of the plurality of lenses based on position information of the object with respect to the sensing area. Attached Figure Description

[0007] The above and other aspects, features, and advantages of various exemplary embodiments of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, wherein:

[0008] Figure 1 This is a perspective view showing the exterior of an electronic device including a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0009] Figure 2 This is an exploded perspective view illustrating an electronic device including a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0010] Figure 3 This is a cross-sectional view illustrating a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0011] Figures 4A to 5B This is a diagram illustrating the structure of a multi-lens array of a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0012] Figure 6A and Figure 6BThis is a diagram illustrating the sensing area of ​​a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0013] Figure 7 and Figure 8 This is a diagram illustrating the operation of a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0014] Figure 9 This is a diagram illustrating a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0015] Figure 10A and Figure 10B This is a diagram illustrating the operation of a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0016] Figure 11 This is a block diagram illustrating the configuration of a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0017] Figure 12 This is a cross-sectional view illustrating a sensing module according to at least one exemplary embodiment of the concept of the present invention;

[0018] Figure 13A and Figure 13B This is a diagram illustrating the operation of a sensing module according to at least one exemplary embodiment of the concept of the present invention; and

[0019] Figures 14 to 16 This is a diagram illustrating an example of an electronic device including a sensing module according to at least one exemplary embodiment of the concept of the present invention. Detailed Implementation

[0020] In the following, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0021] Figure 1 It is a perspective view showing the exterior of an electronic device including a sensing module according to at least one example embodiment. Figure 2 This is an exploded perspective view showing an electronic device including a sensing module according to at least one example embodiment.

[0022] Reference Figure 1 and Figure 2 The electronic device 1 may include a display module DM and / or a housing H, the housing H surrounding the rear and side surfaces of the display module DM and forming the exterior of the electronic device 1, but the example embodiments are not limited thereto.

[0023] The display module DM may include, but is not limited to, a substrate 10, a display panel 20, etc.

[0024] The substrate 10 can provide a light-emitting surface for the electronic device 1, and can be disposed (e.g., included, located, arranged, etc.) on the display panel 20, and / or can protect the display panel 20, etc. The substrate 10 may include a glass substrate, a sapphire substrate, a plastic substrate, and the like. The substrate 10 may have a multilayer structure or a single-layer structure. For example, the substrate 10 may have a stacked structure of multiple plastic substrates bonded together by adhesives or the like, or it may have a stacked structure of glass substrates and plastic substrates bonded together by adhesives, etc.

[0025] The display panel 20 may include multiple pixels with light sources. The light sources can output light signals under the control of a display driver IC (DDI). The display panel 20 can display various images by emitting light signals output from the light sources of the pixels through the substrate 10.

[0026] A first region 11 for outputting an image and a second region 12 for obtaining the user's biometric information may be defined within a substrate 10 (and / or virtually defined within a substrate 10). For example, the first region 11 may be the entire or a portion of the substrate 10 (and / or may correspond to the entire or a portion of the substrate 10), and the second region 12 may be a sensing region that partially or completely overlaps with the first region 11.

[0027] When the first region 11 is activated, different images can be displayed and / or set on the first region 11 using light signals output from the light source in different operating modes. For example, in a standby mode where only some elements (e.g., pixels) of the electronic device 1 are activated, the electronic device 1 can display an image and / or multiple images representing the current time or the like on the first region 11. In an activation mode where all elements (e.g., pixels) of the electronic device 1 are activated, the electronic device 1 can display various types of images on the first region 11 corresponding to user input and / or instructions from the operating system, software applications, etc. of the electronic device 1.

[0028] When the second region 12 is activated, the electronic device 1 can obtain biometric information by sensing light reflected from the portion OBJ of the user's body adjacent to the second region 12. For example, the electronic device 1 can obtain the user's fingerprint information by sensing light reflected from the valleys and ridges (e.g., fingerprints) of the user's finger adjacent to (e.g., placed on the second region 12). For this purpose, the electronic device 1 may include at least one sensing module SM disposed below the display panel 20 to obtain, receive, and / or detect the user's biometric information and / or fingerprint information and send the obtained user's biometric information and / or fingerprint information to the processing circuitry system (not shown) of the electronic device 1, but the example implementation is not limited thereto.

[0029] The sensing module SM can be disposed on the second substrate 30. For example, the sensing module SM can be disposed in a space on the second substrate 30, which includes a space in which circuit components are disposed and / or a battery is housed. However, the example embodiment is not limited to this. Moreover, the sensing module SM can be configured to overlap with the second region 12 in a direction perpendicular to the substrate 10, or in other words, the sensing module SM can be placed on the substrate 10 below the second region 12.

[0030] The sensing module SM can receive optical signals and generate electrical signals corresponding to the received optical signals. The optical signals received by the sensing module SM may include light reflected from a portion OBJ adjacent to the second region 12 of the user's body, which originates from light initially generated (and / or emitted) by the light source of one or more pixels. The reflected light can be incident on the display panel 20 and received by the sensing module SM. The electrical signals generated by the sensing module SM can vary according to (and / or based on) the wavelength and / or amplitude of the received reflected light.

[0031] The sensing module SM in the example embodiment may include multiple lenses arranged parallel to the upper part of the sensor, thereby reducing the thickness of the electronic device 1 and increasing the size of the sensing area.

[0032] The housing H can be connected to the substrate 10 and can define the internal space of the electronic device 1. The display panel 20, the second substrate 30, etc. can be housed in the internal space formed by the housing H of the electronic device 1.

[0033] The housing H may comprise a material having relatively high rigidity sufficient to provide structure and / or protection for the components of the electronic device 1, such as plastic, metal, glass, and the like, or combinations thereof. The housing H may protect the components housed within the internal space of the electronic device 1 from external impacts such as falling objects and / or from external substances such as water, dust, dirt, etc.

[0034] Figure 3 This is a cross-sectional view showing a sensing module according to at least one example embodiment.

[0035] Reference Figure 3 The sensing module 100 may include, but is not limited to, a multi-lens array 110, an optical filter 120, a sensor 130, a substrate 140, and / or a support 150. For example, the sensing module 100 may further include a processing circuitry system (not shown) for detecting, receiving, identifying, acquiring, and / or analyzing biometric information received by the sensor 130, etc., but the example embodiments are not limited thereto. The following is in conjunction with... Figure 11 Further discussion of the processing circuit system.

[0036] Sensor 130 may include multiple optical sensing devices that can receive light signals (such as reflected light) incident on the internal space of sensing module 100. Sensor 130 may be disposed on substrate 140 including circuit components and may include charge-coupled device (CCD) image sensors, CMOS image sensors, and the like. According to some example embodiments, sensor 130 may include processing circuitry for detecting, receiving, identifying, acquiring, and / or analyzing biometric information received by sensor 130, but the example embodiments are not limited thereto. Optical filter 120 may include color filters, monochromatic filters, etc. Support 150 may be disposed on substrate 140 and may support multi-lens array 110 and / or optical filter 120, etc.

[0037] The multi-lens array 110 may include a plurality of lenses, such as lenses 111 and 112, and a support layer 113 supporting the plurality of lenses 111 and 112. The plurality of lenses 111 and 112 may include a plurality of first lenses 111 (e.g., a first layer of lenses) disposed parallel to the upper surface of the support layer 113 and a plurality of second lenses 112 (e.g., a second layer of lenses) disposed parallel to the lower surface of the support layer 113. However, the exemplary embodiments are not limited thereto, and there may be more or fewer lens layers. For example, the plurality of lenses may be disposed on at least one of the upper and lower surfaces of the support layer. In at least one exemplary embodiment, the distance from the lower surface of the display panel to the uppermost of the plurality of first lenses 111 may be approximately 45% or greater of the distance from the lower surface of the display panel to the lower surface of the substrate 140, but the exemplary embodiments are not limited thereto.

[0038] Figure 3 An example is shown in which the multi-lens array 110 includes three first lenses 111 and three second lenses 112, but the example implementation is not limited thereto. For example, the multi-lens array 110 may include five first lenses 111 and five second lenses 112, etc. As the number of the plurality of lenses 111 and 112 included in the multi-lens array 110 increases, the size and resolution of the sensing area of ​​the sensing module 100 can be increased. In addition, in some example embodiments, the number of lens layers may be greater than or less than Figure 3 The lens shown has two layers (e.g., lenses 111 and 112).

[0039] The plurality of lenses 111 and 112 may include lenses having various fields of view and / or refractive indices. For example, the fields of view of the plurality of lenses 111 and 112 may be the same, and the refractive indices of the plurality of lenses 111 and 112 may be the same. As another example, the field of view and refractive index of the first lens 111 may be greater than those of the second lens 112, respectively; or as another example, the field of view of the first lens 111 may be different from that of the second lens 112, and the refractive index of the first lens 111 may be different from that of the second lens 112.

[0040] Since the plurality of lenses 111 and 112 are included in the multi-lens array 110, the overall field of view can be greater than the field of view of a single lens among the plurality of lenses 111 and 112. In at least one example embodiment, the overall field of view of the multi-lens array 110 can be approximately 70 degrees or higher, but the example embodiments are not limited thereto.

[0041] The plurality of lenses 111 and 112 may include one or more lenses having various shapes. For example, the plurality of lenses 111 and 112 may have the same shape, or alternatively, such as... Figure 4A As shown, each first lens 111a may have a semicircle, and each second lens 112a may have a semicircle with a single groove. However, the exemplary embodiment is not limited to this; for example, one or more of the individual lenses 111 and 112 may also have a different shape than the other lenses in the same lens layer. In at least one exemplary embodiment, the multi-lens array 110 may have a structure in which the first lenses 111 and the second lenses 112 are stacked in two levels. For example, as... Figure 4B As shown, the multi-lens array 110b may include a first lens 111b (e.g., a first layer lens) and a second lens 112b (e.g., a second layer lens) disposed above and below the first support layer 113b, and a first lens 114b (e.g., a third layer lens) and a second lens 115b (e.g., a fourth layer lens) disposed above and below the second support layer 116b, respectively. However, the example embodiment is not limited to this, and there may be a larger number of support layers and / or more layers of lenses.

[0042] In the multi-lens array 110, the lens arrays disposed above each of the multiple sensors can be grouped and can be included in a single module. For example, reference Figure 5AMultiple multi-lens arrays 211a, 211b, 211c, 211d, 211e, 211f, 211g, 211h, and 211i, respectively corresponding to multiple sensors adjacent to each other, can be disposed on a single support layer 213 and can be included in a single module 200, but the exemplary embodiment is not limited thereto. The multiple multi-lens arrays 211a to 211i can be applied to different sensors respectively, and a desired and / or specific sensing area SA can be defined over each of the multiple multi-lens arrays 211a to 211i, such as... Figure 5B As shown, however, the example implementation is not limited thereto. In this case, the plurality of multi-lens arrays 211a to 211i can receive reflected light incident through different sensing regions SA, and thus can obtain the user's biometric information (e.g., electrical signals corresponding to the user's fingerprint). Each of the multi-lens arrays 211a, 211b, 211c, 211d, 211e, 211f, 211g, 211h, and 211i may include a plurality of lenses 211.

[0043] Figure 6A and Figure 6B This is a diagram showing the sensing area of ​​a sensing module according to some example embodiments. Figure 6A A comparison example is shown. Figure 6B At least one example implementation of the inventive concept is shown.

[0044] Reference Figure 6A The sensing module 300a in the comparative example may include a lens unit 310a, an optical filter 320a, a sensor 330a, a substrate 340a, and / or a support 350a, etc., but the example implementation is not limited thereto. The lens unit 310a may include a first lens 311a and a second lens 312a stacked in a direction perpendicular to the substrate 340a.

[0045] The entire field of view of lens unit 310a can have a viewing angle of θa, and the width of the sensing area defined on the display panel DP can be Wa. For example, when the first lens 311a and the second lens 312a are configured as wide-angle lenses with a field of view of 120 degrees or more, the overall field of view of lens unit 310a can be 90 degrees or more, and so on. However, the example embodiment is not limited to this, and other types of lenses and / or lenses with different viewing angles can be used.

[0046] The height of the sensing module 300a can be the distance from the lower surface of the display panel DP to the lower surface of the substrate 340a, and can be represented by "ha".

[0047] Reference Figure 6BIn at least one example embodiment, the sensing module 300b may include a multi-lens array 310b, an optical filter 320b, a sensor 330b, a substrate 340b, and / or a support 350b, but the example embodiments are not limited thereto. Figure 6A Unlike the lens unit 310a shown, the multi-lens array 310b may include a plurality of first lenses 311b (e.g., a first lens layer) and a plurality of second lenses 312b (e.g., a second lens layer) disposed parallel to the upper and lower portions of the support layer 313b, respectively. The first lenses 311b and second lenses 312b may include various combinations of lenses having various shapes and fields of view. For example, the plurality of first lenses 311b may include a first microlens 311b-1, a second microlens 311b-2, and a third microlens 311b-3, and the plurality of second lenses 312b may include a fourth microlens 312b-1, a fifth microlens 312b-2, and a sixth microlens 312b-3. For example, the first microlenses 311b-1 to the third microlenses 311b-3 may have the same radius of curvature and field of view as the fourth microlenses 312b-1 to the sixth microlenses 312b-3, but the example embodiment is not limited thereto. As another example, the first microlens 311b-1 to the third microlens 311b-3 may have a radius of curvature and field of view different from those of the fourth microlens 312b-1 to the sixth microlens 312b-3, and so on.

[0048] The overall field of view of the multi-lens array 310b can have a viewing angle θb, and the width of the sensing area defined on the display panel DP can be Wb. In the sensing module 300b, multiple lenses can be arranged in parallel, allowing the overall field of view to be greater than [a certain value]. Figure 6A In the comparative example, the field of view (θb>θa) is such that the width of the sensing area defined on the display panel DP can also be increased (Wb>Wa). In at least one example embodiment, the overall field of view of the multi-lens array 310b can be approximately 70 degrees or greater, but the example embodiments are not limited to this.

[0049] The height of the sensing module 300b (e.g., the thickness of the sensing module 300b) can be the distance from the lower surface of the display panel DP to the lower surface of the substrate 340b, and can be represented by "hb". In the sensing module 300b, since the plurality of lenses are arranged in parallel, ... Figure 6A Compared to the comparative example shown, the height of the module can be reduced (hb < ha). In at least one example embodiment, the height of the sensing module 300b can be approximately 4 mm or less, but is not limited thereto.

[0050] Reflected light incident from the first sub-sensing area a1 of the display panel DP can be divided by the first microlens 311b-1 according to different incident angles, combined by the fourth microlens 312b-1, and can form a focal point on the sensor 330b; however, the exemplary embodiment is not limited to this. Similarly, reflected light incident from the second sub-sensing area a2 of the display panel DP can be divided by the second microlens 311b-2 according to different incident angles, combined by the fifth microlens 312b-2, and can form a focal point on the sensor 330b; however, the exemplary embodiment is not limited to this. Reflected light incident from the third sub-sensing area a3 of the display panel DP can be divided by the third microlens 311b-3 according to different incident angles, combined by the sixth microlens 312b-3, and can form a focal point on the sensor 330b; however, the exemplary embodiment is not limited to this.

[0051] According to some exemplary embodiments, the first sub-sensing region a1 and the second sub-sensing region a2 may partially overlap (or completely overlap) each other in a direction parallel to the display panel DP, but the exemplary embodiments are not limited to this. The second sub-sensing region a2 and the third sub-sensing region a3 may partially overlap (or completely overlap) each other in a direction parallel to the display panel DP, but the exemplary embodiments are not limited to this. Whether the first sub-sensing regions a1 to the third sub-sensing regions a3 overlap each other, and the degree of overlap, may vary depending on the number of lenses included in the multi-lens array 310b and / or the shape, field of view, and / or similar of each lens. Biometric information repeatedly detected from the overlapping region OV1a between the first sub-sensing region a1 and the second sub-sensing region a2, and from the overlapping region OV2a between the second sub-sensing region a2 and the third sub-sensing region a3, can be obtained by using desired and / or specific algorithms (such as combining...). Figure 7 The image processing in the discussed image stitching algorithm is represented as a single image. However, the example implementation is not limited to this, and in the example implementation, there may be more or fewer sensing areas and / or overlapping areas.

[0052] Figure 7 and Figure 8 This is a diagram illustrating the operation of a sensing module according to some example implementations.

[0053] Figure 7 An example of a user's fingerprint image adjacent to multiple sensing areas is shown. (See reference...) Figure 6B and Figure 7The sensing module 300b can obtain an image of the user's first fingerprint region s1 (e.g., a first biometric region) through its first sub-sensing region a1. The sensing module 300b can obtain an image of the user's second fingerprint region s2 (e.g., a second biometric region) through its second sub-sensing region a2. The sensing module 300b can also obtain an image of the user's third fingerprint region s3 (e.g., a third biometric region) through its third sub-sensing region a3.

[0054] The first fingerprint region s1 and the second fingerprint region s2 may also partially overlap each other, and the overlapping region OV1s may be formed in response to the overlapping region OV1a between the first sub-sensing region a1 and the second sub-sensing region a2 of the sensing module 300b. The second fingerprint region s2 and the third fingerprint region s3 may also partially overlap each other, and the overlapping region OV2s may be formed in response to the overlapping region OV2a between the second sub-sensing region a2 and the third sub-sensing region a3.

[0055] The images of the user's first fingerprint region s1 to third fingerprint region s3 obtained from the first sub-sensing region a1 to the third sub-sensing region a3 can be as follows: Figure 8 The example implementation is as shown, however, the example implementation is not limited thereto, and according to other example implementations, there may be more or fewer fingerprint regions and / or sub-sensing regions. When the first fingerprint region s1 to the third fingerprint region s3 overlap with each other, the user fingerprint information obtained by the sensing module 300b may be broken at the boundaries between images (and / or at the boundaries between the sub-sensing regions of the sensor module 300b). Therefore, the sensing module 300b can generate a single image with smoothly connected boundaries by performing image processing on the plurality of obtained images using desired and / or specific algorithms. In at least one example implementation, the sensing module 300b can perform image processing using a stitching algorithm for connecting matching portions or matching parts of the obtained images. The sensing module 300b can generate a single image by sensing reflected light and performing the above-described image processing on the plurality of obtained images, thereby obtaining the user's fingerprint information, wherein the breaks in the plurality of obtained images are smoothly connected into a single image.

[0056] In the following description, reference will be used. Figures 9 to 11 Other example implementations of the sensing module are described below.

[0057] Figure 9 This is a diagram illustrating a sensing module according to at least one example implementation. Figure 10A and Figure 10B This is a diagram illustrating the operation of a sensing module according to some example implementations. Figure 11This is a block diagram illustrating the configuration of a sensing module according to at least one example implementation.

[0058] Reference Figure 9 The sensing module 400 may include a multi-lens array 410, an optical filter 420, a sensor 430, a substrate 440, and / or a support 450, etc., but the example embodiments are not limited thereto. According to some example embodiments, the sensing module 400 may further include a plate 460 and / or a sensor position control layer 470, etc.

[0059] Sensor 430 may include multiple light-sensing devices (e.g., photodetectors, light sensors, photocells, etc.). The multiple light-sensing devices may receive light signals incident on the internal space of sensing module 400 and may generate electrical signals associated with the user's biometric information in response to and / or based on the received light signals (e.g., in response to photons of the received light signals).

[0060] The multi-lens array 410 may include a support layer 413 and a plurality of lenses 411 and 412 arranged parallel to each other. Figure 9 An example is shown in which the plurality of lenses 411 and 412 include a plurality of first lenses 411 (e.g., a first layer lens) disposed on the support layer 413 and a plurality of second lenses 412 (e.g., a second layer lens) disposed below the support layer 413, but the exemplary embodiment is not limited thereto. The plurality of lenses 411 and 412 may have various structures, such as reference Figure 4A The exemplary embodiments described in Figure 5, etc.

[0061] The optical filter 420 may include a color filter, a monochromatic filter, and the like. A support 450 may be disposed on the substrate 440 and may support the multi-lens array 410 and / or the optical filter 420, etc.

[0062] The board 460 and the sensor position control layer 470 may be disposed on the substrate 440, but are not limited thereto.

[0063] The plate 460 may include a material with relatively high rigidity, such as plastic, metal and the like, to reduce and / or prevent deformation of the substrate 440.

[0064] A sensor position control layer 470 may be disposed on the plate 460 and may adjust the up-down (e.g., vertical) and / or left-right (e.g., horizontal) position of the sensor 430. In at least one example embodiment, the sensor position control layer 470 may be attached to and integrated with the sensor 430 and may be movable on the plate 460 along a first direction DIR1 and / or a second direction DIR2 perpendicular to the first direction DIR1 to control the position of the sensor 430. Additionally, in some example embodiments, the sensor position control layer 470 may rotate (e.g., twirl) the sensor 430 about a point.

[0065] The sensor position control layer 470 can adjust the focus of reflected light incident on the internal space of the sensing module 400 by controlling the position of the sensor 430 acquired along the first direction DIR1, but is not limited thereto. Furthermore, the sensor position control layer 470 can adjust the range of reflected light received by the sensor 430 by controlling the position of the sensor 430 acquired along the second direction DIR2, but is not limited thereto. (Refer to...) Figure 10A and Figure 10B Describes a method for controlling the position of sensor 430 via sensor position control layer 470.

[0066] Reference Figure 10A When the center of the fingerprint region ta of a finger OBJ and the center c1 of the sensing region are arranged in a second direction DIR2 (ta1 = ta2) adjacent to (e.g., above) the sensing region of the display panel DP, the sensor position control layer 470 can adjust the position of the sensor 430 in the first direction DIR1 so that the center c2 of the sensor 430 is arranged in the second direction DIR2 with the center c1 of the sensing region (e.g., the center c2 of the sensor 430 is aligned with the center c1 of the sensing region). In at least one example embodiment, the positions of the center c1 of the sensing region and the center c2 of the sensor 430 in the second direction DIR2 can be the base position and / or the default position of the sensor 430. In this case, the sensor 430 can receive all reflected light signals reflected away from the finger OBJ and / or all reflected light signals reflected from the finger OBJ.

[0067] Additionally, when the center of the fingerprint area ta' of the finger OBJ is positioned adjacent to the sensing area of ​​the display panel DP, and the center c1 of the sensing area is as follows: Figure 10BWhen the sensor is not positioned on the second direction DIR2 (ta1' ≠ ta2') (e.g., the center of the fingerprint region ta' is not aligned with the center c1 of the sensing region), the sensor position control layer 470 can adjust the position of the sensor 430 so that the center of the sensor 430 is aligned with the center of the fingerprint region ta' on the second direction DIR2 (e.g., the center of the sensor 430 is positioned to be aligned with the center of the fingerprint region ta'). Figure 10B In at least one example implementation, since the user's finger OBJ is positioned to the right of the sensing area adjacent to the center c1 of the sensing area (ta2'>ta1'), the sensor position control layer 470 can move the sensor 430 along the first direction DIR1 from the center c1 of the sensing area by a desired and / or specific distance Δd1. In this case, the sensing accuracy of the sensing module 400 can be improved because the amount of reflected light signal received in the sensor 430 increases due to the repositioning of the sensing area.

[0068] The sensing module 400 can be configured to control the position of the sensor 430, and as... Figure 11 As shown, the sensing module 400 may include a control processing circuit system 40 (e.g., a controller) and / or an actuator 50, etc.

[0069] The control processing circuitry system 40 can control the actuator 50 to allow the sensor position control layer 470 to control the position of the sensor 430. For this purpose, the control processing circuitry system 40 may include, but is not limited to, a position detector 41, a position processing circuitry system 42 (e.g., a position controller), and / or a driver 43. According to at least one example embodiment, the control processing circuitry system 40 and / or the position processing circuitry system 42 may include a processing circuitry system comprising: hardware including logic circuitry; a hardware / software combination, such as a processor executing software; or a combination thereof. For example, the processing circuitry system may more specifically include, but is not limited to, a central processing unit (CPU), an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field-programmable gate array (FPGA), a system-on-a-chip (SoC), a programmable logic unit, a microprocessor, an application-specific integrated circuit (ASIC), etc.

[0070] Position detector 41 can detect the position of a part of the user's body (OBJ, such as a finger) in the sensing area of ​​the display panel DP. In at least one example embodiment, position detector 41 can use a piezoelectric sensor, thermal sensor, and / or the like to detect the position of said part of the user's body (OBJ). Position processing circuit system 42 can generate a position control signal for adjusting the position of sensor 430 based on the position information detected by position detector 41. For example, position processing circuit system 42 can generate a position control signal for adjusting the position of sensor 430 acquired along a first direction DIR1 and / or along a second direction DIR2 based on the position of said part of the user's body (OBJ) in the sensing area, but is not limited thereto. Driver 43 can drive actuator 50 based on the position control signal received from position processing circuit system 42. Control processing circuit system 40 and / or position processing circuit system 42 may include a processing circuit system comprising: hardware including logic circuitry; a hardware / software combination, such as a processor executing software; or a combination thereof. For example, the processing circuit system may more specifically include, but is not limited to, a central processing unit (CPU), an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field-programmable gate array (FPGA), a system-on-a-chip (SoC), a programmable logic unit, a microprocessor, an application-specific integrated circuit (ASIC), etc.

[0071] The actuator 50, under the control of the driver 43, can generate a driving force for moving the sensor position control layer 470 in the first direction DIR1 and / or the second direction DIR2. The actuator 50 may include, but is not limited to, at least one motor having a drive coil and a drive magnetic material. For example, the actuator 50 may include a rotary motor, a piezoelectric actuator, a voice coil motor, etc.

[0072] In the following description, reference will be made to Figures 12 to 14 Other example implementations of the sensing module are described in detail.

[0073] Figure 12 This is a cross-sectional view showing a sensing module according to at least one example embodiment. Figure 13A and Figure 13B This illustrates some example implementations. Figure 12 The diagram shows the operation of the sensing module.

[0074] Reference Figure 12 The sensing module 500 may include, but is not limited to, a multi-lens array 510, an optical filter 520, a sensor 530, a substrate 540, and / or a support 550. The sensing module 500 may further include a lens position control layer 560, etc.

[0075] The sensor 530 may include multiple light sensing devices that can receive light signals incident on the internal space of the sensing module 500.

[0076] The multi-lens array 510 may include a plurality of lenses 511 and 512 disposed on the support layer 513 and arranged parallel to each other. Figure 12 An example is shown, in which the plurality of lenses 511 and 512 may include a plurality of first lenses 511 (e.g., a first layer lens) disposed on the support layer 513 and a plurality of second lenses 512 (e.g., a second layer lens) disposed below the support layer 513, but the example embodiment is not limited thereto. The plurality of lenses 511 and 512 may have various structures, such as those shown in the reference... Figures 4A to 5B The examples described are not limited thereto.

[0077] The optical filter 520 may include a color filter, a monochromatic filter, and the like. A support 550 may be disposed on the substrate 540 and may support the optical filter 520 and / or the lens position control layer 560, etc.

[0078] The lens position control layer 560 may be disposed on the second direction DIR2 between the support layer 513 and the bracket 550, and may adjust the position of the support layer 513, but is not limited thereto. The lens position control layer 560 may adjust the position of the support layer 513 acquired along the first direction DIR1 and / or the second direction DIR2, etc., to transmit a larger amount (e.g., an increased amount) of reflected light signal to the sensor 530. Or in other words, if an increased amount of reflected light is desired and / or needed to sense the user's biometric information (e.g., the user's biometric information and / or fingerprint is not successfully read), a command instruction may be transmitted from the processing circuitry system, at least one processor, etc., to the lens position control layer to reposition the support layer 513 to the desired position to obtain the increased amount of reflected light.

[0079] Reference Figure 13AWhen the center of the fingerprint area tb of a finger OBJ, which is disposed adjacent to the sensing area of ​​the display panel DP, and the center c1 of the sensing area are arranged in the second direction DIR2 (tb1 = tb2) (e.g., aligned), the lens position control layer 560 can adjust the position of the support layer 513 in the first direction DIR1 so that the center c3 of the support layer 513 and the center c1 of the sensing area are arranged in the second direction DIR2 (e.g., aligning the center c3 of the support layer 513 with the center c1 of the sensing area), but the example implementation is not limited to this. In at least one example implementation, the position of the center c1 of the sensing area and the center c3 of the support layer 513 arranged in the second direction DIR2 can be the base position of the support layer 513. In this case, the sensor 530 can receive some and / or all of the reflected light signals reflected from the finger OBJ.

[0080] Furthermore, when the center of the fingerprint region tb' of the finger OBJ, which is disposed adjacent to the sensing area of ​​the display panel DP, and the center c1 of the sensing area are not arranged on the second direction DIR2 (tb1'≠tb2') (for example, the center of the fingerprint region is not aligned with the center c1 of the sensing area), the lens position control layer 560 can adjust the position of the support layer 513 on the first direction DIR1 so that the center of the support layer 513 and the center of the fingerprint region tb' are arranged on the second direction DIR2 (for example, aligning the center of the support layer 513 with the center of the fingerprint region tb'). Figure 13B In an example implementation, since the user's finger OBJ is positioned adjacent to the right side of the sensing area with respect to the center c1 of the sensing area (tb2'>tb1'), the lens position control layer 560 can move the support layer 513 along the first direction DIR1 from the center c1 of the sensing area by a desired and / or specific distance Δd2, thereby aligning the center of the fingerprint area of ​​the finger OBJ with the center c1 of the sensing area. In this case, the sensing accuracy of the sensing module 500 can be improved as the amount of reflected light signal received from the sensor 530 increases.

[0081] The sensing module 500 can be configured to control the position of the support layer 513, and the sensing module 500 may include at least one processing circuitry system (e.g., controller, processor, etc.) (not shown) and / or actuator (not shown), such as a reference. Figure 11The control processing circuitry system 40 and / or actuator 50 described in the example embodiments are not limited thereto. The processing circuitry system may generate a control signal based on the position of the user's body part OBJ in the sensing area of ​​the display panel DP, and the actuator may move the lens position control layer 560 in a first direction DIR1 and / or a second direction DIR2 in response to the control signal generated by the processing circuitry system, but the example embodiments are not limited thereto. For example, the processing circuitry system may generate a control signal based on the result of a previous biometric information sensing operation, and if the result of the previous biometric information sensing operation is unacceptable and / or another biometric information capture is desired, the processing circuitry system may generate a control signal to the actuator to reposition the lens position control layer 560. According to at least one example embodiment, the processing circuitry system may include: hardware including logic circuitry; a hardware / software combination, such as a processor executing software; or a combination thereof. For example, the processing circuit system may more specifically include, but is not limited to, a central processing unit (CPU), an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field-programmable gate array (FPGA), a system-on-a-chip (SoC), a programmable logic unit, a microprocessor, an application-specific integrated circuit (ASIC), etc.

[0082] In the following description, an electronic device including a sensing module will be described based on one or more example embodiments.

[0083] Figure 14 This is a block diagram illustrating an example of an electronic device including a sensing module according to at least one example embodiment.

[0084] Reference Figure 14 The electronic device 600 may include a sensing module 610, input and output devices 620, a memory 630, a processing circuit system 640, a port 650, and / or the like, but the exemplary embodiments are not limited thereto. The electronic device 600 may further include wired and / or wireless communication devices, a power supply device, and / or other components. Figure 14 Among the components shown, a port 650 may be provided for the electronic device 600 to communicate with a video card, sound card, memory card, and the like.

[0085] Electronic device 600 may include general-purpose desktop computers, laptop computers, servers, smartphones, tablet PCs, smart wearable devices, storage devices (such as solid-state drives (SSDs), hard disk drives (HDDs), etc.) and the like.

[0086] The processing circuitry system 640 can perform desired and / or specific calculations or tasks, or it can process commands. The processing circuitry system 640 can be implemented as a central processing unit (CPU), a microprocessor unit (MCU), a system-on-a-chip (SoC), a multi-core processor, a multiprocessor, a distributed processing system, or the like, and can communicate with the sensing module 610, input and output devices 620, memory 630, and other devices connected to port 650 via bus 660.

[0087] Memory 630 may be a non-transitory storage medium for storing data, multimedia data, or the like necessary for the operation of electronic device 600. Memory 630 may include volatile or non-volatile memory, such as flash memory devices or the like. Memory 630 may include at least one of a solid-state drive (SSD), a hard disk drive (HDD), and an optical disk drive (ODD).

[0088] Input and output devices 620 may include input devices such as keyboards, mice, touch screens, microphones, cameras and the like, and output devices such as displays, audio output units, haptic feedback devices and the like.

[0089] The sensing module 610 can be mounted on a package substrate and can be connected to the processing circuitry system 640 via a bus 660 or other communication means. The sensing module 610 can be configured as shown in reference... Figures 1 to 13B The various methods described in the foregoing example embodiments are used in the electronic device 600, but are not limited thereto.

[0090] Figure 15 and Figure 16 This is a diagram illustrating an example of an electronic device including a sensing module according to some exemplary embodiments.

[0091] refer to Figure 15 The electronic device 700 can be implemented as a smart mirror device for a vehicle, but the example implementation is not limited thereto.

[0092] Electronic device 700 can be embedded, integrated, connected, and / or installed in a vehicle, and electronic device 700 may include a main body with mirroring and / or display functions, a housing forming the exterior of electronic device 700 and having a supporting function, etc. For example, electronic device 700 may be a rearview mirror, dashboard, head-up display, instrument panel, windshield, navigation system, entertainment system, smartphone, tablet computer, etc., but the example embodiments are not limited thereto. The display may be located on the front side of the main body and may be exposed to the outside, and the display may provide driving information of the vehicle, surrounding images, and / or other information, etc. A desired and / or specific sensing area SA may be defined on the display, and the user may place a part of the user's body (OBJ) approximately in the sensing area SA, and may provide biometric information for user authentication to enable biometric protection functions and / or information stored in the electronic device and / or vehicle, etc.

[0093] refer to Figure 16 The electronic device 800 can also be implemented as a digital door lock device, but the example implementation is not limited to this.

[0094] The electronic device 800 may include a display with interface functions (e.g., user interface, manual keypad, virtual keypad, and / or graphical user interface) for user authentication procedures. For example, a desired and / or specific key layout may be displayed on the display, and the user can input a verification key code by touching the key layout set on the display to open or close the digital door lock device, etc. Furthermore, a sensing area SA may be defined on the display, and the user may place a portion of their body (OBJ) approximately in the sensing area SA, and biometric information may be provided during the verification of the user's biometric information to open or close the digital door lock device 800.

[0095] According to one or more of the foregoing example embodiments, since the electronic device includes a sensing module with a multi-lens array, the thickness of the electronic device and / or the sensing module can be reduced.

[0096] In addition, since the electronic device includes a sensing module with a multi-lens array, the size of the sensing area of ​​the sensing module can be increased, and / or the number of lens layers of the sensing module can be increased, thereby improving the accuracy of the sensing module.

[0097] Furthermore, since the electronic device includes a sensing module with a position processing circuit system, the electronic device can properly receive reflected light, thereby improving the sensing accuracy of the sensing module.

[0098] Although various exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the inventive concept as defined by the appended claims.

[0099] This application claims priority to Korean Patent Application No. 10-2019-0098401, filed on August 12, 2019, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.

Claims

1. An electronic device comprising: a first substrate; a display panel including a plurality of light sources configured to emit light signals to an object through the first substrate; a first sensor, a second sensor, and a third sensor disposed on a second substrate, the first sensor, the second sensor, and the third sensor including processing circuitry configured to detect biometric information associated with the object by receiving a reflected light signal corresponding to the light signals reflected off the object and transmitted through the first substrate; and a multi-lens array including a support layer over the first sensor, the second sensor, and the third sensor, a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens directly on an upper surface of the support layer, and the fourth lens, the fifth lens, and the sixth lens directly on a lower surface of the support layer, wherein the support layer is configured to transmit the reflected light signal received through the first lens, the second lens, and the third lens to the fourth lens, the fifth lens, and the sixth lens without a blocking layer that blocks the reflected light signal, reflected light incident from a first sub-sensing area of the display panel passes through the first lens and the fourth lens and is sensed by the first sensor, reflected light incident from a second sub-sensing area of the display panel passes through the second lens and the fifth lens and is sensed by the second sensor, reflected light incident from a third sub-sensing area of the display panel passes through the third lens and the sixth lens and is sensed by the third sensor, the first sub-sensing area overlaps the second sub-sensing area, the second sub-sensing area overlaps the third sub-sensing area. 2.The electronic device of claim 1, further comprising: an optical filter between the first sensor, the second sensor, and the third sensor and the multi-lens array, the optical filter configured to selectively pass the reflected light signal in response to the reflected light signal having a desired wavelength band. 3.The electronic device of claim 1, wherein a distance from a lower surface of the display panel to a lower surface of the second substrate in a direction perpendicular to the second substrate is 4 mm or less. 4.The electronic device of claim 1, wherein the multi-lens array has a field of view that is 70 degrees or wider. 5.The electronic device of claim 1, wherein a first distance from the lower surface of the display panel to an uppermost portion of at least one of the first lens, the second lens, and the third lens in the direction perpendicular to the second substrate is 45% or more of a second distance from the lower surface of the display panel to the lower surface of the second substrate. 6.The electronic device of claim 1, wherein the multi-lens array further includes a plurality of seventh lenses parallel to the upper surface of the support layer. 7.An electronic device comprising: a display panel over a substrate and including a plurality of light sources configured to emit light signals to an object; a first optical sensor, a second optical sensor, and a third optical sensor on the substrate and configured to sense reflected light corresponding to the light signal, the reflected light being reflected from the object and passing through a detection area defined in the display panel; a lens support layer over the first optical sensor, the second optical sensor, and the third optical sensor; a plurality of lenses including a first lens, a second lens, a third lens directly on an upper surface of the lens support layer in a direction parallel to an upper surface of the substrate, and a fourth lens, a fifth lens, and a sixth lens directly on a lower surface of the lens support layer; and a position control layer including processing circuitry over the substrate, the position control layer configured to control a position of the first optical sensor, the second optical sensor, and the third optical sensor and / or a position of at least one lens of the plurality of lenses, wherein the lens support layer is configured to transmit the reflected light received through the first lens, the second lens, and the third lens to the fourth lens, the fifth lens, and the sixth lens without a blocking layer that blocks the reflected light, reflected light incident from a first sub-sensing area of the display panel passes through the first lens and the fourth lens and is sensed by the first optical sensor, reflected light incident from a second sub-sensing area of the display panel passes through the second lens and the fifth lens and is sensed by the second optical sensor, reflected light incident from a third sub-sensing area of the display panel passes through the third lens and the sixth lens and is sensed by the third optical sensor, the first sub-sensing area overlaps the second sub-sensing area, the second sub-sensing area overlaps the third sub-sensing area. 8.The electronic device of claim 7, wherein, the processing circuitry is further configured to control the position of the first optical sensor, the second optical sensor, and the third optical sensor and / or the position of the at least one lens of the plurality of lenses based on position information of an area adjacent to the object with respect to the detection area. 9.The electronic device of claim 8, wherein the position control layer is under the first optical sensor, the second optical sensor, and the third optical sensor. 10.The electronic device of claim 8, wherein the position control layer is under the lens support layer. 11.The electronic device of claim 7, further comprising: an optical filter between the first optical sensor, the second optical sensor, and the third optical sensor and the plurality of lenses and configured to selectively pass the reflected light in response to the reflected light having a desired wavelength band. 12.The electronic device of claim 7, further comprising: a bracket including an accommodation space configured to accommodate the first optical sensor, the second optical sensor, and the third optical sensor and to support the lens support layer. 13.The electronic device of claim 7, wherein a first distance in a direction perpendicular to the substrate from a lower surface of the display panel to an uppermost portion of the plurality of lenses is 45% or more of a second distance from the lower surface of the display panel to the lower surface of the substrate. 14.The electronic device of claim 7, wherein The plurality of lenses is above and / or below the lens support layer.

15. A sensing module, comprising: a first sensor, a second sensor, and a third sensor over a substrate, the first sensor, the second sensor, and the third sensor including processing circuitry configured to receive light reflected from an object adjacent to a sensing region and obtain biometric information of the object; a multi-lens array including a plurality of lenses directly on a support layer, the plurality of lenses being over the first sensor, the second sensor, and the third sensor in a direction parallel to an upper surface of the substrate, the plurality of lenses including a first lens, a second lens, a third lens directly on an upper surface of the support layer, and a fourth lens, a fifth lens, and a sixth lens directly on a lower surface of the support layer; and a position control layer over the substrate, the position control layer including position processing circuitry configured to control a position of the first sensor, the second sensor, and the third sensor and / or a position of at least one lens of the plurality of lenses based on position information of a region adjacent to the object with respect to the sensing region, wherein the support layer is configured to transmit reflected light received through the first lens, the second lens, and the third lens to the fourth lens, the fifth lens, and the sixth lens without a blocking layer that blocks the reflected light, reflected light incident from a first sub-sensing region of the sensing region passes through the first lens and the fourth lens and is sensed by the first sensor, reflected light incident from a second sub-sensing region of the sensing region passes through the second lens and the fifth lens and is sensed by the second sensor, reflected light incident from a third sub-sensing region of the sensing region passes through the third lens and the sixth lens and is sensed by the third sensor, the first sub-sensing region overlaps the second sub-sensing region, the second sub-sensing region overlaps the third sub-sensing region.

16. The sensing module of claim 15, wherein, The position control layer includes at least one sensor position control layer between the substrate and the at least one sensor, the at least one sensor position control layer including an actuator configured to adjust a position of the at least one sensor based on a signal from the position processing circuitry.

17. The sensing module of claim 16, wherein, The position control layer further includes a plate over the substrate, the plate configured to support the at least one sensor position control layer.

18. The sensing module of claim 15, wherein, The position control layer includes a lens position control layer over the sensor, the lens position control layer configured to adjust a position of the support layer.

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