Assembling transfer sticker high temperature tape equipment

Abstract

The invention provides an assembly and transfer high-temperature tape sticking device, comprising a frame, a conveying mechanism, a fixture, a high-temperature tape sticking mechanism and a handling manipulator, wherein the conveying mechanism is arranged on the frame, and the conveying mechanism is provided with a loading station, a high-temperature tape sticking station and a handling station along its conveying direction; the fixture is located on the conveying mechanism, the conveying mechanism can convey the fixture, and the fixture is provided with a placement station for placing an assembly formed by assembling a heat sink and a copper tube; the high-temperature tape sticking mechanism is arranged on the frame and located on one side of the high-temperature tape sticking station, and the high-temperature tape sticking mechanism is used for sticking high-temperature tape to the assembly located at the high-temperature tape sticking station, so that the solder paste does not flow out when it is in a liquid state at high temperature (400°C), and the copper tube is fully in contact with the solder paste and welded evenly; the handling manipulator is arranged on the frame, and the handling manipulator is used for clamping and unloading the assembly located at the handling station.

Description

Technical Field

[0001] The invention relates to the technical field of radiator assembly, and in particular to a device for assembling a transfer sticker high-temperature adhesive tape. Background Art

[0002] Integrated circuits are widely used in computer components, and high temperature is the enemy of integrated circuits. High temperature will not only cause unstable system operation and shorten service life, but may even burn some components. The function of the radiator is to absorb this heat and then dissipate it into or outside the chassis to ensure the normal temperature of computer components. Computer radiators usually include a substrate, a large heat sink, a small heat sink and a copper tube. After the small heat sink and the copper tube are assembled, they usually need to be transferred to the next process for the next assembly. However, at present, they are usually transferred manually, which has problems such as low production efficiency, high labor costs, and the solder paste in the small heat sink easily flowing out. Summary of the invention

[0003] The object of the present invention is to provide an assembly and transfer high-temperature adhesive tape pasting device which can automatically pasted the high-temperature adhesive tape and has high production efficiency.

[0004] To achieve the above-mentioned purpose, the present invention provides an assembly and transfer high-temperature tape application equipment, including a frame, a conveying mechanism, a jig, a high-temperature tape application mechanism and a handling robot, wherein the conveying mechanism is arranged on the frame, and the conveying mechanism is provided with a loading station, a high-temperature tape application station and a handling station along its conveying direction; the jig is located on the conveying mechanism, and the conveying mechanism can convey the jig, and the jig is provided with a placement station for placing an assembly formed by a heat sink and a copper tube; the high-temperature tape application mechanism is arranged on the frame and located on one side of the high-temperature tape application station, and the high-temperature tape application mechanism is used to apply high-temperature tape to the assembly located at the high-temperature tape application station; the handling robot is arranged on the frame, and the handling robot is used to clamp and unload the assembly located at the handling station.

[0005] Preferably, the jig includes a base, a pressing drive mechanism and a pressing piece, the placement station is arranged on the base, the pressing drive mechanism is arranged on the base, the pressing piece is connected to the pressing drive mechanism, and the pressing piece is driven by the pressing drive mechanism so that the pressing piece presses down the assembly located on the placement station.

[0006] Preferably, the pressing down driving mechanism includes a first linear sliding mechanism, a bearing platform, a second linear sliding mechanism and a pushing member, the first linear sliding mechanism is arranged on the base, the bearing platform is arranged on the first linear sliding mechanism, the pressing down member can be slidably arranged on the bearing platform up and down, the second linear sliding mechanism is arranged on the bearing platform, the pushing member is connected to the second linear sliding mechanism, the pressing down member is carried on the pushing member, the sliding direction of the first linear sliding mechanism is perpendicular to the sliding direction of the second linear sliding mechanism, the assembly and transfer of high-temperature adhesive tape equipment also includes a sliding driving mechanism, the sliding driving mechanism drives the first linear sliding mechanism to drive the bearing platform to move, and the sliding driving mechanism drives the second linear sliding mechanism to drive the pushing member to move and release the pressing down member, so that the pressing down member presses down the assembly located on the placement station.

[0007] Preferably, a groove is provided on the top surface of the pushing member, and the pressing member is supported on the top surface of the pushing member. The pushing member is driven to move by the second linear sliding mechanism so that the pressing member sinks into the groove or escapes from the groove, so that the pressing member moves downward or upward.

[0008] Preferably, the conveying mechanism includes a first lifting drive mechanism, a first conveyor belt and a second conveyor belt, the first lifting drive mechanism is arranged on the frame, the first conveyor belt is connected to the output end of the first lifting drive mechanism, the loading station is located on the first conveyor belt, the second conveyor belt is arranged on the frame, the high-temperature tape application station and the transporting station are located on the second conveyor belt, and the first conveyor belt is driven to rise and fall by the first lifting drive mechanism to make the first conveyor belt dock or detach one end of the second conveyor belt.

[0009] Preferably, the conveying mechanism also includes a second lifting drive mechanism, a third conveyor belt and a return conveyor belt, the second lifting drive mechanism is arranged on the frame, the output end of the second lifting drive mechanism is connected to the third conveyor belt, and the return conveyor belt is arranged on the frame and located below the second conveyor belt; the third conveyor belt is driven to rise and fall by the second lifting drive mechanism so that the third conveyor belt is docked with the other end of the second conveyor belt or the third conveyor belt is docked with one end of the return conveyor belt; the first conveyor belt is driven to rise and fall by the first lifting drive mechanism so that the first conveyor belt is docked with or detached from the other end of the return conveyor belt.

[0010] Preferably, the high-temperature tape applying mechanism includes a tape fixing seat, a clamping mechanism, a material dispensing mechanism, a cutting mechanism, a feeding moving drive mechanism and an adsorption mechanism, wherein the tape fixing seat is arranged on the frame and is used to fix the high-temperature tape, the clamping mechanism and the material dispensing mechanism are arranged on the frame at intervals, the material dispensing mechanism is used to drag out one end of the high-temperature tape, the clamping mechanism is used to clamp the dragged high-temperature tape, the cutting mechanism is arranged on the frame and located on one side of the clamping mechanism, the cutting mechanism is used to cut off the high-temperature tape located between the clamping mechanism and the material dispensing mechanism, the feeding moving drive mechanism is arranged on the frame, the adsorption mechanism is arranged on the feeding moving drive mechanism and is located between the cutting mechanism and the material dispensing mechanism, the adsorption mechanism is used to adsorb the cut high-temperature tape, and the feeding moving drive mechanism drives the adsorption mechanism to move, so that the high-temperature tape is adhered to the end surface of the assembly located on the high-temperature tape applying station.

[0011] Preferably, the high-temperature tape applying mechanism also includes a roller mechanism, two of the roller mechanisms are arranged on the feeding mobile drive mechanism and are located on both sides of the adsorption mechanism, and the roller mechanism can roll to press the high-temperature tape onto the side surface of the assembly adjacent to the end surface.

[0012] Preferably, the assembly and transfer high-temperature tape equipment also includes a rotary drive mechanism and a glue filling mechanism. The rotary drive mechanism is arranged on the frame and located at the transport station. The glue filling mechanism is arranged on the frame. The rotary drive mechanism drives the jig to rotate so that the assembly located at the placement station is inclined, thereby allowing the glue filling mechanism to fill glue on the assembly located at the placement station.

[0013] Preferably, the rotary drive mechanism includes a positioning and lifting drive mechanism, a positioning base plate, a positioning rotating plate and a positioning and rotating drive mechanism, the positioning and lifting drive mechanism is arranged on the frame, the positioning base plate is connected to the output end of the positioning and lifting drive mechanism, the positioning rotating plate is pivotally connected to the positioning base plate, the positioning and rotating drive mechanism is arranged on the positioning base plate, the positioning and rotating drive mechanism is connected to the positioning and rotating plate, the positioning and lifting drive mechanism drives the positioning and rotating plate to rise and engage with the bottom of the fixture, so that the positioning and rotating drive mechanism drives the positioning and rotating plate to rotate, thereby driving the fixture to rotate.

[0014] Compared with the prior art, the assembly and transfer high-temperature tape sticking equipment of the present invention utilizes a conveying mechanism to convey a jig loaded with assembly parts, so that the jig moves to the high-temperature tape sticking station and the handling station in turn, so that the high-temperature tape sticking mechanism can be used to stick high-temperature tape to the assembly parts located at the high-temperature tape sticking station in turn, so that the solder paste in the assembly parts does not flow out when it is in a liquid state at high temperature (400°C), allowing the copper tube of the assembly parts to fully contact the solder paste and weld evenly, and using a handling machinery to clamp and unload the assembly parts located at the handling station, thereby realizing automated high-temperature tape sticking, with high production efficiency and low labor costs, and suitable for wide promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the assembly transfer sticker high-temperature tape device of the present invention.

[0016] Figure 2 It is a top view of the assembly transfer sticker high temperature tape device of the present invention.

[0017] Figure 3 It is a three-dimensional structural schematic diagram of the conveying mechanism of the assembly transfer sticker high-temperature tape device of the present invention.

[0018] Figure 4 It is a top view of the conveying mechanism of the assembly transfer sticker high temperature tape device of the present invention.

[0019] Figure 5 It is a structural schematic diagram of a jig for assembling a transfer sticker high-temperature adhesive tape device of the present invention.

[0020] Figure 6 It is a structural schematic diagram of a jig and a sliding drive mechanism for assembling a high-temperature adhesive tape device for transferring the present invention.

[0021] Figure 7 It is a structural schematic diagram of a high-temperature adhesive tape applying mechanism of an assembly and transfer high-temperature adhesive tape applying device of the present invention.

[0022] Figure 8 It is a structural schematic diagram of a feeding moving driving mechanism, an adsorption mechanism and a roller mechanism of a high-temperature adhesive tape sticking mechanism of an assembly and transfer high-temperature adhesive tape sticking device of the present invention.

[0023] Fig. 9 It is a structural schematic diagram of a handling robot for assembling a high-temperature adhesive tape device for transferring the adhesive tape according to the present invention.

[0024] Fig.10 It is a structural schematic diagram of the rotary drive mechanism and the glue filling mechanism of the high-temperature adhesive tape assembly transfer tape device of the present invention.

[0025] Fig.11 It is a schematic diagram of the structure of the rotary drive mechanism of the high-temperature adhesive tape assembly transfer tape device of the present invention. DETAILED DESCRIPTION

[0026] In order to explain the technical content and structural features of the present invention in detail, further description will be given below in combination with the implementation modes and the accompanying drawings.

[0027] See also Figures 1 to 5 as well as Fig. 9 The assembly and transfer high-temperature tape pasting equipment 100 of the present invention includes a frame 1, a conveying mechanism 2, a fixture 3, a high-temperature tape pasting mechanism 4 and a handling manipulator 5. The conveying mechanism 2 is arranged on the frame 1. The conveying mechanism 2 is provided with a loading station 221, a high-temperature tape pasting station 231 and a handling station 232 along its conveying direction; the fixture 3 is located on the conveying mechanism 2, and the conveying mechanism 2 can convey the fixture 3. The fixture 3 is provided with a placement station 31 for placing the assembly 200 formed by the heat sink and the copper tube; the high-temperature tape pasting mechanism 2 is provided with a high-temperature tape pasting mechanism 4 and a handling manipulator 5. The tape mechanism 4 is arranged on the frame 1 and is located on one side of the high-temperature tape applying station 231. The high-temperature tape applying mechanism 4 is used to apply high-temperature tape to the assembly 200 located on the high-temperature tape applying station 231, so that the solder paste of the assembly does not flow out when it is in a liquid state at high temperature (400°C), allowing the copper tube of the assembly to fully contact the solder paste and weld evenly; the handling robot 5 is arranged on the frame 1, and the handling robot 5 is used to clamp and unload the assembly 200 located on the handling station 232.

[0028] See also Figure 5 and Figure 6In this embodiment, the fixture 3 includes a base 32, a pressing drive mechanism 33 and a pressing piece 34. The placement station 31 is arranged on the base 32, the pressing drive mechanism 33 is arranged on the base 32, and the pressing piece 34 is connected to the pressing drive mechanism 33. The pressing piece 34 is driven by the pressing drive mechanism 33 to make the pressing piece 34 press down the assembly 200 located on the placement station 31, so that the assembly 200 is firmly positioned on the placement station 31, so that the high-temperature tape can be affixed to the assembly 200 later. Specifically, the pressing driving mechanism 33 includes a first linear sliding mechanism 331, a bearing platform 332, a second linear sliding mechanism 333 and a pushing member 334, wherein the first linear sliding mechanism 331 is arranged on the base 32, and the bearing platform 332 is arranged on the first linear sliding mechanism 331; the pressing member 34 can be slidably arranged on the bearing platform 332, wherein the bearing platform 332 can be provided with a sliding guide column, and the pressing member 34 is sleeved on the sliding guide column and can slide up and down along the sliding guide column, but is not limited to this; the second linear sliding mechanism 333 is arranged on the bearing platform 332, the pushing member 334 is connected to the second linear sliding mechanism 333, and the pressing member 34 bears On the push member 334, the sliding direction of the first linear sliding mechanism 331 is perpendicular to the sliding direction of the second linear sliding mechanism 333. The assembly and transfer high temperature adhesive tape device also includes a sliding drive mechanism 35, which is arranged on the frame and is used to drive the first linear sliding mechanism 331 and the second linear sliding mechanism 333 to slide. The sliding drive mechanism 35 drives the first linear sliding mechanism 331 to drive the carrier 332 to move, and the sliding drive mechanism 35 drives the second linear sliding mechanism 333 to drive the push member 334 to move and release the pressing member 34, so that the pressing member 34 presses down the assembly 200 located on the placement station 31. Among them, the first linear sliding mechanism 331 and the second linear sliding mechanism 333 can adopt the existing structure of the slider and the slide rail. More specifically, a groove 334a is provided on the top surface of the push member 334, and the pressing member 34 is supported on the top surface of the push member 334. The push member 334 is driven to move by the second linear sliding mechanism 333, so that the pressing member 34 sinks into the groove 334a or escapes from the groove 334a, so that the pressing member 34 moves down or up. The depth of the groove 334a is the height of the pressing member 34 each time it is lifted or lowered, which can fully ensure that the position of the pressing member 34 each time it is pressed down remains the same.When the pressing member 34 is supported on the top surface of the pushing member 334 and is out of the groove 334a, the pressing member 34 is in the upper position and does not press down the assembly 200 located on the placement station 31; when the second linear sliding mechanism 333 drives the pushing member 334 to move, so that the pressing member 34 moves along the top surface of the pushing member 334 and sinks into the groove 334a, the pressing member 34 moves down relative to the support platform 332, thereby pressing down the assembly 200 located on the placement station 31; when the second linear sliding mechanism 333 drives the pushing member 334 to move and reset, the pressing member 34 moves along the top surface of the pushing member 334 and rises out of the groove 334a, and the pressing member 34 moves up relative to the support platform 332. However, the structure of the pressing drive mechanism 33 is not limited to this. For example, the pressing drive mechanism 33 can use an existing linear cylinder to directly drive the pressing member 34 to move up or down.

[0029] See also Figure 3 and Figure 4The conveying mechanism 2 includes a first lifting drive mechanism 21, a first conveyor belt 22 and a second conveyor belt 23. The first lifting drive mechanism 21 is arranged on the frame 1, and the first conveyor belt 22 is connected to the output end of the first lifting drive mechanism 21. The loading station 221 is located on the first conveyor belt 22, and the second conveyor belt 23 is arranged on the frame 1. The high-temperature tape sticking station 231 and the transporting station 232 are located on the second conveyor belt 23. The first lifting drive mechanism 21 drives the first conveyor belt 22 to rise and fall, so that the first conveyor belt 22 and one end of the second conveyor belt 23 are docked or detached. The first conveyor belt 22 can be driven upward by the first lifting drive mechanism 21 to disengage the first conveyor belt 22 from one end of the second conveyor belt 23, thereby facilitating the placement of the assembly 200 on the jig 3 on the first conveyor belt 22 to achieve loading; the first conveyor belt 22 can be driven downward by the first lifting drive mechanism 21 to disengage the first conveyor belt 22 from one end of the second conveyor belt 23, thereby allowing the first conveyor belt 22 to transport the jig 3 to the second conveyor belt 23. Furthermore, the conveying mechanism 2 also includes a second lifting drive mechanism 24, a third conveyor belt 25 and a return conveyor belt 26. The second lifting drive mechanism 24 is arranged on the frame 1, and the output end of the second lifting drive mechanism 24 is connected to the third conveyor belt 25. The return conveyor belt 26 is arranged on the frame 1 and is located below the second conveyor belt 23; the third conveyor belt 25 is driven to rise and fall by the second lifting drive mechanism 24, so that the third conveyor belt 25 is docked with the other end of the second conveyor belt 23 or the third conveyor belt 25 is docked with one end of the return conveyor belt 26; the first conveyor belt 22 is driven to rise and fall by the first lifting drive mechanism 21, so that the first conveyor belt 22 is docked with or detached from the other end of the return conveyor belt 26. When the second lifting drive mechanism 24 drives the third conveyor belt 25 to rise, the third conveyor belt 25 docks with the other end of the second conveyor belt 23, so that the second conveyor belt 23 can convey the jig 3 to the third conveyor belt 25. Since the transport robot 5 has clamped and unloaded the assembly 200 on the jig 3, the jig 3 conveyed to the third conveyor belt 25 is in an empty state at this time. When the second lifting drive mechanism 24 drives the third conveyor belt 25 to descend, the third conveyor belt 25 is docked with one end of the return conveyor belt 26, so that the third conveyor belt 25 can convey the empty jig 3 to the return conveyor belt 26, and then the first lifting drive mechanism 21 is used to drive the first conveyor belt 22 to descend, so that the first conveyor belt 22 is docked with the other end of the return conveyor belt 26, so that the empty jig 3 is returned to the first conveyor belt 22, and the jig 3 is returned. Then, the first lifting drive mechanism 21 drives the first conveyor belt 22 to rise to a height higher than the second conveyor belt 23, so that the first conveyor belt 22 is detached from one end of the second conveyor belt 23, so as to facilitate the loading of the assembly 200 onto the jig 3, realize the reuse of the jig 3, and reduce the production cost.

[0030] See also Figure 7and Figure 8 The high temperature tape attaching mechanism 4 comprises a tape fixing seat 41, a clamping mechanism 42, a material shifting mechanism 43, a cutting mechanism 44, a material feeding moving driving mechanism 45 and an adsorption mechanism 46. The tape fixing seat 41 is arranged on the frame 1 and is used to fix the high temperature tape. The clamping mechanism 42 and the material-dispensing mechanism 43 are arranged on the frame 1 at intervals. The material-dispensing mechanism 43 is used to drag out one end of the high-temperature adhesive tape, and the clamping mechanism 42 is used to clamp the dragged high-temperature adhesive tape. The clamping mechanism 42 includes a clamping movement mechanism and a clamping claw assembly. The clamping movement mechanism is arranged on the frame 1. The output end of the clamping movement mechanism is connected to the clamping claw assembly and can drive the clamping claw assembly to move, so that the clamping claw assembly clamps one end of the high-temperature adhesive tape and drags the high-temperature adhesive tape out. The clamping mechanism 42 includes two clamping parts arranged opposite to each other. By driving the two clamping parts to move in a direction close to each other, the two clamping parts clamp the high-temperature adhesive tape dragged out by the material-dispensing mechanism 43, so that the high-temperature adhesive tape between the clamping mechanism 42 and the material-dispensing mechanism 43 is in a taut state, so as to facilitate cutting of the high-temperature adhesive tape. The more specific structures and principles of the clamping mechanism 42 and the material-dispensing mechanism 43 are well known to those skilled in the art, so they are not repeated here. The cutting mechanism 44 is arranged on the frame 1 and located on one side of the clamping mechanism 42. The cutting mechanism 44 is used to cut the high-temperature adhesive tape between the clamping mechanism 42 and the material-dispensing mechanism 43. The cutting mechanism 44 includes a cutting mobile driving mechanism and a cutter. The output end of the cutting mobile driving mechanism is connected to the cutter. The cutting mobile driving mechanism drives the cutter to move so that the cutter cuts the high-temperature adhesive tape between the clamping mechanism 42 and the material-dispensing mechanism 43. The feeding mobile driving mechanism 45 is arranged on the frame 1. The feeding mobile driving mechanism 45 can use existing mechanisms such as slide cylinders and linear motors to drive the adsorption mechanism 46 to move. The adsorption mechanism 46 is arranged on the feeding mobile driving mechanism 45 and located between the cutting mechanism 44 and the material-dispensing mechanism 43. The adsorption mechanism 46 includes an adsorption mobile driving mechanism and a vacuum suction head. The output end of the adsorption mobile driving mechanism is connected to the vacuum suction head. The adsorption mobile driving mechanism can drive the vacuum suction head to move so that the vacuum suction head adsorbs the cut high-temperature adhesive tape. The suction mechanism 46 sucks the cut high temperature tape, and the feeding moving driving mechanism 45 drives the suction mechanism 46 to move, so that the high temperature tape is pasted on the end surface of the assembly 200 located at the high temperature tape pasting station 231. However, the structure of the high temperature tape pasting mechanism 4 is not limited to this. For example, the high temperature tape pasting mechanism 4 can use a multi-axis robot to suck the cut high temperature tape, then identify and locate the position to be pasted on the assembly 200, and finally directly paste the high temperature tape on the assembly 200.

[0031] Please continue reading Figure 7 and Figure 8In this embodiment, the high-temperature adhesive tape applying mechanism 4 further includes a roller mechanism 47. Two roller mechanisms 47 are arranged on the feeding moving driving mechanism 45 and located on both sides of the adsorption mechanism 46. The roller mechanism 47 can roll to press the high-temperature adhesive tape onto the side surface adjacent to the end surface of the assembly 200. The roller mechanism 47 includes a roller moving driving mechanism and a roller. The output end of the roller moving driving mechanism is connected to the roller. After the feeding moving driving mechanism 45 drives the adsorption mechanism 46 to move so that the high-temperature adhesive tape is pasted onto the end surface of the assembly 200 located at the high-temperature adhesive tape applying station 231, the roller moving driving mechanism is used to drive the roller to move, so that the rollers of the two roller mechanisms 47 move along the two side surfaces adjacent to the end surface of the assembly 200 respectively, so that the high-temperature adhesive tape is fully pressed onto the assembly 200, and the assembly 200 can be protected from being crushed. In addition, the high-temperature tape applying mechanism 4 may also be provided with a guide tensioning wheel for guiding the high-temperature tape, an auxiliary clamping mechanism for auxiliary clamping of the high-temperature tape, and other mechanisms.

[0032] See also Fig.10 and Fig.11The assembly transfer high temperature tape device 100 of the present invention further includes a rotating drive mechanism 6 and a glue filling mechanism 7. The rotating drive mechanism 6 is arranged on the frame 1 and located at the transport station 232. The glue filling mechanism 7 is arranged on the frame 1. The rotating drive mechanism 6 drives the jig 3 to rotate so that the assembly 200 located at the placement station 31 is inclined, so that the glue filling mechanism 7 fills the assembly 200 located at the placement station 31 with glue. Specifically, the rotating drive mechanism 6 includes a positioning and lifting drive mechanism 61, a positioning base plate 62, a positioning rotating plate 63 and a positioning and rotating drive mechanism 64. The positioning and lifting drive mechanism 61 is arranged on the frame 1, the positioning base plate 62 is connected to the output end of the positioning and lifting drive mechanism 61, the positioning rotating plate 63 is pivotally connected to the positioning base plate 62, and the positioning and rotating drive mechanism 64 is arranged on the positioning base plate 62. The positioning and rotating drive mechanism 64 is connected to the positioning and rotating plate 63. The positioning and lifting drive mechanism 61 drives the positioning and rotating plate 63 to rise and engage with the bottom of the fixture 3, so that the positioning and rotating drive mechanism 64 drives the positioning and rotating plate 63 to rotate, thereby driving the fixture 3 to rotate. In this embodiment, the positioning rotation drive mechanism 64 adopts a telescopic cylinder, the body of the positioning rotation drive mechanism 64 is pivoted on the positioning base plate 62, and the output end of the positioning rotation drive mechanism 64 is pivoted to the bottom of the positioning rotation plate 63. The positioning rotation drive mechanism 64 is telescopic to drive the positioning rotation plate 63 to rotate, thereby driving the fixture 3 to rotate, such as rotating 45 degrees, and the angle is not limited to this. The fixture 3 is in an inclined state, so that it is convenient for the glue filling mechanism 7 to fill the assembly 200 located on the fixture 3 to ensure that the heat sink and the copper tube of the assembly 200 can be firmly connected together. However, the structure of the positioning rotation drive mechanism 64 is not limited to this. For example, the positioning rotation drive mechanism 64 can directly adopt a rotary reduction motor to directly drive the positioning rotation plate 63 to rotate using the rotary reduction motor. Among them, the glue filling mechanism 7 can adopt the existing robot to drive the glue dispensing cylinder and the glue dispensing nozzle to move the glue dispensing.

[0033] Combination Figures 1 to 11 The specific working principle of the assembly transfer sticker high temperature tape device 100 of the present invention is as follows:

[0034] The first conveyor belt 22 is driven to rise to a height higher than the second conveyor belt 23 by the first lifting drive mechanism 21, so that the first conveyor belt 22 and one end of the second conveyor belt 23 are disconnected, and the assembly 200 is loaded onto the placement station 31 of the jig 3, and the pressing drive mechanism 33 of the jig 3 drives the pressing member 34 to press down the assembly 200. The first conveyor belt 22 is driven to descend by the first lifting drive mechanism 21, so that the first conveyor belt 22 and one end of the second conveyor belt 23 are connected, so that the first conveyor belt 22 conveys the jig 3 to the second conveyor belt 23. When the second conveyor belt 23 conveys the jig 3 to the high-temperature tape sticking station 231, the material-dispensing mechanism 43 drags out one end of the high-temperature tape, the clamping mechanism 42 clamps the dragged high-temperature tape, the cutting mechanism 44 cuts off the high-temperature tape between the clamping mechanism 42 and the material-dispensing mechanism 43, the adsorption mechanism 46 moves to adsorb the cut high-temperature tape, the clamping mechanism 42 and the material-dispensing mechanism 43 release the high-temperature tape, and the feeding movement drive mechanism 45 drives the adsorption mechanism 46 and the roller mechanism 47 to move to the position corresponding to the assembly 200, so that the high-temperature tape is pasted on the end face of the assembly 200 located on the high-temperature tape sticking station 231, and the roller mechanism 47 is actuated, thereby rolling and pressing the high-temperature tape on the side surface adjacent to the end face of the assembly 200, thereby completing the bonding of the high-temperature tape to the assembly 200, wherein the high-temperature tape is bonded to the heat dissipation block of the assembly 200. When the second conveyor belt 23 conveys the jig 3 to the handling station 232, the positioning jacking drive mechanism 61 drives the positioning rotating plate 63 to rise and engage with the bottom of the jig 3, so that the positioning rotating drive mechanism 64 drives the positioning rotating plate 63 to rotate, thereby driving the jig 3 to rotate, so that the jig 3 is in an inclined state, and the glue filling mechanism 7 is activated, thereby filling the assembly 200 located on the jig 3 with glue. After the glue filling is completed, the rotating drive mechanism 6 and the glue filling mechanism 7 are reset, and the jig 3 is re-positioned on the second conveyor belt 23, and the handling robot 5 takes away the glue-filled assembly 200 on the jig 3 and unloads it.

[0035] In summary, the assembly and transfer high-temperature tape affixing equipment 100 of the present invention can automatically affix high-temperature tape and automatically repair glue for the assembly 200 formed by assembling the copper tube and the heat sink, with high production efficiency and low labor cost, and is suitable for wide promotion.

[0036] The above disclosure is only a preferred embodiment of the present invention, which cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are all within the scope of the present invention.

Claims

1. A device for assembling high-temperature transfer tape, characterized in that: include: frame; A conveying mechanism, wherein the conveying mechanism is arranged on the frame, and the conveying mechanism is provided with a loading station, a high-temperature tape sticking station and a handling station along its conveying direction; A jig, the jig is located on the conveying mechanism, the conveying mechanism can convey the jig, the jig is provided with a placement station for placing an assembly formed by assembling a heat sink and a copper tube; the jig comprises a base, a downward pressing driving mechanism and a downward pressing member, the placement station is arranged on the base, the downward pressing driving mechanism is arranged on the base, the downward pressing member is connected to the downward pressing driving mechanism, and the downward pressing member is driven by the downward pressing driving mechanism so that the downward pressing member presses down the assembly located on the placement station; A high-temperature tape applying mechanism, the high-temperature tape applying mechanism is arranged on the frame and located on one side of the high-temperature tape applying station, and the high-temperature tape applying mechanism is used to apply high-temperature tape to the assembly located on the high-temperature tape applying station; the high-temperature tape applying mechanism includes a tape fixing seat, a clamping mechanism, a material shifting mechanism, a cutting mechanism, a feeding moving drive mechanism, an adsorption mechanism and a roller mechanism, the tape fixing seat is arranged on the frame and used to fix the high-temperature tape, the clamping mechanism and the material shifting mechanism are arranged on the frame at intervals, the material shifting mechanism is used to drag out one end of the high-temperature tape, the clamping mechanism is used to clamp the dragged high-temperature tape, and the cutting mechanism is arranged on the frame and located at the clamping mechanism On one side, the cutting mechanism is used to cut the high-temperature adhesive tape between the clamping mechanism and the material-dispensing mechanism, the feeding moving driving mechanism is arranged on the frame, the adsorption mechanism is arranged on the feeding moving driving mechanism and is located between the cutting mechanism and the material-dispensing mechanism, the adsorption mechanism adsorbs the cut high-temperature adhesive tape by the adsorption mechanism, and the feeding moving driving mechanism drives the adsorption mechanism to move, so that the high-temperature adhesive tape is pasted on the end surface of the assembly located at the high-temperature adhesive tape sticking station; the two roller mechanisms are arranged on the feeding moving driving mechanism and are located on both sides of the adsorption mechanism, and the roller mechanisms can roll to press the high-temperature adhesive tape onto the side surface of the assembly adjacent to the end surface; A handling robot, the handling robot is arranged on the frame, and the handling robot is used to clamp and unload the assembly located on the handling station; A rotating drive mechanism and a glue-filling mechanism, wherein the rotating drive mechanism is disposed on the frame and located at the transport station, and the glue-filling mechanism is disposed on the frame, and the rotating drive mechanism drives the jig to rotate so that the assembly located at the placement station is inclined, thereby enabling the glue-filling mechanism to fill glue on the assembly located at the placement station.

2. The high temperature adhesive tape assembly equipment according to claim 1, characterized in that: The pressing down driving mechanism includes a first linear sliding mechanism, a bearing platform, a second linear sliding mechanism and a pushing member, the first linear sliding mechanism is arranged on the base, the bearing platform is arranged on the first linear sliding mechanism, the pressing down member can be slidably arranged on the bearing platform up and down, the second linear sliding mechanism is arranged on the bearing platform, the pushing member is connected to the second linear sliding mechanism, the pressing down member is carried on the pushing member, the sliding direction of the first linear sliding mechanism is perpendicular to the sliding direction of the second linear sliding mechanism, the assembly and transfer of high-temperature adhesive tape equipment also includes a sliding driving mechanism, the sliding driving mechanism drives the first linear sliding mechanism to drive the bearing platform to move, and the sliding driving mechanism drives the second linear sliding mechanism to drive the pushing member to move and release the pressing down member, so that the pressing down member presses down the assembly located on the placement station.

3. The high temperature adhesive tape assembly equipment according to claim 2, characterized in that: The top surface of the pushing member is provided with a groove, and the pressing member is supported on the top surface of the pushing member. The pushing member is driven to move by the second linear sliding mechanism so that the pressing member sinks into the groove or escapes from the groove, so that the pressing member moves downward or upward.

4. The high temperature adhesive tape assembly equipment according to claim 1, characterized in that: The conveying mechanism includes a first lifting drive mechanism, a first conveyor belt and a second conveyor belt. The first lifting drive mechanism is arranged on the frame. The first conveyor belt is connected to the output end of the first lifting drive mechanism. The loading station is located on the first conveyor belt. The second conveyor belt is arranged on the frame. The high-temperature tape application station and the transport station are located on the second conveyor belt. The first lifting drive mechanism drives the first conveyor belt to rise and fall so that the first conveyor belt can be docked or detached with one end of the second conveyor belt.

5. The high temperature adhesive tape assembly equipment according to claim 4, characterized in that: The conveying mechanism also includes a second lifting drive mechanism, a third conveyor belt and a return conveyor belt. The second lifting drive mechanism is arranged on the frame, and the output end of the second lifting drive mechanism is connected to the third conveyor belt. The return conveyor belt is arranged on the frame and is located below the second conveyor belt. The third conveyor belt is driven to rise and fall by the second lifting drive mechanism so that the third conveyor belt is docked with the other end of the second conveyor belt or the third conveyor belt is docked with one end of the return conveyor belt. The first lifting drive mechanism is used to drive the first conveyor belt to rise and fall so that the first conveyor belt is docked with or detached from the other end of the return conveyor belt.

6. The high temperature adhesive tape assembly equipment according to claim 1, characterized in that: The rotary drive mechanism includes a positioning and lifting drive mechanism, a positioning base plate, a positioning and rotating plate and a positioning and rotating drive mechanism. The positioning and lifting drive mechanism is arranged on the frame. The positioning base plate is connected to the output end of the positioning and lifting drive mechanism. The positioning and rotating plate is pivotally connected to the positioning base plate. The positioning and rotating drive mechanism is arranged on the positioning base plate. The positioning and rotating drive mechanism is connected to the positioning and rotating plate. The positioning and lifting drive mechanism drives the positioning and rotating plate to rise and engage with the bottom of the fixture, so that the positioning and rotating drive mechanism drives the positioning and rotating plate to rotate, thereby driving the fixture to rotate.

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