A microchannel heat sink combining a circular cavity and a water-drop shaped rib column

Abstract

The present application belongs to the field of micro-channel radiator heat dissipation, and particularly relates to a micro-channel radiator combining circular concave cavities and water-drop type rib columns, which comprises a radiator substrate, the radiator substrate comprises a solid wall surface, a flow channel, water-drop type rib columns and circular concave cavities, the flow channel penetrates through the inside of the radiator substrate, the two sides of the radiator substrate are respectively a working medium inlet and a working medium outlet, and the lower part of the radiator substrate is an electronic component adhering surface; the heat of electronic devices is conducted to the radiator by the substrate, then the cooling working medium flows into the heat exchange micro-channel from the heat exchange working medium inlet, flows through the concave cavities and the water-drop type rib columns, absorbs the heat conducted to the radiator, and finally flows out of the heat exchange micro-channel from the heat exchange working medium outlet, so that the heat of electronic devices is timely taken away, and the reliability and service life of the electronic devices are improved.

Description

Technical Field

[0001] This invention belongs to the field of microchannel heat sinks, specifically relating to a microchannel heat sink that combines a circular concave cavity and teardrop-shaped ribs. Background Technology

[0002] With the rapid development of microelectronics technology, electronic devices are evolving towards miniaturization with high power, high performance, and high temperature. Traditional forced air convection heat transfer has reached its thermal limit; therefore, developing an effective method for cooling high-throughput devices is a challenge. The operating temperature limit of electronic devices is generally between 86 and 100°C. Literature shows that for every 1°C above the limit temperature, chip reliability decreases by 6%, and lifespan is significantly reduced. Therefore, if the high heat generated by electronic components cannot be eliminated in time, it will pose a significant threat to chip reliability and lifespan. Thus, it is necessary to research and develop an effective cooling technology to meet the high heat demands of electronic components. Some early researchers analyzed the influence of fluid flow properties and heat transfer performance within simple microchannel structures. Due to the dramatic increase in heat flux density of microdevices, simple microchannel heat exchangers can no longer meet heat dissipation requirements, leading to the emergence of complex microchannel heat exchangers. However, the structure and layout of complex microchannels are limited by computational methods and manufacturing processes. With the emergence and rapid development of technologies such as MEMS, novel and complex microchannel structures have begun to appear one after another. By changing the cross-sectional shape, layout and size of the microchannel, and arranging turbulence elements such as ribs and circular cavities in the channel, many macroscopic heat exchanger concepts can be miniaturized. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art, adapt to practical needs, and provide a microchannel radiator that combines a circular concave cavity and teardrop-shaped ribs to improve the heat transfer performance of the microchannel heat exchanger.

[0004] To achieve the objectives of this invention, the technical solution adopted is as follows:

[0005] This invention discloses a microchannel heat sink combining a circular cavity and teardrop-shaped ribs, comprising a heat sink substrate, the heat sink substrate including a solid wall, flow channels, teardrop-shaped ribs and a circular cavity, the flow channels penetrating the interior of the heat sink substrate, the two sides of the flow channels being the working fluid inlet and the working fluid outlet respectively, and the lower part of the heat sink substrate being the surface for bonding electronic components.

[0006] The flow channel is formed by the gap between two solid walls. A circular cavity is set at equal intervals in the flow channel. A teardrop-shaped rib is provided at the center of the circular cavity. The teardrop-shaped rib is smooth near the working medium inlet and sharp near the working medium outlet.

[0007] The circular cavities of the two adjacent flow channels are arranged in an alternating pattern.

[0008] The teardrop-shaped ribs can be either symmetrical or irregular in shape; the teardrop-shaped ribs with irregular shapes have hooks pointing in opposite directions to adjacent irregular teardrop-shaped ribs.

[0009] The beneficial effects of this invention are as follows:

[0010] This invention significantly improves the heat transfer performance of microchannel heat exchangers by arranging circular cavities and ribs and other turbulence structures within the microchannels, thereby enhancing the reliability and lifespan of electronic devices. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of the present invention;

[0012] Figure 2 This is a cross-sectional view of the internal structure of the present invention;

[0013] Figure 3 This is a three-dimensional cross-sectional view of the internal structure of the present invention;

[0014] Figure 4 This is a partially enlarged view of the internal structure of the present invention.

[0015] Figure 5 This is a diagram of another irregular structure of the teardrop-shaped rib column of the present invention.

[0016] In the diagram: 1. Heat sink substrate, 2. Solid wall, 3. Flow channel, 4. Teardrop-shaped rib, 5. Circular cavity, 6. Working fluid inlet, 7. Working fluid outlet, 8. Electronic component bonding surface. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0018] See Figure 1-5 .

[0019] This invention discloses a microchannel heat exchanger combining a circular cavity and teardrop-shaped ribs, comprising a heat exchanger substrate 1. The heat exchanger substrate 1 includes a solid wall 2, a flow channel 3, teardrop-shaped ribs 4, and a circular cavity 5. The flow channel 3 extends through the interior of the heat exchanger substrate 1. The two sides through the flow channel 1 are a working fluid inlet 6 and a working fluid outlet 7, respectively. The lower part of the heat exchanger substrate 1 is an electronic component bonding surface 8. This invention can significantly improve the heat transfer performance of the microchannel heat exchanger by arranging turbulence structures such as circular cavities and ribs in the microchannel.

[0020] The flow channel 3 is formed by the gap between two solid walls 2. A circular cavity 5 is set at equal intervals in the flow channel 3. A teardrop-shaped rib 4 is provided at the center of the circular cavity 5. The teardrop-shaped rib 4 is smooth at the end near the working fluid inlet 6 and sharp at the end near the working fluid outlet 7. The presence of the teardrop-shaped rib 4 at the center of the flow channel 3 periodically disrupts the thermal boundary layer, causing the thermal boundary to continuously appear during the redevelopment process. Due to the presence of the teardrop-shaped rib 4, the flow is changed to two branches, increasing the heat transfer area and significantly improving the local thermal performance. The teardrop-shaped rib 4 is a special design. Its streamlined surface provides a channel with low resistance for fluid flow, which helps to reduce pressure loss and also reduces the friction coefficient.

[0021] The circular cavities 5 of the two adjacent flow channels 3 are arranged in an alternating manner. This alternating arrangement of the circular cavities 5 allows for more flow channels to be created within the same size, saving a significant amount of space and removing more heat, thereby improving the heat transfer performance of the microchannel heat exchanger.

[0022] The teardrop-shaped rib 4 can be either symmetrical or irregular in shape; the teardrop-shaped rib 4 adopts an irregular shape, and the hook tips of adjacent irregular teardrop-shaped rib 4 face opposite directions.

[0023] Working principle:

[0024] The other side of the heat sink substrate is in contact with the heat dissipation surface of the electronic device. The heat from the electronic device is conducted to the heat sink through the substrate. Then, the cooling medium flows into the heat exchange microchannel from the heat exchange medium inlet, passing through the circular cavity and the teardrop-shaped fins. Due to the expansion of the circular cavity in the channel flow, the flow pressure decreases, which leads to the separation between the fluid and the cavity wall. Recirculation occurs in the cavity, which makes the cold fluid in the cavity mix with the hot wall. The teardrop-shaped fins divide the fluid into two branches, promote flow separation, and form an extended wake region, resulting in sufficient mixing of the fluid. The sufficient mixing of the fluid significantly improves the heat transfer coefficient, fully absorbs the heat conducted to the heat sink, and finally flows out of the heat exchange microchannel from the heat exchange medium outlet.

[0025] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A microchannel heat sink combining a circular concave cavity and teardrop-shaped ribs, comprising a heat sink substrate (1), characterized in that: The heat sink substrate (1) includes a solid wall (2), a flow channel (3), a teardrop-shaped rib (4), and a circular cavity (5). The flow channel (3) penetrates the interior of the heat sink substrate (1). The two sides of the heat sink substrate (1) are the working fluid inlet (6) and the working fluid outlet (7), respectively. The lower part of the heat sink substrate (1) is the electronic component bonding surface (8). The flow channel (3) is formed by the gap between the two solid walls (2). A circular cavity (5) is provided at equal intervals in the flow channel (3). A teardrop-shaped rib (4) is provided at the center of the circular cavity (5). The teardrop-shaped rib (4) is rounded near the working fluid inlet (6) and sharp near the working fluid outlet (7). The teardrop-shaped rib (4) adopts an irregular structure. The hook tips of adjacent irregular teardrop-shaped ribs (4) face opposite directions. The circular cavities (5) formed in adjacent flow channels (3) are arranged in an alternating manner.

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