Substrate processing system

Abstract

The present invention provides a substrate processing system. Multiple processing chambers are arranged side by side, each capable of performing substrate processing. Multiple power supply system units are disposed below the multiple processing chambers, capable of independently supplying power to each processing chamber. The present invention can reduce the installation area.

Description

Technical Field

[0001] The present invention relates to a substrate processing system. Background Art

[0002] Patent document 1 discloses a technology in which, in a semiconductor manufacturing plant, a plurality of processing chambers and a transport block for transporting substrates to each processing chamber, as well as a plurality of power supply system units for supplying power to each processing chamber, are arranged on different floors.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-695664 Summary of the Invention

[0006] Technical problem to be solved by the invention

[0007] The present invention provides a technology capable of reducing the installation area.

[0008] Technical solutions to technical problems

[0009] A substrate processing system according to one embodiment of the present invention includes multiple processing chambers and multiple power supply units. The multiple processing chambers are arranged side by side and can each perform substrate processing. The multiple power supply units are respectively arranged below the multiple processing chambers and can independently supply power to each processing chamber.

[0010] Effects of the Invention

[0011] According to the present invention, the installation area can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective view showing an example of the schematic configuration of the substrate processing system according to the first embodiment.

[0013] Figure 2 It is a plan view showing an example of the schematic configuration of the substrate processing system according to the first embodiment.

[0014] Figure 3 It is a side view showing an example of the schematic configuration of the substrate processing system according to the first embodiment.

[0015] Figure 4 This is a diagram showing an example in which a plurality of substrate processing systems according to the first embodiment are arranged.

[0016] Figure 5 This is a diagram showing an example of a schematic configuration of a power distribution box in the substrate processing system according to the first embodiment.

[0017] Figure 6 This is a diagram showing a state in which the guide rails and the frame are folded in the substrate processing system according to the first embodiment.

[0018] Figure 7 This is a diagram showing a state when the guide rails and the frame are being maintained in the substrate processing system according to the first embodiment.

[0019] Figure 8 This is a diagram showing an example of a unit for moving the substrate processing system according to the first embodiment.

[0020] Figure 9 This is a diagram showing an example in which a plurality of substrate processing systems according to the first embodiment are arranged.

[0021] Figure 10 It is a side view showing an example of the schematic configuration of the substrate processing system according to the second embodiment.

[0022] Description of Reference Numerals

[0023] 10. Substrate handling system

[0024] 11 Processing Blocks

[0025] 12 Vacuum conveying block

[0026] 13 Load lock block

[0027] 14 Atmospheric pressure conveying block

[0028] 20 Gas Box

[0029] 21 Electrical Unit

[0030] 30 pedestal

[0031] 31 Pillars

[0032] 32 Top Plate

[0033] 40 distribution box

[0034] 41 Generator

[0035] 50 guide rails

[0036] 51 Framework

[0037] 52 Pillars

[0038] 55 guide rail

[0039] 56 Frame

[0040] 57 Pillars

[0041] 60 Crane

[0042] 61 Hook

[0043] 62 cables

[0044] 63 Winch

[0045] 70 Circuit Breaker

[0046] 71 Connectors

[0047] 72 power cord. DETAILED DESCRIPTION

[0048] Hereinafter, referring to the accompanying drawings, an embodiment of the substrate processing system disclosed in the present invention will be described in detail. In addition, the disclosed substrate processing system is not limited to this embodiment.

[0049] In recent years, the number of processing chambers in substrate processing systems has increased, and the units mounted in these processing chambers have correspondingly become larger, resulting in an increase in installation area. For example, in Patent Document 1, the processing chambers, the transport block, and the power supply system unit are located on different floors. The increase in the number of processing chambers and the size of the power supply system unit have increased the installation area. In manufacturing plants, the area available for installing substrate processing systems is limited, and in order to accommodate more substrate processing systems, it is necessary to reduce the installation area.

[0050] (First embodiment)

[0051] [Structure of substrate processing system]

[0052] Next, an example of a schematic configuration of the substrate processing system according to the first embodiment will be described. Figure 1 It is a perspective view showing an example of the schematic configuration of the substrate processing system 10 according to the first embodiment. Figure 2 It is a plan view showing an example of a schematic configuration of the substrate processing system 10 according to the first embodiment. Figure 3 1 is a side view showing an example of the schematic structure of the substrate processing system 10 of the first embodiment. The substrate processing system 10 is a device for performing substrate processing on a substrate. In the following, in order to clarify the positional relationship, the X direction, Y direction and Z direction orthogonal to each other are defined as follows. Figure 1 As shown, the X direction and the Y direction are two horizontal directions perpendicular to each other, and the Z direction is a vertically upward direction. Figure 3 This is a side view of the substrate processing system 10 as viewed from the X direction, and guide rails and a frame to be described later are omitted.

[0053] like Figure 1 As shown in the figure, the substrate processing system 10 includes a plurality of processing blocks 11. In addition, the number of processing blocks 11 included in the substrate processing system 10 is not limited to the number shown in the figure.

[0054] The plurality of processing blocks 11 are arranged side by side. In this embodiment, the plurality of processing blocks 11 are arranged side by side in two rows in a straight line in the X direction.

[0055] The processing block 11 is an apparatus for performing substrate processing on a substrate. Examples of substrate processing include film formation using plasma and etching. The substrate is a semiconductor wafer (hereinafter also referred to as a wafer).

[0056] The processing block 11 includes a vacuum processing chamber, such as a vacuum chamber, and performs substrate processing on wafers placed in the vacuum processing chamber. The processing block 11 maintains a reduced-pressure atmosphere within the vacuum processing chamber during wafer processing. Furthermore, the same type of substrate processing can be performed in each processing block 11 of the substrate processing system 10. Furthermore, different types of substrate processing can be performed in some processing blocks 11 of the substrate processing system 10 compared to other processing blocks 11. For example, the substrate processing system 10 can perform multiple types of substrate processing distributed across the processing blocks 11.

[0057] The vacuum transport block 12 is disposed between two rows of processing blocks 11. Figure 2 As shown, the vacuum transfer block 12 is formed in a long, flat rectangular shape and contains a vacuum transfer chamber. The vacuum transfer block 12 maintains a reduced pressure atmosphere within the vacuum transfer chamber while wafers are being processed. Vacuum transfer block 12 has transfer ports for transferring wafers to each processing block 11 on the side facing each processing block 11. These ports communicate with the vacuum processing chambers of each processing block 11. Each transfer port of the vacuum transfer block 12 is equipped with a gate valve (not shown) that opens and closes the port.

[0058] Two load lock blocks 13 are connected to one end of the vacuum transfer block 12 in the X direction via gate valves (not shown). The two load lock blocks 13 are connected to the atmospheric pressure transfer block 14 via gate valves (not shown).

[0059] An atmospheric pressure transfer block 14 is located on the opposite side of the vacuum transfer block 12, across from the load lock block 13. The atmospheric pressure transfer block 14 is formed into a generally rectangular shape when viewed from above. The interior of the atmospheric pressure transfer block 14 is maintained at atmospheric pressure. Two load lock blocks 13 are arranged side by side along one long side of the atmospheric pressure transfer block 14. Furthermore, a wafer carrier can be mounted on the wall of the atmospheric pressure transfer block 14 opposite the wall where the load lock block 13 is located.

[0060] The atmospheric pressure transfer block 14 has a transfer mechanism such as an arm disposed therein, and the transfer mechanism can transfer wafers between the load lock block 13 and the carrier.

[0061] When the wafer is transferred between the vacuum transfer block 12 and the atmospheric pressure transfer block 14 , the load lock block 13 controls the pressure between atmospheric pressure and vacuum.

[0062] The vacuum transfer block 12 has a transfer mechanism such as an arm disposed in a vacuum transfer chamber, and wafers can be transferred between the processing block 11 and the load lock block 13 using the transfer mechanism.

[0063] Processing block 11 performs substrate processing on wafers. For example, processing block 11 is configured as a parallel plate plasma processing apparatus with an upper electrode and a lower electrode disposed within a vacuum processing chamber. A gas box 20 for supplying processing gas to the vacuum processing chamber and an electrical unit 21 are located above processing block 11. Electrical unit 21 houses various devices, including those controlling the electrical components of processing block 11.

[0064] The substrate processing system 10 is required to have a small installation area.

[0065] Therefore, in the first embodiment, a power supply system unit for supplying power to the processing block 11 is arranged at the lower part of the processing block 11. For example, a pedestal 30 for raising the configuration surface is provided on the ground where the substrate processing system 10 is provided. For example, the configuration surface is raised by about 50 cm to 70 cm by the pedestal 30. The pedestal 30 is supported by a plurality of pillars 31 on a top plate 32 and is configured to have a load capacity sufficient for the weight of the processing block 11 and the like. Each processing block 11 is arranged on the pedestal 30. By raising the configuration surface by the pedestal 30, space can be ensured at the lower part of the pedestal 30. The pedestal 30 is configured so that the top plate 32 extends on the front side opposite to the vacuum transfer block 12 relative to the processing block 11. The top plate 32 is provided to be detachable.

[0066] The substrate processing system 10 has a power supply unit located in the space below the pedestal 30. Each processing block 11 in the substrate processing system 10 includes a power distribution box 40 and a generator 41 as the power supply unit. The power distribution box 40 is located below the ceiling 32, which forms the lower portion of the processing block 11. To supply high-frequency power of different frequencies to the lower electrodes, two generators 41 are provided in each processing block 11 and are located below the ceiling 32 at the front of the processing block 11.

[0067] As described above, in the substrate processing system 10, the installation area can be reduced by arranging the power supply system unit for supplying power to the processing block 11 below the processing block 11. Since the installation area can be reduced in this manner, even when multiple substrate processing systems 10 are installed, they can be installed in a small area. Figure 4 FIG. 1 is a diagram showing an example in which a plurality of substrate processing systems 10 according to the first embodiment are arranged. Figure 41 shows an example of arranging two substrate processing systems 10 side by side and adjacent to each other. Even when a plurality of substrate processing systems 10 are arranged, they can be arranged adjacent to each other and can be arranged in a small area.

[0068] Power lines supplied with electric power are connected to the distribution box 40. Conventionally, the distribution box 40 is separated from other units such as the processing block 11, and a wiring area for arranging power lines is provided on the upper portion, and the power lines are arranged from the upper portion.

[0069] However, in the substrate processing system 10 of the first embodiment, since the power distribution box 40 is disposed at the bottom of the processing block 11 , it is not possible to dispose power lines from the top.

[0070] Therefore, in the substrate processing system 10 of the first embodiment, the power distribution box 40 is configured so that the power lines can be arranged from the side.

[0071] Figure 5 This figure shows an example of the schematic configuration of the power distribution box 40 of the substrate processing system 10 according to the first embodiment. A circuit breaker 70 is provided in the power distribution box 40. The circuit breaker 70 is provided with an operating unit for controlling the power supply, such as a switch capable of cutting off the power.

[0072] Since the circuit breaker 70 is provided with an operating unit such as a switch, it is preferably arranged in the upper portion of the distribution box 40. The circuit breaker 70 is provided with a connector 71 for connecting a power cord. The connector 71 is formed of, for example, a conductive metal such as copper. The connector 71 may also be plated with nickel or the like. The connector 71 has a shape that is curved toward the side surface on the side where the vacuum transfer block 12 is arranged. The power cord 72 is arranged in the upper portion of the distribution box 40 from the side surface on the side where the vacuum transfer block 12 is arranged and is connected to the connector 71. Thus, in the substrate processing system 10 of the first embodiment, the power cord 72 can be arranged from the side surface on the side where the vacuum transfer block 12 is arranged and connected to the connector 71, so that the circuit breaker 70 can be arranged in the upper portion of the distribution box 40.

[0073] return Figure 1 The distribution box 40 converts the power supplied from the power line 72 into various voltages used in the processing block 11 and distributes the power to the processing block 11. For example, the distribution box 40 distributes the power to the electrical unit 21 and the generator 41. Alternatively, other power distribution systems may be used to supply power to the electrical unit 21.

[0074] The generator 41 is connected to the lower electrode of the vacuum processing chamber via wiring (not shown). When plasma is generated in the vacuum processing chamber, the generator 41 supplies high-frequency power to the lower electrode.

[0075] In the processing block 11 , while supplying processing gas from the gas box 20 to the vacuum processing chamber, two generators 41 apply high-frequency power of different frequencies to the lower electrode to generate plasma, thereby performing substrate processing on the wafer using the plasma.

[0076] In addition, on the top plate 32 on the front side of the processing block 11, a storage box 42 is arranged side by side for each processing block 11. Devices related to the processing block 11 are arranged inside the storage box 42. For example, when the temperature of the wafer is adjusted in the processing block 11, a temperature adjustment unit is arranged inside the storage box 42. In addition, the storage box 42 can also be empty, with nothing arranged inside. The storage box 42 has a flat upper surface and is constructed to have a load capacity of several hundred kilograms on which a person can stand. With respect to the substrate processing system 10, a person can move along each processing block 11 by standing on the upper surface of the storage box 42 arranged on the pedestal 30 and moving.

[0077] In the substrate processing system 10, various units provided for each processing block 11 are becoming larger and heavier. In the substrate processing system 10, the possibility of disassembling large and heavy units during maintenance is also increasing. In addition, since many substrate processing systems 10 are arranged in a manufacturing plant, it is difficult to occupy a wide space during maintenance work. For example, Figure 4 As shown, when two substrate processing systems 10 are arranged side by side adjacent to each other, there is no space between the substrate processing systems 10 .

[0078] Therefore, in the substrate processing system 10, a guide rail 50 is provided along each processing block 11 at the upper front portion of the processing block 11, on the opposite side of the vacuum transfer block 12. The guide rail 50 is supported by a frame 51. The frame 51 is arranged along each processing block 11 at a height approximately the same as that of the guide rail 50 and is supported by a plurality of pillars 52.

[0079] In the substrate processing system 10, a guide rail 55 and a frame 56 are also provided on the other end of the vacuum transfer block 12 in the X direction, where the load lock block 13 is not located. The end of the guide rail 55 is bent and connected to the guide rail 50. The frame 56 is connected to the frame 51 and supported by a plurality of pillars 57.

[0080] The guide rail 55 and frame 56 protrude outward from the end of the processing block 11 at their other ends in the X direction, potentially obstructing the movement of items. Therefore, the support 57 is removable. Alternatively, the guide rail 55 and frame 56 can be configured so that the connection to the guide rail 50 and frame 51 is rotatable and can be rotated downward to fold. Figure 6 This is a diagram showing a state in which the guide rails 55 and the frame 56 are folded in the substrate processing system 10 according to the first embodiment. Figure 71 is a diagram showing a state in which the guide rail 55 and the frame 56 are maintained in the substrate processing system 10 of the first embodiment. Figure 6 As shown in FIG, the guide rail 55 and the frame 56 are folded up. This prevents the guide rail 55 and the frame 56 from causing obstructions when the items are moved. Figure 7 As shown, the guide rail 55 and the frame 56 are rotated to a horizontal state, and the support column 57 is provided.

[0081] Guide rails 50 and 55 are provided with a suspension mechanism. For example, a crane 60 serving as the suspension mechanism is detachably attached to guide rails 50 and 55. Crane 60 is movable along guide rails 50 and 55. Crane 60 is equipped with a winch 63 that winds a cable 62. The distal end of cable 62 is fixed to hook 61. Crane 60 can raise and lower hook 61 by rotating winch 63. Winch 63 can be electrically or manually rotated.

[0082] In the substrate processing system 10, during maintenance, the hook 61 of the crane 60 is fixed to the unit to be maintained, and the winch 63 is rotated to raise the unit to be maintained. The crane 60 is then moved along the guide rails 50 and 55. This allows the substrate processing system 10 to easily move large and heavy units.

[0083] Figure 8 1 is a diagram showing an example of a unit for moving the substrate processing system 10 according to the first embodiment. Figure 8 The figure shows the situation where the generator 41 is taken out for maintenance. The crane 60 can move along the guide rails 50 and 55. First, the storage box 42 and the top plate 32 on the upper part of the generator 41 to be maintained are removed. Next, the hook 61 of the crane 60 is fixed to the generator 41 to be maintained, and the winch 63 is rotated to raise the generator 41. Then, the crane 60 is moved along the guide rails 50 and 55, and the winch 63 is rotated at an appropriate position to lower the hook 61, thereby lowering the generator 41. Figure 8 In the example shown in FIG. 1 , the generator 41 to be maintained is moved toward the other end in the X direction. As described above, the substrate processing system 10 can easily move the generator 41 to be maintained. Furthermore, since the substrate processing system 10 can move the generator 41 to be maintained to a wider space, maintenance work can be easily performed.

[0084] In addition, Figure 1 、 Figure 2 and Figure 8In the figure, the guide rail 50 is provided along each processing block 11 on the front side opposite to the vacuum transfer block 12 relative to the processing block 11, but the present invention is not limited thereto. The guide rail may also be provided at other locations. For example, the guide rail may be provided on the upper portion of the vacuum transfer block 12 and the upper portion of the atmospheric pressure transfer block 14. The guide rail may also be provided as needed for maintenance, etc. In this case, the substrate processing system 10 may also be provided as follows. Figure 8 As shown by the dashed arrows, the crane 60 is moved above the vacuum transfer block 12 and above the atmospheric pressure transfer block 14. This facilitates the movement of units surrounding the vacuum transfer block 12 and the atmospheric pressure transfer block 14. Furthermore, when multiple substrate processing systems 10 are deployed, the guide rails 55 of each of the systems can be connected. For example, a branch mechanism is provided at the connection between the guide rail 55 and the guide rail 50, enabling the connection to be switched between the guide rail 50 and another guide rail 55, thereby connecting the guide rails 55 to each other. Figure 9 FIG. 1 is a diagram showing an example in which a plurality of substrate processing systems 10 according to the first embodiment are arranged. Figure 9 The example in which two substrate processing systems 10 are arranged side by side and adjacent to each other and their guide rails 55 are connected together is shown. Figure 8 In FIG, the solid arrows indicate the movable range of the crane 60. The crane 60 can move between substrate processing systems 10 via the guide rails 55. Therefore, for example, when a wide work space 90 exists around one substrate processing system 10, units of another substrate processing system 10 can be moved into the space 90.

[0085] As described above, the substrate processing system 10 of this embodiment includes multiple processing blocks 11 and multiple power supply system units. Each processing block 11 is capable of performing substrate processing and is arranged side by side. The multiple power supply system units are disposed below each of the processing blocks 11 and are capable of supplying power to each processing block 11. This allows the substrate processing system 10 to minimize its installation footprint.

[0086] A pedestal 30 is provided between the plurality of processing blocks 11 and the ground. A plurality of power supply system units are arranged below the pedestal 30. Thus, in the substrate processing system 10, the processing blocks 11 and the power supply system can be arranged in a single overlapping arrangement via the pedestal 30, thereby reducing the installation area.

[0087] In addition, the substrate processing system 10 of the present embodiment has a vacuum transfer block 12. The vacuum transfer block 12 is arranged on the side of one side of the multiple processing blocks 11, and transports the wafers to the multiple processing blocks 11. In the pedestal 30, the top plate 32 is arranged to extend to the opposite side of one side of the multiple processing blocks 11, that is, the front side, and the top plate 32 on the front side of the processing block 11 is set to be detachable. The substrate processing system 10 includes a distribution box 40 and a generator 41 as a power system unit. The distribution box 40 is arranged at the lower part of the processing block 11. The generator 41 is arranged under the top plate 32 on the front side of the processing block 11. Therefore, in the substrate processing system 10, the processing block 11 and the distribution box 40 can be arranged to overlap, so that the installation area can be suppressed. Furthermore, in the substrate processing system 10 , by arranging the generator 41 under the detachable top plate 32 , space can be secured on the top plate 32 , and the generator 41 arranged under the top plate 32 can be maintained by removing the top plate 32 .

[0088] Furthermore, the substrate processing system 10 of this embodiment includes a guide rail 50 and a crane 60. The guide rail 50 is provided along the upper portion of the front side of the processing block 11. The crane 60 is mounted on the guide rail 50 and is configured to suspend the generator 41 so that it can be raised and lowered and to be movable along the guide rail 50. This allows the substrate processing system 10 to easily move the generator 41.

[0089] Furthermore, the substrate processing system 10 of this embodiment includes a vacuum transfer block 12. The vacuum transfer block 12 is disposed on the side of one side of the plurality of processing blocks 11, and transports wafers between the plurality of processing blocks 11. A power distribution box 40 is disposed adjacent to the lower portion of the processing block 11. A circuit breaker 70 having a connector 71 that is bent toward one side and is connected to a power supply line 72 is provided on the upper portion of the power distribution box 40. This connector 71 is curved toward the side of one side and is connected to a power supply line 72. Thus, in the substrate processing system 10, even when the power distribution box 40 is disposed adjacent to the lower portion of the processing block 11, the circuit breaker 70 can be disposed in the upper portion of the power distribution box 40.

[0090] (Second embodiment)

[0091] Next, an example of the schematic structure of the substrate processing system 10 of the second embodiment will be described. Figure 1-9 Since the substrate processing system 10 of the first embodiment shown has a part of the same configuration, the same reference numerals are given to the same parts and their description is omitted, and the description will focus on the different parts.

[0092] Figure 10This is a side view showing an example of the schematic structure of the substrate processing system 10 according to the second embodiment. In the substrate processing system 10 according to the second embodiment, the power supply system unit that supplies power to the processing block 11 is also arranged below the processing block 11. For example, the generator 41 is arranged on the floor where the substrate processing system 10 is installed, and the processing block 11 is arranged above the generator 41. That is, the generator 41 is arranged adjacent to the lower portion of the processing block 11. The generator 41 can be arranged adjacent to the lower portion of the processing block 11 while being stored in a storage box, etc. The distribution box 40 can be arranged in front of the processing block 11 or separately from the processing block 11. Alternatively, the distribution box 40 can be arranged on a different floor than the processing block 11 and the generator 41. For example, the distribution box 40 can be arranged on the floor below the surface where the processing block 11 and the generator 41 are arranged. Alternatively, the distribution box 40 can be arranged below the processing block 11. Furthermore, the distribution box 40 and the generator 41 may be placed on a different floor from the processing block 11. For example, the distribution box 40 and the generator 41 may be placed on the floor below the surface where the processing block 11 is placed.

[0093] As described above, the substrate processing system 10 can reduce the installation area by arranging the power supply system unit for supplying power to the processing block 11 at the lower portion of the processing block 11 .

[0094] When the processing block 11 is placed on the ground-mounted generator 41, the height of the substrate processing system 10 increases. In a manufacturing facility, the height at which the substrate processing system 10 can be installed is limited. Therefore, it is preferable to keep the height of the substrate processing system 10 below a certain level. For example, the substrate processing system 10 is preferably configured such that the lower surface of the vacuum transfer block 12 is below 180 cm from the ground, and more preferably, the lower surface of the vacuum transfer block 12 is below 170 cm from the ground. This allows the height of the substrate processing system 10 to be reduced.

[0095] While the embodiments have been described above, it should be understood that the embodiments disclosed herein are illustrative in all respects and are not restrictive. In practice, the embodiments described above can be implemented in a variety of ways. Furthermore, the embodiments described above can be omitted, replaced, or modified in various ways without departing from the scope and spirit of the claims.

[0096] For example, in the first embodiment, the storage box 42 is arranged on the top plate 32. However, the present invention is not limited thereto. The storage box 42 may not be provided.

[0097] For example, in the embodiments, a semiconductor wafer is used as a substrate, but the present invention is not limited to this. The semiconductor wafer is silicon, but may also be a compound semiconductor such as GaAs, SiC, or GaN. Furthermore, the substrate is not limited to a semiconductor wafer and may also be applied to glass substrates and ceramic substrates used in FPDs (flat panel displays) such as liquid crystal displays.

Claims

1. A substrate processing system, characterized in that: The substrate processing system is arranged on the ground and includes: substrate conveying block; a support platform comprising a top plate spaced apart from the ground; a plurality of substrate processing blocks disposed on the top plate and connected to the substrate conveying block along a side surface of the substrate conveying block; and A plurality of power supply system units are disposed under the top plate and correspond to the plurality of substrate processing blocks, respectively, each power supply system unit being configured to supply power to the corresponding substrate processing block. The top plate includes a first portion disposed below the plurality of substrate processing blocks and a second portion extending outward from the first portion. The power supply system unit has a power control device and a generator, The power control device is arranged below the first portion of the top plate, The generator is arranged below the second portion of the top plate, The substrate processing system further comprises: a guide rail disposed above the second portion of the top plate and extending along an arrangement direction of the plurality of substrate processing blocks; and The suspension mechanism is configured to be able to suspend any one of the generators on the guide rail and to transport the suspended generator along the guide rail.

2. The substrate processing system according to claim 1, wherein: Each of the power system units includes a circuit breaker and a power line arranged on an upper portion of the power system unit, and a bent connector connecting the circuit breaker and the power line.

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