Surface mount device platform and assembly

Abstract

The invention relates to surface mount device platforms and assemblies. A surface mount device platform includes a surface mount region, a connection region, and a bendable region between the surface mount region and the connection region, each region including a respective portion of a base substrate. The base substrate includes a conductive layer interspersed with an electrically insulating build-up. Each of the surface mount region, the connection region, and the bendable region spans between a bottom substrate surface and a top substrate surface of the base substrate. The surface mount region further includes an electrically insulating first top rigid layer, and device bond pads exposed on a top surface of the first top rigid layer facing away from the top substrate surface in the surface mount region. The connection region further includes an electrically insulating second top rigid layer and a plurality of connector bond pads, each connector bond pad exposed on a top surface of the second top rigid layer facing away from the top substrate surface in the connection region and electrically connected to a respective device bond pad via at least one of the conductive layers.

Description

Technical Field

[0001] The present invention relates to a surface mount device platform and a surface mount device assembly including the same. Background Technology

[0002] An endoscope is a medical diagnostic instrument used to visualize cavities inside a patient's body. A flexible imaging endoscope includes a flexible shaft that can be inserted into the patient's body through the ventricular orifice. The shaft has a tip that includes a light source and a camera for illuminating a portion of the patient (e.g., a body cavity or organ) and capturing an image of that portion.

[0003] Figure 1 This is a schematic cross-sectional view of a chamber 190 having a lesion 192 imaged by an endoscope 110. The lesion 192 is located on the side wall 191 of the chamber. The chamber 190 is... Figure 1 The endoscope 110 has a chamber diameter of 190D in its cross-section and is, for example, part of the esophagus or intestine. The endoscope 110 has an axial width of 112. To enable perpendicular imaging of the chamber sidewalls 191, the endoscope 110 must be bent at its apex, thus its width within the chamber 190 is 114, which exceeds the width 112. The width 114, which is partly dependent on the axial width 112, sets a lower limit on the chamber diameter 190D of the chamber 190 into which the endoscope 110 can safely image or even enter.

[0004] Endoscopic endoscope 110 includes a camera 130 electrically connected to multiple wires 124. The cost, yield, and robustness of endoscopic endoscope 110 are partly determined by how the camera 130 is electrically connected to the wires 124. Summary of the Invention

[0005] The present invention provides a surface mount device platform and a surface mount device assembly including the same.

[0006] In one aspect, a surface mount device platform is provided. The surface mount device platform includes a surface mount region, a connection region, and a flexible region between the surface mount region and the connection region, each of the surface mount region, the connection region, and the flexible region including a corresponding portion of a substrate. The substrate includes multiple conductive layers with multiple electrically insulating build-up layers (or construction layers) distributed thereon. Each of the surface mount region, the connection region, and the flexible region spans between a bottom substrate surface and a top substrate surface of the substrate. The surface mount region also includes (i) an electrically insulating first top rigid layer and (ii) multiple device bonding pads exposed on the top surface of the first top rigid layer in the surface mount region, facing away from the top substrate surface. The connection region also includes (i) an electrically insulating second top rigid layer and (ii) multiple connector bonding pads on the top substrate surface, each of the multiple connector bonding pads (a) exposed on the top surface of the second top rigid layer in the connection region, facing away from the top substrate surface, and (b) electrically connected via at least one of the multiple conductive layers to a corresponding one of the multiple device bonding pads.

[0007] In one embodiment, the surface mount region further includes a first patterned conductive layer between the top substrate surface and the plurality of device bonding pads, and electrically connects each of the plurality of device bonding pads to one of the plurality of conductive layers.

[0008] In one embodiment, the connection region further includes a second patterned conductive layer between the surface of the top substrate and the plurality of connector bonding pads, and electrically connects each of the plurality of connector bonding pads to one of the plurality of conductive layers.

[0009] In one embodiment, the surface mounting region further includes an electrically insulating first bottom rigid layer, each of the bottom substrate surface and the top substrate surface being located between the first bottom rigid layer and the first top rigid layer; and the connection region further includes an electrically insulating second bottom rigid layer, each of the bottom substrate surface and the top substrate surface being located between the second bottom rigid layer and the second top rigid layer.

[0010] In one embodiment, the distance between any two adjacent device bonding pads in the plurality of device bonding pads is between 75 micrometers and 350 micrometers; and the distance between any two adjacent connector bonding pads in the plurality of connector bonding pads is between 75 micrometers and 350 micrometers.

[0011] In one embodiment, on the top surface of the first top rigid layer, the minimum distance between any of the plurality of device bonding pads and the edge of the first top rigid layer is between 100 micrometers and 200 micrometers; and in the connection region, on the top surface of the second top rigid layer opposite to the top substrate surface, the minimum distance between any of the plurality of connector bonding pads and the edge of the second top rigid layer is between 100 micrometers and 200 micrometers.

[0012] In one embodiment, the multiple device bonding pads form a rectangular array, the length and width of which are both less than 0.6 mm.

[0013] In one embodiment, the thickness of each of the plurality of layers is between 20 micrometers and 40 micrometers.

[0014] In one embodiment, each of the plurality of connector bonding pads is a laser-welded pad.

[0015] In one embodiment, each of the plurality of layers, the first top rigid layer, and the second top rigid layer is formed of an epoxy molding compound.

[0016] In one embodiment, each of the first top rigid layer and the second top rigid layer has a higher flexural modulus than each of the plurality of layers.

[0017] In one embodiment, each of the plurality of layers is formed of a first epoxy molding compound having a first flexural modulus, and each of the first top rigid layer and the second top rigid layer is formed of a second epoxy molding compound having a flexural modulus exceeding the first flexural modulus.

[0018] In another aspect, a surface mount device assembly is provided. The surface mount device assembly includes the aforementioned surface mount device platform and surface mount device, wherein the ball grid array of the surface mount device includes a plurality of conductive elements, each of the plurality of conductive elements being electrically connected to a corresponding one of the plurality of device bonding pads.

[0019] In one embodiment, the surface-mount device includes a sensor electrically connected to each of the plurality of conductive elements.

[0020] In one embodiment, the sensor includes a photodetector.

[0021] In one embodiment, the sensor is an image sensor.

[0022] In one embodiment, the sensor includes one of a microphone, a vibration sensor, and a thermometer. Attached Figure Description

[0023] Figure 1 This is a schematic cross-sectional view of a chamber including a lesion imaged by an endoscope in one embodiment.

[0024] Figure 2 This is a cross-sectional view of a surface-mount device platform in one embodiment. Figure 3 This is its floor plan.

[0025] Figure 4 This is a cross-sectional view of a surface mount device platform in one embodiment. Figure 2 Examples of surface-mount devices.

[0026] Figure 5 One embodiment includes Figure 2 A cross-sectional view of the surface-mount device assembly of the platform.

[0027] Figure 6 This is an example of a bent configuration. Figure 5 A cross-sectional view of a surface-mount device assembly.

[0028] Figure 7 This is a plan view of a substrate surface mounting device in one embodiment. The substrate surface mounting device is... Figure 2 Example of a substrate.

[0029] Figure 8 This is a cross-sectional view of a surface-mount device platform in one embodiment. Figure 9 This is its floor plan.

[0030] Figure 10 This is a cross-sectional view of a surface mount device assembly, which is... Figure 5 An example of a surface-mount device assembly. Detailed Implementation

[0031] Figure 2 This is a cross-sectional view of the surface mount device platform 200. Figure 3 This is its floor plan. In the following description, Figure 2 and Figure 3 It's best to watch them together. Figure 2 and Figure 3 This includes a coordinate system 298 that defines orthogonal axes x, y, and z. Throughout this text, references to axes x, y, or z, or related directions ±x, ±y, or ±z, refer to coordinate system 298. Furthermore, in this text, the horizontal plane is parallel to the xy plane, width refers to the object's extension in the y-direction, and vertical refers to the z-direction. Figure 2 The cross-sectional view is located in a plane parallel to the xz plane. Figure 3 The planar graph lies in a plane parallel to the xy plane.

[0032] The surface mount device platform 200 includes a substrate 220, which includes (i) a plurality of conductive layers 224 having a plurality of electrically insulating stacked layers 226 distributed thereon, and (ii) a surface mount region 204, a connection region 208, and a flexible region 206 between the surface mount region 204 and the connection region 208, each region spanning between a bottom substrate surface 221 and a top substrate surface 229 of the substrate 220. In an embodiment, the substrate 220 is a coreless substrate, such as a coreless ball grid array (BGA) substrate.

[0033] The substrate 220 includes N layers 222, each layer 222 defined by a corresponding height range above the bottom substrate surface 221. A conductive layer 224 and a stacked layer 226 within a layer 222(k) are referred to as conductive layer 224(k) and stacked layer 226(k), respectively, where k is a positive integer less than or equal to M. For example, conductive layer 224 includes conductive layer 224(1), and stacked layer 226 includes stacked layer 226(2). Figure 2 In the accompanying drawings, reference numerals 224(1) and 226(2) represent portions of the conductive layer 224(1) and the laminate 226(2), respectively. For clarity, in... Figure 2 Not all conductive layers 224 and stacked layers 226 are marked.

[0034] Although Figure 3 In some embodiments, M equals seven, but the substrate 220 may include fewer or more than seven layers. In some embodiments, each layer 222 has a thickness between ten and twenty micrometers, which may correspond to the thickness of the stacked layer 226 and / or the conductive layer 224. The conductive layer 224, which is in the same plane as the stacked layer 226, may be thinner than the stacked layer 226. In some embodiments, one or more conductive layers 224 have a thickness between ten and twenty micrometers. In some embodiments, at least two layers 222 have the same thickness.

[0035] In this embodiment, within the flexible region 206, each of surfaces 221 and 229 has no exposed conductive areas, making them completely electrically insulated within the flexible region 206. Figure 2 The regions of the top substrate surface 229 within regions 204, 206, and 208 are designated as surface regions 229A, 229B, and 229C, respectively.

[0036] Surface mount region 204 includes a top rigid layer 270 and a plurality of device bonding pads 272 (1,2,…,N) on surface region 229A. The top rigid layer 270 has a top surface 271 facing away from surface region 229A. Each bonding pad 272 is exposed on the top surface 271. In an embodiment, each bonding pad 272 extends through the rigid layer 270 and is electrically connected to a corresponding conductive path of conductive layer 224. The top rigid layer 270 is formed of an electrical insulator, which in an embodiment has a higher flexural modulus than the electrical insulator constituting layer 226. Each device bonding pad 272 may be, for example, a solder-mask defined (SMD) pad when layer 270 is formed via an additive process, or a non-solder-mask defined (NSMD) pad when layer 270 is formed via a subtractive process.

[0037] The connection region 208 also includes a top rigid layer 275 and a plurality of connector bonding pads 277 (1,2,…,N) on surface region 229C. The top rigid layer 275 has a top surface 279 facing away from surface region 229C. Each connector bonding pad 277(k) is exposed on the top surface 279 and connected to a corresponding device bonding pad 272(k) via conductive layer 224, where k≤N and are positive integers. The top rigid layer 275 is formed of an electrical insulator having a higher flexural modulus than the electrical insulator constituting layer 226. In an embodiment, each connector bonding pad 277 is a laser-welded pad. Top rigid layers 270 and 275 may be formed of the same material.

[0038] The first conductive layer 224 and the second conductive layer 224 can be electrically connected via a third conductive layer 224 or vias located at least partially between the first conductive layer and the second conductive layer 224. Multiple conductive layers 224 can form conductive paths between each of multiple bonding pad pairs 272(k) and 277(k). Each patterned conductive layer 224 can include multiple coplanar conductive paths that are electrically insulated from each other, for example, through a stack 226 coplanar with the conductive layer 224.

[0039] In one embodiment, the surface mount region 204 includes a bottom rigid layer 210, and the connection region 208 includes a bottom rigid layer 215. In such an embodiment, a portion of the substrate 220 within the surface mount region 204 lies between layers 210 and 270, and a portion of the substrate 220 within the connection region 208 lies between layers 215 and 275. Each of the bottom rigid layers 210 and 215 is formed of an electrical insulator having a higher flexural modulus than the electrical insulator constituting the laminate 226.

[0040] In an embodiment, each of layers 226, 270, and 275 is formed of an epoxy molding compound. In an embodiment, rigid layers 210 and 215 are formed of the same material, and / or rigid layers 270 and 275 are formed of the same material. All rigid layers 210, 215, 270, and 275 may be formed of the same material. In an embodiment, each conductive layer 224 is formed of copper, and each laminate 226 is formed of one of a dielectric, a thermosetting resin, a thermoplastic polymer, an epoxy molding compound, and a silica-filled epoxy resin.

[0041] The spacing of the device bonding pads 272 can be limited to accommodate surface-mount devices, such as camera modules, with ball grid arrays having horizontal dimensions less than 600 μm × 600 μm. Therefore, in an embodiment, the bonding pads 272 form with dimensions L x ×L y A rectangular array, where L x and L y Each of them is less than or equal to 600 micrometers. Size L x and L y Each of these can correspond to the center-to-center distance between the bond pads 272 that are most separated in the x and y directions.

[0042] Adjacent device bonding pads 272 are separated by a distance 371, which can be between 75 micrometers and 350 micrometers. Adjacent connector bonding pads 277 are separated by a distance 373, which can be between 75 micrometers and 350 micrometers. In this embodiment, the minimum distance 372 between any device bonding pad 272 and the edge-top rigid layer 270 is between 100 micrometers and 200 micrometers. The aforementioned upper limits of distances 373 and 372 correspond to representative minimum distances in flexible printed circuit design rules.

[0043] In this embodiment, the minimum distance 376 between any connector bonding pad 277 and the edge-top rigid layer 275 is also between 100 micrometers and 200 micrometers. Regions 204, 206, and 208 have corresponding widths 204W, 206W, and 208W. Although Figure 3 Widths 204W, 206W, and 208W are shown as equal, but each of these widths may have a different corresponding width without departing from the scope of the embodiment. In an embodiment, width 204W may exceed at least one of widths 206W and 208W, for example, to accommodate surface mounting of multiple devices on surface mounting region 204. In an embodiment, the multiple devices include a sensor and at least one light-emitting diode.

[0044] In one embodiment, rigid layer 270 includes additional device bonding pads 273 that can be adapted to additional surface mount devices, such as one or more light-emitting diodes. In another embodiment, surface mount device platform 200 includes surface mount devices electrically connected to device bonding pads 272, and at least one additional surface mount device electrically connected to device bonding pads 273. When rigid layer 270 includes additional bonding pads 273, top rigid layer 275 may include additional connection bonding pads 278, each connection bonding pad 278 electrically connected to a corresponding device bonding pad 273.

[0045] Figure 4 This is a cross-sectional view of a surface mount device platform 400. The surface mount device platform 400 is an example of a surface mount device platform 200. The surface mount device platform 400 includes regions 404, 406, and 408, which are examples of regions 204, 206, and 208, respectively. The surface mount device platform 400 also includes top rigid layers 470 and 475, which are corresponding examples of rigid layers 270 and 275, and have corresponding top surfaces 474 and 479.

[0046] Surface mount region 404 includes N conductive elements 472 located between surface region 229A and bonding pads 272. Each conductive element 472 electrically connects a corresponding bonding pad 272 to conductive layer 224 via a conductive path through top rigid layer 470. In embodiments, each conductive element 472 is: (a) part of a patterned conductive layer, (b) a via, (c) extends at least partially through a plurality of holes through top rigid layer 470, or (d) any combination thereof. In embodiments, each bonding pad 272 extends through top rigid layer 470 such that each conductive element 472 is part of a corresponding bonding pad 272.

[0047] The connection region 408 includes N conductive elements 477 located between the surface region 229C and the bonding pads 277. Each conductive element 477 electrically connects a corresponding bonding pad 277 to the conductive layer 224 via a conductive path through the top rigid layer 475. In an embodiment, each conductive element 477 is: (a) part of a patterned conductive layer, (b) a via, (c) extends at least partially through a plurality of holes through the top rigid layer 475, or (d) any combination thereof. In an embodiment, each bonding pad 277 extends through the top rigid layer 475 such that each conductor of the conductive layer 477 is part of the corresponding bonding pad 277.

[0048] Figure 5This is a cross-sectional view of a surface mount device assembly 500, which includes a surface mount device 530 surface-mounted on a surface mount device platform 200. Camera 130 is an example of the surface mount device 530. In embodiments, the surface mount device 530 includes one of a photodetector, an image sensor, a CMOS camera module, a microphone, a vibration sensor, and a thermometer. The surface mount device 530 includes a ball grid array 532A comprising a plurality of solder balls 532, each electrically connected to a corresponding device bonding pad 272. The surface mount device assembly 500 may include microcables 540 electrically connected to each connector bonding pad 277.

[0049] Figure 6 This is a cross-sectional view of the surface mount device assembly 500 within the endoscope housing 600. Figure 6 In this configuration, the flexible region 206 is bent such that the corresponding planes of surface regions 229A and 229B are not parallel and intersect at an angle 620°. In an embodiment, the angle 620 is between 80 and 90 degrees. In an embodiment, the radius of curvature of the flexible region 206 is between 0.2 mm and 1.0 mm. In an embodiment, the ratio of the radius of curvature of the flexible region 206 to the thickness of the substrate 220 is between 8 and 12.

[0050] When Figure 6 When bent as shown, the surface mount device assembly 500, which has a surface mount device 530, has a width 611. In this embodiment, the width 611 is smaller than the width 612 of the endoscope housing 600. The width 612 is similar to the width 112 of the endoscope 110. Figure 6 In the figure, neither the thickness nor the radius of curvature of the substrate 220 is shown to scale relative to the width 612.

[0051] Figure 7This is a plan view of substrate 600, which is an example of a surface mount device platform 200. Substrate 600 includes a surface mount region 204, a flexible region 206, and a connection region 208 of the surface mount device platform 200. Substrate 600 also includes at least one of extensions 710, 720, and 730, which includes a corresponding flexible region 706 (1, 2, 3) and a corresponding connection region 708 (1, 2, 3). Each flexible region 706 is an example of a flexible region 206. Each connection region 708 is an example of a connection region 208 and provides additional bonding pads electrically connected to device bonding pads 272, such that the number of device bonding pads 272 can exceed the number of bonding pads 277. The connection regions 708 (1, 2, 3) have a corresponding plurality of connector bonding pads 717, 727, and 737, each of which is an example of a connector bonding pad 277. Each device bonding pad 272 in the surface mount area 204 is electrically connected to a connector bonding pad 277, a connector bonding pad 717, a connector bonding pad 727, or a connector bonding pad 737.

[0052] Figure 8 This is a cross-sectional view of the Surface Mount Device Platform 800. Figure 9 This is its floor plan. In the following description, Figure 8 and Figure 9 It is best to view them together. Surface mount device platform 800 is an example of surface mount device platform 200 and includes its top rigid layer 270. Surface mount device platform 800 includes a substrate 820, which is an example of substrate 220. Surface mount device platform 800 also includes a top rigid layer 875, which is an example of top rigid layer 275. In an embodiment, surface mount device platform 800 includes a bottom rigid layer 815, which is an example of bottom rigid layer 215. Top rigid layer 875 has a top surface 879.

[0053] In the surface mount device platform 800, the connection region 208 is implemented as a connection region 808, wherein the width (y-direction) of the connection region 808 is different from the width of the surface mount region 204. Therefore, as Figure 9 As shown, the substrate 802 has an uneven width within the bendable region 806.

[0054] Figure 10 This is a cross-sectional view of the surface mount device assembly 1000. When the flexible region 406 bends about an axis perpendicular to the xz plane (e.g.) Figure 6 As shown), the surface mount device assembly 1000 is Figure 5 An example of a surface mount device assembly 500. Although Figure 5The cross-sectional plane is parallel to the xz plane, but Figure 10 The cross-sectional view of the surface mount device assembly 1000 is parallel to the yz plane. Therefore, the cross-sectional view of the surface mount device assembly 1000 in the xz plane can be compared with... Figure 6 The cross-sectional view is the same as that of the surface mount device assembly 500 in the middle.

[0055] The surface mount device assembly 1000 includes a surface mount region 1004, a flexible region 1006, and a connection region 1008, which are corresponding examples of regions 404, 406, and 408. For clarity, Figure 10 Only the portion of the bendable region 1006 parallel to the yz plane is shown.

[0056] In addition to surface mount device 530, surface mount region 1004 also includes additional surface mount devices 1031 and 1032. At least one of surface mount devices 1031 and 1032 may be a light-emitting diode. Each of surface mount device 530 and surface mount devices 1031 and 1032 is surface mounted to a corresponding plurality of device bonding pads 272. Surface mount device assembly 1000 includes rigid layer 1070, which is an example of rigid layer 270, and rigid layer 1070 includes device bonding pads 272 for each of adapters 530, 1031, and 1032.

[0057] Surface mount device assembly 1000 includes a substrate. Figure 10 Not shown, but an example of substrate 220. The substrate of component 1000 includes a conductive layer configured to electrically connect each of devices 530, 1031, and 1032 to connector bonding pads 277 of connection region 1008 via device bonding pads 272. Substrate 1010 has a top surface 1029 having corresponding surface regions 1029A, 1029B, and 1029C. Top surface 1029 and regions 1029A, 1029B, and 1029C are corresponding examples of surface 229 and surface regions 229A, 229B, and 229C. For clarity, Figure 10 It represents surface regions 1029A, 1029B, and 1029C, but not surface 1029.

[0058] Feature combination

[0059] Without departing from the scope of this invention, the above-described features and the features claimed below can be combined in various ways. The following examples illustrate some possible, non-limiting combinations:

[0060] (A1) A surface mount device platform including a surface mount region, a connection region, and a flexible region between the surface mount region and the connection region, each of the surface mount region, the connection region, and the flexible region including a corresponding portion of a substrate. The substrate includes a plurality of conductive layers having a plurality of electrically insulating stacked layers distributed thereon. Each of the surface mount region, the connection region, and the flexible region spans between a bottom substrate surface and a top substrate surface of the substrate. The surface mount region further includes (i) an electrically insulating first top rigid layer and (ii) a plurality of device bonding pads exposed on the top surface of the first top rigid layer in the surface mount region away from the top substrate surface. The connection region further includes (i) an electrically insulating second top rigid layer and (ii) a plurality of connector bonding pads on the top substrate surface, each of the plurality of connector bonding pads (a) being exposed on the top surface of the second top rigid layer in the connection region away from the top substrate surface, and (b) being electrically connected via at least one of the plurality of conductive layers to a corresponding one of the plurality of device bonding pads.

[0061] (A2) In any surface mount device platform (A1), the surface mount area may further include a first patterned conductive layer between the top substrate surface and a plurality of device bonding pads, and electrically connect each of the plurality of device bonding pads to one of the plurality of conductive layers.

[0062] (A3) In any surface mount device platform (A1) or (A2), the connection area may further include a second patterned conductive layer between the top substrate surface and a plurality of connector bonding pads, and electrically connect each of the plurality of connector bonding pads to one of the plurality of conductive layers.

[0063] (A4) In any surface mount device platform (A1)–(A3), (i) the surface mount region may further include an electrically insulating first bottom rigid layer, each of the bottom substrate surface and the top substrate surface being between the first bottom rigid layer and the first top rigid layer, and (ii) the connection region may further include an electrically insulating second bottom rigid layer, each of the bottom substrate surface and the top substrate surface being between the second bottom rigid layer and the second top rigid layer.

[0064] (A5) In any surface mount device platform (A1)–(A4), the distance between any two adjacent device bonding pads of multiple device bonding pads may be between 75 micrometers and 350 micrometers; and the distance between any two adjacent connector bonding pads of multiple connector bonding pads may be between 75 micrometers and 350 micrometers.

[0065] (A6) In any surface mount device platform (A1)–(A5), on the top surface of the first top rigid layer, the minimum distance between any of the plurality of device bonding pads and the edge of the first top rigid layer may be between 100 micrometers and 200 micrometers; and in the connection region on the top surface of the second top rigid layer opposite to the top substrate surface, the minimum distance between any of the plurality of connector bonding pads and the edge of the second top rigid layer may be between 100 micrometers and 200 micrometers.

[0066] (A7) In any surface mount device platform (A1)–(A6), multiple device bonding pads can form a rectangular array with both length and width less than 0.6 mm.

[0067] (A8) In any surface mount device platform (A1)–(A7), the thickness of each of the multiple layers can be between twenty and forty micrometers.

[0068] (A9) In any surface mount device platform (A1)–(A8), each of the multiple connector bonding pads can be a laser-welded pad.

[0069] (A10) In any surface mount device platform (A1)–(A9), each of the plurality of layers, the first top rigid layer and the second top rigid layer may be formed of an epoxy molding compound.

[0070] (A11) In any surface mount device platform (A1)–(A10), each of the first top rigid layer and the second top rigid layer may have a higher flexural modulus than each of the plurality of layers.

[0071] (A12) In any surface mount device platform (A1)–(A11), each of the plurality of layers may be formed of a first epoxy molding compound having a first flexural modulus, and each of the first top rigid layer and the second top rigid layer may be formed of a second epoxy molding compound having a flexural modulus exceeding the first flexural modulus.

[0072] (B1) A surface mount device assembly comprising any one of the surface mount device platforms (A1)–(A12) and a surface mount device, wherein the ball grid array thereon includes a plurality of conductive elements, each of the plurality of conductive elements being electrically connected to a corresponding one of a plurality of device bonding pads.

[0073] (B2) In any surface mount device assembly (B1), the surface mount device may include a sensor electrically connected to each of a plurality of conductive elements.

[0074] (B3) In any surface-mount device assembly (B2), the sensor may include a photodetector.

[0075] (B4) In any surface-mount device assembly (B2), the sensor may be an image sensor.

[0076] (B5) In any surface-mount device assembly (B2), the sensor may include one of a microphone, a vibration sensor, and a thermometer.

[0077] Modifications to the surface mount device platform and surface mount device assembly described above may be made without departing from the scope of the invention. Therefore, it should be noted that the content included in the above description or shown in the drawings should be interpreted as illustrative rather than restrictive. Throughout this document, unless otherwise stated, the phrase "in some embodiments" is equivalent to the phrase "in some embodiments" and does not refer to all embodiments. The following claims are intended to cover all general and specific features described herein, as well as all statements regarding the scope of the platform and components of the invention, and linguistically, these statements may fall between them.

Claims

1. A surface mount device platform comprising: a surface mount region, a connection region, and a bendable region between the surface mount region and the connection region, each of the surface mount region, the connection region, and the bendable region comprising a respective portion of a base substrate; the base substrate comprising a plurality of electrically conductive layers interspersed with a plurality of electrically insulating buildups, each of the surface mount region, the connection region, and the bendable region spanning between a bottom substrate surface and a top substrate surface of the base substrate; the surface mount region further comprising, on the top substrate surface, (i) a first top rigid layer that is electrically insulating and (ii) a plurality of device bond pads exposed on a top surface of the first top rigid layer in the surface mount region that faces away from the top substrate surface; and the connection region further comprising, on the top substrate surface, (i) a second top rigid layer that is electrically insulating and (ii) a plurality of connector bond pads, each of the plurality of connector bond pads (a) exposed on a top surface of the second top rigid layer in the connection region that faces away from the top substrate surface and (b) electrically connected to a respective one of the plurality of device bond pads via at least one of the plurality of electrically conductive layers.

2. The surface mount device platform of claim 1, wherein the surface mount region further comprises a first patterned electrically conductive layer between the top substrate surface and the plurality of device bond pads and electrically connecting each of the plurality of device bond pads to one of the plurality of electrically conductive layers.

3. The surface mount device platform of claim 1 or 2, wherein the connection region further comprises a second patterned electrically conductive layer between the top substrate surface and the plurality of connector bond pads and electrically connecting each of the plurality of connector bond pads to one of the plurality of electrically conductive layers.

4. The surface mount device platform of claim 1 or 2, wherein the surface mount region further comprises a first bottom rigid layer that is electrically insulating, each of the bottom substrate surface and the top substrate surface being between the first bottom rigid layer and the first top rigid layer; and the connection region further comprises a second bottom rigid layer that is electrically insulating, each of the bottom substrate surface and the top substrate surface being between the second bottom rigid layer and the second top rigid layer.

5. The surface mount device platform of claim 1 or 2, wherein a distance between any two adjacent device bond pads of the plurality of device bond pads is between 75 micrometers and 350 micrometers; and a distance between any two adjacent connector bond pads of the plurality of connector bond pads is between 75 micrometers and 350 micrometers.

6. The surface mount device platform of claim 1 or 2, wherein a minimum distance between any one of the plurality of device bond pads and an edge of the first top rigid layer on the top surface of the first top rigid layer is between 100 micrometers and 200 micrometers; and a minimum distance between any one of the plurality of connector bond pads and an edge of the second top rigid layer on the top surface of the second top rigid layer is between 100 micrometers and 200 micrometers. In the connection region, a minimum distance between any one of the plurality of connector bond pads and an edge of the second top rigid layer is between 100 microns and 200 microns on a top surface of the second top rigid layer facing away from the top substrate surface.

7. The surface mount device platform of claim 1 or 2, wherein the plurality of device bond pads form a rectangular array having a length and a width that are each less than 0.6 millimeters.

8. The surface mount device platform of claim 1 or 2, wherein each of the plurality of buildups has a thickness between twenty microns and forty microns.

9. The surface mount device platform of claim 1 or 2, wherein each of the plurality of connector bond pads is a laser solder pad.

10. The surface mount device platform of claim 1 or 2, wherein each of the plurality of buildups, the first top rigid layer, and the second top rigid layer is formed of an epoxy mold compound.

11. The surface mount device platform of claim 1 or 2, wherein each of the first top rigid layer and the second top rigid layer has a higher flexural modulus than each of the plurality of buildups.

12. The surface mount device platform of claim 1 or 2, wherein each of the plurality of buildups is formed of a first epoxy mold compound having a first flexural modulus, and each of the first top rigid layer and the second top rigid layer is formed of a second epoxy mold compound having a flexural modulus that exceeds the first flexural modulus.

13. A surface mount device assembly, comprising: the surface mount device platform of any one of claims 1 to 12; and a surface mount device having a ball grid array including a plurality of conductive elements, each of the plurality of conductive elements being electrically connected to a respective one of the plurality of device bond pads.

14. The surface mount device assembly of claim 13, wherein the surface mount device includes a sensor electrically connected to each of the plurality of conductive elements.

15. The surface mount device assembly of claim 14, wherein the sensor includes a photodetector.

16. The surface mount device assembly of claim 14, wherein the sensor is an image sensor.

17. The surface mount device assembly of claim 14, wherein the sensor includes one of a microphone, a vibration sensor, and a thermometer.

Images