Camera module and photosensitive component and manufacturing method thereof

Abstract

The present application relates to an imaging module, a photosensitive component and a manufacturing method thereof. The photosensitive component includes a circuit board, a photosensitive chip electrically connected to the circuit board, and a package body disposed on the circuit board. The circuit board has a circuit board slot formed therein in a recessed manner, and the circuit board slot is located outside the photosensitive chip mounting area. In this way, the deformation amount of the photosensitive chip caused by stress is effectively reduced.

Description

Technical Field

[0001] This application relates to the field of camera modules, and in particular to camera modules, photosensitive components, and their manufacturing methods. Background Art

[0002] With the popularization of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or pictures) have developed rapidly and advanced. In recent years, camera modules have been widely used in many fields such as medical treatment, security, and industrial production.

[0003] To meet the increasingly broad market demands, high pixel count, large chip size, small form factor, and large aperture are irreversible development trends for existing camera modules. However, it is very difficult to meet the requirements of high pixel count, large chip size, small form factor, and large aperture in the same camera module. For example, first, the market has put forward higher and higher requirements for the imaging quality of camera modules. How to obtain higher imaging quality with a smaller volume of the camera module has become a major problem in the field of compact camera modules (such as camera modules for mobile phones), especially on the premise of the development trends of high pixel count, large aperture, and large chip size in the mobile phone industry; second, the compact development of mobile phones and the increase in the screen-to-body ratio of mobile phones have made the space available for the front camera module inside the mobile phone smaller and smaller; the number of rear camera modules is increasing, and the occupied area is also getting larger and larger, resulting in corresponding reductions in the sizes of other components of the mobile phone such as the battery size and the motherboard size. To avoid sacrificing other components, the market hopes that the volume of the rear camera module can be reduced, that is, small form factor packaging can be achieved; third, with the popularization of high pixel count chips and the gradual improvement of functions such as video shooting, chip power consumption and heat dissipation have become important issues that need to be solved during the module design and manufacturing process.

[0004] The above market demands are the development bottlenecks in the camera module packaging industry. The main reasons for the long-term failure to solve the above demands are analyzed as follows:

[0005] (1) High pixel count, large chip size: As the chip size has been gradually increasing, for example, chips with a pixel count above 48 million are quite common at present, and their size is 1 / 2 inch. In the future, the popularization of 1 / 1.7-inch chips and even larger-sized chips will lead to a rapid increase in chip size. However, since the photosensitive chip is relatively thinner than ordinary chips, only about 0.15 mm thick, large chips are more likely to have field curvature problems. At the same time, since the chip and the circuit board are generally connected by glue, the glue coating generally shows a shape with lower edges and higher middle, such as applying glue in a "rice" shape, resulting in a slight bulge in the middle of the chip. Moreover, when the chip is attached, since the suction nozzle picks up the chip from above, the chip will also show a curved shape with lower edges and higher middle. In addition, the coefficients of thermal expansion (CTE) of the chip, glue, and circuit board are different. For example, the CTE of the chip is 6 ppm / °C, while that of the PCB is 14 ppm / °C. There is generally a baking process in the module assembly process. Due to the different CTE coefficients of various materials, it will cause the chip to bend. And the currently commonly used rigid-flex printed circuit boards have relatively serious warping due to the lamination process, which will also exacerbate the chip bending problem. And the above-mentioned chip bending problem will cause chip field curvature problems in the final module imaging and ultimately affect the imaging quality.

[0006] Furthermore, under the current trend of device miniaturization, in the currently mainstream compact camera modules (such as camera modules used in mobile phones), most circuit boards tend not to add additional heat dissipation components to avoid increasing the size of the camera module. However, at the same time, the heat dissipation performance of the circuit board itself is not sufficient to meet the heat dissipation performance requirements of the module. On the other hand, currently, high-end camera modules have developed to 48 million pixels and above, and at the same time, the demand for video shooting has gradually emerged, such as 4K high-definition video shooting, slow-motion capture, etc. In the future, there will be even higher pixel count and higher frame rate camera modules, and the power of the corresponding photosensitive chips will be greatly increased.

[0007] The inventor of this case has found through research that as the heat generated by the photosensitive chip during operation increases, this heat accumulation causes the photosensitive chip to deform, which is one of the important factors leading to the decline in imaging quality. Specifically, in the working state, as the temperature inside the camera module rises, the circuit board and the photosensitive chip will bend, thereby reducing the imaging quality. In other words, for high-pixel and high-frame rate photosensitive chips, even without encapsulation by molding, they will be affected by temperature and bend. That is, whether it is molded or non-molded encapsulation, the bending problem of high-pixel and large chips cannot be solved.

[0008] (2) Miniaturization / small size: In the field of compact camera modules, in order to reduce the size of the camera module and improve manufacturing efficiency, a molding process is adopted to directly form a bracket for the lens assembly or other components on the circuit board (such as MOB or MOC process solutions). Specifically, the camera module may include a photosensitive component and a lens assembly, and the lens group and other optical elements of the lens assembly are arranged on the photosensitive path of the photosensitive element (usually a photosensitive chip) of the photosensitive component. It should be noted that in some solutions, the color filter can be directly installed on the photosensitive component to form a part of the photosensitive component, but in other solutions, the photosensitive component may not contain a color filter, but the color filter is made into an independent color filter assembly or installed in other forms on the light-transmitting path. Therefore, the lens assembly can sometimes be understood as a combination of light-transmitting elements such as a lens group, a color filter and their supporting structural parts. This combination can sometimes also be called a light-transmitting component. Canceling or lowering the position of the color filter can further reduce the height of the module.

[0009] Furthermore, the photosensitive component may include a circuit board and a molded body integrally molded on the circuit board. Since the molded body eliminates the advantage of the avoidance space of the traditional lens holder attached module, the advantages of the module in terms of length, width and height can be further realized. In addition, the molded body can reinforce the strength of the circuit board, and can reduce the thickness requirement of the circuit board while ensuring the flatness of the module, so the circuit board can be thinned. For example, in the MOC packaging process, the photosensitive element is pre-attached to the circuit board, and then a molded body is formed on the circuit board through a molding process. The molded body can wrap the non-photosensitive area of ​​part of the photosensitive element. In the camera module, the combination of the circuit board and the molded body, and the combination of the molded body and the photosensitive chip are both rigid combinations, which are very strong and often require destructive methods to be removed. But at the same time, the circuit board and the photosensitive chip are combined by glue, which is a relatively flexible combination. In addition, the coefficient of thermal expansion (CTE) of the circuit board, molded body, and photosensitive chip is different. When the ambient temperature changes greatly during the manufacturing process (for example, the molding material needs to be raised to above 150 degrees Celsius during the molding process, and the module baking stage needs to be raised to above 80 degrees Celsius. In the subsequent manufacturing process of the camera module, the ambient temperature may change many times), the expansion degree of the circuit board, chip, and molded body is different, and the expansion speed is also different. Among them, the shrinkage degree of the photosensitive chip is often the smallest. However, since the combination of the circuit board and the molded body is a rigid combination, the circuit board and the molded body will generate stress, causing the circuit board and the molded body to bend. This bending will cause the photosensitive chip to deform, especially the upward bending deformation of the photosensitive chip will cause a significant decrease in the imaging quality of the module. Figure 1 The schematic diagram shows the principle of the bending of the circuit board and the molded body causing the deformation of the photosensitive chip. Figure 1The illustration is rather exaggerated. In reality, the bending amount may only be a dozen to two dozen micrometers. However, this degree of bending is sufficient to have a negative impact on the imaging quality. For example, this bending may cause excessive field curvature of the camera module. At this time, the image obtained by the camera module shows normal center effect but very poor surrounding effect.

[0010] (3) Large aperture

[0011] Due to the popularization of large-pixel chips, the corresponding improvement in optical performance is an inevitable trend. For example, lens optical parameters such as large aperture and large wide angle will be gradually improved to maximize the resolution performance of the photosensitive chip. However, large-aperture and large-wide-angle modules have higher requirements for the flatness of the module.

[0012] Therefore, there is an urgent need for a solution that can avoid or suppress the deformation of the photosensitive chip at the cost of a relatively small space size, and there is also an urgent need for a solution that can ensure the imaging quality of the camera module (especially the imaging quality during long-term operation) at the cost of a relatively small space size. Summary of the Invention

[0013] The main object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, which can effectively reduce the bending amount of the photosensitive chip caused by stress to improve the imaging quality of the camera module.

[0014] Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the circuit board has a circuit board slot formed recessedly therein to reduce the influence of circuit board stress on the photosensitive chip through the circuit board slot.

[0015] Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the circuit board slot makes the stress received by the circuit board relatively more concentratedly distributed at the circuit board slot to relatively reduce the influence of circuit board stress on the photosensitive chip.

[0016] Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the circuit board slot provides a deformation space for the expansion or contraction of the circuit board. That is to say, the circuit board slot makes the circuit board deform relatively more freely to reduce the generation of internal stress of the circuit board, thereby relatively reducing the influence of circuit board stress on the photosensitive chip.

[0017] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Wherein, a circuit board slot formed in the circuit board divides the circuit board into a first circuit board portion and a second circuit board portion located outside the first circuit board portion. Wherein, the circuit board slot can reduce the stress conducted from the second circuit board portion to the first circuit board portion, so as to relatively reduce the influence of the circuit board stress on the photosensitive chip.

[0018] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Wherein, the encapsulation body further includes an encapsulation body slot formed therein in a recessed manner, so as to reduce the magnitude of the stress exerted by the encapsulation body on the photosensitive chip through the encapsulation body slot, so as to effectively reduce the deformation amount of the photosensitive chip caused by stress.

[0019] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Wherein, the formation position of the encapsulation body slot is located outside the photosensitive chip installation area, so as to cut off the stress transmission chain formed by the encapsulation body and the photosensitive chip, or reduce the magnitude of the stress transmitted on the stress transmission chain formed by the encapsulation body and the photosensitive chip.

[0020] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Wherein, the encapsulation body slot divides the encapsulation body into a first encapsulation portion and a second encapsulation portion, so that compared with the existing molding encapsulation process, the volume of the encapsulation portion covering the photosensitive chip will be reduced, so that at the same shrinkage rate, the shrinkage amount of the encapsulation portion covering the photosensitive chip will be reduced. Therefore, the stress generated by this encapsulation portion is also correspondingly reduced, so as to reduce the bending amount of the photosensitive chip.

[0021] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Wherein, the encapsulation body slot makes the stress received by the encapsulation body relatively more concentratedly distributed at the encapsulation body slot, so as to relatively reduce the influence of the encapsulation body stress on the photosensitive chip.

[0022] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Wherein, the encapsulation body slot provides a deformation space for the expansion or contraction of the encapsulation body. That is to say, the encapsulation body slot makes the encapsulation body deform relatively more freely, thereby reducing the influence of the encapsulation body stress on the photosensitive chip.

[0023] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Among them, the encapsulation body slot formed in the encapsulation body divides the encapsulation body into a first encapsulation part and a second encapsulation part located outside the first encapsulation part. Among them, the encapsulation body slot can reduce the stress conducted from the second encapsulation part to the first encapsulation part, so as to relatively reduce the influence of the encapsulation body stress on the photosensitive chip.

[0024] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. The setting of the encapsulation body slot increases the overall surface area of the encapsulation body, so that the stress generated by the encapsulation body can be distributed relatively more on the surface of the encapsulation body, so as to relatively reduce the magnitude of the stress exerted by the encapsulation body on the photosensitive chip.

[0025] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Among them, in an embodiment of the present application, the encapsulation body slot communicates with the circuit board slot.

[0026] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Among them, the mutually communicating encapsulation body slot and the circuit board slot provide a heat dissipation channel, and the heat generated when the photosensitive component works can be dissipated through the heat dissipation channel.

[0027] Another object of the present application is to provide an imaging module, a photosensitive component and a manufacturing method thereof. Among them, the encapsulation body slot and the circuit board slot increase the overall exposed area of the photosensitive component, which is beneficial to improving the heat dissipation performance of the photosensitive component.

[0028] Through the following description, other advantages and features of the present application will become obvious and can be realized by the means and combinations specifically pointed out in the claims.

[0029] To achieve the above at least one object or advantage, the present application provides a photosensitive component, which includes:

[0030] A circuit board;

[0031] A photosensitive chip electrically connected to the circuit board; and

[0032] An encapsulation body disposed on the circuit board, wherein the circuit board has a circuit board slot recessed therein, and the circuit board slot is located outside the photosensitive chip installation area.

[0033] In the photosensitive component according to the present application, the circuit board slot is formed through the circuit board.

[0034] In the photosensitive component according to the present application, the circuit board includes a first circuit board portion and a second circuit board portion divided by a slot in the circuit board, wherein the photosensitive chip is mounted on the first circuit board portion.

[0035] In the photosensitive component according to the present application, the photosensitive component further includes at least one electronic component, wherein the at least one electronic component is disposed on the second circuit board portion.

[0036] In the photosensitive component according to the present application, the slot in the circuit board is symmetrically arranged with respect to the photosensitive chip.

[0037] In the photosensitive component according to the present application, the encapsulation body is integrally formed on the circuit board, wherein the encapsulation body includes an encapsulation body slot formed recessedly therein, and the encapsulation body slot is located outside the photosensitive chip mounting area.

[0038] In the photosensitive component according to the present application, the encapsulation body includes a first encapsulation portion and a second encapsulation portion divided by the encapsulation body slot. The first encapsulation portion covers at least a part of the circuit board and at least a part of the non-photosensitive area of the photosensitive chip, and the second encapsulation portion covers at least part of the at least one electronic component and at least a part of the circuit board.

[0039] In the photosensitive component according to the present application, the position where the encapsulation body slot is formed in the encapsulation body corresponds to the position where the circuit board slot is formed in the circuit board.

[0040] In the photosensitive component according to the present application, the encapsulation body slot is symmetrically distributed with respect to the photosensitive chip.

[0041] In the photosensitive component according to the present application, the encapsulation body slot is a closed loop slot surrounding the first molding portion.

[0042] In the photosensitive component according to the present application, the encapsulation body slot is formed recessedly on the upper surface of the encapsulation body, and the depth of the encapsulation body slot is greater than or equal to 30% of the height of the encapsulation body.

[0043] In the photosensitive component according to the present application, the encapsulation body slot is formed recessedly on the lower surface of the encapsulation body, and the encapsulation body slot communicates with the circuit board slot.

[0044] In the photosensitive component according to the present application, the encapsulation body slot is formed through the encapsulation body to communicate with the circuit board slot.

[0045] In the photosensitive component according to the present application, the volume of the encapsulation body slot is larger than that of the circuit board slot.

[0046] According to another aspect of the present application, the present application further provides an imaging module, which includes:

[0047] An optical lens; and

[0048] The photosensitive component as described above, wherein the optical lens is held in the photosensitive path of the photosensitive component.

[0049] In the imaging module according to the present application, the imaging module further includes a driving element, wherein the driving element is supported by the bracket, and the optical lens is mounted on the driving element.

[0050] According to still another aspect of the present application, there is further provided a method for manufacturing a photosensitive component, which includes:

[0051] Providing a circuit board, wherein the circuit board has at least one photosensitive chip mounting area for mounting at least one photosensitive chip thereon, wherein the circuit board includes at least one circuit board slot formed therethrough, and the circuit board slot is located outside the photosensitive chip mounting area; and

[0052] Setting a package on the circuit board.

[0053] In the manufacturing method according to the present application, setting a package on the circuit board includes:

[0054] Placing the circuit board in a molding space formed when the upper mold and the lower mold of a molding die are closed, wherein at least one intermediate is respectively and adaptively disposed in the circuit board slot;

[0055] Forming a package in the molding space; and

[0056] Separating the upper mold and the lower mold of the molding die.

[0057] In the manufacturing method according to the present application, the height of the intermediate is greater than the circuit board slot, and after separating the upper mold and the lower mold of the molding die, it further includes:

[0058] Removing the intermediate to form the mutually connected circuit board slot and package slot at the corresponding position of the intermediate

[0059] In the manufacturing method according to the present application, the height of the intermediate is equal to the circuit board slot to seal the circuit board slot during the process of forming the package in the molding space.

[0060] In the manufacturing method according to the present application, before placing the circuit board in a molding space formed when the upper mold and the lower mold of a molding die are closed, it further includes:

[0061] At least one intermediate is filled into the slots of the circuit board respectively to seal the slots of the circuit board.

[0062] In the manufacturing method according to the present application, the at least one intermediate is prominently formed on the lower mold. When the upper mold and the lower mold are closed to form the molding space, the at least one intermediate is respectively inserted into the slots of the circuit board in a fitting manner to seal the slots of the circuit board.

[0063] In the manufacturing method according to the present application, the circuit board is implemented as a panel of circuit boards.

[0064] Through the understanding of the subsequent description and the drawings, the further objectives and advantages of the present application will be fully reflected.

[0065] These and other objectives, features and advantages of the present application are fully reflected through the following detailed description, drawings and claims. Description of the Drawings

[0066] By describing the embodiments of the present application in more detail in conjunction with the drawings, the above and other objectives, features and advantages of the present application will become more obvious. The drawings are used to provide a further understanding of the embodiments of the present application, and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation to the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0067] Figure 1 The schematic diagram illustrates the principle of the deformation of the photosensitive chip caused by the bending of the circuit board and the molding body.

[0068] Figure 2 The schematic diagram illustrates the camera module according to the embodiment of the present application.

[0069] Figure 3 The schematic diagram illustrates the photosensitive component of the camera module according to the embodiment of the present application.

[0070] Figure 4 The schematic diagram illustrates the circuit board in the photosensitive component according to the embodiment of the present application.

[0071] Figure 5 The three-dimensional exploded schematic diagram illustrates the photosensitive component according to the embodiment of the present application.

[0072] Figure 6 The schematic diagram illustrates a variant implementation of the photosensitive component according to the embodiment of the present application.

[0073] Figure 7 The schematic diagram illustrates a variant implementation of the photosensitive component according to the embodiment of the present application.

[0074] Figure 8 The figure illustrates a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0075] Figure 9A and Figure 9B The figure illustrates a schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0076] Figure 10 The figure illustrates a schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0077] Figure 11 The figure illustrates a schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0078] Figure 12 The figure illustrates a schematic diagram of yet another variant implementation of the photosensitive component according to an embodiment of the present application.

[0079] Figure 13 The figure illustrates a schematic diagram of yet another variant embodiment of the photosensitive component according to an embodiment of the present application.

[0080] Figure 14A and 14B The figure illustrates a schematic diagram of the manufacturing process of the photosensitive component according to an embodiment of the present application.

[0081] Figure 15 The figure illustrates a schematic diagram of another manufacturing process of the photosensitive component according to an embodiment of the present application.

[0082] Figure 16 The figure illustrates another schematic diagram of the molding die in the manufacturing process according to an embodiment of the present application. Detailed implementation manners

[0083] Hereinafter, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Apparently, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein.

[0084] Exemplary camera module

[0085] As Figures 2 to 5 shown, an imaging module based on an embodiment of the present application is illustrated. Among them, the imaging module includes an optical lens 10 and a photosensitive component 20. The optical lens 10 is held in the light-sensitive path of the photosensitive component 20 so that the light collected by the optical lens 10 can be imaged in the photosensitive component 20 along this light-sensitive path. It should be noted that, as Figure 2The camera module shown is a fixed-focus camera module. Those skilled in the art should be aware that the camera module involved in this application can also be implemented as a variable-focus camera module, that is, the camera module further includes a driving element (not shown in the figure) disposed between the optical lens 10 and the photosensitive component 20, so as to move the optical lens 10 along the photosensitive path by the driving element to change the distance between the optical lens 10 and the photosensitive component 20. Of course, the camera module can also be implemented as an optical image stabilization camera module, wherein the driving element drives the optical lens to move in a direction perpendicular to the photosensitive path.

[0086] As Figure 3 shown, in the embodiment of the present application, the photosensitive component 20 includes a circuit board 21, a photosensitive chip 22, at least one electronic component 23, and a package 24. Specifically, the upper surface of the circuit board 21 includes a photosensitive chip mounting area 211 and a peripheral area 212 located around the photosensitive chip mounting area 211. Among them, the photosensitive chip 22 is mounted on the photosensitive chip mounting area 211 and electrically connected to the circuit board 21, and the at least one electronic component 23 is disposed in the peripheral area 212 and electrically connected to the circuit board 21. The package 24 is disposed on the circuit board 21, and the package 24 has a light passing hole 240 corresponding to at least the photosensitive area of the photosensitive chip 22 to allow external light to enter the photosensitive area of the photosensitive chip 22 through the light passing hole 240.

[0087] Specifically, in the embodiment of the present application, the package 24 can be integrally formed on the circuit board 21 by a molding process or a pressing process to cover at least a part of the circuit board 21. Among them, the molding or pressing molding material includes but is not limited to powdery or colloidal epoxy resin, etc. Of course, in other examples of the present application, the package 24 can also be implemented as a traditional plastic bracket, which is mounted on the corresponding position of the circuit board 21 by glue.

[0088] The at least one electronic component 23 can be mounted on the peripheral area of the circuit board 21 by a surface mounting technology (Surface Mounting Technology) so that the at least one electronic component 23 is located in the surrounding area of the photosensitive chip 22. Or, the at least one electronic component 23 can also be embedded in the circuit board 21 to reduce the height of the at least one electronic component 23 protruding from the circuit board 21. It should be understood that the installation process of the at least one electronic component 23 is not limited by this application. At the same time, in the embodiment of the present application, the type of the at least one electronic component 23 is not limited by this application, and it includes but is not limited to capacitors, inductors, triodes, thyristors, resistors, etc.

[0089] As Figure 3 shown, in the embodiment of the present application, the electrical connection between the photosensitive chip 22 and the circuit board 21 is realized through the lead 25. Specifically, in the embodiment of the present application, each lead 25 extends bendably between the photosensitive chip 22 and the circuit board 21, so that the photosensitive chip 22 is electrically connected to the circuit board 21 through the lead 25. Thus, the circuit board 21 can supply power to the photosensitive chip 22 based on the lead 25, and the photosensitive chip 22 can transmit the collected signals based on the lead 25. It is worth mentioning that the type of the lead 25 is not limited by the present application. For example, the lead 25 can be a gold wire, a silver wire, or a copper wire. And the lead 25 can be installed between the circuit board 21 and the photosensitive chip 22 through the process of "bonding gold wire" to realize the electrical connection between the two.

[0090] Specifically, the process of "bonding gold wire" is generally divided into two types: the "positive bonding gold wire" process and the "negative bonding gold wire" process. The "positive bonding gold wire" process means that during the process of laying the lead 25, one end of the lead 25 is first formed on the conductive end of the circuit board 21, and then the lead 25 is extended bendably, and finally the other end of the lead 25 is formed on the conductive end of the photosensitive chip 22. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. The "negative bonding gold wire" process means that during the process of laying the lead 25, one end of the lead 25 is first formed on the conductive end of the photosensitive chip 22, and then the lead 25 is extended bendably, and finally the other end of the lead 25 is formed on the conductive end of the circuit board 21. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. It is worth mentioning that the height of the lead 25 protruding upward formed by the "negative bonding gold wire" process is relative to the height of the lead 25 protruding upward formed by the "positive bonding gold wire" process. Therefore, preferably, in this specific implementation, the "negative bonding gold wire" process is used to form the lead 25.

[0091] Of course, those skilled in the art should know that in other examples of the present application, the photosensitive chip 22 and the circuit board 21 can be conducted in other ways, such as by using the back conduction method. This is not limited by the present application.

[0092] Particularly, in the embodiment of the present application, the circuit board 21 has a circuit board slot 213 formed recessedly therein, and the circuit board slot 213 is arranged outside the photosensitive chip installation area 211 to reduce the influence of the circuit board stress on the photosensitive chip 22 through the circuit board slot 213. The specific manifestations are as follows.

[0093] First, the photosensitive chip 22 is mounted on the circuit board 21 by glue. Moreover, the thermal expansion coefficients of the photosensitive chip 22, the glue, and the circuit board 21 are different from each other. During the change of ambient temperature (for example, when heated), on the one hand, the amount of expansion and contraction of the circuit board 21 is relatively large, and the stress generated directly acts on the photosensitive chip 22. On the other hand, the glue shrinks when heated and cured, generating stress between the circuit board 21 and the photosensitive chip 22 and acting on the photosensitive chip 22. Therefore, it is necessary to provide the circuit board slot 213 on the circuit board 21 so that the above-mentioned stress can be released through the circuit board slot 213.

[0094] Secondly, those skilled in the art should understand that the circuit board slot 213 can make the stress received by the circuit board 21 be relatively more concentratedly distributed at the circuit board slot 213. Thus, on the premise that the circuit board 21 generates the same stress magnitude, the circuit board stress acting on the photosensitive chip 22 can be relatively reduced.

[0095] In addition, the circuit board slot 213 provided on the circuit board 21 provides a deformation space for the expansion or contraction of the circuit board 21. That is to say, when the circuit board 21 expands when heated or contracts when cooled, the circuit board slot 213 provides a margin for the expansion and contraction deformation of the circuit board 21, so that the circuit board 21 can deform relatively more freely. In this way, the generation of internal stress of the circuit board 21 can be reduced, and thus the influence of the circuit board stress on the photosensitive chip 22 can be relatively reduced.

[0096] Furthermore, the circuit board slot 213 divides the circuit board 21 into a first circuit board part 214 and a second circuit board part 215 located around the first circuit board part 214. It should be understood that when the ambient temperature changes, the temperature conduction is from the outside to the inside. That is to say, the outermost part of the circuit board 21 is the first to be affected by the temperature, that is, the second circuit board part 215 is easily affected by the temperature change and generates stress and deformation. Correspondingly, since the circuit board slot 213 is formed between the first circuit board part 214 and the second circuit board part 215, the circuit board slot 213 can release part of the stress of the second circuit board part 215, so as to relatively reduce the stress conducted from the second circuit board part 215 to the first circuit board part 214.

[0097] Such as Figure 2As shown, in the embodiment of the present application, the circuit board slot 213 is formed through the circuit board 21 to divide the circuit board 21 into the first circuit board portion 214 and the second circuit board portion 215. In particular, in the embodiment of the present application, the photosensitive chip 22 is mounted on the first circuit board portion 214, and the at least one electronic component 23 is mounted on the second circuit board portion 215. Moreover, in the embodiment of the present application, the area of the first circuit board portion 214 is smaller than that of the second circuit board portion 215. That is to say, in the embodiment of the present application, the first circuit board portion 214 for carrying and mounting the photosensitive chip 22 has a relatively small size, so that under the action of the same external force, the deformation amount of the first circuit board portion 214 is relatively small, thereby reducing the stress generated by the first circuit board portion 214 and thus reducing the influence of the circuit board stress on the photosensitive chip 22.

[0098] It should be understood that in other examples of the present application, the circuit board slot 213 can also be arranged at other positions of the circuit board 21. For example, between the electronic components 23, between the electronic component 23 and the lead 25, etc. This is not limited to the present application. At the same time, it is worth mentioning that in other examples of the present application, the circuit board slot 213 may not completely penetrate the circuit board 21. For example, the circuit board slot 213 may be formed recessed in the circuit board 21, and the depth of the recess of the circuit board slot 213 exceeds a preset ratio of the height of the circuit board 21, for example, exceeds 30%. This is not limited to the present application.

[0099] Preferably, in the embodiment of the present application, the circuit board slot 213 is symmetrically arranged with respect to the photosensitive chip mounting area 211. That is to say, preferably, the circuit board slot 213 is formed on the circuit board 21 in a manner symmetrically arranged with respect to the photosensitive chip 22. Specifically, as Figure 4 shown, in the embodiment of the present application, the circuit board 21 has 4 circuit board slots 213, wherein the circuit board slots 213 are symmetrically formed on the circuit board 21 with respect to the center set by the photosensitive chip 22.

[0100] It should be understood that in other examples of the present application, the circuit board 21 may include an even number of circuit board slots 213 with a larger or smaller number. For example, as Figure 6As shown, in this example, the circuit board 21 includes two circuit board slots 213 symmetrically arranged with respect to the center line set for the photosensitive chip 22. Again, for example, the circuit board 21 may include six circuit board slots 213 symmetrically arranged with respect to the photosensitive chip mounting area 211. At the same time, it is worth mentioning that in the embodiment of the present application, the cross-sectional shape of the circuit board slot 213 is not limited in this application, and it includes but is not limited to square, polygon, triangle, strip, etc.

[0101] It is worth mentioning that when the package 24 is implemented as a traditional plastic bracket, it is mounted on the circuit board 21 by glue. During the mounting process, stresses will be generated due to the different coefficients of thermal expansion of the package 24, the glue, and the circuit board 21. That is to say, stresses will be generated in the bracket mounting area on the circuit board 21, which will affect the photosensitive chip 22 and cause a certain deformation of the photosensitive chip 22. Therefore, the circuit board slot 213 provided between the bracket mounting area (located in the second circuit board part 215) and the photosensitive chip mounting area 211 (located in the first circuit board part 214) provides a space that allows the bracket mounting area to expand and contract, so that the stress generated in the bracket mounting area can be released, and the stress transmitted from the bracket mounting area to the photosensitive chip mounting area 211 can be reduced.

[0102] Further, in the embodiment of the present application, when the package 24 is implemented as a molded package 24 or a molded package 24 integrally formed on the circuit board 21, the package 24 has a package slot 241 recessed therein. In particular, the package slot 241 is also formed outside the photosensitive chip mounting area 211, so as to reduce the magnitude of the stress exerted by the package 24 on the photosensitive chip 22 through the package slot 241, and effectively reduce the amount of deformation of the photosensitive chip 22 caused by stress. The specific manifestations are as follows.

[0103] First, since the position where the package slot 241 is formed in the package 24 is outside the photosensitive chip mounting area 211, that is to say, between the package 24 and the photosensitive chip 22. In this way, the package slot 241 can reduce the magnitude of the stress transmitted on the stress transmission chain formed by the package 24 and the photosensitive chip 22, and even cut off the stress transmission chain between the package 24 and the photosensitive chip 22.

[0104] Secondly, the encapsulation body slot 241 divides the encapsulation body 24 into a first encapsulation part 242 and a second encapsulation part 243, so that compared with the existing molding / compression molding encapsulation process, the volume of the encapsulation part covering the photosensitive chip 22 will be reduced, so that under the same shrinkage rate, the shrinkage amount of the encapsulation part covering the photosensitive chip 22 will be reduced. Therefore, the stress generated by this encapsulation part is also correspondingly reduced to reduce the bending amount of the photosensitive chip 22. At the same time, since the encapsulation body slot 241 is located between the first encapsulation part 242 and the second encapsulation part 243, in this way, the encapsulation body slot 241 can reduce the stress conducted from the second encapsulation part 243 to the first encapsulation part 242, so as to relatively reduce the influence of the encapsulation body stress on the photosensitive chip 22.

[0105] In addition, based on the stress concentration law, the encapsulation body slot 241 can make the stress received by the encapsulation body 24 be distributed relatively more concentratedly at the encapsulation body slot 241, so that on the premise of generating the same stress magnitude in the encapsulation body 24, the encapsulation body stress acting on the photosensitive chip 22 can be relatively reduced to reduce the influence of the encapsulation body stress on the photosensitive chip 22.

[0106] Moreover, the encapsulation body slot 241 provides a deformation space for the expansion or contraction of the circuit board 21. That is to say, the encapsulation body slot 241 enables the circuit board 21 to deform relatively more freely, so as to reduce the generation of internal stress in the encapsulation body 24, thereby relatively reducing the influence of the encapsulation body stress on the photosensitive chip 22.

[0107] Furthermore, the setting of the encapsulation body slot 241 increases the overall surface area of the encapsulation body 24, so that the stress generated by the encapsulation body 24 can be distributed relatively more to the surface of the encapsulation body 24, so as to relatively reduce the magnitude of the stress exerted by the encapsulation body 24 on the photosensitive chip 22.

[0108] Such as Figure 3As shown, in the embodiment of the present application, the encapsulation body slot 241 is recessed on the lower surface of the encapsulation body 24, where the lower surface of the encapsulation body 24 is integrally bonded to the circuit board 21. In particular, in the embodiment of the present application, the encapsulation body slot 241 divides the encapsulation body 24 into a first encapsulation part 242 and a second encapsulation part 243. Among them, the first encapsulation part 242 covers at least a part of the circuit board 21 and at least a part of the non-photosensitive area of the photosensitive chip 22, and the second encapsulation part 243 covers at least a part of the at least one electronic component 23 and at least a part of the circuit board 21. It should be understood that in other examples of the present application, the encapsulation body slot 241 may be formed at other positions of the encapsulation body 24, for example, between the electronic components 23, between the electronic component 23 and the lead 25, outside the electronic component 23, etc. This is not limited by the present application.

[0109] In particular, in the embodiment of the present application, the volume of the second encapsulation part 243 is larger than that of the first encapsulation part 242. In this way, at the same shrinkage rate, the shrinkage amount of the first encapsulation part 242 will be reduced to reduce the influence of the stress generated by the first encapsulation part 242 on the photosensitive chip 22.

[0110] Preferably, in the embodiment of the present application, the position where the encapsulation body slot 241 is formed on the encapsulation body 24 corresponds to the position where the circuit board slot 213 is formed on the circuit board 21, so that the circuit board slot 213 communicates with the encapsulation body slot 241. That is to say, preferably, in the embodiment of the present application, the circuit board slot 213 communicates with the encapsulation body slot 241 to form a communication slot.

[0111] It should be understood that when the circuit board slot 213 communicates with the encapsulation body slot 241, on the one hand, the encapsulation body slot 241 and the circuit board slot 213 increase the overall exposed surface area of the photosensitive component 20, which is beneficial to improving the heat dissipation performance of the photosensitive component 20. On the other hand, the encapsulation body slot 241 and the circuit board slot 213 provide a heat dissipation channel, and the heat generated when the photosensitive component 20 works can be dissipated through the heat dissipation channel.

[0112] It is worth mentioning that when the circuit board slot 213 communicates with the encapsulation body slot 241, the setting of the circuit board slot 213 is beneficial to the implementation of the forming process of the encapsulation body 24 and the encapsulation body slot 241. This will be specifically described in the subsequent manufacturing process and will not be elaborated here.

[0113] Preferably, in the embodiments of the present application, the encapsulation body slot 241 is implemented as a closed annular groove, which is recessed and formed on the lower surface of the encapsulation body 24. Of course, in other examples of the embodiments of the present application, the encapsulation body slot 241 can also be implemented as a non-closed annular groove. For example, the encapsulation body slot 241 includes two strip-shaped encapsulation body slots 241 symmetrically arranged with respect to the center line set for the photosensitive chip 22. However, this is not limited to the present application. At the same time, it is worth mentioning that in the embodiments of the present application, the cross-sectional shape of the encapsulation body slot 241 is not limited to the present application, and it includes but is not limited to square, polygon, triangle, strip, arc (including ellipse, semi-circle, etc.).

[0114] Of course, in other examples of the present application, the encapsulation body slot 241 can also be formed at other positions of the encapsulation body 24. For example, in the photosensitive component 20 as Figure 7 shown, the encapsulation body slot 241 is recessed and formed on the upper surface of the encapsulation body 24. Again, for example, in the photosensitive component 20 as Figure 8 shown, the encapsulation body slot 241 is respectively recessed and formed on the upper surface of the encapsulation body 24 and the lower surface of the encapsulation body 24. That is to say, in this example, the encapsulation body 24 includes two encapsulation body slots 241 respectively formed on its upper surface and lower surface. And preferably, the encapsulation body slot 241 formed on the upper surface is aligned with the encapsulation body slot 241 formed on the lower surface. Of course, in other examples of the present application, the encapsulation body 24 groove can also be formed on the side surface of the encapsulation body 24. However, this is not limited to the present application.

[0115] It should be understood that the ability of the encapsulation body slot 241 to reduce the stress of the encapsulation body 24 acting on the photosensitive chip 22 is related to the depth of the encapsulation body slot 241. Specifically, as the depth of the encapsulation body slot 241 increases, the ability of the encapsulation body slot 241 to reduce the stress of the encapsulation body 24 acting on the photosensitive chip 22 becomes stronger. In particular, in the embodiments of the present application, the depth of the encapsulation body slot 241 is greater than or equal to 30% of the height of the encapsulation body 24. Here, the height of the encapsulation body 24 refers to the height of the encapsulation body 24 at the position where the encapsulation body slot 241 is provided. It should be understood that due to the shape of the encapsulation body 24, the height of the encapsulation body 24 at different positions may vary.

[0116] Figure 9A and Figure 9B illustrate another variant embodiment of the photosensitive component 20 according to the embodiments of the present application. As Figure 9A and Figure 9BAs shown, in the embodiment of the present application, the height of the encapsulation body slot 241 is equal to the height of the encapsulation body 24. That is to say, in this example, the encapsulation body slot 241 is a through slot formed in the encapsulation body 24 to expose the corresponding area of the circuit board 21. It should be understood that when the encapsulation body slot 241 is a through slot in the encapsulation body 24, the stress transfer chain between the encapsulation body 24 and the photosensitive chip 22 is completely cut off by the encapsulation body slot 241, so that the stress exerted by the encapsulation body 24 on the photosensitive chip 22 is minimized to the greatest extent. It is worth mentioning that in the embodiment of the present application, the width of the encapsulation body slot 241 can also be increased as much as possible on the premise of not excessively damaging the overall structural strength of the encapsulation body 24, so as to enhance the ability of the encapsulation body slot 241 to reduce the stress exerted by the encapsulation body 24 on the photosensitive chip 22.

[0117] Specifically, in the photosensitive component 20 as Figure 9A and Figure 9B shown, the first encapsulation part 242 and the second encapsulation part 243 of the encapsulation body 24 are connected by a molding channel (not shown in the figure). And, in this example, the encapsulation body slot 241 includes a first slot and a second slot, wherein the first slot and the second slot surround the first encapsulation part 242 and are joined at the molding channel. That is to say, in this example, the molding channel is formed between the first slot and the second slot, so that after the encapsulation body 24 is molded, the encapsulation body 24 is divided into the first encapsulation part 242 and the second encapsulation part 243 through the first slot and the second slot, and the first encapsulation part 242 and the second encapsulation part 243 are connected by the molding channel. Preferably, in this example of the present application, the first slot and the second slot are symmetrically arranged with respect to the center line of the photosensitive chip 22, and the first slot and the second slot have zigzag shape.

[0118] It is worth mentioning that in other specific implementations of this example of the present application, the first slot and the second slot can also be arranged in an asymmetric manner, or when the first slot and the second slot are arranged symmetrically, the first slot and the second slot can be implemented as other shapes, such as "I" shape, which is not limited to the present application. And, in other examples of the present application, the encapsulation body slot 241 can also include a greater number of slots (for example, also including a third slot) or only include the first slot surrounding the first encapsulation part 242, which is not limited to the present application. And, in other specific examples of this example of the present application, the circuit board slot 213 can also be implemented as other shapes, such as, Fonts and the like. The present application is not limited thereto.

[0119] Specifically, in the embodiment of the present application, the volume of the encapsulation body slot 241 is greater than the volume of the circuit board slot 213. The reason for this setting is that: generally, the amount of expansion or contraction of the encapsulation body 24 when the temperature changes is larger than that of the circuit board 21, and the encapsulation body 24 covers five faces (including four side faces + the upper surface) of the photosensitive chip 22, while the circuit board 21 only contacts one face (the lower surface) of the photosensitive chip 22.

[0120] Specifically, as Figure 5 shown, in the embodiment of the present application, the cross-sectional area of the encapsulation body slot 241 is consistent with the cross-section of the circuit board slot 213, but the length of the encapsulation body slot 241 is greater than the length of the circuit board slot 213, so that the volume of the encapsulation body slot 241 is greater than the volume of the circuit board slot 213. Here, in the embodiment of the present application, the length of the encapsulation body slot 241 represents the length dimension of the figure projected by the encapsulation body slot 241 in the direction of the circuit board 21, and the length of the circuit board slot 213 represents the length dimension of the figure projected by the circuit board slot 213 in the direction of the circuit board 21.

[0121] It should be understood that in other examples of the present application, the volume of the encapsulation body slot 241 can be made greater than the volume of the circuit board slot 213 through other implementation manners. For example, in the photosensitive component 20 as Figure 10 shown, the cross-section of the encapsulation body slot 241 has an arc (for example, a semi-circle), its area is greater than the cross-sectional area of the circuit board slot 213, and the length dimension of the encapsulation body slot 241 is greater than, equal to, or even slightly less than the length dimension of the circuit board slot 213. In this way, the volume of the encapsulation body slot 241 is greater than the volume of the circuit board slot 213.

[0122] It should be conceivable that in other examples of the present application, the cross-sectional area of the encapsulation body slot 241 can be slightly less than the cross-sectional area of the circuit board slot 213, as long as the length dimension of the encapsulation body slot 241 is much greater than the length dimension of the circuit board slot 213. For example, in as Figure 11In the photosensitive component 20 shown, the cross-sectional dimensions of the encapsulation body slot 241 and the cross-sectional dimensions of the circuit board slot 213 are both isosceles trapezoids, and moreover, the cross-sectional dimensions of the encapsulation body slot 241 are smaller than the cross-sectional dimensions of the circuit board slot 213. However, the encapsulation body slot 241 is a closed loop slot, and the circuit board slot 213 is a square through slot, so that the length dimension of the encapsulation body slot 241 is much larger than that of the circuit board slot 213. In this way, a configuration can also be formed in which the volume of the encapsulation body slot 241 is larger than the volume of the circuit board slot 213.

[0123] It is worth mentioning that when the cross-sectional area of the encapsulation body slot 241 is smaller than the cross-sectional area of the circuit board slot 213, such a configuration is also beneficial for demolding after the encapsulation body 24 is molded. This aspect will be discussed in more detail in the subsequent manufacturing process of the photosensitive component 20 and will not be elaborated here first.

[0124] Figure 12 The figure shows a schematic diagram of another variant implementation of the photosensitive component 20 according to an embodiment of the present application. As Figure 12 shown, in the embodiment of the present application, the photosensitive component 20 further includes a buffer element 26, and the buffer element 26 is disposed in a communication slot formed by the mutually communicating circuit board slot 213 and the encapsulation body slot 241. In particular, in this example, the buffer element 26 is made of a material with a certain elasticity such as glue or silica gel. In this way, the buffer element 26 disposed in the communication slot formed by the circuit board slot 213 and the encapsulation body slot 241 can also absorb a certain amount of stress to reduce the influence of external stress on the photosensitive chip 22. It is worth mentioning that when the material for making the buffer element 26 has the property of being soluble or ready for rinsing, the buffer element 26 can be removed to form the photosensitive component 20 as Figures 3 to 11 shown.

[0125] Figure 13 The figure shows another variant embodiment of the photosensitive component 20 according to an embodiment of the present application. As Figure 3 shown, in this variant embodiment, the photosensitive component 20 further includes a reinforcing plate 27 disposed on the lower surface of the circuit board 21 to strengthen the structural strength of the circuit board 21 through the reinforcing plate 27. The reason is that when the encapsulation body slot 241 is opened on the encapsulation body 24 and the circuit board slot 213 is opened on the circuit board 21, the structural strength of a partial region (exposed region) of the circuit board 21 is weakened, and the reinforcing plate 27 can prevent the circuit board 21 from deforming or even being broken. Preferably, the reinforcing plate 27 is made of a material with a relatively high stiffness, for example, metal, ceramic, ABS resin, and so on.

[0126] Furthermore, as Figure 3 shown, in the embodiment of the present application, the photosensitive component 20 further includes a filter element 28 held in the photosensitive path of the photosensitive chip 22. Among them, the filter element 28 corresponds to at least the photosensitive area of the photosensitive chip 22 and is used to filter the light entering the photosensitive chip 22 to improve the imaging quality. In particular, in the embodiment of the present application, the photosensitive component 20 further includes a filter element bracket 29 disposed on the second encapsulation portion 243. Among them, the filter element 28 is mounted on the filter element bracket 29 to be held in the photosensitive path of the photosensitive chip 22. It is worth mentioning that in some examples of the present application, when the encapsulation body slot 241 is a slot recessed in the upper surface of the encapsulation body 24, the filter element bracket 29 can be mounted on the encapsulation body slot 241 to support the filter element 28 thereon.

[0127] Of course, it should be understood that in other examples of the present application, the filter element 28 can also be directly mounted on the first encapsulation portion 242 of the encapsulation body 24 to be held in the photosensitive path of the photosensitive chip 22. It is worth mentioning that when the encapsulation body slot 241 is recessed in the upper surface of the encapsulation body 24, the encapsulation body slot 241 is adjacent to the first molding portion 241 so that the glue overflowing when the filter element 28 is mounted on the first encapsulation portion 242 can be received in the encapsulation body slot 241 to prevent the excess glue from contaminating other components (especially the photosensitive chip 22). That is to say, in the embodiment of the present application, the encapsulation body slot 241 also functions as a glue overflow slot. It should be understood that in order to better guide the flow of the glue, in other examples of the present application, a diversion groove communicating with the encapsulation body slot 241 can be further recessed on the upper surface of the first encapsulation portion 242 to guide the excess glue to flow to the encapsulation body slot 241.

[0128] Alternatively, in some examples of the present application, the first encapsulation portion 242 further includes a mounting platform recessedly formed on the upper surface of the first encapsulation portion 242, and the mounting platform is configured to mount the filter element 28 thereon. It should be understood that, compared with directly mounting the filter element 28 on the upper surface of the first encapsulation portion 242, mounting the filter element 28 on the mounting platform is beneficial to reducing the size of the filter element 28 to reduce the cost of the filter element 28. Moreover, such a mounting method can also shorten the distance between the filter element 28 and the photosensitive chip 22, so as to reduce the overall thickness dimension of the photosensitive assembly 20. It is worth mentioning that, in the embodiments of the present application, the inner side surface of the first encapsulation portion 242 can be perpendicular to the photosensitive chip 22 or inclined to the photosensitive chip 22. Among them, different settings of the inner side surfaces correspond to different convex parameter configurations of the molding die 90, but this is not limited to the present application.

[0129] Those skilled in the art should know that, in the embodiments of the present application, the filter element 28 can be implemented as different types, including but not limited to that the filter element 28 can be implemented as an infrared cut-off filter, a full-transmission spectrum filter, and other filters or a combination of multiple filters. Specifically, for example, when the filter element 28 is implemented as a combination of an infrared cut-off filter and a full-transmission spectrum filter, that is, the infrared cut-off filter and the full-transmission spectrum filter can be switched to selectively be located on the light-sensitive path of the photosensitive chip 22. In this way, when used in an environment with sufficient light such as during the day, the infrared cut-off filter can be switched to the light-sensitive path of the photosensitive chip 22 to filter the infrared rays in the light reflected by the object and entering the photosensitive chip 22. And when used in an environment with dim light such as at night, the full-transmission spectrum filter can be switched to the light-sensitive path of the photosensitive chip 22 to allow the infrared ray part in the light reflected by the object and entering the photosensitive chip 22 to transmit light.

[0130] Preferably, in the embodiments of the present application, the filter element bracket 29 is made of a material with relatively high rigidity (for example, metal, PMMA, ceramic, ABS resin, etc.), so that the filter element bracket 2927B has relatively high structural strength.

[0131] In summary, based on the embodiments of the present application, the camera module and its photosensitive assembly are clarified. By means of opening the encapsulation body slot on the encapsulation body and / or opening the circuit board slot on the circuit board, the deformation amount of the photosensitive chip caused by stress is effectively reduced, so as to improve the imaging quality of the camera module.

[0132] Schematic manufacturing process of the photosensitive component

[0133] Figure 14A and 14B FIG. illustrates a schematic diagram of the manufacturing process of the photosensitive component 20 according to an embodiment of the present application, wherein, Figure 14A and 14B the manufacturing process of the photosensitive component 20 illustrated in is taken as an example to manufacture the photosensitive component 20 as illustrated in Figure 3 .

[0134] As Figure 14A and 14B shown, the manufacturing process first includes: providing a circuit board 21, wherein the circuit board 21 has at least one photosensitive chip mounting area 211, and the photosensitive chip mounting area 211 is configured to mount at least one photosensitive chip 22 thereon. The circuit board 21 further includes at least one circuit board slot 213 formed therethrough, and the circuit board slot 213 is disposed outside the photosensitive chip mounting area 211.

[0135] Further, at least one photosensitive chip 22 is mounted on the mounting area of the circuit board 21 and the photosensitive chip 22 is electrically connected to the circuit board 21, and at least one electronic component 23 is mounted on the surrounding area of the photosensitive chip 22.

[0136] Further, the circuit board 21 is placed in a molding die 90, wherein the molding die 90 includes an upper die 91 and a matching lower die 92. Specifically, in the manufacturing process of this example, the circuit board 21 is placed on the lower die 92 of the molding die 90, and then the upper die 91 and the lower die 92 are closed, so that the circuit board 21 is received in the molding space defined by the upper die 91 and the lower die 92.

[0137] To avoid the circuit board slot 213 being filled with the molding material during the molding process, before closing the upper die 91 and the lower die 92, at least one intermediate 922 is filled into the slot of the circuit board 21 to seal the circuit board slot 213. It is worth mentioning that the material of the intermediate 922 can be selected as materials such as glue and silica gel that are soluble or easily rinsable, so as to facilitate the removal of the intermediate 922 after molding to form a corresponding package slot 241 and a circuit board slot 213.

[0138] Specifically, in the manufacturing process of this example, the filling height of the intermediate 922 is greater than the height of the circuit board slot 213, and the volume of the intermediate 922 on the upper surface of the circuit board 21 exceeds the volume of the intermediate 922 filled in the circuit board slot 213, so that the volume of the package slot 241 after molding is greater than the volume of the circuit board slot 213.

[0139] It is worth mentioning that during the manufacturing process of other examples of the present application, the height of the mediator 922 can also be equal to the circuit board slot 213. In this way, after the molding material is cured and formed and the mediator 922 is removed, the circuit board slot 213 is formed at the corresponding position of the mediator 922 without including the molding body slot 241.

[0140] More specifically, in this example of the present application, the upper mold 91 includes an upper mold body 911 and a first protrusion 912 that extends downward at intervals from the upper mold body 911. Among them, the first protrusion 912 has a closed ring shape, for example, a "mouth" shape. When the upper mold 91 and the lower mold 92 are closed, the first protrusion 912 of the upper mold 91 fits against the non-photosensitive area of the photosensitive chip 22 to form a first molding space 913 between the first protrusion 912 and the upper mold body 911, where the mediator 922 is located in the first molding space 913. After filling the mediator 922, the mediator 922 can be cured by means of photocuring, thermal curing, or steam curing. In this way, when the molding material is injected into the first molding space 913, the mediator 922 can effectively prevent the molding material from flowing into the circuit board slot 213.

[0141] After the molding material is cured and formed, the package 24 is formed in the first molding space 913. Further, the upper mold 91 and the lower mold 92 of the molding mold 90 are separated to expose the photosensitive component 20. Further, the mediator 922 is removed to form the interconnected circuit board slot 213 and the package slot 241 at the corresponding position of the mediator 922. It is worth mentioning that since the volume of the mediator 922 located on the upper surface of the circuit board 21 exceeds the volume of the mediator 922 filled in the circuit board slot 213, the volume of the package slot 241 after molding is larger than the volume of the circuit board slot 213. In a specific implementation, the mediator 922 can be removed by means such as solvent dissolution and high-pressure flushing.

[0142] It is worth mentioning that in order to prevent the photosensitive chip 22 from being impacted by the injected molding material during the molding process and causing a positional shift, during the manufacturing process of this example of the present application, before performing the molding process, a side encapsulation that covers at least a part of the side of the photosensitive chip 22 and the lead 25 can also be provided on the side of the photosensitive chip 22 to prevent the position of the photosensitive chip 22 from shifting during the molding process.

[0143] Further, a filter element holder 29 is assembled on the photosensitive component 20, and a filter element 28 is installed on the filter element holder 29, thus obtaining the photosensitive component 20 as shown in Figure 3 the schematic illustration.

[0144] It is worth mentioning that, in the embodiment of the present application, the photosensitive component 20 can also be mass-produced by means of a panelization operation. That is to say, in the manufacturing process of this example of the present application, the circuit board 21 can be implemented as a circuit board panel including at least two circuit boards 21, so as to form multiple photosensitive component 20 monomers in one molding.

[0145] Figure 15 The figure illustrates a schematic diagram of the manufacturing process of the photosensitive component 20 according to the embodiment of the present application, wherein Figure 15 the manufacturing process of the photosensitive component 20 shown in is taken as an example for manufacturing the photosensitive component 20 as shown in Figure 3 the schematic illustration.

[0146] As shown in Figure 15 the manufacturing process first includes: providing a circuit board 21, wherein the circuit board 21 has at least one photosensitive chip mounting area 211, and the photosensitive chip mounting area 211 is configured to mount at least one photosensitive chip 22 thereon. The circuit board 21 further includes at least one circuit board slot 213 formed therethrough, and the circuit board slot 213 is disposed outside the photosensitive chip mounting area 211.

[0147] Further, at least one photosensitive chip 22 is mounted on the mounting area of the circuit board 21 and the photosensitive chip 22 is electrically connected to the circuit board 21, and at least one electronic component 23 is mounted on the surrounding area of the photosensitive chip 22.

[0148] Further, the circuit board 21 is placed in a molding die 90, wherein the molding die 90 includes an upper die 91 and a matching lower die 92. Specifically, in the manufacturing process of this example, the circuit board 21 is placed on the lower die 92 of the molding die 90, and then the upper die 91 and the lower die 92 are closed, so that the circuit board 21 is received in the molding space defined by the upper die 91 and the lower die 92.

[0149] In particular, in this example of the present application, the upper mold 91 includes an upper mold body 911 and a first protrusion 912 that extends downwardly and is spaced apart from the upper mold body 911. The first protrusion 912 has a closed ring shape, for example, a "mouth" shape. When the upper mold 91 and the lower mold 92 are closed, the first protrusion 912 of the upper mold 91 fits against the non-photosensitive area of the photosensitive chip 22 to form a first molding space 913 between the first protrusion 912 and the upper mold body 911. The lower mold 92 includes a lower mold body 921 and at least one intermediate member 922 that protrudes from the lower mold body 921. When the upper mold 91 and the lower mold 92 are closed, at least one intermediate member 922 is respectively inserted into the circuit board slot 213 in a fitting manner to seal the circuit board slot 213. That is to say, compared with Figure 14A and 14B the manufacturing process shown, in this example, at least one intermediate member 922 is integrally and prominently formed on the lower mold body 921. Preferably, the material of at least one intermediate member 922 is the same as the material of the lower mold body 921.

[0150] In particular, the intermediate member 922 has a specific height such that when the intermediate member 922 is inserted into the circuit board slot 213 in a fitting manner, the height of the portion of the intermediate member 922 protruding from the circuit board slot 213 exceeds the height of the circuit board slot 213, so that the volume of the package slot 241 after molding is greater than the volume of the circuit board slot 213

[0151] It is worth mentioning that in the manufacturing process of other examples of the present application, the height of the intermediate member 922 may also be equal to that of the circuit board slot 213. In this way, after the molding material is cured and demolded, the circuit board slot 213 is formed at the corresponding position of the intermediate member 922 without including the molding body slot 241.

[0152] It should be understood that when the molding material is injected into the first molding space 913, the intermediary 922 can effectively prevent the molding material from flowing into the circuit board slot 213. Further, after the molding material is cured and formed, the encapsulation body 24 is formed in the first molding space 913. Further, the upper mold 91 and the lower mold 92 of the molding mold 90 are separated to expose the photosensitive component 20. It should be understood that when the upper mold 91 is separated from the lower mold 92, the intermediary 922 is detached from the circuit board slot 213 to form the interconnected encapsulation body slot 241 and the circuit board slot 213 at the corresponding position of the intermediary 922. It is worth mentioning that, for easy demolding, a demolding agent can be coated on the molding surface of the lower mold 92 before mold closing to facilitate the detachment of the lower mold 92 from the circuit board slot 213, wherein the demolding agent includes but is not limited to silicone series demolding agents (such as siloxides, silicone oils, etc.), wax series demolding agents. Of course, the demolding agent can also be replaced with a film.

[0153] It is also worth mentioning that since the height of the part of the intermediary 922 protruding from the circuit board slot 213 exceeds the height of the circuit board slot 213, the volume of the encapsulation body slot 241 after molding is larger than the volume of the circuit board slot 213, so that the volume of the encapsulation body slot 241 after molding is larger than the volume of the circuit board slot 213.

[0154] It is also worth mentioning that in the embodiment of the present application, the cross-sectional shape of the encapsulation body slot 241 and the cross-sectional shape of the circuit board slot 213 can be determined by the shape of the intermediary 922 of the lower mold 92. In particular, in the example, the intermediary 922 is a cuboid column, so that the cross-section of the encapsulation body slot 241 and the cross-section of the circuit board slot 213 are implemented as rectangles or squares. Figure 16 Another schematic diagram of the molding mold 90 in the manufacturing process according to the embodiment of the present application is illustrated. As Figure 16 shown, in this example, the intermediary 922 has a frustum of a pyramid shape, so that the cross-section of the encapsulation body slot 241 and the cross-section of the circuit board slot 213 are implemented as isosceles trapezoids, and the cross-sectional area of the encapsulation body slot 241 is smaller than the cross-section of the circuit board slot 213 to facilitate the detachment of the lower mold 92 from the circuit board slot 213.

[0155] It is also worth mentioning that in order to prevent the photosensitive chip 22 from being impacted by the injected molding material during the execution of the molding process and causing a positional shift, during the manufacturing process of this example of the present application, before the execution of the molding process, a side encapsulation rubber that covers at least a part of the side of the photosensitive chip 22 and the lead 25 can also be provided on the side of the photosensitive chip 22 to prevent the position of the photosensitive chip 22 from shifting during the execution of the molding process.

[0156] Further, a filter element bracket 29 is assembled on the photosensitive component 20, and a filter element 28 is installed on the filter element bracket 29, thus obtaining the Figure 3 photosensitive component 20 as shown.

[0157] Further, a filter element bracket 29 is assembled on the photosensitive component 20, and a filter element 28 is installed on the filter element bracket 29, thus obtaining the Figure 3 photosensitive component 20 as shown.

[0158] It is worth mentioning that in the embodiment of the present application, the photosensitive component 20 can also be mass-produced by means of a paneling operation. That is to say, during the manufacturing process of this example of the present application, the circuit board 21 can be implemented as a circuit board panel including at least two circuit boards 21 to form multiple photosensitive component monomers at one time.

[0159] In summary, the manufacturing method of the photosensitive component based on the embodiment of the present application is clarified. It should be understood that although in the Figure 14A and 14B and Figure 15 shown in the manufacturing process of the photosensitive component to manufacture the example of the photosensitive component as shown in Figure 3 those skilled in the art should be able to easily infer the manufacturing process of the photosensitive component shown in other deformation implementations based on the Figure 14A and 14B and Figure 15 shown in the manufacturing process, and details are not described herein again.

[0160] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and explained in the embodiments. Without departing from the principle, any deformation or modification of the embodiments of the present invention is possible.

Claims

1. A photosensitive component, characterized in that, comprising: a circuit board; a photosensitive chip electrically connected to the circuit board; and a package body disposed on the circuit board, wherein the circuit board has a circuit board slot recessed therein, and the circuit board slot is located outside the photosensitive chip mounting area; the circuit board slot is formed through the circuit board; the package body is integrally formed on the circuit board, and the package body has a package body slot recessed therein, wherein the package body slot is located outside the photosensitive chip mounting area; the package body includes a first package portion and a second package portion divided by the package body slot, and the first package portion covers at least a part of the circuit board and at least a part of the non-photosensitive area of the photosensitive chip; the package body slot is formed through the package body and communicates with the circuit board slot; the package body slot is a closed loop slot surrounding the first package portion.

2. The photosensitive component according to claim 1, wherein, the circuit board includes a first circuit board portion and a second circuit board portion divided by the circuit board slot, wherein the photosensitive chip is mounted on the first circuit board portion.

3. The photosensitive component according to claim 2, further comprising at least one electronic component, wherein, the at least one electronic component is disposed on the second circuit board portion.

4. The photosensitive component according to claim 3, wherein, the circuit board slot is symmetrically arranged with respect to the photosensitive chip.

5. The photosensitive component according to claim 3, wherein, the second package portion covers at least a part of the at least one electronic component and at least a part of the circuit board.

6. The photosensitive component according to claim 5, wherein, the package body slot is symmetrically distributed with respect to the photosensitive chip.

7. The photosensitive component according to claim 1, wherein, the volume of the package body slot is larger than that of the circuit board slot.

8. The photosensitive component according to claim 7, wherein, the cross-sectional dimension of the package body slot is larger than the cross-sectional dimension of the circuit board through hole.

9. The photosensitive component according to claim 7, wherein, the cross-sectional dimension of the package body slot is consistent with the cross-sectional dimension of the circuit board slot.

10. The photosensitive component according to claim 7, wherein, the cross-sectional dimension of the package body slot is smaller than the cross-sectional dimension of the circuit board slot.

11. The photosensitive component according to claim 1, further comprising a buffer element, and the buffer element is disposed in a communication slot formed by the mutually communicating circuit board slot and the package body slot.

12. The photosensitive component according to claim 11, further comprising a reinforcing plate, and the reinforcing plate is mounted on the lower surface of the circuit board.

13. An imaging module, characterized in that, comprising: an optical lens; and the photosensitive component according to any one of claims 1-12, wherein the optical lens is held in the photosensitive path of the photosensitive component.

14. A manufacturing method of a photosensitive component, characterized in that, comprising: Provided is a circuit board, wherein the circuit board has at least one photosensitive chip mounting area for mounting at least one photosensitive chip thereon, wherein the circuit board includes at least one circuit board slot formed therethrough, and the circuit board slot is located outside the photosensitive chip mounting area; and A package is disposed on the circuit board; wherein the package has a package slot formed recessedly therein, and the package slot is located outside the photosensitive chip mounting area; the package includes a first package portion and a second package portion divided by the package slot, and the first package portion covers at least a part of the circuit board and at least a part of the non-photosensitive area of the photosensitive chip; the package slot is formed through the package and is in communication with the circuit board slot; the package slot is a closed loop slot surrounding the first package portion.

15. The manufacturing method of the photosensitive component according to claim 14, wherein, Disposing the package on the circuit board includes: placing the circuit board in a forming space formed when the upper mold and the lower mold of a forming mold are closed, and at least one intermediate is respectively and adaptively disposed in the circuit board slot; Forming a package in the forming space; and Separating the upper mold and the lower mold of the forming mold.

16. The manufacturing method of the photosensitive component according to claim 15, wherein, The height of the intermediate is greater than that of the circuit board slot. After separating the upper mold and the lower mold of the forming mold, it further includes: removing the intermediate to form the mutually communicating circuit board slot and package slot at the corresponding position of the intermediate.

17. The manufacturing method of the photosensitive component according to claim 14, wherein, The circuit board is implemented as a panel of circuit boards.

Images