The acoustic head of an ultrasonic probe and the ultrasonic probe

Abstract

In a sound head and an ultrasonic probe, a conductive layer formed of a conductive material is provided on the side wall of the internal element, the side wall of the backing, and the negative electrode docking portion of the flexible circuit board. The conductive layer extends from the negative electrode of the wafer through the side wall of the backing and continuously to the grounding point of the negative electrode docking portion, electrically connecting the negative electrode of the internal element to the grounding point. This structure omits the traditional copper foil, and the flexible circuit board is directly electrically connected to the negative electrode of the internal element by using the conductive layer, which can reduce the overall structure of the sound head and is conducive to the consistency of the wafer, the backing, and the matching layer.

Description

Technical Field

[0001] This application relates to the field of medical devices, and particularly to a sound head structure of an ultrasonic probe. Background Art

[0002] An ultrasonic probe is an important component of an ultrasonic device (such as an ultrasonic diagnostic imaging device). Its working principle is to use the piezoelectric effect to convert the excitation electrical pulse signal of the ultrasonic whole machine into an ultrasonic wave signal that enters the patient's body, and then convert the ultrasonic echo signal reflected by the tissue into an electrical signal, thereby realizing the detection of the tissue.

[0003] Among them, a transesophageal ultrasonic probe (TEE) is a device that can extend into the body cavity of a human body for ultrasonic detection. Usually, please refer to Figure 1 and 2 , this type of ultrasonic probe includes a backing 1, a flexible circuit board 2, a wafer 3, a copper foil 4, and a matching layer 5. The flexible circuit board 2 covers the backing 1, and the wafer 3 is located on the flexible circuit board 2. The copper foil 4 covers the wafer 3, and the matching layer 5 is located on the copper foil 4. The outer side of the flexible circuit board 2 is bent from the top wall of the backing 1 to the outer wall position, and the outer side of the copper foil 4 is bent from the top wall of the wafer 3 to the flexible circuit board 2 and welded to the flexible circuit board 2, thereby leading out the positive and negative electrodes of the wafer 3 to the flexible circuit board 2.

[0004] Since this ultrasonic probe is used to view the heart through the esophagus, therefore, the smaller the sound head volume, the better. However, although the volume of existing such ultrasonic probes has been reduced as much as possible, it still causes discomfort to patients. Summary of the Invention

[0005] This application mainly provides a sound head of an ultrasonic probe and an ultrasonic probe using such a sound head to provide a new structure for leading out the negative electrode of an array element.

[0006] In one embodiment of this application, a sound head of an ultrasonic probe is provided, including:

[0007] A backing, the backing having a support platform;

[0008] A flexible circuit board, the flexible circuit board being installed on the support platform, the flexible circuit board having a negative electrode docking portion, the negative electrode docking portion being bent downward to fit against the side surface of the backing, and the negative electrode having a grounding point;

[0009] A wafer, the wafer being cut into a plurality of strip-shaped array elements, the array elements including edge array elements and internal array elements. Among them, the array elements located on both outer sides are edge array elements. The array elements are arranged on the flexible circuit board. The upper surface of the array element is the negative electrode, and the lower surface of the array element is the positive electrode. The flexible circuit board is electrically connected to the positive electrode of the internal array element;

[0010] and a matching layer covering the wafer;

[0011] Among them, the side walls of the internal array element, the side walls of the backing and the negative electrode docking part of the flexible circuit board are all provided with a conductive layer formed by a conductive material, and the conductive layer extends continuously and uninterruptedly from the negative electrode of the chip through the side walls of the backing to the grounding point of the negative electrode docking part, so that the negative electrode of the internal array element is electrically connected to the grounding point.

[0012] In one embodiment, a partition groove is provided on the lower surface of the internal array element to separate the conductive layer on the side wall of the internal array element from the positive electrode.

[0013] In one embodiment, the side wall of the edge array element has a conductive layer, the conductive layer of the edge array element is electrically connected to the conductive layer of the internal array element, the conductive layer conducts the positive and negative electrodes of the edge array element, and the flexible circuit board is electrically connected to the positive electrode of the edge array element.

[0014] In one embodiment, the backing has a cutting groove, and the lowest edge of the conductive layer on the side wall of the backing is lower than the lowest edge of the cutting groove.

[0015] In one embodiment, the conductive layer is a gold-plated layer.

[0016] In one embodiment, the negative electrode docking portion extends from the location of the edge array element.

[0017] In one embodiment, the flexible circuit board has a positive electrode docking portion and at least one adapter portion, the positive electrode docking portion has a positive electrode connection point, the adapter portion has a adapter point for connecting to a control unit of an ultrasound probe, the positive electrode connection point and the grounding point are both electrically connected to the adapter point, the positive electrode docking portion is mounted on a support platform, the array element is located above the positive electrode docking portion, and the positive electrodes of all internal array elements are electrically connected to the positive electrode connection point.

[0018] In one embodiment, the backing includes at least two backing blocks, which are arranged side by side and assembled to form the support platform, and the transition portion extends out of the backing from the gap between adjacent backing blocks.

[0019] In one embodiment, the backing includes at least three backing blocks, which are respectively a first backing block, a second backing block and a third backing block, the second backing block and the third backing block are located on both sides of the first backing block, the flexible circuit board has at least two transition parts, which are respectively a first transition part and a second transition part, the positive electrode docking part is located on the top wall of the first backing block, the first transition part extends from the gap between the first backing block and the second backing block to the outside of the backing, and the second transition part extends from the gap between the first backing block and the third backing block to the outside of the backing.

[0020] In one embodiment, the two side walls of the first backing block are symmetrically arranged relative to the top wall.

[0021] In one embodiment, the top walls of the backing blocks are flush and are assembled into the planar support platform.

[0022] In one embodiment, a sound head of an ultrasonic probe is provided, and the sound head includes:

[0023] A backing;

[0024] A flexible circuit board having a negative electrode docking portion;

[0025] A wafer disposed on the top wall of the backing, the wafer including a plurality of array elements, and the positive electrodes of at least a part of the plurality of array elements are electrically connected to the flexible circuit board;

[0026] And a matching layer disposed on the wafer;

[0027] Wherein, a conductive layer formed of a conductive material is formed on at least a part of the side wall of the wafer and / or the side wall of the backing, and the conductive layer electrically connects the negative electrodes of at least a part of the plurality of array elements of the wafer to the negative electrode docking portion of the flexible circuit board.

[0028] In one embodiment of the present application, an ultrasonic probe is provided, including the sound head and a base as described in any one of the above, and the sound head is mounted on the base through the backing.

[0029] In the sound head and the ultrasonic probe according to the above embodiments, conductive layers formed of a conductive material are provided on the side walls of the internal array elements, the side walls of the backing, and the negative electrode docking portion of the flexible circuit board. The conductive layer extends from the negative electrode of the wafer through the side wall of the backing continuously and uninterruptedly to the grounding point of the negative electrode docking portion, so that the negative electrode of the internal array element is electrically connected to the grounding point. This structure omits the traditional copper foil, and the flexible circuit board is directly electrically connected to the negative electrode of the internal array element by using the conductive layer, which can reduce the overall structure of the sound head and is beneficial to the consistency of the wafer, the backing, and the matching layer. Description of the Drawings

[0030] Figure 1 It is a schematic structural diagram of a sound head of a transesophageal ultrasonic probe;

[0031] Figure 2 For Figure 1 A cross-sectional view of the sound head;

[0032] Figure 3 It is a schematic structural diagram of the sound head (before the wafer is cut) in one embodiment of the present application;

[0033] Figure 4 It is an exploded schematic diagram of the sound head in one embodiment of the present application;

[0034] Figure 5 This is a cross-sectional view of the acoustic head in an embodiment of the present application;

[0035] Figure 6 This is a schematic diagram of using a conductive layer to lead out the negative electrode of the array element in an embodiment of the present application;

[0036] Figure 7 This is a schematic structural diagram of a flexible circuit board and a backplane (before the wafer is cut) in an embodiment of the present application;

[0037] Figures 8 - 10 This is a schematic diagram of different shapes of the first backplane block in an embodiment of the present application;

[0038] Figure 11 This is a schematic structural diagram of the lower surface (positive electrode) of the wafer in an embodiment of the present application. Detailed implementation manners

[0039] The present invention will be further described in detail below in conjunction with the accompanying drawings through specific implementation manners. Similar elements in different implementation manners are labeled with related similar element numbers. In the following implementation manners, many detailed descriptions are provided to enable a better understanding of the present application. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification to avoid overwhelming the core part of the present application with excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the descriptions in the specification and general technical knowledge in the art.

[0040] In addition, the features, operations, or characteristics described in the specification can be combined in any appropriate manner to form various implementation manners. At the same time, the steps or actions in the method description can also be reordered or adjusted in an obvious manner by those skilled in the art. Therefore, the various sequences in the specification and drawings are only for clearly describing a certain embodiment and do not mean that they are the necessary sequences, unless it is stated that a certain sequence must be followed.

[0041] The serial numbers assigned to the components in this article, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meanings. The "connection" and "coupling" mentioned in the present application, unless otherwise specified, both include direct and indirect connections (couplings).

[0042] This embodiment provides a sound head of an ultrasonic probe, which can be applied to various ultrasonic probes. In the following, a transesophageal ultrasonic probe (TEE) is taken as an example for illustration. However, the present invention is not limited to the transesophageal ultrasonic probe.

[0043] Please refer to Figures 3 to 5 , the sound head includes a wafer 100, a backing 200, a flexible circuit board 300, and a matching layer 500.

[0044] The wafer 100 is cut into a plurality of strip-shaped array elements. These array elements can be used to transmit and receive ultrasonic signals. Among them, the upper surface of the array element is the negative pole, and the lower surface is the positive pole. Usually, the array elements include internal array elements 110 and edge array elements 120. Please refer to Figure 4 and 11 , generally, the array elements located on both outer sides are edge array elements 120. Among them, there can be more than one edge array element 120 on each side. The backing 200 has a support platform, and the support platform serves as a support structure for the flexible circuit board 300, the wafer 100, and the matching layer 500.

[0045] Please refer to Figures 3 to 5 , the matching layer 500 is an acoustic material layer laid on the radiation surface of the wafer 100 to achieve the matching of the acoustic characteristic impedance between the transducer wafer 100 and the sound transmission medium, so that the sound energy can pass through well. The matching layer 500 covers above the negative pole lead-out structure 400.

[0046] Please refer to Figure 3 , the flexible circuit board 300 has a negative pole docking part 330. The negative pole docking part 330 has a grounding point. The negative pole docking part 330 is bent downward to fit against the side surface of the backing 200. In order to lead out the negative pole of the internal array element 110 (or all array elements), please refer to Figure 3 and 6 , a conductive layer A is provided on the side wall of the internal array element 110 (as shown in Figure 11 ), the side wall of the backing 200, and the side wall of the negative pole docking part 330 of the flexible circuit board 300. The conductive layer A is formed of a conductive material. The conductive layer A extends continuously from the negative pole of the internal array element 110 through the side wall of the backing 200 to the grounding point of the negative pole docking part 330, so that the negative pole of the internal array element 110 is electrically connected to the grounding point.

[0047] This structure omits the traditional copper foil, and the flexible circuit board 300 is directly electrically connected to the negative pole of the internal array element 110 by using the conductive layer A, which can reduce the overall structure of the sound head and is beneficial to the consistency of the external shapes of the wafer 100, the backing 200, and the matching layer 500, especially the side walls.

[0048] In one embodiment, as shown in Figures 3 to 5 , the negative pole docking part 330 starts from the edge array element 120 (as shown inFigure 11 It is led out from the position shown in the figure. This can not only avoid setting too many negative electrode docking parts 330 on the flexible circuit board 300, but also make clever use of the space of the edge array elements 120, and set the relevant circuits on the flexible circuit board 300 below the edge array elements 120. Without changing the size of the wafer 100, the volume of the entire sound head can be further reduced.

[0049] Please refer to Figure 3 , the negative electrode docking part 330 is bent downward to the side of the backing 200. Since the edge array elements 120 are not directly used for the emission and recovery of ultrasonic waves, the flexible circuit board 300 does not have to be connected to the positive electrode of the edge array elements 120. Therefore, in some embodiments, the negative electrode docking part 330 can be bent downward below the edge array elements 120, so that the negative electrode docking part 330 does not protrude beyond the wafer 100, or only slightly protrudes beyond the wafer 100, further reducing the width of the sound head.

[0050] Furthermore, the upper surface of the internal array element 110 is the negative electrode and the lower surface is the positive electrode. Since a conductive layer A is provided on the side wall of the internal array element 110, its positive electrode and negative electrode may be conducted. To eliminate this hidden danger, in one embodiment, as Figure 11 shown, the lower surface of the internal array element 110 has a partition groove 101 to separate the conductive layer A on the side wall of the internal array element 110 from the positive electrode. Each internal array element 110 may have a conductive layer A provided on the side wall at one end or both ends, and the partition groove 101 is provided corresponding to the conductive layer A. As Figure 6 and 11 shown, in one embodiment, conductive layers A are provided on the side walls at both ends of the internal array element 110 to enhance the conduction effect of the conductive layer A on the negative electrode of the array element and avoid the situation where the negative electrode of the internal array element 110 cannot be led out due to a break in a certain section of the conductive layer A. At this time, the partition groove 101 can separate the middle part of the internal array element 110 from the end part to avoid short-circuiting of its positive electrode and negative electrode. When only one side wall of the internal array element 110 is provided with a conductive layer A, the partition groove 101 can be provided only at this end.

[0051] As for the edge array elements 120, generally, no conductive layer A is provided on their side walls, which will not affect the leading out of the negative electrode of the internal array element 110. Of course, in some embodiments, corresponding conductive layers A can also be provided at both ends of the edge array elements 120. For the convenience of overall processing, the partition groove 101 can be processed for the entire wafer 100 together, and at this time, the partition groove 101 can also be provided on the edge array elements 120.

[0052] Of course, please refer to Figure 11, In one embodiment, the sidewall of the edge element 120 also has a conductive layer A, and the conductive layer A of the edge element 120 is electrically connected to the conductive layer A of the internal element 110. At this time, the conductive layer A conducts the positive and negative electrodes of the edge element 120, and the flexible circuit board 300 is electrically connected to the positive electrode of the edge element 120. That is, through the edge element 120, the negative electrode of the internal element 110 can be conducted to the flexible circuit board 300 to enhance the extraction effect of the negative electrode of the internal element 110.

[0053] Further, usually the wafer 100 is cut after being placed on the backing 200 and the flexible circuit board 300, as Figure 4 and 11 shown. When cutting the wafer 100, the matching layer 500, the positive electrode docking portion 310 of the flexible circuit board 300, and the backing 200 are also cut at the same time. Among them, the matching layer 500 may be cut into the same shape and structure as the wafer 100. And the positive electrode docking portion 310 of the flexible circuit board 300 will also be cut out into a strip structure consistent with the wafer 100, and the positive electrode connection point is located on this strip structure. The backing 200 is a support structure, and its top surface has a cutting groove. In order to prevent the cutting groove from cutting off the conductive layer A, in one embodiment, the lowest edge of the conductive layer A on the sidewall of the backing 200 is lower than the lowest edge of the cutting groove, so that the conductive layer A is always in a conductive state.

[0054] Generally, the above-mentioned conductive layer A can be made of various conductive materials. However, in order to ensure reliable conduction, preferably, the conductive layer A can be made of a relatively soft anti-oxidant metal, such as gold plating. After plating the conductive layer A, the sound head needs to be cut, so it is necessary to ensure that the conductive layer A is not easy to fall off and break the edge during cutting. In one embodiment, the conductive layer A is a gold plating layer.

[0055] Furthermore, in terms of leading out the positive electrode of the element, various structures can also be used to achieve it. Please refer to Figures 3 to 5 and Figure 7 , In one embodiment, the backing 200 includes at least two backing blocks (such as 210, 220, 230), and the backing blocks are arranged side by side and are joined together to form a support platform. Generally, the top walls of the backing blocks are flush and joined together to form a flat support platform. Of course, whether the top wall of the support platform is specifically flat or other shapes can be set according to the actual structural needs, and it can also be arc-shaped, undulating, and irregular shapes, etc., to adapt to the structures of other components.

[0056] The support platform serves as a support structure for the flexible circuit board 300, the wafer 100 and the matching layer 500. The flexible circuit board 300 also has a positive electrode docking portion 310 and at least one adapter portion 320. The positive electrode docking portion 310 has a positive electrode connection point, the negative electrode docking portion 330 has a grounding point, and the adapter portion 320 has a transfer point for connecting to the control unit of the ultrasound probe, and the positive electrode connection point and the grounding point are both electrically connected to the transfer point. Among them, various electrical connection ends such as these positive electrode connection points, grounding points and transfer points can be realized by using common electrical connection structures such as electrodes and connection terminals.

[0057] The transfer point can be divided into a positive transfer point and a negative transfer point. The positive connection point is electrically connected to the positive transfer point, and the negative transfer point is electrically connected to the ground point. Of course, in order to achieve these electrical connections, some circuits can be set on the flexible circuit board 300 to successfully lead out the positive and negative electrodes of the array element. These circuits can be fully realized by existing means, and no further explanation is given here.

[0058] The positive electrode docking portion 310 is mounted on the support platform and can be located on a portion of the support platform. The array element is located above the positive electrode docking portion 310, and the positive electrode of the array element is connected to the positive electrode connection point on the positive electrode docking portion 310. Figure 4 and 5 The positive electrode connecting portion 310 may be located in the middle of all array elements, so that the positive electrode connecting portion 310 can be electrically connected to all array elements (or only the internal array element 110) at the same time with a narrow width.

[0059] The adapter 320 may be one or more. Please refer to Figure 4 , 5 7, two transition parts 320 are shown in the figure. In some embodiments, one of the two transition parts 320 can be omitted. Figure 5 and 7 As shown, the adapter portion 320 extends from the gap between adjacent backing blocks (for example, between 210 and 220 and between 210 and 230) to the outside of the backing 200 so that the flexible circuit board 300 can be electrically connected to other components, such as the control unit of the ultrasound probe, so as to control the working state of the array element.

[0060] Please refer to Figure 1 and 2 When the transfer portion 21 of the flexible circuit board 2 is arranged outside the backing 1, in order to ensure the electrical connection between the flexible circuit board 2 and the positive electrode of the array element, the bending part of the flexible circuit board 2 must be located outside the chip 3. When the width of the chip 3 remains unchanged, since the flexible circuit board 2 itself needs to occupy a certain amount of extra space when it is bent, the width of the sound head will be expanded outward, and finally the width of the sound head will be greater than the width of the chip 3.

[0061] Please refer to Figure 5 , in this embodiment, since the connection part 320 of the flexible circuit board 300 extends out from the inside of the inner lining, by adjusting the sizes of the back lining blocks, it can be ensured that the width of the back lining 200 is consistent with the width of the wafer 100. Without changing the width size of the wafer 100, the width size of the acoustic head is finally basically the same as that of the wafer 100. It can avoid the additional volume increase due to the bending of the flexible circuit board 300 from the outer side wall of the back lining 200, and reduce the overall volume of the acoustic head. Moreover, this structure can ensure the consistency of the shapes of the matching layer 500, the wafer 100, and the back lining 200.

[0062] Furthermore, please refer to Figure 4 , 5 and 7, in an embodiment, the back lining 200 includes at least three back lining blocks, which are the first back lining block 210, the second back lining block 220, and the third back lining block 230 respectively. The second back lining block 220 and the third back lining block 230 are located on both sides of the first back lining block 210. The flexible circuit board 300 has at least two connection parts 320, which are the first connection part 320a and the second connection part 320b respectively (as shown in Figure 5 ), the positive electrode docking part 310 is located on the top wall of the first back lining block 210. The first connection part 320a extends out of the back lining 200 from the gap between the first back lining block 210 and the second back lining block 220, and the second connection part 320b extends out of the back lining 200 from the gap between the first back lining block 210 and the third back lining block 230.

[0063] This structure is beneficial to setting the positive electrode docking part 310 of the flexible circuit board 300 in the middle of the support platform so as to be able to dock with all the array elements. Setting two connection parts 320 is beneficial to improving the convenience and stability of the connection between the flexible circuit board 300 and other components (such as the control unit). Both of these two connection parts 320 can be used to dock with the control unit. Of course, in some embodiments, one of the second back lining block 220 and the third back lining block 230 can also be omitted, and the top wall of the first back lining block 210 can extend outward to replace the omitted second back lining block 220 or third back lining block 230, so as to form a support platform of the same size. At this time, the connection part 320 on the side of the omitted second back lining block 220 or third back lining block 230 can also be omitted.

[0064] Of course, the first back lining block 210 can be set in any possible shape, which can meet the need to form the required support platform and can lead out the connection part 320 of the flexible circuit board 300 from between the two back lining blocks. However, in terms of processing cost and assembly efficiency, please refer to Figures 8 to 10, usually, the two side walls 212 of the first backing block 210 are symmetrically arranged relative to the top wall 211. Correspondingly, the second backing block 220 and the third backing block 230 have side walls that can fit with the first backing block 210. In particular, in one embodiment, the second backing block 220 and the third backing block 230 are of a symmetric structure, which is not only beneficial for processing but also convenient for assembly.

[0065] Under the condition of symmetric arrangement, the shapes of the two side walls 212 of the first backing block 210 can also be flexibly selected according to needs. Please refer to Figures 8 to 10 , the two side walls 212 of the first backing block 210 can be set but are not limited to being inclined planes (as shown in Figure 8 ), vertical planes arranged in the vertical direction (as shown in Figure 9 ), or inclined arc-shaped surfaces (as shown in Figure 10 ).

[0066] Furthermore, the edge array elements 120 are usually arranged on both sides of the internal array elements 110, and they can be used to protect the internal array elements 110. In order to lead out the positive electrode of the internal array elements 110, in one embodiment, at least the positive electrode of the internal array elements 110 is connected to the positive electrode connection point on the positive electrode docking part 310, and at least the negative electrode of the internal array elements 110 is electrically connected to the ground connection point of the flexible circuit board 300 through the negative electrode lead-out structure 400.

[0067] On the other hand, this embodiment also provides an ultrasonic probe, and the ultrasonic probe includes a sound head as shown in any of the above embodiments. Please refer to Figures 3 to 7 , the ultrasonic probe further includes a base 600, the backing 200 is installed on the base 600 and is assembled to other components through the base 600.

[0068] Of course, the ultrasonic probe also includes components such as a housing and a control unit for controlling the array elements. These structures can be implemented with reference to existing structures, and this embodiment will not elaborate one by one.

[0069] The above uses specific examples to elaborate on this application, which is only used to help understand this application and is not used to limit this application. For those of ordinary skill in the art, according to the idea of this application, the above specific implementation manners can be changed.

Claims

1. The acoustic head of an ultrasonic probe, characterized in that include: Backing; A flexible circuit board, the flexible circuit board is mounted on the backing, the flexible circuit board having a negative electrode docking portion; A wafer, wherein the wafer comprises a plurality of array elements, wherein the array elements comprise edge array elements and internal array elements, wherein the array elements located on the outer sides of both sides are edge array elements, wherein the array elements are arranged on a flexible circuit board, wherein the upper surface of the array element is a negative electrode, and the lower surface of the array element is a positive electrode, and the flexible circuit board is electrically connected to the positive electrode of the internal array element; and a matching layer covering the wafer; Among them, the side walls of the internal array element and the side walls of the backing are provided with a conductive layer formed by a conductive material, and the conductive layer extends continuously and uninterruptedly from the negative electrode of the chip through the side walls of the backing to the grounding point of the negative electrode docking part, so that the negative electrode of the internal array element is electrically connected to the grounding point.

2. The sound head according to claim 1, wherein, The lower surface of the internal array element is provided with a partition groove to separate the conductive layer on the side wall of the internal array element from the positive electrode.

3. The sound head according to claim 1, wherein, The side wall of the edge array element has a conductive layer, the conductive layer of the edge array element is electrically connected to the conductive layer of the internal array element, the conductive layer of the edge array element conducts the positive electrode and the negative electrode of the edge array element, and the flexible circuit board is electrically connected to the positive electrode of the edge array element.

4. The sound head according to claim 1, wherein, The backing has a cutting groove, and the lowest edge of the conductive layer on the side wall of the backing is lower than the lowest edge of the cutting groove.

5. The sound head according to claim 1, characterized in that, The conductive layer is a gold-plated layer.

6. The sound head according to any one of claims 1-5, characterized in that, The negative electrode docking portion extends from the position where the edge array element is located.

7. The sound head according to claim 6, characterized in that, The flexible circuit board has a positive electrode docking portion and at least one transition portion, the positive electrode docking portion has a positive electrode connection point, the transition portion has a transition point for connecting to a control unit of an ultrasound probe, the positive electrode connection point and the grounding point are both electrically connected to the transition point, the positive electrode docking portion is mounted on a backing, the array element is located above the positive electrode docking portion, and the positive electrodes of all internal array elements are electrically connected to the positive electrode connection point.

8. The sound head according to claim 7, characterized in that, The backing includes at least two backing blocks, which are arranged side by side, and the transition portion extends out of the backing from the gap between adjacent backing blocks.

9. The sound head according to claim 7, characterized in that, The backing includes at least three backing blocks, which are respectively a first backing block, a second backing block and a third backing block, the second backing block and the third backing block are located on both sides of the first backing block, the flexible circuit board has at least two transition parts, which are respectively a first transition part and a second transition part, the positive electrode docking part is located on the top wall of the first backing block, the first transition part extends from the gap between the first backing block and the second backing block to the outside of the backing, and the second transition part extends from the gap between the first backing block and the third backing block to the outside of the backing.

10. The sound head according to claim 9, wherein, The side walls of the first backing block are symmetrically arranged relative to the top wall.

11. The acoustic head of an ultrasonic probe, characterized in that, include: Backing; A flexible circuit board, wherein the flexible circuit board has a negative electrode docking portion; A chip, the chip is arranged on the top wall of the backing, the chip comprises a plurality of array elements, and positive electrodes of at least a part of the plurality of array elements are electrically connected to the flexible circuit board; and a matching layer, wherein the matching layer is disposed on the wafer; Wherein, a conductive layer formed of a conductive material is formed on at least a part of the side wall of the wafer and the side wall of the backing, and the conductive layer extends from the negative electrode of the wafer through the side wall of the backing and continuously and uninterruptedly to the grounding point of the negative electrode docking portion, so that the negative electrodes of at least some of the array elements are electrically connected to the grounding point through the conductive layer.

12. An ultrasonic probe, characterized in that, Comprising a sound head and a base as described in any one of claims 1-11, wherein the sound head is mounted on the base through a backing.

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