Water-cooling pressure head on mobile phone display screen bonding equipment

A display screen and water-cooling technology, applied in lighting and heating equipment, household refrigeration equipment, coil equipment, etc., can solve quality problems, poor contact of electronic pin lines, and reduce the connection strength and stress of FPC and liquid crystal glass circuits and other issues to achieve the effect of improving product quality

CN112485933APending Publication Date: 2021-03-12东莞市华慧智能装备有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2021-03-12

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Abstract

The invention belongs to the technical field of mobile phone display screen manufacturing, and particularly relates to a water-cooling pressure head on mobile phone display screen bonding equipment, which comprises two water-cooling glands, pressure head mounting blocks are arranged on the sides, close to each other, of the two water-cooling glands, and the pressure head mounting blocks are fixedly connected with the two water-cooling glands; and a tool bit is fixedly mounted on the pressure head mounting blocks, end covers are fixedly mounted on the two sides of the pressure head mounting blocks correspondingly, the two end covers make contact with the two sides of the two water-cooling glands correspondingly, and first cooling water pipes are fixedly mounted on the same sides of the twoend covers correspondingly. According to the invention, poor contact and mechanical connection of the electronic circuit caused by springback of the material due to evacuation of the pressure head ina high-temperature state in the bonding process of the FPC electronic circuit are avoided.
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Description

technical field

[0001] The invention relates to the technical field of mobile phone display screen manufacturing, in particular to a water-cooled pressure head on a mobile phone display screen bonding device. Background technique

[0002] Bonding indenters are widely used in mobile phone screen liquid crystal display module LCM (Liquid Display Module) combined connection bonding process equipment; that is, liquid crystal display, drive circuit, FPC (Flexible Printed Circuit, flexible printed circuit board), backlight The components assembled together with other structural parts, and the mechanical connection and electrical conduction between the liquid crystal glass, the drive circuit and the FPC in the liquid crystal display are the core parts of the LCM production, and the production process of the liquid crystal glass and the FPC is FOG (Film On Glass ) bonding process, which is to mount the FPC on the glass panel; and the process equipment in the FOG bonding process will...

Examples

Embodiment

[0026] Please refer to Figure 1-3 , the present invention provides a technical solution: a water-cooled indenter on a mobile phone display bonding device, including two water-cooled glands 1, and an indenter mounting block 13 is provided on the side where the two water-cooled glands 1 are close to each other. The indenter mounting block 13 is fixedly connected with the two water-cooled glands 1, the indenter mounting block 13 is fixedly equipped with a cutter head 2, and both sides of the indenter mounting block 13 are fixedly installed with end caps 5, two end caps 5 They are in contact with both sides of the two water-cooled glands 1 respectively, and the first cooling water pipe 7 is fixedly installed on the same side of the two end covers 5;

[0027] A second cooling water pipe 12 is fixedly installed on the side close to each other of the two end covers 5, and the two ends of the second cooling water pipe 12 are respectively fixedly connected with the two first cooling w...