Film and film processing technology

Abstract

The present invention discloses a film and a film processing technology. The film includes: a circuit layer; a board edge, which is arranged around the circuit layer; a process edge, which is arranged around the area between the circuit layer and the board edge; and suction holes, which are arranged on the process edge and / or in the gap between the process edge and the circuit layer, and the suction holes are used to fix the film. When using the film, since the suction holes for fixing the film are arranged on the process edge and the area inside the process edge, the board edge only needs a small margin distance to perform subsequent normal processes and achieve normal production. By using the film, the accuracy and efficiency of film exposure can be maintained without increasing the size of the circuit board, thereby improving the adaptability of the film and reducing production costs.

Description

Technical Field

[0001] The invention relates to the field of circuit board manufacturing, and in particular to a film and a film processing technology. Background Art

[0002] In the production process of circuit boards, inner layer automatic exposure machines are often used to expose films. When using this exposure machine, a 10mm width needs to be reserved at the edge of the board to set up vacuum holes to ensure the vacuum degree of exposure. However, when the reserved width of the edge of individual boards is insufficient, normal production cannot be carried out. At present, the existing solution is to increase the size of the board, but it will affect the utilization rate of the board and increase the cost; use manual exposure machines or semi-automatic exposure machines for production, but the accuracy and efficiency are not up to the level of fully automatic exposure machines. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a film and a film processing technology, which can improve the adaptability of the film and reduce the production cost.

[0004] In a first aspect, an embodiment of the present invention provides a film for application to a circuit board, the film comprising: a circuit layer; a board edge, the board edge being arranged around the circuit layer; a process edge, the process edge being arranged around an area between the circuit layer and the board edge; and suction holes, the suction holes being arranged on the process edge and / or in a gap between the process edge and the circuit layer, the suction holes being used to fix the film.

[0005] The film according to the first aspect of the present invention has at least the following beneficial effects:

[0006] When using this film, since the suction holes for fixing the film are set at the process edge and the inner area of ​​the process edge, the board edge only needs a small margin distance to perform the subsequent normal process and achieve normal production. By using this film, the accuracy and efficiency of film exposure can be maintained without increasing the size of the circuit board, thereby improving the adaptability of the film and reducing production costs.

[0007] According to some embodiments of the first aspect of the present invention, there are at least two suction holes. Providing at least two suction holes can make the vacuuming process of the film more stable and achieve better exposure effect.

[0008] According to some embodiments of the first aspect of the present invention, the suction holes are arranged on the same side of the circuit board. The suction holes are arranged on the same side so that subsequent punching is more convenient.

[0009] According to some embodiments of the first aspect of the present invention, a baffle is provided in the inner layer of the circuit board, the baffle is located in the inner layer area of ​​the board edge, and the suction hole is also provided at the outer edge of the baffle. Providing the suction hole at the outer edge of the baffle can reduce the margin requirement of the board edge for the suction hole, can make full use of the space of the film without affecting the circuit layer, reduce the margin requirement of the film, and improve the adaptability of the film.

[0010] In a second aspect, an embodiment of the present invention provides a film processing process, including:

[0011] Acquire a film image, wherein the film image includes a first image area, a second image area, and a third image area, wherein the second image area is an area surrounding the first image area, and the third image area is an area between the first image area and the second image area;

[0012] Marking a preset number in the third image area and / or the fourth image area, wherein the preset number is used to mark the suction hole position;

[0013] Modify the film image according to the preset label;

[0014] A film with an image is manufactured according to the modified film image, wherein the film includes a circuit layer corresponding to the first image area, a board edge corresponding to the second image area, a process edge corresponding to the third image area, a gap corresponding to the fourth image area, and a suction hole position corresponding to the preset number;

[0015] Punching is performed at the suction hole position to generate a suction hole for fixing the film.

[0016] The film processing technology according to the second aspect of the present invention has at least the following beneficial effects:

[0017] When using the film processing technology, first obtain the film image, then mark the preset number corresponding to the suction hole position to be generated at the corresponding position of the third image area of ​​the corresponding process edge of the film image and the fourth image area at the gap between the first image area and the third image area, then modify the film image according to the position of the preset number, then manufacture the film with the image according to the modified film image, and then punch the preset number on the film to generate the suction hole for fixing the film. By using this process, the suction holes of the film are set at the process edge and the inner area of ​​the process edge, and the plate edge only needs a small margin distance to perform the subsequent normal process, and normal production can be achieved, thereby improving the adaptability of the film and reducing production costs.

[0018] According to some embodiments of the second aspect of the present invention, the number of the preset numbers is at least two. By setting at least two preset numbers, the number of suction holes is controlled to be at least two. Setting at least two suction holes can make the vacuuming process of the film more stable and achieve better exposure effect.

[0019] According to some embodiments of the second aspect of the present invention, the preset marks are set on the same side of the film image. By setting the preset marks on the same side of the film image, the suction holes are controlled to be set on the same side of the circuit board, making subsequent punching more convenient.

[0020] According to some embodiments of the second aspect of the present invention, the film image includes a fifth image area, and the fifth image area is located between the third image area and the second image area;

[0021] Before modifying the film image according to the preset label, the film processing process further includes:

[0022] Marking a preset number at the outer edge of the fifth image area;

[0023] The step of manufacturing a film with an image according to the modified film image comprises:

[0024] The film further includes a flow block corresponding to the fifth image area, the flow block is arranged in the inner layer of the circuit board, and the flow block is located in the inner layer area of ​​the board edge.

[0025] Suction holes are provided at the outer edge of the baffle block, which can reduce the margin requirement of the board edge for the suction holes, and can make full use of the film space without affecting the circuit layer, reduce the margin requirement of the film, and improve the adaptability of the film.

[0026] According to some embodiments of the second aspect of the present invention, modifying the film image according to the preset label includes: modifying the width of the second image area located on the same side as the preset label according to the position of the preset label.

[0027] Since the preset mark is set in the third image area and / or the fourth image area, the suction hole is set in the process edge and the area within the process edge, thereby reducing the margin requirement of the board edge and modifying the width of the second image area on the same side as the preset mark, which can improve the utilization rate of the board and reduce production costs.

[0028] In a third aspect, an embodiment of the present invention provides a film, wherein the film is obtained by the film processing process described in any one of the embodiments of the second aspect.

[0029] The film according to the third aspect of the present invention has at least the following beneficial effects:

[0030] When using this film processing technology, the suction holes of the film are set at the process edge and the inner area of ​​the process edge. The plate edge only needs a small margin distance to execute subsequent normal processes and achieve normal production, thereby improving the adaptability of the film and reducing production costs.

[0031] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, in which:

[0033] Figure 1 A schematic structural diagram of a film according to an embodiment of the first aspect of the present invention;

[0034] Figure 2 A schematic structural diagram of a film according to another embodiment of the first aspect of the present invention;

[0035] Figure 3 A schematic structural diagram of a film according to another embodiment of the first aspect of the present invention;

[0036] Figure 4 This is a flow chart of a film processing process according to an embodiment of the second aspect of the present invention.

[0037] Reference numerals:

[0038] Circuit layer 100; board edge 200; process edge 300; suction hole 400; flow block 500; gap 600. DETAILED DESCRIPTION

[0039] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0040] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0042] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0043] The embodiments of the present invention are further described below in conjunction with the accompanying drawings.

[0044] In a first aspect, an embodiment of the present invention provides a film.

[0045] Reference Figure 1 In some embodiments, a film is applied to a circuit board, and the film includes: a circuit layer 100, a board edge 200, a process edge 300, and a suction hole 400. The board edge 200 is arranged around the circuit layer 100, the process edge 300 is arranged around the area between the circuit layer 100 and the board edge 200, and the suction hole 400 is arranged on the process edge 300 and / or at the gap 600 between the process edge 300 and the circuit layer 100, and the suction hole 400 is used to fix the film. When using the film, since the suction hole 400 for fixing the film is arranged on the process edge 300 and the area inside the process edge 300, the board edge 200 only needs a smaller margin distance to perform subsequent normal processes. By using the film, the accuracy and efficiency of film exposure can be maintained without increasing the size of the circuit board, thereby improving the adaptability of the film and reducing production costs.

[0046] Reference Figure 1 and Figure 2 In some embodiments, there are at least two suction holes 400. Providing at least two suction holes 400 can better fix the film, making the vacuuming process of the film more stable, thereby achieving a better exposure effect. It should be noted that the number of suction holes 400 is usually two or three, or four, five, etc., and this embodiment does not limit the number. In addition, the shape of the suction hole 400 can be circular, square, or other shapes, and this embodiment does not limit the shape.

[0047] Reference Figure 1 and Figure 2In some embodiments, the suction holes 400 are arranged on the same side of the circuit board. The suction holes 400 are arranged on the same side, which is more suitable for the fixing device of the mainstream inner layer automatic exposure machine, making the subsequent punching more convenient. It should be noted that each suction hole 400 can also be arranged on different sides of the circuit board, which can be adjacent sides or opposite sides, and this embodiment does not limit it.

[0048] Reference Figure 3 In some embodiments, a baffle block 500 is provided in the inner layer of the circuit board, and the baffle block 500 is located in the inner layer area of ​​the board edge 200, and the suction hole 400 is also provided at the outer edge of the baffle block 500. The suction hole 400 is provided at the outer edge of the baffle block 500, which can reduce the margin requirement of the board edge 200 without affecting the circuit layer 100 and the flattening effect of the baffle block 500, and make full use of the space of the film, thereby improving the adaptability of the film and reducing the production cost.

[0049] In a second aspect, an embodiment of the present invention further provides a film processing process.

[0050] Reference Figure 4 In some embodiments, the film processing process includes but is not limited to step S100, step S200, step S300, step S400 and step S500.

[0051] Step S100: Acquire a film image, the film image includes a first image area, a second image area, a third image area and a fourth image area, the second image area is an area surrounding the first image area, the third image area is an area between the first image area and the second image area, and the fourth area is an area between the first image area and the third image area.

[0052] Step S200: marking a preset number in the third image area and / or the fourth image area, where the preset number is used to mark the suction hole position.

[0053] In this embodiment, the preset label may be marked only in the first image area, or only in the third image area, or in both the first image area and the third image area, which is not limited in this embodiment.

[0054] Step S300: modifying the film image according to a preset label.

[0055] Step S400: a film with an image is manufactured according to the modified film image, wherein the film includes a circuit layer corresponding to the first image area, a board edge corresponding to the second image area, a process edge corresponding to the third image area, a gap corresponding to the fourth image area, and a suction hole position corresponding to a preset number.

[0056] Step S500: Punching holes at suction hole positions to generate suction holes for fixing the film.

[0057] In this embodiment, according to the position of the preset mark, the width of the third image area on the corresponding side of the preset mark is modified to obtain a modified film image, and then a film with an image is manufactured according to the modified film image, and then punching is performed at the suction hole position of the film to generate suction holes for fixing the film.

[0058] In some embodiments, through step S100, step S200, step S300, step S400 and step S500, the suction holes of the film are set at the process edge and the area within the process edge, thereby reducing the margin distance required for the edge of the board, achieving normal production without reducing the accuracy and efficiency of film exposure, improving the adaptability of the film, and reducing production costs.

[0059] In some embodiments, the number of preset numbers is at least two. In this embodiment, by setting at least two preset numbers, the number of suction holes is controlled to be at least two. Setting at least two suction holes can make the vacuuming process of the film more stable and achieve better exposure effect. It should be noted that the preset numbers can also be three, four, etc., and this embodiment does not limit them.

[0060] In some embodiments, the preset number is on the same side of the third image area. In this embodiment, by setting the preset number on the same side of the film image, the suction holes are controlled to be set on the same side of the circuit board, making subsequent punching more convenient. It should be noted that the preset number can also be set on the adjacent side and the opposite side of the film image, and this embodiment does not limit it.

[0061] In some embodiments, the film image includes a fifth image area, and the fifth image area is located between the third image area and the second image area. The film processing process may include but is not limited to the following steps: before step S300, it also includes: marking a preset number at the outer edge of the fifth image area.

[0062] Regarding step S500, it includes: the film also includes a blocking block corresponding to the fifth image area, and the blocking block is arranged in the inner layer of the circuit board and is located in the inner layer area of ​​the board edge.

[0063] In this embodiment, suction holes are provided at the outer edge of the baffle block, which can reduce the margin requirements of the board edge for the suction holes, and can fully utilize the space of the film without affecting the circuit layer or the flattening effect of the baffle block, thereby reducing the margin requirements of the film and improving the adaptability of the film.

[0064] In some embodiments, regarding step S300, the film processing process may include but is not limited to the following steps:

[0065] Step S310: modifying the width of the second image region located on the same side as the preset mark according to the position of the preset mark.

[0066] In this embodiment, since the preset mark is set in the third image area and / or the fourth image area, the suction holes are set at the process edge and the area within the process edge, thereby reducing the margin requirements of the board edge and modifying the width of the second image area on the same side as the preset mark. This can reduce the area requirement of the board, improve the utilization rate of the board, and reduce production costs.

[0067] In a third aspect, an embodiment of the present invention further provides a film, which is obtained by processing the film processing process of any one of the embodiments of the second aspect above.

[0068] In this embodiment, when the film processing technology is used, the suction holes of the film are set at the process edge and the area within the process edge. The plate edge only needs a smaller margin distance to perform subsequent normal processes, thereby improving the adaptability of the film and reducing production costs.

[0069] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A film applied to a circuit board, wherein the inner layer of the circuit board is provided with a flow block, characterized in that: The film includes: Line layer; A board edge is arranged around the circuit layer, and the blocking block is located in the inner layer area of ​​the board edge; A process edge surrounding an area disposed between the circuit layer and the board edge; Suction holes are arranged on the process edge and / or in the gap between the process edge and the circuit layer, and at the outer edge of the baffle block, and the suction holes are used to fix the film.

2. The film according to claim 1, characterized in that: There are at least two suction holes.

3. The film according to claim 2, characterized in that: The suction holes are arranged on the same side of the circuit board.

4. A film processing process, characterized in that: include: Acquire a film image, wherein the film image includes a first image area, a second image area, a third image area, a fourth image area, and a fifth image area, wherein the second image area is an area surrounding the first image area, the third image area is an area between the first image area and the second image area, the fourth image area is an area between the first image area and the third image area, and the fifth image area is between the third image area and the second image area; Marking a preset number in the third image area and / or the fourth image area, and marking the preset number at the outer edge of the fifth image area, wherein the preset number is used to mark the suction hole position; Modify the film image according to the preset label; A film with an image is manufactured according to the modified film image, wherein the film includes a circuit layer corresponding to the first image area, a board edge corresponding to the second image area, a process edge corresponding to the third image area, a gap corresponding to the fourth image area and a suction hole position corresponding to the preset number, and a baffle corresponding to the fifth image area, wherein the baffle is arranged on an inner layer of the circuit board, and the baffle is located in the inner layer area of ​​the board edge; Punching is performed at the suction hole position to generate a suction hole for fixing the film.

5. The film processing process according to claim 4, characterized in that: The number of the preset labels is at least two.

6. The film processing process according to claim 5, characterized in that: The preset labels are arranged on the same side of the film image.

7. The film processing process according to claim 6, characterized in that: The step of modifying the film image according to the preset label comprises: According to the position of the preset mark, the width of the second image area located on the same side as the preset mark is modified.

8. A film, characterized in that: The film is obtained by the film processing process as described in any one of claims 4 to 7.

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