Filter device for substrate processing device and clean air supply method

Abstract

The present invention provides a filter device for a substrate processing device and a clean air supply method. The temperature of clean air supplied to a plurality of substrate processing devices arranged in parallel via a filter is made uniform. The filter device has a filter arranged above the plurality of substrate processing devices arranged in parallel, and the filter device is configured as follows: an air inlet is formed on one end side of a tube space formed above the filter in the parallel direction of the substrate processing device, and the air flowing in from the air inlet is guided from the front side of the air flow guiding member to the other end side of the tube space by an air flow guiding member that divides the tube space in the up and down directions, and at least a part of the air guided to the other end side is returned to the back side of the air flow guiding member, and the filter device is configured as follows: the air in the tube space flows to the substrate processing device via the filter.

Description

Technical Field

[0001] The present disclosure relates to a filter device for a substrate processing apparatus and a clean air supply method. Background Art

[0002] Patent Document 1 describes that clean air from an air conditioner provided outside a coating and developing treatment apparatus is supplied to a filter unit provided above a liquid supply system unit portion through a pipe, and is supplied to each liquid supply system unit portion.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2007-88485 Summary of the invention

[0004] Problem that the invention aims to solve

[0005] The technology disclosed herein makes the temperature of clean air supplied to a plurality of substrate processing apparatuses arranged in parallel uniform through filters.

[0006] Solutions for solving problems

[0007] A filter device for a substrate processing device according to a technical solution of the present disclosure comprises a filter arranged above a plurality of substrate processing devices arranged in parallel, the filter device for the substrate processing device being constructed as follows: an air inlet is formed on one end side of a tube space formed above the filter in a parallel direction of the substrate processing devices, air flowing in from the air inlet is guided from the front side of the air flow guiding member to the other end side of the tube space by an air flow guiding member that divides the tube space in the up and down directions, at least a portion of the air guided to the other end side is returned to the back side of the air flow guiding member, and the filter device for the substrate processing device being constructed as follows: air in the tube space flows toward the substrate processing device via the filter.

[0008] Effects of the Invention

[0009] According to the present disclosure, the temperature of clean air supplied to a plurality of substrate processing apparatuses arranged in parallel through filters can be made uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is an explanatory diagram schematically showing the front side of a coating and developing treatment apparatus equipped with the filter device according to the present embodiment.

[0011] Figure 2 It is a cross-sectional view of the front side of the filter device according to the present embodiment.

[0012] Figure 3 It is an exploded perspective view of the filter device according to this embodiment.

[0013] Figure 4 It is an explanatory diagram schematically showing the upper surface of the filter device according to the present embodiment.

[0014] Figure 5 It is a perspective view showing a flow portion of the filter device according to the present embodiment.

[0015] Figure 6 This is an explanatory diagram schematically showing the upper surface of the filter device according to the present embodiment, illustrating the operation.

[0016] Figure 7 This is an explanatory diagram schematically showing the upper surface of a filter device applied to a triple-type liquid processing device.

[0017] Figure 8 This is a perspective view showing a flow section of a filter device applied to a triple-type liquid processing device.

[0018] Fig. 9 This is an explanatory diagram schematically showing the upper surface of a filter device applied to a triple-type liquid processing device, showing the operation. DETAILED DESCRIPTION

[0019] In the manufacturing process of semiconductor devices, in a photolithography process which is one of the manufacturing processes of semiconductor devices, a resist pattern is formed on a semiconductor wafer (hereinafter sometimes referred to as a wafer) as a substrate. The wafer with the resist pattern formed thereon is then subjected to an etching process, for example.

[0020] To form the resist pattern, the wafer is transported to, for example, a coating and developing device for coating and developing the resist and subjected to liquid treatment of the resist. Thereafter, the wafer is transported to an exposure device and exposed to a desired pattern, and then subjected to development treatment to form a resist pattern.

[0021] Clean air with adjusted temperature and humidity is supplied to various substrate processing devices installed in the coating and developing processing device. For example, for the resist coating device used to coat the resist, clean air with a specified temperature and humidity is supplied from above through the filter to the flow type. This is because changes in temperature and humidity will affect the film thickness of the resist.

[0022] Regarding this point, the technical record disclosed in Patent Document 1 is as follows: clean air from an air conditioner located outside a coating and developing processing device is supplied to a filter unit located above a liquid supply system unit such as an anti-etching coating device and a developing processing device via a longitudinally installed pipe, and is supplied to each liquid supply system unit.

[0023] The air with adjusted temperature and humidity and supplied from the air conditioner is supplied to the various substrate processing devices mounted on the coating and developing processing device through the vertical pipe as described above. However, since the various substrate processing devices are mounted in multiple layers in the up and down directions, when clean air is supplied to the various substrate processing devices in a downward flow manner, the clean air first flows in a horizontal direction from the inlet at one end of the various substrate processing modules through the vertical pipe, and then is supplied to the substrate processing device located at the lower position in a downward flow manner through the filter.

[0024] However, recently, there are cases where multiple liquid processing devices are mounted in a liquid processing module surrounded by a shell. For example, in the case of a liquid processing module, there are cases where multiple, for example, two or three liquid processing devices are arranged in parallel in a shell. The liquid processing device has a cup with an open upper surface, which surrounds a rotating chuck for holding and rotating a wafer. Clean air with adjusted temperature and humidity is supplied to each of the above cups from above in a downward flow manner through a filter located above the cup.

[0025] In the case of a liquid processing module having a plurality of liquid processing devices in one housing, the temperature of the air introduced from one end side may rise due to the heat around the liquid processing module, such as heat generated by various electrical devices, when flowing to the other end side. If the temperature rises, the relative humidity will also drop from the specified humidity.

[0026] Therefore, when the liquid treatment devices are arranged in parallel, the temperature and humidity of the clean air supplied to the liquid treatment device located at one end side and the liquid treatment device located at the other end side are different. As a result, the thickness of the film coated on each liquid treatment device is also different, resulting in the so-called difference between the liquid treatment devices.

[0027] The technology disclosed in the present invention can supply air with uniform temperature to a substrate processing apparatus located at one end side and a substrate processing apparatus located at the other end side when various substrate processing apparatuses represented by a liquid processing apparatus are arranged in parallel and clean air is introduced from one end side in the parallel direction of the substrate processing apparatus and supplied to each substrate processing apparatus located below the filter through a filter.

[0028] Hereinafter, the substrate processing system of the present embodiment will be described with reference to the drawings. In addition, in this specification, the same reference numerals are attached to elements having substantially the same functional configuration, and repeated descriptions are omitted.

[0029] Figure 11 is an explanatory diagram schematically showing the front of a coating and developing treatment device 1 of a liquid treatment device equipped with a filter device according to the present embodiment. The coating and developing treatment device 1 has a structure in which the following modules are connected integrally: a carrier module 2 for carrying in and out a carrier C storing a plurality of wafers; a processing module 3 having a plurality of substrate processing units for performing predetermined processing on the wafers; and an interface module 5 for transferring wafers to and from an exposure processing device 4.

[0030] In processing module 3, in addition to forming a Figure 1 In addition to the liquid processing module 11 for supplying various coating films represented by the resist film shown, or a processing liquid such as a developer, a heat treatment module (not shown) for heat treating the wafer is also mounted in multiple layers. In addition, the processing module 3 is also provided with a so-called chemical box 12, which stores various processing liquids supplied to the above-mentioned liquid processing module 11 in a replaceable tank.

[0031] Next, the liquid processing module 11 is described. Liquid processing devices 21 and 22 of the same structure are arranged in parallel in one liquid processing module 11, for example, to supply a resist liquid or a developer to a wafer to perform a predetermined process. In addition, a filter device 30 is arranged above the liquid processing devices 21 and 22 in the liquid processing module 11.

[0032] For each filter device 30 , air adjusted to a specified temperature and humidity, for example 23° C. and 45% RH, is supplied from an air conditioner 6 installed outside the coating and developing treatment apparatus 1 to the filter device 30 of each liquid processing module 11 through pipes 7 and 8 installed in the coating and developing treatment apparatus 1 in the vertical direction.

[0033] Liquid processing apparatuses 21 and 22 include cups 21 a and 22 a that accommodate wafers and have open upper surfaces so as to prevent the processing liquid from scattering around when supplying the processing liquid or forming a coating film.

[0034] The filter device 30 has Figure 2 , Figure 3 That is, the filter device 30 is composed of a top plate 31, a tube member 32, a nonwoven fabric 33, a filter 34, and a rectifying plate 35 stacked in order from the top. The space surrounded by the top plate 31, the tube member 32, and the nonwoven fabric 33 forms a tube space Z.

[0035] The pipe member 32 has a rectangular frame structure with an upper surface and a lower surface open and surrounded by a front wall 32a, a side wall 32b on the other end side, a back wall 32c, and a side wall 32d on one end side. An air inlet 32e is formed on the side wall 32d, and the air inlet 32e is connected to the pipe 7 or the pipe 8 described above, and is used to introduce the air from the pipes 7 and 8 with adjusted temperature and humidity.

[0036] The pipe member 32 has an airflow guide member 40 that partitions the pipe space Z in the up-down direction. Figure 3 , Figure 4 As shown, the airflow guiding component 40 includes: an inlet portion 41, which extends obliquely from the back side end of the air inlet 32e toward the front side; and a guide portion 42, which is continuous with the inlet portion 41 and changes its angle relative to the inlet portion 41 when viewed from above and extends parallel to the front wall 32a and the back wall 32c.

[0037] A partition plate 43 is provided between the terminal portion of the guide portion 42 and the side wall 32b on the other end side. The partition plate 43 partitions the tube space Z in the up-down direction and in the front-back direction and is arranged parallel to the side wall 32b. The tube space Z is divided into a first space Z1 on the one end side and a second space Z2 on the other end side by the partition plate 43. In addition, the front side of the airflow guide member 40 in the first space Z1 is configured as a front space Z1a, and the back side of the airflow guide member 40 in the first space Z1 is configured as a back space Z1b. The front space Z1a and the back space Z1b are connected by the space between the terminal portion of the guide portion 42 and the partition plate 43.

[0038] An opening 43a is formed in the partition plate 43. The opening 43a is located closer to the rear side (rear wall 32c side) than the position where the terminal end of the guide portion 42 linearly extends toward the side wall 32c and intersects the partition plate 43 in a plan view.

[0039] In addition, if Figure 4 As shown, the airflow guide member 40 is set at a position where it covers the cup 21a of the liquid treatment device 21 located below when viewed from above, and the center P of the cup 21a is located at the back side of the guide portion 42 of the airflow guide member 40, that is, at the back space Z1b. On the other hand, the position of the partition plate 43 is set at a position where it covers the cup 22a of the liquid treatment device 22 located below when viewed from above, and the center P of the cup 22a is also located at a position close to the back side of the tube space Z. The position of the partition plate 43 may not be such a position where it covers the cup 22a when viewed from above, but it needs to be located between the terminal end of the airflow guide member 40 and the center P of the cup 22a of the second space Z2. This is because if the position of the partition plate 43 is closer to the side wall 32b than the center P of the cup 22a of the second space Z2, the temperature difference improvement effect of the disclosed technology cannot be expected. In addition, the reason why the center P of cup 21a is located in the back space Z1b when viewed from above and the center P of cup 22a is also located in the back side of the second space Z2 is that it is easy to achieve temperature balance between the cups 21a and 22a arranged side by side on the left and right, from the relationship of the airflow guided from the inlet part 41 arranged obliquely when viewed from above to the guide part 42.

[0040] In addition, if Figure 5 As shown, a plurality of flow portions 42 a for communicating the front space Z1 a and the rear space Z1 b are formed in the guide portion 42 of the airflow guide member 40 and at the lower end of the guide portion 42 .

[0041] In this embodiment, if Figure 3 As shown, the nonwoven fabric 33 constituting the lower side of the tube space Z uses four nonwoven fabrics 33a, 33b, 33c, and 33d in an overlapping manner. The top nonwoven fabric 33a is L-shaped and covers one end side and the back side near the air inlet 32e. The other nonwoven fabrics 33b, 33c, and 33d are all rectangular. In addition, a slatted net is appropriately sandwiched between the nonwoven fabrics 33 to give the nonwoven fabric rigidity and ensure shape maintenance and flatness.

[0042] The filter 34 is arranged below the nonwoven fabric 33d of the lowest layer. In the present embodiment, a ULPA filter is used.

[0043] A rectifying plate 35 is disposed on the lower side of the filter 34. In the present embodiment, a punching metal plate 35a having many holes is disposed on the lower side, and spacers 35b are provided on four sides of the punching metal plate 35a. Thus, the spacers 35b form a space S between the lower surface of the filter 34 and the upper surface of the punching metal plate 35a.

[0044] The filter device 30 of the embodiment has the above structure, and the air from the pipes 7 and 8 flows into the pipe space Z from the air inlet 32e formed at one end of the pipe member 32 of the filter device 30. Figure 6 As shown, the inflowing air A flows toward the front space Z1a on the front side (front wall 32a side) of the tube space Z along the introduction portion 41 and the guide portion 42 of the airflow guide member 40 in terms of the horizontal airflow. Then, after colliding with the partition plate 43, a part of the air flows into the second space Z2 from the opening 43a of the partition plate 43 as air A1. Furthermore, after colliding with the partition plate 43, another part of the air flows toward the back space Z1b on the back side (back wall 32c side) of the airflow guide member 40 as air A2.

[0045] Meanwhile, the air in the front space Z1a flows from the flow portion 42a of the guide portion 42 provided in the air flow guide member 40 toward the upper portion of the cup 21a in the rear space Z1b.

[0046] Then, the air A flowing into the front space Z1a of the first space Z1, the air A2 flowing into the back space Z1b, and the air A1 flowing into the second space Z2 are cleaned through the non-woven fabric 33 and the filter 34 on the lower side, and then flow from the perforated metal plate 35a to the top of the liquid treatment devices 21 and 22 below through the upper space S in the rectifying plate 35.

[0047] Here, there are electrical system devices and the like around the liquid processing module 11, so the air is affected by the heat release from the devices as it flows toward the other end side in the tube space Z, and the temperature gradually rises. Therefore, when the air from the tubes 7 and 8 flows into the tube space Z from the air inlet 32e formed at one end of the tube member 32 of the filter device 30 and flows toward the other end side, the temperature near the side wall 32b on the other end side is higher than the temperature near the air inlet 32e.

[0048] Therefore, the temperature of the clean air supplied to the liquid treatment devices 21 and 22 below through the filter 34 is lower in the liquid treatment device 21 at one end side and higher in the liquid treatment device 22 at the other end side. Thus, a difference between the treatment devices occurs between the liquid treatment devices 21 and 22 arranged in parallel with the same structure.

[0049] In the present embodiment as well, the temperature of the air A1 supplied to the second space Z2 is higher than the temperature of the air A supplied to the front space Z1a of the first space Z1, but the air A2 supplied to the back space Z1b of the first space Z1 by colliding with the partition plate 43 is further increased in temperature by the influence of the surrounding heat corresponding to the longer flow distance. Therefore, the air A and the air A2 are mixed as they flow from the tube space Z through the nonwoven fabric 33 and the filter 34 to the liquid treatment device 21 below, and are adjusted to be substantially the same temperature as the air A1.

[0050] In particular, in the present embodiment, a space S is provided on the lower surface side of the filter 34, so that in the space S, the air from the front space Z1a and the back space Z1b of the first space Z1 is mixed, and is also mixed with the air from the second space Z2, so that the temperature difference (humidity difference) of the clean air supplied to the cups 21a and 22a of the liquid treatment devices 21 and 22 below through the perforated metal plate 35a of the rectifying plate 35 can be made very small. Therefore, clean air with uniform temperature and uniform humidity (relative humidity) can be supplied to the liquid treatment devices 21 and 22 arranged in parallel. It is preferred that the length of the space S in the height direction is longer, but as long as a height of at least 2 mm can be ensured, the desired mixing purpose can be achieved.

[0051] In fact, the inventors have verified that when a conventional filter device, i.e., a conventional filter device in which the tube member 32 does not have an airflow guide member 40, a partition plate 43, etc., and the filter device 30 of the present embodiment are compared under the same conditions, in the conventional type, the humidity difference of the clean air supplied to the cups 21a, 22a of the liquid treatment devices 21, 22 is 0.7%, whereas in the embodiment, it can be suppressed to 0.03%.

[0052] In addition, in the embodiment, the air in the front space Z1a can flow to the back space Z1b via the flow portion 42a of the guide portion 42 provided in the airflow guiding member 40. Therefore, the number and presence of the flow portion 42a can be appropriately adjusted according to the conditions, so that the temperature and humidity of the clean air supplied to the cups 21a, 22a of the liquid processing devices 21, 22 can be further adjusted.

[0053] Furthermore, by adjusting the size and opening position of opening 43 a of partition plate 43 , the temperature and humidity of the clean air supplied to cups 21 a and 22 a of liquid processing devices 21 and 22 can also be adjusted.

[0054] In addition, in this embodiment, the nonwoven fabric 33 is arranged on the lower side of the pipe member 32 and the upper side of the filter 34, so the uniformity of the wind speed of the air flowing downward can also be adjusted. In the embodiment, in particular, the L-shaped nonwoven fabric 33a covering the vicinity of the air inlet 32e and the back wall 32c where the wind speed is relatively high is adopted, so that the pressure loss in this area is relatively large, thereby improving the uniformity of the wind speed with other areas.

[0055] However, recently, in order to improve productivity and the number of wafers processed per hour, the number of substrate processing devices mounted on the coating and developing processing device 1 is sometimes increased, and the liquid processing device is sometimes assembled in a liquid processing module, a so-called three-type liquid processing module in which, for example, three liquid processing devices are arranged in parallel.

[0056] The technology disclosed herein can also be applied to such a triple-connected liquid processing module. Figure 7 This is an explanatory diagram schematically showing a plan view of a filter device 50 when applied to a triple-type liquid processing module.

[0057] When the cups 21a, 22a, and 23a of the three liquid processing devices are arranged in parallel, the tube space Z becomes longer in the parallel direction of the devices accordingly. Therefore, the flow rate of the air flowing in from the air inlet 32e is also faster than that of the two cups 21a and 22a, usually about 1.5 times the flow rate.

[0058] In this case, if Figure 7As shown, the guide portion 42 continuous with the introduction portion 41 of the airflow guide member 40 extends to a position above the cup 23a located closest to the other end, and the partition plate 43 used in the above embodiment is not provided. An opening 51 is formed between the terminal end of the guide portion 42 and the side wall 32b on the other end side.

[0059] Moreover, if Figure 8 As shown in the figure, the flow portion 42b provided in the guide portion 42 is formed at the upper end of the guide portion 42, and the flow portion 42b connects the front space Za and the back space Zb formed by the guide portion 42. This is because, since the flow rate of air is relatively fast, if it is provided on the lower side of the guide portion 42 as in the above embodiment, there is a situation where the air cannot flow downward sufficiently. In addition, in the filter device 50, a flow portion (not shown) similar to the flow portion 42b is also formed at the upper end of the introduction portion 41.

[0060] When applied to the triple type, the pipe member 32 is also set so that the center P of each cup 21a, 22a, 23a is located at a position on the back surface space Zb side of the pipe space Z.

[0061] The other structures of the filter device 50 applied to the triple-type filter device, namely, the structures of the nonwoven fabric 33 , the filter 34 , and the rectifying plate 35 are the same as those of the filter device 30 of the above-described embodiment.

[0062] According to the filter device 50 of the above structure, Fig. 9 As shown, the air A flowing in from the air inlet 32e flows along the inlet portion 41, the guide portion 42, and along the front space Za of the tube space Z, then collides with the side wall 32b on the other end side, and flows toward the back space Zb side of the tube space Z along the back wall 32c.

[0063] Compared with the pipe space Z of the parallel type filter device 30, in this case, the distance of air flow is longer, so the temperature difference between one end side (near the air inlet 32e) and the other end side (side wall 32b) of the front space Za is larger. That is, in the front space Za, the air with the lowest temperature is supplied from above the cup 21a, the air with a higher temperature is supplied from above the cup 22a, and the air with the highest temperature is supplied from above the cup 23a, but the air is affected by the surrounding heat in accordance with the longer distance of flow in the back space Zb, so the temperature of the air supplied to the cup 22a is higher than the temperature of the air supplied to the cup 23a, and the temperature of the air supplied to the cup 21a is higher than the temperature of the air supplied to the cup 22a. Therefore, the mixed air of the two is supplied to each cup, so that the air with the temperature difference corrected is supplied to each cup 21a, 22a, 23a. Therefore, the temperature and humidity of the clean air supplied to each cup 21a, 22a, 23a are made uniform.

[0064] In addition, in the filter device 50, the flow portion 42b is also provided in the guide portion 42, so that the air with a relatively low temperature in the front space Za can be appropriately supplied to the back space Zb. Therefore, by adjusting the number, installation position, and presence or absence of the flow portion 42b according to conditions, the temperature and humidity of the air supplied to each cup 21a, 22a, 23a can be further adjusted.

[0065] In addition, compared with the filter device 30, the pipe space Z of the filter device 50 applied to the triple-connected liquid treatment device is longer in the parallel direction. Therefore, in the back space Zb, the temperature of the air on one end side is higher than the temperature of the air on the other end side. Therefore, in the filter device 50, a flow portion similar to the flow portion 42b is appropriately provided in the inlet portion 41, so that Fig. 9 As shown, the lowest temperature air near the air inlet 32e can be supplied to the space closest to one end of the back space Zb. Therefore, air having the same temperature as that of the air supplied to the other cups 22a and 23a can be supplied to the cup 21a located below.

[0066] Of course, the filter device arranged above four or more liquid treatment devices can also be dealt with as follows: apply the above-mentioned three-way filter device 50, appropriately extend the guide part 42 to above the cup located closest to the other end side, and further, appropriately set a flow part 42b in the guide part 42, and also set such a flow part in the introduction part 41 as needed.

[0067] It should be noted that the embodiments disclosed in this disclosure are illustrative in all aspects and are not intended to limit the present invention. The above embodiments may be omitted, replaced, or changed in various forms without departing from the claims and their main purpose. For example, in the above embodiments, the filter device is used when the liquid processing device is arranged in parallel, but it is not limited to this. The technology disclosed in this disclosure can also be applied to other substrate processing devices, such as cooling devices for placing substrates and cooling them.

[0068] In addition, the following structures also belong to the technical scope of the present disclosure.

[0069] (1) A filter device for a substrate processing apparatus, comprising a filter provided above a plurality of substrate processing apparatuses arranged in parallel,

[0070] The filter device for substrate processing device is composed of:

[0071] An air inlet is formed on one end side of the pipe space formed above the filter in the parallel direction of the substrate processing device.

[0072] The air flowing in from the air inlet is guided from the front side of the air flow guide member toward the other end side of the tube space by the air flow guide member that partitions the tube space in the up-down direction.

[0073] At least a portion of the air guided to the other end side is returned to the back side of the airflow guide member,

[0074] Furthermore, the filter device for the substrate processing device is configured as follows:

[0075] The air in the duct space flows toward the substrate processing apparatus via the filter.

[0076] (2) The filter device for a substrate processing apparatus according to (1),

[0077] The number of the substrate processing devices is two,

[0078] The airflow guide member includes an introduction portion extending from the air inlet and a guide portion extending from the introduction portion at a changed angle in a plan view.

[0079] At least the guide portion is located above the substrate processing device on the one end side in a plan view,

[0080] A partition plate is provided between the other end side wall surface of the tube space and the terminal end of the guide portion, the partition plate partitioning the tube space in the up-down direction and in the front-back direction, dividing the tube space into a first space on one end side and a second space on the other end side.

[0081] An opening is formed on the partition plate at a position on the rear side of a terminal end of the guide portion.

[0082] (3) The filter device for a substrate processing apparatus according to (1),

[0083] The number of the substrate processing devices is three or more,

[0084] The airflow guide member includes an introduction portion extending from the air inlet and a guide portion extending from the introduction portion at a changed angle in a plan view.

[0085] At least the guide portion is located above the three or more substrate processing devices in a plan view.

[0086] An opening is provided between a terminal end portion of the guide portion and a side wall surface of the other end portion of the tube space.

[0087] (4) The filter device for a substrate processing apparatus according to any one of (1) to (3),

[0088] A flow portion that allows air to flow from a front side space of the tube space formed by the air flow guide member to a back side space is formed in at least one of the introduction portion and the guide portion of the air flow guide member.

[0089] (5) The filter device for a substrate processing apparatus according to any one of (1) to (4), wherein a rectifying plate having air flow holes is disposed below the filter.

[0090] (6) The filter device for a substrate processing apparatus according to (5),

[0091] A space is formed between the filter and the rectifying plate.

[0092] (7) The filter device for a substrate processing apparatus according to any one of (1) to (5), wherein a nonwoven fabric is disposed between the tube space and the filter.

[0093] (8) A clean air supply method for supplying clean air to a substrate processing apparatus using a filter device having filters provided above a plurality of the substrate processing apparatuses arranged in parallel,

[0094] air is introduced into the duct space from one end side of the duct space formed above the filter in the parallel direction of the substrate processing apparatus,

[0095] The introduced air is guided from the front side of the airflow guide member to the other end side of the tube space by an airflow guide member that partitions the tube space in the up-down direction,

[0096] returning at least a portion of the air guided to the other end side to the back side of the airflow guide member,

[0097] Clean air is supplied from a front side space and a back side space of the airflow guide member of the duct space to at least one substrate processing apparatus located at one end side of the substrate processing apparatus via the filter.

Claims

1. A filter device for a substrate processing device, comprising a filter provided above a plurality of substrate processing devices arranged in parallel, wherein: The filter device for substrate processing device is composed of: An air inlet is formed on one end side of the pipe space formed above the filter in the parallel direction of the substrate processing device. The air flowing in from the air inlet is guided from the front side of the air flow guide member toward the other end side of the tube space by the air flow guide member that partitions the tube space in the up-down direction. At least a portion of the air guided to the other end side is returned to the back side of the airflow guide member, Furthermore, the filter device for the substrate processing device is configured as follows: The air on the front side of the airflow guide member in the duct space and the air on the back side of the airflow guide member are mixed as they flow from the duct space to the substrate processing apparatus below through the filter.

2. The filter device for a substrate processing apparatus according to claim 1, wherein: The number of the substrate processing devices is two, The airflow guide member includes an introduction portion extending from the air inlet and a guide portion extending from the introduction portion at a changed angle in a plan view. At least the guide portion is located above the substrate processing device on the one end side in a plan view, A partition plate is provided between the other end side wall surface of the tube space and the terminal end of the guide portion, the partition plate partitioning the tube space in the up-down direction and in the front-back direction, dividing the tube space into a first space on one end side and a second space on the other end side. An opening is formed on the partition plate at a position on the rear side of a terminal end of the guide portion.

3. The filter device for a substrate processing apparatus according to claim 1, wherein: The number of the substrate processing devices is three or more, The airflow guide member includes an introduction portion extending from the air inlet and a guide portion extending from the introduction portion at a changed angle in a plan view. At least the guide portion is located above the three or more substrate processing devices in a plan view. An opening is provided between a terminal end portion of the guide portion and a side wall surface of the other end portion of the tube space.

4. The filter device for a substrate processing apparatus according to any one of claims 1 to 3, wherein: A flow portion that allows air to flow from a front side space of the tube space formed by the air flow guide member to a back side space is formed in at least one of the introduction portion and the guide portion of the air flow guide member.

5. The filter device for a substrate processing apparatus according to any one of claims 1 to 3, wherein: A rectifying plate having air flow holes is arranged below the filter.

6. The filter device for a substrate processing apparatus according to claim 5, wherein: A space is formed between the filter and the rectifying plate.

7. The filter device for a substrate processing apparatus according to any one of claims 1 to 3, wherein: A nonwoven fabric is disposed between the tube space and the filter.

8. A clean air supply method for supplying clean air to a substrate processing device using a filter device, the filter device having filters provided above a plurality of the substrate processing devices arranged in parallel, wherein: air is introduced into the duct space from one end side of the duct space formed above the filter in the parallel direction of the substrate processing apparatus, The introduced air is guided from the front side of the airflow guide member to the other end side of the tube space by an airflow guide member that partitions the tube space in the up-down direction, returning at least a portion of the air guided to the other end side to the back side of the airflow guide member, clean air is supplied from the front side space and the back side space of the airflow guide member of the duct space to at least one substrate processing device located at one end side of the substrate processing device below through the filter; Here, the clean air in the front side space and the clean air in the back side space in the duct space are mixed as they flow from the duct space through the filter toward the substrate processing apparatus located at least at one end side below.

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