A chip-type electronic component cutting machine

Abstract

The present invention discloses a chip electronic component slitting machine in the technical field of chip electronic component cutting equipment, comprising a frame table, a protective cabinet is set on the top, which is a flat and stable working reference table, at least two vertical brackets are set on the opposite edges, a horizontal beam slide is fixed horizontally between the vertical brackets on both sides, the two vertical brackets and the horizontal beam slide form a gantry processing center, and each time the material is taken from the raw material rack, the material taking and cutting suction cup is translated and adjusted by a fixed difference through a servo motor, so that each time the position of the chip electronic component on the cutting table has a variable, so the position where the blade falls on the cutting table is different each time when cutting, thereby protecting the cutting table from being subjected to the cutting force at the same position, so that the cutting table will not be damaged by cutting, thereby ensuring the flatness of the cutting table.

Description

Technical Field

[0001] The invention relates to the technical field of chip-type electronic component cutting equipment, in particular to a chip-type electronic component slitting machine. Background Art

[0002] With the development of science and technology, electronic products are becoming more and more diverse, with increasingly powerful functions and smaller sizes. This requires that the main electronic components used to manufacture electronic products, such as capacitors, resistors, inductors, sensors, etc., should be as small as possible and as reliable as possible. Currently, chip ceramic electronic components are mainly used, which have excellent performance in insulation, heat resistance, durability and other aspects. Therefore, the manufacture, sales and use of chip ceramic electronic components have been booming.

[0003] When manufacturing chip-type electronic components, a cutting machine is needed to cut the large electronic components stacked in the previous process, and to cut a whole large chip-type electronic component into multiple smaller electronic components according to the design size requirements. The cutting size needs to meet the edge size requirements of the subsequent trimming. Therefore, each electronic component must be cut multiple times from different angles by a slitting machine. Therefore, a slitting machine cuts more times than a general cutting machine, and more cutting is performed on the center line of a larger electronic component. After the electronic component is rotated, the center line overlaps, which causes the blade and cutting platform to wear very easily when the slitting machine is cutting.

[0004] For example, the application date is March 28, 2019, and the Chinese invention patent application number is 201920410926.6, and the publication number is CN210453274U. It specifically discloses an automatic cutting machine, which includes a body structure, a carrier, a detection and positioning mechanism, a cutting mechanism, a control system and two guide rails and other components. It lowers the center of gravity of the carrier and the load-bearing plate, reduces the front and rear pitch torque, improves the operating accuracy and service life, and realizes precise adjustment of the pressure of the tool matrix to meet the use requirements of different ceramic diaphragms, prevent damage to the ceramic diaphragms, and at the same time improve the stability of product cutting to ensure cutting quality.

[0005] In order to ensure the cutting accuracy of electronic components, this type of cutting device places the electronic components in the same position every time, and the blade also cuts in the same position for a long time. However, this device cuts very many times, and the blade and the cutting platform are easily worn out in this cutting method. As long as one of the platform or the blade is worn out and there is a dent or a gap, the processing accuracy cannot be guaranteed.

[0006] Based on this, the present invention designs a chip-type electronic component slitting machine to solve the above problems. Summary of the invention

[0007] The object of the present invention is to provide a chip electronic component slitting machine, which can translate and adjust a fixed difference by a servo motor each time the material is taken from the raw material rack. Therefore, the position of the chip electronic component on the cutting table is variable each time, so the position where the blade falls on the cutting table is different each time when cutting, thereby protecting the cutting table from being subjected to the cutting force at the same position, so the cutting table will not be damaged, thereby ensuring the flatness of the cutting table, and a glass fiber board of a certain thickness is added to the top of the cutting table. The cutting knife cuts through the electronic component and also cuts into the glass fiber board to a certain depth, but will not cut through the glass fiber board, effectively protecting the cutting knife blade from being broken by the harder cutting table, reducing the probability of mutual wear between the cutting knife and the cutting table, thereby improving the cutting accuracy and reducing the replacement frequency of the blade and the cutting table.

[0008] The present invention is implemented as follows: a chip-type electronic component slitting machine, comprising:

[0009] The frame table is provided with a protective cabinet on the top, which is a flat and stable working reference table. At least two vertical brackets are provided on the opposite edges. A horizontal beam slide is fixed horizontally between the vertical brackets on both sides. The two vertical brackets and the horizontal beam slide form a gantry processing center.

[0010] The protection cabinet is fixed on the four side edges of the rack, and an audible and visual alarm is installed on the top of the protection cabinet;

[0011] A raw material rack is horizontally slidably mounted on a raw material slide rail, and the raw material slide rail is horizontally mounted on the top of the rack platform;

[0012] The finished product rack is horizontally slidably mounted on the finished product slide rail, and the finished product slide rail is horizontally mounted on the top of the rack platform;

[0013] The cutting protection box is formed by connecting vertical partitions end to end, closed on all sides, and open at the top and bottom. It is vertically fixed on the top of the frame table and erected between the raw material slide rail and the finished product slide rail without contact. A cutting slide rail is also erected horizontally inside it. A cutting table is arranged on the cutting slide rail so as to slide horizontally. The top of the cutting table is a flat mirror surface. A motor is arranged at the bottom of the cutting table. The cutting table is installed on the cutting slide rail so as to rotate horizontally through the motor.

[0014] The cutting knife is mounted on the rotating shaft of the knife holder lifting motor, the knife holder lifting motor is horizontally mounted on the cutting fixed frame through the cylinder, the cutting fixed frame is fixedly mounted on the frame table, the cutting fixed frame is mounted just above the cutting slide rail, and the cutting knife is arranged just above the cutting slide rail;

[0015] A waste collection bucket is also arranged on the outer side of one end of the cutting slide rail, and the waste collection bucket is arranged in the cutting protection box. The cutting slide rail, the finished product slide rail and the raw material slide rail are arranged parallel to each other, and the cutting slide rail, the finished product slide rail and the raw material slide rail are all perpendicular to the horizontal beam slide rail;

[0016] The horizontal beam slide rail is equipped with a material picking and cutting suction cup and a finished product picking and cutting suction cup which can slide horizontally. The bottom surface of the material picking and cutting suction cup is a mirror flat plate. The bottom surface of the material picking and cutting suction cup is parallel to the cutting table and fits each other flatly. The material picking and cutting suction cup is installed below the suction cup lifting cylinder. The suction cup lifting cylinder is installed on the rotating shaft of the steering motor. The steering motor is horizontally slidable on the horizontal beam slide rail. The lifting axis of the suction cup lifting cylinder and the rotating axis of the steering motor are both arranged perpendicular to the top of the frame table.

[0017] The finished product picking suction cup and the picking and cutting suction cup are sequentially installed on the same horizontal beam slide rail with the same structure;

[0018] The cleaning drum is mounted on the driving shaft of the cleaning motor and is arranged horizontally. The cleaning motor is fixed on the cleaning bracket. The cleaning bracket is mounted on the cutting fixed bracket so as to be able to be raised and lowered by the cleaning cylinder. The length of the cleaning drum is greater than the longest diagonal of the cutting table. The cleaning drum, the cleaning motor and the cleaning cylinder do not interfere with the cutting knife.

[0019] CCD detectors are installed above the raw material rack and the cutting table;

[0020] The controller, the sound and light alarm, the raw material rack, the cutting table, the material taking and cutting sucker, the sucker lifting cylinder, the steering motor, the finished product rack, the finished product taking sucker, the cleaning motor, the cleaning cylinder, and the CCD detector are all electrically connected to the controller.

[0021] Furthermore, the cutting table includes an angle adjustment disk, a rotating base, a vacuum suction disk, a cutting platform and a glass fiber board. The rotating base can be installed on the cutting slide rail in a horizontally slidable manner. The angle adjustment disk can be installed on the center of the rotating base in a horizontally rotatable manner through a vertically arranged motor. The vacuum suction disk is embedded in the top of the angle adjustment disk. The cutting platform sealing sleeve is mounted on the top of the vacuum suction disk. The glass fiber board covers the top of the cutting platform. The top of the cutting platform and the upper and lower surfaces of the glass fiber board are horizontally arranged mirror flat plates. A plurality of suction holes that overlap each other are provided on the cutting platform and the glass fiber board. The suction holes on the cutting platform and the glass fiber board are connected to an external vacuum pump through the vacuum suction disk. The diameter of the suction holes does not exceed 1 mm.

[0022] Furthermore, the installation gaps between the angle adjustment plate, the rotating base, the vacuum suction plate and the cutting platform are filled with sealing rings, and the fiberglass board is flatly adsorbed on the top of the cutting platform by vacuum, and the thickness of the fiberglass board does not exceed 3 mm.

[0023] Furthermore, a negative pressure suction pipe is provided on the material picking and cutting suction cup, and a plurality of suction holes are evenly provided on the suction bottom surface of the material picking and cutting suction cup. The plurality of suction holes are connected to an external vacuum pump through the negative pressure suction pipe, and the material picking and cutting suction cup has the same structure as the finished product material picking suction cup.

[0024] Further, the cleaning cylinder is arranged perpendicular to the top of the frame table, and the rotation axis of the cleaning motor is parallel to the top of the cutting table;

[0025] The bottom of the cleaning drum can be detachably attached to the cutting table. When the cleaning cylinder is raised, the cleaning drum is suspended above the cutting table in a non-contacting level.

[0026] Furthermore, the blade of the cutting knife is a wedge-shaped blade, the length of the cutting knife is smaller than the minimum spacing between any opposite sides of the fiberglass board, the cutting knife is elastically mounted on the lifting cutting plate by a floating limit spring, a blade limit groove is also fixedly mounted on the bottom of the lifting cutting plate, the blade limit groove and the top inclined surface of the wedge-shaped blade of the cutting knife conflict with each other, the wedge-shaped blade of the cutting knife floats up and down inseparably in the blade limit groove, the lifting cutting plate is mounted on the output shaft of the tool holder lifting motor, the output shaft of the tool holder lifting motor is meshed with the lifting cutting plate by a lifting screw, the tool holder lifting motor is vertically fixed on the cutting fixing frame, and the non-contact fixing frame of the cutting fixing frame is arranged above the cutting slide rail.

[0027] Furthermore, at least two CCD detectors are mounted on the cutting table, and the two CCD detectors on the cutting table can be installed on a cutting fixed frame with adjustable directions. The two CCD detectors are arranged on the cutting line of the wedge-shaped blade of the cutting knife on the cutting table. At least one CCD detector is mounted on the raw material rack, and the CCD detector on the raw material rack is arranged on the raw material placement position.

[0028] Furthermore, the top opening of the waste collection bucket extends from directly below the cleaning roller to the side of the frame, the bottom of the waste collection bucket is connected to the interior of the frame, and a recycling box is arranged below the waste collection bucket; the cleaning roller is a soft-bristle roller brush.

[0029] Furthermore, the raw material rack, cutting table and finished product rack are all driven on their respective slide rails by servo motors;

[0030] The controller is a PLC controller, and the controller is also connected to an operating device. The servo motors driving the raw material rack, the cutting table and the finished product rack are all controlled by the controller.

[0031] Furthermore, a plurality of mounting holes are provided on the lower side surface of the cutting platform, and a heating rod is embedded in each of the mounting holes one by one. The plurality of heating rods are evenly dispersed and embedded on the four side walls of the cutting platform, and the plurality of heating rods extend into the center position of the inner cavity of the cutting platform, and the heating rods are electrically connected to the controller.

[0032] The beneficial effects of the present invention are as follows: 1. The present invention uses a CCD detector on a raw material rack to determine the location of chip electronic components and whether the raw materials meet the cutting size requirements, and then uses a material picking and cutting suction cup to pick up materials. Each time the material is picked up, a steering motor drives the material picking and cutting suction cup to adjust the material picking angle to ensure that the electronic components remain parallel to the cutting line where the cutting knife is located. The material picking and cutting suction cup moves different distances on the horizontal beam slide rail, so that the horizontal position of the electronic components placed on the cutting table is different each time. The longitudinal displacement of the servo motor driving the cutting table is different, so that the cutting machine carrying the electronic components is parallel to the cutting line where the cutting knife is located. The longitudinal displacement of the table is different, and the blade cannot move horizontally and vertically, so the cutting position is slightly different from the previous position. The cutting table of the device can be moved longitudinally. Through the difference in the placement of the material-taking cutting suction cup, the horizontal coordinates of the electronic components can also be fine-tuned on the cutting table. In this way, the position where the cutting knife cuts on the cutting table each time is not the same cutting line, so that the position where the cutting knife cuts each time is the position corresponding to the new cutting table, and the cutting knife will not cut repeatedly at the same place on the cutting table, avoiding the cutting table and the cutting knife from repeatedly cutting the same place and causing mutual wear and collapse;

[0033] 2. This device adjusts the cutting position by adjusting the position of the material taking-up cutting suction cup, and then makes up for the longitudinal displacement difference through the cutting table, so as to ensure that the margins of the electronic components cut each time are the same, but the position of the cutting knife on the cutting table is different each time. Therefore, this device not only adjusts the position of the cutting knife on the cutting table, but also keeps the cutting size of the electronic components unchanged, which is still the original set size. It can not only complete high-frequency cutting, but also ensure that the position of the cutting knife on the cutting table does not change, and ensure the cutting accuracy of the electronic components;

[0034] 3. This device adds a 1mm-3mm thick glass fiber board to cover the top of the cutting table, and is fixed by vacuum negative pressure adsorption, ensuring that the glass fiber board is flatly adsorbed on the cutting table and that the glass fiber board will not wrinkle due to cutting and pressing. The glass fiber board has moderate hardness and can maintain a flat surface to support the electronic components for cutting, ensuring that the electronic components will not bend due to the pressure of cutting, nor will they collide with the cutting knife due to being too hard, but will only be cut by the cutting knife. Because the cutting amount of the cutting knife itself is relatively precisely controlled, the amount of the cutting knife cutting into the glass fiber board is less than 0.1mm, and also It can ensure that the electronic components are completely cut off instead of being connected, and the cutting knife does not directly collide with the cutting table, but is buffered by the fiberglass board, which reduces the possibility of damage to the blade and the cutting table, thereby improving the cutting accuracy. The fiberglass board of this device is also very convenient to replace. It is adsorbed on the top of the cutting table through negative pressure. Even if the fiberglass board is cut too many times and is damaged and needs to be replaced, the device generating negative pressure is turned off, and the fiberglass board is no longer adsorbed. Replacement is also very easy, because the cutting position on the fiberglass board is different each time, so the fiberglass board is not easily damaged. In this way, this device effectively protects the blade of the cutting knife from being broken by the harder cutting table. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present invention will be further described below in conjunction with embodiments with reference to the accompanying drawings.

[0036] Figure 1 This is a schematic diagram of the external front structure of the present invention;

[0037] Figure 2 This is a schematic diagram of the external back structure of the present invention;

[0038] Figure 3 It is a schematic diagram of the back structure inside the rack of the present invention;

[0039] Figure 4 It is a schematic diagram of the front structure inside the rack of the present invention;

[0040] Figure 5 It is a schematic diagram of the structure inside the rack of the present invention;

[0041] Figure 6 This is a schematic diagram of the structure of the raw material rack and the finished product rack of the present invention;

[0042] Figure 7 It is a front view of the raw material rack and finished product rack structure of the present invention;

[0043] Figure 8 This is a schematic diagram of the positional relationship between the cutting table and the cutting protection box of the present invention;

[0044] Fig. 9This is a schematic diagram of the interior of the cutting knife of the present invention;

[0045] Fig.10 This is a schematic diagram of the positional relationship between the cleaning drum and the cutting table of the present invention;

[0046] Fig.11 This is a schematic diagram of the structure of the cutting knife of the present invention;

[0047] Fig.12 This is a front view of the cutting protection box and the cutting knife of the present invention;

[0048] Fig.13 It is an overall schematic diagram of a single cutting table of the present invention;

[0049] Fig.14 An exploded view of the cutting table of the present invention;

[0050] Fig.15 This is a schematic diagram of the structure of the material taking and cutting suction cup of the present invention;

[0051] Fig.16 This is a schematic diagram of the bottom of the material-taking and cutting suction cup of the present invention;

[0052] Fig.17 This is a schematic diagram of the lifting and rotating drive of the material-taking and cutting suction cup of the present invention;

[0053] Fig.18 It is a schematic diagram of the specific structure of the cutting tool holder of the present invention;

[0054] Fig.19 This is a schematic diagram of the internal structure of the cutting protection box of the present invention.

[0055] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0056] 1-machine frame, 11-protection cabinet, 12-horizontal beam slide rail, 13-vertical bracket, 14-sound and light alarm, 2-raw material rack, 21-raw material slide rail, 3-cutting protection box, 31-cutting table, 311-angle adjustment plate, 312-rotating base, 313-vacuum suction plate, 314-cutting platform, 315-fiberglass board, 316-heating rod, 32-material cutting suction cup, 321-steering motor, 322-suction cup lifting cylinder, 323- Negative pressure suction pipe, 33-waste collection bucket, 34-cutting knife, 341-knife holder lifting motor, 342-blade limiting groove, 343-lifting cutting plate, 344-cutting fixed frame, 345-floating limiting spring, 35-cutting slide rail, 4-finished product rack, 41-finished product slide rail, 42-finished product material taking suction cup, 5-cleaning roller, 51-cleaning motor, 52-cleaning cylinder, 53-cleaning bracket, 6-CCD detector, 7-controller, 71-operating device. DETAILED DESCRIPTION

[0057] See also Figures 1 to 19 As shown, the present invention provides a technical solution: a chip-type electronic component slitting machine, comprising:

[0058] The frame platform 1 is provided with a protective cabinet 11 on the top, which is a flat and stable working reference platform. At least two vertical brackets 13 are provided on the opposite sides of the edges, and a horizontal beam slide rail 12 is fixed horizontally between the vertical brackets 13 on both sides. The two vertical brackets 13 and the horizontal beam slide rail 12 form a gantry machining center;

[0059] The protection cabinet 11 is fixedly mounted on the four side edges of the rack 1, and an audible and visual alarm 14 is mounted on the top of the protection cabinet 11;

[0060] The raw material rack 2 is horizontally slidably mounted on a raw material slide rail 21, and the raw material slide rail 21 is horizontally mounted on the top of the rack 1;

[0061] The finished product rack 4 is horizontally slidably mounted on a finished product slide rail 41, and the finished product slide rail 41 is horizontally mounted on the top of the rack platform 1;

[0062] The cutting protection box 3 is formed by connecting vertical partitions end to end, is closed on all sides, and is open at the top and bottom. It is vertically fixed on the top of the frame table 1 and is set up between the raw material slide rail 21 and the finished product slide rail 41 without contact. A cutting slide rail 35 is also set up horizontally inside it. A cutting table 31 is set on the cutting slide rail 35 so as to slide horizontally. The top of the cutting table 31 is a flat mirror surface. A motor is set at the bottom of the cutting table 31. The cutting table 31 is installed on the cutting slide rail 35 so as to be horizontally rotatable by the motor.

[0063] The cutting knife 34 is mounted on the rotating shaft of the knife frame lifting motor 341. The knife frame lifting motor 341 is horizontally mounted on the cutting fixed frame 344 through the cylinder, and the cutting fixed frame 344 is fixedly mounted on the frame platform 1. The cutting fixed frame 344 is mounted directly above the cutting slide rail 35, and the cutting knife 34 is arranged directly above the cutting slide rail 35;

[0064] A waste collection bucket 33 is also provided on the outer side of one end of the cutting slide rail 35, and the waste collection bucket 33 is provided in the cutting protection box 3. The cutting slide rail 35, the finished product slide rail 41 and the raw material slide rail 21 are provided in parallel with each other, and the cutting slide rail 35, the finished product slide rail 41 and the raw material slide rail 21 are all perpendicular to the horizontal beam slide rail 12;

[0065] The horizontal beam slide rail 12 is provided with a material picking and cutting suction cup 32 and a finished product picking and cutting suction cup 42 which can slide horizontally. The bottom surface of the material picking and cutting suction cup 32 is a mirror flat plate. The bottom surface of the material picking and cutting suction cup 32 is parallel to the cutting table 31 and fits each other flatly. The material picking and cutting suction cup 32 is installed below the suction cup lifting cylinder 322. The suction cup lifting cylinder 322 is installed on the rotating shaft of the steering motor 321. The steering motor 321 is horizontally slidable on the horizontal beam slide rail 12. The lifting axis of the suction cup lifting cylinder 322 and the rotating axis of the steering motor 321 are both arranged perpendicular to the top of the frame 1.

[0066] The finished product picking suction cup 42 and the picking cutting suction cup 32 are sequentially installed on the same horizontal beam slide rail 12 with the same structure;

[0067] The cleaning roller 5 is mounted on the driving shaft of the cleaning motor 51 and is arranged horizontally. The cleaning motor 51 is fixed on the cleaning bracket 53. The cleaning bracket 53 is lifted and lowered on the cutting fixed bracket 344 through the cleaning cylinder 52. The length of the cleaning roller 5 is greater than the longest diagonal of the cutting table 31. The cleaning roller 5, the cleaning motor 51 and the cleaning cylinder 52 do not interfere with the cutting knife 34.

[0068] A CCD detector 6 is installed above the raw material rack 2 and the cutting table 31;

[0069] The controller 7, the sound and light alarm 14, the raw material rack 2, the cutting table 31, the material picking and cutting suction cup 32, the suction cup lifting cylinder 322, the steering motor 321, the finished product rack 4, the finished product picking and cutting suction cup 42, the cleaning motor 51, the cleaning cylinder 52, and the CCD detector 6 are all electrically connected to the controller 7, so that each time the material is picked up on the raw material rack 2, the material picking and cutting suction cup 32 is translated and adjusted by a fixed difference through the servo motor, so that each time the position of the chip electronic component on the cutting table 31 has a variable, so the position of the blade falling on the cutting table 31 is different each time when cutting, so The cutting table 31 is protected from being subjected to the cutting force at the same position, so the cutting table 31 will not be damaged, thereby ensuring the flatness of the cutting table 31, and a glass fiber board 315 of a certain thickness is added to the top of the cutting table 31. The cutting knife 34 cuts through the electronic components and also cuts into the glass fiber board 315 to a certain depth, but does not cut through the glass fiber board 315, effectively protecting the blade of the cutting knife 34 from being damaged by the harder cutting table 31, and the cutting knife 34 and the cutting table 31 do not contact and no longer impact and wear each other, thereby improving the cutting accuracy and reducing the replacement frequency of the cutting knife 34 and the cutting table 31.

[0070] The cutting table 31 includes an angle adjustment disk 311, a rotating base 312, a vacuum suction disk 313, a cutting platform 314 and a glass fiber board 315. The rotating base 312 can be horizontally slidably installed on the cutting slide rail 35. The angle adjustment disk 311 can be horizontally rotated and installed at the center of the rotating base 312 through a vertically arranged motor. The vacuum suction disk 313 is embedded in the top of the angle adjustment disk 311. The cutting platform 314 is sealed on the top of the vacuum suction disk 313. The glass fiber board 315 covers the top of the cutting platform 314. The top of the cutting platform 314 and the upper and lower surfaces of the glass fiber board 315 are horizontally arranged mirror flat plates. The cutting platform 314 and A plurality of suction holes overlapping each other are provided on the glass fiber board 315. The suction holes on the cutting platform 314 and the glass fiber board 315 are connected to an external vacuum pump through a vacuum suction disk 313. The diameter of the suction holes does not exceed 1 mm. With the structure of the cutting table 31, the raw materials or finished products of electronic components can be evenly adsorbed on the glass fiber board 315, which is convenient for adjusting the longitudinal position of the electronic components, so as to cut at different positions of the glass fiber board 315, avoiding repeated cutting at the same position, and also being able to transport the electronic components evenly and stably for cutting, and also being able to stably support the electronic components so as not to be displaced during cutting. The electronic components are evenly and tightly adsorbed on the cutting table 31, and will not be dented due to the adsorption force.

[0071] The installation gaps between the angle adjustment plate 311, the rotating base 312, the vacuum suction plate 313 and the cutting platform 314 are filled with sealing rings. The glass fiber board 315 is flatly adsorbed on the top of the cutting platform 314 by vacuum. The thickness of the glass fiber board 315 does not exceed 3 mm. At the same time, the glass fiber board 315 is always adsorbed on the top of the cutting table 31, and the adsorption states do not affect each other. At the same time, the glass fiber board 315 of this thickness will not affect the flat support of the electronic components, and can also provide a buffer with moderate hardness, and it is a thickness that the cutting knife 34 will not cut through. The optimal thickness of the glass fiber board 315 is 2 mm;

[0072] A negative pressure suction pipe 323 is also provided on the material picking and cutting suction cup 32. A plurality of suction holes are evenly provided on the suction bottom surface of the material picking and cutting suction cup 32. The plurality of suction holes are connected to an external vacuum pump through the negative pressure suction pipe 323. The material picking and cutting suction cup 32 has the same structure as the finished product material picking suction cup 42. The electronic components are evenly adsorbed by such a bonding and negative pressure suction holes.

[0073] The lifting axis of the suction cup lifting cylinder 322 and the rotating axis of the steering motor 321 are both arranged perpendicular to the top of the frame 1, so as to facilitate the vertical lifting of the material-taking and cutting suction cup 32 and avoid the situation that the suction does not fit due to tilting;

[0074] The cleaning cylinder 52 is arranged perpendicular to the top of the frame table 1, and the rotation axis of the cleaning motor 51 is parallel to the top of the cutting table 31;

[0075] The bottom of the cleaning drum 5 can be separated and fit with the cutting table 31. When the cleaning cylinder 52 is raised, the cleaning drum 5 is suspended above the cutting table 31 without contact, so that the cutting table 31 is cleaned closely to avoid waste blocking the cutting.

[0076] The blade of the cutting knife 34 is a wedge-shaped blade. The length of the cutting knife 34 is less than the minimum spacing between any opposite sides of the glass fiber board 315. The cutting knife 34 is elastically mounted on the lifting cutting plate 343 through a floating limit spring 345. A blade limit groove 342 is also fixedly mounted on the bottom of the lifting cutting plate 343. The blade limit groove 342 and the top inclined surface of the wedge-shaped blade of the cutting knife 34 conflict with each other. The wedge-shaped blade of the cutting knife 34 floats up and down in the blade limit groove 342 inseparably. The lifting cutting plate 343 is mounted on the lifting motor 341 of the knife holder. On the output shaft, the output shaft of the tool holder lifting motor 341 is meshed with the lifting cutting plate 343 through a lifting screw rod. The tool holder lifting motor 341 is vertically fixed on the cutting fixing frame 344. The cutting fixing frame 344 is fixed above the cutting slide rail 35 without contact. Through such a setting of the cutting knife 34, accurate cutting can be achieved, and the cutting force can also be ensured to actively cut off the electronic components. Such a structure makes the toughness greater, and the glass fiber board 315 with greater resistance to the cutting knife 34 will cause the cutting knife 34 blade to retract into the blade limiting groove 342;

[0077] At least two CCD detectors 6 are mounted on the cutting table 31. The two CCD detectors 6 on the cutting table 31 can be mounted on the cutting fixed frame 344 with adjustable orientation. The two CCD detectors 6 are arranged facing the cutting line of the wedge-shaped blade of the cutting knife 34 on the cutting table 31. At least one CCD detector 6 is mounted on the raw material rack 2. The CCD detector 6 on the raw material rack 2 faces the raw material placement position, and monitors the raw materials or processing status of the electronic components at any time, so as to facilitate timely removal of defective products when they appear, and to stop the machine to avoid the mixing of defective products.

[0078] The top opening of the waste collection hopper 33 extends from the bottom of the cleaning drum 5 to the side of the rack 1. The bottom of the waste collection hopper 33 is connected to the inside of the rack 1. A recycling box is provided below the waste collection hopper 33. The cleaning drum 5 is a soft brush, which is convenient for cleaning the scraps or waste materials, avoiding blocking the normal cutting of the cutting knife 34 and the detection camera of the CCD detector 6, so as to enable more accurate detection.

[0079] The raw material rack 2, the cutting table 31 and the finished product rack 4 are all driven on their respective slide rails by servo motors;

[0080] The controller 7 is a PLC controller, and the controller 7 is also connected to an operating device 71. The servo motors driving the raw material rack 2, the cutting table 31 and the finished product rack 4 are all controlled by the controller 7. The controller 7 is easy to obtain, and can be conveniently operated and set. It has a high popularity rate, can complete complex operation steps and movements, and is accurate, convenient for precise movement, and convenient for accurate adjustment of position, movement and absorption of electronic components.

[0081] A plurality of mounting holes are provided on the lower side surface of the cutting platform 314, and a heating rod 316 is embedded in each mounting hole. The plurality of heating rods 316 are evenly dispersed and embedded on the four side walls of the cutting platform 314, and the plurality of heating rods 316 extend into the center position of the inner cavity of the cutting platform 314. The heating rods 316 are electrically connected to the controller 7, so that the electronic components can be heated before cutting, and the cutting edge is more precise.

[0082] In a specific embodiment of the present invention:

[0083] The embodiment of the present invention provides a chip-type electronic component slitting machine, and the technical problem solved by the present invention is:

[0084] 1. In order to ensure the cutting accuracy, the existing technology ensures that the electronic components can be transported at a fixed position each time, and adds a positioning mechanism to ensure that each transport and transfer of the chip-type electronic components is at the same position of the device, and the positioning is accurate, so that the cutting knife 34 can cut at the same position of the electronic components each time. Then, when cutting, the blade of the cutting knife 34 falls on the same position on the cutting table 31, and the cutting depth of the blade changes when cutting, and the electronic components are often penetrated and cut onto the cutting table 31. The cutting table 31 is relatively hard and wear-resistant. Long-term such cutting can easily cause the blade of the cutting knife 34 to break out of the gap, and it is also easy to cause wear, resulting in a significant reduction in the accuracy of the processed electronic components;

[0085] 2. The cutting table 31 needs a flat and horizontal platform with high hardness, and a protective device for the blade of the cutting knife 34. Once the blade is worn, it is difficult to identify it with the naked eye. The monitoring device only monitors the chip and compares the electronic components, and does not perform special inspection on the blade 34. Therefore, if there is a problem with the blade, the equipment will not prompt, and the personnel will not find it. The electronic components produced by cutting with damaged blades generally do not meet the precision requirements. Therefore, the durability and precision of the blade are the current problems that such equipment has not effectively improved.

[0086] 3. Moreover, this type of device cannot cover the cushioning pad to protect the cutting edge of the blade. Under the long-term high-frequency transfer and sliding conditions of the cutting platform, the cushioning pad is easy to wrinkle, so that the blade is difficult to cut through the electronic components. Moreover, when the cushion is subjected to cutting force, it is easy to cause the electronic components to be bent, resulting in the inability to guarantee cutting accuracy and low yield rate.

[0087] 4. The current cutting devices are unable to clean and collect the scraps of discarded chip electronic components that fall during cutting. The fallen scraps can only be thrown away by moving or rotating, which is difficult to remove. This will affect the next cutting and block the detection line of sight of the monitoring device, causing a detection blind spot, which is prone to false alarms or erroneous detection.

[0088] The technical effects achieved are as follows: 1. The present invention uses the CCD detector 6 on the raw material rack 2 to accurately determine the location of the chip electronic components and whether the raw materials meet the cutting size requirements, and then uses the material picking and cutting suction cup 32 to pick up the materials. Each time the materials are picked up, the steering motor 321 drives the material picking and cutting suction cup 32 to adjust the material picking angle to ensure that the electronic components and the cutting line where the cutting knife 34 are located remain parallel. The material picking and cutting suction cup 32 moves different distances on the horizontal beam slide rail 12, so that the horizontal position of the electronic components placed on the cutting table 31 is different each time. The longitudinal displacement of the servo motor driving the cutting table 31 is different, so that the cutting table 31 carrying the electronic components moves by a different distance. The longitudinal displacement of the movement is different, and the cutting knife 34 cannot move horizontally and vertically, so the cutting position is slightly different from the previous position, while the cutting table 31 of the present device can be moved vertically, and the electronic components are placed differently through the material picking and cutting suction cup 32, so that the horizontal coordinates of the electronic components can also be fine-tuned on the cutting table 31, so that the position of the cutting knife 34 for each cutting is a new position of the cutting table 31, and the cutting knife 34 will not repeatedly cut at the same position on the cutting table 31, avoiding the mutual wear and collapse of the same position of the cutting table 31 and the cutting knife 34. If one of the accessories for the cutting is broken, the matching position will also be damaged faster. The present device avoids this situation;

[0089] 2. The device adjusts the cutting position by adjusting the material picking position of the material picking cutting suction cup 32, and then makes up for the longitudinal displacement difference through the cutting table 31, so as to ensure that the margins of the electronic components cut each time are the same, but the cutting position of the cutting knife 34 on the cutting table 31 is different each time. Therefore, the device not only adjusts the falling position of the cutting knife 34 on the cutting table 31, but also keeps the cutting size of the electronic components unchanged, which is still the original set size. It can not only complete high-frequency cutting, but also ensure that the falling position of the cutting knife 34 on the cutting table 31 does not change, and ensure the cutting accuracy of the electronic components;

[0090] 3. The device adds a 1mm-3mm thick glass fiber board 315 to cover the top of the cutting table 31, and is fixed by vacuum negative pressure adsorption, so as to ensure that the glass fiber board 315 is flatly adsorbed on the cutting table 31, and can ensure that the glass fiber board 315 will not be wrinkled due to cutting and pressing. The glass fiber board 315 has moderate hardness and can maintain a flat surface to support the electronic components for cutting, ensuring that the electronic components will not bend due to the pressure of cutting, and will not collide with the cutting knife 34 due to being too hard, and will only be cut by the cutting knife 34, because the cutting amount of the cutting knife 34 is designed to be more precisely controlled. The cutting accuracy of the device is micron level. In order to ensure the accuracy, the cutting blade of the cutting knife 34 is very thin, so the amount of the cutting knife 34 cutting into the glass fiber board 315 is less than 0.1mm, and It can also ensure that the electronic components are completely cut off instead of being disconnected, and the cutting knife 34 does not directly collide with the cutting table 31, but is buffered by the fiberglass board 315, which reduces the possibility of damage to the blade and the cutting table 31, thereby improving the cutting accuracy. The fiberglass board 315 of the device is also very convenient to replace. It is adsorbed on the top of the cutting table 31 by negative pressure. Even if the fiberglass board 315 is cut too many times and needs to be replaced due to damage, the device generating negative pressure is turned off, and the fiberglass board 315 is no longer adsorbed. Replacement is also very easy, because the cutting position on the fiberglass board 315 is different each time, so the fiberglass board 315 is not easily damaged. When the device is cutting, the blade of the cutting knife 34 will not contact the hard cutting table 31 at all, so the device effectively protects the blade of the cutting knife 34 from being broken by the hard cutting table 31.

[0091] 4. The device rolls the cleaning roller on the cutting table and sweeps away the waste scraps by means of a rolling brush. When cleaning is required, the cleaning roller is lowered by the cleaning cylinder and rolled on the cutting table for cleaning. When cleaning is not required, the cleaning roller is raised without affecting the cutting operation of the cutting table. The device does not use wind blowing and does not affect the normal cutting of the cutting table. It can also effectively prevent the waste scraps from being scattered and can also collect the scraps swept away by the cleaning brush to prevent the debris from jamming the equipment. The device also monitors the cutting status of the electronic components in real time through the two CCD detectors 6 on the cutting table 31. If the cutting is scrapped and there is no possibility of remedy, the device can start the cleaning roller 5 through the controller 7 to sweep the scrapped materials into the waste collection bucket 33, making cleaning more convenient.

[0092] 5. The device can more efficiently transfer and place electronic components without interfering with each other through the mutual switching of the three raw material placement positions of the raw material rack 2, the finished product rack 4 and the cutting table 31, and can complete the cutting operation of the electronic components more quickly.

[0093] The technical solution in the embodiment of the present invention is to solve the above problems, and the overall idea is as follows:

[0094] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0095] During the manufacturing and installation of the present invention, a flat rack 1 is first manufactured to ensure that the top of the rack 1 is horizontal and the surface is flat, and then the raw material slide rail 21, the cutting slide rail 35 and the finished product slide rail 41 are installed and manufactured, so that the raw material slide rail 21, the cutting slide rail 35 and the finished product slide rail 41 are all parallel to each other and arranged side by side, such as Figure 3 and Figure 4 As shown, the raw material rack 2 is then installed on the raw material slide rail 21, and the finished product rack 4 is installed on the finished product slide rail 41, and the raw material rack 2 and the finished product rack 4 are driven by a servo motor and a chain gear, and the driving and transmission devices are hoisted below. This is the installation of conventional devices well known to those skilled in the art and will not be described in detail;

[0096] The cutting table 31 is installed on the cutting slide rail 35, and the cutting table 31 is as shown in FIG. Fig.14 As shown, the rotating base 312 is installed on the cutting slide 35 through a servo motor and slides horizontally along the cutting slide 35. The angle adjustment disk 311 is installed on the rotating base 312 through a rotating motor and can be vertically rotated. The rotating shaft of the rotating motor on the rotating base 312 is tightly connected with the angle adjustment disk 311 through a transmission reducer. The driving shaft of the motor is arranged upward and perpendicular to the frame 1, so that the cutting table 31 can rotate along the vertical axis. Then, the vacuum suction disk 313 is embedded in the square groove in the middle of the rotating base 312. The rotating base 312 and the vacuum suction disk 313 are over-matched. The vacuum suction disc 313 is sealed with a sealing gasket to ensure air tightness. An air suction channel needs to be set through a channel in the vacuum suction disc 313 to generate negative pressure on the top of the cutting table 31. The cutting platform 314 is installed on the top of the vacuum suction disc 313. The glass fiber board 315 is covered on the top of the cutting platform 314 to complete the installation. A heating pad needs to be added to the bottom of the cutting platform 314. The heating pad is evenly covered with a thermal wire. Then, the thermal wire is connected to the external heating rod 316 through a threaded connection. The heating pad is embedded in the bottom of the cutting platform 314. There are multiple heating rods 316, such as Fig.13As shown, the cutting platform 314 is surrounded by one end thereof and is inserted into the heating pad inside the cutting platform 314. The cutting platform 314 is also provided with a plurality of negative pressure suction holes. These negative pressure suction holes are arranged in two groups at different positions. One group of negative pressure suction holes overlaps with the negative pressure suction holes on the glass fiber board 315, so that the suction force can pass through the glass fiber board 315 and absorb the chip-type electronic components through the negative pressure suction holes of the glass fiber board 315. The other group of negative pressure suction holes on the cutting platform 314 is covered by the glass fiber board 315. These negative pressure suction holes blocked by the fiberglass board 315 are used to adsorb the fiberglass board 315 flatly and tightly on the cutting platform 314. The negative pressure suction holes on the fiberglass board 315 or the top of the cutting platform 314 are evenly distributed to ensure that the suction is evenly distributed without stress concentration. The diameter of these negative pressure suction holes does not exceed 1 mm, and the optimal diameter is 0.2 mm. Such uniform arrangement and hole size can prevent the fiberglass board 315 or chip-type electronic components from being bent by suction.

[0097] A waste collecting bucket 33 is provided at one end of the cutting slide rail 35. The waste collecting bucket 33 is arranged directly below the cleaning roller 5 and close to the centrifugal force direction of the cleaning roller 5. The waste collecting bucket 33 does not contact the cutting slide rail 35. A cutting protection box 3 is arranged outside the cutting slide rail 35. The waste collecting bucket 33 is also arranged in the cutting protection box 3. The cutting protection box 3 is vertically fixed on the top of the frame platform 1. Figure 8As shown, it is ensured that the entire cutting table 31 cannot leave the range of the cutting protection box 3 regardless of rotation or translation. The shape and structure of the cutting protection box 3 is similar to a vertical fence, which is used to protect the splashing of fragments during cutting and can also collect waste. The height is between 10cm and 20cm, and it is flexibly adjusted according to the height of each component and the interference of the device, so as to be able to collect and block waste. Then, a cutting fixing frame 344 is installed on the outside of the cutting protection box 3, so that the cutting fixing frame 344 is fixed on the frame table 1, and a knife holder lifting motor 341 is installed on the cutting fixing frame 344, and then a lifting cutting plate 343 is installed on the knife holder lifting motor 341, and a cutting knife 34 is installed on the lifting cutting plate 343 through a floating limit spring 345. The blade of the cutting knife 34 should be inserted into the cutting plate 343. It is arranged in the blade limiting groove 342, and the blade limiting groove 342 should conflict with the thicker position of the wedge-shaped blade of the cutting knife 34, ensuring that the height of the blade of the cutting knife 34 extending out of the blade limiting groove 342 when floating downward just exceeds the thickness of the chip electronic component by less than 0.2mm, so that the chip electronic component can be just cut off, and the cutting knife 34 will not cut through the fiberglass board 315, and then install the cleaning cylinder 52 on the cutting fixed frame 344, and then install the cleaning bracket 53 on the telescopic end of the cleaning cylinder 52, and then install the cleaning roller 5 on the outside of the cleaning bracket 53 through the cleaning motor 51, ensuring that all parts connected to the cleaning cylinder 52 do not contact all parts on the cutting fixed frame 344, and cannot conflict with each other on the moving path;

[0098] Then, two vertical brackets 13 and a horizontal beam slide rail 12 in the shape of a gantry machining center are set up on the left and right sides of the top of the frame platform 1, such as Figure 3 and Figure 4 As shown, ensure the stability of the installation, and the two vertical brackets 13 and the horizontal beam slide rail 12 span the two sides of the rack 1, and do not interfere with other components, and then hang the material picking and cutting suction cup 32 and the finished product picking and cutting suction cup 42 on the horizontal beam slide rail 12. The material picking and cutting suction cup 32 and the finished product picking and cutting suction cup 42 have the same structure, but different positions and functions. The material picking and cutting suction cup 32 is responsible for sucking the chip electronic components in the raw material rack 2 to adjust the angle and place them stably on the cutting table 31, while the finished product picking and cutting suction cup 42 is responsible for sucking the cut chip electronic components and placing them in the finished product rack 4. Both the raw material rack 2 and the finished product rack 4 have open tops and are surrounded by limit plates. They are commonly used devices, and the attached description Figure 3 and Figure 4 It is also shown in;

[0099] The material picking and cutting suction cup 32 is installed below the suction cup lifting cylinder 322, and the suction cup lifting cylinder 322 is installed on the rotating shaft of the steering motor 321. The steering motor 321 is installed on the horizontal beam slide rail 12 and can slide horizontally on the horizontal beam slide rail 12. The lifting axis of the suction cup lifting cylinder 322 and the rotating axis of the steering motor 321 are both arranged perpendicular to the top of the frame platform 1, so that the material picking and cutting suction cup 32 can be lifted up and down, and can be moved horizontally on the horizontal beam slide rail 12, and the steering motor 321 can control the material picking and cutting suction cup 32 to rotate along the axis and adjust the angle, so as to adjust the horizontal direction of the sucked chip electronic components;

[0100] The finished product picking suction cup 42 and the picking and cutting suction cup 32 are sequentially installed on the same horizontal beam slide rail 12 with the same structure.

[0101] A protection cabinet 11 is installed outside the rack 1, which needs to be completely closed on all four sides and the top, and the protection cabinet 11 has doors on all four sides that can be opened and locked. The protection cabinet 11 needs to be installed outside all devices and not interfere with the operation of internal devices. A recycling box for collecting waste is installed inside the rack 1, and a controller 7 is also installed. The controller 7 is connected to the operating device 71. The controller 7 is a plc controller, which needs to be connected and controlled with all motors and cylinders, and must be connected to the sound and light alarm 14 on the top of the protection cabinet 11.

[0102] When the present invention is in use, various parameters are set on the controller 7 through the operating device 71, such as the cutting size of the chip electronic components and the size of the cutting. For example, if a square electronic component with a length and width of 10 cm is cut into 4 electronic components with a size of 2.4 cm, it is necessary to set the movement and cutting trajectory and the width of the cut edge.

[0103] The specific setting parameters are subject to actual needs. This implementation only describes the normal operating status of the device;

[0104] In the off state, first place a plurality of chip-type electronic components in the raw material rack 2, generally 20 pieces are in a stack, which can be placed together, then set the parameters and close the door of the protective cabinet 11, turn on the machine, the raw material rack 2 is started under the drive of the servo motor controlled by the controller 7, so that the raw material rack 2, the finished product rack 4 and the cutting table 31 are all in the set origin position, and then the negative pressure suction pipe 323 of the material picking and cutting suction cup 32 generates a vacuum adsorption force under the suction force of the external vacuum machine, the CCD detector 6 monitors the angle, size and position of the electronic components, the suction cup lifting cylinder 322 moves horizontally on the horizontal beam slide 12 to the top of the raw material rack 2, the suction cup lifting cylinder 322 extends downward, the suction force of the material picking and cutting suction cup 32 adsorbs a piece of electronic component flatly and tightly, the suction cup lifting cylinder 322 retracts, and then the material picking and cutting suction cup 32 moves horizontally on the horizontal beam slide 12. The rail 12 moves horizontally to the top of the glass fiber board 315 on the top of the cutting table 31, and the steering motor 321 turns to adjust the electronic component to the set angle. Then the suction cup lifting cylinder 322 extends downward to press the electronic component flat on the glass fiber board 315 of the cutting table 31. At this time, the vacuum suction cup 313 of the cutting table 31 starts to adsorb, and the suction of the material-taking and cutting suction cup 32 is closed to release the electronic component. Then the electronic component is adsorbed on the cutting table 31 by a group of negative pressure suction holes, and the glass fiber board 315 is always adsorbed on the top of the cutting platform 314 through another group of negative pressure suction holes as long as the machine is turned on, and will not relax. Then the heating rod 316 heats the electronic component, and at the same time, the servo motor drives the cutting table 31 to move longitudinally on the cutting slide rail 35 to the set position, and the cutting knife 34 cuts at the set position;

[0105] During cutting, the knife holder lifting motor 341 rotates, and the lifting screw rod rotates, so that the lifting cutting plate 343 descends for cutting. Such lifting precision is higher than that of the cylinder extension. Then the lifting cutting plate 343 descends to drive the cutting knife 34 to descend together. At the same time, the blade limiting groove 342 presses the top of the electronic component. The left and right CCD detectors 6 are facing the blade of the cutting knife 34. The blade limiting groove 342 is blocked by resistance and does not move. The cutting knife 34 continues to move forward in the blade limiting groove 342 to cut off the electronic component. The thicker position of the wedge-shaped blade of the cutting knife 34 is limited by the blade limiting groove 342, so that the electronic component can only be cut off, and it cannot penetrate into the fiberglass board 315. The glass fiber board 315 with a large resistance blocks the cutting knife 34. Under the action of the floating limit spring 345 of the cutting knife 34, the cutting knife 34 retracts into the blade limit groove 342 without breaking. The blade of the cutting knife 34 is normally controlled to be just right and does not cut into the glass fiber board 315. However, in order to cut through the electronic components, the cutting thickness needs to exceed the thickness of the electronic components by 0.01 mm, so that the cutting can be ensured. The cutting knife 34 and the glass fiber board 315 will contact and cut each other, but because the glass fiber board 315 has a buffering effect, it will not cut into it. At the same time, the glass fiber board 315 can play a good flat support role, so that a cut is completed;

[0106] Then, when the other side needs to be cut, the knife holder lifting motor 341 rotates to raise the lifting cutting plate 343, and the cutting knife 34 leaves the cutting table 31. Then, the cutting table 31 moves back to below the material picking and cutting suction cup 32. The material picking and cutting suction cup 32 sucks out the electronic component that has been cut once, and rotates the steering motor 321 to make the material picking and cutting suction cup 32 rotate in one direction, or not rotate in any direction, and the cutting table 31 moves a distance more to cut the other side opposite to the electronic component.

[0107] When the material picking and cutting suction cup 32 sucks the electronic component, the cutting table 31 returns to the cutting original position, and the vacuum suction cup 313 releases the negative pressure suction hole of the electronic component, so that the cut scraps are no longer sucked. At this time, the cleaning cylinder 52 extends downward, and the cleaning motor 51 starts to drive the cleaning roller 5 to rotate. In this way, the cleaning roller 5 rotates and extends downward, resting on the top of the cutting table 31, so that the cut scraps are cleared into the waste collection bucket 33. The rotation direction of the cleaning roller 5 is fixed, and the waste is only rotated to the waste collection bucket 33 for sweeping.

[0108] In this way, the longitudinal cutting position of the electronic component is adjusted by the displacement distance of the cutting table 31, and the transverse cutting position of the electronic component is adjusted by the horizontal displacement of the material picking and cutting suction cup 32 on the horizontal beam slide rail 12. In this way, the size and position of the cutting can be adjusted. Each time the position is adjusted, it is staggered by 1mm to ensure that each time the cutting knife 34 can cut evenly at the cutting position of the fiberglass board 315, so that each time the cutting is adjusted by a small displacement cutting method, it is possible to cut almost every position of the fiberglass board 315, instead of repeatedly cutting at the same position. The staggered cutting is adjusted by the cutting table 31 of the device. The longitudinal displacement is adjusted by the material-taking cutting suction cup 32, and the lateral displacement is adjusted by the material-taking cutting suction cup 32. At this time, in order to avoid the impact force between the cutting knife 34 and the cutting table 31, the device is set with a unique servo motor adjustment structure. Accurate adjustment, accurate misalignment, and accurate cutting can make the device cut more times, and the blade of the cutting knife 31 is not easy to collapse. Through the buffering of the fiberglass board 315, generally, the fiberglass board 315 is damaged and only needs to be replaced. The cutting knife 34 has high precision, high cost, and difficult manufacturing. It effectively protects the cutting knife 34 and the cutting table 31. The cutting table 31 of the device with such a structure will not be damaged unless there is an accident.

[0109] Each time the cutting suction cup 32 is used for cutting and taking, the electronic components are sucked up, and then the cutting table 31 returns to the bottom of the cleaning drum 5 to perform the waste cleaning operation.

[0110] Through multiple cutting, the four sides of a piece of electronic component are cut, and the middle line is also cut twice. After the electronic component is cut into a field shape, the cutting table 31 returns to the bottom of the material picking and cutting suction cup 32, and then the controller 7 controls the material picking and cutting suction cup 32 and the finished product picking and cutting suction cup 42 to move together, and the finished product picking and cutting suction cup 42 moves to the top of the electronic component cut on the cutting table, and the material picking and cutting suction cup 32 moves to the top of the electronic component raw material on the raw material rack 2, and the material picking and cutting suction cup 32 and the finished product picking and cutting suction cup 42 suck the electronic component downward together, and then move together again, and the finished product The picking suction cup 42 has sucked the cut electronic component and moved it to the top of the finished product rack 4, then the finished product picking suction cup 42 extends downward to place the finished electronic component on the finished product rack 4, and the picking and cutting suction cup 32 places a new piece of electronic component raw material on the empty cutting table 31, and repeats the cutting procedure. Each time the cutting procedure is repeated, the displacement of the picking and cutting suction cup 32 and the cutting table 31 will be different from the previous times, and the cutting position is adjusted within the allowable range to ensure the cutting accuracy, so as to avoid repeated cutting at the same position of the fiberglass board 315.

[0111] A CCD detector 6 can also be installed on the finished product rack 4. When there are many finished electronic components, the machine can be stopped to collect the finished products. At the same time, the waste scraps in the recycling box in the rack table 1 should also be collected, and then the electronic component raw materials can be replenished in the original rack 2 for a new round of cutting operation.

[0112] When all CCD detectors 6 of this device detect abnormalities in electronic components, they will activate the sound and light alarm 14 through the controller 7 to sound an alarm, and notify the equipment maintenance personnel to carry out maintenance. It may be that the original size of the electronic component does not meet the requirements, or the size of the cut scraps is set incorrectly, or there is a conflict with the misalignment distance of this device, and personnel maintenance is required. These belong to the programming settings of the PLC controller and are not within the scope of the limitations of this device. As long as the set operation of the device can be achieved, the present device is not limited to this operation mode. All different operating steps brought about by the different programming settings of the PLC belong to the application of this device and should belong to the embodiments of this device, which are not listed one by one here.

[0113] The controller 7 is a plc controller, which is a commonly used control device with easy programming, simple operation and accurate steps. The controller 7 is controlled by an operating device 71, which is a keyboard and mouse, and is a commonly used operating device 71 of the plc controller 7.

[0114] The longitudinal direction of the device refers to a direction perpendicular to the horizontal beam slide rail 12 and parallel to the cutting slide rail 35 ; the transverse direction refers to a direction perpendicular to the cutting slide rail 35 and parallel to the horizontal beam slide rail 12 .

[0115] The CCD detector 6 is also an existing device. Each group of the CCD detector 6 includes a CCD lens, a motor, and a camera fine-tuning device. For example, a CCD camera is used, such as Figure 3 As shown, a CCD camera is provided on the upper side of the raw material rack 2 and aligned with the position where the raw materials are stacked on the raw material rack 2 , for photographing the chip-type electronic components to be cut on the raw material rack 2 .

[0116] The CCD detector 6 is a device that detects the appearance of an object through a display using a CCD component.

[0117] Applicable to the flatness inspection and maintenance of various connector products such as CF CARD, FPC, BTOB, SIM CARD, etc. The coordinate line width is 1 / 2 of the existing similar products in the market, making the inspection more accurate.

[0118] Different colors of coordinate lines can be set according to the background. Four coordinate lines can be set at the same time in the normal configuration. Color CCD can also be used for product appearance inspection and can be used as a vertical projector.

[0119] It is highly versatile, and products with different material numbers can be inspected by replacing different inspection fixtures. The image on the display is directly observed with the naked eye, and the operator is not easily fatigued compared to projectors and microscopes.

[0120] The driving device used in this device includes a cylinder and a motor, which are commonly used driving devices and also a commonly used connection method. This embodiment will not be described in detail. In addition, the driving motors used in this device are all servo motors, which are convenient for precise positioning and cutting of electronic components.

[0121] Although the specific implementation modes of the present invention are described above, those skilled in the art should understand that the specific implementation modes described are only illustrative and are not intended to limit the scope of the present invention. Equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A chip-type electronic component slitting machine, characterized in that: include: The frame platform (1) is provided with a protective cabinet (11) on the top, and is a flat and stable working reference platform. At least two vertical brackets (13) are provided on the opposite side edges, and a horizontal beam slide rail (12) is fixedly provided horizontally between the vertical brackets (13) on both sides. The two vertical brackets (13) and the horizontal beam slide rail (12) form a gantry processing center; The protection cabinet (11) is fixedly mounted on the four side edges of the frame platform (1), and an audible and visual alarm (14) is mounted on the top of the protection cabinet (11); A raw material rack (2) is horizontally slidably mounted on a raw material slide rail (21), wherein the raw material slide rail (21) is horizontally mounted on the top of the machine frame (1); A finished product rack (4) is horizontally slidably mounted on a finished product slide rail (41), wherein the finished product slide rail (41) is horizontally mounted on the top of the rack platform (1); The cutting protection box (3) is formed by connecting vertical partitions end to end, is closed on all sides, and is open at the top and bottom. It is vertically fixed on the top of the frame table (1) and is non-contactingly mounted between the raw material slide rail (21) and the finished product slide rail (41). A cutting slide rail (35) is also horizontally mounted inside the box. A cutting table (31) is horizontally slidably mounted on the cutting slide rail (35). The top of the cutting table (31) is a flat mirror surface. A motor is mounted at the bottom of the cutting table (31). The cutting table (31) is mounted on the cutting slide rail (35) so as to be horizontally rotatable by the motor. The cutting knife (34) is mounted on the rotating shaft of the knife frame lifting motor (341), the knife frame lifting motor (341) is horizontally mounted on the cutting fixed frame (344) through the cylinder, the cutting fixed frame (344) is fixedly mounted on the frame platform (1), the cutting fixed frame (344) is mounted directly above the cutting slide rail (35), and the cutting knife (34) is arranged directly above the cutting slide rail (35); A waste collection bucket (33) is also arranged on the outer side of one end of the cutting slide rail (35), and the waste collection bucket (33) is arranged in the cutting protection box (3). The cutting slide rail (35), the finished product slide rail (41) and the raw material slide rail (21) are arranged parallel to each other, and the cutting slide rail (35), the finished product slide rail (41) and the raw material slide rail (21) are all perpendicular to the horizontal beam slide rail (12); The horizontal beam slide rail (12) is provided with a material picking and cutting suction cup (32) and a finished product picking and cutting suction cup (42) which can slide horizontally. The bottom surface of the material picking and cutting suction cup (32) is a mirror flat plate. The bottom surface of the material picking and cutting suction cup (32) is parallel to the cutting table (31) and is flatly fitted to each other. The material picking and cutting suction cup (32) is installed below a suction cup lifting cylinder (322). The suction cup lifting cylinder (322) is installed on the rotating shaft of a steering motor (321). The steering motor (321) is horizontally slidably arranged on the horizontal beam slide rail (12). The lifting axis of the suction cup lifting cylinder (322) and the rotating axis of the steering motor (321) are both arranged perpendicular to the top of the frame table (1). The finished product taking suction cup (42) and the taking and cutting suction cup (32) are sequentially installed on the same horizontal beam slide rail (12) with the same structure; A cleaning roller (5) is mounted on a driving shaft of a cleaning motor (51) and is arranged horizontally. The cleaning motor (51) is fixed on a cleaning bracket (53). The cleaning bracket (53) is mounted on a cutting fixed bracket (344) so ​​as to be able to be raised and lowered by a cleaning cylinder (52). The length of the cleaning roller (5) is greater than the longest diagonal of the cutting table (31). The cleaning roller (5), the cleaning motor (51) and the cleaning cylinder (52) do not interfere with the cutting blade (34). A CCD detector (6) is installed above the raw material rack (2) and the cutting table (31); The controller (7), the sound and light alarm (14), the raw material rack (2), the cutting table (31), the material taking and cutting sucker (32), the sucker lifting cylinder (322), the steering motor (321), the finished product rack (4), the finished product taking sucker (42), the cleaning motor (51), the cleaning cylinder (52), and the CCD detector (6) are all electrically connected to the controller (7); The cutting table (31) comprises an angle adjustment disk (311), a rotating base (312), a vacuum suction disk (313), a cutting platform (314) and a glass fiber board (315). The rotating base (312) can be horizontally slidably mounted on the cutting slide rail (35). The angle adjustment disk (311) can be horizontally rotated at the center of the rotating base (312) by a vertically arranged motor. The vacuum suction disk (313) is embedded on the top of the angle adjustment disk (311). The cutting platform (314) is sealed and sleeved on the rotating base (312). The top of the vacuum suction disc (313) is covered by the glass fiber board (315) on the top of the cutting platform (314). The top of the cutting platform (314) and the upper and lower surfaces of the glass fiber board (315) are both mirror-surface plates arranged horizontally. The cutting platform (314) and the glass fiber board (315) are provided with a plurality of suction holes overlapping each other. The suction holes on the cutting platform (314) and the glass fiber board (315) are connected to an external vacuum pump through the vacuum suction disc (313). The diameter of the suction holes does not exceed 1 mm. The cleaning cylinder (52) is arranged perpendicular to the top of the frame (1), and the rotation axis of the cleaning motor (51) is parallel to the top of the cutting table (31); The bottom of the cleaning drum (5) can be detachably attached to the cutting table (31), and when the cleaning cylinder (52) is raised, the cleaning drum (5) is suspended above the cutting table (31) in a non-contacting horizontal manner; The raw material rack (2), cutting table (31) and finished product rack (4) are all driven on their respective slide rails by servo motors; The controller (7) is a PLC controller. The controller (7) is also connected to an operating device (71). The servo motors driving the raw material rack (2), the cutting table (31) and the finished product rack (4) are all controlled by the controller (7).

2. The chip-type electronic component slitting machine according to claim 1, characterized in that: The installation gaps between the angle adjustment disk (311), the rotating base (312), the vacuum suction disk (313) and the cutting platform (314) are filled with sealing rings, and the fiberglass board (315) is flatly adsorbed on the top of the cutting platform (314) by vacuum, and the thickness of the fiberglass board (315) does not exceed 3 mm.

3. The chip-type electronic component slitting machine according to claim 1, characterized in that: A negative pressure suction pipe (323) is also provided on the material picking and cutting suction cup (32), and a plurality of suction holes are evenly provided on the suction bottom surface of the material picking and cutting suction cup (32). The plurality of suction holes are connected to an external vacuum pump through the negative pressure suction pipe (323). The material picking and cutting suction cup (32) has the same structure as the finished product material picking suction cup (42).

4. The chip-type electronic component slitting machine according to claim 1, characterized in that: The blade of the cutting knife (34) is a wedge-shaped blade. The length of the cutting knife (34) is less than the minimum spacing between any opposite sides of the glass fiber board (315). The cutting knife (34) is elastically mounted on the lifting cutting plate (343) via a floating limit spring (345). A blade limit groove (342) is fixedly mounted on the bottom of the lifting cutting plate (343). The blade limit groove (342) and the top inclined surface of the wedge-shaped blade of the cutting knife (34) are in conflict with each other. The wedge-shaped blade (34) of the cutting tool (34) floats up and down inseparably in the blade limiting groove (342), the lifting cutting plate (343) is installed on the output shaft of the tool holder lifting motor (341), the output shaft of the tool holder lifting motor (341) is meshed with the lifting cutting plate (343) through a lifting screw rod, the tool holder lifting motor (341) is vertically fixed on the cutting fixing frame (344), and the cutting fixing frame (344) is non-contact fixed frame above the cutting slide rail (35).

5. The chip-type electronic component slitting machine according to claim 4, characterized in that: At least two CCD detectors (6) are mounted on the cutting table (31). The two CCD detectors (6) on the cutting table (31) are mounted on a cutting fixed frame (344) in an adjustable orientation. The two CCD detectors (6) are arranged opposite to the cutting line of the wedge-shaped blade of the cutting knife (34) on the cutting table (31). At least one CCD detector (6) is mounted on the raw material rack (2). The CCD detector (6) on the raw material rack (2) is arranged opposite to the raw material placement position.

6. The chip-type electronic component slitting machine according to claim 1, characterized in that: The top opening of the waste collection hopper (33) extends from directly below the cleaning roller (5) to the side of the frame (1); the bottom of the waste collection hopper (33) is connected to the inside of the frame (1); a recycling box is arranged below the waste collection hopper (33); and the cleaning roller (5) is a roller soft brush.

7. The chip-type electronic component slitting machine according to claim 2, characterized in that: A plurality of mounting holes are provided on the lower side surface of the cutting platform (314), and a heating rod (316) is embedded in each mounting hole in a one-to-one manner. The plurality of heating rods (316) are evenly dispersed and embedded on the four side walls of the cutting platform (314). The plurality of heating rods (316) extend into the center of the inner cavity of the cutting platform (314), and the heating rods (316) are electrically connected to the controller (7).

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